ST Microelectronics S R L SP1ML SPIRIT1 915 MHz Low Power RF Module User Manual Spirit 1 Module Datasheet

ST Microelectronics S.R.L. SPIRIT1 915 MHz Low Power RF Module Spirit 1 Module Datasheet

Users Manual

ST CONFIDENTIAL   February 2014 Doc ID TBD Rev 0.8  Rev 0.8 1/19 www.st.com  SPLML-868 and SP1ML-915    SPIRIT1 868 and 915 MHz Low Power RF Modules PRELIMINARY DATASHEET   Features   Complete RF ready Spirit1 module   Integrated antenna and crystal   STM32L microcontroller up to 32 MHz   Low power consumption   UART interface with AT command set   Operates from a single 1.8V to 3.6V supply   863 to 870 MHz operation (SP1ML-868)   902 to 928 MHz operation (SP1ML-915)   Output power up to +11.6dBm   Data rates up to 500kbps   Modulation schemes: 2-FSK, GFSK, GMSK, OOK, and ASK   Compact size: 14mm x 13.4mm x 2.5mm   Operating temperature: -40 °C to 85 °C   FCC and CE regulatory approvals  Applications   Serial cable replacement   Home automation   M2M industrial control   Service diagnostic   Data acquisition equipment   Machine control   Sensor monitoring   Security systems   Mobile health and medical
 2/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  Contents 1 Description ........................................................................................... 4 2 Hardware specification........................................................................ 5 2.1 Recommended operating conditions ......................................................................... 5 2.2 Absolute maximum ratings ........................................................................................ 5 2.3 I/O operating characteristics ..................................................................................... 5 2.4 Current consumption ................................................................................................. 6 2.5 RF compliance limits ................................................................................................. 6 2.6 Pin assignment ......................................................................................................... 7 2.7 Pin placement ........................................................................................................... 8 2.8 Hardware block diagram ........................................................................................... 8 3 Hardware design .................................................................................. 9 3.1 Pin usage .................................................................................................................. 9 3.2 Typical application circuit ........................................................................................ 10 3.3 Layout guidelines .................................................................................................... 11 3.4 Recommended footprint .......................................................................................... 12 3.5 Module reflow installation ........................................................................................ 13 4 Mechanical data ................................................................................. 14 4.1 RoHS compliance ................................................................................................... 14 5 Regulatory compliance ..................................................................... 15 5.1 FCC certification ..................................................................................................... 15 5.2 CE certification ........................................................................................................ 15 5.3 Labeling instructions ............................................................................................... 16 5.4 Product manual instructions .................................................................................... 16 6 Ordering Information ......................................................................... 18
    Doc ID TBD Rev 0.8  Rev 0.1 3/19 www.st.com  List of tables Table 1. Recommended operating conditions .................................................................................... 5 Table 2. Absolute maximum ratings ................................................................................................... 5 Table 3. I/O operating characteristics ................................................................................................. 5 Table 4. Current consumption ............................................................................................................ 6 Table 5. RF compliance limits ............................................................................................................ 6 Table 6. Pin assignment ..................................................................................................................... 7 Table 7. Module pin usage ................................................................................................................. 9 Table 8. Soldering profile ................................................................................................................. 13 Table 12. Ordering information ....................................................................................................... 18   List of figures Figure 1. Pin placement ...................................................................................................................... 8 Figure 2. Hardware block diagram ...................................................................................................... 8 Figure 3. Typical application circuit ................................................................................................... 10 Figure 4. Layout guidelines ............................................................................................................... 11 Figure 5. Recommended footprint ..................................................................................................... 12 Figure 6. Soldering profile ................................................................................................................. 13 Figure 7. Mechanical data ................................................................................................................. 14
 4/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  1  Description The SP1ML-868 and SP1ML-915 are low power RF modules based on the SPIRIT1 radio, with  integrated  voltage  regulation,  antenna,  crystal  and  microcontroller  in  a  compact surface  mount  module  form-factor.    The  module  allows  OEMs  to  easily  add  wireless capability to any electronic device without requiring in-depth RF experience, and has the necessary FCC modular approvals and CE compliance to reduce time to market. The UART host interface allows simple connection to an external microcontroller.  Access to  module  features  is  provided  through  an  extended  AT  command  set.  A  simple  cable replacement model allows the module to be used similarly to a standard serial interface. The  microcontroller  serial  wire  debug  signals  are  available  and  allow  the  standard firmware  to  be  replaced  by  a  user  application,  enabling  use  as  a  wireless  application module where no external microprocessor system is required.  Select STM32L GPIO and peripherals  are  available  for  interfacing to  external  devices  in  the  user  application,  and advanced features of the SPIRIT1 radio are also accessible.
    Doc ID TBD Rev 0.8  Rev 0.1 5/19 www.st.com  2  Hardware specification General conditions (VIN = 3 V and TA = 25˚C). 2.1  Recommended operating conditions Table 1.  Recommended operating conditions Symbol Parameter Min. Typ. Max. Unit TA Operating ambient temperature range -40 - 85 ˚C VDD Operating supply voltage 1.8 3 3.6 V FREQ RF frequency (SP1ML-868) 863 - 870 MHz FREQ RF frequency (SP1ML-915) 902 - 928 MHz 2.2  Absolute maximum ratings Table 2.  Absolute maximum ratings Symbol Parameter Min. Typ. Max. Unit TSTG Storage temperature range -40 - 85 ˚C VDD Operating supply voltage -0.3 - 3.9 V VIO I/O pin voltage -0.3 - 5.5 V 2.3  I/O operating characteristics Table 3.  I/O operating characteristics Symbol Parameter Min. Typ. Max. Unit VIL(1) I/O input low level voltage -0.3 - 0.3 VDD V VIH(1) I/O input high level voltage 0.7 VIN - VDD+0.3 V 1.  For more details see the STM32L151RB datasheet, I/O port characteristics.
 6/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  2.4  Current consumption Table 4.  Current consumption Symbol Parameter Test Conditions Typ. Unit IDD Supply current Operating mode  Tx, +11dBm, 2-FSK, 915 MHz 20 mA Operating mode  Tx, -7dBm, 2-FSK, 915 MHz 8 mA Operating mode  Rx, 915 MHz 11 mA Operating mode – Idle 800 µA Command mode 1.3 mA Standby 1.4 µA 2.5  RF compliance limits The RF compliance limits are those tested for FCC and CE certification. These limits are enforced by the factory loaded firmware. Table 5.  RF compliance limits Modulation Standards Parameter Max. Unit 2-FSK GFSK  MSK FCC Part 15.207 (1) FCC Part 15.247 (1) EN 300 220-2 V2.4.1 (2) EN 301 489-01 V1.9.2 (2) EN 301 489-03 V1.4.1 (2) Data rate 500 kbps Output power +11.6 dBm OOK ASK FCC Part 15.207 (1) FCC Part 15.249 (1) EN 300 220-2 V2.4.1 (2) EN 301 489-01 V1.9.2 (2) EN 301 489-03 V1.4.1 (2) Data rate 250 kbps Output power +8.5 dBm 1.  FCC standards are only applicable to the SP1ML-915 module. 2.  EN standards are only applicable to the SP1ML-868 module.
    Doc ID TBD Rev 0.8  Rev 0.1 7/19 www.st.com  2.6  Pin assignment  Table 6.  Pin assignment Pin Name Type Description STM32L pin(1) 1 TXRXLED O Active low Tx/Rx LED drive PA2 2 WKUP I/O Wake up module from shutdown PA0 3 GPIO0 I/O General purpose input/output 0 PB15 4 GPIO1 I/O General purpose input/output 1 PB14 5 MODE0 I/O Protocol mode selection 0(2) PB13 6 MODE1 I/O Protocol mode selection 1(2) PB12 7 VDD Power Supply input voltage - 8 GND Power Ground - 9 SWDIO I/O Serial wire I/O PA13 10 SWCLK I Serial wire clock PA14 11 BOOTMODE I Boot mode selection BOOT0 12 RESET I Reset input, active low NRST 13 TXD O UART transmit data PA9 14 RXD I UART receive data PA10 15 RTS O UART request to send PB6 16 CTS I UART clear to send PB7 1.  For more details see the STM32L151RB datasheet, Pin descriptions section.  Alternate functions of any given pin are dependent on the user application firmware that is loaded into the module and is beyond the scope of the document.  2.  Refer to Hardware design section for details of protocol mode selection.
 8/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  2.7  Pin placement Figure 1.  Pin placement 12345678161514131211109  2.8  Hardware block diagram Figure 2.  Hardware block diagram   Spirit1 Filter/BalunSTM32L MicrocontrollerSPIGPIOUARTXTAL1.8V to 3.6V SupplyGPIO TXRXpRXnSMPS
    Doc ID TBD Rev 0.8  Rev 0.1 9/19 www.st.com  3  Hardware design 3.1  Pin usage If used with the default firmware and interfaced to a host MCU, at a minimum the SP1ML module requires power, ground and UART transmit and receive signals to be connected.  Other signals are optional and provide additional functionality. These signals are outlined in the following table. Unused signals must not be connected. Table 7.  Module pin usage Pin Name Description Optional 1 TXRXLED An active-low open drain output that can drive an external LED for TX/RX activity status indication. Yes 2 WKUP Drive this signal low to put the module into a low power shutdown mode.  Float or drive the signal high to wake the module. Yes 3 GPIO0 Reserved for future use, do not connect. Yes 4 GPIO1 Reserved for future use, do not connect. Yes 5 MODE0 Drive this signal low to force the module into operating mode. Drive this signal high to force the module into command mode. This enables faster switching between modes and obviates the need for escape sequences. Yes 6 MODE1 Reserved for future use, do not connect. Yes 7 VDD Connect to power supply, 1.8V to 3.6V.   No 8 GND Connect to system ground. No 9 SWDIO These signals are the serial wire debug (SWD) interface to the STM32L microcontroller, supporting the development and loading of custom firmware. Yes 10 SWCLK Yes 11 BOOTMODE Drive this signal high at power up or reset to start the boot loader and allow device firmware update over the UART interface. Yes 12 RESET Drive this signal low to hold the module in reset. Drive this signal high to release the module from reset. Yes 13 TXD Connect to the host system UART RXD input. No 14 RXD Connect to the host system UART TXD output. No 15 RTS Connect to the host system UART CTS output if flow control is required. Yes 16 CTS Connect to the host system UART RTS input if flow control is required. Yes
 10/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  3.2  Typical application circuit In a typical application the SP1ML module is connected to a host MCU using a standard UART, with transmit and receive signals.  This is illustrated in the following diagram.   Figure 3.  Typical application circuit SP1MLMODULEHOSTMCUTXD TXDRXD RXDRTS RTSCTS CTSGPIOGPIOBOOTMODERESETGPIOGPIOMODE0WKUPTXRXLED1234VDDRESETSWCLKSWDIO5SWD HEADERVDDVDDVDDGND10uF  Optional Functionality 1.  The TXRXLED signal is an active-low open drain output that can be used to drive an external LED for status indication when data is sent or received. 2.  The RTS and CTS signals can be connected to the host UART interface if hardware flow control is required.  3.  The MODE0 signal provides a hardware method for switching between command and operating modes.  The WKUP signal allows the module to be placed into a low power shutdown mode and woken up again. 4.  The BOOTMODE AND RESET signals should be connected if module firmware will need to be updated over the UART interface. 5.  To  support  custom  module  firmware,  the  serial  wire  debug  signals  need  to  be accessible for programming and debugging.
    Doc ID TBD Rev 0.8  Rev 0.1 11/19 www.st.com  3.3  Layout guidelines The  application  PCB  requires  a  flooded  ground  plane.    Care  must  be  taken  to  ensure there are no traces or ground planes under the area surrounding the antenna, with the exception of minimal width traces from pins 1,2,3,4,13,14,15 and 16 of the module if these are used.  It is appropriate to place the module toward the edge of the PCB with no traces or ground planes from the antenna to the board edge.  Figure 4.  Layout guidelines  Application PCBNo copper on any layer surrounding antenna, except minimal traces from pins 1,2,3,4,13,14,15 and 16Flooded ground plane required(signal traces allowed)min .6 mm min .6 mm
 12/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  3.4  Recommended footprint  Figure 5.  Recommended footprint 10.5 mm15.5 mm1.5 mm1 mm0.75 mm1.5 mm
    Doc ID TBD Rev 0.8  Rev 0.1 13/19 www.st.com  3.5  Module reflow installation The  SP1ML  is  a  surface  mount  module  supplied  on  a  16-pin,  4-layer  PCB.  The  final assembly  recommended  reflow  profile  is  indicated  below,  based  on  IPC/JEDEC  JSTD-020C, July 2004 recommendations. Table 8.  Soldering profile Profile feature Lead-free assembly Average ramp-up rate (TSMAX to TP) 3 °C/sec max Preheat: – Temperature min. (TS min.) – Temperature max. (TS max.) – Time (ts min. to ts max.)(ts)  150 °C 200 °C 60-100 sec Time maintained above: – Temperature TL – Temperature TL  217 °C 60-70 sec Peak temperature (TP) 240 °C Time within 5 °C of actual peak temperature (TP) 10-20 sec Ramp-down rate 6 °C/sec Time from 25 °C to peak temperature 8 minutes max.  Figure 6.  Soldering profile
 14/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  4  Mechanical data Figure 7.  Mechanical data 13.4 mm14 mm1.45 mm1.5 mm1 mm0.6 mmR 0.6 mm2.5mm (max.)  4.1  RoHS compliance ST modules are RoHS compliant and comply with ECOPACK® norms.
    Doc ID TBD Rev 0.8  Rev 0.1 15/19 www.st.com  5  Regulatory compliance 5.1  FCC certification This module has been tested and found to comply with the FCC part 15 rules. These limits are  designed to  provide reasonable  protection against harmful  interference in  approved installations.  This  equipment  generates,  uses,  and  can  radiate  radio  frequency  energy and,  if  not  installed  and  used  in  accordance  with  the  instructions,  may  cause  harmful interference to radio communications. However, there is no guarantee that interference may not occur in a particular installation. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not  cause harmful interference, and (2) this  device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. Modular approval FCC ID: S9NSP1ML In accordance with FCC part 15, the SP1ML-915 is listed as a modular transmitter device. This  module  is  evaluated  for  stand-alone  use  only.    Finished  products  incorporating multiple  transmitters  must  comply  with  colocation  and  RF  exposure  requirements  in accordance  with  FCC  multi-transmitter  product  procedures.    Collocated  transmitters operating in portable RF Exposure conditions (e.g. <20cm from persons including but not limited to body worn and hand held devices) may require separate approval. 5.2  CE certification The module has been certified according to the following standards: EN 300 220-2 V2.4.1 EN 301 489-01 V1.9.2 EN 301 489-03 V1.4.1
 16/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  5.3  Labeling instructions When integrating the SP1ML-915  into  the final product,  the  OEM must  ensure  that  the FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains FCC ID: S9NSP1ML  OR    This product contains FCC ID: S9NSP1ML  The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this  device must accept any interference received, including any interference that may cause undesired operation. 5.4  Product manual instructions This section applies to OEM final products containing the SP1ML-915 module, subject to FCC  compliance.  The  final  product  manual  must  contain  the  following  statement  (or  a similar statement that conveys the same meaning): WARNING:    Changes  or  modifications  not  expressly  approved  by  the  party responsible for compliance could void the user’s authority to operate the equipment  In  the  case  where  an  OEM  seeks  Class  B  (residential)  limits  for  the  final  product,  the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class  B  digital  device,  pursuant  to  part  15  of  the  FCC  Rules.  These  limits  are designed  to  provide  reasonable  protection  against  harmful  interference  in  a residential  installation.  This  equipment  generates,  uses  and  can  radiate  radio frequency energy and, if not installed and used in accordance with the instructions, may  cause  harmful  interference  to  radio  communications.  However,  there  is  no guarantee  that  interference  will  not  occur  in  a  particular  installation.  If  this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help.
    Doc ID TBD Rev 0.8  Rev 0.1 17/19 www.st.com  In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class  A  digital  device,  pursuant  to  part  15  of  the  FCC  Rules.  These  limits  are designed to provide reasonable protection against harmful interference when the equipment is operated in  a  commercial  environment. This equipment  generates, uses,  and  can  radiate  radio  frequency  energy  and,  if  not  installed  and  used  in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful  interference  in  which  case  the  user  will  be  required  to  correct  the interference at his expense.
 18/19 Doc ID TBD Rev 0.8  Rev 0.1  www.st.com  6  Ordering Information Table 9.  Ordering information Order code Description SP1ML-868 868 MHz Spirit 1 antenna module (Region 1, Europe) SP1ML-915 915 MHz Spirit 1 antenna module (Region 2, The Americas)
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