ST Microelectronics S R L SPBT30DP1 SPBT3.0DP1 Bluetooth Module User Manual Bluetooth technology class 2 module

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Document ID	3028379
Application ID	PZDPogK7NJqePxiHjvnjVA==
Document Description	Users manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	84.58kB (1057192 bits)
Date Submitted	2016-06-15 00:00:00
Date Available	2016-12-12 00:00:00
Creation Date	2016-06-09 11:49:02
Producing Software	Microsoft® Office Word 2007
Document Lastmod	2016-06-09 11:49:02
Document Title	Bluetooth® technology class-2 module
Document Creator	Microsoft® Office Word 2007
Document Author:	STMICROELECTRONICS

SPBT3.0DP1
Bluetooth® Classic module
Datasheet – preliminary data
Features
•
Bluetooth® radio
Fully
embedded
Bluetooth®
v3.0
with SPP and HID profiles
•
•
Class 1 module
Complete RF ready module
Embedded support for MFI iAP2 profile
128-bit encryption security
Integrated antenna
ST Cortex-M4 microprocessor
up to 100 MHz
512 KB Flash
128 KB RAM memory
Supported transmission speed with SPP
•
General I/O
•
Up to 800KBits
14 general purpose I/Os
User interface
AT command Data Package (DP)
Firmware upgrade over UART
•
ETSI, FCC, IC and Bluetooth® qualified
•
Single voltage supply: 3.3 V typical
•
Micro-sized form factor: 15.24 x 26.9 x 2.9 mm
•
Operating temperature range: -40 °C to 85 °C
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Contents
Features ........................................................................................................................................................... 1
Description .............................................................................................................................................. 4
RoHS compliance ................................................................................................................................... 5
Applications ............................................................................................................................................ 5
Software architecture .............................................................................................................................. 6
4.1 BT stack layers .................................................................................................................................... 6
4.2 Supported Profile ................................................................................................................................. 7
4.3 AT Command set: DATA PACKAGE ................................................................................................ 7
Hardware specifications .......................................................................................................................... 9
5.1 Recommended operating conditions ................................................................................................... 9
5.2 Absolute maximum ratings.................................................................................................................. 9
5.3 Current consumption ............................................................................................................................. 9
5.4 Pin assignment ................................................................................................................................... 10
5.5 Mechanical dimensions ..................................................................................................................... 12
Hardware design ................................................................................................................................... 13
6.1 Module reflow soldering ..................................................................................................................... 13
6.2 UART interface ................................................................................................................................. 15
6.3 GPIO interface .................................................................................................................................... 16
6.4 Reset circuit ........................................................................................................................................ 16
6.4.1 External reset circuit .................................................................................................................... 16
6.4.2 Internal reset circuit ......................................................................................................................... 17
Regulatory compliance ......................................................................................................................... 18
7.1 FCC certification .............................................................................................................................. 18
7.1.1 Labeling instructions .................................................................................................................... 18
7.1.2 Product manual instructions ......................................................................................................... 19
7.2 IC certification .................................................................................................................................... 20
7.2.1 Labeling instructions .................................................................................................................... 20
7.2.2 Product manual instructions ......................................................................................................... 21
7.3 Bluetooth certification ........................................................................................................................ 22
7.4 CE certification ................................................................................................................................... 22
Traceability ........................................................................................................................................... 23
Ordering information ............................................................................................................................ 24
10
Revision history ................................................................................................................................ 25
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List of tables
Table 1: Recommended operating conditions ................................................................................... 9
Table 2: Absolute maximum ratings ..................................................................................................... 9
Table 3: High Performance Power Consumption ............................................................................ 10
Table 4: Pin assignment ......................................................................................................................... 10
Table 5: Soldering .................................................................................................................................... 14
Table 6: Traceability information ......................................................................................................... 23
Table 7: Ordering information .............................................................................................................. 24
Table 8: Document revision history .................................................................................................... 25
List of figures
Figure 1: Software Architecture Overview ..................................................................................................... 6
Figure 2: Block Diagram ................................................................................................................................ 8
Figure 3: Pin assignment ............................................................................................................................... 10
Figure 4: mechanical dimensions .................................................................................................................. 12
Figure 5: Recommend land pattern top view ................................................................................................ 13
Figure 6: Soldering profile ............................................................................................................................ 14
Figure 7: Connection to host device ............................................................................................................. 15
Figure 8: Typical RS232 circuit .................................................................................................................... 15
Figure 9: External reset circuit ...................................................................................................................... 16
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1
Description
The SPBT3.0DP1 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module is among the smallest form factor available which provides a complete RF platform. The
SPBT3.0DP1 enables electronic devices with wireless connectivity, not requiring any RF experience or
expertise for integration into the final product. The SPBT3.0DP1 module, being a certified solution,
optimizes the time to market of the final applications.
The module is designed for maximum performance in a minimal space including fast speed UART and 14
general purpose I/O lines, and up to 800 kbps transmission speed with SPP service active, 250kbps with
iAP2 service active.
Optimized design allows the integration of a complete working Bluetooth modem, including antenna, in
the minimum possible size.
Deep Sleep Mode allows to reduce power consumption when a Bluetooth connection is not established.
The SPBT3.0DP1 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth
wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable
replacement using the Bluetooth SPP profile. Embedded Bluetooth DATA PACKAGE (DP) firmware is a
friendly interface, which realizes a simple control for cable replacement, enabling communication with
most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT3.0DP1,
supporting iAP2 profile, provides communication with Android, smartphone, and the newest Apple® iOS
Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an Apple device
application. The DP FW includes the Bluetooth iAP2 profile capable of recognizing the Apple
authentication chip.
Customers using the Apple authentication IC must register as developers to become an Apple certified
MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and iPad®
gain access to technical documentation, hardware components, technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and other
proprietary features may be supported and can be ordered pre-loaded and configured.
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2
RoHS compliance
ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.
Applications
The SPBT3.0DP1 is suitable for a wide range of application like:
•
•
•
•
•
•
•
•
Serial cable replacement
M2M industrial control
Service diagnostic
Data acquisition equipment
Machine control
Sensor monitoring
Security system
Mobile health
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4
Software architecture
Application
Data Package with AT Command
Bluetooth Profiles
SPP
HID
DID
iAP2
Bluetooth Stack
RFCOMM
SDP
L2CAP
HCI
Operating System
STM32 Hardware Abstraction Layer
STM32F4 controller
Bluetooth Profiles
Bluetooth Controller
Link Manager
Bluetooth
Profiles
Baseband
Radio
Figure 1: Software Architecture Overview
4.1
BT stack layers







Bluetooth v3.0
Device power modes: active, deep sleep
Connection modes: active, sniff
Wake on Bluetooth feature optimized power consumption of host CPU
Authentication and encryption
Encryption key length from 8 bits to 128 bits
Persistent Flash memory for BD address and user parameter storage
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







4.2
Supported Profile




4.3
All ACL (asynchronous connection less) packet types
Sniff mode: fully supported to maximum allowed intervals
Master slave switch supported during connection and post connection
Dedicated inquiry access code for improved inquiry scan performance
Dynamic packet selection channel quality driven data rate to optimize link performance
Dynamic power control
Bluetooth radio natively supports 802.11b co-existence AFH
RFCOMM, SDP, and L2CAP supported
Serial Port Profile (SPP)
Human Interface Device (HID)
iPhone Accessory Profile 2 (iAP2)
Device Identification Profile (DID)
AT Command set: DATA PACKAGE
The complete command list is reported in the AT Command DATA PACKAGE user manual UMxxxxx.
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SPBT3.0DP1 Module Block Diagram
Battery or External Supply
SPBT 3.0DP1 Bluetooth Audio Module
1.8V
Integrated
Voltage Regulator
INTERNAL
RF antenna
1.8V
1.8V
RF Filter
BALUN
Host Controller
interface
HCI SPI
PCM / I2S
AUDIO
INTERFACE
PCM / I2S
Bluetooth RADIO
AUDIO Coprocessor
STLC2690
ARM Cortex MCU
STM32F411CEY6
26.000 MHz
I2S
AUDIO
INTERFACE
I2S
GPIO user
interface
GPIO
UART
user
interface
UART
RESET
BOOT0
BOOT1,etc.
SYSTEM
32.768 kHz
Internal / Ext.
32.768 kHz
clock
1.8V
32.768 kHz
crystal
oscillator
Crystal
26 MHz
clock
(OPTIONAL) EXTERNAL LPCLK (32.768 KHz)
Figure 2: Block Diagram
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5
Hardware specifications
General conditions (VIN = 3.3 V and 25 °C).
5.1
Recommended operating conditions
Table 1: Recommended operating conditions
5.2
Rating
Min.
Typical
Max.
Unit
Operating temperature range
-40
+ 85
°C
Supply voltage VIN
2.1
3.3
3.6
Signal pin voltage
1.8
RF frequency
2402
2480
MHz
Absolute maximum ratings
Table 2: Absolute maximum ratings
Rating
Min.
Typical
Max.
Unit
Storage temperature range
-40
+ 85
°C
Supply voltage, V IN
-0.3
+ 5.5
I/O pin voltage, VIO
-0.3
+1.8
+ 1.84
5.3 Current consumption
High performance configuration current consumption:



CPU: 84 MHz
UART: 115.2 Kbps
Data throughput up to 100 Kbps
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
Temperature: 25 °C
Table 3: High Performance Power Consumption
Modes (typical power consumption)
Average
Unit
No connection, Page/Inquiry Scan, internal crystal LPO, Deep Sleep Mode
1.34
mA
No connection, Page/Inquiry Scan, no external LPO, Active Mode
6.9
mA
No connection, Page/Inquiry Scan, with external LPO, Active Mode
5.4
7.85
mA
No connection, No Page/Inquiry Scan, no external LPO, Active Mode
7.65
mA
Connection, no data traffic, Master
11.28
mA
Connection, no data traffic, Slave
11.3
mA
Pin assignment
Figure 3: Pin assignment
Table 4: Pin assignment
Pin
Name
Description
I/O
Note
GPIO_3
General purpose I/O
I/O
5V tolerant
BOOT_0
Boot pin
RESET
Reset input (active low for 5ms)
GPIO_8
GPIO indicating Module Low Power Status
- When high, device is in active mode
- When low, device is in low power mode
January 2016
I/O
Internal 10K pulldown
5V tolerant
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5
GPIO_10
General purpose I/O or I2C_SDA line for MFI chip
I/O
5V tolerant
TXD
Transmit Data
5V tolerant
GPIO_9
General purpose I/O
I/O
5V tolerant
RXD
Receive Data
5V tolerant
CTS
Clear to send (active low)
5V tolerant
10
RTS
Request to send (active low)
5V tolerant
11
GPIO_11
I/O
5V tolerant
12
GPIO_12
I/O
5V tolerant
13
GPIO_7
General purpose I/O
or
I2C_SCL line for MFI chip
General purpose I/O
or
I2C_SDA line for MFI chip
General purpose I/O
I/O
5V tolerant
14
GPIO_14
General purpose I/O
I/O
5V tolerant
15
GPIO_13
General purpose I/O
I/O
5V tolerant
16
LPO_OUT
Low power 32KHz oscillator output
17
GPIO_1
I/O
5V tolerant
18
GPIO_4
I/O
5V tolerant
19
GPIO_2
GPIO indicating BT Connection Status
o 1: BT connection is active
o 0: BT connection is not active
GPIO indicating Module Power Status
o 1: active mode
o 0: Deep Sleep Mode
General purpose I/O
I/O
5V tolerant
20
GPIO_5
General purpose I/O
I/O
5V tolerant
21
1.8V_OUT
+1.8V out (max 10mA)
22
GPIO_6
General purpose I/O
I/O
5V tolerant
23
GND
Reference ground
24
VIN
Main power supply input
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5.5
Mechanical dimensions
Figure 4: mechanical dimensions
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Figure 5: Recommend land pattern top view
Hardware design
SPBT3.0DP1 module with DP command embedded FW supports UART, I2C and GPIO hardware interfaces.
Note:
All unused pins should be left floating; do not ground.
All GND pins must be well grounded.
The area around the module should be free of any ground planes, power planes, trace routings,
or metal for 6 mm from the module antenna position, in all directions.
Traces should not be routed underneath the module.
6.1 Module reflow soldering
The SPBT3.0DP1 is a high temperature strength surface mount Bluetooth® module supplied on an 24 pin,
6-layer PCB. The final assembly recommended reflow profiles are indicated here below.
Soldering phase must be executed with care: in order to avoid undesired melting phenomenon, particular
attention must be paid to the set-up of the peak temperature.
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Here following some suggestions for the temperature profile based on the following recommendations.
Table 5: Soldering
Profile feature
PB-free assembly
Average ramp-up rate (TSMAX to TP)
3 °C/sec max
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.
$012026Y1
Figure 6: Soldering profile
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6.2
UART interface
The UART is compatible with the 16550 industry standard. Four signals are provided with the UART
interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control.
Host
Bluetooth
Module
Figure 7: Connection to host device
SPB323B-C
Figure 8: Typical RS232 circuit
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SPBT3.0DP
Hardware design
6.3 GPIO interface
All GPIOs are capable of sinking and sourcing 4 mA of I/O current.
Module GPIO configuration depends on the FW embedded.
GPIO1: Bluetooth Connection Status:
0: BT connection not present
1: BT connection is present
GPIO4: Module Power Status:
1: module is in Active Mode;
Blinking: module is in Deep Sleep Mode
GPIOs can be reconfigured with the following commands
At+ab gpioconfig [GPIO pin] [I/O]
At+ab gpioRead [GPIO pin]
At+ab gpioWrite [GPIO pin] [1/0]
For more details refer to the User Manual xxxx.
6.4 Reset circuit
Two types of system reset circuits are detailed below. The maximum voltage that can be
supplied to the RESET pin is 3.6V. As shown in Figure 10 and Figure 11 the RESET is
active low, in absence of a reset circuit the pin is internally pulled up and therefore inactive.
6.4.1 External reset circuit
Figure 9: External reset circuit
Note: RPU ranges from 30 kOhm to 50 kOhm internally provided

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SPBT3.0DP
Hardware design
6.4.2 Internal reset circuit
Note:
RPU ranges from 30 kOhm 50 kOhm internally
Rrst should be from 1KOhm to 10KOhm
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7
Regulatory compliance
7.1
FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to
provide reasonable protection against harmful interference in approved installations. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
This device may not cause harmful interference, and this device must accept any interference received,
including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render
void the user's authority to operate this equipment.
The safe user distance, for RF Exposure, is ≥ 5mm (in compliance with 447498 D01 General RF Exposure
Guidance v06).
Modular approval
FCC ID: S9NSPBT30DP1
In accordance with FCC part 15, the SPBT3.0DP1 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters
must comply with colocation and RF exposure requirements in accordance with FCC multi-transmitter
product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20 cm
from persons including but not limited to body worn and hand held devices) may require separate
approval.
7.1.1 Labeling instructions
When integrating the SPBT3.0DP1 into the final product, the OEM must ensure that the FCC labeling
requirements are satisfied. A statement must be included on the exterior of the final product which
indicates the product includes a certified module. The label should state the following (or similar wording
that conveys the same meaning):
Contains FCC ID: S9NSPBT30DP1
OR
This product contains FCC ID: S9NSPBT30DP1
The OEM must include the following statements on the exterior of the final product unless the product is
too small (e.g. less than 4 x 4 inches) This device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions: this device may not cause harmful interference, and this device
must accept any interference received, including any interference that may cause undesired operation.
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7.1.2 Product manual instructions
This section applies to OEM final products containing the SPBT3.0DP1 module, subject to FCC compliance.
The final product manual must contain the following statement (or a similar statement that conveys the
same meaning):
Warning: Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. (Part. 15.21)
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement
must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the
following statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in which case the user will be
required to correct the interference at his expense.
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7.2 IC certification
The SPBT3.0DP1 module has been tested and found compliant with the IC RSS-247 rules. These limits are
designed to provide reasonable protection against harmful interference in approved installations. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-247 of the IC rules. Operation is subject to the following two conditions:
this device may not cause harmful interference, and this device must accept any interference received,
including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render
void the user's authority to operate this equipment.
The safe user distance, for RF Exposure, is ≥ 15mm (in compliance with RSS-102 Issue 5).
Modular approval
IC: 8976C-SPBT301
In accordance with IC RSS-247, the SPBT3.0DP1 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters
must comply with colocation and RF exposure requirements in accordance with IC multi-transmitter
product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20cm
from persons including but not limited to body worn and hand held devices) may require separate
approval.
7.2.1 Labeling instructions
When integrating the SPBT3.0DP1 into the final product, the OEM must ensure that the IC labeling
requirements are satisfied. A statement must be included on the exterior of the final product which
indicates that the product includes a certified module. The label should state the following (or similar
wording that conveys the same meaning):
Contains IC ID: 8976C-SPBT301
OR
This product contains IC ID: 8976C-SPBT301
The OEM must include the following statements on the exterior of the final product unless the product is
too small (e.g. less than 4 x 4 inches):
This device complies with RSS-247 of the IC Rules. Operation is subject to the following two conditions:
this device may not cause harmful interference, and this device must accept any interference received,
including any interference that may cause undesired operation.
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7.2.2 Product manual instructions
This section applies to OEM final products containing the SPBT3.0DP1 module, subject to IC compliance.
The final product manual must contain the following statement (or a similar statement that conveys the
same meaning):
Warning: Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment. (RSS-247)
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement
must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to RSS-247 of the IC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the
following statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to RSS-247 of the IC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in which case the user will be
required to correct the interference at his expense.
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7.3 Bluetooth certification
Module with embedded stack and profile has been qualified according to SIG qualification rules:
–
–
–
–
Bluetooth SIG Declaration ID: zzzzzz
Product type: End Product
Core spec version: 3.0
Product descriptions: Bluetooth module, spec V3.0
7.4 CE certification
Module has been certified according to following certification rules:
–
–
–
–
–
–
CE Expert opinion: vvvvvv
Measurements have been performed in accordance with (report available on
request):
EN 300 328
EN 301 489
EN 301 489
EN60950
CE certified:
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8
Traceability
Each module is univocally identified by serial number stored in a 2D data matrix laser
marked on the bottom side of the module itself.
The serial number has the following format: WW YY D FF NNN
Table 6: Traceability information
Letter
Meaning
WW
week
YY
year
Product ID number
FF
Production panel coordinate identification
NN
Progressive serial number
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
January 2016
DocID0xxxxx Rev 0.17
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without notice. www.st.com
9
Ordering information
Table 7: Ordering information
Order code
SPBT3.0DP1
January 2016
Description
Class 1 OEM Bluetooth Antenna Module
Packing
TBD
MOQ
pcs
DocID0xxxxx Rev 0.17
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Regulatory compliance
10
SPBT3.0DP1
Revision history
Table 8: Document revision history
Date
12-April-2016
January 2016
Revision
0.1
Changes
First release
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
Regulatory compliance
SPBT3.0DP1
Déclaration de conformité
A.1
Certification FCC
Le module SPBT3.0DP1 a été testé et déclaré conforme avec la section 15 de la
Règlementation FCC. Ces limitations sont stipulées afin de procurer une protection
raisonnable contre les interférences gênantes dans les installations approuvées. Cet
appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en
conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes
sur les communications radio.
Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une
installation particulière.
Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est
soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer
d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y
compris des interférences qui peuvent provoquer un fonctionnement non désiré.
Tout changement ou modification fait(e) à cet appareil et non expressément
approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire
fonctionner l’appareil.
Approbation du module
FCC ID: S9NSPBT30DP1
Conformément à la section 15 des règlements FCC, le module SPBT3.0DP1 est répertorié
comme un dispositif émetteur modulaire.
Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant
plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition
RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs
fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins
de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent
nécessiter d'une approbation séparée.
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
Regulatory compliance
A.1.1
SPBT3.0DP1
Instructions d'étiquetage
Lors de l'intégration du module SPBT3.0DP1 dans le produit final, le fabricant doit
s’assurer que les exigences en matière d'étiquetage de la FCC sont satisfaites . Une
déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le
produit comprend un module certifié. L'étiquette doit comporter les informations suivantes
(ou une mention analogue que recouvre la même notion):
Contient FCC ID: S9NSPBT30DP1
OU
Ce produit contient FCC ID: S9NSPBT30DP1
Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final
à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces):
Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est
soumise aux deux conditions suivantes:
(1) cet appareil ne doit pas causer d'interférences nocives, et
(2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui
peuvent provoquer un fonctionnement non désiré.
A1
DocID temporary Rev1
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
A.1.2
Instructions pour l’utilisation du produit
La présente section concerne les produits finis contenant le module SPBT3.0DP1,
assujettis aux normes FCC. Le manuel du produit final doit contenir la déclaration
suivante (ou une mention analogue que recouvre la même notion):
“ Avertissement: Les changements ou modifications non expressément approuvés par
la partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur
de faire fonctionner cet équipement. (Section 15.21)”
Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la
Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du
produit finis:
“Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans
le cadre de la classe B des appareils numériques, définies par la section 15 du règlement
de la FCC. Ces limites sont conçues pour fournir une protection raisonnable contre toute
interférence dangereuse issue d'une installation résidentielle. Cet équipement produit,
utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé
conformément aux présentes instructions, peut causer des interférences nuisibles aux
communications radio. Cependant, il se peut que des interférences se produisent dans
une installation particulière. Si cet appareil cause des interférences nuisibles à la
réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et
en éteignant l'appareil, on encourage l'utilisateur d'essayer de corriger ces interférences
par l'un des moyens suivants:
–
Réorienter ou repositionner l'antenne de réception.
–
Augmenter la distance séparant l’équipement du récepteur.
–
Connecter l’équipement à une prise appartenant à un circuit différent de celui
sur lequel le récepteur est connecté.
–
Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de
l’aide.”
Dans le cas où le produit fini d’un sous-traitant rentre dans les limites imposées aux
appareils numériques de classe A, les énoncés suivants doivent être inclus dans le
manuel du produit finis:
“REMARQUE : Cet appareil a été testé et certifié conforme aux spécifications d'un
appareil électronique de classe A (class A digital device), conformément à la partie 15 du
règlement de la FCC. Ces contraintes sont destinées à fournir une protection raisonnable
contre les interférences nuisibles quand l'appareil est utilisé dans une installation
commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique
et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer
des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans
une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra
corriger les interférences à ses propres frais.”
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
A.2
Certification IC (a)
Le module SPBT3.0DP1 a été testé et déclaré conforme avec la Règlementation IC
CNR-210. Ces limitations sont stipulées afin de procurer une protection raisonnable
contre les interférences gênantes en installations approuvées. Cet appareil génère, utilise
et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les
instructions dont il fait l’objet, peut causer des interférences gênantes sur les
communications radio.
Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une
installation particulière.
Ce produit répond aux exigences de la norme CNR-210 d'Industrie Canada. Son
fonctionnement est soumis aux deux conditions suivantes:
(1) cet appareil ne doit pas causer d'interférences nocives, et
(2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui
peuvent provoquer un fonctionnement non désiré.
Tout changement ou modification fait(e) à cet appareil et non expressément
approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire
fonctionner l’appareil.
Approbation du module
IC: 8976C-SPBT301
Conformément à IC CNR-210, le module SPBT3.0DP1 est répertorié comme un dispositif
émetteur modulaire
Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant
plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition
RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs
fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins
de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent
nécessiter d'une approbation séparée.
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
A.2.1
Instructions d'étiquetage
Lors de l'intégration du module SPBT3.0DP1 dans le produit final, le fabricant doit
s’assurer que les exigences en matière d'étiquetage de la IC sont satisfaites . Une
déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le
produit comprend un module certifié. L'étiquette doit comporter les informations suivantes
(ou une mention analogue que recouvre la même notion):
Contient IC ID: 8976C-SPBT301
OU
Ce produit contient IC ID: 8976C-SPBT301
Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final
à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces):
Cet appareil est en conformité aux normes IC. L’utilisation est soumise aux deux
conditions suivantes:
(1) cet appareil ne doit pas causer d'interférences nocives, et
(2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui
peuvent provoquer un fonctionnement non désiré
A.2.2
Instructions pour l’utilisation du produit
La présente section concerne les produits finis contenant le module SPBT3.0DP1,
assujettis aux normes IC. Le manuel du produit final doit contenir la déclaration suivante
(ou une mention analogue que recouvre la même notion):
“Avertissement: Les changements ou modifications non expressément approuvés par la
partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur de
faire fonctionner cet équipement. (CNR-210)”
Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la
Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du
produit finis:
“ Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans
le cadre de la classe B des appareils numériques, définies par la norme CNR-210
d'Industrie Canada.
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
Ces limites sont conçues pour fournir une protection raisonnable contre toute
interférence dangereuse issue d'une installation résidentielle. Cet équipement produit,
utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé
conformément aux présentes instructions, peut causer des interférences nuisibles aux
communications radio. Cependant, il se peut que des interférences se produisent dans
une installation particulière. Si cet appareil cause des interférences nuisibles à la
réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et
en éteignant l'appareil, nous encourageons l'utilisateur à essayer de corriger ces
interférences par l'un des moyens suivants:
–
Réorienter ou repositionner l'antenne de réception.
–
Augmenter la distance séparant l’équipement du récepteur.
–
Connecter l’équipement à une prise appartenant à un circuit différent de celui
sur lequel le récepteur est connecté.
–
Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de
l’aide.”
Dans le cas où le produit finis d’un fabriquant OEM rentre dans le cadre des limites
imposées aux appareils numériques de classe A, les énoncés suivants doivent être inclus
dans le manuel du produit finis:
“ REMARQUE: Cet appareil a été testé et certifié conforme aux spécifications d'un appareil
électronique de classe A (class A digital device), conformément à la norme CNR-210
d'Industrie Canada. Ces contraintes sont destinées à fournir une protection raisonnable
contre les interférences nuisibles quand l'appareil est utilisé dans une installation
commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique
et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer
des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans
une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra
corriger les interférences à ses propres frais.”
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
A.3
Certification CE
Le module SPBT3.0DP1 a obtenu une certification de conformité aux normes suivantes:
–
EN 300 328 V1.8.1 :2012
–
EN 300 328 V1.9.1 :2015
–
EN 301 489-17 V2.2.1 :2009
–
EN 301 489-1 V1.9.2:2011
–
EN 62479 :2010
–
EN60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2 :2013
Le module est certifié CE:
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
IMPORTANT NOTICE - PLEASE READ CAREFULLY:
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information
on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products
No license, express or implied, to any intellectual property rights is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics - All rights reserved
www.st.com
January 2016
DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com

---

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Title                           : Bluetooth® technology class-2 module
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