ST Microelectronics S R L ZB260A ZigBee Module User Manual SPZB260

ST Microelectronics S.R.L. ZigBee Module SPZB260

Users Manual

September 2007 Rev 1 1/1414SPZB260ZigBee moduleFeatures■Integrated 2.4GHz ,IEEE 802,15,4-compliant transceiver:– 0 dBm nominal TX output power – -92 dBm RX sensitivity– + 2 dBm in boost mode– RX filtering for co-existence with IEEE 802.11g and Bluetooth devices– Integrated VCO and loop filter■Integrated IEEE 802.15.4 PHY and MAC ■Controlled by a Standard Serial Line for an easy interface of host microcontrollers (SPI)■Embedded flash and integrated RAM for program and data storage ■On board 24 MHz stable Xtal■Integrated RC oscillator ( typ 10KHz) for low power operation■1 µA power consumption in Deep sleep mode■Watchdog timer and power on reset■Pins available for Non-intrusive debug interface (SIF)■Single supply voltage 2.1 to 3.6 Vdc.■Available Link and Activity outputs for external ■Indication / monitor ■CE compliant■FCC compliant ( FCC ID:S9NZB260A )Applications■Industrial controls■Sensor networking■Monitoring of remote systems ■Home applications■Security systems■Lighting controlsDescriptionSPZB260 is a low power consumption ZigBee module optimized for embedded applications. It enables OEMs to easily add wireless capability to electronic devices.The module is based on SN260 ZigBee Network Processor which integrates a 2.4GHz, IEEE 802.15.4-compliant transceiver as well as IEEE 802.15.4 PHY and MAC.24 MHz high stability Xtal is available aboard the module to perform the timing requirements as per ZigBee specifications.A single supply voltage is requested to power the module. An integrated 2.5 GHz specific Murata antenna is aboard. The voltage supply also determines the I/O ports level allowing an easy interface with the host system.The module is controlled by means of a standard serial interface (SPI) allowing the connections to a variety of Host microcontrollers.( for other information and details, please refer to SN260 Datasheet available at www.st.com )www.st.com
Contents SPZB2602/14 Contents1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.2 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.3 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10A.1 Label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11A.2 Special requirement for Modular application . . . . . . . . . . . . . . . . . . . . . . . 116 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
SPZB260 Block diagram 3/141 Block diagramFigure 1. Block diagram2 Pin settings2.1 Pin connectionsFigure 2. Pin connection diagram24 MHzXTALSN 260 Tranceiver Balun Filter Vdd SIF SPI C ONTR SIGN RF antenna
Pin settings SPZB2604/14 2.2 Pin descriptionTable 1. Pin description Pin n Pin name Direction Description1 RSTB I Active low reset ( an internal pull-up of 30 kohm typ is provided)2 HOST_INT O Host Interrupt Signal ( from ZB Module to Host) 3 SPI_SSEL I SPI Slave Select ( from Host to ZB Module)4 SPI MOSI I SPI Data , Master Out / Slave In ( from host to ZB Module)5 SPI MISO O SPI Data , Master In / Slave Out ( from ZB Module to host)6 SPI_CLK I SPI clock7 GND --- Ground8VDD --- Input power supply 9SIF_CLK INon-intrusive debug InterfaceSerial interface Clock Signal ( internal pulldown)10 SIF_MISO O Non-intrusive debug InterfaceSerial interface Master IN/ Slave Out11 SIF_MOSI INon-intrusive debug InterfaceSerial interface Master Out/ Slave In To guarantee a proper signal level when in deep sleep mode connect a 10kΩ resistor to GND12 SIF_LOADB I/ONon-intrusive debug InterfaceSerial interface Load strobe ( Open collector with internal pull-up)To improve noise immunity connect a 10kΩ resistor to VDD13 PTI_EN O Frame Signal of Packet Trace Interface (PTI)14 PTI_DATA O Data Signal of Packet Trace Interface (PTI)15 WAKE I Wake Interrupt Signal from Host to ZB Module 16 ACTIVITY O Activity signal for application debug /monitor17 SDBG O
SPZB260 Maximum ratings 5/143 Maximum ratings3.1 Absolute maximum ratings 3.2 Operating ranges Table 2. Absolute maximum ratingsSymbol Parameter Values Unit Min MaxVDD Module supply voltage -0.3 3.6 VVIN Input voltage on any digital pin -0.3 Vdd+0.3 VTstg Storage temperature -40 +85 °CTsold Soldering temperature < 10s 240Table 3. Operating rangesSymbol Parameter ConditionsValuesUnitMin Typ MaxVDD Module supply voltage - 20°C < T < 70 °C 2.1 3.3 3.6 VTstgOperating ambient temperature -20 +70 °C
Electrical characteristics SPZB2606/14 4 Electrical characteristics 4.1 DC electrical characteristics 4.2 DC I/O specificationTable 4. DC electrical characteristics Symbol Parameter ConditionsValuesUnitMin Typ MaxIRX RX current ( boost mode) Vdd = 3.0 V, T = 25 °C 38 mAIRX RX current ( normal mode) Vdd = 3.0 V, T = 25 °C 36 mAITX TX current ( boost mode) Vdd = 3.0 V, T = 25 °C 42 mAITX TX current (normal mode) Vdd = 3.0 V, T = 25 °C 36 mAIDS Deep sleep current 2.1 < Vdd < 3.6 VT = 25°C 1µATable 5. DC Input / Output specificationSymbol Parameter ConditionsValuesUnitMin Typ MaxVIL Low Level Input Voltage 2.1 < Vdd < 3.6 V 0 0.2 x Vdd VVIH High level input voltage 2.1 < Vdd < 3.6 V 0.8 x Vdd Vdd VIil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mAIih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mARipu Input pull-up resistor 30 kΩRipd Input pull-down resistor 30 kΩVOL Low level output voltage 0 0.18 x Vdd VVOH High level output voltage 0.82 x Vdd Vdd VIOHS Output source current 4 mAIOLS Output sink current 4 mAIOHH Output source current (pin 15,16,17) 8 mAIOLH Output sink current (pin 15,16,17) 8 mAIOTot Total output current for I/O 40 mA
SPZB260 Electrical characteristics 7/144.3 RF electrical characteristicsTable 6. RF electrical characteristicsSymbol Parameter ConditionsValuesUnitMin Typ MaxFrequency range 2.1 < Vdd < 3.6 V 2405 2480 MHzTX Output power 0 dBmRX Sensitivity Vdd = 3.0V, 1% PER -92 dBmCFE Carrier frequency error Vdd=3.0V -20 / + 70 °C -40 40 ppmError Vector magnitude Normal / boost mode 15 25 %Adjacent channel rejection +/- 5 MHz+/- 10 MHZ3540 dBm
Mechanical dimensions SPZB2608/14 5 Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.Figure 3. Mechanical dimensions
SPZB260 Mechanical dimensions 9/14Figure 4. Solder pad layout
FCC statement SPZB26010/14 Appendix A FCC statementThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:●Reorient or relocate the receiving antenna●Increase the separation between the equipment and receiver●Connect the equipment into an outlet on a circuit different from that to which the receiver is connectedConsult the dealer or an experienced radio/TV technician for help.AntennaOur module type SPZB260 is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used. CautionAny changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment.
SPZB260 FCC statement 11/14A.1 Label instructionInstruction manual for FCC ID labelingModule type: ZigBee module SPZB260FCC-ID: S9NZB260AThis intends to inform you how to specify the FCC ID of our ZigBee module SPZB260 on your final product.Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB260A or “Contains FCC ID: S9NZB260A , any similar wording that expressed the same meaning may be use.It shows an example belowA.2 Special requirement for Modular applicationThe following requirements are fulfilled:1. The modular transmitter must have its own RF shielding:The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding.2. The modular transmitter must have buffered modulation/data inputs:The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles.3. The modular transmitter must have its own power supply regulation:The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized.4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used.5. The modular transmitter must be tested in a stand-alone configuration:The RF module was tested in a stand-alone configuration. 6. The modular transmitter must be labelled with its own FCC ID number:The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. Contains FCC ID: S9NZB260A
FCC statement SPZB26012/14 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide.8. The modular transmitter must comply with any applicable RF exposure requirements. ●Maximum measured power output: 3,08 mW●Maximum antenna gain: 0,6 dBi = numeric gain 1,148 (see also FCC test report)Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm². The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation.
SPZB260 Revision history 13/146 Revision history Table 7. Document revision historyDate Revision Changes07-Sep-2007 1 First release
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