ST Microelectronics S R L ZB260B ZigBee Module User Manual SPZB260C PRO SPZB260A PRO 1
ST Microelectronics S.R.L. ZigBee Module SPZB260C PRO SPZB260A PRO 1
Users Manual
SPZB260C-PRO
SPZB260A-PRO
ZigBee® MODULE
June 2009
FEATURES
• Integrated 2.4 GHz, IEEE 802.15.4 compliant
transceiver (PHY and MAC)
• + 3 dBm nominal TX output power
(at UFL connector level)
• + 5 dBm in boost mode
• -95 dBm typ RX sensitivity
• RX filtering for co-existence with IEEE
802.11g and Bluetooth devices
• Integrated VCO and loop filter
• Enabled access to EZSP over synchronous serial
interface (SPI) or to EZSP over asynchronous
serial (UART)
• Integrated EmberZNet network stack version 3.1.1
for SPI access
• Embedded flash and integrated RAM for program
and data storage
• On board 24 MHz stable Xtal
• Integrated RC oscillator ( typ 10KHz) for low
power operation
• Operation over the industrial temperature range of
-40°C to +85°C
• 1 uA power consumption in deep sleep mode
• Watchdog timer and power on reset
• Pins available for Non-Intrusive debug interface
(SIF)
• Single supply voltage (2.1V to 3.6V)
• Available Link and Activity outputs for external
Indication / monitor
• Integrated RF UFL connector for external antenna
(SPZB260C-PRO) or integrated antenna
(SPZB260A-PRO )
• CE compliant
• FCC compliant (FCC ID: S9NZB260B)
APPLICATIONS
• Industrial controls
• Sensor Networking
• Monitoring of remote systems
• Home applications
• Security systems
• Lighting controls
DESCRIPTION
SPZB260C-PRO /SPZB260A-PRO is a low power
consumption ZigBee ® module optimized for embedded
applications. It enables OEMs to easily add wireless
capability to electronic devices.
The module is based on the SN260 ZigBee® Network
Processor which integrates a 2.4GHz, IEEE 802.15.4-
compliant RF and MAC.
A single supply voltage is requested to power the module.
The voltage supply also determines the I/O port level
allowing an easy interface with the host system .
SPZB260C-PRO integrates a RF UFL connector allowing
the use of an external antenna.
SPZB260A-PRO has a specific 2.4GHz Murata
integrated antenna aboard.
The module allows a great flexibility in its integration with
an host processor as it allows connection with the external
controller via SPI or UART interfaces.
For other information and details, please refer to SN260
datasheet available at www.st.com )
SPZB260C-PRO / SPZB260A-PRO
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Contents
1 Block diagram ……………………………………………………………………………. 3
2 Pin Setting………. …………………………………………………………………………3
2.1 Pin connection …………………………………………………………………………………….……… 3
2.2 Pin description …………………………………………………………………………………………..…4
3 Maximum rating………..………………………………………………………………. 4
3.1 Absolute Maximum Ratings …………………………………………………………… 4
3.2 Recommended Operating Conditions ……..…………………………………………… 5
4 Electrical characteristics .………………………………………………………………. 4
4.1 DC Electrical characteristics …………………………………………………………… 5
4.2 Digital I/O Specifications …………………………………………………………….. 5
4.3 RF Electrical characteristics …………………………………………………………… 5
5 Package Mechanical Dimensions ……………………………………………………….. 6
6 Soldering ………………………………………………………………………………… 7
Appendix A FCC Statement ………………………………………………………………… 8
A
.1 Label Instruction ………………………………………………………………………8
A.2 Special requirement for Modular application ………………………………………………9
SPZB260C-PRO / SPZB260A-PRO
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1 - BLOCK DIAGRAM
2 - PIN SETTING
2.1 PIN CONFIGURATION
Figure 3. Pin Configuration
Figure 1. SPZB260C-PRO block diagram
24 MHz
XTAL
SN 260
Tranceiver Balun
Filter
Vdd
SIF
SPI / UART
CONTR SIGN
RF
antenna
24 MHz
XTAL
SN 260
Tranceiver Balun
Filter
Vdd
SIF
SPI / UART
CONTR SIGN
RF antenna
Figure 2. SPZB260A-PRO block diagram
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2.2 – PIN DESCRIPTION
The SPZB260C-PRO/ SPZB260A-PRO allows the use of EZSP application from SPI or UART.
The pin description is given in table1 for both the configurations. Note that the SPZB260C-PRO / SPZB260A-PRO is shipped
with the SPI EZSP application installed.
Table1. Pin Description
Pin # PIN Name Direction Description
SPI Mode UART Mode
1 RTS O Not used RTS signal ( 10kΩ pull-up to VDD )
2 RSTB I Active low reset ( a pull-up of 10 kohm typ is provided with 10nF to GND )
3 HOST_INT /
RXD
O /I Host Interrupt Signal ( from ZB Module to
Host) (SPI Mode)
RXD signal
4 SPI_SSEL /
CTS
I SPI Slave Select ( from Host to ZB
Module)
CTS signal
5 SPI MOSI I SPI Data , Master Out / Slave In ( from
host to ZB Module)
Not used
6 SPI MISO O SPI Data , Master In / Slave Out ( from
ZB Module to host)
Not used
7 SPI_CLK I SPI clock Not used
8 GND --- Ground
9 VDD --- Input power supply
10 TXD O Not used TXD signal ( 10kΩ pull-up to VDD )
11 SIF_CLK I Non-intrusive debug Interface
Serial interface Clock Signal ( internal pull-down)
12 SIF_MISO O Non-intrusive debug Interface
Serial interface Master IN/ Slave Out
13 SIF_MOSI I Non-intrusive debug Interface
Serial interface Master Out/ Slave In
To guarantee a proper signal level when in deep sleep mode a 10kΩ resistor to GND is provided
14 SIF_LOADB I/O Non-intrusive debug Interface
Serial interface Load strobe ( Open collector with internal pull-up).
To improve noise immunity a 10kΩ resistor to Vdd is provided
15 PTI_EN O Frame Signal of Packet Trace Interface (PTI)
16 PTI_DATA O Data Signal of Packet Trace Interface (PTI)
17 WAKE I Wake Interrupt Signal from Host to ZB Module
18 ACTIVITY O Activity signal for application debug /monitor
19 SDBG O Spare debug signal
3 – ELECTRICAL CHARACTERISTICS
3.1 - ABSOLUTE MAXIMUM RATINGS
Table 2. Absolute maximum ratings
Symbol Parameter Min Max Unit
VDD Module supply voltage - 0.3 3.6 V
Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V
Tstg Storage tempeature -40 +85 °C
Tsold. Soldering temperature < 10s 250 °C
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3.2 - RECOMMENDED OPERATING CONDITIONS
Table 3. Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VDD Module supply voltage -40°C < T < 85°C 2.1 3.3 3.6 V
Tstg Operating ambient temperature -40 +85 °C
4 - ELECTRICAL CHARACTERISTICS
4.1 – DC ELECTRICAL CHARACTERISTICS
Tabl4. DC Electrical Characteristics
Symbol Parameter Conditions Min Typ Max Unit
IRX RX current ( boost mode) Vdd = 3.0 V T= 25 °C 38 mA
IRX RX current ( normal mode) Vdd = 3.0 V T= 25 °C 36 mA
ITX TX current ( boost mode) Vdd = 3.0 V T= 25 °C
42 mA
ITX TX current (normal mode) Vdd = 3.0 V T= 25 °C
36 mA
IDS Deep Sleep Current 2.1 < Vdd < 3.6 V
T = 25°C
1
µΑ
4.2 - DIGITAL I/O SPECIFICATIONS
Table5. Digital I/O Specifications
Symbol Parameter Conditions Min Typ Max Unit
VIL Low Level Input Voltage 2.1 < Vdd < 3.6 V 0 0.2 x
Vdd
V
VIH High level input voltage 2.1 < Vdd < 3.6 V 0.8 x Vdd Vdd V
Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 µΑ
Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 µΑ
Ripu Input pull-up resistor 30 κΩ
Ripd Input pull-down resistor 30 κΩ
VOL Low level output voltage 0 0.18 x
Vdd
V
VOH High level output voltage 0.82 x Vdd Vdd V
IOHS Output source current
(standard pin)
4 mA
IOLS Output sink current
(standard pin)
4 mA
IOHH Output source current (pin 17,18,19 ) 8 mA
IOLH Output sink current (pin 17,18,19 ) 8 mA
IOTot Total output current for I/O pins 40 mA
4.3 - RF ELECTRICAL CHARACTERISTICS
Table6. RF Electrical Characteristics (with UFL connector )
Symbol Parameter Conditions Min Typ Max Unit
Frequency range 2.1 < Vdd < 3.6 V 2405 2480 MHz
TX Output power Vdd = 3.0V F= 2450 Mhz 3 dBm
RX Sensitivity Vdd = 3.0V 1% PER -95 dBm
Carrier frequency error Vdd=3.0V -20 / + 70 °C
-40 40 ppm
SPZB260C-PRO / SPZB260A-PRO
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5- Package mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 4. Mechanical dimension
Figure 5. Solder pad layout
SPZB260C-PRO / SPZB260A-PRO
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6 - SOLDERING
Soldering phase has to be execute with care : in order to avoid undesired melting phenomenon, particular attention has to be take
on the set up of the Peak Temperature.
Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C ,July 2004 recommendations.
Table7. Soldering profile Profile feature PB free assembly
Average ramp up rate ( TSMAX to TP) 3°C / sec max
Preheat
Temperature min ( TS MIN)
Temperature max ( TS MAX)
Time (TS MIN to TS MAX) ( tS )
150 ° C
200 ° C
60 – 100 sec
Time maintained above :
Temperature TL
Time tL
217 ° C
40 – 70 sec
Peak Temperature (Tp) 240+0 ° C
Time within 5°C of actual peak temperature (tP) 10 – 20 sec
Ramp down rate 6 °C / sec
Time from 25° C to peak temperature 8 minutes max
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Appendix A - FCC Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
− Reorient or relocate the receiving antenna
− Increase the separation between the equipment and receiver
− Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected
Consult the dealer or an experienced radio/TV technician for help
Antenna
Our module type SPZB260C-PRO / SPZB260A-PRO is for OEM integrations only. The end-user product will be
professionally installed in such a manner that only the authorized antennas are used.
Caution
Any changes or modifications not expressed approved by the part responsible for compliance could cause the
module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment.
.
A.1 - LABEL INSTRUCTION
INSTRUCTION MANUAL FOR FCC ID LABELING
Module type : ZigBee modules SPZB260C-PRO / SPZB260A-PRO
FCC-ID : S9NZB260B
This intends to inform you how to specify the FCC ID of our ZigBee modules SPZB260C-PRO /
SPZB260A-PRO in your final product.
Based on the Public Notice from FCC, the product into which our transmitter module is installed must
display a label referring to the enclosed module.
The label should use wording such as “Contains Transmitter module FCC ID: S9NZB260B or “Contains
FCC ID: S9NZB260B , any similar wording that expressed the same meaning may be use.
It shows an example below
Contains FCC ID: S9NZB260B
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A.2 - Special requirement for Modular application
The following requirements are fulfilled:
1) The modular transmitter must have its own RF shielding:
The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding.
2) The modular transmitter must have buffered modulation/data inputs:
The module has a memory management unit inside of the IC. The processor interfacing with the external application
by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module
exchanging data and command with it. Inside the processor a flash memory is available to download the customer
application and the ZigBee profiles.
3) The modular transmitter must have its own power supply regulation:
The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by
temperature changes or other effects), the internal voltage will be stabilized.
4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204:
The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be
professionally installed in such a manner that only the authorized antenna is used.
5) The modular transmitter must be tested in a stand-alone configuration:
The RF module was tested in a stand-alone configuration.
6) The modular transmitter must be labelled with its own FCC ID number:
The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product,
the label is not visible. The OEM manufacturer is instructed how to apply the exterior label.
7) The modular transmitter must comply with any specific rule or operating requirements applicable to the
transmitter and the manufacturer must provide adequate instructions along with the module to explain any such
requirements:
The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide.
8) The modular transmitter must comply with any applicable RF exposure requirements.
• Maximum measured power output: 3,17 mW
• Maximum antenna gain:2.2 dBi = numeric gain 1,66 (see also FCC test report)
Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm².
The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits;
furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from
routine environmental evaluation.
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