ST Microelectronics S R L ZB260B ZigBee Module User Manual SPZB260C PRO SPZB260A PRO 1
ST Microelectronics S.R.L. ZigBee Module SPZB260C PRO SPZB260A PRO 1
Users Manual
SPZB260C-PRO SPZB260A-PRO ZigBee® MODULE June 2009 FEATURES • Integrated 2.4 GHz, IEEE 802.15.4 compliant transceiver (PHY and MAC) • + 3 dBm nominal TX output power (at UFL connector level) • + 5 dBm in boost mode • -95 dBm typ RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Enabled access to EZSP over synchronous serial interface (SPI) or to EZSP over asynchronous serial (UART) • Integrated EmberZNet network stack version 3.1.1 for SPI access • Embedded flash and integrated RAM for program and data storage • On board 24 MHz stable Xtal • Integrated RC oscillator ( typ 10KHz) for low power operation • Operation over the industrial temperature range of -40°C to +85°C • 1 uA power consumption in deep sleep mode • Watchdog timer and power on reset • Pins available for Non-Intrusive debug interface (SIF) • Single supply voltage (2.1V to 3.6V) • Available Link and Activity outputs for external Indication / monitor • Integrated RF UFL connector for external antenna (SPZB260C-PRO) or integrated antenna (SPZB260A-PRO ) • CE compliant • FCC compliant (FCC ID: S9NZB260B) APPLICATIONS • Industrial controls • Sensor Networking • Monitoring of remote systems • Home applications • Security systems • Lighting controls DESCRIPTION SPZB260C-PRO /SPZB260A-PRO is a low power consumption ZigBee ® module optimized for embedded applications. It enables OEMs to easily add wireless capability to electronic devices. The module is based on the SN260 ZigBee® Network Processor which integrates a 2.4GHz, IEEE 802.15.4compliant RF and MAC. A single supply voltage is requested to power the module. The voltage supply also determines the I/O port level allowing an easy interface with the host system . SPZB260C-PRO integrates a RF UFL connector allowing the use of an external antenna. SPZB260A-PRO has a specific 2.4GHz Murata integrated antenna aboard. The module allows a great flexibility in its integration with an host processor as it allows connection with the external controller via SPI or UART interfaces. For other information and details, please refer to SN260 datasheet available at www.st.com ) SPZB260C-PRO / SPZB260A-PRO Contents Block diagram ……………………………………………………………………………. 3 Pin Setting………. …………………………………………………………………………3 2.1 Pin connection …………………………………………………………………………………….……… 3 2.2 Pin description …………………………………………………………………………………………..…4 Maximum rating………..………………………………………………………………. 4 3.1 Absolute Maximum Ratings …………………………………………………………… 4 3.2 Recommended Operating Conditions ……..…………………………………………… 5 Electrical characteristics .………………………………………………………………. 4 4.1 DC Electrical characteristics …………………………………………………………… 5 4.2 Digital I/O Specifications …………………………………………………………….. 5 4.3 RF Electrical characteristics …………………………………………………………… 5 Package Mechanical Dimensions ……………………………………………………….. 6 Soldering ………………………………………………………………………………… 7 Appendix A FCC Statement ………………………………………………………………… 8 A.1 Label Instruction ………………………………………………………………………8 A.2 Special requirement for Modular application ………………………………………………9 2/10 SPZB260C-PRO / SPZB260A-PRO 1 - BLOCK DIAGRAM Vdd SIF RF antenna 24 MHz XTAL SN 260 Tranceiver SPI / UART Balun Filter CONTR SIGN Figure 1. SPZB260C-PRO block diagram Vdd SIF SPI / UART 24 MHz XTAL SN 260 Tranceiver RF antenna Balun Filter CONTR SIGN Figure 2. SPZB260A-PRO block diagram 2 - PIN SETTING 2.1 PIN CONFIGURATION Figure 3. Pin Configuration 3/10 SPZB260C-PRO / SPZB260A-PRO 2.2 – PIN DESCRIPTION The SPZB260C-PRO/ SPZB260A-PRO allows the use of EZSP application from SPI or UART. The pin description is given in table1 for both the configurations. Note that the SPZB260C-PRO / SPZB260A-PRO is shipped with the SPI EZSP application installed. Table1. Pin Description Pin # PIN Name Direction Description SPI Mode UART Mode RTS Not used RSTB Active low reset ( a pull-up of 10 kohm typ is provided with 10nF to GND ) HOST_INT / RXD SPI_SSEL / CTS SPI MOSI SPI MISO SPI_CLK GND --- Ground VDD --- Input power supply 10 TXD Not used 11 SIF_CLK 12 SIF_MISO 13 SIF_MOSI Non-intrusive debug Interface Serial interface Clock Signal ( internal pull-down) Non-intrusive debug Interface Serial interface Master IN/ Slave Out Non-intrusive debug Interface Serial interface Master Out/ Slave In O /I Host Interrupt Signal ( from ZB Module to Host) (SPI Mode) SPI Slave Select ( from Host to ZB Module) SPI Data , Master Out / Slave In ( from host to ZB Module) SPI Data , Master In / Slave Out ( from ZB Module to host) SPI clock RTS signal ( 10kΩ pull-up to VDD ) RXD signal CTS signal Not used Not used Not used TXD signal ( 10kΩ pull-up to VDD ) To guarantee a proper signal level when in deep sleep mode a 10kΩ resistor to GND is provided 14 SIF_LOADB I/O 15 PTI_EN Non-intrusive debug Interface Serial interface Load strobe ( Open collector with internal pull-up). To improve noise immunity a 10kΩ resistor to Vdd is provided Frame Signal of Packet Trace Interface (PTI) 16 PTI_DATA Data Signal of Packet Trace Interface (PTI) 17 WAKE Wake Interrupt Signal from Host to ZB Module 18 ACTIVITY Activity signal for application debug /monitor 19 SDBG Spare debug signal 3 – ELECTRICAL CHARACTERISTICS 3.1 - ABSOLUTE MAXIMUM RATINGS Table 2. Absolute maximum ratings Symbol VDD Vin Tstg Tsold. Parameter Module supply voltage Input voltage on any digital pin Storage tempeature Soldering temperature < 10s Min Max Unit - 0.3 - 0.3 -40 3.6 Vdd + 0.3 +85 250 °C °C 4/10 SPZB260C-PRO / SPZB260A-PRO 3.2 - RECOMMENDED OPERATING CONDITIONS Table 3. Recommended operating conditions Symbol VDD Tstg Parameter Module supply voltage Operating ambient temperature Conditions Min Typ Max Unit -40°C < T < 85°C 2.1 -40 3.3 3.6 +85 °C Typ Max Unit 4 - ELECTRICAL CHARACTERISTICS 4.1 – DC ELECTRICAL CHARACTERISTICS Tabl4. DC Electrical Characteristics Symbol Parameter Conditions Min IRX IRX RX current ( boost mode) RX current ( normal mode) Vdd = 3.0 V Vdd = 3.0 V T= 25 °C T= 25 °C 38 36 mA mA ITX TX current ( boost mode) Vdd = 3.0 V T= 25 °C 42 mA ITX TX current (normal mode) Vdd = 3.0 V T= 25 °C 36 mA IDS Deep Sleep Current µΑ Max Unit 0.2 x Vdd Vdd -0.5 0.5 2.1 < Vdd < 3.6 V T = 25°C 4.2 - DIGITAL I/O SPECIFICATIONS Table5. Digital I/O Specifications Symbol Parameter Conditions Min VIL Low Level Input Voltage 2.1 < Vdd < 3.6 V VIH Iil Iih Ripu Ripd High level input voltage Input current for logic 0 Input current for logic 1 Input pull-up resistor Input pull-down resistor 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V 0.8 x Vdd VOL Low level output voltage VOH IOHS High level output voltage Output source current (standard pin) Output sink current (standard pin) Output source current (pin 17,18,19 ) Output sink current (pin 17,18,19 ) Total output current for I/O pins IOLS IOHH IOLH IOTot Typ 30 30 0.82 x Vdd µΑ µΑ κΩ κΩ 0.18 x Vdd Vdd mA mA 40 mA mA mA 4.3 - RF ELECTRICAL CHARACTERISTICS Table6. RF Electrical Characteristics (with UFL connector ) Symbol TX RX Parameter Frequency range Output power Sensitivity Carrier frequency error Conditions Min 2.1 < Vdd < 3.6 V Vdd = 3.0V F= 2450 Mhz Vdd = 3.0V 1% PER Vdd=3.0V -20 / + 70 °C 2405 Typ Max Unit 2480 MHz dBm dBm ppm -95 -40 40 5/10 SPZB260C-PRO / SPZB260A-PRO 5- Package mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 4. Mechanical dimension Figure 5. Solder pad layout 6/10 SPZB260C-PRO / SPZB260A-PRO 6 - SOLDERING Soldering phase has to be execute with care : in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the Peak Temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C ,July 2004 recommendations. Table7. Soldering profile Profile feature Average ramp up rate ( TSMAX to TP) Preheat Temperature min ( TS MIN) Temperature max ( TS MAX) Time (TS MIN to TS MAX) ( tS ) Time maintained above : Temperature TL Time tL Peak Temperature (Tp) Time within 5°C of actual peak temperature (tP) Ramp down rate Time from 25° C to peak temperature PB free assembly 3°C / sec max 150 ° C 200 ° C 60 – 100 sec 217 ° C 40 – 70 sec 240+0 ° C 10 – 20 sec 6 °C / sec 8 minutes max 7/10 SPZB260C-PRO / SPZB260A-PRO Appendix A - FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: − Reorient or relocate the receiving antenna − Increase the separation between the equipment and receiver − Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help Antenna Our module type SPZB260C-PRO / SPZB260A-PRO is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used. Caution Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment. A.1 - LABEL INSTRUCTION INSTRUCTION MANUAL FOR FCC ID LABELING Module type : ZigBee modules FCC-ID : S9NZB260B SPZB260C-PRO / SPZB260A-PRO This intends to inform you how to specify the FCC ID of our ZigBee modules SPZB260C-PRO / SPZB260A-PRO in your final product. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB260B or “Contains FCC ID: S9NZB260B , any similar wording that expressed the same meaning may be use. It shows an example below Contains FCC ID: S9NZB260B 8/10 SPZB260C-PRO / SPZB260A-PRO A.2 - Special requirement for Modular application The following requirements are fulfilled: 1) The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2) The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles. 3) The modular transmitter must have its own power supply regulation: The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. 5) The modular transmitter must be tested in a stand-alone configuration: The RF module was tested in a stand-alone configuration. 6) The modular transmitter must be labelled with its own FCC ID number: The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. 7) The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. 8) The modular transmitter must comply with any applicable RF exposure requirements. • • Maximum measured power output: 3,17 mW Maximum antenna gain:2.2 dBi = numeric gain 1,66 (see also FCC test report) Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm². The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation. 9/10 SPZB260C-PRO / SPZB260A-PRO Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 200 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com http://www.st.com 10/10
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