Sagem Wireless 95MASV2C Transmitter module for mobile applications User Manual SCT TMO MASV2 SPEC 14 N1

Sagem Wireless Transmitter module for mobile applications SCT TMO MASV2 SPEC 14 N1

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TELEPHONIE MOBILE

MOBILE PHONES

Ref. : SCT TMO MASV2 SPEC 14 M

Date : 04/03/03

MO130 module for mobile applications

This document contains information on a product under development. SAGEM reserves the right to change or discontinue this product

without notice.

MO130 MODULE FOR

MOBILE APPLICATION

SPREADING:

Company Name Original Copies 1stpage

SAGEM SA / SCT F. ROMAO

O. HOLIN

T. GLASSON

F. BULTEAU

P. CAILLET

F. HADDED

R. PATINEC

P. RATAJCZYK

E. SOUBRANE

JC. SURBON

R. CRITON

T. FEIX

C. LABAUME

A. SEVENS

JM. ROBERT

M. BAPSERES

R. ALLIOT

D. QUIQUEREZ

P. QUENTIN

G. BADUEL

A. LAFOURCADE

Secretariat 38 (Archive)

CONCLUSION OR SUMMARY :

This document gives an overview of the MO130 module: a miniature, single-side board, tri-band GSM/GPRS

module, ready for integration in mobile application like vehicle-mounted or vending machines…

It describes the main functionalities of this module as well as the electrical interfaces, the mechanical

specification (dimension, form…) and the electrical specification of the module.

APPROBATION :

Writer Project manager IPDE

Name : E. SOUBRANE T. GLASSON O. HOLIN

Date : 28/03/03 28/03/03 28/03/03

Signature :

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without notice.

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Date : 28/03/03

MO130 module for mobile applications

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without notice.

MO130 MODULE

FOR MOBILE APPLICATION

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without notice.

REVISIONS

Version Date Writer Subject

A 17/01/02 E. Soubrane Document creation

B 25/02/02 E. Soubrane Modification: 120 pin connector pinout

C 02/05/02 E. Soubrane Modification: Battery connector pinout and functioning

modes description, consumption

D 11/08/02 E. Soubrane Pinout modifications, sensitivity, audio.

E 28/06/02 E. Soubrane V56, sensitivity

F 23/07/02 E. Soubrane DTR, DSR modification

G 06/09/02 E. Soubrane LEDs connection precision, mechanical dimension

precision, maximum capacitance on parallel bus

H 13/09/02 E. Soubrane VBACKUP, IO description, SIMCD

I 14/11/02 E. Soubrane BACKLCD/BACKKEY, Battery connector

J 06/01/03 E. Soubrane /

T. Glasson

IO description precision, mechanical scheme update,

humidity constraints. Compliance with FCC

guidelines, GCF-CC (V.3.5.0)

K 06/02/03 E. Soubrane Reset input level, V56 voltage in OFF mode

L 11/02/03 T. Glasson Certification procedure warnings

M 04/03/03 E. Soubrane VBAT max

N 28/03/03 T. Glasson Certification clarifications

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without notice.

INDEX

1. OVERVIEW................................................................................................................................................................. 5

1.1 OBJECT OF THE DOCUMENT................................................................................................................. 5

1.2 REFERENCE DOCUMENTS..................................................................................................................... 5

1.3 STANDARDS COMPLIANCE .................................................................................................................... 5

1.4 COMPLIANCE WITH FCC GUIDELINES .................................................................................................. 6

1.5 TERMS AND ABBREVIATION .................................................................................................................. 6

1.6 PRODUCT FEATURES ............................................................................................................................. 7

BLOC DIAGRAM................................................................................................................................................................. 9

3. FUNCTIONAL DESCRIPTION.................................................................................................................................. 10

3.1 SIM .......................................................................................................................................................... 10

3.2 AUDIO ..................................................................................................................................................... 10

3.3 DISPLAY.................................................................................................................................................. 11

3.4 PARALLEL INTERFACE ......................................................................................................................... 12

3.5 SPI INTERFACE...................................................................................................................................... 15

3.6 DATA ....................................................................................................................................................... 16

3.6.1 Data services .......................................................................................................................... 16

3.6.2 IrDA......................................................................................................................................... 16

3.6.3 UART 2 ................................................................................................................................... 16

3.6.4 V24 ......................................................................................................................................... 16

3.7 MULTIMEDIA........................................................................................................................................... 16

3.8 MELODIES GENERATION...................................................................................................................... 17

3.9 ANTENNA................................................................................................................................................ 17

3.10 KEYPAD .................................................................................................................................................. 19

3.11 DAI........................................................................................................................................................... 19

3.12 CLOCKS .................................................................................................................................................. 19

3.13 POWER MANAGEMENT AND CHARGE................................................................................................ 20

3.13.1 Battery..................................................................................................................................... 20

3.13.2 VRDBB.................................................................................................................................... 20

3.13.3 VRDBBDC .............................................................................................................................. 20

3.13.4 VRIO ....................................................................................................................................... 20

3.13.5 V56 ......................................................................................................................................... 20

3.13.6 Vbackup.................................................................................................................................. 20

3.13.7 Charge .................................................................................................................................... 21

3.13.8 AC/DC switching charger........................................................................................................ 22

3.13.8.1 Operating temperature............................................................................................................................................22

3.13.8.2 Electrical ratings.....................................................................................................................................................22

3.13.8.3 Thermal ratings ......................................................................................................................................................23

3.13.9 Simple battery charger............................................................................................................ 23

3.13.9.1 Operating temperature............................................................................................................................................23

3.13.9.2 Electrical ratings.....................................................................................................................................................24

3.13.9.3 Thermal ratings ......................................................................................................................................................26

3.14 ACCESSORIES....................................................................................................................................... 27

3.15 MANUFACTURER MMI CUSTOMIZATION ............................................................................................ 27

3.16 OTHER FUNCTIONS .............................................................................................................................. 27

3.16.1 Flap......................................................................................................................................... 27

3.16.2 Buzzer..................................................................................................................................... 27

3.16.3 Backlight ................................................................................................................................. 27

3.16.3.1 Red or Green LEDs ................................................................................................................................................27

3.16.3.2 Blue and White LEDs.............................................................................................................................................28

3.16.3.3 Multicolour LEDs and EL film ..............................................................................................................................28

3.16.4 Network LED........................................................................................................................... 28

3.16.5 Vibrator ................................................................................................................................... 29

4. OPERATING MODES............................................................................................................................................... 30

4.1 MODES DESCRIPTION .......................................................................................................................... 30

4.1.1 No supply................................................................................................................................ 30

4.1.2 OFF......................................................................................................................................... 30

4.1.3 Active ...................................................................................................................................... 30

4.1.4 Standby................................................................................................................................... 30

4.2 TRANSITIONS DESCRIPTION ............................................................................................................... 31

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4.2.1 Power_on................................................................................................................................ 31

4.2.2 Power_off................................................................................................................................ 31

4.2.3 Switch_on ............................................................................................................................... 31

4.2.4 Switch_off ............................................................................................................................... 31

4.2.5 Wake up.................................................................................................................................. 31

5. PINOUT .................................................................................................................................................................... 32

6. ELECTRICAL SPECIFICATION................................................................................................................................ 35

6.1 VBAT ....................................................................................................................................................... 35

6.2 POWER SUPPLIES................................................................................................................................. 36

6.2.1 VRDBB (120 pin connector, pin 3) .......................................................................................... 36

6.2.2 VRIO (120 pin connector, pin 2).............................................................................................. 36

6.2.3 V56 (120 pin connector, pin 74) .............................................................................................. 36

6.2.4 ALIMLCD (120 pin connector, pin 75)..................................................................................... 37

6.3 DAI INTERFACE...................................................................................................................................... 38

6.4 NETWORK LED....................................................................................................................................... 38

6.5 BACKLIGHT ............................................................................................................................................ 38

6.6 SERIAL INTERFACE FOR LCD .............................................................................................................. 38

6.7 KEYBOARD INTERFACE........................................................................................................................ 39

6.8 VIBRATOR CONTROL ............................................................................................................................ 39

6.9 V24 .......................................................................................................................................................... 39

6.10 IRDA ........................................................................................................................................................ 39

6.11 CHARGER............................................................................................................................................... 39

6.12 RESET..................................................................................................................................................... 40

6.13 SPARE IO................................................................................................................................................ 40

6.14 CLOCKS .................................................................................................................................................. 40

6.15 PARALLEL INTERFACE ......................................................................................................................... 40

6.16 JTAG INTERFACE .................................................................................................................................. 41

6.17 DAC ......................................................................................................................................................... 41

6.18 ADC ......................................................................................................................................................... 41

6.19 INTERRUPTS .......................................................................................................................................... 41

6.20 VBACKUP................................................................................................................................................ 42

7. ENVIRONMENTAL SPECIFICATION....................................................................................................................... 42

7.1 OPERATING CONDITIONS .................................................................................................................... 42

7.2 CLIMATIC CONDITIONS......................................................................................................................... 42

8. MECHANICAL SPECIFICATION WITH CONNECTOR ............................................................................................ 43

9. INTEGRATION.......................................................................................................................................................... 46

9.1 120 PINS CONNECTOR ......................................................................................................................... 46

9.1.1 MO130 connector ................................................................................................................... 46

9.1.2 Mother board connector.......................................................................................................... 47

9.2 MO130 ANTENNA CONNECTOR ........................................................................................................... 48

9.3 BATTERY CONNECTOR ........................................................................................................................ 49

ANNEXE 1 : REFERENCE SENSITIVITY LEVEL ............................................................................................................ 50

ANNEXE 2 : IO DESCRIPTION ........................................................................................................................................ 51

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without notice.

1. OVERVIEW

1.1 OBJECT OF THE DOCUMENT

This document gives an overview of the MO130 module: a miniature, single-side board, tri-band GSM/GPRS

module, ready for integration in mobile application like vehicle-mounted or vending machines…

It describes the main functionalities (GPRS / GSM 900MHz / DCS 1800MHz / PCS 1900MHz, interface to a

melody chip, LCD interface, SIM interface, vibrator interface, audio interfaces for speaker/microphone or

accessories, battery interface, battery charging interface…) of this module as well as the electrical interfaces,

the mechanical specification (dimension, form…) and the electrical specification of the module.

1.2 REFERENCE DOCUMENTS

SCT U37 MT SPEC 117 C MASV2 module – Target specification

SCT TMO MASV2 SPEC 57 F MO130 module application note

1.3 STANDARDS COMPLIANCE

• GSM 02.60: "Digital cellular telecommunications system (Phase 2+); Stage 1 Service Description of the

General Packet Radio Service (GPRS)". Version 6.3.0.

• GSM 03.03: "Digital cellular telecommunications system (Phase 2+); Numbering, addressing and

identification". Version 6.6.0.

• GSM 03.13: "Digital cellular telecommunications system (Phase 2+); Discontinuous Reception (DRX) in

the GSM system". Version 6.0.0.

• GSM 03.60: "Digital cellular telecommunications system (Phase 2+); General Packet Radio Service

(GPRS); Service description; Stage 2". Version 6.7.0.

• GSM 03.64: "Digital cellular telecommunications system (Phase 2+); General Packet Radio Service

(GPRS);Overall description of GPRS radio Interface; Stage 2". Version 6.4.0.

• GSM 04.02: "Digital cellular telecommunications system (Phase 2+); GSM Public Land Mobile Network

(PLMN) access reference configuration". Version 6.0.0.

• GSM 04.03: "Digital cellular telecommunications system (Phase 2+); Mobile Station - Base Station

System (MS - BSS) interface Channel structures and access capabilities". Version 6.0.0.

• GSM 04.04: "Digital cellular telecommunications system (Phase 2+); Layer 1 General requirements".

Version 6.0.0.

• GSM 04.05: "Digital cellular telecommunications system (Phase 2+); Data Link (DL) layer General

aspects". Version 6.0.1.

• GSM 04.07: "Digital cellular telecommunications system (Phase 2+); Mobile radio interface signalling

layer 3 General aspects". Version 6.5.1.

• GSM 04.08: "Digital cellular telecommunications system (Phase 2+);Mobile radio interface layer 3

specification". Version 6.11.0.

• GSM 04.60: "Digital cellular telecommunications system (Phase 2+); General Packet Radio Service

(GPRS); Radio Link Control/Medium Access Control (RLC/MAC) protocol". Version 6.9.0.

• GSM 04.64: "Digital cellular telecommunications system (Phase 2+); General Packet Radio Service

(GPRS); Logical Link Control (LLC)". Version 6.7.0.

• GSM 04.65: : "Digital cellular telecommunications system (Phase 2+); General Packet Radio Service

(GPRS); Mobile Station (MS) - Serving GPRS Support Node (SGSN); Sub network Dependent

Convergence Protocol (SNDCP)". Version 6.7.0.

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• GSM 05.02: "Digital cellular telecommunications system (Phase 2+); Multiplexing and multiple access on

the radio path". Version 6.9.0.

• GSM 05.03: "Digital cellular telecommunications system (Phase 2+); Channel coding". Version 6.2.1.

• GSM 05.08: "Digital cellular telecommunications system (Phase 2+); Radio subsystem link control".

Version 6.8.0.

• GSM 05.10: "Digital cellular telecommunications system (Phase 2+); Radio subsystem synchronisation".

Version 6.6.0.

• GCF-CC (V.3.5.0) and GT.01.

• NAPRD.03 (V.2.5.1).

1.4 COMPLIANCE WITH FCC GUIDELINES

Fix-mount and mobile devices incorporating M0130 modules must be designed to maintain a minimum

separation distance of 20 cm between the antenna and the end user to satisfy RF exposure requirements for

mobile transmitting devices.

1.5 TERMS AND ABBREVIATION

ADC Analog to Digital Converter

ADPCM Adaptive Delta Pulse Code Modulation

AFC Application Frequency Correction

ASIC Application Specific Integrated Circuit

BMP Bitmap

CODEC Coder-Decoder

CTS Clear To Send

DAC Digital to Analog Converter

DAI Digital Analog Interface

DCS Digital

DSP Data Signal Processor

DSR Data Set Ready

DTR Data Terminal Ready

EGSM Enhanced GSM

EMS Enhanced Messaging Services

ESD Electrostatic Discharge

ETS European Telecommunication Standard

GSM Global Standard for Mobile communication

GPRS Global Packet Radio Services

IC Integrated Circuit

IEEE Institute of Electrical and Electronics Engineers

I/O Input / Output

IRDA Infra Red

ISO International Standards Organisation

ITU International Telecommunication Union

JPEG Joint Picture Expert Group

JTAG Joint Test Action Group

KBPS Kbit per second

LCD Liquid Crystal Display

LED Diode

LNA Low Noise Amplifier

MBPS Mbit per second

MIDI Musical Instrument Digital Interface

MMI Man Machine interface

PA Power Amplifier

PBCCH Packet Broadcast Channel

PCB Printed Circuit Board

PCS Personal Communication System

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PLL Phase Locked Loop

PNG Portable Network Graphics

RAM Random Access Memory

RF Radio Frequency

RI Ring Indication

RMS Root Mean Square

RTS Ready To Send

RX Receive direction

SIM Subscriber Identification Module

SMS Short Message Service

SRAM Static Random Access Memory

TBC To Be Confirmed

TBD To Be Defined

TX Transmit direction

UART Universal Asynchronous Receiver and Transmitter

USB Universal Serial Bus

USSD Unstructured Supplementary Service Data

VCO Voltage Controlled Oscillator

WAP Wireless Application Protocol

WBMP Wide Bitmap

1.6 PRODUCT FEATURES

Temperature range

Normal range: -10°C to +55°C (full compliant)

Extended range: -20°C to –10°C and +55°C to +70°C

(functional without any risk for the network)

Storage: -40°C to °85°C

Weight (in g) 10.5g

ESD ESD protected, < 1kv or 2kv (see application note)

Physical dimensions 34x54.4x3 mm (typical)

Connection 120 pins connector + 1 antenna connection + 1

battery connection

Decoupling capacitors Mainly integrated.

Power supply 3.45V to 5V range, 3.8V nominal.

Power consumption

Off mode: 120uA (typ)

Standby mode: 2.5mA (typ)

Communication mode: 280mA typ (average in GPRS

4+1 at max power)

Communication mode: 1800mA (peak during TX slot)

Power supply connector Dedicated connector.

Battery charge management and interface Battery charge management is included. The charger

interface is provided on 120 pins connector.

Antenna No antenna included in the module.

Antenna connector

50 ohms with coaxial connector.

The return loss of the external antenna has to be

better than –10dB (50Ohms reference) in all the

frequency range.

Frequency bands EGSM900 + DCS1800 + PCS1900

Voice codecs Half Rate, Full Rate, Enhanced Full Rate

GSM class Small MS

Transmit power Class 4 (2W) for EGSM900

Class 1 (1W) for DCS1800 / PCS1900

Supported SIM card 3V SIM cards.

To prevent SIM card’s damages, the power supply of

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MO130 module for mobile applications

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the module has to be turned off before any

manipulation of the SIM card.

SIM slot

Not included on the module. Signals for the

management of the SIM card are provided on 120

pins connector.

Vibrator Not included in the module. Controls are provided on

120 pins connector.

Network LED Not included in the module. Controls are provided on

120 pins connector.

Keyboard / LCD backlight Not included in the module. Controls are provided on

120 pins connector.

Audio up-link 2 differential inputs are provided for microphone

(accessories and handset)

Audio down-link 2 differential inputs are provided for earphone

(accessories and handset)

Flap open/closed detection Dedicated interrupt input is provided on 120 pins

connector for the open/closed detection.

Keyboard interface 5x5 keyboard interface is provided on 120 pins

connector.

UART1 interface with flow control

Up to 115.2 Kbaud with autobauding.

Full flow control signals (+2.8V) are provided on 120

pins connector.

If a full compliant RS232 (+/-5V) serial interface is

needed:

The drivers (like MAX3232, ST3237CD, …) are not

included in the module and have to be added on the

main PCB.

A proven schematic to build the RS232 interface is

provided in application note.

IrDA interface or UART2 interface

Up to 115.2 Kbaud.

UART2 and IrDA are not multiplexed but could not be

used at the same time.

Data services GPRS, CSD, Fax

Supplementary services

Line identification, Call Waiting, Call Hold, Call

Forwarding, Multiparty, Closed User Group, Call

Barring, Advice of Charge, USSD

USB interface

Not integrated in the module.

It can be added by means of a dedicated micro-

controller with USB capabilities.

Melody chip interface

The melody chip is not integrated in the module but

the interface is provided (power supply, clock, audio,

serial link) on 120 pins connector.

Serial Interface A serial interface is provided on 120 pins connector in

order to manage an external LCD and a chip melody.

Parallel Interface

A parallel interface (16 bits) is provided on 120 pins

connector (7 addresses, 2 chip select and OE, RW

signals are available).

Reset pin Available (reset of all the system including backup)

Power on pin Available

General purpose I/Os pin See chapter

GPRS SMG 31bis, Multi slot class 8 (class 10 in future

versions), class B terminal, PBCCH support

WAP 1.2

GSM/DCS certification GCF-CC V.3.5.0 and GT.01

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PCS certification NAPRD.03 (V.2.5.1)

Multimedia objects download ringing tones, wallpapers, icons, games, screen

savers

Picture / animation formats supported WBMP, BMP, JPEG, PNG, GIF, SAGEM proprietary

formats

Audio formats supported MIDI, iMelody, PCM, ADPCM, SAGEM proprietary

formats

Software customisation Customisable MMI

2. BLOC DIAGRAM

Figure 1

MO130 bloc diagram

See Pinout chapter for more details.

Earphone (accessory)

Microphone (accessory) Serial interface to LCD

MO130 module

GPRS / GSM900 / DCS1800

PCS1900

Keyboard

Battery charger

Battery (3.6V)

Vibrato

Melody chip interface

SIM interface (3V)

Serial link 2 or IRDA

interface

Serial link 1

with flow control

Antenna

Backlight

Network LED

Spare I/Os

Parallel interface (16 bits)

Backup

SPI interface

Flap detection

Interruption Inputs

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3. FUNCTIONAL DESCRIPTION

3.1 SIM

The SIM Card interface is compatible with the ISO 7816-3 IC card standard on the issues required by the

GSM 11.11 Phase 2+ standard. The module also supports Release 99 of the SIM Toolkit recommendation

too and supports a Fixed Dialling Number directory.

The SIM Card interface insures the detection (SIMCD), the power on (SIMVCC) of the SIM Card and the

communication with it through a data signal (SIMIO), a clock signal (SIMCLK) and a reset signal (SIMRST).

Signal Pin N° Description

SIMRST 5SIM reset, provided by Base-band processor

SIMCLK 4SIM clock, provided by Base-band processor

SIMIO 7SIM serial data line, input and output

SIMVCC 6SIM supply voltage

SIMCD 114 SIM insertion detection

SIM card connection:

Figure 2

SIM connection

The SIMCD signal should be connected to the SIM card reader in order to get SIMCD at low level (GND)

when no card is present and at high level (SIMVCC) when card is present (external pull down needed when

SIM card connector with detection is used).

This interface includes main protections.

3.2 AUDIO

The module supports the following voice codecs:

• Half-Rate

• Full-Rate

• Enhanced Full Rate

It manages an external handset microphone (MICP/MICN) and an external handset earphone (HPP/HPN) in

differential mode.

MO130

SIMVCC

SIMIO

SIMRST

SIMCL

SIMCD

SIM card

In option

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The bias voltage of the microphone is provided directly on MICP/MICN pins.

There are three options for the earphone:

- One multi-mode earphone, as earpiece, hands free loudspeaker and melody/ring.

- Two earphones, one 32 Ohms as earpiece and one 8 Ohms as Ring/melody and as hands-free

loudspeaker if it is far from the microphone.

- one 32 Ohms earphone as earpiece.

The Module can also manage accessories (earphone and microphone) through dedicated lines

(BFRXP/BFRXN for earphone and BFTXP/BFTXN for microphone). The typical impedance for the earphone

is 150ohms.

Figure 3

Audio

This interface includes main protections.

To ensure proper operation of such sensitive signals, there have to be isolated from the other by ground on

mother board layout.

NB: To avoid destruction of module components, the HP inductance has to be 47nH +/- 5% @ 200MHz

3.3 DISPLAY

A serial interface is provided on the module to manage an external LCD (256 colour) through data input

signal (DIMIW), data output signal (DOMIW), clock (CKMIW), reset (RESETLCD*), register select (RSLCD)

and two chip selects (CSMIW1 and CSMIW2), one dedicated to the LCD, the other to the chip melody.

Power supply of the LCD (ALIMLCD) is also provided through this interface.

This interface could be used to manage two LCDs. In this case, the module can’t manage a chip melody

through this serial link.

Base-band

Ampli+Filter

MICP

MICN

BFTXP

BFTXN

HPIN

BFRXP

BFRXN

HPP

HPN

LPHP

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without notice.

Figure 4

Serial link timing

Figure 5

Reset serial link timing

This interface includes main protections.

If another LCD driver is used, the software would be provided by SAGEM, or at least the specific drivers will

be integrated by SAGEM. In that case a specific quotation is required.

3.4 PARALLEL INTERFACE

A parallel interface is provided on the 120 pins connector. This interface include 16 bits data lines (D<0..15),

7 address lines (A<0>,A<1>, A<2>, A<3>, A<4>, A<5>,A<6>), Write control signal RW* (active low), Output

Enable signal OE* (active low) and two chip selects CS2 and CS3 (active low).

NB: The maximum capacitance acceptable on each signal of the parallel interface is 25pF (including copper

line capacitance, connectors capacitance…).

> 1µs

RESETLCD∗

Software initialisation

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Figure 6

Parallel link read timing

Timing Description Min (ns) Max (ns)

tcyc CPU frequency -1/Fcpu

tcsv Chip Select Valid tcyc (N+1)tcyc

tda NCS to Address valid -3.9

tha Address hold from nCS 0 -

tdbe NBHE, nBLE to nCS --0.2

tdoe NOE to nCS -4.5

tsu Input data setup to nCS 7.9 -

tho Input data hold from nCS 0 -

tsrw NCS to RnW Tcyc/2-tdrw -

tdrw RnW to nCS 1.3 2.2

tdso NCS to output data valid - Tsrw+14

thd Output data hold from RnW 1.1 -

N= Wait State number

Note: all timings computed for an external capacitance load of 10pF

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This document contains information on a product under development. SAGEM reserves the right to change or discontinue this product

without notice.

Figure 7

Parallel link write timing

NB: if needed, additional Wait State could be added by SAGEM.

Be careful: the maximum capacitance (components, lines, connectors,…) acceptable on each signal of the

parallel bus is 25pF.

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3.5 SPI INTERFACE

A SPI interface is provided on the 120 pins connector. This interface include Input/output data lines (DOSPI,

DISPI), clock (CLKSPI) and enable (ENSPI1).

Figure 8

SPI interface timing

Figure 9

SPI interface timing (second)

Timing Description Min (ns) Max (ns)

Tw(CLK13M_OUT) Pulse duration 30ns -

Tc(CLK13M_OUT) Cycle time 77ns -

Td(MCUDO) Delay time DOSPI -8.2ns

Th(MCUDO) Hold time DOSPI 0 -

Td(MCUEN) Delay time ENSPI1 -7.5ns

Th(MCUEN) Hold time ENSPI1 0 -

Ts(MCUDI) Setup DISPI 7.5ns -

Th(MCUDI) Hold time DISPI 2.5ns -

DISPI

116

CLKSPI

ENSPI1

lsb

msb

> 3 T13Mhz

msb

DOSPI lsb

msb msb

CLKSPI

ENSPI1

DISPI

DOSPI

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3.6 DATA

3.6.1 Data services

The module supports the following services:

• GPRS

• CSD: transparent and non-transparent up to 9600 BPS

• fax: class 1

Data sessions may be established over the main serial link or using the IrDA port (see below).

3.6.2 IrDA

This UART interface is compatible with 16C750 compliant devices. It includes the slow infra-red protocol in

order to be connected with an infra-red transmitter to any external data peripherals with an IrDA compliant

data interface.

This IrDA interface (TXIR, RXIR and CMDIRDA) provided by the module is compliant with the IrDA 1.0 SIR

up to 115.2 Kbaud.

This interface includes main protections.

3.6.3 UART 2

It is strongly recommended to let this interface externally accessible for Debug.

3.6.4 V24

A V24 interface is provided on external pins of the module with the following signals:

- RTS/CTS

- RX/TX

- DSR

- DTR

- DCD

- RI

It supports speeds up to 115.2 KBPS and may be used in autobauding mode.

This interface includes main protections.

3.7 MULTIMEDIA

The MO130 module offers various multimedia and downloading features:

• WAP 1.2 browser

• Download Fun services for customisation of screensavers, wallpapers, ringtones and call groups icons

• EMS V5

• Downloadable games using Infusio's ExEN platform (Optional through specific development)

The supported picture formats are:

• WBMP

• BMP

• JPEG

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• PNG

• GIF

• SAGEM proprietary B/W format

The supported screensavers formats are:

• Animated GIF

• SAGEM proprietary formats

The supported ringtones formats are:

• MIDI

• iMelody

• PCM (mono, 8kHz)

• SAGEM proprietary formats

3.8 MELODIES GENERATION

The module is hardware compatible with three solutions :

1. First solution

For MIDI files melodies the current available characteristics of the rendering is: 8 tones / 15 instruments /

4kHz bandwidth (available later 16 tones / 8 instruments / 4kHz bandwidth).

2. Second solution:

For rich rendering PCM (4 kHz bandwidth) is used, this format can also be used for over the air downloading.

3. Third solution: external chip melody

The characteristics of this solution are: 16 tones, 16 instruments, wide audio bandwidth.

In this case, some interfaces of the module could be used to manage a chip melody:

- 13MHz digital clock is available on external pins of the module for this application.

- HPIN audio digital signal is available on external pins of the module for this application.

- A serial link (DIMIW, DOMIW, CKMIW) could be used for the communication between the module and

the chip melody.

- VRIO +2.8V regulator output could be used to supply the chip melody.

Be careful, the serial link used for the melody chip is the same as the one used for the LCD (but 2 different

chip selects).

Most of this interface includes main protection.

The melody chip driver would be done by SAGEM if needed (specific development).

3.9 ANTENNA

Two accesses for the antenna connection are provided.

- one by mean of a 50ohms connector

- one by mean of a simple copper area

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Figure 10

Antenna area on the MO130

See into application note for more details.

NB:

- No ground in the neighbourhood of the pad for the antenna connection.

- 50ohms guaranteed only in conducted mode

- Functioning of the module in radiated mode depends on the respect of the radio rules.

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3.10 KEYPAD

A 5X5 keyboard could be managed by the module through the R1/R2/R3/R4/R5 row signals and

C1/C2/C3/C4/C5 column signals.

OUI signal performs the ON function. OFF signals performs OFF function.

Figure 11

Keyboard connection

(1) tbd (for example: refusal of an incoming call when the flap is closed)

(2) could be used for a particular function if required.

NC = these keys are connected internally in the MO130 module but are not managed.

The module uses the Tegic T9TM predictive input system.

3.11 DAI

A DAI interface is provided on the module for type approval tests.

3.12 CLOCKS

A 32KHz frequency clock and a 13MHz frequency digital clock are provided on external pins of the module.

The 13MHz clock could be used for the chip melody interface (see §3.6-Chip melody).

To ensure proper operation of such sensitive signals, there have to be isolated from the other by ground on

mother board layout.

OUI

GND

MO130

987

6OFF5OK

∧

>CLR* 0 #

∨123

VOL-VOL+♣(1) NC NC

(2)

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3.13 POWER MANAGEMENT AND CHARGE

3.13.1 Battery

The power supply signal VBAT is 3.45V to 5V range and 3.8V nominal.

It has to be more than 3V, even during transients in order to avoid unwanted resets. The power supply

dropout has to be limited to 450mV, when the current consumption goes from minimum to maximum (0.1 to

1.8A). The noise level of the power supply has to be limited to 50mV RMS in the 100MHz – 1MHz frequency

range

A battery level measurement algorithm is turning the module OFF when average VBAT < 3.45V for more

than a few minutes.

For Li-ion battery, SAGEM advises to use Sanyo or LG battery. If other battery is used, SAGEM agreement

is needed (slight qualification tests).

This interface includes main protections.

3.13.2 VRDBB

+1.8V output is available on external pin of the module and could supply +1.8V external components (current

capability 10mA in active mode).

This interface includes main protections.

3.13.3 VRDBBDC

+1.8V input is available on external pin of the module. An external +1.8V DC-DC converter could eventually

be connected on this pin to supply the +1.8V to all the module. If no external DC-DC is added, this pin has to

be connected to the VRDBB output.

This interface includes main protections.

3.13.4 VRIO

+2.8V output is available on external pin of the module and could supply +2.8V external components (current

capability 10mA in active mode).

This interface includes main protections.

3.13.5 V56

+5.6V un-regulated power supply is available for Blue or White LEDs power supply on external pin of the

module with the following characteristics:

- 27mA capability in ON mode

- 5.5V to 5.7V in ON mode

This interface includes main protections.

3.13.6 Vbackup

External Backup could be supply through the VBACKUP input (from 2.2V to 3.2V).

If No external Backup is supplied, VBACKUP input has to be connected to VBAT signal.

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3.13.7 Charge

This interface manages the charge of the mobile, when a charger is connected, even in the following

conditions: deeply discharged battery, short-circuited battery and unconnected battery.

No additional components are needed.

Three types of charger can be managed by this interface:

Parameter Type 1 Type 2 Type 3

Unloaded max output

voltage (V)

711 16

Max voltage for max

current (V)

6.5 10.5 -

Current limitation (mA) 450 650 -

Voltage period (ms) - - 10

Equivalent output resistor

(ohms)

- - 8+/-10%

This interface includes main protections.

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3.13.8 AC/DC switching charger

3.13.8.1 Operating temperature

0°C to +55°C.

3.13.8.2 Electrical ratings

Batter

char

Class II equipment (EN 60950 § 1-2-4-2)

1 - Primary input voltage

98V < Vp < 254V ; F = 50/60Hz.

2 - Primary/secondary insulation

Security transformer class E (EN 60950 § 5-1)

Electric strength : reinforced insulation (EN 60950 § 5-3-2)

3 - Static output template

This template shows the Vs = f(Is) function.

550 mA

450 mA

6V 7V

500 mA VALID AREA

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4 - Dynamic output template

An external device is controlling the battery charge by means of a switch S1, which can be switched on and

off.

Following templates shows the output current and voltage during transients, this feature is very important to

enable the charging control by controlling S1 (PWM).

5 - Reverse current (main off)

Main off or unplug, the current flowing from the battery to the charger have to stay smaller than « Ir » in order

to prevent discharge !

Ir < 100µA for VBAT ≤ 5V

3.13.8.3 Thermal ratings

The heating of the enclosure will comply with EN 60950 § 5-1

Tab. 16 - part 2.

3.13.9 Simple battery charger

3.13.9.1 Operating temperature

0°C to +55°C.

BATTERY CHARGER 0V <VBAT< 5V

Is (dynamic)

Time

5A Max

5ms Max

S1 is

switched on

VALID AREA

Ripple : +/- 50m

Vs (dynamic)

Time

20V Ma

0.2ms Max

S1 is

switched off

VALID AREA

TBD

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3.13.9.2 Electrical ratings

Batter

char

Class II equipment (EN 60950 § 1-2-4-2)

1 - Bloc definition

Equivalent resistance : Req = K2 Rp + Rs = 8,3Ω +/-10% ( for 20°C Ambient )

Transformation Ratio : K = 0,038

NOTA : Rs can be realise by coil resistor and if necessary by external resistor

NOTA2 : Without output capacitor to avoid current over load through GSM switch

Thermal

Protection

Four diodes 1N4003

Four capacitors 10nF

Over Voltage protection

( leakage self effect)

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2 - Test circuit

This design show the test circuit

5.2V

Is moyen

Vs ≅ VBAT + 0.6V

500mA

3.6V

150mA 1,2A

15V

NORMAL

HAR

VALID AREA

CHARGER

Vp +/-10%

Vs3

Ω

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3 - Dynamic output template

An external device is controlling the battery charge by means of a switch S1, which can be switched on and

off.

Following templates shows the output current and voltage during transients, this feature is very important to

enable the charging control by controlling S1 (PWM).

4 - Reverse current (main off)

Main off or unplug, the current flowing from the battery to the charger have to stay smaller than « Ir » in order

to prevent discharge !

Ir < 100µA for VBAT ≤ 5V

3.13.9.3 Thermal ratings

The heating of the enclosure will comply with EN 60950 § 5-1

Tab. 16 - part 2.

Thermal tests will be done with 230V +10%, the duration of the tests will be at least 3 hours stabilisation ,

the test circuit will be conform to paragraph 4.4 with K1 closed .

Bobbin temperature elevation have to be lower than 75°C in all cases , to insure a final temperature lower

than 115°C for 40°C ambient temperature .

Primary resistance increase with temperature and ∆θ = ∆Rp / ( Rp . 4,2 10-3 )

Is (dynamic)

Time

le : +/- 50m

5A Max

5ms Max

S1 is

switched on

VALID AREA

Vs (dynamic)

Time

20V Ma

0.2ms Max

S1 is

switched off

VALID AREA

BATTERY CHARGER 0V <VBAT< 5V

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Verify : ∆Rp / Rp (20°C) < 0.315

Report have to be made by the supplier stipulating the bobbin and the enclosure temperature elevation .

3.14 ACCESSORIES

Accessories connection has to be defined more precisely.

With the MO130 module, the following accessories could be connected :

- a pedestrian stereo or non stereo hand-free kit

- a battery charger

- an automotive hand-free kit

These interfaces includes main protections.

3.15 MANUFACTURER MMI CUSTOMIZATION

The MO130 module already includes built-in MMI. This MMI can be customised by customer with SAGEM

help.

Options for customisation include :

• custom bitmaps and animations (with pre-determined sizes): start animation, menus animations,

icons…

• custom fonts (with pre-determined sizes)

• custom messages (provided they fit in the MMI design)

• custom screen-savers

• enabling or disabling some features

If more customisation is required, this has to be discussed with SAGEM.

As explained in other chapters, if a specific LCD or keyboard configuration is needed, SAGEM will take the

responsibility to develop the required software drivers. In case of already available drivers, SAGEM will take

the responsibility to integrate them in the software.

All these options are submitted to specific software development on SAGEM side. Therefore, MMI options

require separate, dedicated quotation.

3.16 OTHER FUNCTIONS

3.16.1 Flap

An interrupt pin is available on external pin of the module for the Open/closed detection of a clam mobile.

3.16.2 Buzzer

This interface is not provided at this time but could be included if requested.

3.16.3 Backlight

3.16.3.1 Red or Green LEDs

A current generator (BACKKEY) is dedicated to backlight of the LCD or the keyboard with the following

characteristics:

- Output voltage Von from 1.7V to 3.7V, 2.5V typ.

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- Output current Ion from up to 150mA typ.

- Output voltage Voff from 3.0V to 5.5V, 3.8V typ.

- Output current Ioff 200nA max.

- Analog output, programmable current NMOS type.

An other current generator (BACKLCD) is dedicated to backlight of the LCD or the keyboard with the

following characteristics:

- Output voltage Von from 1.7V to 3.7V, 2.5V typ.

- Output current Ion up to 80mA typ.

- Output voltage Voff from 3.0V to 5.5V, 3.8V typ.

- Output current Ioff 100nA max

- Analog, programmable NMOS type, or Digital output

Figure 12

LED (baklight) connection

This interface includes main protections.

3.16.3.2 Blue and White LEDs

V56 power supply could be used to supply maximum 3 blue or white LEDs (IV56 = 27mA max). To connect

more blue or White LEDs; an external driver has to be added.

3.16.3.3 Multicolour LEDs and EL film

An external driver has to be added to manage the multicolour LEDs or White LEDs.

3.16.4 Network LED

Two external pin of the module (LEDR and LEDG) are dedicated to network LED.

Figure 13

Network LED connection

This interface includes main protections.

BACKLCD

BACKKEY

VBAT

LEDR or

LEDG

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3.16.5 Vibrator

An external pin of the module provides vibrator command (CMDVIB) to drive a vibrator with the following

characteristics:

- Rs series resistance from 10 ohms to 50 ohms.

- Zl series inductance from 50uH to 100uH.

- Cl load capacitance from 0 to 1nF.

- Ioff quiescent current 100nA max.

Figure 14

Vibrator connection

This interface includes main protections.

VIB

VBAT

CMDVIB

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4. OPERATING MODES

Figure 15

Operating modes state diagram

4.1 MODES DESCRIPTION

4.1.1 No supply

VBAT < 3.2V and VBACKUP < 2.2V.

All functions and power supplies are OFF: VRDBB, VRIO, V56 = 0.

4.1.2 OFF

VBAT > 3.2V or external Backup VBACKUP > 2.2V.

The RTC only is running (32kHz). For internal reasons, V56 is in low power configuration (V56 = 4.5V and

Iv56 = 1mA max). All other functions and power supplies are OFF: VRDBB, VRIO = 0.

4.1.3 Active

The module is active: all the functions are running and all the power supplies are ON and in full power mode

(full consumption).

VRDBB = +1.8V

VRIO = +2.8V

V56 = +5.6V

4.1.4 Standby

The module is in standby mode: the power supplies are ON and in low power mode.

This mode is typically use when the module is connected to the network and checking periodically if there is

an incoming call.

Wake-up

Sleep (automatic)

Switch_off

Switch_on

Switch_off

Power_on

Power_off

No supply

OFF

Active

Standby

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4.2 TRANSITIONS DESCRIPTION

4.2.1 Power_on

A battery is connected to the module with VBAT > 3.2V (and/or VBACKUP is switched ON).

4.2.2 Power_off

The battery is removed from the module (and/or VBACKUP is switched OFF).

4.2.3 Switch_on

The battery is already connected. The module starts when ON key is pressed or a charger is connected or

when wake up occurs.

4.2.4 Switch_off

The battery is connected. The software is turning off of the module when OFF key is pressed and VBAT >

3.2V.

4.2.5 Wake up

The actions to go from standby mode to active mode are:

- Charger connection

- Key pressed

- Incoming call

- Data cable connection

- V24 activity

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5. PINOUT

The following list of signals could change.

Signal name IO type Function Description Pin N°

DAIRST Input DAI reset 116

DAIOUT Output DAI output data 115

DAIIN Input DAI input data 117

DAICLK Input

DAI interface

DAI clock 118

SWANTANT Output Antenna switch

command

112

ITFLAP Input Flap interrupt Flap detection interruption 80

BACKLCD Output Backlight LED control 72

BACKKEY Output Backlight LED control 71

LEDR_BUZ Output 91

LEDG Output

LED control

Alarm LED control / buzzer control on

demand

Network LED control 90

RSLCD Output LCD driver register select 89

RESETLCD* Output LCD driver reset 88

ALIMLCD Output LCD driver power supply 75

DIMIW Input LCD driver input data of the serial link 86

DOMIW Output LCD driver output data of the serial link 84

CKMIW Output LCD driver clock of the serial link 85

CSMIW1 Output LCD1 driver chip select of the serial link 98

CSMIW2 Output

Serial interface to

connect LCD or chip

melody (2 chip

selects)

LCD2 driver chip select of the serial link 97

R1 Input Keyboard row 1 22

R2 Input Keyboard row 2 21

R3 Input Keyboard row 3 20

R4 Input Keyboard row 4 19

R5 Input Keyboard row 5 18

C5 Output Keyboard column 5 23

C4 Output Keyboard column 4 24

C3 Output Keyboard column 3 25

C2 Output Keyboard column 2 26

C1 Output

Keyboard interface

Keyboard column 1 27

OUI* Input ON key Keyboard ON key 113

SIMVCC Output SIM power supply 6

SIMRST Output SIM reset 5

SIMCLK Output SIM clock 4

SIMIO In/output SIM data 7

SIMCD Input

SIM interface

SIM insertion detection 114

BFTXP Input Differential input from microphone 52

BFTXN Input

To external

microphone

(accessory) Differential input from microphone 53

BFRXP Output Differential output to earphone 49

BFRXN Output

To external HP

(accessory) Differential output to earphone 50

MICP Input Microphone interface Differential input to handset microphone 63

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MICN Input Differential input to handset microphone 62

HPP Output Differential output to 32ohms or 8ohms

earphone

HPN Output Differential output to 8ohms earphone 57

LPHP Output

Earphone interface

Differential output to 32ohms earphone 55

HPIN Input Melody chip interface HP in for melody chip interface 59

CMDVIB Output Vibrator interface Vibrator command 79

RI Output Ring Indicator 109

DSR Output Data Send Ready 94

DCD Output Data Carrier Detect 110

DTR Input Data Terminal Ready 95

CTS Output Clear To Send 82

RTS Input Request To Send 83

TXD1 Output UART transmit 1 101

RXD1 Input

V24 interface with

flow control

UART receive 1 105

TXD2 Output UART transmit 2 103

RXD2 Input

UART interface

UART receive 2 104

TXIR Output IRDA transmit 100

RXIR Input IRDA receive 99

CMDIRDA Output

IRDA interface

IRDA command 96

INT Input 92

SCL Output 14

SDA In/out

Internal use

CHARGEUR Input Load interface Charge 69,70

ON* Output Accessories control 73

TESTRESETZ Input Reset Reset system signal 81

ITDATA Input Accessories detection Interrupt signal 76

CMDSW1 In/output I/O 107

CMDSW2 In/output

Spare IO

I/O 106

CINT Input Interrupt Interruption 111

D<0> In/output Data bus 33

D<1> In/output Data bus 34

D<2> In/output Data bus 35

D<3> In/output Data bus 36

D<4> In/output Data bus 37

D<5> In/output Data bus 38

D<6> In/output Data bus 39

D<7> In/output Data bus 40

D<8> In/output Data bus 41

D<9> In/output Data bus 42

D<10> In/output Data bus 43

D<11> In/output Data bus 44

D<12> In/output Data bus 45

D<13> In/output Data bus 46

D<14> In/output Data bus 47

D<15> In/output Data bus 87

A<0> In/output Address bus 32

A<1> In/output Address bus 78

A<2> In/output

Parallel interface

Address bus 77

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A<3> In/output Address bus 68

A<4> In/output Address bus 67

A<5> In/output Address bus 66

A<6> In/output Address bus 65

OE* Output Output Enable 30

RW* Output Read / Write 29

CS2 Output Chip select 2 31

CS3 Output Chip select 3 28

CLK13M Output 13MHz clock digital output 16

CLK32K Output

Clocks

32KHz clock digital output 9

ADC1 Input Battery type detection 11

DAC Output

ADC/DAC

Digital to analog converter 13

DISPI Input Data input 120

DOSPI Output Data output 102

CLKSPI Output Clock SPI 108

ENSPI1 Output

SPI bus

SPI enable 119

VBAT Input +3.6V battery power supply Bat. Conn. 1

V56 Output +5.6V output power supply 74

VRDBB Output +1.8V output power supply 3

VRDBBDC Input +1.8V DCDC output 1

VRIO Output +2.8V output power supply 2

VBACKUP Input

Power supply

Backup input 12

GND Ground Ground 8,10,15,17,48

,51,54,58,60,

61,64

Bat. Conn 2

OUT_ANT Output Antenna output Ant. conn.

TCLK Input JTAG Test point

TMS Input JTAG Test point

TDI Input JTAG Test point

TDODIGIT Output JTAG Test point

TDIANALOG Input JTAG Test point

TDOANALOG Output

JTAG interface

JTAG Test point

NBSCAN Input Boundary scan JTAG Test point

NEMU0 Output For debug Test point

NEMU1 Output For debug Test point

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6. ELECTRICAL SPECIFICATION

VOH High level output voltage

VOL Low level output voltage

VIH High level input voltage

VIL Low level input voltage

6.1 VBAT

The module is supplied through the VBAT signal with the following characteristics:

Parameter Name Min Typ Max

VBAT period (ms) VbatTe (*) 4.614 4.615 DC

VBAT low duration

(us)

VbatTi (*) 550 -VBAT period

VBAT rise time (us) VbatTr (*) 0 - -

VBAT fall time (us) VbatTf (*) 0 - -

VBAT maximum

voltage (V)

VbatMax (*) - - 5

VBAT minimum

voltage (V)

VbatMin (*) 3.45 - -

VBAT drop voltage

(mV)

DeltaVbat (*) - - 450 (**)

Transient voltage

(V)

3 - -

Noise level (Vrms)

@100MHz-1MHz

- - 50mV

(*): cf figure 16.

(**): for a new battery. Of course for old battery, this value will be higher and will create a reset (without MMI

message) of the mobile phone when the battery begins to be discharge.

Figure 16

VBAT voltage waveform

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NB: a battery level measurement algorithm is turning the module OFF when VBAT < 3.45V for more than a

few minutes.

6.2 POWER SUPPLIES

6.2.1 VRDBB (120 pin connector, pin 3)

Signal Min Typ Max Remarks

Voltage level 1.65V 1.80V 1.95V

Current capability

Active mode

- - 10mA

Current capability

Sleep mode

- - 1mA

Quiescent current

Active mode

-150µA-

Quiescent current

Sleep mode

-20µA-

Quiescent current

Disable

-1µA-

Rise time -10µs-

Protection

6.2.2 VRIO (120 pin connector, pin 2)

Signal Min Typ Max Remarks

Voltage level 2.70V 2.80V 2.90V

Current capability

Active mode

- - 10mA

Current capability

Sleep mode

- - 1mA

Quiescent current

Active mode

-150µA-

Quiescent current

Sleep mode

-20µA-

Quiescent current

Disable

-1µA-

Rise time -10µs-

Protection

6.2.3 V56 (120 pin connector, pin 74)

Signal Min Max Remarks

Voltage level 5.5V 5.7V

Current capability -27mA

Rise time - 2ms

Protection

Un-regulated

NB: in OFF mode, this power supply is in low power configuration (V56 = 4.5V and IV56 = 1mA max).

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6.2.4 ALIMLCD (120 pin connector, pin 75)

Signal Min Max Remarks

Voltage level 2.75V 2.85V

Current capability -10mA

Protection

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6.3 DAI INTERFACE

DAIRST, DAIIN, DAICLK and DAIOUT have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

DAIRST (in) -0.5 +0.8 +2.0 +3.2 Protection

DAICLK (in) -0.5 +0.8 +2.0 +3.2 Pull down

Protection

DAIIN (in) -0.5 +0.8 +2.0 +3.2 Pull down

Protection

DAIOUT (out) -+0.6 +2.4 -Protection

6.4 NETWORK LED

LEDR and LEDG have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

LEDR, LEDG (out) -+0.6 +2.4 -Protection

Iout max = 4mA

6.5 BACKLIGHT

BACKLCD and BACKKEY have the following characteristics:

Parameter Signal Min Typ Max Remarks

Von BACKLCD,

BACKKEY

1.7V 2.5V 3.7V

BACKKEY 120mA 150mA 180mAIon

BACKLCD 50mA 80mA 90mA

Voff BACKLCD,

BACKKEY

3.0V 3.8V 5.5V

BACKKEY 200nAIoff

BACKLCD 100nA

Protections

BACKLCD:

analog or digital

BACKKEY:

analog

6.6 SERIAL INTERFACE FOR LCD

RESETLCD*, RSLCD, DIMIW, DOMIW, CKMIW, CSMIW1, CSMIW2 have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

DIMIW (in) -0.5 +0.8 +2.0 +3.2 Protection

RESETLCD* (out) -+0.6 +2.4 -Pull down

Protection

Output (out) -+0.6 +2.4 -Protection

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6.7 KEYBOARD INTERFACE

R1, R2, R3, R4, R5, C1, C2, C3, C4 and C5 have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Input (R1/2/3/4/5) -0.5 +0.8 +2.0 +3.2

Output (C1/2/3/4/5) -+0.6 +2.4 -

OUI*:

Signal Min Max

Ton (ms) 65 -

6.8 VIBRATOR CONTROL

CMDVIB has the following characteristics:

Parameter Min Typ Max

Von 1.2V 1.8V 3V

Ion 70mA 80mA 92mA

Voff 3.0V 3.8V 5.5V

Ioff - - 100nA

6.9 V24

CTS, RTS, DCD, DSR, DTR and RI have the following characteristics:

VL (V) VH (V) RemarksSignal

Min Max Min Max

RTS (in) -0.5 +0.8 +2.0 +3.2 Pull-up

RI (out) -+0.6 +2.4 -Pull up

DCD, DSR, CTS

(out)

-+0.6 +2.4 -Pull-up on DCD

DTR (in) -0.5 +0.8 +2.0 +3.2 Pull up on DTR

6.10 IRDA

RXIR, TXIR and CMDIRDA have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

RXIR (in) -0.5 +0.8 +2.0 +3.2

TXIR, CMDIRDA

(out)

-+0.6 +2.4 -

Protections

6.11 CHARGER

Charger has the following characteristics:

Parameter Description Min Max

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VCHARGEUR Charger voltage 0V 16V

Tchstart Charge start up timer 8s 16s

6.12 RESET

TESTRESETZ has the following characteristics:

Signal Min Max Remarks

VL (V) -0.5 +0.495 Pull up

Protection

VH (V) +1.365 +2.15

Treset (ms) 65 -

NB: The reset signal resets all the system including backup.

6.13 SPARE IO

CMDSW1/2 have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

Input -0.5 +0.8 +2.0 +3.2

Output -+0.6 +2.4 -

Protections

Iout max = 4mA

6.14 CLOCKS

CLK13M and CLK32K have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

CLK13M (out) -+0.6 +2.4 -

CLK32K (out) -+0.4 +1.6 -

6.15 PARALLEL INTERFACE

D<0..15>, A<0..6>, OE*, RW*, CS2, CS3 have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

Input

D<0..15>

-0.5 +0.8 +2.0 +3.2

Output

D<0..15>, A<0..6>,

RW*, OE*, CS2,

CS3

-+0.6 +2.4 -

NB: The maximum capacitance acceptable on each signal of the parallel interface is 25pF (including copper

line capacitance, connectors capacitance…).

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6.16 JTAG INTERFACE

TCLK, TMS, TDI, TDODIGIT, TDIANALOG, NBSCAN, NEMU0, NEMU1 have the following characteristics:

VL (V) VH (V)Signal

Min Max Min Max

Remarks

Input

TCLK, TMS, TDI,

TDIANALOG,

NBSCAN

-0.5 +0.8 +2.0 +3.2

Output

TDODIGIT,

TDOANALOG,

NEMU0, NEMU1

-+0.6 +2.4 -

6.17 DAC

Recommended load on pin DAC : 30pF max // 10Kohms min

Parameter Min Typ Max

Resolution -10 bits -

Output voltage with code max 2.0V 2.2V 2.4V

Output voltage with code min 0.18V 0.24V 0.3V

6.18 ADC

Parameter Min Typ Max

Resolution -10 bits -

Input range 0 - 1.75V

Input resistance -5.7Kohms -

6.19 INTERRUPTS

ITFLAP, ITDATA and CINT have the following characteristics :

VL (V) VH (V)Signal

Min Max Min Max

Remarks

ITFLAP -0.5 +0.8 +2.0 +3.2 Pull up

Digital port

ITDATA -0.5 +0.8 +2.0 +3.2 Pull up

Digital port

CINT -0.5 +0.8 +2.0 +3.2 Pull down

Digital port

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6.20 VBACKUP

Signal Min Max Remarks

VBACKUP +2.2V +3.2V Protection

If no external backup is supplied, VBACKUP has to be connected to VBAT.

With external BACKUP:

- if VBAT < VBACKUP, internal RTC is supplied by VBACKUP.

- if VBAT > VBACKUP, internal RTC is supplied by VBAT.

Without external VBACKUP (VBACKUP input connected to VBAT)

- if VBAT > 2.2V, internal RTC is supplied by VBAT.

- if VBAT < 2.2V, internal RTC is not supplied.

7. ENVIRONMENTAL SPECIFICATION

7.1 OPERATING CONDITIONS

Parameter Min Max

Ambient temperature -10°C +55°C

Supply voltage VBAT +3.45V +5V

7.2 CLIMATIC CONDITIONS

Parameter Min Max

Ambient temperature

Normal range

-10°C +55°C

Ambient temperature

Extended range

-20°C +70°C

Storage temperature -40°C +85°C

Long damp heat

Operating conditions

Tested at +60°C, 95% RH during 504 hours

Short damp heat

Storage and

transportation conditions

Tested at +40°C, 95% RH during 96 hours

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8. MECHANICAL SPECIFICATION WITH CONNECTOR

Figure 17

MO130

VX Board to Board connecto

JST 2 way stacker assembly Murata coaxial

connection

Pad for antenna

connection

120

60 61

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Figure 18

MO130 dimensions

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Figure 19

MO130 connection to a mother board

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9. INTEGRATION

9.1 120 PINS CONNECTOR

9.1.1 MO130 connector

Recommended PC Board Mounting pattern:

Dimensions and references:

Pin Number Reference

120 AVX 10 5604 120 212 829

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9.1.2 Mother board connector

Recommended PC Board Mounting pattern:

Dimensions and references:

Pin Number References

120 AVX 20 5604 120 222 829

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9.2 MO130 ANTENNA CONNECTOR

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9.3 BATTERY CONNECTOR

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ANNEXE 1 : Reference sensitivity level

The min reference guaranteed sensitivity is:

The sensitivity level is defined as the input level for which class II bits RBER/FER don’t exceed 2.4%

This minimum sensitivity shall be :

GSM 900 MS: -105 dBm max

DCS 1800 MS: -105 dBm max

Notes :

This min sensitivity value is guaranteed at 25°C and under static conditions.

Test Conditions :

Measurement is performed with :

A flexible coaxial cable equipped with a GSC connector.

A SMA-FSC adapter

A GSM tester

GSM testor

GSC Cable + SMA-FSC Adapter

RF output Murata GSC

connector

Module

Faraday Chamber

Notes: Insertion loss of the cable is removed.

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ANNEXE 2 : IO description

IO name Type

DAIRST Digital bi directional buffer (IDI041/OUK431)

DAIOUT Digital bi directional buffer (IDI041/OUK431)

DAIIN Digital bi directional buffer (IDI041/OUK431). Pull-down

DAICLK Digital bi directional buffer (IDI041/OUI431). Pull-down

SWANTANT Digital output buffer (OUO231)

CMDSW1 Digital bi directional buffer (IDI041/OUO431)

CMDSW2 Digital bi directional buffer (IDI041/OUO431)

ITFLAP Digital bi directional IO with interrupt capability. Pull up

ITDATA Digital bi-directional IO with interrupt capability. Pull up

CINT Pull down

BACKKEY Power open drain

BACKLCD Power open drain or Digital bi directional IO

LEDR_BUZ Digital output buffer (OUK831)

LEDG Digital output buffer (OUK431)

RSLCD Digital bi directional buffer (IDI041/OUO431)

RESETLCD* Digital bi directional buffer (IDI041/OUO431). Pull-down

ALIMLCD Power supply output

DIMIW Digital bi directional buffer (IDI041/OUO431)

DOMIW Digital output buffer (OUK431)

CKMIW Digital output buffer (OUI431)

R1 Digital bi directional buffer (IDI041/OUO231)

R2 Digital bi directional buffer (IDI041/OUO231)

R3 Digital bi directional buffer (IDI041/OUO231)

R4 Digital bi directional buffer (IDI041/OUO231)

R5 Digital bi directional buffer (IDI041/OUO231)

C1 Digital bi directional buffer (IDI041/OUO431)

C2 Digital bi directional buffer (IDI041/OUO431)

C3 Digital bi directional buffer (IDI041/OUO431)

C4 Digital bi directional buffer (IDI041/OUO431)

C5 Digital bi directional buffer (IDI041/OUO431)

SIMVCC Power supply output

SIMRST Digital output

SIMCLK Digital output

SIMIO Digital bi directional buffer

SIMCD Digital bi directional buffer (IDI091/OUO431). Pull-down

BFTXP Analog audio input

BFTXN Analog audio input

BFRXP power audio output

BFRXN power audio output

HPP High/Mean power audio output

HPN High power audio output

LPHP Mean power audio output

HPIN Analog audio input

MICP Analog audio input

MICN Analog audio input

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CMDVIB Power open drain

DISPI Digital input buffer (IDI041). Pull-down.

DOSPI Digital output buffer (OUK431)

ENSPI1 Digital bi directional buffer (IDI041/OUK431)

CLKSPI Digital output buffer (OUO231)

DCD Digital bi directional buffer (IDI041/OUK431). Pull-up

DTR Digital bi directional buffer (IDI091/OUK831). Pull-up

RI Open drain. Pull up

DSR Digital bi directional buffer (IDI041/OUK431)

RTS Digital bi directional buffer (IDI091/OUO231). Pull-up

CTS Digital output buffer (OUK831)

TXD2 Digital bi directional buffer (IDI041/OUK831)

RXD2 Digital input buffer (IDI091). Pull-up

TXD1 Digital output buffer (OUK831)

RXD1 Digital bi directional buffer (IDI091/OUO231). Pull-up

TXIR Digital bi directional buffer (IDI041/OUK831)

RXIR Digital bi directional buffer (IDI091/OUK431). Pull-up

CMDIRDA Digital output buffer (OUK431)

CHARGEUR Analog input

ON* Analog open drain

TESTRESETZ Digital input. Pull-up

CLK13M Digital output

CLK32K Digital output buffer (OUK431)

ADC1

DAC Analog output

D<0..15> Digital bi directional buffer (IDI041/OUI831)

A<0..6> Digital output buffer (OUI831)

CS2* Digital output buffer (OUI831)

CS3* Digital bi directional buffer (IDI041/OUI831)

RW* Digital bi directional buffer (IDI041/OUI831)

OE* Digital output buffer (OUI831)

VBACKUP Power supply input

VRIO Power supply output

VRDBB Power supply output

VRDBBDC Power supply input

V56 Power supply output

NB:

OUO231 -> Level shifter type 1 (Iol = 1mA max)

OUI431, OUK431, OUO431 -> Level shifter type 2 (Iol = 2mA max)

OUI831, OUK831 -> Level shifter type 3 (Iol = 4mA max)

----

END OF DOCUMENT

Sagem Wireless 95MASV2C Transmitter module for mobile applications User Manual SCT TMO MASV2 SPEC 14 N1

Sagem Wireless Transmitter module for mobile applications SCT TMO MASV2 SPEC 14 N1

Users Manual

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