Sierra Wireless EM5625 Embedded Wireless Radio Modem User Manual Universal Development Kit Hardware Users Guide

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Document Title	Universal Development Kit Hardware Users Guide
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Universal Development Kit
Hardware Users Guide
2130391
Rev 1.1
U N I V E R S AL D E V E L O P M E N T K I T
Sierra Wireless reserves the right to make changes in its products without notice in order to
improve design or performance characteristics.
This publication neither states nor implies any warranty of any kind, including but not limited to
implied warrants of merchantability or fitness for a particular application.
The information in this publication is believed to be accurate in all respects at the time of publication,
but is subject to change without notice. Sierra Wireless assumes no responsibility for any error or
omissions, and disclaims responsibility for any consequences resulting from the use of the
information included herein.
Copyright
©2004 Sierra Wireless.
All rights reserved.
P AG E 2
INTRODUCTION
Table of Contents
INTRODUCTION......................................................................................................................... 6
OVERVIEW ................................................................................................................................... 6
TERMS AND ACRONYMS .............................................................................................................. 6
REGULATORY INFORMATION ............................................................................................. 7
STATEMENT ................................................................................................................................. 7
REQUIREMENTS............................................................................................................................ 7
SAFETY ........................................................................................................................................ 7
User operation requirements .................................................................................................. 7
INTERFACES ................................................................................................................................. 8
DEVELOPMENT KIT CONTENTS .................................................................................................... 9
CONFIGURATIONS ........................................................................................................................ 9
Boxed configuration................................................................................................................ 9
Bench configuration.............................................................................................................. 10
SETUP AND INSTALLATION ................................................................................................ 12
QUICK SETUP ............................................................................................................................. 12
PC CONNECTIONS ...................................................................................................................... 12
POWERING THE DEVELOPMENT KIT ........................................................................................... 13
AC wall cube power .............................................................................................................. 13
DC power .............................................................................................................................. 14
RF CONNECTION ....................................................................................................................... 14
DEVELOPMENT KIT FEATURES ........................................................................................ 16
INTRODUCTION .......................................................................................................................... 16
MODES OF OPERATION ............................................................................................................... 16
Standalone mode................................................................................................................... 16
Host Development mode ....................................................................................................... 17
Extender Mode ...................................................................................................................... 18
CEPC mode........................................................................................................................... 19
LED INDICATORS ...................................................................................................................... 21
D10 – 10-segment LED......................................................................................................... 21
D11 – Board power LED ...................................................................................................... 22
D12 – Module power LED.................................................................................................... 22
SERIAL INTERFACES ................................................................................................................... 23
UART (1~3) - DE9 ................................................................................................................ 23
UART signals ........................................................................................................................ 23
UART switches ...................................................................................................................... 23
UART monitor support.......................................................................................................... 24
XIM interface ........................................................................................................................ 26
USB ....................................................................................................................................... 27
SWITCHES .................................................................................................................................. 27
SW2 – Digital control DIP switch ........................................................................................ 27
P AG E 3
SW3 – Anlalog DIP switch.................................................................................................... 29
Typical DIP switch settings .................................................................................................. 29
Reset switch........................................................................................................................... 30
DEBUG HEADERS AND CONNECTORS .......................................................................................... 30
CN11 – UART signal test points ........................................................................................... 30
CN12 - MIO (Module Input/Output) signal test points......................................................... 31
CN3 - Analog test points ....................................................................................................... 31
CN15 – JTAG header............................................................................................................ 31
CN23 – ISR header ............................................................................................................... 32
J4 – Battery connector .......................................................................................................... 32
J5 – External power switch connector.................................................................................. 32
CN27 - Board-to-board connector........................................................................................ 32
AUDIO TESTING .......................................................................................................................... 35
Using a headset..................................................................................................................... 35
Using a handset..................................................................................................................... 37
RF INTERFACE......................................................................................................................... 38
INTRODUCTION .......................................................................................................................... 38
50Ω CONNECTION ..................................................................................................................... 38
Cables ................................................................................................................................... 39
ANTENNA USE ............................................................................................................................ 39
PART NUMBERS .......................................................................................................................... 39
Figures
Figure 1 - UDK boxed Configuration........................................................................................... 10
Figure 2 - UDK bench configuration............................................................................................ 11
Figure 3 - Dual UART and USB+UART Configurations ............................................................. 12
Figure 4 - RF Connections Diagram ............................................................................................ 15
Figure 5 - Standalone mode connection diagram......................................................................... 17
Figure 6 - Extender mode configuration ...................................................................................... 19
Figure 7 – CEPC connection diagram ......................................................................................... 20
Figure 8 - Monitor mode connection example.............................................................................. 25
Figure 9 - Protocol analyzer Y-adapter cable.............................................................................. 26
Figure 11 - Headset schematic implementation ........................................................................... 36
Figure 12 - Pushbutton microphone headset................................................................................ 37
Tables
Table 1 – Acronyms and definitions................................................................................................ 6
Table-2 - UDK Interfaces ............................................................................................................... 8
Table 3 - Power switch settings .................................................................................................... 13
Table 4 - VBATT voltage adjustment ............................................................................................ 14
Table 5 – Standalone / Host Development mode switch configurations ...................................... 18
Table 6 - Extender mode switch configuration ............................................................................. 18
Table 7 - CEPC switch settings .................................................................................................... 19
Table 9 - CEPC Signal Definition ................................................................................................ 20
Table 10 - Primary 10-segment LED map.................................................................................... 21
P AG E 4
INTRODUCTION
Table 11 - Secondary 10-segment LED map ................................................................................ 22
Table 12 - D12 power LED states................................................................................................. 22
Table 13 - UART signals............................................................................................................... 23
Table 14 - UART Switch Settings.................................................................................................. 23
Table 15 - UART Monitor Connections ........................................................................................ 24
Table 16 - XIM switch settings...................................................................................................... 26
Table 17 - CN25 XIM signal interface.......................................................................................... 27
Table 18 - USB signal interface.................................................................................................... 27
Table 19 - Switch 2 (SW2) settings ............................................................................................... 28
Table 20 - Switch 3 (SW3) Settings............................................................................................... 29
Table 21 - SW2 typical settings..................................................................................................... 29
Table 22 - SW3 Typical Settings ................................................................................................... 30
Table 23 - CN11 - UART signal test points .................................................................................. 30
Table 24 - CN12 - MIO signal test points.................................................................................... 31
Table 25 - CN3 - analog test points.............................................................................................. 31
Table 26 - CN15 - JTAG header................................................................................................... 31
Table 27 - CN23 - ISR Header...................................................................................................... 32
Table 28 – J4 Battery connector pinout........................................................................................ 32
Table 29 – J5 External power switch pinout ................................................................................ 32
Table 30 - UDK 100-pin Connector Pinout by EM3420 Function............................................... 33
Table 31 - Audio switch settings ................................................................................................... 36
Table 32 - Headset connector pinout............................................................................................ 36
Table 33 - Handset connector pinout............................................................................................ 37
Table 34 - Typical RF Performance Parameters.......................................................................... 38
Table 35 - Connector part numbers.............................................................................................. 39
P AG E 5
Introduction
Overview
This document explains the features and capabilities of the Universal
Development Kit (UDK). The UDK is based on a development platform that is
designed to support multiple members of the Wireless Embedded Module (EM)
product family. The purpose of the Universal Development Kit is to assist the
OEM during the following product development stages:
•
Initial EM evaluation
•
Host software development
•
Preliminary hardware integration
Terms and Acronyms
Table 1 – Acronyms and definitions
Acronym
or Term
Call Box
CDMA
Cellular
CW
CCW
dB
dBm
EM
GPS
HW
MIO
Modem
PCS
RF
RUIM
SIM
UART
UDK
USB
xIM
Definition
Test equipment used for CDMA testing, a.k.a. test set
Code Division Multiple Access (digital phone standard)
800 MHz radio spectrum air interface
Clock-wise
Counter clock-wise
Decibel = 10 x log10 (P1/P2) (Power dB)
Decibel = 20 x log10 (V1/V2) (Voltage dB)
Decibels, relative to 1 mW… Decibel(mW) = 10 x log10 (Pwr
(mW)/1mW)
Embedded Module
Global positioning system
Hardware
Module Input/Output
Modulator – demodulator (the EM)
Personal Communication System –spans the 1.9GHz radio
spectrum
Radio Frequency
Removable User Identity Module
Subscriber Identity Module
Universal Asynchronous Receiver Transmitter
Universal Development Kit
Universal Serial Bus
Either RUIM or SIM, as the cards themselves are interchangeable
P AG E 6
R E G U L AT O R Y I N F O R M AT I O N
Regulatory Information
Statement
The following safety precautions must be observed during all phases of the
operation, use, service or repair of any cellular terminal or mobile incorporating
the EM. Manufacturers of the cellular terminal devices are advised to convey the
following safety information to users and operating personnel and to incorporate
these guidelines into all safety standards of design, manufacture and intended
use of the product. Sierra Wireless assumes no liability for customer failure to
comply with these precautions.
1.
The EM must be operated at the voltages described in this technical documentation.
2.
The EM must not be mechanically or electrically changed. Use of the connectors
should follow the guidance of this technical documentation.
3.
The EM is designed to meet the EMC requirements of 47 CFR Part 2 and Part 15.
4.
When integrating the EM into a system, Sierra Wireless recommends testing the
system to OET Bulletin 65 Supplement C edition 97‐01.
Requirements
The Federal Communications Commission (FCC) requires application for
certification of digital devices in accordance with CFR Title 47, Part 2 and Part 15.
This includes electromagnetic susceptibility testing. As the EM is not a stand‐
alone transceiver but is an integrated module, the EM cannot be tested by itself
for EMC/EMI certification.
This device complies with Part 15 of the FCC rules. Operation of the EM is
subject to the following two conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Your mobile device is a low power radio transmitter and receiver. While ON, it
receives and sends out radio frequency (RF) signals. The design of this module
complies with the FCC guidelines and applicable standards.
WARNING: Unauthorized antennas, modifications, or attachments could impair
call quality, damage the EM, or result in violation of FCC regulations. Do not use
the EM with a damaged antenna. Please contact your local authorized dealer for
antenna replacement.
Safety
User operation requirements
The antenna used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all persons and must not be co‐located or
operating in conjunction with any other antennas or transmitters. A person or
object within 8 inches (20 centimeters) of the antenna could impair call quality
P AG E 7
and may cause the phone to operate at a higher power level than necessary and
expose that person to RF energy in excess of that established by the FCC RF
Exposure Guidelines.
!IMPORTANT!: The UDK must be installed with a minimum separation distance of 20
cm or more between the antenna and persons to satisfy FCC RF exposure requirements
for mobile transmitting devices.
The transmitter effective radiated power must be less than 1.5 Watts ERP, 2.0 Watts or
33.0 dBm EIRP. This requires that the combination of antenna gain and feed line loss
does not exceed 6.0 dBi (Conducted max power + cable loss + Antenna gain).
Interfaces
The Universal Development Kit consists of two printed circuit boards, a main
board and a daughter card. The main board contains the interfaces and
development features that are common to multiple EM types. The daughter card
is designed to adapt a given EM type to the main board. The following table
describes the interfaces and development features (main board only) available on
the Universal Development Kit.
Table-2 - UDK Interfaces
External Interfaces
Available Outside of Box
USB connector: B-type / USB device
4 UART connectors: 2 or 3 UARTs + 1 or 2 TxD monitors
Power on/off switch
DC Input jack: +5VDC from universal input AC adapter
2 Power LEDs
10 Status LEDs
Reset switch
2.5mm headset jack
RJ-14 handset jack
Host adapter flat cable connector
RF connector for antenna or call-box: TNC female
Available on main board only
Battery test clips (& battery header)
Digital / Logic analyzer headers: GPIO & UART
Analog header
JTAG debug interface
x10 DIP switches: x10 analog / x10 digital
XIM socket
P AG E 8
R E G U L AT O R Y I N F O R M AT I O N
Development Kit Contents
The Universal Development Kit package includes:
•
Universal Development Kit main board
•
Universal Development Kit daughter card
•
Wireless Embedded Module (EM)
•
Wall outlet 110/220VAC power supply
•
2 DE9 serial cables
•
CD‐ROM containing Sierra Wireless Tools software and utilities
The kit also includes a number of optional components, depending on the EM
type or intended use:
•
Antenna – combinations of cellular, PCS and GPS bands upon request
•
RF Adapter – specific to the EM type
•
USB cable
•
Parallel cable – only used for CEPC interface
•
Headset – with push‐to‐talk button
•
Dual UART adapter – supports 230kbps
•
Metal enclosure – optional, typically used for demonstration or
certification
Configurations
Boxed configuration
The boxed (demo) configuration is shown below. You must specify this delivery
option at the time of ordering. Note that this configuration is not preferable for
development use, since only a subset of the interfaces is available. It is intended
for initial EM evaluation or demonstration only.
The diagram below depicts all of the available interfaces and indicators for the
boxed configuration, and is shown with the lid off for clarity. Note that the
internal RF cable connects either to the SMA or to the TNC bulkhead adapter, not
both.
P AG E 9
Figure 1 ‐ UDK boxed Configuration
TNC Adapter. (Typically not
installed) See 50Ω Connection on
page 38.
SMA Adapter.
See 50Ω Connection
on page 38.
TxDn See UART monitor
support on page 24.
UART3 See UART
signals on page 23.
UART2 See UART
signals on page 23.
UART1 See UART
signals on page 23.
USB. See USB on
page .27.
Wall Cube Input. See
AC wall cube power
on page 13.
UDK Power LED. See D11
– Board power LED on
page 22.
Module Power LED. See D12 –
Module power LED on page
22.
Handset Jack. See Using a
handset on page 37.
Headset Jack. See Using a
headset on page 35.
Reset Button. See Reset
switch on page 30.
Bench configuration
The bench configuration is the most common‐used configuration. This is an
open‐board configuration with access to all development features. The EM3420
Daughter Card is shown in the diagram as an example.
The embedded module’s RF adapter can also be accessed directly in this
configuration in order to minimize RF losses. These additional interfaces are
shown in Figure 2 ‐ UDK bench configuration
P AG E 1 0
S E T U P AN D I N S T AL L AT I O N
Figure 2 ‐ UDK bench configuration
EM RF Adapter. See page 38.
EM3420 Daughter Card
CEPC / Parallel Interface. See page 19.
SMA Adapter.
See page 38.
Battery Header. See page 32.
RUIM Connector. See page 24.
MIO Header
See page 31.
CPLD Program
Header. See page 32.
Digital / Control DIP
Switch. See page 27.
10x DIP LED. See
page 21.
UART Header. See
page 30.
MSM JTAG Header.
See page 31.
Analog / Control DIP
Switch. See page 29.
Analog Header. See
page 31.
P AG E 1 1
Setup and Installation
Quick setup
To set up and install the development kit:
1.
Configure the UDK DIP switches for Standalone Mode. See Typical DIP
switch settings on page 29. The boxed configuration has pre‐configured
default settings.
2.
Connect the Development Kit to a PC (or other host) via serial cable(s).
3.
Plug the wall outlet power brick AC cable into an AC receptacle, then plug
the DC cable into the development kit.
4.
Connect the cable from the development kit SMA RF connector to the call
box or CDMA emulator; please contact Sierra Wireless Applications
Engineering for additional setup information.
PC connections
The development kit may be connected to a PC in a dual UART configuration or
USB + single UART as illustrated below. A USB‐only configuration is not shown.
Figure 3 ‐ Dual UART and USB+UART Configurations
SW2
SW3
DC Input USB
Seria
l Cab
le(s)
Wall
Cube
UART 1
Universal Dev Kit
UART 2
UART 3
EM
TxDn
Daughter Card
Data
Control
P AG E 1 2
S E T U P AN D I N S T AL L AT I O N
SW2
SW3
Wall
Cube
UART 1
Universal Dev Kit
UART 2
UART 3
EM
TxDn
Daughter Card
Seria
l Cab
le(s)
DC Input USB
Data
Control
Note that “COM A” and “COM B” labels are used on the host PC in the above
diagram. This is to identify the physical COM ports and should not be confused
with the COM port number assigned by Windows.
Powering the Development Kit
There are two options for powering the development kit, using an AC “wall‐
cube” or DC power from an external power supply.
AC wall cube power
When using the AC “wall‐cube”, the DC output jack from the wall‐cube connects
to the “DC Input” jack on the development kit, CN5.
If the “wall‐cube” supplied with the Dev Platform is not suitable, another wall‐
cube may be used so long as it has a 5V output rated for at least 2 Amps with the
jack barrel exterior grounded and 5V on the barrel interior.
When using the UDK in the packaged configuration, Switch SW2‐1 must be in
the OFF position, as this is in parallel with the box‐mounted power switch.
Turning SW2‐1 ON over‐rides the external switch. Table 3 shows the required
switch settings when using wall‐cube power.
Table 3 ‐ Power switch settings
Bench
Configuration
Boxed
Configuration
SW2-1
OFF
ON
OFF
OFF
ON
External Power Switch
OFF
ON
Module Power State
OFF
ON
OFF
ON
ON
P AG E 1 3
When using the wall cube input, there are 2 settings for battery voltage. SW3‐8 is
closed to set the voltage to a nominal value (~3.9 V). This is the default setting,
and should be used in most cases. When open, the voltage can be adjusted using
R394 for testing low‐ or high‐ battery voltage conditions. Adjustment ranges
between 3.0 V ~ 4.5 V, as shown in Table 4.
To adjust the VBATT voltage, measure at TP17 & TP18 and adjust R394. Note
that SW3‐8 must be OFF in order to adjust VBATT voltage according to the table.
Table 4 ‐ VBATT voltage adjustment
SW3-8
ON
OFF
OFF
R394
Full CCW
Full CW
VBATT Voltage
~3.9V
~3.0V
~4.5V
DC power
If using a DC power source without a jack connector, the DC voltage must be
between 3.6 V and 4.2 V and rated for at least 2 amps. The DC voltage must be
connected to the development kit on TP17 (VBATT) and ground must be
connected on TP18. In this configuration, SW2‐1 must be turned OFF.
RF Connection
The boxed configuration connects to a CDMA call box or other RF test
equipment via the external SMA connector. For the bench configuration, there
are two options.
1.
Use the SMA connector at the end of the daughter card. This provides the
most commonly available connector type, so no special RF adapters are
required.
2.
Direct connection. The EM’s RF connector provides minimal RF losses, but
requires a special RF adapter. The adapter type depends on the EM model is
supplied with your UDK.
Both configurations are shown below, with Option 1 shown in blue and Option 2
in violet.
P AG E 1 4
S E T U P AN D I N S T AL L AT I O N
Figure 4 ‐ RF Connections Diagram
SM
??
MA
/S
Daughter Card
Universal Dev Kit
SW3
UART 2
UART 3
SW2
UART 1
EM
TxDn
U.
.F
/U
/S
SMA / SM
CDMA
Call Box
DC Input USB
For more detailed information on the RF interface for the UDK, see 50Ω
Connection on page 38.
P AG E 1 5
Development Kit Features
Introduction
The development kit includes a number of switches for various controls and
configuration options. This section discusses these switches, LED indicators and
the various development kit headers and connectors.
Modes of operation
The development kit supports four modes of operation: standalone mode, host
development mode, extender mode and CEPC mode. In all modes of operation,
the embedded module is mounted on the development kit daughter card, which
is specifically designed for a given EM model.
•
Standalone mode allows for operation of the module independent of the
target host system. The interface protocol is forced to “DM” protocol,
allowing communication with the lowest‐level development tools.
•
Host Development mode also allows the module to operate
independently of the target host system, however the protocol is
compatible with the target host device.
•
Extender mode assists with hardware and software integration of the
module into the target host system.
•
CEPC mode allows a specially configured PC to control host‐modem
handshaking signals and power control during early stages of Windows
CE development.
Each mode of operation is required to satisfy the interface requirements of the
EM model being used. See “Embedded Module Hardware Integration Guide”for
details on host‐modem handshaking. By enabling the Module Wake DIP Switch
SW2‐6 (see SW2 – Digital control DIP switch), the UDK asserts the necessary
signals to keep the EM communicating with the host platform.
Please see the tables under heading SW2 – Digital control DIP switch for the
typical switch settings for each mode.
Standalone mode
Standalone mode is intended for product evaluation and early development
independent of the target host system. In standalone mode, a PC or other host
can communicate with the development kit via serial ports. Use the same serial
port configuration described later in this document. Standalone mode also
supports audio test capability via a 2.5 mm headset jack and RJ‐11 handset jack.
To set the development kit for standalone mode, Switches SW2.6 and SW2.7
must be turned ON before resetting the module (via SW1). It is recommended to
use the default switch settings as shown under Typical DIP switch settings on
page 29.
P AG E 1 6
D E V E L O P M E N T K I T F E AT U R E S
Setting SW2.6 and SW2.7 for Standalone mode and resetting the module, forces
the serial interface to use the “DM” protocol which is compatible with the low‐
level debug tools. This is true for modules using either CnS or HI protocols.
See Figure 5 for an example of standalone operation for the Dual UART
configuration.
Figure 5 ‐ Standalone mode connection diagram
SW2
SW3
Wall
Cube
UART 1
Universal Dev Kit
UART 2
UART 3
EM
TxDn
Daughter Card
Seria
l Cab
le(s)
DC Input USB
Data Port
Control Port
Host Development mode
Host Development mode is intended for host protocol development independent
of the target host system. In Host Development mode, a PC or other host can
communicate with the development kit via serial ports. Use the same serial port
configuration described later in this document. Host Development mode also
supports audio test capability via a 2.5 mm headset jack and RJ‐11 handset jack.
To set the development kit for Host Development mode, Switches SW2.7 must be
turned OFF before resetting the module (via SW1).
IMPORTANT! Switch SW2.6 can be turned either ON or OFF during reset, but must
be turned OFF for the module to fully power down at any time!
P AG E 1 7
The connection diagram is the same as that shown for Standalone Mode. The
table below shows the effect of switches SW2‐6 and SW2‐7 following a module
reset. The states shown in this table are valid only when handshaking is enabled.
Table 5 – Standalone / Host Development mode switch configurations
Operating Mode
Standalone Mode
SW2-6
Module Wake
ON
SW2-7
Host Status
ON
Host Development Mode
ON / OFF
OFF
Behavior
DM Protocol; communication
channel never closes
CnS or HI Protocol; communication
channel follows the state of
MODULE_WAKE
Extender Mode
In extender mode, a blank “EM Pod” is installed in the target host in place of the
EM. This “dummy” module provides a flex cable connection to the development
kit, but no EM circuitry. In this arrangement, the EM on the development kit is
powered and controlled by the target host. This mode of operation allows for
probing a number of the signals on the module host interface connector.
Additionally the serial ports can be configured to allow monitoring of RX and TX
communication directions for both ports using a serial port analyzer.
Two control switch changes (from standalone / host development modes) are
required to support extender mode. The development kit main board will release
the required control/handshaking signals when the flex cable is detected,
depending on the position of the Module Wake & Host Status switches. Analog
switches requiring setup are for battery connection and monitoring. These
options are shown in the following table:
Table 6 ‐ Extender mode switch configuration
Switch
Position
SW2-6
Signal
OFF
ON
MODULE_WAKE
SW2-7
HOST_STATUS
SW3-9
AUXV0 ↔ VBATT
Tri-states Module Wake signal to the
EM, allowing these to be controlled by
the Host.
Tri-states Host Status signal to the
EM, allowing these to be controlled by
the Host.
Isolates AUXV0 pin on EM connector
SW3-10
VBATT ↔
HOST_VBATT
Isolates dev kit VBATT from Host
battery voltage
Drives Module Wake signal
to the EM, forcing control
channel ON
Drives Host Status signal to
the EM, forcing control
channel ON
Connects VBATT to AUXV0
pin on EM connector
Supplies dev kit VBATT
from host battery voltage
A diagram showing Extender mode interconnection is shown below. This
example shows a dual‐UART configuration. Extender mode in its most basic
form simply routes signals between the host and EM via a CPLD.
Note that TxD always originates from the Host (DTE), and RxD originates from
the EM (DCE). Signal directions are indicated in the diagram.
P AG E 1 8
D E V E L O P M E N T K I T F E AT U R E S
Certain EM models bring one or more Auxiliary Analog‐to‐digital inputs
numbered (0...) out to the host connector. AUXV0 is reserved for measuring
battery voltage, and AUXV1, AUXV2, etc. can be connected for general use.
Supported AUXVn signal pins are defined in the EM Reference Guides.
Figure 6 ‐ Extender mode configuration
RxD2
CPLD
TxD1
TxD 2
UART 2
D1 D1
Rx Tx
TxD2
EM
Pod
D2
D2 Tx
Rx
EM
TxD 1
Daughter Card
Universal Dev Kit
UART 1
RxD1
Host
Platform
DC Input
Wall
Cube
CEPC mode
CEPC is a specially configured PC, running Windows CE on PC platform
(CEPC). The PC’s parallel port directly interfaces to the Universal Dev Kit to
perform power control and signaling functions. Signals used for this interface
conform to the Host‐Modem Handshaking Specification Rev 3.7.
Similar to Extender Mode, the UDK main board will release the required
control/handshaking signals when the parallel cable is detected, depending on
the position of the Module Wake and Host Status switches (refer to the table
below).
Table 7 ‐ CEPC switch settings
Switch
position
SW2-6
SW2-7
Signal
OFF
ON
MODULE_
WAKE
HOST_ST
ATUS
Tri-states Module Wake signal to the EM,
allowing these to be controlled by the Host.
Tri-states Host Status signal to the EM,
allowing these to be controlled by the Host.
Drives Module Wake signal to the
EM, forcing control channel ON
Drives Host Status signal to the
EM, forcing control channel ON.
P AG E 1 9
The following diagram shows interconnection between the PC and EM
Development Board, using a standard DB‐25 parallel cable and 2 serial cables.
Figure 7 – CEPC connection diagram
UART 1
Universal Dev Kit
UART 2
EM
DB-25
Daughter Card
Wall
Cube
(2) S
erial
Cable
DC Input
CEPC
(WinCE
Emulator)
Data Port
Control Port
The following table shows pinout and signal names for the PC parallel port and
UDK, signal direction and signal description. The Active column defines the
active state for the PC parallel port only. The UDK then translates these signals
according to EM type detected.
Table 8 ‐ CEPC Signal Definition
PC
pin
PC
signal
Data 0
Data 1
Data 2
12
Data 3
+Paper
End
+Select
13
Active
Description
ON/OFF_EM
RESET_N
MODULE_WAKE
UDK
pin
27
25
30
High
Low
High
Æ
Å
HOST_STATUS
HOST_WAKE
28
29
High
High
Å
MODEM_
STATUS
26
Low
High level turns the EM on
Low pulse resets the EM
High level tells EM to wake up;
Enable the control channel
Low level tells EM to keep control channel open
High level tells the host that the EM has high
priority message to send
Low level tells host that EM has been reset;
High level: control channel has been initialized
Dir
UDK Signal
Æ
Æ
Æ
P AG E 2 0
D E V E L O P M E N T K I T F E AT U R E S
Two CEPC functions are typically developed independently – power control and
host‐modem handshaking. The Module Wake switch (SW2‐6) should be turned
ON while Host‐Modem Handshaking is not being controlled by the CEPC. This
will allow proper debug of the Power Control function.
LED Indicators
D10 – 10-segment LED
The Universal Development Kit supports a 10‐segment LED bar to display
digital signal status, plus 2 power/status indicators.
Each segment of the 10‐segment display is related to an IO signal as shown in the
table below. The LED lights up when the signal is in the ACTIVE state; and off
when the signal is in the INACTIVE state.
Two maps are available for a given EM model. The primary LED map is enabled
by default, and is used for host‐modem handshaking signal states and selected
UART1 and UART2 signals. The primary LED map for most embedded modules
is shown below:
Table 9 ‐ Primary 10‐segment LED map
D13 10-Segment LED Array (Primary map)
Pos Label Name Description
Module Wake MODULE_WAKE - wakeup signal from host
Host Status
HOST_STATUS - status signal from host
Host Wake
HOST_WAKE - wakeup signal from EM
Modem Reset MODEM_RESET_STATUS - from EM
DTR1/
UART1 Data Terminal Ready - from host
DSR1/
UART1 Data Set Ready - from EM
CD1/
UART1 Carrier Detect - from EM
RI1/
UART1 Ring Indicator - from EM
TXD2
UART2 Transmit Data - from host
10
RXD2
UART2 Receive Data - from EM
Some EM models also support full UART1 signal status using a DIP switch on
their Daughter Card. This places TxD1, RTS1/, RxD1, and CTS1/ onto Positions
1~4, respectively. Positions 5~10 remain per the above table. Refer to the
Reference Guide for your EM model for more details.
The secondary LED map for most embedded modules supports XIM
development. To use this LED map, MIO19 must be pulled high (see CN12.3
details in CN12 ‐ MIO (Module Input/Output) signal test points on page 31).
Note that a given EM model supports only one XIM interface, the other will
default to a UART interface. For example EM3420 uses UART3 for the RUIM
interface, so in the LED map below, UART2 signals will apply to positions 7~10.
P AG E 2 1
Table 10 ‐ Secondary 10‐segment LED map
D13 10-Segment LED Array (Secondary map)
Description
Pos Label Name
XIM_EN3
TXD3 pin, enables XIM VCC when high
XIM_IO3
RXD3 pin, bidirectional XIM data
XIM_RST3
RTS3_N pin, active high reset to XIM card
XIM_CLK3
CTS3_N pin, XIM clock
XIM_DET
GPIO5 PD, goes high when card is inserted
N.U.
Not Used
XIM_EN2
TXD2 pin, enables XIM VCC when high
XIM_RST2
RTS2_N pin, active high reset to XIM card
XIM_CLK2
CTS2_N pin, XIM clock
10
XIM_IO2
RXD2 pin, bidirectional XIM data
Other combinations of LED signaling can be assigned for specific development
tasks or EM interface capabilities via CPLD, as required. These assignments may
vary between EM models; see the Reference Guide for your specific module.
NOTE: The 10 segment LED is also used to display the CPLD code version, when the
daughter card is removed. The LED Enable switch must be turned OFF to view this code.
The code version is displayed as a binary number, with LED D13.1 being the LSB.
D11 – Board power LED
D11 is the Board Power indicator, and displays GREEN when the UDK main
board is powered on.
D12 – Module power LED
D12 is the Module Power indicator, which displays GREEN or RED when the
Module is powered on. The LED is turned OFF when the Module power control
is OFF (via the UDK). This combination of indication is valid for standalone
mode, Extender Mode or CEPC, according to the table below.
Table 11 ‐ D12 power LED states
D12 State
OFF
GREEN
RED
Description
Power control to the EM is in the OFF state. Controlled by
SW2-1 unless in Extender Mode or using CEPC.
The EM is ON, and reset is inactive
The EM is turned ON, but either power is not detected or the
EM is in the reset state.
P AG E 2 2
D E V E L O P M E N T K I T F E AT U R E S
Serial Interfaces
UART (1~3) - DE9
Used to access the EM UARTs, RS‐232 compatible up to 8‐wire interface
(UART1), 2‐ or 4‐ wire interface (UART2 & UART3). RTS/CTS functionality is
optional for UART2 & UART3. UART1 contains all flow control signals, and is
used primarily as the data port (i.e. AT command interface) for UART‐only
implementations.
It may be necessary to adjust the EM data port UART during development, as
the default data rate is 230 kbps. Most PC’s do not support more than 115 kbps
without a specialized serial port adapter (available as Sierra Wireless accessory).
Scripts are provided on the CD‐ROM to configure UART1 for 115 kbps or 230
kbps.
UART signals
Signals from the module connector to this DE9 will be level shifted using an RS‐
232 transceiver.
Table 12 ‐ UART signals
Pin #
Ref.
Des.
UART1
Signal Name
CD1_N
RXD1
TXD1
DTR1_N
GND
DSR1_N
RTS1_N
CTS1_N
RI1_N
CN2
UART2
Signal Name
NC
RXD2
TXD2
NC
GND
NC
RTS2_N
CTS2_N
NC
CN1
UART3
Signal Name
NC
RXD3
TXD3
NC
GND
NC
RTS3_N
CTS3_N
NC
CN13
TxDn
Signal Name
NC
NC
TXDn
NC
GND
NC
NC
NC
NC
CN14
UART switches
Each UART can be individually selected using SW2 positions 3~5, where the
switch ON position = UARTn Selected. Note that the Embedded Module
Firmware setting determines the UART selection. The UDK UART selections are
shown below.
Table 13 ‐ UART Switch Settings
Switch Position
SW2-3
SW2-4
SW2-5
Select UARTn
UART1
UART2
UART3
P AG E 2 3
UART monitor support
The 4 DE9 connectors are dynamically assigned, based on the combination of
DIP switch settings for SW2‐3, ‐4 and ‐5. The following table shows these
assignments. For the Extender Mode case, the full UART use is turned off,
however the RxD signal will still be transmitted to the connector per the table.
See * note below the table for more details.
SW2-5
(UART3)
SW2-4
(UART2)
SW2-3
(UART1)
UART Signal Assignment
UART Switch Setting
Table 14 ‐ UART Monitor Connections
CN2
(UART1)
UART1
UART1
UART1
UART1
CN1
(UART2)
UART2
UART2
TxD3
TxD3
UART2
UART2
CN13
(UART3)
TxD2
TxD2
UART3
UART3
UART3
UART3
CN14
(TxDn)
TxD1
TxD2
TxD1
TxD1
TxD2
TxD1
* Note: For extender mode, RxDn replaces UARTn in the above assignment table.
This means that only the RxD signal is passed out through these connectors
when using extender mode. Signals in both directions can be monitored, but
from different connectors.
Signal TxDn is provided on the fourth DE9 connector. This signal is used
exclusively for monitor mode. TxDn assignment is defined in Table 14 above.
Note that for monitor mode, a maximum of 4 signals can be monitored in a dual‐
UART configuration:
•
TxD1, RxD1, TxD2, RxD2 are monitored when using UART1 + UART2
•
TxD1, RxD1, TxD3, RxD3 are monitored when using UART1 + UART3
•
UART2 + UART3 is configurable on the development kit, but is typically not
used in any EM.
The interconnect for monitor mode operation is shown in Figure 8. Here, the
UDK is used in the extender mode (see page 17), to monitor UART1 and/or
UART2. In this configuration, the SW2 settings from Table 14 are SW2‐5, 4, 3 = 0,
1, 1 in order to enable UART1 and UART2.
In Figure 8 the UART2 connector monitors RxD2 (signals from EM Æ host), and
TxD2 monitors signals from the host Æ EM.
It is also possible to monitor both directions of UART1 in this configuration,
where the UART1 connector monitors RxD1 (signals from EM Æ host), and TxD1
monitors signals from the host Æ EM.
P AG E 2 4
D E V E L O P M E N T K I T F E AT U R E S
Figure 8 ‐ Monitor mode connection example
TxD2
RxD2
EM
Pod
CPLD
TxD1
TxD 2
UART 2
D1 D1
Rx Tx
D2
D2 Tx
Rx
EM
TxD 1
Daughter Card
Universal Dev Kit
RxD
D2
Rx D2
Tx
Host
Platform
**See adapter
cable schematic
UART 1
RxD1
TxD2
DC Input
Wall
Cube
Protocol Analyzer
Monitors TxD & RxD pins
**Requires adapter cable
PC used as "sniffer"
Monitors RxD pin of COMx
A Y‐adapter cable is used to monitor both TxD and RxD using a protocol
analyzer. This puts RxD onto pin 2 and TxD onto pin 3 of the protocol analyzer’s
DE9 plug. The schematic for this cable is shown below.
P AG E 2 5
6
nd
To Protocol
Analyzer
Grou
DE9 SOCKET
TxD
Groun
TxD
From Host
DE9 PLUG
Figure 9 ‐ Protocol analyzer Y‐adapter cable
RxD
From EM
DE9 PLUG
Rx D
XIM interface
Some embedded modules can support XIM on either UART2 or UART3. When
the EM firmware is configured for XIM, the associated UART function is not
available.
DIP switch settings are used to enable XIM. Select XIM for UART2 or UART3
pinouts according to the table below. Note that the XIM selection, when enabled,
overrides Table 13 for the selected UART. For example, if UART2 is enabled in
Table 13 and XIM is enabled with UART2 selected in Table 15 , then Table 13
behaves as if UART2 is NOT selected.
Table 15 ‐ XIM switch settings
SW2-10
setting
OFF
ON
ON
SW2-9
setting
OFF
ON
XIM configuration
XIM disabled
XIM enabled on UART2
XIM enabled on UART3
Note that the detection of an XIM card is configurable, and should be determined
during the design of the Host/EM interface. Typically, an available MIO is used
in a level‐triggered interrupt or polled mode. Any required detection circuitry is
a function of the Host board design.
As shown in Table 16 the detection mechanism for the UDK is a contact that
closes between pins 4 & 8 when the XIM card is inserted with the CN25 latch
connector closed. The XIM_DET_POL signal is the detection polarity, which is
set on the EM daughter card. If the MIO used for XIM_DET contains a pull‐down
element, then the signal XIM_DET_POL would be tied high, and vice‐versa.
P AG E 2 6
D E V E L O P M E N T K I T F E AT U R E S
Table 16 ‐ CN25 XIM signal interface
Pin #
Signal name
VCC_XIM
XIM_RST
XIM_CLK
XIM_DET_POL
GROUND
XIM_VPP
XIM_IO
XIM_DET
Direction
To Card
To Card
To Card
To Socket
N/A
Bidirectional
From Socket
Description
VCC supply for XIM card
Active HI reset signal
Clock signal
Detection polarity (UDK only)
Ground
Not Used
Data to/from XIM card
XIM detect to MSM
USB
Performs direct connection to a PC for modules that support USB. No additional
signals or switches are required, however the EM and/or daughter card must be
configured with a USB transceiver and the necessary firmware.
Table 17 ‐ USB signal interface
CN20 Pin #
Signal name
VCC_USB
USB-
USB+
Ground
When using a module with the USB interface, it may not be possible to use
certain interface combinations. For example, the MSM6050’s UART3 pins
interface with the USB transceiver, so UART3 cannot be used. In this case, SW2‐5
UART3 must be in the OFF position to avoid contention. See the Reference
Guide for your Embedded Module for details on which interface combinations
are not possible.
The UDK uses MIO(1) and MIO(2) to route the signals USB+ and USB‐,
respectively. These MIO signals are not available for general use in this case.
Switches
SW2 – Digital control DIP switch
DIP switch SW2 is used for digital control functions. Certain functions are over‐
ridden in Extender Mode and/or CEPC Mode, meaning that connection of a
CEPC or Extender cable are automatically detected, so the switch setting does
not need to be changed. These functions are indicated in the table below, in the
far right columns.
P AG E 2 7
Table 18 ‐ Switch 2 (SW2) settings
Switch
position
10
Function
MODULE_ON– This switch is used to turn the module on. Turning the
switch to OFF position turns modem OFF. Turning switch to ON
position turns modem ON. This switch is only used in standalone mode
to control modem power state. In the extender and CEPC modes this
switch position is overridden in the CPLD.
Battery Enable – Enables the barrel jack LDO regulator / Battery supply,
which powers up the Universal Dev Kit board. Turn this switch ON to
use the wall cube input to supply the EM. Turn this switch OFF if using
DC Power at the battery terminals.
UART1 Select – Turn this switch ON to enable UART1
communications. This enables both the RS-232 transmitter and receiver
for UART1. This switch setting is ignored when using Extender Mode,
where only monitoring of RS-232 signals is possible.
UART2 Select – Turn this switch ON to enable UART2
communications.
UART3 Select – Turn this switch ON to enable UART3
communications. Note that UART3 must be disabled when using the
USB interface with the MSM6050. See the Reference Guide for the
associated EM for details.
Module Wake – Turn this switch ON to activate the MODULE_WAKE
signal. Used in conjunction with SW2.7 Host Status during reset to
initiate Standalone Mode.
Host Status – Turn this switch ON to activate the HOST_STATUS
signal. Used in conjunction with SW2.6 Module Wake during reset to
initiate Standalone Mode.
LED Enable – Enables the MIO LED array. Turn this switch ON to
enable the LED array.
XIM Select – This switch selects which MSM UART channel will be
used for XIM mode, only when XIM is enabled by SW2-10. Turn this
switch OFF (Low) to select UART2, and ON (High) to select UART3.
XIM Enable – Turn this switch ON to enable XIM on UART2 or UART3
(as per SW2-9 setting). The combination of XIM enable and XIM select
will override the UARTn Select function switch for SW2-4 and SW2-5
above. That is, the XIM selection takes precedence over the UART
function.
See XIM interface on page 26 for more details.
Extender
override
√
CEPC
override
√
√
√
√
P AG E 2 8
D E V E L O P M E N T K I T F E AT U R E S
SW3 – Analog DIP switch
Table 19 ‐ Switch 3 (SW3) Settings
Switch
position
10
Function
MIC BIAS Control – This switch is used to enable an onboard mic bias for the headset. Turn to ON
position to enable bias at headset microphone. Turn to OFF position to disable bias. Turn to OFF
during extender mode.
MIC1PHeadset - When ON, connects SPK1P to the headset SPK pin.
SPK2>Headset - When ON, connects SPK2 to the headset SPK pin.
Bat Voltage Set – Sets the battery LDO regulator output to nominal voltage ~3.9V when turned ON.
When this switch is turned OFF, the LDO output voltage can be adjusted between 3.0~4.5V using
potentiometer R394.
AUXV0Headset Connect SPK1P to headset jack
SPK2>Headset Connect SPK2 to headset jack
Batt Voltage Set Set battery voltage LDO to
mid-level (~3.9V)
9 AUXV0Battery
Connect VBATT to the host
battery pin
EM3420 does not
support MIC2/SPK2
Depends on power
source
Reset switch
Momentary switch SW1 resets the EM when pressed.
Debug headers and connectors
Internal to the development kit are two standard 2‐row 0.1” x 0.1” headers that
can be used for connecting logic analyzer or scope probes. A third header is used
for probing analog signals.
CN11 – UART signal test points
Table 22 ‐ CN11 ‐ UART signal test points
Signal name
RXD1
DTR1_N
RTS1_N
RI1_N
RXD2
RTS2_N
RXD3
RTS3_N
Pin #
11
13
15
17
19
Pin #
10
12
14
16
18
20
Signal name
CD1_N
TXD1
DSR1_N
CTS1_N
TXD2
CTS2_N
TXD3
CTS3_N
GND
P AG E 3 0
D E V E L O P M E N T K I T F E AT U R E S
CN12 - MIO (Module Input/Output) signal test points
Table 23 ‐ CN12 ‐ MIO signal test points
Signal name
RESET_EM
MIO(19)
MIO(1)
MIO(3)
MIO(5)
MIO(7)
MIO(9)
MIO(11)
MIO(13)
MIO(15)
Pin #
11
13
15
17
19
Pin #
10
12
14
16
18
20
Signal name
MIO(0)
MIO(2)
MIO(4)
MIO(6)
MIO(8)
MIO(10)
MIO(12)
MIO(14)
GND
CN3 - Analog test points
In addition to the Analog test header, you can install a set of test clips to assist in
connecting audio test equipment. Ground test clips are black and signal test clips
are red. These test clips are defined in the table below. Refer to the Embedded
Module Hardware Integration Guide for information on using the audio circuitry.
Table 24 ‐ CN3 ‐ analog test points
Test clip
TP13
TP8
TP7
TP11
TP9
TP5
TP6
TP10
TP12
TP14
Signal name
GND
MIC1P
MIC1N
MIC2P
MIC2N
SPK1P
SPK1N
SPK2
RINGER/SPK3
GND
Pin #
11
13
15
17
19
Pin #
10
12
14
16
18
20
Signal name
GND
N.C.
VCC_MSM_P
VCC_BRD
VCC_XIM
VCC_USB
VCC_5V
VBATT
AUXV0
GND
CN15 – JTAG header
The JTAG header can be used as an alternate method for programming the EM’s
Flash memory using the JTAG interface to the MSM processor. The header pins
out directly to the Lauterbach Trace32 debugger.
Table 25 ‐ CN15 ‐ JTAG header
Signal name
VCC_MSM_P
TRST_N
TDI
TMS
Pin #
Pin #
Signal name
GND
GND
GND
GND
P AG E 3 1
Signal name
TCK
TDO
VCC_MSM_P
Pin #
11
13
Pin #
10
12
14
Signal name
GND
RESET_EM
GND
CN23 – ISR header
The ISR (In‐System Reprogramming) header is used to program the CPLDs on
the Universal Development Kit, which is performed by Sierra Wireless. The three
devices are daisy‐chained to use only one header. Note you must remove the
daughter card to program the CPLDs.
Table 26 ‐ CN23 ‐ ISR Header
Signal name
GND
JTAG_EN
VCC_BRD
TDO
Pin #
Pin #
10
Signal name
TMS
TCK
TDI
GND
J4 – Battery connector
J4 can be used to directly connect a battery for testing charge or low‐battery
condition behavior.
Table 27 – J4 Battery connector pinout
J4 Pin #
Signal name
VBATT
Ground
J5 – External power switch connector
J5 routes the MODULE_ON signal to the external power switch. This is used
only for the boxed configuration.
Table 28 – J5 External power switch pinout
J4 Pin #
Signal name
ON_SWITCH
MODULE_ON
CN27 - Board-to-board connector
A 100‐pin board‐to‐board connector is the interface between the UDK main
board and the EM daughter card. The reference guide for each EM model shows
the 100‐pin connector grouped by EM function. Table 29
contains a 100‐pin pinout table indexed by the UDK connector pin number.
P AG E 3 2
D E V E L O P M E N T K I T F E AT U R E S
Table 29 ‐ UDK 100‐pin Connector Pinout by EM3420 Function
Pin #
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
Signal Name
Type
Dir(1)
Description
VBATT
Power
Bi-Dir
Battery Voltage (3.7V Nominal)
SPK1P
GND
MIC2P
GND
SPK1N
GND
MIC2N
GND
SPK2
GND
MIC1P
GND
MIC1N
GND
VCC_USB
VCC_BRD
AUXV0
TP36
VCC_MSM_P
VCC_XIM
ON/OFF_EM
TP35
RESET_EM
VCC_5V
MIO(8)
TRST_N
TXD2
TXD3
MIO(9)
TDI
RXD2
RXD3
MIO(12)
TMS
CTS2_N
CTS3_N
Audio
Power
Audio
Power
Audio
Power
Audio
Power
Audio
Power
Audio
Power
Audio
Power
Power
Power
Analog
N/A
Power
Power
Digital
N/A
Digital
Power
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
IN
Bi-Dir
OUT
Bi-Dir
IN
Bi-Dir
OUT
Bi-Dir
IN
Bi-Dir
OUT
Bi-Dir
OUT
Bi-Dir
OUT
OUT
OUT
N/A
IN
OUT
OUT
N/A
OUT
OUT
Bi-Dir
OUT
OUT
OUT
Bi-Dir
OUT
IN
IN
Bi-Dir
OUT
IN
IN
Speaker 1 +
Ground
Microphone 2 +
Ground
Speaker 1 Ground
Microphone 2 Ground
Speaker 2
Ground
Microphone 1 +
Ground
Microphone 1 Ground
USB Transceiver Voltage
UDK Main Board Regulated Voltage
Battery Voltage tap for EM ADC
Test Point, not used
MSM Digital Voltage from EM
XIM Card Digital Voltage
On / Off control to EM
Test Point, not used
Reset control to EM
UDK Main Board 5V from wall cube
Module Input/Output 8
JTAG Test Reset
Transmit Data UART2
Transmit Data UART3
Module Input/Output 9
JTAG Test Data Input
Receive Data UART2
Receive Data UART3
Module Input/Output 12
JTAG Test Mode Set
Clear to Send UART2
Clear to Send UART3
P AG E 3 3
Pin #
Signal Name
Type
Dir(1)
Description
43
44
45
46
MIO(13)
TCK
RTS2_N
RTS3_N
Digital
Digital
Digital
Digital
Bi-Dir
OUT
OUT
OUT
Module Input/Output 13
JTAG Test Clock
Ready to Send UART2
Ready to Send UART2
47
MIO(14)
Digital
Bi-Dir
Module Input/Output 14
48
49
50
51
52
53
54
55
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
IN
Bi-Dir
OUT
Bi-Dir
OUT
Bi-Dir
IN
Bi-Dir
JTAG Test Data Output
Module Input/Output 14
Module Wake Handshaking signal
Module Input/Output 6
Host Status Handshaking signal
Module Input/Output 10
Host Wake Handshaking signal
Module Input/Output 11
Digital
IN
Reset Status Handshaking signal
57
58
59
60
TDO
MIO(15)
MODULE_WAKE
MIO(6)
HOST_STATUS
MIO(10)
HOST_WAKE
MIO(11)
MODEM_RESET_
STATUS
MIO(5)
XIM_EN
CTS1_N
XIM_RST
Digital
Digital
Digital
Digital
Bi-Dir
IN
IN
IN
61
MIO(2)
Digital
Bi-Dir
62
63
64
65
66
67
68
69
70
71
72
XIM_CLK
TXD1
XIM_IO
MIO(3)
XIM_VPP
RTS1_N
XIM_DET
MIO(4)
XIM_DET_POL
RXD1
EM_ID(0)
Digital
Digital
Digital
Digital
Power
Digital
Digital
Digital
Digital
Digital
Digital
IN
OUT
Bi-Dir
Bi-Dir
Bi-Dir
OUT
OUT
Bi-Dir
IN
IN
IN
73
MIO(1)
Digital
Bi-Dir
74
75
76
77
78
EM_ID(1)
MIO(7)
EM_ID(2)
MIO(0)
EM_ID(3)
Digital
Digital
Digital
Digital
Digital
IN
Bi-Dir
IN
Bi-Dir
IN
79
RINGER/SPK3
Analog
IN
80
81
82
EM_ID(4)
RI1_N
TP34
Digital
Digital
N/A
IN
OUT
N/A
Module Input/Output 5
XIM Enable
Clear to Send UART1
XIM Reset
Module Input/Output 2
USBXIM Clock
Transmit Data UART1
XIM Data Input/Output
Module Input/Output
XIM Programming Voltage
Ready to Send UART1
XIM Detection signal
Module Input/Output
XIM Detection Polarity
Receive Data UART1
Embedded Module ID Bus, Bit 0
Module Input/Output 1
USB+
Embedded Module ID Bus, Bit 1
Module Input/Output 7
Embedded Module ID Bus, Bit 2
Module Input/Output 0
Embedded Module ID Bus, Bit 3
Ringer PWM signal (Digital)
Speaker 3
Embedded Module ID Bus, Bit 4
Ring Indicator UART1
Test Point, not used
56
P AG E 3 4
D E V E L O P M E N T K I T F E AT U R E S
Pin #
Signal Name
Type
Dir(1)
Description
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
DTR1_N
MIO(23)
CD1_N
MIO(22)
DSR1_N
MIO(21)
MIO(16)
MIO(20)
GND
MIO(19)
GND
MIO(18)
GND
MIO(17)
GND
HEADSET_DET
GND
BUTTON_DET
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Power
Digital
Power
Digital
Power
Digital
Power
Digital
Power
Digital
OUT
Bi-Dir
IN
Bi-Dir
IN
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
Bi-Dir
OUT
Bi-Dir
OUT
Data Terminal Ready UART1
Module Input/Output 23
Carrier Detect UART1
Module Input/Output 22
Data Set Ready UART1
Module Input/Output 21
Module Input/Output
Module Input/Output 20
Ground
Module Input/Output 19
Ground
Module Input/Output 18
Ground
Module Input/Output 17
Ground
Headset Insertion Detection
Ground
Headset Button-press Detection
Note (1): Signal Direction is taken from the UDK main board perspective.
Audio testing
The development kit provides two methods of audio testing, a 2.5 mm headset
jack for a hands free headset and an RJ‐11 connector for a standard telephone
handset.
There are two audio paths supported by the UDK:
•
Audio Path 1 is typically used for Handset applications
•
Audio Path 2 is typically used for the Headset interface in the end
product. However, Audio Path 1 can be used in conjunction with a
headset to facilitate product development with the UDK.
Using a headset
The development kit has a 2.5mm headset jack for a cell‐phone headset (J1).
MIC Bias voltage – When using a headset in standalone mode or if the host does
not provide a MIC bias voltage, set SW3‐1 to the ON position, otherwise this
switch should be set to the OFF position. Note that the default audio gains of the
modem are set for use with a host front end which contains additional gains in
the transmit path (20 dB). For this reason the audio will be very faint while using
the headset in standalone mode – unless additional gains are added to the
modem transmit path using directed test scripts.
The table below depicts SW3 settings for using the headset jack with audio path 1
or 2.
P AG E 3 5
Table 30 ‐ Audio switch settings
Switch
Signals
Headset
Headset
Handset
position
to Path 1
to Path 2
to Path 1
SW3-1
ON
ON
J1 MIC pin ↔ MIC_BIAS
SW3-2
ON
OFF
OFF
J1 MIC pin ↔ MIC1P
SW3-3
ON
OFF
OFF
AC ground ↔ MIC1N
SW3-4
OFF
ON
J1 MIC pin ↔ MIC2P
SW3-5
OFF
ON
AC ground ↔ MIC2N
SW3-6
ON
OFF
OFF
J1 SPK pin ↔ SPK1P
SW3-7
OFF
ON
J1 SPK pin ↔ SPK2
J1 is a standard 2.5mm headset jack. The pinout for this connector is shown
below.
Table 31 ‐ Headset connector pinout
Pin #
Signal name
GND
MIC_P
SPK_P
MIC_DET
SPK_DET
The schematic representation of the headset jack, as connected on the UDK main
board is shown in Figure 10 ‐ Headset schematic implementation
The HEADSET DETECT function is implemented using the MIC_DET pin 4, and
is active low. This connection relies on both the Microphone bias voltage being
capable of signaling a logic 1 voltage level, plus the use of a GPIO with pull‐
down in the MSM. The BUTTON DETECT function as implemented is also active
low, and relies on the use of a GPIO with pull‐up in the MSM.
Figure 10 ‐ Headset schematic implementation
Microphone IN
/HEADSET DETECT
Speaker Out
/BUTTON DETECT
This configuration is compatible with headset models containing a push‐to‐talk
button function on the microphone signal, or standard 3‐pin headset models
P AG E 3 6
D E V E L O P M E N T K I T F E AT U R E S
without a push‐button function. Sierra Wireless offers a headset containing a
push‐button function on the microphone signal as a UDK accessory.
Figure 11 ‐ Pushbutton microphone headset
Button
MIC
SPK
Microphone
GND
Speaker
Using a handset
For handset testing, a landline phone handset plugs directly into CN24, an RJ‐11
jack. To use this connector, the SW3 positions (see above table) corresponding to
MIC1 & SPK1 signals must be in the open (OFF) state.
It is important to note that the Handset interface requires that the EM be
configured for direct interface to the microphone, i.e. provides bias to MIC1P /
MIC1N. If the EM is configured for interface to a Host CODEC or other line‐level
circuitry not requiring DC bias, then the headset connector must be used as
described above.
CN24 is used for the handset connector. The pinout for this connector is shown
below.
Table 32 ‐ Handset connector pinout
Pin #
Signal Name
MIC1N
SPK1N
SPK1P
MIC1P
P AG E 3 7
RF Interface
Introduction
This chapter covers information related to the radio frequency (RF) interface of
the embedded module when used with the UDK. The module’s RF use
parameters vary between models. For performance specifications of each EM
model see the Product Specification and/or Application Notes. The Application
Notes are also available as a reference for integrating an EM into a host platform.
Some examples of various bands and typical performance parameters include:
Table 33 ‐ Typical RF Performance Parameters
Parameter
Transmit Band
Maximum Transmit Power
Receiver Band
Receiver Sensitivity
GPS Band
Band
PCS
Cellular
IMT
PCS
Cellular
IMT
PCS
Cellular
IMT
PCS
Cellular
IMT
Value
1851 to 1910 MHz
824 to 849 MHz
1920 to 1980 MHz
+24.0 dBm (251 mW)
+24.0 dBm (251 mW)
+23.0 dBm (200 mW)
1930 to 1990 MHz
869 to 894 MHz
2110 to 2170 MHz
>-106 dBm
>-106 dBm
>-105 dBm
1575.42 MHz
50 Connection
The RF connection point on the development kit can be attached in several ways.
The EM antenna connection can be made with 50Ω coaxial cable, using the
associated coaxial cable connector (for example, Hirose U.FL or Murata CSG
series), or by attaching an SMA cable directly to the daughter card for bench
configuration or the SMA bulkhead connector for the boxed configuration. The
boxed configuration can alternatively be connected via a TNC bulkhead adapter.
Direct connection to the module requires the correct RF connector adapter cable.
This can be obtained as an accessory through Sierra Wireless. Note that
additional RF cabling losses will affect the performance values listed in the
embedded module specification. The boxed configuration of the UDK, or use of
the SMA connector on the daughter card will incur such losses.
Typical RF losses FOR each configuration are provided in the Reference Guide
for the EM model used. Values are given for the bands of operation, depending
on the EM model.
P AG E 3 8
R F I N T E R F AC E
Cables
Any connecting cables between the modem and the antenna (if required) must be
50Ω. Mismatching the impedance of the EM will result in a significant reduction
in RF performance.
Antenna use
An SMA‐type connector is shipped with the UDK. Frequency band(s) of
operation for this antenna will depend on the model of EM delivered. Additional
frequency band(s) such as GPS, or additional antenna types are available from
Sierra Wireless as accessories.
Part numbers
This table contains part numbers for external connectors used in the UDK. These
are useful if you require mating connectors.
Table 34 ‐ Connector part numbers
Interface Reference
CN5
CN1, 2, 13, 14
Description
DC input jack
DE9 jack, UARTs
CN20
CN22
CN24
CN25
USB
DB25 plug
Phone handset jack
XIM socket
J1
Standard 2.5mm
headset jack
External battery
J4
Part number
Switchcraft, RAPC712
AMP, 747844-2 (or
equivalent)
AMP, 787780-1
AMP, 747842-2
AMP, 520249-2
ITT Industries, CCM03-3013
R102
Hosiden, HSJ1621-01901
JST, SM02B-SRSS-TB
P AG E 3 9

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