Sierra Wireless HL7588 Wireless module User Manual

Sierra Wireless Inc. Wireless module Users Manual

Users Manual

TBC 1.0 July 28, 2015 AirPrime HL7588User Guide
TBC Rev 1.0 July 28, 2015 2 User Guide Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Customer understands that Sierra Wireless is not providing cellular or GPS (including A-GPS) services. These services are provided by a third party and should be purchased directly by the Customer.
TBC Rev 1.0 July 28, 2015 3 User Guide SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS) SERVICES. Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright © 2015 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales Desk: Phone: 1-604-232-1488 Hours: 8:00 AM to 5:00 PM Pacific Time Contact: http://www.sierrawireless.com/sales Post: Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4 Technical Support: support@sierrawireless.com RMA Support: repairs@sierrawireless.com Fax: 1-604-231-1109 Web: http://www.sierrawireless.com/ Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases: www.sierrawireless.com
TBC Rev 1.0 July 28, 2015 4 User Guide Document History Version Date Updates 1.0 July 28, 2015 Creation
TBC Rev 1.0 July 28, 2015 5 Contents 1.INTRODUCTION .................................................................................................... 81.1.Common Flexible Form Factor (CF3) ............................................................................... 81.2.Physical Dimensions ....................................................................................................... 81.3.General Features ............................................................................................................ 91.4.Architecture ................................................................................................................... 121.5.Interfaces ...................................................................................................................... 121.6.Connection Interface ..................................................................................................... 131.7.ESD .............................................................................................................................. 131.8.Environmental & Certifications ...................................................................................... 141.8.1.Environmental Specifications ................................................................................. 141.8.2.Regulatory ............................................................................................................. 141.8.3.RoHS Directive Compliant ..................................................................................... 141.8.4.Disposing of the Product ........................................................................................ 151.8.5.References ............................................................................................................ 152.DETAILED INTERFACE SPECIFICATIONS ....................................................... 162.1.Power Supply ................................................................................................................ 162.2.Current Consumption .................................................................................................... 162.3.VGPIO ........................................................................................................................... 173.MECHANICAL DRAWINGS ................................................................................. 184.FCC REGULATIONS ........................................................................................... 205.TERMS AND ABBREVIATIONS .......................................................................... 23
TBC Rev 1.0 July 28, 2015 6 List of Figures Figure 1.AirPrime HL7588 Architecture Overview ....................................................................... 12Figure 2.AirPrime HL7588 Mechanical Overview ........................................................................ 13Figure 3.AirPrime HL7588 Mechanical Drawing .......................................................................... 18Figure 4.AirPrime HL7588 Dimensions Drawing ......................................................................... 19
TBC Rev 1.0 July 28, 2015 7 List of Tables Table 1.Supported Bands/Connectivity ........................................................................................ 8Table 2.AirPrime HL7588 Features .............................................................................................. 9Table 3.ESD Specifications ........................................................................................................ 13Table 4.AirPrime HL7588 Environmental Specifications ............................................................ 14Table 5.Regulation Compliance ................................................................................................. 14Table 6.Power Supply ................................................................................................................ 16Table 7.Current Consumption .................................................................................................... 16Table 8.VGPIO Electrical Characteristics ................................................................................... 17
TBC Rev 1.0 July 28, 2015 8 1. Introduction This document is the Product Technical Specification for the AirPrime HL7588 Embedded Module. It defines the high level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7588 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless networks (as listed in Table 1 Supported Bands/Connectivity). The HL7588 supports a large variety of interfaces such as USB 2.0, UART, GPIOs, and dual SIM to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit band (Tx) Receive band (Rx) HL7588 LTE B2 1850 to 1910 MHz 1930 to 1990 MHz  LTE B4 1710 to 1755 MHz 2110 to 2155 MHz  LTE B5 824 to 849 MHz 869 to 894 MHz  LTE B13 777 to 787 MHz 746 to 756 MHz  LTE B17 704 to 716 MHz 734 to 746 MHz  UMTS B2 1850 to 1910 MHz 1930 to 1990 MHz  UMTS B5 824 to 849 MHz 869 to 894 MHz  1.1. Common Flexible Form Factor (CF3) The AirPrime HL7588 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it:  Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings  Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions  Offers electrical and functional compatibility  Provides Direct Mount as well as Socketability depending on customer needs 1.2. Physical Dimensions AirPrime HL7588 module is a compact, robust, fully shielded module with the following dimensions:  Length: 23 mm  Width: 22 mm  Thickness: 2.5 mm  Weight: 3.5 g Note: Dimensions specified above are typical values.
TBC Rev 1.0 July 28, 2015 9 User Guide Introduction 1.3. General Features The table below summarizes the AirPrime HL7588 features. Table 2. AirPrime HL7588 Features Feature Description Physical  Small form factor (146-pin solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal)  Complete body shielding  RF connection pads (RF main interface)  Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V RF Penta-band LTE and dual-band UMTS:  LTE B2: 1900 PCS  LTE B4: 1700 AWS  LTE B5: 850 CLR  LTE B13: 700  LTE B17: 700  UMTS B2: 1900 PCS  UMTS B5: 850 CLR SIM interface  1.8V/3V support  SIM extraction / hot plug detection  SIM/USIM support  Conforms with ETSI UICC Specifications  Supports SIM application tool kit with proactive SIM commands Application interface  NDIS NIC interface support (Windows XP, Windows 7, Windows 8, Windows CE, Linux)  Multiple non-multiplexed USB channel support  Dial-up networking  USB selective suspend to maximize power savings  CMUX multiplexing over UART (not available on the HL7588)  AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands
TBC Rev 1.0 July 28, 2015 10 User Guide Introduction Feature Description Protocol Stack  Single mode LTE operation:  LTE FDD, bandwidth 1.4-20 MHz  System Release: 3GPP Rel. 9  Category 4 (up to 150 Mbit/s in downlink, 50 Mbit/s in uplink)  MIMO 2x2  Max modulation 64 QAM DL, 16 QAM UL  Intra-frequency and inter-frequency mobility  SMS over SGs and IMS  SON ANR  Public Warning System PWS  HSDPA (High Speed Downlink Packet Access)**  Evolved High Speed Downlink Packet Access (HSDPA+)  Compliant with 3GPP Release 9  Up to Category 24 (DC, 42.2Mbps)  Continuous Packet Connectivity (CPC)  Enhance fractional DPCH  IPv6 support  HSUPA (High Speed Uplink Packet Access)**  Compliant with 3GPP Release 9  Category 7 (11.5Mbps)  Robust Header Compression (RoHC)  RXDIV Performance Enhancements  Type 3i (HSDPA)  HSPA Enhancements**  MAC-ehs Rel. 7  HSDPA Enhanced CELL_FACH/PCH states  HSUPA Enhanced CELL_FACH states (eFACH) Rel 8  MAC-i/is Rel.8  Serving cell change enhancements Rel. 8 SMS  SMS over SGs and IMS  SMS MO and MT  SMS saving to SIM card or ME storage  SMS reading from SIM card or ME storage  SMS sorting  SMS concatenation  SMS Status Report  SMS replacement support  SMS storing rules (support of AT+CNMI, AT+CNMA)
TBC Rev 1.0 July 28, 2015 11 User Guide Introduction Feature Description Connectivity  Multiple (up to 20) cellular packet data profiles  Sleep mode for minimum idle power draw  Mobile-originated PDP context activation / deactivation  Support QoS profile  Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput  Release 99 QoS negotiation – Background, Interactive, and Streaming  Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).  Supports PAP and CHAP authentication protocols  PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context  RFC1144 TCP/IP header compression Environmental Operating temperature ranges (industrial grade):  Class A: -30°C to +70°C  Class B: -40°C to +85°C RTC Real Time Clock (RTC) with calendar
TBC Rev 1.0 July 28, 2015 12 User Guide Introduction 1.4. Architecture The figure below presents an overview of the AirPrime HL7588’s internal architecture and external interfaces. Figure 1. AirPrime HL7588 Architecture Overview 1.5. Interfaces The AirPrime HL7588 module provides the following interfaces and peripheral connectivity:  1x - 4-pin UART  1x - Active Low RESET  1x - USB 2.0  1x - Backup Battery Interface  2x - System Clock Out  1x - Active Low POWER-ON  1x - 1.8V/3V SIM  1x - JTAG Interface  14x - GPIOs (5 of which have multiplexes)  1x - Main Antenna  1x - RX Diversity Antenna  1x – VGPIO  1x – TX ON  1x - ADC  1x – Debug Interface
TBC Rev 1.0 July 28, 2015 13 User Guide Introduction 1.6. Connection Interface The AirPrime HL7588 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. AirPrime HL7588 Mechanical Overview The 146 pads have the following distribution:  66 inner signal pads, 1x0.5mm, pitch 0.8mm  1 reserved test point (do not connect), 1.0mm diameter  7 test point (JTAG), 0.8mm diameter, 1.20mm pitch  64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm  4 inner corner ground pads, 1x1mm  4 outer corner ground pads, 1x0.9mm 1.7. ESD Refer to the following table for ESD Specifications. Note: Information specified in the following table is preliminary and subject to change. Table 3. ESD Specifications Category Connection Specification Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test) Non-operational Host connector interface Unless otherwise specified:  JESD22-A114 +/- 2kV Human Body Model  JESD22-A115 +/- 200V Machine Model  JESD22-C101C +/- 250V Charged Device Model Signals SIM connector Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. Other host signals
TBC Rev 1.0 July 28, 2015 14 User Guide Introduction 1.8. Environmental & Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. AirPrime HL7588 Environmental Specifications Conditions Range Operating Class A -30°C to +70°C Operating Class B -40°C to +85°C Storage -40°C to +85°C Class A is defined as the operating temperature ranges that the device:  Shall exhibit normal function during and after environmental exposure.  Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device:  Shall remain fully functional during and after environmental exposure  Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance.  Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 1.8.2. Regulatory The AirPrime HL7588 is compliant with FCC and IC regulations. FCC and IC compliance will be reflected on the AirPrime HL7588 label. Table 5. Regulation Compliance Document Current Version Description HL7588 NAPRD.03 V5.22 or later North American Program Reference Document  FCC Part 22, 24, 27 NA Federal Communications Commission  1.8.3. RoHS Directive Compliant The AirPrime HL7588 modules are compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
TBC Rev 1.0 July 28, 2015 15 User Guide Introduction 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.8.5. References [1] AirPrime HL Series Customer Process Guidelines Reference Number: 4114330 [2] AirPrime HL7519, HL7548 and HL7588 AT Commands Interface Guide Reference Number: TBC
TBC Rev 1.0 July 28, 2015 16 2. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7588 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 2.1. Power Supply The AirPrime HL7588 module is supplied through the VBATT signal with the following characteristics. Table 6. Power Supply Supply Minimum Typical Maximum VBATT voltage (V) 3.21 3.7 4.5 VBATT_PA voltage (V) Full Specification 3.21 3.7 4.5 VBATT_PA voltage (V) Extended Range 2.8 3.7 4.5 1 This value has to be guaranteed during the burst. Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module. Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module. 2.2. Current Consumption The following table lists the current consumption of the AirPrime HL7588 at different conditions. Note: Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports. Maximum values are provided for VSWR4:1 with worst conditions among supported ranges of voltages and temperature. Table 7. Current Consumption Parameter Minimum Typical Maximum Unit Off mode 95.0 110 202.0 µA Sleep mode – LTE DRX = 1.28s USB = suspended Band 2 1.2 1.4 6.2 mA Band 4 1.2 1.4 6.2 mA Band 5 1.2 1.4 6.2 mA Band 13 1.2 1.4 6.2 Band 17 1.2 1.4 6.2 mA
TBC Rev 1.0 July 28, 2015 17 User Guide Detailed Interface Specifications Parameter Minimum Typical Maximum Unit LTE in communication mode (TX Max) Band 2 630 750 895 mA Band 4 510 610 945 mA Band 5 440 530 745 mA Band 13 460 548 720 Band 17 540 651 780 mA HSPA+ (TX Max) Band 2 TBD mA Band 5 TBD mA 2.3. VGPIO The VGPIO output can be used to:  Pull-up signals such as I/Os  Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL7588 module is switched ON. Table 8. VGPIO Electrical Characteristics Parameter Min Typ Max Remarks Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode Current capability Active Mode (mA) - - 50 Power management support up to 50mA output in Active mode Current capability Sleep Mode (mA) - - 3 Power management support up to 3mA output in Sleep mode Rise Time(ms) - - 1.5 Start-Up time from 0V
TBC Rev 1.0 July 28, 2015 18 3. Mechanical Drawings Figure 3. AirPrime HL7588 Mechanical Drawing
TBC Rev 1.0 July 28, 2015 19 User Guide Mechanical Drawings Figure 4. AirPrime HL7588 Dimensions Drawing
TBC Rev 1.0 July 28, 2015 20 4. FCC Regulations FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. IMPORTANT NOTE – FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The HL7588 module has been granted modular approval for mobile applications. Integrators may use the HL7588 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:  TBD 7.51 dBi in Band 2  TBD 5.78 dBi in Band 4  TBD 9.72 dBi in Band 5  TBD 10.17 dBi in Band 13  TBD 9.74 dBi in Band 17 3. This device and its antenna(s) must not transmit be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter RF exposure product procedures. 4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com).
TBC Rev 1.0 July 28, 2015 21 User Guide FCC Regulations If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-controllers, etc.) may degrade the reception performances. The antenna connector is intended to be directly connected to a 50Ω antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7588 module is incorporated, with a statement similar to the following: This device contains FCC ID: N7NHL7588 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7588 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
TBC Rev 1.0 July 28, 2015 22 User Guide FCC Regulations Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.
TBC Rev 1.0 July 28, 2015 23 5. Terms and Abbreviations Abbreviation Definition ADC Analog to Digital Converter AGC Automatic Gain Control AT Attention (prefix for modem commands) CDMA Code Division Multiple Access CF3 Common Flexible Form Factor CLK ClocK CODEC Coder DECoder CPU Central Processing Unit DAC Digital to Analog Converter DTR Data Terminal Ready EGNOS European Geostationary Navigation Overlay Service EMC ElectroMagnetic Compatibility EMI ElectroMagnetic Interference EN Enable ESD ElectroStatic Discharges ETSI European Telecommunications Standards Institute FDMA Frequency-division multiple access GAGAN GPS aided geo augmented navigation GLONASS GLObal NAvigation Satellite System GND GrouND GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GSM Global System for Mobile communications Hi Z High impedance (Z) IC Integrated Circuit IMEI International Mobile Equipment Identification I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX MAXimum MIN MINimum MSAS Multi-functional Satellite Augmentation System N/A Not Applicable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PLL Phase Lock Loop PWM Pulse Width Modulation
TBC Rev 1.0 July 28, 2015 24 User Guide Terms and Abbreviations Abbreviation Definition QZSS Quasi-Zenith Satellite System RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST ReSeT RTC Real Time Clock RX Receive SCL Serial CLock SDA Serial DAta SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW SoftWare PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP TYPical UART Universal Asynchronous Receiver-Transmitter UICC Universal Integrated Circuit Card USB Universal Serial Bus UIM User Identity Module VBATT Main Supply Voltage from Battery or DC adapter VSWR Voltage Standing Wave Ratio WAAS Wide Area Augmentation System

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