Sierra Wireless M2113 GSM Modem User Manual Introduction to the Integra outstanding assets

Sierra Wireless, Inc. GSM Modem Introduction to the Integra outstanding assets

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March 2002/ version 1.6

Integra

Version : 1.7

Date : March 2002

Reference : WM_Integra_UG_016

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March 2002/ version 1.6

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Level/

Indice

Date/ Date History of the evolution /

Historique des évolutions

Writer / Rédacteur

0.3 June 2000 Creation and Correction P. Calvez, S. Dechicha F.

Doherier, T. Lapousterle,

M. Nau, D. Martinez, B.

Zenou

1.2 Sept. 2000 Correction: figure 5 application note for serial link S. Dechicha

1.3 Sept 2000 Application note for external SIM 3V/5V interface S. Dechicha

1.4 January

2001

Minor formal modifications + addition of the mechanical

specifications

M. Nau

1.5 August

2001

SIM3/5V electric scheme added + modification flat cable

reference

S. Marion

1.6 March 2002 Modifications to include 2C-2 module version N. Subiger

1.7 March 2002 Add RF exposure and OEM instructions O. Clerc

Name / Nom Function /

Fonction

Date/ Date Signature/ Signature

Written by / Rédigé par B.Zenou Product Marketing June

2000

Validated by / Validé par D. MARTINEZ Modem Support Engineer June

2000

Approved by / Approuvé

par

P.Calvez Product Marketing Senior

Manager

June

2000

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March 2002/ version 1.6

Integra

Integra User’s Guide

Hardware Specifications

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March 2002/ version 1.6

Integra

Contents

1 Introduction to the Integra: outstanding assets........................................................................................................................7

1.1 Scope of the user’s guide ............................................................................................................ 7

1.2 General characteristics ................................................................................................................ 8

1.2.1 General..................................................................................................................................... 8

1.2.2 Electrical ................................................................................................................................... 8

1.2.3 Physical .................................................................................................................................... 8

1.2.4 Basic Features.......................................................................................................................... 8

1.2.5 Interfaces.................................................................................................................................. 9

1.3 Mechanical Design Overview .................................................................................................... 10

2 Safety precautions ..................................................................................................................................................................................13

2.1 RF safety.................................................................................................................................... 13

2.1.1 General................................................................................................................................... 13

2.1.2 Exposure to RF energy...........................................................................................................13

2.1.3 Efficient modem operation......................................................................................................13

2.1.4 Antenna care and replacement .............................................................................................. 13

2.2 General safety ........................................................................................................................... 14

2.2.1 Driving..................................................................................................................................... 14

2.2.2 Electronic devices................................................................................................................... 14

2.2.3 Vehicle electronic equipment .................................................................................................14

2.2.4 Medical electronic equipment................................................................................................. 14

2.2.5 Aircraft .................................................................................................................................... 14

2.2.6 Children .................................................................................................................................. 14

2.2.7 Blasting areas......................................................................................................................... 14

2.2.8 Potentially explosive atmospheres ......................................................................................... 15

2.3 Safety standards........................................................................................................................ 15

3 Standard Compliance ............................................................................................................................................................................15

3.1 GSM compliance ....................................................................................................................... 15

3.2 FTA Compliance ........................................................................................................................ 16

3.2.1 IMEI Number .......................................................................................................................... 16

3.2.2 CE Label................................................................................................................................. 17

4 Hardware Interfaces...............................................................................................................................................................................18

4.1 Interfaces on the 50-pin general purpose connector................................................................ 18

4.1.1 The 50-pin connector description ........................................................................................... 18

4.1.2 Power supply .......................................................................................................................... 22

4.1.3 Serial link ................................................................................................................................ 24

4.1.4 ON / ~OFF .............................................................................................................................. 25

4.1.5 BOOT...................................................................................................................................... 27

4.1.6 Reset signal (~RST) ............................................................................................................... 28

4.1.7 Flashing LED .......................................................................................................................... 29

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4.1.8 General Purpose Input/Output ............................................................................................... 29

4.1.9 Analog to Digital Converter ....................................................................................................29

4.1.10 Audio Interface........................................................................................................................ 31

4.1.11 SIM interface........................................................................................................................... 35

4.1.12 SPI bus ................................................................................................................................... 37

4.1.13 Keypad interface..................................................................................................................... 37

4.2 RF Interface ............................................................................................................................... 39

4.2.1 RF connector .......................................................................................................................... 39

4.2.2 RF performances.................................................................................................................... 39

4.3 SIM interface.............................................................................................................................. 39

5 Connector Supplier and Peripheral devices ............................................................................................................................40

5.1 Where to find the SMD connectors............................................................................................ 40

5.1.1 GSM Antenna ......................................................................................................................... 41

5.1.2 The SIM card holder ............................................................................................................... 42

6 Climatic and mechanical environment....................................................................................................................................... 42

7 Demonstration board............................................................................................................................................................................43

8 General guidelines for the use of the Integra.......................................................................................................................... 44

8.1 Key information.......................................................................................................................... 44

8.1.1 Hardware and RF ................................................................................................................... 44

8.1.2 The Antenna ........................................................................................................................... 44

8.1.3 Firmware upgrade .................................................................................................................. 44

8.1.4 Getting started ........................................................................................................................ 45

9 Reference documents .......................................................................................................................................................................... 46

10 Acronyms and Abbreviations.............................................................................................................................................................47

11 Index 48

12 Annexes 53

12.1 Mechanical specifications.......................................................................................................53

12.2 3V/5V SIM management ........................................................................................................ 54

12.3 AT command list..................................................................................................................... 54

13 RF exposure instructions ....................................................................................................................................................................59

14 Instructions to OEM ................................................................................................................................................................................60

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March 2002/ version 1.6

Integra

Cautions:

Information furnished herein by Wavecom are accurate and reliable. However no responsibility

is assumed for its use.

Please read carefully the safety precautions.

If you have any technical questions regarding this document or the product described in it,

please contact your distributor.

General information about Wavecom and its range of products is available at the following

internet address: http://www.wavecom.com

Trademarks

Some mentioned products are registered trademarks of their respective companies

user’s guide may be produced in any form without the prior written permission of

Wavecom SA.

No patent liability is assumed with respect to the use of the information contained herein.

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son autorisation préalable.

March 2002/ version 1.6

Integra

1 Introduction to the Integra: outstanding assets

Integra M2100 series integrated modem provides a quick and easy way to plug in GSM and GPRS

functionality to systems and terminals. Available in dual-band configurations, this full type approved

integrated modem constitutes a self-contained, fully integrated implementation of the GSM/GPRS

standard.

Thanks to standard interfaces, it can be integrated into any system which offers unlimited assets. It is

ready for voice, SMS, data and fax. Integra is a product with a sole connector, which puts together all the

interface signals in order to facilitate its integration.

It has an integrated SIM connector as well as a standard RF connector type MMCX (Miniature Micro

Connector).

For system integrators, Integra is the fast track to the wireless world.

1.1 Scope of the user’s guide

This document describes the hardware interface and the technical specifications of the Integra M2100

series modem.

The integrated modem is referenced as Integra according to the GSM/GPRS 900 standard, the

GSM/GPRS 1800 standard and the GSM/GPRS 1900 standard. This product is based on a Dual Band

WISMOTM: every integrated modem referenced Integra-G900/1800 includes a GSM 900/1800 MHz

module and every integrated modem referenced Integra-G900/1900 includes a GSM 900/1900 MHz

module. This two dual-band modems have the same specifications unless otherwise specified. Integra

has two version, one GSM only and one GSM/GPRS. The GSM and GSM/GPRS versions have the

same specifications unless otherwise specified.

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1.2 General characteristics

1.2.1 General

• Dual Band GSM/GPRS modem E-GSM 900/1800 or E-GSM 900/1900

• Class 4 (2W at 900MHz)

• Class 1 (1W at 1800/1900 MHz)

• Small size and low power consumption

• Voice, SMS

• fax and data transmission without extra hardware

• Tricodec (FR/EFR/HR)

• Internal 3V SIM interface

• Easy remote control by AT commands for dedicated applications

• Fully Type Approved according to GSM Phase 2+ specifications

• Fully shielded and ready-to-use

1.2.2 Electrical

• Power supply: 5 VDC +/- 5% 1A

• 310 mA average in GSM 900 at Tx power max 2W

• 410 mA average in GSM/GRPS 900 at Tx power max 2W

• 9 mA in idle mode

1.2.3 Physical

• Absolute maximum dimension: 46 x 64 x 12 mm

• Weight: 90 g

• Volume: 36.21 cm3

• Casing: Complete shielding-stainless steel-

• Mounting: 4 screw holes

• Operating temperature range: -20°C to + 55°C

• Storage temperature: -35°C to +85°C

1.2.4 Basic Features

1.2.4.1 telephony

• Telephony (TCH/FS) & Emergency calls

• Full Rate, Enhanced Full Rate and Half Rate

• Dual Tone Multi Frequency function (DTMF)

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March 2002/ version 1.6

Integra

1.2.4.2 Short Message Service (GSM and GPRS mode)

• Text and PDU

• Point to point MT & MO

• SMS Cell Broadcast

1.2.4.3 GSM circuit Data Features

• Data circuit asynchronous, transparent and non transparent up to 14,400 bits/s

• Automatic fax group 3 (Class 1 & 2)

• Alternate speech and fax

• MNP2, V.42bis

1.2.4.4 GPRS Packet Data Features

• GPRS Class 2

• Coding Schemes: C1S1 to CS4

• Compliant with SMG31bis

1.2.4.5 GSM Supplementary services

• Call Forwarding

• Call Barring

• Multiparty

• Call Waiting and Call Hold

• Calling Line Identity

• Advice of Charge

• USSD

• Closed User Group

• Explicit Call Transfer

1.2.4.6 Other features

• ME+SIM phone book management

• Fixed Dialling Number

• SIM Toolkit Class 2

• SIM, network and service provider locks

• Real Time Clock

• Alarm management

• Software upgrade through Xmodem protocol

• UCS2 character set management

1.2.5 Interfaces

Single antenna interface

Internal SIM interface: 3V only

External SIM interface: 3V only for engineering sample.

3V or 5V for production unit

For Data Operation:

RS-232C serial link

remote control by AT commands (GSM 07.07 and 07.05)

baud rate from 300 to 115,200 bits/s

from 300 up to 38400 bits/s with autobauding

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March 2002/ version 1.6

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1.3 Mechanical Design Overview

Integra is encased as shown in the figure here-below. It includes a WISMO™ module, a 50-pin

connector, a SIM holder and a RF connector.

figure 1 : mechanical description

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March 2002/ version 1.6

Integra

figure 2 : mechanical description II

4 screw holes allow the Integra to be fixed on the mother PCB. The Integra can be mounted

indifferently on both sides (top or bottom).

For further details see mechanical specifications in annex.

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March 2002/ version 1.6

Integra

Note: Interfaces

The integrated modem has a sole 50-pin connector which gathers all the interface signals in order to

facilitate its integration.

It has an integrated SIM card holder as well as a standard RF connector type MMCX (Miniature Micro

Connector)

The concept of the integrated modem has been defined to integrate on a sole device:

• only one standard easy to find connector (worldwide supplied) gathering the analog and digital

interfaces

• one standard easy to find RF connector. See chapter RF connector page 34

• one SIM card holder. See chapter SIM interface

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March 2002/ version 1.6

Integra

2 Safety precautions

IMPORTANT

FOR THE EFFICIENT AND SAFE OPERATION OF

YOUR GSM INTEGRATED MODEM

READ THIS INFORMATION BEFORE USE

2.1 RF safety

2.1.1 General

Your Integra modem is based on the GSM standard for cellular technology. The GSM standard is spread

all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used

telecommunication standard.

Your modem is actually a low power radio transmitter and receiver. It sends out and receives radio

frequency energy. When you use your Integra integrated modem, the cellular system which handles your

calls controls both the radio frequency and the power level of your cellular modem.

2.1.2 Exposure to RF energy

There has been some public concern about possible health effects of using GSM modems. Although

research on health effects from RF energy has focused on the current RF technology for many years,

scientists have begun research regarding newer radio technologies, such as GSM. After existing

research had been reviewed, and after compliance to all applicable safety standards had been tested, it

has been concluded that the product was fitted for use.

If you are concerned about exposure to RF energy there are things you can do to minimize exposure.

Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can

reduce RF exposure by operating your cellular modem efficiently by following the below guidelines.

2.1.3 Efficient modem operation

For your modem to operate at the lowest power level, consistent with satisfactory call quality :

If your modem has an extendible antenna, extend it fully. Some models allow you to place a call with the

antenna retracted. However your modem operates more efficiently with the antenna fully extended.

Do not hold the antenna when the modem is « IN USE ». Holding the antenna affects call quality and

may cause the modem to operate at a higher power level than needed.

2.1.4 Antenna care and replacement

Do not use the modem with a damaged antenna. If a damaged antenna comes into contact with the skin,

a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you

may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have

your antenna repaired by a qualified technician.

Use only the supplied or approved antenna. Unauthorized antennas, modifications or attachments could

damage the modem and may contravene local RF emission regulations or invalidate type approval.

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March 2002/ version 1.6

Integra

2.2 General safety

2.2.1 Driving

Check the laws and the regulations regarding the use of cellular devices in the area where you have to

drive as you always have to comply with them. When using your modem while driving, please :

give full attention to driving,

pull off the road and park before making or answering a call if driving conditions so require.

2.2.2 Electronic devices

Most electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy.

However RF energy may affect some improperly shielded electronic equipment.

2.2.3 Vehicle electronic equipment

Check your vehicle manufacturer representative to determine if any on-board electronic equipment is

adequately shielded from RF energy.

2.2.4 Medical electronic equipment

Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to

determine if they are adequately shielded from external RF energy.

Turn your modem OFF in health care facilities when any regulations posted in the area instruct you to do

so. Hospitals or health care facilities may be using RF monitoring equipment.

2.2.5 Aircraft

Turn your modem OFF before boarding any aircraft.

• Use it on the ground only with crew permission.

• Do not use it in the air.

To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA)

regulations require you to have permission from a crew member to use your modem while the aircraft

is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your

modem while airborne.

2.2.6 Children

Do not allow children to play with your modem. It is not a toy. Children could hurt themselves or others

(by poking themselves or others in the eye with the antenna, for example). Children could damage the

modem, or make calls that increase your modem bills.

2.2.7 Blasting areas

To avoid interfering with blasting operations, turn your unit OFF when in a « blasting area » or in areas

posted : « turn off two-way radio ». Construction crew often use remote control RF devices to set off

explosives.

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March 2002/ version 1.6

Integra

2.2.8 Potentially explosive atmospheres

Turn your modem OFF when in any area with a potentially explosive atmosphere. It is rare, but your

modem or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire

resulting in bodily injuries or even death.

Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include

fueling areas such as petrol stations ; below decks on boats ; fuel or chemical transfer or storage

facilities ; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders.

Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle which

contains your modem or accessories.

Before using your modem in a vehicle powered by liquefied petroleum gas (such as propane or butane)

ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the

vehicle is to be used.

2.3 Safety standards

THIS INTEGRA COMPLIES WITH ALL APPLICABLE RF SAFETY STANDARDS.

This cellular modem meets the standards and recommendations for the protection of public exposure

to RF electromagnetic energy established by governmental bodies and other qualified organizations,

such as the following :

Directives of the European Community, Directorate General V in Matters of Radio Frequency

Electromagnetic Energy

3 Standard Compliance

3.1 GSM compliance

Reference regulations: TBR 19, TBR 20, TBR 31, TBR 32

Table 1 : Wavecom acceptance test

Tests Applied Standard Acceptance Criteria

Performance

Test

ETSI recommendation for

GSM/DCS

communication.

Full conformity to the recommendation regarding the main RF

parameters.

Cooking Test - The test continues even after the Cooking Test milestone has been

reached

Stress Test Therma shocks IEC 68-2-

14.

Full conformity to the recommendation regarding the main parameters.

Vibration Test Sinusoidal vibration IEC

68-2-6.

No performance degradation or mechanical degradation is allowed after

test.

Vibration Test Random vibration IEC 68-

2-36.

No performance degradation or mechanical degradation is allowed after

test.

Shock Test IEC 68-2-27. No performance degradation or mechanical degradation is allowed after

test.

Bump Test IEC 68-2-29. No performance degradation or mechanical degradation is allowed after

test.

Humidity Test Corrosion test IEC 68-2-3. No visible degradation of the product, both visual and functionnal.

The unit is tested at room temperature and must be fully operative for

the main RF parameters.

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March 2002/ version 1.6

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Warehouse Test Low temperance IEC 68-

2-1.

Under normal condition (room temperature) after the test, the unit must

behave in full conformity with the main RF parameters specification.

Warehouse Test High temperature IEC 68-

2-2.

Under normal condition (room temperature) after the test, the unit must

behave in full conformity with the main RF parameters specification.

Dust Test MIL-STD-810D, method

510-3.

No visible dust in the visible areas. No more than 50 dust particules in

the cabinet of the product. The unit, tested at room temperature must

be fully operative.

Light Test UV radiation and

temperature EDF

HN60E03.

Visual inspection on the discoloration and other degradation effects

such as cracks in the material of the unit after the test.

Fall Test IEC 68-2-32. Only minor casing degradation is allowed, with a maximum dimension

change of 1mm. The unit must remain fully operative and full

specification for the main RF parameters.

Electro Static

Discharge Test

IEC 1000-4-2. No performance degradation allowed after the test.

Salt Mist Test IEC 68-2-11 After the test, visual inspection on the unit.

Atmosphere

Test

Flowing mixed gas

corrosion. IEC 68-2-60

After the test, visual inspection on the unit and inside.

Marking Test EN 60 950 After the test, visual inspection on the unit. No degradation is allowed

on the marking.

3.2 FTA Compliance

The Integra has received a Full-Type Approval (according to normal MS requirements) in the

configuration using the internal SIM interface.

3.2.1 IMEI Number

GSM 900/1800:

TAC: 5 000 64

FAC: 11

Serial Numbers: 000000 to 999999

GSM 900/1900:

TAC: 500 100

FAC: 11

Serial Number: 000000 to 999999

GSM/GPRS 900/1800:

TAC: 500161

FAC: 11

Serial Numbers: 000000 to 999999

GSM/GPRS 900/1900:

TAC: 500167

FAC: 11

Serial Number: 000000 to 999999

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March 2002/ version 1.6

Integra

3.2.2 CE Label

The Integra integrated modem is CE compliant which implies that the modem is in conformity with the

European Community directives and it bears the CE label

Carrying out tests:

Electro-magnetic field immunity

EN 61000-4-3

ETS 300-342—1

Radiated emission

EN 55022

ETS 300-342

ESD immunity

EN 61000-4-2

ETS 300-342-1

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Integra

4 Hardware Interfaces

This chapter describes the hardware interfaces:

• interfaces on the 50-pin general purpose connector

• RF interface

• SIM interface

4.1 Interfaces on the 50-pin general purpose connector

4.1.1 The 50-pin connector description

Table 2 : 50-pin connector description

Pin # Name I/O I/O type Description Comment

1 GND GROUND High current

2 GND GROUND High current

3 +5V Supply High current

4 +5V Supply High current

5 CT109/DCD O CMOS/2X RS232-Data Carrier Detect

6 GND GROUND High current

GPIO4 I/O CMOS/2X General Purpose I/O

8 SPK2N O Analog Speaker2 negative output

9 CT125/RI O CMOS/2X RS232-Ring Indicator

10 SPK2P O Analog Speaker 2 positive output

11 Flashing LED I/O CMOS/2X Working mode indication

Led

Driven by module

12 SPK1P O Analog Speaker 1 positive output

13 CT106/CTS O 1X RS232 interface Clear To

Send

14 SPK1N O Analog Speaker 1 negative output

15 ON/~OFF I Power ON/OFF control ON = VCC(3)

16 MIC2P I Analog Microphone 2 positive

input

17 AUXV0 I Analog Auxiliary ADC input

18 MIC2N I Analog Microphone 2 negative

input

19 ~RST I Reset active low Open Collector

20 MIC1P I Analog Microphone 1 positive

input

21 GND I Ground

22 MIC1N I Analog Microphone 1 negative

input

23 BOOT I BOOT Open Collector

24 GND GROUND High current

25 CT103/TX I RS232 interface - Transmit Pull up to VCC(3)

with 100KΩ when

not used

26 GPIO0 I/O CMOS/2X General Purpose I/O

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Pin # Name I/O I/O type Description Comment

27 CT107/DSR O 1X RS232 interface

Data Set Ready

28 CT104/RX O 1X RS232 interface – Receive

29 CT108-2/DTR I RS232 interface

Data Terminal Ready

Pull up to VCC(3)

with 100KΩ when

not used

30 CT105/RTS I RS232 interface

Request To Send

Pull up to VCC(3)

with 100KΩ when

not used

31 COL3 I/O 1X Keypad column

32 COL4 I/O 1X Keypad column

33 COL1 I/O 1X Keypad column

34 COL2 I/O 1X Keypad column

35 ROW4 I/O 1X Keypad row

36 COL0 I/O 1X Keypad column

37 ROW2 I/O 1X Keypad row

38 ROW3 I/O 1X Keypad row

39 ROW0 I/O 1X Keypad row

40 ROW1 I/O 1X Keypad row

41 GND(1)

NC(2)

GROUND(1)

No Connected(2) High current

42 SPI_EN O 1X SPI enable

43 SPI_IO I/O 1X I2 C Data or SPI Data

44 SPI_CLK O 1X I2 C Clock or SPI Clock

45 SIMCLK O 2X Clock for SIM Interface 3V mode

46 SIMRST O 2X Reset for SIM interface 3V mode

47 SIMVCC O SIM card supply 3V mode

6mA max

48 SIMPRES1 I SIM card detect Connected to SIM

connector pin 8.

Pin 4 of SIM

connector must be

pulled down to

GND with 1 KΩ*

49 SIMDATA I/O 3X I/O for SIM interface 3V mode

50 GND(1),

GPO0(2)**

See (1) and (2) High current

(1) for engineering sample

(2) for production unit.

(3) VCC = application digital power supply either 5V or 2.8V

*see SIM socket diagram 4.3 SIM interface

** GPO0 is a general purpose output for selection of external SIM 3V or 5V

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Table 3 : operating conditions

Parameter I/O type Min Max Condition

Vinput low CMOS -0.5 V 0.8 V

Vinput high CMOS 2.1 V 3.0 V

Voutput low 1X 0.2 V IOL = -1 mA

2X 0.2 V IOL = -2 mA

3X 0.2 V IOL = -3 mA

Voutput high 1X 2.6 V IOH = 1 mA

2X 2.6 V IOH = 2 mA

3X 2.6 V IOH = 3 mA

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March 2002/ version 1.6

Integra

GND

+5V

GND

SPK2N

MIC2P

GND

GPIO0

CT104/Rx

CT105/RTS

COL4

ROW3

SPI EN

SIMRST

SIMPRES1

GND(1), GPO0(2)

SPK2P

SPK1P

SPK1N

MIC2N

MIC1P

MIC1N

COL2

COL0

ROW1

SPI CL

GND

+ 5 V

CT109/DCD

GPIO4

ON/~OFF

BOOT

CT103/Tx

CT107/DS

CT108-2/DT

COL3

ROW2

GND(1), NC(2)

SIMCL

SIMVCC

SIMDATA

CT125/RI

FLASHING LED

CT106/CTS

AUXV0

~RST

GND

COL1

ROW4

ROW0

SPI IO

(1) for engineering sample

(2) for production unit

figure 3 : 50-pin connector

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Integra

49 50

1 2

figure 4 : pin numbering/bottom view

4.1.2 Power supply

The main power supply is provided through a double connection. These connections are respectively the

pin 3 and 4 for the +5V and the pins 1 and 2 for the ground (GND). The pins 6, 21, 24 and 40 are also

ground connection in order to produce a proper ground plane.

A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise, serious dysfunctions may

appear. However, the modem does not have to constantly deliver 1A current at 5V on this power supply.

This power supply is internally regulated to a nominal value VBATT.

Table 4 : power supply pin description

Pin number Name Description Comment

1 GND Ground High Current

2 GND Ground High Current

3 +5 V Ground High Current

4 +5 V Ground High Current

6 GND Ground High Current

21 GND Ground High Current

24 GND Ground High Current

41* GND Ground High Current

50* GND Ground High Current

*for engineering sample

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Table 5 : Power consumption in EGSM only mode @ 25°C

Conditions INOM I

MAX

+5V During TX bursts @ 2W 810 mA 1 A

+5V Average @ 2W 310 mA 370 mA

+5V Average @ 0.5W 185 mA 200 mA

+5V Average Idle mode 22 mA 25 mA

+5V Average Idle with power saving

mechanism activated

9.2 mA 10.5 mA

Table 6 : Power consumption in GSM only 1800 and1900 mode @ 25°C

Conditions INOM I

MAX

+5V During TX bursts @ 1W 635 mA 800 mA

+5V Average @ 1W 260 mA 280 mA

+5V Average @ 0.25W 150 mA 170 mA

+5V Average Idle mode 20 mA 22 mA

+5V Average Idle with power saving

mechanism activated

9.2 mA 10.5 mA

Table 7 : Power consumption in EGSM/GPRS cl2 mode @ 25°C

Conditions INOM I

MAX

+5V During TX bursts @ 2W 810 mA 1 A

+5V Average @ 2W 310 mA 370 mA

+5V Average @ 0.5W 185 mA 200 mA

+5V Average in GPRS @ 2W 410 mA 490 mA

+5V Average Idle mode 22 mA 25 mA

+5V Average Idle with power saving

mechanism activated

9.2 mA 10.5 mA

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March 2002/ version 1.6

Integra

Table 8 : Power consumption GSM/GPRS cl2 1800 or 1900 mode @

25°C

Conditions INOM I

MAX

+5V During TX bursts @ 1W 635 mA 800 mA

+5V Average @ 1W 260 mA 280 mA

+5V Average @ 0.25W 150 mA 170 mA

+5V Average in GPRS @ 1W 360 mA 400 mA

+5V Average Idle mode 20 mA 22 mA

+5V Average Idle with power saving

mechanism activated

9.2 mA 10.5 mA

4.1.3 Serial link

A serial link interface is available complying with V24 protocol signalling but not with V28 (electrical

interface) due to a 2.8 Volts interface. TX, RTS and DTR can be either 5V or 3V.

The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send (CT105/RTS), Clear To

Send (CT106/CTS), Data Terminal Ready (CT108-2/DTR) and Data Set Ready (CT107/DSR).

The set of RS232 signals can be required for GSM DATA services application. The 2 additional signals

are Data Carrier Detect (CT109/DCD) and Ring Indicator (CT125/RI).

Table 7 : Serial Link pin description

Signal Pin number I/O I/O type* Description

CT103 / TX 25 I CMOS Transmit serial data

CT104 / RX 28 O 1X Receive serial data

CT105 / RTS 30 I CMOS Ready To Send

CT106 / CTS 13 O 1X Clear To Send

CT107 / DSR 27 O 1X Data Set Ready

CT108-2 / DTR 29 I CMOS Data Terminal Ready

CT109 / DCD 5 O CMOS / 2X Data Carrier Detect

CT125 / RI 9 O CMOS / 2X Ring Indicator

CT102/GND 21,24…** Ground

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector

description

** Any of the available GND pins can be used

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Integra

11 S

RTS

7 S_RX

GND

5 S_RI

6 S_DCD

10 S

CTS

12 S

DSR

DTR

14 VCC

VCC

GND

DTR 21

RTS 18

VCC 13

CTS 19

DSR 17

RI 24

DCD 23

VCC

RX 22

TX 20

C1+

C1-

C2+

C2-

T1IN

T2IN

T3IN

T4IN

T5IN

R1OUTB

R2OUT

R3OUT

R4OUT

T1OUT

R1I

T2OUT

T3OUT

T4OUT

T5OUT

R2I

R3I

ERRO

OFF

Modem Level Shifte

Terminal

MAX 3238

figure 5* : level shifter application diagram for serial link

* This application note is valid for VCC ≥ 3.0Volt (see MAX3238 specifications). Auto shut down mode is not used in

this example.

4.1.4 ON / ~OFF

This input is used to switch ON or OFF the Integra modem. A high level signal has to be provided on

the ON/~OFF pin to switch on the modem. The level of the voltage of this signal has to be maintained

to VCC during a minimum time of 1 second. When powered off, the shutdown current is roughly

60 µA.

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Table 8 : ON / OFF pin description

Signal Pin number I/O I/O type* Description

ON/∼OFF 15 I CMOS Module Power ON/OFF

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

4.1.4.1 Power OFF procedure

In order to power OFF the Integra, switch it OFF both via software (AT+CPOF, See AT commands

user’s guide for more details) and via hardware line. See the diagram below.

figure 6 : power OFF procedure 1

figure 7 : power OFF procedure 2

bout

500 ms

bout

500 ms

OK response

T+CPOF

ON/~OFF

Serial link

to Integra

Serial link

from Integra

Integra status

OFF

bout

500

ON/~OFF

Serial link

to Integra

T+CPOF

Serial Link

from Integra OK response

bout

500 ms

Integra Status

OFF

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Integra

4.1.5 BOOT

This input is used to switch the Integra into download mode (backup procedure). The internal boot

procedure is started when this pin is low during the power ON of the module. In normal mode, this pin

has to be left open. If used, this input has to be driven by an open collector or an open drain. See below

an example of application diagram. See also the software upgrade procedure in General Guidelines

chapter 8

BOOT : pin 23

Switch BOOT

figure 8 : boot procedure

If Switch Boot = 1, Boot pin 23 = 0, to download mode

If Switch Boot = 0, Boot pin 23 = 1, to normal mode

Table 9 : BOOT pin description

Signal Pin number I/O I/O type* Description

BOOT 23 I CMOS SW downloading

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

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Integra

4.1.6 Reset signal (~RST)

This signal is used to force a reset of the Integra. It has to be used by providing low level during

approximately 2ms. This signal has to be considered as an emergency reset only. A reset procedure is

already driven by an internal hardware during the power-up sequence.

This signal can also be used to provide a reset to an external device. If no external reset is necessary

this input can be left open. If used (emergency reset), it has to be driven by an open collector or an open

drain. See below an example of application diagram.

Reset : pin 19

Switch reset

figure 9 : reset procedure

If switch Reset = 1, Reset pin 19 = 0

If switch Reset = 0, Reset pin 19 = 1

Table 10 : reset signal pin description

Signal Pin number I/O I/O type* Description

∼RST 19 I/O Module Reset

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

Table 11 : reset signal electrical characteristics

Parameter Min Max Unit

Input Impedance ( R ) 4.7 kΩ

Input Impedance ( C ) 10 NF

Table 12 : reset signal operating conditions

Parameter Min Max Condition

*VT- 1.1V 1.2 V

*VT+ 1.7V 1.9 V

VOL 0.4 V IOL = -50 µA

VOH 2.0 V IOH = 50 µA

VT-, VT+ : Hysterisis Level

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Integra

4.1.7 Flashing LED

The flashing LED signal is used to indicate the working mode of the Integra.

Table 13 : the flashing LED pin description

Signal Pin number I/O I/O type* Description

Flashing LED 11 I/O CMOS/2X Working mode indication

LED

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

Table 14 : LED and Integra status

LED status Integra status

OFF Download mode or switched OFF

Permanent Switched ON, not registered on the network

Slow flash Switched ON, registered on the network

Quick flash Switched ON, registered on the network, communication in

progress

4.1.8 General Purpose Input/Output

The Integra provides 2 General Purpose I/O. They are used to control any external device.

Table 15 : General Purpose pin description

Signal Pin number I/O I/O type* Description Default value

GPIO0 26 I/O CMOS / 2X General Purpose

I/O

GPIO4 7 I/O CMOS / 2X General Purpose

I/O

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

All digital I/O comply with 3Volts CMOS.

You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR. See AT commands

user’s guide for more details.

4.1.9 Analog to Digital Converter

Analog to Digital converter (ADC) input is provided by the Integra. This converter is a 10 bits one,

ranging from 0 to 2.5V. You can see the measurements via AT+ADC. See AT commands user’s guide

for more details.

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Table 16 : A/D converter pin description

Signal Pin number I/O I/O type* Description

AUXV0 17 I Analog A/D converter

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

description

Table 17 : A/D converter electrical characteristics

Parameter Min Max Unit

Resolution 10 bits

Sampling rate 90.3 Ksps

Input signal range 0 2.5V V

ADC Reference Accuracy 0.5 %

Integral Accuracy +/- 1 LSB

Differential Accuracy +/- 1 LSB

Input Impedance ( R ) 10 MΩ

Input Impedance ( C ) 50 pF

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4.1.10 Audio Interface

Two different microphone inputs and two different speaker outputs are supported.

The connection can be either differential or single-ended but using a differential connection in order to

reject common mode noise and TDMA noise is recommended.

4.1.10.1 Microphone 2 Inputs

The MIC2 inputs are differential ones. They already include the convenient biasing for an electret

microphone (0,5 mA and 2 Volts). This electret microphone can be directly connected on these inputs.

The impedance of the microphone 2 has to be around 2kΩ. These inputs are the standard ones for a

handset design while MIC1 inputs can be connected to an external headset or a handsfree kit.

The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The

connection to the microphone is direct. The gain can be tuned using the AT+VGR command.

See chapter Connector suppliers and peripheral devices.

MIC2P

C1 = 22pF to 100pF

33 pF recommanded

MIC2N

figure 10 : microphone 2 input

C1 has to be the nearest as possible to the microphone. Microphone manufacturers provide this

capacitor directly soldered on the microphone.

Table 18 : microphone 2 input pin description

Signal Pin # I/O I/O type* Description

MIC2P 16 I Analog Microphone 2 positive input

MIC2N 18 I Analog Microphone 2 negative input

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

4.1.10.2 Microphone 1 Inputs

The MIC1 inputs are differential and do not include internal bias. To use these inputs with an electret

microphone, bias has to be generated outside the INTEGRA modem according to the characteristic of

this electret microphone. These inputs are the standard ones used for an external headset or a

handsfree kit. When using a single-ended connection, be sure to have a very good ground plane, a very

good filtering as well as shielding in order to avoid any disturbance on the audio path.

The gain of MIC1 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB.

The gain can be tuned using the AT+VGR command.

Differential connection VCC analog power supply 2.8V

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MIC1P

March 2002/ version 1.6

Integra

figure 11 : microphone 1 input

R1 = R4 = from 100 to 330 Ω

R2 = R3 = usually between 1KΩ and 3.3KΩ as per the

microphone characteristics

C1 = 22pF to 100pF

C2 = 47µF

R1 and R4 are used as a voltage supply filter with C2.

C1 has to be the nearest possible to the microphone. Microphone manufacturers provide this capacitor

directly soldered on the microphone.

Table 19 : microphone 1 input pin description

Signal Pin # I/O I/O type* Description

MIC1P 20 I Analog Microphone 1 positive input

MIC1N 22 I Analog Microphone 1 negative input

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

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4.1.10.3 Speaker 2 Outputs

Speaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF.

These outputs are differential and the output power can be adjusted by step of 2dB. The output can be

directly connected to a speaker.

When using a single-ended connection, be sure to have a very good ground plane, a very good filtering

as well as shielding in order to avoid any disturbance on the audio path.

Differential Connection

SPK2P

SPK2N

Single-ended Connection

SPK2P

figure 12 : speaker 2 output

C1 = from 100nF to 47µF as per the speaker characteristics and the output power.

Using a single-ended connection also includes losing half of the output power compared to a

differential connection.

Table 20 : speaker 2 output pin description

Signal Pin # I/O I/O type* Description

SPK2P 10 O Analog Speaker 2 positive output

SPK2N 8 O Analog Speaker 2 negative output

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

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4.1.10.4 Speaker 1 Outputs

Speaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF.

These outputs are differential and the output power can be adjusted by step of 2dB. The output can be

directly connected to a speaker.

When using a single-ended connection, be sure to have a very good ground plane, a very good

filtering as well as a shielding in order to avoid any disturbance on the audio path.

Differential Connection

SPK1P

SPK1N

Single-ended Connection C1

SPK1P

figure 13 : speaker 1 output

C1 = from 100nF to 47µF as per the speaker characteristics.

Using a single-ended connection also includes losing half of the output power compared to a

differential connection.

Table 21 : speaker 1 output pin description

Signal Pin # I/O I/O type* Description

SPK1P 12 O Analog Speaker 1 positive output

SPK1N 14 O Analog Speaker 1 negative output

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

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4.1.11 SIM interface

The external SIM interface is available through the 50-pin connector in order to use a stand-alone SIM

card holder. This interface is 3V only on the engineering samples. 5V SIMs can be driven with

production unit using an external level shifter.

SIM line must not exceed 15 cm. see also “General guidelines” chapter 8

5 signals are available:

SIMVCC: SIM power supply.

SIMRST: reset.

SIMCLK: clock.

SIMDATA: I/O port.

SIMPRES1 SIM card detect. This signal is connected to the external SIM connector on pin 8. Pin 4 of

SIM connector must be pulled down to GND with 1 KΩ.

This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.

Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in

order to prevent any Electro-Static Discharge. TVS diodes with low capacitance (less than 10pF) are

connected on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edge.

Table 22 : SIM interface pin description

Signal Pin number I/O I/O type* Description

SIMCLK 45 O 2X SIM Clock

SIMRST 46 O 2X SIM Reset

SIMDATA 49 I/O CMOS / 3X SIM Data

SIMVCC 47 O

SIM Power Supply

SIMPRES1 48 I CMOS SIM Card Detect

GPO0** 50 O 2X SIM 3V or 5V

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

** for production units

See application schematics in annex for 3V/5V SIM management

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Table 23 : SIM interface electrical characteristics

Parameter Conditions Min Typ Max Unit

SIMDATA VIH IIH = ± 20µA 0.7xSIMVCC V

SIMDATA VIL I

IL = 1mA 0.3xSIMVCC V

SIMRST,

SIMDATA

SIMCLK VOH

Source current =

20µA

SIMVCC – 0.1V V

SIMRST,

SIMDATA

SIMCLK VOL

Sink current =

- 200µA

0.1 V

SIMVCC Output

Voltage

ISIMVCC <= 6mA 2.70 2.80 2.85 V

SIMCLK Rise/Fall

Time

Loaded with 30pF 50 ns

SIMRST,

SIMDATA

Rise/Fall Time

Loaded with 30pF 1 µs

SIMCLK

Frequency

Loaded with 30pF 3.25 MHz

Table 24 : SIM socket pin description

Signal Pin number Description

VCC 1 SIMVCC

RST 2 SIMRST

CLK 3 SIMCLK

CC4 4 R10 to GROUND

GND 5 GROUND

VPP 6 Not connected

I/O 7 SIMDATA

CC8 8 SIMPRES1

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SIMVCC 1

SIMRST 2

SIMCLK 3

SIMDATA 7

SIMPRES1 8

1 K

VCC

RST

CC4

GND

VPP

I / O

CC8

GND

Figure 14: SIM socket

4.1.12 SPI bus

The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard.

The maximum speed transfer is 3.25Mb/s.

Table 25 : SPI Bus pin description

Signal Pin number I/O I/O type* Description

SPI_CLK 44 O 1X SPI Serial Clock

SPI_IO 43 I/O CMOS / 1X SPI Data

SPI_EN 42 O 1X SPI Enable

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

4.1.13 Keypad interface

This interface provides 10 connections : 5 rows (R0 to R4) and 5 columns (C0 to C4).

The scanning is a digital one, and the debouncing is done in the integrated modem. No discrete

components like R,C (Resistor, Capacitor) are needed.

It is possible to scan the column and rows using the: AT+ CMER. command. See AT command user’s

guide for more details.

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Table 26 : keypad interface pin description

Signal Pin number I/O I/O type* Description

ROW0 39 I/O CMOS / 1X Row scan

ROW1 40 I/O CMOS / 1X Row scan

ROW2 37 I/O CMOS / 1X Row scan

ROW3 38 I/O CMOS / 1X Row scan

ROW4 35 I/O CMOS / 1X Row scan

COL0 36 I/O CMOS / 1X Column scan

COL1 33 I/O CMOS / 1X Column scan

COL2 34 I/O CMOS / 1X Column scan

COL3 31 I/O CMOS / 1X Column scan

COL4 32 I/O CMOS / 1X Column scan

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description

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4.2 RF Interface

The impedance is 50 Ohms nominal.

4.2.1 RF connector

The RF connector is MMCX (Miniature Micro Connector) standard type.

An antenna can be directly connected through the matting connector or using a small adaptor. See also

paragraph on GSM antenna.

4.2.2 RF performances

RF performances are compliant with the ETSI recommendation 05.05 and 11.10.

The main parameters are :

• Receiver:

• EGSM Sensitivity : < -104 dBm

• GSM 1800/GSM 1900 Sensitivity : < -102 dBm

• Selectivity @ 200 kHz : > +9 dBc

• Selectivity @ 400 kHz : > +41 dBc

• Dynamic range : 62 dB

• Intermodulation : > -43 dBm

• Co-channel rejection : + 9 dBc

Transmitter :

• Maximum output power (EGSM) : 33 dBm +/- 2 dB

• Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB

• Minimum output power (EGSM): 5 dBm +/- 5 dB

• Minimum output power (DCS/PCS): 0 dBm +/- 5 dB

• H2 level : < -30 dBm

• H3 level : < -30 dBm

• Noise in 925 - 935 MHz : < -67 dBm

• Noise in 935 - 960 MHz : < -79 dBm

• Noise in 1805 - 1880 MHz : < -71 dBm

• Phase error at peak power : < 5 ° RMS

• Frequency error : +/- 0.1 ppm max

4.3 SIM interface

The internal SIM interface of the Integra supports 3V SIMs only.

The part number reference of the SIM card holder supplier is MOLEX 91228-0002

The part number reference of the SIM receptacle supplier is MOLEX 91236-0002

See also subdivision The SIM card holder.

confidential © 39/60

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son autorisation préalable.

March 2002/ version 1.6

Integra

5 Connector Supplier and Peripheral devices

5.1 Where to find the SMD connectors

The Integra matting interface connector is made by SAMTEC France (http://www.samtec.com/).

Many SAMTEC products are available via SAMTEC dealers throughout the world.

The connectors data sheets are available in annex of this document.

Figure 15: high and low profile CLP connectors

Part number : FFSD-20-S-10-01-N

Figure 16: flexible flat cable

Part number : FLE 125 01LDVA

Figure 17: flex cable connector

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son autorisation préalable.

March 2002/ version 1.6

Integra

5.1.1 GSM Antenna

The integrated modem antenna connector is a MMCX connector. The MMCX connector incorporates a

'Snap On' latching action in order to make the connection easier with an excellent RF performance. An

additional advantage is its small physical size which is 50% of the standard MCX connector.

This type of connector is suitable for the standard ranges of flexible and semi-rigid cables. The

characteristic impedance of the MMCX coaxial connector is 50 ohm.

The antenna manufacturer must guarantee that the antenna will be working according to the following

radio characteristics:

Table 27 : radio characteristics

EGSM 900 GSM 1800 GSM 1900

Frequency RX 925 to 960 MHz 1805 to 1880 MHz 1930 to 1990 MHz

Frequency TX 880 to 915 MHz 1710 to 1785 MHZ 1850 to 1910 MHz

RF power stand 2W at 12.5 % duty cycle 1W at 12.5 % duty cycle 1W at 12.5 % duty cycle

Impedance 50 Ω

VSWR < 2

Typical radiated

gain 0 dBi on azimuth plane

The Integra requires an MMCX (Miniature Micro Connector) plug to connect an antenna

Figure 18: MMCX connector example (right angle)

An antenna with matting connector can be ordered, for example, from :

IMS Connectors Systems GMBH

Obere Hauptstrasse 30

D-79843 Löffingen

Germany

Tel : +49 76 54 90 10

Fax : +49 76 54 90 11 99

http://www.imscs.com/

or using a small MMCX / SMA adaptor can be ordered, for example, from :

Amphenol Socapex

http://www.amphenol.com/

Order N° : 908-31100

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son autorisation préalable.

March 2002/ version 1.6

Integra

5.1.2 The SIM card holder

The SIM card holder used in the integrated modem is a MOLEX connector.

Part number connector: 99228-0002

Part number holder : 91236-0002

For more information about this connector :

http://www.molex.com/

It is possible to use a stand-alone SIM card holder through the 50-pin connector (the length of the SIM

line must not exceed 15 cm).

6 Climatic and mechanical environment

Table 28 : climatic and mechanical environment

WM2C-G900/G1800 ENVIRONNEMENTAL CLASSES

TYPE OF TEST STANDARDS STORAGE TRANSPORTATION OPERATING (PORT USE)

Class 1.2 Class 2.3 Class 7.3

Cold IEC 68-2.1 -25° C 72 h -40° C 72 h -20° C (GSM) 16 h

Ab test -10° C (DCS) 16 h

Dry heat IEC 68-2.2 +70° C 72 h +70° C 72 h +55° C 16 h

Bb test

Change of temperature IEC 68-2.14 -40° / +30° C 5 cycles -20° / +30° C (GSM) 3 cycles

Na/Nb test t1 = 3 h -10° / +30° C (DCS) 3 cycles

t1 = 3 h

Damp heat IEC 68-2.30 +30° C 2 cycles +40° C 2 cycles +40° C 2 cycles

cyclic Db test 90% - 100% RH 90% - 100% RH 90% - 100% RH

variant 1 variant 1 variant 1

Damp heat IEC 68-2.56 +30° C 4 days +40° C 4 days +40° C 4 days

Cb test

Sinusoidal vibration IEC 68-2.6 5 - 62 Hz : 5 mm / s

Fc test 62 - 200Hz : 2 m / s2

3 x 5 sweep cycles

5 - 20 Hz : 0.96 m2 / s3 10 -12 Hz : 0.96 m2 / s3

Random vibration IEC 68-3.36 20 - 500Hz : - 3 dB / oct 12 - 150Hz : - 3 dB / oct

wide band Fdb test 3 x 10 min 3 x 30 min

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March 2002/ version 1.6

Integra

7 Demonstration board

Keypad

WMOi3

Integrated

Modem

SIM

Card

Holder

Reset

RS 232

serial link

Power

Supply

5V only/1 A

Audio RJ 9

Handset and

handsfree

Antenna

Connector

Flex

connector

ON/OFF

Download

Test

connector

Flashing

LED

Figure 19: Integra demoboard description

The Wavecom demonstration board (“demoboard”) is manufactured by Wavecom. It can be ordered

from Wavecom or directly from your distributor.

confidential © 43/60

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March 2002/ version 1.6

Integra

8 General guidelines for the use of the Integra

8.1 Key information

8.1.1 Hardware and RF

• Ground plane: Wavecom recommends to have a common ground plane for analog,

digital and RF grounds.

• Length of the SIM interface lines (15 cm maximum)

• Bias of the Microphone inputs must be properly adjusted when using audio connectors

(mic + speaker) 1.

• EMC protection on audio input/output (filters against 900 MHz)

• ESD protection on serial link,…

• Possible spurious emission radiated by the application to the RF receiver in the

receiver band

8.1.2 The Antenna

The antenna sub-system and integration in the application is a major issue. It is a major issue in the

choice of the antenna cable ( type, length, performances, thermal resistance, etc.)

These elements could affect GSM performances such as sensitivity and emitted power.

The antenna should be isolated as much as possible from the digital circuitry including the interface

signals.

It is recommended to shield the terminal. On terminals including the antenna, a poor shielding could

dramatically affect the sensitivity of the terminal. Subsequently, the power emitted through the antenna

could affect the application.

8.1.3 Firmware upgrade

The Integra firmware is stored in flash memory and it can easily be upgraded.

Two upgrade procedures are available:

• one (nominal) procedure based on the Xmodem protocol (AT+WDWL command)

• one emergency mode (backup procedure) based on a Wavecom specific downloader

8.1.3.1 Nominal upgrade procedure

The firmware file can be downloaded into the modem using the Xmodem protocol.

To enter this mode, the AT+WDWL command (see description in the AT command manual) has to be

sent to the Integra.

The necessary serial signals to proceed with the Xmodem downloading are:

Rx, Tx, RTS, CTS, GND.

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

8.1.3.2 backup procedure

In case the nominal upgrade mode is not possible (due to critical corruption on the flash memory), a

backup procedure is also available. It requires a WAVECOM specific software to download the firmware

file into the modem.

This tool has to run on a PC connected to the serial bus of the modem. As this procedure is very specific

and needs Wavecom tools, this process has to be executed by your distributor.

The necessary signals to proceed with the downloading are: Rx, Tx, RTS, CTS, GND.

Prior to running the WAVECOM downloader, the modem has to be set in download mode.

For this, the BOOT signal has to be set to low while powering ON (or reseting) the modem.

The application must support serial speed changes, up to 115,200 bps and hardware flow control.

8.1.4 Getting started

8.1.4.1 Minimum hardware interface to get started

As a minimum, it is necessary to connect the following signals to properly operate the Integra :

Table 29 : minimum signals to operate the Integra

Pin number Name Description

1 GND GROUND

2 GND GROUND

3 +5V Power supply

4 +5V Power supply

6 GND GROUND

13 CT106/CTS Clear To Send

15 ON/OFF Power On/OFF*

21 GND GROUND

24 GND GROUND

25 CT103/TX Transmit

28 CT104/RX Receive

30 CT105/RTS Request To Send

* connected to +5V for example

The serial link signals must be used through the implementation of the serial link level shifter. See

figure 5 : level shifter application diagram for serial link

8.1.4.2 Terminal emulator setup

Here below is an example based on the WindowsTM Hyperterminal application (terminal emulator

program).

Setup:

START – PROGRAMS – ACCESSORIES – HYPERTERMINAL , then

Start the software HYPERTRM

Give the name of your choice, click on the icone of your choice, then click “OK”, then

choose:

Connect using : direct to COM1

Properties :

choose 9600 bps – 8 bits data – no parity – 1 stop bit – hardware flow control

Click “OK”

Once Hyperterminal is open and configured, it can be used to send AT commands to the Integra.

Please see the “Informative Example” annex in the AT command user’s guide to test your Integra.

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

9 Reference documents

Table 31 : GSM ETSI recommendations for Phase I and Phase II.

Specification Reference Title

GSM ph2 Radio ETSI GSM 05.05 and GT 01 v4.2.1

DCS ph2 Radio ETSI GSM05.05 and GT01 v4.2.1

GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 and GT 01 v4.2.1

GSM ph2 Layer 2 ETSI GSM 04.06 and GT 01 v4.2.1

GSM ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1

DCS ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1

GSM/DCS Multiband ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 and GT 01 v4.2.1

GSM ph2 SIM ETSI GSM 11.11 and GT 01 v4.2.1

GSM ph2 Teleservices ETSI GSM 03.50 and GT 01 v4.2.1

GSM ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.1

06.31, 06.32, 07.01, 09.07 and GT 01 v4.2.1

DCS ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.1

06.31, 06.32, 07.01, 09.07 and GT 01 v4.2.1

You can find the documents on

ETSI Contacts: ETSI Secretariat

F-06921 Sophia Antipolis cedex, France

e-mail: secretariat@etsi.fr

http://www.etsi.org

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

10 Acronyms and Abbreviations

ADC : Analog Digital Converter

ASIC : Application Specific Integrated Circuit

BCCH : Broadcast Control Channel

CE : Communauté Européenne

CLK : Clock

CTS : Clear To send

dB : decibel

DCD : Data Carrier Detect

DCE : Data Circuit Terminating Equipment

DSR : Data Set Ready

DTE : Data Terminal Equipment

DTR : Data Terminated Ready

EFR : Enhanced Full Rate

E-GSM : Extended- GSM

EMC : Electromagnetic Conformity

EN : Enable

ETSI :

FAC : Final Assembly Code

FR : Full-Rate

FTA : Full Type Approval

GND : Ground

GPIO : General Purpose Input Output

GPRS : General Packet Radio Service

GSM : Global System for Mobile Communication

HR : Half-Rate

IMEI : International Mobile Equipment Identity

MO : Mobile Originated

MT : Mobile Terminated

OEM : Original Equipment Manufacturer

PDA : Personal Digital Assistant

PCB : Printed Circuit Board

PRES : Presence

RI : Ring Indicator

RTS : Request To Send

SIM : Subscriber Identity Module

SMD : Surface Mounted Design

SMS : Short Message Service

TAC : Type Approval Code

TDMA : Time Code Multiple Access

TE : Terminal Equipment

VSWR : Voltage Standing Wave Ratio

WAP : Wireless application Protocol

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

11 Index

2X, 19, 20, 22, 23, 27, 34, 41

Advice of Charge, 9

analog, 12, 52

Analog, 19, 20, 34, 35, 36, 38, 39, 40, 66

antenna, 9, 13, 14, 15, 46, 48, 49, 52

antenna cable, 52

asynchronous, 9

AT commands, 8, 9, 63

AT+ CMER, 44

AT+CPOF, 29

autobauding, 9

AUXV0, 20, 35

baud rate, 9

BOOT, 20, 31

bursts, 26

Call Barring, 9

Call Forwarding, 9

Call Hold, 9

Call Waiting, 9

Calling Line Identity, 9

Casing, 8

CE, 18, 56

Cell Broadcast, 9

Class 1, 8, 9

Class 4, 8

Closed User Group, 9

CMOS, 19, 20, 23, 27, 29, 31, 34, 41, 44, 45

column, 21, 44

connector, 7, 10, 12, 19, 22, 27, 29, 31, 32, 33,

34, 35, 36, 38, 39, 40, 41, 44, 45, 46, 47, 48,

converter, 34, 35

data, 7, 8, 27, 64, 65

Data Carrier Detect, 19, 27

dB, 46, 56

DCS, 7, 16, 26, 46, 48, 55

digital, 12, 34, 44, 52, 66

Digital, 34, 56

dual-band, 7

Easy remote control, 8

Echo, 63, 65

EFR, 8, 56

EMC protection, 52

Emergency calls, 8

ESD protection, 52

ETSI, 16, 46, 55

Explicit Call Transfer, 9

fax, 7, 8, 9

Fixed Dialling Number, 9

Flash LED, 20

FR, 8, 56

gain, 36, 37, 48, 66

general purpose, 19

General Purpose, 19, 20, 34

GND, 25

GND, 19, 20, 21, 22, 25, 27, 41, 43, 56

GPIO, 66

GPRS, 56

Ground plane, 52

GSM, 7, 8, 9, 13, 16, 27, 41, 48, 52, 55, 56

handset, 36

hardware, 7, 8, 19, 29, 32, 53

HR, 8, 56

I/O, 19, 20, 21, 22, 23, 27, 29, 31, 32, 33, 34,

35, 36, 38, 39, 40, 41, 43, 44, 45

Idle, 26

idle mode, 8

interface, 7, 8, 9, 12, 19, 20, 21, 22, 27, 41, 42,

44, 45, 46, 52

Keyboard, 21, 44

MIC1N, 20, 38

MIC1P, 20, 38

MIC2N, 20, 36

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

MIC2P, 20, 36

microphone, 36, 37, 38, 63

Microphone, 63

Microphone, 20, 36, 37, 38, 52

MMCX (Miniature Micro Connector), 7, 12, 46,

MNP2, 9

MO, 9, 56

modem, 7, 8, 10, 12, 13, 14, 15, 16, 18, 25, 28,

37, 44, 46, 48, 49

module, 7, 10, 31

Mounting, 8

MT, 9, 56

Multiparty, 9

nominal value, 25

OFF, 15, 16, 20, 28, 29, 30

Ohms, 39, 40, 46

ON/~OFF, 20, 28

operating conditions, 23, 27, 29, 31, 32, 33,

34, 35, 36, 38, 39, 40, 41, 44, 45

Operating temperature range, 8

PCB, 11

PCS, 7, 46, 48

Performance Test, 16

Phone Book, 64

phonebook, 64

point to point, 9

power, 8, 13, 25, 29, 30, 32, 39, 40, 41, 46, 48,

power supply, 25, 41

Power supply, 8, 25

radio, 13, 16, 48, 65

Real Time Clock, 9

RF, 7, 10, 12, 13, 14, 15, 16, 17, 19, 46, 48, 52

Ring Indicator, 19, 27

RST, 20, 32, 33, 43

serial link, 9, 27, 52

Signal, 27, 29, 31, 32, 33, 34, 35, 36, 38, 39,

40, 41, 43, 44, 45, 63

SIM, 7, 8, 9, 10, 12, 19, 22, 41, 42, 43, 46, 49,

52, 55, 56

SIM Toolkit, 9

SIMCLK, 22, 41, 42, 43

SIMDATA, 22, 41, 42, 43

SIMPRES, 41

SIMRST, 22, 41, 42, 43

SIMVCC, 22, 41, 42, 43

SMS, 7, 8, 9, 56

socket, 22, 41

speaker, 36, 39, 40, 52

Speaker, 19, 20, 39, 40, 63

SPI, 21, 22, 44

SPK1N, 20, 40

SPK1P, 20, 40

Storage temperature, 8

Telephony, 8

terminal, 52

Tricodec, 8

UCS2, 9

USSD, 9

V.42bis, 9

VCC, 20, 21, 22, 43

voice, 7, 63, 66

Volume, 8

WAP, 56

Weight, 8

Integra, 1, 3, 6, 7, 10, 11, 13, 16, 17, 18, 28,

29, 31, 32, 34, 46, 52

Xmodem, 9

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

Figures

figure 1 : mechanical description........................................................................................................... 10

figure 2 : mechanical description II........................................................................................................ 11

figure 3 : 50-pin connector..................................................................................................................... 21

figure 4 : pin numbering/bottom view .................................................................................................... 22

figure 5* : level shifter application diagram for serial link ...................................................................... 25

figure 6 : power OFF procedure 1 ......................................................................................................... 26

figure 7 : power OFF procedure 2 ......................................................................................................... 26

figure 8 : boot procedure ....................................................................................................................... 27

figure 9 : reset procedure ...................................................................................................................... 28

figure 10 : microphone 2 input............................................................................................................... 31

figure 11 : microphone 1 input............................................................................................................... 32

figure 12 : speaker 2 output................................................................................................................... 33

figure 13 : speaker 1 output................................................................................................................... 34

Figure 14: SIM socket............................................................................................................................ 37

Figure 15: high and low profile CLP connectors.................................................................................... 40

Figure 16: flexible flat cable................................................................................................................... 40

Figure 17: flex cable connector ............................................................................................................. 40

Figure 18: MMCX connector example (right angle) .............................................................................. 41

Figure 19: Integra demoboard description ............................................................................................ 43

Tables

Table 1 : Wavecom acceptance test ..................................................................................................... 15

Table 2 : 50-pin connector description .................................................................................................. 18

Table 3 : operating conditions ............................................................................................................... 20

Table 4 : power supply pin description .................................................................................................. 22

Table 5 : Power consumption in EGSM mode @ 25°C......................................................................... 23

Table 6 : Power consumption in GSM 1800 and1900 mode @ 25°C................................................... 23

Table 7 : Serial Link pin description ...................................................................................................... 24

Table 8 : ON / OFF pin description........................................................................................................ 26

Table 9 : BOOT pin description ............................................................................................................. 27

Table 10 : reset signal pin description................................................................................................... 28

Table 11 : reset signal electrical characteristics.................................................................................... 28

Table 12 : reset signal operating conditions.......................................................................................... 28

Table 13 : the flashing LED pin description........................................................................................... 29

Table 14 : LED and Integra status......................................................................................................... 29

Table 15 : General Purpose pin description .......................................................................................... 29

Table 16 : A/D converter pin description ............................................................................................... 30

Table 17 : A/D converter electrical characteristics ................................................................................ 30

Table 18 : microphone 2 input pin description....................................................................................... 31

Table 19 : microphone 1 input pin description....................................................................................... 32

Table 20 : speaker 2 output pin description .......................................................................................... 33

Table 21 : speaker 1 output pin description .......................................................................................... 34

Table 22 : SIM interface pin description ................................................................................................ 35

Table 23 : SIM interface electrical characteristics ................................................................................. 36

Table 24 : SIM socket pin description ................................................................................................... 36

Table 25 : SPI Bus pin description ........................................................................................................ 37

Table 26 : keypad interface pin description........................................................................................... 38

Table 27 : radio characteristics.............................................................................................................. 41

Table 28 : climatic and mechanical environment ..................................................................................42

Table 29 : minimum signals to operate the Integra ...............................................................................45

Table 31 : GSM ETSI recommendations for Phase I and Phase II....................................................... 46

Table 30 : AT command list................................................................................................................... 54

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

12 Annexes

12.1 Mechanical specifications

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

12.2 3V/5V SIM management

12.3 AT command list

For comprehensive information about AT Commands, please read the AT Commands user’s guide

Table 30 : AT command list

General Commands

+CGMI Manufacturer Identification

+CGMM Request Model Identification

+CGMR Request Revision Identification

+CGSN Product Serial Number

+CSCS Select TE Character Set

+CIMI Request IMSI

+CCID Card Identification

+GCAP Capabilities List

A/ Repeat Last Command

+CPOF Power Off

+CFUN Set Phone Functionality

+CPAS Phone Activity Status

+CMEE Report Mobile Equipment Errors

+CKPD Keypad Control

+CCLK Clock management

+CALA Alarm management

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

Call Control Commands

D Dial command

H Hang-up Command

A Answer a Call

+CEER Extended Error Report

+VTD, +VTS DTMF Signals

ATDL Redial Last Telephone Number

AT%Dn Automatic Dialing (or SMS send) with DTR

ATSO Automatic Answer

+CICB Incoming Call Bearer

+VGR, +VGT Gain Control

+CMUT Microphone Mute Control

+SPEAKER Speaker and Microphone Selection

+ECHO Echo Cancellation

+SIDET Side Tone Modification

+VIP Initialize Voice Parameters

+CSNS Single Numbering Scheme

Network Service Commands

+CSQ Signal Quality

+COPS Operator Selection

+CREG Network Registration

+WOPN Read Operator Name

+CPOL Preferred Operator List

Security Commands

+CPIN Enter PIN

+CPIN2 Enter PIN2

+CPINC PIN Remaining Attempt Number

+CLCK Facility Lock

+CPWD Change Password

Phone Book Commands

+CPBS Select Phone Book Memory Storage

+CPBR Read Phone Book Entries

+CPBF Find Phone Book Entries

+CPBW White Phone Book Entry

+CPBP Phone Book Phone Search

+CPBN Move Action in Phone Book

+CNUM Subscriber Number

+WAIP Avoid Phone Book Init

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

Short Message Commands

+CSMS Select Message Service

+CNMA New Message Acknowledgement

+CPMS Preferred Message Storage

+CMGF Preferred Message Format

+CSAS Save Settings

+CRES Restore Settings

+CSDH Show Text Mode parameters

+CNMI New Message Indication

+CMGR Read Message

+CMGL List Message

+CMGS Send Message

+CMGW Write Message to Memory

+CMSS Send Message from Storage

+CSMP Set Text Mode Parameters

+CMGD Delete Message

+CSCA Service Center Address

+CSCB Select Cell Broadcast Message Types

+WCBM Cell Broadcast Message Identifiers

+WMSC Message Status Modification

+WMGO Message Overwriting

Supplementary Services Commands

+CCFC Call Forwarding

+CLCK Call Barring

+CPWD Modify SS Password

+CCWA Call Waiting

+CLIR Calling Line Identification Restriction

+CLIP Calling Line Identification Presentation

+COLP Connected Line Identification Presentation

+CAOC Advice Of Charge

+CACM AccumulatedCcall Meter

+CAMM Accumulated Call Meter Maximum

+CPUC Price Per Unit and Currency Table

+CHLD Call Related Supplementary Services

+CLCC List Current Calls

+CSSN Supplementary Service Notifications

+CUSD Unstructured Supplementary Service Data

+CCUG Closed User Group

Data Commands

+CBST Bearer Type Selection

+FCLASS Select Mode

+CR Service Reporting Control

+CRC Cellular Result Codes

+ILRR DTE-DCE Local Rate Reporting

+CRLP Radio Link Protocol Parameters

+DOPT Others Radio Link Parameters

%C Select Data Compression

+DS V42 bis Data Compression

+DR V42 bis Data Compression Report

\N Select Data Error Correcting Mode

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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

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March 2002/ version 1.6

Integra

Fax Commands

+FTM Transmit Speed

+FRM Receive Speed

+FTH HDLC Transmit Speed

+FRH HDLC Receive Speed

+FTS Stop Transmission and Wait

+FRS Receive Silence

Fax Class 2 Commands

+FDT Transmit Data

+FDR Receice Data

+FET Transmit Page Punctuation

+FPTS Page Transfer Status Parameters

+FK Terminate Session

+FBOR Page Transfer Bit Order

+FBUF Buffer Size Report

+FCQ Copy Quality Checking

+FCR Capability to Receive

+FDIS Current Sessions Parameters

+FDCC DCE Capabilities Parameters

+FLID Local ID String

+FPHCTO Page Transfer Timeout Parameter

V24-V25 Commands

+IPR Fixed DTE Rate

+ICF DTE-DCE Character Framing

+IFC DTE-DCE Local Flow Control

&C Set DCD Signal

&D Set DTR Signal

&S Set DSR Signal

O Back to Online Mode

Q Result Code Suppression

V DCE Response Format

Z Default Configuration

&W Save Configuration

&T Auto-Tests

E Echo

&F Restore Factory Settings

&V Display Configuration

I Request Identification Information

SIM Toolkit Commands

+STSF SIM Toolkit Set Facilities

+STIN SIM Toolkit Indication

+STGI SIM Toolkit Get Information

+STCR SIM Toolkit Control Response

+STGR SIM Toolkit Give Response

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

Specific AT Commands

+CCED Cell Environment Description

+CCED Automatic RxLev Indication

+WIND General Indications

+ADC Analog Digital Converters Measurements

+CMER Mobile Equipment Event Reporting

+WLPR Read Language Preference

+WLPW Write Language Preference

+WIOR Read GPIO Value

+WIOW Write GPIO Value

+WAC Abort Command

+WTONE Play Tone

+WDTMF Play DTMF Tone

+WDWL Wavecom Downloading

+WVR Wavecom Voice Rate

+WDR Data Rate

+WHWV Hardware Version

+WDOP Date Of Production

+WSVG Wavecom Select Voice Gain

+WSTR Wavecom Status Request

+WSCAN Wavecom Scan

+WRIM Ring Indicator Mode

+W32K Power saving mode

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

13 RF exposure instructions

Pursuant to 47 CFR § 24.52 of the FCC Rules and Regulations, personnal

communications services (PCS) equipment is subject to the radiofrequency radiation exposure

requirements specified in § 1.1307(b), § 2.1091 and § 2.1093 as approporiate.

The Wavecom Modem is a GSM (PCS 1900) terminal which operates in the US

licensed PCS frequency spectrum. The device transmits over the 1850-1910 MHz band and

receives over the 1930-1990 MHz Band.

Wavecom, Inc. certifies that it has determined that the Modem complies with the RF

hazard requirements applicable to broadband PCS equipment operating under the authority of

47 CFR Part 24, Subpart E of the FCC Rules and Regulations. This determination is

dependent upon installation, operation and use of the equipment in accordance with all

instructions provided.

The Modem is designed for and intended to be used in fixed and mobile applications.

"Fixed" means that the device is physically secured at one location and is not able to be easily

moved to another location. "Mobile" means that the device is designed to be used in other

than fixed locations and generally in such a way that a separation distance of at least 20 cm is

normally maintained between the transmitter's antenna and the body of the user or nearby

persons. The Modem is not designed for or intended to be used in portable applications

(within 20 cm of the body of the user) and such uses are strictly prohibited.

To ensure that the unit complies with current FCC regulations limiting both maximum

RF output power and human exposure to radiofrequency radiation, a separation distance of at

least 20 cm must be maintained between the unit's antenna and the body of the user and any

nearby persons at all times and in all applications and uses. Additionally, in mobile

applications, maximum antenna gain must not exceed 3 dBi (to comply with Section 24.232(b)

and is limited to7 dBi for fixed applications. Finally, the tune-up procedure for the O9EM2113

ensures that the maximum RF output power of the device does not exceed 30.0 dBm within

the variations that can be expected due to quantity production and testing on a statistical

basis.

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

March 2002/ version 1.6

Integra

14 Instructions to OEM

Wavecom User’s manual includes specific warnings and cautions in order to ensure that OEMs

are aware of their responsibilities, with regards to RF exposure compliance, for products into which the

modem is integrated. With this guidance, the OEM will be able to incorporate into their documentation

the necessary operating conditions and warnings.

OEMs need to provide a manual with the ‘’final’’ product that clearly states the operating

requirements and conditions and that these must be observed to ensure compliance with current FCC

RF exposure requirements / MPE limits (refer to chapter 13. RF exposure instructions ). This will

enable the OEM to generate (and provide the end-user with) the appropriate operating instructions,

warnings and cautions, and/or markings for their product.

This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written

agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans

son autorisation préalable.

Sierra Wireless M2113 GSM Modem User Manual Introduction to the Integra outstanding assets

Sierra Wireless, Inc. GSM Modem Introduction to the Integra outstanding assets

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