Sierra Wireless Q2687 GSM/GPRS/EDGE/AMR Module User Manual

Sierra Wireless Inc. GSM/GPRS/EDGE/AMR Module Users Manual

Contents

Users Manual

WA_DEV_Q26RD_PTS_001 002 April 20, 2010 AirPrime Q2687 Refreshed Product Technical Specification and Customer Design Guideline
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 2 Product Technical Specification and Customer Design Guideline Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 3 Product Technical Specification and Customer Design Guideline Patents Portions of this product may be covered by some or all of the following US patents: 5,515,013 5,629,960 5,845,216 5,847,553 5,878,234 5,890,057 5,929,815 6,169,884 6,191,741 6,199,168 6,339,405 6,359,591 6,400,336 6,516,204 6,561,851 6,643,501 6,653,979 6,697,030 6,785,830 6,845,249 6,847,830 6,876,697 6,879,585 6,886,049 6,968,171 6,985,757 7,023,878 7,053,843 7,106,569 7,145,267 7,200,512 7,295,171 7,287,162 D442,170 D459,303 D599,256 D560,911 and other patents pending. This product includes technology licensed from QUALCOMM® 3G Manufactured or sold by Sierra Wireless or its licensees under one or more patents licensed from InterDigital Group. Copyright © 2010 Sierra Wireless. All rights reserved. Trademarks AirCard® and Watcher® are registered trademarks of Sierra Wireless. Sierra Wireless™, AirPrime™, AirLink™, AirVantage™ and the Sierra Wireless logo are trademarks of Sierra Wireless. , , ®, inSIM®, WAVECOM®, WISMO®, Wireless Microprocessor®, Wireless CPU®, Open AT® are filed or registered trademarks of Sierra Wireless S.A. in France and/or in other countries. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh and Mac OS are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of the respective owners. Contact Information Sales Desk: Phone: 1-604-232-1488 Hours: 8:00 AM to 5:00 PM Pacific Time E-mail: sales@sierrawireless.com Post: Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4 Fax: 1-604-231-1109 Web: www.sierrawireless.com Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases: www.sierrawireless.com
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 4 Product Technical Specification and Customer Design Guideline Document History Version Date Updates 001 January 28, 2010 Creation 002 April 20, 2010 Reformatted in the rebranded SWI template. In Section 3 Technical Specifications:  Moved the Power Supply Design Requirements to section 9.1 Power Supply  Updated Figure 5 In section 4 Interfaces:  Updated section 4.7.4 5-wire Serial Interface  Updated section 4.8.1 Pin Description  Updated section 4.8.3 4-wire Serial Interface Updated section 8.4 Reliability Prediction Model. Updated links in section 13.1.1 Web Site Support. Updated Intelligent Embedded Module weight to 8g. Updated the RF Component list. Removed references to IMP Connector throughout the document. Updated Figure 10 Example of a 4-wire SPI Bus Application. Updated section 4.15 Temperature Sensor Interface. Updated Power ON information based on Tracker 01626. Updated U1 Chip information based on CUS57225. Updated antenna gain information. Updated FCC ID. Updated power consumption values in section 6 Power Consumption. Updated Figure 5 Q2687 Refreshed Embedded Module Mechanical Drawing and Figure 6 Maximum Bulk Occupied on the Host Board.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 5 Contents 1. INTRODUCTION ................................................................................................ 16 1.1. Physical Dimensions ................................................................................................... 16 1.2. General Features ........................................................................................................ 16 1.3. GSM/GPRS/EGPRS Features .................................................................................... 18 1.4. Interfaces ................................................................................................................... 18 1.5. Operating System ....................................................................................................... 18 1.6. Connection Interfaces ................................................................................................. 19 1.7. Environment and Mechanics ....................................................................................... 19 1.7.1. RoHS Directive Compliant ................................................................................... 19 1.7.2. Disposing of the Product ...................................................................................... 19 2. FUNCTIONAL SPECIFICATIONS ...................................................................... 20 2.1. Functional Architecture ............................................................................................... 20 2.1.1. RF Functionalities ................................................................................................ 20 2.1.2. Baseband Functionalities ..................................................................................... 21 2.2. Operating System ....................................................................................................... 21 3. TECHNICAL SPECIFICATIONS ........................................................................ 22 3.1. Power Supply ............................................................................................................. 22 3.1.1. Power Supply Pin-Out .......................................................................................... 23 3.1.2. Start-Up Current .................................................................................................. 24 3.1.3. Decoupling of Power Supply Signals .................................................................... 24 3.2. Mechanical Specifications ........................................................................................... 24 3.3. Firmware Upgrade ...................................................................................................... 27 4. INTERFACES ..................................................................................................... 28 4.1. General Purpose Connector (GPC) ............................................................................. 28 4.1.1. Pin Description .................................................................................................... 29 4.1.2. Pin Out Differences .............................................................................................. 34 4.2. Electrical Information for Digital I/O ............................................................................. 35 4.3. General Purpose Input/Output .................................................................................... 37 4.3.1. Pin Description .................................................................................................... 37 4.4. Serial Interface ........................................................................................................... 39 4.4.1. SPI Bus ............................................................................................................... 39 4.4.1.1. Characteristics ........................................................................................................ 39 4.4.1.2. SPI Configuration .................................................................................................... 39 4.4.1.3. SPI Waveforms ....................................................................................................... 40 4.4.1.4. SPI1 Pin Description ................................................................................................ 41 4.4.1.5. SPI2 Pin Description ................................................................................................ 41 4.4.1.6. Application .............................................................................................................. 42 4.4.2. I2C Bus ................................................................................................................ 43 4.4.2.1. I2C Waveforms ........................................................................................................ 43 4.4.2.2. I2C Pin Description .................................................................................................. 44 4.4.2.3. Application .............................................................................................................. 44 4.5. Parallel Interface ......................................................................................................... 45
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 6 Product Technical Specification and Customer Design Guideline 4.5.1. Pin Description .................................................................................................... 45 4.5.2. Electrical Characteristics ...................................................................................... 46 4.5.3. Asynchronous Access .......................................................................................... 46 4.5.4. Synchronous Access ........................................................................................... 48 4.5.5. Additional Information Regarding Address Size Bus ............................................. 51 4.5.6. Application ........................................................................................................... 51 4.6. Keyboard Interface ..................................................................................................... 52 4.6.1. Pin Description .................................................................................................... 52 4.6.2. Application ........................................................................................................... 53 4.7. Main Serial Link (UART1) ........................................................................................... 54 4.7.1. Pin Description .................................................................................................... 54 4.7.2. Level Shifter Implementation ................................................................................ 55 4.7.2.1. Recommended Components .................................................................................... 55 4.7.3. V24/CMOS Possible Designs ............................................................................... 56 4.7.4. 5-wire Serial Interface .......................................................................................... 57 4.7.5. 4-wire Serial Interface .......................................................................................... 57 4.7.6. 2-wire Serial Interface .......................................................................................... 57 4.8. Auxiliary Serial Link (UART2) ...................................................................................... 58 4.8.1. Pin Description .................................................................................................... 58 4.8.2. Level Shifter Implementation ................................................................................ 59 4.8.2.1. Recommended Components .................................................................................... 59 4.8.3. 4-wire Serial Interface .......................................................................................... 60 4.8.4. 2-wire Serial Interface .......................................................................................... 60 4.9. SIM Interface .............................................................................................................. 61 4.9.1. Pin Description .................................................................................................... 61 4.9.2. Electrical Characteristics ...................................................................................... 61 4.9.3. Application ........................................................................................................... 62 4.9.3.1. SIM Socket Pin Description ...................................................................................... 62 4.9.3.2. Recommended Components .................................................................................... 63 4.10. USB 2.0 Interface ....................................................................................................... 64 4.10.1. Pin Description .................................................................................................... 64 4.10.2. Electrical Characteristics ...................................................................................... 64 4.10.3. Application ........................................................................................................... 65 4.10.3.1. Recommended Components .................................................................................. 65 4.11. RF Interface ................................................................................................................ 66 4.11.1. RF Connections ................................................................................................... 66 4.11.1.1. UFL Connector ...................................................................................................... 66 4.11.1.2. Soldered Solution .................................................................................................. 66 4.11.1.3. Precidip Connector ................................................................................................ 66 4.11.2. RF Performance .................................................................................................. 66 4.11.3. Antenna Specifications ........................................................................................ 67 4.11.3.1. Application ............................................................................................................ 67 4.12. Analog Audio Interface................................................................................................ 68 4.12.1. Pin Description .................................................................................................... 68 4.12.2. Microphone Features ........................................................................................... 68 4.12.2.1. MIC1 Microphone Input .......................................................................................... 68 4.12.2.2. MIC2 Microphone Input .......................................................................................... 72 4.12.3. Speaker Features ................................................................................................ 75 4.12.3.1. Speakers Output Power ......................................................................................... 76 4.12.3.2. SPK1 Speaker Output............................................................................................ 76
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 7 Product Technical Specification and Customer Design Guideline 4.12.3.3. SPK2 Speaker Output............................................................................................ 77 4.12.3.4. Differential Connection Example ............................................................................ 78 4.12.3.5. Single-Ended Connection Example ........................................................................ 78 4.12.3.6. Recommended Characteristics .............................................................................. 79 4.13. Digital Audio Interface (PCM) ...................................................................................... 80 4.13.1. PCM Waveforms.................................................................................................. 81 4.13.2. Pin Description .................................................................................................... 82 4.14. Battery Charging Interface .......................................................................................... 83 4.14.1. Charging Algorithms ............................................................................................ 84 4.14.1.1. Ni-Cd/Ni-Mh Charging Algorithm ............................................................................ 84 4.14.1.2. Li-Ion Charging Algorithm ...................................................................................... 85 4.14.2. Pre-Charging ....................................................................................................... 88 4.14.3. Temperature Monitoring ....................................................................................... 88 4.14.4. Recharging .......................................................................................................... 88 4.14.5. Application ........................................................................................................... 89 4.14.5.1. Temperature Computation Method ......................................................................... 89 4.14.6. Charger Recommendations ................................................................................. 90 4.15. Temperature Sensor Interface .................................................................................... 91 5. SIGNALS AND INDICATORS ............................................................................ 92 5.1. ON/~OFF Signal ......................................................................................................... 92 5.1.1. Pin Description .................................................................................................... 92 5.1.2. Electrical Characteristics ...................................................................................... 92 5.1.3. Power-ON ............................................................................................................ 92 5.1.4. Power-OFF .......................................................................................................... 94 5.1.5. Application ........................................................................................................... 95 5.2. Reset Signal (~RESET) .............................................................................................. 96 5.2.1. Reset Sequence .................................................................................................. 96 5.2.2. Pin Description .................................................................................................... 97 5.2.3. Electrical Characteristics ...................................................................................... 97 5.2.4. Application ........................................................................................................... 97 5.3. BOOT Signal .............................................................................................................. 99 5.3.1. Pin Description .................................................................................................... 99 5.4. BAT-RTC (Backup Battery) ....................................................................................... 100 5.4.1. Pin Description .................................................................................................. 100 5.4.2. Electrical Characteristics .................................................................................... 101 5.4.3. Application ......................................................................................................... 101 5.4.3.1. Super Capacitor .....................................................................................................101 5.4.3.2. Non-Rechargeable Battery ......................................................................................101 5.4.3.3. Rechargeable Battery .............................................................................................102 5.5. Buzzer Output........................................................................................................... 103 5.5.1. Pin Description .................................................................................................. 103 5.5.2. Electrical Characteristics .................................................................................... 103 5.5.3. Application ......................................................................................................... 104 5.5.4. Recommended Characteristics .......................................................................... 104 5.6. External Interrupt ...................................................................................................... 105 5.6.1. Pin Description .................................................................................................. 105 5.6.2. Electrical Characteristics .................................................................................... 105 5.6.3. Application ......................................................................................................... 105
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 8 Product Technical Specification and Customer Design Guideline 5.7. VCC_2V8 and VCC_1V8 Output ............................................................................... 107 5.7.1. Pin Description .................................................................................................. 107 5.7.2. Electrical Characteristics .................................................................................... 107 5.8. FLASH-LED (LED0) .................................................................................................. 108 5.8.1. Pin Description .................................................................................................. 108 5.8.2. Electrical Characteristics .................................................................................... 109 5.8.3. Application ......................................................................................................... 109 5.9. Analog to Digital Converter ....................................................................................... 110 5.9.1. Pin Description .................................................................................................. 110 5.9.2. Electrical Characteristics .................................................................................... 110 5.10. Digital to Analog Converter ....................................................................................... 111 5.10.1. Pin Description .................................................................................................. 111 5.10.2. Electrical Characteristics .................................................................................... 111 6. POWER CONSUMPTION ................................................................................ 112 6.1. Power Consumption without the Sierra Wireless Software Suite ................................ 112 6.2. Power Consumption with the Sierra Wireless Software Suite .................................... 113 7. CONSUMPTION MEASUREMENT PROCEDURE .......................................... 116 7.1. Hardware Configuration ............................................................................................ 116 7.1.1. Equipments Used .............................................................................................. 116 7.1.2. Q Series Development Kit Board v3 ................................................................... 117 7.1.3. SIM Cards ......................................................................................................... 117 7.2. Software Configuration ............................................................................................. 118 7.2.1. Embedded Module Configuration ....................................................................... 118 7.2.2. Equipment Configuration.................................................................................... 118 8. RELIABILITY COMPLIANCE AND RECOMMENDED STANDARDS ............. 120 8.1. Reliability Compliance............................................................................................... 120 8.2. Applicable Standards Listing ..................................................................................... 120 8.3. Environmental Specifications .................................................................................... 121 8.3.1. Function Status Classification ............................................................................ 121 8.4. Reliability Prediction Model ....................................................................................... 122 8.4.1. Life Stress Tests ................................................................................................ 122 8.4.2. Environmental Resistance Stress Tests ............................................................. 123 8.4.3. Corrosive Resistance Stress Tests..................................................................... 124 8.4.4. Thermal Resistance Cycle Stress Tests ............................................................. 125 8.4.5. Mechanical Resistance Stress Tests .................................................................. 126 8.4.6. Handling Resistance Stress Tests ...................................................................... 128 9. DESIGN GUIDELINES ..................................................................................... 129 General Rules and Constraints ................................................................................................ 129 9.1. Power Supply ........................................................................................................... 129 9.2. Antenna .................................................................................................................... 129 9.1. Layout/Pads Design .................................................................................................. 130 9.2. Routing Constraints .................................................................................................. 131
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 9 Product Technical Specification and Customer Design Guideline 9.2.1. System Connector ............................................................................................. 131 9.2.2. Power Supply .................................................................................................... 131 9.2.2.1. Ground Plane and Shielding Connection .................................................................133 9.2.3. SIM Interface ..................................................................................................... 133 9.2.4. Audio Circuit ...................................................................................................... 133 9.2.5. RF Circuit .......................................................................................................... 133 9.2.5.1. UFL/SMA Connector...............................................................................................135 9.2.5.2. Coaxial Cable .........................................................................................................135 9.2.5.3. Precidip Connector .................................................................................................136 9.3. EMC and ESD Recommendations ............................................................................ 137 9.4. Mechanical Integration .............................................................................................. 137 9.5. Operating System Upgrade ....................................................................................... 138 10. EMBEDDED TESTABILITY ............................................................................. 139 10.1. Serial Link Access .................................................................................................... 139 10.2. RF Output Accessibility ............................................................................................. 140 11. CONNECTOR AND PERIPHERAL DEVICE REFERENCES .......................... 141 11.1. General Purpose Connector ..................................................................................... 141 11.2. SIM Card Reader ...................................................................................................... 141 11.3. Microphone............................................................................................................... 141 11.4. Speaker .................................................................................................................... 142 11.5. Antenna Cable .......................................................................................................... 142 11.6. RF board-to-board connector .................................................................................... 142 11.7. GSM antenna ........................................................................................................... 142 11.8. Buzzer ...................................................................................................................... 143 12. CERTIFICATION COMPLIANCE AND RECOMMENDED STANDARDS ....... 144 12.1. Certification Compliance ........................................................................................... 144 12.2. Applicable Standards Listing ..................................................................................... 144 13. REFERENCES ................................................................................................. 146 13.1. Web Site Support ..................................................................................................... 146 13.2. Reference Documents .............................................................................................. 146 13.2.1. Sierra Wireless Software Documentation ........................................................... 146 13.2.2. Firmware Documentation ................................................................................... 147 13.2.3. Hardware Documentation .................................................................................. 147 13.2.4. Other Sierra Wireless Documentation ................................................................ 147 13.2.5. Other Related Documentation ............................................................................ 148 13.2.6. Application Notes ............................................................................................... 148 13.3. List of Abbreviations ................................................................................................. 148 14. SAFETY RECOMMENDATIONS (FOR INFORMATION ONLY) ..................... 151 14.1. RF Safety ................................................................................................................. 151 14.1.1. General ............................................................................................................. 151 14.1.2. Exposure to RF Energy ...................................................................................... 151 14.1.3. Efficient Terminal Operation ............................................................................... 151
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 10 Product Technical Specification and Customer Design Guideline 14.1.4. Antenna Care and Replacement ........................................................................ 151 14.2. General Safety.......................................................................................................... 152 14.2.1. Driving ............................................................................................................... 152 14.2.2. Electronic Devices ............................................................................................. 152 14.2.3. Vehicle Electronic Equipment ............................................................................. 152 14.2.4. Medical Electronic Equipment ............................................................................ 152 14.2.5. Aircraft ............................................................................................................... 152 14.2.6. Children ............................................................................................................. 153 14.2.7. Blasting Areas ................................................................................................... 153 14.2.8. Potentially Explosive Atmospheres..................................................................... 153
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 11 List of Figures Figure 1. Functional Architecture ............................................................................................... 20 Figure 2. Power Supply During Burst Emission .......................................................................... 22 Figure 3. Power Supply Ripple Graph (TBC) .............................................................................. 23 Figure 4. Start-up Current Waveform ......................................................................................... 24 Figure 5. Q2687 Refreshed Embedded Module Mechanical Drawing ......................................... 25 Figure 6. Maximum Bulk Occupied on the Host Board ............................................................... 26 Figure 7. SPI Timing Diagram (Mode 0, Master, 4 wires) ........................................................... 40 Figure 8. SPI Timing Diagram with LOAD Signal (Mode 0, Master, 4 wires) ............................... 41 Figure 9. Example of a 3-wire SPI Bus Application..................................................................... 42 Figure 10. Example of a 4-wire SPI Bus Application..................................................................... 42 Figure 11. I2C Timing Diagram (master) ....................................................................................... 43 Figure 12. Example1 of an I2C Bus Application ............................................................................ 44 Figure 13. Example2 of an I2C Bus Application ............................................................................ 44 Figure 14. Asynchronous Access................................................................................................. 47 Figure 15. Synchronous Access .................................................................................................. 49 Figure 16. Read Synchronous Timing .......................................................................................... 49 Figure 17. Write Synchronous Timing .......................................................................................... 50 Figure 18. Example of a Parallel Bus Application (NAND Memory) .............................................. 51 Figure 19. Example of a Keyboard Implementation ...................................................................... 53 Figure 20. Example of an RS-232 Level Shifter Implementation for UART1 ................................. 55 Figure 21. Example of V24/CMOS Serial Link Implementation for UART1.................................... 56 Figure 22. Example of a Full Modem V24/CMOS Serial Link Implementation for UART1 .............. 56 Figure 23. Example of RS-232 Level Shifter Implementation for UART2 ...................................... 59 Figure 24. Example of a Typical SIM Socket Implementation ....................................................... 62 Figure 25. Example of a USB Implementation .............................................................................. 65 Figure 26. MIC1 Equivalent Circuits ............................................................................................. 69 Figure 27. Example of a MIC1 Differential Connection with LC Filter ............................................ 69 Figure 28. Example of a MIC1 Differential Connection without an LC Filter .................................. 70 Figure 29. Example of a MIC1 Single-Ended Connection with LC Filter ........................................ 71 Figure 30. Example of a MIC1 Single-Ended Connection without an LC Filter .............................. 71 Figure 31. MIC2 Equivalent Circuits ............................................................................................. 72 Figure 32. Example of a MIC2 Differential Connection with LC Filter ............................................ 73 Figure 33. Example of a MIC2 Differential Connection without an LC Filter .................................. 74 Figure 34. Example of a MIC2 Single-Ended Connection with LC Filter ........................................ 74 Figure 35. Example of a MIC2 Single-Ended Connection without an LC Filter .............................. 75 Figure 36. SPK1 Equivalent Circuits ............................................................................................ 76 Figure 37. SPK2 Equivalent Circuits ............................................................................................ 77
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 12 Product Technical Specification and Customer Design Guideline Figure 38. Example of an SPK Differential Connection................................................................. 78 Figure 39. Example of an SPK Single-Ended Connection ............................................................ 78 Figure 40. PCM Frame Waveform ............................................................................................... 81 Figure 41. PCM Sampling Waveform ........................................................................................... 81 Figure 42. Battery Charging Diagram........................................................................................... 83 Figure 43. Ni-Cd/Ni-Mh Charging Waveform ................................................................................ 84 Figure 44. Li-Ion Full Charging Waveform .................................................................................... 85 Figure 45. Phase 2 Pulse ............................................................................................................ 86 Figure 46. Phase 2 Rest .............................................................................................................. 87 Figure 47. Phase 3 Switch ........................................................................................................... 87 Figure 48. Example of an ADC Application .................................................................................. 89 Figure 49. Temperature Sensor Characteristics ........................................................................... 91 Figure 50. Power-ON Sequence (no PIN code activated) ............................................................. 93 Figure 51. Power-OFF Sequence ................................................................................................ 95 Figure 52. Example of ON/~OFF Pin Connection ......................................................................... 95 Figure 53. Reset Sequence Waveform ........................................................................................ 96 Figure 54. Example of ~Reset Pin Connection with Switch Configuration ..................................... 98 Figure 55. Example of ~Reset Pin Connection with Transistor Configuration ................................ 98 Figure 56. Example of BOOT Pin Implementation ........................................................................ 99 Figure 57. Real Time Clock Power Supply ................................................................................. 100 Figure 58. RTC Supplied by a Gold Capacitor ........................................................................... 101 Figure 59. RTC Supplied by a Non-Rechargeable Battery.......................................................... 101 Figure 60. RTC Supplied by a Rechargeable Battery ................................................................. 102 Figure 61. Example of a Buzzer Implementation ........................................................................ 104 Figure 62. Example of an LED Driven by the Buzzer Output ...................................................... 104 Figure 63. Example of INT0 Driven by an Open Collector .......................................................... 106 Figure 64. Example of INT1 Driven by an Open Collector .......................................................... 106 Figure 65. LED0 State During RESET and Initialization Time ..................................................... 109 Figure 66. Example of FLASH-LED Implementation................................................................... 109 Figure 67. Typical Hardware Configuration ................................................................................ 116 Figure 68. Layout Requirement ................................................................................................. 130 Figure 69. Precidip Connector Pad Design (Sierra Wireless Side).............................................. 131 Figure 70. Power Supply Routing Example ................................................................................ 132 Figure 71. Burst Simulation Circuit ............................................................................................. 132 Figure 72. AppCad Screenshot for MicroStrip Design ................................................................ 134 Figure 73. Routing Examples..................................................................................................... 134 Figure 74. UFL/SMA Connector ................................................................................................. 135 Figure 75. Antenna Connection to both RF pad and Ground pad ............................................... 136 Figure 76. Precidip Connector ................................................................................................... 136 Figure 77. Main Serial Link (UART1) Debug Access .................................................................. 139
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 13 List of Tables Table 1: Q2687 Refreshed Embedded Module Features........................................................... 17 Table 2: List of RF Frequency Ranges...................................................................................... 20 Table 3: Input Power Supply Voltage ........................................................................................ 23 Table 4: Power Supply Pin-Out................................................................................................. 23 Table 5: Current Start-Up (TBC) ............................................................................................... 24 Table 6: Available Interfaces and Signals ................................................................................. 28 Table 7: General Purpose Connector Pin Description ............................................................... 29 Table 8: Signal Comparison between the Q Series Intelligent Embedded Modules ................... 34 Table 9: Electrical Characteristic of a 2.8 Volt Type (2V8) Digital I/O ......................................... 35 Table 10: Electrical Characteristic of a 1.8 Volt Type (1V8) Digital I/O ......................................... 35 Table 11: Open Drain Output Type ............................................................................................. 35 Table 12: Reset State Definition ................................................................................................. 36 Table 13: GPIO Pin Description .................................................................................................. 37 Table 14: SPI Bus Configuration................................................................................................. 39 Table 15: SPI Bus AC Characteristics ........................................................................................ 40 Table 16: SPI1 Pin Description ................................................................................................... 41 Table 17: SPI2 Pin Description ................................................................................................... 41 Table 18: I2C AC Characteristics ................................................................................................ 43 Table 19: I2C Pin Description ...................................................................................................... 44 Table 20: Parallel Interface Pin Description ................................................................................ 45 Table 21: AC Characteristics of Asynchronous Accesses ........................................................... 47 Table 22: AC Characteristics of Synchronous Accesses ............................................................. 50 Table 23: Address Bus Size Details ............................................................................................ 51 Table 24: Keyboard Interface Pin Description ............................................................................. 52 Table 25: UART1 Pin Description ............................................................................................... 54 Table 26: UART2 Pin Description ............................................................................................... 58 Table 27: SIM Pin Description .................................................................................................... 61 Table 28: Electrical Characteristics of the SIM Interface ............................................................. 61 Table 29: SIM Socket Pin Description ......................................................................................... 62 Table 30: USB Pin Description ................................................................................................... 64 Table 31: Electrical Characteristics of the USB Interface ............................................................ 64 Table 32: Antenna Specifications ............................................................................................... 67 Table 33: Analog Audio Pin Description ...................................................................................... 68 Table 34: Electrical Characteristics of MIC1 ................................................................................ 69 Table 35: Recommended Components for a MIC1 Differential Connection ................................. 70 Table 36: Recommended Components for a MIC1 Single-Ended Connection ............................. 72 Table 37: Electrical Characteristics of MIC2 ................................................................................ 72
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 14 Product Technical Specification and Customer Design Guideline Table 38: Recommended Components for a MIC2 Differential Connection ................................. 74 Table 39: Recommended Components for a MIC2 Single-Ended Connection ............................. 75 Table 40: Speaker Information ................................................................................................... 76 Table 41: Electrical Characteristics of SPK1 ............................................................................... 76 Table 42: Electrical Characteristics of SPK2 ............................................................................... 77 Table 43: AC Characteristics of the Digital Audio Interface ......................................................... 82 Table 44: PCM Interface Pin Description .................................................................................... 82 Table 45: Electrical Characteristics of Ni-Cd/Ni-Mh Battery Timing Charge ................................. 85 Table 46: Electrical Characteristics of Li-Ion Battery Timing Charge............................................ 86 Table 47: Battery Charging Interface Pin Description .................................................................. 88 Table 48: Electrical Characteristics of the Temperature Monitoring Feature ................................ 88 Table 49: Charger Recommendations ........................................................................................ 90 Table 50: ON/~OFF Signal Pin Description ................................................................................. 92 Table 51: Electrical Characteristics of the ON/~OFF Signal ........................................................ 92 Table 52: Ton/off-hold Minimum Values ........................................................................................... 94 Table 53: Reset Signal Pin Description ....................................................................................... 97 Table 54: Electrical Characteristics of the Reset Signal .............................................................. 97 Table 55: Reset Settings ............................................................................................................ 98 Table 56: BOOT Settings ........................................................................................................... 99 Table 57: Boot Signal Pin Description ......................................................................................... 99 Table 58: BAT-RTC Pin Description ......................................................................................... 100 Table 59: Electrical Characteristics of the BAT-RTC Interface................................................... 101 Table 60: PWM/Buzzer Output Pin Description ......................................................................... 103 Table 61: Electrical Characteristics of the Buzzer Output .......................................................... 103 Table 62: External Interrupt Pin Description .............................................................................. 105 Table 63: Electrical Characteristics of the External Input/Interrupt ............................................. 105 Table 64: VCC_2V8 and VCC_1V8 Pin Description .................................................................. 107 Table 65: Electrical Characteristics of the VCC_2V8 and VCC_1V8 Signals ............................. 107 Table 66: FLASH-LED Status ................................................................................................... 108 Table 67: FLASH-LED Pin Description ..................................................................................... 108 Table 68: Electrical Characteristics of the FLASH-LED Signal .................................................. 109 Table 69: ADC Pin Description ................................................................................................. 110 Table 70: Electrical Characteristics of the ADC ......................................................................... 110 Table 71: DAC Pin Description ................................................................................................. 111 Table 72: Electrical Characteristics of the DAC ......................................................................... 111 Table 73: Power Consumption Without the Sierra Wireless Software Suite; Typical Values ...... 112 Table 74: Power Consumption With the Application CPU @ 26MHz, Typical Values................. 113 Table 75: Power Consumption With the Application CPU @ 104MHz, Typical Values ............... 114 Table 76: Recommended Equipments ...................................................................................... 117 Table 77: Operating Mode Configuration .................................................................................. 118
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 15 Product Technical Specification and Customer Design Guideline Table 78: Standards Conformity for the Q2687 Refreshed Embedded Module .......................... 120 Table 79: Applicable Standards and Requirements................................................................... 120 Table 80: Operating Class Temperature Range ........................................................................ 121 Table 81: ISO Failure Mode Severity Classification................................................................... 122 Table 82: Life Stress Tests ....................................................................................................... 122 Table 83: Environmental Resistance Stress Tests .................................................................... 123 Table 84: Corrosive Resistance Stress Tests ........................................................................... 124 Table 85: Thermal Resistance Cycle Stress Tests .................................................................... 125 Table 86: Mechanical Resistance Stress Tests ......................................................................... 126 Table 87: Handling Resistance Stress Tests ............................................................................. 128 Table 88: Contact Information of GSM Antenna Providers ........................................................ 143 Table 89: Standards Conformity for the Q2687 Refreshed Embedded Module .......................... 144 Table 90: Applicable Standards and Requirements for the Q2687 Refreshed Embedded Module ... ................................................................................................................................. 144
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 16 1. Introduction The Q2687 Refreshed Intelligent Embedded Module is a self-contained E-GSM/DCS/GSM850/PCS GPRS/EGPRS 900/1800/850/1900 quad-band embedded module. It supports the Sierra Wireless Software Suite, the world’s most comprehensive cellular development environment which allows embedded standard ANSI C applications to be natively executed directly on the embedded module. For more information about Sierra Wireless Software Suite, refer to the documents listed in section 13.2 Reference Documents. Note that this document only covers the Q2687 Refreshed Intelligent Embedded Module and does not cover the programmable capabilities available through the Sierra Wireless Software Suite. 1.1. Physical Dimensions  Length: 40 mm  Width: 32.2 mm  Thickness: 4 mm  Weight: 8g Note: The physical dimensions mentioned above do not include the shielding pins. 1.2. General Features The following table lists the Q2687 Refreshed embedded module features.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 17 Product Technical Specification and Customer Design Guideline Introduction Table 1: Q2687 Refreshed Embedded Module Features Feature Description Shielding The Q2687 Refreshed embedded module has complete body shielding. Intelligent Embedded Module Control  Full set of AT commands for GSM/GPRS/EGPRS including GSM 07.07 and 07.05 AT command sets  Status indication for GSM GSM/DCS Output Power  Class 4 (2 W) for GSM 850 and E-GSM  Class 1 (1 W) for DCS and PCS GPRS  GPRS multislot class 10  Multislot class 2 supported  PBCCH support  Coding schemes: CS1 to CS4 EGPRS  EGPRS multislot class 10  Multislot class 2 supported  PBCCH support  Coding schemes MCS5 to MCS9 Voice  GSM Voice Features with Emergency calls 118 XXX  Full Rate (FR)/ Enhanced Full Rate (EFR) / Half Rate (HR) / Adaptive Multi Rate (AMR)  Echo cancellation and noise reduction  Full duplex Hands free SMS  SMS MT, MO  SMS CB  SMS storage into SIM card GSM Supplementary Services  Call Forwarding, Call Barring  Multiparty  Call Waiting, Call Hold  USSD Data/Fax  Data circuit asynchronous, transparent, and non-transparent up to 14400 bits/s  Fax Group 3 compatible SIM Interface  1.8V/3V SIM interface  5V SIM interfaces are available with external adaptation  SIM Tool Kit Release 99 Real Time Clock Real Time Clock (RTC) with calendar and alarm
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 18 Product Technical Specification and Customer Design Guideline Introduction 1.3. GSM/GPRS/EGPRS Features  2-Watt EGSM – GPRS 900/850 radio section running under 3.6 volts  1-Watt GSM-GPRS1800/1900 radio section running under 3.6 volts  0.5-Watt EGPRS 900/850 radio section running under 3.6 volts  0.4-Watt EGPRS 1800/1900 radio section running under 3.6 volts  Hardware GSM/GPRS class 10 and EGPRS class 10 capable 1.4. Interfaces  Digital section running under 2.8V and 1.8V  3V/1V8 SIM interface  Complete Interfacing:  Power supply  Serial link  Analog audio  PCM digital audio  SIM card  Keyboard  USB 2.0 slave  Serial LCD (not available with AT commands)  Parallel port for specific applications (under Open AT® control only) 1.5. Operating System  Real Time Clock (RTC) with calendar  Battery charger  Echo cancellation + noise reduction (quadri codec)  Full GSM or GSM/GPRS/EGPRS Operating System stack
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 19 Product Technical Specification and Customer Design Guideline Introduction 1.6. Connection Interfaces The Q2687 Refreshed Intelligent Embedded Module has four external connections:  Three for RF circuit:  UFL connector  Soldered connection  Precidip connection  One for baseband signals:  100-pin I/O connector (compatible with Q2686 and Q2687 embedded modules) 1.7. Environment and Mechanics 1.7.1. RoHS Directive Compliant The Q2687 Refreshed embedded module is compliant with RoHS Directive 2002/95/EC which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”. 1.7.2. Disposing of the Product This electronic product is subject to the EU Directive 2002/96/EC for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed off at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 20 2. Functional Specifications 2.1. Functional Architecture The global architecture of the Q2687 Refreshed Embedded Module is described in the figure below. Figure 1. Functional Architecture 2.1.1. RF Functionalities The Radio Frequency (RF) functionalities of the Q2687 Refreshed embedded module complies with the Phase II EGSM 900/DCS 1800 and GSM 850/PCS 1900 recommendations. The frequency range for the transmit band and receive band are given in the table below. Table 2: List of RF Frequency Ranges RF Bandwidth Transmit Band (Tx) Receive Band (Rx) GSM 850 824 to 849 MHz 869 to 894 MHz E-GSM 900 880 to 915 MHz 925 to 960 MHz DCS 1800 1710 to 1785 MHz 1805 to 1880 MHz
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 21 Product Technical Specification and Customer Design Guideline Functional Specifications RF Bandwidth Transmit Band (Tx) Receive Band (Rx) PCS 1900 1850 to 1910 MHz 1930 to 1990 MHz The Radio Frequency (RF) component is based on a specific quad-band chip that includes the following:  Quad-band LNAs (Low Noise Amplifier)  Digital Low-IF Receiver  Offset PLL/PL (Phase Locked Loop and Polar Loop) transmitter  Frequency synthesizer  Digitally controlled crystal oscillator (DCXO)  Tx/Rx FEM (Front-End module) for quad-band GSM/GPRS/EGPRS 2.1.2. Baseband Functionalities The digital part of the Q2687 Refreshed embedded module is composed of a PCF5213 PHILIPS chip. This chipset uses a 0.18µm mixed technology CMOS, which allows massive integration as well as low current consumption. 2.2. Operating System The Q2687 Refreshed Embedded Module is Sierra Wireless Software Suite compliant. With the Sierra Wireless Software Suite, customers can embed their own applications with the Q2687 Refreshed embedded module and turn the Q2687 Refreshed embedded module into a solution for their specific market need. The operating system allows for the Q2687 Refreshed Embedded Module to be controlled by AT commands. However, some interfaces in the Q2687 Refreshed embedded module may still not be available even with AT command control as these interfaces are dependent on the peripheral devices connected to the Q2687 Refreshed embedded module.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 22 3. Technical Specifications 3.1. Power Supply The power supply is one of the key issues in the design of a GSM terminal. Due to the burst emission in GSM/GPRS, the power supply must be able to deliver high current peaks in a short time. During these peaks, the ripple (Uripp) on the supply voltage must not exceed a certain limit (refer to Table 3: Input Power Supply Voltage). Listed below are the corresponding radio burst rates in connected mode:  GSM/GPRS class 2 terminals emit 577µs radio bursts every 4.615ms (see Figure 2 Power Supply During Burst Emission)  GPRS class 10 terminals emit 1154µs radio bursts every 4.615ms In connected mode, the RF Power Amplifier current (2.0A peak in GSM /GPRS mode) flows with a ratio of:  1/8 of the time (around 577µs every 4.615ms for GSM /GPRS cl 2 – 2RX/1TX) and  2/8 of the time (around 1154µs every 4.615ms for GSM /GPRS cl 10 – 3RX/2TX) with the rising time at around 10µs. Figure 2. Power Supply During Burst Emission Only VBATT (external power supply source) input is necessary to supply the Q2687 Refreshed embedded module. VBATT also provides for the following functions:  Directly supplies the RF components with 3.6V. (Note that it is essential to keep a minimum voltage ripple at this connection in order to avoid any phase error or spectrum modulation degradation. On the other hand, insufficient power supply could dramatically affect some RF performances such as TX power, modulation spectrum, EMC performance, spurious emission and frequency error.)  Internally used to provide through several regulators, the power supplies VCC_2V8 and VCC_1V8, which are needed for the baseband signals. The Q2687 Refreshed embedded module shielding case is the grounding. The ground must be connected on the motherboard through a complete layer on the PCB. The following table describes the electrical characteristics of the input power supply voltage that will guarantee nominal functioning of the Q2687 Refreshed embedded module.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 23 Product Technical Specification and Customer Design Guideline Technical Specifications Table 3: Input Power Supply Voltage VMIN VNO M VMAX Ripple Max (Uripp) Ipeak Max VBATT 3.2V1,2 3.6V 4.8V 250mVpp (freq < 10kHz) 40mVpp (10kHz < freq < 100kHz) 5mVpp (freq > 100kHz) (TBC) 2.0A 1: This value must be guaranteed during the burst (with 2.0A Peak in GSM, GPRS or EGPRS mode) 2: Maximum operating Voltage Standing Wave Ratio (VSWR) 2:1. Figure 3. Power Supply Ripple Graph (TBC) When the Q2687 Refreshed embedded module is supplied with a battery, the total impedance (battery + protections + PCB) should be less than 150 m. Caution: When the Q2687 Refreshed embedded module is in Alarm mode or Off mode, no voltage has to be applied on any pin of the 100-pin connector except on VBATT (pins 1 to 4), BAT-RTC (pin 7) for RTC operation or ON/~OFF (pin 19) to power-ON the Q2687 Refreshed embedded module. 3.1.1. Power Supply Pin-Out Table 4: Power Supply Pin-Out Signal Pin Number VBATT 1, 2, 3, 4 GND Shielding The grounding connection is made through the shielding; therefore the four leads must be soldered to the ground plane.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 24 Product Technical Specification and Customer Design Guideline Technical Specifications 3.1.2. Start-Up Current During the initial second following Power ON, a peak of current appears. This peak of current is called “IStartup current” and has a duration of about 161ms (typical) (TBC). Figure 4: Start-up Current Waveform shows the current waveform and identifies the peak considered as the start-up current. <TBC> Figure 4. Start-up Current Waveform In this condition, we can consider the following results: Table 5: Current Start-Up (TBC) Current Peak at Ambient Temperature (25°C) VBATTmin (3.2V) VBATTtyp (3.6V) VBATTmax (4.8V) IStartup 86 mA 77 mA 64 mA 3.1.3. Decoupling of Power Supply Signals Decoupling capacitors on VBATT lines are embedded in the Q2687 Refreshed embedded module, so it should not be necessary to add decoupling capacitors close to the embedded module. However, in case of EMI/RFI problems, the VBATT signal may require some EMI/RFI decoupling – parallel 33pF capacitors close to the embedded module or a serial ferrite bead (or both to get better results). Low frequency decoupling capacitors (22µF to 100µF) can be used to reduce TDMA noise (217Hz). Caution: When ferrite beads are used, the recommendation given for the power supply connection must be carefully followed (high current capacity and low impedance). 3.2. Mechanical Specifications The Q2687 Refreshed Embedded Module has a complete self-contained shield and the mechanical specifications are shown in the figure below, which also specifies the following:  The area needed for the Q2687 Refreshed embedded module to fit in an application  The drill template for the four pads to be soldered on the application board  The dimensions and tolerance for correctly placing the 100-pin female connector on the application board It is strongly recommended to plan a free area (no components) around the Q2687 Refreshed embedded module in order to facilitate the removal/re-assembly of the embedded module on the application board. Also take note that when transmitting, the Q2687 Refreshed Embedded Module produces heat (due to the internal Power Amplifier). This heat will generate a temperature increase and may warm the application board on which the Q2687 Refreshed embedded module is soldered. This is especially true for GPRS Class 10 use in low band. The Q2687 Refreshed Embedded Module’s built-in temperature sensor can be used to monitor the temperature inside the module. For more information, refer to document [14] AirPrime Q2687 Product Technical Specification.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 25 Product Technical Specification and Customer Design Guideline Technical Specifications Figure 5. Q2687 Refreshed Embedded Module Mechanical Drawing
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 26 Product Technical Specification and Customer Design Guideline Technical Specifications Figure 6. Maximum Bulk Occupied on the Host Board
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 27 Product Technical Specification and Customer Design Guideline Technical Specifications 3.3. Firmware Upgrade The firmware upgrade process consists of downloading GSM/GPRS/EGPRS software into the corresponding internal flash memories of the Q2687 Refreshed Intelligent Embedded Module. Downloading is done through the GSM Main Serial link port (UART1) connected to a PC using the XMODEM protocol. A specific AT command, AT+WDWL, is used to start the download. For more information, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Access to the following UART1 main serial link signals are required to carry out downloading:  CT103-TXD1  CT104-RXD1  ~CT106-CTS1  ~CT105-RTS1  GND Consequently, it is very important to plan and define easy access to these signals during the hardware design of the application board. For more information about these signals, refer to section 4.7 Main Serial Link (UART1).
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 28 4. Interfaces Caution: Some of the Embedded Module interface signals are multiplexed in order to limit the number of pins but this architecture includes some restrictions. 4.1. General Purpose Connector (GPC) A 100-pin connector is provided to interface the Q2687 Refreshed Intelligent Embedded Module with a board containing either a serial or parallel LCD module; a keyboard, a SIM connector or a battery connection. The following table lists the interfaces and signals available on the GPC and specifies whether these interfaces and signals are driven by AT Command, Open AT® or both. Table 6: Available Interfaces and Signals Name Driven by AT commands Driven by Open AT® Serial Interface  Parallel Interface  Keyboard Interface   Main Serial Link   Auxiliary Serial Link   SIM Interface   General Purpose IO   Analog to Digital Converter   Analog Audio Interface   PWM / Buzzer Output   Battery Charging Interface   External Interruption   BAT-RTC (Backup Battery) LED0 signal   Digital Audio Interface (PCM)  USB 2.0 Interface  
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 29 Product Technical Specification and Customer Design Guideline Interfaces 4.1.1. Pin Description Refer to the following table for the pin description of the general purpose connector. Table 7: General Purpose Connector Pin Description Pin # Signal Name I/O Type Voltage I/O* Reset State Description Dealing with Unused Pins Nominal Mux 1 ADC0/VBATT VBATT I Power Supply 2 ADC0/VBATT VBATT I Power Supply 3 ADC0/VBATT VBATT I Power Supply 4 ADC0/VBATT VBATT I Power Supply 5 VCC_1V8 VCC_1V8 O 1.8V Supply Output NC 6 CHG-IN CHG-IN I Charger input NC 7 BAT-RTC BAT-RTC I/O RTC Battery connection NC 8 CHG-IN CHG-IN I Charger input NC 9 SIM-VCC 1V8 or 3V O SIM Power Supply 10 VCC_2V8 VCC_2V8 O 2.8V Supply Output NC 11 SIM-IO 1V8 or 3V I/O Pull-up (about 10kΩ) SIM Data 12 SIMPRES GPIO18 VCC_1V8 I Z SIM Detection NC 13 ~SIM-RST 1V8 or 3V O 0 SIM reset Output 14 SIM-CLK 1V8 or 3V O 0 SIM Clock 15 BUZZER0 Open Drain O Z Buzzer Output NC 16 BOOT VCC_1V8 I Not Used Add a test point / a jumper/ a switch to VCC_1V8 (Pin 5) in case Download Specific mode is used (See product specification for details)
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 30 Product Technical Specification and Customer Design Guideline Interfaces Pin # Signal Name I/O Type Voltage I/O* Reset State Description Dealing with Unused Pins Nominal Mux 17 LED0 Open Drain O 1 and Undefined LED0 Output NC 18 ~RESET VCC_1V8 I/O RESET Input NC or add a test point 19 ON/~OFF VBATT I ON / ~OFF Control 20 ADC1/BAT-TEMP Analog I Analog temperature Pull to GND 21 ADC2 Analog I Analog to Digital Input Pull to GND 22 GPIO31/ SPI1 Load VCC_2V8 I/O Z NC 23 SPI1-CLK GPIO28 VCC_2V8 O Z SPI1 Clock NC 24 SPI1-I GPIO30 VCC_2V8 I Z SPI1 Data Input NC 25 SPI1-IO GPIO29 VCC_2V8 I/O Z SPI1 Data Input / Output NC 26 SPI2-CLK GPIO32 VCC_2V8 O Z SPI2 Clock NC 27 SPI2-IO GPIO33 VCC_2V8 I/O Z SPI2 Data Input / Output NC 28 GPIO35/SPI2-Load VCC_2V8 I/0 Z NC 29 SPI2-I GPIO34 VCC_2V8 I Z SPI2 Data Input NC 30 CT104-RXD2 GPIO15 VCC_1V8 O Z Auxiliary RS232 Receive Add a test point for debugging 31 CT103-TXD2 GPIO14 VCC_1V8 I Z Auxiliary RS232 Transmit (TXD2) Pull-up to VCC_1V8 with 100kΩ and add a test point for debugging 32 ~CT106-CTS2 GPIO16 VCC_1V8 O Z Auxiliary RS232 Clear To Send (CTS2) Add a test point for debugging 33 ~CT105-RTS2 GPIO17 VCC_1V8 I Z Auxiliary RS232 Request To Send (RTS2) Pull-up to VCC_1V8 with 100kΩ and add a test point for debugging 34 MIC2N Analog I Micro 2 Input Negative NC 35 SPK1P Analog O Speaker 1 Output Positive NC 36 MIC2P Analog I Micro 2 Input Positive NC 37 SPK1N Analog O Speaker 1 Output Negative NC 38 MIC1N Analog I Micro 1 Input Negative NC
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 31 Product Technical Specification and Customer Design Guideline Interfaces Pin # Signal Name I/O Type Voltage I/O* Reset State Description Dealing with Unused Pins Nominal Mux 39 SPK2P Analog O Speaker 2 Output Positive NC 40 MIC1P Analog I Micro 1 Input Positive NC 41 SPK2N Analog O Speaker 2 Output Negative NC 42 A1 VCC_1V8 O Address bus 1 NC 43 GPIO0 32kHz VCC_2V8 I/O 32 kHz NC 44 SCL1 GPIO26 Open Drain O Z I²C Clock NC 45 GPIO19 VCC_2V8 I/O Z NC 46 SDA1 GPIO27 Open Drain I/O Z I²C Data NC 47 GPIO21 VCC_2V8 I/O Undefined NC 48 GPIO20 VCC_2V8 I/O Undefined NC 49 INT1 GPIO25 VCC_2V8 I Z Interruption 1 Input If INT1 is not used, it should be configured as GPIO 50 INT0 GPIO3 VCC_1V8 I Z Interruption 0 Input If INT0 is not used, it should be configured as GPIO 51 GPIO1 ** VCC_1V8 I/O Undefined NC 52 VPAD-USB VPAD-USB I USB Power supply input NC 53 GPIO2 ** VCC_1V8 I/O Undefined NC 54 USB-DP VPAD-USB I/O USB Data NC 55 GPIO23 ** VCC_2V8 I/O Z NC 56 USB-DM VPAD-USB I/O USB Data NC 57 GPIO22 ** VCC_2V8 I/O Z NC 58 GPIO24 VCC_2V8 I/O Z NC 59 COL0 GPIO4 VCC_1V8 I/O Pull-up Keypad column 0 NC 60 COL1 GPIO5 VCC_1V8 I/O Pull-up Keypad column 1 NC 61 COL2 GPIO6 VCC_1V8 I/O Pull-up Keypad column 2 NC 62 COL3 GPIO7 VCC_1V8 I/O Pull-up Keypad column 3 NC
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 32 Product Technical Specification and Customer Design Guideline Interfaces Pin # Signal Name I/O Type Voltage I/O* Reset State Description Dealing with Unused Pins Nominal Mux 63 COL4 GPIO8 VCC_1V8 I/O Pull-up Keypad column 4 NC 64 ROW4 GPIO13 VCC_1V8 I/O 0 Keypad Row 4 NC 65 ROW3 GPIO12 VCC_1V8 I/O 0 Keypad Row 3 NC 66 ROW2 GPIO11 VCC_1V8 I/O 0 Keypad Row 2 NC 67 ROW1 GPIO10 VCC_1V8 I/O 0 Keypad Row 1 NC 68 ROW0 GPIO9 VCC_1V8 I/O 0 Keypad Row 0 NC 69 ~CT125-RI GPIO42 VCC_2V8 O Undefined Main RS232 Ring Indicator NC 70 ~CT109-DCD1 GPIO43 VCC_2V8 O Undefined Main RS232 Data Carrier Detect NC 71 CT103-TXD1 GPIO36 VCC_2V8 I Z Main RS232 Transmit (TXD1) Pull-up to VCC_2V8 with 100kΩ and add a test point for firmware update 72 ~CT105-RTS1 GPIO38 VCC_2V8 I Z Main RS232 Request To Send (RTS1) Pull-up to VCC_2V8 with 100kΩ and add a test point for firmware update 73 CT104-RXD1 GPIO37 VCC_2V8 O 1 Main RS232 Receive (RXD1) Add a test point for firmware update 74 ~CT107-DSR1 GPIO40 VCC_2V8 O Z Main RS232 Data Set Ready NC 75 ~CT106-CTS1 GPIO39 VCC_2V8 O Z Main RS232 Clear To Send (CTS1) Add a test point for firmware update 76 ~CT108-2-DTR1 GPIO41 VCC_2V8 I Z Main RS232 Data Terminal Ready (DTR1) Pull-up to VCC_2V8 with 100kΩ 77 PCM-SYNC VCC_1V8 O Pull-down PCM Frame Synchro NC 78 PCM-IN VCC_1V8 I Pull-up PCM Data Input NC 79 PCM-CLK VCC_1V8 O Pull-down PCM Clock NC 80 PCM-OUT VCC_1V8 O Pull-up PCM Data Output NC 81 /OE-R/W VCC_1V8 O Output Enable/ Read not write NC 82 DAC0 Analog O Digital to Analog Output NC 83 /CS3 VCC_1V8 O Chip Select 3 NC 84 /WE-E VCC_1V8 O Write Enable NC 85 D0 VCC_1V8 I/O Data for Peripheral NC
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 33 Product Technical Specification and Customer Design Guideline Interfaces Pin # Signal Name I/O Type Voltage I/O* Reset State Description Dealing with Unused Pins Nominal Mux 86 D15 VCC_1V8 I/O Data for Peripheral NC 87 D1 VCC_1V8 I/O Data for Peripheral NC 88 D14 VCC_1V8 I/O Data for Peripheral NC 89 D2 VCC_1V8 I/O Data for Peripheral NC 90 D13 VCC_1V8 I/O Data for Peripheral NC 91 D3 VCC_1V8 I/O Data for Peripheral NC 92 D12 VCC_1V8 I/O Data for Peripheral NC 93 D4 VCC_1V8 I/O Data for Peripheral NC 94 D11 VCC_1V8 I/O Data for Peripheral NC 95 D5 VCC_1V8 I/O Data for Peripheral NC 96 D10 VCC_1V8 I/O Data for Peripheral NC 97 D6 VCC_1V8 I/O Data for Peripheral NC 98 D9 VCC_1V8 I/O Data for Peripheral NC 99 D7 VCC_1V8 I/O Data for Peripheral NC 100 D8 VCC_1V8 I/O Data for Peripheral NC * The I/O direction information is only for the nominal signal. When the signal is configured in GPIO, it can always be an Input or an Output. ** For more information about multiplexing these signals, refer to section 4.3 General Purpose Input/Output. Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 34 Product Technical Specification and Customer Design Guideline Interfaces 4.1.2. Pin Out Differences Although the Q Series Embedded Modules are compatible, one must be careful with regards to their specific signal differences. The following table enumerates the pin out differences between the Q2686, Q2687 and the Q2687 Refreshed embedded modules. Table 8: Signal Comparison between the Q Series Intelligent Embedded Modules Pin # Q2686 Q2687 Q2687 Refreshed Signal Name Function Value Signal Name Function Value Signal Name Function Value 42 Reserved Not in Use - A1 Address Bus 1V8 A1 Address Bus 1V8 51 GPIO1 General Purpose IO 1V8 CS2 /A25 /GPIO1 Chip Select, Address bus, General Purpose IO 1V8 CS2 /A25 /GPIO1 Chip Select, Address bus, General Purpose IO 1V8 53 GPIO2 General Purpose IO 1V8 A24 / GPIO2 Address bus, General Purpose IO 1V8 A24 / GPIO2 Address bus, General Purpose IO 1V8 83 NC-5 Not Connected - /CS3 Chip Select 3 1V8 /CS3 Chip Select 3 1V8 81, 84-100 NC Not Connected - Parallel Interface Parallel Bus Interface 1V8 Parallel Interface Parallel Bus Interface 1V8
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 35 Product Technical Specification and Customer Design Guideline Interfaces 4.2. Electrical Information for Digital I/O There are three types of digital I/Os on the Q2687 Refreshed Embedded Module:  2.8 volt CMOS  1.8 volt CMOS  Open drain Refer to the tables below for the electrical characteristics of these three digital I/Os. Table 9: Electrical Characteristic of a 2.8 Volt Type (2V8) Digital I/O Parameter I/O Type Minimum Typical Maximum Condition Internal 2.8V power supply VCC_2V8 2.74V 2.8V 2.86V Input / Output Pin VIL CMOS -0.5V* 0.84V VIH CMOS 1.96V 3.2V* VOL CMOS 0.4V IOL = - 4 mA VOH CMOS 2.4V IOH = 4 mA IOH 4mA IOL - 4mA * Absolute maximum ratings All 2.8V I/O pins do not accept input signal voltages above the maximum voltage specified above; except for the UART1 interface, which is 3.3V tolerant. Table 10: Electrical Characteristic of a 1.8 Volt Type (1V8) Digital I/O Parameter I/O Type Minimum Typical Maximum Condition Internal 1.8V power supply VCC_1V8 1.76V 1.8V 1.94V Input / Output Pin VIL CMOS -0.5V* 0.54V VIH CMOS 1.33V 2.2V* VOL CMOS 0.4V IOL = - 4 mA VOH CMOS 1.4V IOH = 4 mA IOH 4mA IOL - 4mA * Absolute maximum ratings Table 11: Open Drain Output Type Signal Name Parameter I/O Type Minimum Typical Maximum Condition LED0 VOL Open Drain 0.4V IOL Open Drain 8mA BUZZER0 VOL Open Drain 0.4V IOL Open Drain 100mA SDA1 / GPIO27 and SCL1 / GPIO26 VTOL Open Drain 3.3V Tolerated voltage VIH Open Drain 2V VIL Open Drain 0.8V VOL Open Drain 0.4V
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 36 Product Technical Specification and Customer Design Guideline Interfaces Signal Name Parameter I/O Type Minimum Typical Maximum Condition IOL Open Drain 3mA The reset states of the I/Os are given in each interface description chapter. Definitions of these states are given in the table below. Table 12: Reset State Definition Parameter Definition 0 Set to GND 1 Set to supply 1V8 or 2V8 depending on I/O type Pull-down Internal pull-down with ~60kΩ resistor Pull-up Internal pull-up with ~60kΩ resistor to supply 1V8 or 2V8 depending on I/O type Z High impedance Undefined Caution: Undefined must not be used in an application if a special state is required at reset. These pins may be toggling a signal(s) during reset.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 37 Product Technical Specification and Customer Design Guideline Interfaces 4.3. General Purpose Input/Output The Q2687 Refreshed Embedded Module provides up to 44 General Purpose I/O. They are used to control any external device such as a LCD or a Keyboard backlight. 4.3.1. Pin Description Refer to the following table for the pin description of the general purpose input/output interface. Table 13: GPIO Pin Description Pin Number Signal I/O I/O Type Reset State Multiplexed With 43 GPIO0 I/O 2V8 Undefined 32kHz*** 51 GPIO1 I/O 1V8 Undefined A25/~CS2* 53 GPIO2 I/O 1V8 Undefined A24* 50 GPIO3 I/O 1V8 Z INT0 59 GPIO4 I/O 1V8 Pull up COL0 60 GPIO5 I/O 1V8 Pull up COL1 61 GPIO6 I/O 1V8 Pull up COL2 62 GPIO7 I/O 1V8 Pull up COL3 63 GPIO8 I/O 1V8 Pull up COL4 68 GPIO9 I/O 1V8 0 ROW0 67 GPIO10 I/O 1V8 0 ROW1 66 GPIO11 I/O 1V8 0 ROW2 65 GPIO12 I/O 1V8 0 ROW3 64 GPIO13 I/O 1V8 0 ROW4 31 GPIO14 I/O 1V8 Z CT103 / TXD2 30 GPIO15 I/O 1V8 Z CT104 / RXD2 32 GPIO16 I/O 1V8 Z ~CT106 / CTS2 33 GPIO17 I/O 1V8 Z ~CT105 / RTS2 12 GPIO18 I/O 1V8 Z SIMPRES 45 GPIO19 I/O 2V8 Z Not mux 48 GPIO20 I/O 2V8 Undefined Not mux 47 GPIO21 I/O 2V8 Undefined Not mux 57 GPIO22 I/O 2V8 Z Not mux** 55 GPIO23 I/O 2V8 Z Not mux** 58 GPIO24 I/O 2V8 Z Not mux 49 GPIO25 I/O 2V8 Z INT1 44 GPIO26 I/O Open drain Z SCL1 46 GPIO27 I/O Open drain Z SDA1 23 GPIO28 I/O 2V8 Z SPI1-CLK 25 GPIO29 I/O 2V8 Z SPI1-IO 24 GPIO30 I/O 2V8 Z SPI1-I 22 GPIO31 I/O 2V8 Z
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 38 Product Technical Specification and Customer Design Guideline Interfaces Pin Number Signal I/O I/O Type Reset State Multiplexed With 26 GPIO32 I/O 2V8 Z SPI2-CLK 27 GPIO33 I/O 2V8 Z SPI2-IO 29 GPIO34 I/O 2V8 Z SPI2-I 28 GPIO35 I/O 2V8 Z 71 GPIO36 I/O 2V8 Z CT103 / TXD1 73 GPIO37 I/O 2V8 1 CT104 / RXD1 72 GPIO38 I/O 2V8 Z ~CT105 / RTS1 75 GPIO39 I/O 2V8 Z ~CT106 / CTS1 74 GPIO40 I/O 2V8 Z ~CT107 / DSR1 76 GPIO41 I/O 2V8 Z ~CT108-2 / DTR1 69 GPIO42 I/O 2V8 Undefined ~CT125 / RI1 70 GPIO43 I/O 2V8 Undefined ~CT109 / DCD1 * If the parallel bus is used, these pins will be mandatory for the parallel bus functionality. Refer to section 4.5 Parallel Interface. ** If a Bluetooth module is used with the Q2687 Refreshed Embedded Module, this GPIO must be reserved. *** With the Sierra Wireless Software Suite 2. For more details, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 39 Product Technical Specification and Customer Design Guideline Interfaces 4.4. Serial Interface The Q2687 Refreshed Embedded Module may be connected to an LCD module driver through either the two SPI buses (3 or 4-wire interface) or through the I2C bus (2-wire interface). 4.4.1. SPI Bus Both SPI bus interfaces include:  A CLK signal (SPIx-CLK)  An I/O signal (SPIx-IO)  An I signal (SPIx-I)  A CS (Chip Select) signal complying with the standard SPI bus (any GPIO) (~SPIx-CS)  An optional Load signal (only the SPIx-LOAD signal) 4.4.1.1. Characteristics The following lists the features available on the SPI bus.  Master mode operation  The CS signal must be any GPIO  The LOAD signal (optional) is used for word handling mode (only the SPIx-LOAD signal)  SPI speed is from 102Kbit/s to 13Mbit/s in master mode operation  3 or 4-wire interface (5-wire interface is possible with the optional SPIx-LOAD signal)  SPI-mode configuration: 0 to 3 (for more details, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33))  1 to 16 bits data length 4.4.1.2. SPI Configuration Table 14: SPI Bus Configuration Operation Maximum Speed SPI-Mode Duplex 3-wire Type 4-wire Type 5-wire Type Master 13 Mb/s 0,1,2,3 Half SPIx-CLK; SPIx-IO; GPIOx as CS SPIx-CLK; SPIx-IO; SPIx-I; GPIOx as CS SPIx-CLK; SPIx-IO; SPIx-I; GPIOx as CS; SPIx-LOAD (not muxed in GPIO) Refer to section 4.4.1.6 Application for more information on the signals used and their corresponding configurations.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 40 Product Technical Specification and Customer Design Guideline Interfaces 4.4.1.3. SPI Waveforms The figure below shows the waveforms for SPI transfers with a 4-wire configuration in master mode 0. Figure 7. SPI Timing Diagram (Mode 0, Master, 4 wires) Table 15: SPI Bus AC Characteristics Signal Description Minimum Typical Maximum Unit CLK-cycle SPI clock frequency 0.102 13 MHz Data-OUT delay Data out ready delay time 10 ns Data-IN-setup Data in setup time 2 ns Data-OUT-hold Data out hold time 2 ns
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 41 Product Technical Specification and Customer Design Guideline Interfaces The following figure shows the waveform for SPI transfer with the LOAD signal configuration in master mode 0 (chip select is not represented). Figure 8. SPI Timing Diagram with LOAD Signal (Mode 0, Master, 4 wires) 4.4.1.4. SPI1 Pin Description Refer to the following table for the SPI1 pin description. Table 16: SPI1 Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 22 SPI1-LOAD O 2V8 Z SPI load GPIO31 23 SPI1-CLK O 2V8 Z SPI Serial Clock GPIO28 24 SPI1-I I 2V8 Z SPI Serial input GPIO30 25 SPI1-IO I/O 2V8 Z SPI Serial input/output GPIO29 Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 4.4.1.5. SPI2 Pin Description Refer to the following table for the SPI2 pin description. Table 17: SPI2 Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 26 SPI2-CLK O 2V8 Z SPI Serial Clock GPIO32 27 SPI2-IO I/O 2V8 Z SPI Serial input/output GPIO33 28 SPI2-LOAD O 2V8 Z SPI load GPIO35 29 SPI2-I I 2V8 Z SPI Serial input GPIO34
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 42 Product Technical Specification and Customer Design Guideline Interfaces Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 4.4.1.6. Application 4.4.1.6.1. 3-wire Application For the 3-wire configuration, only the SPIx-I/O is used as both input and output. Figure 9. Example of a 3-wire SPI Bus Application The SPIx-I line is not used in a 3-wire configuration. Instead, this can be left open or used as a GPIO for other application functionality. One pull-up resistor, R1, is needed to set the SPIx-CS level during the reset state. Except for R1, no other external component is needed is the electrical specifications of the customer application comply with the Q2687 Refreshed embedded module interface electrical specifications. Note that the value of R1 depends on the peripheral plugged to the SPIx interface. 4.4.1.6.2. 4-wire Application For the 4-wire configuration, the input and output data lines are dissociated. SPIx-I/O is used as output only and SPIx-I is used as input only. Figure 10. Example of a 4-wire SPI Bus Application One pull-up resistor, R1, is needed to set the SPIx-CS level during the reset state. Except for R1, no other external component is needed if the electrical specifications of the customer application comply with the Q2687 Refreshed embedded module SPIx interface electrical specifications.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 43 Product Technical Specification and Customer Design Guideline Interfaces 4.4.1.6.3. 5-wire Application For the 5-wire configuration, SPIx-I/O is used as output only and SPIx-I is used as input only. The dedicated SPIx-LOAD signal is also used. This is an additional signal in more than a Chip Select (any other GPIOx). 4.4.2. I2C Bus The I2C Bus interface includes a CLK signal (SCL1) and a data signal (SDA1) complying with a 100kbit/s-standard interface (standard mode: s-mode). The I2C bus is always in master mode operation. The maximum speed transfer is 400Kbit/s (fast mode: f-mode). For more information on the I2C bus, see document [21] “I2C Bus Specification”, Version 2.0, Philips Semiconductor 1998. 4.4.2.1. I2C Waveforms The figure below shows the I2C bus waveform in master mode configuration. Figure 11. I2C Timing Diagram (master) Table 18: I2C AC Characteristics Signal Description Minimum Typical Maximum Unit SCL1-freq I²C clock frequency 100 400 kHz T-start Hold time START condition 0.6 µs T-stop Setup time STOP condition 0.6 µs T-free Bus free time, STOP to START 1.3 µs T-high High period for clock 0.6 µs T-data-hold Data hold time 0 0.9 µs T-data-setup Data setup time 100 ns
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 44 Product Technical Specification and Customer Design Guideline Interfaces 4.4.2.2. I2C Pin Description Refer to the following table for the I2C pin description. Table 19: I2C Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 44 SCL1 O Open drain Z Serial Clock GPIO26 46 SDA1 I/O Open drain Z Serial Data GPIO27 Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 4.4.2.3. Application Figure 12. Example1 of an I2C Bus Application The two lines, SCL1 and SDA1, both need to be pulled-up to the VI2C voltage. Although the VI2C voltage is dependent on the customer application component connected to the I2C bus, it must comply with the Q2687 Refreshed embedded module electrical specifications. The VCC_2V8 (pin 10) of the Q2687 Refreshed embedded module can be used to connect the pull-up resistors if the I2C bus voltage is 2.8V. Figure 13. Example2 of an I2C Bus Application The I2C bus complies with both the standard mode (baud rate = 100Kbit/s) and the fast mode (baud rate = 400Kbit/s). The value of the pull up resistors varies depending on the mode used. When using Fast mode, it is recommended to use 1KΩ resistors to ensure compliance with the I2C specifications. When using Standard mode, a higher resistance value can be used to save power consumption.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 45 Product Technical Specification and Customer Design Guideline Interfaces 4.5. Parallel Interface The Q2687 Refreshed Intelligent Embedded Module may be connected to a NAND memory through the 16-bit 1.8V parallel bus interface. The VCC_1V8 (pin 5) of the Q2687 Refreshed embedded module can be used to supply the power to this interface. The following lists the features available on the parallel interface.  Up to 128MB address range per chip select (CSand 3CS)  Support for 8, 16, and 32 bit (multiplexed synchronous mode) devices  Byte enabled signals for 16 bit and 32 bit operations  Fully programmable timings based on AHB (a division of the ARM clock at 26 MHz ) cycles (except for synchronous mode which is based on CLKBURST cycles at 26 MHz only):  individually selectable timings for read and write  0 to 7 clock cycles for setup  1 to 32 clock cycles for access cycle  1 to 8 clock cycles for page access cycle  0 to 7 clock cycles for hold  1 to 15 clock cycles for turnaround  Page mode Flash memory support  page size of 4, 8, 16 or 32  Burst mode Flash memory support up to AHB (26 MHz) clock frequency (for devices sensitive to rising edge of the clock only)  AHB, AHB/2, AHB/4 or AHB/8 burst clock output  burst size of 4, 8, 16, 32  automatic CLKBURST power-down between accesses  Intel mode (WE and OE) and Motorola mode (E and /RW) control signals  Synchronous write mode  Synchronous multiplexed data/address mode (x32 mode)  Adaptation to word, half word, and byte accesses to the external devices 4.5.1. Pin Description Refer to the following table for the pin description of the Parallel Interface. Table 20: Parallel Interface Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 42 A1 O 1V8 1 This signal has 2 functions: external Address or byte enable 2 for 16 or 32 bits devices. Another name is used: A1_BE2 Not mux 51 /CS2 I/O 1V8 Undefined User Chip Select 2 A25/GPIO1 53 A24 I/O 1V8 Undefined Address line for external device/Command selection GPIO2 81 /OE-R/W O 1V8 1 Output enable signal (Intel mode); read not write signal (Motorola mode) Not mux
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 46 Product Technical Specification and Customer Design Guideline Interfaces Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 83 /CS3 O 1V8 1 User Chip select 3 Not mux 84 /WE-E O 1V8 1 Write enable Signal (Intel mode) enable signal (Motorola mode) Not mux 85 D0 I/O 1V8 Pull down Bidirectional data and address line Not mux 86 D15 I/O 1V8 Pull down Bidirectional data and address line Not mux 87 D1 I/O 1V8 Pull down Bidirectional data and address line Not mux 88 D14 I/O 1V8 Pull down Bidirectional data and address line Not mux 89 D2 I/O 1V8 Pull down Bidirectional data and address line Not mux 90 D13 I/O 1V8 Pull down Bidirectional data and address line Not mux 91 D3 I/O 1V8 Pull down Bidirectional data and address line Not mux 92 D12 I/O 1V8 Pull down Bidirectional data and address line Not mux 93 D4 I/O 1V8 Pull down Bidirectional data and address line Not mux 94 D11 I/O 1V8 Pull down Bidirectional data and address line Not mux 95 D5 I/O 1V8 Pull down Bidirectional data and address line Not mux 96 D10 I/O 1V8 Pull down Bidirectional data and address line Not mux 97 D6 I/O 1V8 Pull down Bidirectional data and address line Not mux 98 D9 I/O 1V8 Pull down Bidirectional data and address line Not mux 99 D7 I/O 1V8 Pull down Bidirectional data and address line Not mux 100 D8 I/O 1V8 Pull down Bidirectional data and address line Not mux Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 4.5.2. Electrical Characteristics 4.5.3. Asynchronous Access For all timing diagrams in the following section, the notations hereafter are used:  ADR is used for address bus A24, A1 or D[15:0] when used as address lines  DATA is used for D[15:0] when used as DATA lines  CS is used for 2CS or 3CS  BE is used for A1_2BE (Double function on A1 pin)  OEand R/W are used for OE_/RW  WE and E are used for WE_E  ADV signal (not available on 100-pin connector) is the address valid signal
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 47 Product Technical Specification and Customer Design Guideline Interfaces Figure 14. Asynchronous Access The ADV signal is mentioned here because synchronous mode devices may require the signal to be asserted when an asynchronous access is performed. Refer to the table below for the AC characteristics of asynchronous accesses. Table 21: AC Characteristics of Asynchronous Accesses Signal Description Minimum Typical Maximum Unit TADR_DELAY ADR delay time from CSactive 3 ns TDATA_SETUP DATA to OE setup time 18 ns TDATA_HOLD DATA hold time after OE inactive 3 4 ns TDATA_DELAY DATA delay time from CS active 5 ns TDATA_SECURE DATA hold time after WE inactive or CS inactive -5[1] ns TADV_DELAY ADV delay time from CSactive and inactive 3 ns TWE_DELAY WE delay time from CS active 3[2] ns
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 48 Product Technical Specification and Customer Design Guideline Interfaces Signal Description Minimum Typical Maximum Unit TOE_DELAY OEdelay time from CS active 3[2] ns TBE_DELAY BE delay time from CS active 3 ns [1] This timing forces to program at least one cycle for asynchronous [2] These maximum delays also depends on the setting of registers 4.5.4. Synchronous Access For all timing diagrams in the following section, the notations hereafter are used:  ADR is used for address bus as A24, A1 or D[15:0] when used as address lines  DATA is used for D[15:0] when used as data lines  CS is used for 2CS or 3CS  BE is used for A1_2BE (Double function on A1 pin)  OEand R/W are used for OE_/RW  WE and E are used for WE_E  CLKBURST is the internal clock at 26MHz (not available on connector pin-out)  ADV signal (not available on 100-pin connector) is the address valid signal  BAA signal (not available on 100-pin connector) is the burst address advance for synchronous operations  WAIT signal (not available on 100-pin connector) is the wait signal for synchronous operation
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 49 Product Technical Specification and Customer Design Guideline Interfaces Figure 15. Synchronous Access Figure 16. Read Synchronous Timing
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 50 Product Technical Specification and Customer Design Guideline Interfaces Figure 17. Write Synchronous Timing Refer to the table below for the AC characteristics of the synchronous accesses. Table 22: AC Characteristics of Synchronous Accesses Signal Description Minimum Typical Maximum Unit TDATA_DELAY CLKBURTS falling edge to DATA valid delay 4 ns TWE_SETUP WE to CLKBURST setup time 7 ns TBE_DELAY CLKBURST falling edge to BE delay 4 ns TCLKBURST CLKBURST clock : period time 38.4 ns TADR_SETUP Address bus setup time 7 ns TADR_HOLD Address bus hold time 19 ns TADR_TRISTATE Address bus tristate time 10 ns TDATA_SETUP Data bus setup time 5 ns TDATA_HOLD Data bus hold time 3 ns TCS_SETUP Chip select setup time 7 ns TADV_SETUP ADV setup time 7 ns TADV_HOLD ADV hold time 7 ns TOE_DELAY Output Enable delay time 13 TBAA_DELAY BAA delay time 13 ns TWAIT_SETUP Wait setup time 5 ns
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 51 Product Technical Specification and Customer Design Guideline Interfaces Signal Description Minimum Typical Maximum Unit TWAIT_HOLD Wait hold time 5 ns 4.5.5. Additional Information Regarding Address Size Bus The following table establishes the possible configurations depending on address bus size requested on parallel interface. Table 23: Address Bus Size Details Address Bus Size Address Lines Chip Select Available Notes 1 A1 /CS2, /CS3 2 A1, A24 /CS2, /CS3 3 A1, A24, A25 /CS3 A25 is multiplexed with /CS2 Note that some signals are multiplexed. It is thus possible to have the following configurations:  CS3*, A1, GPIO1, GPIO2  CS3*, A1, A24, GPIO1  CS3*, A1, A24, A25;  CS3*, CS2*, A1, GPIO2  CS3*, CS2*, A1, A24 4.5.6. Application Figure 18. Example of a Parallel Bus Application (NAND Memory) When interfaced with a NAND memory, VCC_1V8 (pin 5) can be used to supply the power to the NAND.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 52 Product Technical Specification and Customer Design Guideline Interfaces 4.6. Keyboard Interface This interface provides 10 connections:  5 rows (ROW0 to ROW4) and  5 columns (COL0 to COL4) Scanning is digital and debouncing is performed in the Q2687 Refreshed Embedded Module. No discreet components like resistors or capacitors are needed when using this interface. The keyboard scanner is equipped with the following:  Internal pull-down resistors for the rows  Pull-up resistors for the columns Note that current only flows from the column pins to the row pins. This allows transistors to be used in place of the switch for power-on functions. 4.6.1. Pin Description Refer to the following table for the pin description of the keyboard interface. Table 24: Keyboard Interface Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 59 COL0 I/O 1V8 Pull-up Column scan GPIO4 60 COL1 I/O 1V8 Pull-up Column scan GPIO5 61 COL2 I/O 1V8 Pull-up Column scan GPIO6 62 COL3 I/O 1V8 Pull-up Column scan GPIO7 63 COL4 I/O 1V8 Pull-up Column scan GPIO8 64 ROW4 I/O 1V8 0 Row scan GPIO13 65 ROW3 I/O 1V8 0 Row scan GPIO12 66 ROW2 I/O 1V8 0 Row scan GPIO11 67 ROW1 I/O 1V8 0 Row scan GPIO10 68 ROW0 I/O 1V8 0 Row scan GPIO9 Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. With the Sierra Wireless Software Suite 2, when the keyboard service is used, the set of multiplexed signals becomes unavailable for any other purpose. In the same way, if one or more GPIOs (from the table above) are allocated elsewhere, the keyboard service becomes unavailable.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 53 Product Technical Specification and Customer Design Guideline Interfaces 4.6.2. Application Figure 19. Example of a Keyboard Implementation
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 54 Product Technical Specification and Customer Design Guideline Interfaces 4.7. Main Serial Link (UART1) The main serial link (UART1) is used for communication between the Q2687 Refreshed embedded module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with V24 protocol signalling, but not with the V28 (electrical interface) due to its 2.8V interface. To get a V24/V28 (i.e. RS-232) interface, an RS-232 level shifter device is required as described in section 4.7.2 Level Shifter Implementation. The signals used by UART1 are as follows:  TX data (CT103/TXD1)  RX data (CT104/RXD1)  Request To Send (~CT105/RTS1)  Clear To Send (~CT106/CTS1)  Data Terminal Ready (~CT108-2/DTR1)  Data Set Ready (~CT107/DSR1)  Data Carrier Detect (~CT109/DCD1)  Ring Indicator (CT125/RI1) 4.7.1. Pin Description Refer to the following table for the pin description of the UART1 interface. Table 25: UART1 Pin Description Pin Number Signal* I/O I/O Type Reset State Description Multiplexed With 69 ~CT125/RI1 O 2V8 Undefined Ring Indicator GPIO42 70 ~CT109/DCD1 O 2V8 Undefined Data Carrier Detect GPIO43 71 CT103/TXD1 I 2V8 Z Transmit serial data GPIO36 72 ~CT105/RTS1 I 2V8 Z Request To Send GPIO38 73 CT104/RXD1 O 2V8 1 Receive serial data GPIO37 74 ~CT107/DSR1 O 2V8 Z Data Set Ready GPIO40 75 ~CT106/CTS1 O 2V8 Z Clear To Send GPIO39 76 ~CT108-2/DTR1 I 2V8 Z Data Terminal Ready GPIO41 Shielding leads CT102/GND GND Ground * According to PC view Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. With the Sierra Wireless Software Suite 2, when the UART1 service is used, the set of multiplexed signals becomes unavailable for any other purpose. In the same way, if one or more GPIOs (from the table above) are allocated elsewhere, the UART1 service becomes unavailable. The maximum baud rate of UART1 is 921kbit/s with the Sierra Wireless Software Suite 2.33. The rise and fall times of the reception signals (mainly CT103/TXD1) must be less than 300ns. The UART1 interface is 2.8V type, but it is 3V tolerant.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 55 Product Technical Specification and Customer Design Guideline Interfaces Tip: The Q2687 Refreshed embedded module is designed to operate using all the serial interface signals and it is recommended to use ~CT105/RTS1 and ~CT106/CTS1 for hardware flow control in order to avoid data corruption or loss during transmissions. 4.7.2. Level Shifter Implementation The level shifter must be a 2.8V with V28 electrical signal compliance. Figure 20. Example of an RS-232 Level Shifter Implementation for UART1 Note: The U1 chip also protects the Q2687 Refreshed embedded module against ESD at 15KV (air discharge). 4.7.2.1. Recommended Components  R1, R2 :15KΩ  C1, C2, C3, C4, C5 :1uF  C6 :100nF  C7 :6.8uF TANTAL 10V CP32136 AVX  U1 :ADM3307EACP ANALOG DEVICES  J1 :SUB-D9 female R1 and R2 are only necessary during the Reset state to force the ~CT1125-RI1 and ~CT109-DCD1 signals to HIGH level. The ADM3307EACP chip is able to speed up to 921Kb/s. If others level shifters are used, ensure that their speeds are compliant with the UART1 speed. The ADM3307EACP can be powered by the VCC_2V8 (pin 10) of the Q2687 Refreshed embedded module or by an external regulator at 2.8 V. If the UART1 interface is connected directly to a host processor, it is not necessary to use level shifters. The interface can be connected as defined in the following sub-section.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 56 Product Technical Specification and Customer Design Guideline Interfaces 4.7.3. V24/CMOS Possible Designs Figure 21. Example of V24/CMOS Serial Link Implementation for UART1 Note that the design presented above is a basic one and that a more flexible design to access the serial link with all modem signals is presented below. Figure 22. Example of a Full Modem V24/CMOS Serial Link Implementation for UART1 It is recommended to add a 15kΩ pull-up resistor on the ~CT125-RI1 and ~CT109-DCD1 signals to set them to HIGH level during the reset state. Caution: In case the Power Down mode (Wavecom 32K mode) is to be activated using the Sierra Wireless Software Suite, the DTR pin must be wired to a GPIO. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information regarding using the Sierra Wireless Software Suite to activate Wavecom 32K mode.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 57 Product Technical Specification and Customer Design Guideline Interfaces 4.7.4. 5-wire Serial Interface The signals used in this interface are as follows:  CT103/TXD1  CT104/RXD1  ~CT105/RTS1  ~CT106/CTS1  ~CT108-2/DTR1 The signal ~CT108-2/DTR1* must be managed following the V24 protocol signaling if slow (or fast) idle mode is to be used. The other signals and their multiplexed GPIOs are not available. Refer to the technical appendixes of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information. 4.7.5. 4-wire Serial Interface The signals used in this interface are as follows:  CT103/TXD1  CT104/RXD1  ~CT105/RTS1  ~CT106/CTS1 The signal ~CT108-2/DTR1* must be configured from low level. The other signals and their multiplexed GPIOs are not available. Refer to the technical appendixes of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information. 4.7.6. 2-wire Serial Interface Caution: Although this case is possible for a connected external chip, it is not recommended (and forbidden for AT command or modem use). The flow control mechanism has to be managed from the customer side. The signals used in this interface are as follows:  CT103/TXD1  CT104/RXD1 Signals ~CT108-2/DTR1 and ~CT105/RTS1 must be configured from low level. Signals ~CT105/RTS1 and ~CT106/CTS1 are not used; default hardware flow control on UART1 should be de-activated using AT command AT+IFC=0,0. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). The other signals and their multiplexed GPIOs are not available. Refer to the technical appendixes of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 58 Product Technical Specification and Customer Design Guideline Interfaces 4.8. Auxiliary Serial Link (UART2) The auxiliary serial link (UART2) is used for communications between the Q2687 Refreshed embedded module and external devices. It consists of a flexible 4-wire serial interface that complies with V24 protocol signaling, but not with the V28 (electrical interface) due to its 1.8V interface. To get a V24/V28 (i.e. RS-232) interface, an RS-232 level shifter device is required as described in section 4.8.2 Level Shifter Implementation. Refer to documents [20] Bluetooth Interface Application Note and [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information about the Bluetooth application on the auxiliary serial interface (UART2). The signals used by UART1 are as follows:  TX data (CT103/TXD2)  RX data (CT104/RXD2)  Request To Send (~CT105/RTS2)  Clear To Send (~CT106/CTS2) 4.8.1. Pin Description Refer to the following table for the pin description of the UART2 interface. Table 26: UART2 Pin Description Pin Number Signal* I/O I/O Type Reset State Description Multiplexed With 30 CT104/RXD2 O 1V8 Z Receive serial data GPIO15 31 CT103/TXD2 I 1V8 Z Transmit serial data GPIO14 32 ~CT106/CTS2 O 1V8 Z Clear To Send GPIO16 33 ~CT105/RTS2 I 1V8 Z Request To Send GPIO17 * According to PC view Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. The maximum baud rate of UART2 is 921kbit/s with the Sierra Wireless Software Suite 2.33. Tip: The Q2687 Refreshed embedded module is designed to operate using all the serial interface signals and it is recommended to use ~CT105/RTS2 and ~CT106/CTS2 for hardware flow control in order to avoid data corruption during transmissions.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 59 Product Technical Specification and Customer Design Guideline Interfaces 4.8.2. Level Shifter Implementation The voltage level shifter must be a 1.8V with V28 electrical signal compliance. Figure 23. Example of RS-232 Level Shifter Implementation for UART2 4.8.2.1. Recommended Components  Capacitors  C1 :220nF  C2, C3, C4 :1µF  Inductor  L1 :10µH  RS-232 Transceiver  U1 :LINEAR TECHNOLOGY LTC® 2804IGN  J1 :SUB-D9 female The LTC2804 can be powered by the VCC_1V8 (pin 5) of the Q2687 Refreshed embedded module or by an external regulator at 1.8 V. The UART2 interface can be connected directly to others components if the voltage interface is 1.8V.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 60 Product Technical Specification and Customer Design Guideline Interfaces 4.8.3. 4-wire Serial Interface The signals used in this interface are as follows:  CT103/TXD2  CT104/RXD2  ~CT105/RTS2  ~CT106/CTS2 The other signals and their multiplexed GPIOs are not available. Refer to the technical appendixes of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information. 4.8.4. 2-wire Serial Interface Caution: Although this case is possible for a connected external chip, it is not recommended (and forbidden for AT command or modem use). The flow control mechanism has to be managed from the customer side. The signals used in this interface are as follows:  CT103/TXD2  CT104/RXD2 Signals ~CT105/RTS2 and ~CT106/CTS2 are not used; default hardware flow control on UART2 should be de-activated using AT command AT+IFC=0,0. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). The signal ~CT105/RTS2* must be configured from low level. The other signals and their multiplexed GPIOs are not available. Refer to the technical appendixes of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 61 Product Technical Specification and Customer Design Guideline Interfaces 4.9. SIM Interface The Subscriber Identification Module (SIM) may be directly connected to the Q2687 Refreshed embedded module via this dedicated interface. This interface controls either a 3V or a 1V8 SIM and it is fully compliant with GSM 11.11 recommendations concerning SIM functions. The five signals used by this interface are as follows:  SIM-VCC: SIM power supply  ~SIM-RST: reset  SIM-CLK: clock  SIM-IO: I/O port  SIMPRES: SIM card detect 4.9.1. Pin Description Refer to the following table for the pin description of the SIM interface. Table 27: SIM Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 9 SIM-VCC O 2V9 / 1V8 SIM Power Supply Not mux 11 SIM-IO I/O 2V9 / 1V8 *Pull-up SIM Data Not mux 12 SIMPRES I 1V8 Z SIM Card Detect GPIO18 13 ~SIM-RST O 2V9 / 1V8 0 SIM Reset Not mux 14 SIM-CLK O 2V9 / 1V8 0 SIM Clock Not mux * SIM-IO pull-up is about 10kΩ. Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 4.9.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the SIM interface. Table 28: Electrical Characteristics of the SIM Interface Parameter Conditions Minimum Typical Maximum Unit SIM-IO VIH IIH = ± 20µA 0.7xSIMVCC V SIM-IO VIL IIL = 1mA 0.4 V ~SIM-RST, SIM-CLK VOH Source current = 20µA 0.9xSIMVCC V SIM-IO VOH Source current = 20µA 0.8xSIMVCC ~SIM-RST, SIM-IO, SIM-CLK VOL Sink current = -200µA 0.4 V SIM-VCC Output Voltage SIMVCC = 2.9V IVCC= 1mA 2.84 2.9 2.96 V
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 62 Product Technical Specification and Customer Design Guideline Interfaces Parameter Conditions Minimum Typical Maximum Unit SIMVCC = 1.8V IVCC= 1mA 1.74 1.8 1.86 V SIM-VCC current VBATT = 3.6V 10 mA SIM-CLK Rise/Fall Time Loaded with 30pF 20 ns ~SIM-RST, Rise/Fall Time Loaded with 30pF 20 ns SIM-IO Rise/Fall Time Loaded with 30pF 0.7 1 µs SIM-CLK Frequency Loaded with 30pF 3.25 MHz Note: When SIMPRES is used, a low to high transition means that a SIM card is inserted and a high to low transition means that the SIM card is removed. 4.9.3. Application Figure 24. Example of a Typical SIM Socket Implementation It is recommended to add Transient Voltage Suppressor diodes (TVS) on the signal(s) connected to the SIM socket in order to prevent any ElectroStatic Discharge. TVS diodes with low capacitance (less than 10pF) have to be connected on SIM-CLK and SIM-IO signals to avoid any disturbance of the rising and falling edge. These types of diodes are mandatory for the Full Type Approval and should be placed as close to the SIM socket as possible. 4.9.3.1. SIM Socket Pin Description The following table lists the SIM socket pin description. Table 29: SIM Socket Pin Description Pin Number Signal Description 1 VCC SIM-VCC
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 63 Product Technical Specification and Customer Design Guideline Interfaces Pin Number Signal Description 2 RST ~SIM-RST 3 CLK SIM-CLK 4 CC4 SIMPRES with 100 k pull down resistor 5 GND GROUND 6 VPP Not connected 7 I/O SIM-IO 8 CC8 VCC_1V8 of the Q2687 Refreshed embedded module (pin 5) 4.9.3.2. Recommended Components  R1 :100KΩ  C1 :470pF  C2 :100nF Note: Note that this capacitor, C2, on the SIM-VCC line must not exceed 330nF.  D1 :ESDA6V1SC6 from ST  D2 :DALC208SC6 from SGS-THOMSON/ST Microelectronics  J1 :ITT CANNON CCM03 series (Refer to section 11.2 SIM Card Reader.)
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 64 Product Technical Specification and Customer Design Guideline Interfaces 4.10. USB 2.0 Interface A 4-wire USB slave interface is available on the Q2687 Refreshed embedded module that complies with USB 2.0 protocol signaling, but not with the electrical interface due to the 5V interface of VPAD-USB. The signals used by the USB interface are as follows:  VPAD-USB  USB-DP  USB-DM  GND The USB 2.0 interface also features the following:  12Mbit/s full-speed transfer rate  3.3V type compatible  USB Soft connect feature  Download feature is not supported by USB  CDC 1.1 – ACM compliant Note: A 5V to 3.3V typical voltage regulator is needed between the external interface power in line (+5V) and the Q2687 Refreshed embedded module line (VPAD-USB). 4.10.1. Pin Description Refer to the following table for the pin description of the USB interface. Table 30: USB Pin Description Pin Number Signal I/O I/O Type Description 52 VPAD-USB I VPAD_USB USB Power Supply 54 USB-DP I/O VPAD_USB Differential data interface positive 56 USB-DM I/O VPAD_USB Differential data interface negative 4.10.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the USB interface. Table 31: Electrical Characteristics of the USB Interface Parameter Minimum Typical Maximum Unit VPAD-USB, USB-DP, USB-DM 3 3.3 3.6 V VPAD_USB Input current consumption 8 mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 65 Product Technical Specification and Customer Design Guideline Interfaces 4.10.3. Application Figure 25. Example of a USB Implementation The regulator used is a 3.3V regulator and it is supplied through J1 when the USB wire is plugged. D1 is an EMI/RFI filter with ESD protection. The internal pull-up resistor of D1 which is used to detect the interface’s full speed is not connected because it is embedded into the embedded module. Note that both R1 and C1 have to be close to J1. 4.10.3.1. Recommended Components  R1 :1MΩ  C1, C3 :100nF  C2, C4 :2.2µF  D1 :STF2002-22 from SEMTECH  U1 :LP2985AIM 3.3V from NATIONAL SEMICONDUCTOR
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 66 Product Technical Specification and Customer Design Guideline Interfaces 4.11. RF Interface The RF (radio frequency) interface of the Q2687 Refreshed Embedded Module allows the transmission of RF signals. This interface has a 50Ω nominal impedance and a 0Ω DC impedance. 4.11.1. RF Connections The antenna cable and connector should be selected in order to minimize loss in the frequency bands used for GSM 850/900MHz and 1800/1900MHz. The maximum value of loss considered between the Q2687 Refreshed embedded module and an external connector is 0.5dB. The Q2687 Refreshed embedded module does not support an antenna switch for a car kit, but this function can be implemented externally and can be driven using a GPIO. 4.11.1.1. UFL Connector A wide variety of cables fitted with UFL connectors from different suppliers may be used. For more information, refer to section 9.2.5.1 UFL/SMA Connector. 4.11.1.2. Soldered Solution The soldered solution will preferably be based on an RG178 coaxial cable. For more information, refer to section 9.2.5.2 Coaxial Cable. 4.11.1.3. Precidip Connector This connector is compatible with Precidip and is dedicated for board-to-board applications and must be soldered on the customer board. The recommended supplier is as follows:  Preci-dip SA for the Precidip connector (reference: 9PM-SS-0003-02-248//R1) For more information, refer to section 9.2.5.3 Precidip Connector. 4.11.2. RF Performance The RF performance is compliant with ETSI GSM 05.05 recommendations. The main receiver parameters are:  GSM850 Reference Sensitivity = -109 dBm typical (Static & TUHigh)  E-GSM900 Reference Sensitivity = -109 dBm typical (Static & TUHigh)  DCS1800 Reference Sensitivity = -108 dBm typical (Static & TUHigh)  PCS1900 Reference Sensitivity = -108 dBm typical (Static & TUHigh)  Selectivity @ 200 kHz: > +9 dBc  Selectivity @ 400 kHz: > +41 dBc  Linear dynamic range: 63 dB  Co-channel rejection: >= 9 dBc The main transmitter parameters are:  Maximum output power (EGSM & GSM850): 33 dBm +/- 2 dB at ambient temperature
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 67 Product Technical Specification and Customer Design Guideline Interfaces  Maximum output power (GSM1800 & PCS1900): 30 dBm +/- 2 dB at ambient temperature  Minimum output power (EGSM & GSM850): 5 dBm +/- 5 dB at ambient temperature  Minimum output power (GSM1800 & PCS1900): 0 dBm +/- 5 dB at ambient temperature 4.11.3. Antenna Specifications The antenna must meet the requirements specified in the table below. The optimum operating frequency depends on the application. A dual-band, tri-band or quad-band antenna should operate in these frequency bands and have the following characteristics. Table 32: Antenna Specifications Characteristic E-GSM 900 DCS 1800 GSM 850 PCS 1900 TX Frequency 880 to 915 MHz 1710 to 1785 MHz 824 to 849 MHz 1850 to 1910 MHz RX Frequency 925 to 960 MHz 1805 to 1880 MHz 869 to 894 MHz 1930 to 1990 MHz Impedance 50Ω VSWR RX max 1.5:1 TX max 1.5:1 Typical Radiated Gain 0dBi in one direction at least Note: Sierra Wireless recommends a maximum VSWR of 1.5:1 for both TX and RX bands. Even so, all aspects of this specification will be fulfilled even with a maximum VSWR of 2:1. For the list of antenna recommendations, refer to section 11.5 Antenna Cable. 4.11.3.1. Application The antenna should be isolated as much as possible from analog and digital circuitry (including interface signals). On applications with an embedded antenna, poor shielding could dramatically affect the receiving sensitivity. Moreover, the power radiated by the antenna could affect the application (TDMA noise, for instance). As a general recommendation, all components or chips operated at high frequencies (microprocessors, memories, DC/DC converter) or other active RF parts should not be placed too close to the Q2687 Refreshed embedded module. In the event that this happens, the correct power supply layout and shielding should be designed and validated. Components near RF connections or unshielded feed lines must be prohibited. RF lines must be kept as short as possible to minimize loss.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 68 Product Technical Specification and Customer Design Guideline Interfaces 4.12. Analog Audio Interface The Q2687 Refreshed Embedded Module supports two microphone inputs and two speaker outputs. It also includes an echo cancellation and a noise reduction feature which allows for an improved quality of hands-free functionality. In some cases, ESD protection must be added on the audio interface lines. 4.12.1. Pin Description The following table lists the pin description of the analog audio interface. Table 33: Analog Audio Pin Description Pin Number Signal I/O I/O Type Description 40 MIC1P I Analog Microphone 1 positive input 38 MIC1N I Analog Microphone 1 negative input 36 MIC2P I Analog Microphone 2 positive input 34 MIC2N I Analog Microphone 2 negative input 35 SPK1P O Analog Speaker 1 positive output 37 SPK1N O Analog Speaker 1 negative output 39 SPK2P O Analog Speaker 2 positive output 41 SPK2N O Analog Speaker 2 negative output 4.12.2. Microphone Features The microphone can be connected in either differential or single-ended mode. However, it is strongly recommended to use a differential connection in order to reject common mode noise and TDMA noise. When using a single-ended connection, be sure to have a very good ground plane, very good filtering, as well as shielding in order to avoid any disturbance on the audio path. Also note that using a single-ended connection decreases the audio input signal by 6dB as compared to using a differential connection. The gain of both MIC inputs are internally adjusted and can be tuned using AT commands. For more information on AT commands, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). 4.12.2.1. MIC1 Microphone Input By default, MIC1 input is single-ended, but can be configured in differential mode. The MIC1 input does not include an internal bias making it the standard input for an external headset or a hands-free kit. If an electret microphone is used, there must be external biasing that corresponds with the characteristics of the electret microphone used. AC coupling is already embedded in the Q2687 Refreshed embedded module.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 69 Product Technical Specification and Customer Design Guideline Interfaces Figure 26. MIC1 Equivalent Circuits Refer to the following table for the electrical characteristics of MIC1. Table 34: Electrical Characteristics of MIC1 Parameter Minimum Typical Maximum Unit DC Characteristics N/A V AC Characteristics 200 Hz<F<4 kHz Z1 70 120 160 k Working voltage ( MIC1P-MIC1N) AT+VGT*=3500(1) 13.8 18.6** mVrms AT+VGT*=2000(1) 77.5 104** mVrms AT+VGT*=700(1) 346 465** mVrms Maximum rating voltage (MIC1P or MIC1N) Positive +7.35 V Negative -0.9 * The input voltage depends on the input micro gain set by AT command. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). ** This value is obtained with digital gain = 0, for frequency = 1 kHz (1) This value is given in dB, but it’s possible to toggle it to index value. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information. Caution: The voltage input value for MIC1 cannot exceed the maximum working voltage; otherwise, clipping will appear. 4.12.2.1.1. MIC1 Differential Connection Example Figure 27. Example of a MIC1 Differential Connection with LC Filter
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 70 Product Technical Specification and Customer Design Guideline Interfaces Audio quality can be very good without a filter (L1, L2, C2, C3 and C4), depending on the design. But if there is EMI perturbation, this filter can reduce TDMA noise. Note though that this filter is not mandatory. If the filter is not to be used, the capacitors must be removed and the coil replaced by 0Ω resistors as shown in the following diagram. Figure 28. Example of a MIC1 Differential Connection without an LC Filter Capacitor C1 is highly recommended to eliminate TDMA noise and it must be connected close to the microphone. Although Vbias can be VCC_2V8 (pin 10) of the Q2687 Refreshed embedded module, it is recommended to use another 2V to 3V power supply voltage instead. This is because Vbias must be kept as “clean” as possible to avoid bad performance when a single-ended connection is used. Caution: TDMA noise may degrade quality when VCC_2V8 is used. The following table lists the recommended components to use in creating the LC filter. Table 35: Recommended Components for a MIC1 Differential Connection Component Value Notes R1 4.7kΩ For Vbias equal to 2.8V. R2, R3 820Ω R4 1kΩ C1 12pF to 33pF Must be tuned depending on the design. C2, C3, C4 47pF Must be tuned depending on the design. C5 2.2uF +/- 10% L1, L2 100nH Must be tuned depending on the design.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 71 Product Technical Specification and Customer Design Guideline Interfaces 4.12.2.1.2. MIC1 Single-Ended Connection Example Figure 29. Example of a MIC1 Single-Ended Connection with LC Filter The single-ended design is not recommended for improving TDMA noise rejection as it is usually difficult to eliminate TDMA noise from a single-ended design. It is recommended to use an LC filter (L1 and C2) to eliminate TDMA noise. Note though that this filter is not mandatory. If the filter is not to be used, the capacitor C2 must be removed and the coil replaced by 0Ω resistors as shown in the following diagram. Figure 30. Example of a MIC1 Single-Ended Connection without an LC Filter The capacitor, C1, is highly recommended to eliminate TDMA noise and it must be connected close to the microphone. Although Vbias can be VCC_2V8 (pin 10) of the Q2687 Refreshed embedded module, it is recommended to use another 2V to 3V power supply voltage instead. This is because Vbias must be kept as “clean” as possible to avoid bad performance when a single-ended connection is used.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 72 Product Technical Specification and Customer Design Guideline Interfaces Caution: TDMA noise may degrade quality when VCC_2V8 is used. The following table lists the recommended components to use in creating the LC filter. Table 36: Recommended Components for a MIC1 Single-Ended Connection Component Value Notes R1 4.7kΩ For Vbias equal to 2.8V. R2 820Ω C1 12pF to 33pF Must be tuned depending on the design. C2 47pF Must be tuned depending on the design. L1 100nH Must be tuned depending on the design. 4.12.2.2. MIC2 Microphone Input By default, MIC2 input is differential, but can be configured in single-ended mode. The MIC2 input already includes biasing for an electret microphone and the electret microphone may be directly connected to this input. AC coupling is already embedded in the Q2687 Refreshed embedded module. Figure 31. MIC2 Equivalent Circuits Refer to the following table for the electrical characteristics of MIC2. Table 37: Electrical Characteristics of MIC2 Parameter Minimum Typical Maximum Unit Parameters Internal biasing DC Characteristics MIC2+ 2 2.1 2.2 V Output current 0.5 1.5 mA R2 1650 1900 2150  AC Characteristics 200 Hz<F<4 kHz Z2 MIC2P (MIC2N=Open) 1.1 1.3 1.6 k Z2 MIC2N (MIC2P=Open) Z2 MIC2P (MIC2N=GND) 0.9 1.1 1.4 Z2 MIC2N (MIC2P=GND) Impedance between MIC2P and MIC2N 1.3 1.6 2 Working voltage AT+VGT*=3500(1) 13.8 18.6*** mVrms AT+VGT*=2000(1) 77.5 104***
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 73 Product Technical Specification and Customer Design Guideline Interfaces Parameter Minimum Typical Maximum Unit ( MIC2P-MIC2N) AT+VGT*=700(1) 346 466*** Maximum rating voltage (MIC2P or MIC2N) Positive +7.35** V Negative -0.9 * The input voltage depends of the input micro gain set by AT command. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). ** Because MIC2P is internally biased, it is necessary to use a coupling capacitor to connect an audio signal provided by an active generator. Only a passive microphone can be directly connected to the MIC2P and MIC2N inputs. *** This value is obtained with digital gain = 0, for frequency = 1 kHz (1) This value is given in dB, but it’s possible to toggle it to index value. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Caution: The voltage input value for MIC2 cannot exceed the maximum working voltage; otherwise, clipping will appear. 4.12.2.2.1. MIC2 Differential Connection Example Figure 32. Example of a MIC2 Differential Connection with LC Filter Audio quality can be very good without a filter (L1, L2, C2, C3 and C4), depending on the design. But if there is EMI perturbation, this filter can reduce TDMA noise. Note though that this filter is not mandatory. If the filter is not to be used, the capacitors must be removed and the coil replaced by 0Ω resistors as shown in the following diagram.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 74 Product Technical Specification and Customer Design Guideline Interfaces Figure 33. Example of a MIC2 Differential Connection without an LC Filter Capacitor C1 is highly recommended to eliminate TDMA noise and it must be connected close to the microphone. The following table lists the recommended components to use in creating the LC filter. Table 38: Recommended Components for a MIC2 Differential Connection Component Value Notes C1 12pF to 33pF Must be tuned depending on the design. C2, C3, C4 47pF Must be tuned depending on the design. L1, L2 100nH Must be tuned depending on the design. 4.12.2.2.2. MIC2 Single-Ended Connection Example Figure 34. Example of a MIC2 Single-Ended Connection with LC Filter
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 75 Product Technical Specification and Customer Design Guideline Interfaces The single-ended design is not recommended for improving TDMA noise rejection as it is usually difficult to eliminate TDMA noise from a single-ended design. The internal input resistor value becomes 1150Ω due to the connection of MIC2N to the ground. It is recommended to use an LC filter (L1 and C2) to eliminate TDMA noise. Note though that this filter is not mandatory. If the filter is not to be used, the capacitor C2 must be removed and the coil replaced by 0Ω resistors as shown in the following diagram. Figure 35. Example of a MIC2 Single-Ended Connection without an LC Filter The capacitor, C1, is highly recommended to eliminate TDMA noise and it must be connected close to the microphone. The following table lists the recommended components to use in creating the LC filter. Table 39: Recommended Components for a MIC2 Single-Ended Connection Component Value Notes C1 12pF to 33pF Must be tuned depending on the design. C2 Must be tuned depending on the design. L1 Must be tuned depending on the design. 4.12.3. Speaker Features There are two different speaker channels, SPK1 and SPK2, available on the Q2687 Refreshed embedded module. The connection on SPK1 is fixed as single-ended, but SPK2 may be configured in either differential or single-ended mode. However, as with the microphone connection, it is strongly recommended to use a differential connection in order to reject common mode noise and TDMA noise. Furthermore, using a single-ended connection entails losing power (the power is divided by 4 in a single-ended connection) as compared to using a differential connection. Note that when using a single-ended connection, a very good ground plane, very good filtering, as well as shielding is needed in order to avoid any disturbance on the audio path.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 76 Product Technical Specification and Customer Design Guideline Interfaces The gain of each speaker output channel is internally adjusted and can be tuned using AT commands. For more information on AT commands, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). No discreet components like resistors or capacitors are needed when using this interface. The following table lists the typical values of both speaker outputs. Table 40: Speaker Information Parameter Typical Unit Connection Z (SPK1P, SPK1N) 16 or 32  Single-ended mode Z (SPK2P, SPK2N) 4  Single-ended mode Z (SPK2P, SPK2N) 8  Differential mode 4.12.3.1. Speakers Output Power The maximum power output of SPK1 and SPK2 are not similar because of the difference in their configuration. Because SPK2 can be connected in differential mode, it can provide more power compared to SPK1 which only allows single-ended connections. The maximal specifications given below are available with the maximum power output configuration values set by AT command, and the typical values are recommended. Caution: It is mandatory not to exceed the maximal speaker output power and the speaker load must be in accordance with the gain selection (gain is controlled by AT command). Exceeding beyond the specified maximal output power may damage the Q2687 Refreshed embedded module. 4.12.3.2. SPK1 Speaker Output SPK1 only allows for a single-ended connection. Figure 36. SPK1 Equivalent Circuits Refer to the following table for the electrical characteristics of SPK1. Table 41: Electrical Characteristics of SPK1 Parameter Minimum Typical Maximum Unit Biasing voltage - 1.30 V Output swing voltage RL=16: AT+VGR=-1600**; single-ended - 1.7 - Vpp
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 77 Product Technical Specification and Customer Design Guideline Interfaces Parameter Minimum Typical Maximum Unit RL=32; AT+VGR=-1600**; single-ended - 1.9 2.75 Vpp RL Load resistance 14.5 32 -  IOUT Output current; single-ended; peak value RL=16 - 40 85 mA RL=32 - 22 - mA POUT RL=16; AT+VGR*=-1600** - 25 mW RL=32; AT+VGR*=-1600** - 16 27 mW RPD Output pull-down resistance at power-down 28 40 52 k * The output voltage depends of the output speaker gain set by AT command. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). ** This value is given in dB, but it’s possible to toggle it to index value. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). 4.12.3.3. SPK2 Speaker Output SPK2 can have either a single-ended or a differential connection. Figure 37. SPK2 Equivalent Circuits Refer to the following table for the electrical characteristics of SPK2. Table 42: Electrical Characteristics of SPK2 Parameter Minimum Typical Maximum Unit Biasing voltage SPK2P and SPK2N 1.30 V Output swing voltage RL=8: AT+VGR=-1000*; single ended - - 2 Vpp RL=8: AT+VGR=-1000*; differential - - 4 Vpp RL=32: AT+VGR=-1000*; single ended - - 2.5 Vpp RL=32: AT+VGR=-1000*; differential - - 5 Vpp
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 78 Product Technical Specification and Customer Design Guideline Interfaces Parameter Minimum Typical Maximum Unit RL Load resistance 6 8 -  IOUT Output current; peak value; RL=8 - - 180 mA POUT RL=8; AT+VGR=-1000*; - - 250 mW RPD Output pull-down resistance at power-down 28 40 52 k VPD Output DC voltage at power-down - - 100 mV * The output voltage depends of the output speaker gain set by AT command. This value is given in dB, but it’s possible to toggle it to index value. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). If a singled-ended connection is used with SPK2, only one of either SPK2 has to be chosen. The result is a maximal output power divided by 4. 4.12.3.4. Differential Connection Example Figure 38. Example of an SPK Differential Connection The impedance of the speaker amplifier output in differential mode is R  1 +/-10%. Note that the connection between the speaker and the Q2687 Refreshed embedded module pins must be designed to keep the serial impedance lower than 3Ω when it is connected in differential mode. 4.12.3.5. Single-Ended Connection Example Figure 39. Example of an SPK Single-Ended Connection Take note of the following when connecting the speaker in single-ended mode:  6.8µF < C1 < 47µF (depending on the characteristics of the speaker and the output power)  C1 = C2  R1 = Zhp
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 79 Product Technical Specification and Customer Design Guideline Interfaces Again, note that using a single-ended connection includes losing power (-6dB) as compared to a differential connection. In the case of a 32Ω speaker, a cheaper and smaller solution can be implemented where R1 = 82Ω and C2 = 6.8µF (ceramic). Note that the connection between the speaker and the Q2687 Refreshed embedded module pins must be designed to keep the serial impedance lower than 1.5Ω when it is connected in single-ended mode. Lastly, when the SPK1 channel is used, only SPK1P is useful in a single-ended connection and SPK1N can be left open. 4.12.3.6. Recommended Characteristics  Type :10mW, electro-magnetic  Impedance  Z = 8Ω for hands-free (SPK2)  Z = 32Ω for headset kit (SPK1)  Sensitivity :110dB SPL minimum (0dB = 20µPa)  Frequency response must be compatible with GSM specifications
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 80 Product Technical Specification and Customer Design Guideline Interfaces 4.13. Digital Audio Interface (PCM) The Digital Audio Interface (PCM) interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals. The signals used by the Digital Audio Interface are as follows:  PCM-SYNC (output): The frame synchronization signal delivers an 8kHz frequency pulse that synchronizes the frame data in and the frame data out.  PCM-CLK (output): The frame bit clock signal controls data transfer with the audio peripheral.  PCM-OUT (output): The frame “data out” relies on the selected configuration mode.  PCM-IN (input): The frame “data in” relies on the selected configuration mode. The Digital Audio Interface also features the following:  IOM-2 compatible device on physical level  Master mode only with 6 slots by frame, user only on slot 0  Bit rate single clock mode at 768kHz only  16 bits data word MSB first only  Linear Law only (no compression law)  Long Frame Synchronization only  Push-pull configuration on PCM-OUT and PCM-IN Note that the digital audio interface configuration cannot differ from those specified above.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 81 Product Technical Specification and Customer Design Guideline Interfaces 4.13.1. PCM Waveforms The following figures describe the PCM Frame and Sampling waveforms. Figure 40. PCM Frame Waveform Figure 41. PCM Sampling Waveform Refer to the following table for the AC characteristics of the digital audio interface.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 82 Product Technical Specification and Customer Design Guideline Interfaces Table 43: AC Characteristics of the Digital Audio Interface Signal Description Minimum Typical Maximum Unit Tsync_low + Tsync_high PCM-SYNC period 125 µs Tsync_low PCM-SYNC low time 93 µs Tsync_high PCM-SYNC high time 32 µs TSYNC-CLK PCM-SYNC to PCM-CLK time -154 ns TCLK-cycle PCM-CLK period 1302 ns TIN-setup PCM-IN setup time 50 ns TIN-hold PCM-IN hold time 50 ns TOUT-delay PCM-OUT delay time 20 ns 4.13.2. Pin Description Refer to the following table for the pin description of the digital audio (PCM) interface. Table 44: PCM Interface Pin Description Pin Number Signal I/O I/O Type* Reset State Description 77 PCM-SYNC O 1V8 Pull-down Frame synchronization 8kHz 78 PCM-IN* I 1V8 Pull-up Data input 79 PCM-CLK O 1V8 Pull-down Data clock 80 PCM-OUT O 1V8 Pull-up Data output * When using analog audio interface, the PCM_In signal should be in HZ. Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 83 Product Technical Specification and Customer Design Guideline Interfaces 4.14. Battery Charging Interface The Q2687 Refreshed embedded module supports one battery charging circuit, two algorithms and one hardware charging mode (pre-charging) for the following battery types:  Ni-Cd (Nickel-Cadmium)  Ni-Mh (Nickel-Metal Hydride)  Li-Ion (Lithium-Ion) with the embedded PCM (Protection Circuit Module) algorithm 1 Note: Li-Ion batteries must be used with embedded PCM (protection circuit module). The Q2687 Refreshed embedded module charging circuit is composed of a transistor switch which connects the CHG-IN signal (pins 6 and 8) to the VBATT signal (pins 1, 2, 3 and 4). This switch is then controlled by the two charging algorithms – algorithm 0 and algorithm 1. Caution: Voltage is forbidden on the CHG-IN signal if no battery is connected to the VBATT signal. The charger DC power supply must have an output current limited to 800mA and that the maximum charger output current provided to the battery must also correspond to the battery’s electrical characteristics. The algorithms control the frequency and the connected time of the switching. During the charging procedure, the battery charging level is monitored and when the Li-Ion algorithm is used, the battery temperature is also monitored via the ADC1/BAT-TEMP input. Figure 42. Battery Charging Diagram One more charging procedure provided by the Q2687 Refreshed embedded module is the hardware charging mode which is also called “pre-charging”. This is a special charging mode as it is only activated when the Q2687 Refreshed embedded module is OFF. The goal of this charging mode is to avoid battery damage by preventing the battery from being discharged to a level that is lower than the specified minimum battery level. Control of this mode is managed by hardware.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 84 Product Technical Specification and Customer Design Guideline Interfaces To use the battery charging functionality of the Q2687 Refreshed embedded module, 3 hardware parts are needed:  Charger Power Supply – this provides a DC current power supply limited to 800mA, with a voltage range that corresponds to the battery and the Q2687 Refreshed embedded module specifications.  Battery – the battery charging functionality must only be used with a rechargeable battery. The three supported battery types are: Ni-Cd, Ni-Mh and Li-Ion.  Analog Temperature Sensor – this is only used for Li-Ion batteries to monitor their temperatures. This sensor is composed of an NTC sensor and several resistors. 4.14.1. Charging Algorithms OASiS provides the charging algorithms for Li-ion, Ni-Mh and Ni-Cd type batteries. Algorithm 0 is used for Ni-Mh and Ni-Cd type batteries, while algorithm 1 is used for Li-Ion type batteries. Temperature monitoring is only performed when using algorithm 1. Both charging algorithms are controlled by two AT commands:  AT+WBCI  AT+WBCM These two AT commands are used to set the charging battery parameters, select the type of battery and starts/stops the battery charging. Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information about these AT commands. Note: In the following sub-sections, the parameters in bold and italic type can be modified with the AT+WBCM command. 4.14.1.1. Ni-Cd/Ni-Mh Charging Algorithm This algorithm measures the battery voltage when the DC switch is open (T2). If the voltage is below BattLevelMax, the switch is closed (T1) to charge the battery. The switch is then re-opened for a time specified by TPulseInCharge (typically 100ms) and then the switch is closed again. When the battery voltage has reached BattLevelMax, the software monitors the battery voltage (typically every 5seconds; defined by TPulseOutCharge) and the switch state is left open for time T3. Figure 43. Ni-Cd/Ni-Mh Charging Waveform Refer to the following table for the electrical characteristics of the Ni-Cd and Ni-Mh battery timing charge.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 85 Product Technical Specification and Customer Design Guideline Interfaces Table 45: Electrical Characteristics of Ni-Cd/Ni-Mh Battery Timing Charge Parameter Minimum Typical Maximum Unit T1 1 s T2 0.1 s T3 5 s T1, T2, T3 and BattLevelMax may be configured using AT commands. For more information, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Note: Only the battery level, and not the temperature, is monitored by the software. 4.14.1.2. Li-Ion Charging Algorithm The Li-Ion algorithm provides battery temperature monitoring, which is highly recommended to prevent battery damage during the charging phase. The Li-Ion charger algorithm can be broken down into three phases: 1. Beginning of pulse charge – this is the beginning of the alternating pulse charge (1second) and rest (100ms). 2. Constant current charge – this is when the battery voltage reaches DedicatedVoltStart (4.1V on the graph below, but specified as 4.0V as default value). 3. End of pulse charge – this is when the rest period lasts longer because the voltage has exceeded BattLevelMax (4.3V by default) during the rest period. The three phases can be seen on the following waveform for full charging: Figure 44. Li-Ion Full Charging Waveform In the diagram above, the charge was done with an empty battery in order to know the maximum duration of a full charge; and in this specific example, complete charging took more than an hour.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 86 Product Technical Specification and Customer Design Guideline Interfaces The charging stops when the battery voltage has exceeded 4.3V (by default) and when the rest time between pulses has reached 10seconds. For more information, refer to section 4.14.1.2.2 Rest in Between Pulses in Phase 3. Caution: If the Li-Ion battery is locked by its PCM when it is plugged for the first time, charging will not take place. The Q2687 Refreshed embedded module cannot release the PCM protection inside the Lithium battery pack. The following table lists the electrical characteristics of the Li-Ion battery timing charge. Table 46: Electrical Characteristics of Li-Ion Battery Timing Charge Parameter Minimum Typical Maximum Unit Phase 1 switching Closed Always s Phase 2 switching Open 0.1 s Closed 1 s Phase 3 switching Open 0.1 10 s Closed 1 s 4.14.1.2.1. Pulse Appearance in Phase 2 The pulse is always 1second long and does not depend on the battery voltage. The pulse charge starts when while charging, the battery voltage reaches DedicatedVoltStart. At the beginning of the pulse charge, the battery voltage looks like a square signal with a 91% duty cycle. Figure 45. Phase 2 Pulse This lasts for as long as the voltage has not exceeded BattLevelMax while resting.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 87 Product Technical Specification and Customer Design Guideline Interfaces Figure 46. Phase 2 Rest 4.14.1.2.2. Rest in Between Pulses in Phase 3 At the end of the charge when the battery is almost full, the rest period between the two pulses lasts as long as the voltage stays beyond 4.2V. When this happens, the pulse length remains the same but the rest time between the two pulses increases regularly until it reaches 10 seconds. (The minimum rest time is 100ms.) If this period lasts more than 10 seconds, then the charge stops (as the battery is then fully charged). Figure 47. Phase 3 Switch
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 88 Product Technical Specification and Customer Design Guideline Interfaces 4.14.2. Pre-Charging When a DC power supply is connected to the CHG-IN input and if the battery voltage is between 2.8V* and 3.2V, a constant current of 50mA is provided to the battery to prevent it from being discharged below the specified minimum battery level. When the battery is able to supply the Q2687 Refreshed embedded module, it is automatically powered on and the software algorithm is activated to finish the charge. When pre-charging is launched, LED0 blinks automatically. Note: * For the Lithium-ion battery, the minimum voltage must be higher than the PCM lock level. Take note that if the voltage goes below the PCM lock level (in this case, 2.8V), charging is not guaranteed. 4.14.3. Temperature Monitoring Temperature monitoring is only available for the Li-Ion battery with algorithm 1. ADC1/BAT-TEMP (pin 20) input must be used to sample the analog temperature signal provided by an NTC temperature sensor. The minimum and maximum temperature range may be set by AT command. Refer to the following table for the pin description of the battery charging interface. Table 47: Battery Charging Interface Pin Description Pin Number Signal I/O I/O Type Description 6, 8 CHG-IN I Analog Current source input 20 ADC1/BAT-TEMP I Analog A/D converter Refer to the following table for the electrical characteristics of the battery charging interface. Table 48: Electrical Characteristics of the Temperature Monitoring Feature Parameter Minimum Typical Maximum Unit Charging operating temperature 0 50 °C ADC1/BAT-TEMP (pin 20 ) Maximum output code 1635 LSB Sampling rate 216 S/s Input Impedance (R) 1M  Input signal range 0 2 V CHG-IN (pin 6, 8 ) Voltage (for I=Imax) 4.6* V Voltage (for I=0) 6* V Current Imax 400** 800 mA * To be configured as specified by the battery manufacturer. ** Be careful as this value has to be selected in function of the power consumption mode used. Refer to the power consumption tables in section 6 Power Consumption for more information. 4.14.4. Recharging When battery charging has stopped because the maximum battery level has been reached and the charger has been left plugged in, the charging algorithm will not authorize a new charge to start until 5 minutes after the voltage difference has reached 103mV.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 89 Product Technical Specification and Customer Design Guideline Interfaces 4.14.5. Application The VCC_2V8 voltage provided by the Q2687 Refreshed embedded module can be used to polarize the NTC sensor. However, additional resistors (R1 and R2) must be used to adjust the maximum voltage from the ADC input to 2V. If another polarized voltage is used, the resistors must be adjusted accordingly. Note that it is not recommended to use the VCC_1V8 voltage. Figure 48. Example of an ADC Application The R(t) resistor is the NTC and should be placed close to the battery. Usually, it is integrated into the battery. 4.14.5.1. Temperature Computation Method The following computations and values represent the ambient temperature in °C. The resistor value depends on the temperature:  to represents the ambient temperature (+25°C) associated to R(to) which is the nominal resistor  B is the thermal sensibility (4250K)  t represents the temperature in °C
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 90 Product Technical Specification and Customer Design Guideline Interfaces For more information about NTC equations, refer to your NTC provider specifications. 4.14.6. Charger Recommendations The following table specifies the charger recommendations. Table 49: Charger Recommendations Parameter Minimum Typical Maximum Unit Remarks Input voltage 90 265 Vrms Input frequency 45 65 Hz Output voltage limit 6 V No load Output voltage limit 4.6 V Io max Output current (1) 1C(2) (3) mA Output Voltage 150 mVpp Io max Ripple Vout=5.3V (1) See the cell battery specifications for current charging conditions. (2) 1C = Nominal capacity (of the battery cell). (3) See the cell battery specifications for current charging conditions. T1 and D1 must be chosen according to the nominal capacity battery cell. It is recommended to let the output voltage (Vo) drop to less than 1.18V in less than 1second when the AC/DC adapter is unplugged.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 91 Product Technical Specification and Customer Design Guideline Interfaces 4.15. Temperature Sensor Interface A temperature sensor is implanted in the Q2687 Refreshed embedded module which is used to detect the temperature in the embedded module. The software can be used to report the temperature via ADC4. For more details about ADC4, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). The following waveform describes the characteristic of this function. The average step of the Q2687 Refreshed is 13mV/°C and the formula for computing the temperature sensor output is as follows: VTemp (V) = -0.013 x Temperature (°C) + 1.182 Figure 49. Temperature Sensor Characteristics
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 92 5. Signals and Indicators 5.1. ON/~OFF Signal This input is used to switch the Q2687 Refreshed embedded module ON or OFF. A HIGH level signal must be provided on the ON/~OFF pin to switch the Q2687 Refreshed embedded module ON. The voltage of this signal has to be maintained higher than 0.8 x VBATT for a minimum of 1500ms. This signal can be left at HIGH level until switched off. To switch the Q2687 Refreshed embedded module OFF, the ON/~OFF signal must be reset and an AT+CPOF command must be sent to the embedded module. 5.1.1. Pin Description Refer to the following table for the pin description of the ON/~OFF signal. Table 50: ON/~OFF Signal Pin Description Pin Number Signal I/O I/O Type Description 19 ON/OFF I CMOS Embedded Module Power-ON Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 5.1.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the ON/~OFF signal. Table 51: Electrical Characteristics of the ON/~OFF Signal Parameter I/O Type Minimum Maximum Unit VIL CMOS VBATT x 0.2 V VIH CMOS VBATT x 0.8 VBATT V Caution: All external signals must be inactive when the embedded module is OFF to avoid any damage when starting and to allow the embedded module to start and stop correctly. 5.1.3. Power-ON Once the embedded module is supplied through VBATT, the application must set the ON/OFF signal to high to start the embedded module power-ON sequence. The ON/OFF signal must be held high during a minimum delay of Ton/off-hold (minimum hold delay on the ON/~OFF signal) to power-ON. After this delay, an internal mechanism maintains the embedded module in power-ON condition. During the power-ON sequence, an internal reset is automatically performed by the embedded module for 40ms (typical). During this phase, any external reset should be avoided.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 93 Product Technical Specification and Customer Design Guideline Signals and Indicators Once initialization is completed (timing is SIM and network dependent), the AT interface answers the application with "OK". For further details, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Figure 50. Power-ON Sequence (no PIN code activated) The duration of the firmware power-ON sequence depends on the need to perform a recovery sequence if power has been lost during a flash memory modification. Listed below are the other factors that have a minor influence on the power-ON sequence:  The number of parameters stored in EEPROM by the AT commands received so far  The ageing of the hardware components, especially the flash memory  The temperature conditions The recommended way to release the ON/~OFF signal is to use either an AT command or WIND indicators: the application has to detect the end of the power-up initialization and release the ON/~OFF signal afterwards. To release the ON/~OFF signal, either of the following methods may be used:  Using AT Command  An AT command is sent to the application. Once the initialization is complete, the AT interface will answer with «OK». Note: If the application manages hardware flow control, the AT command can be sent during the initialization phase.  Using WIND Indicators  If configured to do so, an unsolicited “+WIND: 3” message is returned after initialization. Note that the generation of this message is either enabled or disabled using AT command. For more information on these commands, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Proceeding thus, by software detection, will always prevent the application from releasing the ON/~OFF signal too early. If WIND indicators are disabled or AT commands are unavailable or not used, it is still possible to release the ON/~OFF signal after a delay that is long enough (Ton/off-hold) to ensure that the firmware has already completed its power-up initialization.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 94 Product Technical Specification and Customer Design Guideline Signals and Indicators The table below gives the minimum values of Ton/off-hold: Table 52: Ton/off-hold Minimum Values Firmware Ton/off-hold Safe Evaluations of the Firmware Power-Up Time Firmware 7.43 (Sierra Wireless Software Suite 2.33) 8s The value in the table above take the worst cases into account: power-loss recovery operations, slow flash memory operations in high temperature conditions, and so on. But they are safe because they are large enough to ensure that ON/~OFF is not released too early. The typical power-up initialization time figures for best case conditions (no power-loss recovery, fast and new flash memory, etc.) is approximately 3.5 seconds in every firmware version. Note that releasing the ON/~OFF signal after this delay does not guarantee that the application will actually start-up (for example, the power plug has been pulled off during a flash memory operation, like a phone book entry update or an AT&W command). The ON/~OFF signal can be left at a HIGH level until switched OFF. But this is not recommended as it will prevent the AT+CPOF command from performing a clean power-OFF. When using a battery as power source, it is not recommended to let the ON/OFF signal high. If the battery voltage is too low and the ON/~OFF signal is at LOW level, an internal mechanism switches the embedded module OFF. This automatic process prevents the battery from being over discharged and optimizes its life span. During the power-ON sequence, an internal reset is automatically performed by the embedded module for 40 ms (typical). Any external reset should be avoided during this phase. 5.1.4. Power-OFF Caution: All external signals must be inactive when the embedded module is OFF to avoid any damage when starting. To properly power-OFF the embedded module, the application must reset the ON/OFF signal and then send the AT+CPOF command to unregister the module from the network and switch the embedded module OFF. Once the response "OK" is returned by the embedded module, the external power supply can be switched OFF.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 95 Product Technical Specification and Customer Design Guideline Signals and Indicators Figure 51. Power-OFF Sequence If the ON/~OFF pin is maintained at ON (High Level), then the embedded module cannot be switched OFF. Connecting a charger on the embedded module has exactly the same effect as connecting the ON/~OFF signal. Specifically, the embedded module will not power-OFF after the AT+CPOF command, unless the charger is disconnected. 5.1.5. Application The ON/~OFF input (pin 19) is used to switch ON (ON/~OFF=1) or OFF (ON/~OFF=0) the Q2687 Refreshed embedded module. A high level signal has to be provided on the ON/~OFF pin to switch the embedded module ON. The level of the voltage of this signal has to be maintained at 0.8 x VBATT for a minimum of 2000ms. This signal can be left at HIGH level until switched OFF. Figure 52. Example of ON/~OFF Pin Connection
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 96 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.2. Reset Signal (~RESET) This signal is used to force a reset procedure by providing the embedded module with a LOW level for at least 200µs. This signal must be considered as an emergency reset only. A reset procedure is already driven by the internal hardware during the power-up sequence. This signal may also be used to provide a reset to an external device (at power-ON only). If no external reset is necessary, this input may be left open. If used (emergency reset), it must be driven either by an open collector or an open drain. The embedded module remains in reset mode as long as the ~RESET signal is held LOW. Note that an operating system reset is preferred to a hardware reset. Caution: This signal should only be used for EMERGENCY resets. 5.2.1. Reset Sequence To activate the "emergency" reset sequence, the ~RESET signal must be set to LOW for a minimum of 200µs. As soon as the reset is completed, the AT interface returns "OK" to the application. Figure 53. Reset Sequence Waveform At power-up, the ~RESET time (Rt) is carried out after switching the embedded module ON. It is generated by the internal voltage supervisor. The ~RESET time is provided by the internal RC component. To keep the same time, it is not recommended to connect another R or C component <resistor or capacitor> on the ~RESET signal. Only a switch or an open drain gate is recommended. Ct is the cancellation time required for the embedded module initialization. Ct is automatically carried out after hardware reset.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 97 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.2.2. Pin Description Refer to the following table for the pin description of the reset signal. Table 53: Reset Signal Pin Description Pin Number Signal I/O I/O Type Description 18 ~RESET I/O Open Drain 1V8 Embedded Module Reset Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 5.2.3. Electrical Characteristics Refer to the following table for the electrical characteristics of the reset signal. Table 54: Electrical Characteristics of the Reset Signal Parameter Minimum Typical Maximum Unit Input Impedance (R)* 100 k Input Impedance (C) 10n F ~RESET time (Rt)1 200 µs ~RESET time (Rt)2 at power up only 20 40 100 ms Cancellation time (Ct) 34 ms VH** 0.57 V VIL 0 0.57 V VIH 1.33 V * Internal pull-up ** VH: Hysterisis Voltage 1 This reset time is the minimum to be carried out on the ~RESET signal when the power supply is already stabilized. 2 This reset time is internally carried out by the embedded module power supply supervisor only when the embedded module power supplies are powered ON. 5.2.4. Application The ~RESET input (pin 18) is used to force a reset procedure by providing a LOW level for at least 200µs. This signal has to be considered as an emergency reset only: a reset procedure is automatically driven by an internal hardware during the power-ON sequence. This signal can also be used to provide a reset to an external device (it then behaves as an output). If no external reset is necessary this input can be left open. If used (emergency reset), it has to be driven by an open collector or an open drain output (due to the internal pull-up resistor embedded into the embedded module) as shown in the diagram below.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 98 Product Technical Specification and Customer Design Guideline Signals and Indicators Figure 54. Example of ~Reset Pin Connection with Switch Configuration Figure 55. Example of ~Reset Pin Connection with Transistor Configuration An open collector or open drain transistor can be used. If an open collector is chosen, T1 can be a ROHM DTC144EE. Table 55: Reset Settings Reset Command ~Reset (Pin 18) Operating Mode 1 0 Reset activated 0 1 Reset inactive
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 99 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.3. BOOT Signal A specific BOOT control pin is available to download to the Q2687 Refreshed embedded module (only if the standard XMODEM download, controlled with AT command, is not possible). A specific PC software program, provided by Sierra Wireless, is needed to perform this specific download. The BOOT pin must be connected to VCC_1V8 for this specific download. Table 56: BOOT Settings BOOT Operating Mode Comment Leave open Normal use No download Leave open Download XMODEM AT command for Download AT+WDWL* 1 Download specific Need Sierra Wireless PC software * Refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) for more information about this AT command. 5.3.1. Pin Description Refer to the following table for the pin description of the Boot signal. Table 57: Boot Signal Pin Description Pin Number Signal I/O I/O Type Description 16 BOOT I 1V8 Download mode selection Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. For more information about using AT commands to manipulate this signal, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). Note that this BOOT pin must be left open for normal use or XMODEM download. However, in order to render the development and maintenance phases easier, it is highly recommended to set a test point, either a jumper or a switch on the VCC_1V8 (pin 5) power supply. Figure 56. Example of BOOT Pin Implementation
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 100 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.4. BAT-RTC (Backup Battery) The Q2687 Refreshed embedded module provides an input/output to connect a Real Time Clock power supply. This pin is used as a back-up power supply for the internal Real Time Clock. The RTC is supported by the Q2687 Refreshed embedded module when VBATT is available, but a backup power supply is needed to save date and time when VBATT is switched off (VBATT = 0V). Figure 57. Real Time Clock Power Supply If RTC is not used, this pin can be left open. If VBATT is available, the back-up battery can be charged by the internal 2.5V power supply regulator. The back-up power supply can be provided by any of the following:  A super capacitor  A non-rechargeable battery  A rechargeable battery 5.4.1. Pin Description Refer to the following table for the pin description of the BAT-RTC interface. Table 58: BAT-RTC Pin Description Pin Number Signal I/O I/O Type Description 7 BAT-RTC I/O Supply RTC Back-up supply
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 101 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.4.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the BAT-RTC interface. Table 59: Electrical Characteristics of the BAT-RTC Interface Parameter Minimum Typical Maximum Unit Input voltage 1.85 3.0 V Input current consumption* 3.0 3.3 3.6 µA Output voltage 2.40 2.45 2.50 V Output current 2 mA * Provided by an RTC back-up battery when the Q2687 Refreshed embedded module power supply is off (VBATT = 0V). 5.4.3. Application 5.4.3.1. Super Capacitor Figure 58. RTC Supplied by a Gold Capacitor The estimated range with a 0.47Farad gold capacitor is 25 minutes (minimum). Note: The gold capacitor maximum voltage is 2.5V. 5.4.3.2. Non-Rechargeable Battery Figure 59. RTC Supplied by a Non-Rechargeable Battery Diode D1 is mandatory to prevent the non-rechargeable battery from becoming damaged.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 102 Product Technical Specification and Customer Design Guideline Signals and Indicators The estimated range with an 85mAh battery is 800H (minimum). 5.4.3.3. Rechargeable Battery Figure 60. RTC Supplied by a Rechargeable Battery The estimated range with a 2mAh rechargeable battery is approximately 15H. Caution: Ensure that the cell voltage is lower than 2.75V before battery cell assembly to avoid damaging the Q2687 Refreshed embedded module.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 103 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.5. Buzzer Output This digital output is controlled by a pulse-width modulation controller and is an open drain output. This signal may only be used in the implementation of a buzzer. The buzzer can be directly connected to this output signal and VBATT. The maximum current is 100mA (PEAK). 5.5.1. Pin Description Refer to the following table for the pin description of the buzzer output. Table 60: PWM/Buzzer Output Pin Description Pin Number Signal I/O I/O Type Reset State Multiplexed With 15 BUZZER0 O Open drain Z Buzzer output Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 5.5.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the buzzer output. Table 61: Electrical Characteristics of the Buzzer Output Parameter Condition Minimum Maximum Unit VOL on Iol = 100mA 0.4 V IPEAK VBATT = VBATTmax 100 mA Frequency 1 50000 Hz
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 104 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.5.3. Application The maximum peak current for this interface is 100mA and the maximum average current is 40mA. A transient voltage suppressor (TVS) diode, D1, must be added to the circuit as shown in the figure below. Figure 61. Example of a Buzzer Implementation Take note of the following when implementing a buzzer:  R1 must be chosen in order to limit the current at IPEAK max  C1 = 0 to 100nF (depending on the buzzer type)  D1 = BAS16 (example) The BUZZ-OUT output can also be used to drive an LED as shown in the following figure: Figure 62. Example of an LED Driven by the Buzzer Output The value of R1 should correspond with the characteristics of the LED (D1). 5.5.4. Recommended Characteristics  Type :electro-magnetic  Impedance :7Ω to 30Ω  Sensitivity :90dB SPL minimum @ 10cm  Current :60mA to 90mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 105 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.6. External Interrupt The Q2687 Refreshed embedded module provides two external interrupt inputs with different voltages. These interrupt inputs can be activated on the:  High to low level transition  Low to high level transition  Low to high and high to low level transitions When used, the interrupt inputs must not be left open; and when they are not used, they must be configured as GPIOs. 5.6.1. Pin Description Refer to the following table for the pin description of the external input/interrupt. Table 62: External Interrupt Pin Description Pin Number Signal I/O I/O Type Reset State Description Multiplexed With 49 INT1 I 2V8 Z External Interrupt GPIO25 50 INT0 I 1V8 Z External Interrupt GPIO3 Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 5.6.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the external input/interrupt. Table 63: Electrical Characteristics of the External Input/Interrupt Parameter Minimum Maximum Unit INT1 VIL 0.84 V VIH 1.96 V INT0 VIL 0.54 V VIH 1.33 V 5.6.3. Application INT0 and INT1 are high impedance input types so it is important to set the interrupt input signals with pull-up or pull-down resistors if they are driven by an open drain, an open collector or by a switch. If the interrupt signals are driven by a push-pull transistor, then no pull-up or pull-down resistors are necessary.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 106 Product Technical Specification and Customer Design Guideline Signals and Indicators Figure 63. Example of INT0 Driven by an Open Collector Figure 64. Example of INT1 Driven by an Open Collector where:  The value of R1 can be 47kΩ  T1 can be a ROHM DTC144EE open collector transistor
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 107 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.7. VCC_2V8 and VCC_1V8 Output These digital power supply outputs are mainly used to:  Pull-up signals such as I/Os  Supply the digital transistors driving LEDs  Supply the SIMPRES signal  Act as a voltage reference for the ADC interface AUX-ADC (VCC_2V8 only) Each digital output has a maximum current of 15mA. Both VCC_2V8 and VCC_1V8 are only available when the embedded module is ON. 5.7.1. Pin Description Refer to the following table for the pin description of the VCC_2V8 and VCC_1V8 output. Table 64: VCC_2V8 and VCC_1V8 Pin Description Pin Number Signal I/O I/O Type Description 5 VCC_1V8 O Supply 1.8V digital supply 10 VCC_2V8 O Supply 2.8V digital supply Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions. 5.7.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the VCC_2V8 and VCC_1V8 output signals. Table 65: Electrical Characteristics of the VCC_2V8 and VCC_1V8 Signals Parameter Minimum Typical Maximum Unit VCC_2V8 Output voltage 2.74 2.8 2.86 V Output Current 15 mA VCC_1V8 Output voltage 1.76 1.8 1.94 V Output Current 15 mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 108 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.8. FLASH-LED (LED0) The FLASH-LED is the GSM activity status indicator signal of the Q2687 Refreshed embedded module and it can be used to drive an LED. This signal is an open drain output. An LED and a resistor can be directly connected between this output and VBATT. When the Q2687 Refreshed embedded module is OFF, if 2.8V < VBATT < 3.2V and a charger is connected on the CHG-IN inputs, this output flashes (100 ms = ON; 900ms = OFF) to indicate the pre-charging phase of the battery. When the Q2687 Refreshed embedded module is ON, this output is used to indicate the network status. Table 66: FLASH-LED Status Q2687 State VBATT Status FLASH-LED Status Q2687 Refreshed Embedded Module Status OFF VBATT< 2.8V or VBATT > 3.2V OFF OFF 2.8V < VBATT < 3.2V Pre-charge flash LED ON for 100 ms, OFF for 900 ms OFF; Pre-charging mode (charger must be connected on CHG-IN to activate this mode) ON VBATT > 3.2V Permanent ON; not registered on the network Slow flash LED ON for 200 ms, OFF for 2 s ON; registered on the network Quick flash LED ON for 200 ms, OFF for 600 ms ON; registered on the network, communication in progress Very quick flash LED ON for 100ms, OFF for 200ms ON; software downloaded is either corrupted or non-compatible ("BAD SOFTWARE") 5.8.1. Pin Description Refer to the following table for the pin description of the FLASH-LED. Table 67: FLASH-LED Pin Description Pin Number Signal I/O I/O Type* Reset State Description 17 LED0 O Open Drain Output 1 and Undefined LED driving Refer to section 4.2 Electrical Information for Digital I/O for open drain, 2V8 and 1V8 voltage characteristics and reset state definitions.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 109 Product Technical Specification and Customer Design Guideline Signals and Indicators Figure 65. LED0 State During RESET and Initialization Time LED0 state is HIGH during the RESET time and undefined during the software initialization time. During software initialization time, for a maximum of 2 seconds after RESET cancellation, the LED0 signal is toggling and does not provide the embedded module status. After the 2s period, the LED0 provides the true status of the embedded module. 5.8.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the FLASH-LED signal. Table 68: Electrical Characteristics of the FLASH-LED Signal Parameter Condition Minimum Typical Maximum Unit VOL 0.4 V IOUT 8 mA 5.8.3. Application Figure 66. Example of FLASH-LED Implementation R1 can be harmonized depending on the characteristics of the LED (D1).
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 110 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.9. Analog to Digital Converter Two Analog to Digital Converter inputs, BAT-TEMP/ADC1 and AUX-ADC/ADC2, are provided by the Q2687 Refreshed embedded module. These converters are 10-bit resolution ADCs ranging from 0V to 2V. Typically, the BAT-TEMP/ADC1 input is used to monitor external temperature. This is very useful for monitoring the application temperature and can be used as an indicator to safely power OFF the application in case of overheating (for Li-Ion batteries). For more information on battery charging, refer to section 4.14 Battery Charging Interface. The AUX-ADC/ADC2 input can be used for customer specific applications. 5.9.1. Pin Description Refer to the following table for the pin description of the ADC. Table 69: ADC Pin Description Pin Number Signal I/O I/O Type Description 20 ADC1/BAT-TEMP* I Analog A/D converter 21 ADC2 I Analog A/D converter * This input is reserved for the battery charging temperature sensor. For more information, refer to section 4.14 Battery Charging Interface. 5.9.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the ADC. Table 70: Electrical Characteristics of the ADC Parameter Minimum Typical Maximum Unit Maximum output code 1635 LSBs Sampling rate 138¹ sps Input signal range 0 2 V INL (Integral non linearity) 15 mV DNL (Differential non linearity) 2.5 mV Input impedance ADC1/BAT-TEMP 1M*  ADC2 1M  * Internal pull-up to 2.8V 1 Sampling rate only for ADC2 and the Sierra Wireless Software Suite application
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 111 Product Technical Specification and Customer Design Guideline Signals and Indicators 5.10. Digital to Analog Converter One Digital to Analog Converter output is provided by the Q2687 Refreshed embedded module. The converter is an 8-bit resolution DAC, ranging from 0V to 2.3V. 5.10.1. Pin Description Refer to the following table for the pin description of the DAC. Table 71: DAC Pin Description Pin Number Signal I/O I/O Type Description 82 DAC0 O Analog D/A converter Note: This output assumes a typical external load of 2k and 50pF in parallel to GND. 5.10.2. Electrical Characteristics Refer to the following table for the electrical characteristics of the DAC. Table 72: Electrical Characteristics of the DAC Parameter Minimum Typical Maximum Unit Resolution 8 bits Output signal range 0 2.3 V Output voltage after reset 1.147 V INL (Integral non linearity) -5 +5 LSB DNL (Differential non linearity) -1 +1 LSB
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 112 6. Power Consumption The power consumption values of the Q2687 Refreshed embedded module vary depending on the operating mode, RF band and software used (with or without the Sierra Wireless Software Suite). The following power consumption values were obtained by performing measurements on Q2687 Refreshed embedded module samples at a temperature of 25°C with the assumption of a 50 RF output. Three VBATT values were used to measure the power consumption of the Q2687 Refreshed Embedded Module:  VBATT = 3.2V  VBATT = 3.6V  VBATT = 4.8V The average current and the maximum current peaks were also measured for all three VBATT values. For a more detailed description of the operating modes, refer to the appendix of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). For more information on the consumption measurement procedure, refer to section 7 Consumption Measurement Procedure. 6.1. Power Consumption without the Sierra Wireless Software Suite The following measurement results are relevant when:  there is no Sierra Wireless Software Suite application  the Sierra Wireless Software Suite application is disabled  no processing is required by a Sierra Wireless Software Suite application Note: Power consumption performance is software related. The values listed below were based on Firmware 7.43. TX means that the current peak is the RF transmission burst (Tx burst). RX means that the current peak is the RF reception burst (Rx burst). Table 73: Power Consumption Without the Sierra Wireless Software Suite; Typical Values Operating Mode Parameter IAverage IPeak Unit VBATT=3.2V VBATT=3.6V VBATT=4.8V ALARM Mode 10.6 11.1 12.8 N/A µA SLEEP Mode 0.38 0.39 0.40 59.6 mA ACTIVE Mode 48.3 44.0 35.8 66.4 mA SLEEP mode with telecom stack in Idle Mode * Paging 9/Rx burst occurrence ~2s 1.94 1.85 1.65 208 mA Paging 2/Rx burst occurrence ~0,5s 5.81 5.43 4.74 218 mA ACTIVE mode with telecom stack in Idle Mode Paging 9/Rx burst occurrence ~2s 23.5 21.9 19.0 147 mA Paging 2/Rx burst occurrence ~0,5s 24.5 23.4 20.1 149 mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 113 Product Technical Specification and Customer Design Guideline Power Consumption Operating Mode Parameter IAverage IPeak Unit Peak current in GSM/GPRS Mode 850/900 MHz - PCL5/gam.3 (TX power 33dBm) 1704 1591 1548 1704 mA 1800/1900 MHz - PCL0/gam.3 (TX power 30dBm) 1130 1101 1085 1130 mA GSM Connected Mode (Voice) 850/900 MHz - PCL5 (TX power 33dBm) 263 246 233 1681 mA 850/900 MHz - PCL19 (TX power 5dBm) 102 97 89 307 mA 1800/1900 MHz - PCL0 (TX power 30dBm) 198 191 181 1120 mA 1800/1900 MHz - PCL15 (TX power 0dBm) 98 94 85 271 mA GPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.3 (TX power 30dBm) 453 423 406 1704 mA EGPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.6 (TX power 24dBm) 367 363 359 1420 mA 1800/1900 MHz - gam.5 (TX power 23dBm) 312 307 299 1091 mA * Sleep Idle Mode consumption is dependent on the SIM card used. Some SIM cards respond faster than others; the longer the response time, the higher the consumption. 6.2. Power Consumption with the Sierra Wireless Software Suite The following consumption results were measured during the Dhrystone application run. Note: Power consumption performance is software related. The values listed in the tables below were based on Firmware 7.43. TX means that the current peak is the RF transmission burst (Tx burst). RX means that the current peak is the RF reception burst (Rx burst). Table 74: Power Consumption With the Application CPU @ 26MHz, Typical Values Operating Mode Parameter IAv e r age IPeak Unit VBATT=3.2V VBATT=3.6V VBATT=4.8V ALARM Mode N/A N/A µA SLEEP Mode N/A N/A mA ACTIVE Mode 45.4 41.5 33.9 89.7 mA SLEEP mode with telecom Paging 9/Rx burst occurrence ~2s N/A N/A mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 114 Product Technical Specification and Customer Design Guideline Power Consumption Operating Mode Parameter IAv e r age IPeak Unit stack in Idle Mode * Paging 2/Rx burst occurrence ~0,5s N/A N/A mA ACTIVE mode with telecom stack in Idle Mode Paging 9/Rx burst occurrence ~2s 44.3 40.5 33.1 144 mA Paging 2/Rx burst occurrence ~0,5s 45.1 41.3 33.9 146 mA Peak current in GSM/GPRS Mode 850/900 MHz - PCL5/gam.3 (TX power 33dBm) 1727 1608 1559 1727 mA 1800/1900 MHz - PCL0/gam.3 (TX power 30dBm) 1138 1108 1095 1138 mA GSM Connected Mode (Voice) 850/900 MHz - PCL5 (TX power 33dBm) 266 246 232 1719 mA 850/900 MHz - PCL19 (TX power 5dBm) 100 95 87 301 mA 1800/1900 MHz - PCL0 (TX power 30dBm) 196 189 180 1128 mA 1800/1900 MHz - PCL15 (TX power 0dBm) 96 91 83 273 mA GPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.3 (TX power 30dBm) 457 426 408 1727 mA EGPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.6 (TX power 24dBm) 321 320 328 1398 mA 1800/1900 MHz - gam.5 (TX power 23dBm) 270 269 270 1081 mA Table 75: Power Consumption With the Application CPU @ 104MHz, Typical Values Operating Mode Parameter IAv e r age IPeak Unit VBATT=3.2V VBATT=3.6V VBATT=4.8V ALARM Mode N/A N/A µA SLEEP Mode N/A N/A mA ACTIVE Mode 82.6 74.5 58.8 101.8 mA SLEEP mode with telecom stack in Idle Mode * Paging 9/Rx burst occurrence ~2s N/A N/A mA Paging 2/Rx burst occurrence ~0,5s N/A N/A mA ACTIVE mode with telecom stack in Idle Mode Paging 9/Rx burst occurrence ~2s 81.4 73.4 57.7 176 mA Paging 2/Rx burst occurrence ~0,5s 82.1 74.1 58.5 176 mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 115 Product Technical Specification and Customer Design Guideline Power Consumption Operating Mode Parameter IAv e r age IPeak Unit Peak current in GSM/GPRS Mode 850/900 MHz - PCL5/gam.3 (TX power 33dBm) 1764 1650 1590 1764 mA 1800/1900 MHz - PCL0/gam.3 (TX power 30dBm) 1178 1141 1121 1178 mA GSM Connected Mode (Voice) 850/900 MHz - PCL5 (TX power 33dBm) 301 279 257 1763 mA 850/900 MHz - PCL19 (TX power 5dBm) 135 127 111 344 mA 1800/1900 MHz - PCL0 (TX power 30dBm) 232 221 204 1178 mA 1800/1900 MHz - PCL15 (TX power 0dBm) 131 122 107 310 mA GPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.3 (TX power 30dBm) 491 459 432 1764 mA EGPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.6 (TX power 24dBm) 352 351 354 1423 mA 1800/1900 MHz - gam.5 (TX power 23dBm) 303 298 293 1109 mA
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 116 7. Consumption Measurement Procedure This chapter describes the consumption measurement procedure used to obtain the Q2687 Refreshed Embedded Module consumption specification. 7.1. Hardware Configuration Consumption results are highly dependent on the hardware configuration used during measurement and this section describes the hardware configuration settings that must be used to obtain optimum consumption measurements. The following hardware configuration includes both the measurement equipment used and the Q2687 Refreshed embedded module on the Q Series Development Kit board v3. 7.1.1. Equipments Used Four devices were used to perform consumption measurement:  Network Analyzer  Current Measuring Power Supply  Standalone Power Supply  Computer, to control the embedded module and to save measurement data Figure 67. Typical Hardware Configuration The network analyzer is a CMU 200 from Rhode & Schwartz. This analyzer offers all GSM/GPRS/EGPRS network configurations required and allows a wide range of network configurations to be set. The AX502 standalone power supply is used to supply all development kit board components except the embedded module. The goal is to separate the development kit board consumption from the
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 117 Product Technical Specification and Customer Design Guideline Consumption Measurement Procedure embedded module consumption which is measured by the other power supply, the 66321B “current measuring power supply”. The “current measuring power supply” is also connected and controlled by the computer (GPIB control not shown in the previous figure). A SIM must be inserted in the Q Series Development Kit during all consumption measurements. The following table lists the recommended equipments to use for the consumption measurement. Table 76: Recommended Equipments Device Manufacturer Reference Notes Network analyzer Rhode & Schwartz CMU 200 Quad Band GSM/DCS/GPRS/EGPRS Current measuring power supply Agilent 66321B Used for VBATT Standalone power supply Metrix AX502 Used for VBAT 7.1.2. Q Series Development Kit Board v3 The Q Series Development Kit Board v3 is used as a basis for the Q2687 Refreshed embedded module measurements using several settings. For more information about these settings, refer to document [15] AirPrime Q Series Development Kit User Guide. The Q Series Development Kit board is powered by the standalone power supply VBAT; while the Q2687 Refreshed embedded module is powered by the current measuring power supply, VBATT. Because of this, the link between VBATT and VBAT (J103) must be opened (by removing the solder at the top of the board in the SUPPLY area).  VBATT is powered by the current measuring power supply 66321B  VBAT is powered by the standalone power supply AX502 Also take note of the following additional configuration/settings:  The R100 resistor (around the BAT-TEMP connector) must be removed.  The UART2 link is not used; therefore, J501, J502, J503 and J504 must be opened (by removing the solder).  UART2 R502 must be removed; R507 must be soldered with a 0Ω resistor.  The USB link is not used; therefore, J801, J802 and J803 must be opened (by removing the solder).  UART1 R408 must be removed; R406 must be soldered with a 0Ω resistor.  The standalone power supply, VBAT, may be set to 4V. The goal of the settings listed above is to eliminate all bias current from VBATT and to supply the entire board (except the embedded module) using only VBAT. Note: When measuring the current consumption in alarm mode, it is necessary to remove D100, D103 and R103 from the Q Series Development Kit in order to have accurate results. 7.1.3. SIM Cards Consumption measurement may be performed with either 3-Volt or 1.8-Volt SIM cards. However, all specified consumption values are for a 3-Volt SIM card.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 118 Product Technical Specification and Customer Design Guideline Consumption Measurement Procedure Note: The SIM card’s voltage is supplied by the embedded module’s power supply. Consumption measurement results may vary depending on the SIM card used. 7.2. Software Configuration The software configuration for the equipment(s) used and the Q2687 Refreshed embedded module settings are presented in the following sub-sections. 7.2.1. Embedded Module Configuration The software configuration for the embedded module is done by selecting the operating mode to use in performing the measurement. A description of the operating modes and the procedures used to change the operating mode are given in the appendix of document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). The available operating modes in the Q2687 Refreshed embedded module are as follows:  Alarm Mode  Active Idle Mode  Sleep Idle Mode  Active Mode  Sleep Mode  Connected Mode  Transfer Mode class 8 (4Rx/1Tx)  Transfer Mode class 10 (3Rx/2Tx) 7.2.2. Equipment Configuration The network analyzer is set according to the embedded module’s operating mode. Paging during Idle modes, TX burst power, RF band and GSM/DCS/GPRS/EGPRS may be selected on the network analyzer. Refer to the following table for the network analyzer configuration according to operating mode. Table 77: Operating Mode Configuration Operating Mode Network Analyzer Configuration ALARM Mode N/A SLEEP Mode N/A ACTIVE Mode N/A SLEEP mode with telecom stack in Idle Mode Paging 9/Rx burst occurrence ~2s Paging 2/Rx burst occurrence ~0,5s ACTIVE mode with telecom stack in Idle Mode Paging 9/Rx burst occurrence ~2s Paging 2/Rx burst occurrence ~0,5s Peak current in GSM/GPRS Mode 850/900 MHz - PCL5/gam.3 (TX power 33dBm) 1800/1900 MHz - PCL0/gam.3 (TX power 30dBm) GSM Connected Mode (Voice) 850/900 MHz - PCL5 (TX power 33dBm) 850/900 MHz - PCL19 (TX power 5dBm)
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 119 Product Technical Specification and Customer Design Guideline Consumption Measurement Procedure Operating Mode Network Analyzer Configuration 1800/1900 MHz - PCL0 (TX power 30dBm) 1800/1900 MHz - PCL15 (TX power 0dBm) GPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.3 (TX power 30dBm) EGPRS Transfer Mode class 10 (3Rx/2Tx) 850/900 MHz - gam.6 (TX power 24dBm) 1800/1900 MHz - gam.5 (TX power 23dBm) The standalone power supply, VBAT, may be set from 3.2V to 4.8V. The current measuring power supply, VBATT, may be set from 3.2V to 4.8V according to the Q2687 Refreshed embedded module VBATT specifications.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 120 8. Reliability Compliance and Recommended Standards 8.1. Reliability Compliance The Q2687 Refreshed embedded module connected on a development kit board application is compliant with the following requirements. Table 78: Standards Conformity for the Q2687 Refreshed Embedded Module Abbreviation Definition IEC International Electro technical Commission ISO International Organization for Standardization 8.2. Applicable Standards Listing The table hereafter gives the basic list of standards applicable to the Q2687 Refreshed Embedded Module. Note: References to any features can be found from these standards. Table 79: Applicable Standards and Requirements Document Current Version Title IEC6006826 7.0 Environmental testing - Part 2.6: Test FC: Sinusoidal Vibration. IEC60068234 73 Basic environmental testing procedures part 2: Test FD: random vibration wide band - general requirements Cancelled and replaced by IEC60068-2-64. For reference only. IEC60068264 2.0 Environmental testing - part 2-64: Test FH: vibration, broadband random and guidance. IEC60068232 2.0 Basic environmental testing procedures - part 2: Test ED: (procedure 1) (withdrawn & replaced by IEC60068-2-31). IEC60068231 2.0 Environmental testing part 2-31: Test EC: rough handling shocks, primarily for equipment-type specimens. IEC60068229 2.0 Basic environmental testing procedures - part 2: Test EB and guidance: bump Withdrawn and replaced by IEC60068-2-27. For reference only. IEC60068227 4.0 Environmental testing - part 2-27: Test EA and guidance: shock. IEC60068214 6.0 Environmental testing - part 2-14: Test N: change of temperature. IEC6006822 5.0 Environmental testing - part 2-2: Test B: dry heat. IEC6006821 6.0 Environmental testing - part 2-1: Test A: cold. IEC60068230 3.0 Environmental testing - part 2-30: Test DB: damp heat, cyclic (12 h + 12 h cycle). IEC6006823 69 w/A1 Basic environmental testing procedures part 2: Test CA: damp heat, steady State Withdrawn and replaced by IEC60068-2-78. For reference only.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 121 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards Document Current Version Title IEC60068278 1.0 Environmental testing part 2-78: Test CAB: damp heat, steady state. IEC60068238 2.0 Environmental testing - part 2-38: Test Z/AD: composite temperature/humidity cyclic test. IEC60068240 1.0 w/A1 Basic environmental testing procedures - part 2: Test Z/AM combined cold/low air pressure tests. ISO167501 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 1: general. ISO167502 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 2: electrical loads. ISO167503 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 3: mechanical loads. ISO167504 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 4: climatic loads. IEC60529 2.1 w/COR2 Degrees of protection provided by enclosures (IP code). IEC60068217 4.0 Basic environmental testing procedures - part 2: Test Q: sealing. IEC60068218 2.0 Environmental testing - part 2-18: Tests - R and guidance: water. IEC60068270 1.0 Environmental testing - part 2: tests - test XB: abrasion of markings and letterings caused by rubbing of fingers and hands. IEC60068268 1.0 Environmental testing - part 2: tests - test l: dust and sand. IEC60068211 3.0 Basic environmental testing procedures, part 2: test KA: salt mist. IEC60068260 2.0 Environmental testing - part 2: Test KE: flowing mixed gas corrosion test. IEC60068252 2.0 w/COR Environmental testing - part 2: Test KB: salt mist, cyclic (sodium chloride solution). 8.3. Environmental Specifications The Q2687 Refreshed embedded module is compliant with the operating classes listed in the table below. The ideal temperature range of the environment for each operating class is also specified. Table 80: Operating Class Temperature Range Conditions Temperature Range Operating / Class A -30 °C to +70°C Operating / Class B -40 °C to +85°C Storage -40 °C to +80°C 8.3.1. Function Status Classification The classes reported below comply with the Annex “ISO Failure Mode Severity Classification”, ISO Standard 7637, and Section 1. Note: The word “function” as used here concerns only the function performed by the Q2687 Refreshed embedded module.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 122 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards Table 81: ISO Failure Mode Severity Classification Class Definition CLASS A The Q2687 Refreshed Embedded Module remains fully functional during and after environmental exposure; and shall meet the minimum requirements of 3GPP or appropriate wireless standards. CLASS B The Q2687 Refreshed Embedded Module remains fully functional during and after environmental exposure; and shall exhibit the ability to establish a voice, SMS or DATA call at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 8.4. Reliability Prediction Model 8.4.1. Life Stress Tests The following tests the Q2687 Refreshed embedded module’s product performance. Table 82: Life Stress Tests Designation Condition Performance Test PT3T° & PT Standard: N/A Special conditions:  Temperature:  Class A: -30°C to +70°C  Class B: -40°C to +85°C  Rate of temperature change: ± 3°C/min  Recovery time: 3 hours Operating conditions: Powered Duration: 14 days Durability Test DT Standard: IEC 60068-2-2, Test Bb Special conditions:  Temperature: +80°C  Rate of temperature change: ± 3°C/min  Recovery time: 3 hours Operating conditions: Powered and Un-powered Duration: 156 days
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 123 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards 8.4.2. Environmental Resistance Stress Tests The following tests the Q2687 Refreshed embedded module’s resistance to extreme temperature. Table 83: Environmental Resistance Stress Tests Designation Condition Cold Test COT Standard: IEC 680068-2-1, Test Ab Special conditions:  Temperature: -40°C  Rate of temperature change: dT/dt >= ± 3°C/min  Recovery time: 3 hours Operating conditions: Un-powered Duration: 72 hours Resistance to Heat Test RH Standard: IEC 680068-2-2, Test Bb Special conditions:  Temperature: +80°C  Rate of temperature change: dT/dt >= ± 3°C/min  Recovery time: 3 hours Operating conditions: The DUT is switched ON for 1 minute and then OFF for 1 minute Duration: 60 days Dry Heat Test DHT Standard: IEC 680068-2-2, Test Bb Special conditions:  Temperature: +80°C  Rate of temperature change: dT/dt >= ± 3°C/min  Recovery time: 3 hours Operating conditions: Un-powered Duration: 60 days
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 124 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards 8.4.3. Corrosive Resistance Stress Tests The following tests the Q2687 Refreshed embedded module’s resistance to corrosive atmosphere. Table 84: Corrosive Resistance Stress Tests Designation Condition Humidity Test HT Standard: IEC 60068-2-3 Special conditions:  Temperature: +65°C  RH: 95%  Rate of temperature change: dT/dt >= ± 3°C/min  Recovery time: 3 hours Operating conditions: The DUT is switched ON for 5 minutes and then OFF for 15 minutes Duration: 10 days Moist Heat Cyclic Test MHCT Standard: IEC 60068-2-30, Test Db Special conditions:  Upper temperature: +55 ± 2°C  Lower temperature: +25°C ± 2°C  RH:  Upper temperature: 93%  Lower temperature: 95%  Number of cycles: 21 (1 cycle/24 hours)  Rate of temperature change: dT/dt >= ± 3°C/min  Recovery time: 3 hours Operating conditions: Un-powered Duration: 21 days
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 125 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards 8.4.4. Thermal Resistance Cycle Stress Tests The following tests the Q2687 Refreshed embedded module’s resistance to extreme temperature cycling. Table 85: Thermal Resistance Cycle Stress Tests Designation Condition Thermal Shock Test TSKT Standard: IEC 60068-2-14 Special conditions:  Upper temperature: +85°C  Lower temperature: -40°C  Rate of temperature change: 30s  Number of cycles: 200  Duration of exposure: 30 minutes  Recovery time: 3 hours Operating conditions: Un-powered Duration: 72 hours Temperature Change TCH Standard: IEC 60068-2-14, Test Nb Special conditions:  Upper temperature: +85°C  Lower temperature: -40°C  Rate of temperature change: dT/dt >= ± 3°C/min  Number of cycles: 400  Duration of exposure: 30 minutes  Recovery time: 3 hours Operating conditions: Un-powered
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 126 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards 8.4.5. Mechanical Resistance Stress Tests The following tests the Q2687 Refreshed embedded module’s resistance to vibrations and mechanical shocks. Table 86: Mechanical Resistance Stress Tests Designation Condition Sinusoidal Vibration Test SVT1 Standard: IEC 60068-2-6, Test Fc Special conditions:  Frequency range: 10Hz to 1000Hz  Displacement: ±5mm (peak)  Frequency range: 16Hz to 62Hz  Acceleration: 5G  Frequency range: 62Hz to 200Hz  Acceleration: 3G  Frequency range: 200Hz to 1000Hz  Acceleration: 1G  Sweep rate: 1 oct/min.  Test duration: 20 cycles  Sweep directions: X, Y and Z Operating conditions: Un-powered Duration: 72 hours Random Vibration Test RVT Standard: IEC 60068-2-64 Special conditions:  Density spectrum: 0.96m2/s3  Frequency range:  0.1 g2/Hz at 10Hz  0.01 g2/Hz at 250Hz  0.0005 g2/Hz at 1000Hz  0.0005 g2/Hz at 2000Hz  Slope: -3dB/octave  Acceleration: 0.9gRMS  Number of axis: 3 Operating conditions: Un-powered Duration: 16 hours Mechanical Shock Test Standard: IEC 60068-2-27, Test Ea
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 127 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards Designation Condition MST Special conditions:  Shock Test 1:  Wave form: Half sine  Peak acceleration: 30G  Duration: 11ms  Number of shocks: 8 per direction  Number of directions: 6 (±X, ±Y, ±Z)  Shock Test 2:  Wave form: Half sine  Peak acceleration: 200G  Duration: 3ms  Number of shocks: 3 per direction  Number of directions: 6 (±X, ±Y, ±Z)  Shock Test 3:  Wave form: Half sine  Peak acceleration: 100G  Duration: 6ms  Number of shocks: 3 per direction  Number of directions: 6 (±X, ±Y, ±Z) Operating conditions: Un-powered Duration: 72 hours
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 128 Product Technical Specification and Customer Design Guideline Reliability Compliance and Recommended Standards 8.4.6. Handling Resistance Stress Tests The following tests the Q2687 Refreshed embedded module’s resistance to handling malfunctions and damage. Table 87: Handling Resistance Stress Tests Designation Condition ESD Test Standard: IEC 1000-4-2 Special conditions:  Contact discharges: 10 positive and 10 negative applied  Voltage: ±2kV, ±4kV, ±6kV Operating conditions: Powered Duration: 24 hours Free Fall Test FFT Standard : IEC 60068-2-32, Test Ed Special conditions:  Drop: 2 samples for each direction  Equivalent drop height: 1m  Number of directions: 6 (±X, ±Y, ±Z)  Number of drops/face: 2 Operating conditions: Un-powered Duration: 24 hours
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 129 9. Design Guidelines This section provides general design guidelines for the Q2687 Refreshed embedded module. General Rules and Constraints Clock and other high frequency digital signals (e.g. serial buses) should be routed as far as possible from the Q2687 Refreshed embedded module analog signals. If the application design makes it possible, all analog signals should be separated from digital signals by a ground line on the PCB. Tip: It is recommended to avoid routing any signals under the embedded module on the application board. 9.1. Power Supply The power supply is one of the key issues in the design of a GSM terminal. A weak power supply design could, in particular, affect:  EMC performance  The emission spectrum  The phase error and frequency error When designing the power supply, careful attention should be paid to the following:  The quality of the power supply – low ripple, PFM or PSM systems should be avoided; linear regulation or PWM converters are preferred for low noise.  The capacity to deliver high current peaks in a short time (pulsed radio emission).  The VBATT line must support peak currents with an acceptable voltage drop which guarantees a minimal VBATT value of 3.2V (lower limit of VBATT). For PCB design constraints related to power supply tracks, ground planes and shielding, refer to section 9.2 Routing Constraints. 9.2. Antenna Another key issue in the design of a GSM terminal is the mechanical and electrical antenna adaptation. Sierra Wireless strongly recommends working with an antenna manufacturer either to develop an antenna adapted to the application or to adapt an existing solution to the application. For more information on routing constraints for the RF circuit, refer to section 9.2.5 RF Circuit.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 130 Product Technical Specification and Customer Design Guideline Design Guidelines 9.1. Layout/Pads Design Figure 68. Layout Requirement It is strongly recommended to use through-hole pads for the 4 legs of the Q2687 Refreshed embedded module. If the holes are connected internally to the ground plane, use thermal brakes.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 131 Product Technical Specification and Customer Design Guideline Design Guidelines Figure 69. Precidip Connector Pad Design (Sierra Wireless Side) 9.2. Routing Constraints 9.2.1. System Connector Refer to section 11.1 General Purpose Connector for references to the 100-pin GPC. More information is also available at http://www.naisweb.com/e/connecte/con_eng/. 9.2.2. Power Supply Since the maximum peak current can reach 2A, Sierra Wireless strongly recommends having a large width for the layout of the power supply signal (to avoid voltage loss between the external power supply and the Q2687 Refreshed embedded module supply). Pins 1, 2, 3 and 4 of the embedded module should be gathered in the same piece of copper, as shown in the figure below.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 132 Product Technical Specification and Customer Design Guideline Design Guidelines Figure 70. Power Supply Routing Example Filtering capacitors near the Q2687 Refreshed embedded module power supply are also recommended (22µF to 100µF). Attention should be paid to the ground track or the ground plane on the application board for the power supply which supplies the embedded module. The ground track or the ground plane on the application board must support current peaks as well as with the VBATT track. If the ground track between the embedded module and the power supply is a ground plane, it must not be parceled out. The routing must be done in such a way that the total line impedance could be  10m @ 217Hz. This impedance must include the bias impedances. The same care should be taken when routing the ground supply. If these design rules are not followed, phase error (peak) and power loss could occur. In order to test the supply tracks, a burst simulation circuit is given below. This circuit simulates burst emissions, equivalent to bursts generated when transmitting at full power. Figure 71. Burst Simulation Circuit
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 133 Product Technical Specification and Customer Design Guideline Design Guidelines 9.2.2.1. Ground Plane and Shielding Connection The Q2687 Refreshed embedded module shielding case is linked to the ground. The ground has to be connected to the Q Series Development Kit board through a complete layer on the PCB. A ground plane must be available on the application board to provide efficient connection to the Q2687 Refreshed embedded module shielding. The bottom side shielding of the Q2687 Refreshed embedded module is achieved through the top folded tin cover connected to the internal ground plane of the Q2687 Refreshed embedded module. This is connected through the shielding to the application ground plane. The best shielding performance is achieved when the application ground plane is a complete layer of the application PCB. To ensure good shielding of the Q2687 Refreshed embedded module, a complete ground plane layer on the application board must be available, with no trade-offs. Connections between other ground planes should be done with bias. Without this ground plane, external spurious TX or RX blockings could appear. 9.2.3. SIM Interface The length of the tracks between the Q2687 Refreshed embedded module and the SIM socket should be as short as possible. Maximum recommended length is 10cm. ESD protection is mandatory on the SIM lines if access from outside of the SIM socket is possible. The capacitor on SIM_VCC signal (100nF) must be placed as close as possible to the DALC208SC6 component on the PCB (refer to section 4.9 SIM Interface). 9.2.4. Audio Circuit To get better acoustic performances, the basic recommendations are as follows:  The speaker lines (SPKxx) must be routed in parallel without any wires in between  The microphone lines (MICxx) must be routed in parallel without any wires in between All the filtering components (RLC) must be placed as close as possible to the associated MICxx and SPKxx pins. 9.2.5. RF Circuit If RF signals need to be routed on the application board, the RF signals must be routed using tracks with a 50 characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the Figure below and that is available free of charge at http://www.agilent.com).
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 134 Product Technical Specification and Customer Design Guideline Design Guidelines Figure 72. AppCad Screenshot for MicroStrip Design If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) “outside” the RF structure as shown in the figure below. Figure 73. Routing Examples Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some bias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighboring electronics (AF amplifier, etc.). In the same way, the neighboring electronics (micro-controllers, etc.) may degrade the reception performances. The GSM/GPRS connector is intended to be directly connected to a 50Ω antenna and no matching is needed. If the GSM/GPRS/EGPRS RF connections need to be implemented on the application board (for mechanical purposes, for instance), there are four main possible connections:  via UFL/SMA connector  via Coaxial cable
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 135 Product Technical Specification and Customer Design Guideline Design Guidelines  via Precidip connector 9.2.5.1. UFL/SMA Connector The antenna can be connected to the Q2687 Refreshed embedded module through the UFL connector present on the embedded module by inserting the plug in the receptacle. This step is done prior to the Q2687 Refreshed embedded module mounting. Figure 74. UFL/SMA Connector 9.2.5.2. Coaxial Cable The antenna can also be connected to the Q2687 Refreshed embedded module through a coaxial cable. The coaxial cable is connected to both the “RF pad” (Round pad) and the “Ground pad”. It is recommended to use an RG178 coaxial cable with the following characteristics:  Static curvature radius :10mm  Dynamic curvature radius :20mm The cable must be soldered as follows:  The shielding of the antenna cable must be soldered on the “Ground pad”.  The antenna cable core must be soldered only once positioned in line with the “RF pad” and “Ground pad”. Tip: It is highly recommended to use a template to adjust the antenna cable to the “RF pad” and “Ground pad” before soldering. When soldering the antenna cable, the temperature of the iron must not exceed 350°C for 3 seconds. Note: The coaxial cable can be soldered in any direction. It can also be soldered on the “opposite direction”. In this case, it is necessary to solder it in a curve. This step is done after the Q2687 Refreshed embedded module mounting.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 136 Product Technical Specification and Customer Design Guideline Design Guidelines Figure 75. Antenna Connection to both RF pad and Ground pad 9.2.5.3. Precidip Connector Lastly, the Q2687 Refreshed embedded module can also be connected through the Precidip connecter. For more information on the contact pad available on the Q2687 Refreshed embedded module, refer to section 9.1 Layout/Pads Design. For more information on the mounting, assembling and handling of this component, contact your Precidip supplier directly (Preci-dip SA at http://www.precidip.com). Sierra Wireless cannot support customers regarding the use of this connector. Figure 76. Precidip Connector
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 137 Product Technical Specification and Customer Design Guideline Design Guidelines 9.3. EMC and ESD Recommendations EMC tests have to be performed on the application as soon as possible to detect any potential problems. When designing, special attention should be paid to:  Possible spurious emissions radiated by the application to the RF receiver in the receiver band  ESD protection is mandatory on all signals which are externally accessible  Typically, ESD protection is mandatory for the: o SIM (if accessible from outside) o Serial link  Length of the SIM interface lines (preferably <10cm)  EMC protection on audio input/output (filters against 900MHz emissions)  Biasing of the microphone inputs  Ground plane: Sierra Wireless recommends a common ground plane for analog/digital/RF grounds  A metallic case or plastic casing with conductive paint are recommended, except area around the antenna Note: The Q2687 Refreshed embedded module does not include any protection against over voltage. 9.4. Mechanical Integration Attention should be paid to:  Antenna cable integration (bending, length, position, etc)  Leads of the Embedded Module to be soldered to the Ground plane
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 138 Product Technical Specification and Customer Design Guideline Design Guidelines 9.5. Operating System Upgrade The Q2687 Refreshed Embedded Module Operating System is stored in flash memory and can be easily upgraded. Important: In order to follow regular changes in the GPRS standard and to offer a state-of-the-art operating system, Sierra Wireless recommends that the application designed around an Embedded Module (or Embedded Module–based product) should allow easy operating system upgrades on the Embedded Module via the standard XMODEM protocol. Therefore, the application shall either allow a direct access to the Embedded Module serial link through an external connector or implement any mechanism allowing the Embedded Module operating system to be downloaded via XMODEM. The operating system file can be downloaded to the embedded module using the XMODEM protocol. The AT+WDWL command allows the downloading process to be launched. For more details, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33). The serial signals required to proceed with XMODEM downloading are:  RXD  TXD  RTS  CTS  GND The Operating System file can also be downloaded to the embedded module using the DOTA (download over the air) feature. This feature is available with the Sierra Wireless Software Suite interface. For more details, refer to the list of documents in section 13.2 Reference Documents.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 139 10. Embedded Testability 10.1. Serial Link Access Direct access to UART1 serial link is very useful for:  Testability operations  Firmware download (for more information on firmware upgrade, refer to section 3.3 Firmware Upgrade) To allow that access, the following serial link access design is recommended: Figure 77. Main Serial Link (UART1) Debug Access When it is necessary to download firmware into the Q2687 Refreshed embedded module without going through the RS232 interface, access to the embedded module is forced via the debug connector. In such cases, input signals coming from this connector masks the input signals coming from the ADM3307 device. VCC_2V8 and GND are available on the debug connector to allow the powering of an external RS232 transceiver in order to communicate with a PC via a COM (COM1 or COM2) port, for example. It is also possible to trace the signals on the serial link through the debug connector.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 140 Product Technical Specification and Customer Design Guideline Embedded Testability Note: R4 is used to have the possibility to disable the R1OUT, R2OUT and R3OUT of the ADM3307 by the enable signal (~EN) when the debug connector is used. For debug connector use, TP6 must be connected to VCC_2V8. For normal use, TP6 must be left open. An economical solution consists of making the debug connection using 7 test points (TP) and placing these points on the edge of the application board. Caution: If communications on UART1 above the baud rate of 720kbps is needed, an external power supply source (3.0V typical) should be used. 10.2. RF Output Accessibility During the integration phase of the Q2687 Refreshed embedded module, it can be helpful to connect the Q2687 Refreshed embedded module to a GSM/GPRS simulator in order to check critical RF TX parameters and power behaviour. Although the Q2687 Refreshed embedded module has been certified, some parameters may have degraded due to some basic precautions not having been followed (poor power supply, for example). This will not affect the functionality of the product, but the product will not comply with GSM specifications. The following TX parameters can be checked using a GSM/GSM simulator:  Phase & Frequency Error  Output Power and GSM Burst Time  Output Spectrum (Modulation and Switching) Listed below are available typical GSM/GPRS simulators:  CMU200 from Rhode & Schwarz  8960 from Agilent Because of the high prices associated with GSM/GPRS simulators and the necessary GSM know-how to perform simulations, customers can check their applications in the Sierra Wireless laboratories. Contact the Sierra Wireless support team for more information.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 141 11. Connector and Peripheral Device References This section contains a list of recommended manufacturers or suppliers for the peripheral devices to be used with the Q2687 Refreshed embedded module. 11.1. General Purpose Connector The GPC is a 100-pin connector with 0.5mm pitch from the from PANASONIC Group's P5K series, with the following reference:  AXK600347BN1 The mating connector has the following reference:  AXK500147BN1J The stacking height is 3.0 mm. Sierra Wireless recommends that the AXK500147BN1J connector is used for applications to benefit from Sierra Wireless prices. For more information, contact Sierra Wireless and specify the Sierra Wireless connector reference: WM18868. For further details see the GPC data sheets in the appendix. More information is also available from http://www.panasonic.com/host/industrl.html. 11.2. SIM Card Reader  ITT CANNON CCM03 series (see http://www.ittcannon.com)  AMPHENOL C707 series (see http://www.amphenol.com)  JAE (see http://www.jae.com) Drawer type:  MOLEX (see http://www.molex.com)  Connector: MOLEX 99228-0002  Holder: MOLEX 91236-0002 11.3. Microphone The microphone selected must comply with GSM recommendations in terms of frequency response. Possible suppliers:  HOSIDEN (see http://www.hosiden.co.jp/)  PANASONIC (see http://www.panasonic/com/industrial/components/)  PEIKER
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 142 Product Technical Specification and Customer Design Guideline Connector and Peripheral Device References 11.4. Speaker The speaker selected must comply with GSM recommendations in terms of frequency response. Possible suppliers:  SANYO (see http://www.sanyo.com/industrial/components/)  HOSIDEN (see http://www.hosiden.co.jp/)  PRIMO (see http://www.primo.com.sg/)  PHILIPS (see http://www.semiconductors.philips.com/) 11.5. Antenna Cable A wide variety of cables fitted with UFL connectors is offered by HIROSE (refer to the UFL datasheet in document [14] AirPrime Q2687 Product Technical Specification for more information):  UFL pigtails, Ex: Ref = U.FL-2LP(V)-04-A-(100)  UFL Ref = U.FL-R-SMT  UFL cable assemblies,  Between series cable assemblies. More information is also available from http://www.hirose-connectors.com/. A coaxial cable can also be soldered on the RF pad. The following references have been certified for mounting on the Q2687 Refreshed embedded module:  RG178  RG316 11.6. RF board-to-board connector The supplier for the Precidip connector is Preci-dip SA (see http://www.precidip.com), with the following reference:  9PM-SS-0003-02-248//R1 11.7. GSM antenna GSM antennas and support for antenna adaptation can be obtained from manufacturers such as:  ALLGON (see http://www.allgon.com)  IRSCHMANN (see http://www.hirschmann.com/)  MOTECO (see http://www.moteco.com)  GALTRONICS (see http://www.galtronics.com) The following table lists the contact details for other GSM antenna providers.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 143 Product Technical Specification and Customer Design Guideline Connector and Peripheral Device References Table 88: Contact Information of GSM Antenna Providers Provider Reference Address Contact Mat Equipment MA112VX00 Z.I. La Boitardière Chemin du Roy 37400 Amboise FRANCE Laurent.LeClainche@matequipement.com Tel: +33 2 47 30 69 70 Fax: +33 2 47 57 35 06 ProComm MU 901/1801/UMTS-MMS + 2M FME Europarc 121, Chemin des Bassins F-94035 CRETEIL CEDEX Tel: +33 1 49 80 32 00 Fax: +33 1 49 80 12 54 procom@procom.fr 11.8. Buzzer One possible Buzzer supplier is:  SAMBU (see http://www.sambuco.co.kr)
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 144 12. Certification Compliance and Recommended Standards 12.1. Certification Compliance The Q2687 Refreshed Embedded Module connected on a development kit board application is compliant with the following requirements. Table 89: Standards Conformity for the Q2687 Refreshed Embedded Module Domain Applicable Standard Safety standard EN 60950-1 (ed.2006) Health standard (EMF Exposure Evaluation) EN 62311 (ed. 2008) Efficient use of the radio frequency spectrum EN 301 511 (V 9.0.2) EMC EN 301 489-1 (v1.8.1) EN 301 489-7 (v1.3.1) FCC FCC Part 15 FCC Part 22, 24 IC RSS-132 Issue 2 RSS-133 Issue 5 12.2. Applicable Standards Listing The table hereafter gives the basic list of standards applicable for the Q2687 Refreshed Embedded Module (2G (R99/Rel. 4)). Note: References to any features can be found from these standards. Table 90: Applicable Standards and Requirements for the Q2687 Refreshed Embedded Module Document Current Version Title GCF 3.37.0 GSM Certification Forum - Certification Criteria NAPRD.03 5.2 Overview of PCS Type certification review board (PTCRB) Mobile Equipment Type Certification and IMEI control TS 51.010-1 9.0.1 3rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 1: Conformance specification TS 51.010-2 9.0.1 3rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) proforma specification TS 51.010-4 4.14.1 3rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 4: SIM Application Toolkit Conformance specification EN 301 511 9.0.2 Global System for Mobile Communications (GSM); Harmonised standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC)
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 145 Product Technical Specification and Customer Design Guideline Certification Compliance and Recommended Standards Document Current Version Title ETSI 102.230 3.9.0 Smart cards; UICC-Terminal interface; Physical, electrical and logical test specification(Release 99) EN 301 908-2 3.2.1 Global System for Mobile Communications (GSM); Harmonised standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) Federal Communications Commission (FCC) rules and Regulations: Power listed on the Grant is conducted for Part 22 and conducted for Part 24. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. Antennas used for this OEM module must not exceed a gain of 8.4dBi (850 MHz) and 3.5dBi (1900 MHz) for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. Installed in other portable devices, the exposure condition requires a separate equipment authorization. The licensed module has an FCC ID label on the module itself. The FCC ID label must be visible through a window or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the device that contains the following text: Contains FCC ID: N7NQ2687 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. this device may not cause harmful interference, 2. this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT: Manufacturers of mobile or fixed devices incorporating the Q2687 Refreshed Embedded Module are advised to:  clarify any regulatory questions,  have their completed product tested,  have product approved for FCC compliance, and  include instructions according to the above mentioned RF exposure statements in the end product user manual. Please note that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 146 13. References 13.1.1. Web Site Support Check the Sierra Wireless website at http://sierrawireless.com for the latest documentation available. Content Web Site General information about the Q Series Intelligent Embedded Module http://www.sierrawireless.com/productsandservices/AirPrime/Embedded_Modules/Q_Series.aspx Specific support about the Q2687 Refreshed Embedded Module http://www.sierrawireless.com/productsandservices/AirPrime/Embedded_Modules/Q_Series/Q2687.aspx Carrier/Operator approvals http://www.sierrawireless.com/Support/Downloads/AirPrime/Q_Series/AirPrime_Q2687.aspx Sierra Wireless Software Suite Introduction http://www.sierrawireless.com/en/productsandservices/AirPrime/Sierra_Wireless_Software_Suite.aspx Developer support for software and hardware http://forum.sierrawireless.com/ 13.2. Reference Documents For more details, several reference documents can be consulted. The Sierra Wireless documents referenced herein are provided in the Sierra Wireless documentation package; however, the general reference documents which are not Sierra Wireless owned are not provided in the documentation package. 13.2.1. Sierra Wireless Software Documentation [1] Getting started with SDK 2.33 Reference: WM_DEV_OAT_UGD_048 [2] Tutorial for IDE 1.08 (if using IDE; obsolete if using Developer Studio) Reference: WM_DEV_OAT_UGD_044 [3] Tools Manual for IDE (if using IDE; obsolete if using Developer Studio) Reference: WM_DEV_OAT_UGD_045 [4] Basic Development Guide for SDK 2.33 (if using IDE; obsolete if using Developer Studio) Reference: WM_DEV_OAT_UGD_050 [5] ADL User Guide for SDK 2.33 (if using IDE; obsolete if using Developer Studio) Reference: WM_DEV_OAT_UGD_051 [6] SDK 2.33 Official Release Note Reference: WM_DEV_OAT_DVD_338 [7] Getting Started with the Sierra Wireless Software Suite 2.32
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 147 Product Technical Specification and Customer Design Guideline References WM_DEV_OAT_UGD_078 13.2.2. Firmware Documentation [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33) Reference: WM_DEV_OAT_UGD_079 (Version 14) [9] AT Commands Interface Guide (Bluetooth) Reference: WM_ASW_BLU_UGD_001 [10] Firmware 7.43 Customer Release Note Reference: TBC 13.2.3. Hardware Documentation [11] AirPrime Q2687 Classic Product Technical Specification Reference: WM_DEV_Q2687_PTS_001 [12] AirPrime Q26xx Process Customer Guidelines Reference: WM_PRJ_Q2686_PTS_004 [13] AirPrime Q2687 Customer Design Guidelines Reference: WA_DEV_Q2687_PTS_007 [14] AirPrime Q2687 Product Technical Specification Reference: WA_ENG_Q2687_PTS_001 [15] AirPrime Q Series Development Kit User Guide Reference: WM_BBD_Q26_UGD_001 [16] AirPrime Q2687 Refreshed Migration Guide Reference: WA_DEV_Q26RD_UGD_001 [17] AirPrime Q2686 Product Technical Specification Reference: WM_PRJ_Q2686_PTS_001 [18] AirPrime Q2686 Customer Design Guideline WM_PRJ_Q2686_PTS_003 13.2.4. Other Sierra Wireless Documentation [19] Automotive Environmental Control Plan for AirPrime Q2687 Refreshed Intelligent Embedded Module Reference: WM_QUA_Q2687_DCP_001 [20] Bluetooth Interface Application Note Reference: WM_ASW_OAT_APN_016
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 148 Product Technical Specification and Customer Design Guideline References 13.2.5. Other Related Documentation [21] “I2C Bus Specification”, Version 2.0, Philips Semiconductor 1998 [22] ISO 7816-3 Standard 13.2.6. Application Notes For other application notes, the following reference designs are available upon request to Sierra Wireless support. Title Description Power Supply with automotive constraints DC-DC converter based on STMicroElectronics L5973AD VIN = 5.5...32V VOUT = 3.8V Especially designed to meet Sierra Wireless Intelligent Embedded Module requirements. CAN Interface (high speed) CAN Interface over SPI based on: - MicroChip MCP2515 CAN Controller, - Philips PCA82C250T CAN Transceiver. CAN Interface (low speed) CAN Interface (over SPI) based on: - MicroChip MCP2515 CAN Controller, - Philips TJA1054A CAN Transceiver. Bluetooth Connection Provides BlueTooth Connectivity (over UART2) based on: Murata LBMA29BAE2 HCI BlueTooth module. Dual USB Interface Provides 2 separate serial ports on a USB interface, based on: FTDI FTDI2232C Dual USB UART with FIFO Power Supply on USB VIN = 5.0V (from USB supply) VOUT = 3.8V Especially designed to meet Sierra Wireless Intelligent Embedded Module and power supply requirements. Full GSM-GPRS modem on USB Based on the two previous designs 13.3. List of Abbreviations Abbreviation Definition AC Alternative Current ADC Analog to Digital Converter A/D Analog to Digital conversion AF Audio-Frequency AT ATtention (prefix for modem commands) AUX AUXiliary CAN Controller Area Network CB Cell Broadcast CEP Circular Error Probable CLK CLocK
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 149 Product Technical Specification and Customer Design Guideline References Abbreviation Definition CMOS Complementary Metal Oxide Semiconductor CS Coding Scheme CTS Clear To Send DAC Digital to Analogue Converter dB Decibel DC Direct Current DCD Data Carrier Detect DCE Data Communication Equipment DCS Digital Cellular System DR Dynamic Range DSR Data Set Ready DTE Data Terminal Equipment DTR Data Terminal Ready EDGE Enhance Data rates for GSM Evolution EFR Enhanced Full Rate E-GSM Extended GSM EGPRS Enhance GPRS EMC ElectroMagnetic Compatibility EMI ElectroMagnetic Interference EMS Enhanced Message Service EN ENable ESD ElectroStatic Discharges FIFO First In First Out FR Full Rate FTA Full Type Approval GND GrouND GPI General Purpose Input GPC General Purpose Connector GPIO General Purpose Input Output GPO General Purpose Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile communications HR Half Rate I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX MAXimum MIC MICrophone MIN MINimum MMS Multimedia Message Service MO Mobile Originated MT Mobile Terminated na Not Applicable
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 150 Product Technical Specification and Customer Design Guideline References Abbreviation Definition NF Noise Factor NMEA National Marine Electronics Association NOM NOMinal NTC Negative Temperature Coefficient PA Power Amplifier Pa Pascal (for speaker sound pressure measurements) PBCCH Packet Broadcast Control CHannel PC Personal Computer PCB Printed Circuit Board PDA Personal Digital Assistant PFM Power Frequency Modulation PSM Phase Shift Modulation PWM Pulse Width Modulation RAM Random Access Memory RF Radio Frequency RFI Radio Frequency Interference RHCP Right Hand Circular Polarization RI Ring Indicator RST ReSeT RTC Real Time Clock RTCM Radio Technical Commission for Maritime services RTS Request To Send RX Receive SCL Serial CLock SDA Serial DAta SIM Subscriber Identification Module SMS Short Message Service SPI Serial Peripheral Interface SPL Sound Pressure Level SPK SPeaKer SRAM Static RAM TBC To Be Confirmed TDMA Time Division Multiple Access TP Test Point TVS Transient Voltage Suppressor TX Transmit TYP TYPical UART Universal Asynchronous Receiver-Transmitter USB Universal Serial Bus USSD Unstructured Supplementary Services Data VSWR Voltage Standing Wave Ratio
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 151 14. Safety Recommendations (For Information Only) For the efficient and safe operation of your GSM application based on the Q2687 Refreshed Embedded Module, please read this information carefully. 14.1. RF Safety 14.1.1. General Your GSM terminal is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used telecommunication standard. Your GSM terminal is actually a low power radio transmitter and receiver. It sends out as well as receives radio frequency energy. When you use your GSM application, the cellular system which handles your calls controls both the radio frequency and the power level of your cellular modem. 14.1.2. Exposure to RF Energy There has been some public concern about possible health effects of using GSM terminals. Although research on health effects from RF energy has focused on the current RF technology for many years, scientists have begun research regarding newer radio technologies, such as GSM. After existing research had been reviewed, and after compliance to all applicable safety standards had been tested, it has been concluded that the product was fitted for use. If you are concerned about exposure to RF energy, there are things you can do to minimize exposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can reduce RF exposure by operating your cellular terminal efficiently by following the guidelines below. 14.1.3. Efficient Terminal Operation For your GSM terminal to operate at the lowest power level, consistent with satisfactory call quality: If your terminal has an extendable antenna, extend it fully. Some models allow you to place a call with the antenna retracted. However your GSM terminal operates more efficiently with the antenna when it is fully extended. Do not hold the antenna when the terminal is "IN USE". Holding the antenna affects call quality and may cause the modem to operate at a higher power level than needed. 14.1.4. Antenna Care and Replacement Do not use the GSM terminal with a damaged antenna. If a damaged antenna comes into contact with the skin, a minor burn may result. Replace a damaged antenna immediately. You may repair antenna to yourself by following the instructions provided to you. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 152 Product Technical Specification and Customer Design Guideline Safety Recommendations (For Information Only) Buy or replace the antenna only from the approved suppliers list. Using unauthorized antennas, modifications or attachments could damage the terminal and may contravene local RF emission regulations or invalidate type approval. 14.2. General Safety 14.2.1. Driving Check the laws and the regulations regarding the use of cellular devices in the area where you have to drive as you always have to comply with them. When using your GSM terminal while driving, please:  give full attention to driving,  pull off the road and park before making or answering a call if driving conditions so require. 14.2.2. Electronic Devices Most electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy. However, RF energy may affect some improperly shielded electronic equipment. 14.2.3. Vehicle Electronic Equipment Check with your vehicle manufacturer representative to determine if any on-board electronic equipment is adequately shielded from RF energy. 14.2.4. Medical Electronic Equipment Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to determine if they are adequately shielded from external RF energy. Turn your terminal OFF in health care facilities when any regulations posted in the area instruct you to do so. Hospitals or health care facilities may be using RF monitoring equipment. 14.2.5. Aircraft Turn your terminal OFF before boarding any aircraft.  Use it on the ground only with crew permission.  Do not use it in the air. To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you should have prior permission from a crew member to use your terminal while the aircraft is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your modem while airborne.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 153 Product Technical Specification and Customer Design Guideline Safety Recommendations (For Information Only) 14.2.6. Children Do not allow children to play with your GSM terminal. It is not a toy. Children could hurt themselves or others (by poking themselves or others in the eye with the antenna, for example). Children could damage the modem, or make calls that increase your modem bills. 14.2.7. Blasting Areas To avoid interfering with blasting operations, turn your unit OFF when you are in a "blasting area" or in areas posted: "turn off two-way radio". Construction crew often uses remote control RF devices to set off explosives. 14.2.8. Potentially Explosive Atmospheres Turn your terminal OFF when in any area with a potentially explosive atmosphere. Though it is rare, but your modem or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodily injuries or even death. Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fuelling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storage facilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders. Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle which contains your terminal or accessories. Before using your terminal in a vehicle powered by liquefied petroleum gas (such as propane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the vehicle is used.

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