Sigma Designs ZM5304-U Z-Wave Serial Interface Module with On-Board Antenna User Manual
Sigma Designs Inc Z-Wave Serial Interface Module with On-Board Antenna
User Manual.pdf
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| Document Description | User Manual.pdf |
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| Date Submitted | 2013-08-23 00:00:00 |
| Date Available | 2014-02-19 00:00:00 |
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DATASHEET: ZM5304 FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH ON-BOARD ANTENNA Features Complete Z-Wave stack available over UART or USB 32kB of byte addressable NVM memory Fully Integrated crystal, EEPROM, SAW filter, matching circuit, and antenna Supply voltage range from 2.3V-3.6V for optional battery operation No external components required FCC modular approval CE self-certified ITU G.9959 compliant Radio Transceiver The Sigma Designs ZM5304 Modem is a fully integrated Z-Wave modem module in a small 27mmx15.2mmx5.5mm form factor. It is an ideal solution for home control applications such as access control, appliance control, AV control, building automation, energy management, lighting, security, and sensor networks in the “Internet of Things”. A baseband controller, sub-1 GHz radio transceiver, crystal, decoupling, SAW filter, matching, and the antenna is included to provide a complete Z-Wave solution to an application executing in an external host microcontroller. The ZM5304 Modem is certified with the FCC modular approval, ready to be used in any product without additional testing and license costs. The ZM5304 Modem is based on an 8-bit 8051 CPU core, which is optimized to handle the data and link management requirements of a Z-Wave node. The UART or USB interface can be used to access the Z-Wave stack available in the on-chip Flash memory, or to easily upgrade the modem firmware. FCC ID IC ID DSH12461-3 | 7/2013 TBD TBD Receiver sensitivity with SAW filter down to -103dBm Transmit power with SAW filter up to +2dBm Z-Wave 9.6/40/100kbps data rates Supports all Z-Wave sub-1 GHz frequency bands (865.2-926.3 MHz) Supports multi-channel frequency agility and listen before talk Regulatory Compliance ACMA: AS/NZS 4268 CE: EN 300 220/489 FCC: CFR 47 Part 15 Modular Approval IC: RSS-GEN/210 MIC: ARIB STD-T108 Modem UART speed up to 230.4kbps USB 2.0 full speed Z-Wave serial API accessed over UART or USB Firmware upgradeable via UART or USB TX mode current typ. 40mA @ +2dBm RX mode current typ. 32mA Normal mode current typ. 15mA Sleep mode current typ. 2µA Less than 1ms cold start-up time Power-On-Reset / Brown-out Detector Datasheet: ZM5304 CONTENT OVERVIEW .......................................................................................................................................................................... 4 2.1 PERIPHERALS ........................................................................................................................................................................... 4 2.1.1 Advanced Encryption Standard Security Processor ..................................................................................................... 4 2.1.2 Analog-to-Digital Converter ........................................................................................................................................ 5 2.1.3 Crystal Driver and System Clock .................................................................................................................................. 5 2.1.4 Interrupt Controller ..................................................................................................................................................... 5 2.1.5 Power-On-Reset / Brown-Out Detector....................................................................................................................... 6 2.1.6 Reset Controller ........................................................................................................................................................... 6 2.1.7 Universal Asynchronous Receiver / Transmitter ......................................................................................................... 6 2.1.8 Universal Serial Bus ..................................................................................................................................................... 6 2.1.9 Watchdog .................................................................................................................................................................... 7 2.1.10 Wireless Transceiver.................................................................................................................................................... 7 2.2 MEMORY MAP ........................................................................................................................................................................ 7 2.3 MODULE PROGRAMMING.......................................................................................................................................................... 8 2.3.1 Entering In-System Programming Mode ..................................................................................................................... 8 2.3.2 Entering Auto Programming Mode ............................................................................................................................. 8 2.4 POWER SUPPLY REGULATOR ...................................................................................................................................................... 8 TYPICAL APPLICATION ........................................................................................................................................................ 9 PAD CONFIGURATION ....................................................................................................................................................... 10 4.1 PAD FUNCTIONALITY ............................................................................................................................................................... 10 ELECTRICAL CHARACTERISTICS .......................................................................................................................................... 12 5.1 TEST CONDITIONS .................................................................................................................................................................. 12 5.1.1 Typical Values............................................................................................................................................................ 12 5.1.2 Minimum and Maximum Values ............................................................................................................................... 12 5.2 ABSOLUTE MAXIMUM RATINGS ................................................................................................................................................ 13 5.3 GENERAL OPERATING RATINGS ................................................................................................................................................. 13 5.4 CURRENT CONSUMPTION ........................................................................................................................................................ 13 5.5 SYSTEM TIMING ..................................................................................................................................................................... 14 5.6 NON-VOLATILE MEMORY RELIABILITY ........................................................................................................................................ 15 5.7 ANALOG-TO-DIGITAL CONVERTER ............................................................................................................................................. 16 5.8 DC CHARACTERISTICS ............................................................................................................................................................. 16 5.9 RF CHARACTERISTICS .............................................................................................................................................................. 17 5.9.1 Transmitter................................................................................................................................................................ 17 5.9.2 Receiver ..................................................................................................................................................................... 18 5.9.3 Antenna ..................................................................................................................................................................... 21 5.9.4 Regulatory Compliance ............................................................................................................................................. 22 Z-WAVE FREQUENCIES ...................................................................................................................................................... 23 MODULE INFORMATION ................................................................................................................................................... 24 7.1 7.2 PCB MOUNTING AND SOLDERING..................................................................................................................................... 25 8.1 8.2 MODULE MARKING ................................................................................................................................................................ 24 MODULE DIMENSIONS ............................................................................................................................................................ 24 RECOMMENDED PCB MOUNTING PATTERN................................................................................................................................ 25 RECOMMENDED PLACEMENT ON PCB ....................................................................................................................................... 26 DSH12461-3 | 7/2013 Datasheet: ZM5304 8.3 SOLDERING INFORMATION ....................................................................................................................................................... 26 ORDERING INFORMATION ................................................................................................................................................ 28 9.1 TAPE AND REEL INFORMATION ................................................................................................................................................. 29 10 REVISION HISTORY ........................................................................................................................................................ 31 11 REFERENCES .................................................................................................................................................................. 32 DSH12461-3 | 7/2013 Datasheet: ZM5304 OVERVIEW The ZM5304 Modem is a fully integrated module with an on-board antenna that allows the establishment of a Z-Wave network with minimum risk. The SD3503 modem chip is used with an external NVM (EEPROM), 32MHz crystal, power supply decoupling, SAW filter, matching circuit, and a helical antenna. Figure 2.1 shows the main blocks of the ZM5304 Modem, while Figure 2.2 illustrates the firmware stack of an example application. ZM5304 EEPROM Memory SPI SD3503 VDD RESET_N RXD TXD Decoupling Voltage Regulator ADC POR / BOD AES Helical Antenna UART 8051 CPU USB Flash Memory USB_DP USB_DM Sub-1 GHz Radio Transceiver SAW Filter & Matching 32MHz XTAL Figure 2.1: Functional block diagram HOST Application UART / USB ZM5304 Z-Wave® Serial API Z-Wave® Protocol Stack Network Layer MAC Layer PHY Layer ITU G.9959 Figure 2.2: Firmware stack 2.1 PERIPHERALS 2.1.1 ADVANCED ENCRYPTION STANDARD SECURITY PROCESSOR The Z-Wave protocol specifies the use of Advanced Encryption Standard (AES) 128-bit block encryption for secure applications. The built-in Security Processor is a hardware accelerator that encrypts and decrypts data at a rate of 1 byte per 1.5µs. It encodes DSH12461-3 | 7/2013 Datasheet: ZM5304 the frame payload and the message authentication code to ensure privacy and authenticity of messages. The processor supports Output FeedBack (OFB), Cipher-Block Chaining (CBC), and Electronic CodeBook (ECB) modes to target variable length messages. Payload data is streamed in OFB mode, and authentication data is processed in CBC mode as required by the Z-Wave protocol. The processor implements two efficient access methods: Direct Memory Access (DMA) and streaming through Special Function Register (SFR) ports. The processor functionality is exposed via the Z-Wave API for application use. 2.1.2 ANALOG-TO-DIGITAL CONVERTER The Analog-to-Digital Converter (ADC) is capable of sampling an input voltage source and returns an 8 or 12 bit unsigned representation of the input scaled relative to the selected reference voltage, as described by the formula below. The ADC is capable of operating rail to rail, while the following input configurations apply (V BG = built-in Band-gap 1.25V, VDD = supply voltage): Table 2.1: ADC voltage source configuration options Source VIN VREF+ VREF- Description The sampling input voltage The positive node of the reference voltage The negative node of the reference voltage Pin VBG VBG, VDD GND If the sampling input voltage crosses a predefined lower or upper voltage threshold, an interrupt is triggered. Setting V IN = VBG and VRFE+ = VDD implements a battery monitor. 2.1.3 CRYSTAL DRIVER AND SYSTEM CLOCK The system clock and RF frequencies are derived from an external 32MHz crystal (XTAL) which is factory trimmed to guarantee initial frequency precision. The temperature and 5 years aging margin for the 32MHz crystal is 15 ppm. 2.1.4 INTERRUPT CONTROLLER The interrupts are shared between the user application and the Z-Wave protocol. Priorities for the interrupts are pre-assigned by the Z-Wave protocol implementation. Therefore, constraints for the user application apply. Table 2.2: Interrupt vector table Vector 14 Interrupt Name UART General Purpose Timer ADC RF NMI DSH12461-3 | 7/2013 Priority 10 Resources served UART General Purpose Timer Battery monitor, ADC low and high monitor RF DMA Non Maskable Interrupt for debugger and more Datasheet: ZM5304 2.1.5 POWER-ON-RESET / BROWN-OUT DETECTOR When a cold start-up occurs, an internal Power-On-Reset (POR) circuit ensures that code execution does not begin unless the supply voltage is sufficient. After which, an internal Brown-Out Detector (BOD) circuit guarantees that faulty code execution does not occur by entering the reset state, if the supply voltage drops below the minimum operating level. These guarantees apply equally in both the active and sleep modes. 2.1.6 RESET CONTROLLER After a reset event, the MCU is reinitialized in less than 1ms. This delay is mostly due to the charge time of the internal and external supply capacitances, and bringing the XTAL clock into a stable oscillation. Multiple events may cause a reset. Therefore, the actual cause is latched by hardware and may be retrieved via software when the system resumes operation. Some reset methods deliberately leave the state of GPIO pins unchanged, while other GPIO pins are set to high impedance with an internal weak pull-up. Table 2.3: Supported reset methods Reset Cause POR BOR RESET_N WATCHDOG Description Reset request generated by Power-OnReset hardware Reset request generated by Brown-OutReset hardware Reset request generated by the RESET_N pin being de-asserted Reset request generated by the WATCHDOG Timer timing out GPIO state High impedance with pull-up High impedance with pull-up High impedance with pull-up High impedance with pull-up Maskable NO NO NO YES 2.1.7 UNIVERSAL ASYNCHRONOUS RECEIVER / TRANSMITTER The Universal Asynchronous Receiver / Transmitter (UART) is a hardware block operating independently of the 8051 CPU. It offers full-duplex data exchange, up to 230.4kbps, with an external host microcontroller requiring an industry standard NRZ asynchronous serial data format. The UART interface is available over EP4 and EP5 (refer section 4). A data byte is shifted as a start bit, 8 data bits (lsb first), and a stop bit, respectively, with no parity and hardware handshaking. Figure 2.3 shows the waveform of a single serial byte. The UART is compliant with RS-232 when an external level converter is used. START BIT D0 D1 D2 D3 D4 D5 D6 D7 STOP BIT Figure 2.3: UART waveform 2.1.8 UNIVERSAL SERIAL BUS A Universal Serial Bus (USB) 2.0 full speed interface is available over EP6 and EP7 (refer section 4). The Communication Device Class / Abstract Control Mode (CDC/ACM) provides an emulated virtual COM port to a host. This makes it easy to migrate from legacy RS-232 communication to USB communication. Figure 2.4 shows the two termination resistors necessary to maintain signal integrity of the differential pair and a single pull-up resistor on USB_DP, which indicates a full speed device to the host. DSH12461-3 | 7/2013 Datasheet: ZM5304 ZM5304 USB_DP USB_DM Host Figure 2.4: USB interface 2.1.9 WATCHDOG The watchdog helps prevents the CPU from entering a deadlock state. A timer that is enabled by default achieves this by triggering a reset event in case it overflows. The timer overflows in 1 second, therefore it is essential that the software clear the timer periodically. The watchdog is disabled when the chip is in power down mode, and automatically restarts with a cleared timer when waking up to the active mode. 2.1.10 WIRELESS TRANSCEIVER The wireless transceiver is a sub-1 GHz ISM narrowband FSK radio, a modem, and a baseband controller. This architecture provides an all-digital direct synthesis transmitter and a low IF digital receiver. The Z-Wave protocol currently utilizes 2-key FSK/GFSK modulation schemes at 9.6/40/100 kbps data rates throughout a span of carrier frequencies from 865.2 to 926.3MHz. The output power of the transmitter is configurable in the range -26dBm to +2dBm (VDD = 2.3 to 3.6V, TA = -10 to +85°C). 2.2 MEMORY MAP An application executing on an external host microcontroller can access a minimum of 16kB allocated on the higher address space of the integrated EEPROM via the serial API. As shown in Figure 2.5, the protocol data is stored in the lower address space. A serial API function returns the size of the application data space. [1][2] EEPROM Memory (Byte addressable) 16kB (min) Application Data (Available to Host) Offset Protocol Data (Reserved for Modem) Figure 2.5: EEPROM memory map DSH12461-3 | 7/2013 Datasheet: ZM5304 2.3 MODULE PROGRAMMING The firmware of the ZM5304 Modem can be upgraded through the UART or USB interface. [3] In-System Programming is the default mode delivered from the factory. 2.3.1 ENTERING IN-SYSTEM PROGRAMMING MODE The module can be placed into the UART In-System Programming (ISP) mode by asserting the active low RESET_N signal for 4.2ms. The programming unit of the module then waits for the “Interface Enable” serial command before activating the ISP mode over the UART. 2.3.2 ENTERING AUTO PROGRAMMING MODE Alternatively, the module can be placed into the Auto Programming Mode (APM) by calling a serial API function. The programming unit of the module will enter APM immediately after a hardware or software reset. Once the module is in APM, the firmware can be written to the internal flash using either the UART or USB interface. 2.4 POWER SUPPLY REGULATOR While the supply to the digital I/O circuits is unregulated, on-chip low-dropout regulators derive all the 1.5 V and 2.5 V internal supplies required by the Micro-Controller Unit (MCU) core logic, non-volatile data registers, flash, and the analogue circuitry. DSH12461-3 | 7/2013 Datasheet: ZM5304 TYPICAL APPLICATION An illustration of two application examples using the ZM5304 Modem implementation follows. The host application located on an external microcontroller accesses the Z-Wave stack via the serial API. Figure 3.1 depicts the scenario when the UART is used as the primary interface to the ZM5304 Modem, while Figure 3.2 shows the scenario when the USB is used. It is strongly recommended that the power supply is decoupled sufficiently, and a pull-up resistor placed on the RESET_N signal if the host GPIO is unable to drive it. 3V3 3V3 VDD GPIO Host RESET_N TXD RXD RXD TXD ZM5304 GND Figure 3.1: Example of a host microcontroller based application using the UART 3V3 3V3 3V3 1.5kΩ±5% 22Ω±5% USB_DP Host VDD USB_DP USB_DM USB_DM 22Ω±5% GPIO ZM5304 RESET_N GND Figure 3.2: Example of a host microcontroller based application using the USB Firmware upgrades can be performed only when the ZM5304 Modem is placed in APM. DSH12461-3 | 7/2013 Datasheet: ZM5304 PAD CONFIGURATION GND NC NC NC NC NC NC NC NC NC NC NC NC GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 The layout of the Exposed Pads (EP) on the ZM5304 Modem is shown in Figure 4.1. GND 34 GND RESET_N 33 NC NC 32 NC TXD 31 NC RXD 30 GND USB_DM 29 NC USB_DP 28 GND GND 27 NC VDD 26 NC GND 10 25 GND 18 19 20 21 22 23 24 NC NC NC NC NC NC GND 15 NC 17 14 NC NC 13 NC 16 12 NC NC 11 GND GND Plane Copper Free Figure 4.1: Pad layout (top view) 4.1 PAD FUNCTIONALITY Table 4.1: Power, ground, and no connect signals Pad Name VDD GND NC Pad Location 1, 8, 10, 11, 24, 25, 28, 30, 34, 35, 48 3, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 26, 27, 29, 31, 32, 33, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47 Type Function Module power supply. Ground. Must be connected to the ground plane. Placement pads for mechanical stability. Leave unconnected. Table 4.2: Module control signals Pad Name RESET_N Pad Location Type Function Active low signal that places the module in a reset state. I = Input, O = Output, D+ = Differential Plus, D- = Differential Minus, S = Supply 10 DSH12461-3 | 7/2013 Datasheet: ZM5304 Table 4.3: UART interface signals RXD Pad Location TXD Pad Name Type Function in Reset State Waits for the “Interface Enable” serial command after 4.2ms. Enters ISP mode after command is received from the host. Serial data transmit when in ISP mode, high impedance otherwise. Function in Active State Receive data from host serial port. Transmit data to host serial port. Table 4.4: USB interface signals USB_DP Pad Location USB_DM Pad Name DSH12461-3 | 7/2013 Type D+ D- Function in Reset State USB 2.0 full speed APM when serial API function is used before entering the reset state. Function in Active State USB 2.0 full speed. 11 Datasheet: ZM5304 ELECTRICAL CHARACTERISTICS This section describes the electrical parameters of the ZM5304 Modem module. 5.1 TEST CONDITIONS Characterization in Lab (TA=-10°C to +85°C, VDD=+2.3 to +3.6V) Sorting criterion specified with Min and Max values Manufactured Modules Statistics with Min, Typ, and Max values Final Test in Production (TA=+25°C, VDD=+3.3V) Tested Modules Figure 5.1: Testing flow The following conditions apply for characterization in the lab, unless otherwise noted. 1. 2. 3. 4. 5. Ambient temperature TA = -10 to +85°C Supply voltage VDD = +2.3 to +3.6V All tests are carried out on the ZDB5304 Z-Wave Development Board. [4] Conducted transmission power is measured at the output of the SAW filter for 868.4, 908.4, 919.8, and 921.4MHz Conducted receiver sensitivity is measure at the output of the SAW filter for 868.4, 908.4, 919.8, and 921.4MHz The following conditions apply for the final test in production, unless otherwise noted. 1. 2. 3. 4. Ambient temperature TA = +25°C Supply voltage VDD = +3.3V Radiated transmission power is measured for 868.4, 908.4, 919.8, and 921.4MHz Radiated receiver sensitivity is measured for 868.4, 908.4, 919.8, and 921.4MHz 5.1.1 TYPICAL VALUES Unless otherwise specified, typical data refer to the mean of a data set measured at an ambient temperature of TA=25°C and supply voltage of VDD=+3.3V. 5.1.2 MINIMUM AND MAXIMUM VALUES Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by a final test in production on 100% of the devices at an ambient temperature of T A=25°C and supply voltage of VDD=+3.3V. For data based on measurements, the minimum and maximum values represent the mean value plus or minus three times the standard deviation (µ±3σ). 12 DSH12461-3 | 7/2013 Datasheet: ZM5304 5.2 ABSOLUTE MAXIMUM RATINGS The absolute ratings specify the limits beyond which the module may not be functional. Exposure to absolute maximum conditions for extended periods may cause permanent damage to the module. Table 5.1: Voltage characteristics Symbol VDD-GND VIN-GND ESDHBM ESDMM ESDCDM Description Main supply voltage Voltage applied on any I/O pad JEDEC JESD22-A114F Human Body Model JEDEC JESD22-A115C Machine Model JEDEC JESD22-C101E Field-Induced Charged-Device Model Min -0.3 -0.3 Max +3.6 +3.6 +2000.0 +200.0 +500.0 Unit Max +120 -120 Unit mA mA -55 Max +125 Unit °C Table 5.2: Current characteristics Symbol IVDD IGND Description Current into VDD power supply pad Sum of the current out of all GND ground pads Min Table 5.3: Thermal characteristics Symbol TJ 5.3 Description Min Junction temperature GENERAL OPERATING RATINGS The operating ratings indicate the conditions where the module is guaranteed to be functional. Table 5.4: Recommended operating conditions Symbol VDD VDD_USB fSYS TA 5.4 Description Standard operating supply voltage Standard operating supply voltage when USB PHY is used Internal clock frequency Ambient operating temperature Min +2.3 +3.0 -10.0 Typ +3.3 +3.3 32.0 +25.0 Max +3.6 +3.6 +85.0 Unit MHz °C CURRENT CONSUMPTION Measured at an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. DSH12461-3 | 7/2013 13 Datasheet: ZM5304 Table 5.5: Current consumption in active modes Symbol IDD_ACTIVE IDD_ACTIVE_USB IDD_RX IDD_TX_0 IDD_TX_2 Description MCU running at 32MHz MCU running at 32MHz and USB PHY active MCU and radio receiver active MCU and radio transmitter active, 0dBm MCU and radio transmitter active, +2dBm Min Typ Max 16 TBD 34 TBD TBD Unit mA mA mA mA mA 15 TBD 32 36 40 -6 -3 2.0 2.0 Max TBD 2.3 Unit µA mA 15 15 Max TBD TBD Unit mA mA Current Consumption (mA) 43 41 39 37 35 33 31 29 27 -27 -24 -21 -18 -15 -12 -9 Transmit Power (dBm) Figure 5.2: Typical current consumption vs. transmit power Table 5.6: Current consumption in power saving modes Symbol IDD_SLEEP IUSB_SLEEP Description Module in sleep state USB suspend mode with state persistency, and system clock (Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V) Min Typ Table 5.7: Current consumption during programming Symbol IDD_PGM_UART IDD_PGM_USB 5.5 Description Programming via UART Programming via USB Min TBD TBD Typ SYSTEM TIMING Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. 14 DSH12461-3 | 7/2013 Datasheet: ZM5304 Table 5.8: Transition between operating modes Symbol tACTIVE_SLEEP tSLEEP_ACTIVE Description Transition time from the active state to the sleep state Transition time from the sleep state to the active state ready to execute code Min Typ Max 125 Unit ns µs Max +2.3 Unit 1.0 ms 160 Table 5.9: System start-up time Symbol VPOR tRESET_ACTIVE Description Power-on-Reset (POR) threshold on rising supply voltage at which the reset signal is deasserted Transition time from the reset state to the active state ready to execute code with a power rise time not exceeding 10µs Min Typ Table 5.10: Reset timing requirements Symbol tRST_PULSE Description Duration to assert RESET_N to guarantee a full system reset Min 20 Typ Min Typ Max Unit ns TBD Max 44.1 TBD Unit ms ms Table 5.11: Programming time Symbol tERASE_FULL tPGM_FULL 5.6 Description Time taken to erase the entire flash memory Time taken to program the entire flash memory TBD NON-VOLATILE MEMORY RELIABILITY Qualified for an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. The on-chip memory is based on SuperFlash® technology. Table 5.12: On-chip flash Symbol ENDFLASH RETFLASH-LT RETFLASH-HT Description Endurance, erase cycles before failure Data retention Data retention (Qualified for a junction temperature of TJ=-10°C to +85°C) Min 10000 100 10 Typ Min 1Mil 100 Typ Max Unit cycles years years Unit cycles years Table 5.13: EEPROM Symbol ENDEEPROM RETEEPROM Description Endurance, erase cycles before failure Data retention DSH12461-3 | 7/2013 Max 15 Datasheet: ZM5304 5.7 ANALOG-TO-DIGITAL CONVERTER Measured at an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. Table 5.14: 12 bit ADC characteristics Symbol VBG VREF+ VREFDNLADC ACC8b ACC12b fS-8b fS-12b 5.8 Description Internal reference voltage Upper reference input voltage Lower reference input voltage Differential non-linearity Accuracy when sampling 20ksps with 8 bit resolution Accuracy when sampling 10ksps with 12 bit resolution 8 bit sampling rate 12 bit sampling rate Min +1.20 VDD - 0.90 0.00 -1.00 -2.00 -5.00 Max +1.30 VDD +1.20 +1.00 2.00 5.00 0.02 0.01 Unit LSB LSB LSB Msps Msps Max Unit µA µA µA pF DC CHARACTERISTICS Measured at an ambient temperature of TA=-10°C to +85°C. Table 5.15: Digital input characteristics, supply voltage of VDD=+2.3V to +3.0V Symbol VIH VIL VIF VIR VHYS IIH IIL-NPU IIL-PU CIN Description Logical 1 input voltage high level Logical 0 input voltage low level Falling input trigger threshold Rising edge trigger threshold Schmitt trigger voltage hysteresis Logical 1 input high level current leakage Logical 0 input low level current leakage (no internal pull-up resistor) Logical 0 input low level current leakage (with internal pull-up resistor) Pad input capacitance Min +1.85 +0.75 +1.35 +0.55 +35.00 +0.75 +1.05 +1.85 +0.85 +7.00 -7.00 +90.00 15.00 Table 5.16: Digital output characteristics, supply voltage of VDD=+2.3V to +3.0V Symbol VOH VOL IOH-LP IOL-LP 16 Description Logical 1 output voltage high level Logical 0 output voltage low level Logical 1 output high level current sourcing Logical 0 output low level current sinking Min +1.9 Max +0.4 +6.0 -6.0 Unit mA mA DSH12461-3 | 7/2013 Datasheet: ZM5304 Table 5.17: Digital input characteristics, supply voltage of VDD=+3.0V to +3.6V Symbol VIH VIL VIF VIR VHYS IIH IIL-NPU IIL-PU CIN Description Logical 1 input voltage high level Logical 0 input voltage low level Falling input trigger threshold Rising edge trigger threshold Schmitt trigger voltage hysteresis Logical 1 input high level current leakage Logical 0 input low level current leakage (no internal pull-up resistor) Logical 0 input low level current leakage (with internal pull-up resistor) Pad input capacitance Min +2.10 +0.90 +1.60 +0.65 +40.00 Max +0.90 +1.30 +2.10 +0.95 +10.00 -10.00 +120.00 15.00 Unit µA µA µA pF Table 5.18: Digital output characteristics, supply voltage of VDD=+3.0V to +3.6V Symbol VOH VOL IOH-LP IOL-LP 5.9 Description Logical 1 output voltage high level Logical 0 output voltage low level Logical 1 output high level current sourcing Logical 0 output low level current sinking Min +2.4 Max +0.4 +8.0 -8.0 Unit mA mA RF CHARACTERISTICS 5.9.1 TRANSMITTER Measured at an ambient temperature of T A=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. The transmission power is adjusted by setting the value of the RFPOW register. Table 5.19: Transmit performance Symbol P63 P01 PH2 PH3 Description RF output power delivered to the antenna, RFPOW=63 RF output power delivered to the antenna, RFPOW=01 nd 2 harmonic, RFPOW=63 rd 3 harmonic, RFPOW=63 DSH12461-3 | 7/2013 Min +1.3 -27.5 Typ +2.0 -26.3 Max +3.5 -25.0 TBD TBD Unit dBm dBm dBc dBc 17 Datasheet: ZM5304 Transmit Power (dBm) -3 -6 -9 -12 -15 -18 -21 -24 -27 10 15 20 25 30 35 40 45 50 55 60 RFPOW Setting Figure 5.3: Typical transmit power vs. RFPOW setting TBD Figure 5.4: Typical output impedance 5.9.2 RECEIVER Measured over an ambient temperature of TA=-10°C to +85°C and a supply voltage of VDD=+2.3V to +3.6V. Table 5.20: Receiver sensitivity Symbol P9.6 P40 P100 18 Description Sensitivity at 9.6kbps, FER < 1% Sensitivity at 40kbps, FER < 1% Sensitivity at 100kbps, FER < 1% Min Typ -103 -99 -92 Max Unit dBm dBm dBm DSH12461-3 | 7/2013 Datasheet: ZM5304 -91 Sensitivity (dBm) -93 -95 -97 9.6 kbps -99 40 kbps -101 100 kbps -103 -105 -50 -25 25 50 75 100 Temperature (°C) Figure 5.5: Typical sensitivity vs. temperature Measured at an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. Table 5.21: Receiver performance Symbol CCR ACR200kHz ACR400kHz ACR800kHz BI1MHZ BI2MHZ BI5MHZ BI10MHZ BI100MHZ RSSIRANGE RSSILSB PLO IIP3 Description Co-channel rejection Adjacent channel rejection at Δf=200kHz Adjacent channel rejection at Δf=400kHz Adjacent channel rejection at Δf=800kHz Blocking immunity at Δf=1MHz Blocking immunity at Δf=2MHz Blocking immunity at Δf=5MHz Blocking immunity at Δf=10MHz Blocking immunity at Δf=100MHz Dynamic range of the RSSI measurement Resolution of the RSSI measurement LO leakage at Δf=TBDkHz rd Input 3 order intercept point Min Typ TBD TBD TBD TBD 34.0 38.0 60.0 63.0 TBD 70.0 1.5 -80.0 -12.0 Max Unit dBc dBc dBc dBc dBc dBc dBc dBc dBc dB dB dBm dBm Blocker level is defined relative to the wanted receiving signal and measured with the wanted receiving signal 3dB above the sensitivity level DSH12461-3 | 7/2013 19 Received Power (dBm) Datasheet: ZM5304 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 35 40 45 50 55 60 65 70 75 80 85 Received Signal Strength Indicator Value Figure 5.6: Typical input power vs. RSSI value TBD Figure 5.7: Typical input impedance 20 DSH12461-3 | 7/2013 Datasheet: ZM5304 5.9.3 ANTENNA Figure 5.8: Radiatian pattern measured starting from the top with the antenna placed to the left on the ZX plane Figure 5.9: Radiatian pattern measured starting from the top with the antenna facing up on the XY plane Figure 5.10: Radiation pattern measured starting from the right with the antenna placed to the left on the YZ plane DSH12461-3 | 7/2013 21 Datasheet: ZM5304 Table 5.22: Antenna performance Frequency Range (MHz) 868 908 923.5 Orientation XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical XY plane, horizontal XY plane, vertical YZ plane, horizontal YZ plane, vertical ZX plane, horizontal ZX plane, vertical Average Gain (dBi) -11.6 -5.4 -6.2 -14.3 -7.3 -8.4 -11.6 -5.5 -6.8 -14.5 -8.0 -8.6 -11.9 -4.9 -6.2 -13.9 -7.3 -8.3 Max Gain (dBi) -9.4 -4.6 -2.8 -12.6 -4.4 -6.8 -9.4 -4.7 -3.5 -13.2 -5.1 -7.4 -9.7 -4.0 -2.9 -12.7 -4.3 -7.1 Total Efficiency (%) 34.6 31.6 36.3 5.9.4 REGULATORY COMPLIANCE The ZM5304 Modem has been tested to be compliant with the following regulatory standards. 22 ACMA COMPLIANCE o AS/NZS 4268 o CISPR 22 CE COMPLIANCE o EN 50364 o EN 60950 o EN 300 220 o EN 301 489-1/3 FCC COMPLIANCE o FCC CFR 47 Part 15 Unlicensed Modular Approval IC COMPLIANCE o RSS-GEN o RSS-210 MIC COMPLIANCE o ARIB STD-T108 DSH12461-3 | 7/2013 Datasheet: ZM5304 Z-WAVE FREQUENCIES Table 6.1: Z-Wave RF specification Data rate 9.6kbps 40kbps 100kbps Frequency Shift Keying (FSK) FSK Gaussian Frequency Shift Keying (GFSK) fC±20kHz fC±20kHz fC±29.3kHz Manchester encoded Non-return to Zero (NRZ) NRZ United Arab Emirates 868.42 MHz 868.40 MHz 869.85 MHz Australia 921.42 MHz 921.40 MHz 919.80 MHz Brazil 921.42 MHz 921.40 MHz 919.80 MHz Canada 908.42 MHz 908.40 MHz 916.00 MHz Chile 908.42 MHz 908.40 MHz 916.00 MHz China 868.42 MHz 868.40 MHz 869.85 MHz European Union 868.42 MHz 868.40 MHz 869.85 MHz Hong Kong 919.82 MHz 919.80 MHz 919.80 MHz Israel 916.02 MHz 916.00 MHz India 865.20 MHz 865.20 MHz 865.20 MHz Modulation Frequency deviation Coding 922.50 MHz 923.90 MHz 926.30 MHz 919.70 MHz 923.10 MHz 926.30 MHz Mexico 908.42 MHz 908.40 MHz 916.00 MHz Malaysia 868.12 MHz 868.10 MHz 868.10 MHz New Zealand 921.42 MHz 921.40 MHz 919.80 MHz Russia 869.02 MHz 869.00 MHz Singapore 868.42 MHz 868.40 MHz 869.85 MHz 922.50 MHz 923.90 MHz 926.30 MHz United States 908.42 MHz 908.40 MHz 916.00 MHz South Africa 868.42 MHz 868.40 MHz 869.85 MHz Japan Korea Taiwan DSH12461-3 | 7/2013 23 Datasheet: ZM5304 7.1 MODULE INFORMATION MODULE MARKING FCC ID Table 7.1: Marking description REGION: Regional information US regulatory information FCC ID REGION Figure 7.1: Marking placement NB: The shield is mounted only on the U regional module. 7.2 MODULE DIMENSIONS ZM5304 vHW/vFW PRODCODE REGION YYWWDD FCC ID: TBD 15.20 Shield FCC ID 27 * All dimensions are in millimeters (mm) Figure 7.2: Top view of module 5.5 3.8 ANTENNA Shield PAD GND Plane Copper Free PAD Copper Free 27 15 * All dimensions are in millimeters (mm) Figure 7.3: Side view of module 24 DSH12461-3 | 7/2013 Datasheet: ZM5304 14.85 RECOMMENDED PCB MOUNTING PATTERN 36 37 38 39 40 41 42 43 44 45 46 47 48 0.15 8.1 PCB MOUNTING AND SOLDERING 15.05 35 12.10 34 11.10 33 10.10 32 9.10 8.10 7.10 29 6.10 28 5.10 27 4.10 26 3.10 10 25 31 30 11 12 13 14 15 16 17 18 19 20 21 22 23 24 10 11 12 13 14 Top View 0.15 1.70 0.65 * All dimensions are in millimeters (mm) Figure 8.1: Top view of land pattern DSH12461-3 | 7/2013 25 Datasheet: ZM5304 8.2 RECOMMENDED PLACEMENT ON PCB Recommended metal free space > 50mm recommended 24 23 22 25 21 26 10 20 27 19 28 18 29 17 30 16 31 15 32 14 33 13 34 12 11 > 55mm recommended 35 36 37 38 39 40 41 42 43 44 45 46 47 48 > 5mm recommended > 55mm recommended > 50mm recommended PCB ground plane with components Copper free PCB Figure 8.2: Top view of recommended placement of module on PCB 8.3 SOLDERING INFORMATION The soldering details to properly solder the ZM5202 module on standard PCBs are described below. The information provided is intended only as a guideline and Sigma Designs is not liable if a selected profile does not work. See IPC/JEDEC J-STD-020D.1 for more information. Table 8.1: Soldering details PCB solder mask expansion from landing pad edge PCB paste mask expansion from landing pad edge PCB process PCB finish Stencil aperture Stencil thickness Solder paste used Flux cleaning process 0.1 mm 0 mm Pb-free (Lead free for RoHS compliance) Defined by the manufacturing facility (EMS) or customer Defined by the manufacturing facility (EMS) or customer Defined by the manufacturing facility (EMS) or customer Defined by the manufacturing facility (EMS) or customer Defined by the manufacturing facility (EMS) or customer RoHS = Restriction of Hazardous Substances Directive, EU 26 DSH12461-3 | 7/2013 Datasheet: ZM5304 Table 8.2: Typical reflow profile Symbol TP to TL TS tS TL tL TP tP TP to TL Description Ramp-up rate Preheat temperature Preheat time Heating temperature Heating time Peak temperature Time within 5°C of actual peak temperature Ramp-down rate Time 25°C to peak temperature Min Max 150 60 215 60 28 200 120 220 150 260 32 Unit °C/s °C °C °C °C/s min Figure 8.3: Typical reflow profile DSH12461-3 | 7/2013 27 Datasheet: ZM5304 ORDERING INFORMATION Table 9.1: Ordering codes Orderable Device Status ZM5304AE-CME3R ACTIVE Package Type SOM ZM5304AU-CME3R ACTIVE ZM5304AH-CME3R ACTIVE 48 Minimum Order Quantity 500 pcs. SOM 48 500 pcs. SOM 48 500 pcs. Pads Description ZM5304 Modem Module, No Shield, RevA, 868MHz Band, Tape and Reel ZM5304 Modem Module, With Shield, RevA, 908MHz Band, Tape and Reel ZM5304 Modem Module, No Shield, RevA, 921MHz Band, Tape and Reel SOM = System-on-Module 28 DSH12461-3 | 7/2013 Datasheet: ZM5304 9.1 TAPE AND REEL INFORMATION Figure 9.1: Tape information DSH12461-3 | 7/2013 29 Datasheet: ZM5304 Figure 9.2: Reel information 30 DSH12461-3 | 7/2013 Datasheet: ZM5304 10 REVISION HISTORY Date 2013/07/02 Version 3A Affected §1, §2, §5 2013/07/02 2B §2.1.9, §10 2013/07/01 2A §2.1, §2.3, §7.2, §6 2013/06/03 2013/05/31 2013/05/30 1F 1E 1D §5.5, §6 §All §All 2013/05/27 1C §All 2013/02/22 2013/02/18 1A 1A §All §All DSH12461-3 | 7/2013 Revision Removed remnants of WUT TODO: Add table of abbreviations Add typical IO graphs Remove invalid references to the WUT and added the date to the references, with feedback from NTJ, MVO, and OPP Added dimensions of shield Changed the low operating voltage from 2.5V to 2.3V Added AES, ADC, XTAL driver, BOD, RST controller, WUT, Watchdog, and RF transceiver sections to the peripheral descriptions Changed “Firmware Upgrade” to “Module Programming” and added default programming mode Changed the module width to 15.05mm Removed the frequency from the module marking and added region data to the frequency table TODO: Add table of abbreviations Add typical IO graphs Added transition time values Removed empty page TODO: Add table of abbreviations Add typical IO graphs Updated IO characteristics and added USB termination resistor values TODO: Verify USB 2.0 vs. 1.1 Add table of abbreviations Add typical IO graphs Updated with feedback from MVO and NTJ. Added missing receiver graphs. TODO: Verify USB termination resistor values Verify USB 2.0 vs. 1.1 Add table of abbreviations Updated layout with feedback from Jeanne Christiansen, and data from the latest corner tests. Preliminary draft released. Initial draft. 31 Datasheet: ZM5304 11 REFERENCES [1] [2] [3] [4] 32 Sigma Designs, “Serial API Host Application Programming Guide,” INS12350, Denmark, 2012. Sigma Designs, “Z-Wave 500 Series Application Programmers Guide v6.50.00,” INS12308, Denmark, 2012. Sigma Designs, “500 Series Z-Wave Single Chip Programming Mode,” INS11681, Denmark, 2012. Sigma Designs, “ZDB5304 Z-Wave Development Board,” DSH12468, Denmark, 2013. DSH12461-3 | 7/2013 Datasheet: ZM5304 DISCLAIMER The information in this document is subject to change without notice. Sigma Designs reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the datasheet is current before placing orders. Information furnished by Sigma Designs is believed to be accurate and reliable. However, no responsibility is assumed by Sigma Designs or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Sigma Designs or its subsidiaries. Sigma Designs, Inc. makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from intellectual property infringement. Sigma Designs, Inc. makes no warranty of merchantability or fitness for any purpose. Sigma Designs, Inc. shall not be responsible for any errors that may appear in this document. Sigma Designs, Inc. makes no commitment to update or keep current the information contained in this document. The product(s) described in this document is not intended for use as critical component(s) in life support devices or systems without prior written permission from Sigma Designs, Inc. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Sigma Designs, Inc. The information in this document is subject to change without notice. Sigma Designs logo are either registered trademarks or trademarks of Sigma Designs, Inc. in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners. Sigma Designs products are sold by description only. Sigma Designs reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Sigma Designs is believed to be accurate and reliable. However, no responsibility is assumed by Sigma Designs or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Sigma Designs or its subsidiaries. CONFIDENTIALITY This document contains confidential information, trade secrets, or both that are the property of Sigma Designs, Inc. It is to be treated as confidential under the Non-Disclosure Agreement (NDA), which has been signed by the obtainer. Reproduction or transmission in any manner to others in whole or in part is prohibited without prior written permission from Sigma Designs, Inc. TRADEMARKS Sigma Designs and the Sigma Designs logo are registered trademarks of Sigma Designs, Inc. in the United States and/or other countries. All other trademarks or registered trademarks are the properties of their respective owners. Z-Wave® is a registered trademark of Sigma Designs, Inc. in the United States and/or other countries. SALES OFFICE AND DISTRIBUTOR CONTACT INFORMATION www.sigmadesigns.com/sales HEADQUARTERS Sigma Designs, Inc. 1778 McCarthy Blvd. Milpitas, CA 95035 Tel: +1.408.262.9003 Fax: +1.408.957.9740 www.sigmadesigns.com sales@sigmadesigns.com DSH12461-3 | 7/2013 33 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: D87-ZM5304-U”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
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