Silicon Laboratories Finland EM358L ETRX3581-LRS, ETRX3582-LRS, ETRX3585-LRS, ETRX3586-LRS, ETRX3587-LRS, ETRX3588-LRS, ETRX3581HR-LRS, ETRX3582HR-LRS, ETRX3585HR-LRS, ETRX3586HR-LRS, ETRX3587HR-LRS, ETRX3588HR-LRS User Manual TG PM 0511 ETRX358x LRS r2

Telegesis

TG-PM-0511-ETRX358x-LRS r2

ETRX358x-LRS and ETRX358xHR-LRS Product Manual

ETRX358x-LRS ZIGBEE

®

MODULES

PRODUCT MANUAL

ETRX358x-LRS and ETRX358xHR-LRS

Table of Contents

1 INTRODUCTION ................................................................................................................. 5

1.1 Hardware Description ....................................................................................................... 5

2 PRODUCT APPROVALS ................................................................................................... 7

2.1 FCC Approvals ................................................................................................................. 7

2.1.1 FCC Labelling Requirements ........................................................................................... 8

2.2 IC (Industry Canada) Approvals ....................................................................................... 8

2.2.1 IC Labelling Requirements ............................................................................................... 9

2.3 European Certification .................................................................................................... 10

2.4 Declarations of Conformity ............................................................................................. 10

2.5 IEEE 802.15.4 ................................................................................................................ 10

2.6 The ZigBee Protocol ...................................................................................................... 11

3 MODULE PINOUT ............................................................................................................ 12

4 HARDWARE DESCRIPTION ............................................................................................ 14

4.1 Hardware Interface ......................................................................................................... 14

5 FIRMWARE DESCRIPTION ............................................................................................. 15

5.1 Token Settings ............................................................................................................... 16

5.2 Custom Firmware ........................................................................................................... 16

5.3 Boost Mode vs. Normal Mode ........................................................................................ 16

5.4 Software Interface .......................................................................................................... 17

6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 18

6.1 Environmental Characteristics ........................................................................................ 18

6.2 Recommended Operating Conditions............................................................................. 18

7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 19

8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 21

9 A/D CONVERTER CHARACTERISTICS .......................................................................... 22

10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 22

10.1 TX Power Characteristics ............................................................................................... 24

10.2 Power Settings for Regulatory Compliance .................................................................... 25

10.3 Temperature behaviour .................................................................................................. 26

11 PHYSICAL DIMENSIONS ................................................................................................. 27

12 RECOMMENDED REFLOW PROFILE ............................................................................. 28

13 PRODUCT LABEL DRAWING ......................................................................................... 29

14 RECOMMENDED FOOTPRINT ........................................................................................ 30

14.1 Recommended Placement ............................................................................................. 32

14.2 Example carrier board .................................................................................................... 34

15 RELIABILITY TESTS ........................................................................................................ 35

ETRX358x-LRS and ETRX358xHR-LRS

16 APPLICATION NOTES ..................................................................................................... 35

16.1 Safety Precautions ......................................................................................................... 35

16.2 Design Engineering Notes .............................................................................................. 35

16.3 Storage Conditions ......................................................................................................... 36

17 PACKAGING .................................................................................................................... 37

17.1 Embossed Tape ............................................................................................................. 37

17.2 Component Orientation .................................................................................................. 38

17.3 Reel Dimensions ............................................................................................................ 38

17.4 Packaging ...................................................................................................................... 39

18 ORDERING INFORMATION ............................................................................................. 40

19 TRADEMARKS ................................................................................................................. 41

20 DISCLAIMER .................................................................................................................... 41

21 ROHS DECLARATION ..................................................................................................... 41

22 DATA SHEET STATUS .................................................................................................... 41

23 LIFE SUPPORT POLICY .................................................................................................. 41

24 RELATED DOCUMENTS ................................................................................................. 42

25 CONTACT INFORMATION ............................................................................................... 42

ETRX358x-LRS and ETRX358x-LRS

The Telegesis ETRX358x-LRS and ETRX358xHR-LRS

modules are low power 2.4GHz ZigBee modules with an added

frontend module (SiGe SE2432L) containing both PA and LNA

for highest possible link budget.

Based on the latest Ember EM358x family of single chip ZigBee

solutions the new long range modules are footprint compatible

with the entire Telegesis ETRX3 family, thus representing a

drop-in replacement for all applications where a high link

budget is required.

The module’s unique AT-style command line interface allows

designers to quickly integrate ZigBee technology without

complex software engineering. For custom application

development the ETRX358x series integrates with ease into

Ember’s InSight development environment.

Image not shown actual size; enlarged to show detail.

Module Features

• Small form factor, SMT module 25mm x 19mm

• Same footprint and pin-out as ETRX357-LRS

• Side Castellations for easy soldering and inspection

• Two antenna options: Integrated chip antenna or U.FL

coaxial connector

• Based on 32-bit ARM® Cortex-M3

• Industry standard JTAG Programming and real time

network level debugging via the Ember Debug Port

• Up to 512kB of flash and 64kbytes of RAM

• Lowest Deep Sleep Current of sub 1µA with retained

RAM and GPIO and multiple sleep modes

• Ultra Wide supply voltage range (2.1 to 3.6V)

• Optional 32.768kHz watch crystal can be added

externally

• Module ships with standard Telegesis AT-style

command interface based on the ZigBee PRO feature

set

• Can act as an End Device, Router or Coordinator

• 22 general-purpose I/O lines including analogue inputs

• Firmware upgrades via serial port or over the air

(password protected)

• Hardware supported encryption (AES-128)

• CE and FCC and IC compliance, IC and FCC modular

approval

• Operating temperature range: -40

°

C to +85

°

C

• Standard version without LNA and PA available in the

same form factor

Radio Features

• Based on the Silicon Labs EM358x family of single chip

ZigBee®

SoCs

• 2.4GHz ISM Band

• 250kbit/s over the air data rate – NB: actual usable data

throughput with ZigBee is about 20kbps

• 15 channels (IEEE802.15.4 Channel 11 to 25)

• SiGe SE2432L integrated PA and LNA

• +20dBm output power (adjustable down to -41dBm)

• High sensitivity of -106dBm typ. @ 1% packet error rate

• RX Current: 33mA, TX Current: approx 140mA at

20dBm

•

Robust Wi

-

Fi and Bluetooth coexistence

Suggested Application

s

• ZigBee Smart Energy applications

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Lighting and ventilation control

• Remote monitoring

• Environmental monitoring and control

Development Kit

• Enhancement kit available to upgrade existing

Telegesis and Ember development kits to be used with

the new ETRX358x family

• AT-style software interface command dictionary can be

modified for high volume customers.

• Custom software development available upon request.

Example AT

-

Style Commands

AT+BCAST Send a Broadcast

AT+UCAST:<address> Send a Unicast

AT+EN Establish PAN network

AT+JN Join PAN

At power-up the last configuration is loaded from non-

volatile S-Registers, which can eliminate the need for an

additional host controller.

ETRX358x-LRS and ETRX358x-LRS

1 Introduction

This document describes the Telegesis ETRX358x-LRS and ETRX358xHR-LRS ZigBee long

range modules which have been designed to be easily integrated into another device and to

provide a fast, simple and low cost wireless mesh networking interface.

The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform

consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant

EmberZNet meshing stack. Integration into a wide range of applications is made easy using a

simple AT style command interface and advanced hardware design.

The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series

ZigBee modules to be used without an additional host microcontroller saving even more integration

time and costs. In addition to the Telegesis AT Commandset, the ETRX358x-LRS and

ETRX358xHR-LRS modules can be used with custom-built firmware whilst representing an ideal

platform for custom firmware development in conjunction with the Silicon Labs ZigBee

development kits.

No RF experience or expertise is required to add this powerful wireless networking capability to

your products. The ETRX358x-LRS and ETRX358xHR-LRS offer fast integration opportunities

and the shortest possible time to market for your product.

1.1 Hardware Description

The main building blocks of the ETRX358x-LRS and ETRX358xHR-LRS are the single chip

EM358x SoC from Silicon Labs, a SiGe SE2432L frontend module combining a Power Amplifier

with a Low Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best

RF performance. The modules are available with on-board antenna or alternatively a U.FL

connector for attaching external antennae. Modules with the U.FL connector are identified by the

“HR” suffix.

The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data

are available from the Antenova website [5].

Module

Chip

Flash

RAM

Antenna

USB

ETRX3581-LRS

1

EM3581 256kB 32kB Chip No

ETRX3581HR-LRS

1

EM3581 256kB 32kB External No

ETRX3582-LRS

1

EM3582 256kB 32kB Chip Yes

ETRX3582HR-LRS

1

EM3582 256kB 32kB External Yes

ETRX3585-LRS

1

EM3585 512kB 32kB Chip No

ETRX3585HR-LRS

1

EM3585 512kB 32kB External No

ETRX3586-LRS

1

EM3586 512kB 32kB Chip Yes

ETRX3586HR-LRS

1

EM3586 512kB 32kB External Yes

ETRX3587

-LRS

EM3587

512kB

64kB

Chip

No

ETRX3587HR

-LRS

EM3587

512kB

64kB

External

No

ETRX3588-LRS

1

EM3588 512kB 64kB Chip Yes

ETRX3588HR

1

EM3588 512kB 64kB External Yes

Table 1: Memories

1

MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR

ETRX358x-LRS and ETRX358x-LRS

The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the

sensitivity by 5dB which will increase the range by approximately 700% relative to the standard

devices (where local regulations permit the use of the maximum output power).

The ETRX358x and ETRX358xHR are used for ZigBee

(www.zigbee.org) applications. In case it is

desired to develop custom firmware instead of using the pre-loaded AT-Command interface, the

Silicon Labs toolchain, consisting of Ember Desktop together with a comprehensive integrated

development environment (IDE), is required.

ETRX358x-LRS and ETRX358x-LRS

2 Product Approvals

The ETRX358x-LRS and ETRX358xHR-LRS have been designed to meet all national regulations

for world-wide use. In particular the following certifications have been obtained:

2.1 FCC Approvals

The Telegesis ETRX358x-LRS family with integrated Antenna as well as the ETRX358xHR-LRS

family including the antennas listed in able 2 and the power levels listed in section 10.2 have been

tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular

transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.

FCC statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

This module complies with the USA SAR requirements and is not intended to be operated within

20cm of the body. The following statement must be included as a CAUTION statement in manuals

for OEM products to alert users on FCC RF exposure compliance

“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a

separation distance of 20cm or more should be maintained between the antenna of this

device and persons during operation. To ensure compliance, operations at closer

distances than this are not recommended.”

Item

Part No.

Manufacturer

Type

Impedance

Gain

1 BT-Stubby

(straight) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

2 BT-Stubby

(right-angle) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

3 CJ-2400-6603 Chang Jia ½ Wave 50 Ω 2.0dBi

4 Rufa (on

board) Antenova Chip 50Ω 2.1dBi

(peak)

Table 2. Approved Antennae

An end user deploying an ETRX358x-LRS or an ETRX358xHR-LRS module together with an

antenna as listed in Table 2 is not required to obtain a new authorization for the module – BUT this

does not preclude the possibility that some other form of authorization or testing may be required

for the end product depending upon local territorial regulations.

The FCC requires the user to be notified that any changes or modifications made to this device

that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the

equipment.

When using the ETRX358x-LRS with approved antennae, it is required to prevent end-users from

replacing them with non-approved ones.

FCC ID

:

S4

GEM358L

ETRX358x-LRS and ETRX358x-LRS

The antenna(s) must be installed such that a minimum separation distance of 20cm is maintained

between the radiator (antenna) and all persons at all times.

2.1.1 FCC Labelling Requirements

When integrating the ETRX358x-LRS or ETRX358xHR-LRS families into a product it must be

ensured that the FCC labelling requirements are met. This includes a clearly visible label on the

outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358L) as

well as the notice above. This exterior label can use wording such as “Contains Transmitter

Module FCC ID: S4GEM358L” or “Contains FCC ID: S4GEM358L” although any similar wording

that expresses the same meaning may be used.

2.2 IC (Industry Canada) Approvals

The Telegesis ETRX358x-LRS family with integrated Antenna as well as the ETRX358xHR-LRS

family have been approved by Industry Canada to operate with the antenna types listed in Table 2

with the maximum permissible gain and required antenna impedance for each antenna type

indicated. Antenna types not included in this list, having a gain greater than the maximum gain

indicated for that type, are strictly prohibited for use with this device.

IC-ID: 8735A-EM358L

• This device complies with Industry Canada license-exempt RSS standard(s). Operation is

subject to the following two conditions: (1) this device may not cause interference, and (2)

this device must accept any interference, including interference that may cause undesired

operation of the device.

• Under Industry Canada regulations, this radio transmitter may only operate using an antenna

of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To

reduce potential radio interference to other users, the antenna type and its gain should be so

chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that

permitted for successful communication.

• To comply with Industry Canada RF radiation exposure limits for general population, the

antenna(s) used for this transmitter must be installed such that a minimum separation

distance of 20cm is maintained between the radiator (antenna) and all persons at all times

and must not be co-located or operating in conjunction with any other antenna or transmitter

• This device has been designed to operate with the antennas listed in Table 2, and having a

maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1

dBi are strictly prohibited for use with this device. The required antenna impedance is 50

ohms.

French Statements

• Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain

ETRX358x-LRS and ETRX358x-LRS

de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité

nécessaire à l'établissement d'une communication satisfaisante.

• Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le

fonctionnement.

OEM Responsibilities

The ETRX358x-LRS and ETRX358x-LRS families of module have been certified for integration into

products only by OEM integrators under the following conditions:

1. The antenna(s) must be installed such that a minimum separation distance of 20cm is

maintained between the radiator (antenna) and all persons at all times.

2. The transmitter module must not be co-located or operating in conjunction with any other

antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any additional

compliance requirements required with this module installed (for example, digital device emissions,

PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations

or co-location with another transmitter), then Industry Canada certification is no longer considered

valid and the IC Certification Number can not be used on the final product. In these circumstances,

the OEM integrator will be responsible for re-evaluating the end product (including the transmitter)

and obtaining a separate Industry Canada authorization.

2.2.1 IC Labelling Requirements

The ETRX358x-LRS and ETRX358xHR-LRS family modules are labelled with its own IC Certification

Number. If the IC Certification Number is not visible when the module is installed inside another device,

then the outside of the device into which the module is installed must also display a label referring to the

enclosed module. In that case, the final end product must be labelled in a visible area with the following:

“Contains Transmitter Module IC: 8735A-EM358L”

or

“Contains IC: 8735A-EM358L”

The OEM of the ETRX358x-LRS and ETRX358xHR-LRS family modules must only use the approved

antenna(s) listed above, which have been certified with this module.

The OEM integrator has to be aware not to provide information to the end user regarding how to

install or remove this RF module or change RF related parameters in the user’s manual of the end

product.

ETRX358x-LRS and ETRX358x-LRS

2.3 European Certification

The ETRX358x and ETRX358xHR families are at a maximum power level of 21.15mW e.i.r.p.

(13.2dBm) compliant to the following standards:

• Radio: EN 300 328:V1.8.1

• EMC: EN 301 489-17:V2.2.1

• Safety: EN 60950-1:2006/A12:2011

All tests have been conducted with the antennae listed in Table 2.

If the ETRX358x-LRS and ETRX358xHR-LRS families of modules are incorporated into an OEM

product, the OEM product manufacturer must ensure compliance of the final product to the

European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must

be issued for each of these standards and kept on file as described in the R&TTE Directive. The

final product must not exceed the specified power ratings, antenna specifications and installation

requirements as specified in this user manual. If any of these specifications are exceeded in the

final product then a submission must be made to a notified body for compliance testing to all of the

required standards.

The ‘CE’ marking must be applied to a visible location on any OEM product. For more information

please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full

responsibility for learning and meeting the required guidelines for each country in their distribution

market.

2.4 Declarations of Conformity

Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF

Modules, which cover Radio Emissions, EMC and Safety. These documents will be available from

our website or on request

2.5 IEEE 802.15.4

IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet

of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life

applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.

ETRX358x-LRS and ETRX358x-LRS

2.6 The ZigBee Protocol

The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices

over short to medium distances. The specification was originally ratified in December 2004, paving

the way for companies to start making low-power networks a reality.

ZigBee uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three

additional layers for networking, security and applications. What makes the specification unique is

its use of a mesh network architecture which, in bucket chain style, passes data from one node to

the next until it lands at its destination. The network is self-healing and adapts its routing as link

quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not

act as routers, but can therefore be put into a low-power sleep state.

The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,

adding new features and improvements to the only global wireless communication standard

enabling the development of easily deployable low-cost, low-power, monitoring and control

products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee

Alliance introduced the PRO feature-set which offers advantages over earlier feature-sets,

including

• Truly self-healing mesh networking

• Messages can now travel up to 30 hops

• Source-Routing for improved point to multipoint message transmission

• Improved security including Trust-Centre link keys

• New message types and options

The Telegesis AT Command-set, which by default ships on all ETRX3 series products is based on

the ZigBee PRO feature-set. For more information on the Telegesis AT Command-set please refer

to the separate documentation at www.telegesis.com.

ETRX358x-LRS and ETRX358x-LRS

3 Module Pinout

Figure 1. ETRX3 series Module Pinout (top view)

The table below gives details about the pin assignment for direct SMD soldering of the ETRX3

series modules to the application board. For more information on the alternate functions please

refer to [2]. Also refer to the Telegesis AT Command-set documentation to understand how the

pre-programmed firmware makes use of the individual I/Os.

All GND pads are connected within the module, but for best RF performance all of them should be

grounded externally.

ETRX35

8

x

pad

Name

Default

Use

Alternate

function

EM35x

Alternate

functions

1 GND GND GND

2 TX_ACTIVE{1} I/O 11 TX_ACTIVE. PC5 of the EM35x is used to control

the FEM

3 PC6 I/O 13 OSC32B, nTX_ACTIVE

4 PC7 I/O 14 OSC32A, OSC32_EXT

5 PA7 {5} I/O 18 TIM1C4

6 PB3 {2,3} I/O CTS 19 SC1nCTS, SC1SCLK, TIM2C3

7 nReset {5} nReset 12

8 PB4 {2} I/O RTS 20 TIM2C4, SC1nRTS, SC1nSSEL

9 PA0 I/O 21 TIM2C1, SC2MOS,USBDM{7}I

10 PA1 I/O 22 TIM2C3, SC2SDA, SC2MISO,USBDP{7}

11 PA2 I/O 24 TIM2C4, SC2SCL, SC2SCLK

12 PA3 I/O 25 SC2nSSEL, TRACECLK, TIM2C2

13 GND GND GND

14 PA4 I/O 26 ADC4, PTI_EN, TRACEDATA

15 PA5 {4} I/O 27 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

16 PA6 {5} I/O 29 TIM1C3

17 PB1{3} TXD 30 SC1MISO, SC1MOSI, SC1SDA, SC1TXD,

TIM2C1

18 PB2{3} RXD 31 SC1MISO, SC1MOSI, SC1SCL, SC1RXD,

TIM2C2

ETRX358x-LRS and ETRX358x-LRS

ETRX35

8

x

pad

Name

Default

Use

Alternate

function

EM35x

Alternate

functions

19 GND GND GND

20 GND GND GND

21 JTCK JTCK 32 SWCLK

22 PC2 I/O 33 JTDO, SWO

23 PC3 I/O 34 JTDI

24 PC4 I/O 35 JTMS, SWDIO

25 N/C{1} N/C 36 PB0 of the EM35x is used to control the FEM

26 PC1 I/O ADC3 38 ADC3, SWO, TRACEDATA0

27 PC0 {5} I/O 40 JRST, IRQD, TRACEDATA1

28 PB7 {5} I/O ADC2 41 ADC2, IRQC, TIM1C2

29 PB6 {5} I/O ADC1 42 ADC1, IRQB, TIM1C1

30 PB5 I/O ADC0 43 ADC0, TIM2CLK, TIM1MSK

31 GND GND GND

32 Vcc Vcc Vcc

33 GND GND GND

Table 3. Pin Information

Notes:

{1} Pins PB0 and PC5 of the EM357 are used internally to control the front-end module. PB0 is not

available to the user.

{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively

{3} When using the Telegesis AT Command-set, RTS/CTS handshaking is selectable in firmware. See

the AT Command Manual.

{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader

{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)

{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET

is low. This signal has a 30kΩ Pull-Up.

{7} ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only

Alternate functions depend on the firmware, but the Telegesis R3xx AT Command-set functions

are indicated here for convenience.

Important Note: The ETRX358x series and the ETRX358x-LRS series of modules are footprint

compatible, but on the ETRX358x-LRS series pins PB0 and PC5 of the EM358x are used

internally to control the front-end module and are not available to the user. PC5 is still available on

Pad2, but it is configured as TX_ACTIVE signal and cannot be used as a general purpose GPIO.

See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.

Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names.

ETRX358x-LRS and ETRX358x-LRS

4 Hardware Description

24MHz

EM358x

I/O

UART

I / O

programming

5

JTAG

V

cc

V

reg

RESET

Match

integrated

antenna

U.FL socket

rf

terminal

selection,

filtering and

matching

circuitry

LDO

1V8

1,8Vdc

A/D

LDO

1V25

Match

FEM

USB*

*not available on all Types

Figure 2. Hardware Diagram

The ETRX358x-LRS and ETRX358x-LRS are based on the Silicon Labs EM358x family of ZigBee

SoCs in addition to a frontend module containing a PA, LNA and RF switch in addition to the RF-

frontend circuitry. The EM358x family of ZigBee SoCs are fully integrated 2.4GHz ZigBee

transceivers with a 32-bit ARM

®

Cortex M3

TM

microprocessor, flash and RAM memory, and

peripherals.

The industry standard serial wire and JTAG programming and debugging interfaces together with

the standard ARM system debug components help to streamline any custom software

development.

In addition to this a number of MAC functions are also implemented in hardware to help maintain

the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.

The new advanced power management features allow faster wakeup from sleep and new power-

down modes allow this 3

rd

generation module to offer a longer battery life than any 2

nd

generation

modules on the market.

The EM358x has fully integrated voltage regulators for both required 1.8V and 1.25V supply

voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit

eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be

connected externally to pads 3 and 4 in case more accurate timing is required.

4.1 Hardware Interface

All GPIO pins of the EM358x chips are accessible on the module’s pads. Whether signals are

used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.

When using the Telegesis AT Commandset please refer to the AT Commandset manual and the

development kit manual for this information and when developing custom firmware please refer to

the EM358x datasheet [2].

ETRX358x-LRS and ETRX358x-LRS

5 Firmware Description

By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-

air bootloading as well as serial bootloading of new firmware.

In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and

power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally

make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A

pull-up is not required).

In addition to the standalone bootloader the modules also contain the current release of the

Telegesis AT-style command interface as described in the Telegesis AT command dictionary and

the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a

unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and

responses pass through the serial port of the ETRX358x as ASCII text, so a simple terminal

application will usually suffice. We provide Telegesis Terminal for interaction with the module but it

is not an essential feature.

The pre-loaded AT-style command interface firmware is based on the EmberZNet PRO meshing

stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have

no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and

receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices

the module firmware also supports mobile (sleepy) end devices capable of changing their parent

quickly whenever they change their position within the network.]

A router is typically a mains powered device whilst a sleepy end device (SED) can be battery

powered.

The module is also able to act as a coordinator and Trust Centre through external host control.

The AT style command line supplies all the tools required to set up and manage a ZigBee network

by allowing easy access to the low-level functionality of the stack.

The Telegesis firmware uses the meshing and self-healing EmberZNet PRO stack to overcome

many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee

PRO featureset.

The Telegesis firmware allows low-level access to physical parameters such as channel and

power level. Parameters that define the functionality of the ETRX358x module and also allow

standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The

SPI and I2C buses are not supported by the current firmware release, but can be used with custom

firmware.

ETRX358x-LRS and ETRX358x-LRS

5.1 Token Settings

The ETRX358x-LRS Series Modules’ manufacturing tokens will be pre-programmed with the

settings shown in the table below.

Token Description TG Default

MFG_CIB_OBS Option Bytes <not written>

MFG_CUSTOM_VERSION Optional Version Number <not written>

MFG_CUSTOM_EUI_64 Custom EUI <not written>

MFG_STRING Device Specific String TELEGESIS

MFG_BOARD_NAME Hardware Identifier <Order Code>

MFG_MANUF_ID Manufacturer ID 0x1010

MFG_PHY_CONFIG Default Power Settings 0xFFFD

MFG_BOOTLOAD_AES_KEY Bootloader Key <not written>

MFG_EZSP_STORAGE EZSP related <not written>

MFG_CBKE_DATA SE Security <not written>

MFG_INSTALLATION_CODE SE Installation <not written>

MFG_OSC24M_BIAS_TRIM Crystal Bias <not written>

MFG_SYNTH_FREQ_OFFSET Frequency offset <not written>

MFG_OSC24M_SETTLE_DELAY Crystal Stabilizing Time <not written>

MFG_SECURITY_CONFIG Security Settings <not written>

MFG_CCA_THRESHOLD CCA Threshold 0xFEBF

MFG_SECURE_BOOTLOADER_KEY

Secure Bootloader Key <not written>

Table 4. Manufacturing tokens

5.2 Custom Firmware

For high volume customers the firmware can be customised on request. In addition to this the

ETRX358x-LRS series of modules is an ideal platform for developing custom firmware. In order to

develop custom firmware the Silicon Labs Ember toolchain is required.

When writing firmware for the ETRX358x-LRS it is important to ensure that pins PB0 and PC5 are

correctly configured in order that the RF front-end module can operate correctly. An application

note “Writing customised firmware for the ETRX35x-LRS” can be downloaded from the Telegesis

website.

5.3 Boost Mode vs. Normal Mode

The Ember EM358x chips support a “boost mode” power setting next to the “normal mode” power

setting. The “boost mode” setting increases the sensitivity and output power of the radio

transceiver, however with the LRS variants enabling boost mode has no positive effect on neither

the output power nor the sensitivity and therefore it is recommended to not use boost mode on this

platform. The Telegesis AT Command-set firmware automatically disables boost mode on LRS

series modules and adjusts the power maximum power settings.

Section 10.2 lists the requirements for the maximum power settings for use of the LRS family in

different countries.

ETRX358x-LRS and ETRX358x-LRS

5.4 Software Interface

Using the default firmware the ETRX358x-LRS is controlled using a simple AT-style command

interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-

Commands, please refer to the AT command dictionary document which corresponds to the

firmware revision you intend to use.

In addition to the command dictionary there are user guides explaining the features of the firmware

in more detail. If you need to find out which firmware resides on your module simply type “ATI”

followed by a carriage return and you will be prompted with the module’s manufacturing

information.

The Development Kit manual describes how to upgrade the firmware either via a serial link or over

the air.

ETRX358x-LRS and ETRX358x-LRS

6 Absolute Maximum Ratings

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 Supply voltage V

CC

-0.3 to +3.6 Vdc

2 Voltage on any Pad V

in

-0.3 to V

CC

+0.3 Vdc

3

Voltage on any Pad pin (PA4, PA5, PB5,

PB6, PB7, PC1), when used as an input

to the general purpose ADC with the

low voltage range selected

V

in

-0.3 to +2.0 Vdc

4 Storage temperature range T

stg

-40 to +105 °C

5 Operating temperature range T

op

-40 to +85 °C

6 Input RF level P

max

+6 dBm

8 Reflow temperature T

Death

Please refer to chapter 12 °C

Table 5: Absolute Maximum Ratings

The absolute maximum ratings given above should under no circumstances be violated.

Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device

in order to prevent permanent damage.

6.1 Environmental Characteristics

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 ESD on any pad according to

Human Body Model (HBM) circuit

description V

THHBM

±2 kV

2 ESD on non-RF pads according to

Charged Device Model (CDM) circuit

description V

THCDM

±400 V

3 ESD on RF terminal (HBM)

V

THCDM

1000 V

4 Moisture Sensitivity Level MSL MSL3, per J-STD-033

Table 6: Absolute Maximum Ratings

6.2 Recommended Operating Conditions

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Supply voltage V

CC

2.1 3.0 3.6 Vdc

2 RF Input Frequency f

C

2405 2480 MHz

3 RF Input Power p

IN

0 dBm

4 Operating temperature

range T

op

-40 +85 °C

Table 7. Recommended Operating Conditions

ETRX358x-LRS and ETRX358x-LRS

7 DC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE (non-Boost) unless otherwise stated

No. Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Module supply voltage V

CC

2.1 3.6 Vdc

Deep Sleep Current

2 Quiescent current,

internal RC oscillator

disabled, 4kB RAM retained I

SLEEP

1.0 µA

3 Quiescent current,

internal RC oscillator

enabled 4kB RAM retained I

SLEEP

1.25 µA

4 Quiescent current,

including

32.768kHz oscillator 4kB RAM retained I

SLEEP

1.6 µA

5

Quiescent current

including internal RC

oscillator and 32.768kHz

oscillator

4kB RAM retained I

SLEEP

1.9 µA

6 Additional current per

4kB block of RAM

retained I

RAMSLEEP

0,067 µA

Reset Current

7 Quiescent current

nReset asserted I

RESET

2 3 mA

Processor and Peripheral Currents

8 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 12MHz

Core clock I

MCU

7.5 mA

9 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 24MHz

Core clock I

MCU

8.5 mA

10 ARM

®

Cortex

TM

M3,

RAM and flash memory

sleep current

25°C, 12MHz

Core clock I

MCU

4.0 mA

11 ARM

®

Cortex

TM

M3,

RAM and flash memory

sleep current

25°C, 6MHz Core

clock I

MCU

2.5 mA

12 Serial controller current Per serial

controller at max.

clock rate I

SC

0.2 mA

13 General purpose timer

current Per timer at max.

clock rate I

TIM

0.25 mA

14 General purpose ADC

current Max. Sample rate,

DMA I

ADC

1.1 mA

15 USB Active Current I

USB

1 mA

16 USB Suspend Mode

Current I

USBSUSP

2.5 mA

RX Current

17 LNA,Radio receiver MAC

and Baseband ARM

®

Cortex

TM

M3 sleeping. I

RX

26.5 mA

18 Receive current

consumption Total, 12MHz

clock speed I

RX

30 mA

19 Receive current

consumption Total, 24MHz

clock speed I

RX

31.5 mA

ETRX358x-LRS and ETRX358x-LRS

TX Current

20 Transmit current

consumption

at +20dBm

module output

power I

TXVCC

140 mA

21 Transmit Current

consumption at min module

output power I

TXVCC

52 mA

Sleep Modes & Peripheral Current

22 MCU, RAM and flash,

FEM, radio off 12MHz clock

speed I

MCU

7 mA

23 MCU, RAM and flash,

FEM, radio off 24MHz clock

speed I

MCU

8 mA

24 Serial Controller Max data rate I

SC

0.2 mA

25 Timer Max clock rate I

TMR

0.25 mA

26 ADC Max sample rate I

ADC

1.1 mA

Table 8: DC Electrical Characteristics

ETRX358x-LRS and ETRX358x-LRS

8 Digital I/O Specifications

The digital I/Os of the ETRX358x-LRS module have the ratings shown below.

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE unless otherwise stated

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.8 x V

CC

MHz

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value R

IPU

24 29 34 kΩ

6 Input Pull-down resistor

value R

IPD

24 29 34 kΩ

7 Output voltage for logic 0 I

OL

= 4mA (8mA) for

standard (high

current) pads V

OL

0 0.18 x V

CC

V

8 Output voltage for logic 1 I

OH

= 4mA (8mA)for

standard (high

current) pads V

OH

0.82 x V

CC

V

CC

V

9 Output Source Current Standard current

pad I

OHS

4 mA

10 Output Sink current Standard current

pad I

OLS

4 mA

11 Output Source Current High current pad (1) I

OHH

8 mA

12 Output Sink current High current pad (1) I

OLH

8 mA

13 Total output current I

OH

+ I

OL

40 mA

Table 9. Digital I/O Specifications

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.68 x V

CC

Vdc

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value Chip not reset R

IPU

24 29 34 kΩ

6 Input Pull-up resistor

value Chip reset R

IPURESET

12 14.5 17 kΩ

Table 10. nReset Pin Specifications

Notes

1) High current pads are PA6, PA7, PB6, PB7, PC0

ETRX358x-LRS and ETRX358x-LRS

9 A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer

to the EM358x datasheet.

No.

Item

1 A/D resolution Up to 14 bits

2 A/D sample time for 7-bit conversion 5.33µs (188kHz)

3 A/D sample time for 14-bit conversion 682µs

4 Reference Voltage 1.2V

Table 11. A/D Converter Characteristics

10 AC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket

No.

Receiver

Value

Unit

Min

Typ

Max

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -107 -106 -100 dBm

4 Saturation (maximum input level for correct operation) -3 2 dBm

5 High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 41 dB

6 Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 40 dB

7 2

nd

High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 54 dB

8 2

nd

Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 52 dB

9 Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1]) tbd dB

10 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1]) tbd dB

11 Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1]) tbd dBc

12 Relative frequency error

(2x40ppm required by [1]) -120 120 ppm

13 Relative timing error

(2x40ppm required by [1]) -120 120 ppm

14 Linear RSSI range 35 dB

15 Output power at highest power setting

NORMAL MODE

BOOST MODE

20

20 21

21 21.5

21.5 dBm

16 Output power at lowest power setting -40 dBm

17 Error vector magnitude as per IEEE802.15.4 7 15 %

18 Carrier frequency error -40 40 ppm

Table 12. AC Electrical Characteristics

Please Note: For the relationship between EM358x power settings and module output power

please relate to chapter 10.1 of this document. When developing custom firmware the output

power settings described in this document relate directly to the EM358x power settings accessible

via the Ember stack API. When using the Telegesis AT Command-set firmware the settings

ETRX358x-LRS and ETRX358x-LRS

mentioned in this document directly relate to the settings in the S-Register S01 which is used for

setting the output power.

No.

Synthesiser Characteristics

Limit

Unit

Min

Typ

Max

22 Frequency range 2400 2500

MHz

23 Frequency resolution 11.7 kHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -71dBc/Hz

27 Phase noise at 1MHz offset -91dBc/Hz

28 Phase noise at 4MHz offset -103dBc/Hz

29 Phase noise at 10MHz offset -111dBc/Hz

Table 13. Synthesiser Characteristics

No.

Power On Reset (POR) Specifications

Limit

Unit

Min

Typ

Max

30 V

CC

POR release 0.62 0.95 1.2 Vdc

31 V

CC

POR assert 0.45 0.65 0.85 Vdc

Table 14. Power On Reset Specifications

No.

nRESET Specifications

Limit

Unit

Min

Typ

Max

32 Reset Filter Time constant 2.1 12 16 µs

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 15. nReset Specifications

ETRX358x-LRS and ETRX358x-LRS

10.1 TX Power Characteristics

The diagrams below show the typical output power and module current in dependency on

EM358x-LRS power setting in NORMAL MODE at 3.6V and room temperature.

Figure 3. Output Power vs. Power Setting

Figure 4. Module Current vs. Power Setting

ETRX358x-LRS and ETRX358x-LRS

10.2 Power Settings for Regulatory Compliance

Because of the high gain of the frontend module output power of up to 22dBm can be achieved

When the antenna gain is included the output power of the EM358x transceivers needs to be

reduced for regulatory compliance. The following tables list the maximum permitted power setting

for the antenna types listed in Table 2. Note that this is the power out of the EM358x chip (set in

register S01 when using Telegesis R3xx firmware), and the power delivered to the antenna will be

higher by the gain of the RF power amplifier.

(

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE)

Antenna Channels 11-24 Channel 25 Channel 26

1/2 Wave tbd tbd tbd

1/4 Wave tbd tbd tbd

On Board tbd tbd tbd

Table 16: Maximum Power Settings for European Compliance

Finally Table 17 the maximum Power settings for FCC and IC compliance.

Antenna Channels 11-24 Channel 25 Channel 26

1/2 Wave -8 -12 -43

1/4 Wave -8 -8 -26

On Board -7 -7 -26

Table 17: Maximum Power Settings for FCC, IC Compliance

ETRX358x-LRS and ETRX358x-LRS

10.3 Temperature behaviour

Figure 5 and Figure 6 illustrate the temperature behaviour of the ETRX358x-LRS series of

modules. Please note that although the temperature behaviour was measured to up to 100

degrees Celsius the absolute maximum rating is 85 degrees Celsius.

Figure 5. Sensitivity vs. Temperature

Figure 6. TX Power vs. Temperature

ETRX358x-LRS and ETRX358x-LRS

11 Physical Dimensions

Figure 7. ETRX3 Physical Dimensions

Symbol

Explanation

Distance

L Length of the module 25.0mm

W Width of the module 19.0mm

H Height of the module 3.8mm

A1 Distance centre of pad PCB edge 0.9mm

A2 Pitch 1.27mm

R1 Keep-out Zone from corner of PCB 17.5mm

R2 Keep-out Zone from corner of PCB 4.1mm

X1 Distance centre of Antenna connector PCB edge 3.8mm

X2 Distance centre of Antenna connector PCB edge 2.8mm

Table 18. ETRX3 Physical Dimensions

For ideal RF performance when using the on-board antenna, the antenna should be located at the

corner of the carrier PCB. There should be no components, tracks or copper planes in the “keep-

out” area which should be as large as possible. When using the U.FL RF connector the “keep-out”

area does not have to be kept. NB: The modules’ transmit/receive range will depend on the

antenna used and also the housing of the finished product.

ETRX358x-LRS and ETRX358x-LRS

12 Recommended Reflow Profile

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 200°C

90 ±30s

60 +60s-20s

Figure 8. Recommended Reflow Profile

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.

Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent

and other residuals are remaining underneath the shielding can as well as in the gap between the

module and the host board.

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your PCB and re-flow).

ETRX358x-LRS and ETRX358x-LRS

13 Product Label Drawing

Figure 9. Product Label

The label dimensions are 16mm x 14 mm. The label will withstand temperatures used during

reflow soldering. The characters “HR” are only present on the versions with the Hirose connector,

Imprint

Description

ETRX3587HR-LRS

Module Order code Possible codes are:

- ETRX3581-LRS

- ETRX3581HR-LRS

- ETRX3582-LRS

- ETRX3582HR-LRS

- ETRX3585-LRS

- ETRX3585HR-LRS

- ETRX3586-LRS

- ETRX3586HR-LRS

- ETRX3587-LRS

- ETRX3587HR-LRS

- ETRX3588-LRS

- ETRX3588HR-LRS

000001 Indication for the serial number.

090101 Production Date Code in the format YYMMDD, e.g. 090602

01 Indication for factory ID

02 Indication for the hardware revision

FCC ID: S4GEM358L FCC ID code for this product

IC: 8735A-EM358L The IC ID

CE The CE Mark

2D-Barcode

Information in the 2D-Barcode are the serial number [6 characters], the Part-Order code,

identifier for the batch number [2 characters], the identifier for the hardware release [2

characters] and the production date code in the format Year-Month-Day [6 characters], all

separated by a semicolon.

Table 19. ETRX358x-LRS Label Details

ETRX358x-LRS and ETRX358x-LRS

14 Recommended Footprint

In order to surface mount an ETRX3 series module, we recommend that you use pads which are

1mm wide and 1.2mm high. Unless using the “HR” variants the “keep-out” zone shown in section

11 must be retained, and it must be ensured that this area is free of copper tracks and/or copper

planes/layers.

You must also ensure that there is no exposed copper on your layout which may contact with the

underside of the ETRX3 series module.

For best RF performance it is required to provide good ground connections to the ground pads of

the module. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductivity in the ground path.

Figure 10. Recommended Footprint

The land pattern dimensions above serve as a guideline.

We recommend that you use the same pad dimensions for the solder paste screen as you have for

the copper pads. However these sizes and shapes may need to be varied depending on your

soldering processes and your individual production standards. We recommend a paste screen

thickness of 120µm to 150µm.

Figure 11 shows the typical pad dimensions of the module and Figure 12-Figure 14 in section 14.1

show examples of how to align the module on its host PCB.

ETRX358x-LRS and ETRX358x-LRS

Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such

as through-hole vias, planes or tracks on your board component layer, should be located below the

ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB

containing an inner RF shielding ground plane, therefore there is no need to have an additional

copper plane directly under the ETRX3 series module.

Figure 11. Typical pad dimensions

Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules

and to not use a washing process after reflow. If the process does require washing then care must

be taken that no washing agent is trapped underneath the shielding can after the drying process

has completed.

ETRX358x-LRS and ETRX358x-LRS

14.1 Recommended Placement

When placing the module please either locate the antenna in the corner as shown in Figure 12 so

that the recommended antenna keepout zone is being followed, or add a no copper zone as

indicated in Figure 14.

Figure 12. Typical placement

Figure 13. How to not place the Module

ETRX358x-LRS and ETRX358x-LRS

Figure 14. Adding a no copper / no component area

ETRX358x-LRS and ETRX358x-LRS

14.2 Example carrier board

Since the RF performance of the module with the on board antenna is strongly dependent on the

proper location of the module on its carrier board figure 17 shows the reference carrier board

which was used during testing by Telegesis.

Figure 17: Reference Board

For best performance it is recommended to locate the antenna towards the corner of the carrier

board and to respect the recommended keep-out areas as described in section 11.

Finally to provide a good reference ground to the on board antenna, the carrier board should have

a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will

suffice, but a degradation in radio performance could be the result.

ETRX358x-LRS and ETRX358x-LRS

15 Reliability Tests

The following measurements will be conducted after the module has been exposed to standard

room temperature and humidity for 1 hour.

No

Item

Limit

Condition

1 Vibration test Electrical parameter should be

in specification

Freq.:40Hz,Amplitude:1.5mm

20min. / cycle,1hrs. each of X and Y axis

2 Shock test the same as the above Dropped onto hard wood from height of

50cm for 10 times

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.;

each temperature 300 cycles

5 Low temp. test the same as the above -40°C, 300h

6 High temp. test the same as the above +85°C, 300h

Table 20: Reliability Tests

16 Application Notes

16.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual

components.

Before use, check and evaluate their operation when mounted on your products. Abide by

these specifications when using the products. These products may short-circuit. If electrical

shocks, smoke, fire, and/or accidents involving human life are anticipated when a short

circuit occurs, then provide the following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection

device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another

system to prevent a single fault causing an unsafe status.

16.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of these products. Avoid assembly and

use of the target equipment in conditions where the product’s temperature may exceed

the maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the

product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the

products, before use, check and evaluate their operation when assembled onto your

products.

(4) These products are not intended for other uses, other than under the special conditions

shown below. Before using these products under such special conditions, check their

performance and reliability under the said special conditions carefully, to determine

whether or not they can be used in such a manner.

ETRX358x-LRS and ETRX358x-LRS

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where

liquid may splash.

(6) In direct sunlight, outdoors, or in a dusty environment

(7) In an environment where condensation occurs.

(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,

SO2, H2S, NH3, and NOx)

(9) If an abnormal voltage is applied due to a problem occurring in other components or

circuits, replace these products with new products because they may not be able to

provide normal performance even if their electronic characteristics and appearances

appear satisfactory.

(10) Mechanical stress during assembly of the board and operation has to be avoided.

(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not

permitted.

16.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance

characteristics of the product, such as RF performance, may well be adversely

affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas,

such as Cl2, H2S, NH3, SO2, or NOX

(4) Storage (before assembly of the end product) of the modules for more than one year

after the date of delivery at your company even if all the above conditions (1) to (3)

have been met, should be avoided.

ETRX358x-LRS and ETRX358x-LRS

17 Packaging

17.1 Embossed Tape

(1) Dimension of the tape

(2) Cover tape peel force

Force direction

Speed = 300mm/min.

Cover tape peel force

=0.098～0.68N (10～70g)

θ= 10deg

(3) Empty pockets

NB: Empty pockets in the component packed area will be less than two per reel and those empty

pockets will not be consecutive.

Empty pockets

more

Components

Empty pockets

Top cover

tape

Direction of

feed

g

ETRX358x-LRS and ETRX358x-LRS

17.2 Component Orientation

Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the

carrier tape

(top view)

Component Orientation

Part No.

Direction

17.3 Reel Dimensions

(4) Quantity per reel: 600 pieces

(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on

the reel

ETRX358x-LRS and ETRX358x-LRS

17.4 Packaging

(6) Each reel will be packed in a hermetically-sealed bag

(7) Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following

label

Imprint Description

MFG P/N: 99X902DL Internal use

Lot: 00 Internal use

P/N:ETRX3587-LRS Telegesis Module Order Code.

Quantity:600 Quantity of modules inside the reel/carton

Reel No: 000001 Six digit unique Reel number counting up from 000001

Date:120824

Date Code in the format YYMMDD, e.g. 120824

P/C: ETRX3587-LRS-

R308 Module product code with reference to firmware/module type selected during ATE. If

needed multiline.

2D-Barcode

Information in the 32x32 Datamatrix 2D-Barcode are and identifier “!REEL” [5

characters], the reel number [6 characters], the Module Order code [max 18 characters

], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6

characters] and the product code [max 40 characters] , all separated by a semicolon.

ETRX358x-LRS and ETRX358x-LRS

18 Ordering Information

2

MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR

Ordering/Product Code

Description

ETRX3581

-

LRS

2

ETRX3582-LRS

2

ETRX3585-LRS

2

ETRX3586-LRS

2

ETRX3587-LRS

ETRX3588-LRS

2

Power amplified Telegesis Wireless Mesh Networking Module

with Silicon Labs ZigBee Technology:

• Based on Silicon Labs EM358x SoC

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee PRO

stack

• Integrated 2.4GHz Antenna

ETRX3581HR

-

LRS

2

ETRX3582HR-LRS

2

ETRX3585HR-LRS

2

ETRX3586HR-LRS

2

ETRX3587HR-LRS

ETRX3588HR-LRS

2

Power amplified Telegesis Wireless Mesh Networking Module

with Silicon Labs ZigBee

Technology:

• Based on Silicon Labs EM358x SoC

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee PRO

stack

• U.FL coaxial Antenna Connector

ETRX357DVK

Telegesis Development Kit with:

• 3 x ETRX3DVK Development Boards

• 3 x USB cables

• 2 x ETRX357 on carrier boards

• 2 x ETRX357HR on carrier boards

• 2 x ETRX357-LRS on carrier boards

• 2 x ETRX357HR-LRS on carrier boards

• 1 x ETRX3USB USB stick

• 2 x ½-wave antennae

• 2 x ¼-wave antennae

ETRX3587 Expansion Pack

•

2 x ETRX3587 on carrier boards

• 2 x ETRX3587HR on carrier boards

• 2 x ETRX3587-LRS on carrier boards

• 2 x ETRX3587HR-LRS on carrier boards

Notes:

• Customers’ PO’s must state the Ordering/Product Code.

• There is no “blank” version of the ETRX358x modules available. All Modules are pre-

programmed with the Telegesis AT style command interpreter based on the EmberZNet

stack. (In case it is desired to program custom firmware the pre-programmed firmware can

simply be overwritten).

ETRX358x-LRS and ETRX358x-LRS

19 Trademarks

All trademarks, registered trademarks and products names are the sole property of their respective

owners.

20 Disclaimer

Product and company names and logos referenced may either be trademarks or registered

trademarks of their respective companies. We reserve the right to make modifications and/or

improvements without prior notification. All information is correct at time of issue. Telegesis (UK)

Ltd does not convey any license under its patent rights or assume any responsibility for the use of

the described product

21 RoHS Declaration

Declaration of environmental compatibility for supplied products:

Hereby we declare to our best present knowledge based on the declaration of our suppliers that

this product does not contain any of the substances which are banned by Directive 2011/65/EU

(RoHS)

22 Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to

improve the design and supply the best possible product. Please consult the most recently issued

data sheet before initiating or completing a design.

23 Life Support Policy

This product is not designed for use in life support appliances, devices, or systems where

malfunction can reasonably be expected to result in a significant personal injury to the user, or as a

critical component in any life support device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness. Customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.

ETRX358x-LRS and ETRX358x-LRS

24 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical

Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-

WPANs)

[2] Datasheet EM35x, Ember. (www.ember.com)

[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -

Low Profile 1.9mm or 2.4mm Mated Height

[4] The ZigBee specification (www.zigbee.org)

[5] Specification for Antenova Rufa Antenna (www.antenova.com)

[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

25 Contact Information

Website: www.telegesis.com

E-mail sales@telegesis.com

Telegesis (UK) Limited

Abbey Barn Business Centre

Abbey Barn Lane

High Wycombe

Bucks

HP10 9QQ

UK

Tel: +44 (0)1494 510199

Fax: +44 (0)5603 436999

Silicon Laboratories Finland EM358L ETRX3581-LRS, ETRX3582-LRS, ETRX3585-LRS, ETRX3586-LRS, ETRX3587-LRS, ETRX3588-LRS, ETRX3581HR-LRS, ETRX3582HR-LRS, ETRX3585HR-LRS, ETRX3586HR-LRS, ETRX3587HR-LRS, ETRX3588HR-LRS User Manual TG PM 0511 ETRX358x LRS r2

Telegesis (UK) Ltd ETRX3581-LRS, ETRX3582-LRS, ETRX3585-LRS, ETRX3586-LRS, ETRX3587-LRS, ETRX3588-LRS, ETRX3581HR-LRS, ETRX3582HR-LRS, ETRX3585HR-LRS, ETRX3586HR-LRS, ETRX3587HR-LRS, ETRX3588HR-LRS TG PM 0511 ETRX358x LRS r2

User Manual

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