Silicon Laboratories Finland SEM357L sETRX357-LRS sETRX357HR-LRS User Manual TG PM 0514 sETRX357 LRS r0

Telegesis

TG-PM-0514-sETRX357-LRS r0

sETRX357-LRS family Product Manual

sETRX357-LRS ZIGBEE

®

MODULES

PRODUCT MANUAL

sETRX357-LRS family

Table of Contents

1 INTRODUCTION ................................................................................................................. 5

1.1 Hardware Description ....................................................................................................... 5

2 PRODUCT APPROVALS ................................................................................................... 6

2.1 FCC Approvals ................................................................................................................. 6

2.1.1 FCC Labelling Requirements ........................................................................................... 7

2.2 IC (Industry Canada) Approvals ....................................................................................... 7

2.2.1 IC Labelling Requirements ............................................................................................... 8

3 MODULE PIN-OUT ............................................................................................................. 9

3.1 Interface to Optional 8Mbit Flash .................................................................................... 11

4 HARDWARE DESCRIPTION ............................................................................................ 12

4.1 Hardware Interface ......................................................................................................... 12

5 FIRMWARE DESCRIPTION ............................................................................................. 13

5.1 Token Settings ............................................................................................................... 14

5.2 Custom Firmware ........................................................................................................... 14

5.3 Boost Mode vs. Normal Mode ........................................................................................ 14

5.4 Software Interface .......................................................................................................... 15

6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 16

6.1 Environmental Characteristics ........................................................................................ 16

6.2 Recommended Operating Conditions............................................................................. 16

7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 17

8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 18

9 A/D CONVERTER CHARACTERISTICS .......................................................................... 19

10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 19

10.1 TX Power Characteristics ............................................................................................... 21

10.2 Power Settings for Regulatory Compliance .................................................................... 22

11 PHYSICAL DIMENSIONS ................................................................................................. 23

12 RECOMMENDED REFLOW PROFILE ............................................................................. 24

13 PRODUCT LABEL DRAWING ......................................................................................... 25

13.1 Date Codes .................................................................................................................... 26

14 RECOMMENDED FOOTPRINT ........................................................................................ 27

14.1 Recommended Placement ............................................................................................. 29

14.2 Example carrier board .................................................................................................... 30

15 RELIABILITY TESTS ........................................................................................................ 31

16 APPLICATION NOTES ..................................................................................................... 31

16.1 Safety Precautions ......................................................................................................... 31

sETRX357-LRS family

16.2 Design Engineering Notes .............................................................................................. 31

16.3 Storage Conditions ......................................................................................................... 32

17 PACKAGING .................................................................................................................... 32

18 ORDERING INFORMATION ............................................................................................. 33

19 TRADEMARKS ................................................................................................................. 34

20 DISCLAIMER .................................................................................................................... 34

21 ROHS DECLARATION ..................................................................................................... 34

22 DATA SHEET STATUS .................................................................................................... 34

23 LIFE SUPPORT POLICY .................................................................................................. 34

24 RELATED DOCUMENTS ................................................................................................. 35

25 CONTACT INFORMATION ............................................................................................... 35

sETRX357-LRS Family

Image not shown actual size; enlarged to show detail.

Module Features

• Small form factor, SMT module 23mm x 16mm

• Side Castellations for easy soldering and inspection

• Three antenna options: Integrated chip antenna, U.FL

coaxial connector or RF pad

• Based on 32-bit ARM® Cortex-M3

• Industry standard JTAG Programming and real time

network level debugging via the Ember Debug Port

• Up to 192kB of flash and 12kB of RAM

• Optional 8Mbit Flash Chip

• Lowest Deep Sleep Current of sub 1µA with retained

RAM and GPIO and multiple sleep modes

• Ultra Wide supply voltage range (2.1 to 3.6V; 2.3V to

3.6V on “8” variants)

• Optional 32.768kHz watch crystal can be added

externally

• Module ships with standard Telegesis AT-style

command interface based on the ZigBee PRO feature

set

• Can act as an End Device, Router or Coordinator

• Up to 22 general-purpose I/O lines including analogue

inputs

• Firmware upgrades via serial port or over the air

(password protected)

• Hardware supported encryption (AES-128)

• FCC and IC modular compliance

• Operating temperature range: -40

°

C to +85

°

C

The Telegesis sETRX357-LRS family of modules are low power

2.4GHz ZigBee modules with an added frontend module (SiGe

SE2432L) containing both PA and LNA for highest possible link

budget.

Based on the Silicon Labs EM357 family of single chip ZigBee

solutions the new long range modules offer three possible RF

output configurations, namely an on board antenna, U.FL

coaxial antenna connector or a RF pad. A further option is an

8Mbit flash chip which can be switched off completely for lowest

possible power consumption.

The module’s unique AT-style command line interface allows

designers to quickly integrate ZigBee technology without

complex software engineering. For custom application

development the sETRX357 series integrates with ease into

Ember’s InSight development environment.

Radio Features

• Based on the Silicon Labs EM357 family of single chip

ZigBee®

SoCs

• 2.4GHz ISM Band

• 250kbit/s over the air data rate – NB: actual usable data

throughput with ZigBee is about 20kbps

• 15 channels (IEEE802.15.4 Channel 11 to 25)

• SiGe SE2432L integrated PA and LNA

• +20dBm output power (adjustable down to -41dBm)

• High sensitivity of -106dBm typ. @ 1% packet error rate

• RX Current: 33mA, TX Current: approx 140mA at

20dBm

•

Robust Wi

-

Fi and Bluetooth coexistence

Suggested Applications

• ZigBee Smart Energy applications

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Lighting and ventilation control

• Remote monitoring

• Environmental monitoring and control

Development Kit

• Development kit containing everything required to set

up a mesh network quickly and evaluate range and

performance of the sETRX357-LRS.

• AT-style software interface command dictionary can be

modified for high volume customers.

• Custom software development available upon request.

Example AT

-

Style Commands

AT+BCAST Send a Broadcast

AT+UCAST:<address> Send a Unicast

AT+EN Establish PAN network

AT+JN Join PAN

At power-up the last configuration is loaded from non-

volatile S-Registers, which can eliminate the need for an

additional host controller.

sETRX357-LRS Family

1 Introduction

This document describes the Telegesis small form factor sETRX357-LRS family of ZigBee long

range modules which have been designed to be easily integrated into another device and to

provide a fast, simple and low cost wireless mesh networking interface.

The Telegesis sETRX3-LRS series modules are based on the Silicon Labs ZigBee compliant

platform consisting of the EM357 single chip family combined with the ZigBee PRO compliant

EmberZNet meshing stack. Integration into a wide range of applications is made easy using a

simple AT style command interface and advanced hardware design.

The configurable functionality of the Telegesis AT Commandset often allows the sETRX357-LRS

series of ZigBee modules to be used without an additional host microcontroller saving even more

integration time and costs. In addition to the Telegesis AT Commandset, the sETRX357-LRS

family can be used with custom-built firmware whilst representing an ideal platform for custom

firmware development in conjunction with the Silicon Labs ZigBee development kits.

No RF experience or expertise is required to add this powerful wireless networking capability to

your products. The sETRX357-LRS family offers fast integration opportunities and the shortest

possible time to market for your product.

1.1 Hardware Description

The main building blocks of the sETRX357-LRS family are the single chip EM357 SoC from Silicon

Labs, a SiGe SE2432L frontend module combining a Power Amplifier with a Low Noise Amplifier, a

24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The

modules are available with on-board antenna, a U.FL connector or a RF pad for attaching external

antennae. Modules with the U.FL connector are identified by the “HR” suffix, modules with the

antenna pad by the “AP” suffix.

The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data

are available from the Antenova website [5].

Module

Chip

Flash

RAM

Antenna

Additional

8Mbit Flash

sETRX37-LRS EM357 192kB 12kB Chip No

sETRX357HR-LRS EM357 192kB 12kB External No

sETRX357AP-LRS

EM357 192kB 12kB Pad No

sETRX37-LRS8 EM357 192kB 12kB Chip Yes

sETRX357HR-LRS8 EM357 192kB 12kB External Yes

sETRX357AP-LRS8 EM357 192kB 12kB Pad Yes

Table 1: Order Codes

The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the

sensitivity by 5dB which will increase the range by up to 700% relative to unamplified devices with

suitable propagation conditions (where local regulations permit the use of the maximum output

power).

The sETRX357 family is used for ZigBee

(www.zigbee.org) applications. In case it is desired to

develop custom firmware instead of using the pre-loaded AT-Command interface, the Silicon Labs

toolchain, consisting of Ember Desktop together with a comprehensive integrated development

environment (IDE), is required.

sETRX357-LRS Family

2 Product Approvals

The sETRX357-LRS family has been designed to meet all national regulations for world-wide use.

In particular the following certifications have been obtained:

2.1 FCC Approvals

The Telegesis sETRX357-LRS and sETRX357-LRS8 modules with integrated Antenna as well as

the sETRX357HR-LRS and sETRX357HR-LRS8 modules including the antennas listed in table 2

and the power levels listed in section 10.2 have been tested to comply with FCC CFR Part 15

(USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC

public notice DA00.1407.transmitter.

FCC statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. End users must follow the specific operating instructions for satisfying RF

exposure compliance. This transmitter must not be co-located or operating in conjunction

with any other antenna or transmitter.

Item

Part No.

Manufacturer

Type

Impedance

Gain

1 BT-Stubby

(straight) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

2 BT-Stubby

(right-angle) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

3 CJ-2400-6603 Chang Jia ½ Wave 50 Ω 2.0dBi

4 Rufa (on

board) Antenova Chip 50Ω 2.1dBi

(peak)

Table 2. Approved Antennae

An end user deploying sETRX357-LRS, sETRX357HR-LRS, sETRX357-LRS8 or sETRX357HR-

LRS8 modules together with an antenna listed in Table 2 is not required to obtain a new

authorization for the module – BUT this does not preclude the possibility that some other form of

authorization or testing may be required for the end product depending upon local territorial

regulations.

The FCC requires the user to be notified that any changes or modifications made to this device

that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the

equipment.

When using the sETRX357-LRS with approved antennae, it is required to prevent end-users from

replacing them with non-approved ones. The antenna(s) must be installed such that a minimum

FCC ID

:

S4

GSEM357L

sETRX357-LRS Family

separation distance of 2.6cm is maintained between the radiator (antenna) and all persons at all

times.

2.1.1 FCC Labelling Requirements

When integrating the sETRX357-LRS, sETRX357HR-LRS, sETRX357-LRS8 or sETRX357HR-

LRS8 modules into a product it must be ensured that the FCC labelling requirements are met.

This includes a clearly visible label on the outside of the finished product specifying the Telegesis

FCC identifier (FCC ID: S4GSEM357L) as well as the notice above. This exterior label can use

wording such as “Contains Transmitter Module FCC ID: S4GSEM357L” or “Contains FCC ID:

S4GSEM357L” although any similar wording that expresses the same meaning may be used.

2.2 IC (Industry Canada) Approvals

The Telegesis sETRX357-LRS family with integrated Antenna as well as the sETRX357HR-LRS

family have been approved by Industry Canada to operate with the antenna types listed in Table 2

with the maximum permissible gain and required antenna impedance for each antenna type

indicated. Antenna types not included in this list, having a gain greater than the maximum gain

indicated for that type, are strictly prohibited for use with this device.

IC-ID: 8735A-SEM357L

• This device complies with Industry Canada license-exempt RSS standard(s). Operation is

subject to the following two conditions: (1) this device may not cause interference, and (2)

this device must accept any interference, including interference that may cause undesired

operation of the device.

• Under Industry Canada regulations, this radio transmitter may only operate using an antenna

of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To

reduce potential radio interference to other users, the antenna type and its gain should be so

chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that

permitted for successful communication.

• This device has been designed to operate with the antennas listed in Table 2, and having a

maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1

dBi are strictly prohibited for use with this device. The required antenna impedance is 50

ohms.

French Statements

• Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain

de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité

nécessaire à l'établissement d'une communication satisfaisante.

• Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le

fonctionnement.

sETRX357-LRS Family

OEM Responsibilities

The sETRX357-LRS and sETRX357HR-LRS families of modules have been certified for integration into

products only by OEM integrators under the following conditions:

1. The antenna(s) must be installed such that a minimum separation distance of 2.6cm is

maintained between the radiator (antenna) and all persons at all times.

2. The transmitter module must not be co-located or operating in conjunction with any other

antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any additional

compliance requirements required with this module installed (for example, digital device emissions,

PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations

or co-location with another transmitter), then Industry Canada certification is no longer considered

valid and the IC Certification Number can not be used on the final product. In these circumstances,

the OEM integrator will be responsible for re-evaluating the end product (including the transmitter)

and obtaining a separate Industry Canada authorization.

2.2.1 IC Labelling Requirements

The sETRX357-LRS and sETRX357HR-LRS modules are labelled with their own IC Certification

Number. As the IC Certification Number is not visible when the module is installed inside another device,

the outside of the device into which the module is installed must display a label referring to the enclosed

module. In that case, the final end product must be labelled in a visible area with the following:

“Contains Transmitter Module IC: 8735A-SEM357L”

or

“Contains IC: 8735A-SEM357L”

The OEM of the sETRX357-LRS and sETRX357HR-LRS family modules must only use the approved

antenna(s) listed above, which have been certified with this module.

The OEM integrator has to be aware not to provide information to the end user regarding how to

install or remove this RF module or change RF related parameters in the user’s manual of the end

product.

sETRX357-LRS Family

3 Module Pin-out

Figure 1. sETRX357-LRS series Module Pin-out (top view)

The table below gives details about the pin assignment for direct SMD soldering of the sETRX357-

LRS series modules to the application board. For more information on the alternate functions

please refer to [2]. Also refer to the Telegesis AT Command-set documentation to understand how

the pre-programmed firmware makes use of the individual I/Os.

All GND pads are connected within the module, but for best RF performance all of them should be

grounded externally.

sETRX357-LRS Family

s

ETRX35x

Pad

Name

EM35x Pin

Default use

Alternate Functions

1 GND GND GND

2 GND GND GND

3 PC5 {1} 11 TX_ACTIVE

4 nReset {6} 12 nReset

5 PC6 13 I/O OSC32B, nTX_ACTIVE

6 PC7 14 I/O OSC32A, OSC32_EXT, FLASH_ENABLE{7}

7 GND GND GND GND

8 PA7 {5} 18 I/O TIM1C4

9 PB3 {2,3} 19 I/O, CTS SC1nCTS, SC1SCLK, TIM2C3

10 PB4 {2,3} 20 I/O, RTS TIM2C4, SC1nRTS, SC1nSSEL

11 PA0 21 I/O TIM2C1, SC2MOSI, Flash MOSI{7}

12 PA1 22 I/O TIM2C3, SC2SDA, SC2MISO, Flash MISO{7}

13 GND GND GND

14 PA2 24 I/O TIM2C4, SC2SCL, SC2SCLK, Flash CLK{7}

15 PA3 25 I/O SC2nSSEL, TRACECLK, TIM2C2, Flash CS{7}

16 PA4 26 I/O ADC4, PTI_EN, TRACEDATA

17 PA5 {4} 27 I/O ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

18 PA6 {5} 29 I/O TIM1C3

19 PB1 {3} 30 TXD SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1

20 PB2 {3} 31 RXD SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2

21 JTCK 32 SWCLK

22 PC2 33 I/O JTDO, SWO

23 PC3 34 I/O JTDI

24 GND GND GND

25 PC4 35 I/O JTMS, SWDIO

26 n/c n/c Reserved, don’t connect

27 PC1 38 I/O ADC3, SWO, TRACEDATA0

28 PC0 {5} 40 I/O JRST, IRQD, TRACEDATA1

29 PB7 {5} 41 I/O ADC2, IRQC, TIM1C2

30 PB6 {5} 42 I/O ADC1, IRQB, TIM1C1

31 n/c n/c Reserved, don’t connect

32 Vcc Vcc Vcc Supply Voltage

33 GND GND GND

34 RF n/a Optional RF Pad

35 GND GND GND

36 GND GND GND

Table 3: Pin Information

Notes:

{1} When the alternate GPIO function is selected, TX_ACTIVE becomes an output that indicates that the

EM35x radio transceiver is in transmit mode. PC5 must be used in this mode as it is used internally

as TX_ACTIVE to control the external RF frontend.

{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively

{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See

the AT Command Manual.

{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader

{5} PA6, PA7, PB6, PB7 and PC0 can source or sink high current (8mA)

{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET

is low

{7} functionality available on versions with “L” suffix: Optional on chip flash (Winbond W25Q80BLUXIG)

sETRX357-LRS Family

Alternate functions depend on the firmware, but the Telegesis R3xx AT Command-set functions

are indicated here for convenience.

3.1 Interface to Optional 8Mbit Flash

Table 4 shows the connectivity to the optional

Winbond W25Q80BLUXIG

8Mbit SPI flash chip which

is fitted to all module variants with the “8” suffix.

Signal Name Functionality

PA0 MOSI

PA1 MISO

PA2 CLK

PA3 Chip Select

PC7 Flash enable

Table 4: GPIO usage for Flash

To minimize power consumption the Flash chip can be switched on by driving PC7 low. Driving

PC7 high, or not driving PC7 at all will leave the flash chip powered off.

The /hold and /WP pins of the optional flash chip are tied high.

sETRX357-LRS Family

4 Hardware Description

24MHz

EM357

I/O

UART

I / O

programming

5

JTAG

V

cc

V

reg

RESET

Match

integrated

antenna

U.FL socket

rf

terminal

selection,

filtering and

matching

circuitry

LDO

1V8

1,8Vdc

A/D

LDO

1V25

Match

FEM

Optional 8Mbit

Flash

SPI

Figure 2. Block Diagram

The sETRX357-LRS family of modules are based on the Silicon Labs EM357 family of ZigBee

SoCs plus a frontend module containing a PA, LNA and RF switch in addition to the RF antenna

matching circuitry. The EM357 family of ZigBee SoCs are fully integrated 2.4GHz ZigBee

transceivers with a 32-bit ARM

®

Cortex M3

TM

microprocessor, flash and RAM memory, and

peripherals.

The industry standard serial wire and JTAG programming and debugging interfaces together with

the standard ARM system debug components help to streamline any custom software

development.

In addition to this a number of MAC functions are also implemented in hardware to help maintain

the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.

The new advanced power management features allow faster wakeup from sleep and new power-

down modes allow this 3

rd

generation module to offer a longer battery life than any 2

nd

generation

modules on the market.

The EM357 has fully integrated voltage regulators for both required 1.8V and 1.25V supply

voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit

eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be

connected externally to pads 3 and 4 in case more accurate timing is required.

4.1 Hardware Interface

All GPIO pins of the EM357 chip are accessible on the module’s pads. Whether signals are used

as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.

When using the Telegesis AT Commandset please refer to the AT Commandset manual and the

development kit manual for this information and when developing custom firmware please refer to

the EM357 datasheet [2].

sETRX357-LRS Family

5 Firmware Description

By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-

air bootloading as well as serial bootloading of new firmware.

In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and

power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally

make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A

pull-up is not required).

In addition to the standalone bootloader the modules also contain the current release of the

Telegesis AT-style command interface as described in the Telegesis AT command dictionary and

the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a

unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and

responses pass through the serial port of the sETRX357-LRS as ASCII text, so a simple terminal

application will usually suffice. We provide Telegesis Terminal for interaction with the module but it

is not an essential feature.

The pre-loaded AT-style command interface firmware is based on the latest EmberZNet PRO

meshing stack which implements routers/coordinators as well as (sleepy) end devices. [End

devices have no routing responsibility and therefore are allowed to go to sleep, whilst still being

able to send and receive messages via a parent router. In addition to classical sleepy and non-

sleepy end devices the module firmware also supports mobile (sleepy) end devices capable of

changing their parent quickly whenever they change their position within the network.]

A router is typically a mains powered device whilst a sleepy end device (SED) can be battery

powered.

The module is also able to act as a coordinator and Trust Centre through external host control.

The AT style command line supplies all the tools required to set up and manage a ZigBee network

by allowing easy access to the low-level functionality of the stack.

The Telegesis firmware uses the meshing and self-healing EmberZNet PRO stack to overcome

many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee

PRO featureset.

The Telegesis firmware allows low-level access to physical parameters such as channel and

power level. Parameters that define the functionality of the sETRX357-LRS module and also allow

standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The

SPI and I2C buses are not supported by the current firmware release, but can be used with custom

firmware.

sETRX357-LRS Family

5.1 Token Settings

The sETRX357-LRS series modules’ manufacturing tokens will be pre-programmed with the

settings shown in the table below.

Token Description TG Default

MFG_CIB_OBS Option Bytes <not written>

MFG_CUSTOM_VERSION Optional Version Number <not written>

MFG_CUSTOM_EUI_64 Custom EUI <not written>

MFG_STRING Device Specific String TELEGESIS

MFG_BOARD_NAME Hardware Identifier <Order Code>

MFG_MANUF_ID Manufacturer ID 0x1010

MFG_PHY_CONFIG Default Power Settings 0xFFFD

MFG_BOOTLOAD_AES_KEY Bootloader Key <not written>

MFG_EZSP_STORAGE EZSP related <not written>

MFG_CBKE_DATA SE Security <not written>

MFG_INSTALLATION_CODE SE Installation <not written>

MFG_OSC24M_BIAS_TRIM Crystal Bias <not written>

MFG_SYNTH_FREQ_OFFSET Frequency offset <not written>

MFG_OSC24M_SETTLE_DELAY Crystal Stabilizing Time <not written>

MFG_SECURITY_CONFIG Security Settings <not written>

MFG_CCA_THRESHOLD CCA Threshold 0xFEBF

MFG_SECURE_BOOTLOADER_KEY

Secure Bootloader Key <not written>

Table 5. Manufacturing tokens

5.2 Custom Firmware

For high volume customers the firmware can be customised on request. In addition to this the

sETRX357-LRS series of modules is an ideal platform for developing custom firmware. In order to

develop custom firmware the Silicon Labs Ember toolchain is required.

When writing firmware for the sETRX357-LRS it is important to ensure that pins PB0 and PC5 are

correctly configured in order that the RF front-end module can operate correctly. The application

note “Writing customised firmware for the ETRX357-LRS” which can be downloaded from the

Telegesis website is also applicable to the sETRX357-LRS.

5.3 Boost Mode vs. Normal Mode

The Ember EM357 chips support a “boost mode” power setting next to the “normal mode” power

setting. The “boost mode” setting increases the sensitivity and output power of the radio

transceiver, however with the LRS variants enabling boost mode has no positive effect on either

the output power or the sensitivity and therefore it is recommended to not use boost mode on this

platform. The Telegesis AT Command-set firmware automatically disables boost mode on LRS

series modules and adjusts the power maximum power settings.

Section 10.2 lists the requirements for the maximum power settings for use of the LRS family in

different countries.

sETRX357-LRS Family

5.4 Software Interface

Using the default firmware the sETRX357-LRS is controlled using a simple AT-style command

interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-

Commands, please refer to the AT command dictionary document which corresponds to the

firmware revision you intend to use.

In addition to the command dictionary there are user guides explaining the features of the firmware

in more detail. If you need to find out which firmware resides on your module simply type “ATI”

followed by a carriage return and you will be prompted with the module’s manufacturing

information.

The Development Kit manual describes how to upgrade the firmware either via a serial link or over

the air.

sETRX357-LRS Family

6 Absolute Maximum Ratings

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 Supply voltage V

CC

-0.3 to +3.6 Vdc

2 Voltage on any Pad V

in

-0.3 to V

CC

+0.3 Vdc

3

Voltage on any Pad pin (PA4, PA5, PB5,

PB6, PB7, PC1), when used as an input

to the general purpose ADC with the

low voltage range selected

V

in

-0.3 to +2.0 Vdc

4 Storage temperature range T

stg

-40 to +105 °C

5 Operating temperature range T

op

-40 to +85 °C

6 Input RF level P

max

+6 dBm

8 Reflow temperature T

Death

Please refer to chapter 12 °C

Table 6: Absolute Maximum Ratings

The absolute maximum ratings given above should under no circumstances be violated.

Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device

in order to prevent permanent damage.

6.1 Environmental Characteristics

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 ESD on any pad according to

Human Body Model (HBM) circuit

description V

THHBM

±2 kV

2 ESD on non-RF pads according to

Charged Device Model (CDM) circuit

description V

THCDM

±400 V

3 ESD on RF terminal (HBM)

V

THCDM

1000 V

4 Moisture Sensitivity Level MSL MSL3, per J-STD-033

Table 7: Absolute Maximum Ratings

6.2 Recommended Operating Conditions

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Supply voltage V

CC

2.1 or 2.3 3.0 3.6 Vdc

2 RF Input Frequency f

C

2405 2480 MHz

3 RF Input Power p

IN

0 dBm

4 Operating temperature

range T

op

-40 +85 °C

Table 8. Recommended Operating Conditions

sETRX357-LRS Family

7 DC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE (non-Boost) unless otherwise stated

No. Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Module supply voltage Without 8Mbit

flash (non “8”

suffix) V

CC

2.1 3.6 Vdc

2 Module supply voltage With 8Mbit

optional flash (“8”

variants) V

CC

2.3 3.6 Vdc

Deep Sleep Current

3 Quiescent current,

internal RC oscillator

disabled, I

SLEEP

0.6 µA

4 Quiescent current,

internal RC oscillator

enabled I

SLEEP

0.7 µA

5 Quiescent current,

including

32.768kHz oscillator I

SLEEP

1.5 µA

6

Additional Current in

case flash chip is

enabled, but in power-

down on variants with “8”

suffix

I

FlashSleep

1 5 µA

7

Additional Current in

case flash chip is

enabled, but in standby-

on variants with “8” suffix

I

FlashSleep

25 50 µA

Reset Current

8 Quiescent current

nReset asserted I

RESET

2 3 mA

Processor and Peripheral Currents

9 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 12MHz

Core clock I

MCU

6.5 mA

10 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 24MHz

Core clock I

MCU

7.5 mA

11 Serial controller current Per serial

controller at max.

clock rate I

SC

0.2 mA

12 General purpose timer

current Per timer at max.

clock rate I

TIM

0.25 mA

13 General purpose ADC

current Max. Sample

rate, DMA I

ADC

1.1 mA

14 Flash Write current of

8Mbit flash (“8” suffix) I

FLASHWRITE

20 25 mA

RX Current

15 Receive current

consumption Total, 12MHz

clock speed I

RX

30 mA

16 Receive current

consumption Total, 24MHz

clock speed I

RX

31.5 mA

TX Current

17 Transmit current

consumption

at +20dBm

module output

power I

TXVCC

140 mA

18 Transmit Current

consumption at min module

output power I

TXVCC

52 mA

Table 9: DC Electrical Characteristics

sETRX357-LRS Family

8 Digital I/O Specifications

The digital I/Os of the sETRX357-LRS module have the ratings shown below.

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE unless otherwise stated

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.8 x V

CC

MHz

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value R

IPU

24 29 34 kΩ

6 Input Pull-down resistor

value R

IPD

24 29 34 kΩ

7 Output voltage for logic 0 I

OL

= 4mA (8mA) for

standard (high

current) pads V

OL

0 0.18 x V

CC

V

8 Output voltage for logic 1 I

OH

= 4mA (8mA)for

standard (high

current) pads V

OH

0.82 x V

CC

V

CC

V

9 Output Source Current Standard current

pad I

OHS

4 mA

10 Output Sink current Standard current

pad I

OLS

4 mA

11 Output Source Current High current pad (1) I

OHH

8 mA

12 Output Sink current High current pad (1) I

OLH

8 mA

13 Total output current I

OH

+ I

OL

40 mA

Table 10. Digital I/O Specifications

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.68 x V

CC

Vdc

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value Chip not reset R

IPU

24 29 34 kΩ

6 Input Pull-up resistor

value Chip reset R

IPURESET

12 14.5 17 kΩ

Table 11. nReset Pin Specifications

Notes

1) High current pads are PA6, PA7, PB6, PB7, PC0

sETRX357-LRS Family

9 A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer

to the EM358x datasheet.

No.

Item

1 A/D resolution Up to 14 bits

2 A/D sample time for 7-bit conversion 5.33µs (188kHz)

3 A/D sample time for 14-bit conversion 682µs

4 Reference Voltage 1.2V

Table 12. A/D Converter Characteristics

10 AC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket

No.

Receiver

Value

Unit

Min

Typ

Max

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -107 -106 -100 dBm

4 Saturation (maximum input level for correct operation) -3 2 dBm

5 High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 41 dB

6 Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 40 dB

7 2

nd

High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 54 dB

8 2

nd

Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 52 dB

9 Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1]) tbd dB

10 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1]) tbd dB

11 Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1]) tbd dBc

12 Relative frequency error

(2x40ppm required by [1]) -120 120 ppm

13 Relative timing error

(2x40ppm required by [1]) -120 120 ppm

14 Linear RSSI range 35 dB

15 Output power at highest power setting

NORMAL MODE

BOOST MODE

20

20 21

21 21.5

21.5 dBm

16 Output power at lowest power setting -40 dBm

17 Error vector magnitude as per IEEE802.15.4 7 15 %

Table 13. AC Electrical Characteristics

Please Note: For the relationship between EM357 power settings and module output power

please relate to chapter 10.1 of this document. When developing custom firmware the output

power settings described in this document relate directly to the EM357 power settings accessible

via the Ember stack API. When using the Telegesis AT Command-set firmware the settings

sETRX357-LRS Family

mentioned in this document directly relate to the settings in the S-Register S01 which is used for

setting the output power.

No.

Synthesiser Characteristics

Limit

Unit

Min

Typ

Max

22 Frequency range 2400 2500

MHz

23 Frequency resolution 11.7 kHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -71dBc/Hz

27 Phase noise at 1MHz offset -91dBc/Hz

28 Phase noise at 4MHz offset -103dBc/Hz

29 Phase noise at 10MHz offset -111dBc/Hz

Table 14. Synthesiser Characteristics

No.

Power On Reset (POR) Spec

ifications

Limit

Unit

Min

Typ

Max

30 V

CC

POR release 0.62 0.95 1.2 Vdc

31 V

CC

POR assert 0.45 0.65 0.85 Vdc

Table 15. Power On Reset Specifications

No.

nRESET Specifications

Limit

Unit

Min

Typ

Max

32 Reset Filter Time constant 2.1 12 16 µs

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 16. nReset Specifications

sETRX357-LRS Family

10.1 TX Power Characteristics

The diagrams below show the typical output power and module current as a function of

sETRX357-LRS power setting in NORMAL MODE at 3.6V and room temperature.

Figure 3. Output Power vs. Power Setting

Figure 4. Module Current vs. Power Setting

sETRX357-LRS Family

10.2 Power Settings for Regulatory Compliance

Because of the high gain of the frontend module output power of up to 22dBm can be achieved

When the antenna gain is included the output power of the sETRX357-LRS transceivers needs to

be reduced for regulatory compliance. The following tables list the maximum permitted power

setting for the antenna types listed in Table 2. Note that this is the power out of the EM357 chip

(set in register S01 when using Telegesis R3xx firmware), and the power delivered to the antenna

will be higher by the gain of the RF power amplifier.

Antenna Channels 11-18 Channels 19-24 Channel 25 Channel 26

1/2 Wave -9 -9 -9 -43

1/4 Wave -8 -8 -8 -26

On Board -7 -7 -8 -26

Table 17: Maximum Power Settings for FCC, IC Compliance

sETRX357-LRS Family

11 Physical Dimensions

Figure 5. ETRX3 Physical Dimensions

For ideal RF performance when using the on-board antenna, the antenna should stick out from the

carrier PCB. There should be no components, tracks or copper planes in the “keep-out” area

which should be as large as possible. When using the U.FL RF connector or the Rf pad the “keep-

out” area does not have to be kept. NB: The modules’ transmit/receive range will depend on the

antenna used and also the housing of the finished product.

sETRX357-LRS Family

12 Recommended Reflow Profile

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 200°C

90 ±30s

60

±

20s

Figure 6. Recommended Reflow Profile

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.

Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent

and other residuals are remaining underneath the shielding can as well as in the gap between the

module and the host board.

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your PCB and re-flow).

sETRX357-LRS Family

13 Product Label Drawing

Figure 7. Product Label

The label dimensions are 9.5mm x 9.5mm. The label will withstand temperatures used during

reflow soldering.

Imprint

Description

sETRX357-LRS8

Module Order code Possible codes are:

- sETRX357-LRS

- sETRX357HR-LRS

- sETRX357AP-LRS

- sETRX357-LRS8

- sETRX357HR-LRS8

- sETRX357AP-LRS8

000D6F0012345678 Indication for the serial number.

E2 Production Date Code

01 Indication for factory ID

02 Indication for the hardware revision

2D-Barcode Information in the 2D-Barcode are the serial number [16 characters], the Part-Order code,

identifier for the batch number [2 characters], the identifier for the hardware release [2

characters] and the production date code [2 characters], all separated by a semicolon.

Table 18. sETRX357-LRS Label Details

Due to the limited space on the label the FCC and IC IDs are printed on the bottom side of the

sETRX357-LRS module family.

sETRX357-LRS Family

13.1 Date Codes

The date codes are set up as follows:

Year 1st / Month 2nd char.

E1 01.01.2014

E2 01.02.2014

E3 01.03.2014

E4 01.04.2014

E5 01.05.2014

E6 01.06.2014

E7 01.07.2014

E8 01.08.2014

E9 01.09.2014

EO 01.10.2014

EN 01.11.2014

ED 01.12.2014

F1 01.01.2015

F2 01.02.2015

F3 01.03.2015

F4 01.04.2015

F5 01.05.2015

F6 01.06.2015

F7 01.07.2015

sETRX357-LRS Family

14 Recommended Footprint

In order to surface mount a sETRX357-LRS series module, we recommend that you use pads

which are 0.86mm wide and 1.5mm high. Unless using the “HR” or “AP” variants it should be

insured that the antenna area is not on top of the carrier PCB

For best RF performance it is required to provide good ground connections to the ground pads of

the module. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductivity in the ground path.

Figure 8. Recommended Footprint

The land pattern dimensions above serve as a guideline.

We recommend that you use the same pad dimensions for the solder paste screen as you have for

the copper pads. However these sizes and shapes may need to be varied depending on your

soldering processes and your individual production standards. We recommend a paste screen

thickness of 120µm to 150µm.

Figure 11 shows the typical pad dimensions of the module and Figure -Figure in section 14.1

show examples of how to align the module on its host PCB.

sETRX357-LRS Family

Although the undersides of the sETRX357-LRS series modules are fully coated, no exposed

copper, such as through-hole vias, planes or tracks on your board component layer, should be

located below the sETRX357-LRS series module in order to avoid ‘shorts’. All sETRX357-LRS

series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore

there is no need to have an additional copper plane directly under the sETRX357-LRS series

module.

tbd

Figure 95. Typical pad dimensions

Finally it is recommended to use no clean flux when soldering the sETRX357-LRS family of

modules and to not use a washing process after reflow. If the process does require washing then

care must be taken that no washing agent is trapped underneath the shielding can after the drying

process has completed.

sETRX357-LRS Family

14.1 Recommended Placement

tbd

Figure 10. Typical placement

tbd

Figure 11. How to not place the Module

tbd

Figure 12. Adding a no copper / no component area

sETRX357-LRS Family

14.2 Example carrier board

Since the RF performance of the module with the on board antenna is strongly dependent on the

proper location of the module on its carrier board, Figure 6shows the reference carrier board which

was used during testing by Telegesis.

Figure 6: Reference Board

Finally to provide a good reference ground to the on board antenna, the carrier board should have

a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will

suffice, but a degradation in radio performance could be the result.

sETRX357-LRS Family

15 Reliability Tests

The following measurements have been conducted after the module has been exposed to

standard room temperature and humidity for 1 hour.

No

Item

Limit

Condition

1 Vibration test Electrical parameter should be

in specification

Freq.:40Hz,Amplitude:1.5mm

20min. / cycle,1hrs. each of X and Y axis

2 Shock test the same as the above Dropped onto hard wood from height of

50cm for 10 times

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.;

each temperature 300 cycles

5 Low temp. test the same as the above -40°C, 300h

6 High temp. test the same as the above +85°C, 300h

Table 19: Reliability Tests

16 Application Notes

16.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual

components.

Before use, check and evaluate their operation when mounted on your products. Abide by

these specifications when using the products. These products may short-circuit. If electrical

shocks, smoke, fire, and/or accidents involving human life are anticipated when a short

circuit occurs, then provide the following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection

device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another

system to prevent a single fault causing an unsafe status.

16.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of these products. Avoid assembly and

use of the target equipment in conditions where the product’s temperature may exceed

the maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the

product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the

products, before use, check and evaluate their operation when assembled onto your

products.

(4) These products are not intended for other uses, other than under the special conditions

shown below. Before using these products under such special conditions, check their

performance and reliability under the said special conditions carefully, to determine

whether or not they can be used in such a manner.

sETRX357-LRS Family

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where

liquid may splash.

(6) In direct sunlight, outdoors, or in a dusty environment

(7) In an environment where condensation occurs.

(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,

SO2, H2S, NH3, and NOx)

(9) If an abnormal voltage is applied due to a problem occurring in other components or

circuits, replace these products with new products because they may not be able to

provide normal performance even if their electronic characteristics and appearances

appear satisfactory.

(10) Mechanical stress during assembly of the board and operation has to be avoided.

(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not

permitted.

16.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance

characteristics of the product, such as RF performance, may well be adversely

affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas,

such as Cl2, H2S, NH3, SO2, or NOX

(4) Storage (before assembly of the end product) of the modules for more than one year

after the date of delivery at your company even if all the above conditions (1) to (3)

have been met, should be avoided.

17 Packaging

The modules will be delivered on trays. Tbd.

sETRX357-LRS Family

18 Ordering Information

Ordering

/Product Code

Description

sETRX35

7

-

LRS

sETRX357-LRS8

Power amplified Telegesis Wireless Mesh Networking Module

with Silicon Labs ZigBee Technology:

• Based on Silicon Labs EM357 SoC

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee PRO

stack

• Integrated 2.4GHz Antenna

sETRX357

HR

-

LRS

sETRX357HR-LRS

Power amplified Telegesis Wireless Mesh Networking Module

with Silicon Labs ZigBee

Technology:

• Based on Silicon Labs EM357 SoC

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee PRO

stack

• U.FL coaxial Antenna Connector

sETRX357AP

-

LRS

sETRX357AP-LRS

Power amplified Telegesis Wireless Mesh Networking Module

with Silicon Labs ZigBee

Technology:

• Based on Silicon Labs EM357 SoC

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee PRO

stack

• RF Pad

s

ETRX357DVK

(to be announced)

Telegesis Development Kit with:

• 3 x ETRX3DVK Development Boards

• 3 x USB cables

• 3 x sETRX357-LRS on carrier boards

• 3 x sETRX357HR-LRS on carrier boards

• 1 x ETRX3USB USB stick

• 3 x ½-wave antennae

• 3 x ¼-wave antennae

Notes:

• Customers’ PO’s must state the Ordering/Product Code.

• There are no un-programmed versions of the sETRX357-LRS modules available. All

Modules are pre-programmed with the Telegesis AT style command interpreter based on

the EmberZNet stack. (In case it is desired to program custom firmware the pre-

programmed firmware can simply be overwritten).

sETRX357-LRS Family

19 Trademarks

All trademarks, registered trademarks and products names are the sole property of their respective

owners.

20 Disclaimer

Product and company names and logos referenced may either be trademarks or registered

trademarks of their respective companies. We reserve the right to make modifications and/or

improvements without prior notification. All information is correct at time of issue. Telegesis (UK)

Ltd does not convey any license under its patent rights or assume any responsibility for the use of

the described product

21 RoHS Declaration

Declaration of environmental compatibility for supplied products:

Hereby we declare to our best present knowledge based on the declaration of our suppliers that

this product does not contain any of the substances which are banned by Directive 2011/65/EU

(RoHS)

22 Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to

improve the design and supply the best possible product. Please consult the most recently issued

data sheet before initiating or completing a design.

23 Life Support Policy

This product is not designed for use in life support appliances, devices, or systems where

malfunction can reasonably be expected to result in a significant personal injury to the user, or as a

critical component in any life support device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness. Customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.

sETRX357-LRS Family

24 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical

Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-

WPANs)

[2] Datasheet EM35x, Ember. (www.ember.com)

[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -

Low Profile 1.9mm or 2.4mm Mated Height

[4] The ZigBee specification (www.zigbee.org)

[5] Specification for Antenova Rufa Antenna (www.antenova.com)

[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

25 Contact Information

Website: www.telegesis.com

E-mail sales@telegesis.com

Telegesis (UK) Limited

Abbey Barn Business Centre

Abbey Barn Lane

High Wycombe

Bucks

HP10 9QQ

UK

Tel: +44 (0)1494 510199

Fax: +44 (0)5603 436999

Silicon Laboratories Finland SEM357L sETRX357-LRS sETRX357HR-LRS User Manual TG PM 0514 sETRX357 LRS r0

Telegesis (UK) Ltd sETRX357-LRS sETRX357HR-LRS TG PM 0514 sETRX357 LRS r0

User Product Manual

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