Silicon Laboratories Finland SEM357L sETRX357-LRS sETRX357HR-LRS User Manual TG PM 0514 sETRX357 LRS r0
Telegesis (UK) Ltd sETRX357-LRS sETRX357HR-LRS TG PM 0514 sETRX357 LRS r0
User Product Manual
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| Document Description | User Product Manual |
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| Date Submitted | 2014-05-07 00:00:00 |
| Date Available | 2014-05-07 00:00:00 |
| Creation Date | 2014-04-25 13:32:58 |
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| Document Lastmod | 2014-04-25 13:32:58 |
| Document Title | TG-PM-0514-sETRX357-LRS r0 |
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| Document Author: | Marius |
Telegesis
TG-PM-0514-sETRX357-LRS r0
sETRX357-LRS family
Product Manual
sETRX357-LRS ZIGBEE ® MODULES
PRODUCT MANUAL
©2014 Telegesis (UK) Ltd
sETRX357-LRS Product Manual
sETRX357-LRS family
Table of Contents
1.1
2.1
2.1.1
2.2
2.2.1
3.1
4.1
5.1
5.2
5.3
5.4
6.1
6.2
INTRODUCTION ................................................................................................................. 5
Hardware Description ....................................................................................................... 5
PRODUCT APPROVALS ................................................................................................... 6
FCC Approvals ................................................................................................................. 6
FCC Labelling Requirements ........................................................................................... 7
IC (Industry Canada) Approvals ....................................................................................... 7
IC Labelling Requirements ............................................................................................... 8
MODULE PIN-OUT ............................................................................................................. 9
Interface to Optional 8Mbit Flash.................................................................................... 11
HARDWARE DESCRIPTION ............................................................................................ 12
Hardware Interface......................................................................................................... 12
FIRMWARE DESCRIPTION ............................................................................................. 13
Token Settings ............................................................................................................... 14
Custom Firmware ........................................................................................................... 14
Boost Mode vs. Normal Mode ........................................................................................ 14
Software Interface .......................................................................................................... 15
ABSOLUTE MAXIMUM RATINGS ................................................................................... 16
Environmental Characteristics ........................................................................................ 16
Recommended Operating Conditions............................................................................. 16
DC ELECTRICAL CHARACTERISTICS ........................................................................... 17
DIGITAL I/O SPECIFICATIONS ....................................................................................... 18
A/D CONVERTER CHARACTERISTICS .......................................................................... 19
10
AC ELECTRICAL CHARACTERISTICS ........................................................................... 19
10.1
10.2
TX Power Characteristics ............................................................................................... 21
Power Settings for Regulatory Compliance .................................................................... 22
11
PHYSICAL DIMENSIONS................................................................................................. 23
12
RECOMMENDED REFLOW PROFILE ............................................................................. 24
13
PRODUCT LABEL DRAWING ......................................................................................... 25
13.1
14
14.1
14.2
Date Codes .................................................................................................................... 26
RECOMMENDED FOOTPRINT ........................................................................................ 27
Recommended Placement ............................................................................................. 29
Example carrier board .................................................................................................... 30
15
RELIABILITY TESTS ........................................................................................................ 31
16
APPLICATION NOTES ..................................................................................................... 31
16.1
Safety Precautions ......................................................................................................... 31
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS family
16.2
16.3
Design Engineering Notes.............................................................................................. 31
Storage Conditions......................................................................................................... 32
17
PACKAGING .................................................................................................................... 32
18
ORDERING INFORMATION ............................................................................................. 33
19
TRADEMARKS ................................................................................................................. 34
20
DISCLAIMER .................................................................................................................... 34
21
ROHS DECLARATION ..................................................................................................... 34
22
DATA SHEET STATUS .................................................................................................... 34
23
LIFE SUPPORT POLICY .................................................................................................. 34
24
RELATED DOCUMENTS ................................................................................................. 35
25
CONTACT INFORMATION............................................................................................... 35
©2014 Telegesis (UK) Ltd
-3-
sETRX357-LRS Product Manual
sETRX357-LRS Family
The Telegesis sETRX357-LRS family of modules are low power
2.4GHz ZigBee modules with an added frontend module (SiGe
SE2432L) containing both PA and LNA for highest possible link
budget.
Based on the Silicon Labs EM357 family of single chip ZigBee
solutions the new long range modules offer three possible RF
output configurations, namely an on board antenna, U.FL
coaxial antenna connector or a RF pad. A further option is an
8Mbit flash chip which can be switched off completely for lowest
possible power consumption.
Image not shown actual size; enlarged to show detail.
Module Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
The module’s unique AT-style command line interface allows
designers to quickly integrate ZigBee technology without
complex software engineering. For custom application
development the sETRX357 series integrates with ease into
Ember’s InSight development environment.
Small form factor, SMT module 23mm x 16mm
Side Castellations for easy soldering and inspection
Three antenna options: Integrated chip antenna, U.FL
coaxial connector or RF pad
Based on 32-bit ARM® Cortex-M3
Industry standard JTAG Programming and real time
network level debugging via the Ember Debug Port
Up to 192kB of flash and 12kB of RAM
Optional 8Mbit Flash Chip
Lowest Deep Sleep Current of sub 1µA with retained
RAM and GPIO and multiple sleep modes
Ultra Wide supply voltage range (2.1 to 3.6V; 2.3V to
3.6V on “8” variants)
Optional 32.768kHz watch crystal can be added
externally
Module ships with standard Telegesis AT-style
command interface based on the ZigBee PRO feature
set
Can act as an End Device, Router or Coordinator
Up to 22 general-purpose I/O lines including analogue
inputs
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
FCC and IC modular compliance
Operating temperature range: -40°C to +85°C
Radio Features
• Based on the Silicon Labs EM357 family of single chip
ZigBee® SoCs
• 2.4GHz ISM Band
• 250kbit/s over the air data rate – NB: actual usable data
throughput with ZigBee is about 20kbps
• 15 channels (IEEE802.15.4 Channel 11 to 25)
• SiGe SE2432L integrated PA and LNA
• +20dBm output power (adjustable down to -41dBm)
• High sensitivity of -106dBm typ. @ 1% packet error rate
• RX Current: 33mA, TX Current: approx 140mA at
20dBm
• Robust Wi-Fi and Bluetooth coexistence
©2014 Telegesis (UK) Ltd
-4-
Suggested Applications
•
•
•
•
•
•
•
•
ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
Development Kit
•
•
•
Development kit containing everything required to set
up a mesh network quickly and evaluate range and
performance of the sETRX357-LRS.
AT-style software interface command dictionary can be
modified for high volume customers.
Custom software development available upon request.
Example AT-Style Commands
AT+BCAST
AT+UCAST:
AT+EN
AT+JN
Send a Broadcast
Send a Unicast
Establish PAN network
Join PAN
At power-up the last configuration is loaded from nonvolatile S-Registers, which can eliminate the need for an
additional host controller.
sETRX357-LRS Product Manual
sETRX357-LRS Family
1 Introduction
This document describes the Telegesis small form factor sETRX357-LRS family of ZigBee long
range modules which have been designed to be easily integrated into another device and to
provide a fast, simple and low cost wireless mesh networking interface.
The Telegesis sETRX3-LRS series modules are based on the Silicon Labs ZigBee compliant
platform consisting of the EM357 single chip family combined with the ZigBee PRO compliant
EmberZNet meshing stack. Integration into a wide range of applications is made easy using a
simple AT style command interface and advanced hardware design.
The configurable functionality of the Telegesis AT Commandset often allows the sETRX357-LRS
series of ZigBee modules to be used without an additional host microcontroller saving even more
integration time and costs. In addition to the Telegesis AT Commandset, the sETRX357-LRS
family can be used with custom-built firmware whilst representing an ideal platform for custom
firmware development in conjunction with the Silicon Labs ZigBee development kits.
No RF experience or expertise is required to add this powerful wireless networking capability to
your products. The sETRX357-LRS family offers fast integration opportunities and the shortest
possible time to market for your product.
1.1
Hardware Description
The main building blocks of the sETRX357-LRS family are the single chip EM357 SoC from Silicon
Labs, a SiGe SE2432L frontend module combining a Power Amplifier with a Low Noise Amplifier, a
24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The
modules are available with on-board antenna, a U.FL connector or a RF pad for attaching external
antennae. Modules with the U.FL connector are identified by the “HR” suffix, modules with the
antenna pad by the “AP” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data
are available from the Antenova website [5].
Module
Chip
Flash
RAM
Antenna
sETRX37-LRS
sETRX357HR-LRS
sETRX357AP-LRS
sETRX37-LRS8
sETRX357HR-LRS8
sETRX357AP-LRS8
EM357
EM357
EM357
EM357
EM357
EM357
192kB
192kB
192kB
192kB
192kB
192kB
12kB
12kB
12kB
12kB
12kB
12kB
Chip
External
Pad
Chip
External
Pad
Additional
8Mbit Flash
No
No
No
Yes
Yes
Yes
Table 1: Order Codes
The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the
sensitivity by 5dB which will increase the range by up to 700% relative to unamplified devices with
suitable propagation conditions (where local regulations permit the use of the maximum output
power).
The sETRX357 family is used for ZigBee (www.zigbee.org) applications. In case it is desired to
develop custom firmware instead of using the pre-loaded AT-Command interface, the Silicon Labs
toolchain, consisting of Ember Desktop together with a comprehensive integrated development
environment (IDE), is required.
©2014 Telegesis (UK) Ltd
-5-
sETRX357-LRS Product Manual
sETRX357-LRS Family
2 Product Approvals
The sETRX357-LRS family has been designed to meet all national regulations for world-wide use.
In particular the following certifications have been obtained:
2.1
FCC Approvals
The Telegesis sETRX357-LRS and sETRX357-LRS8 modules with integrated Antenna as well as
the sETRX357HR-LRS and sETRX357HR-LRS8 modules including the antennas listed in table 2
and the power levels listed in section 10.2 have been tested to comply with FCC CFR Part 15
(USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC
public notice DA00.1407.transmitter.
FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: S4GSEM357L
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. End users must follow the specific operating instructions for satisfying RF
exposure compliance. This transmitter must not be co-located or operating in conjunction
with any other antenna or transmitter.
Item
Part No.
BT-Stubby
(straight)
BT-Stubby
(right-angle)
CJ-2400-6603
Rufa (on
board)
Manufacturer
Type
EAD Ltd. [6]
¼ Wave
EAD Ltd. [6]
¼ Wave
Chang Jia
½ Wave
Antenova
Chip
Impedance Gain
50Ω
0dBi
50Ω
50 Ω
50Ω
0dBi
2.0dBi
2.1dBi
(peak)
Table 2. Approved Antennae
An end user deploying sETRX357-LRS, sETRX357HR-LRS, sETRX357-LRS8 or sETRX357HRLRS8 modules together with an antenna listed in Table 2 is not required to obtain a new
authorization for the module – BUT this does not preclude the possibility that some other form of
authorization or testing may be required for the end product depending upon local territorial
regulations.
The FCC requires the user to be notified that any changes or modifications made to this device
that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the sETRX357-LRS with approved antennae, it is required to prevent end-users from
replacing them with non-approved ones. The antenna(s) must be installed such that a minimum
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
separation distance of 2.6cm is maintained between the radiator (antenna) and all persons at all
times.
2.1.1
FCC Labelling Requirements
When integrating the sETRX357-LRS, sETRX357HR-LRS, sETRX357-LRS8 or sETRX357HRLRS8 modules into a product it must be ensured that the FCC labelling requirements are met.
This includes a clearly visible label on the outside of the finished product specifying the Telegesis
FCC identifier (FCC ID: S4GSEM357L) as well as the notice above. This exterior label can use
wording such as “Contains Transmitter Module FCC ID: S4GSEM357L” or “Contains FCC ID:
S4GSEM357L” although any similar wording that expresses the same meaning may be used.
2.2
IC (Industry Canada) Approvals
The Telegesis sETRX357-LRS family with integrated Antenna as well as the sETRX357HR-LRS
family have been approved by Industry Canada to operate with the antenna types listed in Table 2
with the maximum permissible gain and required antenna impedance for each antenna type
indicated. Antenna types not included in this list, having a gain greater than the maximum gain
indicated for that type, are strictly prohibited for use with this device.
IC-ID: 8735A-SEM357L
• This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
• Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
• This device has been designed to operate with the antennas listed in Table 2, and having a
maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1
dBi are strictly prohibited for use with this device. The required antenna impedance is 50
ohms.
French Statements
• Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain
de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
• Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
©2014 Telegesis (UK) Ltd
-7-
sETRX357-LRS Product Manual
sETRX357-LRS Family
OEM Responsibilities
The sETRX357-LRS and sETRX357HR-LRS families of modules have been certified for integration into
products only by OEM integrators under the following conditions:
1. The antenna(s) must be installed such that a minimum separation distance of 2.6cm is
maintained between the radiator (antenna) and all persons at all times.
2. The transmitter module must not be co-located or operating in conjunction with any other
antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device emissions,
PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations
or co-location with another transmitter), then Industry Canada certification is no longer considered
valid and the IC Certification Number can not be used on the final product. In these circumstances,
the OEM integrator will be responsible for re-evaluating the end product (including the transmitter)
and obtaining a separate Industry Canada authorization.
2.2.1
IC Labelling Requirements
The sETRX357-LRS and sETRX357HR-LRS modules are labelled with their own IC Certification
Number. As the IC Certification Number is not visible when the module is installed inside another device,
the outside of the device into which the module is installed must display a label referring to the enclosed
module. In that case, the final end product must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 8735A-SEM357L”
or
“Contains IC: 8735A-SEM357L”
The OEM of the sETRX357-LRS and sETRX357HR-LRS family modules must only use the approved
antenna(s) listed above, which have been certified with this module.
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module or change RF related parameters in the user’s manual of the end
product.
©2014 Telegesis (UK) Ltd
-8-
sETRX357-LRS Product Manual
sETRX357-LRS Family
3 Module Pin-out
Figure 1. sETRX357-LRS series Module Pin-out (top view)
The table below gives details about the pin assignment for direct SMD soldering of the sETRX357LRS series modules to the application board. For more information on the alternate functions
please refer to [2]. Also refer to the Telegesis AT Command-set documentation to understand how
the pre-programmed firmware makes use of the individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally.
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
sETRX35x Name
EM35x Pin
Default use
GND
GND
11
12
13
14
GND
18
19
20
21
22
GND
24
25
26
27
29
30
31
32
33
34
GND
35
n/c
38
40
41
42
n/c
Vcc
GND
n/a
GND
GND
GND
GND
Alternate Functions
Pad
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
GND
GND
PC5 {1}
nReset {6}
PC6
PC7
GND
PA7 {5}
PB3 {2,3}
PB4 {2,3}
PA0
PA1
GND
PA2
PA3
PA4
PA5 {4}
PA6 {5}
PB1 {3}
PB2 {3}
JTCK
PC2
PC3
GND
PC4
n/c
PC1
PC0 {5}
PB7 {5}
PB6 {5}
n/c
Vcc
GND
RF
GND
GND
TX_ACTIVE
nReset
I/O
I/O
GND
I/O
I/O, CTS
I/O, RTS
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
TXD
RXD
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT, FLASH_ENABLE{7}
GND
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOSI, Flash MOSI{7}
TIM2C3, SC2SDA, SC2MISO, Flash MISO{7}
TIM2C4, SC2SCL, SC2SCLK, Flash CLK{7}
SC2nSSEL, TRACECLK, TIM2C2, Flash CS{7}
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
SWCLK
JTDO, SWO
JTDI
I/O
I/O
GND
I/O
JTMS, SWDIO
Reserved, don’t connect
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
Reserved, don’t connect
Supply Voltage
I/O
I/O
I/O
I/O
Vcc
GND
Optional RF Pad
GND
GND
Table 3: Pin Information
Notes:
{1} When the alternate GPIO function is selected, TX_ACTIVE becomes an output that indicates that the
EM35x radio transceiver is in transmit mode. PC5 must be used in this mode as it is used internally
as TX_ACTIVE to control the external RF frontend.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively
{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can source or sink high current (8mA)
{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET
is low
{7} functionality available on versions with “L” suffix: Optional on chip flash (Winbond W25Q80BLUXIG)
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
Alternate functions depend on the firmware, but the Telegesis R3xx AT Command-set functions
are indicated here for convenience.
3.1
Interface to Optional 8Mbit Flash
Table 4 shows the connectivity to the optional Winbond W25Q80BLUXIG 8Mbit SPI flash chip which
is fitted to all module variants with the “8” suffix.
Signal Name
PA0
PA1
PA2
PA3
PC7
Functionality
MOSI
MISO
CLK
Chip Select
Flash enable
Table 4: GPIO usage for Flash
To minimize power consumption the Flash chip can be switched on by driving PC7 low. Driving
PC7 high, or not driving PC7 at all will leave the flash chip powered off.
The /hold and /WP pins of the optional flash chip are tied high.
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
4 Hardware Description
Vreg
Vcc
I/O
LDO
1V8
1,8Vdc
integrated
antenna
LDO
1V25
A/D
EM357
Match
RESET
Match
FEM
rf
U.FL socket terminal
selection,
filtering and
matching
circuitry
I/O
UART
24MHz
SPI
JTAG
RESET
programming
Optional 8Mbit
Flash
Figure 2. Block Diagram
The sETRX357-LRS family of modules are based on the Silicon Labs EM357 family of ZigBee
SoCs plus a frontend module containing a PA, LNA and RF switch in addition to the RF antenna
matching circuitry. The EM357 family of ZigBee SoCs are fully integrated 2.4GHz ZigBee
transceivers with a 32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and
peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software
development.
In addition to this a number of MAC functions are also implemented in hardware to help maintain
the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new powerdown modes allow this 3rd generation module to offer a longer battery life than any 2nd generation
modules on the market.
The EM357 has fully integrated voltage regulators for both required 1.8V and 1.25V supply
voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit
eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be
connected externally to pads 3 and 4 in case more accurate timing is required.
4.1
Hardware Interface
All GPIO pins of the EM357 chip are accessible on the module’s pads. Whether signals are used
as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.
When using the Telegesis AT Commandset please refer to the AT Commandset manual and the
development kit manual for this information and when developing custom firmware please refer to
the EM357 datasheet [2].
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
5 Firmware Description
By default, the modules will be pre-loaded with a standalone bootloader which supports over-theair bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and
power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally
make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A
pull-up is not required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a
unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and
responses pass through the serial port of the sETRX357-LRS as ASCII text, so a simple terminal
application will usually suffice. We provide Telegesis Terminal for interaction with the module but it
is not an essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet PRO
meshing stack which implements routers/coordinators as well as (sleepy) end devices. [End
devices have no routing responsibility and therefore are allowed to go to sleep, whilst still being
able to send and receive messages via a parent router. In addition to classical sleepy and nonsleepy end devices the module firmware also supports mobile (sleepy) end devices capable of
changing their parent quickly whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a coordinator and Trust Centre through external host control.
The AT style command line supplies all the tools required to set up and manage a ZigBee network
by allowing easy access to the low-level functionality of the stack.
The Telegesis firmware uses the meshing and self-healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee
PRO featureset.
The Telegesis firmware allows low-level access to physical parameters such as channel and
power level. Parameters that define the functionality of the sETRX357-LRS module and also allow
standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The
SPI and I2C buses are not supported by the current firmware release, but can be used with custom
firmware.
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5.1
Token Settings
The sETRX357-LRS series modules’ manufacturing tokens will be pre-programmed with the
settings shown in the table below.
Token
MFG_CIB_OBS
MFG_CUSTOM_VERSION
MFG_CUSTOM_EUI_64
MFG_STRING
MFG_BOARD_NAME
MFG_MANUF_ID
MFG_PHY_CONFIG
MFG_BOOTLOAD_AES_KEY
MFG_EZSP_STORAGE
MFG_CBKE_DATA
MFG_INSTALLATION_CODE
MFG_OSC24M_BIAS_TRIM
MFG_SYNTH_FREQ_OFFSET
MFG_OSC24M_SETTLE_DELAY
MFG_SECURITY_CONFIG
MFG_CCA_THRESHOLD
MFG_SECURE_BOOTLOADER_KEY
Description
Option Bytes
Optional Version Number
Custom EUI
Device Specific String
Hardware Identifier
Manufacturer ID
Default Power Settings
Bootloader Key
EZSP related
SE Security
SE Installation
Crystal Bias
Frequency offset
Crystal Stabilizing Time
Security Settings
CCA Threshold
Secure Bootloader Key
TG Default
TELEGESIS
0x1010
0xFFFD
0xFEBF
Table 5. Manufacturing tokens
5.2
Custom Firmware
For high volume customers the firmware can be customised on request. In addition to this the
sETRX357-LRS series of modules is an ideal platform for developing custom firmware. In order to
develop custom firmware the Silicon Labs Ember toolchain is required.
When writing firmware for the sETRX357-LRS it is important to ensure that pins PB0 and PC5 are
correctly configured in order that the RF front-end module can operate correctly. The application
note “Writing customised firmware for the ETRX357-LRS” which can be downloaded from the
Telegesis website is also applicable to the sETRX357-LRS.
5.3
Boost Mode vs. Normal Mode
The Ember EM357 chips support a “boost mode” power setting next to the “normal mode” power
setting. The “boost mode” setting increases the sensitivity and output power of the radio
transceiver, however with the LRS variants enabling boost mode has no positive effect on either
the output power or the sensitivity and therefore it is recommended to not use boost mode on this
platform. The Telegesis AT Command-set firmware automatically disables boost mode on LRS
series modules and adjusts the power maximum power settings.
Section 10.2 lists the requirements for the maximum power settings for use of the LRS family in
different countries.
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5.4
Software Interface
Using the default firmware the sETRX357-LRS is controlled using a simple AT-style command
interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available ATCommands, please refer to the AT command dictionary document which corresponds to the
firmware revision you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing
information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
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6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
Supply voltage
Voltage on any Pad
Voltage on any Pad pin (PA4, PA5, PB5,
PB6, PB7, PC1), when used as an input
to the general purpose ADC with the
low voltage range selected
Storage temperature range
Operating temperature range
Input RF level
Reflow temperature
VCC
Vin
-0.3 to +3.6
-0.3 to VCC +0.3
Vdc
Vdc
Vin
-0.3 to +2.0
Vdc
Tstg
Top
Pmax
TDeath
-40 to +105
-40 to +85
+6
Please refer to chapter 12
°C
°C
dBm
°C
Table 6: Absolute Maximum Ratings
The absolute maximum ratings given above should under no circumstances be violated.
Exceeding one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1
No.
Environmental Characteristics
Item
ESD on any pad according to
Human Body Model (HBM) circuit
description
ESD on non-RF pads according to
Charged Device Model (CDM) circuit
description
ESD on RF terminal (HBM)
Moisture Sensitivity Level
Symbol
Absolute Maximum Ratings
Unit
VTHHBM
±2
kV
VTHCDM
±400
VTHCDM
MSL
1000
MSL3, per J-STD-033
Table 7: Absolute Maximum Ratings
6.2
No.
Recommended Operating Conditions
Condition /
Remark
Item
Symbol
Value
Min
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature
range
VCC
fC
pIN
2.1 or 2.3
2405
Top
-40
Typ
3.0
Unit
Max
3.6
2480
Vdc
MHz
dBm
+85
°C
Table 8. Recommended Operating Conditions
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7 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated
No.
Condition /
Remark
Item
Symbol
Value
Min
Module supply voltage
Module supply voltage
Deep Sleep Current
Quiescent current,
internal RC oscillator
disabled,
Quiescent current,
internal RC oscillator
enabled
Quiescent current,
including
32.768kHz oscillator
Additional Current in
case flash chip is
enabled, but in powerdown on variants with “8”
suffix
Additional Current in
case flash chip is
enabled, but in standbyon variants with “8” suffix
Reset Current
Quiescent current
nReset asserted
Processor and Peripheral Currents
ARM® CortexTM M3,
RAM and flash memory
ARM® CortexTM M3,
10
RAM and flash memory
11
Serial controller current
General purpose timer
current
General purpose ADC
13
current
Flash Write current of
14
8Mbit flash (“8” suffix)
RX Current
Receive current
15
consumption
Receive current
16
consumption
TX Current
12
17
Transmit current
consumption
18
Transmit Current
consumption
Without 8Mbit
flash (non “8”
suffix)
With 8Mbit
optional flash (“8”
variants)
25°C, 12MHz
Core clock
25°C, 24MHz
Core clock
Per serial
controller at max.
clock rate
Per timer at max.
clock rate
Max. Sample
rate, DMA
Total, 12MHz
clock speed
Total, 24MHz
clock speed
at +20dBm
module output
power
at min module
output power
Unit
Typ
Max
VCC
2.1
3.6
Vdc
VCC
2.3
3.6
Vdc
ISLEEP
0.6
µA
ISLEEP
0.7
µA
ISLEEP
1.5
µA
IFlashSleep
µA
IFlashSleep
25
50
µA
IRESET
mA
IMCU
6.5
mA
IMCU
7.5
mA
ISC
0.2
mA
ITIM
0.25
mA
IADC
1.1
mA
IFLASHWRITE
20
IRX
30
mA
IRX
31.5
mA
ITXVCC
140
mA
ITXVCC
52
mA
25
mA
Table 9: DC Electrical Characteristics
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8 Digital I/O Specifications
The digital I/Os of the sETRX357-LRS module have the ratings shown below.
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No.
Condition /
Remark
Item
Symbol
Value
Min
Low Schmitt switching
threshold
High Schmitt switching
threshold
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-down resistor
value
Output voltage for logic 0
Output voltage for logic 1
Output Source Current
10
Output Sink current
11
12
13
Output Source Current
Output Sink current
Total output current
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.8 x VCC
MHz
-0.5
0.5
µA
µA
IIL
IIH
IOL = 4mA (8mA) for
standard (high
current) pads
IOH = 4mA (8mA)for
standard (high
current) pads
Standard current
pad
Standard current
pad
High current pad (1)
High current pad (1)
Unit
RIPU
24
29
34
kΩ
RIPD
24
29
34
kΩ
VOL
0.18 x VCC
VOH
0.82 x VCC
VCC
IOHS
mA
IOLS
mA
IOHH
IOLH
IOH + IOL
40
mA
mA
mA
Table 10. Digital I/O Specifications
No.
Condition /
Remark
Item
Symbol
Value
Min
Low Schmitt switching
threshold
High Schmitt switching
threshold
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-up resistor
value
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Unit
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.68 x VCC
Vdc
-0.5
0.5
µA
µA
IIL
IIH
Chip not reset
RIPU
24
29
34
kΩ
Chip reset
RIPURESET
12
14.5
17
kΩ
Table 11. nReset Pin Specifications
Notes
1) High current pads are PA6, PA7, PB6, PB7, PC0
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9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to the EM358x datasheet.
No.
Item
A/D resolution
A/D sample time for 7-bit conversion
A/D sample time for 14-bit conversion
Reference Voltage
Up to 14 bits
5.33µs (188kHz)
682µs
1.2V
Table 12. A/D Converter Characteristics
10 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket
No.
10
11
12
13
14
15
16
17
Receiver
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Min
Value
Typ
2400
-107
-3
-106
Unit
Max
2500
-100
MHz
dBm
dBm
41
dB
40
dB
54
dB
52
dB
tbd
dB
tbd
dB
tbd
dBc
-120
120
ppm
-120
120
ppm
35
dB
20
20
21
21
21.5
21.5
dBm
-40
15
dBm
Table 13. AC Electrical Characteristics
Please Note: For the relationship between EM357 power settings and module output power
please relate to chapter 10.1 of this document. When developing custom firmware the output
power settings described in this document relate directly to the EM357 power settings accessible
via the Ember stack API. When using the Telegesis AT Command-set firmware the settings
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mentioned in this document directly relate to the settings in the S-Register S01 which is used for
setting the output power.
No.
Synthesiser Characteristics
Limit
Typ
Min
22
23
24
25
26
27
28
29
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
2400
11.7
Unit
Max
2500 MHz
kHz
100 µs
100 µs
-71dBc/Hz
-91dBc/Hz
-103dBc/Hz
-111dBc/Hz
Table 14. Synthesiser Characteristics
No.
30
31
Power On Reset (POR) Specifications
VCC POR release
VCC POR assert
Min
Limit
Typ
Max
Unit
0.62
0.45
0.95
0.65
1.2
0.85
Limit
Typ
Max
Vdc
Vdc
Table 15. Power On Reset Specifications
No.
nRESET Specifications
Min
32
33
34
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
2.1
26
12
Unit
16
µs
µs
µs
Table 16. nReset Specifications
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sETRX357-LRS Family
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current as a function of
sETRX357-LRS power setting in NORMAL MODE at 3.6V and room temperature.
Figure 3. Output Power vs. Power Setting
Figure 4. Module Current vs. Power Setting
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10.2 Power Settings for Regulatory Compliance
Because of the high gain of the frontend module output power of up to 22dBm can be achieved
When the antenna gain is included the output power of the sETRX357-LRS transceivers needs to
be reduced for regulatory compliance. The following tables list the maximum permitted power
setting for the antenna types listed in Table 2. Note that this is the power out of the EM357 chip
(set in register S01 when using Telegesis R3xx firmware), and the power delivered to the antenna
will be higher by the gain of the RF power amplifier.
Antenna
1/2 Wave
1/4 Wave
On Board
Channels 11-18
-9
-8
-7
Channels 19-24
-9
-8
-7
Channel 25
-9
-8
-8
Channel 26
-43
-26
-26
Table 17: Maximum Power Settings for FCC, IC Compliance
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11 Physical Dimensions
Figure 5. ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should stick out from the
carrier PCB. There should be no components, tracks or copper planes in the “keep-out” area
which should be as large as possible. When using the U.FL RF connector or the Rf pad the “keepout” area does not have to be kept. NB: The modules’ transmit/receive range will depend on the
antenna used and also the housing of the finished product.
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12 Recommended Reflow Profile
Recommended temperature profile
for reflow soldering
Temp.[°C]
60 ±20s
230°C -250°C max.
220°C
150°C – 200°C
90 ±30s
Time [s]
Figure 6. Recommended Reflow Profile
Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Family
13 Product Label Drawing
Figure 7. Product Label
The label dimensions are 9.5mm x 9.5mm. The label will withstand temperatures used during
reflow soldering.
Imprint
sETRX357-LRS8
000D6F0012345678
E2
01
02
2D-Barcode
Description
Module Order code Possible codes are:
- sETRX357-LRS
- sETRX357HR-LRS
- sETRX357AP-LRS
- sETRX357-LRS8
- sETRX357HR-LRS8
- sETRX357AP-LRS8
Indication for the serial number.
Production Date Code
Indication for factory ID
Indication for the hardware revision
Information in the 2D-Barcode are the serial number [16 characters], the Part-Order code,
identifier for the batch number [2 characters], the identifier for the hardware release [2
characters] and the production date code [2 characters], all separated by a semicolon.
Table 18. sETRX357-LRS Label Details
Due to the limited space on the label the FCC and IC IDs are printed on the bottom side of the
sETRX357-LRS module family.
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13.1 Date Codes
The date codes are set up as follows:
Year 1st / Month 2nd char.
E1
E2
E3
E4
E5
E6
E7
E8
E9
EO
EN
ED
F1
F2
F3
F4
F5
F6
F7
01.01.2014
01.02.2014
01.03.2014
01.04.2014
01.05.2014
01.06.2014
01.07.2014
01.08.2014
01.09.2014
01.10.2014
01.11.2014
01.12.2014
01.01.2015
01.02.2015
01.03.2015
01.04.2015
01.05.2015
01.06.2015
01.07.2015
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14 Recommended Footprint
In order to surface mount a sETRX357-LRS series module, we recommend that you use pads
which are 0.86mm wide and 1.5mm high. Unless using the “HR” or “AP” variants it should be
insured that the antenna area is not on top of the carrier PCB
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
Figure 8. Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120µm to 150µm.
Figure 11 shows the typical pad dimensions of the module and Figure -Figure in section 14.1
show examples of how to align the module on its host PCB.
©2014 Telegesis (UK) Ltd
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sETRX357-LRS Product Manual
sETRX357-LRS Family
Although the undersides of the sETRX357-LRS series modules are fully coated, no exposed
copper, such as through-hole vias, planes or tracks on your board component layer, should be
located below the sETRX357-LRS series module in order to avoid ‘shorts’. All sETRX357-LRS
series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore
there is no need to have an additional copper plane directly under the sETRX357-LRS series
module.
tbd
Figure 95. Typical pad dimensions
Finally it is recommended to use no clean flux when soldering the sETRX357-LRS family of
modules and to not use a washing process after reflow. If the process does require washing then
care must be taken that no washing agent is trapped underneath the shielding can after the drying
process has completed.
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14.1 Recommended Placement
tbd
Figure 10. Typical placement
tbd
Figure 11. How to not place the Module
tbd
Figure 12. Adding a no copper / no component area
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sETRX357-LRS Family
14.2 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 6shows the reference carrier board which
was used during testing by Telegesis.
Figure 6: Reference Board
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will
suffice, but a degradation in radio performance could be the result.
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sETRX357-LRS Family
15 Reliability Tests
The following measurements have been conducted after the module has been exposed to
standard room temperature and humidity for 1 hour.
No
Item
Limit
Vibration test
Electrical parameter should be
in specification
Shock test
the same as the above
Heat cycle test
the same as the above
Low temp. test
High temp. test
the same as the above
the same as the above
Condition
Freq.:40Hz,Amplitude:1.5mm
20min. / cycle,1hrs. each of X and Y axis
Dropped onto hard wood from height of
50cm for 10 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
-40°C, 300h
+85°C, 300h
Table 19: Reliability Tests
16 Application Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short
circuit occurs, then provide the following failsafe functions as a minimum:
(1)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2)
Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1)
Heat is the major cause of shortening the life of these products. Avoid assembly and
use of the target equipment in conditions where the product’s temperature may exceed
the maximum allowable.
(2)
Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3)
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
(4)
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
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(5)
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
(6)
In direct sunlight, outdoors, or in a dusty environment
(7)
In an environment where condensation occurs.
(8)
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOx)
(9)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1)
The module must not be stressed mechanically during storage.
(2)
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance, may well be adversely
affected:
(3)
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
(4)
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3)
have been met, should be avoided.
17 Packaging
The modules will be delivered on trays. Tbd.
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18 Ordering Information
Ordering/Product Code
Description
sETRX357-LRS
sETRX357-LRS8
Power amplified Telegesis Wireless Mesh Networking Module
with Silicon Labs ZigBee Technology:
•
•
•
•
sETRX357HR-LRS
sETRX357HR-LRS
Power amplified Telegesis Wireless Mesh Networking Module
with Silicon Labs ZigBee Technology:
•
•
•
•
sETRX357AP-LRS
sETRX357AP-LRS
Based on Silicon Labs EM357 SoC
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee PRO
stack
U.FL coaxial Antenna Connector
Power amplified Telegesis Wireless Mesh Networking Module
with Silicon Labs ZigBee Technology:
•
•
•
•
sETRX357DVK
(to be announced)
Based on Silicon Labs EM357 SoC
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee PRO
stack
Integrated 2.4GHz Antenna
Based on Silicon Labs EM357 SoC
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee PRO
stack
RF Pad
Telegesis Development Kit with:
•
•
•
•
•
•
•
3 x ETRX3DVK Development Boards
3 x USB cables
3 x sETRX357-LRS on carrier boards
3 x sETRX357HR-LRS on carrier boards
1 x ETRX3USB USB stick
3 x ½-wave antennae
3 x ¼-wave antennae
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There are no un-programmed versions of the sETRX357-LRS modules available. All
Modules are pre-programmed with the Telegesis AT style command interpreter based on
the EmberZNet stack. (In case it is desired to program custom firmware the preprogrammed firmware can simply be overwritten).
©2014 Telegesis (UK) Ltd
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19 Trademarks
All trademarks, registered trademarks and products names are the sole property of their respective
owners.
20 Disclaimer
Product and company names and logos referenced may either be trademarks or registered
trademarks of their respective companies. We reserve the right to make modifications and/or
improvements without prior notification. All information is correct at time of issue. Telegesis (UK)
Ltd does not convey any license under its patent rights or assume any responsibility for the use of
the described product
21 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on the declaration of our suppliers that
this product does not contain any of the substances which are banned by Directive 2011/65/EU
(RoHS)
22 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product. Please consult the most recently issued
data sheet before initiating or completing a design.
23 Life Support Policy
This product is not designed for use in life support appliances, devices, or systems where
malfunction can reasonably be expected to result in a significant personal injury to the user, or as a
critical component in any life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness. Customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.
©2014 Telegesis (UK) Ltd
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24 Related Documents
[1]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
[2]
Datasheet EM35x, Ember. (www.ember.com)
[3]
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
[4]
The ZigBee specification (www.zigbee.org)
[5]
Specification for Antenova Rufa Antenna (www.antenova.com)
[6]
Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
25 Contact Information
Website:
E-mail
www.telegesis.com
sales@telegesis.com
Telegesis (UK) Limited
Abbey Barn Business Centre
Abbey Barn Lane
High Wycombe
Bucks
HP10 9QQ
UK
Tel: +44 (0)1494 510199
Fax: +44 (0)5603 436999
©2014 Telegesis (UK) Ltd
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