Silicon Laboratories Finland WF111 IEEE 802.11b/g/n Wi-Fi module WF111 User Manual WF111 Datasheet
Silicon Laboratories Finland Oy IEEE 802.11b/g/n Wi-Fi module WF111 WF111 Datasheet
Contents
- 1. User Manual and Installations
- 2. User Manual
User Manual and Installations
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| Document Description | User Manual and Installations |
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| Date Submitted | 2012-09-26 00:00:00 |
| Date Available | 2012-09-26 00:00:00 |
| Creation Date | 2012-07-11 14:56:13 |
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WF111 – 802.11 B/G/N MODULE DATA SHEET Wednesday, 11 July 2012 Version 1.1.4 Copyright © 2000-2012 Bluegiga Technologies All rights reserved. Bluegiga Technologies assumes no responsibility for any errors which may appear in this manual. Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or specifications detailed here at any time without notice and does not make any commitment to update the information contained here. Bluegiga’s products are not authorized for use as critical components in life support devices or systems. The WRAP, Bluegiga Access Server, Access Point and iWRAP are registered trademarks of Bluegiga Technologies. The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Bluegiga Technologies. All other trademarks listed herein are owned by their respective owners. Bluegiga Technologies Oy VERSION HISTORY Version Comment 1.0 First public version 1.1 Product codes updated 1.1.1 Added sleep clock specifications 1.1.2 Added frequency variation table 1.1.3 FCC and IC information added 1.1.4 WT111-N layout guide Bluegiga Technologies Oy TABLE OF CONTENTS Product description ....................................................................................................................................... 6 Ordering Information..................................................................................................................................... 7 Pinout and terminal descriptions .................................................................................................................. 8 Interfaces .................................................................................................................................................... 12 4.1 Host interfaces ................................................................................................................................... 12 4.1.1 Host selection ................................................................................................................................ 12 4.1.2 SDIO interface ............................................................................................................................... 12 4.1.3 CSR Serial Peripheral Interface (CSPI)......................................................................................... 13 4.1.4 SDIO/CSPI deep-sleep control schemes ...................................................................................... 15 4.1.5 CCCR and CIS register defaults .................................................................................................... 16 4.2 Other interfaces ................................................................................................................................. 20 4.2.1 Debug SPI interface....................................................................................................................... 20 4.2.2 Bluetooth coexistence.................................................................................................................... 20 4.2.3 Configurable I/O pads .................................................................................................................... 21 Clock generation......................................................................................................................................... 22 5.1 32.768 kHz external reference clock ................................................................................................. 22 Power Control and Regulation ................................................................................................................... 23 6.1 Power Control and Regulation ........................................................................................................... 23 6.2 REGEN .............................................................................................................................................. 24 6.3 RESET ............................................................................................................................................... 24 Example Application Schematic ................................................................................................................. 26 Wi-Fi radio .................................................................................................................................................. 28 8.1 Wi-Fi receiver ..................................................................................................................................... 28 8.2 Wi-Fi transmitter ................................................................................................................................ 28 8.3 Antenna switch for Bluetooth coexistence ......................................................................................... 28 Electrical characteristics ............................................................................................................................. 29 9.1 Absolute maximum ratings ................................................................................................................ 29 9.2 Recommended Operating Conditions ............................................................................................... 29 9.3 Input/Output terminal characteristics ................................................................................................. 30 10 RF Characteristics ................................................................................................................................. 31 11 Power Consumption .............................................................................................................................. 33 12 Physical Dimensions.............................................................................................................................. 35 13 Layout Guidelines .................................................................................................................................. 36 13.1 WF111-A ............................................................................................................................................ 36 13.2 WF111-E ............................................................................................................................................ 36 13.3 WF111-N............................................................................................................................................ 36 13.4 Thermal considerations ..................................................................................................................... 38 Bluegiga Technologies Oy 13.5 EMC considerations ........................................................................................................................... 38 14 Soldering Recommendations................................................................................................................. 40 15 Certifications .......................................................................................................................................... 41 15.1 Wi-Fi................................................................................................................................................... 41 15.2 CE ...................................................................................................................................................... 41 15.3 FCC and IC ........................................................................................................................................ 41 15.3.1 15.4 FCC et IC ................................................................................................................................... 43 Qualified Antenna Types for WF111-E .............................................................................................. 46 Contact Information ........................................................................................................................................... 47 Bluegiga Technologies Oy 1 KEY FEATURES: Product description DESCRIPTION IEEE 802.11 b/g/n radio o Single 2.4 GHz band WF111 is a fully integrated single 2.4GHz band 802.11 b/g/n module, intended for portable and battery powered applications, where Wi-Fi connectivity is needed. WF111 integrates an IEEE 802.11 b/g/n radio, antenna or U.FL antenna connector and SDIO or CSPI host interfaces. WF111 provides a low cost and simple Wi-Fi solution for devices that run an operating system and a TCP/IP stack on-board, but still offers the benefits of a module – small form factor, easy integration and certifications. Bluegiga also provides WF111 drivers for the Linux operating system. WF111 has hardware support for Wi-Fi encryption protocols and for various coexistence schemes which enables exceptional performance during simultaneous use of IEEE 802.11 and Bluetooth with a single antenna. o Symbol rate up to 72.2Mbps Integrated antenna or U.FL connector Hardware support for WEP, WPA and WPA2 encryption Hardware support for Wi-Fi Direct and soft-AP Advanced support Temperature range: -40oC - +85oC SDIO or CSPI host interfaces Fully CE, FCC, IC and South-Korea qualified (in progress) Operating system drivers for Linux Bluetooth coexistence PHYSICAL OUTLOOK: TARGET APPLICATIONS: PoS terminals RFID and laser scanners Wi-Fi internet radios streaming products Wireless cameras Portable navigation devices Portable handheld devices Wi-Fi medical sensors Wireless picture frames and audio Figure 1: WF111-A Bluegiga Technologies Oy 2 Ordering Information WF111 Product Numbering WF1 1 1- X Antenna: A = Internal antenna E = External N = RF pin Confirmed products and codes Product code Description WF111-A WF111 module with internal chip antenna WF111-E WF111 module with U.FL connector for external antenna WF111-N WF111 module with 50 RF pin (contact sales@bluegiga.com for availability) DKWF111 WF111-A SDIO evaluation kit Bluegiga Technologies Oy Page 7 of 47 GND SPI_MOSI SPI_CLK SPI_MISO VDD_ANA BT GND SDIO_CMD SDIO_CLK SDIO_DAT[3] SDIO_DAT[2] SDIO_DAT[1] GND 14 13 12 11 10 GND_PAD 33 SDIO_DAT[0] 32 31 GND 30 GND PIO[0] REGEN PIO[1] RST SPI_CS PIO[5] VDD_PA GND 21 22 23 24 25 26 27 28 29 Pinout and terminal descriptions PIO[3] VDD_PADS ANT PIO[4] VDD_REGIN PIO[2] VDD_SDIO 20 19 18 GND 17 16 15 Figure 2: WF111 pinout Bluegiga Technologies Oy Page 8 of 47 POWER SUPPLIES PIN NUMBER DESCRIPTION VDD_REGIN 17 Input for the internal regulators REGEN 23 Pull high to enable internal voltage regulators (2.0V max) GND 1, 8, 14, 21, 29, 30, 32 Ground GND_PAD 33 Thermal pad, on bottom of WF111 VDD_ANA 10 Positive supply for PA control VDD_PADS 19 Positive supply for the digital interfaces VDD_SDIO 15 Positive supply for the SDIO interface VDD_PA 28 Positive supply for the power amplifier Table 1: Supply Terminal Descriptions PIO PORT PIN NUMBER PIO[0] 22 PIO[1] 24 PIO[2] 16 PIO[3] 20 PIO[4] 18 PIO[5] 27 PAD TYPE DESCRIPTION Bi-directional, programmable strength internal pull-down/pull-up Programmable input/output line. Can be used for Bluetooth coexistence. Table 2: GPIO Terminal Descriptions Bluegiga Technologies Oy Page 9 of 47 SDIO/CSPI Interfaces PIN NUMBER PAD TYPE SDIO_DATA[0] SDIO_SPI_DI Synchronous data input/output SDIO SPI data output Bi-directional, tristate, weak internal pull-up CSPI_MISO SDIO_DATA[1] SDIO_SPI_INT CSPI_CS# Synchronous data input/output Bi-directional, weak/strong internal pull-up SDIO_CLK SDIO_SPI_SCLK SDIO SPI chip select, active low CSPI chip select, active low SDIO SPI clock CSPI clock SDIO_CMD CSPI_MOSI Synchronous data input/output SDIO clock Input, weak internal pull-up CSPI_CLK SDIO_SPI_MOSI Synchronous data input/output CSPI data input SDIO_DATA[3] SDIO_SPI_CS# CSPI data output SDIO SPI interrupt output CSPI_INT SDIO_DATA[2] DESCRIPTION Bi-directional, weak internal pull-up SDIO data input SDIO SPI data input CSPI data input Table 3: Host Interface Terminal Descriptions Bluegiga Technologies Oy Page 10 of 47 OTHER SIGNALS PIN NUMBER PAD TYPE DESCRIPTION RST 25 Input, weak internal pullup, active low System reset ANT 31 RF, DC blocked Antenna output on N variant, on A and E variants not connected BT RF, DC blocked Bluetooth antenna sharing RF input Table 4: Other Terminal Descriptions DEBUG SPI INTERFACE PIN NUMBER PAD TYPE DESCRIPTION SPI_MISO 11 Output, tri-state, weak internal pull-down Synchronous data output SPI_CLK 12 SPI_MOSI 13 SPI_CS 26 Synchronous clock input Input, weak internal pull-down Synchronous data input Debug SPI Chip select, active low Table 5: Debug SPI Terminal Descriptions Bluegiga Technologies Oy Page 11 of 47 4 Interfaces 4.1 Host interfaces WF111 can be interfaced by the host using SDIO in 1bit or 4bit mode, SDIO SPI or CSR proprietary CSPI connection. The host connection buses can be clocked up to 50MHz. 4.1.1 Host selection WF111 will default to 1-bit SDIO mode. The host interface can be set with 1-bit SDIO or SDIO SPI commands to the required mode. After mode selection, it will then remain in that mode until the module is reset either with the RESET pin or the internal power supply supervisor. 4.1.2 SDIO interface This is a host interface which allows a Secure Digital Input Output (SDIO) host to gain access to the internals of the chip. All defined slave modes (SPI, SD 1bit, SD 4bit) are provided. Two functions are supported: Function 0 is mandatory function used for SDIO slave configuration. This contains CCCR, FBR and CIS. CCCR registers support sleep and wakeup signaling. Function 1 provides access to the IEEE 802.11 functionality. Command IO_RW_DIRECT (CMD52) is used to directly access internal registers. IO_RW_EXTENDED (CMD53) is used for block transfer to/from module MMU buffers. Command SD Mode (1/4 bit) SDIO SPI Mode GO_IDLE_STATE (CMD0) SEND_RELATIVE_ADDR (CMD3) IO_SEND_OP_COND (CMD5) SELECT/DESELECT_CARD (CMD7) GO_INACTIVE_STATE (CMD15) IO_RW_DIRECT (CMD52) IO_RW_EXTENDED (CMD53) CRC_ON_OFF (CMD59) Table 6: Supported commands per mode For more information and detailed descriptions of above functions and commands, see the following specifications: SD Specifications Part 1 Physical Layer Specification v.1.10 SD Specification Part E1 SDIO Specification v.1.10 Bluegiga Technologies Oy Page 12 of 47 4.1.3 CSR Serial Peripheral Interface (CSPI) The CSPI is a host interface which shares pins with the SDIO. It contains a number of modifications on the SDIO SPI specification aimed at increasing the host bus efficiency in hosts supporting SPI but not SDIO. The main advantages compared to SDIO SPI are: Burst transfer is continuous instead of blocks with CRC Timings are deterministic (fixed number of clocks) reducing the required interaction 16 bit registers are transferred as a single command instead of two 8 bit writes MMU buffers are accessed using burst read/writes. The command and address fields are used to select the correct buffer. The CSPI is able to generate an interrupt to the host when a memory access fails. This interrupt line is shared with the SDIO functions. The CSPI Interface is an extension of the basic SPI Interface, with the access type determined by the following fields: 8-bit command 24-bit address 16-bit burst length (optional). Only applicable for burst transfers into or out of the MMU 4.1.3.1 CSPI read/write cycles Register read/write cycles are used to access Function 0, Bluetooth acceleration and MCU registers. Burst read/write cycles are used to access the MMU. 4.1.3.2 CSPI register write cycle The command and address are locked into the slave, followed by 16bits of write data. An Error Byte is returned on the MISO signal indicating whether or not the transfer has been successful. Figure 3: CSPI Register Write Cycle 4.1.3.3 CSPI register read cycle The command and address field are clocked into the slave, the slave then returns the following: Bytes of padding data (MISO held low) Error byte 16-bits of read data Figure 4: CSPI Register Read Cycle Bluegiga Technologies Oy Page 13 of 47 4.1.3.4 CSPI register burst write cycle Burst transfers are used to access the MMU buffers. They cannot be used to access registers. Burst read/write cycles are selected by setting the nRegister/Burst bit in the command field to 1. Burst transfers are byte orientated, have a minimum length of 0 bytes and a maximum length of 64kbytes. Setting the length field to 0 results in no data being transferred to or from the MMU. As with a register access, the command and address fields are transferred first. There is an optional length field transferred after the address. The use of the length field is controlled by the LengthFieldPresent bit in the Function 0 registers, which is cleared on reset. Figure 5: CSPI Burst Write Cycle 4.1.3.5 CSPI register read cycle Burst reads have a programmable amount of padding data that is returned by the slave. 0-15 bytes are returned as defined in the BurstPadding register. Following this the Error byte is returned followed by the data. Once the transfer has started, no further padding is needed. A FIFO within SDIO_TOP will pre-fetch the data. The address is not retransmitted, and is auto-updated within the slave. The length field is transmitted if LengthFieldPresent in the Function 0 registers is set. In the absence of a length field the CSB signal is used to indicate the end of the burst. Figure 6: CSPI Burst Read Cycle Bluegiga Technologies Oy Page 14 of 47 4.1.4 SDIO/CSPI deep-sleep control schemes The module automatically enters deep sleep to minimize power consumption after a while of idling. Deep sleep is the lowest power mode, where the processor, the internal reference (fast) clock, and much of the digital and analogue hardware are shut down. The SDIO communication system however remains on, and is clocked by the host system. During deep sleep only the function 0 is available, while attempts to access Function 1 will likely result in bus timeouts. Control of when the module is allowed to enter deep sleep is done via Vendor Unique Register in CCCR in function 0. Wake-up is also initiated through this register. The module will initiate an SDIO interrupt when the wake-up is complete. Bluegiga Technologies Oy Page 15 of 47 4.1.5 CCCR and CIS register defaults Address 0x00 Bits 3-0 Field name CCRx: CCCR format version number Value 0x2(a); CCCR/FBR version 1.20 0x01 7-4 3-0 SDIOx: SDIO spec. version SDx: SD format version number 0x3(a); SDIO 2.00 0x1; SD Physical Specification 1.10 0x07 SCSI: Support continuous SPI interrupt supported 0x1 0x08 SDC: Card supports direct commands during data transfer 0x1; IO_RW_DIRECT can be executed while transfer in progress SMB: Card supports multiblock 0x1; IO_RW_EXTENDED can be executed in block mode SRW: Card supports read wait 0x1; Wait signal is supported on SDIO_DAT[2] SBS: Card supports suspend/resume 0x0; Operations can't be suspended S4MI: Supports interrupt between data blocks in 4-bit SD 0x0; Block interrupts not supported in 4-bit multi-block transfer LSC: Card is a low-speed card 4BLS: 4-bit support for low-speed cards 0x0; Full-speed card 0x0; Full-speed card 0x09-0x0B 23-0 Pointer to card's common CIS 0x001000; Pointer to the start of Card Information Structure 0x12 SMPC: Support master power control 0x1; Total card current may exceed 200mA (EMPC, SPS and EPS are available) 0x13 SHS: Support high-speed 0x1(a); High speed mode supported (enabled by the host via the EHS bit) Table 7: SDIO CCCR values, (a) can be modified by software Bluegiga Technologies Oy Page 16 of 47 Address 0x100 Bits 3-0 Field name Standard SDIO Function interface code Value 0x0; No SDIO standard interface supported by this function (no defined interface for IEEE 802.11 0x101 7-0 Supports CSA Extended Standard SDIO Function interface 0x0; No Code Storage Area 0x00; No SDIO standard interface supported by this function 0x102 SPS 0x1; This function has two power modes which are selected by EPS 0x109-0x10B 23-0 Pointer to standard Function 1 CIS 0x002000; Pointer to the start of the CIS for this function Table 8: SDIO FBR values for Function 1 Address Field name 0x00 TPL_CODE 0x01 0x02 0x03 TPL_LINK TPLFID_FUNCTION TPFLID_SYSINIT Value 0x21; CISTPL_FUNCID: Function identification tuple 0x02; Link to next tuple 0x0C; Card function tuple 0x00; System init bit mask (not used) 0x04 TPL_CODE 0x22; CISTPL_FUNCE: Function extension tuple 0x05 0x06 TPL_LINK TPLFE_TYPE 0x07-0x08 TPLFE_FN0_BLK_SIZE 0x05; Link to next tuple 0x00; Type of extended data = Function 0 0x0200; Maximum block size and byte count = 512 0x09 TPLFE_MAX_TRAN_SPEED 0x0A TPL_CODE 0x0B 0x0C-0x0D TPL_LINK TPLMID_MAND_CODE 0x0E-0x0F TPLMID_CARD 0x10 TPL_CODE 0x5A(a); Maximum transfer speed per line = 50 Mbps 0x20; CISTPL_MANDIF: Manufacturer identification string tuple 0x04; Link to next tuple 0x032A(a); Card manufacturer code = CSR 0x0007(a); Manufacturer information - UniFi CSR6031 0xFF; End-of-chain tuple Table 9: SDIO CIS values for Function 0, (a) can be modified by software Bluegiga Technologies Oy Page 17 of 47 Address 0x00 Field name TPL_CODE Value 0x21; CISTPL_FUNCID: Function identification tuple 0x02; Link to next tuple 0x0C; Card function tuple 0x00; System init bit mask (not used) 0x22; CISTPL_FUNCE: Function extension tuple 0x05; Link to next tuple 0x00; Type of extended data = Function 1-7 0x01(a); FNWUS: Wake up support = 1 (card can wake up host with SDIO clock stopped) 0x00; No SDIO standard function supported 0x00000000(a); Product serial number 0x00000000; No code storage area 0x00; No code storage area 0x0200; Maximum block size and byte count = 512 0x00FF8000(a); 2.7-3.6V operation supported 0x14(a); Minimum operating current = 20mA 0x32(a); Average operating current = 50mA 0xC8(a); Maximum operating current = 500mA 0x05(a); Minimum current in standby = 5mA 0x07(a); Average current in standby = 7mA 0x0A(a); Maximum current in standby = 10mA 0x0BB8(a); Minimum data transfer bandwidth = 3000kBps (24Mbps) 0x1B58(a); Optimum data transfer bandwidth = 7000kBps (54Mbps) 0x001F4; Function's timeout after being enabled = 5s 0x0032(a); Average current when operating = 50mA (copy of TPLFE_OP_AVG_PWR) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 TPL_LINK TPLFID_FUNCTION TPFLID_SYSINIT TPL_CODE TPL_LINK TPLFE_TYPE TPLFE_FUNCTION_INFO 0x08 0x09-0x0C 0x0D-0x10 0x11 0x12-0x13 0x14-0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E-0x1F TPLFE_STD_IO_REV TPL_CARD_PSN TPLFE_CSA_SIZE TPLFE_CSA_PROPERTY TPLFE_MAX_BLOCK_SIZE TPLFE_OCR TPLFE_OP_MIN_PWR TPLFE_OP_AVG_PWR TPLFE_OP_MAX_PWR TPLFE_SB_MIN_PWR TPLFE_SB_AVG_PWR TPLFE_SB_MAX_PWR TPLFE_MIN_BW 0x20-0x21 TPLFE_OPT_BW 0x22-0x23 TPLFE_ENABLE_TIMEOUT_VAL 0x24-0x25 TPLFE_SP_AVG_PWR_3.3V 0x26-0x27 TPLFE_SP_MAX_PWR_3.3V 0x00C8(a); Maximum current when operating = 200mA (copy of TPLFE_OP_MAX_PWR) 0x28-0x29 TPLFE_HP_AVG_PWR_3.3V 0x00C8(a); Average current when operating in higher current mode = 200mA 0x2A-0x2B TPLFE_HP_MAX_PWR_3.3V 0x015E(a); Maximum current when operating in higher current mode = 350mA 0x2C-0x2D TPLFE_LP_AVG_PWR_3.3V 0x2E-0x2F TPLFE_LP_MAX_PWR_3.3V 0x078(a); Average current when operating in lower current mode = 120mA 0x00C8(a); Maximum current when operating in lower current mode = 200mA Bluegiga Technologies Oy Page 18 of 47 0x30 TPL_CODE 0xFF; CISTPL_END: End-of-chain tuple Table 11: SDIO CIS values for Function 1, (a) can be modified by software; current consumption figures are conservative values for the host power control Bluegiga Technologies Oy Page 19 of 47 4.2 Other interfaces 4.2.1 Debug SPI interface A separate SPI bus is provided at the module pads for device access during testing and uploading settings during application development and manufacturing. This interface cannot be used as a host interface. It is recommended to bring these to a header in case RF tests or changes to the stored internal MIB are required after production. The debug SPI bus has logic levels set by the VDD_PADS reference supply line. 4.2.2 Bluetooth coexistence Bluetooth coexistence systems allow co-located Wi-Fi and Bluetooth devices to be aware of each other and to avoid simultaneous transfers that would degrade link performance. There are many ways of implementing such connections, from host driver negotiated channel and time sharing, to hardware signalling between the two devices. WF111 supports a number of different coexistence schemes with up to 6 control lines for hardware communication between the two devices. Wi-Fi and Bluetooth may also use separate antennas, or share a single antenna through a switch and/or a coupler. With a shared antenna, usually two additional signals are needed to control the front end switch. WF111 contains an internal switch for separating Wi-Fi and Bluetooth transmissions as well as a shared low noise amplifier that allows both Wi-Fi and Bluetooth to receive simultaneously using the same amplifier. For use with CSR-based Bluetooth (BC4 to BC6 with firmware version 21 or later, BC7 and onwards with all versions), Unity-3e+ is recommended as the coexistence scheme. Unity-3e is an enhanced version of the 3wire Unity-3 –scheme that uses tighter timings and uses the three control lines also for antenna switch control, removing the need for the two separate switch control lines. Unity-3e+, or Unity-3e with Unity+ adds an additional BT_PERIODIC signal to communicate the need for a periodic transmission from the Bluetooth to the Wi-Fi, allowing a guaranteed low-latency throughput for certain Bluetooth applications despite high Wi-Fi usage. This allows reliable audio connections that would otherwise suffer from the Wi-Fi’s higher priority. Figure 7: Coexistence signals between WF111 and WT21 Bluetooth module (not showing antenna sharing connection) Bluegiga Technologies Oy Page 20 of 47 The required MIB values for the coexistence scheme in Figure 7 are: unifiCoexScheme ::= 3 unifiCoexPTABTStatusPIO ::= 3 unifiCoexPTABTInbandPIO ::= -1 unifiCoexPTABTActivePIO ::= 5 unifiCoexPTAWLANDenyPIO ::= 4 unifiCoexPeriodicPIO ::= 2 The corresponding PSKEYs for the WT21 are: PSKEY_LC_COMBO_DISABLE_PIO_MASK (0x0028) = 0x0200 0x0000 0x0000 PSKEY_LC_COMBO_DOT11_CHANNEL_PIO_BASE (0x002A) = 0x0011 PSKEY_LC_COMBO_DOT11_ESCO_RTX_PRIORITY ( 0x0050) = 0x0001 PSKEY_LC_COMBO_DOT11_PULL_DISABLE_MASK (0x005A) = 0x0200 PSKEY_LC_COMBO_DOT11_PERIODIC_PIO_MASK (0x005C) = 0x0010 0x0000 PSKEY_LC_COMBO_DOT11_T1 (0x005E) = 0x0043 PSKEY_LC_COMBO_DOT11_T2 (0x005F) = 0x000A PSKEY_TXRX_PIO_CONTROL (0x0209) = 0x0001 For other coexistence schemes, please contact Bluegiga technical support. 4.2.3 Configurable I/O pads A number of programmable bi-directional input/outputs (I/O) are provided. PIO[0:5] logic levels are referred to the VDD_PADS supply line. PIO lines can be configured through software to implement various automated functions or as generic inputs or outputs. As inputs the lines can be configured to have either weak or strong pull-ups or pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. In addition to the coexistence functions, any of the PIO lines can be configured as interrupt request lines, wake-up lines from sleep modes, status led drivers with multiple internally generated modes, general I/O pins controlled by the host, or as a 32.768 kHz sleep clock input. For further information, please contact Bluegiga technical support. Note: All unused signals can be left floating. Bluegiga Technologies Oy Page 21 of 47 5 Clock generation WF111 uses an internal 26 MHz crystal as the RF reference clock. All WF111 internal digital clocks except sleep timing are generated using phase locked loops, which are locked to the 26 MHz reference clock. 5.1 32.768 kHz external reference clock The module contains an integrated RC oscillator for sleep timing. If more accurate timing is required, an external 32.768 kHz clock can be applied to a PIO pin configured as a clock input to implement a more accurate sleep clock. The Wi-Fi packet timing is derived from the 26MHz crystal and so is unaffected by tolerances in the sleep clock. The pin chosen as a clock input is an ordinary digital input and the clock waveform should be a logic level square wave. Configuring an input as a clock input requires a setting in the MIB. For further information, please contact Bluegiga technical support. Bluegiga Technologies Oy Page 22 of 47 6 Power Control and Regulation 6.1 Power Control and Regulation Figure 8: System block diagram WF111 contains four linear regulators supplying clean voltages for the different parts of the system. All of them produce a 1.2V output voltage, and are fed from a common input, VDD_REGIN. This input can be supplied with a voltage between 1.45-2.0V, typically 1.5V or 1.8V. The VDD_REGIN supply should be relatively clean of ripple and switching spikes in order to avoid degrading the RF performance. WF111 also needs four other supply lines connected in addition to VDD_REGIN: VDD_PADS provides a reference voltage for matching voltage levels of the host system to the GPIO pins used for Bluetooth coexistence and other functions. This can range from 1.7V to 3.6V. The current drawn from this supply is negligible. VDD_SDIO provides a reference voltage for matching voltage levels of the host system to the SDIO connection. This can range from 1.7V to 3.6V. The current drawn from this supply depends on bus usage, but with no active data transfer will be negligible. VDD_ANA provides a reference voltage for communication between the Wi-Fi chip and the power amplifier. This should be between 1.7V and 3.6V. The current drawn from this supply is negligible. Note for WF111 engineering sample version without RF shield: o VDD_ANA provides a reference voltage for communication between the Wi-Fi chip and the power amplifier. This should be between 2.7V and 3.6V. The current drawn from this supply is negligible. In the production version, the voltage range for VDD_ANA has been extended for more flexible supplying. VDD_PA is a separate supply voltage for the Wi-Fi power amplifier. This supply will draw considerable currents in pulses and should be bypassed with a relatively large capacitor close to the module, and the power traces should be relatively wide. This voltage can range from 2.7V to 4.8V making use Bluegiga Technologies Oy Page 23 of 47 directly from a single lithium cell possible. A higher supply voltage will not affect the power amplifiers current draw significantly. These voltages are not tied to each other and any combination of supply voltages within the specified limits can be used. In a 3.3V logic level host system all other supplies would usually be tied to the 3.3V supply, with a separate regulator providing the 1.45-2.0V supply for the Wi-Fi core. A switch mode regulator with 1.5V output is recommended for minimum power consumption. Please see the example schematic in this datasheet. In a 1.8V logic level host system, all other supplies can be connected to the 1.8V supply rail except VDD_PA which should be connected to a 2.7-4.8V supply. Note for WF111 engineering sample version without RF shield: In a 1.8V logic level host system VDD_PA would be connected to a 2.7-4.8V supply, VDD_ANA to a 2.7-3.6V supply and the rest of the supplies to the 1.8V supply rail. The higher voltage supplies should be powered before or at the same time as the core supply line, i.e. the VDD_REGIN should be powered up last. Powering the core first may lead to the GPIO and SDIO blocks booting into an inaccessible state. External high frequency bypassing of the supply lines is not required. Note: All supply voltages and ground lines must be connected. 6.2 REGEN The regulator enable pin REGEN is used to enable the WF111. REGEN enables the regulators of the digital and analog core supply voltages. The pin is active high, with a logic threshold of around 1V, and has a weak pull-down. REGEN can tolerate voltages up to 2.0V, and may be connected directly to the internal voltage regulator input (VDD_REGIN) to permanently enable the device. Part of the regulators can also be disabled by firmware in power saving modes. The VDD_REGIN supply can also be externally switched off while leaving the other supply voltages powered. Cutting power to the core will fully shut down the module internal processors and returning power will cause a power-on reset, requiring a full initialization of the module. The REGEN pin will not disable system blocks not supplied by the core supply, meaning the coexistence interface and the SDIO Function 0 are available even when the core is powered off. 6.3 RESET WF111 may be reset from several sources: RESET pin, power-on reset, via software configured watchdog timers as well as through the SDIO/CSPI host interface. The RESET pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset is performed between 1.5 and 4.0ms following RESET being active. It is recommended that RESET be applied for a period greater than 5ms. The power-on reset occurs when the core supply (generated by the internal 1.2V linear regulator) falls below typically 1.05V and is released when core voltage rises above typically 1.10V. At reset regardless of the source the digital I/O pins are set to a high impedance state with weak pull-downs, except RESET and DEBUG_SPI_CS# which have a weak pull-up. The host connection interface is only reset by the RESET pin or a power-on reset. A power-on reset can be achieved through powering down the digital core by either externally cutting the VDD_REGIN supply or giving a low pulse to the REGEN-pad. If REGEN is connected to the host system for powering down the module, or a separate core power switch is implemented, the RESET pin can be tied permanently to a supply voltage line. Bluegiga Technologies Oy Page 24 of 47 Following a reset, WF111 automatically generates internally the clocks needed for safe boot-up of the internal processors. The crystal oscillator is then configured by software with the correct input frequency. Bluegiga Technologies Oy Page 25 of 47 Example Application Schematic 30 31 32 21 22 GND PIO[0] 23 REGEN 24 PIO[1] RST 26 SPI_CS 27 PIO[5] 28 VDD_PA GND 29 RESET 100uF 25 PIO[3] VDD_PADS GND ANT PIO[4] 19 18 GND 17 16 GND 15 14 SPI_MOSI VDD_SDIO 13 SPI_CLK 12 SPI_MISO 11 VDD_ANA 10 BT GND SDIO_CMD SDIO_CLK PIO[2] SDIO_DAT[3] SDIO_DAT[2] SDIO_DAT[1] GND GND_PAD SDIO_DAT[0] VDD_REGIN 33 20 3.3V regulator VIN VOUT 1.5/1.8V +3.3V CMD CLK DAT[3] DAT[2] DAT[1] DAT[0] GND SDIO bus Figure 9: An example application circuit with SDIO host connection, 3.3V level host logic and 1.5/1.8V core supply, REGEN hard wired to the core supply and RST pad used to reset the module (Note: with N-variant ANT-pad and associated grounds would also be connected) Bluegiga Technologies Oy Page 26 of 47 30 31 32 21 GND 22 PIO[0] REGEN 24 PIO[1] 25 RST 26 SPI_CS 27 PIO[5] 28 VDD_PA GND 29 100uF 23 REGEN 2.7-4.8V PIO[3] VDD_PADS GND ANT PIO[4] 19 18 GND 16 GND 15 14 SPI_MOSI 13 SPI_CLK 12 SPI_MISO 11 VDD_ANA 10 VDD_SDIO 17 +1.8V BT GND SDIO_CMD CMD CLK SDIO_CLK PIO[2] SDIO_DAT[3] DAT[3] SDIO_DAT[2] DAT[2] SDIO_DAT[1] DAT[1] DAT[0] GND GND_PAD SDIO_DAT[0] VDD_REGIN 33 20 SDIO bus Figure 10: An example application circuit with SDIO host connection, 1.8V level host logic and a separate power amplifier supply, RST hard wired to the core supply and REGEN pad used to power off and reset the module (Note: with N-variant ANT-pad and associated grounds would also be connected)(Note: engineering samples will require VDD_ANA to be 2.7-3.6V) Bluegiga Technologies Oy Page 27 of 47 8 8.1 Wi-Fi radio Wi-Fi receiver The receiver features direct conversion architecture. Sufficient out-of-band blocking specification at the Low Noise Amplifier (LNA) input allows the receiver to be used in close proximity to Global System for Mobile Communications (GSM) and Wideband Code Division Multiple Access (W-CDMA) cellular phone transmitters without being desensitized. High-order baseband filters ensure good performance against in-band interference. 8.2 Wi-Fi transmitter The transmitter features a direct IQ modulator. Digital baseband transmit circuitry provides the required spectral shaping and on-chip trims are used to reduce IQ modulator distortion. Transmitter gain can be controlled on a per-packet basis, allowing the optimization of the transmit power as a function of modulation scheme. The internal Power Amplifier (PA) has a maximum output power of +15dBm for IEEE 802.11g/n and +17dBm for IEEE 802.11b. The module internally compensates for PA gain and reference oscillator frequency drifts with varying temperature and supply voltage. 8.3 Antenna switch for Bluetooth coexistence WF111 supports sharing the integrated antenna or antenna connector with a Bluetooth device through the BT_RF pad. The module contains a bypass switch to route the Bluetooth signal directly to the antenna, and supports using the internal LNA for Bluetooth reception. The switch is controlled through the coexistence interface. Bluegiga Technologies Oy Page 28 of 47 9 Electrical characteristics 9.1 Absolute maximum ratings Rating Min Max Unit Storage temperature -40 85 °C VDD_PADS, VDD_ANA, VDD_SDIO -0.4 3.6 VDD_REGIN, REGEN -0.4 2.5 VDD_PA -0.4 VSS+0.3 VDD+0.3 Other terminal voltages Table 10: Absolute Maximum Ratings 9.2 Recommended Operating Conditions Rating Min Max Unit Operating temperature range (a) -40 85 °C VDD_PADS, VDD_SDIO, VDD_ANA 1.7 3.6 Engineering samples: VDD_ANA* 2.7 3.6 VDD_PA 2.7 4.8 VDD_REGIN 1.45 Table 11: Recommended Operating Conditions (a) The module will heat up depending on use, at high transmit duty cycles the maximum operating temperature may need to be derated. See chapter 13.4 *) This applies to WF111 modules with no RF shield. Bluegiga Technologies Oy Page 29 of 47 9.3 Input/Output terminal characteristics Digital Terminals Min Typ Max Unit VIL input logic level low 1.7V ≤ VDD ≤ 3.6V -0.3 0.25*Vdd VIH input logic level low 1.7V ≤ VDD ≤ 3.6V 0.625*Vdd VDD+0.3 VOL output logic level low 1.7V ≤ VDD ≤ 3.6V, (Io = 4.0 mA) 0.4 VOH output logic level low 1.7V ≤ VDD ≤ 3.6V, (Io = -4.0 mA) 0.75*Vdd Vdd Strong pull-up -150 -40 -10 µA Strong pull-down 10 40 150 µA Weak pull-up -5 -1 -0.33 µA Weak pull-down 0.33 µA I/O pad leakage current -1 µA Pad input capacitance pF Input Voltage Levels Output Voltage Levels Input Tri-state Current with: Table 12: Digital terminal electrical characteristics Frequency Min Typ max 32.748 32.768 32.788 kHz Deviation @25oC -20 +20 ppm Deviation over temperature -150 +150 ppm Duty cycle 30 50 Rise time 70 50 ns Input high level 0.625Vdd Vdd+0.3 Input low level -0.3 0.25Vdd Table 13: External sleep clock specifications Bluegiga Technologies Oy Page 30 of 47 10 RF Characteristics Min max Channel 13 Note: channel 14 can be set but proper operation is not guaranteed and its use should be avoided. Frequency 2412 2472 MHz Table 14: Supported frequencies Standard Supported bit rates 802.11b 1, 2, 5.5, 11Mbps 802.11g 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n, HT, 20MHz, 800ns 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps 802.11n, HT, 20MHz, 400ns 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2Mbps Table 15: Supported modulations 802.11b Typ 802.11g Typ 802.11n short GI Typ 802.11n long GI Typ 1 Mbps -97 dBm 6 Mbps -92 dBm 6.5 Mbps -91 dBm 7.2 Mbps -92 dBm 2 Mbps -95 dBm 9 Mbps -91 dBm 13 Mbps -87 dBm 14.4 Mbps -90 dBm 5.5 Mbps -93 dBm 12 Mbps -89 dBm 19.5 Mbps -85 dBm 21.7 Mbps -87 dBm 11 Mbps -89 dBm 18 Mbps -87 dBm 26 Mbps -82 dBm 28.9 Mbps -84 dBm 24 Mbps -84 dBm 39 Mbps -78 dBm 43.3 Mbps -80 dBm 36 Mbps -80 dBm 52 Mbps -74 dBm 57.8 Mbps -75 dBm 48 Mbps -75 dBm 58.5 Mbps -71 dBm 65 Mbps -72 dBm 54 Mbps -73 dBm 65 Mbps -68 dBm 72.2 Mbps -69 dBm Table 16: Receiver sensitivity Bluegiga Technologies Oy Page 31 of 47 Modulation type Min Typ Max 802.11b +16 +17 +17.6 dBm 802.11g +14 +15 +15.6 dBm 802.11n +14 +15 +15.6 dBm Table 17: Transmitter output power at maximum setting Operating mode Min Typ Max TX loss -2.5 -3 -3.5 dB RX gain (using internal LNA) 10 12 dB 2.0 2.5 dB Internal LNA noise figure Table 18: BT antenna sharing interface properties Typ Max 802.11 limit (total error) Variation between individual units +/-5 +/-10 +/-25 ppm Variation with temperature +/-3 +/-10 +/-25 ppm Table 19: Carrier frequency accuracy Bluegiga Technologies Oy Page 32 of 47 11 Power Consumption Operating mode VDD_PA/peak VDD_PA/typ VDD_REGIN/peak VDD_REGIN/typ Transmit (802.11b, 1M, +17dBm) 248 mA 190 mA 240 mA 100 mA Transmit (802.11b, 1M, +8dBm) 144 mA 90 mA Transmit (802.11g, 54M, +15dBm) 154 mA 104 mA Receive, no data 12 mA Deep sleep 10.5 mA 240 mA 16 µA 114 mA 75 µA Table 20: Current consumption during specific operating modes Operating mode Bit rate Throughput (limited) Current/3.3V Transmit/802.11n 65 Mbps 12 Mbps 144 mA Transmit/802.11g 18 Mbps 5.9 Mbps 192 mA Transmit/802.11b 11 Mbps 4.8 Mbps 192 mA Transmit/802.11b 1 Mbps 920 kbps 184 mA Transmit/802.11n 72.2 Mbps 1 Mbps 74 mA* Transmit/802.11g 54 Mbps 1 Mbps 78 mA Transmit/802.11g 18 Mbps 1 Mbps 86 mA Transmit/802.11b 11 Mbps 1 Mbps 94 mA Transmit/802.11b 2 Mbps 1 Mbps 158 mA Receive 72 Mbps 16.5 Mbps 88 mA Receive 72 Mbps 1 Mbps 70 mA* Idle, associated 3.2 mA** Idle, non-associated 0.6mA Table 21: Average current consumption in normal use with various constant throughputs measured from evaluation board test point (Preliminary) *) Note 1: The module draws about 70mA in idle mode without power saves enabled. With default power save timing settings transferring short packets with short intervals will not allow the Wi-Fi core to go to a power save mode, and the average consumption will approximate 70mA when the relative duration of actual transfers is Bluegiga Technologies Oy Page 33 of 47 minimal. However, when longer packets are transferred with longer intervals, the Wi-Fi core will be able to sleep during the interval, reducing power consumption considerably. **) Note 2: Idle current when associated varies considerably, with 1mA to 8mA measured with different access points in a noisy office environment. Bluegiga Technologies Oy Page 34 of 47 12 Physical Dimensions Figure 11: Physical dimensions Figure 12: WF111 recommended PCB land pattern Bluegiga Technologies Oy Page 35 of 47 13 13.1 Layout Guidelines WF111-A Figure 13: Recommended layouts, on board corner and on board edge See figure 13: recommended layout for the suggested module layout. The impedance matching of the antenna is designed for a layout similar to the module evaluation board. For an optimal performance of the antenna the layout should strictly follow the layout example shown in figure 8 and the thickness of FR4 should be between 1 and 2 mm, preferably 1.6mm. Any dielectric material close to the antenna will change the resonant frequency and it is recommended not to place a plastic case or any other dielectric closer than 5 mm from the antenna. ANY metal in close proximity of the antenna will prevent the antenna from radiating freely. It is recommended not to place any metal or other conductive objects closer than 20 mm to the antenna except in the directions of the ground planes of the module itself. For optimal performance, place the antenna end of the module outside any metal surfaces and objects in the application, preferably on the device corner. The larger the angle in which no metallic object obstructs the antenna radiation, the better the antenna will work. DO NOT place WF111-A in the middle of the application board. Even with a board cutout around the antenna the range will be bad. The three pads on the antenna end of the WF111-A can be connected to the ground or left unsoldered. 13.2 WF111-E RF output can be taken directly from the U.FL connector of the module, and no antenna clearances need to be made for the module. The three pads on the antenna end of the module can be connected to the ground or left unsoldered. 13.3 WF111-N Antenna connection is routed to pad 31. Pads 30 and 32 beside the antenna connection should be properly connected to the ground plane. No antenna clearances are needed for the module itself. The antenna trace should be properly impedance controlled and kept short. Figure 14 shows a typical 50 ohm trace from the RF pin to a SMA connector. Bluegiga Technologies Oy Page 36 of 47 Figure 14: Typical 50 trace for WF111-N A transmission line impedance calculator, such as TX-Line made by AWR, can be used to approximate the dimensions for the 50 ohm transmission line. Figure 15 shows an example for two different 50 ohm transmission lines. CPW Ground W = 0.15 mm G = 0.25 mm RF GROUND Prepreg, εr = 3.7 RF GROUND h = 0.076 mm RF GROUND FR4, εr = 4.6 GND stitching vias MICROSTRIP W = 1.8 mm FR4, εr = 4.6 h = 1 mm RF GROUND Figure 15: Example cross section of two different 50 ohm transmission line Bluegiga Technologies Oy Page 37 of 47 13.4 Thermal considerations The WF111 module may at continuous full power transmit consume up to 1 W of DC power, most of which is drawn by the power amplifier. Most of this will be dissipated as heat. In any application where high ambient temperatures and constant transmissions for more than a few seconds can occur, it is important that a sufficient cooling surface is provided to dissipate the heat. The thermal pad in the bottom of the module must be connected to the application board ground planes by soldering. The application board should provide a number of vias under and around the pad to conduct the produced heat to the board ground planes, and preferably to a copper surface on the other side of the board in order to dissipate the heat into air. The module internal thermal resistance should in most cases be negligible compared to the thermal resistance from the module into air, and common equations for surface area required for cooling can be used to estimate the temperature rise of the module. Only copper planes on the circuit board surfaces with a solid thermal connection to the module ground pad will dissipate heat. For an application with high transmit duty cycles (low bit rate, high throughput, long bursts or constant streaming) the maximum allowed ambient temperature should be reduced due to inherent heating of the module, especially with small fully plastic enclosed applications where heat transfer to ambient air is low due to low thermal conductivity of plastic. The module measured on the evaluation board exhibits a temperature rise of about 25oC above ambient temperature when continuously transmitting IEEE 802.11b at full power with minimal off-times and no collision detection (a worst case scenario regarding power dissipation). An insufficiently cooled module will rapidly heat beyond operating range in ambient room temperature. 13.5 EMC considerations Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC problems caused by RF part of the module. Do not remove copper from the PCB more than needed. For proper operation the antenna requires a solid ground plane with as much surface area as possible. Use ground filling as much as possible. Connect all grounds together with multiple vias. Do not leave small floating unconnected copper areas or areas connected by just one via, these will act as additional antennas and raise the risk of unwanted radiations. Do not place a ground plane underneath the antenna. The grounding areas under the module should be designed as shown in Figure 13: Recommended layout. When using overlapping ground areas use conductive vias separated max. 3 mm apart at the edge of the ground areas. This prevents RF from penetrating inside the PCB. Use ground vias extensively all over the PCB. All the traces in (and on) the PCB are potential antennas. Especially board edges should have grounds connected together at short intervals (stitching) to avoid resonances. Avoid current loops. Keep the traces with sensitive, high current or fast signals short, and mind the return current path, having a short signal path is not much use if the associated ground path between the ends of the signal trace is long. Remember, ground is also a signal trace. The ground will conduct the same current as the signal path and at the same frequency, power and sensitivity. Split a ground plane ONLY if you know exactly what you are doing. Splitting the plane may cause more harm than good if applied incorrectly. The ground plane acts as a part of the antenna system. Insufficient ground planes or large separate sensitive signal ground planes will easily cause the coupled transmitted pulses to be AM-demodulated by semiconductor junctions around the board, degrading system performance. Bluegiga Technologies Oy Page 38 of 47 Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Figure 16: Use of stitching vias to avoid emissions from the edges of the PCB Bluegiga Technologies Oy Page 39 of 47 14 Soldering Recommendations WF111 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Bluegiga Technologies will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for reflow profile configurations Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150m stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, “no clean” solder paste should be used due to low mounted height of the component. If the vias used on the application board have a diameter larger than 0.3mm, it is recommended to mask the via holes at the module side to prevent solder wicking through the via holes. Solders have a habit of filling holes and leaving voids in the thermal pad solder junction, as well as forming solder balls on the other side of the application board which can in some cases be problematic. Bluegiga Technologies Oy Page 40 of 47 15 Certifications WF111 is compliant to the following specifications: 15.1 Wi-Fi TBD 15.2 CE TBD 15.3 FCC and IC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This transmitter is considered as mobile device and should not be used closer than 20 cm from a human body. To allow portable use in a known host class 2 permissive change is required. Please contact support@bluegiga.com for detailed information. IC Statements: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. If detachable antennas are used: This radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. See table 22 for the approved antennas for WF111-E and WF111-N. Bluegiga Technologies Oy Page 41 of 47 OEM Responsibilities to comply with FCC and Industry Canada Regulations The WF111 Module has been certified for integration into products only by OEM integrators under the following conditions: The antenna(s) must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. End Product Labeling The WF111 Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: QOQWF111” “Contains Transmitter Module IC: 5123A-BGTWF111” or “Contains FCC ID: QOQWF111 “Contains IC: 5123A-BGTWF111” The OEM of the WF111 Module must only use the approved antenna(s) described in table 22, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. To comply with FCC and Industry Canada RF radiation exposure limits for general population, the antenna(s) used for this transmitter must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times and must not be colocated or operating in conjunction with any other antenna or transmitter. Bluegiga Technologies Oy Page 42 of 47 15.3.1 FCC et IC Cet appareil est conforme à l’alinéa 15 des règles de la FCC. Deux conditions sont à respecter lors de son utilisation : (1) cet appareil ne doit pas créer d’interférence susceptible de causer un quelconque dommage et, (2) cet appareil doit accepter toute interférence, quelle qu’elle soit, y compris les interférences susceptibles d’entraîner un fonctionnement non requis. Déclaration de conformité FCC d’exposition aux radiofréquences (RF): Ce matériel respecte les limites d’exposition aux radiofréquences fixées par la FCC dans un environnement non contrôlé. Les utilisateurs finaux doivent se conformer aux instructions d’utilisation spécifiées afin de satisfaire aux normes d’exposition en matière de radiofréquence. Ce transmetteur ne doit pas être installé ni utilisé en concomitance avec une autre antenne ou un autre transmetteur. Ce transmetteur est assimilé à un appareil mobile et ne doit pas être utilisé à moins de 20 cm du corps humain. Afin de permettre un usage mobile dans le cadre d’un matériel de catégorie 2, il est nécessaire de procéder à quelques adaptations. Pour des informations détaillées, veuillez contacter le support technique Bluegiga : support@bluegiga.com. Déclaration de conformité IC : Ce matériel respecte les standards RSS exempt de licence d’Industrie Canada. Son utilisation est soumise aux deux conditions suivantes : (1) l’appareil ne doit causer aucune interférence, et (2) l’appareil doit accepter toute interférence, quelle qu’elle soit, y compris les interférences susceptibles d’entraîner un fonctionnement non requis de l’appareil. Selon la réglementation d’Industrie Canada, ce radio-transmetteur ne peut utiliser qu’un seul type d’antenne et ne doit pas dépasser la limite de gain autorisée par Industrie Canada pour les transmetteurs. Afin de réduire les interférences potentielles avec d’autres utilisateurs, le type d’antenne et son gain devront être définis de telle façon que la puissance isotrope rayonnante équivalente (EIRP) soit juste suffisante pour permettre une bonne communication. Lors de l’utilisation d’antennes amovibles : Ce radio-transmetteur (identifié par un numéro certifié ou un numéro de modèle dans le cas de la catégorie II) a été approuvé par Industrie Canada pour fonctionner avec les antennes référencées ci-dessous dans la limite de gain acceptable et l’impédance requise pour chaque type d’antenne cité. Les antennes non référencées possédant un gain supérieur au gain maximum autorisé pour le type d’antenne auquel elles Bluegiga Technologies Oy Page 43 of 47 appartiennent sont strictement interdites d’utilisation avec ce matériel. Veuillez vous référer au tableau 22 concernant les antennes approuvées pour les WF111. Les responsabilités de l’intégrateur afin de satisfaire aux réglementations de la FCC et d’Industrie Canada : Les modules WF111 ont été certifiés pour entrer dans la fabrication de produits exclusivement réalisés par des intégrateurs dans les conditions suivantes : L’antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance minimum de 20cm entre la source de radiation (l’antenne) et toute personne physique. Le module transmetteur ne doit pas être installé ou utilisé en concomitance avec une autre antenne ou un autre transmetteur. Tant que ces deux conditions sont réunies, il n’est pas nécessaire de procéder à des tests supplémentaires sur le transmetteur. Cependant, l’intégrateur est responsable des tests effectués sur le produit final afin de se mettre en conformité avec d’éventuelles exigences complémentaires lorsque le module est installé (exemple : émissions provenant d’appareils numériques, exigences vis-à-vis de périphériques informatiques, etc.) ; IMPORTANT : Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou installation avec un autre transmetteur), les autorisations fournies par la FCC et Industrie Canada ne sont plus valables et les numéros d’identification de la FCC et de certification d’Industrie Canada ne peuvent servir pour le produit final. Dans ces circonstances, il incombera à l’intégrateur de faire réévaluer le produit final (comprenant le transmetteur) et d’obtenir une autorisation séparée de la part de la FCC et d’Industrie Canada. Etiquetage du produit final Chaque module WF111 possède sa propre identification FCC et son propre numéro de certification IC. Si l’identification FCC et le numéro de certification IC ne sont pas visibles lorsqu’un module est installé à l’intérieur d’un autre appareil, alors l’appareil en question devra lui aussi présenter une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit comporter une étiquette placée de façon visible affichant les mentions suivantes : « Contient un module transmetteur certifié FCC QOQWF111 » « Contient un module transmetteur certifié IC 5123A-BGTWF111 » ou « Inclut la certification FCC QOQWF111 » Bluegiga Technologies Oy Page 44 of 47 « Inclut la certification IC 5123A-BGTWF111 » L’intégrateur du module WF111 ne doit utiliser que les antennes répertoriées dans le tableau 25 certifiées pour ce module. L’intégrateur est tenu de ne fournir aucune information à l’utilisateur final autorisant ce dernier à installer ou retirer le module RF, ou bien changer les paramètres RF du module, dans le manuel d’utilisation du produit final. Afin de se conformer aux limites de radiation imposées par la FCC et Industry Canada, l’antenne (ou les antennes) utilisée pour ce transmetteur doit être installée de telle sorte à maintenir une distance minimum de 20cm à tout instant entre la source de radiation (l’antenne) et les personnes physiques. En outre, cette antenne ne devra en aucun cas être installée ou utilisée en concomitance avec une autre antenne ou un autre transmetteur. Bluegiga Technologies Oy Page 45 of 47 15.4 Qualified Antenna Types for WF111-E This device has been designed to operate with the antennas listed below, and having a maximum gain of 2.14 dBi. Antennas not included in this list or having a gain greater than 2.14 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. Antenna Type Dipole Qualified Antenna Types for WF111-E Maximum Gain 2.14 dBi Table 22: Qualified Antenna Types for WF111-E Any antenna that is of the same type and of equal or less directional gain as listed in table above can be used without a need for retesting. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. Using an antenna of a different type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. Please, contact support@bluegiga.com for more information. Bluegiga Technologies Oy Page 46 of 47 Contact Information Sales: sales@bluegiga.com Technical support: support@bluegiga.com http://techforum.bluegiga.com Orders: orders@bluegiga.com WWW: www.bluegiga.com www.bluegiga.hk Head Office / Finland: Phone: +358-9-4355 060 Fax: +358-9-4355 0660 Sinikalliontie 5A 02630 ESPOO FINLAND Postal address / Finland: P.O. BOX 120 02631 ESPOO FINLAND Sales Office / USA: Phone: +1 770 291 2181 Fax: +1 770 291 2183 Bluegiga Technologies, Inc. 3235 Satellite Boulevard, Building 400, Suite 300 Duluth, GA, 30096, USA Sales Office / Hong-Kong: Phone: +852 3182 7321 Fax: +852 3972 5777 Bluegiga Technologies, Inc. 19/F Silver Fortune Plaza, 1 Wellington Street, Central Hong Kong Bluegiga Technologies Oy Page 47 of 47
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