Simcom 1005242010007 SIM900B Wireless Module User Manual

Shanghai Simcom Ltd. SIM900B Wireless Module

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Contents

1. Mounting Information
2. User Manual
3. Users Manual

User Manual

a Hardware Design SIM900B_HD_V1.03

SIM900B Hardware Design Document Title: SIM900B Hardware Design Version: 1.03 Date: 2010-06-24 Status: Release Document Control ID: SIM900B_HD_V1.03 General Notes SIMCom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by SIMCom. The information provided is based upon requirements specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information which is the property of SIMCom Limited, copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2010 SIM900B_HD_V1.03 24.06.2010 2

SIM900B Hardware Design Contents Contents .....................................................................................................................................................................3 Version history...........................................................................................................................................................7 1 Introduction.............................................................................................................................................................8 1.1 Related Documents .......................................................................................................................................8 1.2 Terms and Abbreviations...............................................................................................................................8 1.3 Safety Caution.............................................................................................................................................11 2 SIM900B Overview ..............................................................................................................................................13 2.1 SIM900B Key Features...............................................................................................................................13 2.2 SIM900B Functional Diagram ....................................................................................................................15 2.3 SIM900B Evaluation Board ........................................................................................................................16 3 Application Interface.............................................................................................................................................18 3.1 SIM900B Pin Description ...........................................................................................................................18 3.2 Operating Modes.........................................................................................................................................21 3.3 Power Supply ..............................................................................................................................................22 3.3.1 Power Supply Pins.............................................................................................................................23 3.3.2 Minimizing Power Losses .................................................................................................................24 3.3.3 Monitoring Power Supply .................................................................................................................24 3.4 Power Up and Power Down Scenarios........................................................................................................24 3.4.1 Turn on SIM900B..............................................................................................................................24 3.4.2 Turn Off SIM900B............................................................................................................................26 3.4.3 Restart SIM900B Using the PWRKEY Pin.......................................................................................28 3.5 Power Saving ..............................................................................................................................................28 3.5.1 Minimum Functionality Mode ..........................................................................................................28 3.5.2 Sleep Mode (Slow Clock Mode) .......................................................................................................29 3.5.3 Wake Up SIM900B from SLEEP Mode ...........................................................................................29 3.6 Summary of State Transitions (except SLEEP mode).................................................................................29 3.7 RTC Backup ................................................................................................................................................30 3.8 Serial Interfaces...........................................................................................................................................31 3.8.1 Function of serial port & debug port supporting ...............................................................................33 3.8.2 Software Upgrade and Software Debug ............................................................................................34 3.9 Audio Interfaces ..........................................................................................................................................35 3.9.1 Speaker Interface Configuration........................................................................................................36 3.9.2 Microphone Interfaces Configuration ...............................................................................................37 3.9.3 Earphone Interface Configuration .....................................................................................................37 3.9.4 Referenced Electronic Characteristic ................................................................................................38 3.10 Buzzer .......................................................................................................................................................39 3.11 SIM Card Interface....................................................................................................................................40 3.11.1 SIM Card Application .....................................................................................................................40 3.11.2 Design Considerations for SIM Card Holder ..................................................................................41 SIM900B_HD_V1.03 24.06.2010 3

SIM900B Hardware Design 3.12 LCD Display Interface ..............................................................................................................................44 3.13 Keypad Interface .......................................................................................................................................44 3.14 ADC ..........................................................................................................................................................45 3.15 Behaviors of the RI ...................................................................................................................................46 3.16 Network Status Indication.........................................................................................................................46 3.17 General Purpose Input Output (GPIO)......................................................................................................48 4 Antenna Interface ..................................................................................................................................................49 4.1 Module RF Output Power ...........................................................................................................................50 4.2 Module RF Receive Sensitivity...................................................................................................................50 4.3 Module Operating Frequencies ...................................................................................................................50 5 Electrical, Reliability and Radio Characteristics...................................................................................................50 5.1 Absolute Maximum Ratings........................................................................................................................50 5.2 Operating Temperatures..............................................................................................................................51 5.3 Power Supply Ratings .................................................................................................................................51 5.4 Current Consumption ..................................................................................................................................52 5.5 Electro-Static Discharge..............................................................................................................................53 6 Mechanics .............................................................................................................................................................55 6.1 Mechanical Dimensions of SIM900B .........................................................................................................55 6.2 Top View of the SIM900B ..........................................................................................................................56 6.3 Mounting SIM900B onto the application platform.....................................................................................57 6.4 Board-to-board connector ...........................................................................................................................57 6.4.1 Mechanical dimensions of the SUNCAGEY BB530-06001-20R.....................................................57 6.5 RF connector ...............................................................................................................................................59 6.6 PIN Assignment of SIM900B .....................................................................................................................61 SIM900B_HD_V1.03 24.06.2010 4

SIM900B Hardware Design Table Index TABLE 1: RELATED DOCUMENTS............................................................................................................................... 8 TABLE 2: TERMS AND ABBREVIATIONS ................................................................................................................... 8 TABLE 3: SIM900B KEY FEATURES ........................................................................................................................... 13 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ............................ 15 TABLE 5: PIN DESCRIPTION ....................................................................................................................................... 18 TABLE 6: OVERVIEW OF OPERATING MODES........................................................................................................ 21 TABLE 7: PIN DEFINITION OF THE SERIAL INTERFACES .................................................................................... 31 TABLE 8: LOGIC LEVELS OF THE SERIAL PORT AND DEBUG PORT ................................................................. 32 TABLE 9: PIN DEFINE OF THE AUDIO INTERFACE ................................................................................................ 35 TABLE 10: MIC INPUT CHARACTERISTICS ............................................................................................................. 38 TABLE 11: AUDIO OUTPUT CHARACTERISTICS .................................................................................................... 38 TABLE 12: BUZZER OUTPUT CHARACTERISTICS ................................................................................................. 39 TABLE 13: PIN DEFINE OF THE SIM INTERFACE.................................................................................................... 40 TABLE 14: PIN DESCRIPTION (AMPHENOL SIM CARD HOLDER) ...................................................................... 42 TABLE 15: PIN DESCRIPTION (MOLEX SIM CARD HOLDER) .............................................................................. 43 TABLE 16: PIN DEFINE OF THE LCD INTERFACE................................................................................................... 44 TABLE 17: PIN DEFINE OF THE KEYPAD INTERFACE........................................................................................... 44 TABLE 18: ADC SPECIFICATION ................................................................................................................................45 TABLE 19: BEHAVIOURS OF THE RI.......................................................................................................................... 46 TABLE 20: WORKING STATE OF THE NETLIGHT ................................................................................................... 47 TABLE 21: PIN DEFINE OF THE GPIO INTERFACE ................................................................................................. 48 TABLE 22: SIM900B CONDUCTED RF OUTPUT POWER........................................................................................ 50 TABLE 23: SIM900B CONDUCTED RF RECEIVE SENSITIVITY ............................................................................ 50 TABLE 24: SIM900B OPERATING FREQUENCIES.................................................................................................... 50 TABLE 25: ABSOLUTE MAXIMUM RATINGS........................................................................................................... 51 TABLE 26: SIM900B OPERATING TEMPERATURE .................................................................................................. 51 TABLE 27: SIM900B POWER SUPPLY RATINGS....................................................................................................... 51 TABLE 28: SIM900B CURRENT CONSUMPTION（VBAT=3.8V）......................................................................... 52 TABLE 29: THE ESD ENDURE STATUE MEASURED TABLE (TEMPERATURE: 25℃, HUMIDITY:45% ) ........ 53 TABLE 30: PIN ASSIGNMENT...................................................................................................................................... 61 SIM900B_HD_V1.03 24.06.2010 5

SIM900B Hardware Design Figure Index FIGURE 1: SIM900B FUNCTIONAL DIAGRAM......................................................................................................... 16 FIGURE 2: TOP VIEW OF SIM900B EVB .................................................................................................................... 17 FIGURE 3: REFERENCE CIRCUIT OF THE VBAT INPUT ........................................................................................ 22 FIGURE 4: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT..................................................... 23 FIGURE 5: VBAT VOLTAGE DROP DURING TRANSMIT BURST........................................................................... 23 FIGURE 6: TURN ON SIM900B USING DRIVING CIRCUIT..................................................................................... 25 FIGURE 7: TURN ON SIM900B USING BUTTON ...................................................................................................... 25 FIGURE 8: TIMING OF TURN ON SYSTEM USING PWRKEY ................................................................................ 26 FIGURE 9: TIMING OF TURN OFF SYSTEM USING PWRKEY............................................................................... 26 FIGURE 10: TIMING OF RESTART SYSTEM ............................................................................................................. 28 FIGURE 11: STATE TRANSITION ................................................................................................................................29 FIGURE 12: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ......................................................................... 30 FIGURE 13: RTC SUPPLY FROM RECHARGEABLE BATTERY .............................................................................. 30 FIGURE 14: RTC SUPPLY FROM CAPACITOR .......................................................................................................... 31 FIGURE 15: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ......................................................................... 31 FIGURE 16: CONNECTION OF THE SERIAL INTERFACES..................................................................................... 33 FIGURE 17: CONNECTION OF SOFTWARE UPGRADE AND SOFTWARE DEBUG ............................................. 34 FIGURE 18: RS232 LEVEL CONVERTER CIRCUIT................................................................................................... 35 FIGURE 19: SPEAKER INTERFACE CONFIGURATION ........................................................................................... 36 FIGURE 20: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION .......................................................... 36 FIGURE 21: MICROPHONE INTERFACE CONFIGURATION................................................................................... 37 FIGURE 22: EARPHONE INTERFACE CONFIGURATION........................................................................................ 37 FIGURE 23: REFERENCE CIRCUIT OF BUZZER ...................................................................................................... 39 FIGURE 24: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD.............................................................................. 41 FIGURE 25: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD.............................................................................. 41 FIGURE 26: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER........................................................................ 42 FIGURE 27: MOLEX 91228 SIM CARD HOLDER ...................................................................................................... 43 FIGURE 28: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE ....................................................................... 45 FIGURE 29: SIM900B SERVICES AS RECEIVER ....................................................................................................... 46 FIGURE 30: SIM900B SERVICES AS CALLER ........................................................................................................... 46 FIGURE 31: REFERENCE CIRCUIT OF NETLIGHT .................................................................................................. 47 FIGURE 32 : THE RF INTERFACE OF MODULE ....................................................................................................... 49 FIGURE 33: TOP AN SIDE MECHANICAL DIMENSIONS OF MODULE （UNIT: MM）.................................... 55 FIGURE 34：MECHANICAL DIMENSIONS OF MODULE PCB DECAL（UNIT: MM）...................................... 56 FIGURE 35: TOP VIEW OF THE SIM900B................................................................................................................... 56 FIGURE 36: SUNCAGEY BB530-06001-20R BOARD-TO-BOARD CONNECTOR.................................................. 57 FIGURE 37 BOARD-TO-BOARD CONNECTOR PHYSICAL PHOTO ...................................................................... 58 FIGURE 38: U.FL-R-SMT............................................................................................................................................... 59 FIGURE 39: U.FL SERIES RF ADAPTER CABLE ....................................................................................................... 60 SIM900B_HD_V1.03 24.06.2010 6

SIM900 Hardware Design Version history Date Version Description of change Author 2010-04-08 1.01 Origin Huangqiuju 2010-05-31 1.02 Modify voltage domain ，current consumption and figure37 Huangqiuju 2010-06-23 1.03 §2.1, §3.3. §3.4 Modify the power supply range from 3.2V~4.8V to 3.1V~4.8V §3.7, Modify the VRTC pin connection when RTC backup is not needed. Huangqiuju SIM900_HD_V1.03 7 24.06.2010

SIM900B Hardware Design 1 Introduction This document describes the hardware interface of the SIMCom SIM900B module that connects to the specific application and the air interface. As SIM900B can be integrated with a wide range of applications, all functional components of SIM900B are described in great detail. This document can help you quickly understand SIM900B interface specifications, electrical and mechanical details. With the help of this document and other SIM900B application notes, user guide, the user can use SIM900B module to design and set-up mobile applications quickly. 1.1 Related Documents Table 1: Related documents SN Document name Remark [1] SIM900_ATC SIM900_ATC [2] ITU-T Draft new recommendation V.25ter: Serial asynchronous automatic dialing and control [3] GSM 07.07: Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) [4] GSM 07.10: Support GSM 07.10 multiplexing protocol [5] GSM 07.05: Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) [6] GSM 11.14: Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface [7] GSM 11.11: Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface [8] GSM 03.38: Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information [9] GSM 11.10 Digital cellular telecommunications system (Phase 2)； Mobile Station (MS) conformance specification； Part 1: Conformance specification [10] AN_Serial Port AN_Serial Port 1.2 Terms and Abbreviations Table 2: Terms and Abbreviations SIM900B_HD_V1.03 24.06.2010 8

SIM900B Hardware Design Abbreviation Description ADC Analog-to-Digital Converter AMR Adaptive Multi-Rate ARP Antenna Reference Point ASIC Application Specific Integrated Circuit BER Bit Error Rate BTS Base Transceiver Station CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DRX Discontinuous Reception DSP Digital Signal Processor DTE Data Terminal Equipment (typically computer, terminal, printer) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity kbps Kilo bits per second LED Light Emitting Diode Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MT Mobile Terminated SIM900B_HD_V1.03 24.06.2010 9

SIM900B Hardware Design Abbreviation Description PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCS Personal Communication System, also referred to as GSM 1900 PDU Protocol Data Unit PPP Point-to-point protocol RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock RX Receive Direction SIM Subscriber Identification Module SMS Short Message Service TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TX Transmit Direction UART Universal Asynchronous Receiver & Transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value Inorm Normal Current Imax Maximum Load Current SIM900B_HD_V1.03 24.06.2010 10

SIM900B Hardware Design Phonebook abbreviations Abbreviation Description FD SIM fix dialing phonebook LD SIM last dialing phonebook (list of numbers most recently dialed) MC Mobile Equipment list of unanswered MT calls (missed calls) ON SIM (or ME) own numbers (MSISDNs) list RC Mobile Equipment list of received calls SM SIM phonebook NC Not connect 1.3 Safety Caution The following safety precautions must be observed during all phases of the operation. Usage, service or repair of any cellular terminal or mobile incorporating SIM900B module. Manufactures of the cellular terminal should send words the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, SIMCom does not take on any liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it be switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. SIM900B_HD_V1.03 24.06.2010 11

SIM900B Hardware Design Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, for example no mobile fee or a invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. SIM900B_HD_V1.03 24.06.2010 12

SIM900B Hardware Design 2 SIM900B Overview Designed for global market, SIM900B is a quad-band GSM/GPRS engine that works on frequencies GSM 850MHz, EGSM 900MHz, DCS 1800MHz and PCS 1900MHz. SIM900B features GPRS multi-slot class 10/ class 8 (optional) and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. With a tiny configuration of 40mm x 33mm x 3mm, SIM900B can meet almost all the space requirements in your applications, such as M2M, smart phone, PDA and other mobile devices. The physical interface to the mobile application is a 60-pin board-to-board connector, which provides all hardware interfaces between the module and customers’ boards except the RF antenna interface. z The keypad and SPI display interface will give you the flexibility to develop customized applications. z Serial port and Debug port can help you easily develop your applications. z Two audio channels include a microphone input and a speaker output. z Programmable general purpose input & output. The SIM900B is designed with power saving technique so that the current consumption is as low as 1.2mA in SLEEP mode. The SIM900B is integrated with the TCP/IP protocol; extended TCP/IP AT commands are developed for customers to use the TCP/IP protocol easily, which is very useful for those data transfer applications. 2.1 SIM900B Key Features Table 3: SIM900B key features Feature Implementation Power supply Single supply voltage :3.1V – 4.8V Power saving Typical power consumption in SLEEP mode is 1.2mA ( BS-PA-MFRMS=5) Frequency Bands z Quad-band: GSM 850, EGSM 900, DCS 1800, PCS 1900. The SIM900B can search the 4 frequency bands automatically. The frequency bands also can be set by AT command. z Compliant to GSM Phase 2/2+ GSM class Small MS Transmitting power z Class 4 (2W) at GSM 850 and EGSM 900 z Class 1 (1W) at DCS 1800 and PCS 1900 GPRS connectivity z GPRS multi-slot class 10 （default） z GPRS multi-slot class 8 (option) z GPRS mobile station class B SIM900B_HD_V1.03 24.06.2010 13

SIM900B Hardware Design Temperature range z Normal operation: -30°C to +80°C z Restricted operation: -40°C to -30°C and +80 °C to +85°C(1) z Storage temperature -45°C to +90°C DATA GPRS: CSD: z GPRS data downlink transfer: max. 85.6 kbps z GPRS data uplink transfer: max. 42.8 kbps z Coding scheme: CS-1, CS-2, CS-3 and CS-4 z Supports the protocols PAP (Password Authentication Protocol) usually used for PPP connections. z Integrates the TCP/IP protocol. z Support Packet Switched Broadcast Control Channel (PBCCH) z CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent z Unstructured Supplementary Services Data (USSD) support SMS z MT, MO, CB, Text and PDU mode z SMS storage: SIM card FAX Group 3 Class 1 SIM interface Support SIM card: 1.8V, 3V External antenna Connected via 50 Ohm antenna connector or antenna pad Audio features Speech codec modes: z Half Rate (ETS 06.20) z Full Rate (ETS 06.10) z Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) z Adaptive multi rate (AMR) z Echo Cancellation z Noise Suppression Serial port and Debug port Serial Port: z 7-wire modem interface with status and control lines, unbalanced, asynchronous. z 1200bps to 115200bps. z Serial Port can be used for AT commands or data stream. z Supports RTS/CTS hardware handshake and software ON/OFF flow control. z Multiplex ability according to GSM 07.10 Multiplexer Protocol. z Autobauding supports baud rate from 1200 bps to 57600bps. Debug port: z 2-wire interface DBG_TXD and DBG_RXD. z Can be used for debugging and firmware upgrade. Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC. SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 Real time clock Implemented Timer function Programmable via AT command Physical characteristics Size: 40mm x 33mm x 3.0mm Weight: 7g Firmware upgrade Firmware upgrade over debug port. SIM900B_HD_V1.03 24.06.2010 14

SIM900B Hardware Design (1) The SIM900B does work, but deviations from the GSM specification may occur. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot CS-1: 9.05kbps 18.1kbps 36.2kbps CS-2: 13.4kbps 26.8kbps 53.6kbps CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2 SIM900B Functional Diagram The following figure shows a functional diagram of the SIM900B and illustrates the mainly functional part: z The GSM baseband engine z Flash and SRAM z The GSM radio frequency part z The antenna interface z The board-to-board interface z The Other interfaces SIM900B_HD_V1.03 24.06.2010 15

SIM900B Hardware Design Flash+SRAM Baseband EngineRadio FrequencyBoard-to-board ConnectorLCDKEYPADSAUDIOSIMADCUARTGPIOPOWERSIM 900BAntenna connector Figure 1: SIM900B functional diagram 2.3 SIM900B Evaluation Board In order to help you on the application of SIM900B, SIMCom can supply an Evaluation Board (EVB) that interfaces the SIM900B directly with appropriate power supply, SIM card holder, RS232 serial port, handset port, earphone port, antenna and all GPIO of the SIM900B. SIM900B_HD_V1.03 24.06.2010 16

SIM900B Hardware Design SIM900B_HD_V1.03 24.06.2010 17 Figure 2: Top view of SIM900B EVB For details please refer to the SIM900B-EVB_UGD document.

SIM900B Hardware Design 3 Application Interface SIM900B is equipped with a 60-pin 0.5mm pitch board-to-board connector that connects to the cellular application platform. Sub-interfaces included in this board-to-board connector are described in detail in following chapters: z Power supply (please refer to Chapter 3.3) z Serial interfaces (please refer to Chapter 3.8) z Analog audio interfaces (please refer to Chapter 3.9) z SIM interface (please refer to Chapter 3.11) Electrical and mechanical characteristics of the board-to-board connector are specified in Chapter 6. There we also include order information for mating connectors. 3.1 SIM900B Pin Description Table 5: Pin description Power Supply PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT VBAT I 8 VBAT pins are dedicated to connect the supply voltage. The power supply of SIM900B has to be a single voltage source of VBAT= 3.2V...4.8V. It must be able to provide sufficient current in a transmit burst which typically rises to 2A Vmax= 4.8V Vmin=3.1V Vnorm=4.0V VRTC I/O Current input for RTC when the battery is not supplied for the system. Current output for backup battery when the main battery is present and the backup battery is in low voltage state. Vmax=3.15V Vmin=2.0V Vnorm=3.0V Iout(max)= 200uA Iin=3 uA If the RTC function is enabled, a backup battery or capacitor should be connected to the VRTC pin. Otherwise connect a 4.7uF capacitor to the VRTC pin. VDD_EXT O 2.8V output power supply Vmax=2.95V Vmin=2.70V Vnorm=2.80V If unused, keep open. SIM900B_HD_V1.03 24.06.2010 18

SIM900B Hardware Design Iout(max)= 10mA GND Ground Power on or power off PIN NAME I/O DESCRIPTION DC CHARACTERISTICS PWRKEY I Power on/off detect, active low. VILmax=0.9V VIHmin=2.6V VImax=3.3V VILmin= 0V It is already pulled up internally (3V). Audio interfaces PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT MIC1P MIC1N I Positive and negative voice-band input MIC2P MIC2N I Auxiliary positive and negative voice-band input If unused keep open SPK1P SPK1N O Positive and negative voice-band output SPK2P SPK2N O Auxiliary positive and negative voice-band output Audio DC Characteristics refer to chapter 3.9.4 If unused keep open AGND Analog ground Separate ground connection for external audio circuits. If unused keep open. Display interface PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT DISP_RST O DISP_DATA I/O DISP _CLK O DISP _CS O DISP _D/C O Display interface VILmax=0.15 *VDD_EXT VIHmin=0.85*VDD_EXT VILmin= 0V VIHmax= VDD_EXT VOHmin= VDD_EXT-0.1V VOLmax=0.1V VOHmax= VDD_EXT VOLmin= 0V If unused keep open General purpose input/output GPIO1/ KBC4 I/O Default as GPIO,can be multiplexed as keypad VILmax=0.15 *VDD_EXT VIHmin=0.85*VDD_EXT If unused keep open SIM900B_HD_V1.03 24.06.2010 19

SIM900B Hardware Design GPIO2/ KBC3 I/O GPIO3/ KBC2 I/O GPIO4/ KBC1 I/O GPIO6/ KBR3 I/O GPIO7/ KBR4 I/O GPIO8/ KBR2 I/O GPIO9/ KBR1 I/O KBR0 I KBC0 O VILmin= 0V VIHmax= VDD_EXT VOHmin= VDD_EXT-0.1V VOLmax=0.1V VOHmax= VDD_EXT VOLmin= 0V Just for power down, If unused keep open Serial port PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT RXD I Receive data TXD O Transmit data RTS I Request to send CTS O Clear to send RI O Ring indicator DCD O Data carry detect DTR I Data terminal Ready VILmax=0.15 *VDD_EXT VIHmin=0.85*VDD_EXT VILmin= 0V VIHmax= VDD_EXT VOHmin= VDD_EXT-0.1V VOLmax=0.1V VOHmax= VDD_EXT VOLmin= 0V DTR Pin has been pulled up to VDD_EXT internally. If unused keep open Debug interface PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT DBG_TXD O DBG_RXD I Serial interface for debugging and firmware upgrade VILmax=0.15 *VDD_EXT VIHmin=0.85*VDD_EXT VILmin= 0V VIHmax= VDD_EXT VOHmin= VDD_EXT-0.1V VOLmax=0.1V VOHmax= VDD_EXT VOLmin= 0V If unused keep open SIM interface PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT SIM_VDD O Voltage supply for SIM card The voltage can be select by software automatically either 1.8V or 3V SIM_DATA I/O SIM data output VILmax=0.15 *SIM_VDD SIM900B_HD_V1.03 24.06.2010 20

SIM900B Hardware Design SIM_CLK O SIM clock SIM_RST O SIM reset VIHmin=0.85*SIM_VDD VILmin= 0V VIHmax= SIM_VDD VOHmin= SIM_VDD-0.1V VOLmax=0.1V VOHmax= SIM_VDD VOLmin= 0V SIM_PRESENCE I SIM detect VILmax=0.15 *VDD_EXT VIHmin=0.85*VDD_EXT VILmin= 0V VIHmax= VDD_EXT If unused keep open ADC PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT ADC0 I General purpose analog to digital converter. Input voltage range: 0V ~ 2.8V If unused keep open Pulse Width Modulation PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT BUZZER O PWM Output VOHmin= VDD_EXT-0.1V VOLmax=0.1V VOHmax= VDD_EXT VOLmin=0 If unused keep open 3.2 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Function GSM/GPRS SLEEP Module will automatically go into SLEEP mode if DTR is set to high level and there is no on air and no hardware interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will reduce to the minimal level. In SLEEP mode, the module can still receive paging message and SMS from the BTS normally. Normal operation GSM IDLE Software is active. Module has registered to the GSM network, and the SIM900B_HD_V1.03 24.06.2010 21

SIM900B Hardware Design module is ready to send and receive. GSM TALK Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. GPRS STANDBY Module is ready for GPRS data transfer, but no data is currently sent or received. In this case, power consumption depends on network settings and GPRS configuration. GPRS DATA There is GPRS data transfer (PPP or TCP or UDP) in progress. In this case, power consumption is related with network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multi-slot settings). POWER DOWN Normal shutdown by sending the “AT+CPOWD=1” command or using the PWRKEY. The power management ASIC disconnects the power supply from the baseband part of the module, and only the power supply for the RTC is remained. Software is not active. The serial port is not accessible. Operating voltage (connected to VBAT) remains applied. Minimum functionality mode (without remove power supply) Use the “AT+CFUN” command can set the module to a minimum functionality mode without remove the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be closed, and the serial port is still accessible. The power consumption in this case is very low. 3.3 Power Supply The power supply of SIM900B is from a single voltage source of VBAT= 3.1V...4.8V. In some case, the ripple in a transmitting burst may cause voltage drops when current consumption rises to typical peaks of 2A. So the power supply must be able to provide sufficient current up to 2A. For the VBAT input, a local bypass capacitor is recommended. A capacitor (about 100 µF, low ESR) is recommended. Multi-layer ceramic chip (MLCC) capacitors can provide the best combination of low ESR and small size but may not be cost effective. A lower cost choice may be a 100 µF tantalum capacitor (low ESR) with a small (0.1µF to 1µF) ceramic in parallel, which is illustrated as following figure. The capacitors should be placed as close as possible to the SIM900B VBAT pins. The following figure is the recommended circuit. CACBVBAT+ Figure 3: Reference circuit of the VBAT input SIM900B_HD_V1.03 24.06.2010 22

SIM900B Hardware Design The circuit design of the power supply depends strongly upon the power source where this power is drained. The following figure is the reference design of +5V input source power supply. The designed output for the power supply is 4.1V, thus a linear regulator can be used. If there’s a big difference between the input source and the desired output (VBAT), a switching converter power supply will be preferable because of its better efficiency especially with the 2A peak current in burst mode of the module. A single 3.6V Li-Ion cell battery type can be connected to the power supply of the SIM900B VBAT directly. But the Ni_Cd or Ni_MH battery types must be used carefully, since their maximum voltage can rise over the absolute maximum voltage of the module and damage it. Figure 4: Reference circuit of the source power supply input The following figure is the VBAT voltage ripple wave at the maximum power transmit phase, the test condition is VBAT=4.0V, VBAT maximum output current =2A, CA=100µF tantalum capacitor (ESR=0.7Ω) and CB=1µF. Max:300mVVBATBurst:2AIVBAT4.615ms577us Figure 5: VBAT voltage drop during transmit burst 3.3.1 Power Supply Pins Eight VBAT pins of the board-to-board connector are dedicated to connect the supply voltage; six GND pins are recommended for grounding. VRTC pin can be used to back up the RTC. SIM900B_HD_V1.03 24.06.2010 23

SIM900B Hardware Design 3.3.2 Minimizing Power Losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBAT never drops below 3.2V even in a transmit burst where current consumption can rise to typical peaks of 2A. If the power voltage drops below 3.2V, the module may be switched off. The PCB traces from the VBAT pins to the power source must be wide enough to decrease voltage drops in the transmitting burst mode. 3.3.3 Monitoring Power Supply To monitor the supply voltage, the user can use the “AT+CBC” command which include a parameter: voltage value (in mV). The voltage is continuously measured at intervals depending on the operating mode. The displayed voltage (in mV) is averaged over the last measuring period before the “AT+CBC” command is executed. For details please refer to document [1] 3.4 Power Up and Power Down Scenarios In general, be sure not to turn on SIM900B while it is beyond the safety limits of voltage and temperature stated in Chapter 3.4.2. SIM900B would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.4.1 Turn on SIM900B SIM900B can be turned on by the following way, which is described in following chapters: z Via PWRKEY pin: starts normal operating mode (please refer to chapter 3.4.1.1); Note: The AT command must be set after the SIM900B is power on and Unsolicited Result Code “RDY” is received from the serial port. However if the SIM900B is set autobauding, the serial port will receive nothing. The AT commands can be set after the SIM900B is power on. “AT+IPR=x” can be used to set a fixed baud rate and save the configuration to non-volatile flash memory. After the configuration is saved as fixed baud rate, the Code “RDY” should be received from the serial port all the time that the SIM900B is power on. Please refer to the chapter “AT+IPR” in document [1]. 3.4.1.1 Turn on SIM900B Using the PWRKEY Pin (Power on) The SIM900B can be turn on by driving the PWRKEY to a low level voltage for some time and then release. This pin has pulled up to a 3V voltage source in the module. The simple circuit illustrates as the following figures. SIM900B_HD_V1.03 24.06.2010 24

SIM900B Hardware Design 4.7k47kTurn on impulse3V1K100KPOWERKEYModule Figure 6: Turn on SIM900B using driving circuit S1PWRKEYTVS1 Figure 7: Turn on SIM900B using button The power on scenarios illustrates as following figure. VIL=1.2VVIH > 2.55VPulldown >1sVBATPWRKEY(INPUT)Delay > 2.2sSerial Port Undefined Active SIM900B_HD_V1.03 24.06.2010 25

SIM900B Hardware Design Figure 8: Timing of turn on system using PWRKEY When power on procedure completes, the SIM900B will send out following result code to indicate the module is ready to operate when set as fixed baud rate. RDY This result code does not appear when autobauding is active. 3.4.2 Turn Off SIM900B Following ways can be used to turn off the SIM900B: z Normal power down procedure: Turn off SIM900B using the PWRKEY pin z Normal power down procedure: Turn off SIM900B using AT command z Over-voltage or under-voltage automatic shutdown: Take effect if over-voltage or under-voltage is detected z Over-temperature or under-temperature automatic shutdown: Take effect if over-temperature or under-temperature is detected 3.4.2.1 Turn Off SIM900B Using the PWRKEY Pin (Power down) The SIM900B can be turned off by driving the PWRKEY to a low level voltage for a short time and then release. Please refer to the turn on circuit. The power down scenario illustrates as following figure. This procedure lets the module log off from the network and allows the software to enter into a secure state and save data before completely disconnecting the power supply. Before the completion of the switching off procedure the module will send out result code: NORMAL POWER DOWN After this moment, the AT commands can’t be executed. The module enters the POWER DOWN mode, only the RTC is still active. POWER DOWN can also be indicated by VDD_EXT pin, which is a low level voltage in this mode. VDD_EXT（OUTPUT）VIL<0.9VVIH > 2.55VPulldown >1sPWRKEY(INPUT)VOL < 0.1VDelay > 1.7sLogout net Figure 9: Timing of turn off system using PWRKEY SIM900B_HD_V1.03 24.06.2010 26

SIM900B Hardware Design 3.4.2.2 Turn Off SIM900B Using AT Command AT command “AT+CPOWD=1”can be use to turn off the module. This command lets the module log off from the network and allows the module to enter into a secure state and save data before completely disconnecting the power supply. Before the completion of the switching off procedure the module will send out result code: NORMAL POWER DOWN After this moment, the AT commands can’t be executed. The module enters the POWER DOWN mode, only the RTC is still active. POWER DOWN can also be indicated by VDD_EXT pin, which is a low level voltage in this mode. Please refer to document [1] for detail about the AT command of “AT+CPOWD”. 3.4.2.3 Over-voltage or Under-voltage Automatic Shutdown The module will constantly monitor the voltage applied on the VBAT. If the voltage ≤ 3.2V, the following URC will be presented: UNDER-VOLTAGE WARNNING If the voltage ≥ 4.7V, the following URC will be presented: OVER-VOLTAGE WARNNING The uncritical voltage range is 3.1V to 4.8V. If the voltage > 4.8V or < 3.1V, the module will be automatic shutdown soon. If the voltage < 3.1V, the following URC will be presented: UNDER-VOLTAGE POWER DOWN If the voltage > 4.8V, the following URC will be presented: OVER-VOLTAGE POWER DOWN After this moment, no further more AT commands can be executed. The module logs off from network and enters POWER DOWN mode, and only the RTC is still active. POWER DOWN can also be indicated by VDD_EXT pin, which is a low level voltage in this mode. 3.4.2.4 Over-temperature or Under-temperature Automatic Shutdown The module will constantly monitor the temperature of the module, if the temperature > +80 , the following ℃URC will be presented: +CMTE:1 If the temperature < -30 , the following URC will be presented:℃ +CMTE:-1 The uncritical temperature range is -40 to ℃+85 . If the temperature ℃> +85 or ℃< -40 , the module will be ℃automatic shutdown soon. If the temperature >+ 85 , the following URC will be presented℃: +CMTE:2 If the temperature < -40℃, the following URC will be presented: +CMTE:-2 After this moment, the AT commands can’t be executed. The module logs off from network and enters POWER SIM900B_HD_V1.03 24.06.2010 27

SIM900B Hardware Design DOWN mode, and only the RTC is still active. POWER DOWN can also be indicated by VDD_EXT pin, which is a low level voltage in this mode. To monitor the temperature, the “AT+CMTE” command can be used to read the temperature when the module is power on. For details please refer to document [1] 3.4.3 Restart SIM900B Using the PWRKEY Pin By driving the PWRKEY to a low level voltage for a short time and then release ,SIM900B can be restarted, the timing is the same as turning on SIM900B using the PWRKEY pin. Before restarting the SIM900B, you need delay at least 500ms from detecting the VDD_EXT low level on. The restarting scenario illustrates as the following figure. VDD_EXT（OUTPUT）HPWRKEY（INPUT）Delay > 500msTurn offPull down the PWRKEY to turn on the moduleRestart Figure 10: Timing of restart system 3.5 Power Saving There are two methods for the module to enter into low current consumption status. “AT+CFUN” is used to set module into minimum functionality mode and DTR signal can be used to control system enter or exit SLEEP mode (or slow clocking mode). 3.5.1 Minimum Functionality Mode Minimum functionality mode reduces the functionality of the module to a minimum and, thus, minimizes the current consumption to the lowest level. This mode is set with the “AT+CFUN” command which provides the choice of the functionality levels <fun>=0，1，4 z 0: minimum functionality; z 1: full functionality (default); z 4: disable phone both transmit and receive RF circuits; SIM900B_HD_V1.03 24.06.2010 28

SIM900B Hardware Design If SIM900B has been set to minimum functionality by “AT+CFUN=0”, the RF function and SIM card function will be closed. In this case, the serial port is still accessible, but all AT commands correlative with RF function or SIM card function will not be accessible. If SIM900B has been set by “AT+CFUN=4”, the RF function will be closed, the serial port is still active. In this case all AT commands correlative with RF function will not be accessible. After SIM900B has been set by “AT+CFUN=0” or “AT+CFUN=4”, it can return to full functionality by “AT+CFUN=1”. For detailed information about “AT+CFUN”, please refer to document [1]. 3.5.2 Sleep Mode (Slow Clock Mode) DTR signal can be used to control SIM900B module to enter or exit the SLEEP mode in customer applications When DTR is in high level and there is no on air and hardware interrupt (such as GPIO interrupt or data on serial port), SIM900B will enter SLEEP mode automatically. In this mode, SIM900B can still receive paging or SMS from network but the serial port is not accessible. Note: For SIM900B, it requests to set AT command “AT+CSCLK=1” to enable the sleep mode; the default value is 0, that can’t make the module enter sleep mode. For more details please refer to our AT command list. 3.5.3 Wake Up SIM900B from SLEEP Mode When SIM900B is in SLEEP mode, the following methods can wake up the module. z Enable DTR pin to wake up SIM900B. If DTR pin is pulled down to a low level，this signal will wake up SIM900B from power saving mode. The serial port will be active after DTR changed to low level for about 50ms. z Receiving a voice or data call from network to wake up SIM900B. z Receiving a SMS from network to wake up SIM900B. 3.6 Summary of State Transitions (except SLEEP mode) The following figure shows how to proceed from one mode to another. Normal ModeNormal Mode Power Down ModePower Down ModeAT+CPOWD or Drive PWRKEY to groundDrive PWRKEY to ground Figure 11: State Transition SIM900B_HD_V1.03 24.06.2010 29

SIM900B Hardware Design 3.7 RTC Backup The RTC (Real Time Clock) power supply of module can be provided by an external capacitor or a battery (rechargeable or non-chargeable) through the VRTC. Note: If the RTC function is enabled, a battery or capacitor should be connected with the VRTC pin. If this function is not needed, a 4.7uF capacitor is recommended to connect to the VRTC pin. The following figures show various sample circuits for RTC backup. RTCCore10KSIM900BVRTCNon-chargeableBackup Battery Figure 12: RTC supply from non-chargeable battery RTCCore10KSIM900BVRTCRechargeableBackup Battery Figure 13: RTC supply from rechargeable battery SIM900B_HD_V1.03 24.06.2010 30

SIM900B Hardware Design RTCCore10KSIM900BVRTC Large-capacitance Capacitor Figure 14: RTC supply from capacitor z Li-battery backup Coin-type Rechargeable Capacitor such as XH414H-IV01E form Seiko can be used. Typical charge curves for each cell type are shown in following figures. Note that the rechargeable Lithium type coin cells generally come pre-charged from the vendor. Figure 15: Seiko XH414H-IV01E Charge Characteristic 3.8 Serial Interfaces Table 7: Pin definition of the serial interfaces SIM900B_HD_V1.03 24.06.2010 31

SIM900B Hardware Design Name Pin Function DCD 28 Data carrier detection DTR 38 Data terminal ready RXD 40 Receive data TXD 42 Transmit data RTS 44 Request to send CTS 46 Clear to send Serial port RI 48 Ring indicator DBG_RXD 47 Receive data Debug port DBG_TXD 49 Transmit data SIM900B provides two unbalanced asynchronous serial ports. One is the serial port and the other is the debug port. The GSM module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. The module and the client (DTE) are connected through the following signal (as following figure shows). Autobauding supports baud rate from 1200bps to 57600bps. Serial port z TXD: Send data to the RXD signal line of the DTE z RXD: Receive data from the TXD signal line of the DTE Debug port z DBG_TXD: Send data to the RXD signal line of the DTE z DBG_RXD: Receive data from the TXD signal line of the DTE The logic levels are described in following table. Table 8: Logic levels of the serial port and debug port Parameter Min Max Unit VIL 0 0.15*VDD_EXT V VIH 0.85 *VDD_EXT VDD_EXT V VOL 0 0.1 V VOH VDD_EXT -0.1 VDD_EXT V SIM900B_HD_V1.03 24.06.2010 32

SIM900B Hardware Design TXDRXDRTSCTSDTRDCDRITXDRXDRTSCTSDTRDCDRINGMODULE (DCE) CUSTOMER (DTE)Serial port1Serial portDebug port Serial port2DBG_RXDBG_TX TXDRXD Figure 16: Connection of the serial interfaces 3.8.1 Function of serial port & debug port supporting Serial port z Modem device. z Contains data lines TXD and RXD, State lines RTS and CTS, Control lines DTR, DCD and RI. z Serial port can be used for CSD FAX, GPRS service and send AT command of controlling module. Also serial port can be used for multiplexing function. SIM900B supports only basic mode of multiplexing so far. z Serial port supports the communication rates as following: 1200, 2400, 4800, 9600, 19200, 38400, 57600 and 115200bps. z Autobauding supports baud rates as following: 1200, 2400, 4800, 9600, 19200, 38400, and 57600bps，the default setting is autobauding。 Autobauding allows the GSM engine to automatically detect the baud rate configured in the host application. The serial port of the GSM engine supports autobauding for the following baud rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600bps. Factory setting is autobauding enabled. This gives you the flexibility to put the GSM engine into operation no matter what baud rate your host application is configured to. To take advantage of autobauding mode, specific attention should be paid to the following requirements: Synchronization between DTE and DCE: When DCE powers on with the autobauding enabled, user must first send “A” to synchronize the baud rate. It is recommended to wait 2 to 3 seconds before sending “AT” character. After receiving the “OK” response, DTE and DCE are correctly synchronized. The more information please refer to the AT command “AT+IPR”. Restrictions on autobauding operation SIM900B_HD_V1.03 24.06.2010 33

SIM900B Hardware Design z The serial port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting). z The Unsolicited Result Codes like "RDY", "+CFUN: 1" and "+CPIN: READY” are not indicated when you start up the ME while autobauding is enabled. This is due to the fact that the new baud rate is not detected unless DTE and DCE are correctly synchronized as described above. Note: use “AT+IPR=x “to set a fixed baud rate and save the configuration to non-volatile flash memory. After the configuration is saved as fixed baud rate, the Unsolicited Result Codes like "RDY" should be received from the serial port all the time that the SIM900B is power on. Debug port z Null modem port z Only contain Data lines TXD and RXD z Debug Port used for debugging and upgrading firmware. It cannot be used for CSD call, FAX call. And the Debug port can not use multiplexing function. It does not support autobauding function. z Debug port supports the communication rates is 115200bps 3.8.2 Software Upgrade and Software Debug The DBG_TXD, DBG_RXD and GND must be connected to the IO connector when user need to upgrade software and debug software, the DBG_TXD, DBG_RXD should be used for software upgrade and for software debugging. The TXD and RXD also should be connected to the IO connector, if user wants to send AT command or data stream to SIM900B. The PWRKEY pin is recommended to connect to the IO connector. The user also can add a switch between the PWRKEY and the GND. The PWRKEY should be connected to the GND when SIM900B is upgrading software. Please refer to the following figure. MODULE(DCE) DBG_TXD DBG_RXD GND PWRKEYTXDRXDGNDPWRKEYSerial port I/O Connector Figure 17: Connection of software upgrade and software debug The serial port and the debug port don’t support the RS_232 level and it only supports the CMOS level. Please refer to the table 10 for details about the voltage level. You should add the level converter IC between the DCE and DTE, if you connect it to the computer. Please refer to the following figure SIM900B_HD_V1.03 24.06.2010 34

SIM900B Hardware Design Figure 18: RS232 level converter circuit 3.9 Audio Interfaces Table 9: Pin define of the Audio interface Name Pin Function MIC1P 53 Microphone1 input + MIC1N 55 Microphone1 input - SPK1P 54 Audio1 output+ (AIN1/AOUT1) SPK1N 56 Audio1 output- MIC2P 57 Microphone2 input + MIC2N 59 Microphone2 input - SPK2P 58 Audio2 output+ (AIN2/AOUT2) SPK2N 60 Audio2 output- The module provides two analogy input channels, AIN1 and AIN2, which may be used for both microphone and line inputs. The electret microphone is recommended when the interface is used for microphone. One of the two channels is typically used with a microphone built into a handset. The other channel is typically used with an external microphone or external line input. The module analogy input configuration is determined by control register settings and established using analogy multiplexes. For each channels, “AT+CMIC” can be used to adjust the input gain level of microphone, “AT+SIDET” can be SIM900B_HD_V1.03 24.06.2010 35

SIM900B Hardware Design used to set the side-tone level. In addition, “AT+CLVL” can be used to adjust the output gain level of both receiver and speaker at the same time, use AT+CHFA to activate one of the two audio channels and deactivate the other one.. For more details, please refer to document [1]. Note: Use AT command AT+CHFA to select_audio channel: 0— AIN1/AOUT1 (normal audio channel), the default value is 0. 1— AIN2/AOUT2(aux_audio channel) . It is suggested that you adopt one of the following two matching circuits in order to improve audio performance. The difference audio signals have to be layout according to difference signal layout rules. As show in following figures (Note: all components package are 0603.) If an amplifier circuit for audio is needed, then National company’s LM4890 is recommended. Of course it can select it according to your requirement. 3.9.1 Speaker Interface Configuration Figure 19: Speaker interface configuration Figure 20: Speaker interface with amplifier configuration SIM900B_HD_V1.03 24.06.2010 36

SIM900B Hardware Design 3.9.2 Microphone Interfaces Configuration 10pF 33pF33pF33pFClose to MicrophoneMICxPMICxNGNDGNDDifferential layoutAGNDMODULEElectret MicrophoneGNDGND10pF10pFGNDGNDESD ANTIESDANTIAGND Figure 21: Microphone interface configuration 3.9.3 Earphone Interface Configuration 1243AmphenolSPK2PMIC2NMIC2P1uF10R100R33pFGNDGNDGNDGNDClose to MODULEClose to SocketDifferential layout33pF 33pF33pF33pF 10pFGND GNDGNDGNDMODULEGNDGNDSPK2NGND Figure 22: Earphone interface configuration SIM900B_HD_V1.03 24.06.2010 37

SIM900B Hardware Design 3.9.4 Referenced Electronic Characteristic Table 10: MIC Input Characteristics Parameter Min Typ Max Unit Working Voltage 1.2 1.5 2.0 V Working Current 200 500 uA External Microphone Load Resistance 1.2 2.2 k Ohms Internal biasing DC Characteristics 2.5 V THD <1% at F=1KHz; pre-amp gain = 20 dB; PGA gain = 14 dB 15.9 mVrms Differential input voltage THD <5% at F=1KHz;pre-amp gain = 0 dB; PGA gain = 0 dB 740 mVrms Table 11: Audio Output Characteristics Parameter Conditions Min Typ Max Unit load Resistance 27 32 - Ohm Biasing voltage 1.4 V Output swing Voltage(single) 1.1V Vpp Output swing Voltage(differential) 2.2 Vpp RL=32 Ohm THD=0.1% - 91 - mW Normal Output(SPK1P/1N) RL=32 Ohm THD=1% - 96 - mW load Resistance 27 32 - Ohm Biasing voltage 1.4 V Normal Output(SPK2P/2N) Output swing Voltage(single) 1.1V V SIM900B_HD_V1.03 24.06.2010 38

SIM900B Hardware Design Output swing Voltage(differential) 2.2 V RL=32 Ohm THD=0.1% - 91 - mW RL=32 Ohm THD=1% - 96 - mW 3.10 Buzzer The BUZZER on the board-to-board connector can be used to drive a buzzer to indicate incoming call. The output volume of buzzer can be set by “AT+CRSL”. The reference circuit for buzzer shown as following figure: MODULE4.7K47KVBATBUZZER Figure 23: Reference circuit of Buzzer Table 12: Buzzer Output Characteristics Parameter Min Typ Max Unit Working Voltage 2.4 2.85 3.0 V Working Current 2 mA Load Resistance 1 k Ohms SIM900B_HD_V1.03 24.06.2010 39

SIM900B Hardware Design 3.11 SIM Card Interface 3.11.1 SIM Card Application The user can use AT Command to get information in SIM card. For more information, please refer to document [1]. The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM (intended for use with a SIM application Tool-kit). Both 1.8V and 3.0V SIM Cards are supported. The SIM interface is powered from an internal regulator in the module having normal voltage 3V. All pins reset as outputs driving low. Logic levels are as described in table Table 13: Pin define of the SIM interface Name Pin Function SIM_VDD 19 SIM Card Power output automatic output on SIM mode，one is 3.0V±10%, another is 1.8V±10%. Current is about 10mA. SIM_DATA 21 SIM Card data I/O SIM_CLK 23 SIM Card Clock SIM_RST 25 SIM Card Reset SIM_PRESENCE 16 SIM Card Presence Following is the reference circuit about SIM interface. We recommend an Electro-Static discharge device ST (www.st.com ) ESDA6V1W5 or ON SEMI (www.onsemi.com ) SMF05C for “ESD ANTI”. The 22Ω resistors showed in the following figure should be added in series on the IO line between the module and the SIM card for protecting the SIM I/O port. The pull up resistor (about 15KΩ) on the SIM_DATA line already added in the module. Note that the SIM peripheral circuit should be close to the SIM card socket. The SIM_PRESENCE pin is used for detecting the SIM card insert or removal. The user can use the AT command “AT+CSDT” to set the SIMCARD configuration. For detail of this AT command, please refer to document [1]: 8 pins SIM card holder can be selected . The reference circuit about 8 pins SIM card holder illustrates as following figure. SIM900B_HD_V1.03 24.06.2010 40

SIM900B Hardware Design MODULESMF05CSIM_VDDSIM_CLKSIM_DATASIM_RSTSIM_PRESENCEVCC GNDRST VPPCLK I/OPRESENCE GND22R22R22R220nF MOLEX-91228SIM CARD22pF Figure 24: Reference circuit of the 8 pins SIM card If the SIM card detection function don’t use, the SIM_PRESENCE pin can be keep open. The reference circuit about 6 pins SIM card illustrates as following figure. MODULESMF05CSIM_VDDSIM_CLKSIM_DATASIM_RST22pFVCC GNDRST VPPCLK I/O22R22R22R220nFC707 10M006 512 2SIM CARD Figure 25: Reference circuit of the 6 pins SIM card 3.11.2 Design Considerations for SIM Card Holder For 6 pins SIM card holder, we recommend to use Amphenol C707 10M006 512 2, the user can visit http://www.amphenol.com for more information about the holder. SIM900B_HD_V1.03 24.06.2010 41

SIM900B Hardware Design Figure 26: Amphenol C707 10M006 512 2 SIM card holder Table 14: Pin description (Amphenol SIM card holder) Pin Name Signal Description C1 SIM_VDD SIM Card Power supply, it can identify automatically the SIM Card power mode，one is 3.0V±10%, another is 1.8V±10%. Current is about 10mA. C2 SIM_RST SIM Card Reset. C3 SIM_CLK SIM Card Clock. C5 GND Connect to GND. C6 VPP Not connect. C7 SIM_DATA SIM Card data I/O. For 8 pins SIM card holder, Molex 91228 is recommended. The user can visit http://www.molex.com for more information about the holder. SIM900B_HD_V1.03 24.06.2010 42

SIM900B Hardware Design SIM900B_HD_V1.03 24.06.2010 43 Figure 27: Molex 91228 SIM card holder Table 15: Pin description (Molex SIM card holder) Pin Name Signal Description C1 SIM_VDD SIM Card Power supply, it can identify automatically the SIM Card power mode，one is 3.0V±10%, another is 1.8V±10%. Current is about 10mA. C2 SIM_RST SIM Card Reset C3 SIM_CLK SIM Card Clock C4 GND Connect to GND C5 GND Connect to GND C6 VPP Not connect C7 SIM_DATA SIM Card data I/O C8 SIM_PRESENCE Detect SIM Card Presence NOTE: the sim900B can support embedded SIM IC or embedded SIM card holder, but these functions aren’t included in the default version, please contact SIMCom for more details.

SIM900B Hardware Design 3.12 LCD Display Interface SIM900B provides a serial LCD display interface that supports serial communication with LCD device. When used as LCD interface, the following table is the pin definition. LCD interface timing should be united with the LCD device. Table 16: Pin define of the LCD interface Name Pin Function DISP_DATA 18 Display data output DISP_CLK 20 Display clock for LCD DISP_CS 22 Display enable DISP_D/C 24 Display data or command select DISP_RST 26 LCD reset Note: This function is not supported in the default firmware. There must be some customized firmware if you want. Please contact SIMCom for more details. 3.13 Keypad Interface The keypad interface consists of 5 keypad column outputs and 4 keypad row inputs. The basic configuration is 5 keypad columns and 4 keypad rows, giving 20 keys. Table 17: Pin define of the keypad interface Name Pin Function KBC0 27 GPIO4/KBC1 29 GPIO3/KBC2 31 GPIO2/KBC3 33 GPIO1/KBC4 35 Keypad matrix column GPIO9/KBR1 39 GPIO8/KBR2 41 GPIO7/KBR3 43 GPIO6/KBR4 45 Keypad matrix row The keypad interface allows a direct external matrix connection. A typical recommended circuit about the keypad is as shown in the following figure. SIM900B_HD_V1.03 24.06.2010 44

SIM900B Hardware Design KBR4KBR3KBR2KBR1KBC0KBC1KBC2KBC3KBC4GNDMODULE Figure 28: Reference circuit of the keypad interface *Note: 1. This function is not supported in the default firmware. There must be customized firmware if you want. Please contact SIMCom for more details. 2.KBR0&KBC0 is used to power off the module, so do not connect them for other application. 3. keypad is the second function of this pin , the default function is GPIO. 3.14 ADC SIM900B provides one auxiliary ADC (General purpose analog to digital converter.) as voltage input pin, which can be used to detect the values of some external items such as voltage, temperature etc. We can use AT command “AT+CADC” to read the voltage value on ADC. For detail of this AT command, please refer to document [1]. Table 18: ADC specification MIN Type MAX Units Voltage range 0 - 2.8 V ADC Resolution - 10 - bits Sampling rate - - 200K Hz SIM900B_HD_V1.03 24.06.2010 45

SIM900B Hardware Design 3.15 Behaviors of the RI Table 19: Behaviours of the RI State RI respond Standby HIGH Voice calling Change LOW, then: （1）Change to HIGH when establish calling. （2）Use AT command ATH, the RI pin changes to HIGH. （3）Sender hangs up, change to HIGH. Data calling Change LOW, then：（1）Change to HIGH when establish calling. （2）Use AT command ATH, the RI changes to HIGH. SMS When receive SMS, The RI will change to LOW and hold low level about 120 ms, then change to HIGH. URC Some URCs triggers 120ms low level on RI. For more details, please refer to document [10] If the module is used as caller, the RI will maintain high. However, when it is used as receiver, following is timing of ring. Power on Ring MO or MT Hang upRing Hang on(talking)MO or MTHang upRing RI HIGHLOW Figure 29: SIM900B Services as Receiver RIPower on calling Hang up Echo talking calling Echo Hang up HIGHLOW Figure 30: SIM900B Services as caller 3.16 Network Status Indication The NETLIGHT can be used to drive a network status indication LED lamp. The working state of this pin is listed in following table: SIM900B_HD_V1.03 24.06.2010 46

SIM900B Hardware Design Table 20: Working state of the NETLIGHT State SIM900B function Off SIM900B is not running 64ms On/ 800ms Off SIM900B does not find the network 64ms On/ 3000ms Off SIM900B find the network 64ms On/ 300ms Off GPRS communication The reference circuit is shown as the following figure: 300R4.7K47KMODULENETLIGHTVBAT Figure 31: Reference circuit of NETLIGHT SIM900B_HD_V1.03 24.06.2010 47

SIM900B Hardware Design 3.17 General Purpose Input Output (GPIO) SIM900B provides a limited number of General Purpose Input/Output signal pin. Name Pin Function RESET GPIO0 32 Input pull down GPIO1/KBC4 35 Input pull down GPIO2/KBC3 33 Input pull down GPIO3/KBC2 31 Input pull down GPIO4/KBC1 29 Input pull down GPIO6/KBR4 45 Input pull down GPIO7/KBR3 43 Input pull down GPIO8/KBR2 41 Input pull down GPIO9/KBR1 39 General Purpose Input/Output PortInput pull down Table 21: Pin define of the GPIO interface Note: This function is not supported in the default firmware. There must be special firmware if you require. Please contact SIMCom for more details . SIM900B_HD_V1.03 24.06.2010 48

SIM900B Hardware Design 4 Antenna Interface The RF interface has an impedance of 50Ω. To suit the physical design of individual applications, SIM900B offers alternatives: z Recommended approach: antenna connector on the component side of the PCB z Antenna pad and grounding plane placed on the bottom side. Figure 32 : The RF interface of module The antenna can be soldered to the pad, or attached via contact springs. To help you to ground the antenna, SIM900B comes with a grounding plane located close to the antenna pad. SIM900B material properties: SIM900B PCB Material: FR4 Antenna pad: Gold plated pad To minimize the loss on the RF cable, it need be very careful to choose RF cable. We recommend the insertion loss should be meet following requirements: z GSM900<1dB z DCS1800/PCS1900<1.5dB SIM900B_HD_V1.03 24.06.2010 49

SIM900B Hardware Design 4.1 Module RF Output Power Table 22: SIM900B conducted RF output power Frequency Max Min GSM850 33dBm ±2db 5dBm±5db EGSM900 33dBm ±2db 5dBm±5db DCS1800 30dBm ±2db 0dBm±5db PCS1900 30dBm ±2db 0dBm±5db 4.2 Module RF Receive Sensitivity Table 23: SIM900B conducted RF receive sensitivity Frequency Receive sensitivity（Typical） Receive sensitivity(Max) GSM850 -109dBm -107dBm EGSM900 -109dBm -107dBm DCS1800 -109dBm -107dBm PCS1900 -109dBm -107dBm 4.3 Module Operating Frequencies Table 24: SIM900B operating frequencies Frequency Receive Transmit GSM850 869 ～ 894MHz 824 ～ 849 MHz EGSM900 925 ～ 960MHz 880 ～ 915MHz DCS1800 1805 ～ 1880MHz 1710 ～ 1785MHz PCS1900 1930 ～ 1990MHz 1850 ～ 1910MHz 5 Electrical, Reliability and Radio Characteristics 5.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 28 are stress ratings under non-operating conditions. Stresses beyond any of these limits will cause permanent damage to SIM900B. SIM900B_HD_V1.03 24.06.2010 50

SIM900B Hardware Design Table 25: Absolute maximum ratings Parameter Min Max Unit VBAT - 5.5 V Peak current of power supply 0 3.0 A Voltage at digit pins* -0.3 3.1 V II* - 10 mA IO* - 10 mA *For digital interface pins, such as keypad, GPIO, UART and LCD. 5.2 Operating Temperatures The operating temperature is listed in following table: Table 26: SIM900B operating temperature Parameter Min Typ Max Unit Ambient temperature -30 +25 +80 ℃ Restricted operation* -40 to -30 +80 to +85 ℃ Storage temperature -45 +90 ℃ * The SIM900B does work, but deviations from the GSM specification may occur. 5.3 Power Supply Ratings Table 27: SIM900B power supply ratings Parameter Description Conditions Min Typ Max Unit Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. 3.1 4.0 4.8 V VBAT Voltage drop during transmit burst Normal condition, power control level for Pout max 300 mV SIM900B_HD_V1.03 24.06.2010 51

SIM900B Hardware Design Voltage ripple Normal condition, power control level for Pout max @ f<200kHz @ f>200kHz 50 2 mV POWER DOWN mode SLEEP mode(BS-PA-MFRMS=2 ) (BS-PA-MFRMS=5 ) (BS-PA-MFRMS=9 ) 50 1.5 1.2 1.0 uA mA mA mA IDLE mode GSM 850 EGSM 900 DCS1800 PCS1900 22 22 22 22 mA TALK mode GSM 850 EGSM 900 DCS1800 PCS1900 235 247 181 170 mA DATA mode, GPRS (3 Rx,2Tx) GSM 850 EGSM 900 DCS1800 PCS1900 436 463 322 303 mA IVBAT Average supply current DATA mode, GPRS (4 Rx,1Tx) GSM 850 EGSM 900 DCS1800 PCS1900 270 282 215 205 mA Peak supply current (during Tx burst) Power control level for Pout max. 2.0 A 5.4 Current Consumption Please refer to the following table for the values of current consumption. Table 28: SIM900B current consumption（VBAT=3.8V） SIM900B_HD_V1.03 24.06.2010 52

SIM900B Hardware Design Voice Call GSM 850/EGSM 900 @power level #5 <300mA,Typical 250mA @power level #12,Typical 110mA @power level #19,Typical 80mA DCS 1800/PCS 1900 @power level #0 <200mA,Typical 180mA @power level #7,Typical 94mA @power level #15,Typical 76mA GPRS Data DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 8 GSM 850/EGSM 900 @power level #5 <300mA,Typical 235mA @power level #12,Typical 102mA @power leve#19,Typical 74mA DCS 1800/PCS 1900 @power level #0 <200mA,Typical 170mA @power level #7,Typical 90mA @power level #15,Typical 70mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 10 GSM 850/EGSM 900 @power level #5<450mA,Typical 440mA @power level #12,Typical 185mA @power level #19,Typical 125mA DCS 1800/PCS 1900 @power level #0 <350mA,Typical 320mA @power level #7,Typical 155mA @power level #15,Typical 120mA DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 8 GSM 850/EGSM 900 @power level #5 <300mA,Typical 273mA @power level #12,Typical 145mA @power level #19,Typical 120mA DCS 1800/PCS 1900 @power level #0<300mA,Typical 205mA @power level #7,Typical 130mA @power level #15,Typical 110mA Class 10 is default set when the module works at data translation mode, the module can also work at class 8 set by AT command. 5.5 Electro-Static Discharge The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Therefore, it is subject to ESD handing precautions that typically apply to ESD sensitive components. Proper ESD handing and packaging procedures must be applied throughout the processing, handing and operation of any application using a SIM900B module. The measured values of SIM900B are shown as the following table: Table 29: The ESD endure statue measured table (Temperature: 25 , Humidity:45% )℃ SIM900B_HD_V1.03 24.06.2010 53

SIM900B Hardware Design Part Contact discharge Air discharge VBAT ±5KV ±10KV GND ±5KV ±10KV RXD, TXD ±2KV ±8KV Antenna port ±5KV ±10KV SPK_P/N MIC_P/N ±4KV ±8KV PWRKEY ±2KV ±8KV Other port TBD TBD SIM900B_HD_V1.03 24.06.2010 54

SIM900B Hardware Design 6 Mechanics This chapter describes the mechanical dimensions of SIM900B. 6.1 Mechanical Dimensions of SIM900B Following shows the Mechanical dimensions of SIM900B (top view, side view and bottom view). Figure 33: Top an Side Mechanical dimensions of module （Unit: mm） SIM900B_HD_V1.03 24.06.2010 55

SIM900B Hardware Design Figure 34：Mechanical dimensions of module PCB decal（Unit: mm） 6.2 Top View of the SIM900B Figure 35: Top view of the SIM900B SIM900B_HD_V1.03 24.06.2010 56

SIM900B Hardware Design 6.3 Mounting SIM900B onto the application platform Use the connector SUNCAGEY BB530-06001-20R to fix the SIM900B onto the customer platform 6.4 Board-to-board connector We recommend to use SUNCAGEY Company’s BB530-06001-20R as the board-to-board connector. They are fully compatible each other. This high density SMT connector is designed for parallel PCB-to-PCB applications. It is ideal to use in VCRs, notebook PCs, cordless telephones, mobile phones, audio/visual and other telecommunications equipment where reduced size and weight are important. Following is parameter of BB530-06001-20R. For more details, you can login http://www.suncagey.com for more information. 6.4.1 Mechanical dimensions of the SUNCAGEY BB530-06001-20R Figure 36: SUNCAGEY BB530-06001-20R board-to-board connector SIM900B_HD_V1.03 24.06.2010 57

SIM900B Hardware Design Figure 37 Board-to-board connector physical photo SIM900B_HD_V1.03 24.06.2010 58

SIM900B Hardware Design 6.5 RF connector The RF connector in module side is a ultra small surface mount coaxial connectors (Part Number: U.FL-R-SMT, vended by HRS). It has high performance with wide frequency range, surface mountable and reflows solderable. Following is parameter (Figure 36). Certainly the user can visit http://www.hirose-connectors.com/ for more information. To get good RF performance in customer’s design, we suggest the customer to use the matching RF adapter cable which is also supplied by HRS (Part Number: U.FL-LP（V）-040), the following figure 41 is the dimensions of U.FL series RF adapter cable. The customer can get it from the cable’s manufacturer HRS, and for details, please visit http://www.hirose-connectors.com/. Unit:mm Figure 38: U.FL-R-SMT SIM900B_HD_V1.03 24.06.2010 59

SIM900B Hardware Design Unit:mm Figure 39: U.FL series RF adapter cable SIM900B_HD_V1.03 24.06.2010 60

SIM900B Hardware Design 6.6 PIN Assignment of SIM900B Table 30: PIN assignment PIN NO. PIN NAME I/O PIN NO. PIN NAME I/O 1 VBAT I 2 VBAT I 3 VBAT I 4 VBAT I 5 VBAT I 6 VBAT I 7 VBAT I 8 VBAT I 9 GND 10 GND 11 GND 12 GND 13 GND 14 GND 15 VRTC I/O 16 SIM_PRESENCE I 17 VDD_EXT O 18 DISP_DATA I/O 19 SIM_VDD O 20 DISP_CLK O 21 SIM_DATA I/O 22 DISP_CS O 23 SIM_CLK O 24 DISP_D/C O 25 SIM_RST O 26 DISP_RST O 27 KBC0 O 28 DCD O 29 GPIO4/KBC1 I/O 30 NETLIGHT O 31 GPIO3/KBC2 I/O 32 GPIO0 I/O 33 GPIO2/KBC3 I/O 34 PWRKEY I 35 GPIO1/KBC4 I/O 36 BUZZER O 37 KBR0 I 38 DTR I 39 GPIO9/KBR1 I/O 40 RXD I 41 GPIO8/KBR2 I/O 42 TXD O 43 GPIO7/KBR3 I/O 44 RTS I 45 GPIO6/KBR4 I/O 46 CTS O 47 DBG_RXD I 48 RI O 49 DBG_TXD O 50 AGND 51 AGND 52 ADC0 I 53 MIC1P I 54 SPK1P O 55 MIC1N I 56 SPK1N O 57 MIC2P I 58 SPK2P O 59 MIC2N I 60 SPK2N O SIM900B_HD_V1.03 24.06.2010 61

SIM900B Hardware Design Contact us: Shanghai SIMCom Wireless Solutions Ltd. Add: SIM Technology Building，No.633，Jinzhong Road，Changning District，Shanghai P.R. China 200335 Tel: +86 21 3235 3300 Fax: +86 21 3235 3301 URL: www.sim.com/wm SIM900B_HD_V1.03 24.06.2010 62

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