Sony BE001012 CDMA 800 & 1900 MHz/AMPS User Manual Part 90

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Rhein Tech Laboratories, Inc.
360 Herndon Parkway
Suite 1400
Herndon, VA 20170
http://www.rheintech.com
APPENDIX I:
Client: Sony Ericsson Mobile Communications
Model: CM-52 (0.6W)
Standards: FCC Pt 22, 24/IC RSS-129/-133
Report Number: 2005084
Date: August 3, 2005
USER MANUAL
Please refer to the following pages.
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CM52 Integrator's Manual
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Table of Contents
Introduction to the Integrator’s Manual
1.1
OVERVIEW
1.2
HOW TO READ THE MANUAL
1.3
SERVICE AND SUPPORT
1.3.1
WEB PAGES
1.4
RELATED DOCUMENTS
1.5
ABBREVIATIONS
Integrating the CM52 Module
2.1
OVERVIEW
2.2
MECHANICAL DESCRIPTION
2.2.1
MECHANICAL DIMENSIONS
2.2.2
HEAT-SINK REQUIREMENTS
2.2.3
MOUNTING HOLES
2.3
SYSTEM CONNECTOR INTERFACE
2.3.1
MECHANICAL OVERVIEW
2.3.2
PINOUT
2.3.3
LOGIC LEVELS
2.4
POWER SUPPLY
2.4.1
POWER SUPPLY AND GROUND SIGNALS
2.4.1.1
2.4.1.2
2.4.2
2.4.2.1
2.4.2.2
2.4.2.3
POWER SUPPLY SIGNAL PINS
GROUND SIGNAL PINS
POWER CONSUMPTION
WAKEUP-INRUSH CURRENT
CONTACT-INRUSH CURRENT
POWER DOWN MODE (MINIMUM DC POWER CONSUMPTION)
2.4.3
VREF REQUIREMENTS
2.4.4
REAL TIME CLOCK (RTC) CIRCUIT
2.5
AUDIO INTERFACE
2.5.1
DIGITAL AUDIO
2.5.1.1
2.5.1.2
DATA FORMAT
TIMING
10
10
11
12
12
12
12
13
13
16
16
16
16
17
17
18
18
18
2.5.2
ANALOG AUDIO
2.6
SERIAL DATA INTERFACE
2.7
ANTENNA INTERFACE
2.7.1
ANTENNA CONNECTOR
2.7.2
RF OUTPUT POWER
2.7.3
CARRIER APPROVAL
2.7.4
ANTENNA DIAGNOSTICS
20
23
24
24
26
26
26
Recommended Circuitry
3.1
STATUS GROUP RECOMMENDED CIRCUITRY
3.1.1
MODULE_PWR_EN_B
3.1.2
VREF
3.1.3
HW_SD
3.2
DATA GROUP RECOMMENDED CIRCUITRY
3.2.1
VPPFLASH/DCD
3.3
PCM GROUP RECOMMENDED CIRCUITRY
3.4
ANALOG AUDIO GROUP RECOMMENDED CIRCUITRY
3.4.1
CREATING AN ANALOG GROUND
3.4.2
CREATING AN ANALOG REFERENCE VOLTAGE (BIAS)
3.4.3
ANALOG GROUND VS. AGND
3.4.4
MICROPHONE PATH
3.4.5
LOUDSPEAKER PATH
3.5
SYSTEM CONNECTOR IO FUNCTIONALITY
28
28
29
29
29
30
31
32
33
33
33
34
34
35
36
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Functional Description
Hints for Integrating the Module
5.1
PRECAUTIONS
5.2
WHERE TO INSTALL THE MODULE
5.3
SAFETY STANDARDS
5.4
ANTENNA
5.4.1
ANTENNA TYPE
5.4.2
ANTENNA PLACEMENT
5.5
POSSIBLE COMMUNICATION DISTURBANCES
Technical Data
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Tables
TABLE 1: SYSTEM CONNECTOR AND M ATING PART NUMBERS ........................................................................................................ 10
TABLE 2: PIN-OUT OF THE SYSTEM CONNECTOR HEADER .............................................................................................................. 11
TABLE 3: CMOS OUTPUT / INPUT ELECTRICAL CHARACTERISTICS ................................................................................................ 12
TABLE 4: CM52 POWER SUPPLY REQUIREMENTS.......................................................................................................................... 12
TABLE 5: CM52 POWER SUPPLY SIGNALS .................................................................................................................................... 13
TABLE 6: CM52 GROUND SIGNALS ............................................................................................................................................... 13
TABLE 7: VCC_AUX SUPPLY POWER CONSUMPTION ................................................................................................................... 14
TABLE 8: VCC_MAIN SUPPLY POWER CONSUMPTION .................................................................................................................. 15
TABLE 9: VREF SUPPLY DETAILS ................................................................................................................................................. 16
TABLE 10: CM52 AUDIO SIGNALS................................................................................................................................................. 17
TABLE 11: CM52 DIGITAL AUDIO SIGNALS.................................................................................................................................... 18
TABLE 12: PCM TIMING PARAMETERS .......................................................................................................................................... 19
TABLE 13: CM52 ANALOG AUDIO SIGNALS................................................................................................................................... 20
TABLE 14: AUDIO CHARACTERISTICS ............................................................................................................................................ 20
TABLE 15: SERIAL DATA CHANNELS ............................................................................................................................................. 23
TABLE 16: MOBILE STATION NOMINAL ANALOG POWER LEVELS .................................................................................................... 26
TABLE 17: MOBILE STATION CDMA M AXIMUM OUTPUT POWER .................................................................................................... 26
TABLE 18: PIN DIRECTION FOR GENERAL PURPOSE SIGNALS......................................................................................................... 38
Figures
FIGURE 1: CM52 PRIMARY SIDE ..................................................................................................................................................... 7
FIGURE 2: CM52 SECONDARY SIDE ................................................................................................................................................ 7
FIGURE 3: MECHANICAL DIMENSIONS DRAWING............................................................................................................................... 8
FIGURE 4: 40-PIN SYSTEM CONNECTOR ........................................................................................................................................ 10
FIGURE 5: 40-PIN SYSTEM CONNECTOR PIN NUMBERING ............................................................................................................... 10
FIGURE 6: RTC FUNCTIONAL BLOCK DIAGRAM ............................................................................................................................. 17
FIGURE 8: PCM TIMING DIAGRAM ................................................................................................................................................. 19
FIGURE 9: COLOR AND KEYING FOR VARIOUS FAKRA CONNECTORS ............................................................................................. 24
FIGURE 10: ANTENNA DIAGNOSTIC CIRCUIT................................................................................................................................... 27
Revision History
Release
Date
PA1
PA2
PA3
PA4
PA5
PA6
05/07/2004
09/01/2004
11/17/2004
11/29/2004
12/1/2004
06/16/2005
Summary of Changes
Initial Draft
Formatting
Updated Chapters 1 & 2
Updated with review feedback
Updated the List of Tables and Figures
Current Consumption Table, RTC Block Diagram, Mechanical Drawing
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Introduction to the Integrator’s Manual
1.1
Overview
This manual is for use as a guide to the setup, installation, and use of the CM52 module
into your application. The module may be tested using the developer’s board, which is
supplied together with all the necessary tools in the Developer’s Kit.
1.2
How to read the manual
This manual is divided into six chapters:
Chapter 1 gives a general view of the integrator’s manual. A list of related documents
as well as a list of abbreviations, used throughout the manual, is also included.
Information concerning service and support is also presented.
Chapter 2 focuses on helping the hardware developer to integrate the CM52 hardware
into their application. An overview of the mechanical and electrical information is
provided. Also, interface specifications, RF output power, and power supply issues are
included in this chapter.
Chapter 3 contains information on recommended circuitry needed to ensure proper
performance from the CM52 module.
Chapter 4 describes several of the common cellular functions available with the CM52.
Chapter 5 provides some hints for integrating the module.
Chapter 6 provides a summary of the technical data for the CM52 module.
1.3
Service and Support
1.3.1
Web Pages
Please look at our web page for more information about where you can buy our
modules or for recommendations of accessories and components. The address is:
http://www.sonyericsson.com/m2m
To register for product news and announcements or for product questions, contact the
Sony Ericsson modules technical support group:
• Telephone: 919-472-1122
• Email: M2Msupport.Americas@sonyericsson.com
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Related Documents
CM52 AT Command Manual – Details the AT command interface for the CM52
The CM52 is based upon the following mobile standards:
• IS-2000 Release 0 (1XRTT), MOB_P_REV – CDMA protocol
• TIA/EIA/IS-91 – Mobile Station – Base Station Compatibility Standard for 800
MHz Analog Cellular
• TIA/EIA-98-D – Recommended Minimum Performance Standards for Dual-Mode
Spread Spectrum Mobile Stations
1.5
Abbreviations
AGND
AMPS
AT
CDMA
CTS
DCD
DFMS
DTMS
DTR
EMI
ESD
GND
IRA
LSB
ME
MO
MS
MT
OEM
PCB
PCM
PIN
RD
RF
RTS
SMS
TD
Analog Reference
Advanced Mobile Phone System
Attention Command
Code Division Multiple Access
Clear to Send
Data Carrier Detect
Data from Mobile Station
Data to Mobile Station
Data Terminal Ready
Electromagnetic Interference
Electrostatic Discharge
Chassis GrouND
International Reference Alphabet
Least Significant Bit
Mobile Equipment
Mobile Originated
Mobile Station
Mobile Terminated
Original Equipment Manufacturer
Printed Circuit Board
Pulse Code Modulation
Personal Identification Number
Receive Data, also known as DFMS
Radio Frequency
Request to Send
Short Message Service
Transmit Data, also know as DTMS
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Integrating the CM52 Module
2.1
Overview
The CM52 is a dual band, dual mode CDMA transceiver module. It operates in the 800
MHz band for CDMA and AMPS and in the 1900 MHz band for CDMA. It is designed
for consumer and OEM industrial voice and data applications.
The CM52 module is intended for mounting into an application developer’s chassis to
provide wireless communication capability for the product. The target chassis could be
in a wide variety of forms such as a residential electric meter, a point of sale terminal,
an alarm panel, or an automobile console. All initial configuration, mode control, and
operational commands are issued to the module over an RS-232 serial port using a
flexible AT command format. The module circuitry has been designed to meet the
environmental requirements of a large range of commercial and industrial users.
2.2
Mechanical Description
The CM52 has no mechanical elements other than the main PCB assembly. All critical
electronic components are shielded using six cans to prevent internal and external
electromagnetic interference from degrading the module’s performance and to prevent
the module from interfering with other nearby devices. The module is plugged into the
fixed mating connector and secured with four screws.
The antenna interface is provided via a board mounted RF connector at the opposite
end of the board from the system connector. See Section 2.8 for more information on
antenna connector options.
The module has no keypad, display, microphone, speaker, or battery. The following
figures show a mechanical drawing and physical dimensions of the module.
Note! All the measurements are in millimeters.
Figure 1: CM52 Primary Side
Figure 2: CM52 Secondary Side
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Mechanical Dimensions
Figure 3: Mechanical Dimensions Drawing
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Heat-Sink Requirements
The application is required to provide a heat-sink for the 3W AMPS capabilities of the
CM52.
The application should be designed to provide a heat sink with a thermal resistance of
4.0 oC/W.
For applications that disable the 3W mode (Class I) and only operate in 0.6W mode
(Class III) a heat-sink is not required.
2.2.3
Mounting Holes
Mounting holes and tabs are provided for proper mechanical support of the CM52
module in the customer’s application. OEM application must provide sufficient
mechanical retention using the mounting holes and/or tabs or some other means. The
system connector and RF connector connections should not be used as a means of
mechanical support. Also, please note that the mounting holes may not substitute for
the actual grounding pins provided via the system connector.
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2.3
System Connector Interface
2.3.1
Mechanical Overview
External interfaces to the module are made primarily through a 40 pin, standard 0.050inch pitch, ODU header show below.
Figure 4: 40-Pin System Connector
Figure 5: 40-Pin System Connector Pin Numbering
Description
ODU Part Number
System Connector
515.569.035.140.xxx
Mating Ribbon Connector
525.060.035.040.xxx
SMT Mating Header
525.041.035.040.xxx
Ribbon cable, AWG 30
921.659.031.040.000
Dimension A
Dimension B
24.13 mm
22.86 mm
Table 1: System Connector and Mating Part Numbers
Please consult the ODU site for more information on mating options: http://www.odu.de
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Pinout
Pin
Signal
I/O_1 / Timemark
VREF
I/O_3 / GPS_FIX
I/O_4 / VRTC
10
11
GND
GND
AFMS
GND
AGND
ATMS
INPUT1 / UART3_RX
12
13
MODULE_PWR_EN_B
OUTPUT1 / UART3_TX
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
OUTPUT2
HW_SD
INPUT2
PCMCLK
PCMSYNC
PCMULD
PCMDLD
GND
GND
DCD / VPPFLASH
RINGER
CTS
DTR
TD
RTS
VCC_AUX
RD
VCC_AUX
VCC_AUX
VCC_MAIN
VCC_MAIN
SDA_SPI_IN
SCL_SPI_CLK
SYS_DTM_2
38
39
SPI_OUT
SYS_DFM_2
40
RI
Description
Reserved
1 PPS output from GPS chip
Logic Voltage Reference
Reserved
Logic HIGH signal to indicate active GPS Fix
Reserved
Supply pin for RTC and GPS regulators
Chassis Ground
Chassis Ground
Analog Audio from module
Chassis Ground
Analog Reference
Analog Audio to module
Reserved
Receive Data for UART3
Switches the module on/off (hardware-wise), active low
Reserved
Transmit Data for UART3
Reserved
Hardware shutdown
Reserved
PCM Clock output from Module to Application
PCM Frame sync from Module to Application
PCM Voice input to Module from Application
PCM Voice output from Module to Application
Chassis Ground
Chassis Ground
Data Carrier Detect & Flash programming voltage input
Ringer output
Clear to send
Data Terminal Ready
Transmit data, also known as DTMS
Request to Send
13.8 VDC supply input
Receive data, also known as DFMS
13.8 VDC supply input
13.8 VDC supply input
5 VDC regulated supply input
5 VDC regulated supply input
Reserved
Reserved
Transmit Data for UART2
Transmit Data for GPS
Reserved
Receive Data for UART2
Receive Data for GPS
Ring Indicator
Table 2: Pin-out of the System Connector Header
11(41)
Default function if GPS option on board.
Default function if RTC option on board
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Logic Levels
Many of the signals present in the interface are CMOS signals where the following
levels apply. The nominal voltage level for the CMOS signals is 2.9 V.
Limits
Test
Conditions
Min
Max
High level output voltage (IOH = 800 µA)
VOH
2.45
3.1
Volts
Low level output voltage (IOL = 800 µA)
VOL
0.45
Volts
High level input voltage (VIH = 800 µA)
VIH
1.9
3.1
Volts
Low level input voltage (VIL = 800 µA)
VIL
0.9
Volts
Parameters
Units
Table 3: CMOS Output / Input Electrical Characteristics
2.4
Power Supply
The CM52 requires a dual DC power supply implementation in the application.
VCC_MAIN provides power to the entire radio while VCC_AUX provides power for the
3-Watt functionality and biasing for the RF switches. VCC_AUX must be present if the
3W option is provided even if it is not used. If the 3W circuitry is not populated then
VCC_AUX is not required.
The following table summarizes the power supply requirements from the application.
Input Supply
Voltage
(Volts DC)
Max. Current (Amps)
Max. Ripple (mVpp)
Operation
0- 4KHz
4 KHz-10MHz
VCC_MAIN
5.00 ± 10%
1.0
100mVpp
50mVpp
VCC_AUX
13.8 ± 20%
1.3
600mVpp
240mVpp
VRTC(no GPS)
1.8 to 3.9
1.2 µ
VRTC(with GPS)
3.4 to 3.9
500 µ
Table 4: CM52 Power Supply Requirements
2.4.1
Power Supply and Ground Signals
2.4.1.1
Power Supply Signal Pins
Following is a list of the power supply pins:
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Pin
Signal
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Description
VRTC
29
VCC_AUX
13.8 volt ± 20%
31
VCC_AUX
13.8 volt ± 20%
32
VCC_AUX
13.8 volt ± 20%
33
VCC_MAIN
5 volt ± 10% regulated
34
VCC_MAIN
5 volt ± 10% regulated
1.8 V to 3.9V ( 3.4V to 3.9V if GPS mounted)
Table 5: CM52 Power Supply Signals
2.4.1.2
Ground Signal Pins3
The ground signal in the CM52 is Digital Ground, GND, connected to the system
connector interface through pin numbers 5, 6, 8, 21 and 22.
Following is a list of the ground pins:
Pin
Signal
Description
GND
Digital Ground
GND
Digital Ground
GND
Digital Ground
21
GND
Digital Ground
22
GND
Digital Ground
Table 6: CM52 Ground Signals
Digital Ground (GND) is the logical reference of all digital signals in the System
Interface as well as the DC return of the power supply signal, VCC_MAIN and
VCC_AUX (used for AMPS Class I operation). All 5 ground pins in the module need to
be connected to the application ground. The PCB mounting holes will not substitute the
regular ground connections.
2.4.2
Power Consumption
The following tables show typical and maximum currents that can be expected from the
module for various conditions.
Only applicable to units with GPS or RTC functions
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[VCC_AUX power supply supports the 3W mode AMPS circuitry]
Parameter
Minimum
Value
11
Typical
Value
13.8
Maximum
Value
16.6
Units
In a Call on Power Level 0
(Power Class I)
0.88
1.3
In a Call on Power Level 2
3.5
4.5
mA
AMPS Burst Duration for network
update
Stand-by/Idle mode (RX ON)
0.16
0.5
µA
Powered Down Current Draw
µA
Inrush Current (Entering PL0)
16
Duration of Inrush (Entering PL0)
40
µs
Inrush Current (contact)
28
Duration of Inrush (contact)
40
µs
Input Voltage
Table 7: VCC_AUX Supply Power Consumption
Note: The typical values observed in AMPS call are made with voice channel set at
358.
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[VCC_MAIN supply is the primary CM52 power supply]
Parameter
Minimum
Value
4.5
Input Voltage
Typical
Value
Maximum
Value
5.5
Units
In AMPS Call on Power Level 0
(Power Class I)
In AMPS Call on Power Level 2
0.59
0.75
0.83
1.0
In CDMA call-Cellular Mode
0.67
0.90
In CDMA call-PCS Mode
0.72
0.95
CDMA burst duration for Network
update
Standby/Idle Current Draw in
Slotted Mode (CDMA)
1.28 sec slot
1.2
9.6
mA
2.56 sec slot
7.2
mA
5.12 sec slot
4.5
mA
Stand-by/Idle mode (AMPS)
45
mA
Powered Down Current Draw
µA
2.2
150
2.0
50
µs
µs
Inrush Current (on wake up)
Duration of Inrush (on wake-up)
Inrush Current (contact)
Duration of Inrush (contact)
Table 8: VCC_MAIN Supply Power Consumption
Notes
1. The typical current measurements noted in CDMA mode are with the following
settings:
a. CDMA-Cellular (800MHz): Band = IS-2000, Cell-Power = -104dBm,
Channel Number 358
b. CDMA-PCS (1900MHz): Band = IS-2000, Cell-Power = -104dBm,
Channel Number 563
Maximum Slot Cycle Index for both 800MHz and 1900MHz modes = 1
2. The inrush current measurements noted here are with respect to the stand alone
CM52 module at room temperature, the results might vary when the CM52 is used
in the Customer Application.
3. Measurements are based on worst case scenario—CM52 with 3W option. Values
for CM52 with no 3W option could be marginally lower.
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Wakeup-Inrush Current
The wakeup inrush current occurs when the MODULE_PWR_EN_B signal transitions
from High to Low. The wakeup-inrush event occurs on the VCC_MAIN supply input and
not the VCC_AUX supply. The magnitude of the inrush is dependent on power supply
output impedance.
2.4.2.2
Contact-Inrush Current
The contact inrush current simulates application of power to the VCC_MAIN input lines
and measures the impact of the input impedance of the module.
While holding the MODULE_PWR_EN_B signal HIGH, a direct contact of VCC_MAIN
input pins to the output of the corresponding VCC_MAIN power supply is made and the
peak current measured. Similarly the contact inrush current of the VCC_AUX lines was
measured by making a direct contact of VCC_AUX pins to the output of the
corresponding VCC_AUX power supply.
2.4.2.3
Power Down Mode (Minimum DC Power Consumption)
In power down mode the module is placed in a low power consumption state under
control of the host application. In this mode, the unit consumes approximately 1 uA of
current as measured from the VCC_MAIN supply input and 1 uA of current as
measured from the VCC_AUX supply input. To activate this mode, the
Module_PWR_EN_B signal on pin 12 of the system connector is pulled to a logic level
1, which puts the module into the low power state. The module will stay in the low
power state until the Module_PWR_EN_B signal is driven low by an external open
collector transistor in the application circuitry. Turning the external open collector
transistor off will cause the Module_PWR_EN_B signal to float high and turn the module
off. The Module_PWR_EN_B line is tied to VCC_MAIN through a 220k pull-up
resistor so the sink current in the external open collector transistor is minimal.
2.4.3
VREF Signal Details
The following table defines the current sourcing capabilities and behavior of the VREF
signal.
Parameter
Supply Voltage Reference
Min
Typical
Max
Units
2.45
2.9
3.1
1000
µA
Output Current
Application Load
10
100
Rise Time
3300
µs
Fall Time
0.8
ms
Table 9: VREF Supply Details
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Real Time Clock (RTC) Circuit
The purpose of this section is to detail the design of incorporating the Real Time Clock
feature into the CM52.
UART
Ring Indicator
HW_SHDN
Radio
Module_PWR_EN_B
Application
RTC
(HH: MM)
Battery
Figure 6: RTC Functional Block Diagram
2.6
Audio Interface
The audio-related signals are: the analog audio signals
• ATMS (Audio to Mobile Station),
• AFMS (Audio from Mobile Station),
• PCM (Pulse Code Modulation) signals (PCMULD, PCMDLD, PCMCLK, and
PCMSYNC).
Pin
Signal
Description
AFMS
Audio Output From Module.
10
ATMS
Audio Input to Module.
AGND
Analog Reference
17
PCMCLK
18
PCMSYNC
19
PCMULD
PCM Voice Input to module
20
PCMDLD
PCM Voice Output from module.
PCM Clock Output from module.
PCM Frame Sync Output from module.
Table 10: CM52 Audio Signals
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Digital Audio
The CM52 provides digital audio capability over the system connector. The digital audio
signals enable the connection of a digital audio source. The receiver is bypassing the
analog audio processing functions performed within the module. The digital audio
interface includes the following PCM signals:
Pin
CM52
Description
17
PCMCLK
18
PCMSYNC
19
PCMULD
PCM Voice Input to module.
20
PCMDLD
PCM Voice Output from module.
PCM Clock Output from module.
PCM Frame Sync from module
Table 11: CM52 Digital Audio Signals
Already defined CMOS output/input electrical characteristics apply (see Section 2.3.3).
The PCM format (for PCMULD and PCMDLD) follows a linear PCM data format with
13-bit data embedded in a 16-bit word. The data bits in PCMULD (input) and PCMDLD
(output) are aligned so that the MSB in each word occurs on the same clock edge. See
timing diagram in 2.6.1.2.
2.6.1.1
Data Format
The CM-52 module implements a 13-bit PCM with the 13-bit data embedded in a 16-bit
word as follows.
Each PCM word shall contain 16-bits D15 – D00. D15 – D03 is the 2´s-complement
value of the 13-bit PCM, with D15 as the sign bit. D15 is the MSB while D03 is the LSB.
Note that the MSB is sent in first place. Ensure that the read data from PCMDLD is right
shifted three times and sign extended before being used
15
14 13 12 11 10
13-bit linear
8 7 6
MSB
2.6.1.2
LSB
Bit
D15
D03
D02
D00
Contents
–
Two complement of the 13-bit PCM.
–
Bits are undefined.
Timing
Timing shall be according to the following diagram (see Figure 7: PCM Timing
Diagram). The signals in the diagram shall be interpreted according to the following
relation.
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Figure 7: PCM Timing Diagram
The meaning and value of the timing parameters are described in Table 12.
Name
tSYNC
Description
Min
Typical
Max
Unit
PCM_SYNC cycle time.
125
µs
PCM_SYNC frequency
8.0
kHz
tSYNCA PCM_SYNC asserted time.
62.4
62.5
µs
tSYNCD PCM_SYNC de-asserted time.
62.4
62.5
µs
tSU(SYN
PCM_SYNC setup time to PCM_CLK rising.
1.95
µs
PCM_SYNC hold time after PCM_CLK
falling.
1.95
µs
C)
tH(SYNC)
tCLK
PCM_CLK cycle time.
7.8
µs
PCM_CLK frequency
128
kHz
tCLKH
PCM_CLK high time.
3.8
3.9
µs
tCLKL
PCM_CLK low time.
3.8
3.9
µs
tPDLD
Propagation delay from PCM_CLK rising to
PCM_DLD valid.
TSU(ULD
PCM_ULD setup time to PCM_CLK falling.
50
ns
70
ns
20
ns
TH(ULD) PCM_ULD hold time after PCM_CLK falling.
Table 12: PCM Timing Parameters
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Analog Audio
ATMS is the analog audio input to the module. When it is active, it is connected to the
radio via the audio processing stages in the module.
The AFMS is the analog audio output from the module. When it is active it is connected
to the radio via the audio processing stages in the module.
The AGND is the analog reference signal. ATMS and AFMS are referenced to this
signal, which is connected to GND in one place inside the module.
Pin
Signal
Description
AFMS
Audio Output From Module
10
ATMS
Audio Input To Module
AGND
Analog Reference
Table 13: CM52 Analog Audio Signals
Signal
Parameter
AFMS
Module audio output
Output Impedance
Drive capacity into 10 k
External Device audio input
impedance
Volume control
Sensitivity
ATMS
Sources are preferably AC
coupled.
External Device audio source
Output resistance
Module audio input impedance
Levels from external audio
source (maximum)
Sensitivity
300 – 3400 Hz
Rout 100
3.77 VP-P max. or 2.5 dBV
Zin 10 k
-81 dB from maximum > - 81 dB (mute)
1004 Hz tone at 8kHz deviation
generates 900+100 mVrms.
Cout 2.2uF
Rout
1.0 k
Zin 10 k
3.77 VP-P max. or 2.5 dBV
1004 Hz tone at 900+100 mVrms
generates 8kHz deviation.
Table 14: Audio Characteristics
Analog Reference (AGND)
• The AGND lead is the analog audio reference ground. It is the return signal for
Audio To Mobile Station (ATMS), Audio From Mobile Station (AFMS).
• Electrical characteristics: Imax < 40 mA (peak)
• The AGND is connected to the chassis Ground (GND) in the CM52 module, and
only there. The application should be connected to GND and only use AGND as
reference for the audio lines ATMS and AFMS.
• The PCM signals are referenced to digital ground.
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Application Implementation:
BIAS: An analog ground plane should be generated, which connects to GND in one
point so that high frequency digital current is not floating through the analog ground.
Connecting the analog ground in only one point also avoids ground currents from power
supplies and other high current circuitry from creating noise in the analog circuitry. The
voltage supply for the analog circuitry should connect its ground pin as close as
possible to the point where the analog ground connects to GND. The BIAS reference is
generated from this supply voltage and analog ground, and shall be used as a
reference for all analog circuitry in the application. Note that Analog Ground and AGND
are two different signals. Analog Ground is the ground plane used by the application. It
should be connected to the application’s GND in one point preferably at the regulator
that generates the analog supply voltage. AGND is the analog audio reference
received from the phone. This is a signal with the intent to be used together with ATMS
and AFMS as a semi differential interface between the module and the application.
VIN
Regulator
VCC
BIAS
GND
Analog Ground
ATMS: An application using the analog audio interface must re-reference the signal
from its own internal BIAS to AGND. The figure below shows an example of a
microphone implementation.
VCC
<=1k
>=2.2uF
ATMS
>=2.2uF
AGND
BIAS
The microphone should preferably be connected to its pre-amplifier differentially, which
will minimize noise pickup from possible ground current.
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AFMS: An application using the analog audio interface must re-reference the AFMSsignal from AGND to its own internal BIAS. The figure shows a differential
implementation. C1 is chosen to create the correct HP frequency response. R1 and R2
determine the gain, and C2 and R2 determine the LP frequency response.
C2
R2
AFMS
C1
R1
>=10k
Internal App +
AGND
C1
R1
>=10k
Internal App R2
C2
BIAS
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Serial Data Interface
The serial channels are used as asynchronous communication links between the
application system and the module. The following table shows the serial data channels
related signals:
Pin
23
Signal Description
DCD
Dir
Data Carrier Detect
This signal is set default high. It goes low indicating that a data call
is established (CONNECT received from the remote modem). The
signal goes high when the data connection is disconnected.
25
CTS
Clear To Send
This signal is initially set high, indicating that the module is not ready
to receive data. It is set low after the module is done performing its
startup procedure indicating that it is ready to receive data.
26
DTR
Data Terminal Ready
This signal should be set low by the application during a data call. A
low to high transition will terminate the data call.
27
TD
Transmit Serial Data To Module (DTMS)
The application shall set this signal high at startup.
28
RTS
Request To Send
The application shall set this pin low when it is ready to receive data.
30
RD
Receive Serial Data From Module (DFMS)
The module will set this signal high at startup.
Table 15: Serial Data Channels
The common CMOS electrical specifications defined in Section 2.3.3 are valid for all
these signals. The standard character format is 1 start bit, 8 data bits, non-parity and 1
stop bit. In all, there are 10 bits per character.
Note! The signal levels do not match the standard RS-232 (V.28). If the application
signal levels are not compatible with the CMOS levels described in Table 3: CMOS
Output / Input Electrical Characteristics, then electrical protection level limiters or
level conversion hardware will be necessary between the CM-52 module and the
application.
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Antenna Interface
The antenna interface of the CM52 consists of a single or dual RF connector for the
radio with optional antenna diagnostics, and a single RF connector for the optional GPS
function.
2.8.1
Antenna Connector
A variety of antenna connectors are available for the CM-52 module including SMA,
SMB, MCX, and BNC. A standard 5-pin, thru-hole pattern has been selected because
of the wide variety of compatible connectors available and also for the maximum
mechanical strength.
For automotive applications, a FAKRA-type connector is available which provides a
double locking mechanism as well as a keyed, color-coded interface as shown below:
Black
Natural
Blue
Violet
Green
Brown
Gray
Violet
Beige
Curry
Figure 8: Color and Keying for various FAKRA connectors
Waterblue
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The physical dimensions of a sample SMA connector and mounting hole are shown in
the drawing below.
Electrical performance parameters are valid only when the terminating impedance at
the output of the antenna connector exhibits a VSWR of less than 2:1 for all phase
angles in the frequency band of operation. High VSWR loads at the antenna connector
adversely affect current consumption, linearity, and power efficiency of the module and
may degrade operation; however, internal protection circuitry has been added to the
design to prevent damage.
The performance of the module as defined in Section 2.8.2 of this manual is referenced
to the antenna connector. The antenna connectors must not negatively affect the
performance of the CM52. For this reason, all options are discrete connectors and thus
do not include cable assemblies.
The table below lists several suppliers of antenna connectors that are available.
Description
Vendor / Part #
RF Connectors and cabling
ITT Cannon / Various
RF Connectors and cabling
Amphenol RF / Various
RF Connectors and cabling
Hirschmann / Various
Additional Information
http://www.ittcannon.com
http://www.amphenolrf.com
http://portal.hirschmann.com
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RF Output Power
The CM52 is able to operate in several modes and different output power level.
Applications may require output power levels similar to those in a handheld cellular
phone or higher levels commonly required in rural areas. The following tables show the
nominal power provided by the CM52.
Mobile Station Power Level (dBm)
Class I, AMPS
34.8
31
26.3
24
20
16
12
Class III, AMPS
26.3
26.3
26.3
24
20
16
12
Table 16: Mobile Station Nominal Analog Power Levels
Note: These numbers represent the Nominal Output Power4 in AMPS mode and are
referenced to the antenna connector. Analog output power levels are as defined for a
Power Class I device in Industry Specification EIA/TIA IS-91.
Mobile Station Power Level (dBm)
Lower Limit
Upper Limit
Class III, CDMA Band Class 0
23 dBm (0.2 Watts)
30 dBm (1.0 Watts)
Class II, CDMA Band Class 1
23 dBm (0.2 Watts)
30 dBm (1.0 Watts)
Table 17: Mobile Station CDMA Maximum Output Power
2.8.3
Carrier Approval
The CM52 will undergo carrier qualification. Approval of the CM52 is sought referenced
to the antenna connector. Any applications intending to use the CM52 will likely be
required to undergo similar testing with the CM52 integrated into the application. For
this reason it is strongly recommended that the application is designed to accommodate
exposing the antenna connector(s) of the CM52. This will help insure that the
qualification of the application with the carrier will be successful.
2.8.4
Antenna Diagnostics
The antenna diagnostics function consists of one antenna detection circuit per RF
connector. Each detection circuit can support antenna resistance (RL) values of 1 K
to 20 K and 49.9 K . Internal resistance (R) value is either 10 K or 49.9 K , as
required by the customer’s application.
AT commands are provided to query the status, query the limits and set the limits for
the status: GOOD, OPEN, or SHORTED. These commands are detailed in the CM52
Software User’s Guide and AT Command.
The drawing below is a high level description of the antenna diagnostics circuit.
PL0 and PL1 require VCC_AUX = 13.8V
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Figure 9: Antenna Diagnostic Circuit
The current antenna status is based on a comparison between the voltage measured at
the antenna connector and the limits set by the application for OPEN and SHORTED.
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Recommended Circuitry
Abbreviations:
• VCC
- Represents the logic supply voltage used by the application.
• VREF
- Current amplified reference voltage used as supply voltage for all logic
interface circuitry.
Component proposals:
• Transistors not showing a base resistor should be interpreted as a BRT (Built in
Resistor Transistor) i.e. Toshiba RN1308.
• The inverting buffers should preferably be Schmitt-Triggered, i.e. Toshiba TC7S14
or similar.
3.1
Status Group Recommended Circuitry
The status group contains four signals, one output signal from the application and three
input signals to the application.
Application
Phone Module
12, MODULE_PWR_EN_B
0 = Phone Module Power OFF
1 = Phone Module Power ON
5V
5V
0 -10 ohm
0 - 1k
2, VREF
1M
VREF
10uF
100
Shutdown Indicate
15, HW_SD
Shutdown Request
VCC
1 - 100k
VREF
Ring Indicator
40, RI
VCC
24, RINGER
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MODULE_PWR_EN_B
This signal, located on pin 12 in the system connector, enables the main 5V supply in
the phone module so that it powers on. This is an open collector input to the phone
module. Its reference voltage is the main 5V supply.
3.1.2
VREF
This signal, located on pin 2 in the system connector, provides the application with its
logic supply voltage. The application can current-amplify this signal and use it to supply
its interface circuits.
3.1.3
HW_SD
This signal, located on pin 15 in the system connector, provides the ability of performing
a hardware shutdown of the module. It is a bi-directional signal that is pulled up inside
the phone module.
Application
Phone Module
VREF
Shutdown
Indicate
Shutdown
Request
15, HW_SD
Shutdown
Detect
Shutdown
Confirm
Shut down sequence:
1 To request a shutdown of the phone module, the application should provide an
active low pulse of 100 ± 25 ms on the HW_SD pin through an open collector
output.
2 This pulse is detected by the module, which confirms the request by enabling its
HW_SD output, setting it active low.
3 The application waits for the HW_SD pin to become inactive high.
4 The module has performed its power down sequence and disables its output
resulting in HW_SD becoming inactive high.
5 The application shuts down, disabling MODULE_PWR_EN_B.
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HW_SD
Shutdown
Request
Shutdown
Confirm
MODULE_
PWR_EN_B
12
3.2
Data Group Recommended Circuitry
The data group contains six signals, three output signals from application, two input
signals to application, and one I/O signal.
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Phone Module
Application
VCC
1 - 100k
VREF
RxD
CTS
30, RD (DFMS)
25, CTS
VREF
VREF
27, TD (DTMS)
28, RTS
26, DTR
1 - 100k
TxD
RTS
DTR
VREF
VREF
1 - 100k
VPPFLASH_EN
VCC
1 - 100k
DCD
VREF
23, VPPFLASH/DCD
100k
3.2.1
VPPFLASH/DCD
This signal, located on pin 23 in the system connector, can be used by the application
to enable flashing of the phone module. To enter flash-mode, the application shall set
VPPFLASH_EN active high, then enable the MODULE_PWR_EN_B pin.
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PCM Group Recommended Circuitry
The PCM group contains four signals, three input signals to the application, and one
output signal from the application.
Application
Phone Module
VCC
PCM_IN
PCM_SYNC
PCM_CLK
1 - 100k
VREF
19, PCMULD
18, PCMSYNC
17, PCMCLK
VREF
1 - 100k
PCM_OUT
VREF
20, PCMDLD
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3.4
Analog Audio Group Recommended Circuitry
3.4.1
Creating an analog ground
An analog ground plane should be generated, which connects to GND in one point so
that high frequency digital current is not floating through the analog ground. Connecting
the analog ground in only one point avoids ground currents from power supplies and
other high current circuitry from creating noise in the analog circuitry. This common
point should be located where the analog supply voltage (VANA) is generated (at filter
(A), or regulator (B) depending on implementation).
12V
5V
3.4.2
Regulator
VANA
VANA
Creating an analog reference voltage (BIAS)
The BIAS reference should be generated from the analog supply voltage (VANA) and
be referenced to the analog ground. This reference shall be used to bias all analog
circuitry in the application.
VANA
100k
100k
BIAS
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The bias can be tapped directly from the resistor voltage divider, but the amplifier will
make the bias more stable and less susceptible to noise.
3.4.3
Analog ground vs. AGND
The AGND signal output from the module is not a ground. It is an analog reference,
which is connected to the main ground used by the module in one place inside the
module. It should not under any circumstances be used as a ground or connected to a
ground in the application.
AGND must be treated as a signal. Together with ATMS and AFMS it creates a semi
differential interface. The analog ground shall be used as ground plane for the analog
circuitry of the application. It should not be connected to the AGND signal output from
the phone module.
3.4.4
Microphone path
An application using the analog audio interface must re-reference the signal from its
own internal BIAS to AGND received from the module.
The figure below shows an example of a microphone implementation.
C3
VCC
C5
R1
R3
C2
R2
C2
R5
R4
R2
R4
<=1k
>=2.2uF
ATMS
R3
R5
R1
>=2.2uF
AGND
C3
BIAS
C5
The microphone should preferably be connected to its pre-amplifier differentially, which
will minimize noise picked up along the way from the microphone to its amplifier. If the
impedance is the same on both microphone lines, and the lines are run in parallel, the
same amount of noise is picked up on both lines. This noise is then removed in the
differential amplifier stage.
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Loudspeaker path
An application using the analog audio interface must re-reference the AFMS-signal from
AGND to its own internal BIAS. The figure shows a differential implementation. C1 is
chosen to create the correct HP frequency response. R1 and R2 determine the gain,
and C2 and R2 determine the LP frequency response.
C2
R2
AFMS
C1
R1
>=10k
Internal App +
AGND
C1
R1
>=10k
Internal App R2
C2
BIAS
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System connector IO functionality
Note 1: The application IO can be one of the following listed types:
• I
Logic input (no pull up or pull down resistors required).
• IOC
Logic open-collector input.
• O
Logic output (no pull up or pull down resistors required).
• OOC
Logic open-collector output.
• I/O
Logic I/O.
The pin direction in this table is referenced from the application’s point of view.
Group
Pin No
Name
Application Requirements
App I/O
HW flow control is by default enabled in the phone module.
27
TD (DTMS)
Logic output to phone module. The application shall set this
output high upon start-up.
30
RD (DFMS)
Logic input from phone module.
28
RTS
Logic output to phone module. Pulled down by the phone
module (R > 20k). The application shall set this pin low when
ready to receive data.
CTS
Logic input from phone module. This signal is initially set
high, indicating that the phone module is not ready to receive
data. It is set low when the phone module is ready to receive
data.
25
Logic output to phone module. This signal is pulled up in the
phone module (R > 20k).
This signal should be set low by the application during a data
call. A low to high transition will terminate the data call.
Data
26
DTR
23
VPPFLASH/DCD
This signal is asserted by the application when it wishes to
open a communications channel. The phone module then
prepares the modem to be connected to the telephone circuit,
and, once connected, maintains the connection. When DTR is
de-asserted, the phone module is switched to "on-hook" to
terminate the connection.
DCD: Logic input from phone module. This signal is set
default high. It goes low indicating that a data call is
established, (CONNECT) received from remote modem. The
signal goes high when data connection is disconnected.
Sent from the phone module (DCE) to the application (DTE) to
indicate that it has received a basic carrier signal from a
(remote) DCE.
VPPFLASH: The application shall not apply a voltage to this
pin unless they intend to use it as VPPFLASH in which case it
becomes a power output.
I/O
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Group
Pin No
PCM
Name
PA6
Application Requirements
App I/O
Logic output to phone module.
20
PCMDLD
Logic input from phone module.
18
PCMSYNC
Logic input from phone module.
PCMCLK
Logic input from phone module.
AGND
Analog
Audio
Analog reference. This signal is an analog reference
output by the phone module. This signal is connected
to GND in one place in the phone module. Under no
circumstances shall it be connected to any ground or
be used as ground in the application.
See 2.4 for more detailed information.
10
AUX1(ATMS)
Single ended audio output to phone module.
AUX0(AFMS)
Single ended audio input from phone module.
12
MODULE_PWR_EN_B
Logic open collector output that is set low by the
application to enable power to the phone module. The
pull-up resistor resides in the phone module.
OOC
VREF
Phone module logic voltage sense input to application.
This signal provides the application with the logic
system voltage level used by the phone module.
40
RI
This signal is used to indicate to the application of an
incoming voice or data call or SMS. The event is
indicated by the signals falling edge and remains low
for 100 ms.
24
RINGER5
Pulse Modulated logic input from phone module. The
application must provide power amplification if the
current draw is expected to exceed 1mA.
15
HW_SD
Bi-directional signal, default set to be an open collector
output from the application.
39
CFMS
No termination. Leave open.
37
CTMS
No termination. Leave open.
36
Reserved
No termination. Leave open.
IOC
35
Reserved
No termination. Leave open.
IOC
38
Reserved
No termination. Leave open.
IO_4_VRTC
No termination. Leave open.
I/O
IO_3_GPS_FIX
No termination. Leave open.
I/O
IO_1_TIMEMARK
No termination. Leave open.
I/O
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Unused
Document number
19
17
Status
37(41)
Not currently Implemented in the CM52.
OOC
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13
OUTPUT1
No termination. Leave open.
16
INPUT2
No termination. Leave open.
11
INPUT1
No termination. Leave open.
14
OUTPUT2
No termination. Leave open.
Table 18: Pin Direction for General Purpose Signals
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Functional Description
The CM52 module performs a set of telecom services according to TIA/EIA-IS-2000.
The functions of the display and keypad, usually used to make calls, are implemented
by issuing AT Commands over the serial interface.
See the CM52 Software User's Guide and AT Command Manual for a complete
functional description and user scenarios for the CM52.
Hints for Integrating the Module
This section, which gives you advice and helpful hints on how to integrate the CM-52
with the application, should be taken as a guide.
Note! The circuits on the test board are not shielded. Therefore, take proper
precautions for avoiding ESD and EMI.
5.1
Precautions
Here is a list of preparations that you should make before beginning the integration
work that is described in this section.
• Where to install the module.
• Safety standards
• Network and subscription
• Antenna
5.2
Where to Install the Module
Make sure that the module is installed so that the environmental conditions, such as
temperature, humidity, vibration, etc., are not beyond the limits specified for it.
Make sure that the signal strength is sufficient. To improve signal strength, move the
antenna to another position. Signal strength may depend on how close the module is to
a radio base station. Degradation in signal strength could be a result of disturbance
from another source, for example, an electronic device nearby.
You can verify signal strength by issuing the AT command AT+CSQ. See the CM52
Software User’s Guide and AT Command for a description of this and other useful AT
commands.
Tip! Before installing the module, use an ordinary mobile telephone to check a possible
location for it. Consider signal strength as well as cable length in determining the
location for the module and antenna. That way, you will find out if it is practical to install
the module where you intended.
5.3
Safety Standards
You are responsible for observing your country’s safety standards and the relevant
wiring rules, where applicable.
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5.4
Antenna
5.4.1
Antenna Type
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When choosing an antenna for your application you must consider the following
requirements:
• The antenna must be designed for the AMPS/CDMA 800 and CDMA 1900 MHz
frequency band (dual band) for the CM-52.
• The impedance of the antenna and antenna cable must be 50 .
• The VSWR value should be less than 2:1.
5.4.2
Antenna Placement
Always follow the instructions supplied by the antenna manufacturer.
You should place the antenna away from electronic devices or other antennas. The
recommended minimum distance between adjacent antennas operating in a similar
radio frequency band is at least 50 centimeters.
If the module is used in the Class I AMPS mode, a separation distance of at least 20
centimeters must be maintained between the radiating antenna and the user or nearby
persons. In this mode of operation, the combined connection cable path loss and
antenna gain must also be no greater than 1 dBi.
5.5
Possible Communication Disturbances
Noise can be caused by electronic devices and radio transmitters.
Free Space Path-loss occurs as the strength of the received signal steadily decreases
with the distance from the transmitter.
Shadowing is a form of environmental attenuation of radio signals that is caused by hills,
buildings, trees or even vehicles. Inside buildings this can cause problems, especially if
the walls are thick and reinforced.
Multi-path fading is a sudden decrease or increase in the signal strength. This is the
result of interference caused when direct and reflected signals reach the mobile phone
simultaneously. Flat surfaces such as buildings, streets, vehicles, etc, can reflect
signals.
Confidential
USERS MANUAL
41(41)
Document number
Revision
4/198 17-LXE 108 566 Uen
PA6
Technical Data
Mechanical specifications
Maximum length:
114 mm
Maximum width:
49.50 mm
Maximum thickness:
18.97 mm
Weight:
68.2 g
Power supply voltage, normal operation
VCC_MAIN
VCC_AUX
Nominal Voltage:
5.00 Volts
13.8 Volts
Voltage range:
4.50 – 5.50 Volts
11.0 – 16.5 Volts
Radio specifications
AMPS
CDMA (BC-0)
CDMA (BC-1)
Frequency range:
TX: 824 – 849
RX: 869 – 894
TX: 824 – 849
RX: 869 – 894
TX: 1850-1910
RX: 1930-1990
Antenna impedance:
50
50
50
VSWR (Maximum):
2:1
2:1
2:1
Environmental specifications
Operating temperature range:
-30°C to +70°C: EIA/TIA/IS-2000
+70°C to +85°C: –3dB Degradation beyond +70°C Spec
Storage temperature range:
-40 C to +85 C
Maximum relative humidity:
95% ± 3% at +40 C
Stationary vibration, random
Acceleration spectral density (m /s ): 0.96
Frequency range: 5-10 10-200 200-500
60 min per/axis
Non-stationary vibration, including shock
Shock response spectrum I, peak acceleration:
- 3 shocks in each axis and direction: 300 m/s , 11 ms
2.88
0.96
Shock response spectrum II, peak acceleration:
- 3 shocks in each axis and direction: 1000 m/s , 6 ms
Bump:
Acceleration 250 m/s
Free fall transportation:
1.0 m
Rolling pitching transportation:
Angle: 35 degrees, period: 8s
Static load:
10 kPa
Low air pressure/high air pressure:
70 kPa / 106 kPa

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