TCL Technoly Electronics 12 Bluetooth Module User Manual TBM A2823 Bluetooth Module Datasheet
TCL Technoly Electronics (Huizhou) Co., Ltd. Bluetooth Module TBM A2823 Bluetooth Module Datasheet
User Manual

Bluetooth    Module    Datasheet 
Model No.型号:TBM-A2823 
版本 Version:V1.0   
公布日期 Release Date: 2016-03-08 
TONLY ELECTRONICS HOLDINGS LIMITED.通力电子控股有限公司 
Address:Section 37, Zhongkai Hi-tech Development Zone, Huizhou Guangdong 516006, P.R.China 
地址:中国广东省惠州市仲恺高新区惠风 6路37 号小区 
网址 http://www.tonlyele.com 
©2015 TONLY ELECTRONICS HOLDINGS LIMITED.All rights reserved 保留所有版权 
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版本变更说明 Document Revision History 
Revision 
版本 
Date 
日期 
Author 
作者 
Description 
描述 
V1.0 
2017-02-08  Tommy.li  First release. 
  V1.1 
2017-07-17  Tommy.li  Operating temperature modify 
  V1.2 
2017-09-20  Tommy.li  BT version modify 
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目录 Table of Contents 
 法律声明 Legal Notice, Disclaimer, Copyright 
 文档变更说明 Document Revision History 
 目录 Table of contents 
 1.系统概览 System overview 
 1.1 通用说明  General Descriptions 
 1.2  性能特点 Features 
 1.3系统方框图 Block Diagram 
 2.产品描述 Production Description 
 引脚与功能说明 Pin Layout & Pin Description 
 外观与尺寸  Appearance& Dimension   
 3.应用说明 Application Explanation 
 4.电气特性 Electrical Characteristics 
 工作条件 
 直流特性 DC characteristics 
 热特性 Thermal characteristics 
 电流消耗 Current consumption 
 5.射频性能 RF Performance 
 6.认证与法规信息 Certificate& Regulation 
 7.包装与订货说明  Package& Ordering information   
 8.环保声明 Green Policy 
 9  推荐过炉温度  RECOMMENDED TEMPERATURE REFLOW PROFILE 
 10.抗静电保护 ESD Protection 
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1. 系统概览 System overview 
1.1 通用说明  General Descriptions 
TBM-A2823 is a Bluetooth sub-system using ATS2823 chipset from ‘Actions’ . The ATS2823 
consumer audio platform for wired and wireless applications integrates an ultra low power DSP 
and application processor , a high-performance stereo codec, a power management subsystem, 
LED    drivers , Usb flash Disk and MMC in a SoC IC. 
1.2 性能特点 Features 
 104 MHz MIPS32 Processor and 180 MHz DSP 
 Internal ROM and serial flash memory 
 interface supporting randomizer 
 Internal RAM for data and program 
 Built-in high performance stereo 24 bit DAC& ADC 
 Supports Digital microphones, single-ended 
 Analog microphones and full difference microphone 
 Built-in stereo PA for headphone and differential audio output for speaker PA 
 Bluetooth V4.2 compatible with Bluetooth V4.1, V3.0, V2.1 systems 
 Bluetooth fast AGC control to improve receiving dynamic range 
 Supports AFH to dynamically detect channel quality to improve Bluetooth transmission 
quality. 
 Support SD/MMC/eMMC card interface and 
 SPI Nor Flash interface 
 Audio Interfaces: I2S, SPDIF TX 
 Serial Interfaces: UART, SPI 
 Infrared Remote controller supported 
 Integrated PMU supports multiple low energy States 
 Integrated Linear battery charger up to 600mA charging current 
 PCB Dimension: 16.9mm (L) × 13.7mm (W) ×0.8mm (H) 
1.3 系统方框图Block Diagram 
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2.产品描述 Production Description 
引脚与功能说明 Apperance & Pin Description& Physical Dimensions 
 Description & Apperance: 
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 Physical Dimensions 
Top VIEW 
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Bottom VIEW 
PCB    Layerout recommend 
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    Pin descriptions 
PIN 
NO. 
Symbol  Description  Function 
1 
AGND Ground Analog ground   
2 
MICINR Analog input MIC right channel input 
3 
MICINL  Analog input  MIC left channel input 
4 
VRO  Analog output  Virtual Ground for PA 
5 
AOUTL  Analog output  Left channel of PA 
6 
AOUTR  Analog output  Right channel of PA 
7 
VRO_S  Analog input  VRO Sense for PA 
8 
AGND ground Analog ground 
9 
GND Power ground Ground 
10 
VCC Power output 3.3V power supply 
11 
GPIOA21 Bi-directional General  Purpose  Input 
Output: A21/Uart_RX 
12 
GPIOA23 Bi-directional 
General  Purpose  Input 
Output: 
A23/SPDIF_TX,Uart_TX1 
13 
GPIOA22 
Bi-directional 
General  Purpose  Input 
Output: A22/IR_RX 
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14 
GPIOA16 Bi-directional Bi-directional  General 
Purpose Input Output: A16 
15 
SPI_MOSI Bi-directional General  Purpose  Input 
Output: A31/SPI_MOSI 
16 
SPI_CLK 
Bi-directional 
General  Purpose  Input 
Output: A29/ SPI_CLK 
17 
SPI_SS Bi-directional General Purpose Input 
Output: A28 SPI_SS 
18 
GPIOB11 Bidirectional with weak 
pull-down 
Programmable  I/O  line 
11./SPI_BTIO2 
19 
GND Power ground Ground 
20 
BT_ANT 
This pin can be used when not using 
a chip antenna or connector of the 
module. 
Bluetooth 50Ω transmitter 
output /receiver inpu 
21 
RTCVDD Power output Power for RTC Module, 
typical voltage:1.2V 
22 
ON/OFF Input Power on/off 
23 
BAT Power input 
Battery input, typical 
voltage 
range :3.4V ~ 4.2V 
24 
GND Power ground Ground 
25 
DC5V Power input 
USB power input, typical 
voltage 
range :4.5V ~ 7.0V 
26 
GND Power ground Ground 
27 
GND Power ground Ground 
28 
AUX0R Analog input AUX0 right channel input 
29 
AUX0L Analog input AUX0 left channel input 
30 
AVCC Power output 
Power for Analog module, 
typical 
voltage:2.95V 
3.应用说明 Application Explanations 
 Stereo headsets and headphones 
 Portable stereo speakers and speakerphones 
 Bluetooth car audio unit 
 Bluetooth sound bar 
4. 电气特性 Electrical Characteristics 
  Base Characteristics 
ELECTRICAL CHARACTERISTICS 
Supply Voltage 
>= 3.6V DC 
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(Absolute Maximum Ratings 4.2V) 
Working current 
Depends on profiles, Max 24mA (A2DP) 
Standby current(disconnected) 
0mA~5mA 
WEIGHT AND DIMENSIONS 
(unit : mm) 
Size    (L x W x H) 
24.9*14*1.5 mm 
Weight 
~1.0g 
 Recommended operating conditions 
Min 
Max
 Unit 
Operating temperature 
-10
70
°C
VDD_BAT 
2.8
4.2
V
VDD_CHG 
0
7
V
Terminal voltages 
0
 VD
D 
V
Regulator Maximum output current 
电池充电 Battery charger 
Item 
Min  Type  Max  Unit 
Input Voltage 
4.5  5  7  V 
Charge Current(CC mode) 
~  500 600 mA 
Trickle Charge Current 
 10    mA 
Trickle Charge Threshold Voltage 
  3    V 
Regulated Output(Float)Voltage 
  4.2    V 
 Audio feature 
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5.射频性能 RF Performance 
Specification 
Description 
RF performance 
Standard 
Bluetooth 4.2 
Frequency Band 
2.402~ 2.48GHz 
Modulation Method 
GFSK;4/ΠDQPSK;8DQPSK 
Maximum Data Rate 
1 Mbps/2 Mbps/3 Mbps 
Antenna 
External antenna 
Interface 
UART, PIO, AIO, SPI,PCM,SPI 
Operation Range 
>=30 meters(Free Space) 
Sensitivity 
-90dBm at 0.1% BER 
RF TX Power 
<+10dBm 
6.认证与法规信息 Certification& Regulation 
The BQB Certification:   
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7.包装与订货说明 Package & Ordering  Information 
Assembly Information 
 60Pcs per every Blister tray 
 600Pcs per every Vacuum packing 
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8.环保声明 Green Policy 
This module can meet ROHS&REACH compliance. 
9.推荐过炉温度  RECOMMENDED TEMPERATURE REFLOW PROFILE 
The  soldering  profile  depends  on  various  parameters  necessitating  a  set  up  for  each 
application. The data here is given only for guidance on solder re-flow. There are four zones: 
1. Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s. 
2. Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the 
flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out 
gassing of the flux. 
3. Reflow Zone - The peak temperature should be high enough to achieve good wetting but not 
so high as to cause component discoloration or damage. Excessive soldering time can lead to 
inter metallic growth which can result in a brittle joint. 
4. Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a 
longer lasting joint. Typical rates will be 2-5°C/s. 
Key features of the profile: 
■ Initial ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium 
■ Equilibrium time = 60 to 180 seconds 
■ Ramp to maximum temperature (245°C) = 3°C/sec max. 
■ Time above liquidus temperature (217°C): 45-90 seconds 
■ Device absolute maximum reflow temperature: 260°C 
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10.抗静电保护  ESD Protection 
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undesired operation.
2.This device must accept any interference received, including interference that may cause
1.This device may not cause harmful interference.
conditions:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two 
For IC:
This device complies with RSS247 of Industry Canada. Cet appareil se conforme à 
RSS247 de Canada d'Industrie. This device complies with Industry Canada license-
exempt RSS standard(s). Operation is subject to the following two conditions: (1) 
this device may not cause interference, and (2) this device must accept any 
interference, including interference that may cause undesired operation of the 
device. appareils radio exempts de licence. Son fonctionnement est sujet aux deux 
conditions suivantes: (1) le dispositif ne doit pas produire de brouillage 
prejudiciable, et (2) ce dispositif doit accepter tout brouillage recu, y compris un 
brouillage susceptible de provoquer un fonctionnement indesirable.
This Class B digital apparatus complies with Canadian ICES-003. 
Cet appareil numérique de la classe B est conforme a la norme NMB-003 du 
Canada. 
For FCC:
Warning:  Changes or modifications to this unit not expressly approved by the party 
responsible for compliance could void the user’s authority to operate the equipment.
NOTE:  This equipment has been tested and found to comply with the limits for a Class B 
digital device, pursuant to Part 15 of the FCC Rules.  These limits are designed to provide 
reasonable protection against harmful interference in a residential installation.  This 
equipment generates, uses and can radiate radio frequency energy and, if not installed and 
used in accordance with the instructions, may cause harmful interference to radio 
communications.
However, there is no guarantee that interference will not occur in a particular installation.  If 
this equipment does cause harmful interference to radio or television reception, which can be 
determined by turning the equipment off and on, the user is encouraged to try to correct the 
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which 
the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
“The device must not be co-located or operating in conjunction with any other 
antenna or transmitter.”
FCC RF Radiation Exposure Statement Caution: To maintain compliance with the 
FCC’s RF exposure guidelines, place the product at least 20cm from nearby persons.
The device should be installed and operated with a minimum distance of 20cm between the 
radiator and your body.
L'appareil doit être installé et utilisé avec une distance minimale de 20 cm entre le radiateu
et votre corps.
FCC Conditions
Antenna Gain : 2dBi
Antenna Type: PCB Antenna
ZVA12
This device is intended only for OEM integrators under the following 
conditions: 
1) The antenna must be installed such that 20 cm is maintained between the antenna 
and users, and 
2) The transmitter module may not be co-located with any other transmitter or 
antenna. 
3) For all products market in United States, OEM has to limit the operation channels in CH1 
to CH11 for 2.4G band by supplied firmware programming tool. And OEM shall 
not supply any tool or info to the end-user regarding to change the domain selection. 
As long as 3 conditions above are met, further transmitter test will not be required. 
However, the OEM integrator is still responsible for testing their end-product for 
any additional compliance requirements required with this module installed (for 
example, digital device emissions, PC peripheral requirements, etc.). 
IMPORTANT NOTE: In the event that these conditions cannot be met (for 
example certain laptop configurations or co-location with another transmitter), then 
the FCC authorization is no longer considered valid and the FCC ID cannot be 
used on the final product. In these circumstances, the OEM integrator will be 
responsible for re-evaluating the end product (including the transmitter) and 
obtaining a separate FCC authorization. 
End Product Labeling 
This transmitter module is authorized only for use in device where the antenna may 
be installed such that 20 cm may be maintained between the antenna and users (for 
example: Access point, Wireless Router, Notebook, etc.). The final end product 
must be labeled in a visible area with the following: “Contains FCC ID:  ”.