TDK SESUB BU 13808 BTLE Module User Manual Rev 2

TDK Corporation SESUB BU BTLE Module Users Manual Rev 2

Users Manual Rev 2

© TDK Corporation 2013-2014 1TDK CorporationThin Film Device CenterSESUB BURevision FC2014.6.25SP13808 Bluetooth Module User’s GuideAn Integrated 2.4GHz Bluetooth SMART Compliant Transceiver Module
© TDK Corporation 2013-2014 2SP13808 is a Bluetooth Smart compliant Module which is composed by world smallest size of TDK module SESUB-PAN-T2541 and Chip Antenna. SP13808 equips a 2.4GHz band chip antenna, a 32.768kHz sleep clock resonator.It is covered with a metal shield case on top.SP13808 can be connected with SP13809 Adapter Board to for easy connection to user’s application board. a) SP13808 Bluetooth Module b) SP13809 Adapter BoardConnectorDF23C-30DS-0.5V(92) [Hirose]ConnectorDF23C-30DS-0.5V(92) [Hirose]Covered with a metal shield caseReady for radio certification12.014.08pins DIP IC Socket for Sensor moduleIs availablePin header for TI’s CC-DebuggerSP13808 Metal schield caseSP13808 Bluetooth Module
© TDK Corporation 2013-2014 3SP13808 is composed by BLE Module(SESUB-PAN-T2541) ,Antenna, Crystal, and some more passive components (Capacitors, Inductors, Connector).SESUB-PAN-T2541 is BLE Module from TDK and it contains Texas Instruments BLE IC (CC2541) inside. Please refer to Technical Information Document from TDK and also refer to the datasheet and Software developer‘s guide of CC2541(TI) for further detail.SP13808 Bluetooth Module12.014.0SESUB-PAN-T2541BLE Module TDK SESUB-PAN-T2541ANTENNABoard to Board ConnectorSP13808Power Supply 3.3V Crystal 32kHz Analog and Digital I/O I2C UARTFilter Texas InstrumentsCC2541Crystal 32 MHzANTENNACrystal 32MHzCrystal 32KHzSP13808 Bluetooth Module
© TDK Corporation 2013-2014 46.07.01.0±±±±0.20.81.21.251.054.5Unit in mmTolerance ±±±±0.15mm unless otherwise noted.3.1±±±±0.2CLCL4.5CL7.0CL6.01.05SP13808 Mechanical Dimensions0.8±±±±0.1
© TDK Corporation 2013-2014 5SP13808 PCB Connector Pin AssignmentPin # Description Pin # DescpriptionA01 VDD B01 SCLA02 VDD3V3 B02 P2_1A03 RST B03 P2_0A04 GND B04 SDAA05 P0_0 B05 GNDA06 P0_1 B06 P2_2A07 P0_2 B07 GNDA08 P0_3 B08 GNDA09 P0_4 B09 P1_7A10 P0_5 B10 P1_6A11 P0_6 B11 P1_1A12 P0_7 B12 P1_2A13 P1_0 B13 P1_3A14 GND B14 P1_4A15 GND B15 P1_5
© TDK Corporation 2013-2014 6SP13809 Peripherals Pin AssignmentPin # Description01 GND02 VDD03 P2_204 P2_105 P2_006 P0_507 RST08 P0_309 VDD3V310 P0_2b) J2 1.27mm pitch Pin Headera) J1 8Pins DIP IC SocketPin # Description01 P1_402 P1_303 P1_204 GND05 SDA06 SCL07 P1_308 VDD3V3J1J2RemarkJ1 : User can install additional sensor module PCB(e.g. Pressure Sensor, Accelerometer, Gyro)J2 : User can connect TI’s CC-Debugger connector for install user FW or debugging thru this connector.
© TDK Corporation 2013-2014 7LED and Push SW Configuration in SP13809SW3Connected to RST SW3Connected to RST SW1Connected to P0_0SW1Connected to P0_0SW2Connected to P1_6SW2Connected to P1_6LED2Connected to P1_1 LED2Connected to P1_1 LED1Connected to P1_0 LED1Connected to P1_0 RemarkPower Supply has to be connected.Supplying voltage range is 3.0 ~ 3.6V is preferable for operation properly.Connect Power Supply hereVcc : 3.3V (2.2~3.6V) Connect Power Supply hereVcc : 3.3V (2.2~3.6V) GNDGND
© TDK Corporation 2013-2014 8Reference Information1. Bluetooth Core Technical Specification document, version 4.0http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip2. Texas Instruments CC2541 2.4GHz Bluetooth Low Energy System-on-Chip Datasheet (swrs110c)3. Texas Instruments CC2541 System-on-Chip Solution for 2.4GHz Bluetooth low energy Applications User’s Guide (swru191d)4. Texas Instruments Bluetooth Low Energy Software Development Kit (SDK)http://www.ti.com/tool/ble-stack5. Texas Instruments SmartRF Studiohttp://focus.ti.com/docs/toolsw/folders/print/smartrftm-studio.html6. IAR Embedded Workbench for 8051 devices programminghttp://www.iar.com7. For all other related technical documents, visit Texas Instruments Low-Power RF web site.http://www.ti.com/lprf-forumhttp://www.ti.com/lprfnetwork
© TDK Corporation 2013-2014 9
© TDK Corporation 2013-2014 10

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