TDK SESUB BU 13808 BTLE Module User Manual Rev 2

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Document ID	2323462
Application ID	cjjcjWTDxQMgmIVFywCZVg==
Document Description	Users Manual Rev 2
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	82.74kB (1034194 bits)
Date Submitted	2014-07-11 00:00:00
Date Available	2014-07-21 00:00:00
Creation Date	2014-06-25 09:08:41
Producing Software	GPL Ghostscript 9.07; modified using iTextSharp™ 5.4.2 ©2000-2012 1T3XT BVBA (AGPL-version)
Document Lastmod	2014-06-25 09:08:43
Document Title	Users Manual Rev 2
Document Creator	CubePDF

SP13808 Bluetooth Module User’s Guide
An Integrated 2.4GHz Bluetooth SMART Compliant Transceiver Module
TDK Corporation
Thin Film Device Center
SESUB BU
Revision FC
2014.6.25
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP13808 Bluetooth Module
SP13808 is a Bluetooth Smart compliant Module which is composed by world smallest size of
TDK module SESUB-PAN-T2541 and Chip Antenna.
SP13808 equips a 2.4GHz band chip antenna, a 32.768kHz sleep clock resonator.
It is covered with a metal shield case on top.
Metal schield case
SP13808 can be connected with SP13809 Adapter Board to for
easy connection to user’s application board.
SP13808
14.0
Pin header
for TI’s CCDebugger
12.0
Covered with a metal shield case
Ready for radio certification
8pins DIP
IC Socket
for Sensor
module
Is available
Connector
DF23C-30DS-0.5V(92) [Hirose]
a) SP13808 Bluetooth Module
b) SP13809 Adapter Board
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP13808 Bluetooth Module
SP13808 is composed by BLE Module(SESUB-PAN-T2541) ,Antenna, Crystal, and some more passive
components (Capacitors, Inductors, Connector).
SESUB-PAN-T2541 is BLE Module from TDK and it contains Texas Instruments BLE IC (CC2541) inside.
Please refer to Technical Information Document from TDK and also refer to the datasheet and Software
developer‘s guide of CC2541(TI) for further detail.
ANTENNA
SP13808
Crystal
32kHz
Filter
14.0
ANTENNA
Crystal 32MHz
BLE Module
TDK SESUB-PAN-T2541
Texas
Instruments
CC2541
Crystal
32 MHz
12.0
Crystal 32KHz
SESUB-PAN-T2541
Board to Board Connector
Power Supply 3.3V
Analog and Digital I/O
I2C UART
SP13808 Bluetooth Module
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP13808 Mechanical Dimensions
1.05
7.0
4.5
CL
4.5
1.0±
±0.2
CL
CL
1.05
7.0
CL
0.8
6.0
0.8±
±0.1
3.1±
±0.2
6.0
1.25
1.2
Unit in mm
Tolerance ±0.15mm unless otherwise noted.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP13808 PCB Connector Pin Assignment
Pin #
Description
Pin #
Descpription
A01
VDD
B01
SCL
A02
VDD3V3
B02
P2_1
A03
RST
B03
P2_0
A04
GND
B04
SDA
A05
P0_0
B05
GND
A06
P0_1
B06
P2_2
A07
P0_2
B07
GND
A08
P0_3
B08
GND
A09
P0_4
B09
P1_7
A10
P0_5
B10
P1_6
A11
P0_6
B11
P1_1
A12
P0_7
B12
P1_2
A13
P1_0
B13
P1_3
A14
GND
B14
P1_4
A15
GND
B15
P1_5
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP13809 Peripherals Pin Assignment
a) J1 8Pins DIP IC Socket
Pin #
Description
b) J2 1.27mm pitch Pin Header
Pin #
Description
01
P1_4
01
GND
02
P1_3
02
VDD
03
P1_2
03
P2_2
04
GND
04
P2_1
05
SDA
05
P2_0
06
SCL
06
P0_5
07
P1_3
07
RST
08
VDD3V3
08
P0_3
09
VDD3V3
10
P0_2
J1
J2
Remark
J1 : User can install additional sensor module PCB
(e.g. Pressure Sensor, Accelerometer, Gyro)
J2 : User can connect TI’s CC-Debugger connector for
install user FW or debugging thru this connector.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
LED and Push SW Configuration in SP13809
LED2
Connected to P1_1
LED1
Connected to P1_0
Connect Power
Supply here
Vcc : 3.3V (2.2~3.6V)
GND
SW1
SW3
Connected to P0_0
Connected to RST
SW2
Connected to P1_6
Remark
Power Supply has to be connected.
Supplying voltage range is 3.0 ~ 3.6V is preferable for
operation properly.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
Reference Information
1. Bluetooth Core Technical Specification document, version 4.0
http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip
2. Texas Instruments CC2541 2.4GHz Bluetooth Low Energy System-on-Chip Datasheet (swrs110c)
3. Texas Instruments CC2541 System-on-Chip Solution for 2.4GHz Bluetooth low energy Applications User’s
Guide (swru191d)
4. Texas Instruments Bluetooth Low Energy Software Development Kit (SDK)
http://www.ti.com/tool/ble-stack
5. Texas Instruments SmartRF Studio
http://focus.ti.com/docs/toolsw/folders/print/smartrftm-studio.html
6. IAR Embedded Workbench for 8051 devices programming
http://www.iar.com
7. For all other related technical documents, visit Texas Instruments Low-Power RF web site.
http://www.ti.com/lprf-forum
http://www.ti.com/lprfnetwork
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
Certain Instructions.
User shall operate SP138098 within TDK’s recommended specifications and environmental considerations per the user’s guide, accompanying
documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to input and output voltage,
current, power, and environmental ranges) for SP13808 may cause property damage, personal injury or death.
If there are questions concerning these ratings, user should contact a TDK field representative prior to connecting interface electronics
including input power and intended loads.
Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent
damage to the SP13808 and/or interface electronics.
Please consult the applicable user's guide prior to connecting any load to the SP13808 output. If there is uncertainty as to the load
specification, please contact a TDK field representative.
Agreement to Defend, Indemnify and Hold Harmless.
User agrees to defend, indemnify, and hold TDK, its directors, officers, employees, agents, representatives, affiliates, licensors and their
representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out
of, or in connection with, any handling and/or use of SP13808.
User’s indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if SP13808 fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications.
User agrees that SP13808 shall not be used as, or incorporated into, all or any part of safety critical applications (such as life support),
and a failure of a TDK product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
REGULATORY COMPLIANCE INFORMATION
Caution
This device complies with part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Radio-Frequency Exposure and Approval Conditions:
1. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this
transmitter must not be collocated or operating in conjunction with any other antenna or transmitter within a host device,
except in accordance with FCC multi-transmitter product procedures..
2. The regulatory label on the final system must include the statement: “Contains FCC ID:2ACNB13808” or using electronic labeling method as
documented in KDB784748.
3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to
install or remove the transmitter module except such device has implemented two-ways authentication between module and the host
system.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
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