THALES DIS AlS Deutschland ELS31-V LTE Module User Manual hid

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Cinterion® ELS31-V/ELS51-V
Hardware Interface Overview
Version:
DocId:
00.502
ELS31-V_ELS51-V_HIO_v00.502
 M2M.GEMALTO.COM
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Page 2 of 35
Document Name: Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
Version:
00.502
Date:
2015-12-07
DocId:
ELS31-V_ELS51-V_HIO_v00.502
Status:
Confidential / Preliminary
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE
SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,
MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY
AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY
AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED
BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.
THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED
ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2015, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain
countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned
in this document are property of their respective owners.
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Contents
35
Contents
Introduction ................................................................................................................. 2
1.1
Key Features at a Glance .................................................................................. 2
1.2
ELS31-V / ELS51-V System Overview .............................................................. 5
Interface Characteristics ............................................................................................ 6
2.1
Application Interface .......................................................................................... 6
2.1.1 USB Interface........................................................................................ 6
2.1.2 Serial Interface ASC0 ........................................................................... 7
2.1.3 Serial Interface ASC1 (ELS51-V Only) ................................................. 8
2.1.4 UICC/SIM/USIM Interface..................................................................... 9
2.1.5 GPIO Interface .................................................................................... 11
2.1.6 I2C Interface ........................................................................................ 12
2.1.7 SPI Interface ....................................................................................... 13
2.1.8 Pulse Counter ..................................................................................... 13
2.1.9 HSIC Interface (ELS51-V Only) .......................................................... 13
2.1.10 SDIO Interface (ELS51-V Only) .......................................................... 13
2.1.11 Control Signals.................................................................................... 13
2.1.11.1 Status LED .......................................................................... 13
2.1.11.2 Fast Shutdown .................................................................... 13
2.2
RF Antenna Interface....................................................................................... 14
2.2.1 Antenna Installation ............................................................................ 15
2.3
Sample Application .......................................................................................... 16
Operating Characteristics ........................................................................................ 18
3.1
Operating Modes ............................................................................................. 18
3.2
Power Supply................................................................................................... 19
Mechanical Dimensions, Mounting and Packaging............................................... 20
4.1
Mechanical Dimensions of ELS31-V / ELS51-V .............................................. 20
Regulatory and Type Approval Information ........................................................... 22
5.1
Directives and Standards................................................................................. 22
5.2
SAR requirements specific to portable mobiles ............................................... 24
5.3
Reference Equipment for Type Approval ......................................................... 25
5.4
Compliance with FCC and IC Rules and Regulations ..................................... 26
Document Information.............................................................................................. 28
6.1
Revision History ............................................................................................... 28
6.2
Related Documents ......................................................................................... 28
6.3
Terms and Abbreviations ................................................................................. 28
6.4
Safety Precaution Notes .................................................................................. 32
Appendix.................................................................................................................... 33
7.1
List of Parts and Accessories........................................................................... 33
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Tables
35
Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:

Signals of the SIM interface (SMT application interface) ................................. 9
GPIO lines and possible alternative assignment............................................ 11
Return loss in the active band........................................................................ 14
Overview of operating modes ........................................................................ 18
Directives ....................................................................................................... 22
Standards of North American type approval .................................................. 22
Standards of Verizon type approval ............................................................... 22
Standards of GCF type approval.................................................................... 22
Requirements of quality ................................................................................. 22
Standards of the Ministry of Information Industry of the
People’s Republic of China ............................................................................ 23
Toxic or hazardous substances or elements with defined concentration
limits ............................................................................................................... 23
Antenna gain limits for FCC and IC................................................................ 26
List of parts and accessories.......................................................................... 33
Molex sales contacts (subject to change) ...................................................... 34
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Figures
35
Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:

ELS31-V / ELS51-V system overview.............................................................. 5
USB circuit ....................................................................................................... 6
Serial interface ASC0....................................................................................... 7
Serial interface ASC1....................................................................................... 8
External UICC/SIM/USIM card holder circuit ................................................. 10
Schematic diagram of ELS31-V / ELS51-V sample application..................... 17
ELS31-V– top and bottom view...................................................................... 20
Dimensions of ELS31-V / ELS51-V (all dimensions in mm)........................... 21
Dimensions of ELS31-V / ELS51-V (all dimensions in mm) - bottom view .... 21
Reference equipment for Type Approval ....................................................... 25
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1 Introduction
Introduction
This document1 describes the hardware of the Cinterion® ELS31-V and ELS51-V modules for
Verizon Network. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
The ELS31-V and ELS51-V modules include a baseband, a complete dual band RF frontend,
memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Release 10
set of specifications) and Verizon Wireless LTE UE specifications.
The module variants differentiate a follows:
- ELS31-V provides LTE connectivity with IP Services
- ELS51-V adds a Linux execution environment available for customer applications
Note: Throughout the document ELS31-V refers to ELS31-V Release 2.
1.1
Key Features at a Glance
Feature
Implementation
General
Frequency bands
LTE dualband: B4, B13
Output power
Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13
Power supply
3.3V to 4.5V
Operating temperature
(board temperature)
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Physical
Dimensions: 27.6mm x 18.8mm x 2.2mm
Weight: approx. 3g
RoHS
All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9
DL 10Mbps, UL 5Mbps
LTE Cat. 1 data rates
SMS
Point-to-point MT and MO
Text and PDU mode
Storage in mobile equipment
Software
AT commands
Hayes, 3GPP TS 27.007, TS 27.005, product specific
SIM Application Toolkit
SAT Release 99
Firmware update
Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB
1. The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
Feature
Implementation
Interfaces
Module interface
Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application development equipment.
USB
USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces
ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Default baud rate: 115,200 baud
• Adjustable baud rates: 1,200 to 921,600, no autobauding support
• Supports RTS0/CTS0 hardware flow control.
• indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)
ELS51-V only:
ASC1 (shared with GPIO lines):
• 4-wire, unbalanced asynchronous interface
• Default baud rate: 115,200 baud
• Adjustable baud rates: 1,200bps to 921,600bps
• Supports RTS1/CTS1 hardware flow control
UICC interface
Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC
Module is prepared for an embedded UICC
GPIO interface
20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3):
GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and
SPI signal lines
Programming is done via AT commands
I2C interface
Supports I2C serial interface
SPI interface
Supports SPI interface
SDIO
ELS51-V only:
4 wire interface.
HSIC
ELS51-V only:
High Speed Interchip Communication interface.
ADC
Analog-to-Digital Converter with one unbalanced analog input.
Digitial audio interface
Hardware prepared for future use.
Antenna interface pads
50 LTE main antenna, 50LTE diversity antenna
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1.1 Key Features at a Glance
Feature
Implementation
Power on/off, Reset
Power on/off
Switch-on by hardware signal ON
Switch-off by AT command
Switch off by hardware signal GPIO4/FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions
Reset
Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_RST
Evaluation kit
Evaluation module
ELS31-V / ELS51-V module soldered onto a dedicated PCB that can be
connected to an adapter in order to be mounted onto the DSB75.
DSB75
DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the ELS31-V / ELS51V evaluation module to the DSB75.
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1.2 ELS31-V / ELS51-V System Overview
ELS31-V / ELS51-V System Overview
Application
Serial modem
interface
I2C
SPI
USB
HSIC
SDIO
(with SIM detection)
ADC
Power supply
ON
Emergency reset
ADC
POWER
ANTENNA
(LTE dual band)
Antenna /
div. Antenna
CONTROL
SIM card
SIM interface
SPI
SDIO
HSIC
USB
SPI
I2C
ASC0
SPI
Pulse counter
COUNTER
GP(I)Os
GPIOs
Serial interface
ASC1
Serial modem
interface
ASC0
Fast shutdown
FST_SHDN
LED
Status
GPIO
interface
Module
1.2
Figure 1: ELS31-V / ELS51-V system overview
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2 Interface Characteristics
17
Interface Characteristics
ELS31-V / ELS51-V is equipped with an SMT application interface that connects to the external
application. The SMT application interface incorporates the various application interfaces as
well as the RF antenna interfaces.
2.1
Application Interface
2.1.1
USB Interface
ELS31-V / ELS51-V supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full
Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and
data interface and for downloading firmware.
The VUSB line is used for cable detection only, this is to be supplied by the external device. The
USB circuitry in the ELS31-V / ELS51-V is designed to meet the USB 2.0 specification for selfpower.2.0”1.
Module
SMT
VREG (3V075)
lin. reg.
BATT+
GND
USB part1)
VBUS
Detection only
VUSB_IN
USB_DP2)
USB_DN2)
DP
DN
Host wakeup
RING0
1)
It is recommended to add EMI suppression filter (see section 2.1.3.1)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90Ohm for proper signal integrity.
2)
Figure 2: USB circuit
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver
distributed with ELS31-V / ELS51-V needs to be installed.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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2.1 Application Interface
17
2.1.2
Serial Interface ASC0
ELS31-V / ELS51-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with
ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data
bit or inactive state).
ELS31-V / ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE
connections it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 1200bps up to 921600bps.
• Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXD
and TXD lines, if RTS0 is pulled low.
• Wake up from SLEEP mode by RTS0 activation (high to low transition).
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2.1 Application Interface
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2.1.3
Serial Interface ASC1 (ELS51-V Only)
ELS51-V provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to
ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T
V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit
or inactive state). With ELS31-V, ASC1 can only be used as data interface.
ELS51-V is designed for use as a DCE. Based on the conventions for DCE-DTE connections
it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
Figure 4: Serial interface ASC1
Features
• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake.
• On ASC1 no RING line is available.
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at fixed bit rates from 1,200 bps to 921600 bps.
• Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXD
and TXD lines, if RTS1 is pulled low.
• Wake up from SLEEP mode by RTS0 activation (high to low transition).
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2.1 Application Interface
17
2.1.4
UICC/SIM/USIM Interface
ELS31-V / ELS51-V has an integrated UICC/SIM/USIM interface compatible with the 3GPP
31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an
external SIM card holder. Five pads on the SMT application interface are reserved for the SIM
interface.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the
mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on
the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with ELS31-V / ELS51-V and is part of the Gemalto M2M reference equipment
submitted for type approval. See Section 7.1 for Molex ordering numbers.
Table 1: Signals of the SIM interface (SMT application interface)
Signal
Description
GND
Separate ground connection for SIM card to improve EMC.
CCCLK
Chipcard clock
CCVCC
SIM supply voltage.
CCIO
Serial data line, input and output.
CCRST
Chipcard reset
CCIN
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN signal is by default low and will change to high level if a SIM card
is inserted.
The CCIN signal is mandatory for applications that allow the user to remove the SIM card
during operation.
The CCIN signal is solely intended for use with a SIM card. It must not be used for any other
purposes. Failure to comply with this requirement may invalidate the type approval of
ELS31-V / ELS51-V.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after
removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In
this case, the application must restart ELS31-V / ELS51-V.
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2.1 Application Interface
17
The figure below shows a circuit to connect an external SIM card holder.
V180
CCIN
CCVCC
SIM
220nF
1nF
CCRST
CCIO
CCCLK
Figure 5: External UICC/SIM/USIM card holder circuit
The total cable length between the SMT application interface pads on ELS31-V / ELS51-V and
the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach is using a GND line to shield
the CCIO line from the CCCLK line.
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2.1 Application Interface
17
2.1.5
GPIO Interface
ELS31-V / ELS51-V offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are
shared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED
(see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1
(see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9).
The following table shows the configuration variants for the GPIO pads. All variants are mutually exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.
Table 2: GPIO lines and possible alternative assignment
GPIO
Fast
Shutdown
Status
LED
Pulse
Counter
ASC0
GPIO1
DTR0
GPIO2
DCD0
GPIO3
DSR0
GPIO4
GPO5
ASC1
SPI
HSIC
FST_SHDN
LED
GPIO6
GPIO7
GPIO8
COUNTER
GPIO16
RXD1
AP_WAKEUP
GPIO17
TXD1
HOST_ACTIVE
GPIO18
RTS1
CP_WAKEUP
GPIO19
CTS1
SUSPEND
GPIO20
GPIO21
GPIO22
GPO23
GPIO24
RING0
GPIO25
GPO26
SPI_CS1
GPIO27
SPI_CS2
After startup, the above mentioned alternative GPIO line assignments can be configured using
AT commands (see [1]). The configuration is non-volatile and available after module restart.
Notes:
• GPO5, GPO23 and GPO26 are GPOs only.
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2.1 Application Interface
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2.1.6
I2C Interface
I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts
as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as mastertransmitter or as master-receiver. The customer application transmits or receives data only on
request of the module.
The I2C interface can be powered via the V180 line of ELS31-V / ELS51-V. If connected to the
V180 line, the I2C interface will properly shut down when the module enters the Power Down
mode.
Note: Good care should be taken when creating the PCB layout of the host application: The
traces of I2CCLK and I2CDAT should be equal in length and as short as possible.
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2.1 Application Interface
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2.1.7
SPI Interface
Four ELS31-V / ELS51-V GPIO interface lines can be configured as Serial Peripheral Interface
(SPI). The SPI is a synchronous serial interface for control and data transfer between ELS31V / ELS51-V and the external application. Only one application can be connected to the SPI
and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The
SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as
the chip select lines SPI_CS1 and SPI_CS2.
2.1.8
Pulse Counter
The GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter interface can be used, for example, as a clock (for GPIOs see Section 2.1.5).
2.1.9
HSIC Interface (ELS51-V Only)
TBD
2.1.10
SDIO Interface (ELS51-V Only)
TBD
2.1.11
2.1.11.1
Control Signals
Status LED
The GPO5 interface line can be configured to drive a status LED that indicates different operating modes of the module (for GPIOs see Section 2.1.5). GPO and LED functionality are mutually exclusive.
2.1.11.2
Fast Shutdown
The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The configured FST_SHDN line is an active low control signal.
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2.2 RF Antenna Interface
17
2.2
RF Antenna Interface
The RF interface has an impedance of 50. ELS31-V /ELS51-V is capable of sustaining a total
mismatch at the antenna line without any damage, even when transmitting at maximum RF
power.
The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression. Antenna matching networks are
not included on the ELS31-V / ELS51-V module and should be placed in the host application if
the antenna does not have an impedance of 50.
Regarding the return loss ELS31-V / ELS51-V provides the following values in the active band:
Table 3: Return loss in the active band
State of module
Return loss of module
Recommended return loss of application
Receive
> 8dB
> 12dB
Transmit
not applicable
> 12dB
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2.2 RF Antenna Interface
17
2.2.1
Antenna Installation
The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT,
pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the
application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-V /
ELS51-V. All RF data specified throughout this document is related to the ARP.
The distance between the antenna RF pads and its neighboring GND pads has been optimized
for best possible impedance. On the application PCB, special attention should be paid to these
3 pads, in order to prevent mismatch.
The wiring of the antenna connection line, starting from the antenna pad to the application antenna should result in a 50 line impedance. Line width and distance to the GND plane needs
to be optimized with regard to the PCB’s layer stack.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the application PCB, it is recommended to realize the antenna connection line
using embedded Stripline rather than Micro-Stripline technology.
For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
to ELS31-V / ELS51-V‘s antenna pad.
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2.3 Sample Application
17
2.3
Sample Application
Figure 6 shows a typical example of how to integrate a ELS31-V / ELS51-V module with an
application. Usage of the various host interfaces depends on the desired features of the application.
Because of the high RF field density inside the module, it cannot be guaranteed that no self
interference might occur, depending on frequency and the applications grounding concept. The
potential interferers may be minimized by placing small capacitors (47pF) at suspected lines
(e.g. RXD0, VDDLP, and ON).
While developing SMT applications it is strongly recommended to provide test points
for certain signals, i.e., lines to and from the module - for debug and/or test purposes.
The SMT application should allow for an easy access to these signals. For details on
how to implement test points see [4].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for
an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the
PCB eliminates the need to use the ferrite beads shown in the sample schematic.
Note: ELS31-V / ELS51-V is not intended for use with cables longer than 3m.
Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 6 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating
safeguards for their products using ELS31-V / ELS51-V modules.
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2.3 Sample Application
17
ELS31-V/51-V
Main Antenna
SDIO
WiFi
Div. Antenna
USB
HSIC
BATT+RF
Power Supply
ON
BATT+BB
33pF
FST_SHUTDOWN
33pF
+ 150µF
Low ESR!
ASC0
µC
ASC1
USB
Blocking
GPIOs
LED
PWM
COUNTER
V180
2k2
V180
2k2
I2CCLK
CCIN
CCVCC
CCIO
CCRST
CCCLK
SIM
220nF 10pF 1nF
10pF
I2CDAT
GND
Interfaces available only on ELS51-V
Figure 6: Schematic diagram of ELS31-V / ELS51-V sample application
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3 Operating Characteristics
19
Operating Characteristics
3.1
Operating Modes
The table below briefly summarizes the various operating modes referred to throughout the
document.
Table 4: Overview of operating modes
Mode
Function
Normal
operation
LTE IDLE
No data transfer is in progress and the USB connection is suspended
by host (or is not present) and no active communication via ASC0/
ASC1. In IDLE mode, the software can be active or in SLEEP state.
LTE DATA
LTE data transfer in progress. Power consumption depends on network
settings and data transfer rate.
Power
Down
Normal shutdown after sending the power down command. Software is not active. Interfaces are not accessible. Operating voltage remains applied.
Airplane
mode
Airplane mode shuts down the radio part of the module, causes the module to log off from
the LTE network and disables all AT commands whose execution requires a radio connection.
Airplane mode can be controlled by AT command (see [1]).
In Airplane mode, the software can be active or in SLEEP state.
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3.2 Power Supply
19
3.2
Power Supply
ELS31-V/ ELS51-V needs to be connected to a power supply at the SMT application interface
- 2 BATT lines and GND. There are two separate voltage domains for BATT:
• BATT_BB with a line mainly for the baseband power supply.
• BATT_RF with a line for the RF power amplifier supply.
Please note that throughout the document BATT refers to both voltage domains and power
supply lines - BATT_BB and BATT_RF.
The power supply of ELS31-V / ELS51-V has to be a single voltage source at BATT_BB and
BATT_RF. It must be able to provide the current for all operation modes of the module.
All the key functions for supplying power to the device are handled by the power management
section of the analog controller. This IC provides the following features:
•
•
•
Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and
a DC-DC step down switching regulator.
Switches the module's power voltages for the power-up and -down procedures.
SIM switch to provide SIM power supply.
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4 Mechanical Dimensions, Mounting and Packaging
21
Mechanical Dimensions, Mounting and Packaging
4.1
Mechanical Dimensions of ELS31-V / ELS51-V
Figure 7 shows the top and bottom view of ELS31-V / ELS51-V and provides an overview of
the board's mechanical dimensions. For further details see Figure 8.
Product label
Top view
Bottom view
Figure 7: ELS31-V– top and bottom view
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4.1 Mechanical Dimensions of ELS31-V / ELS51-V
21
Figure 8: Dimensions of ELS31-V / ELS51-V (all dimensions in mm)
Figure 9: Dimensions of ELS31-V / ELS51-V (all dimensions in mm) - bottom view
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5 Regulatory and Type Approval Information
27
Regulatory and Type Approval Information
5.1
Directives and Standards
ELS31-V / ELS51-V is designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "ELS31-V / ELS51-V Hardware Interface Description".
Table 5: Directives
2002/95/EC (RoHS 1)
2011/65/EC (RoHS 2)
Directive of the European Parliament and of the Council
of 27 January 2003 (and revised on 8 June 2011) on the
restriction of the use of certain hazardous substances in
electrical and electronic equipment (RoHS)
Table 6: Standards of North American type approval
CFR Title 47
Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC
OET Bulletin 65
(Edition 97-01)
Evaluating Compliance with FCC Guidelines for Human Exposure to
Radiofrequency Electromagnetic Fields
UL 60 950-1
Product Safety Certification (Safety requirements)
California Leadfree Mandate
Covered by European RoHS requirements
RSS132 (Issue2)
RSS133 (Issue5)
Canadian Standard
Table 7: Standards of Verizon type approval
Verizon Wireless Unified Module Process for Compliance Testing and Approval, October 2014
Verizon Wireless Device Requirements LTE 3GPP Band 13 Network Access, October 2014
Verizon Wireless Device Requirements LTE 3GPP Band 4 Network Access, October 2014
3GPP2 C.S0015-A v1.0
Short Message Service for spread spectrum systems
Table 8: Standards of GCF type approval
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 10); Mobile Station
(MS) conformance specification;
GCF-CC V3.58
Global Certification Forum - Certification Criteria
Table 9: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
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5.1 Directives and Standards
27
Table 10: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the
Gemalto M2M Hardware Interface Description.
Please see Table 11 for an overview of toxic or hazardous substances or
elements that might be contained in product parts in concentrations
above the limits defined by SJ/T 11363-2006.
Table 11: Toxic or hazardous substances or elements with defined concentration limits
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5.2 SAR requirements specific to portable mobiles
27
5.2
SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable ELS31V / ELS51-V based applications
to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For US markets the
relevant directives are mentioned below. It is the responsibility of the manufacturer of the final
product to verify whether or not further standards, recommendations or directives are in force
outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the
frequency range 30MHz - 6GHz
Please note that SAR requirements are specific only for portable devices and not for mobile
devices as defined below:
•
•
Portable device:
A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user.
Mobile device:
A mobile device is defined as a transmitting device designed to be used in other than fixed
locations and to generally be used in such a way that a separation distance of at least 20
centimeters is normally maintained between the transmitter's radiating structure(s) and the
body of the user or nearby persons. In this context, the term ''fixed location'' means that the
device is physically secured at one location and is not able to be easily moved to another
location.
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5.3 Reference Equipment for Type Approval
27
5.3
Reference Equipment for Type Approval
The Gemalto M2M reference setup submitted to type approve ELS31-V / ELS51-V(including a
special approval adapter for the DSB75) is shown in the following figure1:
Antenna
LTE
Base station
GSM/ GPRS / UMTS
Antenna with 1mcable
USB
PC
ASC0
ASC1
Approval adapter for
DSB75
SIMcard
Power
supply
DSB75
SMA
USB
Evaluation module
Evaluation module
ELS31-V
ELS51-V
ELS31-V
ELS51-V
Top view
Bottomview
Figure 10: Reference equipment for Type Approval
1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is chosen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing
the SMA antenna connectors on the ELS31-V- / ELS51-V-DSB75 adapter as shown in Figure 10. The
following products are recommended:
Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)
(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/
Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T
(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)
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5.4 Compliance with FCC and IC Rules and Regulations
27
5.4
Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.3 will be registered under the following identifiers:
•
ELS31-V:
FCC Identifier: QIPELS31-V (not yet granted)
Industry Canada Certification Number: 7830A-ELS31V (not yet granted)
Granted to Gemalto M2M GmbH
•
ELS51-V:
FCC Identifier: QIPELS51-V (not yet granted)
Industry Canada Certification Number: 7830A-ELS51V (not yet granted)
Granted to Gemalto M2M GmbH
Manufacturers of mobile or fixed devices incorporating ELS31-V / ELS51-V modules are authorized to use the FCC Grants and Industry Canada Certificates of the ELS31-V / ELS51-V
modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host
device shall bear a second label stating "Contains FCC ID: QIPELS31-V" / "Contains FCC ID:
QIPELS51-V", and accordingly “Contains IC: 7830A-ELS31V“ / “Contains IC: 7830A-ELS51V“.
The integration is limited to fixed or mobile categorised host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions.
For mobile and fixed operation configurations the antenna gain, including cable loss, must not
exceed the limits in the following Table 12 for FCC and IC.
Table 12: Antenna gain limits for FCC and IC
Operating band
FCC limit
IC limit
Unit
Maximum gain in lower operating bands with f< 1GHz
(LTE Bd13)
10.4
7.4
dBi
Maximum gain in higher operating bands with f=1700MHz
(LTE Bd4)
6.5
6.5
dBi
IMPORTANT:
Manufacturers of portable applications incorporating ELS31V / ELS51-V modules are required
to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements
for portable mobiles (see Section 5.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS
standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference
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5.4 Compliance with FCC and IC Rules and Regulations
27
will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003.
If Canadian approval is requested for devices incorporating ELS31V / ELS51-V modules the
above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does
not contain any information on how to install or remove the module from the final product.
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6 Document Information
32
Document Information
6.1
Revision History
New document: "Cinterion® ELS31-V/ELS51-V Hardware Interface Overview" v00.502
Chapter
What is new
--
Initial document setup.
6.2
[1]
[2]
[3]
[4]
[5]
Related Documents
ELS31-V / ELS51-V AT Command Set
ELS31-V / ELS51-V Release Note
Application Note 40: Thermal Solutions
Application Note 48: SMT Module Integration
Universal Serial Bus Specification Revision 2.0, April 27, 2000
6.3
Terms and Abbreviations
Abbreviation
Description
ADC
Analog-to-digital converter
AGC
Automatic Gain Control
ANSI
American National Standards Institute
ARFCN
Absolute Radio Frequency Channel Number
ARP
Antenna Reference Point
ASC0/ASC1
Asynchronous Controller. Abbreviations used for first and second serial interface of
the modue
Thermistor Constant
BER
Bit Error Rate
BTS
Base Transceiver Station
CB or CBM
Cell Broadcast Message
CE
Conformité Européene (European Conformity)
CHAP
Challenge Handshake Authentication Protocol
CPU
Central Processing Unit
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear to Send
DAC
Digital-to-Analog Converter
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6.3 Terms and Abbreviations
32
Abbreviation
Description
DAI
Digital Audio Interface
dBm0
Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE
Data Communication Equipment (typically modems, e.g. Gemalto M2M module)
DCS 1800
Digital Cellular System, also referred to as PCN
DRX
Discontinuous Reception
DSB
Development Support Box
DSP
Digital Signal Processor
DSR
Data Set Ready
DTE
Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
EIRP
Equivalent Isotropic Radiated Power
EMC
Electromagnetic Compatibility
ERP
Effective Radiated Power
ESD
Electrostatic Discharge
ETS
European Telecommunication Standard
FCC
Federal Communications Commission (U.S.)
FDMA
Frequency Division Multiple Access
FR
Full Rate
GMSK
Gaussian Minimum Shift Keying
GPIO
General Purpose Input/Output
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
HiZ
High Impedance
HR
Half Rate
I/O
Input/Output
IC
Integrated Circuit
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
kbps
kbits per second
LED
Light Emitting Diode
Li-Ion/Li+
Lithium-Ion
Li battery
Rechargeable Lithium Ion or Lithium Polymer battery
LTE
Long Term Evolution
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6.3 Terms and Abbreviations
32
Abbreviation
Description
Mbps
Mbits per second
MMI
Man Machine Interface
MO
Mobile Originated
MS
Mobile Station (GSM module), also referred to as TE
MSISDN
Mobile Station International ISDN number
MT
Mobile Terminated
NTC
Negative Temperature Coefficient
OEM
Original Equipment Manufacturer
PA
Power Amplifier
PAP
Password Authentication Protocol
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board
PCL
Power Control Level
PCM
Pulse Code Modulation
PCN
Personal Communications Network, also referred to as DCS 1800
PCS
Personal Communication System, also referred to as GSM 1900
PDU
Protocol Data Unit
PLL
Phase Locked Loop
PPP
Point-to-point protocol
PSK
Phase Shift Keying
PSU
Power Supply Unit
PWM
Pulse Width Modulation
R&TTE
Radio and Telecommunication Terminal Equipment
RAM
Random Access Memory
RF
Radio Frequency
RLS
Radio Link Stability
RMS
Root Mean Square (value)
RoHS
Restriction of the use of certain hazardous substances in electrical and electronic
equipment.
ROM
Read-only Memory
RTC
Real Time Clock
RTS
Request to Send
Rx
Receive Direction
SAR
Specific Absorption Rate
SAW
Surface Accoustic Wave
SELV
Safety Extra Low Voltage
SIM
Subscriber Identification Module
SMD
Surface Mount Device
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6.3 Terms and Abbreviations
32
Abbreviation
Description
SMS
Short Message Service
SMT
Surface Mount Technology
SRAM
Static Random Access Memory
TA
Terminal adapter (e.g. GSM module)
TDMA
Time Division Multiple Access
TE
Terminal Equipment, also referred to as DTE
TLS
Transport Layer Security
Tx
Transmit Direction
UART
Universal asynchronous receiver-transmitter
URC
Unsolicited Result Code
USSD
Unstructured Supplementary Service Data
VSWR
Voltage Standing Wave Ratio
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6.4 Safety Precaution Notes
32
6.4
Safety Precaution Notes
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating ELS31-V. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply
with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close
to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
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7 Appendix
34
Appendix
7.1
List of Parts and Accessories
Table 13: List of parts and accessories
Description
Supplier
Ordering information
ELS31-V
Gemalto M2M
Standard module
Gemalto M2M IMEI:
Packaging unit (ordering) number:
L30960-N4500-A200
Module label number:
S30960-S4500-A200-1
ELS51-V
Gemalto M2M
Standard module
Gemalto M2M IMEI:
Packaging unit (ordering) number:
L30960-N4530-A100
Module label number:
S30960-S4530-A100-1
ELS31-V Evaluation Module
Gemalto M2M
Ordering number:
L30960-N4501-A200
ELS51-V Evaluation Module
Gemalto M2M
Ordering number:
L30960-N4531-A100
DSB75 Evaluation Kit
Gemalto M2M
Ordering number: L36880-N8811-A100
DSB Mini
Compact Evaluation Board
Gemalto M2M
Ordering number: L30960-N0030-A100
Starter Kit B80
Gemalto M2M
Ordering Number L30960-N0040-A100
Multi-Adapter R1 for mount- Gemalto M2M
ing ELS31-V/ELS51-V evaluation modules onto DSB75
Ordering number: L30960-N0010-A100
Approval adapter for mount- Gemalto M2M
ing ELS31-V/ELS51-V evaluation modules onto DSB75
Ordering number: L30960-N2301-A100
SIM card holder incl. push
button ejector and slide-in
tray
Ordering numbers: 91228
91236
Sales contacts are listed in Table 14.

Molex
ELS31-V_ELS51-V_HIO_v00.502
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2015-12-07
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview
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7.1 List of Parts and Accessories
34
Table 14: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex Deutschland GmbH
Otto-Hahn-Str. 1b
69190 Walldorf
Germany
Phone: +49-6227-3091-0
Fax: +49-6227-3091-8100
Email: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1311, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
110, International Road
Jurong Town,
Singapore 629174
Molex Japan Co. Ltd.
1-5-4 Fukami-Higashi,
Yamato-City,
Kanagawa, 242-8585
Japan
Phone: +65-6-268-6868
Fax: +65-6-265-6044
Phone: +81-46-265-2325
Fax: +81-46-265-2365

ELS31-V_ELS51-V_HIO_v00.502
Confidential / Preliminary
2015-12-07
35
About Gemalto
Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual
revenues of €2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees
operate out of 99 offices, 34 personalization and data centers, and 24 research and software
development centers located in 46 countries.
Gemalto develops secure embedded software and secure products which we design and
personalize. Our platforms and services manage these secure products, the confidential data they
contain and the trusted end-user services they enable. Our innovations enable our clients to offer
trusted and convenient digital services to billions of individuals.
Gemalto thrives with the growing number of people using its solutions to interact with the digital
and wireless world.
For more information please visit
m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter.
Gemalto M2M GmbH
St.-Martin-Str. 60
81541 Munich
Germany
 M2M.GEMALTO.COM
© Gemalto 2015. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. April 2013
We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly
want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere
- in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal
mobile services, payment security, authenticated cloud access, identity and privacy protection,
eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-tomachine (M2M) applications.

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