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 M2M.GEMALTO.COMCinterion® ELS61-USHardware Interface OverviewVersion: 00.281DocId: ELS61-US_HIO_v00.281

Cinterion® ELS61-US Hardware Interface Overview Contents40ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 3 of 40Contents1 Introduction ................................................................................................................. 61.1 Key Features at a Glance .................................................................................. 61.2 ELS61-US System Overview ............................................................................. 92 Interface Characteristics .......................................................................................... 102.1 Application Interface ........................................................................................ 102.1.1 USB Interface...................................................................................... 102.1.2 Serial Interface ASC0 ......................................................................... 112.1.3 Serial Interface ASC1 ......................................................................... 122.1.4 UICC/SIM/USIM Interface................................................................... 132.1.5 GPIO Interface .................................................................................... 152.1.6 I2C Interface ........................................................................................ 162.2 SPI Interface .................................................................................................... 162.2.1 PWM Interfaces .................................................................................. 172.2.2 Pulse Counter ..................................................................................... 172.2.3 Status LED.......................................................................................... 172.2.4 Fast Shutdown .................................................................................... 172.3 RF Antenna Interface....................................................................................... 182.3.1 Antenna Installation ............................................................................ 192.4 Sample Application .......................................................................................... 203 Operating Characteristics ........................................................................................ 223.1 Operating Modes ............................................................................................. 223.2 Power Supply................................................................................................... 234 Mechanical Dimensions ........................................................................................... 244.1 Mechanical Dimensions of ELS61-US ............................................................. 245 Regulatory and Type Approval Information ........................................................... 265.1 Directives and Standards................................................................................. 265.2 SAR requirements specific to portable mobiles ............................................... 295.3 Reference Equipment for Type Approval......................................................... 305.4 Compliance with FCC and IC Rules and Regulations ..................................... 316 Document Information.............................................................................................. 336.1 Revision History ............................................................................................... 336.2 Related Documents ......................................................................................... 336.3 Terms and Abbreviations ................................................................................. 346.4 Safety Precaution Notes .................................................................................. 377 Appendix.................................................................................................................... 387.1 List of Parts and Accessories........................................................................... 38

Cinterion® ELS61-US Hardware Interface Overview Tables114ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 4 of 40TablesTable 1: Signals of the SIM interface (SMT application interface) ............................... 13Table 2: GPIO lines and possible alternative assignment............................................ 15Table 3: Return loss in the active band........................................................................ 18Table 4: Overview of operating modes ........................................................................ 22Table 5: Directives ....................................................................................................... 26Table 6: Standards of North American type approval .................................................. 26Table 7: Standards of European type approval............................................................ 26Table 8: Requirements of quality ................................................................................. 27Table 9: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................ 27Table 10: Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 28Table 11: List of parts and accessories.......................................................................... 38Table 12: Molex sales contacts (subject to change) ...................................................... 39

Cinterion® ELS61-US Hardware Interface Overview Figures114ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 5 of 40FiguresFigure 1: ELS61-US system overview............................................................................. 9Figure 2: USB circuit ..................................................................................................... 10Figure 3: Serial interface ASC0..................................................................................... 11Figure 4: Serial interface ASC1..................................................................................... 12Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 14Figure 6: Schematic diagram of ELS61-US sample application.................................... 21Figure 7: ELS61-US– top and bottom view................................................................... 24Figure 8: Dimensions of ELS61-US (all dimensions in mm) ......................................... 25Figure 9: Reference equipment for Type Approval ....................................................... 30

Cinterion® ELS61-US Hardware Interface Overview1 Introduction9ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 6 of 401 IntroductionThis document1 describes the hardware of the Cinterion® ELS61-US module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.1.1 Key Features at a Glance1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-mentation delivered with your Gemalto M2M product.Feature ImplementationGeneralFrequency bands UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII)LTE: Quad band, 700 (Bd12) / 850 (Bd5) / AWS (Bd4) / 1900MHz (Bd2)Output power (according to Release 99)Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdIIClass 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIVClass 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVOutput power (according to Release 8)Class 3 (+23dBm ±2dB) for LTE 1900,LTE FDD Bd2Class 3 (+23dBm ±2dB) for LTE AWS, LTE FDD Bd4Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12Power supply 3.0V to 4.5VOperating temperature (board temperature)Normal operation: -30°C to +85°CExtended operation: -40°C to +90°CPhysical Dimensions: 27.6mm x 25.4mm x 2.2mmWeight: approx. TBD.gRoHS All hardware components fully compliant with EU RoHS DirectiveLTE features3GPP Release 9 UE CAT 1 supportedDL 10.2Mbps, UL 5.2MbpsHSPA features3GPP Release 8 DL 7.2Mbps, UL 5.7MbpsHSDPA Cat.8 / HSUPA Cat.6 data ratesCompressed mode (CM) supported according to 3GPP TS25.212UMTS features3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps ULCS data rate – 64 kbps DL / 64 kbps UL

Cinterion® ELS61-US Hardware Interface Overview1.1 Key Features at a Glance9ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 8 of 40GPIO interface 22 GPIO lines comprising: 13 lines shared with ASC0, ASC1 and SPI lines, with network status indica-tion, PWM functionality, fast shutdown and pulse counter9 GPIO lines not sharedI2C interface Supports I2C serial interfaceSPI interface Serial peripheral interface, shared with GPIO linesAntenna interface pads 50Ω. UMTS/LTE main antenna, UMTS/LTE Rx Diversity antennaPower on/off, ResetPower on/off Switch-on by hardware signal ONSwitch-off by AT command Switch off by hardware signal FST_SHDN instead of AT commandAutomatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT commandEmergency reset by hardware signal EMERG_RSTSpecial featuresReal time clock Timer functions via AT commandsPhonebook SIM and phoneEvaluation kitEvaluation module ELS61-US module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS61-US evalu-ation module to the DSB75.Feature Implementation

Cinterion® ELS61-US Hardware Interface Overview1.2 ELS61-US System Overview9ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 9 of 401.2 ELS61-US System OverviewFigure 1: ELS61-US system overviewGPIO interfaceI2CUSBASC0 linesASC1/SPICONTROLRTCPOWERRx diversity antenna(UMTS/LTE)ModuleSIM interface(with SIM detection)SIM cardApplicationPower supplyBackup supplyEmergency resetONSerial interface/SPI interfaceSerial modem interface linesI2CGPIO3445291112USBRx diversity1Status LED1DAC (PWM) PWM2Fast shutdown Fast shutdown11COUNTER Pulse counter1ASC0 linesSerial modem interface lines/SPI interface4Main antenna (UMTS/LTE)Main antenna1

Cinterion® ELS61-US Hardware Interface Overview2 Interface Characteristics21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 10 of 402 Interface CharacteristicsELS61-US is equipped with an SMT application interface that connects to the external applica-tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface2.1.1 USB InterfaceELS61-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data in-terface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because ELS61-US is designed as a self-powered device compliant with the “Universal Se-rial Bus Specification Revision 2.0”1.Figure 2: USB circuitTo properly connect the module's USB interface to the external application, a USB 2.0 compat-ible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS61-US needs to be installed.1. The specification is ready for download on http://www.usb.org/developers/docs/VBUSDPDNVREG (3V075)BATT+USB_DP2)lin. reg.GNDModuleDetection only VUSB_INUSB part1)RING0Host wakeup1) All serial (including RS) and pull-up resistors for data lines are implemented.USB_DN2)2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity.RSRSSMT

Cinterion® ELS61-US Hardware Interface Overview2.1 Application Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 11 of 402.1.2 Serial Interface ASC0ELS61-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to the module’s TXD0 signal line• Port RXD @ application receives data from the module’s RXD0 signal lineFigure 3: Serial interface ASC0Features:• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,the modem control lines DTR0, DSR0, DCD0 and RING0.• The RING0 signal serves to indicate incoming calls and other types of URCs (UnsolicitedResult Code). It can also be used to send pulses to the host application, for example towake up the application from power saving state. • Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps.• Autobauding supports bit rates from 1,200bps up to 230,400bps.• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has aninternal pull down resistor causing a low level signal, if the line is not used and open.Although hardware flow control is recommended, this allows communication by using onlyRXD and TXD lines.• Wake up from SLEEP mode by RTS0 activation.

Cinterion® ELS61-US Hardware Interface Overview2.1 Application Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 12 of 402.1.3 Serial Interface ASC1Four ELS61-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connectionsit communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to module’s TXD1 signal line• Port RXD @ application receives data from the module’s RXD1 signal lineFigure 4: Serial interface ASC1Features• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-shake. • On ASC1 no RING line is available.• Configured for 8 data bits, no parity and 1 or 2 stop bits.• ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internalpull down resistor causing a low level signal, if the line is not used and open. Although hard-ware flow control is recommended, this allows communication by using only RXD and TXDlines.

Cinterion® ELS61-US Hardware Interface Overview2.1 Application Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 13 of 402.1.4 UICC/SIM/USIM InterfaceELS61-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. .The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to op-erate with ELS61-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.Note [1]: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS61-US.Note [2]: On the evaluation board, the CCIN signal is inverted, thus the CCIN signal is by default high and will change to a low level if a SIM card is inserted. Table 1: Signals of the SIM interface (SMT application interface)Signal DescriptionGND Separate ground connection for SIM card to improve EMC.CCCLK Chipcard clockCCVCC SIM supply voltage.CCIO Serial data line, input and output.CCRST Chipcard resetCCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted.The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS61-US.

Cinterion® ELS61-US Hardware Interface Overview2.1 Application Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 14 of 40The figure below shows a circuit to connect an external SIM card holder.Figure 5: External UICC/SIM/USIM card holder circuitThe total cable length between the SMT application interface pads on ELS61-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.SIMCCVCCCCRSTCCIOCCCLK220nF1nFCCINV180

Cinterion® ELS61-US Hardware Interface Overview2.1 Application Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 15 of 402.1.5 GPIO InterfaceELS61-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with otherinterfaces or functions: Fast shutdown (see Section 2.2.4), status LED (see Section 2.2.3), thePWM functionality (see Section 2.2.1), an pulse counter (see Section 2.2.2), ASC0 (see Sec-tion 2.1.2), ASC1 (see Section 2.1.3), an SPI interface (see Section 2.2). The following table shows the configuration variants for the GPIO pads. All variants are mutu-ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.After startup, the above mentioned alternative GPIO line assignments can be configured usingAT commands (see [1]). The configuration is non-volatile and available after module restart.Table 2: GPIO lines and possible alternative assignmentGPIO Fast Shutdown Status LED PWM Pulse Counter ASC0 ASC1 SPIGPIO1 DTR0GPIO2 DCD0GPIO3 DSR0 SPI_CLKGPIO4 FST_SHDNGPIO5 Status LEDGPIO6 PWM2GPIO7 PWM1GPIO8 COUNTERGPIO11GPIO12GPIO13GPIO14GPIO15GPIO16 RXD1 MOSIGPIO17 TXD1 MISOGPIO18 RTS1GPIO19 CTS1 SPI_CSGPIO20GPIO21GPIO22GPIO23GPIO24 RING0

Cinterion® ELS61-US Hardware Interface Overview2.2 SPI Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 16 of 402.1.6 I2C InterfaceI2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con-sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module actsas a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-dress, and simple master/slave relationships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only onrequest of the module.The I2C interface can be powered via the V180 line of ELS61-US. If connected to the V180 line,the I2C interface will properly shut down when the module enters the Power Down mode.Note: Good care should be taken when creating the PCB layout of the host application: Thetraces of I2CCLK and I2CDAT should be equal in length and as short as possible.2.2 SPI InterfaceFour ELS61-US GPIO interface lines can be configured as Serial Peripheral Interface (SPI).The SPI is a synchronous serial interface for control and data transfer between ELS61-US andthe external application. Only one application can be connected to the SPI and the interfacesupports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface com-prises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select lineSPI_CS.

Cinterion® ELS61-US Hardware Interface Overview2.2 SPI Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 17 of 402.2.1 PWM InterfacesThe GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interfacelines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzz-ers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOssee Section 2.1.5). GPIO and PWM functionality are mutually exclusive.2.2.2 Pulse CounterThe GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter inter-face can be used, for example, as a clock (for GPIOs see Section 2.1.5).2.2.3 Status LEDThe GPIO5 interface line can be configured to drive a status LED that indicates different oper-ating modes of the module (for GPIOs see Section 2.1.5). GPIO and LED functionality are mu-tually exclusive.2.2.4 Fast ShutdownThe GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-figured FST_SHDN line is an active low control signal and must be applied for at least 10 mil-liseconds. If unused this line can be left open because of a configured internal pull-up resistor.

Cinterion® ELS61-US Hardware Interface Overview2.3 RF Antenna Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 18 of 402.3 RF Antenna InterfaceThe ELS61-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50Ω. ELS61-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.The external antenna must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS61-US module and should be placed in the host application if the an-tenna does not have an impedance of 50Ω.Regarding the return loss ELS61-US provides the following values in the active band:1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module sinceits usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.Table 3: Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable > 12dB

Cinterion® ELS61-US Hardware Interface Overview2.3 RF Antenna Interface21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 19 of 402.3.1 Antenna InstallationThe antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS61-US. All RF data specified throughout this document is related to the ARP.The distance between the antenna pad and its neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application‘s PCB.The wiring of the antenna connection, starting from the antenna pad to the application‘s anten-na should result in a 50Ω line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-nection line using embedded Stripline rather than Micro-Stripline technology. For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS61-US‘s antenna pad.

Cinterion® ELS61-US Hardware Interface Overview2.4 Sample Application21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 20 of 402.4 Sample ApplicationFigure 6 shows a typical example of how to integrate a ELS61-US module with an application.Usage of the various host interfaces depends on the desired features of the application.Because of the very low power consumption design, current flowing from any other source intothe module circuit must be avoided, for example reverse current from high state external controllines. Therefore, the controlling application must be designed to prevent reverse current flow.Otherwise there is the risk of undefined states of the module during startup and shutdown oreven of damaging the module.Because of the high RF field density inside the module, it cannot be guaranteed that no selfinterference might occur, depending on frequency and the applications grounding concept. Thepotential interferers may be minimized by placing small capacitors (47pF) at suspected lines(e.g. RXD0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test pointsfor certain signals, i.e., lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [3].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy foran individual application is very much determined by the overall layout and, especially, the po-sition of components. Note: ELS61-US is not intended for use with cables longer than 3m.DisclaimerNo warranty, either stated or implied, is provided on the sample schematic diagram shown inFigure 6 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operatingsafeguards for their products using ELS61-US modules.

Cinterion® ELS61-US Hardware Interface Overview2.4 Sample Application21ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 21 of 40Figure 6: Schematic diagram of ELS61-US sample applicationVCOREV180ASC0 (including GPIO1...GPIO3 for DSR0, DTR0, DCD0 and GPIO24 for RING0)/SPI_CLK (for DSR0)GPIO16...GPIO19/ASC1/SPI84CCVCCCCIOCCCLKCCINCCRSTSIMV180220nF 1nFI2CCLKI2CDAT2.2kV180GPIO4 (FST_SHDN) GPIO5 (Status LED)GPIO6 (PWM)GPIO7 (PWM)GPIO8 (COUNTER)GPIO11...GPIO15LEDGNDGNDGNDANT_MAINBATT+RFPower supplyMain antennaELS6xAll SIM components should be close to card holder. Keep SIM wires low capacitive.*10pF *10pF* add optional 10pF for SIM protection against RF (internal Antenna)50µF,Low ESR! 33pFBlocking**Blocking**Blocking**PWR_INDBATT+BB53204GPIO20...GPIO234Blocking**100k4.7k100k22k2.2k3USB150µF,Low ESR!33pFGNDGNDANT_DRXDiversity antennaONEMERG_RSTRESETVDDLP100kVDDLPSwitch on

Cinterion® ELS61-US Hardware Interface Overview3 Operating Characteristics23ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 22 of 403 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout the document.Table 4: Overview of operating modesMode FunctionNormal operationUMTS / HSPA / LTE SLEEPPower saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active commu-nication via ASC0. UMTS / HSPA / LTE IDLEPower saving disabled or an USB connection not suspended, but no call in progress.UMTS DATA UMTS data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.HSPA DATA HSPA data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.Power DownNormal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-ing voltage remains applied.Airplane modeAirplane mode shuts down the radio part of the module, causes the module to log off from the network and disables all AT commands whose execution requires a radio connection.Airplane mode can be controlled by AT command (see [1]).

Cinterion® ELS61-US Hardware Interface Overview3.2 Power Supply23ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 23 of 403.2 Power SupplyELS61-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+:•BATT+BB with a line mainly for the baseband power supply.•BATT+RF with a line for the UMTS/LTE power amplifier supply.Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF.The power supply of ELS61-US has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators anda DC-DC step down switching regulator.• Switches the module's power voltages for the power-up and -down procedures.• SIM switch to provide SIM power supply.

Cinterion® ELS61-US Hardware Interface Overview4 Mechanical Dimensions25ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 24 of 404 Mechanical Dimensions4.1 Mechanical Dimensions of ELS61-USFigure 7 shows the top and bottom view of ELS61-US and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Figure 7: ELS61-US– top and bottom viewProduct labelTop viewBottom view

Cinterion® ELS61-US Hardware Interface Overview4.1 Mechanical Dimensions of ELS61-US25ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 25 of 40Figure 8: Dimensions of ELS61-US (all dimensions in mm)

Cinterion® ELS61-US Hardware Interface Overview5 Regulatory and Type Approval Information32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 26 of 405 Regulatory and Type Approval Information5.1 Directives and StandardsELS61-US is designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "ELS61-US Hardware Interface Description".11. Manufacturers of applications which can be used in the US shall ensure that their applications have aPTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. Table 5: Directives1999/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Direc-tive 1999/5/EC).The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1)2011/65/EC (RoHS 2)Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 6: Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCOET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements)NAPRD.03 V5.15 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI controlPCS Type Certification Review board (PTCRB)RSS132 (Issue2)RSS133 (Issue5)Canadian StandardTable 7: Standards of European type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification;GCF-CC V3.49 Global Certification Forum - Certification CriteriaETSI EN 301 489-01 V1.9.2Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical RequirementsETSI EN 301 489-07 V1.3.1Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services;

Cinterion® ELS61-US Hardware Interface Overview5.1 Directives and Standards32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 27 of 40ETSI EN 301 489-24 V1.5.1Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipmentETSI EN 301 908-01 V5.2.1Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cel-lular networks; Part 1: Harmonized EN for IMT-2000, introduction and com-mon requirements of article 3.2 of the R&TTE DirectiveETSI EN 301 908-02 V5.2.1Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cel-lular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE DirectiveEN 62311:2008 Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz)IEC/EN 60950-1:2006/A1:2010+A12:2011IEC 60950-1:2005/A1:2009(second edition)Safety of information technology equipmentTable 8: Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codesTable 9: Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-stances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description.Please see Table 10 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 7: Standards of European type approval

Cinterion® ELS61-US Hardware Interface Overview5.1 Directives and Standards32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 28 of 40Table 10: Toxic or hazardous substances or elements with defined concentration limits

Cinterion® ELS61-US Hardware Interface Overview5.2 SAR requirements specific to portable mobiles32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 29 of 405.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS mod-ule must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS61-US based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US-markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in thefrequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:• Portable device:A portable device is defined as a transmitting device designed to be used so that the radi-ating structure(s) of the device is/are within 20 centimeters of the body of the user.• Mobile device:A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20centimeters is normally maintained between the transmitter's radiating structure(s) and thebody of the user or nearby persons. In this context, the term ''fixed location'' means that thedevice is physically secured at one location and is not able to be easily moved to anotherlocation.

Cinterion® ELS61-US Hardware Interface Overview5.3 Reference Equipment for Type Approval32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 30 of 405.3 Reference Equipment for Type ApprovalThe Gemalto M2M reference setup submitted to type approve ELS61-US (including a special approval adapter for the DSB75) is shown in the following figure1:Figure 9: Reference equipment for Type Approval1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-sen to connect the evaluation module directly to the UMTS test equipment instead of employing the SMAantenna connectors on the ELS61-US-DSB75 adapter as shown in Figure 9. The following products arerecommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)AntennaMa i n AntennaASC0PCPower Suppl yLTE / UMTSBase Stati onDSB75ASC1USBApproval adapter for DSB75SMAUSBSIM CardSMASMARx diversity AntennaEvaluation moduleELS61 Evaluation moduleELS61Top viewBottom view

Cinterion® ELS61-US Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 31 of 405.4 Compliance with FCC and IC Rules and RegulationsThe Equipment Authorization Certification for the Gemalto M2M reference application de-scribed in Section 5.3 will be registered under the following identifiers:FCC Identifier: QIPELS61-USIndustry Canada Certification Number: 7830A-ELS61USGranted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS61-US modules are authorized to use the FCC Grants and Industry Canada Certificates of the ELS61-US modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS61-US", and accordingly “Contains IC: 7830A-ELS61US“. The integration is limited to fixed or mobile categorized host devices, where a sepa-ration distance between the antenna and any person of min. 20cm can be assured during nor-mal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limit 2.15 dBi for 700MHz, 850MHz, 1700MHz and 1900MHz.IMPORTANT: Manufacturers of portable applications incorporating ELS61-US modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-table mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.

Cinterion® ELS61-US Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations32ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 32 of 40If Canadian approval is requested for devices incorporating ELS61-US modules the below notes will have to be provided in the English and French language in the final user documen-tation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.Notes (IC): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-tion is subject to the following two conditions: (1) this devive may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.(EN) Radio frequency (RF) Exposure InformationThe radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.This device has also been evaluated and shown compliant with the IC RF Exposure limits un-der mobile exposure conditions. (antennas are greater than 20cm from a person‘s body).(FR) Informations concernant l'exposltion aux fréquences radio (RF)La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux fréquences radio d‘Industry Canada (IC). Utilisez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement normal.Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20cm du corps d'une personne).

Cinterion® ELS61-US Hardware Interface Overview6 Document Information37ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 33 of 406 Document Information6.1 Revision HistoryNew document: "Cinterion® ELS61-US Hardware Interface Overview" Version 00.2816.2 Related Documents[1] ELS61-US AT Command Set[2] ELS61-US Release Note[3] Application Note 48: SMT Module Integration[4] Application Note 40: Thermal Solutions[5] Universal Serial Bus Specification Revision 2.0, April 27, 2000Chapter What is new-- Initial document setup.

Cinterion® ELS61-US Hardware Interface Overview6.3 Terms and Abbreviations37ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 34 of 406.3 Terms and AbbreviationsAbbreviation DescriptionADC Analog-to-digital converterAGC Automatic Gain ControlANSI American National Standards InstituteARFCN Absolute Radio Frequency Channel NumberARP Antenna Reference PointASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of ELS61-USB Thermistor ConstantBER Bit Error RateBIP Bearer Independent ProtocolBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CHAP Challenge Handshake Authentication ProtocolCPU Central Processing UnitCS Coding SchemeCSD Circuit Switched DataCTS Clear to SendDAC Digital-to-Analog ConverterDAI Digital Audio InterfacedBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module)DRX Discontinuous ReceptionDSB Development Support BoxDSP Digital Signal ProcessorDSR Data Set ReadyDTE Data Terminal Equipment (typically computer, terminal, printer or, for example, UMTS application)DTR Data Terminal ReadyDTX Discontinuous TransmissionEFR Enhanced Full RateEIRP Equivalent Isotropic Radiated PowerEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication Standard

Cinterion® ELS61-US Hardware Interface Overview6.3 Terms and Abbreviations37ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 35 of 40FCC Federal Communications Commission (U.S.)FDMA Frequency Division Multiple AccessFR Full RateGMSK Gaussian Minimum Shift KeyingGPIO General Purpose Input/OutputHiZ High ImpedanceHR Half RateI/O Input/OutputIC Integrated CircuitIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLi-Ion/Li+ Lithium-IonLi battery Rechargeable Lithium Ion or Lithium Polymer batteryLPM Link Power ManagementMbps Mbits per secondMMI Man Machine InterfaceMO Mobile OriginatedMS Mobile Station (UMTS module), also referred to as TEMSISDN Mobile Station International ISDN numberMT Mobile TerminatedNTC Negative Temperature CoefficientOEM Original Equipment ManufacturerPA Power AmplifierPAP Password Authentication ProtocolPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPDU Protocol Data UnitPLL Phase Locked LoopPPP Point-to-point protocolPSK Phase Shift KeyingPSU Power Supply UnitPWM Pulse Width ModulationR&TTE Radio and Telecommunication Terminal EquipmentAbbreviation Description

Cinterion® ELS61-US Hardware Interface Overview6.3 Terms and Abbreviations37ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 36 of 40RAM Random Access MemoryRF Radio FrequencyRLS Radio Link StabilityRMS Root Mean Square (value)RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. ROM Read-only MemoryRTC Real Time ClockRTS Request to SendRx Receive DirectionSAR Specific Absorption RateSAW Surface Accoustic WaveSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceSMT Surface Mount TechnologySPI Serial Peripheral InterfaceSRAM Static Random Access MemoryTA Terminal adapter (e.g. UMTS module)TDMA Time Division Multiple AccessTE Terminal Equipment, also referred to as DTETLS Transport Layer SecurityTx Transmit DirectionUART Universal asynchronous receiver-transmitterURC Unsolicited Result CodeUSSD Unstructured Supplementary Service DataVSWR Voltage Standing Wave RatioAbbreviation Description

Cinterion® ELS61-US Hardware Interface Overview6.4 Safety Precaution Notes37ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 37 of 406.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS61-US. Manufacturers of the cellular terminal are advised to convey the following safety information to users and oper-ating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.

Cinterion® ELS61-US Hardware Interface Overview7 Appendix39ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 38 of 407 Appendix7.1 List of Parts and AccessoriesTable 11: List of parts and accessoriesDescription Supplier Ordering informationELS61-US Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number: L30960-N4401-A100Module label number: S30960-S4401-A100-1ELS61-US Evaluation Mod-uleGemalto M2M Ordering number: L30960-N4400-A100 (ELS61-US)DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100DSB MiniCompact Evaluation BoardGemalto M2M Ordering number: L30960-N0030-A100Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100Multi-Adapter R1 for mount-ing ELS61-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N0010-A100Approval adapter for mount-ing ELS61-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N2301-A100Votronic Handset Votronic / Gemalto M2MGemalto M2M ordering number: L36880-N8301-A107Votronic ordering number: HH-SI-30.3/V1.1/0Votronic Entwicklungs- und Produktionsgesellschaft für elek-tronische Geräte mbHSaarbrücker Str. 866386 St. IngbertGermanyPhone: +49-(0)6 89 4 / 92 55-0Fax: +49-(0)6 89 4 / 92 55-88Email: contact@votronic.comSIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers: 91228 91236Sales contacts are listed in Table 12.

Cinterion® ELS61-US Hardware Interface Overview7.1 List of Parts and Accessories39ELS61-US_HIO_v00.281 2016-02-11Confidential / PreliminaryPage 39 of 40Table 12: Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email: mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone: +86-10-6526-9628 Fax: +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone: +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone: +81-46-265-2325Fax: +81-46-265-2365