THALES DIS AlS Deutschland ELS61-US LTE/WCDMA Module User Manual els61 us hid
Gemalto M2M GmbH LTE/WCDMA Module els61 us hid
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Cinterion® ELS61-US Hardware Interface Overview Version: DocId: 00.281 ELS61-US_HIO_v00.281 M2M.GEMALTO.COM Cinterion® ELS61-US Hardware Interface Overview Page 2 of 40 Document Name: Cinterion® ELS61-US Hardware Interface Overview Version: 00.281 Date: 2016-02-11 DocId: ELS61-US_HIO_v00.281 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © 2016, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 3 of 40 Contents 40 Contents Introduction ................................................................................................................. 6 1.1 Key Features at a Glance .................................................................................. 6 1.2 ELS61-US System Overview ............................................................................. 9 Interface Characteristics .......................................................................................... 10 2.1 Application Interface ........................................................................................ 10 2.1.1 USB Interface...................................................................................... 10 2.1.2 Serial Interface ASC0 ......................................................................... 11 2.1.3 Serial Interface ASC1 ......................................................................... 12 2.1.4 UICC/SIM/USIM Interface................................................................... 13 2.1.5 GPIO Interface .................................................................................... 15 2.1.6 I2C Interface ........................................................................................ 16 2.2 SPI Interface .................................................................................................... 16 2.2.1 PWM Interfaces .................................................................................. 17 2.2.2 Pulse Counter ..................................................................................... 17 2.2.3 Status LED.......................................................................................... 17 2.2.4 Fast Shutdown .................................................................................... 17 2.3 RF Antenna Interface....................................................................................... 18 2.3.1 Antenna Installation ............................................................................ 19 2.4 Sample Application .......................................................................................... 20 Operating Characteristics ........................................................................................ 22 3.1 Operating Modes ............................................................................................. 22 3.2 Power Supply................................................................................................... 23 Mechanical Dimensions ........................................................................................... 24 4.1 Mechanical Dimensions of ELS61-US ............................................................. 24 Regulatory and Type Approval Information ........................................................... 26 5.1 Directives and Standards................................................................................. 26 5.2 SAR requirements specific to portable mobiles ............................................... 29 5.3 Reference Equipment for Type Approval ......................................................... 30 5.4 Compliance with FCC and IC Rules and Regulations ..................................... 31 Document Information.............................................................................................. 33 6.1 Revision History ............................................................................................... 33 6.2 Related Documents ......................................................................................... 33 6.3 Terms and Abbreviations ................................................................................. 34 6.4 Safety Precaution Notes .................................................................................. 37 Appendix.................................................................................................................... 38 7.1 List of Parts and Accessories........................................................................... 38 ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 4 of 40 Tables 114 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Signals of the SIM interface (SMT application interface) ............................... GPIO lines and possible alternative assignment............................................ Return loss in the active band........................................................................ Overview of operating modes ........................................................................ Directives ....................................................................................................... Standards of North American type approval .................................................. Standards of European type approval............................................................ Requirements of quality ................................................................................. Standards of the Ministry of Information Industry of the People’s Republic of China ............................................................................ Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................... List of parts and accessories.......................................................................... Molex sales contacts (subject to change) ...................................................... ELS61-US_HIO_v00.281 Confidential / Preliminary 13 15 18 22 26 26 26 27 27 28 38 39 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 5 of 40 Figures 114 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: ELS61-US system overview............................................................................. 9 USB circuit ..................................................................................................... 10 Serial interface ASC0..................................................................................... 11 Serial interface ASC1..................................................................................... 12 External UICC/SIM/USIM card holder circuit ................................................. 14 Schematic diagram of ELS61-US sample application.................................... 21 ELS61-US– top and bottom view ................................................................... 24 Dimensions of ELS61-US (all dimensions in mm) ......................................... 25 Reference equipment for Type Approval ....................................................... 30 ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 6 of 40 1 Introduction Introduction This document1 describes the hardware of the Cinterion® ELS61-US module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 Key Features at a Glance Feature Implementation General Frequency bands UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII) LTE: Quad band, 700 (Bd12) / 850 (Bd5) / AWS (Bd4) / 1900MHz (Bd2) Output power (according to Release 99) Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Output power (according to Release 8) Class 3 (+23dBm ±2dB) for LTE 1900,LTE FDD Bd2 Class 3 (+23dBm ±2dB) for LTE AWS, LTE FDD Bd4 Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12 Power supply 3.0V to 4.5V Operating temperature (board temperature) Normal operation: -30°C to +85°C Extended operation: -40°C to +90°C Physical Dimensions: 27.6mm x 25.4mm x 2.2mm Weight: approx. TBD.g RoHS All hardware components fully compliant with EU RoHS Directive LTE features 3GPP Release 9 UE CAT 1 supported DL 10.2Mbps, UL 5.2Mbps HSPA features 3GPP Release 8 DL 7.2Mbps, UL 5.7Mbps HSDPA Cat.8 / HSUPA Cat.6 data rates Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features 3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL CS data rate – 64 kbps DL / 64 kbps UL 1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 7 of 40 1.1 Key Features at a Glance Feature Implementation SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility Java™ Open Platform Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.1 HI • Secure data transmission via HTTPS/SSL • Multi-threading programming and multi-application execution Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely cost-efficient hardware and software design – ideal platform for industrial applications. The memory space available for Java programs is around 30MB in the flash file system and around 18MB RAM. Application code and data share the space in the flash file system and in RAM. Microsoft™ compatibility RIL for Pocket PC and Smartphone SIM Application Toolkit SAT letter classes b, c, e; with BIP Firmware update Generic update from host application over ASC0 or USB modem. Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equipment. USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant 2 serial interfaces ASC0 (shared with GPIO lines): • 8-wire modem interface with status and control lines, unbalanced, asynchronous • Adjustable baud rates: 1,200bps to 921,600bps • Autobauding: 1,200bps to 230,400bps • Supports RTS0/CTS0 hardware flow control. ASC1 (shared with GPIO lines): • 4-wire, unbalanced asynchronous interface • Adjustable baud rates: 1,200bps to 921,60bps • Autobauding: 1,200bps to 230,400bps • Supports RTS1/CTS1 hardware flow control UICC interface Supported SIM/USIM cards: 3V, 1.8V ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 8 of 40 1.1 Key Features at a Glance Feature Implementation GPIO interface 22 GPIO lines comprising: 13 lines shared with ASC0, ASC1 and SPI lines, with network status indication, PWM functionality, fast shutdown and pulse counter 9 GPIO lines not shared I2C interface Supports I2C serial interface SPI interface Serial peripheral interface, shared with GPIO lines Antenna interface pads 50Ω. UMTS/LTE main antenna, UMTS/LTE Rx Diversity antenna Power on/off, Reset Power on/off Switch-on by hardware signal ON Switch-off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST Special features Real time clock Timer functions via AT commands Phonebook SIM and phone Evaluation kit Evaluation module ELS61-US module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75. DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS61-US evaluation module to the DSB75. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 9 of 40 1.2 ELS61-US System Overview 1.2 ELS61-US System Overview Application Serial interface/ SPI interface COUNTER ASC0 lines ASC0 lines I2C Serial modem interface lines I2C USB Backup supply Power supply ON Emergency reset POWER Main antenna (UMTS/LTE) Rx diversity antenna (UMTS/LTE) Main antenna RTC Rx diversity CONTROL SIM card (with SIM detection) SIM interface Pulse counter Serial modem interface lines/ SPI interface USB ASC1/SPI Fast shutdown Fast shutdown PWM DAC (PWM) LED Status GPIO Module GPIO interface Figure 1: ELS61-US system overview ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 10 of 40 2 Interface Characteristics 21 Interface Characteristics ELS61-US is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface ELS61-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because ELS61-US is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 2.0”1. Module SMT VREG (3V075) lin. reg. BATT+ GND USB part1) VBUS Detection only VUSB_IN RS RS DP DN Host wakeup USB_DP2) USB_DN2) RING0 1) All serial (including RS) and pull-up resistors for data lines are implemented. If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. 2) Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS61-US needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/ ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 11 of 40 2.1 Application Interface 21 2.1.2 Serial Interface ASC0 ELS61-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: • Port TXD @ application sends data to the module’s TXD0 signal line • Port RXD @ application receives data from the module’s RXD0 signal line Figure 3: Serial interface ASC0 Features: • Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. • The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. • Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. • Wake up from SLEEP mode by RTS0 activation. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 12 of 40 2.1 Application Interface 21 2.1.3 Serial Interface ASC1 Four ELS61-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS61-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: • Port TXD @ application sends data to module’s TXD1 signal line • Port RXD @ application receives data from the module’s RXD1 signal line Figure 4: Serial interface ASC1 Features • Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake. • On ASC1 no RING line is available. • Configured for 8 data bits, no parity and 1 or 2 stop bits. • ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 13 of 40 2.1 Application Interface 21 2.1.4 UICC/SIM/USIM Interface ELS61-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. . The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with ELS61-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers. Table 1: Signals of the SIM interface (SMT application interface) Signal Description GND Separate ground connection for SIM card to improve EMC. CCCLK Chipcard clock CCVCC SIM supply voltage. CCIO Serial data line, input and output. CCRST Chipcard reset CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS61-US. Note [1]: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS61-US. Note [2]: On the evaluation board, the CCIN signal is inverted, thus the CCIN signal is by default high and will change to a low level if a SIM card is inserted. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 14 of 40 2.1 Application Interface 21 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS61-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 15 of 40 2.1 Application Interface 21 2.1.5 GPIO Interface ELS61-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other interfaces or functions: Fast shutdown (see Section 2.2.4), status LED (see Section 2.2.3), the PWM functionality (see Section 2.2.1), an pulse counter (see Section 2.2.2), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), an SPI interface (see Section 2.2). The following table shows the configuration variants for the GPIO pads. All variants are mutually exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 2: GPIO lines and possible alternative assignment GPIO Fast Shutdown Status LED PWM Pulse Counter ASC0 GPIO1 DTR0 GPIO2 DCD0 GPIO3 DSR0 GPIO4 GPIO5 SPI SPI_CLK FST_SHDN Status LED GPIO6 PWM2 GPIO7 PWM1 GPIO8 ASC1 COUNTER GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 RXD1 MOSI GPIO17 TXD1 MISO GPIO18 RTS1 GPIO19 CTS1 SPI_CS GPIO20 GPIO21 GPIO22 GPIO23 GPIO24 RING0 After startup, the above mentioned alternative GPIO line assignments can be configured using AT commands (see [1]). The configuration is non-volatile and available after module restart. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 16 of 40 2.2 SPI Interface 21 2.1.6 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as mastertransmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C interface can be powered via the V180 line of ELS61-US. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. 2.2 SPI Interface Four ELS61-US GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS61-US and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 17 of 40 2.2 SPI Interface 21 2.2.1 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.5). GPIO and PWM functionality are mutually exclusive. 2.2.2 Pulse Counter The GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter interface can be used, for example, as a clock (for GPIOs see Section 2.1.5). 2.2.3 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different operating modes of the module (for GPIOs see Section 2.1.5). GPIO and LED functionality are mutually exclusive. 2.2.4 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The configured FST_SHDN line is an active low control signal and must be applied for at least 10 milliseconds. If unused this line can be left open because of a configured internal pull-up resistor. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 18 of 40 2.3 RF Antenna Interface 21 2.3 RF Antenna Interface The ELS61-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50Ω. ELS61-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS61-US module and should be placed in the host application if the antenna does not have an impedance of 50Ω. Regarding the return loss ELS61-US provides the following values in the active band: Table 3: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive > 8dB > 12dB Transmit not applicable > 12dB 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 19 of 40 2.3 RF Antenna Interface 21 2.3.1 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS61-US. All RF data specified throughout this document is related to the ARP. The distance between the antenna pad and its neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application‘s PCB. The wiring of the antenna connection, starting from the antenna pad to the application‘s antenna should result in a 50Ω line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS61-US‘s antenna pad. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 20 of 40 2.4 Sample Application 21 2.4 Sample Application Figure 6 shows a typical example of how to integrate a ELS61-US module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines (e.g. RXD0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. Note: ELS61-US is not intended for use with cables longer than 3m. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 6 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using ELS61-US modules. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 21 of 40 2.4 Sample Application 21 Main antenna GND VDDLP ANT_MAIN Switch on GND EMERG_RST ANT_DRX GND 100k RESET Diversity antenna GND ON VDDLP V180 PWR_IND BATT+RF VCORE 22k BATT+BB 150µF, Low ESR! 53 33pF 204 Power supply 100k 50µF, Low ESR! 4.7k 33pF ELS6x 100k Blocking** Blocking** GPIO20...GPIO23 GPIO16...GPIO19/ ASC1/ SPI ASC0 (including GPIO1...GPIO3 for DSR0, DTR0, DCD0 and GPIO24 for RING0)/SPI_CLK (for DSR0) GPIO4 (FST_SHDN) GPIO5 (Status LED) GPIO6 (PWM) GPIO7 (PWM) GPIO8 (COUNTER) GPIO11...GPIO15 USB * add optional 10pF for SIM protection against RF (internal Antenna) LED Blocking** Blocking** V180 *10pF *10pF CCIN CCVCC CCIO SIM V180 1nF CCCLK 2.2k 220nF 2.2k CCRST I2CCLK All SIM components should be close to card holder. Keep SIM wires low capacitive. I2CDAT GND Figure 6: Schematic diagram of ELS61-US sample application ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 22 of 40 3 Operating Characteristics 23 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 4: Overview of operating modes Mode Function Normal UMTS / HSPA / operation LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0. UMTS / HSPA / LTE IDLE Power saving disabled or an USB connection not suspended, but no call in progress. UMTS DATA UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. HSPA DATA HSPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. Power Down Normal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage remains applied. Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 23 of 40 3.2 Power Supply 23 3.2 Power Supply ELS61-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line mainly for the baseband power supply. • BATT+RF with a line for the UMTS/LTE power amplifier supply. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The power supply of ELS61-US has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features: • • • Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 24 of 40 4 Mechanical Dimensions 25 Mechanical Dimensions 4.1 Mechanical Dimensions of ELS61-US Figure 7 shows the top and bottom view of ELS61-US and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Product label Top view Bottom view Figure 7: ELS61-US– top and bottom view ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 25 of 40 4.1 Mechanical Dimensions of ELS61-US 25 Figure 8: Dimensions of ELS61-US (all dimensions in mm) ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 26 of 40 5 Regulatory and Type Approval Information 32 Regulatory and Type Approval Information 5.1 Directives and Standards ELS61-US is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "ELS61-US Hardware Interface Description".1 Table 5: Directives 1999/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC). The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 6: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC OET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.15 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard Table 7: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification; GCF-CC V3.49 Global Certification Forum - Certification Criteria ETSI EN 301 489-01 V1.9.2 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements ETSI EN 301 489-07 V1.3.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 27 of 40 5.1 Directives and Standards 32 Table 7: Standards of European type approval ETSI EN 301 489-24 V1.5.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment ETSI EN 301 908-01 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE Directive ETSI EN 301 908-02 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive EN 62311:2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) IEC/EN 60950-1:2006/ A1:2010+A12:2011 IEC 60950-1:2005/ A1:2009 (second edition) Safety of information technology equipment Table 8: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes Table 9: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06). According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description. Please see Table 10 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 28 of 40 5.1 Directives and Standards 32 Table 10: Toxic or hazardous substances or elements with defined concentration limits ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 29 of 40 5.2 SAR requirements specific to portable mobiles 32 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS61-US based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US-markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below: • Portable device: A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. • Mobile device: A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 30 of 40 5.3 Reference Equipment for Type Approval 32 5.3 Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve ELS61-US (including a special approval adapter for the DSB75) is shown in the following figure1: Antenna LTE / UMTS Base Station Main Antenna Rx diversity Antenna USB PC ASC0 ASC1 Approval adapter for DSB75 SIMCard Power Supply SMA SMA DSB75 SMA USB Evaluation module Evaluation module ELS61 ELS61 Top view Bottomview Figure 9: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is chosen to connect the evaluation module directly to the UMTS test equipment instead of employing the SMA antenna connectors on the ELS61-US-DSB75 adapter as shown in Figure 9. The following products are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40) (for details see http://www.hirose-connectors.com/ or http://www.farnell.com/ Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 31 of 40 5.4 Compliance with FCC and IC Rules and Regulations 32 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.3 will be registered under the following identifiers: FCC Identifier: QIPELS61-US Industry Canada Certification Number: 7830A-ELS61US Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS61-US modules are authorized to use the FCC Grants and Industry Canada Certificates of the ELS61-US modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS61-US", and accordingly “Contains IC: 7830AELS61US“. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limit 2.15 dBi for 700MHz, 850MHz, 1700MHz and 1900MHz. IMPORTANT: Manufacturers of portable applications incorporating ELS61-US modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 32 of 40 5.4 Compliance with FCC and IC Rules and Regulations 32 If Canadian approval is requested for devices incorporating ELS61-US modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. Notes (IC): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: (1) this devive may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. (FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement. (EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the IC RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a person‘s body). (FR) Informations concernant l'exposltion aux fréquences radio (RF) La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux fréquences radio d‘Industry Canada (IC). Utilisez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement normal. Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20cm du corps d'une personne). ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 33 of 40 6 Document Information 37 Document Information 6.1 Revision History New document: "Cinterion® ELS61-US Hardware Interface Overview" Version 00.281 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents ELS61-US AT Command Set ELS61-US Release Note Application Note 48: SMT Module Integration Application Note 40: Thermal Solutions Universal Serial Bus Specification Revision 2.0, April 27, 2000 ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 34 of 40 6.3 Terms and Abbreviations 37 6.3 Terms and Abbreviations Abbreviation Description ADC Analog-to-digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of ELS61-US Thermistor Constant BER Bit Error Rate BIP Bearer Independent Protocol BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module) DRX Discontinuous Reception DSB Development Support Box DSP Digital Signal Processor DSR Data Set Ready DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, UMTS application) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 35 of 40 6.3 Terms and Abbreviations 37 Abbreviation Description FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPIO General Purpose Input/Output HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Li-Ion/Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery LPM Link Power Management Mbps Mbits per second MMI Man Machine Interface MO Mobile Originated MS Mobile Station (UMTS module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coefficient OEM Original Equipment Manufacturer PA Power Amplifier PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PDU Protocol Data Unit PLL Phase Locked Loop PPP Point-to-point protocol PSK Phase Shift Keying PSU Power Supply Unit PWM Pulse Width Modulation R&TTE Radio and Telecommunication Terminal Equipment ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 36 of 40 6.3 Terms and Abbreviations 37 Abbreviation Description RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RMS Root Mean Square (value) RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. ROM Read-only Memory RTC Real Time Clock RTS Request to Send Rx Receive Direction SAR Specific Absorption Rate SAW Surface Accoustic Wave SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMD Surface Mount Device SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface SRAM Static Random Access Memory TA Terminal adapter (e.g. UMTS module) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 37 of 40 6.4 Safety Precaution Notes 37 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS61-US. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard. IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 38 of 40 7 Appendix 39 Appendix 7.1 List of Parts and Accessories Table 11: List of parts and accessories Description Supplier Ordering information ELS61-US Gemalto M2M Standard module Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N4401-A100 Module label number: S30960-S4401-A100-1 ELS61-US Evaluation Mod- Gemalto M2M Ordering number: L30960-N4400-A100 (ELS61-US) ule DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100 DSB Mini Compact Evaluation Board Gemalto M2M Ordering number: L30960-N0030-A100 Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100 Multi-Adapter R1 for mount- Gemalto M2M Ordering number: L30960-N0010-A100 ing ELS61-US evaluation modules onto DSB75 Approval adapter for mount- Gemalto M2M Ordering number: L30960-N2301-A100 ing ELS61-US evaluation modules onto DSB75 Votronic Handset Votronic / Gemalto M2M ordering number: L36880-N8301-A107 Gemalto M2M Votronic ordering number: HH-SI-30.3/V1.1/0 Votronic Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 12. ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 Cinterion® ELS61-US Hardware Interface Overview Page 39 of 40 7.1 List of Parts and Accessories 39 Table 12: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 ELS61-US_HIO_v00.281 Confidential / Preliminary 2016-02-11 40 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual revenues of €2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees operate out of 99 offices, 34 personalization and data centers, and 24 research and software development centers located in 46 countries. Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offer trusted and convenient digital services to billions of individuals. Gemalto thrives with the growing number of people using its solutions to interact with the digital and wireless world. For more information please visit m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter. Gemalto M2M GmbH St.-Martin-Str. 60 81541 Munich Germany M2M.GEMALTO.COM © Gemalto 2016. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. April 2013 We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere - in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-tomachine (M2M) applications.
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