THALES DIS AlS Deutschland HC25 GSM/GPRS/EDGE/UMTS/HSDPA MODULE User Manual HC25 Hardware Interface Overview
Gemalto M2M GmbH GSM/GPRS/EDGE/UMTS/HSDPA MODULE HC25 Hardware Interface Overview
User Manual
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| Document ID | 771663 |
| Application ID | GAd4QS96qVs8aiCAbZCm7g== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 59.29kB (741144 bits) |
| Date Submitted | 2007-03-23 00:00:00 |
| Date Available | 2007-03-23 00:00:00 |
| Creation Date | 2007-03-20 08:19:21 |
| Producing Software | Acrobat Distiller 7.0 (Windows) |
| Document Lastmod | 2007-03-20 09:23:17 |
| Document Title | HC25 Hardware Interface Overview |
| Document Creator | FrameMaker 7.0 |
| Document Author: | hc30217 |
HC25 Siemens Cellular Engine Version: DocId: 00.220 HC25_HO_v00.220 Hardware Interface Overview HC25 Hardware Interface Overview Document Name: HC25 Hardware Interface Overview Version: 00.220 Date: 2007-03-20 DocId: HC25_HO_v00.220 Status: Confidential / Preliminary Supported Products: HC25 General Notes Product is deemed accepted by Recipient and is provided without interface to Recipient´s products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © Siemens AG 2007 HC25_HO_v00.220 Confidential / Preliminary Page 2 of 39 2007-03-20 HC25 Hardware Interface Overview Contents 39 Contents Introduction ................................................................................................................. 6 1.1 Related Documents ........................................................................................... 6 1.2 Terms and Abbreviations ................................................................................... 6 1.3 Regulatory and Type Approval Information ....................................................... 9 1.3.1 Directives and Standards...................................................................... 9 1.4 SAR requirements specific to portable mobiles ............................................... 11 1.4.1 SELV Requirements ........................................................................... 11 1.5 Safety Precautions........................................................................................... 12 Product Concept ....................................................................................................... 13 2.1 Key Features at a Glance ................................................................................ 13 Application Interface................................................................................................. 16 3.1 Operating Modes ............................................................................................. 16 Antenna Interface...................................................................................................... 17 4.1 Antenna Installation ......................................................................................... 17 4.2 Antenna Pad .................................................................................................... 18 4.3 Antenna Connector .......................................................................................... 19 Electrical, Reliability and Radio Characteristics.................................................... 23 5.1 Absolute Maximum Ratings ............................................................................. 23 5.2 Operating Temperatures.................................................................................. 24 5.3 Storage Conditions .......................................................................................... 25 5.4 Reliability Characteristics ................................................................................. 26 Mechanics.................................................................................................................. 27 6.1 Mechanical Dimensions of HC25..................................................................... 27 6.2 Mounting HC25 to the Application Platform ..................................................... 29 6.3 Board-to-Board Application Connector ............................................................ 29 Reference Approval .................................................................................................. 31 7.1 Reference Equipment for Type Approval......................................................... 31 7.2 Compliance with FCC Rules and Regulations ................................................. 32 Appendix.................................................................................................................... 33 8.1 List of Parts and Accessories........................................................................... 33 8.2 Fasteners and Fixings for Electronic Equipment ............................................. 35 8.2.1 Fasteners from German Supplier ETTINGER GmbH ......................... 35 8.3 Mounting Advice Sheet .................................................................................... 38 HC25_HO_v00.220 Confidential / Preliminary Page 3 of 39 2007-03-20 HC25 Hardware Interface Overview Tables Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Directives ......................................................................................................... 9 Standards of North American type approval .................................................... 9 Standards of European type approval.............................................................. 9 Requirements of quality ................................................................................. 10 Overview of operating modes ........................................................................ 16 Return loss in the active band........................................................................ 17 Product specifications of U.FL-R-SMT connector .......................................... 19 Material and finish of U.FL-R-SMT connector and recommended plugs ....... 20 Ordering information for Hirose U.FL Series.................................................. 22 Absolute maximum ratings............................................................................. 23 Board temperature ......................................................................................... 24 Sample operating conditions without forced air circulation (according to IEC 60068-2) ............................................................................ 24 Sample operating conditions with forced air circulation (air speed 0.9m/s) ... 24 Storage conditions ......................................................................................... 25 Summary of reliability test conditions............................................................. 26 Electrical and mechanical characteristics of the board-to-board connector... 29 List of parts and accessories.......................................................................... 33 Molex sales contacts (subject to change) ...................................................... 34 Hirose sales contacts (subject to change) ..................................................... 34 HC25_HO_v00.220 Confidential / Preliminary Page 4 of 39 2007-03-20 HC25 Hardware Interface Overview Figures Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Restricted area around antenna pad (side and bottom view) ......................... 18 Mechanical dimensions of U.FL-R-SMT connector......................................... 19 U.FL-R-SMT connector with U.FL-LP-040 plug .............................................. 20 U.FL-R-SMT connector with U.FL-LP-066 plug .............................................. 20 Specifications of U.FL-LP-(V)-040(01) plug .................................................... 21 HC25 – Top and bottom view.......................................................................... 27 Dimensions of HC25 (all dimensions in mm) .................................................. 28 Mechanical dimensions of the board-to-board connector ............................... 30 Reference equipment for Type Approval ........................................................ 31 HC25_HO_v00.220 Confidential / Preliminary Page 5 of 39 2007-03-20 HC25 Hardware Interface Overview 1 Introduction 12 Introduction This document describes the hardware of the Siemens HC25 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 [1] [2] Related Documents HC25 AT Command Set 00.220 HC25 Release Notes 00.220 1.2 Terms and Abbreviations Abbreviation Description ANSI American National Standards Institute AMR Adaptive Multirate ARP Antenna Reference Point B2B Board-to-board connector BB Baseband BEP Bit Error Probability BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CS Coding Scheme CS Circuit Switched CSD Circuit Switched Data DAC Digital-to-Analog Converter dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCS Digital Cellular System DL Download DRX Discontinuous Reception DSB Development Support Board DSP Digital Signal Processor DTMF Dual Tone Multi Frequency DTX Discontinuous Transmission EDGE Enhanced Data rates for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM HC25_HO_v00.220 Confidential / Preliminary Page 6 of 39 2007-03-20 HC25 Hardware Interface Overview 1.2 Terms and Abbreviations 12 Abbreviation Description EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard ETSI European Telecommunications Standards Institute FCC Federal Communications Commission (U.S.) FDD Frequency Division Duplex FDMA Frequency Division Multiple Access FR Full Rate GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HSDPA High Speed Downlink Packed Access HR Half Rate I/O Input/Output IF Intermediate Frequency IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Mbps Mbits per second MCS Modulation and Coding Scheme MO Mobile Originated MS Mobile Station, also referred to as TE MT Mobile Terminated NTC Negative Temperature Coefficient PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCS Personal Communication System, also referred to as GSM 1900 PS Packet Switched PDU Protocol Data Unit PSK Phase Shift Keying R&TTE Radio and Telecommunication Terminal Equipment HC25_HO_v00.220 Confidential / Preliminary Page 7 of 39 2007-03-20 HC25 Hardware Interface Overview 1.2 Terms and Abbreviations 12 Abbreviation Description RACH Random Access Channel RF Radio Frequency RTC Real Time Clock Rx Receive Direction SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscriber Identification Module SLIC Subscriber Line Interface Circuit SMS Short Message Service SRAM Static Random Access Memory SRB Signalling Radio Bearer TA Terminal adapter (e.g. GSM engine) TDMA Time Division Multiple Access TE Terminal Equipment TS Technical Specification Tx Transmit Direction UL Upload UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code USB Universal Serial Bus UICC USIM Integrated Circuit Card USIM UMTS Subscriber Identification Module WCDMA Wideband Code Division Multiple Access HC25_HO_v00.220 Confidential / Preliminary Page 8 of 39 2007-03-20 HC25 Hardware Interface Overview 1.3 Regulatory and Type Approval Information 12 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards HC25 has been designed to comply with the directives and standards listed below. Table 1: Directives 99/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC). The product is labeled with the CE conformity mark 2002/95/EC Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 2: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC UL 60 950 Product Safety Certification (Safety requirements) NAPRD.03 V3.9.1 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132, RSS133 Canadian Standard Table 3: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998) GCF-CC V3.23.1 Global Certification Forum - Certification Criteria ETSI EN 301 489-1 V1.4.1 Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements ETSI EN 301 489-7 V1.2.1 (2000-09) Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) IEC/EN 60950-1 (2001) Safety of information technology equipment (2000) HC25_HO_v00.220 Confidential / Preliminary Page 9 of 39 2007-03-20 HC25 Hardware Interface Overview 1.3 Regulatory and Type Approval Information 12 Table 3: Standards of European type approval EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment EN 301 908-01 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE Directive EN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. 3GPP TS 34.121 Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD) 3GPP TS 34.123-1 User Equipment (UE) conformance specification; Part 1: Protocol conformance specification. 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test Suites. Table 4: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes HC25_HO_v00.220 Confidential / Preliminary Page 10 of 39 2007-03-20 HC25 Hardware Interface Overview 1.4 SAR requirements specific to portable mobiles 12 1.4 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable HC25 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) IMPORTANT: Manufacturers of portable applications based on HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. See also Section 7.2. 1.4.1 SELV Requirements The power supply connected to the HC25 module shall be in compliance with the SELV requirements defined in EN 60950-1. HC25_HO_v00.220 Confidential / Preliminary Page 11 of 39 2007-03-20 HC25 Hardware Interface Overview 1.5 Safety Precautions 12 1.5 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating HC25. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer’s failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard. IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. HC25_HO_v00.220 Confidential / Preliminary Page 12 of 39 2007-03-20 HC25 Hardware Interface Overview 2 Product Concept 15 Product Concept 2.1 Key Features at a Glance Feature Implementation General Frequency bands UMTS/HSDPA: Triple band, 850//1900/2100MHz GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz GSM class Small MS Output power (according to Release 99) Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Power supply 3.2V < VBATT+ < 4.2V Physical Dimensions: 50mm x 34mm x 4.5mm Weight: approx. 10g RoHS All hardware components fully compliant with EU RoHS Directive HSDPA features 3GPP Release 5 3.6 Mbps, UL 384 kbps UE CAT. [1-6], 11, 12 supported Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features Release 99, June 2004, W- PS data rate – 384 kbps DL / 384 kbps UL CDMA FDD standard CS data rate – 64 kbps DL / 64 kbps UL HC25_HO_v00.220 Confidential / Preliminary Page 13 of 39 2007-03-20 HC25 Hardware Interface Overview 2.1 Key Features at a Glance 15 Feature Implementation GSM / GPRS / EGPRS features Data transfer GPRS • • • • Multislot Class 10 Full PBCCH support Mobile Station Class B Coding Scheme 1 – 4 EGPRS • • • • • • • • • • • • Multislot Class 10 EDGE E2 power class for 8 PSK Downlink coding schemes – CS 1-4, MCS 1-9 Uplink coding schemes – CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B CSD • • V.110, RLP, non-transparent 9.6 kbps SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Fax Group 3; Class 1 Audio Audio speech codecs GSM: AMR, EFR, FR, HR 3GPP: AMR One ringing melody supported CEPT supervisory tones supported DTMF supported 6 audio modes: Approval, Router, Handset, Headset, Speakerphone and Transparent mode TTY support selecting a dedicated audio mode Download of audio parameters Gains and volumes can be controlled by AT commands Several additional ringing melodies CEPT and ANSI supervisory tones supported Software AT commands AT-Hayes GSM 07.05 and 07.07, Siemens AT commands for RIL compatibility (NDIS/RIL) MicrosoftTM compatibility RIL / NDIS for Windows MobileTM SIM Application Toolkit SAT Class C Firmware update Firmware update from host application over USB. HC25_HO_v00.220 Confidential / Preliminary Page 14 of 39 2007-03-20 HC25 Hardware Interface Overview 2.1 Key Features at a Glance 15 Feature Implementation Interfaces USB Supports a USB 2.0 Full Speed (12Mbit/s) device interface. Wakeup Control Signal pin to wake up an inactive USB Host into an active state. Status Signal pins to indicate network connectivity status. Audio 1 analog interface UICC interface Supported chip cards: SIM / UICC 3V, 1.8V Antenna 50Ohms. External antenna can be connected via antenna connector or antenna pad (spring contact). Module interface 50-pin board-to-board connector Power on/off, Reset Power on/off Switch-on by hardware pin IGT Switch-off by hardware pin IGT Switch-off by AT command Reset Orderly shutdown and reset by AT command Emergency off by hardware pin EMERG_OFF and restart with hardware pin IGT Emergency off Emergency off by hardware pin EMERG_OFF Evaluation kit DSB HC25_HO_v00.220 Confidential / Preliminary DSB75 Evaluation Board designed to test and type approve Siemens cellular engines and provide a sample configuration for application engineering. A special adapter is required to connect the module to the DSB75. Page 15 of 39 2007-03-20 HC25 Hardware Interface Overview 3 Application Interface 16 Application Interface HC25 is equipped with a 50-pin board-to-board connector that connects to the external application and incorporates several sub-interfaces: power supply, USB interface, UICC/SIM interface, analog audio interface, as well as various status and control lines (see also Chapter 2). 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 5: Overview of operating modes Mode Function Normal GSM / operation GPRS / UMTS / HSDPA SLEEP Power Down Power saving mode set automatically when no call is in progress and the USB connection is suspended by host or not present. GSM IDLE Software is active. Once registered to the GSM network, paging with BTS is carried out in order to achieve synchrony with the GSM network. The repetition rate depends on the parameter BSPA_Multiframe. The module is ready to send and receive. GSM TALK/ GSM DATA Connection between two subscribers is in progress. Power consumption depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be measured in TALK_GSM mode: DTX off, FR and no frequency hopping, otherwise same as for IDLE measurements. GPRS IDLE Module is attached and ready for GPRS data transfer, but no data is currently sent or received. GPRS DATA GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS DATA EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS / HSDPA IDLE Module is attached and ready for UMTS / HSDPA data transfer, but no data is currently sent or received. UMTS TALK/ UMTS DATA UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. HSDPA DATA HSDPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. The internal power section is shut down. The SW on the module is not active. The interfaces are not accessible. HC25_HO_v00.220 Confidential / Preliminary Page 16 of 39 2007-03-20 s HC25 Hardware Interface Overview 4 Antenna Interface 22 Antenna Interface The RF interface has an impedance of 50Ω. HC25 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the HC25 PCB and should be placed in the host application. Regarding the return loss HC25 provides the following values in the active band: Table 6: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive > 8dB > 12dB Transmit not applicable > 12dB Idle < 5dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. Note: The antenna must be isolated for ESD protection (to withstand a voltage resistance up to 8kV air discharge). 4.1 Antenna Installation To suit the physical design of individual applications HC25 offers two alternative approaches to connecting the antenna: • Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the top side of the PCB. See Section 4.3 for connector details. • Antenna pad and grounding plane placed on the bottom side. See Section 4.2. The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve HC25. All RF data specified throughout this manual are related to the ARP. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty. HC25_HO_v00.220 Confidential / Preliminary Page 17 of 39 2007-03-20 HC25 Hardware Interface Overview 4.2 Antenna Pad 22 No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 1.4mm in height. Figure 1: Restricted area around antenna pad (side and bottom view) 4.2 Antenna Pad The antenna can be attached via contact springs. If you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens HC25 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50Ω connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter. HC25 material properties: HC25 PCB: FR4 Antenna pad: Gold plated pad HC25_HO_v00.220 Confidential / Preliminary Page 18 of 39 2007-03-20 s HC25 Hardware Interface Overview 4.3 Antenna Connector 22 4.3 Antenna Connector HC25 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is: • U.FL-R-SMT Figure 2: Mechanical dimensions of U.FL-R-SMT connector Table 7: Product specifications of U.FL-R-SMT connector Item Specification Conditions Nominal impedance 50Ω Operating temp:-40°C to + 90°C Operating humidity: max. 90% Rated frequency DC to 3GHz Ratings Mechanical characteristics Female contact holding force 0.15N min Measured with a Ø 0.475 pin gauge Repetitive operation Contact resistance: Center 25mΩ Outside 15mΩ 30 cycles of insertion and disengagement Vibration No momentary disconnections of 1µs; Frequency of 10 to 100Hz, single No damage, cracks and looseness of amplitude of 1.5mm, acceleration of parts 59m/s2, for 5 cycles in the direction of each of the 3 axes Shock No momentary disconnections of 1µs. Acceleration of 735m/s2, 11ms duration No damage, cracks and looseness of for 6 cycles in the direction of each of parts. the 3 axes Environmental characteristics Humidity resistance No damage, cracks and looseness of parts. Insulation resistance: 100MΩ min. at high humidity 500MΩ min. when dry HC25_HO_v00.220 Confidential / Preliminary Page 19 of 39 Exposure to 40°C, humidity of 95% for a total of 96 hours 2007-03-20 s HC25 Hardware Interface Overview 4.3 Antenna Connector 22 Table 7: Product specifications of U.FL-R-SMT connector Item Specification Conditions Temperature cycle No damage, cracks and looseness of parts. Contact resistance: Center 25mΩ Outside 15mΩ Temperature: +40°C → 5 to 35°C → +90°C → 5 to 35°C Time: 30min → within 5min → 30min within 5min Salt spray test No excessive corrosion 48 hours continuous exposure to 5% salt water Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs Part Material Finish Shell Phosphor bronze Silver plating Male center contact Brass Gold plating Female center contact Phosphor bronze Gold plating Insulator Plug: PBT Receptacle: LCP Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 9. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com. Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug HC25_HO_v00.220 Confidential / Preliminary Page 20 of 39 2007-03-20 HC25 Hardware Interface Overview 4.3 Antenna Connector 22 In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to Ø 0.81mm) and minimizes the mating height to 2mm. See Figure 5 which shows the Hirose datasheet. Figure 5: Specifications of U.FL-LP-(V)-040(01) plug HC25_HO_v00.220 Confidential / Preliminary Page 21 of 39 2007-03-20 s HC25 Hardware Interface Overview 4.3 Antenna Connector 22 Table 9: Ordering information for Hirose U.FL Series Item Part number HRS number Connector on HC25 U.FL-R-SMT CL331-0471-0-10 Right-angle plug shell for Ø 0.81mm cable U.FL-LP-040 CL331-0451-2 Right-angle plug for Ø 0.81mm cable U.FL-LP(V)-040 (01) CL331-053-8-01 Right-angle plug for Ø 1.13mm cable U.FL-LP-068 CL331-0452-5 Right-angle plug for Ø 1.32mm cable U.FL-LP-066 CL331-0452-5 Extraction jig E.FL-LP-N CL331-04441-9 HC25_HO_v00.220 Confidential / Preliminary Page 22 of 39 2007-03-20 s HC25 Hardware Interface Overview 5 Electrical, Reliability and Radio Characteristics 26 Electrical, Reliability and Radio Characteristics 5.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 10 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to HC25. Table 10: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+ -0.3 4.5 Voltage at digital pins in POWER DOWN mode -0.3 0.3 Voltage at digital pins in normal operation -0.3 2.8 Voltage at analog pins in POWER DOWN mode -0.3 0.3 Voltage at analog pins in normal operation -0.3 2.5 Voltage at STATSUSx pins -0.5 7.5 VUSB -0.3 7.5 USB_DP, USB_DN -0.3 7.5 PWR_IND -0.3 10 VDDLP -0.3 3.25 HC25_HO_v00.220 Confidential / Preliminary Page 23 of 39 2007-03-20 s HC25 Hardware Interface Overview 5.2 Operating Temperatures 26 5.2 Operating Temperatures The values stated below are in compliance with GSM recommendation TS 51.010-01. Table 11: Board temperature Parameter Min Typ Max Unit Operating temperature range -20 +25 +85 °C Automatic shutdown1 Temperature measured on HC25 board < -30 --- >+85 °C 1. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of ± 3°C at the overtemperature limit and ± 5°C at the undertemperature limit. Table 11 shows the temperatures for automatic shutdown as measured by the on-board measuring element NTC. The maximum allowable ambient temperature that causes the module to shut down depends on various conditions. The following tables Table 12 and Table 13 show sample lab environment conditions. Please be aware that the operating duration and the maximum ambient temperature will vary significantly for your application. Table 12: Sample operating conditions without forced air circulation (according to IEC 60068-2) Mode Ambient Temperature Voltage RF Power Operating Duration GSM, GPRS/EDGE Class 8 +65°C VBATT+ < 3.8V Max. ∞ WCDMA +55°C VBATT+ < 3.4V < 10dBm WCDMA +65°C VBATT+ < 3.4V < 0dBm ∞ ∞ GRPS/EDGE Class10 +65°C VBATT+ < 3.8V Max. < 2min WCDMA +65°C VBATT+ < 3.8V Max. < 2min Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s) Mode Ambient Temperature Voltage RF Power Operating Duration GSM, GPRS/EDGE Class 8 +75°C VBATT+ < 3.8V Max. ∞ WCDMA +60°C VBATT+ < 3.4V < 10dBm WCDMA +70°C VBATT+ < 3.4V < 0dBm GRPS/EDGE Class 10 +65°C VBATT+ < 3.8V Max. WCDMA +60°C VBATT+ < 3.4V Max. ∞ ∞ ∞ ∞ Note: Generally it is strongly recommended to implement additional measures to lead the heat out of the application, especially at maximum transmission power levels of WCDMA (24dBm), e.g. use of ground area for a heat sink or convection (see Section 6.1 for the ground area that may be used for a heat sink). HC25_HO_v00.220 Confidential / Preliminary Page 24 of 39 2007-03-20 s HC25 Hardware Interface Overview 5.3 Storage Conditions 26 5.3 Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 14: Storage conditions Type Condition Unit Reference Air temperature: Low High -40 +85 °C ETS 300 019-2-1: T1.2, IEC 68-2-1 Ab ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb Humidity relative: Low High Condens. 10 90 at 30°C 90-100 at 30°C --ETS 300 019-2-1: T1.2, IEC 68-2-56 Cb ETS 300 019-2-1: T1.2, IEC 68-2-30 Db Air pressure: 70 106 kPa IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4 Water: rain, dripping, icing and frosting Not allowed --- --- Radiation: 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb Low High Solar Heat Chemically active substances Not recommended IEC TR 60271-3-1: 1C1L Mechanically active substances Not recommended IEC TR 60271-3-1: 1S1 IEC TR 60271-3-1: 1M2 Vibration sinusoidal: Displacement Acceleration Frequency range 1.5 2-9 9-200 Shocks: Shock spectrum Duration Acceleration semi-sinusoidal ms 50 m/s2 HC25_HO_v00.220 Confidential / Preliminary mm m/s2 Hz IEC 68-2-27 Ea Page 25 of 39 2007-03-20 HC25 Hardware Interface Overview 5.4 Reliability Characteristics 26 5.4 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 15: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz; acceleration: 3.1mm amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes DIN IEC 68-2-6 Shock half-sinus Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z) DIN IEC 68-2-27 Dry heat Temperature: +70 ±2×C Test duration: 16h Humidity in the test chamber: < 50% EN 60068-2-2 Bb ETS 300 019-2-7 Temperature change (shock) Low temperature: -40×C ±2×C High temperature: +85×C ±2×C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 DIN IEC 68-2-14 Na High temperature: +55×C ±2×C Low temperature: +25×C ±2×C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h DIN IEC 68-2-30 Db Temperature: -40 ±2×C Test duration: 16h DIN IEC 68-2-1 Damp heat cyclic Cold (constant exposure) HC25_HO_v00.220 Confidential / Preliminary Page 26 of 39 ETS 300 019-2-7 ETS 300 019-2-5 2007-03-20 s HC25 Hardware Interface Overview 6 Mechanics 30 Mechanics 6.1 Mechanical Dimensions of HC25 Length:50.00mm Width: 34.00mm Height: 4.5mm RF Antenna Connector Ground Pin 1 Pin 25 Pin 50 Pin 26 Ground (for Heat Sink) Ground Figure 6: HC25 – Top and bottom view HC25_HO_v00.220 Confidential / Preliminary Page 27 of 39 2007-03-20 HC25 Hardware Interface Overview 6.1 Mechanical Dimensions of HC25 30 Figure 7: Dimensions of HC25 (all dimensions in mm) HC25_HO_v00.220 Confidential / Preliminary Page 28 of 39 2007-03-20 HC25 Hardware Interface Overview 6.2 Mounting HC25 to the Application Platform 30 6.2 Mounting HC25 to the Application Platform There are many ways to properly install HC25 in the host device. An efficient approach is to mount the HC25 PCB to a frame, plate, rack or chassis. Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to achieve better support. To help you find appropriate spacers a list of selected screws and distance sleeves for 3mm stacking height can be found in Section 8.2. When using the holes the screws can be inserted from top or bottom. For proper grounding it is strongly recommended to use the large ground plane on the bottom of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape. Please take care that attached cooling elements do not touch the antenna pads on the module’s bottom side, as this may lead a short-circuit. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device (see also Section 8.3 with mounting advice sheet). 6.3 Board-to-Board Application Connector This section provides specifications for the 50-pin board-to-board (B2B) connector used to connect HC25 to the host application. For the module’s external interface the following connector series has been chosen: Supplier: Hirose ( www.hirose.com ) Type: DF12C (3.0)-50DS-0.5V (SlimStack Receptacle) Height: 3.0 mm Table 16: Electrical and mechanical characteristics of the board-to-board connector Parameter Specification (50-way connector) Number of Contacts 50 Quantity delivered 2000 Connectors per Tape & Reel Voltage 50V Current Rating 0.4A max per contact Resistance 0.05 Ohm per contact Dielectric Withstanding Voltage 150V RMS AC for 1min Operating Temperature -40°C...+85°C Contact Material phosphor bronze finish: solder plating Insulator Material PPS, deep brown / Polyamide, beige FFC/FPC Thickness 0.3mm ±0.05mm (0.012" ±0.002") Maximum connection cycles 20 (@ 50mOhm max) Cable FFC (Flat Flexible Cable), max. length 150mm from SIM interface HC25_HO_v00.220 Confidential / Preliminary Page 29 of 39 2007-03-20 HC25 Hardware Interface Overview 6.3 Board-to-Board Application Connector 30 A recommended corresponding board-to-board connector series for external applications is: Supplier: Hirose ( www.hirose.com ) Type: DF12x-50DP-0.5V (SlimStack Header) Height: 3.0 – 5.0 mm For Hirose sales contacts see Chapter 8. Note: There is no inverse polarity protection for the board-to-board connector. It is therefore very important that the board-to-board connector is connected correctly to the host application, i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section 5.5, pin locations are shown in Figure 6. Figure 8: Mechanical dimensions of the board-to-board connector HC25_HO_v00.220 Confidential / Preliminary Page 30 of 39 2007-03-20 HC25 Hardware Interface Overview 7 Reference Approval 32 Reference Approval 7.1 Reference Equipment for Type Approval The Siemens reference setup submitted to type approve HC25 consists of the following components: • Siemens HC25 cellular engine • Development Support Box DSB75 and HC15/HC25-DSB75-Adapter for mounting the HC25 module • SIM card reader integrated on DSB75 • U.FL-LP antenna cable • Handset type Votronic HH-SI-30.3/V1.1/0 • PC as MMI Figure 9: Reference equipment for Type Approval HC25_HO_v00.220 Confidential / Preliminary Page 31 of 39 2007-03-20 HC25 Hardware Interface Overview 7.2 Compliance with FCC Rules and Regulations 32 7.2 Compliance with FCC Rules and Regulations The Equipment Authorization Certification for the Siemens reference application described in Section 7.1 will be registered under the following identifiers: FCC Identifier: QIPHC25 Industry Canada Certification Number: 267W-HC25 Granted to Siemens AG Manufacturers of mobile or fixed devices incorporating HC25 modules are authorized to use the FCC Grants and Industry Canada Certificates of the HC25 modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID QIPHC25". IMPORTANT: Manufacturers of portable applications incorporating HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 1.4 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. HC25_HO_v00.220 Confidential / Preliminary Page 32 of 39 2007-03-20 s HC25 Hardware Interface Overview 8 Appendix 39 Appendix 8.1 List of Parts and Accessories Table 17: List of parts and accessories Description Supplier Ordering information HC25 Siemens Standard module (Siemens IMEI) Siemens ordering number: L30960-N1050-A100 Customer IMEI mode: Siemens Ordering number: L30960-N1060-A100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100 HC15/HC25-DSB75-Adapter Siemens Siemens ordering number: L30960-N1001-A100 Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 e-mail: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 18. Board-to-board connector Molex Sales contacts are listed in Table 18. Antenna connector Hirose Sales contacts are listed in Table 19. HC25_HO_v00.220 Confidential / Preliminary Page 33 of 39 2007-03-20 HC25 Hardware Interface Overview 8.1 List of Parts and Accessories 39 Table 18: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Mail: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-972 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366 Table 19: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click: http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric GmbH Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email info@hirose.de Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Hirose Electric Co., Ltd. European Branch First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469 HC25_HO_v00.220 Confidential / Preliminary Page 34 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 8.2 Fasteners and Fixings for Electronic Equipment This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document. 8.2.1 Fasteners from German Supplier ETTINGER GmbH Sales contact: ETTINGER GmbH http://www.ettinger.de/main.cfm Phone: +49-81-046623-0 Fax: +49-81-046623-99 The following tables contain only article numbers and basic parameters of the listed components. For further detail and ordering information please contact Ettinger GmbH. Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below. Article number: 05.71.038 Spacer - Aluminum / Wall thickness = 0.8mm Length 3.0mm Material AlMgSi-0,5 For internal diameter M2=2.0-2.3 Internal diameter d = 2.4mm External diameter 4.0mm Vogt AG No. x40030080.10 HC25_HO_v00.220 Confidential / Preliminary Page 35 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 Article number: 07.51.403 Insulating Spacer for M2 Self-gripping1 Length 3.0mm Material Polyamide 6.6 Surface Black Internal diameter 2.2mm External diameter 4.0mm Flammability rating UL94-HB 1. 2 spacers are delivered with DSB75 Support Board Article number: 05.11.209 Threaded Stud M2.5 - M2 Type E / External thread at both ends Length 3.0mm Material Stainless steel X12CrMoS17 Thread 1 / Length M2.5 / 6.0mm Thread 2 / Length M2 / 8.0mm Width across flats Recess yes Type External / External HC25_HO_v00.220 Confidential / Preliminary Page 36 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 Article number: 01.14.131 Screw M21 DIN 84 - ISO 1207 Length 8.0mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8mm Head height 1.30mm Type Slotted cheese head screw 1. 2 screws are delivered with DSB75 Support Board Article number: 01.14.141 Screw M2 DIN 84 - ISO 1207 Length 10.0mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8mm Head height 1.30mm Type Slotted cheese head screw HC25_HO_v00.220 Confidential / Preliminary Page 37 of 39 2007-03-20 s HC25 Hardware Interface Overview 8.3 Mounting Advice Sheet 39 Article number: 02.10.011 Hexagon Nut1 DIN 934 - ISO 4032 Material Steel 4.8 Surface Zinced A2K Thread M2 Wrench size / Ø Thickness / L 1.6mm Type Nut DIN/UNC, DIN934 1. 8.3 2 nuts are delivered with DSB75 Support Board Mounting Advice Sheet To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. The advice sheet on the next page shows a number of examples for the kind of bending that may lead to mechanical damage of the module. HC25_HO_v00.220 Confidential / Preliminary Page 38 of 39 2007-03-20 HC25 Hardware Interface Overview 8.3 Mounting Advice Sheet 39 HC25_HO_v00.220 Confidential / Preliminary Page 39 of 39 2007-03-20
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