Teko Telecom Srl VHPA25 Very High Power Amplifier User Manual

Teko Telecom Srl Very High Power Amplifier

User Manual

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Document TitleUser Manual

TEKO DAS Platform
TEKO DAS PLATFORM
Part A - Components and Solutions
TECHNICAL HANDBOOK
Doc ID Number 91 080 0783 - Rev. 01
TEKO DAS Platform
TEKO DAS PLATFORM
Part A - Components and Solutions
BOLOGNA, 14/07/2015
UPDATINGS:
.........................................
.........................................
.........................................
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Document Identification Number
91 080 0783 - Rev. 01
TEKO DAS Platform
Table of Contents - Part A
Initial Notes......................................................................................................................................A4
Declaration of Conformity ........................................................................................................................................ A4
EU directive 2011/65/EU – RoHS (Restriction of the use of certain Hazardous Substances)............. A4
EU directive 2012/19/EU – WEEE (Waste Electrical and Electronic Equipment)..................................... A4
Packaging and Packaging Waste Directive 94/62/EC....................................................................................... A4
Compliance with the Maximum Permissible Exposure (MPE) limits - Examples of minimum
separation distance calculation, based on the EN 50385............................................................................... A5
Industry Canada / Industrie Canada....................................................................................................................... A7
Part A. Teko Platform Components.......................................................................................... A10
A1 Overview............................................................................................................................... A10
A2 Components......................................................................................................................... A12
A.2.1 Modules providing the RF interface towards the signal source....................................................A14
A.2.2 Equipment extending coverage / distributing capacity...................................................................A24
A.2.3 Modules providing the optical interface towards Remote Units..................................................A27
A.2.4 Passive Modules providing distribution and filtering........................................................................A34
A.2.5 Master Unit Components for Time Division LTE (LTE-TDD) technology......................................A43
A.2.6 Components for the management of the System..............................................................................A46
A.2.7 Power Supply Components.........................................................................................................................A51
A.2.8 Subracks hosting the System modules...................................................................................................A60
A.2.9 Forced-air cooling Subrack..........................................................................................................................A62
A3 Coverage and Capacity Solutions.................................................................................... A64
A.3.1 Rack-mounted Modular Repeater............................................................................................................A64
A.3.2 Optical DAS.......................................................................................................................................................A66
A.3.3 Coverage Systems Management and Power Supply.........................................................................A79
A.3.4 Coverage Systems Technical Specifications..........................................................................................A83
Part B. Teko DAS Platform Installation Maintenance Troubleshooting
Part C. Safety Rules (Règles de sécurité) and Standards
Warnings and caution statements
Mises en garde et déclarations de précaution
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A3
Components & Solutions
Note relevant to product utilization within the European Union (EU)...................................................... A4
TEKO DAS Platform
Initial Notes
Declaration of Conformity (*)
Castel S. Pietro Terme (Bologna) – ITALY
Legal representative
Teko Telecom S.r.l.
a Socio Unico
(*) A signed copy of the conformity declaration is available upon request. For further information, please contact our after sales department:
www.jmawireless.com
Note relevant to product utilization within the European Union (EU)
It’s under user’s own responsibility to verify to be compliant to the National provisions or authorisations required.
For further information refer to: http://ec.europa.eu/enterprise/sectors/rtte/index_en.htm
EU directive 2011/65/EU – RoHS (Restriction of the use of certain Hazardous Substances)
This product complies with EU Directive 2011/65/EC on Restriction of the use of certain Hazardous Substances in electrical and electronic
equipment (also known as “RoHS Recast” or “RoHS 2”). The product does not contain the substances listed in the Directive in concentrations
higher than the maximum admitted values.
The Environmental Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol shown here, unless
otherwise marked. Certain parts may have a different EFUP (for example, battery modules) and so are marked to reflect such.
The Environmental Friendly Use Period is valid only when the product is operated under the conditions defined in the
product manual.
EU directive 2012/19/EU – WEEE (Waste Electrical and Electronic Equipment)
This product complies with the EU directive 2012/19/EU – WEEE (Waste Electrical and Electronic Equipment)
The symbol of the crossed container marked on the equipment shows that the product, at the end of its
useful life, must be collected separately from other refuse. Therefore the user must deliver the equipment
that has reached the end of its life to the special differentiated electronic and electrotechnical refuse
collection centres, far subsequent dispatch of the discarded equipment for recycling, treatment and
environmentally compatible disposal, thus contributing in preventing possible negative effects on the
environment and on health and favouring the recycling of the materials from which the equipment is
made.
Illicit disposal of the product by the user will lead to the application of the penalties provided far by the
national legislations of the various Member States on receipt of directive 2012/19/EU.
For further information, please contact our after sales department: www.jmawireless.com
Packaging and Packaging Waste Directive 94/62/EC
The packaging of the product complies with the Directive 94/62/EC, concerning packaging and packaging waste. Environmentally harmful
materials are not used for packaging.
Packaging is made from materials that can easily be recycled after use. Depending on the means of transportation, the equipment is packed
in a cardboard or wooden box, protected with expanded polystyrene or barrier bags.
The packaging materials are marked according to ISO 11 469.
Please do not throw packaging materials into unsorted waste but separate them according to local regulations waste disposal options.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
According to Directive 1999/5/EC (R&TTE)
We TEKO TELECOM S.r.l., member of JMA Wireless Group, hereby declare that the products described in this technical handbook are compliant
with the essential requirements of article 3 and other relevant provisions of the Radio & Telecommunications Terminal Equipment Directive,
n.1999/5/EC, when used for their intended purpose: improving coverage of mobile communication networks.
page A4
TEKO DAS Platform
Compliance with the Maximum Permissible Exposure (MPE) limits - Examples of minimum separation
distance calculation, based on the EN 50385
Equipment
Remote Unit
and
Service Front
End (TSFE)
Donor Front
End
(TDFE)
Type
Maximum
Output
Power
(dBm)
Minimum separation distance between a person and
the antenna in order to comply with MPE limits [m]
E=6 [V/m]
E=20 [V/m] E=6 [V/m]
E=20 [V/m]
• Low Power Single band Remote Units
• Medium Power EGSM band Remote Unit
29
1.8
0.6
7.1
2.3
Medium Power DCS band Remote Unit
31
2.2
0.7
8.9
2.8
• Low Power Dual band Remote Units
• Medium Power UMTS band Remote Unit
32
2.5
0.8
10.1
3.2
Indoor installation
Outdoor installation
Triband Low Power Remote Units
33.8
3.1
1.0
12.3
3.9
Dual band Medium Power Remote Units
34.6
3.4
1.1
13.4
4.2
Low Power 4-band Remote Units
35
3.6
1.1
14.2
4.5
Medium Power Triband Remote Units
35.6
3.8
1.5
15.2
4.8
• Low Power 5-band Remote Units
• High Power TETRA Remote Unit
• High Power TETRA Service Front End
36
4.0
1.3
15.9
5.0
• High Power Single band Remote Units (LTE800 or
EGSM or DCS or UMTS)
40
• High Power Service Front End (LTE800 or EGSM or
DCS or UMTS or LTE2600)
6.3
2.0
25.1
8.0
High Power Single band Remote Unit (LTE2600)
41
7.1
2.2
28.1
8.9
• High Power Dual band Remote Units (LTE800
and/or EGSM and/or DCS and/or UMTS)
• Very High Power Single band Remote Units
43
• Very High Power Service Front End (LTE800 or
EGSM or DCS or UMTS)
8.9
2.8
35.6
11.2
High Power Dual Band Remote Units (LTE800 or
43.5
EGSM or DCS or UMTS with LTE2600)
9.5
3.0
37.7
11.9
High Power Triband Remote Units (LTE800 and/or
44.7
EGSM and/or DCS and/or UMTS)
10.9
3.5
43.6
13.8
High Power Tri Band Remote Units (LTE800 or EGSM
45.1
or DCS or UMTS with LTE2600)
11.4
3.6
45.3
14.3
Very High Power Dual Band Remote Units
46
Very Very High Power (40W) Single band Remote Units
12.6
4.0
50.3
15.9
Very High Power 4-Band Remote Unit
Very Very High Power (40W) Dual band Remote Units
17.9
5.7
71.1
22.5
49
Very High Power Triband Remote Units
47.8
15.5
4.9
61.6
19.5
Very Very High Power (40W) Triband Remote Units
50
20
6.3
79.5
25.1
Very Very High Power (40W) 4-band Remote Units
52
21.9
6.9
87.1
27.5
Single Band TETRA Donor Front End
21
0.7
0.2
2.8
0.9
Single Band EGSM Donor Front End
23
0.9
0.3
3.6
1.1
Single Band DCS Donor Front End
25
1.1
0.4
4.5
1.4
Single Band LTE 800 or LTE2600 Donor Front End
26
1.3
0.4
5.0
1.6
Single Band UMTS Donor Front End
27
1.4
0.5
5.6
1.8
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
The following table summarizes the results of the calculations carried out assuming:
• zero losses between the output connector of Teko equipment and the input connector of the antenna
• maximum gain estimated for outdoor Antenna Gi = 19dBi (for each band)
• maximum gain estimated for indoor Antenna Gi = 7dBi (for each band)
• no co-location or operation in conjunction with any other antenna or transmitter.
Please note
The following table is not meant to represent the actual compliance distance from a particular Teko Optical System or Modular Repeater,
being antennas, cables, and other RF components not provided with Teko equipment.
The actual compliance distance from a particular equipment can be calculated in the final installation phase only - when antenna, cables and
other RF components specifications are available.
page A5
TEKO DAS Platform
Operation is subject to the following conditions: (1) this device may not cause interference, and (2) this device must
accept any interference, including interference that may cause undesired operation of the device.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
WARNING FOR Commercial Bands:
SMR700 Low (DL 728 ÷ 746MHz, UL 698 ÷ 716MHz)
SMR700 High (DL 746 ÷ 756MHz, UL 777 ÷ 787 MHz)
Commercial SMR800 (DL 862 ÷ 869MHz, UL 817 ÷ 824MHz)
AMPS (DL 869 ÷ 894MHz, UL 824 ÷ 849MHz)
SMR900 (DL 935 ÷ 940MHz, UL 896 ÷ 901MHz)
NBPCS (DL 940 ÷ 941MHz, UL 901 ÷ 902MHz)
PCS (DL 1930 ÷ 1995MHz, UL 1850 ÷ 1915MHz)
AWS (HBlock) (DL 1995 ÷ 2000MHz, UL 1915 ÷ 1920MHz)
AWS (DL 2110 ÷ 2155MHz, UL 1710 ÷ 1755MHz)
AWSE (DL 2110 ÷ 2180MHz, UL 1710 ÷ 1780MHz)
WCS (DL 2350 ÷ 2360MHz, UL 2305 ÷ 2315MHz)
2500 (LTE-TDD DL/UL 2496 ÷ 2690MHz)
WARNING FOR PUBLIC SAFETY Bands:
Public Safety 700 (DL 763 ÷ 775MHz, UL 793 ÷ 805MHz)
Public Safety 800 (DL 851 ÷ 862MHz, UL 806 ÷ 817MHz)
Public Safety 900 (DL 935 ÷ 940MHz, UL 896 ÷ 901MHz)
Please note
• Fixed stations operating in the 1710-1755MHz band are limited to 1W EIRP and to a maximum antenna height of 10meters above ground
• Regarding to Public Safety bands, to be compliant with 90.217 d)7), signal booster passbands are limited to the service band or bands
for which the operator is authorized. In general, signal boosters should utilize the minimum passband that is sufficient to accomplish
the purpose. When booster encompasses both commercial bands and public safety bands (SMR800/SMR900) has to be installed in DAS
(Distributed Antenna system) indoor system.
• Regarding to Public Safety Bands, the output power capability of the Public Safety signal booster is designed for deployments providing
a radiated power not exceeding 5W ERP for each retransmitted channel.
An example for Low/Enhanced Power, Very/Very Very High Power Amplifier and Donor Front End final installation is provided:
maximum radiated power: 5W ERP = 8.2W EIRP = 39dBm
For remote with splitter and more than one antenna:
G + Pout+ A - 10logN ≤ 39 ⇒ G ≤ 39 - (Pout+A-10logN)
with G = max gain (dBi), Pout = max signal booster output power (dBm), A = attenuation (dB), N = number of carriers
for Very High Power Amplifier we suppose an attenuation (due to cable insertion, splitter, etc.) of 12dB.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A6
Components & Solutions
The antenna(s) used for this transmitter must be installed to provide a separation distance of:
• at least 50cm for Low Power Remote Units family in Tri-Band system (with 8dB of maximum antenna gain for operating bands lower than
1.5GHz and 11dB for operating bands higher than 1.5GHz),
• at least 50cm for Low Power Remote Units family in Six-Band system (with 4.5dB of maximum antenna gain for operating bands lower than
1.5GHz and 6.5dB for operating bands higher than 1.5GHz),
• at least 50cm for Enhanced Power Remote Units family in Dual Band Public Safety system (with 7.89dB of maximum antenna gain for
operating bands lower than 1.5GHz),
• at least 100cm for up to Six-Band Enhanced Power Remote Units family (with 16dB of maximum antenna gain for operating bands lower
than 1.5GHz and 20dB for operating bands higher than 1.5GHz),
• at least 50cm for Donor Front End family (with 12.84dB of maximum antenna gain for operating bands lower than 1.5GHz and 19dB for
operating bands higher than 1.5GHz),
• at least 150cm for Very High Power Amplifier radio module, equipped inside Service Front End family and Very High Power/Pole-mounting
Remote Units family (with 8dB of maximum antenna gain for operating bands lower than 1.5GHz and 11.5dB for operating bands higher
than 1.5GHz)
• at least 150cm for Very Very High Power Amplifier radio module, equipped inside Service Front End family and Very Very High Power (40W)/
Pole-mounting Remote Units family (with 5.4dB of maximum antenna gain for operating bands lower than 1.5GHz and 8.5dB for operating
bands higher than 1.5GHz)
from all persons assuming no co-location or operating in conjunction with any other antenna or transmitter.
Specifications of antennas, cables, RF components, etc will be provided only in the final installation phase, being the external antenna not
provided with equipment.
Equipment will be accessible only to maintenance men, that must switch it off before any maintenance operation.
TEKO DAS Platform
Industry Canada / Industrie Canada
The Radio Standards Specification 102 (RSS-102) sets out the requirements and measurement techniques used to evaluate RF exposure
compliance of radiocommunication apparatus designed to be used within the vicinity of the human body.
It is the responsibility of proponents and operators of antenna system installations to ensure that all radiocommunication and broadcasting
installations comply at all times with Health Canada’s Safety Code 6.
La spécification sur les normes radioélectriques 102 (RSS-102) énonce les exigences et les techniques de mesure utilisées pour évaluer la conformité
de l’exposition aux radiofréquences des appareils de radiocommunication conçus pour être utilisés à proximité du corps humain.
Il incombe aux promoteurs et exploitants d’installations de systèmes d’antennes de s’assurer que toutes les installations de radiocommunication et
de radiodiffusion respectent tout le temps au code de sécurité 6 de santé du Canada.
La/les antenne (s) utilisée(s) pour ce transmetteur doit être installé afin de fournir une distance de séparation de:
• Au moins 50 cm pour la famille des unités à distance améliorée en puissance dans le système à double bande de sécurité publique (avec 11dB de
gain maximal d’antenne pour les bandes de service inférieures à 1,5 GHz),
• Au moins 100 cm pour la famille des unités à distance améliorée en puissance dans le système de six bandes (avec LTE2600 band): avec 16dB de
gain maximal d’antenne pour les bandes inférieures à 1,5GHz et 20dB pour les bandes supérieures à 1,5 GHz),
• Au moins 100 cm pour la famille des unités à distance améliorée en puissance dans le système de six bandes (avec WCS2300 band): avec 13,7dB
de gain maximal d’antenne pour SMR700 band (fréquence inférieure) et 17,2dB de gain maximal d’antenne pour WCS2300 band (fréquence
supérieure )
• Au moins 50 cm pour la famille de Front End Donateur (avec 15,5 dB de gain maximal d’antenne pour les bandes inférieures à 1,5 GHz et 19 dB
pour les bandes supérieures à 1,5 GHz),
• Au moins 150 cm pour le module amplificateur radio à très haute puissance, équipé à l’intérieur de la famille de Front End de Service et la famille
des unités à distance à très haute puissance/support de poteau (avec 8 dB of gain maximal pour les bandes inférieures à 1,5 GHz et 11 dB pour
les bandes supérieures à 1,5 GHz)
de toutes les personnes en supposant l’absence de colocalisation ou d’exploitation en conjonction avec une autre antenne ou émetteur.
Spécifications des antennes, câbles, composants à radiofréquence, etc. ne seront fournis que dans la phase finale de l’installation, étant que
l’antenne externe n’est pas fourni avec l’équipement.
L’équipement sera accessible seulement aux hommes d’entretien, qui doit l’éteindre avant toutes les opérations de maintenance.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A7
Components & Solutions
The antenna(s) used for this transmitter must be installed to provide a separation distance of:
• at least 50cm for Enhanced Power Remote Units family in Dual Band Public Safety system (with 11dB of maximum antenna gain for
operating bands lower than 1.5GHz),
• at least 100cm for Enhanced Power Remote Units family in Six-Band system (including LTE2600 band): with 16dB of maximum antenna
gain for operating bands lower than 1.5GHz and 20dB for operating bands higher than 1.5GHz,
• at least 100cm for Enhanced Power Remote Units family in Six-Band system (including WCS2300 band): with 13,7dB of maximum antenna
gain for SMR700 band (lower frequency) and 17,2dB of maximum antenna gain for WCS2300 band (higher frequency),
• at least 50cm for Donor Front End family (with 15.5dB of maximum antenna gain for operating bands lower than 1.5GHz and 19dB for
operating bands higher than 1.5GHz),
• at least 150cm for Very High Power Amplifier radio module, equipped inside Service Front End family and Very High Power/Pole-mounting
Remote Units family (with 8dB of maximum antenna gain for operating bands lower than 1.5GHz and 11.5dB for operating bands higher
than 1.5GHz)
from all persons assuming no co-location or operating in conjunction with any other antenna or transmitter.
Specifications of antennas, cables, RF components, etc will be provided only in the final installation phase, being the external antenna not
provided with equipment.
Equipment will be accessible only to maintenance men, that must switch it off before any maintenance operation.
TEKO DAS Platform
Frequency Band
Nominal Passband Gain
Nominal Bandwidth
Bande de
fréquence
Gain dans la bande
passante nominale
Largeur de bande
nominale
Rated mean output power
(single carrier)
Puissance de sortie moyenne
nominale (porteuse unique)
Input and output
impedances
Impédances d’entrée et
de sortie
Very High Power Amplifier Radio Module
48dB
18MHz
43dBm (20W)
50Ω
746-756MHz
48dB
10MHz
43dBm (20W)
50Ω
851-869MHz
48dB
18MHz
43dBm (20W)
50Ω
869-894MHz
48dB
25MHz
43dBm (20W)
50Ω
1930-1995MHz
48dB
65MHz
43dBm (20W)
50Ω
2110-2155MHz
48dB
45MHz
43dBm (20W)
50Ω
2620-2690MHz
48dB
70MHz
43dBm (20W)
50Ω
Components & Solutions
728-746MHz
Digital Front End
698-716MHz
64dB
18MHz
26dBm (0.4W)
50Ω
777-787 MHz
64dB
10MHz
26dBm (0.4W)
50Ω
806-824MHz
64dB
18MHz
26dBm (0.4W)
50Ω
824-849MHz
64dB
25MHz
26dBm (0.4W)
50Ω
1850-1915MHz
64dB
65MHz
26dBm (0.4W)
50Ω
1710-1755MHz
64dB
45MHz
26dBm (0.4W)
50Ω
2500-2570MHz
64dB
70MHz
26dBm (0.4W)
50Ω
798-806MHz
64dB
8MHz
26dBm (0.4W)
50Ω
728-746MHz
36dB
18MHz
31dBm (1.25W)
50Ω
Six-band Enhanced Power Remote Unit
746-756MHz
36dB
10MHz
31dBm (1.25W)
50Ω
851-869MHz
36dB
18MHz
31dBm (1.25W)
50Ω
869-894MHz
36dB
25MHz
31dBm (1.25W)
50Ω
1930-1995MHz
36dB
65MHz
31dBm (1.25W)
50Ω
2110-2155MHz
36dB
45MHz
31dBm (1.25W)
50Ω
2110-2180MHz
36dB
70MHz
31dBm (1.25W)
50Ω
2350-2360MHz
36dB
10MHz
31dBm (1.25W)
50Ω
2620-2690MHz
36dB
70MHz
31dBm (1.25W)
50Ω
Dual-band Public Safety Enhanced Power Remote Unit
768-776MHz
36dB
8MHz
31dBm (1.25W)
50Ω
851-869MHz
36dB
18MHz
31dBm (1.25W)
50Ω
The Manufacturer’s rated output power of this equipment is for single carrier operation. For situations when multiple carrier signals are present,
the rating would have to be reduced by 3.5dB, especially where the output signal is re-radiated and can cause interference to adjacent band
users. This power reduction is to be by means of input power or gain reduction and not by an attenuator at the output of the device.
La puissance de sortie nominale indiquée par le fabricant pour cet appareil concerne son fonctionnement avec porteuse unique. Pour des appareils
avec porteuses multiples, on doit réduire la valeur nominale de 3,5dB, surtout si le signal de sortie est retransmis et qu’il peut causer du brouillage
aux utilisateurs de bandes adjacentes. Une telle réduction doit porter sur la puissance d’entrée ou sur le gain, et ne doit pas se faire au moyen d’un
atténuateur raccordé à la sortie du dispositif.
Teko Platform Technical Handbook 91 080 0783
© Copyright 2015 Teko Telecom S.r.l. All rights reserved.
The content of this manual is for informational use only. Information and specifications regarding the products described in this document
are subject to change without notice. The images shown in this document are for illustrative purposes only; they may differ from actual
product appearance. Teko Telecom shall not be liable for technical or editorial errors contained in this manual.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A8
TEKO DAS Platform
TEKO DAS PLATFORM
Part A - Components and Solutions
Components
TEKO DAS Platform
Part A. Teko Platform Components
A1 Overview
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A10
Components & Solutions
The Teko Platform is a versatile, modular, multi-technology platform designed to offer flexible
and reliable wireless coverage and capacity for both indoor and outdoor environments. Teko’s
design delivers the maximum end-user performance, supporting Time Division LTE technology
and LTE-Advanced capabilities to enable multi-path performance with the flexibility to adapt
coverage and capacity in any venue on an event-by-event basis.
The DAS (Distributed Antenna System) Platform is made up of two main elements: Master
Unit and Remote Units.
Teko Master Unit
The Master Unit is a rack-based platform delivering modularity that allows configurations
for different needs and a future-proof design to ensure you can adapt your venue to future
technologies. The Master Unit is configured to provide both the RF interface (off-air and/or
via coaxial cable) towards the signal source (BTS, NodeB, Donor) and the optical interface
towards Remote Units. It also hosts the Supervision Module for the management of the entire
System utilizing secure browser technology that enables administration from any location.
The Master Unit can be configured utilizing Donor Front End, Active Point of Interface or DAS
Trays to provide flexible options to connect to any combination of Carrier interfaces. The Teko
Platform also includes the optional Multiband Spectrum Analyzer (MSA) to allow recordable
and remote monitoring of venue performance to enable easy optimization.
Architecture
The modular sub-rack allows adaptation of deployment needs including the addition of newer
technologies within sub-racks that prepares venues to be more adaptive to venue needs
(e.g. new sectors) and to introduce newer services into the existing venues DAS. The Master
Units DAS shelf and architectural design minimizes system footprint, saving 30-70% of critical
space requirements within venues, BTS Hotels, Co-location environments. The Teko system
design allows for passive repeater or active / optical DAS configurations and the system can
be reconfigured as needs change.
Teko Remote Units
Remote Units (RUs) are connected to the Master Unit via a single mode optical fiber to
distribute multiple frequency bands and multiple Carriers/MNOs to each Remote Unit, or to
multiple RUs to configure multipath (e.g. MIMO) configurations.
Remote Units are self-contained and provide signal distribution to a range of both indoor and
outdoor antennas.
As integral elements of the system all Teko Remote Units can be configured from a single
TEKO DAS Platform
This technical handbook describes the components of the Teko Platform and how these
components can be assembled to provide Optical Systems (DAS) and rack mounted modular
Off-air Repeaters to improve coverage in different environments.
Components & Solutions
administrative interface at the master units. This includes applying new firmware versions to
the Teko system and its RUs.
Multi Power Options
Teko Remote Units are available in different power classes using multi-carrier amplifiers that
can be driven simultaneously by the same Master Unit. This provides a flexible solution to
distribute capacity or extend coverage into different locations (indoor and outdoor) at the
same time, for example in tunnels, undergrounds, airports, high rise buildings, shopping
malls and campuses.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A11
TEKO DAS Platform
A2 Components
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A12
Components & Solutions
The components of the Teko Platform can be grouped into the following categories:
1. Modules providing the RF interface towards the signal source
• DAS Tray Point of Interface (TDTPOI) module: is the single-band/single-operator
interface used in Optical DAS to directly (no external directional coupler nor load needed)
interface up to 2 BTSs or NodeBs/e-NodeBs, either duplex or simplex, with or without
diversity, SISO or MIMO 2x2.
• Point of Interface (POI or TAPOI) module: is the single-band/single-operator interface
towards a BTS or NodeB/e-NodeB. The Point of Interface module is connected to the
signal source via coaxial cable.
• Digital Donor Front End Module: is the single-band/single-operator interface towards a
Donor Antenna, providing a connection to a BTS or NodeB/e-NodeB over an air link.
2. Equipment extending coverage / distributing capacity
• Service Front End: is the single-band/multi-operator interface towards a Service
Antenna. It provides wireless signal to the area to be covered (Modular Repeaters). In
Optical Systems the Service Front End can be used to extend coverage to the area close
to the Master Unit site.
• Remote Unit: is the multi-carrier equipment used in Optical DAS to distribute wireless
signal throughout the area to be covered.
3. Modules providing the optical interface towards Remote Units
• Fiber Optic Transmitter/Receiver Modules are the optical interface between Master Unit
and Remote Units: they provide RF-to-Optical/Optical-to-RF conversion.
• Master and Slave Point to Point Modules perform the RF-to-Optical/Optical-to-RF
conversion required by the optical point to point link connecting RF Interface modules to
distant Fiber Optic Transmitter/Receiver Modules. The optical point to point link allows a
separation distance -up to 20km- between RF Interface modules and Fiber Optic Modules.
4. Passive Modules providing distribution and filtering
Our passive components provide RF distribution and filtering.
Due to the flexible configuration options of the Teko Platform, the same passive components
can be used for different purposes.
• The 2-way/4-way Combiner/Splitter can be used to manage either up to 4 RF interface
modules, operating in the same band (Multi-Operator Systems) or up to 4 Fiber Optic
Modules (Fiber Optic Transmitter/Receiver Modules or Master Point to Point Modules).
• The Band Splitter/Combiner -Triplexer (with built-in 1:4 Splitter/Combiner) can be
used to manage up to 3 RF interface modules or Service Front End subracks, operating
in different bands (and up to 4 Fiber Optic Modules). It can also manage up to 3 four-way
TEKO DAS Platform
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A13
Components & Solutions
splitter/combiner modules each connected to multiple RF interface modules, operating
in the same band (and up to 4 Fiber Optic Modules).
• The Pentaplexer (Esaplexer) can be used to manage:
ÌÌ either up to 5 (6) RF interface modules operating in different bands
ÌÌ or up to 5 (6) Service Front End subracks operating in different bands
ÌÌ or up to 5 (6) four-way splitter/combiner modules used to manage multiple RF interface
modules (up to 4 for each band).
5. Modules for the management of the System
• A single Supervision Module allows the management of the whole Coverage System. A
Light Supervision is available for modular repeaters or small/medium DAS.
• The Alarm Module is an optional module that can be equipped to increase the number
of supported external alarms.
6. Power Supply Components
Our Power Supply Components include:
• AC/DC and DC/DC Power Supply modules, to be equipped inside Active subracks. Each
module provides up to 100W output power; several modules can be connected in parallel
to obtain the power required by the System (please refer to the Teko platform datasheet
for details about derating factors).
• AC/DC and DC/DC space efficient Power Supply Subracks, providing up to 2.4kW (AC/
DC) / 3kW (DC/DC) maximum output power in just one height unit space.
• A centralized Power Supply distribution solution for the remote powering of 48VDC Low
Power Remote Units.
The most suitable solution can be selected, according to the System total power consumption
and to the installation requirements.
7. Subracks hosting the System modules
Both active and passive subracks are available.
• Active subracks are provided with a backplane that allows the management and power
supply of active modules.
• Passive subracks are used to host passive modules that do not require power nor management
to function. Passive Subracks allow a reduction in the cost of the whole system.
8. Forced-air cooling Subrack
A forced-air cooling subrack is available to ensure the air flow required for proper cabinet
installed equipment operation.
Rack cabinets for hosting the System Subracks (indoor installation) and cabinets for Outdoor
installation are also available.
A detailed description of the Teko Platform components is provided in the following paragraphs.
TEKO DAS Platform
Figure A1 – DAS Tray module
• TDTPOI-x-D DAS Tray module leds description
Led
ON
ALM
Description
Module operating status green LED ON when power supply is present
Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
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page A14
Components & Solutions
A.2.1 Modules providing the RF interface towards the signal source
• DAS Tray Point of Interface (TDTPOI) modules
DAS Tray Point of Interface modules are used in Optical DAS to directly (no external directional
coupler nor load needed) interface any kind of operator signal source: BTS or NodeB/e-NodeB,
either duplex or simplex, with or without diversity, SISO or MIMO 2x2.
The TDTPOI-x-D (x=operating band) can be connected either to two SISO BTSs (with or without
diversity) or to one MIMO BTS. Dual TDTPOI models, geared to pick up the TDD reference
signals from BTS, are also available (please refer to Paragraph A.2.5).
TDTPOI are equipped with software-controlled attenuators for Downlink and Uplink RF levels
adjustment via the Coverage System Supervision Module and Management Tools.
RMS/Peak detectors and power limiter features enable monitoring of DL and UL signals. Userdefined thresholds allow for alarms to be generated and protection to the DAS system from
overpowering.
The Platform can be equipped with one DAS Tray or more to make multiple configurations
available: single operator (single-band / multi-band) and multi-operator (single-band / multiband).
TEKO DAS Platform
• TDTPOI-x-D DAS Tray module Access Points and Block diagram - BTS simplex
50Ω
LOAD
BTS A
DL SIMPLEX or
DL/UL DUPLEX
DL1 TO DAS
MONITOR
BTS A
UL SIMPLEX
MONITOR
BTS A
UL DIVERSITY
UL1 FROM DAS
MONITOR
50Ω
LOAD
UL2 FROM DAS
BTS B
DL SIMPLEX or
DL/UL DUPLEX
From/to
BTS B
MONITOR
BTS B
UL SIMPLEX
BTS B
UL DIVERSITY
Figure A2 – DAS Tray front view and block diagram - BTS simplex
Access Points when the DAS Tray is USED as interface towards simplex BTS/
NodeB/e-NodeB (two SISO with or without diversity or one MIMO)
Label
Description
BTS A DL/UL Simplex Downlink RF port (7/16-f ) - from BTS/NodeB/e-NodeB A
BTS A UL
Simplex Uplink Output RF port (SMA-F) - to BTS/NodeB/e-NodeB A
BTS A UL div. SMA(f ) Uplink Diversity RF port - to BTS/NodeB/e-NodeB A (from UL2 DAS)
BTS B DL/UL Simplex Downlink RF port from BTS/NodeB/e-NodeB B
BTS B UL
Simplex Uplink Output RF port (SMA-F) - to BTS/NodeB/e-NodeB B
SMA(f) Uplink Diversity RF port - to BTS/NodeB/e-NodeB B (from UL2 DAS,
BTS B UL div.
UMTS diversity; from UL1 DAS, GSM diversity)
SMA(f ) Downlink path RF output connector 1 (to DAS from BTS A separate
DL1 DAS
paths, from BTS A+BTS B combined paths)
DL1 Monitor SMA(f ) DL1 DAS Monitor port
SMA(f ) Downlink path RF output connector 2 (to DAS from BTS B separate
DL2 DAS
paths, from BTS A+BTS B combined paths)
DL2 Monitor SMA(f ) DL2 DAS Monitor port
SMA(f) Uplink path RF input connector 1 from DAS to:
UL1 DAS
BTS A UL (MIMO 2x2); BTS A UL + BTS B UL (Dual SISO and UMTS diversity); BTS
A UL + BTS B UL diversity (GSM diversity)
UL1 Monitor SMA(f ) UL1 DAS Monitor port
SMA(f) Uplink path RF input connector 1 to:
UL2 DAS
BTS B UL (MIMO 2x2); BTS A UL + BTS B UL (Dual SISO); BTS A UL diversity + BTS
B UL diversity (UMTS diversity); BTS A UL diversity + BTS B UL (GSM diversity)
UL2 Monitor SMA(f ) UL2 DAS Monitor port
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
DL2 TO DAS
From/to
BTS A
page A15
TEKO DAS Platform
• TDTPOI-x-D DAS Tray module Access Points and Block diagram - BTS duplex
50Ω
LOAD
MONITOR
DL2 TO DAS
From/to
BTS A
BTS A
UL SIMPLEX
MONITOR
BTS A
UL DIVERSITY
UL1 FROM DAS
MONITOR
50Ω
LOAD
UL2 FROM DAS
BTS B
DL SIMPLEX or
DL/UL DUPLEX
From/to
BTS B
MONITOR
BTS B
UL SIMPLEX
BTS B
UL DIVERSITY
Figure A3 – DAS Tray front view and block diagram - BTS duplex
Access Points when the DAS Tray is USED as interface towards duplex BTS
(two SISO BTSs with or without diversity or one MIMO BTS)
Label
BTS A DL/UL
BTS A UL div.
BTS B DL/UL
BTS B UL div.
DL1 DAS
DL1 Monitor
DL2 DAS
DL2 Monitor
UL1 DAS
UL1 Monitor
UL2 DAS
UL2 Monitor
Description
Duplex port (7/16-f ) from (DL) /to (UL) BTS/NodeB/e-NodeB A
SMA(f ) Uplink Diversity RF port - to BTS/NodeB/e-NodeB A (from UL2 DAS)
Duplex port (7/16-f ) from (DL) /to (UL) BTS/NodeB/e-NodeB B
SMA(f ) Uplink Diversity RF port - to BTS/NodeB/e-NodeB B (from UL2 DAS,
UMTS diversity; from UL1 DAS, GSM diversity)
SMA(f ) Downlink path RF output connector 1 (from BTS A separate paths,
from BTS A+BTS B combined paths)
SMA(f ) DL1 DAS Monitor port
SMA(f ) Downlink path RF output connector 2 (from BTS B separate paths,
from BTS A+BTS B combined paths)
SMA(f ) DL2 DAS Monitor port
SMA(f ) Uplink path RF input connector 1 to:
BTS A DL/UL (MIMO 2x2); BTS A DL/UL + BTS B DL/UL (Dual SISO and UMTS
diversity); BTS A DL/UL + BTS B UL diversity (GSM diversity)
SMA(f ) UL1 DAS Monitor port
SMA(f) Uplink path RF input connector 1 to:
BTS B DL/UL (MIMO 2x2); BTS A DL/UL + BTS B DL/UL (Dual SISO); BTS A UL
diversity + BTS B UL diversity (UMTS diversity); BTS A UL diversity + BTS B DL/
UL (GSM diversity)
SMA(f ) UL2 DAS Monitor port
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
BTS A
DL SIMPLEX or
DL/UL DUPLEX
DL1 TO DAS
page A16
TEKO DAS Platform
Components & Solutions
• Point Of Interface Modules
Point of Interface modules are used in Optical DAS to interface the operator signal source- BS  
or Off-Air Repeater. Each Point of Interface is connected to a single mobile operator/ mobile
band signal source via coaxial cable.
Optical Systems can be equipped with one Point of Interface or more Point of Interface
modules to make multiple configurations available: single operator (single band / multi-band)
and multi-operator (single-band / multi-band).
Figure A4 – Point Of Interface (POI) Modules: Passive POI (left) and Active TAPOI (right)
Teko Point of Interface modules can be equipped either with manually adjustable attenuators
(POI-x models) or with remote-controlled attenuators (TAPOI-x models).
POI modules
Each POI module includes the duplexer, to separate/combine Downlink and Uplink paths and
two rotary adjustable attenuators to make both Downlink and Uplink RF levels separately
adjustable, within a range of either 30dB, with 1dB step, or 10dB, with 1dB step (POI-A10
models).
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TEKO DAS Platform
A monitor port is available either for measurements or for external wireless modem
coupling.
DL
DL OUT
UL IN
Components & Solutions
BTS PORT
UL
MONITOR
Figure A5 – Point Of Interface module block diagram
TAPOI modules
Several models of TAPOI modules are available:
• Duplex TAPOI (Commercial code: TAPOI-band): include the duplexer, to separate/combine
Downlink and Uplink paths and two automated variable attenuators to adjust Downlink
and Uplink RF levels via the Coverage System Supervision Module (TSPV) and Management
Tools (OMT webpages, OMC software). Duplex TAPOI modules make a monitor port available
for measurements/external wireless modem coupling.
DL
DL OUT
BTS PORT
UL IN
UL
MONITOR
Figure A6 – Duplex TAPOI - Block diagram
• Simplex TAPOI (Commercial code: TAPOI-band code-TRX): TAPOI modules without built-in
duplexer provide separate Downlink and Uplink ports.
• Flexible TAPOI (Commercial code: TAPOI-band code-F)
Flexible TAPOI can operate either as duplex or simplex TAPOI modules: they include both a
BTS duplex port (N type) and a simplex Uplink BTS port (BTS UL, SMA type).
DL
DL OUT
BTS DL+UL or
BTS DL PORT
UL IN
UL
BTS UL
(OUT)
Figure A7 – Flexible TAPOI - Block diagram
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
• POI Modules Access Points
Adjustable
attenuators
Adjustable
attenuators
Components & Solutions
Figure A8 – Passive POI - with built-in duplexer (left) without built-in duplexer (right)
Label
Description
(Connectors)
Downlink path RF output
DL-OUT
(SMA connector)
Uplink path RF input (SMA
UL-IN
connector)
RF connector (N type) towards
BTS PORT
the signal source (BTS, Node
B/e-Node B or repeater)
Monitor port for
MONITOR
measurements or for external
wireless modem coupling
Adjustable
attenuators
DL OUT
UL IN
Label
Description
(Connectors)
Downlink path RF output
DL-OUT
SMA connector
Uplink path RF input SMA
UL-IN
connector
Input RF connector (N type)
BTS PORT DL from the signal source - BTS,
Node B/e-NodeB or repeater
Output RF connector to the
BTS PORT UL signal source - BTS, NodeB/eNodeB or repeater (N type)
Description
Downlink path RF level adjustable attenuator (0÷30dB or 0÷10dB - 1 dB step)
Uplink path RF level adjustable attenuator (0÷30dB or 0÷10dB - 1 dB step)
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TEKO DAS Platform
• TAPOI Modules Access Points
Components & Solutions
Figure A9 – Active TAPOI: Duplex (left), Flexi (center), Simplex (right)
TAPOI model
Duplex
Flexi
Simplex
Duplex
Flexi
Simplex
Duplex/Flexi
Simplex
Duplex/Flexi
Simplex
Duplex/Flexi
Simplex
Duplex/Flexi
Simplex
Label
Description
BTS PORT Duplex port from/to BTS/NodeB/e-NodeB/repeater (N type)
BTS DL/UL Duplex port (N or 4.3-10, female type) from /to BTS/NodeB/eNodeB/repeater
or
Downlink RF port (N or 4.3-10, female type) from BTS/NodeB/
e-NodeB/repeater
BTS DL
Input RF port (N type) from BTS/NodeB/e-NodeB/repeater
MONITOR Monitor port for either measurements or external wireless
modem coupling
BTS UL
Output RF port (SMA type) - to BTS/NodeB/e-NodeB/
repeater
DL OUT
Downlink path RF output connector (SMA type)
UL IN
Uplink path RF input connector (SMA type)
ON
TAPOI Module operating status green LED ON when power
supply is present
TAPOI Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning
severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
ALM
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TEKO DAS Platform
Components & Solutions
• Teko Digital Donor Front End (TDFE)
The Digital Donor Front End Module is the single-band/single-operator System RF interface
towards a Donor Antenna, providing Downlink digital filtering and Uplink Power Amplifier.
No physical connections are required between the DFE and the cellular network: the Donor
Antenna provides the connection to a BTS or NodeB/e-NodeB over an air link.
Coverage Systems can be equipped with one or more Donor Front End modules to make
multiple configurations available: single operator (single band / multi-band) and multioperator (single-band / multi-band).
Figure A10 – Digital Donor Front End (TDFE)
A single-band single-operator modular Off-air Repeater can be set up combining a Digital
Donor Front End Module and a Service Front End (Teko single-band/multi-operator interface
towards a Service Antenna). Up to 4 Donor Front End Modules can be connected to a single
Service Front End to provide a single-band 4-operator modular Off-air Repeater.
Digital Donor Front End Modules can also be used to drive Optical Systems: the Digital Donor
Front End Module allows Optical Systems to be driven without the need of a dedicated BTS
or NodeB/e-NodeB. A donor antenna picks-up the signal and the Optical System acts as a
repeater with distributed Service antennas connected to the Remote Units. Service Front
End subracks can be connected to DFE modules to provide coverage to the area next to the
Master Unit site.
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page A21
TEKO DAS Platform
LNA
DL RF
Out
Digital Filter
Components & Solutions
Each DFE module hosts the duplexer, to be connected to the Donor Antenna to separate/
combine downlink and uplink paths.
In downlink the signal from the Donor Antenna is preamplified by a Low Noise Amplifier and
converted into an IF signal by a down converter. The selection of the band of frequencies or
channels to be extended is handled by a digital filter.
The digital filter can manage 1 variable band or 2 variable sub-bands (standard version). A
fully equipped version is available to manage up to 9 variable sub-bands.
An up converter converts the IF signal into the RF output signal.
In uplink the signal from the Service Front End Subrack or from the Optical System is converted
into an IF signal by a down converter, filtered and re-converted into an RF signal, amplified by
a power amplifier and re-transmitted to the signal source.
Donor
Antenna
Port
Duplexer
PA
UL RF
In
Digital Filter
+12V +3.3V +1.8V
μP
DC/DC
FANS
RS485
28÷30VDC
Figure A11 – Digital Donor Front End Module block diagram
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TEKO DAS Platform
Digital Donor Front End Module Access Points
Components & Solutions
Figure A12 – Digital Donor Front End (TDFE) front view
Label (Connectors) Description
DL
Downlink path RF output (SMA connector) to Service Front End or Fiber
Optic Modules
UL
Uplink path RF input (SMA connector) from Service Front End or Fiber
Optic Modules
DONOR ANT
Label (LEDs)
ON
ALM
Donor Antenna Port (N type connector)
Description
Digital Donor Front End Module operating status green LED:
ON when power supply is present
Digital Donor Front End Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
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TEKO DAS Platform
DL in1
Digital
Attenuator
DL in2
PA
From DFEs
DL in3
DL in4
4:1
Digital
Attenuator
To Optics
Service
Antenna
Port
Duplexer
DL out
UL out1
Digital
Attenuator
UL out2
LNA
To DFEs
UL out3
UL out4
4:1
+3.3V +5V
Digital
Attenuator
From Optics
μP
DC/DC
FANS
UL in
RS485
28÷30VDC
Figure A13 – Service Front End block diagram
Teko DAS Platform Technical Handbook
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page A24
Components & Solutions
A.2.2 Equipment extending coverage / distributing capacity
• Teko Service Front End (TSFE)
Teko Service Front End is a single-band/multi-operator equipment, driven by Digital Donor
Front End Modules and connected to the Service Antenna/Leaky Cable to provide wireless
signal to the area to be covered. The equipment is available in different power classes.
A single-band single-operator modular Off-air Repeater can be set-up combining a Digital
Donor Front End Module and a Service Front End. Up to 4 Donor Front End Modules can
be connected to a single Service Front End subrack to provide a single-band 4-operator
Repeater.
The Service Front End subrack can also be used in Optical Systems to provide coverage to the
area adjoining the Master Unit site.
The TSFE 19”/2U subrack hosts the duplexer, to be connected to the Service Antenna to
separate/combine Downlink and Uplink paths.
In Downlink the signals from the Donor Front-End Modules are combined and amplified by a
Power Amplifier.
In Uplink, the RF signal from the Service antenna is amplified by a Low Noise Amplifier (LNA)
and split to feed up to 4 Donor Front-End Modules.
Auxiliary ports are available to drive an Optical System.
TEKO DAS Platform
Service Front End Access Points
Components & Solutions
Figure A14 – Service Front End front view
Label (Connectors) Description
DL TO OPT
Downlink path RF output (SMA connector) - to Optics
UL FROM OPT
Uplink path RF input (SMA connector) - from Optics
SERVICE ANT
DFE1
DFE2
DFE3
DFE4
DL
UL
DL
UL
DL
UL
DL
UL
Label (LEDs)
LED
Service Antenna Port (N type )
Downlink path RF input (SMA connector) - from Digital Donor
Front End 1
Uplink path RF output (SMA connector) - to Digital Donor Front
End 1
Downlink path RF input (SMA connector) - from Digital Donor
Front End 2
Uplink path RF output (SMA connector) - to Digital Donor Front
End 2
Downlink path RF input (SMA connector) - from Digital Donor
Front End 3
Uplink path RF output (SMA connector) - to Digital Donor Front
End 3
Downlink path RF input (SMA connector) - from Digital Donor
Front End 4
Uplink path RF output (SMA connector) - to Digital Donor Front
End 4
Description
Service Front End subrack general operating status LED
Green: no alarm
Blinking Orange: presence of active alarms with warning
severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity
level
Red: presence of active alarms with critical severity level
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page A25
TEKO DAS Platform
Components & Solutions
• Teko Remote Units
Remote Units distribute wireless signals throughout the area to be covered. They are connected
to the Fiber Optic Transmitter/Receiver Modules equipped in the Master Unit.
Remote Units are equipped with the Fiber Optic Receiver and Transmitter module (for Optical
to RF and RF to Optical conversion), power amplifiers and filtering.
They can be Single band or Multi-band with different RF power classes.
Remote Units with different power classes can be driven simultaneously by the same Master
Unit to distribute capacity or extend coverage into different locations at the same time.
Pole-mount and boxed Remote Units (except Low Power) are equipped in a weatherproof
IP66 rating case.
Low Power Remote Units are equipped in an IP32 case; a protection kit, providing IP66 rating,
is available as option for harsh environment installation.
The pole-mounting Remote Unit mechanical design allows the Unit to be mounted inside
utility poles with 12” internal radius.
Pole-mount Remote Unit
Boxed Remote Unit
Low Power Remote Units
Please refer to page A70 for a detailed description of Remote Units.
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
Figure A15 – Fiber Optic Transmitter/Receiver Module (1:4 configuration) with monitor for E9-1-1 service and
Multiband Spectrum Analyzer connection
The Fiber Optic Transmitter provides the RF to optical conversion (Downlink side): the module
RF section covers the 380 to 2700MHz band (TTRU models).
Fiber Optic Receivers convert uplink optical signals from Remote Units into RF. They operate
in the third window (Optical wavelength 1490 ÷ 1570 nm).
Teko DAS Platform Technical Handbook
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page A27
Components & Solutions
A.2.3 Modules providing the optical interface towards Remote Units
• Fiber Optic Transmitter/Receiver Modules
Fiber Optic Transmitter/Receiver Modules are the optical interface between Master Unit and
Remote Units: they provide RF-to-Optical/Optical-to-RF conversion. They are connected to
Remote Units via single mode optical fibers, with Uplink and Downlink signals transmitted
over a single strand of fiber (Wavelength Division Multiplexing -WDM technology).
Different configurations are available: a single Fiber Optic Transmitter/Receiver Module can
be equipped with 1 Optical Transmitter and 1 Optical Receiver (10dB optical link budget, up
to 20km distance - 12.4 miles), or 1 Optical Transmitter split by 2 and 2 combined Optical
Receivers (10dB optical link budget, up to 20km distance- 12.4 miles), or 1 Optical Transmitter
split by 4 and 4 combined Optical Receivers (6dB optical link budget, up to 12km distance 7.5 miles).
The Fiber Optic Transmitter/Receiver Module in 1:4 configuration can manage up to 4 Remote
Units.
The Fiber Optic Transmitter/Receiver Module in 1:1 configuration is able to drive up to 5
cascaded Remote Units with different wavelengths in Uplink.
TEKO DAS Platform
DL/UL 1
DL RF
1:4
Opt
Laser
WDM
DL/UL 2
Components & Solutions
Each Fiber Optic module is controlled by a microprocessor which provides the following data
to the Supervision Module:
-- optical power received by each optical receiver,
-- Downlink attenuator and Uplink attenuator attenuation setting (0 ÷ 15dB),
-- received optical power alarms.
An auto-levelling functionality (AGC) compensates up to 10dB optical link loss in order
to guarantee constant gain over different optical budgets. This feature simplifies system
installation, makes commissioning quick and easy and avoids field adjustments.
DL/UL 3
DL/UL 4
CONTROL
MODEM
UL RF
PA
Digital
Attenuator
LNA
PA
Digital
Attenuator
LNA
PA
Digital
Attenuator
LNA
PA
Digital
Attenuator
LNA
4:1
μP
DC/DC
RS485
28÷30VDC
Figure A16 – Block diagram: Fiber Optic Transmitter/Receiver Module equipped with 1 Optical Transmitter split
by 4 and 4 combined Optical Receivers (WDM technology)
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TEKO DAS Platform
Fiber Optic Transmitter/Receiver Module Access Points
Label (Connectors)
DL (1 to 4)
UL (1 to 4)
DL RF
UL RF
Monitor RXn
Label (LEDs)
ON
ALM
DL UL
Fiber Optic Module 1:4
configuration - WDM with
SSMB ports
Components & Solutions
Fiber Optic Module 1:4
configuration - WDM
Fiber Optic Module 1:4
configuration
Description
Fiber Optic Transmitters optical output connectors (SC-APC)-laser aperture
Fiber Optic Receivers optical input connectors (SC-APC)
Fiber Optic Transmitter RF input SMA connector
Fiber Optic Receiver RF output SMA connector
Remote Units Monitor ports (1 to 4) - SSMB (m) connectors for E 9-1-1 service
and Multiband Spectrum Analyzer connection
Description
Fiber Optic Module operating status green LED
ON when power supply is present
Fiber Optic Module alarm status LED:
OFF: regular operation; BLINKING ORANGE/ORANGE: warning/minor;
BLINKING RED/RED: major/critical
These LEDs describe the general operating status of Remote Units (1 to
4) connected to Fiber Optic Transmitters (DL) and Repeaters (UL) .
Each pair of DL/UL leds takes the same color as the general operating status
led of the Remote Unit connected to the optical connector, except when
• a Laser Fault occurs in the Fiber Optic transmitter. If this fault occurs, all
DL leds turn RED and the ALM Led switches on (RED).
• a Low Optical Power alarm arises in the Fiber Optic receiver. If this alarm
arises, the UL led turns RED and the ALM Led switches on (RED).
Each pair of DL/UL LEDs can be:
Green: Remote Unit status OK
Blinking Orange: presence of RU active alarms with warning severity level
Orange: presence of RU active alarms with minor severity level
Blinking Red: presence of RU active alarms with major severity level
Red: presence of RU active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A29
TEKO DAS Platform
• Master and Slave Point to Point Modules
Master and Slave Point to Point Modules provide an optical point to point link allowing a
separation distance -up to 20km- between RF interface subracks and slave optical subracks.
The point to point link requires the RF interface subracks to be equipped with Master Point
to Point modules and the remote (slave) optical subracks to be equipped with Slave Point
to Point modules. The RF Interface subracks can be equipped with up to 4 Master Point to
Point modules for the management of up to 4 optical subracks, installed in different remote
locations.
Components & Solutions
The point to point link is suitable when the signal source (BTS, NodeB/e-NodeB, Repeater) is
located far from the area to be covered or when the same optical system provides coverage to
several separate buildings; in these applications the point to point link allows the transmission
of signals from/to a group of remote units over a single strand of optical fiber, thus providing
a significant reduction in the number of fiber optics running long distances.
Figure A17 – Point to Point Modules: Master (left) and Slave (right)
Master and Slave Point to Point Modules are connected via a single optical fiber (single-mode
SMR 9/125).
Each Slave optical subrack can be equipped with up to 3 Slave Point to Point Modules for the
coverage of up to 3 sectors.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A30
TEKO DAS Platform
Point to Point Modules (Master and Slave) perform the electrical-to-optical/optical-toelectrical conversion required for the transmission of downlink and uplink signals over the
connecting optical fiber.
1310nm
Coupler
Components & Solutions
Att.
DL RF input
SMA (f )
RS485
port
μP
Modem
WDM
DL/UL
optical SC/APC
connector
UL RF output
SMA (f )
Att.
Coupler
1550nm
Figure A18 – Master Point to Point Module block diagram
The Slave Point to Point module includes the 4-way splitter/combiner to manage up to 4 Fiber
Optic Transmitter/Receiver Modules. A built-in Supervision unit controls the Slave optical
subrack, hosting the Slave Point to Point module, and all connected Remote Units.
The Coverage System Supervision Module communicates with the Slave Point to Point module
built-in Supervision unit via the single-mode optical fiber connecting Master and Slave Point
to Point modules. When Remote optical subracks are equipped with 2 or 3 Slave Point to Point
Modules, only one module communicates with the System Supervision module.
Att.
1310nm
Coupler
DL RF outputs
SMA (f )
connectors
DL/UL
optical SC/APC
connector
μP
WDM
Modem
Att.
UL RF inputs
SMA (f )
connectors
1550nm
Figure A19 – Slave Point to Point Module block diagram
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A31
TEKO DAS Platform
Master Point to Point Module Access Points
Components & Solutions
Figure A20 – Master Point to Point Module front view
Label (Connectors) Description
DL UL
Optical input/output SC-APC connector (from/to Slave Point to Point
Module) - laser aperture
RS485
RJ45 connector for RS485 connection to the Supervision Module
DL
RF input SMA connector (from the System RF Interface modules)
UL
Label (LEDs)
ON
ALM
DL
UL
RF output SMA connector (to the System RF Interface modules)
Description
Master Point to Point Module operating status green LED:
ON when power supply is present
Point to Point Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Fiber Optic Transmitter operating status LED:
BLINKING GREEN: the module is reaching its operating temperature
GREEN optical output power is available
ORANGE: warning: optical output power is degradated
RED: Laser Fault: no optical output power
Fiber Optic Receiver operating status LED:
GREEN: +6dBm to -5dBm optical input power
When a Low Optical Power alarm arises in the Fiber Optic receiver the
UL led turns RED and the ALM Led switches on (RED)
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
Slave Point to Point Module Access Points
Components & Solutions
Figure A21 – Slave Point to Point Module front view
Label (Connectors) Description
DL UL
Optical input/output SC-APC connector (from/to Master Point to Point
Module) - laser aperture
RS232
Factory use only
DL
RF output SMA connectors (to Fiber Optic Modules)
UL
RF input SMA connectors (from Fiber Optic Modules)
Label (LEDs)
ON
ALM
DL
UL
Description
Master Point to Point Module operating status green LED:
ON when power supply is present
Point to Point Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Fiber Optic Receiver operating status LED:
GREEN: +6dBm to -5dBm optical input power
When a Low Optical Power alarm arises in the Fiber Optic receiver the
DL led turns RED and the ALM Led switches on (RED)
Fiber Optic Transmitter operating status LED:
BLINKING GREEN: the module is reaching its operating temperature
GREEN optical output power is available
ORANGE: warning: optical output power is degradated
RED: Laser Fault: no optical output power
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A33
TEKO DAS Platform
Components & Solutions
A.2.4 Passive Modules providing distribution and filtering
• Combiner/Splitter Modules
Combiner/Splitter Modules can be used to manage either up to 4 RF interface modules (POI
modules or TDFE modules), operating in the same band (Multi-Operator Systems) or up to 4
Fiber Optic Transmitter/Receiver Modules.
2-way and 4-way Combiner/Splitter modules are available.
Figure A22 – 2-way Combiner/Splitter (left), 4-way Combiner/Splitter (right)
Example: 4-way Combiner/Splitter module block diagrams
rf interface
MODULES
(poi or dfe)
dl
4-way
splitter/combiner
Ul
4-way combiner (DL side) / 4-way splitter
(UL side) to manage up to 4 RF interface
modules operating in the same band
Teko DAS Platform Technical Handbook
dl
fiber optic
MODULE
4-way
splitter/combiner
rf interface
MODULE
(poi or dfe)
fiber optic
MODULES
Ul
4-way splitter (DL side) / 4-way combiner
(UL side) to manage up to 4 Fiber Optic
Transmitter/Receiver Modules
Doc ID Number 91 080 0783 rev. 01
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TEKO DAS Platform
Combiner/Splitter Modules Access Points
Components & Solutions
4-way Combiner/Splitter
UL COMMON
DL
DL COMMON
Teko DAS Platform Technical Handbook
Up-link path output
SMA connectors (to RF
interface modules)
Up-link path input
SMA connector
Down-link path input
connectors (from RF
interface modules)
Down-link path
output
WHEN USED TO MANAGE MULTIPLE
FIBER OPTIC MODULES
UL
Description
WHEN USED TO MANAGE MULTIPLE
rf interface MODULES
Label (Connectors)
2-way Combiner/Splitter
Up-link path input
SMA connectors (from
optical sub-racks)
Up-link path output
SMA connector
Down-link path
output connectors
(to optical sub-racks)
Down-link path input
Doc ID Number 91 080 0783 rev. 01
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TEKO DAS Platform
• Triplexer (Band Splitter/Combiner)
The Triplexer is used in multi-band configurations to distribute signals operating over different
bands. Several models of Triplexers, operating over different Uplink/Downlink frequency
bands, are available. The triplexer can be equipped with a built-in 4-way Splitter/Combiner.
Components & Solutions
Figure A23 – Triplexers: without built-in 4-way Combiner/Splitter (left), with built-in 4-way Combiner/Splitter
(right)
The triplexer with built-in 4-way Splitter/Combiner can be used in Optical DAS to manage:
-- up to 3 RF interface modules operating in different bands (and up to 4 Fiber Optic Transmitter/
Receiver Modules), or
-- up to 3 Service Front End modules operating in different bands (and up to 4 Fiber Optic
Transmitter/Receiver Modules), or
-- up to 3 four-way splitter/combiner - used to manage multiple RF interface modules- up to
4 for each band (and up to 4 Fiber Optic Transmitter/Receiver Modules).
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A36
TEKO DAS Platform
BAND 1
f < 1GHz
ATT.
LOW
DL
Components & Solutions
HIGH
BAND 2
f > 1GHz
high
BAND 3
f > 1GHz
HIGH
Figure A24 – Example: 1-Low-band + 2-High-Band Triplexer block diagram (Downlink path)
BAND 1
f < 1GHz
ATT.
LOW
UL
HIGH
BAND 2
f > 1GHz
high
BAND 3
f > 1GHz
HIGH
Figure A25 – Example: 1-Low-band + 2-High-Band Triplexer block diagram (Uplink path)
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
Triplexer Module Access Points -Example
Band 1
Band 2
Band 2
Band 3
Band 3
Components & Solutions
Band 1
Triplexer without built-in
4-way Combiner/Splitter
Band 2
Band 3
UL
COMMON
DL
COMMON
BAND 1 input (down-link path)
BAND 1 output (up-link path)
BAND 2 input (down-link path)
BAND 2 output (up-link path)
BAND 3 input (down-link path)
BAND 3 output (up-link path)
Teko DAS Platform Technical Handbook
Uplink path input
connectors (from
optical subrack)
Downlink path
output connectors
(to optical subrack)
WHEN USED TO MANAGE
MULTIPLE FOUR-WAY
COMBINER/SPLITTER MODULES
Band 1
Description
WHEN USED TO MANAGE
MULTIPLE FIBER OPTIC
MODULES
Connectors
Triplexer with built-in 4-way
Combiner/Splitter
Uplink path output
connectors (to 4-way
combiner/splitter
modules)
Downlink path input
connectors (from
4-way combiner/
splitter modules)
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TEKO DAS Platform
BAND 1
BAND 1
BAND 2 +
BAND 3
BAND 2
BAND 3
BAND 4
BAND 4
LO
DL OUT
HI
BAND 5
BAND 5
BAND 6
BAND 6
BAND 1
BAND 1
To a single optical module or
to the 4-way splitter-combiner
for the management of up to 4
optical modules
BAND 2
BAND 3
BAND 2 +
BAND 3
BAND 4
BAND 4
LO
UL IN
HI
BAND 5
BAND 5
BAND 6
BAND 6
From the optical module or from
the 4-way splitter-combiner used
for the management of up to 4
optical modules
Figure A26 – Example: 4-Low-band + 2-High-Band Esaplexer block diagram
Teko DAS Platform Technical Handbook
Components & Solutions
• Esaplexer (US bands)
The Esaplexer is used in multi-band configurations to distribute signals operating over up to
6 different bands.
The Esaplexer can be connected to a 4-way splitter/combiner in order to manage up to 4 Fiber
Optic Transmitter/Receiver Modules (i.e. up to 16 Remote Units).
Doc ID Number 91 080 0783 rev. 01
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TEKO DAS Platform
• Esaplexer Access Points
Components & Solutions
Band (or
Bands) 1
DL path
Band (or
Bands) 2
UL path
Band or
Bands 2
Band (or
Bands) 3
Band (or
Bands) 5
Band (or
Bands) 4
Band (or
Bands) 5
Label
Description
DL OUT
Downlink path output connector
UL IN
Uplink path input connector
Band (or Bands) 1 Band (or Bands) 1 input (downlink path)
Band (or Bands) 1 output (uplink path)
Band (or Bands) 2 Band (or Bands) 2 input (downlink path)
Band (or Bands) 2 output (uplink path)
Band (or Bands) 3 Band (or Bands) 3 input (downlink path)
Band (or Bands) 3 output (uplink path)
Band (or Bands) 4 Band (or Bands) 4 input (downlink path)
Band (or Bands) 4 output (uplink path)
Band (or Bands) 5 Band (or Bands) 5 input (downlink path)
Band (or Bands) 5 output (uplink path)
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
BAND 1
BAND 1
BAND 2
BAND 2
BAND 3
BAND 3
LO
DL OUT
HI
BAND 4
BAND 4
BAND 5
BAND 5
BAND 1
BAND 1
BAND 2
BAND 2
BAND 3
BAND 3
To a single optical module or
to the 4-way splitter-combiner
for the management of up to 4
optical modules
LO
UL IN
HI
BAND 4
BAND 4
BAND 5
BAND 5
From the optical module or from
the 4-way splitter-combiner used
for the management of up to 4
optical modules
Figure A27 – 3-Low-band- + 2-High-Band Pentaplexer block diagram
Teko DAS Platform Technical Handbook
Components & Solutions
• Pentaplexer
The Pentaplexer is used in multi-band configurations to distribute signals operating over up
to 5 different bands.
The Pentaplexer can be connected to a 4-way splitter/combiner in order to manage up to 4
Fiber Optic Transmitter/Receiver Modules (i.e. up to 16 Remote Units).
Doc ID Number 91 080 0783 rev. 01
page A41
TEKO DAS Platform
• Pentaplexer Access Points
Components & Solutions
Band 1
DL path
Band 2
UL path
Band 2
Band 3
Band 5
Band 4
Band 5
Label
Description
DL OUT
Downlink path output connector
UL IN
Uplink path input connector
Band 1
Band 1 input (downlink path)
Band 1 output (uplink path)
Band 2
Band 2 input (downlink path)
Band 2 output (uplink path)
Band 3
Band 3 input (downlink path)
Band 3 output (uplink path)
Band 4
Band 4 input (downlink path)
Band 4 output (uplink path)
Band 5
Band 5 input (downlink path)
Band 5 output (uplink path)
Teko DAS Platform Technical Handbook
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page A42
TEKO DAS Platform
TDD DAS Tray
Point of Interface
RF BS A
monitor
RF BS B
monitor
TDD
SYNC IN
RF TDD REF IN
TSYNC
TDD synchronizer
SYNC
OUT
RF PILOT
OUT
DL
BAND 1
DL
BAND 2
SYNC IN
DL
COMMON
Triplexer for
• FDD/TDD bands combination
and distribution
• downstream DAS components
synchronization
UL
BAND 1
UL
BAND 2
UL
COMMON
Figure A28 – Synchronizing signal path
Teko DAS Platform Technical Handbook
Components & Solutions
A.2.5 Master Unit Components for Time Division LTE (LTE-TDD) technology
The Teko DAS Platform integrates Time-Division Long-Term Evolution technology and provides
a full set of components dedicated to the LTE-TDD:
• TSYNC, TDD synchronizer module managing and distributing the BS TDD reference Signals;
• TDD DAS Tray Point of Interface, geared to pick up the TDD reference signals from BS;
• Triplexer combining the FDD/TDD bands for distribution and synchronizing the downstream
DAS components.
Teko 2-way and 4-way Combiner/Splitter modules (TSC2W-U and TSC4W-U) are TDD Ready
and can be deployed directly in TDD Systems.
Doc ID Number 91 080 0783 rev. 01
page A43
TEKO DAS Platform
• TSYNC Access Points
Components & Solutions
Figure A29 – TSYNC front view
Label (Connectors)
RF
TDD REF IN
SYNC OUT
(1 to 4)
RF PILOT OUT
(1 to 4)
Description
Label (LEDs)
ON
Description
ALM
RF BS signal input
BS TDD reference signal output connector (MCX type) to TDD DAS Tray
Point of Interface for module synchronization
BS TDD reference signal output connector (SMA-F type) to the
Triplexer
Module operating status green LED: ON when power supply is present
TSYNC Module alarm status LED:
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
• TDD DAS Tray Point of Interface - Additional Access Points
TDD SYNC IN
BTS A monitor
BTS B monitor
• FDD/TDD Triplexer Access Points
ÌÌ TRI-2325TR
Components & Solutions
Connector Description
TDD SYNC Base Station TDD reference signal input
IN
connector (MCX type)
from the TDD synchronizer module
BTS A
Monitor port - to the TDD synch module,
monitor extracting the BS TDD reference signal
BTS B
Monitor port - to the TDD synch module,
monitor extracting the BS TDD reference signal
Connector
WCS2300
LTE TDD
SYNC IN
DL COMMON
UL COMMON
Description
WCS2300 input (down-link path)
WCS2300 output (up-link path)
LTE TDD input (down-link path)
LTE TDD output (up-link path)
BTS TDD reference signal input (from
TSYNC)
Downlink path output connector
Uplink path input connector
ÌÌ TRI-23T26TR
Connector
LTE TDD
LTE2600
SYNC IN
DL COMMON
UL COMMON
Teko DAS Platform Technical Handbook
Description
LTE TDD input (down-link path)
LTE TDD output (up-link path)
LTE2600 input (down-link path)
LTE2600 output (up-link path)
BTS TDD reference signal input (from
TSYNC)
Downlink path output connector
Uplink path input connector
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page A45
TEKO DAS Platform
ÌÌ Rack-mount Light Supervision shelf - Access Points
A Light Supervision module, compact and powerful, is available for the management of up to
4 sub-racks: it is suitable for modular repeaters or small/medium DAS.
SMA connector for
external antenna
4 dry contacts for
external alarms
LAN port
Alarm
status LED
4 RS485 ports to connect
4 different sub-racks
SIM card slot
Operating
status LED
Figure A30 – Rack mount Light Supervision shelf front view
Label (Connectors)
ANT
EXT IN
LAN
RS485
(1 to4)
LED
LED
SIM
Description
Optional built-in wireless modem antenna SMA connector
External alarms input connector
Local Control Interface (RJ45 connector)
RJ45 connectors for the management of monitored Active Subracks,
mounted within the same rack cabinet hosting the Supervision module
Supervision Module alarm status LED.
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level Supervision
Module operating status green LED:
ON when power supply is present
Optional built-in modem SIM card slot
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A46
Components & Solutions
A.2.6 Components for the management of the System
• Supervision Units
A single Supervision Unit allows the management of the entire System utilizing secure browser
technology that enables administration from any location.
The Teko Supervision unit provides web-based administration and SNMP v3 support with
Event-based Configurations that significantly simplify remote administration (web browser,
tablets) and enables integration with SNMP v3 Management tools.
For remote control the System can be accessed via optional wireless modem (integrated
inside the supervision module).
JMA Wireless Teko OMT (Operation and Maintenance Terminal) web pages allow the
commissioning, monitoring, setting and troubleshooting of the whole Coverage and Capacity
System via a user friendly graphical interface.
Teko OMC (Operation Management Centre) proprietary software is available to control multiple
Supervision Modules managing different Coverage and Capacity Systems in a Network.
TEKO DAS Platform
ÌÌ Supervision Module
A Supervision module is available for the management of more sophisticated Teko DAS
architectures: the supervision module allows the management of up to 13 Active Subracks.
Components & Solutions
Figure A31 – Supervision Module: equipped with optional built-in wireless modem (left), without built-in
wireless modem (right)
When the optional built-in wireless modem is equipped, an SMA input/output connector is
available on the Supervision front panel for remote management.
4 external alarm inputs and 4 dry contact outputs are available on the Supervision module
front panel.
The 4 Input lines are opto-isolated and are activated by a short circuit between input pins
(max current flow during short = 6mA; max Vdc at input pins = 3.3V).
Please refer to Paragraph B.4.4 for details about external alarms connections.
Teko DAS Platform Technical Handbook
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page A47
TEKO DAS Platform
Supervision Module Access Points
Label (Connectors)
RS485
(1 to 8)
RS485
(S1 to S4)
Components & Solutions
Supervision Module equipped with
optional built-in wireless modem
Supervision Module without
built-in wireless modem
Description
EXT OUT
EXT IN
RS232
ANT
LAN
RJ45 connectors for the management of monitored Active Subracks,
mounted within the same rack cabinet hosting the Supervision module
RJ45 connectors for the management of remote Active Subracks
equipped with Point to Point slave modules.
When not connected to remote Subracks, these ports can be used to
manage additional Active Subracks (exceeding 8) mounted within the
same rack cabinet hosting the Supervision module
External alarms output connector
External alarms input connector
Factory use only
Optional built-in wireless modem antenna SMA connector
RJ45 connector Local Control Interface
Label (LEDs)
Description
ON
ALM
Supervision Module operating status green LED:
ON when power supply is present
Supervision Module alarm status LED.
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A48
TEKO DAS Platform
• Alarm Board
The Alarm Board is an optional I/O Module that can be equipped in addition to the Supervision
Module, in order to increase the number of supported external alarms.
Components & Solutions
Figure A32 – Alarm Board equipped with 16 input pins - TEA-I16
16 external alarm inputs are available on the Alarm Board front panel.
The 16 Input lines are opto-isolated and are activated by a short circuit between input pins
(max current flow during short = 6mA; max Vdc at input pins = 3,3V).
Inputs 1-to-4 can be switched to dry output contacts upon request.
Please refer to the Supervision Module external alarms connection (Paragraph B.4.4) for details
about external alarms connections.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A49
TEKO DAS Platform
Alarm Board Access Points
Components & Solutions
Alarm Board
with female dry connectors
Alarm Board
without female dry connectors
Label (Connectors) Description
EXT IN
External alarms input connector
EXT OUT
Optional external alarms output connector (TEA-I12O4)
Label (LEDs)
Description
ON
Alarm Board Module operating status green LED:
ON when power supply is present
ALM
Alarm Board Module alarm status LED.
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
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page A50
TEKO DAS Platform
Components & Solutions
A.2.7 Power Supply Components
• Power Supply Modules (TPSU)
Power Supply modules are either AC-to-DC or DC-to-DC plug-in modules that provide power
to Active Subracks. Each module provides up to 100W output power; several modules can
be connected in parallel (please refer to the Teko DAS Platform datasheet for details about
derating factors). Hot-plug 1+1 Redundancy feature is supported: it can be implemented to
achieve high system reliability.
Figure A33 – Power Supply Modules: TPSU/AC (left), TPSU/48 (right)
The following figure shows the DC/DC Power Supply Module protection fuse position and
electrical rating. If the fuse blows, it has to be replaced.
Fuse SMD F10A, 125V
Figure A34 – DC/DC Power Supply Module protection fuse position and electrical rating
Power Supply modules can be equipped in monitored Active Subracks, in the Master Active
Subrack or in a dedicated Active Subrack.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A51
TEKO DAS Platform
When Power Supply modules are equipped in monitored Active Subracks, the RJ45 connector
available on the Power Supply Module front panel can be used for connection to the
Supervision Module, equipped in the Master Active Subrack.
Power Supply Modules Access Points
Components & Solutions
AC MAINS
switch
DC switch
TPSU/AC
AC/DC Power Supply Module
TPSU/48
DC/DC Power Supply Module
Connectors Description
RS485
RJ45 connector for RS485
connection to the Supervision
Module (monitored Subracks)
Connectors Description
RS485
RJ45 connector for RS485
connection to the Supervision
Module (monitored Subracks)
AC switch
AC MAINS switch
DC switch
48Vdc switch
AC MAINS
AC MAINS socket (100-240Vac)
DC MAINS
Vdc input connector (48Vdc)
Label (LEDs) Description
POWER ON
ALM
Power Supply Module operating status green LED:
ON when power supply is present
Power Supply Module alarm status LED.
OFF: regular operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A52
TEKO DAS Platform
ÌÌ SUB-PSU-MU: the AC-to-DC Power Supply Subrack can be equipped with up to 3 AC/DC
Power Supply modules to provide up to 2.4kW output power.
Front Access Points
900W power supply
module
900W power supply
module
900W power supply
module
Components & Solutions
• Power Supply Subracks
The AC-to-DC and DC-to-DC Power Supply subracks allow a reduction in the amount of
space required for the System installation: they can be equipped with up to 3 Power Supply
modules to provide up to 2.4kW (SUB-PSU-MU)/3kW (SUB-PSU-MU/48) output power in just
one height unit space. Hot-plug 1+1 redundancy feature is supported: load-sharing power
supply modules can be installed to achieve high system reliability. Hot-plugging allows a
faulty power supply module to be replaced without powering off the system.
The power supply subracks allow the reset of the whole Master Unit, or PTP Slave subrack,
from the System management software (OMT webpages / OMC proprietary software).
AC MAINS
socket
Power Supply
Module Locking
Tab
AC MAINS
socket
Power Supply
Module Locking
Tab
AC MAINS
socket
Power Supply
Module Locking
Tab
Figure A35 – SUB-PSU-MU Power Supply subrack (maximum configuration 2.4kW output power) - Front view
Connectors
AC MAINS
Description
AC MAINS socket (100-240Vac)
Label (LEDs)
AC
OK
DC
FAIL
Description
ON (green) when AC input is present
ON (green) when DC output is available
ON (RED) when DC output is unavailable
Rear Access Points
Vdc Outputs
Ground
RS 485
Figure A36 – SUB-PSU-MU Power Supply subrack - Rear view
Connectors
GROUND
RS485
Vdc outputs
Description
Equipment grounding
RJ45 connector for RS485 connection to the Supervision Module
28Vdc Outputs (max 10A each)
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A53
TEKO DAS Platform
ÌÌ SUB-PSU-MU/48 : the DC-to-DC Power Supply Subrack can be equipped with up to 3 DC/
DC Power Supply modules to provide up to 3kW output power.
Front Access Points
1kW power
supply module
LED 1
+ –
Vdc input
connector
(48Vdc)
1kW power
supply module
LED 1
+ –
LED 2
Power Supply
Module Locking
Tab
Vdc input
connector
(48Vdc)
LED 1
+ –
LED 2
Power Supply
Module Locking
Tab
Vdc input
connector
(48Vdc)
LED 2
Power Supply
Module Locking
Tab
Figure A37 – SUB-PSU-MU/48 Power Supply subrack (maximum configuration 3kW output power) - Front view
LEDs Description
LED 1
LED 2
ON (green) when DC input is present
OFF: regular operation
Orange: fan fail alarm
Red: DC output voltage alarm or communication alarm
Please note
Each DC input is protected by fuses:
F20A, 250V
F20A, 250V
Figure A38 – DC/DC Power Supply module (TPSU/48-30-1K) input protection fuses position and electrical rating
Rear Access Points
Equipment
grounding
RJ45
connector
Vdc Outputs 28Vdc (max 10A each)
Figure A39 – SUB-PSU-MU/48 Power Supply subrack - Rear view
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
1kW power
supply module
page A54
TEKO DAS Platform
ÌÌ SUB-PSU-MU and SUB-PSU-MU/48: each Vdc output connector is protected by a fuse.
Components & Solutions
Figure A40 – SUB-PSU-MU and SUB-PSU-MU/48 protection fuses position
If a fuse blows, the management software reports an Output Voltage alarm for the connector
involved and the green led to the right of the connector switches off. The fuse has to be
replaced.
Connector n protection
fuse (32V-20A)
28Vdc output
connector (n)
Connector n
operating LED
Figure A41 – Detail: Connector n protection fuse and operating status led
Please note
DC/DC Power Supply modules (TPSU/48-30-1K) can be equipped in the SUB-PSU-MU/48
subrack only.
AC/DC Power Supply modules (TPSU/AC-30-1K) can be equipped in the SUB-PSU-MU subrack
only.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A55
TEKO DAS Platform
Power
Distribution Unit
Components & Solutions
• Power Supply distribution system
A centralized Power Supply distribution solution is available for the remote powering of Teko
48VDC Low Power Remote Units.
The Power Supply distribution system is composed of both a Power Supply Unit (PSU) and a
Power Distribution Unit (PDU), housed in a 2U - 19” subrack. The power supply unit can host
up to 4 current-sharing Power Supply modules (either AC/DC or DC/DC).
The configuration allows hot-swapping and supports N+1 redundancy configurations.
The voltage from the power supply modules is made available to the 32 DC power output
ports on the distribution unit front panel.
A Class 2 DC Distribution Unit version is available to meet the requirements of the US National
Electrical Code (NEC).
Please note
Class 2 distribution systems allow power supply cables to be installed throughout the building
without the need of a conduit.
power supply
module 1
power supply
module 2
power supply
module 3
power supply
module 4
Figure A42 – Power Supply distribution system - Front view
Component
Power Distribution
Unit (PDU)
Power supply
modules (1 to 4)
Commercial code
Description
SUB-RPSU2-MU/AC
Class 2 DC Distribution Unit and Subrack
SUB-RPSU2-MU/48
Class 2 DC Distribution Unit and Subrack
SUB-RPSU-MU/AC
Standard DC Distribution Unit and Subrack
SUB-RPSU-MU/48
Standard DC Distribution Unit and Subrack
TRPSU/AC-58-1.2k
AC/DC power supply module
TRPSU/48-58-2k
DC/DC power supply module
Power Supply distribution system components
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A56
TEKO DAS Platform
Vdc output ports 58Vdc
SUB-RPSU-MU models: max 4.5A each port;
SUB-RPSU2-MU models: max 2.5A each port
Port number 1 2 3 4
1+ -18+ -19+ -20+ -21+ -22+ -23+ -24+ -25
1+ -26+ -27+ -28+ -29+ -30+ -31+ -32+
- + - + - + - + - 5+ - 6+ - 7+ -8+ - 91+ -10+ -11+ -12+ -13+ -14+ -15+ -16+ -17
Lead polarity 1 2 3
1 2 3
1 2 3
1 2 3
Power Supply
Module LEDs
Output ports
status LEDs
Figure A43 – Power Supply distribution system - Front view - Access points
32 LED indicators on the front panel of the Power Distribution unit show the status of each
output port as follows:
Led status
OFF
ON
Description
Switched off port
Green: regular functioning (normal operation)
Orange: the port is not operating properly (current absorption out of
range)
Red: no output voltage (port hardware overload protection or broken
fuse)
Please note
Each DC output port is protected by a fuse:
Vdc output ports
protection fuses
(F20A, 250V each)
Figure A44 – Power Supply distribution system output port protection fuses - position and electrical rating
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
Power Supply
Module
securing clip
page A57
TEKO DAS Platform
Four LED indicators are available on the front panel of each Power Supply Module.
Front Panel LEDs description:
• TRPSU/AC-58-1.2k
Description
ON: input ok
Blinking: input out of limits
ON: output ok
Blinking: overload
OFF: no DC output
ON: over-temperature warning
Blinking: service
Components & Solutions
Symbol
ON: fault
• TRPSU/48-58-2k
Symbol
Teko DAS Platform Technical Handbook
Description
ON: input ok
Blinking: input out of limits
ON: output ok
Blinking: overload
ON: over-temperature warning
Blinking: service
ON: fault
Doc ID Number 91 080 0783 rev. 01
page A58
TEKO DAS Platform
ÌÌ SUB-RPSU2-MU/AC and SUB-RPSU-MU/AC: power supply distribution system equipped
with AC/DC power supply modules
Rear Access Points
RS 485
AC MAINS socket
PS module 3
Equipment
grounding
AC MAINS socket
PS module 2
AC MAINS socket
PS module 1
Figure A45 – SUB-RPSU2-MU/AC and SUB-RPSU-MU/AC - Rear view - Access points
ÌÌ SUB-RPSU2-MU/48 and SUB-RPSU-MU/48: power supply distribution system equipped
with DC/DC power supply modules
Rear Access Points
RS 485
VDC Input
to PS modules 3 and 4
Equipment
grounding
VDC Input
to PS modules 1 and 2
Figure A46 – SUB-RPSU2-MU/48 and SUB-RPSU-MU/48 - Rear view - Access points
Teko DAS Platform Technical Handbook
Components & Solutions
AC MAINS socket
PS module 4
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TEKO DAS Platform
28VDC ± 0.5VDC outputs
(max 10A each)
Equipment
Grounding
RS 485
RJ45 connector
Figure A47 – Active Subrack - rear view
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A60
Components & Solutions
A.2.8 Subracks hosting the System modules
• Active subracks (SUB-TRX-PSU)
Active Subracks are provided with a backplane that allows the management and power
supply of up to 12 active modules.
The following connectors are available on each active subrack rear panel:
-- a ground bolt;
-- one or more 28Vdc input/output connectors;
-- an RJ45 connector (RS485) to be used to connect monitored Active Subracks to the RS485
ports, available on the front panel of the Supervision Module (when power supply modules
are not equipped in monitored Active Subracks).
Please note
Master SUB-TRX-PSU: the RJ45 connector, available on the rear panel of the SUB-TRX-PSU
hosting the Supervision module, is used only when the System is equipped with the SUBPSU-MU in addition to other 12 monitored Active Subracks, connected to the Supervision
Module RS485 front ports. It provides an additional port for the management of the power
supply subrack.
Remote SUB-TRX-PSU: the RS485 port, available on the rear panel of a Remote Point to Point
Slave Subrack, is used only when a SUB-PSU-MU or SUB-PSU-MU/48 subrack is installed to
provide power supply to the remote subracks.
TEKO DAS Platform
Components & Solutions
Deep subracks (SUB-TRX-PSU-D)
19” - 3U, 360mm (14.17in) deep subracks are required to host fully equipped Digital Donor
Front End modules.
Please note
Extender boards are required to plug standard-depth modules into deep subracks.
Figure A48 – Teko Extender Board (TME-SUB-TRX-D)
• Passive subracks (SUB-HPOI)
Passive modules that do not require power nor management to function can be housed in
Passive subracks thus allowing a reduction in the cost of the whole system.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A61
TEKO DAS Platform
A.2.9 Forced-air cooling Subrack
Teko forced-air cooling subrack is able to provide a maximum air flow of 180cfm (5m3/min) in
order to ensure the proper operation of cabinet installed equipment.
LED
Components & Solutions
Forced-air cooling Subrack Access Points
Figure A49 – Forced-air cooling subrack - Front view
GND
28V
;10A MAX
RS485
Figure A50 – Forced-air cooling subrack - Rear view
Access Point
LED
RS485
28V ;10A MAX
GND
Description
Forced-air cooling subrack general operating status LED
Green: normal operation
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
RJ45 connector for RS485 connection to the Supervision Module
28VDC ± 0.5VDC input (max 10A)
Equipment grounding
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A62
TEKO DAS Platform
TEKO DAS PLATFORM
Part A - Components and Solutions
Coverage Solutions
TEKO DAS Platform
A3 Coverage and Capacity Solutions
The components of the Teko Platform can be assembled to provide Modular Repeaters, Optical
DAS and integrated solutions to improve coverage in different environments.
Service Front End
Donor Front End Modules
Figure A51 – Rack-mounted Modular Repeater example
The Digital Donor Front End is the single-band/single-operator RF interface towards the
signal source; the Service Front End is the multi-band/single operator equipment that
provides enhanced wireless signal to the area to be covered.
Teko DAS Platform Technical Handbook
Components & Solutions
A.3.1 Rack-mounted Modular Repeater
The Teko platform can be configured for RF repeater applications where the need for optimized
signal coverage is adequate to provide better end-user service that is transparent to protocol
and modulation.
Populating the Teko Master Unit with digital Donor Front End (DFE) and service front-end
modules, multi-band, multi-operator coverage solutions can be configured.
The modularity of the Teko platform allows easy adaptability to new technologies or extending
the solutions to additional operators as needed.
No physical connections are required between the Modular Repeaters and the cellular network:
the Digital Donor Front End is connected to a Donor Antenna, providing the connection
towards a BTS or NodeB/e-NodeB over an air link.
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TEKO DAS Platform
Multiple DFEs (up to 4) can be connected with a single service front-end for single band,
multi-operator configurations. Multiple service front-ends can be utilized with multiple DFEs
to create multi-band, multi-operator solutions.
When Modular Repeaters do not provide satisfactory coverage (extensive areas, long tunnels),
they can be used along with a fiber fed System (Teko Optical DAS).
TDFE 1
TSFE
LNA
Digital Filter
DL RF
Output
DL RF
Input 1
DL RF Input 2
(from TDFE 2)
Digital
Attenuator
DL RF Input 3
(from TDFE 3)
Donor
Antenna
Port
DL RF Input 4
(from TDFE 4)
DUPLEXER
Digital Filter
UL RF
Input
4:1
Remote
Units
Digital
Attenuator
UL RF Output 3
(to TDFE 3)
UL RF Output 4
(to TDFE 4)
LNA
4:1
Digital
Attenuator
DC/DC
Auxiliary UL In
From Optics
28÷30VDC
μP
TDFE 2
TDFE 3
TDFE 4
Service
Antenna
Port
Digital
Attenuator
UL RF
Output 1
UL RF Output 2
(to TDFE 2)
μP
PA
Duplexer
PA
DC/DC
RS485
Auxiliary DL Out
To Optics
28÷30VDC
Fiber Optic
TX/RX
To/From
Remote
Units
optical system & DAS
Figure A52 – Rack-mounted Modular Repeaters block diagram
Teko DAS Platform Technical Handbook
Components & Solutions
Operating principle
Modular repeaters use a directional antenna to interface with the operator’s donor BS and one
or more service antennas to transmit the amplified wireless signal to the area to be covered.
In downlink the repeater receives the signals from the BS, amplifies them and re-transmits
them to the mobiles. In uplink the repeater receives the signals from the mobiles (MS),
amplifies them and re- transmits them to the base station.
Doc ID Number 91 080 0783 rev. 01
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TEKO DAS Platform
• RF interface subracks
RF Interface subracks operate over different frequencies and with various frequency
combinations in the frequency range from 380 to 2700MHz.
Each RF interface subrack can be equipped with one or more RF Interface modules.
Master Unit RF Interface modules can be Point of Interface (POI/TAPOI/TDTPOI) modules and/
or Donor Front End modules.
Master Units equipped with POI/TAPOI/ TDTPOI modules must be installed next to the donor
BTS or NodeB/e-NodeB).
POI modules can be equipped in passive subracks; TAPOI/TDTPOI modules require active
subracks (SUB-TRX).
Donor Front End modules allow the Optical DAS to be driven without the need of a dedicated
BTS or NodeB/e-NodeB: each Donor Front End module interfaces with a Donor Antenna
oriented towards a BTS or NodeB/e-NodeB (connection over an air link).
Active Subracks are required to host Digital Donor Front Ends; fully equipped Digital Donor
Front Ends require deep Active Subracks (depth = 360mm / 14.17in). Each subrack can be
equipped with up to 4 Donor Front End Modules.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A66
Components & Solutions
A.3.2 Optical DAS
The Teko Platform components can be configured to provide multi-carrier Optical Distributed
Antenna Systems.
Optical Systems are based on the Radio over Fiber technology, which enables radio signal
transmission over optical fiber. This technology offers wide bandwidth and very little loss
along the fiber optic cable, allowing the signals to be propagated over long distances. This
allows extensive areas coverage.
Each Teko Optical DAS is made up of two main parts: the Master Unit, interfacing the signal
source, and Remote Units, distributed throughout the territory to be served. Master Unit and
Remote Units are connected via single mode optical fiber (SMR 9/125).
A – Master Unit
The Master Unit provides both the RF interface towards the signal source (one or more BTSs
or NodeBs/e-NodeBs) and the optical interface towards Remote Units.
It is a rack-based modular equipment: Teko Coverage and Capacity Systems components can
be assembled in a variety of ways providing different Master Unit configuration options.
Each Master Unit can be equipped with one or more RF interface subracks, hosting RF interface
modules and with one or more Optical Subracks, hosting Fiber Optic Transmitter/Receiver
modules.
When the Master Unit is equipped with Master and Slave Point to Point Modules, RF interface
subracks and optical subracks can be separated by a maximum distance of 20km.
TEKO DAS Platform
modules -up to 4 for each band (and up to 4 Fiber Optic Transmitter/Receiver Modules).
• the Pentaplexer and Esaplexer can be used to manage
-- up to 5 (Pentaplexer)/ up to 6 (Esaplexer) RF interface modules operating in different
bands or
-- up to 5 (Pentaplexer)/ up to 6 (Esaplexer) Service Front End subracks operating in
different bands or
-- up to 5 (Pentaplexer)/ up to 6 (Esaplexer) four-way splitter/combiner modules- used to
manage multiple RF interface modules (up to 4 for each band).
The RF Interface subracks can also host up to 4 Master Point to Point modules for the
management of up to 4 optical subracks installed in different remote locations.
Digital Donor Front End modules can be connected to Service Front End Subracks to provide
coverage to the area adjoining the Master Unit site.
Each Service Front End can be fed by up to 4 Donor Front-End Modules interfacing the signal
source. Downlink and uplink auxiliary ports are available to drive the Optical System.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A67
Components & Solutions
RF Interface subracks also host passive modules providing distribution and filtering:
• Splitter/Combiner
• Band Splitter/Combiner (Triplexer) with or without built-in 1:4 Splitter/Combiner
• Pentaplexer/Esaplexer.
Due to the flexible configuration options of Teko Coverage and Capacity Systems, the same
passive modules can be used for different purposes:
• the splitter/combiner can be used to manage multiple RF interface modules, operating in
the same band (Multi-Operator Optical Systems) or multiple Fiber Optic modules;
• the triplexer (with built-in 4-way Splitter/Combiner) can be used to manage
-- up to 3 RF interface modules operating in different bands (and up to 4 Fiber Optic
Transmitter/Receiver Modules) or
-- up to 3 Service Front End subracks operating in different bands (and up to 4 Fiber Optic
Transmitter/Receiver Modules) or
-- up to 3 four-way splitter/combiner modules, used to manage multiple RF interface
TEKO DAS Platform
• Optical Subracks
Optical Subracks are Active Subracks hosting Fiber Optic Transmitter/Receiver modules.
Figure A53 – Optical Subrack (example)
Fiber Optic Transmitter/Receiver modules are the optical interface towards Remote Units:
they provide RF to optical /optical to RF conversion.
Fiber Optic modules are connected to Remote Units via single-mode optical fiber (SMR
9/125); each Fiber Optic Module can manage up to 4 Remote Units (up to 5 in cascade
configuration).
Up to 6 Fiber Optic Modules can be housed in a single Optical Subrack.
In Downlink RF signals are converted into optical signals in the Fiber Optic Transmitter modules
of the Master Unit and then they are propagated through optical fiber distribution to Remote
Units. In the Fiber Optic Receiver of each Remote Unit, the optical signal is then converted
back into an RF signal that is amplified and transmitted to mobiles through an antenna or a
passive distribution system.
In Uplink RF signal is converted into an optical signal in the Fiber Optic Transmitter of each
Remote Unit and then it is propagated via fiber optics to the Master Unit. Optical signals from
Remote Units are then converted by the Fiber Optic Receiver modules of the Master Unit into
RF signals and transmitted to the signal recipient.
Uplink and downlink optical signals are transmitted over the same single mode optical fiber
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
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Components & Solutions
Fiber Optic
Modules
TEKO DAS Platform
MULTI-OPERATOR MULTI-STANDARD RF INTERFACE
EQUIPPED WITH MASTER POINT TO POINT MODULES
OPTICAL SUBRACK
TO/FROM
REMOTE UNITS
Components & Solutions
(Wavelength Division Multiplexing -WDM- technology).
When the Coverage System includes point to point links, the remote optical subracks host the
Slave point to point modules to be connected, via optical fiber, to their Master Point to Point
modules, equipped in the RF interface subracks.
The slave point to point module includes the 4-way splitter/combiner to manage up to 4
Fiber Optic Transmitter/Receiver Modules and a built-in Supervision unit for the management
of the remote optical subrack, the power supply subrack (SUB-PSU-MU or SUB-PSU-MU/48,
when equipped), and all connected Remote Units.
When Remote optical subracks are equipped with 2 or 3 Slave Point to Point Modules only
one module is connected to the System Supervision module (the one installed on the left side
of the remote subrack - slots 1 to 6).
SIGNAL SOURCE
FIBER OPTIC
TRANSMITTER
RECEIVER
MODULES
INTERFACE MODULE:
POI MODULE or
TDFE MODULE
4-WAY
SPLITTER
COMBINER
INTERFACE MODULES
OPERATING IN THE
SAME BAND
SIGNAL SOURCE
INTERFACE MODULE:
POI MODULE or
TDFE MODULE
4-WAY
SPLITTER
COMBINER
TRIPLEXER
4-WAY
SPLITTER
COMBINER
REMOTE OPTICAL
SUBRACK 1
MASTER
POINT TO POINT
MODULE
INTERFACE MODULES
OPERATING IN THE
SAME BAND
SLAVE
POINT TO POINT
MODULE
POINT TO
POINT
OPTICAL LINK
SIGNAL SOURCE
TO/FROM
REMOTE UNITS
FIBER OPTIC
TRANSMITTER
RECEIVER
MODULES
INTERFACE MODULE:
POI MODULE or
TDFE MODULE
INTERFACE MODULES
OPERATING IN THE
SAME BAND
4-WAY
SPLITTER
COMBINER
MASTER
POINT TO POINT
MODULE
REMOTE OPTICAL
SUBRACK 2
TO/FROM
REMOTE UNITS
POINT TO
POINT
OPTICAL LINK
SLAVE
POINT TO POINT
MODULE
FIBER OPTIC
TRANSMITTER
RECEIVER
MODULES
Figure A54 – Example: Optical DAS serving 2 remote optical subracks
Teko DAS Platform Technical Handbook
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TEKO DAS Platform
Components & Solutions
B – Remote Units
Remote Units distribute wireless signals throughout the area to be covered; they can be
installed up to 20km (12.4miles) from the Master Unit site.
Remote Units can be Single band or Multi-band with different power classes.
Pole-mounting Remote Unit mechanical design allows the Unit to be mounted inside utility
poles with 12” internal radius. The Unit can also be mounted outside, fastened to a thinner
pole, due to its IP66 rating.
Pole-mount Remote Unit
Boxed Remote Unit
Low Power Remote Unit Low Power Remote Unit
Multi-band
Single, Dual, Tri-band
Single, Dual, Tri-band
Mechanical design
optimized for Pole
Mounting (inside/outside)
Wall Mounting
(pole mounting kit
available as option)
Wall Mounting (pole
Wall Mounting (pole
mounting kit available mounting kit available
as option)
as option)
4-band,5-band,6-band
Remote Units are equipped with the Fiber Optic Receiver and Transmitter modules (for Optical
to RF and RF to Optical conversion) power amplifiers and filtering.
A single Master Unit can drive up to 144 Remote Units. Various network structures can be
supported by the Master Unit: the Remote Units of the same Optical System can be deployed
with a point-to-point connection (star-configuration - using one fiber optic per Remote Unit) or
with cascading of up to 5 Remote Units using a single fiber and optimized optical couplers.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A70
TEKO DAS Platform
PA900
Antenna
System
Fiber Optic
Receiver
From MASTER unit
(DownLink)
PA1800
PA2100
Management module
LNA900
Fiber Optic
Transmitter
To MASTER unit
(UpLink)
PSU
LNA1800
LNA2100
Figure A55 – Example: Tri-band wideband Remote Unit block diagram
Please Note: each final power amplifier is protected by a fuse.
Fuse 32V-7,5A HPA/MPA
Fuse 32V-20A VHPA/WHPA (40W)
Final amplifiers fuse position and electrical rating
Fuse 32V-7,5A
Low Power Remote Unit final amplifier fuse
position and electrical rating
The management module collects information relevant to the various modules. An RF modem
allows data communication over fiber between Remote Unit and Master Unit.
Teko DAS Platform Technical Handbook
Components & Solutions
The following figure shows the Tri-band wideband Remote Unit block diagram: in down-link
the optical signal from Master Unit is converted into an RF signal by the Fiber Optic Receiver
module. RF signals, filtered by the triplexer, are amplified by Power amplifiers, filtered and
transmitted through an antenna or a passive distribution system.
In up-link the RF signal is filtered by the triplexer. The three RF signals are amplified by
Low-Noise Amplifiers, filtered and then converted into an optical signal by the Fiber Optic
Transmitter module. The signal is transmitted via fiber optics to the Master Unit.
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TEKO DAS Platform
• High/Medium Power boxed Remote Units Composition
POWER
SUPPLY
MODULES
POWER AMPLIFIER
(BAND2)
POWER AMPLIFIER
(BAND3)
SUPERVISION
MODULE
Components & Solutions
FIBER OPTIC
MODULE
CAVITY
6-PLEXER
POWER AMPLIFIER
(BAND1)
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A72
TEKO DAS Platform
Very High Power boxed Remote Unit Composition
FIBER OPTIC
MODULE
POWER AMPLIFIER
(BAND1)
Components & Solutions
POWER SUPPLY
MODULE
POWER AMPLIFIER
(BAND2)
POWER AMPLIFIER
(BAND3)
SUPERVISION
MODULE
CAVITY
6-PLEXER
PLEASE NOTE
The boxed Remote Unit case is equipped with a lock to guarantee protection of the equipment.
The following procedure describes how to open the equipment.
OPENING THE REMOTE UNIT
• Unlock the cables protection using the keys delivered with the equipment
• Remove the cables protection
• Remove the Remote Unit cover, sliding it downwards
• Unscrew the 6 screws on the Remote Unit door
• Open the Remote Unit door.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A73
TEKO DAS Platform
Remote Units can be either AC powered or DC powered.
The following figures show power supply modules protection fuses position and electrical rating.
Components & Solutions
Fuse SMD F10A, 125V
Figure A56 – Low Power Remote Unit: DC/DC Power Supply Module protection fuse position and electrical
rating
F20A, 250V
F20A, 250V
Figure A57 – Boxed Very High Power and pole-mount Remote Units: DC/DC Power Supply Module protection
fuses position and electrical rating
F20A, 250V
F25A, 250V
Figure A58 – Boxed Very High Power and pole-mount Remote Units: AC/DC Power Supply Module protection
fuses position and electrical rating
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A74
TEKO DAS Platform
• Remote Units External Access Points
Boxed Remote Units External Access Points
RF PORT
GROUND
LED
OPTICAL
DL/UL WDM
RF PORT
FAN
ALARM
POWER SUPPLY
INPUT
GROUND
POWER SUPPLY
INPUT
LED
ALARM
Fans
Medium power and Single band High power Remote Units
Connector side view
Dual band/Triband high power Remote Units
Connector side view
Components & Solutions
OPTICAL
DL/UL WDM
OPTICAL
DL/UL WDM
RF PORT
FAN
GROUND
LED
ALARM
POWER SUPPLY
INPUT
Fans
REMOTE UNIT GENERAL OPERATING STATUS
LED description (LED)
Green: regular operation (no alarm)
Blinking Orange: presence of active alarms with
warning severity level
Orange: presence of active alarms with minor
severity level
Blinking Red: presence of active alarms with
major severity level
Red: presence of active alarms with critical
severity level
Very high power Remote Units and high power Remote Units
equipped with amplifiers operating in the LTE2600 band
Connector side view
Label (Connectors)
Description
RF PORT
RF connector - 7/16 (f ) type duplex
OPTICAL DL/UL WDM Optical fiber input/output connector (laser aperture)
GROUND
Equipment grounding
AC voltage input (100-240Vac)
POWER SUPPLY
INPUT
DC voltage input (-72 ÷ -36Vdc)
FAN
Fans power supply and control connector
ALARM
Auxiliary alarms connector (4 in, 4 out)
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A75
TEKO DAS Platform
Pole-mount Remote Units External Access Points
RS232
RF PORT
RS232
RF PORT
ALARM
RF PORT
ALARM
COUPLER
COUPLER
OPTICAL
DL/UL
WDM
OPTICAL
DL/UL WDM
COUPLER
RF PORT
POWER SUPPLY
INPUT
COUPLER
LED
GROUND
Pole mount single band/multi-band
High Power/ Very High power wideband
Remote Units - Connector side view
RF PORT
POWER
SUPPLY
INPUT
COUPLER
RS 232
OPTICAL DL/UL
WDM
GROUND
POWER SUPPLY
INPUT
ALARM
LED
Pole mount multi-band 40W output power
Duplexed Remote Units
Connector side view
Wideband Remote Units:
1 x RF connector - 7/16 (f ) type duplex
40W duplexed Remote Units 4 x RF connectors - 4.3-10 (f ) type
Monitor port(s) for measurements (Mobile Station side)
Factory use only
Optical fiber input/output connector (laser aperture)
Equipment grounding
AC voltage input:
100-240Vac
DC voltage input:
-72 ÷ -36Vdc
Auxiliary alarms connector (4 in, 4 out)
Remote Unit General Operating STATUS LED description
Green: regular operation (no alarm)
Blinking Orange: presence of active alarms with warning severity level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
LED GROUND
Label (Connectors) Description
RF PORT
Components & Solutions
COUPLER
page A76
TEKO DAS Platform
Low Power Remote Units External Access Points (AC Powered)
Components & Solutions
EXT IN
EXT OUT
RS232
MAINS
SWITCH
LED
Optical
dl/UL
RF
PORT
MAINS
SOCKET
AC
MAINS
Single/Dual/Tri-Band Low Power Remote Units External Access Points
EXT IN
AC Mains
SWITCH
Optical
dl/UL
Vac MAINS
CONNECTOR
EXT OUT
LED
RS232
RF
PORT
Six-Band Low Power Remote Unit External Access Points
Label (Connectors)
RF PORT
OPTICAL DL/UL
AC MAINS
EXT OUT
EXT IN
RS 232
LED
Description
RF connector - N (f ) or 4.3-10 (f ) type duplex
Optical fiber input/output SC-APC connector (laser aperture)
AC voltage input (100-240Vac) and switch
External alarms output connector
External alarms input connector
Factory use only
Remote Unit general operating status LED
Green: no alarm
Blinking Orange: presence of active alarms with warning severity
level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A77
TEKO DAS Platform
DC Powered Low Power Remote Unit External Access Points
EXT IN
EXT OUT
Optical
dl/UL
Components & Solutions
RS232
LED
48Vdc
SWITCH
RF
PORT
Vdc INPUT
CONNECTOR
EXT IN
EXT OUT
48Vdc
SWITCH
LED
Vdc INPUT
CONNECTORS
Optical
dl/UL
RS232
RF
PORT
Label (Connectors)
Description
RF PORT
OPTICAL DL/UL
48V
EXT OUT
EXT IN
RS 232
LED
RF connector - N (f ) or 4.3-10 (f ) type duplex
Optical fiber input/output SC-APC connector (laser aperture)
Vdc input connector (48Vdc) and switch
External alarms output connector
External alarms input connector
Factory use only
Remote Unit general operating status LED
Green: no alarm
Blinking Orange: presence of active alarms with warning severity
level
Orange: presence of active alarms with minor severity level
Blinking Red: presence of active alarms with major severity level
Red: presence of active alarms with critical severity level
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A78
TEKO DAS Platform
A single Teko Supervision (TSPV) allows the management of an entire Coverage and Capacity
System:
ÌÌ Rack-mount Light Supervision shelf
A rack mount Light Supervision shelf is available for modular repeaters or small/medium
DAS: it is able to manage up to 4 Active Subracks. Four ports (RS485) are available on
the Supervision front panel to be connected to the RS485 ports of monitored Active
Subracks.
Figure A59 – Rack-mount Light Supervision shelf
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A79
Components & Solutions
A.3.3 Coverage Systems Management and Power Supply
Coverage Systems can be accessed and managed simply connecting a PC, either locally or
remotely, to the IP address of the System Supervision Module.
The Supervision Module Communication Interfaces (Ethernet LAN port / Modem) allow the
System to be managed either by a Local Maintenance Terminal (LMT), connected locally to
the Supervision Module LAN port, or by a Network Element Manager (NEM). The connection
with a Network Element Manager (NEM) can be either a physical (Ethernet LAN) or a modem
connection.
The optional wireless modem (GSM/GPRS or GSM/GPRS/UMTS), integrated inside the
Supervision module, allows the Coverage System remote management. A VPN application
installed on the Supervision Module provides remote and secure access to the System using
the Internet. An embedded SNMP agent software is available to provide a Northbound SNMP
interface, allowing easy integration into upper level Network Management Systems (NMS).
The management of the System is performed via JMA Wireless Teko OMT (Operation and
Maintenance Terminal) web pages: the Supervision Module is equipped with a web-server and
each component of the System is associated to a web page displaying detailed information
about the component.
OMT web pages show the Coverage System operating parameters and alarm status. They
allow the commissioning, monitoring, setting and troubleshooting of the whole Coverage
System. Please refer to JMA Wireless Teko OMT web pages User’s Guide for details.
Teko Operation Management Centre (OMC) proprietary software allows the management
of multiple Teko Coverage and Capacity Systems in a Network. Please refer to Teko OMC
User’s Guide for details.
TEKO DAS Platform
Components & Solutions
ÌÌ Supervision Module
A Supervision module is available for the management of more sophisticated Teko DAS
architectures: the module is able to manage the Active Subrack it is equipped in (Master
Subrack), the power supply subrack, up to other 12 Active Subracks (Monitored Subracks),
and all connected Remote Units.
Figure A60 – Supervision Module with optional wireless modem (left) without wireless modem (right)
Twelve ports (1 to 8 and S1 to S4) are available on the Supervision Module front panel to
be connected to the RS485 ports of monitored Active Subracks.
• Ports numbered from 1 to 8
The ports numbered from 1 to 8 are available for the connection to monitored subracks
mounted within the same rack hosting the Master Subrack.
• Ports numbered from S1 to S4
The other four ports (S1 to S4) are available for the management of remote active
subracks equipped with Point to Point Slave modules.
The Slave Point to Point module installed on the left side of the remote slave subrack
(slots 1 to 6) manages the remote optical subrack, the remote power supply subrack
(if any), and all connected Remote Units. The Coverage System Supervision Module
communicates with the Slave Point to Point built-in Supervision via the single-mode
optical fiber (SMR 9/125), connecting Master and Slave Point to Point modules.
The ports S1 to S4 not connected to remote subracks can be used to manage additional
subracks, mounted within the same rack hosting the Master Subrack.
• Additional RS485 port available on the Master Subrack rear panel
The RS485 connector, available on the rear panel of the SUB-TRX-PSU hosting the
Supervision module, provides an additional port for the management of the power
supply subrack (SUB-PSU-MU or SUB-PSU-MU/48). This port is used only when the
System is equipped with the power supply subrack in addition to other 12 monitored
Active Subracks, connected to the Supervision Module RS485 front ports.
• RS485 port available on the Remote Subrack rear panel
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A80
TEKO DAS Platform
Components & Solutions
The RS485 port, available on the rear panel of a Remote Point to Point Slave Subrack, is
used only when a SUB-PSU-MU or SUB-PSU-MU/48 is installed to provide power supply
to the remote subracks.
Address assignment
Each monitored Subrack takes its address from the Supervision Module port it is
connected to (please refer to Paragraph B.4.2 RS485 Connections for details).
The Active Subrack equipped with the Supervision Module (Master Subrack) takes address
= 0 (zero).
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A81
TEKO DAS Platform
Power Supply
Coverage Systems can be AC or DC powered. Power supply modules can be equipped in
monitored Active Subracks or in the Master Subrack or in dedicated Active Subracks.
Example of Power Supply Modules equipped
in the Master Optical Subrack (the second
Power Supply Module, optional, provides
power supply redundancy for higher
reliability).
Fiber Optic
Modules
Supervision
Module
Power Supply
Modules
Example of Power Supply Modules equipped
in a monitored Active Subrack. The RJ45
connector available on the Power Supply
Module front panel can be used for connection
to the Supervision Module, equipped in the
Master Active Subrack.
Fiber Optic
Modules
Example of Power Supply Modules equipped
in a dedicated Active Subrack.
Space efficient AC-to-DC and DC-to-DC Power Supply subracks are available to provide up to
2.4kW (AC/DC) / 3kW (DC/DC) maximum output power in just one height unit space.
A Power Supply distribution system is also available for the remote powering of Teko 48VDC
Low Power Remote Units.
Please refer to Paragraph A.2.7 for details.
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A82
Components & Solutions
Power Supply
Modules
TEKO DAS Platform
A.3.4 Coverage Systems Technical Specifications
Coverage and Capacity Systems mechanical, environmental and power supply specifications
are available in the following tables. Please refer to Teko datasheets for detailed specifications.
Contact Teko Sales Office for further information.
Remote Unit model Dimensions (HxWxD)
max volume
Weight
Operating
IP rating
temperature range
Power
supply
13kg
(28.7lbs)
-20°C up to +55°C
(-4°F up to +131°F)
AC version:
85÷264Vac
(50-60Hz)
Nominal
range:
100÷240Vac
LOW POWER
Single
Dual
Tri
band
N (f)
≈ 355.5 x350x102mm
connector (14.00 x13.78x4.02 in) (*)
4.3-10 (f ) ≈ 363 x350x102mm
connector (14.29 x13.78x4.02 in) (*)
5-US band N (f)
≈ 414 x 414 x 145.6mm
6-US band connector (16.30 x 16.30 x 5.73in) (*)
19kg
(41.9lbs)
IP32 (box)
IP66 (with
optional
protection
kit)
DC version:
-72 ÷ -36Vdc
4.3-10 (f ) ≈ 421.4 x 414 x 145.6mm
connector (16.60 x 16.30 x 5.73in) (*)
4-US band N (f)
4-EU band connector
5-EU band 4.3-10 (f )
connector
≈ 398.2x 414 x 145.6mm
(15.70 x 16.30 x 5.73in) (*)
19kg
(41.9lbs)
≈ 405.6 x 414 x 145.6mm
(15.97 x 16.30 x 5.73in) (*)
(*) heat sinks and connectors included
BOXED MEDIUM POWER
Single band
Dual band
≈ 570 x 408.5 x 263 mm
(22.44 x 16.08 x 10.35 in)
heat sinks, handles and
connectors included
Triband
26kg
(57.32 lbs)
-20°C up to +55°C
(-4°F up to +131°F)
IP66
28kg
(61.73lbs)
30kg
(66.1lbs)
AC version:
85÷264Vac
(50-60Hz)
Nominal
range:
100÷240Vac
DC version:
-72 ÷ -36Vdc
BOXED HIGH POWER
Single band
Dual band
≈ 570 x 408.5 x 263 mm
(22.44 x 16.08 x 10.35 in)
heat sinks, handles and
connectors included
Triband
28kg
(61.73lbs)
-20°C up to +55°C
(-4°F up to +131°F)
IP66
31kg
(68.34lbs)
32kg
(70.55lbs)
AC version:
85÷264Vac
(50-60Hz)
Nominal
range:
100÷240Vac
DC version:
-72 ÷ -36Vdc
BOXED VERY HIGH POWER
Single band
Dual band
≈ 620 x 408.5 x 263 mm
(24.41 x 16.08 x 10.35 in)
heat sinks, handles and
connectors included
Triband
Teko DAS Platform Technical Handbook
Components & Solutions
• Remote Units
36kg
(79.37lbs)
37kg
(81.57lbs)
38kg
(83.78lbs)
-20°C up to +55°C
(-4°F up to +131°F)
IP66
AC version:
85÷264Vac
(50-60Hz)
Nominal
range:
100÷240Vac
DC version:
-72 ÷ -36Vdc
Doc ID Number 91 080 0783 rev. 01
page A83
TEKO DAS Platform
• Pole-mount Remote Units
Remote Unit
model
Up to 4-EU band
Up to 5-US band
Weight
Operating
IP rating
temperature range
Power
supply
≈ 1060 x 185 x 273mm
(41.73 x 7.28 x 10.75in)
≈ 40kg
(88.18lbs)
-20°C up to +55°C
(-4°F up to +131°F)
AC version:
90÷264Vac
(50-60Hz)
Nominal
range:
100÷240Vac
IP66
DC version:
-72 ÷ -36Vdc
• System Subracks
Subrack Commercial Code and Description
Dimensions
Operating Temperature Range
SUB-TRX-PSU
Standard Active Subrack
19” - 3U
depth 270mm (10.63in)
-5°C up to +55°C (+23°F up to +131°F)
with proper forced-air cooling
SUB-HPOI
Standard Passive Subrack
19” - 3U
depth 270mm (10.63in)
-5°C up to +55°C
(+23°F to +131°F)
SUB-TRX-PSU-D
19” - 3U
Deep Active Subrack, required to host fully depth 360mm (14.17in)
equipped Digital Donor Front End modules
-5°C up to +55°C
(+23°F to +131°F)
TSFE
Service Front End Subrack
19” - 2U
depth 360mm (14.17 in)
-5°C up to +55°C
(+23°F to +131°F)
TFAN-19-1U-4F-28V
Forced-Air Cooling Subrack
19” - 1U
depth 270mm (10.63in)
-5°C up to +55°C
(+23°F to +131°F)
Dimensions
Operating Temperature
Range
Output Power
3U - 7TE
-5°C up to +55°C (+23°F 100W each, up to 2 in parallel
to +131°F) with proper 90W each, 3-4 in parallel
forced-air cooling
80W each, more than 4 in
parallel
• Power Supply Components
Commercial Code and
Description
TPSU/AC
AC/DC Power Supply
Module
TPSU/48
DC/DC Power Supply
Module
SUB-PSU-MU
AC/DC Power Supply
Subrack
(equipped with 1 to 3
TPSU/AC-30-1K, AC/DC
Power Supply module)
19” - 1U, depth
0°C up to +70°C (+32°F
900W, each AC/DC Power
to
+158°F)
(handles included)
Supply module
50 to 60°C, derate 2% /°C;
376mm (14.8in)
60 to 70°C, derate 2.5% /°C
2430W, max configuration (3x
TPSU/AC-30-1K)
SUB-PSU-MU/48
DC/DC Power Supply
Subrack
(equipped with 1 to 3
TPSU/48-30-1K, DC/DC
Power Supply module)
19” - 1U, depth
-5°C up to +55°C (+23°F 1kW
(handles included) to +131°F)
each DC/DC Power Supply
376mm (14.8in)
module
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
Components & Solutions
Dimensions
(HxWxD)
page A84
TEKO DAS Platform
Commercial Code and
Description
Dimensions
Operating Temperature
Range
Output Power
SUB-RPSU2-MU/AC
SUB-RPSU-MU/AC
Power Supply
distribution system for
remote units
(equipped with 1 to 4
TRPSU/AC-58-1.2k
AC/DC Power Supply
module )
19” - 2U, depth
421.5mm (16.59in)
(handles and
connectors included)
-5°C up to +55°C (+23°F 1.2kW @110-120Vac
to +131°F) with proper 1.9kW @200-270Vac
forced-air cooling
each AC/DC Power Supply
module
SUB-RPSU2-MU/48 and
SUB-RPSU-MU/48
Power Supply
distribution system for
remote units
(equipped with 1 to 4
TRPSU/48-58-2k
DC/DC Power Supply
Module)
19” - 2U, depth
421.5mm (16.59in)
(handles and
connectors included)
-5°C up to +55°C (+23°F 1.9kW
to +131°F) with proper each DC/DC Power Supply
module
forced-air cooling
Components & Solutions
Teko DAS Platform Technical Handbook
Doc ID Number 91 080 0783 rev. 01
page A85

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