Telit Communications S p A GE863S Quad-Band GSM/GPRS module User Manual GE863 GPS Harware User Guide

Telit Communications S.p.A. Quad-Band GSM/GPRS module GE863 GPS Harware User Guide

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GE863 Family Hardware User Guide

1vv0300783 Rev.0 - 10/06/08

GE863 Hardware User Guide

1vv0300783 Rev.0 - 10/06/08

This document is relating to the following products:

GE863-GPS 3990250660

GE863-GPS 3990250690

GE863-QUAD 3990250662

GE863-PY 3990250661

GE863-SIM 3990250700

NOTE: This document substitutes the following specifications:

• 1vv0300715 GE863-QUAD/PY Hardware User Guide

• 1vv0300714 GE863-GPS Hardware User Guide

GE863 Hardware User Guide

1vv0300783 Rev.0 - 10/06/08

Contents

1Overview............................................................................................................................................ 7

2GE863 Mechanical Dimensions....................................................................................................... 8

3GE863 module connections.............................................................................................................. 9

3.1PIN-OUT .................................................................................................................................................9

3.2PINS LAYOUT.....................................................................................................................................12

4Hardware Commands..................................................................................................................... 13

4.1Turning ON the GE863........................................................................................................................13

4.2Turning OFF the GE863......................................................................................................................15

4.2.1Hardware shutdown ...........................................................................................................................................15

4.2.2Hardware Unconditional Shutdown (for GE863-GPS only)..............................................................................15

4.2.3Hardware Unconditional Reboot (GE863-QUAD/PY/SIM only) .....................................................................17

4.3Power Supply ........................................................................................................................................19

4.4Power Supply Requirements ...............................................................................................................19

4.5General Design Rules ...........................................................................................................................21

4.5.1Electrical Design Guidelines..............................................................................................................................21

4.5.1.1+ 5V input Source Power Supply Design Guidelines ...............................................................................21

4.5.1.2+ 12V Input Source Power Supply Design Guidelines .............................................................................22

4.5.1.3Battery Source Power Supply Design Guidelines.....................................................................................24

4.5.1.4Battery Charge control Circuitry Design Guidelines ................................................................................25

4.5.2Thermal Design Guidelines ...............................................................................................................................27

4.5.3Power Supply PCB layout Guidelines ...............................................................................................................28

5Antenna ........................................................................................................................................... 29

5.1GSM Antenna Requirements ..............................................................................................................29

5.2GSM Antenna - PCB line Guidelines..................................................................................................30

5.3GSM Antenna - Installation Guidelines .............................................................................................31

5.4GPS Antenna Requirements................................................................................................................31

5.4.1Combined GPS Antenna....................................................................................................................................31

5.4.2Linear and Patch GPS Antenna..........................................................................................................................31

5.4.3LNA and Front End Design Considerations ......................................................................................................32

5.5GPS Antenna - PCB Line Guidelines .................................................................................................33

5.6GPS Antenna - Installation Guidelines...............................................................................................33

5.7Logic level specifications ......................................................................................................................34

5.7.1Reset signal........................................................................................................................................................35

6Serial Ports...................................................................................................................................... 36

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6.1GE863-GPS SERIAL PORTS .............................................................................................................36

6.2GE863-QUAD/PY/SIM SERIAL PORTS ..........................................................................................36

6.3MODEM SERIAL PORT ....................................................................................................................37

6.4GE863-GPS secondary ports ...............................................................................................................39

6.4.1MODEM SERIAL PORT 2 (GPS CONTROL) ................................................................................................39

6.4.2GPS SERIAL PORT A (SIRF BINARY)..........................................................................................................39

6.4.3GPS SERIAL PORT B (NMEA).......................................................................................................................40

6.5GE863-QUAD/PY/SIM secondary port..............................................................................................40

6.5.1MODEM SERIAL PORT 2 (Python Debug).....................................................................................................40

6.6RS232 Level Translation......................................................................................................................41

6.75V UART level translation...................................................................................................................44

7Audio Section Overview.................................................................................................................. 46

7.1INPUT LINES (Microphone) ..............................................................................................................48

7.1.1Short description................................................................................................................................................48

7.1.2Input Lines Characteristics ................................................................................................................................49

7.2OUTPUT LINES (Speaker).................................................................................................................50

7.2.1Short description................................................................................................................................................50

7.2.2Output Lines Characteristics..............................................................................................................................51

8General Purpose I/O....................................................................................................................... 52

8.1GPIO Logic levels .................................................................................................................................54

8.2Using a GPIO Pad as INPUT...............................................................................................................55

8.3Using a GPIO Pad as OUTPUT ..........................................................................................................55

8.4Using the RF Transmission Control GPIO4 ......................................................................................55

8.5Using the RFTXMON Output GPIO5................................................................................................55

8.6Using the Alarm Output GPIO6 .........................................................................................................56

8.7Using the Buzzer Output GPIO7 ........................................................................................................57

8.8Magnetic Buzzer Concepts ..................................................................................................................58

8.8.1Short Description ...............................................................................................................................................58

8.8.2Frequency Behaviour.........................................................................................................................................59

8.8.3Power Supply Influence.....................................................................................................................................59

8.8.4Warning .............................................................................................................................................................59

8.8.5Working Current Influence................................................................................................................................59

8.9Using the Temperature Monitor Function.........................................................................................60

8.9.1Short Description ...............................................................................................................................................60

8.9.2Allowed GPIO ...................................................................................................................................................60

8.10Indication of network service availability ..........................................................................................61

9RTC and Ausiliary supply .............................................................................................................. 62

9.1RTC Bypass out ....................................................................................................................................62

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9.2VAUX1 power output...........................................................................................................................62

10PPS GPS Output (GE863-GPS only)............................................................................................. 63

10.1Description ............................................................................................................................................63

10.2Pulse Characteristics ............................................................................................................................63

11DAC and ADC section .................................................................................................................... 64

11.1DAC Converter.....................................................................................................................................64

11.1.1Description ....................................................................................................................................................64

11.1.2Enabling DAC ...............................................................................................................................................65

11.1.3Low Pass Filter Example...............................................................................................................................65

11.2ADC Converter.....................................................................................................................................66

11.2.1Description ....................................................................................................................................................66

11.2.2Using ADC Converter ...................................................................................................................................66

12Mounting the GE863 on the Application Board ........................................................................... 67

12.1General ..................................................................................................................................................67

12.1.1Module Finishing & Dimensions ..................................................................................................................67

12.1.2Recommended foot print for the application .................................................................................................68

12.1.1Suggested Inhibit Area ..................................................................................................................................69

12.1.2Debug of the GE863 in Production ...............................................................................................................70

12.1.3Stencil............................................................................................................................................................70

12.1.4PCB pad Design ............................................................................................................................................71

12.1.5Solder paste ...................................................................................................................................................73

12.1.6GE863 Solder Reflow....................................................................................................................................73

12.1.7Packing System .............................................................................................................................................75

12.1.8Moisture Sensibility.......................................................................................................................................77

13Conformity Assessment Issues ....................................................................................................... 78

14SAFETY RECOMMANDATIONS ................................................................................................ 79

15Document Change Log................................................................................................................... 80

GE863 Hardware User Guide

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DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications

S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other

than the officers, employees, agents or subcontractors of the owner or licensee of this document,

without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the

foregoing, Telit does not make any warranty as to the information contained herein, and does not

accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the

information.

Telit disclaims any and all responsibility for the application of the devices characterized in this

document, and notes that the application of the device must comply with the safety standards of the

applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to

typographical errors, inaccurate information, or improvements to programs and/or equipment at any

time and without notice. Such changes will, nevertheless be incorporated into new editions of this

document.

GE863 Hardware User Guide

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1 Overview

The aim of this document is the description of some hardware solutions useful for developing a product with the

Telit GE863-GPS / QUAD / PY / SIM modules.

In this document all the basic functions of a mobile phone will be taken into account; for each one of them a

proper hardware solution will be suggested and eventually the wrong solutions and common errors to be

avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products

that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the

suggested hardware configurations shall not be considered mandatory, instead the information given shall be

used as a guide and a starting point for properly developing your product with the Telit GE863-GPS / QUAD / PY /

SIM modules. For further hardware details that may not be explained in this document refer to the Telit GE863

Product Description document where all the hardware information is reported.

NOTICE

(EN) The integration of the GSM/GPRS GE863-GPS/QUAD/PY/SIM cellular module within user application

shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare GSM/GPRS GE863-GPS/QUAD/PY/SIM all’interno

dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die integration des GE863-GPS/QUAD/PY/SIM GSM/GPRS Mobilfunk-Moduls in ein Gerät muß

gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen

(SL) Integracija GSM/GPRS GE863-GPS/QUAD/PY/SIM modula v uporabniški aplikaciji bo morala

upoštevati projektna navodila, opisana v tem piročniku.

(SP) La utilización del modulo GSM/GPRS GE863-GPS/QUAD/PY/SIM debe ser conforme a los usos para

los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS GE863-GPS/QUAD/PY/SIM dans l’application de

l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

The information presented in this document is believed to be accurate and reliable. However, no responsibility is

assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent rights of

Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to

change without notice.

GE863-GPS/QUAD/PY/SIM

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2 GE863 Mechanical Dimensions

The Telit GE863 modules overall dimension are:

• Length: 41,4 mm

• Width: 31,4 mm

• Thickness: 3,6 mm

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3 GE863 module connections

3.1 PIN-OUT

BGA

Ball Signal I/O Function Internal

Pull up Type

1 GPIO13 I/O GPIO13 CMOS 2.8V

2 GPIO12 I/O GPIO12 47K

CMOS 2.8V

3 GPIO11 I/O GPIO11 4.7K

CMOS 2.8V

4 GPIO10 I/O GPIO10 CMOS 2.8V

5 GPIO9 I/O GPIO9 CMOS 2.8V

6 GPIO8 I/O GPIO8 CMOS 2.8V

7 RESERVED - RESERVED -

8 GND - Ground Power

9 EAR_MT- AO Handset earphone signal output, phase - Audio

10 EAR_MT+ AO Handset earphone signal output, phase + Audio

11 EAR_HF+ AO Handsfree ear output, phase + Audio

12 EAR_HF- AO Handsfree ear output, phase - Audio

13 MIC_MT+ AI Handset microphone signal input; phase+ Audio

14 MIC_MT- AI Handset microphone signal input; phase- Audio

15 MIC_HF+ AI Handsfree microphone input; phase + Audio

16 MIC_HF- AI Handsfree microphone input; phase - Audio

17 GND - Ground Power

18 SIMCLK O External SIM signal – Clock 1.8/3V ONLY

19 SIMRST O External SIM signal – Reset 1.8/3V ONLY

20 SIMIO I/O External SIM signal - Data I/O 1.8/3V ONLY

21 SIMIN I/O External SIM signal - Presence (active low) 47K

CMOS 2.8V

22 SIMVCC - External SIM signal – Power 1.8/3V ONLY

23 ADC_IN1 AI Analog /Digital converter input A/D

24 VRTC AO VRTC Backup capacitor Power

25 TX_TRACE TX data for GPS control (TX data for Debug in case of

GE863-QUAD/PY/SIM)

CMOS 2.8V

26 RX_TRACE RX data for GPS control (RX data for Debug in case of

GE863-QUAD/PY/SIM)

CMOS 2.8V

27 VBATT - Main power supply Power

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BGA

Ball Signal I/O Function Internal

Pull up Type

28 GND - Ground Power

29 STAT_LED O Status indicator led CMOS 1.8V

30 AXE I Handsfree switching 100K

CMOS 2.8V

31 VAUX1 - Power output for external accessories -

32 GPIO4 I/O GPIO4 Configurable general purpose I/O pin / 4.7K

CMOS 2.8V

33 GPIO2 / JDR I/O GPIO2 Configurable general purpose I/O pin / Jammer

Detect Output

CMOS 2.8V

34 GPIO1 I/O GPIO1 Configurable general purpose I/O pin CMOS 2.8V

35 CHARGE AI Charger input Power

36 GND - Ground Power

37 C103/TXD I Serial data input (TXD) from DTE CMOS 2.8V

38 C104/RXD O Serial data output to DTE CMOS 2.8V

39 C108/DTR I Input for Data terminal ready signal (DTR) from DTE CMOS 2.8V

40 C105/RTS I Input for Request to send signal (RTS) from DTE CMOS 2.8V

41 C106/CTS O Output for Clear to send signal (CTS) to DTE CMOS 2.8V

42 C109/DCD O Output for Data carrier detect signal (DCD) to DTE CMOS 2.8V

43 C107/DSR O Output for Data set ready signal (DSR) to DTE CMOS 2.8V

44 C125/RING O Output for Ring indicator signal (RI) to DTE CMOS 2.8V

45 GND - Ground Power

46 ON_OFF* I Input command for switching power ON or OFF (toggle

command).

47K

Pull up to VBATT

47 RESET* I Reset input

48 GND - Ground Power

49 ANTENNA O GSM Antenna output - 50 ohm RF

50 GND - Ground Power

51 GPIO7 /

BUZZER

I/O GPIO7 / BUZZER output CMOS 2.8V

52 PWRMON O Power ON Monitor CMOS 2.8V

53 GPIO5

RFTXMON

I/O GPIO5 / RF TX_ON signalling output CMOS 2.8V

54 GPIO6

ALARM

I/O GPIO6 / ALARM output CMOS 2.8V

55 GPIO3 I/O GPIO3 47K

CMOS 2.8V

56 GND - Ground Power

57 RESERVED - RESERVED -

58 CLK I/O Python Debug (CLK) (1) CMOS 2.8V

59 GPIO17 I/O GPIO CMOS 2.8V

60 GPIO14 I/O GPIO -

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BGA

Ball Signal I/O Function Internal

Pull up Type

61 MRST I/O Python Debug (MRST) (1) -

62 RESERVED - RESERVED -

63 DAC_OUT O DAC out

64 GPIO16 I/O GPIO CMOS 2.8V

65 RESERVED - RESERVED -

66 MTSR I/O Python Debug (MTSR) (1) -

67 GND - Ground Power

68 TX_GPS - GPS serial Port (TX) (1) -

69 GND - Ground Power

70 RESERVED - RESERVED -

71 GPIO15 I/O GPIO -

72 GND - Ground Power

73 RX_GPS - GPS serial Port (RX) (1) -

74 RESERVED - RESERVED -

75 PPS O 1 Pulse per Second signal (1) 100kOhm pull

down

CMOS 2.8V

76 GPIO18 I/O GPIO -

77 GND - Ground Power

78 RX_GPS_BIN - GPS serial Port (RX) – SIRF BINARY (1) CMOS 2.8V

79 GND - Ground Power

80 TX_GPS_BIN - GPS serial Port (TX) – SIRF BINARY (1) CMOS 2.8V

81 RESERVED - RESERVED -

82 GND - Ground Power

83 GPS_ANT - GPS ANTENNA (1)

84 GND_GPS - GPS_ANTENNA GND (1) Power

NOTES:

(1) Available only on GE863-GPS (in case of GE863-QUAD/PY/SIM it has to be considered

RESERVED)

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3.2 PINS LAYOUT

TOP VIEW

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4 Hardware Commands

4.1 Turning ON the GE863

To turn on the GE863 the pad ON# must be tied low for at least 1 second and then released.

The maximum current that can be drained from the ON# pad is 0,1 mA.

A simple circuit to do it is:

NOTE: don't use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to

latch up problems on the GE863 power regulator and improper power on/off of the module. The line ON# must be

connected only in open collector configuration.

NOTE: In this document all the lines that are inverted, hence have active low signals are labelled with a name that

ends with a "#" or with a bar over the name.

NOTE: The GE863 turns fully on also by supplying power to the Charge pad (Module provided with a battery on the

VBATT pads).

TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line

raised up the device could be considered powered on.

PWRMON line rises up also when supplying power to the Charge pad

ON#

Power ON impulse

GND

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For example:

1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V microcontroller

(uP_OUT1):

2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:

10k

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4.2 Turning OFF the GE863

The turning off of the device can be done in three ways:

• by software command (see GE863 Software User Guide)

• by hardware shutdown

• by Hardware Unconditional Shutdown

When the device is shut down by software command or by hardware shutdown, it issues to the

network a detach request that informs the network that the device will not be reachable any more.

4.2.1 Hardware shutdown

To turn OFF the GE863 the pad ON# must be tied low for at least 2 seconds and then released.

The same circuitry and timing for the power on shall be used.

The device shuts down after the release of the ON# pad.

TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When PWRMON goes

low, the device has powered off.

4.2.2 Hardware Unconditional Shutdown (for GE863-GPS only)

To unconditionally Shutdown the GE863-GPS, the pad RESET# must be tied low for at least 200

milliseconds and then released.

The maximum current that can be drained from the ON# pad is 0,15 mA.

A simple circuit to do it is:

RESET#

Unconditional Shutdown

impulse

GND

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NOTE: don't use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor

may bring to latch up problems on the GE863-GPS power regulator and improper functioning of the module. The

line RESET* must be connected only in open collector configuration.

TIP: The unconditional hardware shutdown should be always implemented on the boards and software should use

it as an emergency exit procedure.

For example:

1- Let's assume you need to drive the RESET# pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT2):

10k

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4.2.3 Hardware Unconditional Reboot (GE863-QUAD/PY/SIM

only)

To unconditionally Reboot the GE863-QUAD/PY/SIM, the pad RESET# must be tied low for at least

200 milliseconds and then released.

The maximum current that can be drained from the ON# pad is 0,15 mA.

A simple circuit to do it is:

NOTE: don't use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up

resistor may bring to latch up problems on the GE863-QUAD/PY/SIM power regulator and improper

functioning of the module. The line RESET* must be connected only in open collector configuration.

TIP: The unconditional hardware reboot should be always implemented on the boards and software

should use it as an emergency exit procedure.

RESET#

Unconditional Reboot

impulse

GND

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For example:

1- Let's assume you need to drive the RESET# pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT2):

10k

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4.3 Power Supply

The power supply circuitry and board layout are a very important part in the full product design and

they strongly reflect on the product overall performances, hence read carefully the requirements and

the guidelines that will follow for a proper design.

4.4 Power Supply Requirements

POWER SUPPLY

Nominal Supply Voltage 3.8 V

Max Supply Voltage 4.2 V

Supply voltage range 3.4 V - 4.2 V

GE863-GPS

Mode Average [mA] Mode description

IDLE mode with GPS OFF Stand by mode; no call in progress; GPS OFF

AT+CFUN=1 24,0 Normal mode: full functionality of the module

AT+CFUN=4 22,0 Disabled TX and RX; module is not registered on the network

AT+CFUN=0 or

AT+CFUN=5 7,3 / 3,41

Power saving: CFUN=0 module registered on the network and

can receive voice call or an SMS; but it is not possible to send

AT commands; module wakes up with an unsolicited code (call

or SMS) or rising RTS line. CFUN=5 full functionality with power

saving; module registered on the network can receive incoming

calls and SMS

IDLE mode with GPS ON2 full power mode

AT+CFUN=1 113,0

AT+CFUN=4 111,0

Stand by mode; no call in progress; GPS ON

IDLE mode with GPS ON trickle power mode

AT+CFUN=1 64,0

AT+CFUN=4 62,0

Stand by mode; no call in progress; GPS consumption reduced

maintaining the NMEA sentences

IDLE mode with GPS ON push to fix mode

AT+CFUN=1 24,0

AT+CFUN=4 22,0

AT+CFUN=5 10,0

Stand by mode; no call in progress; GPS performs a fix and then

it switches off for the defined period

RX mode

1 slot in downlink 53,0

2 slot in downlink 65,0

3 slot in downlink 78,0

4 slot in downlink 91,0

GSM Receiving data mode

GSM TX and RX mode GPS ON

Min power level 135,0

Max power level 254,0

GSM Sending data mode

GPRS (class 10) TX and RX mode GPS ON

Min power level 187,0

Max power level 430,0

GPRS Sending data mode

1 Worst/best case depends on network configuration and is not under module control

2 The values reported are with GPS antenna current consumption (22mA) included

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In case of GE863-GPS with p/n 3990250690 the GPS consumptions are reduced by a 30%:

GE863-GPS (3 990 250 660) GE863-GPS (3 990 250 690)

Operating current

70 mA ±20%, including 50 mA for the

GPS hardware and 20 mA for the

antenna LNA

55mA, including 35mA GPS for the

GPS hardware and 20 mA for the

antenna LNA

GE863-QUAD/PY/SIM

Mode Average (mA) Mode description

IDLE mode Stand by mode; no call in progress

AT+CFUN=1 24,0 Normal mode: full functionality of the module

AT+CFUN=4 22,0 Disabled TX and RX; module is not registered on the network

AT+CFUN=0 or

AT+CFUN=5 7,20 / 3,563

Power saving: CFUN=0 module registered on the network and can

receive voice call or an SMS; but it is not possible to send AT

commands; module wakes up with an unsolicited code (call or

SMS) or rising RTS line. CFUN=5 full functionality with power

saving; module registered on the network can receive incoming

calls and SMS

RX mode

1 slot in downlink 53,0

2 slot in downlink 66,0

3 slot in downlink 79,0

4 slot in downlink 89,0

GSM Receiving data mode

GSM TX and RX mode

Min power level 78,0

Max power level 200,0

GSM Sending data mode

GPRS (class 10) TX and RX mode

Min power level 124,0

Max power level 371,0

GPRS Sending data mode

The GSM system is made in a way that the RF transmission is not continuous, else it is packed into

bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about

2A. Therefore the power supply has to be designed in order to withstand with these current peaks

without big voltage drops; this means that both the electrical design and the board layout must be

designed for this current flow.

If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the

supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the

voltage drop during the peak current absorption is too much, then the device may even shutdown as a

consequence of the supply voltage drop.

TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output

of at least 2 A.

1 Worst/best case depends on network configuration and is not under module control

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4.5 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout.

4.5.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is

drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

4.5.1.1 + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between the

input source and the desired output and a linear regulator can be used. A switching power supply

will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the

power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks close to the GE863, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated

at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863 from

power polarity inversion.

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An example of linear regulator with 5V input is:

4.5.1.2 + 12V Input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the input

source and the desired output, a linear regulator is not suited and shall not be used. A switching

power supply will be preferable because of its better efficiency especially with the 2A peak current

load represented by the GE863.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable

because of its smaller inductor size and its faster transient response. This allows the regulator to

respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to be

developed due to the fact the switching frequency could also generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when

choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at

least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in order

to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the GE863 from

power polarity inversion. This can be the same diode as for spike protection.

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An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):

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4.5.1.3 Battery Source Power Supply Design Guidelines

• The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is

4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit

GE863 module.

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED

DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the

GE863-GPS and damage it.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE863. Their use can lead to

overvoltage on the GE863 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863 from

power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity

inversions when connecting the battery.

• The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the

suggested capacity is from 500mAh to 1000mAh.

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4.5.1.4 Battery Charge control Circuitry Design Guidelines

The charging process for Li-Ion Batteries can be divided into 4 phases:

• Qualification and trickle charging

• Fast charge 1 - constant current

• Final charge - constant voltage or pulsed charging

• Maintenance charge

The qualification process consists in a battery voltage measure, indicating roughly its charge status. If

the battery is deeply discharged, that means its voltage is lower than the trickle charging threshold,

then the charge must start slowly possibly with a current limited pre-charging process where the

current is kept very low with respect to the fast charge value: the trickle charging.

During the trickle charging the voltage across the battery terminals rises; when it reaches the fast

charge threshold level the charging process goes into fast charge phase.

During the fast charge phase the process proceeds with a current limited charging; this current limit

depends on the required time for the complete charge and from the battery pack capacity. During this

phase the voltage across the battery terminals still raises but at a lower rate.

Once the battery voltage reaches its maximum voltage then the process goes into its third state: Final

charging. The voltage measure to change the process status into final charge is very important. It

must be ensured that the maximum battery voltage is never exceeded, otherwise the battery may be

damaged and even explode. Moreover for the constant voltage final chargers, the constant voltage

phase (final charge) must not start before the battery voltage has reached its maximum value,

otherwise the battery capacity will be highly reduced.

The final charge can be of two different types: constant voltage or pulsed. GE863 uses constant

voltage.

The constant voltage charge proceeds with a fixed voltage regulator (very accurately set to the

maximum battery voltage) and hence the current will decrease while the battery is becoming charged.

When the charging current falls below a certain fraction of the fast charge current value, then the

battery is considered fully charged, the final charge stops and eventually starts the maintenance.

The pulsed charge process has no voltage regulation, instead the charge continues with pulses.

Usually the pulse charge works in the following manner: the charge is stopped for some time, let's say

few hundreds of ms, then the battery voltage will be measured and when it drops below its maximum

value a fixed time length charging pulse is issued. As the battery approaches its full charge the off

time will become longer, hence the duty-cycle of the pulses will decrease. The battery is considered

fully charged when the pulse duty-cycle is less than a threshold value, typically 10%, the pulse charge

stops and eventually the maintenance starts.

The last phase is not properly a charging phase, since the battery at this point is fully charged and the

process may stop after the final charge. The maintenance charge provides an additional charging

process to compensate for the charge leak typical of a Li-Ion battery. It is done by issuing pulses with

a fixed time length, again few hundreds of ms, and a duty-cycle around 5% or less.

This last phase is not implemented in the GE863 internal charging algorithm, so that the battery once

charged is left discharging down to a certain threshold so that it is cycled from full charge to slight

discharge even if the battery charger is always inserted. This guarantees that anyway the remaining

charge in the battery is a good percentage and that the battery is not damaged by keeping it always

fully charged (Li-Ion rechargeable batteries usually deteriorate when kept fully charged).

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Last but not least, in some applications it is highly desired that the charging process restarts when the

battery is discharged and its voltage drops below a certain threshold, GE863 internal charger does it.

As you can see, the charging process is not a trivial task to be done; moreover all these operations

should start only if battery temperature is inside a charging range, usually 5°C - 45°C.

The GE863-GPS measures the temperature of its internal component, in order to satisfy this last

requirement, it's not exactly the same as the battery temperature but in common application the two

temperature should not differ too much and the charging temperature range should be guaranteed.

NOTE: For all the threshold voltages, inside the GE863 all threshold are fixed in order to maximize Li-Ion battery

performances and do not need to be changed.

NOTE: In this application the battery charger input current must be limited to less than 400mA. This can be done by

using a current limited wall adapter as the power source.

NOTE: When starting the charger from Module powered off the startup will be in CFUN4; to activate the

normal mode a command AT+CFUN=1 has to be provided. This is also possible using the POWER ON.

There is also the possibility to activate the normal mode using the ON_OFF* signal.

In this case, when HW powering off the module with the same line (ON_OFF*) and having the charger still

connected, the module will go back to CFUN4.

NOTE: It is important having a 100uF Capacitor to VBAT in order to avoid instability of the charger circuit

if the battery is accidentally disconnected during the charging activity.

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4.5.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

• Average current consumption during transmission @PWR level max: 500mA

• Average current consumption during transmission @ PWR level min: 100mA

• Average current during Power Saving(AT+CFUN=5): 4mA

• Average current during idle (Power Saving disabled) 24mA

For GE863-GPS only:

• Average GPS section consumption during Power Saving: 1mA

• Average GPS section consumption during Tracking (Power Saving disabled) 60mA

NOTE: The average consumption during transmissions depends on the power level at which the device is requested

to transmit by the network. The average current consumption hence varies significantly.

TIP: The thermal design for the Power supply should be made keeping an average consumption at the max

transmitting level during calls of 500mA rms plus 60mA rms for GPS in tracking mode.

Considering the very low current during idle, especially if Power Saving function is enabled, it is

possible to consider from the thermal point of view that the device absorbs current significantly only

during calls.

If we assume that the device stays into transmission for short periods of time (let's say few minutes)

and then remains for a quite long time in idle (let's say one hour), then the power supply has always

the time to cool down between the calls and the heat sink could be smaller than the calculated one for

500mA maximum RMS current, or even could be the simple chip package (no heat sink).

Moreover in the average network conditions the device is requested to transmit at a lower power level

than the maximum and hence the current consumption will be less than the 500mA, being usually

around 150mA.

For these reasons the thermal design is rarely a concern and the simple ground plane where the

power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating.

For the heat generated by the GE863, you can consider it to be during transmission 1W max during

CSD/VOICE calls and 2W max during class10 GPRS upload.

This generated heat will be mostly conducted to the ground plane under the GE863; you must ensure

that your application can dissipate it.

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4.5.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the

output to cut the current peaks and a protection diode on the input to protect the supply from spikes

and polarity inversion. The placement of these components is crucial for the correct working of the

circuitry. A misplaced component can be useless or can even decrease the power supply

performances.

• The Bypass low ESR capacitor must be placed close to the Telit GE863 power input pads or in the

case the power supply is a switching type it can be placed close to the inductor to cut the ripple

provided the PCB trace from the capacitor to the GE863 is wide enough to ensure a dropless

connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source is

drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure

no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in

order to save power loss but especially to avoid the voltage drops on the power line at the current

peaks frequency of 216 Hz that will reflect on all the components connected to that supply,

introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-

400 mV may be acceptable from the power loss point of view, the same voltage drop may not be

acceptable from the noise point of view. If your application doesn't have audio interface but only

uses the data feature of the Telit GE863, then this noise is not so disturbing and power supply

layout design can be more forgiving.

• The PCB traces to the GE863 and the Bypass capacitor must be wide enough to ensure no

significant voltage drops occur when the 2A current peaks are absorbed. This is for the same

reason as previous point. Try to keep this trace as short as possible.

• The PCB traces connecting the Switching output to the inductor and the switching diode must be

kept as short as possible by placing the inductor and the diode very close to the power switching

IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the

switching frequency (100-500 kHz usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that

the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry

as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as

microphone/earphone cables.

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5 Antenna

The antenna connection and board layout design are the most important part in the full product design

and they strongly reflect on the product overall performances, hence read carefully and follow the

requirements and the guidelines for a proper design.

5.1 GSM Antenna Requirements

As suggested on the Product Description the antenna and antenna line on PCB for a Telit GE863

device shall fulfil the following requirements:

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by

the network operator, the customer shall use

the most suitable antenna for that/those

band(s)

Bandwidth 70 MHz in GSM850, 80 MHz in GSM900,

170 MHz in DCS & 140 MHz PCS band

Gain Gain < 3dBi

Impedance 50 ohm

Input power > 2 W peak power

VSWR absolute

max

<= 10:1

VSWR

recommended

<= 2:1

When using the Telit GE863, since there's no antenna connector on the module, the antenna must be

connected to the GE863 through the PCB with the antenna pad.

In the case that the antenna is not directly developed on the same PCB, hence directly connected at

the antenna pad of the GE863, then a PCB line is needed in order to connect with it or with its

connector.

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This line of transmission shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Impedance 50 ohm

Max Attenuation 0,3 dB

No coupling with other signals allowed

Cold End (Ground Plane) of antenna shall be equipotential to

the GE863 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply to the

FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter

must be installed to provide a separation distance of at least 20 cm from all persons and must not be

co-located or operating in conjunction with any other antenna or transmitter. End-Users must be

provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators

must ensure that the end user has no manual instructions to remove or install the GE863 module.

Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating

configurations.

5.2 GSM Antenna - PCB line Guidelines

• Ensure that the antenna line impedance is 50 ohm;

• Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less

than 0,3 dB;

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and

abrupt curves;

• Keep, if possible, one layer of the PCB used only for the Ground plane;

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other

signal tracks facing directly the antenna line track;

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by

placing vias once per 2mm at least;

• Place EM noisy devices as far as possible from GE863 antenna line;

• Keep the antenna line far away from the GE863 power supply lines;

• If you have EM noisy devices around the PCB hosting the GE863, such as fast switching ICs, take

care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with

Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of GE863, by using a strip-line on the

superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;

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5.3 GSM Antenna - Installation Guidelines

• Install the antenna in a place covered by the GSM signal.

• The Antenna must be installed to provide a separation distance of at least 20 cm from all persons

and must not be co-located or operating in conjunction with any other antenna or transmitter;

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

5.4 GPS Antenna Requirements

The GE863-GPS module is not provided with an internal LNA amplifier. The use of an active antenna

is important to achieve a good performance.

The module is provided of an Antenna supply circuit with the following characteristics:

• Supply voltage referred to VBATT (Must accept values from 3.4 to 4.2 V DC)

• Supply enable controlled internally by the BB

• Current measurement circuit (readable also with AT commands)

• Voltage measurement circuit (readable also with AT commands)

• HW Protection for Antenna Short Circuit (if consumption exceeds 40mA)

5.4.1 Combined GPS Antenna

The use of combined GPS antennas is NOT recommended; this solution could generate an extremely

poor GPS reception and also the combination antenna requires additional diplexer and adds a loss in

the RF route.

5.4.2 Linear and Patch GPS Antenna

Using this type of antenna introduces at least 3 dB of loss if compared to a circularly polarized (CP)

antenna. Having a spherical gain response instead of a hemispherical gain response could aggravate

the multipath behaviour & create poor position accuracy.

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5.4.3 LNA and Front End Design Considerations

LNA gain should be between 12 dB and 26 dB (assumes a patch antenna).

– This assumes the patch used has >3 dBic of gain

Linear antenna implementation should consider a minimum of ~14.5 dB of LNA gain.

Excessive LNA gain (>27 dB) can introduce jamming spurs, degrade 3IP, and saturate the

receiver.

The supply voltage most accept the range between 3.4 to 4.2 V DC

In highly integrated environments rich with potential interference, SiRF suggests design

implementations with PRE filters.

The module’s GPS input is already provided of a SAW filter.

As suggested on the Product Description the external active antenna for a Telit GE863-GPS device

shall fulfil the following requirements:

ANTENNA REQUIREMENTS

Frequency range 1575.42 MHz (GPS L1)

Bandwidth +- 1.023 MHz

Gain 1.5 dBi < Gain < 4.5 dBi

Impedance 50 ohm

Amplification Typical 25dB (max 27dB)

Supply voltage Must accept from 3 to 5 V DC

Current

consumption

Typical 20 mA (40 mA max)

When using the Telit GE863-GPS, since there's no antenna connector on the module, the antenna

must be connected to the GE863-GPS through the PCB with the antenna pad.

In the case that the antenna is not directly developed on the same PCB, hence directly connected at

the antenna pad of the GE863-GPS, then a PCB line is needed in order to connect with it or with its

connector.

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This line of transmission shall fulfill the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Impedance 50 ohm

No coupling with other signals allowed

Cold End (Ground Plane) of antenna shall be equipotential to

the GE863-GPS ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply with

the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application.

5.5 GPS Antenna - PCB Line Guidelines

• Ensure that the antenna line impedance is 50 ohm;

• Keep the antenna line on the PCB as short as possible to reduce the loss.

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and

abrupt curves;

• Keep, if possible, one layer of the PCB used only for the Ground plane;

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other

signal tracks facing directly the antenna line track;

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by

placing vias once per 2mm at least;

• Place EM noisy devices as far as possible from GE863-GPS antenna line;

• Keep the antenna line far away from the GE863-GPS power supply lines;

• Keep the antenna line far away from the GE863-GPS GSM RF lines;

• If you have EM noisy devices around the PCB hosting the GE863-GPS, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it

with Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of GE863-GPS, by using a strip-line on the

superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;

5.6 GPS Antenna - Installation Guidelines

• The GE863-GPS due to its characteristics of sensitivity is capable to perform a Fix inside the

buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding)

• The Antenna must not be co-located or operating in conjunction with any other antenna or

transmitter;

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

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5.7 Logic level specifications

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following

table shows the logic level specifications used in the Telit GE863 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any

digital pin when on

-0.3V +3.6V

Input voltage on

analog pins when on

-0.3V +3.0 V

Operating Range - Interface levels (2.8V CMOS)

Level Min Max

Input high level 2.1V 3.3V

Input low level 0V 0.5V

Output high level 2.2V 3.0V

Output low level 0V 0.35V

For 1,8V signals:

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.6V 3.3V

Input low level 0V 0.4V

Output high level 1,65V 2.2V

Output low level 0V 0.35V

Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA

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5.7.1 Reset signal

Signal Function I/O BGA Ball

RESET Phone reset I 47

RESET is used to reset the GE863 modules. Whenever this signal is pulled low, the GE863 is reset.

When the device is reset it stops any operation. After the release of the reset GE863-GPS is

unconditionally shut down (in case of GE863-QUAD/PY/SIM the reset line perform an unconditional

restart), without doing any detach operation from the network where it is registered. This behaviour is

not a proper shut down because any GSM device is requested to issue a detach request on turn off.

For this reason the Reset signal must not be used to normally shutting down the device, but only as an

emergency exit in the rare case the device remains stuck waiting for some network response.

The RESET is internally controlled on start-up to achieve always a proper power-on reset sequence,

so there's no need to control this pin on start-up. It may only be used to reset a device already on that

is not responding to any command.

NOTE: do not use this signal to power off the GE863. Use the ON/OFF signal to perform this function or

the AT#SHDN command.

Reset Signal Operating levels:

Signal Min Max

RESET Input high 2.0V* 2.2V

RESET Input low 0V 0.2V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an

open collector transistor, to permit to the internal circuitry the power on reset and under voltage

lockout functions.

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6 Serial Ports

6.1 GE863-GPS SERIAL PORTS

The serial port on the Telit GE863-GPS is the core of the interface between the module and OEM

hardware.

4 serial ports are available on the module:

• MODEM SERIAL PORT

• MODEM SERIAL PORT 2 (GPS CONTROL PORT)

• GPS SERIAL PORT A (SIRF BINARY)

• GPS SERIAL PORT B (NMEA)

6.2 GE863-QUAD/PY/SIM SERIAL PORTS

The serial port on the Telit GE863-QUAD/PY/SIM is the core of the interface between the module and

OEM hardware.

2 serial ports are available on the module:

• MODEM SERIAL PORT

• MODEM SERIAL PORT 2 (DEBUG)

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6.3 MODEM SERIAL PORT

Several configurations can be designed for the serial port on the OEM hardware, but the most

common are:

• RS232 PC com port

• microcontroller UART @ 2.8V - 3V (Universal Asynchronous Receive Transmit)

• microcontroller UART@ 5V or other voltages different from 2.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed

to make the system work. The only configuration that doesn't need a level translation is the 2.8V

UART.

The serial port on the GE863 is a +2.8V UART with all the 7 RS232 signals. It differs from the PC-

RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE863 UART are the

CMOS levels:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any

digital pad when on

-0.3V +3.6V

Input voltage on

analog pads when on

-0.3V +3.0 V

Operating Range - Interface levels (2.8V CMOS)

Level Min Max

Input high level VIH 2.1V 3.3V

Input low level VIL 0V 0.5V

Output high level VOH 2.2V 3.0V

Output low level VOL 0V 0.35V

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The signals of the GE863 serial port are:

RS232 Pin

Number Signal GE863 Pad

Number Name Usage

1 DCD -

dcd_uart

42 Data Carrier Detect Output from the GE863 that indicates the carrier

presence

2 RXD -

tx_uart

38 Transmit line *see Note Output transmit line of GE863 UART

3 TXD -

rx_uart

37 Receive line *see Note Input receive of the GE863 UART

4 DTR -

dtr_uart

39 Data Terminal Ready Input to the GE863 that controls the DTE READY

condition

5 GND 8-17-28-36-45-

48-50-56

Ground ground

6 DSR -

dsr_uart

43 Data Set Ready Output from the GE863 that indicates the module is

ready

7 RTS -

rts_uart

40 Request to Send Input to the GE863 that controls the Hardware flow

control

8 CTS -

cts_uart

41 Clear to Send Output from the GE863 that controls the Hardware

flow control

9 RI -

ri_uart

44 Ring Indicator Output from the GE863 that indicates the incoming

call condition

NOTE: According to V.24, RX/TX signal names are referred to the application side, therefore on the GE863 side

these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here

named TXD/ rx_uart ) of the GE863 serial port and viceversa for RX.

TIP: For a minimum implementation, only the TXD and RXD lines can be connected, the other lines can be left open

provided a software flow control is implemented.

TIP: In order to avoid noise or interferences on the RXD lines it is suggested to add a pull up

resistor (100Kohm to 2.8V)

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6.4 GE863-GPS secondary ports

6.4.1 MODEM SERIAL PORT 2 (GPS CONTROL)

This port is used to control the GPS part by the GSM part.

It is available on the following pins:

PIN # NAME DESCRIPTION TYPE

25 TX_TRACE TX Data for GPS control CMOS 2.8V

26 RX_TRACE RX Data for GPS control CMOS 2.8V

The typical integration requires connecting these pins to GPS serial port A:

PIN # NAME NAME PIN#

25 TX_TRACE RX_GPS_BIN 78

26 RX_TRACE TX_GPS_BIN 80

6.4.2 GPS SERIAL PORT A (SIRF BINARY)

This port is carrying out the GPS navigation data in SIRF BINARY format.

The default configuration is 57600 bps, 8, n, 1

It is available on the following pins:

PIN # NAME DESCRIPTION TYPE

78 RX_GPS_BIN GPS RX Data (Sirf Binary) CMOS 2.8V

80 TX_GPS_BIN GPS TX Data (Sirf Binary) CMOS 2.8V

The typical integration requires connecting of these pins to MODEM serial port 2.

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6.4.3 GPS SERIAL PORT B (NMEA)

This port is carrying out the GPS navigation data in NMEA 0183 format.

The default configuration is 4800 bps, 8, n, 1

It is available on the following pins:

PIN # NAME DESCRIPTION TYPE

68 TX_GPS GPS TX Data (NMEA) CMOS 2.8V

73 RX_GPS GPS RX Data (NMEA) CMOS 2.8V

GPS RX Lines and TX lines may need a dual supply isolation buffer like an FXLP34 to avoid

CMOS high states while in POWER SAVING.

6.5 GE863-QUAD/PY/SIM secondary port

6.5.1 MODEM SERIAL PORT 2 (Python Debug)

It is available on the following pins:

PIN # NAME DESCRIPTION TYPE

25 TX_TRACE TX Data CMOS 2.8V

26 RX_TRACE RX Data CMOS 2.8V

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6.6 RS232 Level Translation

In order to interface the Telit GE863 with a PC COM port or a RS232 (EIA/TIA-232) application a level

translator is required. This level translator must

• invert the electrical signal in both directions

• change the level from 0/3V to +15/-15V

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on

the RS232 side (EIA/TIA-562) , allowing for a lower voltage-multiplying ratio on the level translator.

Note that the negative signal voltage must be less than 0V and hence some sort of level translation is

always required.

The simplest way to translate the levels and invert the signal is by using a single chip level translator.

There are a multitude of them, differing in the number of driver and receiver and in the levels (be sure

to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-3V UART level to the RS232 level, while the

receiver is the translator from RS232 level to 0-3V UART.

In order to translate the whole set of control lines of the UART you will need:

- 5 driver

- 3 receiver

NOTE: The digital input lines working at 2.8VCMOS have an absolute maximum input voltage of 3,75V; therefore the

level translator IC shall not be powered by the +3.8V supply of the module. Instead it shall be powered from a +2.8V /

+3.0V (dedicated) power supply.

This is because in this way the level translator IC outputs on the module side (i.e. GE863 inputs) will work at +3.8V

interface levels, stressing the module inputs at its maximum input voltage.

This can be acceptable for evaluation purposes, but not on production devices.

NOTE: In order to be able to do in circuit reprogramming of the GE863 firmware, the serial port on the Telit GE863

shall be available for translation into RS232 and either it's controlling device shall be placed into tristate,

disconnected or as a gateway for the serial data when module reprogramming occurs.

Only RXD, TXD, GND and the On/off module turn on pad are required to the reprogramming of the module, the other

lines are unused.

All applicator shall include in their design such a way of reprogramming the GE863.

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An example of level translation circuitry of this kind is:

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The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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6.7 5V UART level translation

If the OEM application uses a microcontroller with a serial port (UART) that works at a voltage different

from 2.8 - 3V, then a circuitry has to be provided to adapt the different levels of the two set of signals.

As for the RS232 translation there are a multitude of single chip translators. For example a possible

translator circuit for a 5V TRANSMITTER/RECEIVER can be:

TO TELIT

MODULE

TIP: This logic IC for the level translator and 2.8V pull-ups (not the 5V one) can be powered directly from VAUX line

of the GE863. Note that the TC7SZ07AE has open drain output, therefore the resistor R2 is mandatory.

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NOTE: The UART input line TXD (rx_uart) of the GE863 is NOT internally pulled up with a resistor, so there may be

the need to place an external 47KΩ pull-up resistor, either the DTR (dtr_uart) and RTS (rts_uart) input lines are not

pulled up internally, so an external pull-up resistor of 47KΩ may be required.

A power source of the internal interface voltage corresponding to the 2.8VCMOS high level is

available at the VAUX pin.

A maximum of 9 resistors of 47 KΩ pull-up can be connected to the VAUX pin, provided no other

devices are connected to it and the pulled-up lines are GE863 input lines connected to open collector

outputs in order to avoid latch-up problems on the GE863.

Care must be taken to avoid latch-up on the GE863 and the use of this output line to power electronic

devices shall be avoided, especially for devices that generate spikes and noise such as switching level

translators, micro controllers, failure in any of these condition can severely compromise the GE863

functionality.

NOTE: The input lines working at 2.8VCMOS can be pulled-up with 47KΩ resistors that can be connected directly to

the VAUX line provided they are connected as in this example.

It is important to consider that the added circuit must have consumption lower than 1mA.

In case of reprogramming of the module has to be considered the use of the RESET line to start correctly the

activity.

The preferable configuration is having an external supply for the buffer.

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7 Audio Section Overview

The Base Band Chip of the GE863 Telit Module provides two different audio blocks; both in transmit

(Uplink) and in receive (Downlink) direction:

“MT lines” should be used for handset function,

“HF lines” is suited for hands -free function (car kit).

These two blocks can be active only one at a time, selectable by AXE hardware line or by AT

command. The audio characteristics are equivalent in transmit blocks, but are different in the receive

ones and this should be kept in mind when designing.

The Audio Paths are described in the block diagram on next page.

For a full description on how to design the Audio section on your application please refer to the

following document:

• M2M Telit Modules Audio Application Note code: 80000NT10007a

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GE863-GPS Audio Paths

Differential

Line-Out Drivers

Fully Differential

Power Buffers

EXTERNAL

AMPLIFIER

-12dBFS

+10dB

-45dBV/Pa

Mic_HF-Ear_HF-

Balanced

Single

ended

Mic_HF+Ear_HF+

50cm23mVrms

0,33mV rms

audio2.skd

GM863-GPS

+20dB

7cm-45dBV/Pa

3,3mVrms

365mVrms

Mic_MT+Ear_MT+

Mic_MT-Ear_MT-

GE863 Audio Paths

GE863

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7.1 INPUT LINES (Microphone)

7.1.1 Short description

The Telit GE863 provides two audio paths in transmit section. Only one of the two paths can be active

at a time, selectable by AXE hardware line or by AT command.

You must keep in mind the different audio characteristics of the transmit blocks when designing:

The “MIC_MT” audio path should be used for handset function, while the “MIC_HF” audio path is

suited for hands-free function (car kit).

TIP: being the microphone circuitry the more noise sensitive, its design and layout must be

done with particular care. Both microphone paths are balanced and the OEM circuitry should

be balanced designed to reduce the common mode noise typically generated on the ground

plane. However also an unbalanced circuitry can be used for particular OEM application needs.

TIP: due to the difference in the echo canceller type, the “Mic_MT” audio path is suited for

Handset applications, while the “Mic_HF”audio path is suited for hands-free function (car kit).

The Earphone applications should be made using the “Mic_HF” audio path but DISABLING the

echo canceller by software AT command. If the echo canceller is left active with the Earphone,

then some echo might be introduced by the echo cancel algorithm.

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7.1.2 Input Lines Characteristics

“MIC_MT” 1st differential microphone path

Line Coupling AC*

Line Type Balanced

Coupling capacitor ≥ 100nF

Differential input resistance 50kΩ

Differential input voltage ≤ 1,03Vpp (365mVrms)

Microphone nominal sensitivity -45 dBVrms/Pa

Analog gain suggested + 20dB

Echo canceller type Handset

“MIC_HF” 2nd differential microphone path

Line Coupling AC*

Line Type Balanced

Coupling capacitor ≥ 100nF

Differential input resistance 50kΩ

Differential input voltage ≤ 65mVpp (23mVrms)

Microphone nominal sensitivity -45 dBVrms/Pa

Analog gain suggested +10dB

Echo canceller type Car kit hands-free

(*) WARNING: AC means that the signals from microphone has to be connected to input lines of the

module by a CAPACITOR, which value must be ≥ 100nF. Not respecting this constraint, the input stage

will be damaged.

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7.2 OUTPUT LINES (Speaker)

7.2.1 Short description

The Telit GE863 provides two audio paths in receive section. Only one of the two paths can be active

at a time, selectable by AXE hardware line or by AT command.

You must keep in mind the different audio characteristics of the receive blocks when designing:

Æ the “EAR_MT” lines EPN1 and EPP1 are the Differential Line-Out Drivers ; they can drive an

external amplifier or directly a 16 Ω earpiece at –12dBFS (*) ;

Æ the “EAR_HF” lines EPPA1_2 and EPPA2 are the Fully Differential Power Buffers ; they can

directly drive a 16Ω speaker in differential (balanced) or single ended (unbalanced) operation mode .

(*) FS : acronym of Full Scale. It is equal to 0dB, the maximum Hardware Analog Receive Gain of

BaseBand Chip.

The “EAR_MT” audio path should be used for handset function, while the “EAR_HF” audio path is

suited for hands-free function (car kit).

Both receiver outputs are B.T.L. type (Bridged Tie Load) and the OEM circuitry shall be designed

bridged to reduce the common mode noise typically generated on the ground plane and to get the

maximum power output from the device; however also a single ended circuitry can be designed for

particular OEM application needs.

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7.2.2 Output Lines Characteristics

“EAR_MT” Differential Line-out Drivers Path

Line Coupling DC

Line Type Bridged

Output load resistance ≥ 14 Ω

Internal output resistance 4 Ω (typical)

Signal bandwidth 150 – 4000 Hz @ -3 dB

Differential output voltage 328mVrms /16 Ω @ -12dBFS

SW volume level step - 2 dB

Number of SW volume steps 10

“EAR_HF” Power Buffers Path

Line Coupling DC

Line Type Bridged

Output load resistance ≥ 14 Ω

Internal output resistance 4 Ω ( >1,7 Ω )

Signal bandwidth 150 – 4000 Hz @ -3 dB

Max Differential output voltage 1310 mVrms (typ, open circuit)

Max Single Ended output voltage 656 mVrms (typ, open circuit)

SW volume level step - 2 dB

Number of SW volume steps 10

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8 General Purpose I/O

The general purpose I/O pads can be configured to act in three different ways:

• input

• output

• alternate function (internally controlled)

The following GPIO are available on the GE863:

Ball Signal I/O Function Type

Input /

output

current

Default

State

ON_OFF

state

State

during

Reset

Note

34 GPIO1 I/O GPIO01 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

33 GPIO2 I/O GPIO02 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0 Alternate function

(JDR)

55 GPIO3 I/O GPIO03 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 1 1 47K Pull Up

32 GPIO4 I/O GPIO04 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 1 1

4.7K Pull Up

Alternate function

(RF Transmission

Control)

53 GPIO5 I/O GPIO05 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0 Alternate function

(RFTXMON)

54 GPIO6 I/O GPIO06 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT fig. 01 HIGH Alternate function

(ALARM)

51 GPIO7 I/O GPIO07 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0 Alternate function

(BUZZER)

6 GPIO8 I/O GPIO08 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

5 GPIO9 I/O GPIO09 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

4 GPIO10 I/O GPIO10 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

3 GPIO11 I/O GPIO11 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 1 1 4.7K Pull Up

2 GPIO12 I/O GPIO12 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 1 1 47K Pull Up

1 GPIO13 I/O GPIO13 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

60 GPIO14 I/O GPIO14 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

71 GPIO15 I/O GPIO15 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

64 GPIO16 I/O GPIO16 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

59 GPIO17 I/O GPIO17 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

76 GPIO18 I/O GPIO18 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT 0

Input pads can only be read and report the digital value (high or low) present on the pad at the read

time; output pads can only be written or queried and set the value of the pad output; an alternate

function pad is internally controlled by the GE863 firmware and acts depending on the function

implemented.

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Not all GPIO pads support all these three modes:

• GPIO1, GPIO3, GPIO8 to GPIO18 support both input and output mode but not Alternate

function.

• GPIO2 supports all three modes and can be input, output, Jamming Detect Output (Alternate

function)

• GPIO4 supports all three modes and can be input, output, RF Transmission Control (Alternate

function)

• GPIO5 supports all three modes and can be input, output, RFTX monitor output (Alternate

function)

• GPIO6 supports all three modes and can be input, output, alarm output (Alternate function)

• GPIO7 supports all three modes and can be input, output, buzzer output (Alternate function)

All GPIO pads are 2.8V CMOS signals and their interface levels are the same specified in the

paragraph 5.

fig. 01

ch1: ON_OFF (2sec)

ch2: GPIO 06 [ bis ]

GE863-GPS

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8.1 GPIO Logic levels

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels.

The following table shows the logic level specifications used in the GE863 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any

digital pin when on

-0.3V +3.6V

Input voltage on

analog pins when on

-0.3V +3.0 V

Operating Range - Interface levels (2.8V CMOS)

Level Min Max

Input high level 2.1V 3.3V

Input low level 0V 0.5V

Output high level 2.2V 3.0V

Output low level 0V 0.35V

For 1.8V signals:

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.6V 3.3V

Input low level 0V 0.4V

Output high level 1,65V 2.2V

Output low level 0V 0.35V

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8.2 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and

report its status, provided this device has interface levels compatible with the 2.8V CMOS levels of the

GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface levels different

from the 2.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to

2.8V.

8.3 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible hardware.

When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be

omitted.

8.4 Using the RF Transmission Control GPIO4

The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable the Transmitter

when the GPIO is set to Low by the application.

8.5 Using the RFTXMON Output GPIO5

The GPIO5 pin, when configured as RFTXMON Output, is controlled by the GE863 module and will

rise when the transmitter is active and fall after the transmitter activity is completed.

For example, if a call is started, the line will be HIGH during all the conversation and it will be again

LOW after hanged up.

The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1sec after

last TX burst.

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8.6 Using the Alarm Output GPIO6

The GPIO6 pad, when configured as Alarm Output, is controlled by the GE863 module and will rise

when the alarm starts and fall after the issue of a dedicated AT command.

This output can be used to power up the GE863 controlling microcontroller or application at the alarm

time, giving you the possibility to program a timely system wake-up to achieve some periodic actions

and completely turn off either the application or the GE863 during sleep periods, dramatically reducing

the sleep consumption to few μA.

In battery-powered devices this feature will greatly improve the autonomy of the device.

NOTE: During RESET the line is set to HIGH logic level.

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8.7 Using the Buzzer Output GPIO7

As Alternate Function, the GPIO7 is controlled by the firmware that depends on the function

implemented internally.

This setup places always the GPIO7 pin in OUTPUT direction and the corresponding function must be

activated properly by AT#SRP command (refer to AT commands specification).

Also in this case, the dummy value for the pin state can be both “0” or “1”.

Send the command AT#GPIO=7, 1, 2<cr>:

Wait for response OK

Send the command AT#SRP=3

The GPIO7 pin will be set as Alternate Function pin with its dummy logic status set to HIGH value.

The "Alternate function” permits your application to easily implement Buzzer feature with some small

hardware extension of your application as shown in the next sample figure.

Example of Buzzer’s driving circuit.

NOTE: To correctly drive a buzzer, a driver must be provided; its characteristics depend on the Buzzer and to get

these info contact your buzzer vendor.

TR1

BCR141W

TR2

SMBT2907A

4,7K

D1N4148

33pF

+V buzze r

GPIO7

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8.8 Magnetic Buzzer Concepts

8.8.1 Short Description

A magnetic Buzzer is a sound-generating device with a coil located in the magnetic circuit consisting

of a permanent magnet, an iron core, a high permeable metal disk, and a vibrating diaphragm.

Drawing of the Magnetic Buzzer.

The disk and diaphragm are attracted to the core by the magnetic field. When an oscillating signal is

moved through the coil, it produces a fluctuating magnetic field, which vibrates the diaphragm at a

frequency of the drive signal. Thus the sound is produced relative to the frequency applied.

Diaphragm movement.

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8.8.2 Frequency Behaviour

The frequency behaviour represents the effectiveness of the reproduction of the applied

signals.

Because its performance is related to a square driving waveform (whose amplitude varies from

0V to Vpp), if you modify the waveform (e.g. from square to sinus) the frequency response will

change.

8.8.3 Power Supply Influence

Applying a signal whose amplitude is different from that suggested by manufacturer, the

performance change following the rule “if resonance frequency fo increases, amplitude

decreases”.

Because of resonance frequency depends from acoustic design, lowering the amplitude of the

driving signal the response bandwidth tends to become narrow, and vice versa.

Summarizing: Vpp ↑

fo ↓ Vpp ↓

fo ↑

The risk is that the fo could easily fall outside of new bandwidth; consequently the SPL could

be much lower than the expected.

8.8.4 Warning

It is very important to respect the sense of the applied voltage: never apply to the "-" pin a

voltage more positive than "+" pin : if this happens, the diaphragm vibrates in the opposite

sense with a high probability to be expelled from its physical position , damaging the device

forever .

8.8.5 Working Current Influence

In the component data sheet you will find the value of MAX CURRENT : this represents the

maximum average current that can flow at nominal voltage without current limitation.

In other words it is not the peak current, which could be twice or three times higher.

If driving circuitry does not support these peak values, the SPL will never reach the declared

level or the oscillations will stop.

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8.9 Using the Temperature Monitor Function

8.9.1 Short Description

The Temperature Monitor is a function of the module that permits to control its internal

temperature and if properly set (see the #TEMPMON command on AT Interface guide) it raise

to High Logic level a GPIO when the maximum temperature is reached.

8.9.2 Allowed GPIO

The AT#TEMPMON set command could be used with one of the following GPIO:

Ball Signal Function Type

Input /

output

current

Note

34 GPIO 01 GPIO01 Configurable GPIO CMOS 2.8V 1uA / 1mA

6 GPIO 08 GPIO08 Configurable GPIO CMOS 2.8V 1uA / 1mA

5 GPIO 09 GPIO09 Configurable GPIO CMOS 2.8V 1uA / 1mA

4 GPIO 10 GPIO10 Configurable GPIO CMOS 2.8V 1uA / 1mA

1 GPIO 13 GPIO13 Configurable GPIO CMOS 2.8V 1uA / 1mA

60 GPIO 14 GPIO14 Configurable GPIO CMOS 2.8V 1uA / 1mA

71 GPIO 15 GPIO15 Configurable GPIO CMOS 2.8V 1uA / 1mA

64 GPIO 16 GPIO16 Configurable GPIO CMOS 2.8V 1uA / 1mA

59 GPIO 17 GPIO17 Configurable GPIO CMOS 2.8V 1uA / 1mA

76 GPIO 18 GPIO18 Configurable GPIO CMOS 2.8V 1uA / 1mA

The set command could be used also with one of the following GPIO but in that case the

alternate function is not usable:

Ball Signal Function Type

Input /

output

current

Note

33 GPIO 02 GPIO02 Configurable GPIO CMOS 2.8V 1uA / 1mA Alternate function (JDR)

53 GPIO 05 GPIO05 Configurable GPIO CMOS 2.8V 1uA / 1mA Alternate function

(RFTXMON)

51 GPIO 07 GPIO07 Configurable GPIO CMOS 2.8V 1uA / 1mA Alternate function (BUZZER)

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8.10 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status.

In the GE863 modules, the STAT_LED needs an external transistor to drive an external LED.

Therefore, the status indicated in the following table is reversed with respect to the pin status.

LED status Device Status

Permanently off Device off

Fast blinking

(Period 1s, Ton 0,5s)

Net search / Not registered /

turning off

Slow blinking

(Period 3s, Ton 0,3s)

Registered full service

Permanently on a call is active

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9 RTC and Ausiliary supply

9.1 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital

part, allowing having only RTC going on when all the other parts of the device are off.

To this power output a backup capacitor can be added in order to increase the RTC autonomy during

power off of the battery. NO Devices must be powered from this pin.

9.2 VAUX1 power output

A regulated power supply output is provided in order to supply small devices from the module.

This output is active when the module is ON and goes OFF when the module is shut down.

The operating range characteristics of the supply are:

Operating Range – VAUX1 power supply – GE863-GPS

Min Typical Max

Output voltage 2.75V 2.85V 2.95V

Output current 50mA

Output bypass capacitor

(inside the module)

2.2μF

Operating Range – VAUX1 power supply – GE863-QUAD/PY/SIM

Min Typical Max

Output voltage 2.75V 2.85V 2.95V

Output current 100mA

Output bypass capacitor

(inside the module)

2.2μF

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10 PPS GPS Output (GE863-GPS only)

10.1 Description

The Time Mark output 1PPS provides a one pulse-per-second signal to the user specific application.

The 1PPS pulse is available at any time as soon as a fix is done. This signal is a positive logic, CMOS

level output pulse that transitions from logic 'low' condition to logic 'high' at a 1 Hz rate.

10.2 Pulse Characteristics

The signal is available on BGA Ball # 75 on GE863-GPS and on pin 26 of PL104 on EVK2 Adapter

board (CS1151).

Type: Output CMOS 2.8V

Duration: Typically 1us

Pull up/ down: Internal 100Kohm Pull down

NOTE: The signal is available only when the receiver provides a valid Navigation solution.

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11 DAC and ADC section

11.1 DAC Converter

11.1.1 Description

The GE863 module provides a Digital to Analog Converter. The signal (named DAC_OUT) is

available on BGA Ball #63 of the GE863 module and on pin 17 of PL104 on EVK2 Board (CS1151).

The on board DAC is a 10 bit converter, able to generate a analogue value based a specific input in

the range from 0 up to 1023. However, an external low-pass filter is necessary

Min Max Units

Voltage range (filtered) 0 2,6 Volt

Range 0 1023 Steps

The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated voltage

could be calculated with the following formula:

Integrated output voltage = 2 * value / 1023

DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain an

analog voltage.

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11.1.2 Enabling DAC

An AT command is available to use the DAC function.

The command is AT#DAC[=<enable>[,<value>]]

<value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision)

it must be present if <enable>=1

Refer to SW User Guide or to AT Commands Reference Guide for the full description of this

function.

NOTE: The DAC frequency is selected internally. D/A converter must not be used during

POWERSAVING.

11.1.3 Low Pass Filter Example

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11.2 ADC Converter

11.2.1 Description

The GE863-GPS module provides one Analog to Digital Converter. The input line (named

ADC_IN1) is available on BGA Ball #23 of the GE863-GPS module and on pin 19 of PL104 on

EVK2 Board (CS1151).

The GE863-QUAD / PY / SIM modules provide 3 Analog to Digital Converters.

The input lines are available on:

ADC_IN1 on BGA Ball #23 of the module and on pin 19 of PL104 on EVK Interface board.

ADC_IN2 on BGA Ball #74 of the module and on pin 20 of PL104 on EVK Interface board.

ADC_IN3 on BGA Ball #70 of the module and on pin 21 of PL104 on EVK Interface board.

The on board A/D is 11-bit converter. It is able to read a voltage level in the

range of 0÷2 volts applied on the ADC pin input, store and convert it into 11 bit word.

Min Max Units

Input Voltage range 0 2 Volt

AD conversion - 11 bits

Resolution - < 1 mV

11.2.2 Using ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or to AT Commands Reference Guide for the full description of this

function.

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12 Mounting the GE863 on the Application

Board

12.1 General

The Telit GE863 modules have been designed in order to be compliant with a standard lead-free SMT

process

12.1.1 Module Finishing & Dimensions

Surface finishing Ni/Au for all test pads Lead-free Alloy:

Surface finishing Sn/Ag/Cu for all solder pads

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12.1.2 Recommended foot print for the application

NOTE:

Pads 81,

82, 83

and 84

are not in

line with

the

others.

Please

check the

quotes.

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12.1.1 Suggested Inhibit Area

In order to easily rework the GE863 is suggested to consider on the application a 1.5mm Inhibit area

around the module:

Top View

It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the

application in direct contact with the module.

1.5mm

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12.1.2 Debug of the GE863 in Production

To test and debug the mounting of the GE863, we strongly recommend to foreseen test pads on the

host PCB, in order to check the connection between the GE863 itself and the application and to test

the performance of the module connecting it with an external computer. Depending by the customer

application, these pads include, but are not limited to the following signals:

• TXD

• RXD

• ON/OFF

• RESET

• GND

• VBATT

• TX_TRACE

• RX_TRACE

• PWRMON

12.1.3 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a

thickness of stencil foil ≥ 120µm.

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12.1.4 PCB pad Design

“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

Recommendations for PCB pad dimensions

Ball pitch [mm] 2

Solder resist opening diameter A [mm] 1,150

Metal pad diameter B [mm] 1 ± 0.05

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Placement of microvias not covered by solder resist is not recommended inside the “Solder resist

opening”, unless the microvia carry the same signal of the pad itself.

Holes in pad are allowed only for blind holes and not for through holes.

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Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni /

Immersion Au

3 –7 /

0.05 – 0.15

Good solder ability protection, high

shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.

This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder

paste on the described surface plating is better compared to lead-free solder paste.

12.1.5 Solder paste

Lead free

Solder paste Sn/Ag/Cu

12.1.6 GE863 Solder Reflow

The following is the recommended solder reflow profile

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Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat:

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL:

– Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak Temperature (Tp): 245 +0/-5°C

Time within 5°C of actual Peak

Temperature (tp)

10-30 seconds

Ramp-down Rate 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE863 module can accept only one reflow process

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12.1.7 Packing System

According to SMT processes for pick & place movement requirements, Telit GE863 modules are

packaged on trays, each tray contains 20 pieces. Tray dimensions are:

Note that trays can withstand a maximum temperature of 65° C.

320 ± 0,3

170 ± 0,3

All quotes are in mm, general tolerance ± 0.1

6.1

Section A-A

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Modules orientation on tray:

Ref. Not rounded corner of

module’s printed board

indicates pin 1 corner.

The modules in the tray are

oriented as shown in A and the

tray is oriented toward left as

shown in B.

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12.1.8 Moisture Sensibility

The level of moisture sensibility of Telit GE863 modules is “3”, according with standard IPC/JEDEC J-

STD-020, take care of all the relative requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) The shelf life of GE863 inside of the dry bag shall be 12 month from the bag seal date, when stored

in a non-condensing atmospheric environment of <40°C / 90% RH

b) Environmental condition during the production: ≤ 30°C / 60% RH according to IPC/JEDEC J-STD-

033A paragraph 5

c) The maximum time between the opening of the sealed bag and the reflow process shall be 168

hours if the condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) A baking is required if conditions b) or c) are not respected

e) A baking is required if the humidity indicator inside the bag indicates 10% RH or more

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13 Conformity Assessment Issues

The GE863-GPS/PY/QUAD/SIM module are assessed to be conform to the R&TTE Directive as

stand-alone products, so If the module is installed in conformance with Dai Telecom installation

instructions require no further evaluation under Article 3.2 of the R&TTE Directive and do not require

further involvement of a R&TTE Directive Notified Body for the final product.

In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating

the radio module must be assessed against Article 3.2 of the R&TTE Directive.

In all cases assessment of the final product must be made against the Essential requirements of the

R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3

requirements.

The GE863-GPS/PY/QUAD/SIM module is conform with the following European Union Directives:

• R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)

• Low Voltage Directive 73/23/EEC and product safety

• Directive 89/336/EEC for conformity for EMC

In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the GE863-

GPS/PY/QUAD/SIM module is compliant with the following standards:

• GSM (Radio Spectrum). Standard: EN 301 511 and 3GPP 51.010-1

• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-7

• LVD (Low Voltage Directive) Standards: EN 60 950

In this document and the Hardware User Guide, Software User Guide all the information you may

need for developing a product meeting the R&TTE Directive is included.

The GE863-GPS/PY/QUAD/SIM module is conform with the following US Directives:

• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)

• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15

To meet the FCC's RF exposure rules and regulations:

- The system antenna(s) used for this transmitter must be installed to provide a separation

distance of at least 20 cm from all the persons and must not be co-located or operating in

conjunction with any other antenna or transmitter.

- The system antenna(s) used for this module must not exceed 3 dBi for mobile and fixed or mobile

operating configurations.

- Users and installers must be provided with antenna installation instructions and transmitter

operating conditions for satisfying RF exposure compliance.

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify

any regulatory questions and to have their complete product tested and approved for FCC

compliance.

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14 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of

this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the

product. The product has to be supplied with a stabilized voltage source and the wiring has to be

conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself. Same cautions have to be taken for the SIM, checking

carefully the instruction for its use. Do not insert or remove the SIM when the product is in power

saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be

taken to the external components of the module, as well as of any project or installation issue,

because the risk of disturbing the GSM network or external devices or having impact on the security.

Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has

to be installed with care in order to avoid any interference with other electronic devices and has to

guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied,

the system integrator has to assess the final product against the SAR regulation EN 50360.

The European Community provides some Directives for the electronic equipments introduced on the

market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the

applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

GE863 Hardware User Guide

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15 Document Change Log

ISSUE #0 10/06/08 First release

Telit Communications S p A GE863S Quad-Band GSM/GPRS module User Manual GE863 GPS Harware User Guide

Telit Communications S.p.A. Quad-Band GSM/GPRS module GE863 GPS Harware User Guide

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