Telit Communications S p A GE864QC2 Quadband GSM/ GPRS Module User Manual GE864 QUAD Hardware User Guide
Telit Communications S.p.A. Quadband GSM/ GPRS Module GE864 QUAD Hardware User Guide
User Manual
GE864-QUAD Hardware User Guide
For GE864-QUAD
1vv0300872 Rev.1 2010-04-02
GE864-QUAD Hardware User Guide
1vv0300872 Rev.1 2010-04-02
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APPLICABILITY TABLE
PRODUCT
GE864-QUAD
GE864-QUAD Hardware User Guide
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DISCLAIMER
The information contained in this document is the proprietary information of Telit
Communications S.p.A. and its affiliates (“TELIT”).
The contents are confidential and any disclosure to persons other than the officers,
employees, agents or subcontractors of the owner or licensee of this document,
without the prior written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available.
Notwithstanding the foregoing, Telit does not make any warranty as to the
information contained herein, and does not accept any liability for any injury, loss or
damage of any kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices
characterized in this document, and notes that the application of the device must
comply with the safety standards of the applicable country, and where applicable,
with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this
document due to typographical errors, inaccurate information, or improvements to
programs and/or equipment at any time and without notice.
Such changes will, nevertheless be incorporated into new editions of this document.
Copyright: Transmittal, reproduction, dissemination and/or editing of this document
as well as utilization of its contents and communication thereof to others without
express authorization are prohibited. Offenders will be held liable for payment of
damages. All rights are reserved.
Copyright © Telit Communications S.p.A. 2010
GE864-QUAD Hardware User Guide
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Contents
APPLICABILITY TABLE ........................................................................................................................................................ 2
1. INTRODUCTION .................................................................................................................................................... 7
1.1. SCOPE .................................................................................................................................................................... 7
1.2. AUDIENCE............................................................................................................................................................... 7
1.3. CONTACT INFORMATION, SUPPORT ............................................................................................................................. 7
1.4. DOCUMENT ORGANIZATION ....................................................................................................................................... 8
1.5. TEXT CONVENTIONS ................................................................................................................................................. 9
1.6. RELATED DOCUMENTS .............................................................................................................................................. 9
1.7. DOCUMENT HISTORY .............................................................................................................................................. 10
2. OVERVIEW .......................................................................................................................................................... 11
3. GE864 MECHANICAL DIMENSIONS ..................................................................................................................... 12
4. GE864 MODULE CONNECTIONS .......................................................................................................................... 13
4.1. PIN-OUT ........................................................................................................................................................... 13
4.1.1.
BGA Balls Layout
................................................................................................................................... 17
5. HARDWARE COMMANDS ................................................................................................................................... 19
5.1. TURNING ON THE GE864-QUAD ........................................................................................................................ 19
5.2. TURNING OFF THE GE864-QUAD ...................................................................................................................... 21
5.2.1.
Hardware Unconditional Restart
........................................................................................................ 22
6. POWER SUPPLY .................................................................................................................................................. 25
6.1. POWER SUPPLY REQUIREMENTS ......................................................................................................................... 25
6.2. GENERAL DESIGN RULES .................................................................................................................................... 27
6.2.1.
Electrical Design Guidelines
............................................................................................................... 27
6.2.1.1. +5V input Source Power Supply Design Guidelines ............................................................................................... 27
6.2.1.2. +12V input Source Power Supply Design Guidelines ............................................................................................. 28
6.2.1.3. Battery Source Power Supply Design Guidelines ................................................................................................... 30
6.2.1.4. Battery Charge Control Circuitry Design Guidelines .............................................................................................. 30
6.2.2.
Thermal Design Guidelines
................................................................................................................. 32
6.2.3.
Power Supply PCB Layout Guidelines
................................................................................................ 33
7. ANTENNA ........................................................................................................................................................... 35
7.1. GSM ANTENNA REQUIREMENTS .......................................................................................................................... 35
7.2. GSM ANTENNA – PCB LINE GUIDELINES ............................................................................................................ 36
7.3. GSM ANTENNA – INSTALLATION GUIDELINES ...................................................................................................... 37
8. LOGIC LEVEL SPECIFICATIONS ............................................................................................................................. 38
8.1. RESET SIGNAL .................................................................................................................................................... 39
9. SERIAL PORTS ..................................................................................................................................................... 40
9.1. MODEM SERIAL PORT .......................................................................................................................................... 40
9.2. RS232 LEVEL TRANSLATION .............................................................................................................................. 42
9.3. 5V UART LEVEL TRANSLATION........................................................................................................................... 44
10. AUDIO SECTION OVERVIEW ........................................................................................................................... 46
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1.1 SELECTION MODE .......................................................................................................................................................... 46
1.2 ELECTRICAL CHARACTERISTICS .......................................................................................................................................... 48
10.1.1.
Input Lines Characteristics
................................................................................................................. 48
1.2.1 Output Lines Characteristics
....................................................................................................................... 49
11. EXTERNAL SIM HOLDER IMPLEMENTATION ................................................................................................... 51
12. GENERAL PURPOSE I/O .................................................................................................................................. 52
12.1. GPIO LOGIC LEVELS ....................................................................................................................................... 54
12.2. USING A GPIO PAD AS INPUT ........................................................................................................................ 55
12.3. USING A GPIO PAD AS OUTPUT .................................................................................................................... 55
12.4. USING THE RF TRANSMISSION CONTROL GPIO4 .............................................................................................. 55
12.5. USING THE RFTXMON OUTPUT GPIO5 .......................................................................................................... 55
12.6. USING THE ALARM OUTPUT GPIO6 ................................................................................................................. 56
12.7. USING THE BUZZER OUTPUT GPIO7 ................................................................................................................ 57
12.8. MAGNETIC BUZZER CONCEPTS......................................................................................................................... 58
12.8.1.
Short Description
.................................................................................................................................. 58
12.8.2.
Frequency Behavior
.............................................................................................................................. 59
12.8.3.
Power Supply Influence
....................................................................................................................... 59
12.8.4.
Working Current Influence
.................................................................................................................. 59
12.9. USING THE TEMPERATURE MONITOR FUNCTION ............................................................................................... 60
12.9.1.
Short Description
.................................................................................................................................. 60
12.9.2.
Allowed GPIO
......................................................................................................................................... 60
12.10. INDICATION OF NETWORK SERVICE AVAILABILITY ............................................................................................. 61
12.11. RTC BYPASS OUT ........................................................................................................................................... 62
12.12. VAUX1 POWER OUTPUT ................................................................................................................................. 62
13. DAC AND ADC SECTION .................................................................................................................................. 63
13.1. DAC CONVERTER ............................................................................................................................................ 63
13.1.1.
Description
............................................................................................................................................. 63
13.1.2.
Enabling DAC
.......................................................................................................................................... 63
13.1.3.
Low Pass Filter Example
..................................................................................................................... 64
13.2. ADC CONVERTER ............................................................................................................................................ 64
13.2.1.
Description
............................................................................................................................................. 64
13.2.2.
Using ADC Converter
............................................................................................................................ 64
14. MOUNTING THE GE864 ON THE BOARD ......................................................................................................... 65
14.1. GENERAL ........................................................................................................................................................ 65
14.1.1.
Module Finishing & Dimensions
......................................................................................................... 65
14.1.2.
Recommended Foot Print for the Application (GE864)
................................................................... 66
14.1.3.
Suggested Inhibit Area
......................................................................................................................... 67
14.1.4.
Debug of the GE864 in Production
...................................................................................................... 68
14.1.5.
Stencil
..................................................................................................................................................... 68
14.1.6.
PCB Pad Design
..................................................................................................................................... 68
14.1.7.
Solder Paste
........................................................................................................................................... 69
14.1.8.
GE864 Solder Reflow
............................................................................................................................ 70
14.2. PACKING SYSTEM ........................................................................................................................................... 71
GE864 Orientation on the Tray
............................................................................................................................. 72
14.2.1.
Moisture Sensibility
.............................................................................................................................. 73
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15. CONFORMITY ASSESSMENT ISSUES ................................................................................................................ 74
16. SAFETY RECOMMENDATIONS ........................................................................................................................ 76
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1. Introduction
1.1. Scope
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit GE864-QUAD module.
1.2. Audience
This document is intended for Telit customers, who are integrators, about to
implement their applications using our GE864 modules.
1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order
manuals, contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact
Telit’s Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your
comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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1.4. Document Organization
This document contains the following chapters:
provides a scope for this document, target audience,
contact and support information, and text conventions.
Ch provides an overview of the document.
864
Chapter 4 864 deals with the pin out configuration and
layout.
How to operate on the module via hardware.
Power supply requirements and general design rules.
The antenna connection and board layout design are the most
important parts in the full product design.
Specific values adopted in the implementation
of logic levels for this module.
The serial port on the Telit GE864 is the core of the
interface between the module and OEM hardware
Refers to the audio blocks of the Base Band
Chip of the GE864 Telit Modules.
How the general purpose I/O pads can be
configured.
Deals with these two kind of converters.
g the GE864 Recommendations and
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1.5. Text Conventions
Danger
–
This information MUST be followed or catastrophic equipment failure
or bodily injury may occur.
Caution or Warning
–
Alerts the user to important points about integrating the
module, if these points are not followed, the module and end user equipment
may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6. Related Documents
Telit's GSM/GPRS Family Software User Guide, 1vv0300784
Audio settings application note , 80000NT10007a
Digital voice Interface Application Note, 80000NT10004a
GE864 Product description
SIM Holder Design Guides, 80000NT10001a
AT Commands Reference Guide, 80000ST10025a
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1.7. Document History
R
Re
ev
vi
is
si
io
on
n
D
Da
at
te
e
C
Ch
ha
an
ng
ge
es
s
ISSUE#0
2010-01-18
Release First ISSUE# 0
ISSUE#1
2010-04-02
Added FCC documentation
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2. Overview
In this document all the basic functions of a mobile phone will be taken into account;
for each one of them a proper hardware solution will be suggested and eventually
the wrong solutions and common errors to be avoided will be evidenced. Obviously
this document cannot embrace the whole hardware solutions and products that may
be designed. The wrong solutions to be avoided shall be considered as mandatory,
while the suggested hardware configurations shall not be considered mandatory,
instead the information given shall be used as a guide and a starting point for
properly developing your product with the Telit GE864-QUAD module. For further
hardware details that may not be explained in this document refer to the Telit GE864-
QUAD Product Description document where all the hardware information is reported.
NOTICE:
The integration of the GSM/GPRS GE864-QUAD cellular module within user
application shall be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable.
However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor
any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent rights of Telit
Communications S.p.A. other than for circuitry embodied in Telit products. This
document is subject to change without notice.
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3. GE864 Mechanical Dimensions
The Telit GE864 module overall dimensions are:
Length: 30 mm
Width: 30 mm
Thickness: 2.9 mm
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4. GE864 Module Connections
4.1. PIN-OUT
Ball
Signal
I/O
Function
Internal PULL UP
Type
Audio
H9
EAR_MT-
AO
Handset earphone signal output, phase -
Audio
G10
EAR_MT+
AO
Handset earphone signal output, phase +
Audio
H10
EAR_HF+
AO
Handsfree ear output, phase +
Audio
J10
EAR_HF-
AO
Handsfree ear output, phase -
Audio
J8
MIC_MT+
AI
Handset mic.signal input; phase+
Audio
G9
MIC_MT-
AI
Handset mic.signal input; phase-
Audio
G8
MIC_HF+
AI
Handsfree mic. input; phase +
Audio
J9
MIC_HF-
AI
Handsfree mic.input; phase -
Audio
F9
AXE
I
Handsfree switching
100K
CMOS 2.8V
SIM card interface
C10
SIMCLK
O
External SIM signal Clock
1,8 / 3V
E9
SIMRST
O
External SIM signal Reset
1,8 / 3V
D10
SIMIO
I/O
External SIM signal Data I/O
1,8 / 3V
C11
SIMIN
I
External SIM signal Presence (active low)
47K
1,8 / 3V
D41
SIMVCC
-
External SIM signal Power supply for the SIM
1,8 / 3V
Trace
D11
TX_TRACE
O
TX Data for debug monitor
CMOS 2.8V
F10
RX_TRACE
I
RX Data for debug monitor
CMOS 2.8V
Prog. / Data + HW Flow Control
E7
C103/TXD
I
Serial data input (TXD) from DTE
CMOS 2.8V
H8
C104/RXD
O
Serial data output to DTE
CMOS 2.8V
B7
C108/DTR
I
Input for Data terminal ready signal (DTR) from
DTE
CMOS 2.8V
F7
C105/RTS
I
Input for Request to send signal (RTS) from
DTE
CMOS 2.8V
F6
C106/CTS
O
Output for Clear to send signal (CTS) to DTE
CMOS 2.8V
D9
C109/DCD
O
Output for Data carrier detect signal (DCD) to
DTE
CMOS 2.8V
E11
C107/DSR
O
Output for Data set ready signal (DSR) to DTE
CMOS 2.8V
B6
C125/RING
O
Output for Ring indicator signal (RI) to DTE
CMOS 2.8V
DAC and ADC
C7
DAC_OUT
AO
Digital/Analog converter output
D/A
J11
ADC_IN1
AI
Analog/Digital converter input
A/D
H11
ADC_IN2
AI
Analog/Digital converter input
A/D
G11
ADC_IN3
AI
Analog/Digital converter input
A/D
Miscellaneous Functions
A2
RESET*
I
Reset input
1 On this line a maximum of 10nF bypass capacitor is allowed
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Ball
Signal
I/O
Function
Internal PULL UP
Type
E2
VRTC
AO
VRTC Backup capacitor
Power
D8
STAT_LED
O
Status indicator led
CMOS 1.8V
G1
CHARGE
AI
Charger input
Power
G2
CHARGE
AI
Charger input
Power
J5
ON_OFF*
I
Input command for switching power ON or OFF
(toggle command).
47K
Pull up to VBATT
D5
VAUX1
-
Power output for external accessories
-
L8
PWRMON
O
Power ON Monitor
CMOS 2.8V
L4
Antenna
O
Antenna output 50 ohm
RF
D7
DVI2_CLK
-
DVI2_CLK (Digital Voice Interface)
4.7K
CMOS 2.8
C6
DVI1_TX
-
Digital Transmitting Data
4.7K
CMOS 2.8
GPIO
G4
TGPIO_12
I/O
Telit GPIO12 Configurable GPIO
CMOS 2.8V
C2
TGPIO_03
I/O
Telit GPIO03 Configurable GPIO
CMOS 2.8V
B3
TGPIO_04
I/O
Telit GPIO04 Configurable GPIO / RF
Transmission Control
CMOS 2.8V
C3
TGPIO_20
I/O
Telit GPIO20 Configurable GPIO
CMOS 2.8V
B4
TGPIO_14
I/O
Telit GPIO14 Configurable GPIO
CMOS 2.8V
D1
TGPIO_11
I/O
Telit GPIO11 Configurable GPIO
CMOS 2.8V
B1
TGPIO_19
I/O
Telit GPIO19 Configurable GPIO
CMOS 2.8V
C1
TGPIO_01
I/O
Telit GPIO01 Configurable GPIO
CMOS 2.8V
K7
TGPIO_18
I/O
Telit GPIO18 Configurable GPIO/ DVI2_RX
(Digital Voice Interface)
CMOS 2.8V
H5
TGPIO_17
I/O
Telit GPIO17 Configurable GPIO / DVI2_WA
(Digital Voice Interface)
CMOS 2.8V
F5
TGPIO_15
I/O
Telit GPIO15 Configurable GPIO
CMOS 2.8V
K11
TGPIO_08
I/O
Telit GPIO08 Configurable GPIO
CMOS 2.8V
B5
TGPIO_06 / ALARM
I/O
Telit GPIO06 Configurable GPIO / ALARM
CMOS 2.8V
C9
TGPIO_09
I/O
Telit GPIO09 GPIO I/O pin
CMOS 2.8V
E6
TGPIO_02 / JDR
I/O
Telit GPIO02 I/O pin / Jammer detect report
CMOS 2.8V
L9
TGPIO_07 / BUZZER
I/O
Telit GPIO07 Configurable GPIO / Buzzer
CMOS 2.8V
H6
TGPIO_16
I/O
Telit GPIO16 Configurable GPIO
CMOS 2.8V
K10
TGPIO_13
I/O
Telit GPIO13 Configurable GPIO
CMOS 2.8V
K8
TGPIO_05 / RFTXMON
I/O
Telit GPIO05 Configurable GPIO / Transmitter
ON monitor
CMOS 2.8V
L10
TGPIO_21
I/O
Telit GPIO21 Configurable GPIO
CMOS 2.8V
E8
TGPIO_22
I/O
Telit GPIO22 Configurable GPIO
CMOS 1.8V
(not 2.8V !!)
H3
TGPIO_10
I/O
Telit GPIO10 Configurable GPIO / DVI2_TX
(Digital Voice Interface)
CMOS 2.8V
Power Supply
J1
VBATT
-
Main power supply
Power
K1
VBATT
-
Main power supply
Power
J2
VBATT
-
Main power supply
Power
K2
VBATT
-
Main power supply
Power
A1
GND
-
Ground
Power
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Ball
Signal
I/O
Function
Internal PULL UP
Type
F1
GND
-
Ground
Power
H1
GND
-
Ground
Power
L1
GND
-
Ground
Power
H2
GND
-
Ground
Power
L2
GND
-
Ground
Power
J3
GND
-
Ground
Power
K3
GND
-
Ground
Power
L3
GND
-
Ground
Power
K4
GND
-
Ground
Power
K5
GND
-
Ground
Power
D6
GND
-
Ground
Power
K6
GND
-
Ground
Power
L6
GND
-
Ground
Power
A11
GND
-
Ground
Power
F11
GND
-
Ground
Power
L11
GND
-
Ground
Power
RESERVED
A10
-
A3
-
A4
-
A5
-
A6
-
A7
-
A8
-
A9
-
B10
-
B11
-
B2
-
B8
-
B9
-
C4
-
C8
-
D2
-
D3
-
E1
-
E10
-
E3
-
E4
-
F2
-
F3
-
F4
-
G6
-
G7
-
H4
-
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Ball
Signal
I/O
Function
Internal PULL UP
Type
H7
-
J4
-
J6
-
J7
-
K9
-
L5
-
E5
-
L7
-
G5
-
G3
-
F8
-
C5
-
NOTE:
The GE864-QUAD has one DVI port on the system interface.
the DVI2 port as this minimizes the impact on the module functionality.
NOTE:
RESERVED pins must not be connected
NOTE:
If not used, almost all pins must be left disconnected. The only exceptions are the
following pins2:
2 RTS should be connected to the GND (on the module side) if flow control is not used.
pin
signal
J1,K1,J2,K2
VBATT
A1,F1,H1,L1,H2,L2,J3,K3,L3,
K4,K5,D6,K6,L6,A11,F11,L11
GND
J5
ON/OFF*
E7
TXD
A2
RESET*
H8
RXD
F7
RTS
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4.1.1. BGA Balls Layout
Top view
A
B
C
D
E
F
G
H
J
K
L
1
GND
TGPIO_19
TGPIO_01
TGPIO_11
-
GND
CHARGE
GND
VBATT
VBATT
GND
2
RESET*
-
TGPIO_03
-
VRTC
-
CHARGE
GND
VBATT
VBATT
GND
3
-
TGPIO_04
TGPIO_20
-
-
-
-
TGPIO_10
GND
GND
GND
4
--
TGPIO_14
-
SIMVCC
-
-
TGPIO_12
-
-
GND
Antenna
5
-
TGPIO_06 /
ALARM
VAUX1
-
TGPIO_15
-
TGPIO_17
ON_OFF*
GND
-
6
-
C125/RING
GND
TGPIO_02 /
JDR
C106 / CTS
-
TGPIO_16
-
GND
GND
7
-
C108 / DTR
DAC_OUT
DVI2_CLK
C103 / TXD
C105 / RTS
-
-
-
TGPIO_18
-
8
-
-
-
STAD_ LED
TGPIO_22
-
MIC_HF+
C104 / RXD
MIC_MT+
TGPIO_05 /
RFTXMON
PWRMON
9
-
-
TGPIO_09
C109 / DCD
SIMRST
AXE
MIC_MT-
EAR_MT-
MIC_HF-
-
TGPIO_07 /
BUZZER
10
-
-
SIMCLK
SIMIO
-
RX_TRACE
EAR_MT+
EAR_HF+
EAR_HF-
TGPIO_13
TGPIO_21
11
GND
-
SIMIN
TX_TRACE
C107 / DSR
GND
ADC_IN3
ADC_IN2
ADC_IN1
TGPIO_08
GND
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AUDIO Signals balls
SIM CARD interface balls
TRACE Signals balls
Prog. / data + Hw Flow Control signals balls
DAC and ADC signals balls
MISCELLANEOUS functions signals balls
TELIT GPIO balls
POWER SUPPLY VBATT balls
POWER SUPPLY GND balls
RESERVED
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5. Hardware Commands
5.1. Turning ON the GE864-QUAD
To turn on the GE864-QUAD the pad ON# must be tied low for at least 1 second and
then released.
The maximum current that can be drained from the ON# pad is 0,1 mA.
A simple circuit to do it is:
NOTE:
Do not use any pull up resistor on the ON# line, it is internally pulled up. Using pull
up resistor may bring to latch up problems on the GE864-QUAD power regulator and
improper power on/off of the module. The line ON# must be connected only in open
collector configuration.
NOTE:
In this document all the lines that are inverted, hence have active low signals are
labeled with a name that ends with a “#” or with a bar over the name.
NOTE:
The GE864-QUAD turns fully on also by supplying power to the Charge pad (Module
provided with a battery on the VBATT pads).
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A flow chart showing the proper turn on procedure is displayed below:
TIP:
To check if the device has powered on, the hardware line PWRMON must be
monitored. After 900ms the line raised up the device could be considered powered
on.
PWRMON line rises up also when supplying power to the Charge pad
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For example:
Let us assume you need to drive the ON# pad with a totem pole output of a +3/5 V
micro controller (uP_OUT1):
Let us assume you need to drive the ON# pad directly with an ON/OFF button:
5.2. Turning OFF the GE864-QUAD
The turning off of the device can be done in two ways:
via AT command (see GE864-QUAD Software User Guide)
by tying low pin ON#
Either ways, when the device issues a detach request to the network informing that
the device will not be reachable any more.
To turn OFF the GE864-QUAD the pad ON# must be tied low for at least 2 seconds
and then released.
The same circuitry and timing for the power on shall be used.
The device shuts down after the release of the ON# pad.
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TIP:
To check if the device has powered off, the hardware line PWRMON must be
monitored. When PWRMON goes low, the device has powered off.
5.2.1. Hardware Unconditional Restart
WARNING:
The hardware unconditional Restart must not be used during normal operation of the
device since it does not detach the device from the network. It shall be kept as an
emergency exit procedure to be done in the rare case that the device gets stacked
waiting for some network or SIM responses.
To unconditionally restart the GE864-QUAD, the pad RESET# must be tied low for at
least 200 milliseconds and then released.
The maximum current that can be drained from the ON# pad is 0.15 mA.
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A simple circuit to do it is:
NOTE:
Do not use any pull up resistor on the RESET# line nor any totem pole digital output.
Using pull up resistor may bring to latch up problems on the GE864-QUAD power
regulator and improper functioning of the module. The line RESET# must be
connected only in open collector configuration.
TIP:
The unconditional hardware Restart must always be implemented on the boards and
must be used by the software as an emergency exit procedure.
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The following flow chart shows the proper Reset procedure:
For example:
Let us assume you need to drive the RESET# pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT2):
This signal is internally pulled up so the pin can be left floating if not used.
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6. Power Supply
The power supply circuitry and board layout are a very important part in the full
product design and they strongly reflect on the product overall performances, hence
read carefully the requirements and the guidelines that will follow for a proper
design.
6.1. Power Supply Requirements
POWER SUPPLY
Nominal Supply Voltage
3.8 V
Normal Operating Voltage Range
3.4 V÷ 4.20 V
Extended Operating Voltage Range
3.22 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken in order
to fulfil min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with completely
assumption and application of the HW User guide suggestions.
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The table below shows the mod power consumptions:
GE864-QUAD
Mode
Average
(mA)
Mode description
SWITCHED OFF
Module supplied but Switched Off
Switched Off
<62uA
IDLE mode
AT+CFUN=1
19,0
Normal mode: full functionality of the module
AT+CFUN=4
18,0
Disabled TX and RX; module is not registered on the network
AT+CFUN=0 or =5
3,9
Paging Multiframe 2
2,9
Paging Multiframe 4
2,1
Paging Multiframe 6
1,9
Paging Multiframe 8
1,6
Paging Multiframe 9
CSD TX and RX mode
GSM VOICE CALL
GSM900 CSD PL5
305,0
DCS1800 CSD PL0
208,0
GPRS (class 10) 1TX
GPRS Sending data mode
GSM900 PL5
264,0
DCS1800 PL0
176,0
GPRS (class 10) 2TX
GPRS Sending data mode
GSM900 PL5
473,8
DCS1800 PL0
307,8
The GSM system is made in a way that the RF transmission is not continuous, else it
is packed into bursts at a base frequency of about 216 Hz, the relative current peaks
can be as high as about 2A. Therefore the power supply has to be designed in order
to withstand with these current peaks without big voltage drops; this means that both
the electrical design and the board layout must be designed for this current flow.
If the layout of the PCB is not well designed a strong noise floor is generated on the
ground and the supply; this will reflect on all the audio paths producing an audible
annoying noise at 216 Hz; if the voltage drop during the peak current absorption is
too much, then the device may even shutdown as a consequence of the supply
voltage drop.
TIP:
The power supply must be designed so that it is capable of a peak current output of
at least 2 A.
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6.2. General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
the electrical design
the thermal design
the PCB layout.
6.2.1. Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source
where this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
6.2.1.1. +5V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there is not a big
difference between the input source and the desired output and a linear
regulator can be used. A switching power supply will not be suited
because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in
order to dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in
order to cut the current absorption peaks close to the GE864-QUAD, a
100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a
tantalum one) is rated at least 10V.
A protection diode must be inserted close to the power input, in order to
save the GE864-QUAD from power polarity inversion.
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An example of linear regulator with 5V input is:
6.2.1.2. +12V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V; hence due to the big
difference between the input source and the desired output, a linear
regulator is not suited and shall not be used. A switching power supply
will be preferable because of its better efficiency especially with the 2A
peak current load represented by the GE864-QUAD.
When using a switching regulator, a 500kHz or more switching frequency
regulator is preferable because of its smaller inductor size and its faster
transient response. This allows the regulator to respond quickly to the
current peaks absorption.
In any case the frequency and Switching design selection is related to the
application to be developed due to the fact the switching frequency could
also generate EMC interferences.
For car PB battery the input voltage can rise up to 15.8V and this must be
kept in mind when choosing components: all components in the power
supply must withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in
order to cut the current absorption peaks, a 100μF tantalum capacitor is
usually suited.
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Make sure the low ESR capacitor on the power supply output (usually a
tantalum one) is rated at least 10V.
For Car applications a spike protection diode must be inserted close to
the power input, in order to clean the supply from spikes.
A protection diode must be inserted close to the power input, in order to
save the GE864-QUAD from power polarity inversion. This can be the
same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic (it is split
in 2 parts):
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6.2.1.3. Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.5 V , hence a single 3.7V Li-Ion cell battery type is suited for supplying
the power to the Telit GE864-QUAD module.
CAUTION:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT
BE USED DIRECTLY since their maximum voltage can rise over the absolute
maximum voltage for the GE864-QUAD and damage it.
CAUTION:
DO NOT USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE864-
QUAD. Their use can lead to overvoltage on the GE864-QUAD and damage it. USE
ONLY Li-Ion battery types.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode must be inserted close to the power input, in order to save the
GE864-QUAD from power polarity inversion. Otherwise the battery connector must be
done in a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks
of 2A; the suggested capacity is from 500mAh to 1000mAh.
6.2.1.4. Battery Charge Control Circuitry Design Guidelines
The charging process for Li-Ion Batteries can be divided into 4 phases:
Qualification and trickle charging
Fast charge 1 – constant current
Final charge – constant voltage or pulsed charging
Maintenance charge
The qualification process consists in a battery voltage measure, indicating roughly its
charge status. If the battery is deeply discharged, that means its voltage is lower
than the trickle charging threshold, then the charge must start slowly possibly with a
current limited pre-charging process where the current is kept very low with respect
to the fast charge value: the trickle charging.
During the trickle charging the voltage across the battery terminals rises; when it
reaches the fast charge threshold level the charging process goes into fast charge
phase.
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During the fast charge phase the process proceeds with a current limited charging;
this current limit depends on the required time for the complete charge and from the
battery pack capacity. During this phase the voltage across the battery terminals still
raises but at a lower rate.
Once the battery voltage reaches its maximum voltage then the process goes into its
third state: Final charging. The voltage measure to change the process status into
final charge is very important. It must be ensured that the maximum battery voltage
is never exceeded, otherwise the battery may be damaged and even explode.
Moreover for the constant voltage final chargers, the constant voltage phase (final
charge) must not start before the battery voltage has reached its maximum value,
otherwise the battery capacity will be highly reduced.
The final charge can be of two different types: constant voltage or pulsed. GE864-
QUAD uses constant voltage.
The constant voltage charge proceeds with a fixed voltage regulator (very accurately
set to the maximum battery voltage) and hence the current will decrease while the
battery is becoming charged. When the charging current falls below a certain
fraction of the fast charge current value, then the battery is considered fully charged,
the final charge stops and eventually starts the maintenance.
The pulsed charge process has no voltage regulation, instead the charge continues
with pulses. Usually the pulse charge works in the following manner: the charge is
stopped for some time, let us say few hundreds of ms, then the battery voltage will
be measured and when it drops below its maximum value a fixed time length
charging pulse is issued. As the battery approaches its full charge the off time will
become longer, hence the duty-cycle of the pulses will decrease. The battery is
considered fully charged when the pulse duty-cycle is less than a threshold value,
typically 10%, the pulse charge stops and eventually the maintenance starts.
The last phase is not properly a charging phase, since the battery at this point is fully
charged and the process may stop after the final charge. The maintenance charge
provides an additional charging process to compensate for the charge leak typical of
a Li-Ion battery. It is done by issuing pulses with a fixed time length, again few
hundreds of ms, and a duty-cycle around 5% or less.
This last phase is not implemented in the GE864-QUAD internal charging algorithm,
so that the battery once charged is left discharging down to a certain threshold so
that it is cycled from full charge to slight discharge even if the battery charger is
always inserted. This guarantees that anyway the remaining charge in the battery is a
good percentage and that the battery is not damaged by keeping it always fully
charged (Li-Ion rechargeable battery usually deteriorates when kept fully charged).
Last but not least, in some applications it is highly desired that the charging process
restarts when the battery is discharged and its voltage drops below a certain
threshold, GE864-QUAD internal charger does it.
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As you can see, the charging process is not a trivial task to be done; moreover all
these operations must start only if battery temperature is inside a charging range,
usually 5°C – 45°C.
The GE864-QUAD measures the temperature of its internal component, in order to
satisfy this last requirement, it is not exactly the same as the battery temperature
but in common application the two temperature must not differ too much and the
charging temperature range must be guaranteed.
NOTE:
For all the threshold voltages, inside the GE864-QUAD all thresholds are fixed in
order to maximize Li-Ion battery performances and do not need to be changed.
NOTE:
In this application the battery charger input current must be limited to less than
400mA. This can be done by using a current limited wall adapter as the power
source.
NOTE:
When starting the charger from Module powered off the startup will be in CFUN4; to
activate the normal mode a command AT+CFUN=1 has to be provided. This is also
possible using the POWER ON.
There is also the possibility to activate the normal mode using the ON_OFF* signal.
In this case, when HW powering off the module with the same line (ON_OFF*) and
having the charger still connected, the module will go back to CFUN4.
NOTE:
It is important having a 100uF Capacitor to VBAT in order to avoid instability of the
charger circuit if the battery is accidentally disconnected during the charging activity.
6.2.2. Thermal Design Guidelines
The thermal design for the power supply heat sink must be done with the following
specifications:
Average current consumption during transmission @ max PWR level:
500mA
Average current consumption during transmission @ min PWR level:
100mA
Average current during Power Saving (CFUN=5): 4mA
Average current during idle (Power Saving disabled): 24mA
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NOTE:
The average consumption during transmissions depends on the power level at which
the device is requested to transmit by the network. The average current consumption
hence varies significantly.
Considering the very low current during idle, especially if Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device
absorbs current significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let us
say few minutes) and then remains for a quite long time in idle (let us say one hour),
then the power supply has always the time to cool down between the calls and the
heat sink could be smaller than the calculated one for 500mA maximum RMS
current, or even could be the simple chip package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a
lower power level than the maximum and hence the current consumption will be less
than the 500mA, being usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground
plane where the power supply chip is placed can be enough to ensure a good thermal
condition and avoid overheating.
For the heat generated by the GE864-QUAD, you can consider it to be during
transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS
upload.
This generated heat will be mostly conducted to the ground plane under the GE864-
QUAD; you must ensure that your application can dissipate it.
6.2.3. Power Supply PCB Layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to cut the current peaks and a protection diode on the input
to protect the supply from spikes and polarity inversion. The placement of these
components is crucial for the correct working of the circuitry. A misplaced
component can be useless or can even decrease the power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit GE864-
QUAD power input pads or in the case the power supply is a switching type
it can be placed close to the inductor to cut the ripple provided the PCB
trace from the capacitor to the GE864-QUAD is wide enough to ensure a
dropless connection even during the 2A current peaks.
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The protection diode must be placed close to the input connector where
the power source is drained.
The PCB traces from the input connector to the power regulator IC must
be wide enough to ensure no voltage drops occur when the 2A current
peaks are absorbed. Note that this is not made in order to save power
loss but especially to avoid the voltage drops on the power line at the
current peaks frequency of 216 Hz that will reflect on all the components
connected to that supply, introducing the noise floor at the burst base
frequency. For this reason while a voltage drop of 300-400 mV may be
acceptable from the power loss point of view, the same voltage drop may
not be acceptable from the noise point of view. If your application does not
have audio interface but only uses the data feature of the Telit GE864-
QUAD, then this noise is not so disturbing and power supply layout design
can be more forgiving.
The PCB traces to the GE864-QUAD and the Bypass capacitor must be
wide enough to ensure no significant voltage drops occur when the 2A
current peaks are absorbed. This is for the same reason as previous
point. Try to keep this trace as short as possible.
The PCB traces connecting the Switching output to the inductor and the
switching diode must be kept as short as possible by placing the inductor
and the diode very close to the power switching IC (only for switching
power supply). This is done in order to reduce the radiated field (noise) at
the switching frequency (100-500 kHz usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board must be done in such a
way to guarantee that the high current return paths in the ground plane
are not overlapped to any noise sensitive circuitry as the microphone
amplifier/buffer or earphone amplifier.
The power supply input cables must be kept separate from noise sensitive
lines such as microphone/earphone cables.
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7. Antenna
The antenna connection and board layout design are the most important part in the
full product design and they strongly reflect on the product overall performances,
hence read carefully and follow the requirements and the guidelines for a proper
design.
7.1. GSM Antenna Requirements
As suggested on the Product Description the antenna and antenna line on PCB for a
Telit GE864-QUAD device shall fulfill the following requirements:
ANTENNA REQUIREMENTS
Frequency range
Depending by frequency band(s) provided
by the network operator, the customer
shall use the most suitable antenna for
that/those band(s)
Bandwidth
70 MHz in GSM850, 80 MHz in GSM900,
170 MHz in DCS & 140 MHz PCS band
Gain
Gain < 3dB
i
Impedance
50 Ω
Input power
> 2 W peak power
VSWR absolute
max
<= 10:1
VSWR
recommended
<= 2:1
When using the Telit GE864-QUAD, since there is no antenna connector on the
module, the antenna must be connected to the GE864-QUAD through the PCB with
the antenna pad.
In the case that the antenna is not directly developed on the same PCB, hence
directly connected at the antenna pad of the GE864-QUAD, then a PCB line is needed
in order to connect with it or with its connector.
This line of transmission shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Impedance
50 Ω
Max Attenuation
0,3 dB
No coupling with other signals allowed
Cold End (Ground Plane) of antenna shall be
equipotential to the GE864-QUAD ground pins
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Furthermore if the device is developed for the US market and/or Canada market, it
shall comply to the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. The antenna(s) used
for this transmitter must be installed to provide a separation distance of at least 20
cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter. End-Users must be provided with transmitter
operation conditions for satisfying RF exposure compliance. OEM integrators must
ensure that the end user has no manual instructions to remove or install the GE864-
QUAD module. Antennas used for this OEM module must not exceed 3dBi gain for
mobile and fixed operating configurations.
7.2. GSM Antenna PCB Line Guidelines
Ensure that the antenna line impedance is 50Ω;
Keep the antenna line on the PCB as short as possible, since the antenna
line loss shall be less than 0,3 dB;
Antenna line must have uniform characteristics, constant cross section,
avoid meanders and abrupt curves;
Keep, if possible, one layer of the PCB used only for the Ground plane;
Surround (on the sides, over and under) the antenna line on PCB with
Ground, avoid having other signal tracks facing directly the antenna line
track;
The ground around the antenna line on PCB has to be strictly connected
to the Ground Plane by placing vias once per 2mm at least;
Place EM noisy devices as far as possible from GE864-QUAD antenna line;
Keep the antenna line far away from the GE864-QUAD power supply lines;
If you have EM noisy devices around the PCB hosting the GE864-QUAD
such as fast switching ICs, take care of the shielding of the antenna line
by burying it inside the layers of PCB and surround it with Ground planes,
or shield it with a metal frame cover.
If you do not have EM noisy devices around the PCB of GE864-QUAD, by
using a strip-line on the superficial copper layer for the antenna line, the
line attenuation will be lower than a buried one;
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7.3. GSM Antenna Installation Guidelines
Install the antenna in a place covered by the GSM signal.
The Antenna must be installed to provide a separation distance of at least
20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter;
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer
instructions.
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8. Logic Level Specifications
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic
levels. The following table shows the logic level specifications used in the Telit
GE864-QUAD interface circuits:
Absolute Maximum Ratings –Not Functional
Parameter
Min
Max
Input level on any
digital pin when on
-0.3V
+3.6V
Input voltage on analog
pins when on
-0.3V
+3.0 V
Operating Range – Interface Levels (2.8V CMOS)
Level
Min
Max
Input high level
2.1V
3.3V
Input low level
0V
0.5V
Output high level
2.2V
3.0V
Output low level
0V
0.35V
For 1.8V signals:
Operating Range – Interface Levels (1.8V CMOS)
Level
Min
Max
Input high level
1.6V
2.2V
Input low level
0V
0.4V
Output high level
1,65V
2.2V
Output low level
0V
0.35V
Current Characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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8.1. Reset Signal
Signal
Function
I/O
Bga Ball
RESET
Phone reset
I
A2
RESET is used to reset the GE864-QUAD modules. Whenever this signal is pulled low,
the GE864-QUAD is reset. When the device is reset it stops any operation. After the
release of the reset GE864-QUAD is unconditionally shut down, without doing any
detach operation from the network where it is registered. This behavior is not a
proper shut down because any GSM device is requested to issue a detach request on
turn off. For this reason the Reset signal must not be used to normally shutting down
the device, but only as an emergency exit in the rare case the device remains stuck
waiting for some network response.
The RESET is internally controlled on start-up to achieve always a proper power-on
reset sequence, so there is no need to control this pin on start-up. It may only be
used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the GE864-QUAD. Use the ON/OFF signal to
perform this function or the AT#SHDN command.
Reset Signal Operating Levels:
Signal
Min
Max
RESET Input high
2.0V*
2.2V
RESET Input low
0V
0.2V
This signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be
connected with an open collector transistor, to permit to the internal circuitry the
power on reset and under voltage lockout functions.
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9. Serial Ports
The serial port on the Telit GE864-QUAD is the core of the interface between the
module and OEM hardware.
2 serial ports are available on the module:
MODEM SERIAL PORT
MODEM SERIAL PORT 2 (DEBUG)
9.1. Modem Serial Port
Several configurations can be designed for the serial port on the OEM hardware, but
the most common are:
RS232 PC com port
Micro controller UART @ 2.8V – 3V (Universal Asynchronous Receive
Transmit)
Micro controller UART@ 5V or other voltages different from 2.8V
Depending from the type of serial port on the OEM hardware a level translator circuit
may be needed to make the system work. The only configuration that does not need a
level translation is the 2.8V UART.
The serial port on the GE864-QUAD is a +2.8V UART with all the 7 RS232 signals. It
differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The
levels for the GE864-QUAD UART are the CMOS levels:
Absolute Maximum Ratings – Not Functional
Parameter
Min
Max
Input level on any
digital pad when on
-0.3V
+3.6V
Input voltage on
analog pads when on
-0.3V
+3.0 V
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Operating Range – Interface Levels (2.8V CMOS)
Level
Min
Max
Input high level VIH
2.1V
3.3V
Input low level VIL
0V
0.5V
Output high level VOH
2.2V
3.0V
Output low level VOL
0V
0.35V
The table below shows the signals of the GE864 serial port:
RS232 Pin
Number
Signal
GE864-QUAD
Pad Number
Name
Usage
1
DCD
dcd_uart
D9
Data Carrier Detect
Output from the GE864-QUAD that indicates the
carrier presence
2
RXD
tx_uart
H8
Transmit line *
see Note
Output transmit line of GE864-QUAD UART
3
TXD
rx_uart
E7
Receive line *see Note
Input receive of the GE864-QUAD UART
4
DTR
dtr_uart
B7
Data Terminal Ready
Input to the GE864-QUAD that controls the DTE
READY condition
5
GND
A1,F1,H1,L1, H2,
Ground
ground
6
DSR
dsr_uart
E11
Data Set Ready
Output from the GE864-QUAD that indicates the
module is ready
7
RTS
rts_uart
F7
Request to Send
Input to the GE864-QUAD that controls the
Hardware flow control
8
CTS
cts_uart
F6
Clear to Send
Output from the GE864-QUAD that controls the
Hardware flow control
9
RI
ri_uart
B6
Ring Indicator
Output from the GE864-QUAD that indicates the
incoming call condition
*NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore
on the GE864 side these signal are on the opposite direction: TXD on the application
side will be connected to the receive line (here named TXD/ rx_uart ) of the GE864
serial port and vice versa for RX.
TIP:
For a minimum implementation, only the TXD and RXD lines can be connected, the
other lines can be left open provided a software flow control is implemented.
TIP:
In order to avoid noise or interferences on the RXD lines it is suggested to add a pull
up resistor (100K Ω to 2.8V)
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9.2. RS232 Level Translation
In order to interface the Telit GE864 with a PC com port or a RS232 (EIA/TIA-232)
application a level translator is required. This level translator must
invert the electrical signal in both directions
change the level from 0/3V to +15/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with
lower levels on the RS232 side (EIA/TIA-562) , allowing for a lower voltage-
multiplying ratio on the level translator. Note that the negative signal voltage must
be less than 0V and hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip
level translator. There are a multitude of them, differing in the number of driver and
receiver and in the levels (be sure to get a true RS232 level translator not a RS485 or
other standards).
By convention the driver is the level translator from the 0-3V UART level to the RS232
level, while the receiver is the translator from RS232 level to 0-3V UART.
In order to translate the whole set of control lines of the UART you will need:
5 driver
3 receiver
NOTE:
The digital input lines working at 2.8VCMOS have an absolute maximum input voltage
of 3,75V; therefore the level translator IC shall not be powered by the +3.8V supply of
the module. Instead it shall be powered from a +2.8V / +3.0V (dedicated) power
supply.
This is because in this way the level translator IC outputs on the module side (i.e.
GE864 inputs) will work at +3.8V interface levels, stressing the module inputs at its
maximum input voltage.
This can be acceptable for evaluation purposes, but not on production devices.
NOTE:
In order to be able to do in circuit reprogramming of the GE864 firmware, the serial
port on the Telit GE864 shall be available for translation into RS232 and either it is
controlling device shall be placed into tristate, disconnected or as a gateway for the
serial data when module reprogramming occurs.
Only RXD, TXD, GND and the On/off module turn on pad are required to the
reprogramming of the module, the other lines are unused.
All applicator shall include in their design such a way of reprogramming the GE864.
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An example of level translation circuitry of this kind is:
The RS232 serial port lines are usually connected to a DB9 connector with the
following layout:
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9.3. 5V UART Level Translation
If the OEM application uses a microcontroller with a serial port (UART) that works at
a voltage different from 2.8 – 3V, then a circuitry has to be provided to adapt the
different levels of the two sets of signals. As for the RS232 translation there are a
multitude of single chip translators. For example a possible translator circuit for a 5V
TRANSMITTER/RECEIVER can be:
TIP:
This logic IC for the level translator and 2.8V pull-ups (not the 5V one) can be
powered directly from VAUX line of the GE864-QUAD. Note that the TC7SZ07AE has
open drain output; therefore the resistor R2 is mandatory.
TIP:
The UART input line TXD (rx_uart) of the GE864-QUAD is NOT internally pulled up
with a resistor, so there may be the need to place an external 47KΩ pull-up resistor,
either the DTR (dtr_uart) and RTS (rts_uart) input lines are not pulled up internally,
so an external pull-up resistor of 47KΩ may be required.
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A power source of the internal interface voltage corresponding to the 2.8VCMOS high
level is available at the VAUX pin on the connector,
A maximum of 9 resistors of 47 KΩ pull-up can be connected to the PWRMON pin,
provided no other devices are connected to it and the pulled-up lines are GE864-
QUAD input lines connected to open collector outputs in order to avoid latch-up
problems on the GE864-QUAD.
Care must be taken to avoid latch-up on the GE864-QUAD and the use of this output
line to power electronic devices shall be avoided, especially for devices that generate
spikes and noise such as switching level translators, micro controllers, failure in any
of these condition can severely compromise the GE864-QUAD functionality.
NOTE:
The input lines working at 2.8VCMOS can be pulled-up with 47KΩ resistors that can
be connected directly to the VAUX line provided they are connected as in this
example.
In case of reprogramming of the module has to be considered the use of the RESET
line to start correctly the activity.
The preferable configuration is having an external supply for the buffer.
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10. Audio Section Overview
The Baseband chip was developed for the cellular phones, which needed two
separated amplifiers both in RX and in TX section.
A couple of amplifiers had to be used with internal audio transducers while the other
couple of amplifiers had to be used with external audio transducers.
To distinguish the schematic signals and the Software identifiers, two different
definitions were introduced, with the following meaning:
internal audio transducers
HS/MT
(from HandSet or MicroTelephone )
external audio transducers
HF
(from HandsFree )
Actually the acronyms have not the original importance.
In other words this distinction is not necessary, being the performances between the
two blocks like the same.
Only if the customer needs higher output power to the speaker , he has a constraint.
Otherwise the choice could be done in order to overcome the PCB design difficulties.
For these reasons we have not changed the HS and HF acronyms, keeping them in
the Software and on the schematics.
The Base Band Chip of the GE864Telit Module maintains the same architecture.
For more information refer to Telit document :
“
80000NT10007a Audio Settings Application Note
“.
1.1 Selection mode
Only one block can be active at a time , and the activation of the requested audio
path is done via hardware by
AXE
line or via software by
AT#CAP
command .
Moreover the Sidetone functionality could be implemented by the amplifier fitted
between the transmit path and the receive path, enabled at request in both modes.
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Audio Section Block Diagram
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1.2 Electrical Characteristics
TIP: Being the microphone circuitry the more noise sensitive, its design and layout
must be done with particular care. Both microphone paths are balanced and the OEM
circuitry must be balanced designed to reduce the common mode noise typically
generated on the ground plane. However the customer can use the unbalanced
circuitry for particular application.
10.1.1. Input Lines Characteristics
differential microphone paths
Line Coupling
AC*
Line Type
Balanced
Coupling capacitor
≥ 100nF
Differential input resistance
50kΩ
Differential input voltage
≤ 1,03Vpp @
MicG=0dB
(*) WARNING : AC means that the signals from the microphone have to be
connected to input lines of the module through capacitors which value has to
be ≥ 100nf. not respecting this constraint, the input stages will be damaged.
WARNING: when particular OEM application needs a
Single Ended Input
configuration, it is forbidden connecting the unused input directly to Ground,
but only through a 100nF capacitor. in Single Ended configuration
the useful input signal will be halved.
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1.2.1 Output Lines Characteristics
TIP:
We suggest driving the load differentially from both output drivers, thus the output
swing will double and the need for the output coupling capacitor avoided. However if
particular OEM application needs also a Single Ended circuitry can be implemented,
but the output power will be reduced four times.
The OEM circuitry shall be designed to reduce the common mode noise typically
generated on the ground plane and to get the maximum power output from the
device (low resistance tracks).
WARNING:
The loads are directly connected to the amplifier outputs when in
Differential
configuration, through a capacitor when in
Single Ended
configuration. Using Single
Ended configuration, the unused output line must be left open. Not respecting this
constraint, the output stage will be damaged.
TIP:
Remember that there are slightly different electrical performances between the two
internal audio amplifiers:
the
Ear_MT
lines
can directly drive a
16
Ω
load
at 12dBFS (**) in
Differential
configuration
Ear_HF
lines can directly drive a
16
Ω
load
in
Differential
or
Single Ended
configurations
There is no difference if the amplifiers drive an external amplifier
(**)
0dBFS
is the normalized overall Analog Gain for each Output channel equal to
3,7Vpp
differential
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“EAR_MT” Output Lines
line coupling
AC single-ended
DC differential
output load resistance
≥ 14 Ω
internal output resistance
4 Ω (
typical
)
signal bandwidth
150 - 4000 Hz @ -3 dB
max. differential output voltage
1.31 Vrms (
typical, open circuit
)
differential output voltage
328mVrms /16 Ω /
@ -12dBFS
volume increment
2 dB per step
volume steps
10
“EAR_HF” Output Lines
line coupling:
AC single-ended
DC differential
output load resistance :
≥ 14 Ω
internal output resistance:
4 Ω (>1,7 Ω)
signal bandwidth:
150 - 4000 Hz @ -3 dB
max. differential output
voltage
1.31 Vrms (
typical, open circuit
)
max. S.E. output voltage
656 mVrms (
typical, open circuit
)
volume increment
2 dB per step
volume steps
10
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11. External SIM Holder Implementation
Please refer to the related Telit User Guide :
“
80000NT10001a SIM Holder Design Guides
”
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12. General Purpose I/O
The general purpose I/O pads can be configured to act in three different ways:
input
output
alternate function (internally controlled)
Input pads can only be read and report the digital value (high or low) present on the
pad at the read time; output pads can only be written or queried and set the value of
the pad output; an alternate function pad is internally controlled by the GE864-QUAD
firmware and acts depending on the function implemented. For Logic levels please
refer to chapter 7.
The following GPIO are available on the GE864-QUAD:
Ball
Signal
I/O
Function
Type
Input /
output
current
Default
State
ON_OFF
state
State
during
Reset
Note
C1
TGPIO_01
I/O
GPIO01 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
E6
TGPIO_02
I/O
GPIO02 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
Alternate function
(JDR)
C2
TGPIO_03
I/O
GPIO03 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
B3
TGPIO_04
I/O
GPIO04 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
Alternate function
(RF Transmission
Control)
K8
TGPIO_05
I/O
GPIO05 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
Alternate function
(RFTXMON)
B5
TGPIO_06
I/O
GPIO06 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
Alternate function
(ALARM)
L9
TGPIO_07
I/O
GPIO07 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
Alternate function
(BUZZER)
K11
TGPIO_08
I/O
GPIO08 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
C9
TGPIO_09
I/O
GPIO09 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
H3
TGPIO_10
I/O
GPIO10 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
D1
TGPIO_11
I/O
GPIO11 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
G4
TGPIO_12
I/O
GPIO12 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
K10
TGPIO_13
I/O
GPIO13 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
B4
TGPIO_14
I/O
GPIO14 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
F5
TGPIO_15
I/O
GPIO15 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
H6
TGPIO_16
I/O
GPIO16 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
H5
TGPIO_17
I/O
GPIO17 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
K7
TGPIO_18
I/O
GPIO18 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
B1
TGPIO_19
I/O
GPIO19 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
C3
TGPIO_20
I/O
GPIO20 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
0
L10
TGPIO_21
I/O
GPIO21 Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
1
E8
TGPIO_22
I/O
GPIO22 Configurable GPIO
CMOS 1.8V
(not 2.8V !!)
1uA / 1mA
INPUT
0
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Not all GPIO pads support all these three modes:
GPIO2 supports all three modes and can be input, output, Jamming Detect
Output (Alternate function)
GPIO4 supports all three modes and can be input, output, RF
Transmission Control (Alternate function)
GPIO5 supports all three modes and can be input, output, RFTX monitor
output (Alternate function)
GPIO6 supports all three modes and can be input, output, alarm output
(Alternate function)
GPIO7 supports all three modes and can be input, output, buzzer output
(Alternate function)
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12.1. GPIO Logic Levels
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic
levels.
The following tables show the logic level specifications used in the GE864-QUAD
interface circuits:
Absolute Maximum Ratings – Not Functional
Parameter
Min
Max
Input level on any
digital pin when on
-0.3V
+3.6V
Input voltage on
analog pins when on
-0.3V
+3.0 V
Operating Range – Interface Levels (2.8V CMOS)
Level
Min
Max
Input high level
2.1V
3.3V
Input low level
0V
0.5V
Output high level
2.2V
3.0V
Output low level
0V
0.35V
For 1.8 V signals:
Operating Range – Interface Levels (1.8V CMOS)
Level
Min
Max
Input high level
1.6V
2.2V
Input low level
0V
0.4V
Output high level
1,65V
2.2V
Output low level
0V
0.35V
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12.2. Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another
device and report its status, provided this device has interface levels compatible with
the 2.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has
interface levels different from the 2.8V CMOS, then it can be buffered with an open
collector transistor with a 47K pull up to 2.8V.
12.3. Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or
compatible hardware. When set as outputs, the pads have a push-pull output and
therefore the pull-up resistor may be omitted.
The illustration below shows the base circuit of a push-pull stage:
12.4. Using the RF Transmission Control GPIO4
The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable
the Transmitter when the GPIO is set to Low by the application.
In the design is necessary to add a pull up resistor (47K to VAUX).
12.5. Using the RFTXMON Output GPIO5
The GPIO5 pin, when configured as RFTXMON Output, is controlled by the GE864-
QUAD module and will rise when the transmitter is active and fall after the
transmitter activity is completed.
For example, if a call is started, the line will be HIGH during all the conversation and
it will be again LOW after hanged up.
The line rises up 300ms before first TX burst and will became again LOW from 500ms
to 1sec after last TX burst.
Q1
Q2
VDD
GPIO7
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12.6. Using the Alarm Output GPIO6
The GPIO6 pad, when configured as Alarm Output, is controlled by the GE864-QUAD
module and will rise when the alarm starts and fall after the issue of a dedicated AT
command.
This output can be used to power up the GE864-QUAD controlling micro controller or
application at the alarm time, giving you the possibility to program a timely system
wake-up to achieve some periodic actions and completely turn off either the
application and the GE864-QUAD during sleep periods, dramatically reducing the
sleep consumption to few μA.
In battery-powered devices this feature will greatly improve the autonomy of the
device.
NOTE:
During RESET the line is set to HIGH logic level.
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12.7. Using the Buzzer Output GPIO7
As
Alternate Function
, the GPIO7 is controlled by the firmware that depends on the
function implemented internally.
This setup places always the GPIO7 pin in
OUTPUT
direction and the corresponding
function must be activated properly by AT#SRP command (refer to
AT commands
specification
).
Also in this case, the
dummy value
for the pin state can be both “
0
” or “
1
”.
Send the command AT#GPIO=7, 1, 2<cr>:
Wait for response OK
Send the command AT#SRP=3
The GPIO7 pin will be set as
Alternate Function
pin with its dummy logic status set to
HIGH
value.
The "
Alternate function
” permits your application to easily implement
Buzzer
feature
with some small hardware extension of your application as shown in the
sample figure below.
Example of Buzzer
’
s driving circuit
NOTE:
To correctly drive a buzzer, a driver must be provided; its characteristics depend on
the Buzzer and for them refer to your buzzer vendor.
TR1
BCR141W
TR2
SMBT2907A
R1
4,7K
R2
1K
D1
D1N4148 C1
33pF +
-
+V buzzer
GPIO7
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12.8. Magnetic Buzzer Concepts
12.8.1. Short Description
A magnetic Buzzer is a sound-generating device with a coil located in the magnetic
circuit consisting of a permanent magnet, an iron core, a high permeable metal disk,
and a vibrating diaphragm.
Drawing of the Magnetic Buzzer
The disk and diaphragm are attracted to the core by the magnetic field. When an
oscillating signal is moved through the coil, it produces a fluctuating magnetic field,
which vibrates the diaphragm at a frequency of the drive signal. Thus the sound is
produced relative to the frequency applied.
Diaphragm movement
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12.8.2. Frequency Behavior
The frequency behavior represents the effectiveness of the reproduction of the
applied signals.
Because its performance is related to a square driving waveform (whose amplitude
varies from 0V to Vpp), if you modify the waveform (e.g. from square to sinus) the
frequency response will change.
12.8.3. Power Supply Influence
Applying a signal whose amplitude is different from that suggested by manufacturer,
the performance change following the rule:
“
if resonance frequency f
o
increases, amplitude decreases
”.
Because of resonance frequency depends from acoustic design, lowering the
amplitude of the driving signal the response bandwidth tends to become narrow, and
vice versa.
Summarizing: Vpp ↑ fo ↓ Vpp ↓ fo ↑
The risk is that the
f
o could easily fall outside of new bandwidth; consequently the
SPL could be much lower than the expected.
WARNING:
It is very important to respect the sense of the applied voltage: never apply to the "-"
pin a voltage more positive than the "+" pin: if this happens, the diaphragm vibrates
in the opposite direction with a high probability to be expelled from its physical
position. This damages the device permanently.
12.8.4. Working Current Influence
In the component data sheet you will find the value of MAX CURRENT that represents
the maximum average current that can flow at nominal voltage without current
limitation.
In other words it is not the peak current, which could be twice or three times higher.
If driving circuitry does not support these peak values, the SPL will never reach the
declared level or the oscillations will stop.
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12.9. Using the Temperature Monitor Function
12.9.1. Short Description
The Temperature Monitor is a function of the module that permits to control its
internal temperature and if properly set (see the #TEMPMON command on AT
Interface guide) it raise to High Logic level a GPIO when the maximum temperature
is reached.
12.9.2. Allowed GPIO
The AT#TEMPMON set command could be used with one of the following GPIO:
Ball
Signal
Function
Type
Input /
output
current
Note
C1
TGPIO_01
GPIO01 Configurable GPIO
CMOS 2.8V
1μA / 1mA
C2
TGPIO_03
GPIO03 Configurable GPIO
CMOS 2.8V
1μA / 1mA
K11
TGPIO_08
GPIO08 Configurable GPIO
CMOS 2.8V
1μA / 1mA
C9
TGPIO_09
GPIO09 Configurable GPIO
CMOS 2.8V
1μA / 1mA
H3
TGPIO_10
GPIO10 Configurable GPIO
CMOS 2.8V
1μA / 1mA
D1
TGPIO_11
GPIO11 Configurable GPIO
CMOS 2.8V
1μA / 1mA
G4
TGPIO_12
GPIO12 Configurable GPIO
CMOS 2.8V
1μA / 1mA
K10
TGPIO_13
GPIO13 Configurable GPIO
CMOS 2.8V
1μA / 1mA
B4
TGPIO_14
GPIO14 Configurable GPIO
CMOS 2.8V
1μA / 1mA
F5
TGPIO_15
GPIO15 Configurable GPIO
CMOS 2.8V
1μA / 1mA
H6
TGPIO_16
GPIO16 Configurable GPIO
CMOS 2.8V
1μA / 1mA
H5
TGPIO_17
GPIO17 Configurable GPIO
CMOS 2.8V
1μA / 1mA
K7
TGPIO_18
GPIO18 Configurable GPIO
CMOS 2.8V
1μA / 1mA
B1
TGPIO_19
GPIO19 Configurable GPIO
CMOS 2.8V
1μA / 1mA
C3
TGPIO_20
GPIO20 Configurable GPIO
CMOS 2.8V
1μA / 1mA
E8
TGPIO_22
GPIO22 Configurable GPIO
CMOS 1.8V
(not 2.8V !!)
1μA / 1mA
The set command could be used also with one of the following GPIO but in that case
the alternate function is not usable:
Ball
Signal
Function
Type
Input /
output
current
Note
E6
TGPIO_02
GPIO02 Configurable GPIO
CMOS 2.8V
1μA / 1mA
Alternate function (JDR)
B3
TGPIO_04
GPIO04 Configurable GPIO
CMOS 2.8V
1μA / 1mA
Alternate function (RF
Transmission Control)
K8
TGPIO_05
GPIO05 Configurable GPIO
CMOS 2.8V
1μA / 1mA
Alternate function (RFTXMON)
L9
TGPIO_07
GPIO07 Configurable GPIO
CMOS 2.8V
1μA / 1mA
Alternate function (BUZZER)
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12.10. Indication of Network Service Availability
The STAT_LED pin status shows information on the network service availability and
Call status.
In the GE864 modules, the STAT_LED usually needs an external transistor to drive an
external LED.
Therefore, the status indicated in the following table is reversed with respect to the
pin status.
LED status
Device Status
Permanently off
Device off
Fast blinking
(Period 1s, Ton 0,5s)
Net search / Not registered /
turning off
Slow blinking
(Period 3s, Ton 0,3s)
Registered full service
Permanently on
a call is active
A schematic example could be:
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12.11. RTC Bypass Out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest
of the digital part, allowing having only RTC going on when all the other parts of the
device are off.
To this power output a backup capacitor can be added in order to increase the RTC
autonomy during power off of the battery. NO Devices must be powered from this pin.
12.12. VAUX1 Power Output
A regulated power supply output is provided in order to supply small devices from
the module.
This output is active when the module is ON and goes OFF when the module is shut
down.
The operating range characteristics of the supply are:
Operating Range – VAUX1 power supply
Min
Typical
Max
Output voltage
2.75V
2.85V
2.95V
Output current
100mA
Output bypass capacitor
(inside the module)
2.2μF
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13. DAC and ADC Section
13.1. DAC Converter
13.1.1. Description
The GE864-QUAD module provides a Digital to Analog Converter. The signal (named
DAC_OUT) is available on BGA Ball C7 of the GE864-QUAD module and on pin 17 of
PL102 on EVK2 Board (CS1152).
The on board DAC is a 10-bit converter, able to generate a analogue value based a
specific input in the range from 0 up to 1023. However, an external low-pass filter is
necessary
Min
Max
Units
Voltage range (filtered)
0
2,6
Volt
Range
0
1023
Steps
The precision is 10 bits so, if we consider that the maximum voltage is 2V, the
integrated voltage could be calculated with the following formula:
Integrated output voltage = 2 * value / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to
obtain an analog voltage.
13.1.2. Enabling DAC
The AT command below is available to use the DAC function:
AT#DAC[=<enable>[,<value>]]
<value> – scale factor of the integrated output voltage (0..1023 – 10 bit precision)
it must be present if <enable>=1
Refer to SW User Guide or AT Commands Reference Guide for the full description of
this function.
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
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13.1.3. Low Pass Filter Example
13.2. ADC Converter
13.2.1. Description
The on board A/D are 11-bit converter. They are able to read a voltage level in the
range of 0÷2 volts applied on the ADC pin input, store and convert it into 11 bit word.
Min
Max
Units
Input Voltage range
0
2
Volt
AD conversion
-
11
bits
Resolution
-
< 1
mV
The GE864-QUAD module provides 3 Analog to Digital Converters. The input lines
are:
ADC_IN1 available on Ball J11 and Pin 19 of PL102 on EVK2 Board (CS1152).
ADC_IN2 available on Ball H11 and Pin 20 of PL102 on EVK2 Board (CS1152).
ADC_IN3 available on Ball G11 and Pin 21 of PL102 on EVK2 Board (CS1152).
13.2.2. Using ADC Converter
The AT command below is available to use the ADC function:
AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of
this function.
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14. Mounting the GE864 on the Board
14.1. General
The Telit GE864 modules have been designed in order to be compliant with a
standard lead-free SMT process.
14.1.1. Module Finishing & Dimensions
Lead-free Alloy:
Surface finishing Sn/Ag/Cu for all solder pads
Pin A1
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14.1.2. Recommended Foot Print for the Application (GE864)
Top view
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14.1.3. Suggested Inhibit Area
In order to easily rework the GE864 is suggested to consider on the application a
1.5mm Inhibit area around the module:
Top view
It is also suggested, as common rule for an SMT component, to avoid having a
mechanical part of the application in direct contact with the module.
1.5mm
1.5mm
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14.1.4. Debug of the GE864 in Production
To test and debug the mounting of the GE864, we strongly recommend to foreseen
test pads on the host PCB, in order to check the connection between the GE864 itself
and the application and to test the performance of the module connecting it with an
external computer. Depending by the customer application, these pads include, but
are not limited to the following signals:
TXD
RXD
ON/OFF
RESET
GND
VBATT
TX_TRACE
RX_TRACE
PWRMON
14.1.5. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120µm.
14.1.6. PCB Pad Design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the
PCB.
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Recommendations for PCB pad dimensions:
Ball pitch [mm]
2,5
Solder resist opening diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
It is recommended no microvia without solder resist cover under the module and no
microvia around the pads (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 7 /
0.05 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue must be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
14.1.7. Solder Paste
Lead free
Solder paste
Sn/Ag/Cu
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14.1.8. GE864 Solder Reflow
The illustration below shows the recommended solder reflow profile:
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
8 Temperature Min (Tsmin)
8 Temperature Max
(Tsmax)
Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
Ramp-up Rate
3°C/second max
Time maintained above:
8 Temperature (TL)
Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
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14.2. Packing System
The Telit GE864 modules are packaged on trays of 20 pieces each. This is especially
suitable for the GE864 according to SMT processes for pick & place movement
requirements.
TRAY DRAWING
The size of the tray is: 329 x 176mm
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface.
NOTE:
GE864 module can accept only one reflow process.
Section A-A
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WARNING:
These trays can withstand the maximum temperature of 65° C.
GE864 Orientation on the Tray
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Reel Drawing
14.2.1. Moisture Sensibility
The level of moisture sensibility of GE864 module is “3”, in according with standard
IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of
components.
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15. Conformity Assessment Issues
The Telit GE864 has been assessed in order to satisfy the essential
requirements of the R&TTE Directive 1999/05/EC (Radio Equipment &
Telecommunications Terminal Equipments) to demonstrate the
conformity against the harmonized standards with the final involvement of a
Notified Body.
If the module is installed in conformance to the Telit installation manuals, no further
evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of
a R&TTE Directive Notified Body for the final product.
In all other cases, or if the manufacturer of the final product is in doubt, then the equipment
integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive.
In all cases the assessment of the final product must be made against the Essential
requirements of the R&TTE Directive Articles 3.1(a) and (b), Safety and EMC respectively,
and any relevant Article 3.3 requirements.
This Product Description, the Hardware User Guide and Software User Guide contain all the
information you may need for developing a product meeting the R&TTE Directive.
Furthermore the GE864 module is FCC Approved as module to be installed in other devices.
This device is to be used only for fixed and mobile applications. If the final product after
integration is intended for portable use, a new application and FCC is required.
The GE864 is conforming to the following US Directives:
• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)
• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
To meet the FCC's RF exposure rules and regulations:
• The system antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all the persons and must not be co-located or
operating in conjunction with any other antenna or transmitter.
• The system antenna(s) used for this module must not exceed 1.4dBi (850MHz) and
3.0dBi (1900MHz) for mobile and fixed or mobile operating configurations.
• Users and installers must be provided with antenna installation instructions and
transmitter operating conditions for satisfying RF exposure compliance.
0889
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Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and to have their complete product tested and approved for
FCC compliance.
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16. SAFETY RECOMMENDATIONS
NOTE:
Read this section carefully to ensure the safe operation.
Be sure the use of this product is allowed in the country and in the environment
required. The use of this product may be dangerous and has to be avoided in the
following areas:
Where it can interfere with other electronic devices in environments such
as hospitals, airports, aircrafts, etc
Where there is risk of explosion such as gasoline stations, oil refineries,
etc
It is responsibility of the user to enforce the country regulation and the specific
environment regulation.
Do not disassemble the product; any mark of tampering will compromise the
warranty validity.
We recommend following the instructions of the hardware user guides for a correct
wiring of the product. The product has to be supplied with a stabilized voltage source
and the wiring has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be
taken for the SIM, checking carefully the instruction for its use. Do not insert or
remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product;
therefore, care has to be taken to the external components of the module, as well as
of any project or installation issue, because the risk of disturbing the GSM network or
external devices or having impact on the security. Should there be any doubt, please
refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics.
The antenna has to be installed with care in order to avoid any interference with
other electronic devices and has to guarantee a minimum distance from the body (20
cm). In case of this requirement cannot be satisfied, the system integrator has to
assess the final product against the SAR regulation EN 50360.
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The European Community provides some Directives for the electronic equipments
introduced on the market. All the relevant information are available on the European
Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm