Telit Communications S p A GE910 2G module User Manual 1vv0300962 GE910 Hardware User Guide r4

Telit Communications S.p.A. 2G module 1vv0300962 GE910 Hardware User Guide r4

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GE910 Hardware User Guide

1vv0300962 Rev.4 – 2012-06-25

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APPLICABILITY TABLE

APPLICABILITY TABLEAPPLICABILITY TABLE

APPLICABILITY TABLE

PRODUCT

PRODUCTPRODUCT

PRODUCT

GE910

GE910GE910

GE910-

-QUAD

QUADQUAD

QUAD

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes

no liability resulting from any inaccuracies or omissions in this document, or from use of the

information obtained herein. The information in this document has been carefully checked and is

believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or

omissions. Telit reserves the right to make changes to any products described herein and

reserves the right to revise this document and to make changes from time to time in content

hereof with no obligation to notify any person of revisions or changes. Telit does not assume

any liability arising out of the application or use of any product, software, or circuit described

herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products

(machines and programs), programming, or services that are not announced in your country.

Such references or information must not be construed to mean that Telit intends to announce

such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,

include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit

and its licensors certain exclusive rights for copyrighted material, including the exclusive right

to copy, reproduce in any form, distribute and make derivative works of the copyrighted

material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in

the Telit products described in this instruction manual may not be copied, reproduced,

distributed, merged or modified in any manner without the express written permission of Telit.

Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by

implication, estoppel, or otherwise, any license under the copyrights, patents or patent

applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual

may include copyrighted Telit and other 3rd Party supplied computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit

and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,

including the exclusive right to copy or reproduce in any form the copyrighted computer

program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs

contained in the Telit products described in this instruction manual may not be copied (reverse

engineered) or reproduced in any manner without the express written permission of Telit or the

3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant

either directly or by implication, estoppel, or otherwise, any license under the copyrights,

patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal

non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished

by express license agreement only and may be used only in accordance with the terms of such

an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced, transmitted,

transcribed, stored in a retrieval system, or translated into any language or computer language,

in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-

tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment

in the following hazardous environments requiring fail-safe controls: the operation of Nuclear

Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life

Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically

disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service

names are the property of their respective owners.

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Contents

Introduction.....................................................................................................................................................................7

1.1.

Scope........................................................................................................................................................................7

1.2.

Audience ..................................................................................................................................................................7

1.3.

Contact Information, Support...................................................................................................................................7

1.4.

Document Organization ...........................................................................................................................................8

1.5.

Text Conventions .....................................................................................................................................................9

1.6.

Related Documents ..................................................................................................................................................9

Overview........................................................................................................................................................................10

GE910 module connections ..........................................................................................................................................11

3.1.

PIN-OUT................................................................................................................................................................11

3.2.

LGA PADs Layout.................................................................................................................................................16

Hardware Commands...................................................................................................................................................17

4.1.

Turning ON the GE910..........................................................................................................................................17

4.2.

Turning OFF the GE910 ........................................................................................................................................21

4.3.

HW Unconditional Shutdown on GE910...............................................................................................................23

4.3.1.

Hardware Unconditional shutdown ..............................................................................................................23

Power Supply.................................................................................................................................................................26

5.1.

Power Supply Requirements ..................................................................................................................................26

5.2.

Power Consumption...............................................................................................................................................27

5.3.

General Design Rules.............................................................................................................................................28

5.3.1.

Electrical Design Guidelines.........................................................................................................................28

5.3.2.

Thermal Design Guidelines...........................................................................................................................31

5.3.3.

Power Supply PCB layout Guidelines ...........................................................................................................32

Antenna..........................................................................................................................................................................33

6.1.

GSM Antenna Requirements .................................................................................................................................33

6.2.

GSM Antenna - PCB line Guidelines.....................................................................................................................34

6.3.

PCB Guidelines in case of FCC certification.........................................................................................................35

6.3.1.

Transmission line design ...............................................................................................................................35

6.3.2.

Transmission line measurements...................................................................................................................36

6.4.

GSM Antenna - Installation Guidelines .................................................................................................................38

Logic level specifications ..............................................................................................................................................39

7.1.

Unconditional Shutdown........................................................................................................................................40

Serial Ports ....................................................................................................................................................................41

8.1.

MODEM SERIAL PORT ......................................................................................................................................41

8.2.

RS232 level translation ..........................................................................................................................................43

USB Port........................................................................................................................................................................45

9.1.

USB 2.0 FS ............................................................................................................................................................45

10.

Audio Section Overview...........................................................................................................................................46

10.1.

MIC connection......................................................................................................................................................47

10.2.

LINE-IN connection...............................................................................................................................................48

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10.3.

EAR connection .....................................................................................................................................................49

10.4.

Electrical Characteristics........................................................................................................................................50

10.4.1.

Input Lines.....................................................................................................................................................50

10.4.2.

Output Lines ..................................................................................................................................................51

11.

General Purpose I/O.................................................................................................................................................52

11.1.

GPIO Logic levels..................................................................................................................................................53

11.2.

Using a GPIO Pad as INPUT .................................................................................................................................54

11.3.

Using a GPIO Pad as OUTPUT .............................................................................................................................54

11.4.

Indication of network service availability ..............................................................................................................55

11.5.

RTC Bypass out .....................................................................................................................................................56

11.6.

External SIM Holder Implementation....................................................................................................................56

11.7.

ADC Converter ......................................................................................................................................................56

11.7.1.

Description....................................................................................................................................................56

11.7.2.

Using ADC Converter ...................................................................................................................................56

12.

Mounting the GE910 on your Board.......................................................................................................................57

12.1.

General...................................................................................................................................................................57

12.2.

Module finishing & dimensions.............................................................................................................................57

12.3.

Recommended foot print for the application..........................................................................................................58

12.4.

Stencil.....................................................................................................................................................................59

12.5.

PCB pad design......................................................................................................................................................59

12.6.

Recommendations for PCB pad dimensions (mm): ...............................................................................................59

12.7.

Solder paste............................................................................................................................................................61

12.7.1.

GE910 Solder reflow.....................................................................................................................................61

13.

Debug of the GE910 in production..........................................................................................................................63

14.

Packing system..........................................................................................................................................................64

14.1.

Packing on tray.......................................................................................................................................................64

14.2.

Moisture sensibility................................................................................................................................................66

15.

Conformity Assessment Issues.....................................................................................Error! Bookmark not defined.

16.

SAFETY RECOMMANDATIONS.........................................................................................................................67

17.

Document History.....................................................................................................................................................73

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1. Introduction

1.1. Scope

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit GE910 module.

1.2. Audience

This document is intended for Telit customers, who are integrators, about to implement their

applications using our GE910 modules.

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit’s Technical Support Center (TTSC) at:

TS-EMEA@telit.com

TS-NORTHAMERICA@telit.com

TS-LATINAMERICA@telit.com

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on

accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users of our information.

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1.4. Document Organization

This document contains the following chapters:

Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

Chapter 2: “Overview” provides an overview of the document.

Chapter 3: “GE910 Mechanical Dimensions”

Chapter 3: “GE910 Module Connections” deals with the pin out configuration and layout.

Chapter 4: “Hardware Commands” How to operate on the module via hardware.

Chapter 5: “Power supply” Power supply requirements and general design rules.

Chapter 6: “Antenna” The antenna connection and board layout design are the most important

parts in the full product design.

Chapter 7: “Logic Level specifications” Specific values adopted in the implementation of logic

levels for this module.

Chapter 8: “Serial ports” The serial port on the Telit GE910 is the core of the interface between

the module and OEM hardware

Chapter 9: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the

GE910 Telit Modules.

Chapter 10: “General Purpose I/O” How the general purpose I/O pads can be configured.

Chapter 11: “Mounting the GE910 on the application board” Recommendations and specifics on

how to mount the module on the user’s board.

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1.5. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily

injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if

these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating

the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.6. Related Documents

• Telit's GSM/GPRS Family Software User Guide, 1vv0300784

• Audio settings application note , 80000NT10007a

• Digital Voice Interface Application Note, 80000NT10004a

• GE910 Product description,

• SIM Holder Design Guides, 80000NT10001a

• AT Commands Reference Guide, 80000ST10025a

• Telit EVK2 User Guide, 1vv0300704

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2. Overview

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit GE910 module.

In this document all the basic functions of a mobile phone will be taken into account; for each

one of them a proper hardware solution will be suggested and eventually the wrong solutions

and common errors to be avoided will be evidenced. Obviously this document cannot embrace

the whole hardware solutions and products that may be designed. The wrong solutions to be

avoided shall be considered as mandatory, while the suggested hardware configurations shall not

be considered mandatory, instead the information given shall be used as a guide and a starting

point for properly developing your product with the Telit GE910 module. For further hardware

details that may not be explained in this document refer to the Telit GE910 Product Description

document where all the hardware information is reported.

NOTICE:

(The integration of the GSM/GPRS GE910 cellular module within user application shall be

done according to the design rules described in this manual.

The information presented in this document is believed to be accurate and reliable. However, no

responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of

patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent rights of Telit Communications S.p.A. other than for

circuitry embodied in Telit products. This document is subject to change without notice.

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3. GE910 module connections

3.1. PIN-OUT

PAD

Signal I/O Function Type COMMENT

USB HS 2.0 COMMUNICATION PORT

B15 USB_D+ I/O USB differential Data (+)

C15 USB_D- I/O USB differential Data (-)

Asynchronous UART - Prog. / Data + HW Flow Control

N15 C103/TXD I Serial data input from DTE CMOS 1.8V

M15

C104/RXD O Serial data output to DTE CMOS 1.8V

M14

C108/DTR I Input for (DTR) from DTE CMOS 1.8V

L14 C105/RTS I Input for Request to send signal

(RTS) from DTE CMOS 1.8V

P15 C106/CTS O Output for Clear to Send signal

(CTS) to DTE

CMOS 1.8V

N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V

P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V

R14 C125/RING O Output for Ring (RI) to DTE CMOS 1.8V

Asynchronous Auxiliary UART

D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V

E15 RX_AUX I Auxiliary UART (RX Data from

DTE) CMOS 1.8V

SIM card interface

A6 SIMCLK O External SIM signal – Clock 1.8 / 3V

A7 SIMRST O External SIM signal – Reset 1.8 / 3V

A5 SIMIO I/O External SIM signal – Data I/O 1.8 / 3V

A4 SIMIN I External SIM signal – Presence

(active low) CMOS 1.8

A3 SIMVCC - External SIM signal – Power supply

for the SIM 1.8 / 3V

Analog Voice Interface

EAR+ AO Ear signal output, phase +

EAR- AO Ear signal output, phase -

MIC+ AI Microphone signal input; phase +

MIC- AI Microphone signal input; phase -

Digital Voice Interface (DVI)

B9 DVI_WA0 I/O Digital Audio Interface (WA0) CMOS 1.8V

B6 DVI_RX I/O Digital Audio Interface (RX) CMOS 1.8V

B7 DVI_TX I/O Digital Audio Interface (TX) CMOS 1.8V

B8 DVI_CLK I/O Digital Audio Interface (CLK) CMOS 1.8V

DIGITAL IO

C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V Alternate Function STAT LED

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C9 GPIO_02 I/O GPIO_02 CMOS 1.8V

C10 GPIO_03 I/O GPIO_03 CMOS 1.8V

C11 GPIO_04 I/O GPIO_04 CMOS 1.8V

B14 GPIO_05 I/O GPIO_05 CMOS 1.8V

C12 GPIO_06 I/O GPIO_06 CMOS 1.8V

C13 GPIO_07 I/O GPIO_07 CMOS 1.8V

K15 GPIO_08 I/O GPIO_08 CMOS 1.8V

L15 GPIO_09 I/O GPIO_09 CMOS 1.8V

G15 GPIO_10 I/O GPIO_10 CMOS 1.8V

ADC

B1 ADC_IN1 AI Analog to Digital converter input A/D Values 0 to 1.3V

RF SECTION

K1 ANTENNA I/O GSM/GPRS Antenna

(50 ohm) RF

MISCELLANEOUS FUNCTIONS

R13 HW_SHUTDOWN* I HW Unconditional Shutdown CMOS 1.8V Active low

R12 ON_OFF* I Input command for power ON CMOS 1.8V Active low

C14 VRTC I VRTC Backup capacitor RTC Power Backup for the embedded RTC

supply, don’t connect to VBATT!

R11 VAUX/PWRMON O Supply Output for external

accessories / Power ON Monitor 1.8V

POWER SUPPLY

M1 VBATT - Main power supply (Baseband) Power

M2 VBATT - Main power supply (Baseband) Power

N1 VBATT_PA - Main power supply (Radio PA) Power

N2 VBATT_PA - Main power supply (Radio PA) Power

P1 VBATT_PA - Main power supply (Radio PA) Power

P2 VBATT_PA - Main power supply (Radio PA) Power

E1 GND - Ground Power

G1 GND - Ground Power

H1 GND - Ground Power

J1 GND - Ground Power

L1 GND - Ground Power

A2 GND - Ground Power

E2 GND - Ground Power

F2 GND - Ground Power

G2 GND - Ground Power

H2 GND - Ground Power

J2 GND - Ground Power

K2 GND - Ground Power

L2 GND - Ground Power

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R2 GND - Ground Power

M3 GND - Ground Power

N3 GND - Ground Power

P3 GND - Ground Power

R3 GND - Ground Power

M4 GND - Ground Power

N4 GND - Ground Power

P4 GND - Ground Power

R4 GND - Ground Power

N5 GND - Ground Power

P5 GND - Ground Power

R5 GND - Ground Power

N6 GND - Ground Power

P6 GND - Ground Power

R6 GND - Ground Power

P8 GND - Ground Power

R8 GND - Ground Power

P9 GND - Ground Power

P10 GND - Ground Power

R10 GND - Ground Power

M12

GND - Ground Power

B13 GND - Ground Power

P13 GND - Ground Power

E14 GND - Ground Power

RESERVED

C1 RESERVED - RESERVED

D1 RESERVED - RESERVED

C2 RESERVED - RESERVED

D2 RESERVED - RESERVED

C3 RESERVED - RESERVED

D3 RESERVED - RESERVED

E3 RESERVED - RESERVED

F3 RESERVED - RESERVED

G3 RESERVED - RESERVED

H3 RESERVED - RESERVED

J3 RESERVED - RESERVED

K3 RESERVED - RESERVED

L3 RESERVED - RESERVED

C4 RESERVED - RESERVED

C5 RESERVED - RESERVED

C6 RESERVED - RESERVED

C7 RESERVED - RESERVED

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N7 RESERVED - RESERVED

P7 RESERVED - RESERVED

N8 RESERVED - RESERVED

N9 RESERVED - RESERVED

A10 RESERVED - RESERVED

N10 RESERVED - RESERVED

N11 RESERVED - RESERVED

B12 RESERVED - RESERVED

D12 RESERVED - RESERVED

N12 RESERVED - RESERVED

P12 RESERVED - RESERVED

F14 RESERVED - RESERVED

G14 RESERVED - RESERVED

H14 RESERVED - RESERVED

J14 RESERVED - RESERVED

K14 RESERVED - RESERVED

N13 RESERVED - RESERVED

L13 RESERVED - RESERVED

J13 RESERVED - RESERVED

M13

RESERVED - RESERVED

K13 RESERVED - RESERVED

H13 RESERVED - RESERVED

G13 RESERVED - RESERVED

F13 RESERVED - RESERVED

A11 RESERVED - RESERVED

A12 RESERVED - RESERVED

B11 RESERVED - RESERVED

B10 RESERVED - RESERVED

A9 RESERVED - RESERVED

A8 RESERVED - RESERVED

A13 RESERVED - RESERVED

A14 RESERVED - RESERVED

D13 RESERVED - RESERVED

D14 RESERVED - RESERVED

H15 RESERVED - RESERVED

J15 RESERVED - RESERVED

F1 RESERVED - RESERVED

R9 RESERVED - RESERVED

R7 RESERVED - RESERVED

D4 RESERVED - RESERVED

E13 RESERVED - RESERVED

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F15 RESERVED - RESERVED

P11

RESERVED - RESERVED

WARNING:

Reserved pins must not be connected.

NOTE:

If not used, almost all pins should be left disconnected. The only exceptions are the following

pins:

NOTE:

RTS pin should be connected to the GND (on the module side) if flow control is not used.

The above pins are also necessary to debug the application when the module is assembled on it.

PAD signal

M1,M2,N1,N2,P1,P2 VBATT & VBATT_PA

E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,

J2,K2,L2,R2,M3,N3,P3,R3,M4,

N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,

R8,P9,P10,R10,M12,B13,P13,E14

GND

R12 ON/OFF*

R13 HW_SHUTDOWN*

B15 USB_D+

C15 USB_D-

N15 C103/TXD

M15 C104/RXD

L14 C105/RTS

P15 C106/CTS

D15 TXD_AUX

E15 RXD_AUX

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3.2. LGA PADs Layout

TOP VIEW

A B C D E F G H J K L M N P R

1 RES RES RES GND RES GND GND GND ANT GND VBATT VBATT_

PA VBATT_

2 GND EAR+ RES RES GND GND GND GND GND GND GND VBATT VBATT_

PA VBATT_

PA GND

3 SIMVC

C EAR- RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN MIC+ RES RES GND GND GND GND

5 SIMIO MIC- RES GND GND GND

6 SIMCL

K DVI_RX RES GND GND GND

7 SIMRST DVI_TX RES RES RES RES

8 RES DVI_CL

K GPIO_01 RES GND GND

9 RES DVI_WA

0 GPIO_02 RES GND RES

10 RES RES GPIO_03 RES GND GND

11 RES RES GPIO_04 RES RES VAUX/P

WRMON

12 RES RES GPIO_06 RES GND RES RES

ON_OFF*

13 RES GND GPIO_07 RES

VIO1_1V8

RES RES RES RES RES RES RES RES GND HW_SHU

TDOWN*

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RIN

15 USB_D+ USB_D- TX AUX RX AUX RES GPIO_10 RES RES GPIO_08 GPIO_09 C104/RX

D C103/TX

D C106/CT

NOTE:

The pin defined as H4 has to be considered RESERVED and not connected on any pin in the

application. The related area on the application has to be kept empty.

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4. Hardware Commands

4.1. Turning ON the GE910

To turn on the GE910 the pad ON-OFF* must be tied low for at least 5 seconds and then

released.

The maximum current that can be drained from the ON-OFF* pad is 0,2 mA.

A simple circuit to do it is:

NOTE:

Don't use any pull up resistor on the ON* line, it is internally pulled up. Using pull up resistor

may bring to latch up problems on the GE910 power regulator and improper power on/off of the

module. The line ON* must be connected only in open collector configuration.

NOTE:

In this document all the lines that are inverted, hence have active low signals are labelled with a

name that ends with”*" or with a bar over the name.

TIP:

To check if the device has powered on, the hardware line PWRMON should be monitored. The

device is powered on when PWRMON goes high.

NOTE:

It is mandatory to avoid sending data to the serial ports during the first 200mS of the module

start-up.

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The flow chart showing the proper turn on procedure is displayed below:

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the GE910 when the module is powered off or during

an ON/OFF transition.

Modem ON Proc.

unconditional

SHUTDOWN

AT init sequence

Start AT CMD.

PWMON = ON?

AT answer in 1Sec ?

Delay 1s

DELAY= 300mSec

ON_OFF = LOW

Delay = 5 Sec

ON_OFF = HIGH

Enter AT<CR>

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The Flow chart showing the AT commands managing procedure is displayed below:

AT answer in

1Sec ?

Start AT CMD.

DELAY= 300mSec

Enter AT<CR>

AT init sequence

Modem ON Proc.

unconditional

SHUTDOWN

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For example:

1- Let's assume you need to drive the ON* pad with a totem pole output of a +3/5 V

microcontroller:

2- Let's assume you need to drive the ON* pad directly with an ON/OFF button:

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4.2. Turning OFF the GE910

Turning off of the device can be done in two ways:

• via AT command (see GE910 Software User Guide, AT#SHDN)

• by tying low pin ON*

Either ways, the device issues a detach request to network informing that the device will not be

reachable any more.

To turn OFF the GE910 the pad ON* must be tied low for at least 2 seconds and then released.

A Pulse duration less than 2 seconds should also start the power off procedure, but this is not

guaranteed.

The same circuitry and timing for the power on must be used.

The device shuts down after the release of the ON* pad.

TIP:

To check if the device has been powered off, the hardware line PWRMON must be monitored.

The device is powered off when PWRMON goes low.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the GE910 when the module is powered off or during

an ON/OFF transition.

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The following flow chart shows the proper turnoff procedure:

Modem OFF Proc.

unconditional

SHUTDOWN

PWMON = ON?

Delay 15s

ON_OFF = LOW

Delay = 2 Sec

ON_OFF = HIGH

Modem ON Proc.

PWMON = ON?

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4.3. HW Unconditional Shutdown on GE910

4.3.1. Hardware Unconditional shutdown

WARNING:

The hardware unconditional Shutdown must not be used during normal operation of the device

since it does not detach the device from the network. It shall be kept as an emergency exit

procedure to be done in the rare case that the device gets stacked waiting for some network or

SIM responses.

To unconditionally Shutdown the GE910, the pad HW_SHUTDOWN* must be tied low for at

least 200 milliseconds and then released. After this operation the module is in OFF condition.

The maximum current that can be drained from the HW_SHUTDOWN* pad is 0,4 mA.

NOTE:

Do not use any pull up resistor on the HW_SHUTDOWN* line or any totem pole digital output.

Using pull up resistor may bring to latch up problems on the GE910 power regulator and

improper functioning of the module. The line HW_SHUTDOWN* must be connected only in

open collector configuration.

TIP:

The unconditional hardware shutdown must always be implemented on the boards and the

software must use it as an emergency exit procedure.

A simple circuit to do it is:

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In the following flow chart is detailed the proper restart procedure:

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the GE910 when the module is powered off or during

an ON/OFF transition.

unconditional

SHUTDOWN

HW SHUTDOWN* =

LOW

Delay 200ms

HW SHUTDOWN* =

HIGH

PWRMON = ON

Delay 1s

Modem ON Proc.

Disconnect PWR

supply Modem ON Proc.

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For example:

1. Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output

of a +3/5 V microcontroller:

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5. Power Supply

The power supply circuitry and board layout are a very important part in the full product design

and they strongly reflect on the product overall performances, hence read carefully the

requirements and the guidelines that will follow for a proper design.

5.1. Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must

fulfill the following requirements:

POWER SUPPLY

Nominal Supply Voltage 3.8 V

Normal Operating Voltage Range 3.40 V÷ 4.20 V

Extended Operating Voltage Range 3.20 V÷ 4.50 V

NOTE:

The Operating Voltage Range MUST never be exceeded; care must be taken in order to fulfil

min/max voltage requirement.

NOTE:

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage

(regarding MIN Extended Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only with completely assumption and

application of the HW User guide suggestions.

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5.2. Power Consumption

The GE910 power consumptions are:

GE910

Mode Average

(mA) Mode description

SWITCHED OFF

Switched Off Typical 60uA Module supplied but Switched Off

IDLE mode

AT+CFUN=1 21 Normal mode: full functionality of the module

AT+CFUN=4 18

Disabled TX and RX; module is not registered on the network

3,8

Paging Multiframe 2

2,5

Paging Multiframe 3

2,4

Paging Multiframe 4

AT+CFUN=0 or =5

1,2

Paging Multiframe 9

CSD TX and RX mode

GSM900 CSD PL5 230

DCS1800 CSD PL0 175

GSM VOICE CALL

GPRS (class 1) 1TX + 1RX

GSM900 PL5 225

DCS1800 PL0 160

GPRS Sending data mode

GPRS (class 10) 2TX + 3RX

GSM900 PL5 360

DCS1800 PL0 290

GPRS Sending data mode

The GSM system is made in a way that the RF transmission is not continuous, else it is packed

into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as

about 2A. Therefore the power supply has to be designed in order to withstand with these

current peaks without big voltage drops; this means that both the electrical design and the board

layout must be designed for this current flow.

If the layout of the PCB is not well designed a strong noise floor is generated on the ground and

the supply; this will reflect on all the audio paths producing an audible annoying noise at 216

Hz; if the voltage drop during the peak current absorption is too much, then the device may even

shutdown as a consequence of the supply voltage drop.

NOTE:

The electrical design for the Power supply should be made ensuring it will be capable of a peak

current output of at least 2 A.

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5.3. General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout.

5.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this

power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

5.3.1.1. + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference

between the input source and the desired output and a linear regulator can be used. A

switching power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate

the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks close to the GE910, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the

GE910 from power polarity inversion.

An example of linear regulator with 5V input is:

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5.3.1.2. + 12V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between

the input source and the desired output, a linear regulator is not suited and shall not be

used. A switching power supply will be preferable because of its better efficiency

especially with the 2A peak current load represented by the GE910.

• When using a switching regulator, a 500kHz or more switching frequency regulator is

preferable because of its smaller inductor size and its faster transient response. This

allows the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to

be developed due to the fact the switching frequency could also generate EMC

interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind

when choosing components: all components in the power supply must withstand this

voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power input,

in order to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the

GE910 from power polarity inversion. This can be the same diode as for spike protection.

An example of switching regulator with 12V input is in the below schematic:

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5.3.1.3. Battery Source Power Supply Design Guidelines

• The desired nominal output for the power supply is 3.8V and the maximum voltage

allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the

power to the Telit GE910 module.

WARNING:

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE

USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage

for the GE910 and damage it.

NOTE:

DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE910. Their use

can lead to overvoltage on the GE910 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the

GE910 from power polarity inversion. Otherwise the battery connector should be done in

a way to avoid polarity inversions when connecting the battery.

• The battery capacity must be at least 500mAh in order to withstand the current peaks of

2A; the suggested capacity is from 500mAh to 1000mAh.

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5.3.2. Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following

specifications:

See para 6.2 Power Consumption

Considering the very low current during idle, especially if Power Saving function is enabled, it

is possible to consider from the thermal point of view that the device absorbs current

significantly only during calls.

For the heat generated by the GE910, you can consider it to be during transmission 1W max

during CSD/VOICE calls and 2W max during class10 GPRS upload.

This generated heat will be mostly conducted to the ground plane under the GE910; you must

ensure that your application can dissipate it.

NOTE:

The average consumption during transmissions depends on the power level at which the device

is requested to transmit by the network. The average current consumption hence varies

significantly.

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5.3.3. Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on

the output to cut the current peaks and a protection diode on the input to protect the supply from

spikes and polarity inversion. The placement of these components is crucial for the correct

working of the circuitry. A misplaced component can be useless or can even decrease the power

supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit GE910 power input pads

or in the case the power supply is a switching type it can be placed close to the inductor

to cut the ripple provided the PCB trace from the capacitor to the GE910 is wide enough

to ensure a dropless connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source

is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough

to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this

is not made in order to save power loss but especially to avoid the voltage drops on the

power line at the current peaks frequency of 216 Hz that will reflect on all the

components connected to that supply, introducing the noise floor at the burst base

frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from

the power loss point of view, the same voltage drop may not be acceptable from the noise

point of view. If your application doesn't have audio interface but only uses the data

feature of the Telit GE910, then this noise is not so disturbing and power supply layout

design can be more forgiving.

• The PCB traces to the GE910 and the Bypass capacitor must be wide enough to ensure

no significant voltage drops occur when the 2A current peaks are absorbed. This is for

the same reason as previous point. Try to keep this trace as short as possible.

• The PCB traces connecting the Switching output to the inductor and the switching diode

must be kept as short as possible by placing the inductor and the diode very close to the

power switching IC (only for switching power supply). This is done in order to reduce

the radiated field (noise) at the switching frequency (100-500 kHz usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped to any

noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as

microphone/earphone cables.

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6. Antenna

The antenna connection and board layout design are the most important aspect in the full

product design as they strongly affect the product overall performances, hence read carefully

and follow the requirements and the guidelines for a proper design.

6.1. GSM Antenna Requirements

As suggested on the Product Description the antenna and antenna transmission line on PCB for a

Telit GE910 device shall fulfill the following requirements:

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by the network

operator, the customer shall use the most suitable antenna

for that/those band(s)

Bandwidth 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in

DCS & 140 MHz PCS band

Gain 1.4dBi @900 and 3dBi @1800

1.4dBi @850 and 3dBi @1900

Impedance 50Ω

Input power > 2 W

VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)

VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements)

When using the GE910, since there's no antenna connector on the module, the antenna must be

connected to the GE910 antenna pad (LGA pad K1) by means of a transmission line

implemented on the PCB.

In the case the antenna is not directly connected at the antenna pad of the GE910, then a PCB

line is needed in order to connect with it or with its connector.

This transmission line shall fulfill the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Characteristic Impedance 50Ω

Max Attenuation 0,3 dB

Coupling with other signals shall be avoided

Cold End (Ground Plane) of antenna shall be equipotential to the

GE910 ground pins

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Furthermore if the device is developed for the US market and/or Canada market, it shall comply

with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. In order to re-use the Telit

FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a

separation distance of at least 20 cm from all persons and must not be co-located or operating in

conjunction with any other antenna or transmitter. If antenna is installed with a separation

distance of less than 20 cm from all persons or is co-located or operating in conjunction with

any other antenna or transmitter then additional FCC/IC testing may be required. End-Users

must be provided with transmitter operation conditions for satisfying RF exposure compliance.

Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating

configurations.

6.2. GSM Antenna - PCB line Guidelines

• Make sure that the transmission line’s characteristic impedance is 50Ω ;

• Keep line on the PCB as short as possible, since the antenna line loss shall be less than

around 0,3 dB;

• Line geometry should have uniform characteristics, constant cross section, avoid

meanders and abrupt curves;

• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded

Coplanar Waveguide...) can be used for implementing the printed transmission line

afferent the antenna;

• If a Ground plane is required in line geometry, that plane has to be continuous and

sufficiently extended, so the geometry can be as similar as possible to the related

canonical model;

• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If

possible, use this layer as reference Ground plane for the transmission line;

• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid

having other signal tracks facing directly the antenna line track.

• Avoid crossing any un-shielded transmission line footprint with other signal tracks on

different layers;

• The ground surrounding the antenna line on PCB has to be strictly connected to the main

Ground Plane by means of via holes (once per 2mm at least), placed close to the ground

edges facing line track;

• Place EM noisy devices as far as possible from GE910 antenna line;

• Keep the antenna line far away from the GE910 power supply lines;

• If EM noisy devices are present on the PCB hosting the GE910, such as fast switching

ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB

and surround it with Ground planes, or shield it with a metal frame cover.

• If EM noisy devices are not present around the line, the use of geometries like Microstrip

or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less

attenuation if compared to a Stripline having same length;

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6.3. PCB Guidelines in case of FCC certification

In the case FCC certification is required for an application using GE910, according to FCC KDB

996369 for modular approval requirements, the transmission line has to be similar to that

implemented on GE910 interface board and described in the following chapter.

6.3.1. Transmission line design

During the design of the GE910 interface board, the placement of components has been chosen

properly, in order to keep the line length as short as possible, thus leading to lowest power losses

possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of

transmission line ensures good impedance control and can be implemented in an outer PCB layer

as needed in this case. A SMA female connector has been used to feed the line.

The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by

relative permittivity ε

= 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance

from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3,

while copper is removed from layer 2 underneath the line. Height of trace above ground plane is

1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB.

The line geometry is shown below:

0.3 mm

0.035 mm

0.3 mm

6.2 mm

FR4

0.035 mm

1.335 mm

0.2 mm

1.1 mm

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6.3.2. Transmission line measurements

HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated

coaxial cable has been soldered at the pad corresponding to GE910 RF output; a SMA connector

has been soldered to the board in order to characterize the losses of the transmission line

including the connector itself. During Return Loss / impedance measurements, the transmission

line has been terminated to 50 Ω load.

Return Loss plot of line under test is shown below:

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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is

shown in the following figure:

Insertion Loss of G-CPW line plus SMA connector is shown below:

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6.4. GSM Antenna - Installation Guidelines

• Install the antenna in a place covered by the GSM signal.

• If the device antenna is located greater then 20cm from the human body and there are no

co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product

• If the device antenna is located less then 20cm from the human body or there are no co-

located transmitter then the additional FCC/IC testing may be required for the end

product (Telit FCC/IC approvals cannot be reused)

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

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7. Logic level specifications

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The

following table shows the logic level specifications used in the GE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin

(CMOS 1.8) when on -0.3V

+2.1V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9V

Output low level 0V 0.2V

Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA

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7.1. Unconditional Shutdown

Signal Function I/O Pin

HW_SHUTDOWN* Hardware unconditional Shutdown I R13

HW_SHUTDOWN* is used to unconditionally shutdown the GE910. Whenever this signal is

pulled low, the GE910 is unconditionally shutdown. When the device is reset it stops any

operation. After the release of the HW_SHUTDOWN* pin, the GE910 is unconditionally shut

down, without doing any detach operation from the network where it is registered. This behavior

is not a proper shut down because any GSM device is requested to issue a detach request on turn

off. For this reason the unconditional shutdown pin HW_SHUTDOWN* signal must not be used

to normally shutting down the device, but only as an emergency exit in the rare case the device

remains stuck waiting for some network response.

After the unconditional shutdown pin HW_SHUTDOWN* used the module is in off status.

It may only be used to reset a device already on that is not responding to any command.

NOTE:

Do not use this signal to power off the GE910. Use the ON/OFF signal to perform this function

or the AT#SHDN command.

This signal is internally pulled up so the pin can be left floating if not used.

NOTE:

if used, then it must always be connected with an open collector transistor.

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8. Serial Ports

The serial port on the GE910 is the core of the interface between the module and OEM hardware.

2 serial ports are available on the module:

• MODEM SERIAL PORT 1 (Main, ASC0)

• MODEM SERIAL PORT 2 (Auxiliary, ASC1)

8.1. MODEM SERIAL PORT

Several configurations can be designed for the serial port on the OEM hardware, but the most

common are:

• RS232 PC com port

• microcontroller UART

1.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART

3V or other voltages different from 1.8V

• microcontroller UART

5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be

needed to make the system work. The only configuration that doesn't need a level translation is

the 1.8V UART.

The serial port on the GE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the

PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE910

UART are the CMOS levels:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital

pad when on -0.3V +2.1V

Input voltage on analog

pads when on -0.3V +2.1V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level V

1.5V 1.9V

Input low level V

0V 0.35V

Output high level V

1.6V 1.9V

Output low level V

0V 0.2V

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The signals of the GE910 serial port are:

RS232

Number

Signal GE910

Pad Number

Name Usage

1 DCD - dcd_uart N14 Data Carrier Detect Output from the GE910 that indicates the

carrier presence

2 RXD - tx_uart M15 Transmit line *see Note Output transmit line of GE910 UART

3 TXD -rx_uart N15 Receive line *see Note Input receive of the GE910 UART

4 DTR - dtr_uart M14 Data Terminal Ready Input to the GE910 that controls the DTE

READY condition

5 GND P13 Ground ground

6 DSR - dsr_uart P14 Data Set Ready Output from the GE910 that indicates the

module is ready

7 RTS -rts_uart L14 Request to Send Input to the GE910 that controls the

Hardware flow control

8 CTS - cts_uart P15 Clear to Send Output from the GE910 that controls the

Hardware flow control

9 RI - ri_uart R14 Ring Indicator Output from the GE910 that indicates the

incoming call condition

NOTE:

According to V.24, RX/TX signal names are referred to the application side, therefore on the

GE910 side these signal are on the opposite direction: TXD on the application side will be

connected to the receive line (here named TXD/ rx_uart ) of the GE910 serial port and

viceversa for RX.

NOTE:

For a minimum implementation, only the TXD and RXD lines can be connected, the other lines

can be left open provided a software flow control is implemented.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the GE910 when the module is powered off or during

an ON/OFF transition.

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8.2. RS232 level translation

In order to interface the GE910 with a PC com port or a RS232 (EIA/TIA-232) application a

level translator is required. This level translator must:

• invert the electrical signal in both directions;

• change the level from 0/1.8V to +15/-15V

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower

levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level

translator. Note that the negative signal voltage must be less than 0V and hence some sort of

level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level

translator. There are a multitude of them, differing in the number of drivers and receivers and in

the levels (be sure to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The

receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

NOTE:

The digital input lines working at 1.8V CMOS have an absolute maximum input voltage of

2.1V; therefore the level translator IC shall not be powered by the +3.8V supply of the module.

Instead, it must be powered from a +1.8V (dedicated) power supply.

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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver

(MAX218).

In this case the chipset is capable to translate directly from 0/1.8V to the RS232 levels (Example done on

4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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9. USB Port

The GE910 includes one integrated universal serial bus (USB) transceiver:

• USB 2.0 FS

9.1. USB 2.0 FS

This port is compliant with the USB 2.0 specifications.

The following table is listing the available signals:

PAD

Signal I/O Function Type

B15 USB_D+ I/O USB differential Data (+) 3.3V

C15 USB_D- I/O USB differential Data (-) 3.3V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 12 MHz. The signal traces

should be routed carefully. Trace lengths, number of vias and capacitive loading should be

minimized. The impedance value should be as close as possible to 90 Ohms differential.

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10. Audio Section Overview

The Base Band Chip of the GE910 provides one differential input for audio to be transmitted

(Uplink) and a balanced BTL output for audio to be received (downlink).

The bias for the microphone has to be as clean as possible; the first connection (single ended) is

prefearable since the Vmic noise and ground noise are fed into the input as common mode and

then rejected. This sounds strange; usually the connection to use in order to reject the common

mode is the balanced one. In this situation we have to recall that the microphone is a sound to

current transducer, so the resistor is the current to tension transducer, so finally the resistor feeds

the input in balanced way even if the configuration, from a microphone point of view, seems to

be un-balanced.

For more information refer to Telit document: "80000NT10007a Audio Settings Application

Note".

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10.1. MIC connection

100n

2.2K

100

33pF 33pF

÷10u

Vmic

MIC+

MIC-

GND

÷10K

2÷5v

TELIT MODULE

INPUTADC

If a "balanced way" is anyway desired, much more care has to be taken to Vmic noise and

ground noise; also the 33pF-100Ohm-33pF RF-filter has to be doubled (one each wire).

100n 1K

100

33pF 33pF

100n 100

33pF 33pF

MIC+

MIC-

GND

Vmic

÷10K

2÷5v

÷10u

TELIT MODULE

INPUTADC

TIP: Since the J-FET transistor inside the microphone acts as RF-detector-amplifier, ask

vendor for a microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed

across the output terminals inside the case).

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10.2. LINE-IN connection

100n 100

33pF 33pF

100n 100

33pF 33pF

MIC+

MIC-

GND

LINE_IN+1

Remote_GND

TELIT MODULE

INPUTADC

100n 100

33pF 33pF

100n 100

33pF 33pF

MIC+

MIC-

GND

TELIT MODULE

INPUTADC

LINE_IN+

LINE_IN-

If the audio source is not a mike but a different device, the following connections can be done.

Place 100nF capacitor in series with both inputs, so the DC current is blocked.

Place the 33pF-100Ohm-33pF RF-filter, in order to prevent some EMI field to get into the high

impedance high gain MIC inputs.

Since the input is differential, the common mode voltage noise between the two (different)

ground is rejected, provided that both AF_IN+ & AF_IN- are connected directly onto the source.

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10.3. EAR connection

The audio output of the GE910 is balanced, this is helpful to double the level and to reject

common mode (click and pop are common mode and therefore rejected).

These outputs can drive directly a small loudspeaker with electrical impedance not lower than

8Ohm.

TIP: in order to get the maximum audio level at a given output voltage level (dBspl/Vrms), the

following breaking through procedure can be used. Have the loudspeaker as close as you can to

the listener (this simplify also the echo cancelling); choose the loudspeaker with the higher

sensitivity (dBspl per W); choose loudspeakers with the impedance close to the limit (ex: 16 or 8

Ohm), in order to feed more power inside the transducer (it increases the W/Vrms ratio). If this

were not enough, an external amplifier should be used.

EAR+

EAR-

MODULE

MODULEMODULE

MODULE

OUTPUT

DAC

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10.4. Electrical Characteristics

10.4.1. Input Lines

Microphone/Line-in path

Line Type Differential

Coupling capacitor ≥ 100nF

Differential input resistance 10kΩ

Levels

To have 0dBm0 @1KHz (*) Differential input voltage

AT#HFMICG=0 290mVrms

AT#HFMICG=1 (+6dB) 145mVrms

AT#HFMICG=2 (+12dB) 72mVrms

AT#HFMICG=3 (+18dB) 36mVrms

AT#HFMICG=4 (+24dB) 18mVrms

AT#HFMICG=5 (+30dB) 9mVrms

AT#HFMICG=6 (+36dB) 4.5mVrms

AT#HFMICG=7 (+42dB) 2.25mVrms

(*) 0 dBm0 in the network are -3.14 dBfs

TIP: The Electrect microphone is internally amplified by a J-Fet transistor, thus the sound is

carried out as saturation drain current; this means that the norton equivalence has to be

considered. The signal is converted to voltage on the 2.2KOhm resistance, from there on

circuitry has to be routed in order to not pick up common mode noise; beware of the return

path (ground).

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10.4.2. Output Lines

EAR/Line-out Output

Differential line coupling Direct connection (V

=1.3÷1.6V)

Single-ended line coupling

One EAR terminal connected via a

DC-block capacitor, the other one left

open

output load resistance ≥ 8 Ω

internal output resistance 4 Ω (typ.)

signal bandwidth 250÷3400Hz

(@ -3dB with default filter)

max. differential output voltage 1120mV

@3.14dBm0 (*)

differential output voltage 550mV

rms

@0dBm0 (*)

volume increment 2dB per step

volume steps 0..10

(*) in default condition: AT+CLVL=10, AT#HFRECG=0

WARNING: When in Single Ended configuration, the unused output line must be left open: if

this constraint is not respected, the output stage will be damaged.

TIP : We suggest driving the load differentially; this kills all the common mode noises (click

and pop, for example), the output swing will double (+6dB) and the big output coupling

capacitor will be avoided.

However if particular OEM application needs, also a Single Ended

(S.E)

circuitry can be

implemented. The OEM circuitry shall be designed to reduce the common mode noise typically

generated by the return path of the big currents.

In order to get the maximum power output from the device, the resistance of the tracks has to be

negligible in comparison to the load.

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11. General Purpose I/O

The general purpose I/O pads can be configured to act in three different ways:

• input

• output

• alternate function (internally controlled)

Input pads can be read; they report the digital value (high or low) present on the pad at the read

time .

Output pads can only be written or queried and set the value of the pad output.

An alternate function pad is internally controlled by the GE910 firmware and acts depending on

the function implemented.

The following table shows the available GPIO on the GE910 .

PAD

Signal I/O Function Type Drive

strength Default

State Note

C8 GPIO_01 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT Alternate function STAT LED

C9 GPIO_02 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

C10 GPIO_03 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

C11 GPIO_04 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

B14 GPIO_05 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

C12 GPIO_06 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

C13 GPIO_07 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

K15 GPIO_08 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

L15 GPIO_09 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V 1 mA INPUT

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11.1. GPIO Logic levels

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.

The following table shows the logic level specifications used in the GE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin

(CMOS 1.8) when on -0.3V

+2.1V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9V

Output low level 0V 0.2V

Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA

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11.2. Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and

report its status, provided this device has interface levels compatible with the 1.8V CMOS levels

of the GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface levels

different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a

47K pull up to 1.8V.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the GE910 when the module is powered off or during

an ON/OFF transition.

11.3. Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible

hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up

resistor may be omitted.

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11.4. Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status.

In the GE910 modules, the STAT_LED usually needs an external transistor to drive an external

LED.

Therefore, the status indicated in the following table is reversed with respect to the pin status.

LED status Device Status

Permanently off Device off

Fast blinking

(Period 1s, Ton 0,5s) Net search / Not registered /

turning off

Slow blinking

(Period 3s, Ton 0,3s) Registered full service

Permanently on a call is active

A schematic example could be:

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11.5. RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the

digital part, allowing having only RTC going on when all the other parts of the device are off.

To this power output a backup capacitor can be added in order to increase the RTC autonomy

during power off of the battery. NO Devices must be powered from this pin.

WARNING:

Never connect VRTC pin to VBATT.

11.6. External SIM Holder Implementation

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

11.7. ADC Converter

11.7.1. Description

The on board A/D are 10-bit converter. They are able to read a voltage level in the range of

0÷1,3 volts applied on the ADC pin input, store and convert it into 10 bit word.

Min Max Units

Input Voltage range 0 1.3 Volt

AD conversion - 10 bits

Resolution - < 1.3 mV

The input line is named as ADC_IN1 and it is available on PAD B1.

11.7.2. Using ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this

function.

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12. Mounting the GE910 on your Board

12.1. General

The GE910 modules have been designed in order to be compliant with a standard lead-free SMT

process.

12.2. Module finishing & dimensions

The GE910 overall dimensions are:

• Length: 28.2 mm

• Width: 28.2 mm

• Thickness: 2.70 mm

• Weight: 3.6 g

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12.3. Recommended foot print for the application

In order to easily rework the GE910 is suggested to consider on the application a 1.5mm Inhibit

area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical part

of the application in direct contact with the module.

NOTE:

In the customer application, the region under INHIBIT WIRING must be clear

from signal or ground paths.

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12.4. Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a

thickness of stencil foil ≥ 120µm.

12.5. PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

12.6. Recommendations for PCB pad dimensions (mm):

PCB

Copper Pad

Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

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It is not recommended to place via or micro-via not covered by solder resist in an area of

0.3 mm around the pads unless it carries the same signal of the pad itself (see following

figure).

Holes in pad are allowed only for blind holes and not for through holes. When using the hole in

pad, we suggest the via filling.

Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15 good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead-free

process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-

lead solder paste on the described surface plating is better compared to lead-free solder paste.

Inhibit area for micro

via

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12.7. Solder paste

Lead free

Solder paste Sn/Ag/Cu

We recommend to use only “no clean” solder paste in order to avoid the cleaning of the

modules after assembly.

12.7.1. GE910 Solder reflow

Recommended solder reflow profile

Tsmin

Tsmax

ttp

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Profile Feature

Profile FeatureProfile Feature

Profile Feature

PbPb

Pb-

-Free Ass

Free AssFree Ass

Free Assembly

emblyembly

embly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL

– Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak Temperature (Tp) 245 +0/-5°C

Time within 5°C of actual Peak

Temperature (tp)

10-30 seconds

Ramp-down Rate 6°C/second max.

Time 25°C to Peak Temperature (ttp) 8 minutes max.

NOTE:

All temperatures refer to topside of the package, measured on the package body surface

WARNING:

The GL865 module withstands one reflow process only.

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13. Debug of the GE910 in production

To test and debug the mounting of the GE910, we strongly recommend to foreseen test pads on

the host PCB, in order to check the connection between the GE910 itself and the application and

to test the performance of the module connecting it with an external computer. Depending by the

customer application, these pads include, but are not limited to the following signals:

• TXD

• RXD

• ON/OFF*

• HW SHUTDOWN*

• GND

• VBATT

• TX_AUX

• RX_AUX

•

PWRMON

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14. Packing system

14.1. Packing on tray

The GE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT

processes for pick & place handling.

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14.2. Moisture sensibility

The level of moisture sensibility of the Product is “3”, according with standard IPC/JEDEC J-

STD-020, take care of all the relative requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) The shelf life of the Product inside of the dry bag must be 12 months from the bag seal date,

when stored in a non-condensing atmospheric environment of <40°C / 90% RH

b) Environmental condition during the production: <= 30°C / 60% RH according to IPC/JEDEC

J-STD-033A paragraph 5

c) The maximum time between the opening of the sealed bag and the reflow process must be

168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more

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15. Conformity Assessment Issues

European Union - Directive 1999/5/EC

The GE910-QUAD module has been evaluated against the essential requirements of the 1999/5/EC Directive.

Bulgarian С настоящето Telit Communications S.p.A. декларира, че Quad Band GSM/GPRS module

отговаря на съществените изисквания и другите приложими изисквания на Директива

1999/5/ЕС.

Czech Telit Communications S.p.A. tímto prohlašuje, že tento Quad Band GSM/GPRS module je

ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr Quad Band

GSM/GPRS module overholder de væsentlige krav og øvrige relevante krav i direktiv

1999/5/EF.

Dutch Hierbij verklaart Telit Communications S.p.A. dat het toestel Quad Band GSM/GPRS

module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van

richtlijn 1999/5/EG.

English Hereby, Telit Communications S.p.A., declares that this Quad Band GSM/GPRS module is

in compliance with the essential requirements and other relevant provisions of Directive

1999/5/EC.

Estonian Käesolevaga kinnitab Telit Communications S.p.A. seadme Quad Band GSM/GPRS module

vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele

asjakohastele sätetele.

German Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät Quad Band GSM/GPRS

module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen

einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ∆ΗΛΩΝΕΙ ΟΤΙ Quad Band

GSM/GPRS module ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ

ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.

Hungarian Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a Quad Band GSM/GPRS module

megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb

elõírásainak.

Finnish Telit Communications S.p.A. vakuuttaa täten että Quad Band GSM/GPRS module tyyppinen

laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden

ehtojen mukainen.

French Par la présente Telit Communications S.p.A. déclare que l'appareil Quad Band GSM/GPRS

module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la

directive 1999/5/CE.

Icelandic Hér með lýsir Telit Communications S.p.A. yfir því að Quad Band GSM/GPRS module er í

samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian Con la presente Telit Communications S.p.A. dichiara che questo Quad Band GSM/GPRS

module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla

direttiva 1999/5/CE.

Latvian Ar šo Telit Communications S.p.A. deklarē, ka Quad Band GSM/GPRS module atbilst

Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

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Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis Quad Band GSM/GPRS module

atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese Hawnhekk, Telit Communications S.p.A., jiddikjara li dan Quad Band GSM/GPRS module

jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-

Dirrettiva 1999/5/EC.

Norwegian Telit Communications S.p.A. erklærer herved at utstyret Quad Band GSM/GPRS module er i

samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish Niniejszym Telit Communications S.p.A. oświadcza, że Quad Band GSM/GPRS module jest

zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami

Dyrektywy 1999/5/EC

Portuguese Telit Communications S.p.A. declara que este Quad Band GSM/GPRS module está

conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovak Telit Communications S.p.A. týmto vyhlasuje, že Quad Band GSM/GPRS module spĺňa

základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian Telit Communications S.p.A. izjavlja, da je ta Quad Band GSM/GPRS module v skladu z

bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.

Spanish Por medio de la presente Telit Communications S.p.A. declara que el Quad Band

GSM/GPRS module cumple con los requisitos esenciales y cualesquiera otras disposiciones

aplicables o exigibles de la Directiva 1999/5/CE.

Swedish Härmed intygar Telit Communications S.p.A. att denna Quad Band GSM/GPRS module står

I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser

som framgår av direktiv 1999/5/EG.

In order to satisfy the essential requirements of 1999/5/EC Directive, GE910-QUAD module is compliant with

the following standards:

RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.0.2

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-7 V1.3.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

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The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC

has been followed with the involvement of the following Notified Body Notified Body:

AT4 wireless, S.A.

Parque Tecnologico de Andalucía

C/ Severo Ochoa 2

29590 Campanillas – Málaga

SPAIN

Notified Body No: 1909

Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:

http://www.telit.com/

There is no restriction for the commercialisation of the GE910-QUAD module in all the countries of the

European Union.

Final product integrating this module must be assessed against essential requirements of the 1999/5/EC

(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit

Communications S.p.A. recommends carrying out the following assessments:

RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product.

EMC (R&TTE art. 3.1b) Testing

Health & Safety (R&TTE art. 3.1a) Testing

1909

19091909

1909

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FCC/IC Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications

could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout

changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this

device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de

brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled

environment. The antenna should be installed and operated with minimum distance of 20 cm between

the radiator and your body. Antenna gain must be below:

Frequency band Antenna gain

GSM 850 8.32 dBi

PCS 1900 3.34 dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non

contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source

de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Bande de fréquence Gain de l'antenne

GSM 850 8.32 dBi

PCS 1900 3.34 dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

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FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can radiate

radio frequency energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

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16. SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The

use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment

regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the

product. The product has to be supplied with a stabilized voltage source and the wiring has to be

conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself. Same cautions have to be taken for the SIM, checking

carefully the instruction for its use. Do not insert or remove the SIM when the product is in

power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to

be taken to the external components of the module, as well as of any project or installation issue,

because the risk of disturbing the GSM network or external devices or having impact on the

security. Should there be any doubt, please refer to the technical documentation and the

regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The

antenna has to be installed with care in order to avoid any interference with other electronic

devices and has to guarantee a minimum distance from the body (20 cm). In case of this

requirement cannot be satisfied, the system integrator has to assess the final product against the

SAR regulation.

The European Community provides some Directives for the electronic equipments introduced

on the market. All the relevant information’s are available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipments is available, while the

applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical

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17. Document History

Rev.0 2011-11-11 First Release Rev.0 Preliminary 1

Rev.1 2012-02-27 First Release Rev.1

Rev.2 2012-06-07 Added chapter 11.7 ADC Converter – renaming pin RESET# in HW SHUTDOWN*

Chapter 5.2 Power consumption

Rev.3 2012-06-20 Added chapter 12.3 inhibit area around the RF pins

Rev.4 2012-06-25 Updated chapter 15 Conformity Assessment Issues

Telit Communications S p A GE910 2G module User Manual 1vv0300962 GE910 Hardware User Guide r4

Telit Communications S.p.A. 2G module 1vv0300962 GE910 Hardware User Guide r4

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