Telit Communications S p A GE910 2G module User Manual 1vv0300962 GE910 Hardware User Guide r4

Telit Communications S.p.A. 2G module 1vv0300962 GE910 Hardware User Guide r4

User_guide

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GE910 Hardware User Guide
1vv0300962 Rev.4 – 2012-06-25
GE910
GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
APPLICABILITY TABLE
PRODUCT
GE910GE910-QUAD
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GE910
GE910 Hardware User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
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GE910 Hardware User Guide
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A.
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GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
Contents
1.
Introduction.....................................................................................................................................................................7
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
Scope........................................................................................................................................................................7
Audience ..................................................................................................................................................................7
Contact Information, Support...................................................................................................................................7
Document Organization ...........................................................................................................................................8
Text Conventions .....................................................................................................................................................9
Related Documents ..................................................................................................................................................9
2.
Overview ........................................................................................................................................................................10
3.
GE910 module connections ..........................................................................................................................................11
3.1.
3.2.
4.
PIN-OUT................................................................................................................................................................11
LGA PADs Layout.................................................................................................................................................16
Hardware Commands...................................................................................................................................................17
4.1.
Turning ON the GE910 ..........................................................................................................................................17
4.2.
Turning OFF the GE910 ........................................................................................................................................21
4.3.
HW Unconditional Shutdown on GE910 ...............................................................................................................23
4.3.1.
Hardware Unconditional shutdown ..............................................................................................................23
5.
Power Supply.................................................................................................................................................................26
5.1.
Power Supply Requirements ..................................................................................................................................26
5.2.
Power Consumption ...............................................................................................................................................27
5.3.
General Design Rules.............................................................................................................................................28
5.3.1.
Electrical Design Guidelines.........................................................................................................................28
5.3.2.
Thermal Design Guidelines ...........................................................................................................................31
5.3.3.
Power Supply PCB layout Guidelines ...........................................................................................................32
6.
Antenna..........................................................................................................................................................................33
6.1.
GSM Antenna Requirements .................................................................................................................................33
6.2.
GSM Antenna - PCB line Guidelines.....................................................................................................................34
6.3.
PCB Guidelines in case of FCC certification .........................................................................................................35
6.3.1.
Transmission line design ...............................................................................................................................35
6.3.2.
Transmission line measurements...................................................................................................................36
6.4.
GSM Antenna - Installation Guidelines .................................................................................................................38
7.
Logic level specifications ..............................................................................................................................................39
7.1.
8.
Unconditional Shutdown........................................................................................................................................40
Serial Ports ....................................................................................................................................................................41
8.1.
8.2.
9.
MODEM SERIAL PORT ......................................................................................................................................41
RS232 level translation ..........................................................................................................................................43
USB Port ........................................................................................................................................................................45
9.1.
10.
10.1.
10.2.
USB 2.0 FS ............................................................................................................................................................45
Audio Section Overview ...........................................................................................................................................46
MIC connection......................................................................................................................................................47
LINE-IN connection...............................................................................................................................................48
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10.3. EAR connection .....................................................................................................................................................49
10.4. Electrical Characteristics........................................................................................................................................50
10.4.1.
Input Lines .....................................................................................................................................................50
10.4.2.
Output Lines ..................................................................................................................................................51
11.
General Purpose I/O.................................................................................................................................................52
11.1. GPIO Logic levels..................................................................................................................................................53
11.2. Using a GPIO Pad as INPUT .................................................................................................................................54
11.3. Using a GPIO Pad as OUTPUT .............................................................................................................................54
11.4. Indication of network service availability ..............................................................................................................55
11.5. RTC Bypass out .....................................................................................................................................................56
11.6. External SIM Holder Implementation ....................................................................................................................56
11.7. ADC Converter ......................................................................................................................................................56
11.7.1.
Description ....................................................................................................................................................56
11.7.2.
Using ADC Converter ...................................................................................................................................56
12.
Mounting the GE910 on your Board.......................................................................................................................57
12.1. General ...................................................................................................................................................................57
12.2. Module finishing & dimensions .............................................................................................................................57
12.3. Recommended foot print for the application..........................................................................................................58
12.4. Stencil.....................................................................................................................................................................59
12.5. PCB pad design ......................................................................................................................................................59
12.6. Recommendations for PCB pad dimensions (mm): ...............................................................................................59
12.7. Solder paste ............................................................................................................................................................61
12.7.1.
GE910 Solder reflow .....................................................................................................................................61
13.
Debug of the GE910 in production..........................................................................................................................63
14.
Packing system..........................................................................................................................................................64
14.1.
14.2.
Packing on tray.......................................................................................................................................................64
Moisture sensibility................................................................................................................................................66
15.
Conformity Assessment Issues..................................................................................... Error! Bookmark not defined.
16.
SAFETY RECOMMANDATIONS.........................................................................................................................67
17.
Document History.....................................................................................................................................................73
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GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit GE910 module.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our GE910 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
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GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “GE910 Mechanical Dimensions”
Chapter 3: “GE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate on the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “Antenna” The antenna connection and board layout design are the most important
parts in the full product design.
Chapter 7: “Logic Level specifications” Specific values adopted in the implementation of logic
levels for this module.
Chapter 8: “Serial ports” The serial port on the Telit GE910 is the core of the interface between
the module and OEM hardware
Chapter 9: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
GE910 Telit Modules.
Chapter 10: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 11: “Mounting the GE910 on the application board” Recommendations and specifics on
how to mount the module on the user’s board.
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GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents
•
Telit's GSM/GPRS Family Software User Guide, 1vv0300784
•
Audio settings application note , 80000NT10007a
•
Digital Voice Interface Application Note, 80000NT10004a
•
GE910 Product description,
•
SIM Holder Design Guides, 80000NT10001a
•
AT Commands Reference Guide, 80000ST10025a
•
Telit EVK2 User Guide, 1vv0300704
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GE910
GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
2.
Overview
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit GE910 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot embrace
the whole hardware solutions and products that may be designed. The wrong solutions to be
avoided shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a starting
point for properly developing your product with the Telit GE910 module. For further hardware
details that may not be explained in this document refer to the Telit GE910 Product Description
document where all the hardware information is reported.
NOTICE:
(The integration of the GSM/GPRS GE910 cellular module within user application shall be
done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of
patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent rights of Telit Communications S.p.A. other than for
circuitry embodied in Telit products. This document is subject to change without notice.
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GE910
GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
3.
GE910 module connections
3.1.
PIN-OUT
PAD
Signal
I/O
Function
Type
COMMENT
USB HS 2.0 COMMUNICATION PORT
B15
USB_D+
I/O
USB differential Data (+)
C15
USB_D-
I/O
USB differential Data (-)
Asynchronous UART - Prog. / Data + HW Flow Control
N15
C103/TXD
Serial data input from DTE
CMOS 1.8V
M15
C104/RXD
Serial data output to DTE
CMOS 1.8V
M14
C108/DTR
CMOS 1.8V
L14
C105/RTS
P15
C106/CTS
Input for (DTR) from DTE
Input for Request to send signal
(RTS) from DTE
Output for Clear to Send signal
(CTS) to DTE
N14
C109/DCD
Output for (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
Output for (DSR) to DTE
CMOS 1.8V
R14
C125/RING
Output for Ring (RI) to DTE
CMOS 1.8V
Auxiliary UART (TX Data to DTE)
CMOS 1.8V
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Asynchronous Auxiliary UART
D15
E15
TX_AUX
RX_AUX
SIM card interface
A6
SIMCLK
External SIM signal – Clock
1.8 / 3V
A7
SIMRST
External SIM signal – Reset
1.8 / 3V
A5
SIMIO
I/O
1.8 / 3V
A4
SIMIN
A3
SIMVCC
External SIM signal – Data I/O
External SIM signal – Presence
(active low)
External SIM signal – Power supply
for the SIM
CMOS 1.8
1.8 / 3V
Analog Voice Interface
B2
EAR+
AO
Ear signal output, phase +
B3
EAR-
AO
Ear signal output, phase -
B4
MIC+
AI
Microphone signal input; phase +
B5
MIC-
AI
Microphone signal input; phase -
Digital Voice Interface (DVI)
B9
DVI_WA0
I/O
Digital Audio Interface (WA0)
CMOS 1.8V
B6
DVI_RX
I/O
Digital Audio Interface (RX)
CMOS 1.8V
B7
DVI_TX
I/O
Digital Audio Interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (CLK)
CMOS 1.8V
GPIO_01
I/O
GPIO_01 /STAT LED
CMOS 1.8V
DIGITAL IO
C8
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Alternate Function STAT LED
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GE910 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
ADC_IN1
AI
Analog to Digital converter input
A/D
ANTENNA
I/O
GSM/GPRS Antenna
(50 ohm)
RF
ADC
B1
Values 0 to 1.3V
RF SECTION
K1
MISCELLANEOUS FUNCTIONS
R13
HW_SHUTDOWN*
HW Unconditional Shutdown
CMOS 1.8V
Active low
R12
ON_OFF*
Input command for power ON
CMOS 1.8V
Active low
C14
VRTC
VRTC Backup capacitor
RTC Power
Backup for the embedded RTC
supply, don’t connect to VBATT!
R11
VAUX/PWRMON
Supply Output for external
accessories / Power ON Monitor
1.8V
VBATT
Main power supply (Baseband)
Power
M2
VBATT
Main power supply (Baseband)
Power
N1
VBATT_PA
Main power supply (Radio PA)
Power
N2
VBATT_PA
Main power supply (Radio PA)
Power
P1
VBATT_PA
Main power supply (Radio PA)
Power
P2
VBATT_PA
Main power supply (Radio PA)
Power
E1
GND
Ground
Power
G1
GND
Ground
Power
H1
GND
Ground
Power
J1
GND
Ground
Power
POWER SUPPLY
M1
L1
GND
Ground
Power
A2
GND
Ground
Power
E2
GND
Ground
Power
F2
GND
Ground
Power
G2
GND
Ground
Power
H2
GND
Ground
Power
J2
GND
Ground
Power
K2
GND
Ground
Power
L2
GND
Ground
Power
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R2
GND
Ground
Power
M3
GND
Ground
Power
N3
GND
Ground
Power
P3
GND
Ground
Power
R3
GND
Ground
Power
M4
GND
Ground
Power
N4
GND
Ground
Power
P4
GND
Ground
Power
R4
GND
Ground
Power
N5
GND
Ground
Power
P5
GND
Ground
Power
R5
GND
Ground
Power
N6
GND
Ground
Power
P6
GND
Ground
Power
R6
GND
Ground
Power
P8
GND
Ground
Power
R8
GND
Ground
Power
P9
GND
Ground
Power
P10
GND
Ground
Power
R10
GND
Ground
Power
M12
GND
Ground
Power
B13
GND
Ground
Power
P13
GND
Ground
Power
E14
GND
Ground
Power
C1
RESERVED
RESERVED
D1
RESERVED
RESERVED
C2
RESERVED
RESERVED
D2
RESERVED
RESERVED
C3
RESERVED
RESERVED
D3
RESERVED
RESERVED
E3
RESERVED
RESERVED
F3
RESERVED
RESERVED
G3
RESERVED
RESERVED
H3
RESERVED
RESERVED
RESERVED
J3
RESERVED
RESERVED
K3
RESERVED
RESERVED
L3
RESERVED
RESERVED
C4
RESERVED
RESERVED
C5
RESERVED
RESERVED
C6
RESERVED
RESERVED
C7
RESERVED
RESERVED
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N7
RESERVED
RESERVED
P7
RESERVED
RESERVED
N8
RESERVED
RESERVED
N9
RESERVED
RESERVED
A10
RESERVED
RESERVED
N10
RESERVED
RESERVED
N11
RESERVED
RESERVED
B12
RESERVED
RESERVED
D12
RESERVED
RESERVED
N12
RESERVED
RESERVED
P12
RESERVED
RESERVED
F14
RESERVED
RESERVED
G14
RESERVED
RESERVED
H14
RESERVED
RESERVED
J14
RESERVED
RESERVED
K14
RESERVED
RESERVED
N13
RESERVED
RESERVED
L13
RESERVED
RESERVED
J13
RESERVED
RESERVED
M13
RESERVED
RESERVED
K13
RESERVED
RESERVED
H13
RESERVED
RESERVED
G13
RESERVED
RESERVED
F13
RESERVED
RESERVED
A11
RESERVED
RESERVED
A12
RESERVED
RESERVED
B11
RESERVED
RESERVED
B10
RESERVED
RESERVED
A9
RESERVED
RESERVED
A8
RESERVED
RESERVED
A13
RESERVED
RESERVED
A14
RESERVED
RESERVED
D13
RESERVED
RESERVED
D14
RESERVED
RESERVED
H15
RESERVED
RESERVED
J15
RESERVED
RESERVED
F1
RESERVED
RESERVED
R9
RESERVED
RESERVED
R7
RESERVED
RESERVED
D4
RESERVED
RESERVED
E13
RESERVED
RESERVED
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F15
RESERVED
RESERVED
P11
RESERVED
RESERVED
WARNING:
Reserved pins must not be connected.
NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
PAD
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,
J2,K2,L2,R2,M3,N3,P3,R3,M4,
N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,B13,P13,E14
R12
R13
B15
C15
N15
M15
L14
P15
D15
E15
signal
VBATT & VBATT_PA
GND
ON/OFF*
HW_SHUTDOWN*
USB_D+
USB_DC103/TXD
C104/RXD
C105/RTS
C106/CTS
TXD_AUX
RXD_AUX
NOTE:
RTS pin should be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on it.
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3.2.
LGA PADs Layout
TOP VIEW
RES
RES
RES
GND
RES
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
EAR+
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
EAR-
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
MIC+
RES
RES
GND
GND
GND
GND
SIMIO
MIC-
RES
GND
GND
GND
SIMCL
DVI_RX
RES
GND
GND
GND
SIMRST
DVI_TX
RES
RES
RES
RES
RES
DVI_CL
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
RES
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
RES
RES
GPIO_06
RES
GND
RES
RES
ON_OFF*
13
RES
GND
GPIO_07
RES
VIO1_1V8
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SHU
TDOWN*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RIN
USB_D+
USB_D-
TX AUX
RX AUX
RES
GPIO_10
RES
RES
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as H4 has to be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
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4.
Hardware Commands
4.1.
Turning ON the GE910
To turn on the GE910 the pad ON-OFF* must be tied low for at least 5 seconds and then
released.
The maximum current that can be drained from the ON-OFF* pad is 0,2 mA.
A simple circuit to do it is:
NOTE:
Don't use any pull up resistor on the ON* line, it is internally pulled up. Using pull up resistor
may bring to latch up problems on the GE910 power regulator and improper power on/off of the
module. The line ON* must be connected only in open collector configuration.
NOTE:
In this document all the lines that are inverted, hence have active low signals are labelled with a
name that ends with”*" or with a bar over the name.
TIP:
To check if the device has powered on, the hardware line PWRMON should be monitored. The
device is powered on when PWRMON goes high.
NOTE:
It is mandatory to avoid sending data to the serial ports during the first 200mS of the module
start-up.
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The flow chart showing the proper turn on procedure is displayed below:
Modem ON Proc.
PWMON = ON?
DELAY= 300mSec
Enter AT
ON_OFF = LOW
Delay = 5 Sec
AT answer in 1Sec ?
ON_OFF = HIGH
PWMON = ON?
AT init sequence.
HW unconditional
SHUTDOWN
Delay 1s
Start AT CMD.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE910 when the module is powered off or during
an ON/OFF transition.
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The Flow chart showing the AT commands managing procedure is displayed below:
Start AT CMD.
DELAY= 300mSec
Enter AT
AT answer in
1Sec ?
AT init sequence.
HW unconditional
SHUTDOWN
Modem ON Proc.
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For example:
1- Let's assume you need to drive the ON* pad with a totem pole output of a +3/5 V
microcontroller:
2- Let's assume you need to drive the ON* pad directly with an ON/OFF button:
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4.2.
Turning OFF the GE910
Turning off of the device can be done in two ways:
•
via AT command (see GE910 Software User Guide, AT#SHDN)
•
by tying low pin ON*
Either ways, the device issues a detach request to network informing that the device will not be
reachable any more.
To turn OFF the GE910 the pad ON* must be tied low for at least 2 seconds and then released.
A Pulse duration less than 2 seconds should also start the power off procedure, but this is not
guaranteed.
The same circuitry and timing for the power on must be used.
The device shuts down after the release of the ON* pad.
TIP:
To check if the device has been powered off, the hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE910 when the module is powered off or during
an ON/OFF transition.
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The following flow chart shows the proper turnoff procedure:
Modem OFF Proc.
PWMON = ON?
ON_OFF = LOW
Delay = 2 Sec
ON_OFF = HIGH
Modem ON Proc.
PWMON = ON?
Delay 15s
PWMON = ON?
HW unconditional
SHUTDOWN
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4.3.
HW Unconditional Shutdown on GE910
4.3.1.
Hardware Unconditional shutdown
WARNING:
The hardware unconditional Shutdown must not be used during normal operation of the device
since it does not detach the device from the network. It shall be kept as an emergency exit
procedure to be done in the rare case that the device gets stacked waiting for some network or
SIM responses.
To unconditionally Shutdown the GE910, the pad HW_SHUTDOWN* must be tied low for at
least 200 milliseconds and then released. After this operation the module is in OFF condition.
The maximum current that can be drained from the HW_SHUTDOWN* pad is 0,4 mA.
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line or any totem pole digital output.
Using pull up resistor may bring to latch up problems on the GE910 power regulator and
improper functioning of the module. The line HW_SHUTDOWN* must be connected only in
open collector configuration.
TIP:
The unconditional hardware shutdown must always be implemented on the boards and the
software must use it as an emergency exit procedure.
A simple circuit to do it is:
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In the following flow chart is detailed the proper restart procedure:
HW unconditional
SHUTDOWN
HW SHUTDOWN* =
LOW
Delay 200ms
HW SHUTDOWN* =
HIGH
PWRMON = ON
Modem ON Proc.
Delay 1s
Disconnect PWR
supply
Modem ON Proc.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE910 when the module is powered off or during
an ON/OFF transition.
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For example:
1. Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output
of a +3/5 V microcontroller:
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5.
Power Supply
The power supply circuitry and board layout are a very important part in the full product design
and they strongly reflect on the product overall performances, hence read carefully the
requirements and the guidelines that will follow for a proper design.
5.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfill the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
3.8 V
3.40 V÷ 4.20 V
3.20 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken in order to fulfil
min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with completely assumption and
application of the HW User guide suggestions.
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5.2.
Power Consumption
The GE910 power consumptions are:
GE910
Average
Mode
(mA)
SWITCHED OFF
Switched Off
Typical 60uA
IDLE mode
AT+CFUN=1
21
AT+CFUN=4
18
3,8
AT+CFUN=0 or =5
2,5
2,4
1,2
CSD TX and RX mode
GSM900 CSD PL5
230
DCS1800 CSD PL0
175
GPRS (class 1) 1TX + 1RX
GSM900 PL5
225
DCS1800 PL0
160
GPRS (class 10) 2TX + 3RX
GSM900 PL5
360
DCS1800 PL0
290
Mode description
Module supplied but Switched Off
Normal mode: full functionality of the module
Disabled TX and RX; module is not registered on the network
Paging Multiframe 2
Paging Multiframe 3
Paging Multiframe 4
Paging Multiframe 9
GSM VOICE CALL
GPRS Sending data mode
GPRS Sending data mode
The GSM system is made in a way that the RF transmission is not continuous, else it is packed
into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as
about 2A. Therefore the power supply has to be designed in order to withstand with these
current peaks without big voltage drops; this means that both the electrical design and the board
layout must be designed for this current flow.
If the layout of the PCB is not well designed a strong noise floor is generated on the ground and
the supply; this will reflect on all the audio paths producing an audible annoying noise at 216
Hz; if the voltage drop during the peak current absorption is too much, then the device may even
shutdown as a consequence of the supply voltage drop.
NOTE:
The electrical design for the Power supply should be made ensuring it will be capable of a peak
current output of at least 2 A.
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5.3.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
• the electrical design
• the thermal design
• the PCB layout.
5.3.1.
Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where this
power is drained. We will distinguish them into three categories:
• +5V input (typically PC internal regulator output)
• +12V input (typically automotive)
• Battery
5.3.1.1.
+ 5V input Source Power Supply Design Guidelines
•
•
•
•
•
The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used. A
switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to dissipate
the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the GE910, a 100µF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
GE910 from power polarity inversion.
An example of linear regulator with 5V input is:
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5.3.1.2.
+ 12V input Source Power Supply Design Guidelines
•
•
•
•
•
•
•
•
The desired output for the power supply is 3.8V, hence due to the big difference between
the input source and the desired output, a linear regulator is not suited and shall not be
used. A switching power supply will be preferable because of its better efficiency
especially with the 2A peak current load represented by the GE910.
When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This
allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the application to
be developed due to the fact the switching frequency could also generate EMC
interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100µF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power input,
in order to clean the supply from spikes.
A protection diode should be inserted close to the power input, in order to save the
GE910 from power polarity inversion. This can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic:
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5.3.1.3.
Battery Source Power Supply Design Guidelines
•
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit GE910 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE
USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage
for the GE910 and damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE910. Their use
can lead to overvoltage on the GE910 and damage it. USE ONLY Li-Ion battery types.
•
•
•
•
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100µF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
GE910 from power polarity inversion. Otherwise the battery connector should be done in
a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks of
2A; the suggested capacity is from 500mAh to 1000mAh.
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5.3.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
See para 6.2 Power Consumption
NOTE:
The average consumption during transmissions depends on the power level at which the device
is requested to transmit by the network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if Power Saving function is enabled, it
is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
For the heat generated by the GE910, you can consider it to be during transmission 1W max
during CSD/VOICE calls and 2W max during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane under the GE910; you must
ensure that your application can dissipate it.
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5.3.3.
Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on
the output to cut the current peaks and a protection diode on the input to protect the supply from
spikes and polarity inversion. The placement of these components is crucial for the correct
working of the circuitry. A misplaced component can be useless or can even decrease the power
supply performances.
•
•
•
•
•
•
•
•
The Bypass low ESR capacitor must be placed close to the Telit GE910 power input pads
or in the case the power supply is a switching type it can be placed close to the inductor
to cut the ripple provided the PCB trace from the capacitor to the GE910 is wide enough
to ensure a dropless connection even during the 2A current peaks.
The protection diode must be placed close to the input connector where the power source
is drained.
The PCB traces from the input connector to the power regulator IC must be wide enough
to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this
is not made in order to save power loss but especially to avoid the voltage drops on the
power line at the current peaks frequency of 216 Hz that will reflect on all the
components connected to that supply, introducing the noise floor at the burst base
frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from
the power loss point of view, the same voltage drop may not be acceptable from the noise
point of view. If your application doesn't have audio interface but only uses the data
feature of the Telit GE910, then this noise is not so disturbing and power supply layout
design can be more forgiving.
The PCB traces to the GE910 and the Bypass capacitor must be wide enough to ensure
no significant voltage drops occur when the 2A current peaks are absorbed. This is for
the same reason as previous point. Try to keep this trace as short as possible.
The PCB traces connecting the Switching output to the inductor and the switching diode
must be kept as short as possible by placing the inductor and the diode very close to the
power switching IC (only for switching power supply). This is done in order to reduce
the radiated field (noise) at the switching frequency (100-500 kHz usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped to any
noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
The power supply input cables should be kept separate from noise sensitive lines such as
microphone/earphone cables.
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6.
Antenna
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read carefully
and follow the requirements and the guidelines for a proper design.
6.1.
GSM Antenna Requirements
As suggested on the Product Description the antenna and antenna transmission line on PCB for a
Telit GE910 device shall fulfill the following requirements:
Frequency range
Bandwidth
Gain
Impedance
Input power
VSWR absolute max
VSWR recommended
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the network
operator, the customer shall use the most suitable antenna
for that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in
DCS & 140 MHz PCS band
1.4dBi @900 and 3dBi @1800
1.4dBi @850 and 3dBi @1900
50Ω
>2W
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
When using the GE910, since there's no antenna connector on the module, the antenna must be
connected to the GE910 antenna pad (LGA pad K1) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the GE910, then a PCB
line is needed in order to connect with it or with its connector.
This transmission line shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50Ω
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the
GE910 ground pins
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Furthermore if the device is developed for the US market and/or Canada market, it shall comply
with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter. If antenna is installed with a separation
distance of less than 20 cm from all persons or is co-located or operating in conjunction with
any other antenna or transmitter then additional FCC/IC testing may be required. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure compliance.
Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating
configurations.
6.2.
GSM Antenna - PCB line Guidelines
•
•
•
•
•
•
•
•
•
•
•
•
•
Make sure that the transmission line’s characteristic impedance is 50Ω ;
Keep line on the PCB as short as possible, since the antenna line loss shall be less than
around 0,3 dB;
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line
afferent the antenna;
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related
canonical model;
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line with Ground, avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other signal tracks on
different layers;
The ground surrounding the antenna line on PCB has to be strictly connected to the main
Ground Plane by means of via holes (once per 2mm at least), placed close to the ground
edges facing line track;
Place EM noisy devices as far as possible from GE910 antenna line;
Keep the antenna line far away from the GE910 power supply lines;
If EM noisy devices are present on the PCB hosting the GE910, such as fast switching
ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB
and surround it with Ground planes, or shield it with a metal frame cover.
If EM noisy devices are not present around the line, the use of geometries like Microstrip
or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less
attenuation if compared to a Stripline having same length;
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6.3.
PCB Guidelines in case of FCC certification
In the case FCC certification is required for an application using GE910, according to FCC KDB
996369 for modular approval requirements, the transmission line has to be similar to that
implemented on GE910 interface board and described in the following chapter.
6.3.1.
Transmission line design
During the design of the GE910 interface board, the placement of components has been chosen
properly, in order to keep the line length as short as possible, thus leading to lowest power losses
possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of
transmission line ensures good impedance control and can be implemented in an outer PCB layer
as needed in this case. A SMA female connector has been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by
relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance
from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3,
while copper is removed from layer 2 underneath the line. Height of trace above ground plane is
1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB.
The line geometry is shown below:
0.3 mm
0.2 mm
6.
0.3 mm
L1
FR4
1.1 mm
L2
1.335 mm
0.035 mm
0.035 mm
0.035 mm
1.1 mm
L3
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6.3.2.
Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated
coaxial cable has been soldered at the pad corresponding to GE910 RF output; a SMA connector
has been soldered to the board in order to characterize the losses of the transmission line
including the connector itself. During Return Loss / impedance measurements, the transmission
line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is
shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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6.4.
GSM Antenna - Installation Guidelines
•
•
•
•
•
Install the antenna in a place covered by the GSM signal.
If the device antenna is located greater then 20cm from the human body and there are no
co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product
If the device antenna is located less then 20cm from the human body or there are no colocated transmitter then the additional FCC/IC testing may be required for the end
product (Telit FCC/IC approvals cannot be reused)
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer instructions.
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7.
Logic level specifications
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The
following table shows the logic level specifications used in the GE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V +2.1V
(CMOS 1.8) when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
Output high level
0V
1.6V
0V
0.35V
1.9V
0.2V
Output low level
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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7.1.
Unconditional Shutdown
Signal
HW_SHUTDOWN*
Function
Hardware unconditional Shutdown
I/O
Pin
R13
HW_SHUTDOWN* is used to unconditionally shutdown the GE910. Whenever this signal is
pulled low, the GE910 is unconditionally shutdown. When the device is reset it stops any
operation. After the release of the HW_SHUTDOWN* pin, the GE910 is unconditionally shut
down, without doing any detach operation from the network where it is registered. This behavior
is not a proper shut down because any GSM device is requested to issue a detach request on turn
off. For this reason the unconditional shutdown pin HW_SHUTDOWN* signal must not be used
to normally shutting down the device, but only as an emergency exit in the rare case the device
remains stuck waiting for some network response.
After the unconditional shutdown pin HW_SHUTDOWN* used the module is in off status.
It may only be used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the GE910. Use the ON/OFF signal to perform this function
or the AT#SHDN command.
This signal is internally pulled up so the pin can be left floating if not used.
NOTE:
if used, then it must always be connected with an open collector transistor.
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8.
Serial Ports
The serial port on the GE910 is the core of the interface between the module and OEM hardware.
2 serial ports are available on the module:
• MODEM SERIAL PORT 1 (Main, ASC0)
• MODEM SERIAL PORT 2 (Auxiliary, ASC1)
8.1.
MODEM SERIAL PORT
Several configurations can be designed for the serial port on the OEM hardware, but the most
common are:
• RS232 PC com port
• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
• microcontroller UART @ 3V or other voltages different from 1.8V
• microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be
needed to make the system work. The only configuration that doesn't need a level translation is
the 1.8V UART.
The serial port on the GE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the
PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE910
UART are the CMOS levels:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital -0.3V
+2.1V
pad when on
Input voltage on analog
-0.3V
+2.1V
pads when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level VIH
1.5V
1.9V
Input low level VIL
Output high level VOH
Output low level VOL
0V
1.6V
0V
0.35V
1.9V
0.2V
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The signals of the GE910 serial port are:
RS232
Pin
Number
Signal
GE910
Pad Number
Name
DCD - dcd_uart
N14
Data Carrier Detect
RXD - tx_uart
TXD -rx_uart
M15
N15
Transmit line *see Note
Receive line *see Note
DTR - dtr_uart
M14
Data Terminal Ready
GND
P13
Ground
DSR - dsr_uart
P14
Data Set Ready
RTS -rts_uart
L14
Request to Send
CTS - cts_uart
P15
Clear to Send
RI - ri_uart
R14
Ring Indicator
Usage
Output from the GE910 that indicates the
carrier presence
Output transmit line of GE910 UART
Input receive of the GE910 UART
Input to the GE910 that controls the DTE
READY condition
ground
Output from the GE910 that indicates the
module is ready
Input to the GE910 that controls the
Hardware flow control
Output from the GE910 that controls the
Hardware flow control
Output from the GE910 that indicates the
incoming call condition
NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore on the
GE910 side these signal are on the opposite direction: TXD on the application side will be
connected to the receive line (here named TXD/ rx_uart ) of the GE910 serial port and
viceversa for RX.
NOTE:
For a minimum implementation, only the TXD and RXD lines can be connected, the other lines
can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE910 when the module is powered off or during
an ON/OFF transition.
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8.2.
RS232 level translation
In order to interface the GE910 with a PC com port or a RS232 (EIA/TIA-232) application a
level translator is required. This level translator must:
•
invert the electrical signal in both directions;
•
change the level from 0/1.8V to +15/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less than 0V and hence some sort of
level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and in
the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The
receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
• 5 drivers
• 3 receivers
NOTE:
The digital input lines working at 1.8V CMOS have an absolute maximum input voltage of
2.1V; therefore the level translator IC shall not be powered by the +3.8V supply of the module.
Instead, it must be powered from a +1.8V (dedicated) power supply.
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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver
(MAX218).
In this case the chipset is capable to translate directly from 0/1.8V to the RS232 levels (Example done on
4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
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9.
USB Port
The GE910 includes one integrated universal serial bus (USB) transceiver:
• USB 2.0 FS
9.1.
USB 2.0 FS
This port is compliant with the USB 2.0 specifications.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
B15
USB_D+
I/O
USB differential Data (+)
3.3V
C15
USB_D-
I/O
USB differential Data (-)
3.3V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 12 MHz. The signal traces
should be routed carefully. Trace lengths, number of vias and capacitive loading should be
minimized. The impedance value should be as close as possible to 90 Ohms differential.
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10.
Audio Section Overview
The Base Band Chip of the GE910 provides one differential input for audio to be transmitted
(Uplink) and a balanced BTL output for audio to be received (downlink).
The bias for the microphone has to be as clean as possible; the first connection (single ended) is
prefearable since the Vmic noise and ground noise are fed into the input as common mode and
then rejected. This sounds strange; usually the connection to use in order to reject the common
mode is the balanced one. In this situation we have to recall that the microphone is a sound to
current transducer, so the resistor is the current to tension transducer, so finally the resistor feeds
the input in balanced way even if the configuration, from a microphone point of view, seems to
be un-balanced.
For more information refer to Telit document: "80000NT10007a Audio Settings Application
Note".
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10.1.
MIC connection
Vmic
1K ÷10K
MIC+
100n
2÷5v
1u÷10u
ADC
INPUT
2.2K
MIC-
100n
100
33pF
TELIT MODULE
33pF
GND
If a "balanced way" is anyway desired, much more care has to be taken to Vmic noise and
ground noise; also the 33pF-100Ohm-33pF RF-filter has to be
doubled (one each wire).
Vmic
1K ÷10K
2÷5v
1u÷10u
MIC+
100n
1K
100
33pF
ADC
33pF
INPUT
MIC-
100n
100
33pF
TELIT MODULE
GND
33pF
1K
TIP: Since the J-FET transistor inside the microphone acts as RF-detector-amplifier, ask
vendor for a microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed
across the output terminals inside the case).
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10.2.
LINE-IN connection
MIC+
100n
100
33pF
ADC
MIC-
100n
100
33pF
TELIT MODULE
33pF
GND
MIC+
100n
LINE_IN+1
Remote_GND
100
33pF
ADC
33pF
INPUT
33pF
INPUT
MIC-
100n
100
33pF
TELIT MODULE
33pF
LINE_IN+
LINE_IN-
GND
If the audio source is not a mike but a different device, the following connections can be done.
Place 100nF capacitor in series with both inputs, so the DC current is blocked.
Place the 33pF-100Ohm-33pF RF-filter, in order to prevent some EMI field to get into the high
impedance high gain MIC inputs.
Since the input is differential, the common mode voltage noise between the two (different)
ground is rejected, provided that both AF_IN+ & AF_IN- are connected directly onto the source.
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10.3.
EAR connection
EAR+
DAC OUTPUT
EAR-
MODULE
The audio output of the GE910 is balanced, this is helpful to double the level and to reject
common mode (click and pop are common mode and therefore rejected).
These outputs can drive directly a small loudspeaker with electrical impedance not lower than
8Ohm.
TIP: in order to get the maximum audio level at a given output voltage level (dBspl/Vrms), the
following breaking through procedure can be used. Have the loudspeaker as close as you can to
the listener (this simplify also the echo cancelling); choose the loudspeaker with the higher
sensitivity (dBspl per W); choose loudspeakers with the impedance close to the limit (ex: 16 or 8
Ohm), in order to feed more power inside the transducer (it increases the W/Vrms ratio). If this
were not enough, an external amplifier should be used.
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10.4.
Electrical Characteristics
10.4.1.
Input Lines
Microphone/Line-in path
Line Type
Differential
Coupling capacitor
≥ 100nF
Differential input resistance
10kΩ
Levels
To have 0dBm0 @1KHz (*)
AT#HFMICG=0
Differential input voltage
290mVrms
AT#HFMICG=1
(+6dB)
145mVrms
AT#HFMICG=2
(+12dB)
72mVrms
AT#HFMICG=3
(+18dB)
36mVrms
AT#HFMICG=4
(+24dB)
18mVrms
AT#HFMICG=5
(+30dB)
9mVrms
AT#HFMICG=6
(+36dB)
4.5mVrms
AT#HFMICG=7
(+42dB)
2.25mVrms
(*) 0 dBm0 in the network are -3.14 dBfs
TIP: The Electrect microphone is internally amplified by a J-Fet transistor, thus the sound is
carried out as saturation drain current; this means that the norton equivalence has to be
considered. The signal is converted to voltage on the 2.2KOhm resistance, from there on
circuitry has to be routed in order to not pick up common mode noise; beware of the return
path (ground).
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10.4.2.
Output Lines
EAR/Line-out Output
Direct connection (VDC=1.3÷1.6V)
Differential line coupling
One EAR terminal connected via a
Single-ended line coupling
DC-block capacitor, the other one left
open
output load resistance
≥8Ω
internal output resistance
4 Ω (typ.)
signal bandwidth
max. differential output voltage
250÷3400Hz
(@ -3dB with default filter)
1120mVpp @3.14dBm0 (*)
differential output voltage
550mVrms @0dBm0 (*)
volume increment
2dB per step
volume steps
0..10
(*) in default condition: AT+CLVL=10, AT#HFRECG=0
TIP : We suggest driving the load differentially; this kills all the common mode noises (click
and pop, for example), the output swing will double (+6dB) and the big output coupling
capacitor will be avoided.
However if particular OEM application needs, also a Single Ended (S.E) circuitry can be
implemented. The OEM circuitry shall be designed to reduce the common mode noise typically
generated by the return path of the big currents.
In order to get the maximum power output from the device, the resistance of the tracks has to be
negligible in comparison to the load.
WARNING: When in Single Ended configuration, the unused output line must be left open: if
this constraint is not respected, the output stage will be damaged.
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11.
General Purpose I/O
The general purpose I/O pads can be configured to act in three different ways:
•
•
•
input
output
alternate function (internally controlled)
Input pads can be read; they report the digital value (high or low) present on the pad at the read
time .
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the GE910 firmware and acts depending on
the function implemented.
The following table shows the available GPIO on the GE910 .
CMOS 1.8V
Drive
strength
1 mA
Default
State
INPUT
CMOS 1.8V
1 mA
INPUT
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
PAD
Signal
I/O
Function
Type
C8
GPIO_01
I/O
Configurable GPIO
C9
GPIO_02
I/O
Configurable GPIO
C10
GPIO_03
I/O
C11
GPIO_04
I/O
B14
GPIO_05
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C12
GPIO_06
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C13
GPIO_07
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
K15
GPIO_08
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
L15
GPIO_09
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
G15
GPIO_10
I/O
Configurable GPIO
CMOS 1.8V
1 mA
INPUT
Note
Alternate function STAT LED
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11.1.
GPIO Logic levels
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the GE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V +2.1V
(CMOS 1.8) when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
Output high level
0V
1.6V
0V
0.35V
1.9V
0.2V
Output low level
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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11.2.
Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another device and
report its status, provided this device has interface levels compatible with the 1.8V CMOS levels
of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface levels
different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a
47K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE910 when the module is powered off or during
an ON/OFF transition.
11.3.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
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11.4.
Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call status.
In the GE910 modules, the STAT_LED usually needs an external transistor to drive an external
LED.
Therefore, the status indicated in the following table is reversed with respect to the pin status.
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device Status
Device off
Net search / Not registered /
turning off
Registered full service
a call is active
A schematic example could be:
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11.5.
RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing having only RTC going on when all the other parts of the device are off.
To this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery. NO Devices must be powered from this pin.
WARNING:
Never connect VRTC pin to VBATT.
11.6.
External SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
11.7.
ADC Converter
11.7.1.
Description
The on board A/D are 10-bit converter. They are able to read a voltage level in the range of
0÷1,3 volts applied on the ADC pin input, store and convert it into 10 bit word.
Input Voltage range
AD conversion
Resolution
Min
Max
1.3
10
< 1.3
Units
Volt
bits
mV
The input line is named as ADC_IN1 and it is available on PAD B1.
11.7.2.
Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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12.
Mounting the GE910 on your Board
12.1.
General
The GE910 modules have been designed in order to be compliant with a standard lead-free SMT
process.
12.2.
Module finishing & dimensions
The GE910 overall dimensions are:
•
•
•
•
Length:
Width:
Thickness:
Weight:
28.2 mm
28.2 mm
2.70 mm
3.6 g
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12.3.
Recommended foot print for the application
In order to easily rework the GE910 is suggested to consider on the application a 1.5mm Inhibit
area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical part
of the application in direct contact with the module.
NOTE: In the customer application, the region under INHIBIT WIRING must be clear
from signal or ground paths.
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12.4.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
12.5.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper Pad
Pad
Solder Mask
PCB
SMD
(Solder Mask Defined)
12.6.
NSMD
(Non Solder Mask Defined)
Recommendations for PCB pad dimensions (mm):
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It is not recommended to place via or micro-via not covered by solder resist in an area of
0.3 mm around the pads unless it carries the same signal of the pad itself (see following
figure).
Inhibit area for micro-via
Holes in pad are allowed only for blind holes and not for through holes. When using the hole in
pad, we suggest the via filling.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Electro-less Ni / Immersion Au
3 –7 / 0.05 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tinlead solder paste on the described surface plating is better compared to lead-free solder paste.
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12.7.
Solder paste
Solder paste
Lead free
Sn/Ag/Cu
We recommend to use only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
12.7.1.
GE910 Solder reflow
Recommended solder reflow profile
tp
TL
tL
Tsmax
Tsmin
ts
ttp
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Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (ttp)
PbPb -Free Assembly
Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body surface
WARNING:
The GL865 module withstands one reflow process only.
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13.
Debug of the GE910 in production
To test and debug the mounting of the GE910, we strongly recommend to foreseen test pads on
the host PCB, in order to check the connection between the GE910 itself and the application and
to test the performance of the module connecting it with an external computer. Depending by the
customer application, these pads include, but are not limited to the following signals:
• TXD
• RXD
• ON/OFF*
• HW SHUTDOWN*
• GND
• VBATT
• TX_AUX
• RX_AUX
• PWRMON
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14.
Packing system
14.1.
Packing on tray
The GE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT
processes for pick & place handling.
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14.2.
Moisture sensibility
The level of moisture sensibility of the Product is “3”, according with standard IPC/JEDEC JSTD-020, take care of all the relative requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) The shelf life of the Product inside of the dry bag must be 12 months from the bag seal date,
when stored in a non-condensing atmospheric environment of <40°C / 90% RH
b) Environmental condition during the production: <= 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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15.
Conformity Assessment Issues
European Union - Directive 1999/5/EC
The GE910-QUAD module has been evaluated against the essential requirements of the 1999/5/EC Directive.
Bulgarian
Czech
Danish
Dutch
English
Estonian
German
Greek
Hungarian
Finnish
French
Icelandic
Italian
Latvian
С настоящето Telit Communications S.p.A. декларира, че Quad Band GSM/GPRS module
отговаря на съществените изисквания и другите приложими изисквания на Директива
1999/5/ЕС.
Telit Communications S.p.A. tímto prohlašuje, že tento Quad Band GSM/GPRS module je
ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr Quad Band
GSM/GPRS module overholder de væsentlige krav og øvrige relevante krav i direktiv
1999/5/EF.
Hierbij verklaart Telit Communications S.p.A. dat het toestel Quad Band GSM/GPRS
module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.
Hereby, Telit Communications S.p.A., declares that this Quad Band GSM/GPRS module is
in compliance with the essential requirements and other relevant provisions of Directive
1999/5/EC.
Käesolevaga kinnitab Telit Communications S.p.A. seadme Quad Band GSM/GPRS module
vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele
asjakohastele sätetele.
Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät Quad Band GSM/GPRS
module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen
einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ∆ΗΛΩΝΕΙ ΟΤΙ Quad Band
GSM/GPRS module ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ
ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.
Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a Quad Band GSM/GPRS module
megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb
elõírásainak.
Telit Communications S.p.A. vakuuttaa täten että Quad Band GSM/GPRS module tyyppinen
laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden
ehtojen mukainen.
Par la présente Telit Communications S.p.A. déclare que l'appareil Quad Band GSM/GPRS
module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.
Hér með lýsir Telit Communications S.p.A. yfir því að Quad Band GSM/GPRS module er í
samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC
Con la presente Telit Communications S.p.A. dichiara che questo Quad Band GSM/GPRS
module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla
direttiva 1999/5/CE.
Ar šo Telit Communications S.p.A. deklarē, ka Quad Band GSM/GPRS module atbilst
Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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Lithuanian
Maltese
Norwegian
Polish
Portuguese
Slovak
Slovenian
Spanish
Swedish
Šiuo Telit Communications S.p.A. deklaruoja, kad šis Quad Band GSM/GPRS module
atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Hawnhekk, Telit Communications S.p.A., jiddikjara li dan Quad Band GSM/GPRS module
jikkonforma mal-ħtiāijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fidDirrettiva 1999/5/EC.
Telit Communications S.p.A. erklærer herved at utstyret Quad Band GSM/GPRS module er i
samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.
Niniejszym Telit Communications S.p.A. oświadcza, Ŝe Quad Band GSM/GPRS module jest
zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami
Dyrektywy 1999/5/EC
Telit Communications S.p.A. declara que este Quad Band GSM/GPRS module está
conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Telit Communications S.p.A. týmto vyhlasuje, že Quad Band GSM/GPRS module spĺňa
základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.
Telit Communications S.p.A. izjavlja, da je ta Quad Band GSM/GPRS module v skladu z
bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.
Por medio de la presente Telit Communications S.p.A. declara que el Quad Band
GSM/GPRS module cumple con los requisitos esenciales y cualesquiera otras disposiciones
aplicables o exigibles de la Directiva 1999/5/CE.
Härmed intygar Telit Communications S.p.A. att denna Quad Band GSM/GPRS module står
I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser
som framgår av direktiv 1999/5/EG.
In order to satisfy the essential requirements of 1999/5/EC Directive, GE910-QUAD module is compliant with
the following standards:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
EN 301 511 V9.0.2
EN 301 489-1 V1.9.2
EN 301 489-7 V1.3.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
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The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC
has been followed with the involvement of the following Notified Body Notified Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas – Málaga
SPAIN
Notified Body No: 1909
Thus, the following marking is included in the product:
1909
The full declaration of conformity can be found on the following address:
http://www.telit.com/
There is no restriction for the commercialisation of the GE910-QUAD module in all the countries of the
European Union.
Final product integrating this module must be assessed against essential requirements of the 1999/5/EC
(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit
Communications S.p.A. recommends carrying out the following assessments:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
It will depend on the antenna used on the final product.
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
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FCC/IC Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications
could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout
changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled
environment. The antenna should be installed and operated with minimum distance of 20 cm between
the radiator and your body. Antenna gain must be below:
Frequency band
GSM 850
PCS 1900
Antenna gain
8.32 dBi
3.34 dBi
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non
contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source
de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:
Bande de fréquence
GSM 850
PCS 1900
Gain de l'antenne
8.32 dBi
3.34 dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
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16.
SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The
use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as hospitals,
airports, aircrafts, etc
Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific environment
regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
We recommend following the instructions of the hardware user guides for a correct wiring of the
product. The product has to be supplied with a stabilized voltage source and the wiring has to be
conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM, checking
carefully the instruction for its use. Do not insert or remove the SIM when the product is in
power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has to
be taken to the external components of the module, as well as of any project or installation issue,
because the risk of disturbing the GSM network or external devices or having impact on the
security. Should there be any doubt, please refer to the technical documentation and the
regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The
antenna has to be installed with care in order to avoid any interference with other electronic
devices and has to guarantee a minimum distance from the body (20 cm). In case of this
requirement cannot be satisfied, the system integrator has to assess the final product against the
SAR regulation.
The European Community provides some Directives for the electronic equipments introduced
on the market. All the relevant information’s are available on the European Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication equipments is available, while the
applicable Directives (Low Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical
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17.
Document History
Revision
Date
Rev.0
Rev.1
Rev.2
2011-11-11
2012-02-27
2012-06-07
Rev.3
Rev.4
2012-06-20
2012-06-25
Changes
First Release Rev.0 Preliminary 1
First Release Rev.1
Added chapter 11.7 ADC Converter – renaming pin RESET# in HW SHUTDOWN*
Chapter 5.2 Power consumption
Added chapter 12.3 inhibit area around the RF pins
Updated chapter 15 Conformity Assessment Issues
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Mod. 0805 2011-07 Rev.2
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