Telit Communications S p A HE910NA 2G/3.5G module, HE910-NAG; HE910-NAR; HE910-NAD User Manual HE910 Hardware User Guide

Telit Communications S.p.A. 2G/3.5G module, HE910-NAG; HE910-NAR; HE910-NAD HE910 Hardware User Guide

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HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

PRODUCT

HE910

HE910-GA

HE910-D

HE910-EUR

HE910-EUD

HE910-EUG

HE910-NAR

HE910-NAD

HE910-NAG

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

DISCLAIMER

The information contained in this document is the proprietary information of Telit

Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any

disclosure to persons other than the officers, employees, agents or subcontractors of the owner

or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available.

Notwithstanding the foregoing, Telit does not make any warranty as to the information

contained herein, and does not accept any liability for any injury, loss or damage of any kind

incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this

document, and notes that the application of the device must comply with the safety standards of

the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to

typographical errors, inaccurate information, or improvements to programs and/or equipment at

any time and without notice. Such changes will, nevertheless be incorporated into new editions

of this application note.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

1 INTRODUCTION ......................................................................................................................................................... 7

1.1 SCOPE ................................................................................................................................................................................ 7

1.2 AUDIENCE ........................................................................................................................................................................... 7

1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 7

1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 8

1.5 TEXT CONVENTIONS .............................................................................................................................................................. 9

1.6 RELATED DOCUMENTS ........................................................................................................................................................... 9

1.7 DOCUMENT HISTORY .......................................................................................................................................................... 10

2 OVERVIEW .............................................................................................................................................................. 11

3 HE910 MODULE CONNECTIONS ............................................................................................................................... 12

3.1 PIN-OUT ......................................................................................................................................................................... 12

3.1.1 LGA Pads Layout (HE910 and HE910-GA) .............................................................................................................. 18

3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 19

3.1.3 LGA Pads Layout (HE910-EUx and HE910-NAx) ..................................................................................................... 20

3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG) .................................................................................................... 21

4 HARDWARE COMMANDS ........................................................................................................................................ 22

4.1 TURNING ON THE HE910 ................................................................................................................................................... 22

4.2 TURNING OFF THE HE910 .................................................................................................................................................. 27

4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 29

4.4 HE910 RESET .................................................................................................................................................................. 32

5 POWER SUPPLY ....................................................................................................................................................... 35

5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 35

5.2 POWER CONSUMPTION ....................................................................................................................................................... 36

5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 37

5.3.1 Electrical Design Guidelines ................................................................................................................................... 37

5.3.2 Thermal Design Guidelines ..................................................................................................................................... 41

5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 42

6 GSM/WCDMA RADIO SECTION ............................................................................................................................... 43

6.1 HE910 PRODUCT VARIANTS ................................................................................................................................................ 43

6.2 TX OUTPUT POWER ............................................................................................................................................................ 43

6.3 SENSITIVITY ....................................................................................................................................................................... 44

6.4 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 44

6.5 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 45

6.6 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 46

6.7 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 47

7 GPS RECEIVER .......................................................................................................................................................... 48

7.1 GPS PERFORMANCES .......................................................................................................................................................... 48

7.2 GPS SIGNALS PINOUT ......................................................................................................................................................... 49

7.3 RF FRONT END DESIGN ....................................................................................................................................................... 49

7.3.1 RF Signal Requirements .......................................................................................................................................... 49

7.3.2 GPS Antenna Polarization ...................................................................................................................................... 50

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

7.3.3 GPS Antenna Gain .................................................................................................................................................. 51

7.3.4 Active versus Passive Antenna ............................................................................................................................... 51

7.3.5 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 52

7.3.6 RF Trace Losses....................................................................................................................................................... 52

7.3.7 Implications of the Pre-select SAW Filter ............................................................................................................... 53

7.3.8 External LNA Gain and Noise Figure....................................................................................................................... 53

7.3.9 Powering the External LNA (active antenna) ......................................................................................................... 53

7.3.10 External LNA Enable ............................................................................................................................................. 54

7.3.11 Shielding ............................................................................................................................................................... 55

7.3.12 GPS Antenna - Installation ................................................................................................................................... 55

8 LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 56

8.1 RESET SIGNAL .................................................................................................................................................................... 57

9 USB PORT ................................................................................................................................................................ 58

9.1 USB 2.0 HS ...................................................................................................................................................................... 58

10 SPI PORT ................................................................................................................................................................. 59

10.1 SPI CONNECTIONS ............................................................................................................................................................ 60

11 SERIAL PORTS .......................................................................................................................................................... 61

11.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 62

11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 64

11.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 65

12 AUDIO SECTION OVERVIEW .................................................................................................................................... 67

12.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 67

12.1.1 CODEC Examples .................................................................................................................................................. 67

13 GENERAL PURPOSE I/O ........................................................................................................................................... 68

13.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 69

13.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 70

13.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 70

13.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 71

13.5 RTC BYPASS OUT ............................................................................................................................................................. 72

13.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 72

13.7 VAUX POWER OUTPUT ..................................................................................................................................................... 72

13.8 ADC CONVERTER ............................................................................................................................................................. 73

13.8.1 Description ........................................................................................................................................................... 73

13.8.2 Using ADC Converter ............................................................................................................................................ 73

14 MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 74

14.1 GENERAL ........................................................................................................................................................................ 74

14.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 74

14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 76

14.4 STENCIL .......................................................................................................................................................................... 77

14.5 PCB PAD DESIGN .............................................................................................................................................................. 77

14.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 78

14.7 SOLDER PASTE .................................................................................................................................................................. 80

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

14.7.1 HE910 Solder reflow ............................................................................................................................................. 80

14.8 PACKING SYSTEM .............................................................................................................................................................. 82

14.9 MOISTURE SENSITIVITY ...................................................................................................................................................... 84

15 SAFETY RECOMMANDATIONS ................................................................................................................................. 85

16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 86

16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 86

16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 90

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit HE910 module.

This document is intended for Telit customers, who are integrators, about to implement their

applications using our HE910 modules.

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit’s Technical Support Center (TTSC) at:

TS-EMEA@telit.com

TS-NORTHAMERICA@telit.com

TS-LATINAMERICA@telit.com

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on

accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users of our information.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

This document contains the following chapters:

Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

Chapter 2: “Overview” provides an overview of the document.

Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout.

Chapter 4: “Hardware Commands” How to operate on the module via hardware.

Chapter 5: “Power supply” Power supply requirements and general design rules.

Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the

most important parts in the full product design.

Chapter 7: “GPS Receiver” This section describes the GPS receiver.

Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic

levels for this module.

Chapter 9: “USB Port” The USB port on the Telit HE910 is the core of the interface between the

module and OEM hardware

Chapter 10: “SPI port” Refers to the SPI port of the Telit HE910

Chapter 11: “Serial ports” Refers to the serial ports of the Telit HE910

Chapter 12: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the

HE910 Telit Modules.

Chapter 13: “General Purpose I/O” How the general purpose I/O pads can be configured.

Chapter 14: “Mounting the HE910 on the application board” Mechanical dimensions and

recommendations on how to mount the module on the user’s board.

Chapter 15: “Safety Recommendations” Information related to the Safety topics.

Chapter 16: “Conformity Assessment Issues” Information related to the Conformity

Assessments.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Danger – This information MUST be followed or catastrophic equipment failure or bodily

injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if

these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating

the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

HE910 Digital Voice Interface Application Note 80000NT10050A

HE910 SPI Port Application Note 80000NT10053A

HE910 Product description 80378ST10085a

SIM Holder Design Guides 80000NT10001a

AT Commands Reference Guide 80378ST10091A

Telit EVK2 User Guide 1vv0300704

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

ISSUE#0

2011-03-31

Preliminary Version

ISSUE#1

2011-05-19

Updated pinout on UART1

ISSUE#2

2011-05-25

Update chapter 13

ISSUE#3

2011-07-25

Added DVI app note references; chapter 4.1

ISSUE#4

2011-07-29

Updated audio, on_off/reset and digital sections

ISSUE#5

2011-10-18

Added STAT_LED info, Updated SPI pinout

ISSUE#6

2011-12-22

- Pads A8, A9, D14, A14 now reserved

Power supply extended to 3.3 V

- par 4.3 renamed as “unconditional shutdown”

- USIF0 USIF1 names added to Main and AUX serial ports

- Updated IO logic levels

- Updated module’s mechanical drawing

- IO levels selection 1.8/1.2 removed (now only 1.8)

ISSUE#7

2012-01-16

Added HE910-GA and –D; added Conformity assessment chapter

ISSUE#8

2012-02-03

Chapter 5.1 updated

ISSUE#9

2012-02-07

Chapter 4.2 updated

ISSUE#10

2012-03-16

Added ADC in pinout description; added GPS specification; updated Chapter

13 and 14;

ISSUE#11

2012-03-26

Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9

ISSUE#12

2012-03-27

Added HE910-EU and NA products

ISSUE#13

2012-03-28

Updated paragraph 14.9

ISSUE#14

2012-05-08

Added EUR, EUD, NAR, NAD variants; added Sensitivity and TX Power

Class specifications. Updated par 14.7.1 and 14.3

ISSUE#15

2012-05-30

Updated Chapter 16.2; 7.3.8

ISSUE#16

2012-06-06

Pin R13 renamed as HW_SHUTDOWN*, Pin P11 adeed in pinout as RESET*

ISSUE#17

2012-06-14

Updated RTT&E info on HE910-NAG, NAR, NAD

ISSUE#18

2012-06-15

Updated RTT&E info on HE910-NAG, NAR, NAD ; updated par 3.1;

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit HE910 module.

In this document all the basic functions of a mobile phone will be taken into account; for each

one of them a proper hardware solution will be suggested and eventually the wrong solutions

and common errors to be avoided will be evidenced. Obviously this document cannot embrace

the whole hardware solutions and products that may be designed. The wrong solutions to be

avoided shall be considered as mandatory, while the suggested hardware configurations shall not

be considered mandatory, instead the information given shall be used as a guide and a starting

point for properly developing your product with the Telit HE910 module. For further hardware

details that may not be explained in this document refer to the Telit HE910 Product Description

document where all the hardware information is reported.

NOTICE:

(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall

be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910 all’interno dell’applicazione

dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der

in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati

projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los

cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur

sera faite selon les règles de conception décrites dans ce manuel.

(HE)

The information presented in this document is believed to be accurate and reliable. However, no

responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or

other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in

Telit products. This document is subject to change without notice.

HE910

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

PAD

Signal

I/O

Function

Type

COMMENT

USB HS 2.0 COMMUNICATION PORT

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

VUSB

Power sense for the internal USB

transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15

C103/TXD

Serial data input from DTE

CMOS 1.8V

M15

C104/RXD

Serial data output to DTE

CMOS 1.8V

M14

C108/DTR

Input for (DTR) from DTE

CMOS 1.8V

L14

C105/RTS

Input for Request to send signal

(RTS) from DTE

CMOS 1.8V

P15

C106/CTS

Output for Clear to Send signal

(CTS) to DTE

CMOS 1.8V

N14

C109/DCD

Output for (DCD) to DTE

CMOS 1.8V

P14

C107/DSR

Output for (DSR) to DTE

CMOS 1.8V

R14

C125/RING

Output for Ring (RI) to DTE

CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

D15

TX_AUX

Auxiliary UART (TX Data to DTE)

CMOS 1.8V

E15

RX_AUX

Auxiliary UART (RX Data from

DTE)

CMOS 1.8V

D13

VDD_IO1

VDD_IO1 Input

To be connected to E13

E13

1V8_SEL

1V8 SEL for VDD_IO1

To be connected to D13

SIM card interface

SIMCLK

External SIM signal – Clock

1.8 / 3V

SIMRST

External SIM signal – Reset

1.8 / 3V

SIMIO

I/O

External SIM signal – Data I/O

1.8 / 3V

SIMIN

External SIM signal – Presence

(active low)

CMOS 1.8

SIMVCC

External SIM signal – Power supply

for the SIM

1.8 / 3V

Digital Voice Interface (DVI)

DVI_WA0

I/O

Digital Audio Interface (WA0)

CMOS 1.8V

DVI_RX

I/O

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

I/O

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (CLK)

CMOS 1.8V

SPI

D15

SPI_MOSI

SPI MOSI

CMOS 1.8V

Shared with TX_AUX

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

E15

SPI_MISO

CMOS 1.8V

Shared with RX_AUX

F15

SPI_CLK

SPI Clock

CMOS 1.8V

H15

SPI_MRDY

CMOS 1.8V

J15

SPI_SRDY

CMOS 1.8V

DIGITAL IO

GPIO_01

I/O

GPIO_01 /STAT LED

CMOS 1.8V

Alternate Function STAT LED

GPIO_02

I/O

GPIO_02

CMOS 1.8V

C10

GPIO_03

I/O

GPIO_03

CMOS 1.8V

C11

GPIO_04

I/O

GPIO_04

CMOS 1.8V

B14

GPIO_05

I/O

GPIO_05

CMOS 1.8V

C12

GPIO_06

I/O

GPIO_06

CMOS 1.8V

C13

GPIO_07

I/O

GPIO_07

CMOS 1.8V

K15

GPIO_08

I/O

GPIO_08

CMOS 1.8V

L15

GPIO_09

I/O

GPIO_09

CMOS 1.8V

G15

GPIO_10

I/O

GPIO_10

CMOS 1.8V

ADC

ADC_IN1

Analog / Digital converter input

A/D

Accepted values 0 to 1.2V DC

RF SECTION

ANTENNA

I/O

GSM/EDGE/UMTS Antenna

(50 ohm)

ANT_DIV

Antenna Diversity Input

(50 ohm)

See NOTE 1

GPS SECTION (see NOTE1)

ANT_GPS

GPS Antenna (50 ohm)

GPS_LNA_EN

Output enable for External LNA

supply

CMOS 1.8V

Miscellaneous Functions

R13

HW_SHUTDOWN*

HW Unconditional Shutdown

CMOS 1.8V

Active low

P11

RESET*

HW Unconditional Restart

CMOS 1.8V

Active low

R12

ON_OFF*

Input command for power ON

CMOS 1.8V

Active low

C14

VRTC

VRTC Backup capacitor

Power

backup for the embedded RTC

supply

R11

VAUX/PWRMON

Supply Output for external

accessories / Power ON Monitor

1.8V

Power Supply

VBATT

Main power supply (Baseband)

Power

VBATT

Main power supply (Baseband)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

GND

Ground

Power

GND

Ground

Power

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

P10

GND

Ground

Power

R10

GND

Ground

Power

M12

GND

Ground

Power

B13

GND

Ground

Power

P13

GND

Ground

Power

E14

GND

Ground

Power

RESERVED

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

RESERVED

A10

RESERVED

N10

RESERVED

N11

RESERVED

P11

RESERVED

B12

RESERVED

D12

RESERVED

N12

RESERVED

P12

RESERVED

F14

RESERVED

G14

RESERVED

H14

RESERVED

J14

RESERVED

K14

RESERVED

N13

RESERVED

L13

RESERVED

J13

RESERVED

M13

RESERVED

K13

RESERVED

H13

RESERVED

G13

RESERVED

F13

RESERVED

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

A11

RESERVED

A12

RESERVED

B11

RESERVED

B10

RESERVED

D14

RESERVED

A14

RESERVED

WARNING:

Reserved pins must not be connected.

NOTE 1:

The following table is listing the main Pinout differences between the HE910 variants

Product

GPS

Antenna

Diversity

Notes

HE910

YES

HE910-D

YES

Reserved Pads: R7, R9

HE910-GA

YES

HE910-EUR

Reserved Pads:,F1, R7, R9

HE910-EUD

Reserved Pads:,F1, R7, R9

HE910-EUG

YES

Reserved Pads: F1

HE910-NAR

Reserved Pads: F1, R7, R9

HE910-NAD

Reserved Pads: F1, R7, R9

HE910-NAG

YES

Reserved Pads: F1

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

If not used, almost all pins should be left disconnected. The only exceptions are the following

pins:

RTS pin should be connected to the GND (on the module side) if flow control is not used.

The above pins are also necessary to debug the application when the module is assembled on it.

PAD

signal

M1,M2,N1,N2,P1,P2

VBATT & VBATT_PA

E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,

J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,

N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,

R8,P9,P10,R10,M12,B13,P13,E14

GND

R12

ON/OFF*

R13

HW_SHUTDOWN*

B15

USB_D+

C15

USB_D-

A13

VUSB

N15

C103/TXD

M15

C104/RXD

L14

C105/RTS

P15

C106/CTS

D15

TXD_AUX

E15

RXD_AUX

D13

VDD_IO1

E13

1V8_SEL

MAIN ANTENNA

ANT_DIV (if supported by the product)

ANT_GPS (if supported by the product)

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

ADC_IN1

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND

SIMIO

RES

GND

SIMCLK

DVI_RX

RES

GND

SIMRS

DVI_TX

RES

GPS_LN

A_EN

RES

DVI_CLK

GPIO_01

RES

GND

RES

DVI_WA

GPIO_02

RES

GND

ANT_GP

RES

GPIO_03

RES

GND

RES

GPIO_04

RES

RESET*

VAUX/P

WRMON

RES

GPIO_06

RES

GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO

1V8_SEL

RES

GND

HW_SH

UTDOW

RES

GPIO_05

VRTC

RES

GND

RES

C105/RT

C108/DT

C109/DC

C107/DS

C125/RI

USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TX

C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

ADC_IN1

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND

SIMIO

RES

GND

SIMCLK

DVI_RX

RES

GND

SIMRS

DVI_TX

RES

DVI_CLK

GPIO_01

RES

GND

RES

DVI_WA

GPIO_02

RES

GND

RES

GPIO_03

RES

GND

RES

GPIO_04

RES

RESET*

VAUX/P

WRMON

RES

GPIO_06

RES

GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO

1V8_SEL

RES

GND

HW_SH

UTDOW

RES

GPIO_05

VRTC

RES

GND

RES

C105/RT

C108/DT

C109/DC

C107/DS

C125/RI

USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TX

C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

ADC_IN1

RES

GND

RES

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND

SIMIO

RES

GND

SIMCLK

DVI_RX

RES

GND

SIMRS

DVI_TX

RES

DVI_CLK

GPIO_01

RES

GND

RES

DVI_WA

GPIO_02

RES

GND

RES

GPIO_03

RES

GND

RES

GPIO_04

RES

RESET*

VAUX/P

WRMON

RES

GPIO_06

RES

GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO

1V8_SEL

RES

GND

HW_SH

UTDOW

RES

GPIO_05

VRTC

RES

GND

RES

C105/RT

C108/DT

C109/DC

C107/DS

C125/RI

USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TX

C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

ADC_IN1

RES

GND

RES

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND

SIMIO

RES

GND

SIMCLK

DVI_RX

RES

GND

SIMRS

DVI_TX

RES

GPS_LN

A_EN

RES

DVI_CLK

GPIO_01

RES

GND

RES

DVI_WA

GPIO_02

RES

GND

ANT_GP

RES

GPIO_03

RES

GND

RES

GPIO_04

RES

RESET*

VAUX/P

WRMON

RES

GPIO_06

RES

GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO

1V8_SEL

RES

GND

HW_SH

UTDOW

RES

GPIO_05

VRTC

RES

GND

RES

C105/RT

C108/DT

C109/DC

C107/DS

C125/RI

USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TX

C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then

released.

The maximum current that can be drained from the ON# pad is 0,1 mA.

A simple circuit to do it is:

NOTE:

Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up

resistor may bring to latch up problems on the HE910 power regulator and improper power

on/off of the module. The line ON_OFF* must be connected only in open collector or open

drain configuration.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

NOTE:

In this document all the lines that are inverted, hence have active low signals are labelled with a

name that ends with”#",”*” or with a bar over the name.

TIP:

To check if the device has powered on, the hardware line PWRMON should be monitored.

NOTE:

It is mandatory to avoid sending data to the serial ports during the first 200ms of the module

start-up.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

A flow chart showing the proper turn on procedure is displayed below:

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

Modem ON Proc.

HW unconditional

SHUTDOWN

AT init sequence.

Start AT CMD.

PWMON = ON?

AT answer in 1Sec ?

Delay 1s

DELAY= 300mSec

ON_OFF = LOW

Delay = 5 Sec

ON_OFF = HIGH

Enter AT<CR>

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

A flow chart showing the AT command managing procedure is displayed below:

AT answer in

1Sec ?

Start AT CMD.

DELAY= 300mSec

Enter AT<CR>

AT init sequence.

Modem ON Proc.

HW unconditional

SHUTDOWN

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

For example:

1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT1):

2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Turning off of the device can be done in two ways:

via AT command (see HE910 Software User Guide, AT#SHDN)

by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will not be

reachable any more.

To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 2 seconds and then

released.

TIP:

To check if the device has been powered off, the hardware line PWRMON must be monitored.

The device is powered off when PWRMON goes low.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The following flow chart shows the proper turn off procedure:

Modem OFF Proc.

HW unconditional

SHUTDOWN

PWMON = ON?

Delay 15s

ON_OFF = LOW

Delay = 2 Sec

ON_OFF = HIGH

Modem ON Proc.

PWMON = ON?

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The Unconditional Shutdown of the module could be activated using the

HW_SHUTDOWN* line (pad R13).

WARNING:

The hardware unconditional Shutdown must not be used during normal operation of the device

since it does not detach the device from the network. It shall be kept as an emergency exit

procedure.

To unconditionally shutdown the HE910, the pad HW_SHUTDOWN* must be tied low for at

least 200 milliseconds and then released.

NOTE:

Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital

output. Using pull up resistor may bring to latch up problems on the HE910 power regulator and

improper functioning of the module. The line HW_SHUTDOWN* must be connected only in

open collector configuration.

The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an

automatic restart.

The module will shutdown, but will NOT perform the detach from the cellular network.

To proper power on again the module please refer to the related paragraph (“Powering ON the

HE910”)

TIP:

The unconditional hardware shutdown must always be implemented on the boards and should be

used only as an emergency exit procedure.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

A typical circuit is the following:

For example:

1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of

a +3/5 V microcontroller (uP_OUT2):

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

In the following flow chart is detailed the proper restart procedure:

HW unconditional

SHUTDOWN

HW_SHUTDOWN*=

LOW

= LOW

Delay 200ms

HW_SHUTDOWN*=

HIGH

PWRMON = ON

Delay 1s

Modem ON Proc.

Disconnect PWR

supply

Modem ON Proc.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The Unconditional Restart of the module could be activated using the

RESET* line (pad P11).

WARNING:

The hardware unconditional Restart must not be used during normal operation of the device

since it does not detach the device from the network. It shall be kept as an emergency exit

procedure.

To unconditionally Restart the HE910, the pad RESET* must be tied low for at

least 200 milliseconds and then released.

NOTE:

Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull

up resistor may bring to latch up problems on the HE910 power regulator and improper

functioning of the module. The line RESET* must be connected only in open collector

configuration.

The module will Restart and will NOT perform the detach from the cellular network.

TIP:

The unconditional hardware Restart should be implemented on the boards and should be used

only as an emergency exit procedure.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

A typical circuit is the following:

For example:

1- Let us assume you need to drive the RESET* pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT2):

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

In the following flow chart is detailed the proper restart procedure:

HW unconditional

Restart

Reset* = LOW

Delay 200ms

Reset* = HIGH

PWRMON = ON

Delay 1s

Modem Startup

Disconnect PWR

supply

Modem ON Proc.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The power supply circuitry and board layout are a very important part in the full product design

and they strongly reflect on the product overall performances, hence read carefully the

requirements and the guidelines that will follow for a proper design.

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil

the following requirements:

POWER SUPPLY

Nominal Supply Voltage

3.8 V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.10 V÷ 4.50 V

NOTE:

The Operating Voltage Range MUST never be exceeded; care must be taken when designing the

application’s power supply section to avoid having an excessive voltage drop.

If the voltage drop is exceeding the limits it could cause a Power Off of the module.

NOTE:

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage

(regarding MIN Extended Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only with completely assumption and

application of the HW User guide suggestions.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

HE910

Mode

Average

(mA)

Mode description

SWITCHED OFF

Module supplied but Switched Off

Switched Off

40uA

IDLE mode (WCDMA)

AT+CFUN=5

1.2

Disabled TX and RX; DRX7

IDLE mode (GSM/EDGE)

AT+CFUN=1

Normal mode: full functionality of the module

AT+CFUN=4

16.5

Disabled TX and RX; module is not registered on the network

AT+CFUN=5

0.8

Disabled TX and RX; DRX9 (1.1mA in case of DRX5)

Operative mode (WCDMA)

WCDMA Voice

152

WCDMA voice call (TX = 10dBm)

WCDMA HSDPA (0dBm)

187

WCDMA data call (Cat 14, TX = 0dBm)

WCDMA HSDPA (22dBm)

494

WCDMA data call (Cat 14, TX = 22dBm)

Operative mode (EDGE)

EDGE 4TX+2RX

EDGE Sending data mode

GSM900 PL5

495

DCS1800 PL0

484

Operative mode (GSM)

CSD TX and RX mode

GSM VOICE CALL

GSM900 CSD PL5

220

DCS1800 CSD PL0

167

GPRS 4TX+2RX

GPRS Sending data mode

GSM900 PL5

580

DCS1800 PL0

438

The GSM system is made in a way that the RF transmission is not continuous, else it is packed

into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as

about 2A. Therefore the power supply has to be designed in order to withstand with these

current peaks without big voltage drops; this means that both the electrical design and the board

layout must be designed for this current flow. If the layout of the PCB is not well designed a

strong noise floor is generated on the ground and the supply; this will reflect on all the audio

paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current

absorption is too much, then the device may even shutdown as a consequence of the supply

voltage drop.

NOTE:

The electrical design for the Power supply should be made ensuring it will be capable of a peak

current output of at least 2 A.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The principal guidelines for the Power Supply Design embrace three different design steps:

the electrical design

the thermal design

the PCB layout.

The electrical design of the power supply depends strongly from the power source where this

power is drained. We will distinguish them into three categories:

+5V input (typically PC internal regulator output)

+12V input (typically automotive)

Battery

The desired output for the power supply is 3.8V, hence there's not a big difference between

the input source and the desired output and a linear regulator can be used. A switching

power supply will not be suited because of the low drop out requirements.

When using a linear regulator, a proper heat sink shall be provided in order to dissipate the

power generated.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks close to the HE910, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

A protection diode should be inserted close to the power input, in order to save the HE910

from power polarity inversion.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

An example of linear regulator with 5V input is:

The desired output for the power supply is 3.8V, hence due to the big difference between the

input source and the desired output, a linear regulator is not suited and shall not be used. A

switching power supply will be preferable because of its better efficiency especially with the

2A peak current load represented by the HE910.

When using a switching regulator, a 500kHz or more switching frequency regulator is

preferable because of its smaller inductor size and its faster transient response. This allows

the regulator to respond quickly to the current peaks absorption.

In any case the frequency and Switching design selection is related to the application to be

developed due to the fact the switching frequency could also generate EMC interferences.

For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind

when choosing components: all components in the power supply must withstand this

voltage.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

For Car applications a spike protection diode should be inserted close to the power input, in

order to clean the supply from spikes.

A protection diode should be inserted close to the power input, in order to save the HE910

from power polarity inversion. This can be the same diode as for spike protection.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

An example of switching regulator with 12V input is in the below schematic:

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The desired nominal output for the power supply is 3.8V and the maximum voltage

allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the

power to the Telit HE910 module.

WARNING:

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE

USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage

for the HE910 and damage it.

NOTE:

DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use

can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

A protection diode should be inserted close to the power input, in order to save the HE910 from

power polarity inversion. Otherwise the battery connector should be done in a way to avoid

polarity inversions when connecting the battery.

The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the

suggested capacity is from 500mAh to 1000mAh.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The thermal design for the power supply heat sink should be done with the following

specifications:

Average current consumption during HSDPA transmission @PWR level max :

600 mA

Average current during idle:

1.5 mA

NOTE:

The average consumption during transmissions depends on the power level at which the device

is requested to transmit by the network. The average current consumption hence varies

significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it

is possible to consider from the thermal point of view that the device absorbs current

significantly only during calls.

If we assume that the device stays into transmission for short periods of time (let's say few

minutes) and then remains for a quite long time in idle (let's say one hour), then the power

supply has always the time to cool down between the calls and the heat sink could be smaller

than the calculated one for 600mA maximum RMS current, or even could be the simple chip

package (no heat sink).

Moreover in the average network conditions the device is requested to transmit at a lower power

level than the maximum and hence the current consumption will be less than the 600mA, being

usually around 150mA.

For these reasons the thermal design is rarely a concern and the simple ground plane where the

power supply chip is placed can be enough to ensure a good thermal condition and avoid

overheating.

For the heat generated by the HE910, you can consider it to be during transmission 1W max

during CSD/VOICE calls and 2W max during class10 GPRS upload.

This generated heat will be mostly conducted to the ground plane under the HE910; you must

ensure that your application can dissipate it.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on

the output to cut the current peaks and a protection diode on the input to protect the supply from

spikes and polarity inversion. The placement of these components is crucial for the correct

working of the circuitry. A misplaced component can be useless or can even decrease the power

supply performances.

The Bypass low ESR capacitor must be placed close to the Telit HE910 power

input pads or in the case the power supply is a switching type it can be placed close

to the inductor to cut the ripple provided the PCB trace from the capacitor to the

HE910 is wide enough to ensure a dropless connection even during the 2A current

peaks.

The protection diode must be placed close to the input connector where the power

source is drained.

The PCB traces from the input connector to the power regulator IC must be wide

enough to ensure no voltage drops occur when the 2A current peaks are absorbed.

Note that this is not made in order to save power loss but especially to avoid the

voltage drops on the power line at the current peaks frequency of 216 Hz that will

reflect on all the components connected to that supply, introducing the noise floor at

the burst base frequency. For this reason while a voltage drop of 300-400 mV may

be acceptable from the power loss point of view, the same voltage drop may not be

acceptable from the noise point of view. If your application doesn't have audio

interface but only uses the data feature of the Telit HE910, then this noise is not so

disturbing and power supply layout design can be more forgiving.

The PCB traces to the HE910 and the Bypass capacitor must be wide enough to

ensure no significant voltage drops occur when the 2A current peaks are absorbed.

This is for the same reason as previous point. Try to keep this trace as short as

possible.

The PCB traces connecting the Switching output to the inductor and the switching

diode must be kept as short as possible by placing the inductor and the diode very

close to the power switching IC (only for switching power supply). This is done in

order to reduce the radiated field (noise) at the switching frequency (100-500 kHz

usually).

The use of a good common ground plane is suggested.

The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped

to any noise sensitive circuitry as the microphone amplifier/buffer or earphone

amplifier.

The power supply input cables should be kept separate from noise sensitive lines

such as microphone/earphone cables.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The following table is listing the main differences between the HE910 variants:

Product

Supported 2G Bands

Supported 3G bands

Antenna Diversity

HE910

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B2, B4, B5, B8

FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-D

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B2, B4, B5, B8

FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-GA

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B2, B5, B8

FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-EUR

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B5, B8

HE910-EUD

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B5, B8

HE910-EUG

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B1, B5, B8

HE910-NAR

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B2, B4, B5

HE910-NAD

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B2, B4, B5

HE910-NAG

GSM 850, GSM 900,

DCS1800, PCS 1900

FDD B2, B4, B5

Band

Power Class

GSM 850 / 900

4 (2W)

DCS1800 / PCS 1900

1 (1W)

EDGE, 850/900 MHz

E2 (0.5W)

EDGE, 1800/1900 MHz

Class E2 (0.4W)

WCDMA FDD B1, B2, B4, B5, B8

Class 3 (0.25W)

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The antenna connection and board layout design are the most important aspect in the full

product design as they strongly affect the product overall performances, hence read carefully

and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the

following requirements:

ANTENNA REQUIREMENTS

Frequency range

Depending by frequency band(s) provided by the network operator, the

customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE)

70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140

MHz PCS band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

460 MHz in WCDMA Band IV

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance

50 ohm

Input power

> 33dBm(2 W) peak power in GSM

> 24dBm Average power in WCDMA

VSWR absolute max

≤ 5:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfil all regulatory requirements)

When using the HE910, since there's no antenna connector on the module, the antenna must

be connected to the HE910 antenna pad (K1) by means of a transmission line implemented

on the PCB.

Band

Typical

Note

GSM 850

-109.5 dBm

BER Class II <2.44%

GSM 900

-109 dBm

BER Class II <2.44%

DCS1800

-110 dBm

BER Class II <2.44%

PCS 1900

-109.5 dBm

BER Class II <2.44%

WCDMA FDD B1

-111 dBm

BER <0.01%

WCDMA FDD B2

-110 dBm

BER <0.01%

WCDMA FDD B4

-111 dBm

BER <0.01%

WCDMA FDD B5

-111 dBm

BER <0.01%

WCDMA FDD B8

-110 dBm

BER <0.01%

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB

line is needed in order to connect with it or with its connector.

This transmission line shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Characteristic Impedance

50 ohm

Max Attenuation

0,3 dB

Coupling with other signals shall be avoided

Cold End (Ground Plane) of antenna shall be equipotential to

the HE910 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall

comply with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. In order to re-use the Telit

FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a

separation distance of at least 20 cm from all persons and must not be co-located or operating

in conjunction with any other antenna or transmitter. If antenna is installed with a separation

distance of less than 20 cm from all persons or is co-located or operating in conjunction with

any other antenna or transmitter then additional FCC/IC testing may be required. End-Users

must be provided with transmitter operation conditions for satisfying RF exposure

compliance.

Antennas used for this OEM module must not exceed the gains for mobile and fixed

operating configurations as described in “FCC/IC Regulatory notices” chapter.

Make sure that the transmission line’s characteristic impedance is 50ohm ;

Keep line on the PCB as short as possible, since the antenna line loss shall be less than

around 0,3 dB;

Line geometry should have uniform characteristics, constant cross section, avoid meanders

and abrupt curves;

Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded

Coplanar Waveguide...) can be used for implementing the printed transmission line afferent

the antenna;

If a Ground plane is required in line geometry, that plane has to be continuous and

sufficiently extended, so the geometry can be as similar as possible to the related canonical

model;

Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible,

use this layer as reference Ground plane for the transmission line;

It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having

other signal tracks facing directly the antenna line track.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Avoid crossing any un-shielded transmission line footprint with other signal tracks on

different layers;

The ground surrounding the antenna line on PCB has to be strictly connected to the main

Ground Plane by means of via holes (once per 2mm at least), placed close to the ground

edges facing line track;

Place EM noisy devices as far as possible from HE910 antenna line;

Keep the antenna line far away from the HE910 power supply lines;

If EM noisy devices are present on the PCB hosting the HE910, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and

surround it with Ground planes, or shield it with a metal frame cover.

If EM noisy devices are not present around the line, the use of geometries like Microstrip or

Grounded Coplanar Waveguide has to be preferred, since they typically ensure less

attenuation if compared to a Stripline having same length;

Install the antenna in a place covered by the GSM signal.

If the device antenna is located greater then 20cm from the human body and there are no co-

located transmitter then the Telit FCC/IC approvals can be re-used by the end product

If the device antenna is located less then 20cm from the human body or there are no co-

located transmitter then the additional FCC/IC testing may be required for the end product

(Telit FCC/IC approvals cannot be reused)

Antenna shall not be installed inside metal cases

Antenna shall be installed also according Antenna manufacturer instructions.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

This product is including an input for a second RX antenna to improve the radio sensitivity. The

function is called Antenna Diversity.

ANTENNA REQUIREMENTS

Frequency range

Depending by frequency band(s) provided by the network

operator, the customer shall use the most suitable antenna for

that/those band(s)

Bandwidth (GSM/EDGE)

70 MHz in GSM850, 80 MHz in GSM900 & 140 MHz PCS

band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance

50 ohm

When using the HE910, since there's no antenna connector on the module, the antenna must be

connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the

PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB

line is needed in order to connect with it or with its connector.

The second Rx antenna should not be located in the close vicinity of main antenna. In order to

improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be

located at the maximum reciprocal distance possible, taking into consideration the available

space into the application.

NOTE1:

The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV in 3G

NOTE:

If the RX Diversity is not used/connected, disable the Diversity functionality using the

AT#RXDIV command (ref to the AT User guide for the proper syntax) and leave the pad F1

unconnected.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 module is integrating a GPS receiver that could be used in Standalone mode and in A-GPS

(assisted GPS).

With the help of advanced digital signal processing algorithms and the use of A-GPS data, the receiver

is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.

The following table is listing the HE910 variants that support the GPS receiver:

Product

GPS Receiver

HE910

YES

HE910-D

HE910-GA

YES

HE910-EUR

HE910-EUD

HE910-EUG

YES

HE910-NAR

HE910-NAD

HE910-NAG

YES

Advanced real time hardware correlation engine for enhanced sensitivity (better than -165 dBm for

A-GPS).

Fast Acquisition giving rapid Time-to-First-Fix (TTFF)

Capability to monitor up to 28 channels

Stand Alone and Assisted mode

Integrated LNA

The following Table is listing the main characteristics:

Characteristic

Typical Values

GPS RX Sensitivity

-164dBm

GPS Cold Start Autonomous

-147dBm

GPS Hot Start Autonomous

-161dBm

GPS tracking mode

-166 dBm

GPS Accuracy

TTFF from Cold Start

42 sec

TTF from Warm Start

30sec

TTF from Hot Start

1.8 sec

Power Consumption in Acquisition

46.4 mA @3.8V

Power Consumption in Tracking

37.8 mA @3.8V

Power Consumption in Low Power Tracking

25.7 mA @3.8V

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The Pads related to this function are the following:

PAD

Signal

I/O

Function

Type

ANT_GPS

GPS Antenna (50 ohm)

GPS_LNA_EN

Output enable for External LNA supply

CMOS 1.8V

The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the module to

work well with a passive GPS antenna. If the antenna cannot be located near the HE910, then an active

antenna (that is, an antenna with a low noise amplifier built in) can be used.

The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input. This means

the GPS receiver can find the necessary satellites, download the necessary ephemeris data and compute

the location within a 5 minute period.

In the GPS signal acquisition process, downloading and decoding the data is the most difficult task,

which is why Cold Start acquisition requires a higher signal level than navigation or tracking signal

levels. For the purposes of this discussion, autonomous operation is assumed, which makes the Cold

Start acquisition level the important design constraint. If assistance data in the form of time or

ephemeris aiding is available, then even lower signal levels can be used to compute a navigation

solution.

Each GPS satellite presents its own signal to the HE910, and best performance is obtained when the

signal levels are between -125 dBm and -117 dBm. These received signal levels are determined by :

GPS satellite transmit power

GPS satellite elevation and azimuth

Free space path loss

Extraneous path loss such as rain

Partial or total path blockage such as foliage or building

Multipath caused by signal reflection

GPS antenna

Signal path after the GPS antenna

The first three items in the list above are specified in IS-GPS-200E, readily available multiple sources

online. IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to the receiver

when using a linearly polarized antenna with 3 dBi gain.

The GPS signal is relatively immune to rainfall attenuation and does not really need to be considered.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

However, the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies, etc.,

as well as outright blockage caused by building, terrain or other items in the line of sight to the specific

GPS satellite. This variable attenuation is highly dependent upon GPS satellite location. If enough

satellites are blocked, say at a lower elevation, or all in a general direction, the geometry of the

remaining satellites will result is a lower accuracy of position. The HE910 reports this geometry in the

form of PDOP, HDOP and VDOP.

For example, in a vehicular application, the GPS antenna may be placed embedded into the dashboard

or rear package tray of an automobile. The metal roof of the vehicle will cause significant blockage,

plus any thermal coating applied to the vehicle glass can attenuate the GPS signal by as much as 15 dB.

Again, both of these factors will affect the performance of the receiver.

Multipath is a phenomena where the signal from a particular satellite is reflected and is received by the

GPS antenna in addition to or in place of the original line of sight signal. The multipath signal has a

path length that is longer than the original line of sight path and can either attenuate the original signal,

or if received in place of the original signal add additional error in determining a solution because the

distance to the particular GPS satellite is actually longer than expected. It is this phenomena that makes

GPS navigation in urban canyons (narrow roads surround by high rise buildings) so challenging. In

general, the reflecting of the GPS signal causes the polarization to reverse. The implications of this are

covered in the next section.

The GPS signal as broadcast is a right hand circularly polarized signal. The best antenna to receive the

GPS signal is a right hand circularly (RHCP) polarized antenna.

Remember that IS-GPS-200E specifies the receive power level with a linearly polarized antenna. A

linearly polarized antenna will have 3 dB loss as compared to an RHCP antenna assuming the same

antenna gain (specified in dBi and dBic respectively).

An RHCP antenna is better at rejecting multipath than a linearly polarized antenna.

This is because the reflected signal changes polarization to LHCP, which would be rejected by the

RHCP antenna by typically 20 dB or so. If the multipath signal is attenuating the line of sight signal,

then the RHCP antenna would show a higher signal level than a linearly polarized antenna because the

interfering signal is rejected.

However, in the case where the multipath signal is replacing the line of sight signal, such as in an

urban canyon environment, then the number of satellites in view could drop below that needed to

determine a 3D solution. This is a case where a bad signal may be better than no signal. The system

designer needs to make tradeoffs in their application to determine which is the better choice.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical

isotropic antenna (equally sensitive in all directions).

For example, a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by

70mm) will give an antenna gain at zenith of 5 dBic. A smaller 18mm by 18mm square patch on a

reference ground plane (usually 50mm by 50mm) will give an antenna gain at zenith of 2 dBic.

While an antenna vendor will specify a nominal antenna gain (usually at zenith, or directly overhead)

they should supply antenna pattern curves specifying gain as a function of elevation, and gain at a fixed

elevation as a function of azimuth. Pay careful attention to the requirement to meet these specifications,

such as ground plane required and any external matching components. Failure to follow these

requirements could result in very poor antenna performance.

It is important to note that GPS antenna gain is not the same thing as external LNA gain. Most antenna

vendors will specify these numbers separately, but some combine them into a single number. It is

important to know both numbers when designing and evaluating the front end of a GPS receiver.

For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20 dB for a

combined total of 25 dB. Antenna Y has an antenna gain of -5 dBiC at azimuth and an LNA gain of 30

dB for a combined total of 25 dB. However, in the system, antenna X will outperform antenna Y by

about 10 dB (refer to next chapter for more details on system noise floor).

An antenna with higher gain will generally outperform an antenna with lower gain. Once the signals

are above about -130 dBm for a particular satellite, no improvement in performance would be gained.

However, for those satellites that are below about -125 dBm, a higher gain antenna would improve the

gain and improve the performance of the GPS receiver. In the case of really weak signals, a good

antenna could mean the difference between being able to use a particular satellite signal or not.

If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive (nominally 1

dB), then a passive antenna can be used. This would normally be the lowest cost option and most of the

time the simplest to use. However, if the antenna needs to be located away from the HE910 then an

active antenna may be required to obtain the best system performance. The active antenna has its own

built in low noise amplifier to overcome RF trace or cable losses after the active antenna.

However, an active antenna has a low noise amplifier (LNA) with associated gain and noise figure. In

addition, many active antennas have either a pre-select filter, a post-select filter, or both.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Ensure that the antenna line impedance is 50ohm.

Keep the antenna line on the PCB as short as possible to reduce the loss.

Antenna line must have uniform characteristics, constant cross section, avoid meanders and

abrupt curves.

Keep one layer of the PCB used only for the Ground plane, if possible.

Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having

other signal tracks facing directly the antenna line of track.

The ground around the antenna line on PCB has to be strictly connected to the Ground Plane

by placing vias once per 2mm at least.

Place EM noisy devices as far as possible from HE910 antenna line.

Keep the antenna line far away from the HE910 power supply lines.

Keep the antenna line far away from the HE910 GSM RF lines.

If you have EM noisy devices around the PCB hosting the HE910, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and

surround it with Ground planes, or shield it with a metal frame cover.

If you do not have EM noisy devices around the PCB of HE910, use a strip-line on the

superficial copper layer for the antenna line. The line attenuation will be lower than a buried

one.

RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF

simulation software to estimate what the losses would be. A good rule of thumb would be to keep the

RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp

bends.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA, that

is, the RF input of the HE910 ties directly into the SAW filter. Any circuit connected to the input of the

HE910 would see complex impedance presented by the SAW filter, particularly out of band, rather

than the relatively broad and flat return loss presented by the LNA. Filter devices pass the desired in

band signal to the output, resulting in low reflected energy (good return loss), and reject the out of band

signal by reflecting it back to the input, resulting in high reflected energy (bad return loss).

If an external amplifier is to be used with the HE910, the overall design should be checked for RF

stability to prevent the external amplifier from oscillating. Amplifiers that are unconditionally stable at

the output will be fine to use with the HE910.

If an external filter is to be connected directly to the HE910, care needs to be used in making sure

neither the external filter nor the internal SAW filter performance is compromised. These components

are typically specified to operate into 50 ohms impedance, which is generally true in band, but would

not be true out of band. If there is extra gain associated with the external filter, then a 6 dB Pi or T

resistive attenuator is suggested to improve the impedance match between the two components.

The HE910 can be used with an external LNA such as what might be found in an active antenna.

Because of the internal LNA, the overall gain (including signal losses past the external LNA) should

not exceed 14 dB. Levels higher than that can affect the jamming detection capability of the HE910. If

a higher gain LNA is used, either a resistive Pi or T attenuator can be inserted after the LNA to bring

the gain down to 14 dB .

The external LNA should have a noise figure better than 1 dB. This will give an overall system noise

figure of around 2 dB assuming the LNA gain is 14 dB, or if higher the low gain mode is automatically

managed by the HE910 with its internal AGC.

The external LNA, if having no pre-select filter, needs to be able to handle other signals other than the

GPS signal. These signals are typically at much higher levels. The amplifier needs to stay in the linear

region when presented with these other signals. Again, the system designer needs to determine all of

the unintended signals and their possible levels that can be presented and make sure the external LNA

will not be driven into compression. If this were to happen, the GPS signal itself would start to be

attenuated and the GPS performance would suffer.

The external LNA needs a source of power. Many of the active antennas accept a 3 volt or 5 volt DC

voltage that is impressed upon the RF signal line. This voltage is not supplied by the HE910, but can

be easily supplied by the host design.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 is already provided by an internal LNA. In case the Application needs to include an

additional LNA stage, the module is provided by a digital signal usable to enable the power

supply of the external amplifier. The signal is set to High only when the GPS receiver is active.

The electrical characteristics of the GPS_LNA_EN signal are:

Level

Min

Max

Output high level

1.6V

1.9

Output low level

0.2V

An example of GPS Antenna Supply circuit is shown in the following image:

NOTE:

The maximum DC voltage applicable to the ANT_GPS pin is 5V. In case this is exceeded, a

series capacitor has to be included in the design to avoid exceeding the maximum input DC

level.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS

antenna itself, the most sensitive portion of the RF path. The antenna cannot be shielded because then

it can’t receive the GPS signals.

There are two solutions, one is to move the antenna away from the source of interference or the second

is to shield the digital interference to prevent it from getting to the antenna.

The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the

buildings. (In any case the sensitivity could be affected by the building characteristics i.e.

shielding).

The Antenna must not be co-located or operating in conjunction with any other antenna or

transmitter.

Antenna must not be installed inside metal cases.

Antenna must be installed also according to the Antenna manufacturer instructions.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with respect

to ground

-0.3V

3.1V

Operating Range - Interface levels (1.8V CMOS)

Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

Current characteristics (Preliminary values)

Level

Typical

Output Current

1mA

Input Current

1uA

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 module is provided by two Reset lines that are described in the following table:

Signal

Function

I/O

PAD

HW_SHUTDOWN*

Phone Unconditional

Shut Down

R13

Unconditional Shutdown of the module.

It will NOT perform the detach from the

cellular network

RESET*

Phone reset

P11

Power-cycle of the module, but will NOT

perform the detach from the cellular network

RESET* and HW_SHUTDOWN are used to reset the HE910. Whenever those signals are

pulled low, the HE910 is reset. When the device is reset it stops any operation. After the

release of the reset HE910 is unconditionally shut down (in case of HW_SHUTDOWN*) or

restart (in case of RESET*), without doing any detach operation from the network where it

is registered. This behaviour is not a proper shut down because any GSM device is requested

to issue a detach request on turn off. For this reason the Reset signal must not be used to

normally shutting down the device, but only as an emergency exit in the rare case the device

remains stuck waiting for some network response.

The RESET* and HW_SHUTDOWN* are internally controlled on start-up to achieve always

a proper power-on reset sequence, so there's no need to control the pins on start-up. They

may only be used to reset a device already on that is not responding to any command.

NOTE:

Do not use those signals to power off the HE910. Use the ON/OFF signal to perform this

function or the AT#SHDN command.

Reset Signal Operating levels:

Signal

Min

Max

Input high

1.5V

1.9V

Input low

0.35V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected

with an open collector transistor, to permit to the internal circuitry the power on reset and

under voltage lockout functions.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 includes one integrated universal serial bus (USB) transceiver:

USB 2.0 HS

This port is compliant with the USB 2.0 specifications.

The following table is listing the available signals:

PAD

Signal

I/O

Function

Type

NOTE

B15

USB_D+

I/O

USB differential Data (+)

3.3V

C15

USB_D-

I/O

USB differential Data (-)

3.3V

A13

VUSB

Power sense for the internal USB

transceiver.

Accepted range:

4.4V to 5.25V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal

traces should be routed carefully. Trace lengths, number of vias and capacitive

loading should be minimized. The impedance value should be as close as possible to 90

Ohms differential.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 Module is provided by one SPI interface.

The SPI interface defines two handshake lines for flow control and mutual wake-up of the

modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).

The AP has the master role, that is, it supplies the clock.

The following table is listing the available signals:

PAD

Signal

I/O

Function

Type

COMMENT

D15

SPI_MOSI

SPI MOSI

CMOS 1.8V

Shared with TX_AUX

E15

SPI_MISO

SPI MISO

CMOS 1.8V

Shared with RX_AUX

F15

SPI_CLK

SPI Clock

CMOS 1.8V

H15

SPI_MRDY

CMOS 1.8V

J15

SPI_SRDY

CMOS 1.8V

The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this

digital section.

NOTE:

Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART

port.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

SPI_MISO

E15

D15

F15

H15

J15

D13

E13

D14

HE910

SPI_MOSI

SPI_CLK

SPI_MRDY

SPI_SRDY

VDD_IO1

1V8_SEL

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 module is provided with by 2 Asynchronous serial ports:

MODEM SERIAL PORT 1 (Main)

MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most

common are:

RS232 PC com port

microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be

needed to make the system work.

On the HE910 the ports are CMOS 1.8..

The electrical characteristics of the Serial ports are explained in the following tables:

Absolute Maximum Ratings -Not Functional

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with

respect to ground

-0.3V

3.1V

Operating Range - Interface levels (1.8V CMOS)

Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.

It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

RS232

Pin #

Signal

HE910

Pad Number

Name

Usage

C109/DCD

N14

Data Carrier Detect

Output from the HE910 that indicates the carrier presence

C104/RXD

M15

Transmit line *see

Note

Output transmit line of HE910 UART

C103/TXD

N15

Receive line *see

Note

Input receive of the HE910 UART

C108/DTR

M14

Data Terminal Ready

Input to the HE910 that controls the DTE READY condition

GND

M12, B13, P13,

E14 …

Ground

C107/DSR

P14

Data Set Ready

Output from the HE910 that indicates the module is ready

C106/CTS

P15

Clear to Send

Output from the HE910 that controls the Hardware flow

control

C105/RTS

L14

Request to Send

Input to the HE910 that controls the Hardware flow control

C125/RING

R14

Ring Indicator

Output from the HE910 that indicates the incoming call

condition

The following table shows the typical input value of internal pull-up resistors for RTS DTR

and TXD input lines and in all module states:

STATE

RTS DTR TXD

Pull up tied to

5K to 12K

1V8

OFF

Schottky diode

RESET

Schottky diode

POWER

SAVING

5K to 12K

1V8

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The input line ON_OFF and RESET state can be treated as in picture below

NOTE:

According to V.24, some signal names are referred to the application side, therefore on the

HE910 side these signal are on the opposite direction:

TXD on the application side will be connected to the receive line (here named C103/TXD)

RXD on the application side will be connected to the transmit line (here named C104/RXD)

NOTE:

For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can

be left open provided a software flow control is implemented.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX

signals.

The signals of the HE910 serial port are:

PAD

Signal

I/O

Function

Type

COMMENT

D15

TX_AUX

Auxiliary UART (TX Data to

DTE)

CMOS 1.8V

SHARED WITH

SPI_MTSR

E15

RX_AUX

Auxiliary UART (RX Data from

DTE)

CMOS 1.8V

SHARED WITH

SPI_MRST

The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this port.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

NOTE:

Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI

functions.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a

level translator is required. This level translator must:

invert the electrical signal in both directions;

Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower

levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level

translator. Note that the negative signal voltage must be less than 0V and hence some sort of

level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level

translator. There are a multitude of them, differing in the number of drivers and receivers and in

the levels (be sure to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The

receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

5 drivers

3 receivers

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver

(MAX218)

In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example

done on 4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The Audio of the HE910 Module is carried by DVI digital audio interface.

The audio port can be directly connected to end device using digital interface, or via one of the

several compliant codecs (in case an analog audio is needed).

The product is providing the Digital Audio Interface (DVI) on the following Pins:

Digital Voice Interface (DVI)

PAD

Signal

I/O

Function

Note

Type

DVI_WA0

I/O

Digital Audio Interface (Word Alignment /

LRCLK)

CMOS 1.8V

DVI_RX

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (BCLK)

CMOS 1.8V

Please refer to the HE910 Digital Audio Application note.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 module is provided by a set of Digital Input / Output pins

Input pads can only be read; they report the digital value (high or low) present on the pad at the

read time.

Output pads can only be written or queried and set the value of the pad output.

An alternate function pad is internally controlled by the HE910 firmware and acts depending on

the function implemented.

The following table shows the available GPIO on the HE910:

PAD

Signal

I/O

Function

Type

Drive

strength

Default

State

Note

GPIO_01

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

Alternate function STAT

LED

GPIO_02

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C10

GPIO_03

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C11

GPIO_04

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

B14

GPIO_05

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C12

GPIO_06

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C13

GPIO_07

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

K15

GPIO_08

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be

connected to 1V8_SEL

L15

GPIO_09

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be

connected to 1V8_SEL

G15

GPIO_10

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be

connected to 1V8_SEL

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with respect

to ground

-0.3V

3.1V

Operating Range - Interface levels (1.8V CMOS)

Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The GPIO pads, when used as inputs, can be connected to a digital output of another device and

report its status, provided this device has interface levels compatible with the 1.8V CMOS levels

of the GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface levels

different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a

47K pull up to 1.8V.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible

hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up

resistor may be omitted.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The STAT_LED pin status shows information on the network service availability and Call

status. The function is available as alternate function of GPIO_01

In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED.

Therefore, the status indicated in the following table is reversed with respect to the pin status.

LED status

Device Status

Permanently off

Device off

Fast blinking

(Period 1s, Ton 0,5s)

Net search / Not registered /

turning off

Slow blinking

(Period 3s, Ton 0,3s)

Registered full service

Permanently on

a call is active

A schematic example could be:

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the

digital part, allowing having only RTC going on when all the other parts of the device are off.

To this power output a backup capacitor can be added in order to increase the RTC autonomy

during power off of the battery. NO Devices must be powered from this pin.

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

A regulated power supply output is provided in order to supply small devices from the module.

The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON

indication) function.

This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Level

Min

Typical

Max

Output voltage

1.78V

1.80V

1.82V

Output current

60mA

Output bypass capacitor

(inside the module)

1uF

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 is provided by one AD converter. It is able to read a voltage level in the range of

0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.

The following table is showing the ADC characteristics:

Min

Typical

Max

Units

Input Voltage range

1.2

Volt

AD conversion

bits

Input Resistance

Mohm

Input Capacitance

The input line is named as ADC_IN1 and it is available on Pad B1

An AT command is available to use the ADC function.

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this

function.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 modules have been designed in order to be compliant with a standard lead-free

SMT process.

Pin B1

Dimensions in mm

Bottom view

Lead-free Alloy:

Surface finishing Ni/Au for all solder pads

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

TOP VIEW

In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm

placement inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical

part of the application in direct contact with the module.

NOTE:

In the customer application, the region under WIRING INHIBIT (see figure above) must

be clear from signal or ground paths.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we

suggest a thickness of stencil foil ≥ 120 µm.

Non solder mask defined (NSMD) type is recommended for the solder pads on the

PCB.

PCB

Copper Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The recommendation for the PCB pads dimensions are described in the following image

(dimensions in mm)

Solder resist openings

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

It is not recommended to place via or micro-via not covered by solder resist in an

area of 0,3 mm around the pads unless it carries the same signal of the pad itself

(see following figure).

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish

Layer thickness [µm]

Properties

Electro-less Ni / Immersion

3 –7 / 0.05 – 0.15

good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the

lead-free process. This issue should be discussed with the PCB-supplier. Generally,

the wettability of tin-lead solder paste on the described surface plating is better

compared to lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is

suggested to use milled contours and predrilled board breakouts; scoring or v-cut

solutions are not recommended.

Inhibit area for micro-via

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Lead free

Solder paste

Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules

after assembly.

Recommended solder reflow profile:

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TL to TP)

3°C/second max

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL

– Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak Temperature (Tp)

245 +0/-5°C

Time within 5°C of actual Peak

Temperature (tp)

10-30 seconds

Ramp-down Rate

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

NOTE:

All temperatures refer to topside of the package, measured on the package body surface

WARNING:

The HE910 module withstands one reflow process only.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 modules are packaged on trays of 20 pieces each. These trays can be used in

SMT processes for pick & place handling.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-

STD-020, take care all the relatives requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC

J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must be

168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH

or more

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this

product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the product.

The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the

security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully

the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken

to the external components of the module, as well as of any project or installation issue, because the risk

of disturbing the GSM network or external devices or having impact on the security. Should there be any

doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to

be installed with care in order to avoid any interference with other electronic devices and has to guarantee

a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system

integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the

market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable

Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910, HE910-D, HE910-GA, HE910-EUG, HE910-EUR, HE910-EUD, HE910-NAG, HE910-

NAR, HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC

Directive.

Bulgarian

С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на

съществените изисквания и другите приложими изисквания на Директива

1999/5/ЕС.

Czech

Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se

základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish

Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G

module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Dutch

Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in

overeenstemming is met de essentiële eisen en de andere relevante bepalingen van

richtlijn 1999/5/EG.

English

Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance

with the essential requirements and other relevant provisions of Directive 1999/5/EC.

Estonian

Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust

direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele

asjakohastele sätetele.

German

Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in

Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen

Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek

ΜΕ ΣΗΝ ΠΑΡΟΤ΢Α Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΣΙ 2G/3G module

΢ΤΜΜΟΡΦΩΝΕΣΑΙ ΠΡΟ΢ ΣΙ΢ ΟΤ΢ΙΩΔΕΙ΢ ΑΠΑΙΣΗ΢ΕΙ΢ ΚΑΙ ΣΙ΢ ΛΟΙΠΕ΢ ΢ΥΕΣΙΚΕ΢

ΔΙΑΣΑΞΕΙ΢ ΣΗ΢ ΟΔΗΓΙΑ΢ 1999/5/ΕΚ.

Hungarian

Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a

vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Finnish

Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on

direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen

mukainen.

French

Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est

conforme aux exigences essentielles et aux autres dispositions pertinentes de la

directive 1999/5/CE.

Icelandic

Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við

grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian

Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è

conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva

1999/5/CE.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Latvian

Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas

1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

Lithuanian

Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius

reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese

Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma

mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva

1999/5/EC.

Norwegian

Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar

med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish

Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z

zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy

1999/5/EC

Portuguese

Telit Communications S.p.A. declara que este 2G/3G module está conforme com os

requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovak

Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné

požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian

Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi

zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.

Spanish

Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module

cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o

exigibles de la Directiva 1999/5/CE.

Swedish

Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I

överensstämmelse med de väsentliga egenskapskrav och övriga relevanta

bestämmelser som framgår av direktiv 1999/5/EG.

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910,

HE910-GA, HE910-EUG modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2)

EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EN 301 908-1 V4.2.1

EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-NAG modules are

compliant with the following standards:

RF spectrum use (R&TTE art. 3.2)

EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

The HE910-D, HE910-EUR, HE910-EUD modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2)

EN 301 511 V9.02

EN 301 908-1 V4.2.1

EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

The HE910-NAR, HE910-NAD modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2)

EN 301 511 V9.02

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1

EN 301 489-7 V1.3.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive

1999/5/EC has been followed with the involvement of the following Notified Body:

AT4 wireless, S.A.

Parque Tecnologico de Andalucía

C/ Severo Ochoa 2

29590 Campanillas – Málaga

SPAIN

Notified Body No: 1909

Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:

http://www.telit.com/

There is no restriction for the commercialisation of the HE910, HE910-D, HE910-GA, HE910-EUG,

HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules in all the countries of the

European Union.

1909

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Final product integrating this module must be assessed against essential requirements of the 1999/5/EC

(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit

Communications S.p.A. recommends carrying out the following assessments:

RF spectrum use (R&TTE art. 3.2)

It will depend on the antenna used on the final product.

EMC (R&TTE art. 3.1b)

Testing

Health & Safety (R&TTE art. 3.1a)

Testing

Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a)

essential requirements can be done against the essential requirements of the EMC and the LVD Directives:

Low Voltage Directive 2006/95/EC and product safety

Directive EMC 2004/108/EC for conformity for EMC

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications

could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout

changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this

device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de

brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment.

The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your

body. Antenna gain must be below:

Frequency band

HE910, HE910-D

HE910-GA

HE910-NAR, HE910-NAD, HE910-NAG

GSM 850/FDD V

5.22 dBi

5.29 dBi

PCS 1900/FDD II

3.31 dBi

4.02 dBi

FDD IV

6.45 dBi

6.32 dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

HE910 Hardware User Guide

1vv0300925 Rev.18 – 15-06-2012

Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non

contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source

de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Bande de fréquence

HE910, HE910-D

HE910-GA

HE910-NAR, HE910-NAD, HE910-NAG

GSM 850/FDD V

5.22 dBi

5.29 dBi

PCS 1900/FDD II

3.31 dBi

4.02 dBi

FDD IV

6.45 dBi

6.32 dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation. If this equipment does

cause harmful interference to radio or television reception, which can be determined by turning the equipment

off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Telit Communications S p A HE910NA 2G/3.5G module, HE910-NAG; HE910-NAR; HE910-NAD User Manual HE910 Hardware User Guide

Telit Communications S.p.A. 2G/3.5G module, HE910-NAG; HE910-NAR; HE910-NAD HE910 Hardware User Guide

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