Telit Communications S p A UL865N3G 3G Module User Manual 11

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Document Title	11_User Manual

UL865-N3G V2 Hardware User
Guide
1VV0301177 Rev 2– 2015-04-20
UL865-N3G Hardware User Guide
1VV0301177 Rev 2– 2015-04-20
APPLICABILITY TABLE
PRODUCT
UL865-N3G V2
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2014
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Contents
1.
Introduction ................................................. 8
1.1.
Scope ..................................................... 8
1.2.
Audience .................................................. 8
1.3.
Contact Information, Support .............................. 8
1.4.
Document Organization ..................................... 9
1.5.
Text Conventions ......................................... 10
1.6.
Related Documents ........................................ 10
1.7.
Document History ......................................... 11
2.
Overview .................................................... 12
3.
UL865-N3G V2 Mechanical Dimensions .......................... 13
4.
UL865-N3G V2 module connections ............................. 14
4.1.
PIN-OUT .................................................. 14
4.2.
Debug in Production ...................................... 16
4.3.
Pin Layout ............................................... 17
5.
Hardware Commands ........................................... 18
5.1.
Auto-Turning ON the UL865-N3G V2 ......................... 18
5.2.
Turning OFF the UL865-N3G V2 ............................. 21
5.3.
Resetting the UL865-N3G V2 ............................... 22
5.3.1.
6.
Hardware Unconditional restart ............................. 22
Power Supply ................................................ 25
6.1.
Power Supply Requirements ................................ 25
6.2.
Power Consumption ........................................ 26
6.3.
General Design Rules ..................................... 26
6.3.1.
6.3.2.
6.3.3.
7.
Electrical Design Guidelines ............................... 26
Thermal Design Guidelines .................................. 30
Power Supply PCB layout Guidelines ......................... 31
Radio Section ............................................... 33
7.5.
TX Output Power .......................................... 33
7.6.
Sensitivity .............................................. 33
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7.7.
Antenna Requirements ..................................... 33
7.7.1.
7.8.
UL865-N3G V2 Antenna – PCB line Guidelines ................. 34
PCB Guidelines in case of FCC certification .............. 35
7.8.1.
7.8.2.
7.9.
8.
Antenna - Installation Guidelines ........................ 38
Logic level specifications .................................. 39
8.5.
9.
Transmission line design ................................... 35
Transmission line measurements ............................. 36
Reset signal ............................................. 40
USB Port .................................................... 41
9.1.
USB 2.0 HS ............................................... 41
10. SPI Port .................................................... 42
10.5.
SPI Connections ........................................ 42
11. Serial Ports ................................................ 43
11.1.
MODEM SERIAL PORT 1 .................................... 43
11.2.
MODEM SERIAL PORT 2 .................................... 45
11.3.
RS232 level translation ................................ 46
12. Audio Section Overview ...................................... 48
13. General Purpose I/O ......................................... 48
13.1.
GPIO Logic levels ...................................... 50
13.2.
Using a GPIO Pad as INPUT .............................. 51
13.3.
Using a GPIO Pad as OUTPUT ............................. 51
13.4.
Indication of network service availability ............. 52
13.5.
SIMIN detect function .................................. 53
13.6.
RTC Bypass out ......................................... 53
13.7.
SIM Holder Implementation .............................. 53
14. DAC and ADC section ......................................... 54
14.1.
DAC Converter .......................................... 54
14.1.1.
14.1.2.
14.1.3.
14.2.
Description .............................................. 54
Enabling DAC ............................................. 55
Low Pass Filter Example .................................. 55
ADC Converter .......................................... 56
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14.2.1.
14.2.2.
14.3.
Description .............................................. 56
Using ADC Converter ...................................... 56
VAUX Power Output ...................................... 57
15. Mounting the UL865-N3G V2 on your Board ..................... 58
15.1.
General ................................................ 58
15.2.
Module finishing & dimensions .......................... 58
15.3.
Recommended foot print for the application ............. 59
15.4.
Stencil ................................................ 60
15.5.
PCB pad design ......................................... 60
15.6.
Recommendations for PCB pad dimensions (mm): ........... 61
15.7.
Solder paste ........................................... 62
15.8.
UL865-N3G V2 Solder reflow ............................. 62
16. Packing system .............................................. 64
16.1.
Packing on tray ........................................ 64
16.2.
Packing in Reel ........................................ 66
16.3.
Moisture sensitivity ................................... 67
17. SAFETY RECOMMANDATIONS ...................................... 68
18. FCC/IC REGULATORY NOTICES ................................... 69
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1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit UL865-N3G V2 module.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our UL865-N3G V2 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
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1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support
information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “UL865-N3G V2 Mechanical Dimensions”
Chapter 4: “UL865-N3G V2 Module Connections” deals with the pin out configuration and layout.
Chapter 5: “Hardware Commands” How to operate on the module via hardware.
Chapter 6: “Power supply” Power supply requirements and general design rules.
Chapter 7: “GSM/WCDMA Radio Section” The antenna connection and board layout design are the
most important parts in the full product design.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic levels
for this module.
Chapter 9: “USB ports” The serial port on the Telit UL865-N3G V2 is the core of the interface between
the module and OEM hardware
Chapter 10: “Serial ports” The serial port on the Telit UL865-N3G V2 is the core of the interface
between the module and OEM hardware
Chapter 11: “Audio Section overview”
Chapter 12: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 13 “DAC and ADC Section” Deals with these two kind of converters.
Chapter 14: “Mounting the UL865-N3G V2 on the application board” Recommendations and specifics
on how to mount the module on the user’s board.
Chapter 15: “Packaging system” Recommendations and specifics on how the system is packaged.
Chapter 16: “Conformity Assessment Issues”
Chapter 17: “Safety Recommendations”
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1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents





Digital Voice Interface Application Note
SPI Port Application Note
SIM Holder Design Guides
AT Commands Reference Guide
Telit EVK2 User Guide
80000NT10050A
80000NT10053A
80000NT10001a
80378ST10091A
1vv0300704
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1.7.
Document History
Revision
Rev 0
Rev.1
Rev.2
Date
2014-10-13
2015-04-01
2015-04-20
Changes
Preliminary Version
Added par. 17/18
Updated chapter 12
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2.
Overview
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit UL865-N3G V2 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace all hardware solutions and products that may be designed. Avoiding the wrong
solutions shall be considered as mandatory. While the suggested hardware configurations
shall not be considered mandatory, the information given shall be used as a guide and a
starting point for properly developing your product with the Telit UL865-N3G V2 module.
For further hardware details that may not be explained in this document refer to the Telit
UL865-N3G V2 Product Description document where all the hardware information is
reported.
NOTICE:
(EN) The integration of the GSM/GPRS/WCDMA UL865-N3G V2 cellular module within user
application shall be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA UL865-N3G V2 all’interno
dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die Integration des UL865-N3G V2 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß
gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA UL865-N3G V2 modula v uporabniški aplikaciji bo morala
upoštevati projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA UL865-N3G V2 debe ser conforme a los usos
para los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA UL865-N3G V2 dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
(HE)
UL865-N3G V2
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement
of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent rights of Telit Communications S.p.A. other
than for circuitry embodied in Telit products. This document is subject to change without
notice.
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3.
UL865-N3G V2 Mechanical Dimensions
The UL865-N3G V2 overall dimensions are:
Length:
Width:
Thickness:
Weight
24.4 mm
24.4 mm
2.6 mm
4g
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4.
UL865-N3G V2 module connections
4.1.
PIN-OUT
Pad
Signal
I/O
Function
Note
Type
18
USB_D+
I/O
USB differential Data (+)
17
USB_D-
I/O
USB differential Data (-)
16
USB_VBUS
AI
Power sense for the internal USB transceiver.
SIMVCC
External SIM signal – Power supply for the SIM
1,8 / 3V
10
SIMRST
External SIM signal – Reset
1,8 / 3V
11
SIMCLK
External SIM signal – Clock
12
All GPI0
can be
program
med
SIMIO
I/O
SIMIN
RXD_AUX
/SPI_MISO
TXD_AUX /
SPI_MOSI
C109/DCD/GPO
C125/RING/GPO
C107/DSR/GPO
C108/DTR/GPI
C105/RTS/GPI
C106/CTS/GPO
Audio
SIM card interface
External SIM signal – Data I/O
Presence SIM input
C103/TXD
Auxiliary
Auxiliary UART (RX Data)
SPI_MISO
Auxiliary UART (TX Data)
SPI_MOSI
Prog. / Data + HW Flow Control
Output for Data carrier detect signal (DCD) to DTE
/ GP output
Output for Ring indicator signal (RI) to DTE
/ GP output
Output for Data set ready signal (DSR) to DTE
/ GP output
Input for Data terminal ready signal (DTR) from DTE
/ GP input
Input for Request to send signal (RTS) from DTE
/ GP input
Output for Clear to send signal (CTS) to DTE
/ GP output
Serial data input (TXD) from DTE
C104/RXD
Serial data output to DTE
44
45
1,8 / 3V
4.7k Pull up
1,8 / 3V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
DAC and ADC
13
ADC_IN1
AI
Analog/Digital converter input
14
ADC_IN2
AI
Analog/Digital converter input
15
DAC_OUT
AO
Digital/Analog converter output
Accepted
values 0 to
1.2V DC
Accepted
values 0 to
1.2V DC
A/D
A/D
D/A
Miscellaneous Functions
30
VRTC
AO
47
RESET*
43
V_AUX / PWRMON
backup for the embedded RTC supply (1.8V)
Reset Input
1.8V stabilized output Imax=100mA
/ Power ON monitor
Power
CMOS 1.8V
Power Out 1.8V
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Pad
Signal
I/O
Function
34
Antenna
I/O
Antenna pad – 50 Ω
42
GPIO_01 / DVI_WA0
I/O
41
GPIO_02 / JDR /
DVI_RX
I/O
40
GPIO_03 / DVI_TX
I/O
39
GPIO_04 / DVI_CLK
I/O
29
GPIO_05
I/O
28
GPIO_06 / SPI_SRDY
I/O
27
GPIO_07 / SPI_MRDY
I/O
26
GPIO_08 / STAT_LED
I/O
25
SPI_CLK
I/O
GPIO
GPIO01 Configurable GPIO
/ Digital Audio Interface (WA0)
GPIO02 I/O pin
/ Jammer Detect Report
/ Digital Audio Interface (RX)
GPIO03 GPIO I/O pin
/ Digital Audio Interface (TX)
GPIO04 Configurable GPIO
Digital Audio Interface (CLK)
GPIO05 Configurable GPIO
GPIO06 Configurable GPIO
/ ALARM / SPI_SRDY
GPIO07 Configurable GPIO
/ Buzzer / SPI_MRDY
GPIO08 Configurable GPIO
/ Digital Audio Interface (CLK)
SPI_CLK
Note
Type
RF
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Power Supply
38
VBATT
Main power supply (Baseband)
37
VBATT_PA
Main power supply (Radio PA)
Power
23
AGND
AF Signal Ground (see audio section)
32
GND
Ground
Power
33
GND
Ground
Power
35
GND
Ground
Power
36
GND
Ground
Power
46
GND
Ground
Power
23
GND
Ground
Power
AF Signal
RESERVED
19
20
21
22
24
31
48
WARNING:
Reserved pins must not be connected.
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NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the
following pins:
4.2.
Pin
38, 37
32, 33, 35, 36, 46
23
43
47
45
44
signal
VBATT & VBATT_PA
GND
AGND
C103/TXD
C104/RXD
C105/RTS
C106/CTS
V_AUX / PWRMON
RESET*
TXD_AUX
RXD_AUX
18
USB D+
17
USB D-
16
USB_VBUS
If not used should be connected to a Test Point
If not used should be connected to a Test Point
If not used should be connected to a Test Point
If not used should be connected to a Test Point
If not used should be connected to a Test Point
If not used should be connected to a Test Point
If not used should be connected to a Test Point or
an USB connector
If not used should be connected to a Test Point or
an USB connector
If not used should be connected to a Test Point or
an USB connector
Debug in Production
To test and debug the assembled UL865-N3G V2, we strongly recommend foreseeing test
pads on the host PCB, in order to check the connection between the UL865-N3G V2 itself and
the application and to test the performance of the module connecting it with an external
computer. Depending by the customer application, these pads include, but are not limited to
the following signals:
TXD
RXD
RESET*
GND
VBATT
VBATT_PA
TX_AUX
RX_AUX
PWRMON
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4.3.
Pin Layout
TOP VIEW
NOTE:
The pins defined as NC/RFU shall be considered RESERVED and must not be connected
to any pin in the application.
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5.
Hardware Commands
5.1.
Auto-Turning ON the UL865-N3G V2
The UL865-N3G V2 will automatically power on itself when VBATT & VBATT_PA are
applied to the module.
V_AUX / PWRMON pin will be at the high logic level and the module can be considered
fully operating after 5 seconds.
The following flow chart shows the proper turn on procedure:
Modem ON Proc.
PWR supply ON
and >3.22V?
Delay 300mS
Enter AT
PWMON = ON?
AT answer in
1second ?
Delay 1s - 5s for Low
Voltage Operating
PWMON = ON?
AT init sequence.
Modem Reset Proc.
Delay 1s
Start AT CMD.
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NOTE:
The power supply must be applied either at the same time on pins VBATT and
VBATT_PA.
NOTE:
To guarantee a correct module’s start-up please check that the Power Supply is with a
level >3.22V within 21mS.
NOTE:
In order to prevent a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the UL865-N3G V2 when the module is
powered OFF or during an ON/OFF transition.
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A flow chart showing the AT commands managing procedure is displayed below:
Start AT CMD.
Delay 300mS
Enter AT
AT answer in
1second?
AT init sequence.
Disconnect PWR supply
Modem ON Proc.
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5.2.
Turning OFF the UL865-N3G V2
The following flow chart shows the proper turnoff procedure:
Modem OFF Proc.
AT#SYSHALT
10s timeout
Disconnect PWR supply
Delay 1.5s
Modem ON Proc.
NOTE:
In order to prevent a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the UL865-N3G V2 when the module is
powered off or during an ON/OFF transition.
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5.3.
Resetting the UL865-N3G V2
5.3.1.
Hardware Unconditional restart
To unconditionally reboot the UL865-N3G V2, the pad RESET* must be tied low for at
least 200 milliseconds and then released.
The maximum current that can be drained from the ON* pad is 0,15 mA.
WARNING:
The hardware unconditional Restart must not be used during normal operation of the
device since it does not detach the device from the network. It shall be kept as an
emergency exit procedure to be done in the rare case that the device gets stuck waiting for
some network or SIM responses.
NOTE:
Do not use any pull up resistor on the RESET* line nor any totem pole digital output.
Using pull up resistor may bring to latch up problems on the UL865-N3G V2 power
regulator and improper functioning of the module.
The line RESET* must be connected only in open collector configuration; the transistor
must be connected as close as possible to the RESET* pin.
TIP:
The unconditional hardware restart must always be implemented on the boards and the
software must use it as an emergency exit procedure.
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A simple circuit to do it is:
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In the following flow chart is detailed the proper restart procedure:
Modem Reset
Proc.
Reset = LOW
Delay 200ms
Reset = HIGH
Delay 1s
Start AT CMD.
NOTE:
In order to prevent a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the UL865-N3G V2 when the module is
powered OFF or during an ON/OFF transition.
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6.
Power Supply
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performance, hence read the
requirements carefully and the guidelines that will follow for a proper design.
6.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and
must fulfill the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
3.8 V
3.40 V÷ 4.20 V
3.1 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken in order to
fulfil min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with complete assumption
and application of the HW User guide suggestions.
If the voltage drop is exceeding the limits it could cause a Power Off of the module.
The Power supply must be higher than 3.22 V to power on the module.
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6.2.
Power Consumption
UL865-N3G V2
Mode
Average (mA)
Mode description
SWITCHED OFF
Module supplied but Switched Off
Switched Off
180 uA
IDLE mode (WCDMA)
AT+CFUN=5
1.8
Disabled TX and RX; DRX7
Operative mode (WCDMA)
WCDMA Voice
152
WCDMA voice call (TX = 10dBm)
WCDMA HSDPA (0dBm)
187
WCDMA data call (Cat 8, TX = 0dBm)
WCDMA HSDPA (22dBm)
494
WCDMA data call (Cat 8, TX = 24dBm)
NOTE:
The electrical design for the Power supply should be made ensuring it will be capable of a
peak current output of at least 2 A.
6.3.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
 the electrical design
 the thermal design
 the PCB layout.
6.3.1.
Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where
this power is drained. We will distinguish them into three categories:
 +5V input (typically PC internal regulator output)
 +12V input (typically automotive)
 Battery
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6.3.1.1. + 5V input Source Power Supply Design
Guidelines





The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used. A
switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to
dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks close to the UL865-N3G V2, a 100μF tantalum capacitor
is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
UL865-N3G V2 from power polarity inversion.
An example of linear regulator with 5V input is:
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6.3.1.1. + 12V input Source Power Supply Design
Guidelines








The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited and
shall not be used. A switching power supply will be preferable because of its better
efficiency especially with the 2A peak current load represented by the UL865-N3G
V2.
When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This
allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the application
to be developed due to the fact the switching frequency could also generate EMC
interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in
mind when choosing components: all components in the power supply must
withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power
input, in order to clean the supply from spikes.
A protection diode should be inserted close to the power input, in order to save the
UL865-N3G V2 from power polarity inversion. This can be the same diode as for
spike protection.
An example of switching regulator with 12V input is in the below schematic:
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6.3.1.1. Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit UL865-N3G V2 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT
BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum
voltage for the UL865-N3G V2 and damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with UL865N3G V2. Their use can lead to overvoltage on the UL865-N3G V2 and damage it. USE
ONLY Li-Ion battery types.




A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
UL865-N3G V2 from power polarity inversion. Otherwise the battery connector should
be done in a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks of
2A; the suggested capacity is from 500mAh to 1000mAh.
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6.3.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:

Average current consumption during HSDPA transmission @PWR level max :
600 mA

Average current during idle:
1.5 mA
NOTE:
The average consumption during transmissions depends on the power level at which the
device is requested to transmit by the network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if Power Saving function is enabled,
it is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let's say few
minutes) and then remains for a quite long time in idle (let's say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be smaller
than the calculated one for 600mA maximum RMS current, or even could be the simple chip
package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a lower
power level than the maximum and hence the current consumption will be less than the
600mA, being usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground plane where
the power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
For the heat generated by the UL865-N3G V2, you can consider it to be during transmission
1W max during CSD/VOICE calls.
This generated heat will be mostly conducted to the ground plane under the UL865-N3G V2;
you must ensure that your application can dissipate it.
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6.3.3.
Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor
on the output to cut the current peaks and a protection diode on the input to protect the supply
from spikes and polarity inversion. The placement of these components is crucial for the
correct working of the circuitry. A misplaced component can be useless or can even decrease
the power supply performances.

The Bypass low ESR capacitor must be placed close to the Telit UL865-N3G V2
power input pads or in the case the power supply is a switching type it can be
placed close to the inductor to cut the ripple provided the PCB trace from the
capacitor to the UL865-N3G V2 is wide enough to ensure a dropless connection
even during the 2A current peaks.

The protection diode must be placed close to the input connector where the
power source is drained.

The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 2A current peaks are absorbed.
Note that this is not made in order to save power loss but especially to avoid the
voltage drops on the power line at the current peaks frequency of 216 Hz that
will reflect on all the components connected to that supply, introducing the noise
floor at the burst base frequency. For this reason while a voltage drop of 300-400
mV may be acceptable from the power loss point of view, the same voltage drop
may not be acceptable from the noise point of view. If your application doesn't
have audio interface but only uses the data feature of the Telit UL865-N3G V2,
then this noise is not so disturbing and power supply layout design can be more
forgiving.

The PCB traces to the UL865-N3G V2 and the Bypass capacitor must be wide
enough to ensure no significant voltage drops occur when the 2A current peaks
are absorbed. This is for the same reason as previous point. Try to keep this trace
as short as possible.

The PCB traces connecting the Switching output to the inductor and the
switching diode must be kept as short as possible by placing the inductor and the
diode very close to the power switching IC (only for switching power supply).
This is done in order to reduce the radiated field (noise) at the switching
frequency (100-500 kHz usually).

The use of a good common ground plane is suggested.

The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not
overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or
earphone amplifier.
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
The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.

The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines.
A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N
FBMH1608HM101 can be used for this purpose.
The below figure shows the recommended circuit:
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7.
Radio Section
7.5.
TX Output Power
Band
WCDMA FDD B2, B5
7.6.
Sensitivity
Band
WCDMA FDD B2
WCDMA FDD B5
7.7.
Power Class
Class 3 (0.25W)
Typical
-110 dBm
-111 dBm
Note
BER <0.1%
BER <0.1%
Antenna Requirements
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read carefully
and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit UL865-N3G V2 device shall
fulfill the following requirements:
Frequency range
Bandwidth
(WCDMA)
Impedance
Input power
VSWR absolute max
VSWR recommended
UL865-N3G V2
Depending by frequency band(s) provided by the network operator,
the customer shall use the most suitable antenna for that/those band(s)
70 MHz in WCDMA Band V
140 MHz in WCDMA Band II
50 ohm
> 24dBm Average power in WCDMA
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfill all regulatory requirements)
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7.7.1.
UL865-N3G V2 Antenna – PCB line Guidelines
When using the Telit UL865-N3G V2 module, since there's no antenna connector on the
module, the antenna must be connected to the UL865-N3G V2 through the PCB with the
antenna pad (pin 34).
In the case that the antenna is not directly developed on the same PCB, hence directly
connected at the antenna pad of the UL865-N3G V2, then a PCB line is needed in order to
connect with it or with its connector.
This transmission line shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
50 ohm
Impedance
0,3 dB
Max Attenuation
No coupling with other signals allowed
Cold End (Ground Plane) of antenna shall be equipotential to the
UL865-N3G V2 ground pins
This transmission line should be designed according to the following guidelines:
Ensure that the antenna line impedance is 50 ohm;
Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be
less than 0,3 dB;
Antenna line must have uniform characteristics, constant cross section; avoid meanders and
abrupt curves;
Keep, if possible, one layer of the PCB used only for the Ground plane;
Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having
other signal tracks facing directly the antenna line track;
The ground around the antenna line on PCB has to be strictly connected to the Ground Plane
by placing vias every 2mm at least;
Place EM noisy devices as far as possible from UL865-N3G V2 antenna line;
Keep the antenna line far away from the UL865-N3G V2 power supply lines;
If you have EM noisy devices around the PCB hosting the UL865-N3G V2, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the layers of
PCB and surround it with Ground planes, or shield it with a metal frame cover.
If you don't have EM noisy devices around the PCB of UL865-N3G V2, by using a micro
strip on the superficial copper layer for the antenna line, the line attenuation will be lower
than a buried one;
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7.8.
PCB Guidelines in case of FCC certification
In the case FCC certification is required for an application using UL865-N3G V2, according
to FCC KDB 996369 for modular approval requirements, the transmission line has to be
similar to that implemented on UL865-N3G V2 interface board and described in the following
chapter.
7.8.1.
Transmission line design
During the design of the UL865-N3G V2 interface board, the placement of components has
been chosen properly, in order to keep the line length as short as possible, thus leading to
lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been
chosen, since this kind of transmission line ensures good impedance control and can be
implemented in an outer PCB layer as needed in this case. A SMA female connector has been
used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by
relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance
from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on
layer 3, while copper is removed from layer 2 underneath the line. Height of trace above
ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss
is less than 0.1 dB. The line geometry is shown below:
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7.8.2.
Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A
calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA
connector has been soldered to the board in order to characterize the losses of the transmission
line including the connector itself. During Return Loss / impedance measurements, the
transmission line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load)
is shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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7.9.
Antenna - Installation Guidelines
Install the antenna in a place covered by the GSM / WCDMA signal.
If the device antenna is located farther than 20cm from the human body and there are no colocated transmitter then the Telit FCC/IC approvals can be re-used by the end product.
If the device antenna is located closer than 20cm from the human body or there are co-located
transmitter then the additional FCC/IC testing may be required for the end product (Telit
FCC/IC approvals cannot be reused).
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according to antenna manufacturer instructions.
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8.
Logic level specifications
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The
following table shows the logic level specifications used in the UL865-N3G V2 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V +2.1V
(CMOS 1.8) when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
Output high level
0V
1.6V
0.35V
1.9V
Output low level
0V
0.2V
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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8.5.
Reset signal
Signal
Function
I/O
pin
RESET*
Phone reset
47
RESET* is used to reset the UL865-N3G V2. Whenever this signal is pulled low, the UL865N3G V2 is reset. When the device is reset it stops any operation. After the release of the reset
UL865-N3G V2 is unconditionally shut down, without doing any detach operation from the
network where it is registered. This behavior is not a proper shut down because any GSM
device is requested to issue a detach request on turn off. For this reason the Reset signal must
not be used to normally shutting down the device, but only as an emergency exit in the rare
case the device remains stuck waiting for some network response.
The RESET* is internally controlled on start-up to achieve a proper power-on reset sequence,
so there's no need to control this pin on start-up. It may only be used to reset a device already
on that is not responding to any command.
NOTE:
Do not use this signal to power OFF the UL865-N3G V2. Use the ON/OFF procedure to
perform this function.
Reset Signal Operating levels:
Signal
RESET* Input high
RESET* Input low
Min
1.5V(NOTE1)
0V
Max
1.9V
0.35V
(NOTE1) this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be connected with
an open collector transistor, to permit to the internal circuitry the power on reset and under
voltage lockout functions.
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9.
USB Port
The UL865-N3G V2 includes one integrated universal serial bus (USB) transceiver.
9.1.
USB 2.0 HS
This port is compliant with the USB 2.0 HS only.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
18
USB_D+
I/O
USB differential Data (+)
3.3V
17
USB_D-
I/O
USB differential Data (-)
3.3V
VUSB
AI
Power sense for the internal USB
transceiver.
5V
NOTE
Accepted range:
4.4V to 5.25V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.
The signal traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The characteristic impedance value should be as close as
possible to 90 Ohms differential.
In case there is a need to add an ESD protection the suggested connection is the following:
NOTE:
VUSB pin should be disconnected before activating the Power Saving Mode.
The USB FS mode could be used to provide AT Commands / Data communication but not
for a SW upgrade.
The USB FS mode is supported only when the module is fully operative.
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10.
SPI Port
The UL865-N3G V2 Module is provided by one SPI interface.
The SPI interface defines two handshake lines for flow control and mutual wake-up of the
modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).
The AP has the master role, that is, it supplies the clock.
The following table is listing the available signals:
PAD
44
45
28
27
25
Signal
SPI_MISO
SPI_MOSI
SPI_SRDY
SPI_MRDY
SPI_CLK
I/O
I/O
I/O
I/O
Function
SPI_MISO
SPI_MOSI
SPI_SRDY
SPI_MRDY
SPI_CLK
Type
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Comment
Shared with RX_AUX
Shared with GPIO_06 / ALARM /
Shared with GPIO_07 / BUZZER /
CMOS 1.8V
NOTE:
Due to the shared functions, when the SPI port is used, it is not possible to use the Auxiliary
UART, GPIO_06, GPIO_07 and related alternate functions.
10.5.
SPI Connections
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11.
Serial Ports
The serial port on the UL865-N3G V2 is the core of the interface between the module and
OEM hardware.
2 serial ports are available on the module:
 MODEM SERIAL PORT 1 (Main, ASC0)
 MODEM SERIAL PORT 2 (Auxiliary, ASC1)
11.1.
MODEM SERIAL PORT 1
Several configurations can be designed for the serial port on the OEM hardware, but the most
common are:
 RS232 PC com port
 microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
 microcontroller UART @ 3V or other voltages different from 1.8V
 microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be
needed to make the system work. The only configuration that doesn't need a level translation
is the 1.8V UART.
The serial port on the UL865-N3G V2 is a +1.8V UART with all the 8 RS232 signals. It
differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels
for the UL865-N3G V2 UART are the CMOS levels:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital -0.3V
+2.1V
pad when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level VIH
1.5V
1.9V
Input low level VIL
Output high level VOH
Output low level VOL
0V
1.6V
0V
0.35V
1.9V
0.2V
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The signals of the UL865-N3G V2 serial port are:
RS232 Pin
Number
Signal
UL865-N3G V2
Pad Number
Name
DCD - dcd_uart
Data Carrier Detect
RXD - tx_uart
Transmit line *see Note
TXD - rx_uart
Receive line *see Note
DTR - dtr_uart
Data Terminal Ready
GND
32, 33, 35, 36, 46
Ground
DSR - dsr_uart
Data Set Ready
RTS -rts_uart
Request to Send
CTS - cts_uart
Clear to Send
RI - ri_uart
Ring Indicator
Usage
Output from the UL865-N3G V2 that
indicates the carrier presence
Output transmit line of UL865-N3G V2
UART
Input receive of the UL865-N3G V2
UART
Input to the UL865-N3G V2 that controls
the DTE READY condition
Ground
Output from the UL865-N3G V2 that
indicates the module is ready
Input to the UL865-N3G V2 that controls
the Hardware flow control
Output from the UL865-N3G V2 that
controls the Hardware flow control
Output from the UL865-N3G V2 that
indicates the incoming call condition
The following table shows the typical input value of internal pull-up resistors for RTS DTR
and TXD input lines and in all module states:
RTS DTR TXD
STATE
ON
OFF
RESET
POWER
SAVING
5K to 12K
Schottky diode
Schottky diode
5K to 12K
Pull up tied to
1V8
1V8
The input line ON_OFF and RESET state can be treated as in picture below
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NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore on the
UL865-N3G V2 side these signal are on the opposite direction: TXD on the application side
will be connected to the receive line (here named TXD/ rx_uart ) of the UL865-N3G V2
serial port and vice versa for RX.
NOTE:
For a minimum implementation, only the TXD and RXD lines can be connected, the other
lines can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the UL865-N3G V2 when the module is powered off
or during an ON/OFF transition.
11.2.
MODEM SERIAL PORT 2
The secondary serial port on the UL865-N3G V2 is a CMOS1.8V with only the RX and TX
signals. The signals of the UL865-N3G V2 serial port are:
PAD
Signal
I/O
Function
Type
Comment
44
RXD_AUX
Auxiliary UART (RX Data from DTE)
CMOS 1.8V
Shared with SPI_MISO
45
TXD_AUX
Auxiliary UART (TX Data to DTE)
CMOS 1.8V
Shared with SPI_MOSI
NOTE:
Due to the shared functions, when the SPI port is used, it is not possible to use the SPI port.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the UL865-N3G V2 when the module is powered off
or during an ON_OFF transition.
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11.3.
RS232 level translation
In order to interface the UL865-N3G V2 with a PC com port or a RS232 (EIA/TIA-232)
application a level translator is required. This level translator must:
invert the electrical signal in both directions;
change the level from 0/1.8V to +15/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the
level translator. Note that the negative signal voltage must be less than 0V and hence some
sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and
in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:

5 drivers

3 receivers
NOTE:
The digital input lines working at 1.8V CMOS have an absolute maximum input voltage of
2.1V; therefore the level translator IC shall not be powered by the +3.8V supply of the
module. Instead, it must be powered from a +1.8V (dedicated) power supply.
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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver
(MAX218).
In this case the chipset is capable to translate directly from 0/1.8V to the RS232 levels
(Example done on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
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12.
Audio Section Overview
The Base Band Chip of the UL865-N3G V2 provides one Digital Audio Interface.
Please refer to the UL865-N3G V2 DVI Application Note for additional details on this
function.
13.
General Purpose I/O
The general purpose I/O pads can be configured to act in three different ways:
 input
 output
 alternate function (internally controlled)
Input pads can be read; they report the digital value (high or low) present on the pad at the
read time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the UL865-N3G V2 firmware and acts
depending on the function implemented.
The following table shows the available GPIO on the UL865-N3G V2 and their state.
Type
Input /
output
current
Default
State
ON_OFF
state
State
during
Reset
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
GPIO_03
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
39
GPIO_04
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
29
GPIO_05
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
28
GPIO_06
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
27
GPIO_07
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
26
GPIO_08
I/O
Configurable GPIO
CMOS 1.8V
1uA/1mA
INPUT
Pin
Signal
I/O
42
GPIO_01
I/O
41
GPIO_02
40
Function
Note
Alternate function
DVI_WA0
Alternate function
JDR and DVI_RX
Alternate function
DVI_TX
Alternate function
TX Disable and
DVI_CLK
Alternate function
/SPI_SRDY
Alternate function
/SPI_MRDY
Alternate function
STAT_LED
NOTE:
The internal GPIO’s pull up/pull down could be set to the preferred status for the application
using the AT#GPIO command.
Please refer for the AT Commands User Guide for the detailed command Syntax.
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WARNING:
During power up the GPIOs may be subject to transient glitches.
Also the UART‘s control flow pins can be usable as GPI/O.
Pin
Signal
I/O
Function
GPO_A
Configurable GPO
GPO_B
Configurable GPO
GPO_C
Configurable GPO
GPI_E
Configurable GPI
GPI_F
Configurable GPI
GPO_D
Configurable GPO
Type
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
Input /
output
current
Default
State
ON_OFF
state
State
during
Reset
1uA/1mA
INPUT
1uA/1mA
INPUT
1uA/1mA
INPUT
1uA/1mA
INPUT
1uA/1mA
INPUT
1uA/1mA
INPUT
Note
Alternate function
C109/DCD
Alternate function
C125/RING
Alternate function
C107/DSR
Alternate function
C108/DTR
Alternate function
C105/RTS
Alternate function
C106/CTS
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13.1.
GPIO Logic levels
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the UL865-N3G V2 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V +2.1V
(CMOS 1.8) when on
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
Output high level
0V
1.6V
0V
0.35V
1.9V
0.2V
Output low level
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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13.2.
Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another device
and report its status, provided this device has interface levels compatible with the 1.8V
CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface levels
different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a
47K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the UL865-N3G V2 when the module is powered
OFF or during an ON/OFF transition.
TIP:
The V_AUX / PWRMON pin can be used for input pull up reference or/and for ON
monitoring.
13.3.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
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13.4.
Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call
status. The function is available as alternate function of GPIO_08 (to be enabled using the
AT#GPIO=8,0,2 command).
In the UL865-N3G V2 modules, the STAT_LED needs an external transistor to drive an
external LED.
Therefore, the status indicated in the following table is reversed with respect to the pin status.
Device Status
LED status
Device off
Permanently off
Not Registered
Permanently on
Registered in idle
Registered in idle + power saving
Blinking 1sec on + 2 sec off
It depends on the event that triggers the wakeup
(In sync with network paging)
Voice Call Active
Dial-Up
Permanently on
Blinking 1 sec on + 2 sec off
A schematic example could be:
13.5.
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13.5.
SIMIN detect function
All the GPIO pins can be used as SIM DETECT input. The AT Command used to enable the
function is:
AT#SIMINCFG
Use the AT command AT#SIMDET=2 to enable the SIMIN detection
Use the AT command AT&W0 and AT&P0 to store the SIMIN detection in the common
profile.
For full details see AT Commands Reference Guide, 80000ST10025a.
NOTE:
Don’t use the SIM IN function on the same pin where the GPIO function is enabled and vice
versa!
13.6.
RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing having only RTC going on when all the other parts of the device are off.
To this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery. NO Devices must be powered from this pin.
In order to keep the RTC active when VBATT is not supplied it is possible to back up the
RTC section connecting a backup circuit to the related VRTC signal (pad 30 on module’s
Pinout).
For additional details on the Backup solutions please refer to the related application note
(RTC Backup Application Note)
13.7.
SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
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14.
DAC and ADC section
14.1.
DAC Converter
14.1.1. Description
The UL865-N3G V2 provides a Digital to Analog Converter. The signal (named DAC_OUT)
is available on pin 15 of the UL865-N3G V2.
The on board DAC is a 10 bit converter, able to generate an analogue value based on a
specific input in the range from 0 up to 1023. However, an external low-pass filter is
necessary
Voltage range (filtered)
Range
Min
Max
1.8
1023
Units
Volt
Steps
The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated
voltage could be calculated with the following formula:
Integrated output voltage = (2 *value) / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain
an analog voltage.
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14.1.2. Enabling DAC
An AT command is available to use the DAC function.
The command is: AT#DAC= [ [, ]]
 - scale factor of the integrated output voltage (0..1023 - 10 bit precision)
it must be present if =1
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
14.1.3. Low Pass Filter Example
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14.2.
ADC Converter
14.2.1. Description
The UL865-N3G V2 is provided by two A/D converters. They are able to read a voltage level
in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.
The following table is showing the ADC characteristics:
Input Voltage range
AD conversion
Input Resistance
Input Capacitance
Min
Typical Max
1.2
10
Units
Volt
bits
Mohm
pF
The signal is available on the following pads:
PAD
Name
I/O
13
ADC_IN1
AI
14
ADC_IN2
AI
14.2.2.
Description
Analog/Digital converter
input
Analog/Digital converter
input
Notes
Accepted values 0 to 1.2V DC
Accepted values 0 to 1.2V DC
Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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14.3.
VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the
module. The signal is present on Pad 43 and it is in common with the PWRMON (module
powered ON indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Level
Output voltage
Output current
Output bypass capacitor
(inside the module)
Min
Typical
Max
1.78V
1.80V
1.82V
60mA
1uF
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15.
Mounting
Board
15.1.
General
the
UL865-N3G
V2
on
your
The UL865-N3G V2 modules have been designed to be compliant with a standard lead-free
SMT process.
15.2.
Module finishing & dimensions
Pin 1
Lead-free Alloy:
Surface finishing Ni/Au for all solder pads
Bottom View
Dimensions in mm
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15.3.
Recommended foot print for the application
In order to easily rework the UL865-N3G V2 is suggested to consider on the application a 1.5
mm placement inhibited area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
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15.4.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
15.5.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper Pad
Pad
Solder Mask
PCB
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
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15.6.
Recommendations for PCB pad dimensions
(mm):
Solder resist opening
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm
around the pads unless it carries the same signal of the pad itself (see following figure).
Inhibit area for micro-via
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Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Electro-less Ni / Immersion Au
3 –7 / 0.03 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tinlead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to use milled
contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
15.7.
Solder paste
Lead free
Sn/Ag/Cu
Solder paste
We recommend using only “no clean” solder paste in order to avoid the cleaning of
the modules after assembly.
15.8.
UL865-N3G V2 Solder reflow
Recommended solder reflow profile
tp
TL
tL
Tsmax
Tsmin
ts
ttp
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Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (ttp)
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
The UL865-N3G V2 module withstands one reflow process only.
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16.
Packing system
16.1.
Packing on tray
The UL865-N3G V2 modules are packaged on trays of 20 pieces each. These trays can be
used in SMT processes for pick & place handling.
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16.2.
Packing in Reel
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16.3.
Moisture sensitivity
The moisture sensitivity level of the Product is “3” according with standard IPC/JEDEC JSTD-020, take care of all the relative requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) The shelf life of the Product inside of the dry bag is 12 months from the bag seal date,
when stored in a non-condensing atmospheric environment of < 40°C and < 90% RH.
b) Environmental condition during the production: <= 30°C / 60% RH according to
IPC/JEDEC J-STD-033B.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033B paragraph 5.2” is respected.
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more.
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17.
SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The
use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as hospitals,
airports, aircrafts, etc.
Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific environment
regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty
validity.
We recommend following the instructions of the hardware user guides for a correct wiring of
the product. The product has to be supplied with a stabilized voltage source and the wiring
has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be taken for the
SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has
to be taken to the external components of the module, as well as of any project or installation
issue, because the risk of disturbing the GSM network or external devices or having impact
on the security.
Should there be any doubt, please refer to the technical documentation and the regulations in
force.
Every module has to be equipped with a proper antenna with specific characteristics. The
antenna has to be installed with care in order to avoid any interference with other electronic
devices and has to guarantee a minimum distance from the body (20 cm). In case of this
requirement cannot be satisfied, the system integrator has to assess the final product against
the SAR regulation.
The European Community provides some Directives for the electronic equipments introduced
on the market. All the relevant information’s are available on the European Community
website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available, while
the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
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18.
FCC/IC REGULATORY NOTICES
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes
or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit
la nature.
Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par
l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an
uncontrolled environment. The antenna should be installed and operated with minimum
distance of 20 cm between the radiator and your body. Antenna gain must be below:
Frequency Band
Band II (1900 MHz)
Band V (850 MHz)
Gain
9.01 dBi
7.76 dBd
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un
environnement non contrôlé. L'antenne doit être installé de façon à garder une distance
minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne
doit être ci-dessous:
Bande de fréquence
Band II (1 900 MHz)
Band V (850 MHz)
Gain
9.01 dBi
7.76 dBd
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
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L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou
autreémetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The
certification label of the module shall be clearly visible at all times when installed in the host
device, otherwise the host device must be labelled to display the FCC ID and IC of the
module, preceded by the words "Contains transmitter module", or the word "Contains", or
similar wording expressing the same meaning, as follows:
Contains FCC ID: RI7UL865N3G
Contains IC: 5131A- UL865N3G
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui
s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à
un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une
étiquette donnant le FCC ID et le IC du module, précédé des mots « Contient un module
d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens,
comme suit :
Contains FCC ID: RI7UL865N3G
Contains IC: 5131A- UL865N3G
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
Page 70 of 70
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