Texas Instruments 26M1 BLE and 802.15.4 module User Manual

Texas Instruments Inc. BLE and 802.15.4 module Users Manual

Users Manual

PRODUCTPREVIEWProductFolderSample &BuyTechnicalDocumentsTools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase ofdevelopment. Subject to change or discontinuance without notice.CC2650MODSWRS187 –AUGUST 2016CC2650MOD SimpleLink™ Multistandard Wireless MCU Module1 Device Overview11.1 Features1• Microcontroller– Powerful ARM®Cortex®-M3– EEMBC CoreMark®Score: 142– Up to 48-MHz Clock Speed– 128KB of In-System Programmable Flash– 8KB of SRAM for Cache– 20KB of Ultra-Low Leakage SRAM– 2-Pin cJTAG and JTAG Debugging– Supports Over-The-Air Upgrade (OTA)• Ultra-Low Power Sensor Controller– Can Run Autonomous From the Rest of theSystem– 16-Bit Architecture– 2KB of Ultra-Low Leakage SRAM for Code andData• Efficient Code Size Architecture, Placing Drivers,Bluetooth®low energy Controller, IEEE 802.15.4MAC, and Bootloader in ROM• Integrated Antenna• Peripherals– All Digital Peripheral Pins Can Be Routed toAny GPIO– Four General-Purpose Timer Modules (8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)– 12-Bit ADC, 200-ksamples/s, 8-Channel AnalogMUX– Continuous Time Comparator– Ultra-Low Power Analog Comparator– Programmable Current Source– UART– 2 × SSI (SPI, MICROWIRE, TI)– I2C– I2S– Real-Time Clock (RTC)– AES-128 Security Module– True Random Number Generator (TRNG)– 15 GPIOs– Support for Eight Capacitive Sensing Buttons– Integrated Temperature Sensor• External System– On-Chip internal DC-DC Converter– No External Components Needed, Only SupplyVoltage– Version With CC2592 Range Extender Available• Low Power– Wide Supply Voltage Range• Operation from 1.8 to 3.8 V– Active-Mode RX: 6.1 mA– Active-Mode TX at 0 dBm: 6.1 mA– Active-Mode TX at +5 dBm: 9.1 mA– Active-Mode MCU: 61 µA/MHz– Active-Mode MCU: 48.5 CoreMark/mA– Active-Mode Sensor Controller: 8.2 µA/MHz– Standby: 1 µA (RTC Running and RAM/CPURetention)– Shutdown: 100 nA (Wake Up on ExternalEvents)• RF Section– 2.4-GHz RF Transceiver Compatible WithBluetooth low energy (BLE) 4.1 Specificationand IEEE 802.15.4 PHY and MAC– Excellent Receiver Sensitivity (–97 dBm forBluetooth low energy and –100 dBm for802.15.4), Selectivity, and BlockingPerformance– Programmable Output Power up to +5 dBm– Integrated Antenna– Pre-Certified for Compliance With WorldwideRadio Frequency Regulations• ETSI (Europe)• IC (Canada)• FCC (USA)• ARIB STD-T66 (Japan)• Tools and Development Environment– Full-Feature and Low-Cost Development Kits– Multiple Reference Designs for Different RFConfigurations– Packet Sniffer PC Software– Sensor Controller Studio– SmartRF™ Studio– SmartRF Flash Programmer 2– IAR Embedded Workbench®for ARM– Code Composer Studio™
PRODUCTPREVIEW2CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDevice Overview Copyright © 2016, Texas Instruments Incorporated1.2 Applications• Consumer Electronics• Mobile Phone Accessories• Sports and Fitness Equipment• HID Applications• Home and Building Automation• Lighting Control• Alarm and Security• Proximity Tags• Medical• Remote Controls• Wireless Sensor Networks(1) For more information, see Section 9,Mechanical Packaging and Orderable Information.1.3 DescriptionThe CC2650MOD device is a SimpleLink™ wireless MCU module that targets Bluetooth Smart, ZigBee®and 6LoWPAN, and ZigBee®RF4CE remote control applications.The module is based on the CC2650 Wireless MCU, a member of the CC26xx family of cost-effective,ultra-low power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode currentconsumption provide excellent battery lifetime and allow for operation on small coin cell batteries and inenergy-harvesting applications.The CC2650MOD contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processorand a rich peripheral feature set that includes a unique ultra-low power sensor controller. This sensorcontroller is ideal for interfacing external sensors or for collecting analog and digital data autonomouslywhile the rest of the system is in sleep mode. Thus, the CC2650MOD device is ideal for applicationswithin a whole range of products including industrial, consumer electronics, and medical devices.The CC2650MOD is precertified for operation under the regulations of the FCC, IC, ETSI and ARIB.These certifications save significant cost and effort for customers when integrating the module into theirproducts.The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partlyrunning on a separate ARM®Cortex®-M0 processor. This architecture improves overall systemperformance and power consumption and makes more flash memory available.The Bluetooth Smart and ZigBee stacks are available free of charge from www.ti.com.Device Information(1)PART NUMBER PACKAGE BODY SIZECC2650MODAMOH MOH (Module) 16.90 mm × 11.00 mm
PRODUCTPREVIEWMain CPU:128KBFlashSensor ControllercJTAG 20KBSRAMROMARM®Cortex®-M3 DC/DC converterRF coreARM®Cortex®-M0DSP Modem4KB SRAMROMSensor Controller Engine2× Analog Comparators12-bit ADC, 200ks/sConstant Current SourceSPI / I2C Digital Sensor IF2KB SRAMTime to Digital ConverterGeneral Peripherals / Modules4× 32-bit Timers2× SSI (SPI, µWire,TI)Watchdog TimerTemp. / Batt. MonitorRTC I2CUART I2S10 / 15 / 31 GPIOsAES32 ch. µDMAADCADCDigital PLLSimpleLinkTM CC2650MOD Wireless MCU ModuleTRNG8KBCache24MHz Crystal Oscillator32.768kHz Crystal Oscillator RF BalunCopyright © 2016, Texas Instruments Incorporated3CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDevice OverviewCopyright © 2016, Texas Instruments Incorporated1.4 Functional Block DiagramFigure 1-1 is a block diagram for the CC2650MOD device.Figure 1-1. CC2650MOD Block Diagram
PRODUCTPREVIEW4CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODRevision History Copyright © 2016, Texas Instruments IncorporatedTable of Contents1 Device Overview ......................................... 11.1 Features .............................................. 11.2 Applications........................................... 21.3 Description............................................ 21.4 Functional Block Diagram ............................ 32 Revision History ......................................... 43 Device Comparison ..................................... 54 Terminal Configuration and Functions.............. 64.1 Module Pin Diagram.................................. 64.2 Pin Functions ......................................... 75 Specifications ............................................ 85.1 Absolute Maximum Ratings .......................... 85.2 ESD Ratings.......................................... 85.3 Recommended Operating Conditions ................ 85.4 Power Consumption Summary ....................... 95.5 General Characteristics .............................. 95.6 Antenna ............................................. 105.7 1-Mbps GFSK (Bluetooth low energy) – RX ........ 105.8 1-Mbps GFSK (Bluetooth low energy) – TX ........ 115.9 2-Mbps GFSK (Bluetooth low energy) – RX ........ 115.10 2-Mbps GFSK (Bluetooth low energy) – TX ........ 125.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –RX ................................................... 125.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –TX ................................................... 135.13 24-MHz Crystal Oscillator (XOSC_HF) ............. 135.14 32.768-kHz Crystal Oscillator (XOSC_LF).......... 135.15 48-MHz RC Oscillator (RCOSC_HF) ............... 135.16 32-kHz RC Oscillator (RCOSC_LF)................. 135.17 ADC Characteristics................................. 145.18 Temperature Sensor ................................ 155.19 Battery Monitor...................................... 155.20 Continuous Time Comparator....................... 155.21 Low-Power Clocked Comparator ................... 155.22 Programmable Current Source ..................... 165.23 DC Characteristics .................................. 165.24 Thermal Resistance Characteristics for MOHPackage ............................................. 175.25 Timing Requirements ............................... 175.26 Switching Characteristics ........................... 175.27 Typical Characteristics .............................. 206 Detailed Description ................................... 256.1 Overview ............................................ 256.2 Functional Block Diagram........................... 256.3 Main CPU ........................................... 266.4 RF Core ............................................. 266.5 Sensor Controller ................................... 276.6 Memory.............................................. 286.7 Debug ............................................... 286.8 Power Management................................. 296.9 Clock Systems ...................................... 306.10 General Peripherals and Modules .................. 306.11 System Architecture................................. 326.12 Certification.......................................... 326.13 End Product Labeling ............................... 336.14 Manual Information to the End User ................ 337 Application, Implementation, and Layout ......... 347.1 Application Information .............................. 348 Device and Documentation Support ............... 358.1 Device Nomenclature ............................... 358.2 Tools and Software ................................. 368.3 Documentation Support ............................. 378.4 Texas Instruments Low-Power RF Website ........ 378.5 Low-Power RF eNewsletter ......................... 378.6 Community Resources.............................. 388.7 Additional Information ............................... 388.8 Trademarks.......................................... 388.9 Electrostatic Discharge Caution..................... 398.10 Export Control Notice ............................... 398.11 Glossary ............................................. 399 Mechanical Packaging and OrderableInformation .............................................. 399.1 Packaging Information .............................. 392 Revision HistoryDATE REVISION NOTESAugust 2016 * Initial Release
PRODUCTPREVIEW5CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDevice ComparisonCopyright © 2016, Texas Instruments Incorporated3 Device ComparisonTable 3-1. Device Family OverviewDEVICE PHY SUPPORT FLASH(KB) RAM (KB) GPIO PACKAGECC2650MODAMOH Multiprotocol 128 20 15 MOH
PRODUCTPREVIEW CC2650MOD (Exposed GND Pads) 3124567 1921201817232210 11 12 13 14 15 16AntennaGNDDIO 0DIO 1DIO 2DIO 3DIO 4JTAG_TMSVDDVDDDIO 14DIO 13DIO 12DIO 11DIO 10JTAG_TCKDIO 5/JTAG_TDODIO 6/JTAG_TDInRESETDIO 7DIO 8DIO 9892524GND GNDG1 G2G3 G4NC NC6CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODTerminal Configuration and Functions Copyright © 2016, Texas Instruments Incorporated4 Terminal Configuration and Functions4.1 Module Pin Diagram(1) The following I/O pins marked in bold in the pinout have high-drive capabilities:• DIO 2• DIO 3• DIO 4• JTAG_TMS• DIO 5/JTAG_TDO• DIO 6/JTAG_TDI(2) The following I/O pins marked in italics in the pinout have analog capabilities:• DIO 7• DIO 8• DIO 9• DIO 10• DIO 11• DIO 12• DIO 13• DIO 14Figure 4-1. MOH Package(16.9-mm × 11-mm) Module Pinout
PRODUCTPREVIEW7CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODTerminal Configuration and FunctionsCopyright © 2016, Texas Instruments Incorporated4.2 Pin FunctionsTable 4-1. Signal Descriptions – MOH PackagePIN NAME PIN NO. PIN TYPE DESCRIPTIONDIO_0 4 Digital I/O GPIO, Sensor ControllerDIO_1 5 Digital I/O GPIO, Sensor ControllerDIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capabilityDIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capabilityDIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capabilityDIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDODIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDIDIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analogDIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analogEGP G1, G2, G3, G4 Power Ground – Exposed ground padGND 1, 25 — GroundJTAG_TCKC 10 Digital I/O JTAG TCKCJTAG_TMSC 9 Digital I/O JTAG TMSC, high-drive capabilityNC 2, 24 NC Not Connected—TI recommends that these pins are leftfloatingRESET_N 13 Digital input Reset, active low. No internal pullupVDDS 22, 23 Power 1.8-V to 3.8-V main chip supply
PRODUCTPREVIEW8CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to ground, unless otherwise noted.(3) Including analog capable DIO.5 Specifications5.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)(2)MIN MAX UNITVDDS Supply voltage –0.3 4.1 VVoltage on any digital pin(3) –0.3 VDDS + 0.3, max 4.1 VVin Voltage on ADC inputVoltage scaling enabled –0.3 VDDSVVoltage scaling disabled, internal reference –0.3 1.49Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9Input RF level 5 dBmTstg Storage temperature –40 85 °C(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.5.2 ESD RatingsVALUE UNITVESD Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDECJS001(1) All pins ±2500VCharged device model (CDM), per JESD22-C101(2) RF pins ±750Non-RF pins ±7505.3 Recommended Operating ConditionsMIN MAX UNITAmbient temperature –40 85 °COperating supply voltage (VDDS)For operation in battery-powered and 3.3-Vsystems(internal DC-DC can be used to minimize powerconsumption)1.8 3.8 V
PRODUCTPREVIEW9CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments Incorporated(1) Iperi is not supported in Standby or Shutdown.5.4 Power Consumption SummaryTc= 25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITIcore Core current consumptionReset. RESET_N pin asserted or VDDS belowPower-on-Reset threshold 100 nAShutdown. No clocks running, no retention 150Standby. With RTC, CPU, RAM and (partial)register retention. RCOSC_LF 1µAStandby. With RTC, CPU, RAM and (partial)register retention. XOSC_LF 1.2Standby. With Cache, RTC, CPU, RAM and(partial) register retention. RCOSC_LF 2.5Standby. With Cache, RTC, CPU, RAM and(partial) register retention. XOSC_LF 2.7Idle. Supply systems and RAM powered. 550Active. Core running CoreMark 1.45 mA +31 µA/MHzRadio RX 6.1mARadio TX, 0-dBm output power 6.1Radio TX, 5-dBm output power 9.1Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1)IperiPeripheral power domain Delta current with domain enabled 20 µASerial power domain Delta current with domain enabled 13 µARF Core Delta current with power domain enabled, clockenabled, RF Core Idle 237 µAµDMA Delta current with clock enabled, module idle 130 µATimers Delta current with clock enabled, module idle 113 µAI2C Delta current with clock enabled, module idle 12 µAI2S Delta current with clock enabled, module idle 36 µASSI Delta current with clock enabled, module idle 93 µAUART Delta current with clock enabled, module idle 164 µA(1) This number is dependent on Flash aging and will increase over time and erase cycles5.5 General CharacteristicsTc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITFLASH MEMORYSupported flash erase cycles beforefailure 100 k CyclesFlash page/sector erase current Average delta current 12.6 mAFlash page/sector erase time(1) 8 msFlash page/sector size 4 KBFlash write current Average delta current, 4 bytes at a time 8.15 mAFlash write time(1) 4 bytes at a time 8 µs
PRODUCTPREVIEW10CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated5.6 AntennaTc= 25°C, VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITPolarization LinearPeak Gain 2450 MHz 1.26 dBiEfficiency 2450 MHz 56.9 %(1) Numbers given as I/C dB(2) X / Y, where X is +N MHz and Y is –N MHz(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification5.7 1-Mbps GFSK (Bluetooth low energy) – RXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITReceiver sensitivity BER = 10–3 –97 dBmReceiver saturation BER = 10–3 4 dBmFrequency error tolerance Difference between center frequency of the received RF signaland local oscillator frequency. –350 350 kHzData rate error tolerance –750 750 ppmCo-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel,BER = 10–3 –6 dBSelectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz,BER = 10–3 7 / 3(2) dBSelectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz,BER = 10–3 34 / 25(2) dBSelectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz,BER = 10–3 38 / 26(2) dBSelectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz,BER = 10–3 42 / 29(2) dBSelectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥±5 MHz,BER = 10–3 32 dBSelectivity, Image frequency(1) Wanted signal at –67 dBm, modulated interferer at imagefrequency, BER = 10–3 25 dBSelectivity,Image frequency ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz fromimage frequency, BER = 10–3 3 / 26(2) dBOut-of-band blocking(3) 30 MHz to 2000 MHz –20 dBmOut-of-band blocking 2003 MHz to 2399 MHz –5 dBmOut-of-band blocking 2484 MHz to 2997 MHz –8 dBmOut-of-band blocking 3000 MHz to 12.75 GHz –8 dBmIntermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405and 2408 MHz respectively, at the given power level –34 dBmSpurious emissions,30 MHz to 1000 MHzConducted measurement in a 50-Ωsingle-ended load. Suitablefor systems targeting compliance with EN 300 328, EN 300 440class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –71 dBmSpurious emissions,1 GHz to 12.75 GHzConducted measurement in a 50-Ωsingle-ended load. Suitablefor systems targeting compliance with EN 300 328, EN 300 440class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –62 dBmRSSI dynamic range 70 dBRSSI accuracy ±4 dB
PRODUCTPREVIEW11CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments Incorporated(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)5.8 1-Mbps GFSK (Bluetooth low energy) – TXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITOutput power, highest setting 5 dBmOutput power, lowest setting –21 dBmSpurious emission conductedmeasurement(1)f < 1 GHz, outside restricted bands –43 dBmf < 1 GHz, restricted bands ETSI –65 dBmf < 1 GHz, restricted bands FCC –76 dBmf > 1 GHz, including harmonics –46 dBm(1) Numbers given as I/C dB.(2) X / Y, where X is +N MHz and Y is –N MHz.(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification.5.9 2-Mbps GFSK (Bluetooth low energy) – RXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITReceiver sensitivity Differential mode. Measured at the CC2650EM-5XDSMA connector, BER = 10–3 –91.7 dBmReceiver saturation Differential mode. Measured at the CC2650EM-5XDSMA connector, BER = 10–3 4 dBmFrequency error tolerance Difference between the incoming carrier frequencyand the internally generated carrier frequency –300 500 kHzData rate error tolerance Difference between incoming data rate and theinternally generated data rate –1000 1000 ppmCo-channel rejection (1) Wanted signal at –67 dBm, modulated interferer inchannel,BER = 10–3 –7 dBSelectivity, ±2 MHz (1)Wanted signal at –67 dBm, modulated interferer at±2 MHz,Image frequency is at –2 MHzBER = 10–38 / 4(2) dBSelectivity, ±4 MHz (1) Wanted signal at –67 dBm, modulated interferer at±4 MHz,BER = 10–3 31 / 26(2) dBSelectivity, ±6 MHz (1) Wanted signal at –67 dBm, modulated interferer at±6 MHz,BER = 10–3 37 / 38(2) dBAlternate channel rejection, ±7MHz(1) Wanted signal at –67 dBm, modulated interferer at ≥±7 MHz, BER = 10–3 37 / 36(2) dBSelectivity, Image frequency(1) Wanted signal at –67 dBm, modulated interferer atimage frequency,BER = 10–3 4 dBSelectivity, Image frequency±2 MHz(1)Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulatedinterferer at ±2 MHz from image frequency,BER = 10–3–7 / 26(2) dBOut-of-band blocking (3) 30 MHz to 2000 MHz –33 dBmOut-of-band blocking 2003 MHz to 2399 MHz –15 dBmOut-of-band blocking 2484 MHz to 2997 MHz –12 dBmOut-of-band blocking 3000 MHz to 12.75 GHz –10 dBmIntermodulation Wanted signal at 2402 MHz, –64 dBm. Twointerferers at 2405 and 2408 MHz respectively, atthe given power level –45 dBm
PRODUCTPREVIEW12CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).5.10 2-Mbps GFSK (Bluetooth low energy) – TXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITOutput power, highest setting Differential mode, delivered to a single-ended 50-Ωloadthrough a balun 5 dBmOutput power, highest setting Measured on CC2650EM-4XS, delivered to a single-ended50-Ωload 2 dBmOutput power, lowest setting Delivered to a single-ended 50-Ωload through a balun –21 dBmSpurious emission conductedmeasurement(1)f < 1 GHz, outside restricted bands –43 dBmf < 1 GHz, restricted bands ETSI –65 dBmf < 1 GHz, restricted bands FCC –76 dBmf > 1 GHz, including harmonics –46 dBm5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITReceiver sensitivity PER = 1% –100 dBmReceiver saturation PER = 1% +4 dBmAdjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz,PER = 1% 39 dBAlternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz,PER = 1% 52 dBChannel rejection, ±15 MHz ormoreWanted signal at –82 dBm, undesired signal is IEEE 802.15.4modulated channel, stepped through all channels 2405 to2480 MHz, PER = 1% 57 dBBlocking and desensitization,5 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 64 dBBlocking and desensitization,10 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 64 dBBlocking and desensitization,20 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 65 dBBlocking and desensitization,50 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 68 dBBlocking and desensitization,–5 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 63 dBBlocking and desensitization,–10 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 63 dBBlocking and desensitization,–20 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 65 dBBlocking and desensitization,–50 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level),CW jammer, PER = 1% 67 dBSpurious emissions,30 MHz to 1000 MHzConducted measurement in a 50-Ωsingle-ended load.Suitable for systems targeting compliance with EN 300 328,EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66–71 dBmSpurious emissions,1 GHz to 12.75 GHzConducted measurement in a 50-Ωsingle-ended load.Suitable for systems targeting compliance with EN 300 328,EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66–62 dBmFrequency error tolerance Difference between center frequency of the received RFsignal and local oscillator frequency >200 ppmRSSI dynamic range 100 dBRSSI accuracy ±4 dB
PRODUCTPREVIEW13CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments Incorporated(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TXRF performance is specified in a single ended 50-Ωreference plane at the antenna feeding point with Tc= 25°C,VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITOutput power, highest setting 5 dBmOutput power, lowest setting –21 dBmError vector magnitude At maximum output power 2%Spurious emission conductedmeasurement(1)f < 1 GHz, outside restricted bands –43dBmf < 1 GHz, restricted bands ETSI –65f < 1 GHz, restricted bands FCC –76f > 1 GHz, including harmonics –46(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As perBluetooth and IEEE 802.15.4 specification(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection5.13 24-MHz Crystal Oscillator (XOSC_HF)(1)Tc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITCrystal frequency 24 MHzCrystal frequency tolerance(2) –40 40 ppmStart-up time(3) 150 µs5.14 32.768-kHz Crystal Oscillator (XOSC_LF)Tc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITCrystal frequency 32.768 kHzCrystal frequency tolerance, Bluetooth lowenergy applications –250 250 ppm(1) Accuracy relatively to the calibration source (XOSC_HF).5.15 48-MHz RC Oscillator (RCOSC_HF)Tc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITFrequency 48 MHzUncalibrated frequency accuracy ±1%Calibrated frequency accuracy(1) ±0.25%Start-up time 5 µs5.16 32-kHz RC Oscillator (RCOSC_LF)Tc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITCalibrated frequency 32.8 kHzTemperature coefficient 50 ppm/°C
PRODUCTPREVIEW14CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated(1) Using IEEE Std 1241™-2010 for terminology and test methods.(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24.(4) For a typical example, see Figure 5-25.(5) Applied voltage must be within absolute maximum ratings (Section 5.1) at all times.5.17 ADC Characteristics(1)Tc= 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITInput voltage range 0 VDDS VResolution 12 BitsSample rate 200 kspsOffset Internal 4.3-V equivalent reference(2) 2 LSBGain error Internal 4.3-V equivalent reference(2) 2.4 LSBDNL(3) Differential nonlinearity >–1 LSBINL(4) Integral nonlinearity ±3 LSBENOB Effective number of bitsInternal 4.3-V equivalent reference(2), 200 ksps,9.6-kHz input tone 9.8BitsVDDS as reference, 200 ksps, 9.6-kHz input tone 10Internal 1.44-V reference, voltage scaling disabled,32 samples average, 200 ksps, 300-Hz input tone 11.1THD Total harmonicdistortionInternal 4.3-V equivalent reference(2), 200 ksps,9.6-kHz input tone –65dBVDDS as reference, 200 ksps, 9.6-kHz input tone –69Internal 1.44-V reference, voltage scaling disabled,32 samples average, 200 ksps, 300-Hz input tone –71SINADand SNDR Signal-to-noise anddistortion ratioInternal 4.3-V equivalent reference(2), 200 ksps,9.6-kHz input tone 60dBVDDS as reference, 200 ksps, 9.6-kHz input tone 63Internal 1.44-V reference, voltage scaling disabled,32 samples average, 200 ksps, 300-Hz input tone 69SFDR Spurious-free dynamicrangeInternal 4.3-V equivalent reference(2), 200 ksps,9.6-kHz input tone 67dBVDDS as reference, 200 ksps, 9.6-kHz input tone 72Internal 1.44-V reference, voltage scaling disabled, 32samples average, 200 ksps, 300-Hz input tone 73Conversion time Serial conversion, time-to-output, 24-MHz clock 50 clock-cyclesCurrent consumption Internal 4.3-V equivalent reference(2) 0.66 mACurrent consumption VDDS as reference 0.75 mAReference voltageEquivalent fixed internal reference (input voltagescaling enabled). For best accuracy, the ADCconversion should be initiated through the TI-RTOS™API in order to include the gain or offset compensationfactors stored in FCFG1.4.3(2)(5) VReference voltageFixed internal reference (input voltage scalingdisabled). For best accuracy, the ADC conversionshould be initiated through the TI-RTOS API in orderto include the gain or offset compensation factorsstored in FCFG1. This value is derived from the scaledvalue (4.3 V) as follows: Vref = 4.3 V × 1408 / 40951.48 VReference voltage VDDS as reference (Also known as RELATIVE) (inputvoltage scaling enabled) VDDS VReference voltage VDDS as reference (Also known as RELATIVE) (inputvoltage scaling disabled) VDDS /2.82(5) VInput Impedance 200 ksps, voltage scaling enabled. Capacitive input,input impedance depends on sampling frequency andsampling time >1 MΩ
PRODUCTPREVIEW15CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments Incorporated(1) Automatically compensated when using supplied driver libraries.5.18 Temperature SensorTc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITResolution 4 °CRange –40 85 °CAccuracy ±5 °CSupply voltage coefficient(1) 3.2 °C/V5.19 Battery MonitorTc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITResolution 50 mVRange 1.8 3.8 VAccuracy 13 mV(1) Additionally the bias module needs to be enabled when running in standby mode.5.20 Continuous Time ComparatorTc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITInput voltage range 0 VDDS VExternal reference voltage 0 VDDS VInternal reference voltage DCOUPL as reference 1.27 VOffset 3 mVHysteresis <2 mVDecision time Step from –10 mV to +10 mV 0.72 µsCurrent consumption when enabled(1) 8.6 µA5.21 Low-Power Clocked ComparatorTc= 25°C, VDDS = 3.0 V, unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNITInput voltage range 0 VDDS VClock frequency 32 kHzInternal reference voltage, VDDS / 2 1.49 – 1.51 VInternal reference voltage, VDDS / 3 1.01 – 1.03 VInternal reference voltage, VDDS / 4 0.78 – 0.79 VInternal reference voltage, DCOUPL / 1 1.25 – 1.28 VInternal reference voltage, DCOUPL / 2 0.63 – 0.65 VInternal reference voltage, DCOUPL / 3 0.42 – 0.44 VInternal reference voltage, DCOUPL / 4 0.33 – 0.34 VOffset <2 mVHysteresis <5 mVDecision time Step from –50 mV to +50 mV <1 clock-cycleCurrent consumption when enabled 362 nA
PRODUCTPREVIEW16CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated(1) Additionally, the bias module must be enabled when running in standby mode.5.22 Programmable Current SourceTc= 25°C, VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITCurrent source programmable output range 0.25–20 µAResolution 0.25 µACurrent consumption(1) Including current source at maximumprogrammable output 23 µA(1) Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details.5.23 DC CharacteristicsPARAMETER TEST CONDITIONS MIN TYP MAX UNITTA= 25°C, VDDS = 1.8 VGPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 1.32 1.54 VGPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.26 0.32 VGPIO VOH at 4-mA load IOCURR = 1 1.32 1.58 VGPIO VOL at 4-mA load IOCURR = 1 0.21 0.32 VGPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µAGPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 21.1 µAGPIO high/low input transition,no hysteresis IH = 0, transition between reading 0 and reading 1 0.88 VGPIO low-to-high input transition,with hysteresis IH = 1, transition voltage for input read as 0 →1 1.07 VGPIO high-to-low input transition,with hysteresis IH = 1, transition voltage for input read as 1 →0 0.74 VGPIO input hysteresis IH = 1, difference between 0 →1 and 1 →0 points 0.33 VTA= 25°C, VDDS = 3.0 VGPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 VGPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 VGPIO VOH at 4-mA load IOCURR = 1 2.72 VGPIO VOL at 4-mA load IOCURR = 1 0.28 VTA= 25°C, VDDS = 3.8 VGPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µAGPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 113 µAGPIO high/low input transition,no hysteresis IH = 0, transition between reading 0 and reading 1 1.67 VGPIO low-to-high input transition,with hysteresis IH = 1, transition voltage for input read as 0 →1 1.94 VGPIO high-to-low input transition,with hysteresis IH = 1, transition voltage for input read as 1 →0 1.54 VGPIO input hysteresis IH = 1, difference between 0 →1 and 1 →0 points 0.4 VTA= 25°CVIH Lowest GPIO input voltage reliably interpreted as a«High» 0.8 VDDS(1)VIL Highest GPIO input voltage reliably interpreted as a«Low» 0.2 VDDS(1)
PRODUCTPREVIEW17CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments Incorporated(1) °C/W = degrees Celsius per watt.(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on aJEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see theseEIA/JEDEC standards:• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal MeasurementsPower dissipation of 2 W and an ambient temperature of 70ºC is assumed.(3) m/s = meters per second.5.24 Thermal Resistance Characteristics for MOH PackageNAME DESCRIPTION °C/W(1) (2) AIR FLOW (m/s)(3)RΘJC Junction-to-case 20.0RΘJB Junction-to-board 15.3RΘJA Junction-to-free air 29.6 0RΘJMA Junction-to-moving air 25.0 1PsiJT Junction-to-package top 8.8 0PsiJB Junction-to-board 14.8 0(1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor (seeSection 7.1.1) must be used to ensure compliance with this slew rate.(2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (seeSection 5.16).(3) TA= –40°C to +85°C, VDDS = 1.7 V to 3.8 V, unless otherwise noted.(4) Tc= 25°C, VDDS = 3.0 V, unless otherwise noted. Device operating as SLAVE. For SSI MASTER operation, see Section 5.26.(5) Refer to SSI timing diagrams Figure 5-1,Figure 5-2, and Figure 5-3.5.25 Timing RequirementsMIN NOM MAX UNITRising supply-voltage slew rate 0 100 mV/µsFalling supply-voltage slew rate 0 20 mV/µsFalling supply-voltage slew rate, with low-power flash settings(1) 3 mV/µsPositive temperature gradient in standby(2) No limitation for negativetemperature gradient, oroutside standby mode 5 °C/sCONTROL INPUT AC CHARACTERISTICS(3)RESET_N low duration 1 µsSYNCHRONOUS SERIAL INTERFACE (SSI) (4)S1 (SLAVE) (5) tclk_per SSIClk period 12 65024 systemclocksS2 (5) tclk_high SSIClk high time 0.5 tclk_perS3(5) tclk_low SSIClk low time 0.5 tclk_per(1) Device operating as MASTER. For SSI SLAVE operation, see Section 5.25.(2) Refer to SSI timing diagrams Figure 5-1,Figure 5-2, and Figure 5-3.5.26 Switching CharacteristicsMeasured on the TI CC2650EM-5XD reference design with Tc= 25°C, VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITWAKEUP AND TIMINGIdle →Active 14 µsStandby →Active 151 µsShutdown →Active 1015 µsSYNCHRONOUS SERIAL INTERFACE (SSI) (1)S1 (TX only)(2) tclk_per (SSIClk period) One-way communication to SLAVE 4 65024 systemclocksS1 (TX and RX)(2) tclk_per (SSIClk period) Normal duplex operation 8 65024 systemclocks
PRODUCTPREVIEW0SSIClkSSIFssSSITxSSIRxMSB LSBMSB LSBS2S3S18-bit control4 to 16 bits output dataSSIClkSSIFssSSITxSSIRx MSB LSBS2S3S14 to 16 bits18CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments IncorporatedSwitching Characteristics (continued)Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, VDDS = 3.0 V, unless otherwise noted.PARAMETER TEST CONDITIONS MIN TYP MAX UNITS2 (2) tclk_high (SSIClk high time) 0.5 tclk_perS3 (2) tclk_low(SSIClk low time) 0.5 tclk_perFigure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing MeasurementFigure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
PRODUCTPREVIEWSSIClk(SPO = 1)SSITx(Master)SSIRx(Slave) LSBSSIClk(SPO = 0)S2S1SSIFssLSBS3MSBMSB19CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments IncorporatedFigure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
PRODUCTPREVIEWFrequency (MHz)Sensitivity Level (dBm)2400 2410 2420 2430 2440 2450 2460 2470 2480-101-100-99-98-97-96-95D008SensitivityFrequency (MHz)Sensitivity Level (dBm)2400 2410 2420 2430 2440 2450 2460 2470 2480-99-98.5-98-97.5-97-96.5-96-95.5-95D009SensitivityVDDS (V)Sensitivity (dBm)1.8 2.3 2.8 3.3 3.8-101-100-99-98-97-96-95D006BLE SensitivityVDDS (V)Sensitivity (dBm)1.9 2.4 2.9 3.4 3.8-101-100-99-98-97-96-95D007IEEE 802.15.4 SensitivityTemperature (qC)Sensitivity (dBm)-40 -30 -20 -10 0 10 20 30 40 50 60 70 80-99-98-97-96-95-94-93D004SensitivityTemperature (qC)Sensitivity (dBm)-40 -30 -20 -10 0 10 20 30 40 50 60 70 80-103-102-101-100-99-98-97-96-95D005Sensitivity20CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments Incorporated5.27 Typical CharacteristicsFigure 5-4. Bluetooth low energy Sensitivity vs Temperature Figure 5-5. IEEE 802.15.4 Sensitivity vs TemperatureFigure 5-6. Bluetooth low energy Sensitivity vs Supply Voltage(VDDS) Figure 5-7. IEEE 802.15.4 Sensitivity vs Supply Voltage (VDDS)Figure 5-8. IEEE 802.15.4 Sensitivity vs Channel Frequency Figure 5-9. Bluetooth low energy Sensitivity vs ChannelFrequency
PRODUCTPREVIEWVoltage (V)Current Consumption (mA)1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.54.555.566.577.588.599.51010.5D014Temperature (qC)RX Current (mA)-40 -30 -20 -10 0 10 20 30 40 50 60 70 805.55.65.75.85.966.16.26.36.46.56.66.76.86.97D015RX CurrentFrequency (MHz)Output Power (dBm)2400 2410 2420 2430 2440 2450 2460 2470 2480-1012345678D0125-dBm settingVDDS (V)TX Current (mA)1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.845678910111213141516D0135-dBm SettingTemperature (qC)Output Power (dBm)-40 -30 -20 -10 0 10 20 30 40 50 60 70 800123456D0105-dBm SettingVDDS (V)Output power (dBm)1.8 2.3 2.8 3.3 3.80123456D0115-dBm Setting21CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments IncorporatedTypical Characteristics (continued)Figure 5-10. TX Output Power vs Temperature Figure 5-11. TX Output Power vs Supply Voltage (VDDS)Figure 5-12. TX Output Powervs Channel Frequency Figure 5-13. TX Current Consumptionvs Supply Voltage (VDDS)Figure 5-14. RX Mode Current vs Supply Voltage (VDDS) Figure 5-15. RX Mode Current Consumption vs Temperature
PRODUCTPREVIEWInput Frequency (Hz)Effective Number of Bits200300 500 1000 2000 5000 10000 20000 1000009.49.69.81010.210.410.610.81111.211.4D009Fs= 200 kHz, No AveragingFs= 200 kHz, 32 samples averagingVDDS (V)ADC Code1.8 2.3 2.8 3.3 3.81004.810051005.21005.41005.61005.810061006.21006.4D012VDDS (V)Current Consumption (mA)1.8 2.3 2.8 3.3 3.822.533.544.55D007Active Mode CurrentTemperature (qC)Current (uA)-20 -10 0 10 20 30 40 50 60 70 8000.511.522.533.54D008Standby Mode CurrentTemperature (qC)Active Mode Current Consumpstion (mA)-40 -30 -20 -10 0 10 20 30 40 50 60 70 802.852.92.9533.053.1D006Active Mode CurrentTemperature (qC)TX Current (mA)-40 -30 -20 -10 0 10 20 30 40 50 60 70 80024681012D0165-dBm Setting22CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments IncorporatedTypical Characteristics (continued)Figure 5-16. TX Mode Current Consumption vs Temperature Figure 5-17. Active Mode (MCU Running, No Peripherals)Current Consumption vs TemperatureFigure 5-18. Active Mode (MCU Running, No Peripherals)Current Consumption vs Supply Voltage (VDDS) Figure 5-19. Standby Mode Current ConsumptionWith RCOSC RTC vs TemperatureFigure 5-20. SoC ADC Effective Number of Bits vs InputFrequency (Internal Reference, No Scaling) Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input,Internal Reference, No Scaling)
PRODUCTPREVIEWADC CodeDNL020040060080010001200140016001800200022002400260028003000320034003600380040004200-1.5-1-0.500.511.522.533.5D010Temperature (qC)ADC Code-40 -30 -20 -10 0 10 20 30 40 50 60 70 801004.510051005.510061006.510071007.5D013Sampling Frequency (Hz)ENOB9.69.79.89.91010.110.210.310.410.51k 10k 100k 200kD009AENOB Internal Reference (No Averaging)ENOB Internal Reference (32 Samples Averaging)23CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODSpecificationsCopyright © 2016, Texas Instruments IncorporatedTypical Characteristics (continued)Figure 5-22. SoC ADC Output vs Temperature (Fixed Input,Internal Reference, No Scaling) Figure 5-23. SoC ADC ENOB vs Sampling Frequency(Input Frequency = FS / 10)Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference, No Scaling)
PRODUCTPREVIEWADC CodeINL0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200-4-3-2-10123D01124CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODSpecifications Copyright © 2016, Texas Instruments IncorporatedTypical Characteristics (continued)Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference, No Scaling)
PRODUCTPREVIEWMain CPU:128KBFlashSensor ControllercJTAG 20KBSRAMROMARM®Cortex®-M3 DC/DC converterRF coreARM®Cortex®-M0DSP Modem4KB SRAMROMSensor Controller Engine2× Analog Comparators12-bit ADC, 200ks/sConstant Current SourceSPI / I2C Digital Sensor IF2KB SRAMTime to Digital ConverterGeneral Peripherals / Modules4× 32-bit Timers2× SSI (SPI, µWire,TI)Watchdog TimerTemp. / Batt. MonitorRTC I2CUART I2S10 / 15 / 31 GPIOsAES32 ch. µDMAADCADCDigital PLLSimpleLinkTM CC2650MOD Wireless MCU ModuleTRNG8KBCache24MHz Crystal Oscillator32.768kHz Crystal Oscillator RF BalunCopyright © 2016, Texas Instruments Incorporated25CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDetailed DescriptionCopyright © 2016, Texas Instruments Incorporated6 Detailed Description6.1 OverviewSection 6.2 shows the core modules of the CC2650MOD device.6.2 Functional Block Diagram
PRODUCTPREVIEW26CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDetailed Description Copyright © 2016, Texas Instruments Incorporated6.3 Main CPUThe SimpleLink CC2650MOD Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runsthe application and the higher layers of the protocol stack.The CM3 processor provides a high-performance, low-cost platform that meets the system requirementsof minimal memory implementation, and low-power consumption, while delivering outstandingcomputational performance and exceptional system response to interrupts.CM3 features include:• 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications• Outstanding processing performance combined with fast interrupt handling• ARM Thumb®-2 mixed 16- and 32 bit instruction set delivers the high performance expected of a 32-bitARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in therange of a few kilobytes of memory for microcontroller-class applications:– Single-cycle multiply instruction and hardware divide– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheralcontrol– Unaligned data access, enabling data to be efficiently packed into memory• Fast code execution permits slower processor clock or increases sleep mode time• Harvard architecture characterized by separate buses for instruction and data• Efficient processor core, system, and memories• Hardware division and fast digital-signal-processing oriented multiply accumulate• Saturating arithmetic for signal processing• Deterministic, high-performance interrupt handling for time-critical applications• Enhanced system debug with extensive breakpoint and trace capabilities• Serial wire trace reduces the number of pins required for debugging and tracing• Migration from the ARM7™ processor family for better performance and power efficiency• Optimized for single-cycle flash memory use• Ultra-low power consumption with integrated sleep modes• 1.25 DMIPS per MHz6.4 RF CoreThe RF Core contains an ARM®Cortex®-M0 processor that interfaces the analog RF and base-bandcircuitries, handles data to and from the system side, and assembles the information bits in a given packetstructure. The RF core offers a high level, command-based API to the main CPU.The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (802.15.4RF4CE and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources forthe user application.The RF core has a dedicated 4KB SRAM block and runs initially from separate ROM memory. The ARMCortex-M0 processor is not programmable by customers.
PRODUCTPREVIEW27CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDetailed DescriptionCopyright © 2016, Texas Instruments Incorporated6.5 Sensor ControllerThe Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripheralsin this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimizedCPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantlyreducing power consumption and offloading the main CM3 CPU.The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, andtypical use cases may be (but are not limited to):• Analog sensors using integrated ADC• Digital sensors using GPIOs and bit-banged I2C or SPI• UART communication for sensor reading or debugging• Capacitive sensing• Waveform generation• Pulse counting• Keyboard scan• Quadrature decoder for polling rotation sensors• Oscillator calibrationThe peripherals in the Sensor Controller include the following:• The low-power clocked comparator can be used to wake the device from any state in which thecomparator is active. A configurable internal reference can be used in conjunction with the comparator.The output of the comparator can also be used to trigger an interrupt or the ADC.• Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital converter, and a comparator. The continuous time comparator in this block can also be usedas a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will takecare of baseline tracking, hysteresis, filtering and other related functions.• The ADC is a 12-bit, 200 ksamples/s ADC with eight inputs and a built-in voltage reference. The ADCcan be triggered by many different sources, including timers, I/O pins, software, the analogcomparator, and the RTC.• The Sensor Controller also includes a SPI/I2C digital interface.• The analog modules can be connected to up to eight different GPIOs.The peripherals in the Sensor Controller can also be controlled from the main application processor.
PRODUCTPREVIEW28CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDetailed Description Copyright © 2016, Texas Instruments Incorporated(1) Up to 13 pins can be connected to the Sensor Controller. Up to eightof these pins can be connected to analog modulesTable 6-1. GPIOs Connected to the Sensor Controller(1)ANALOG CAPABLE 16.9 × 11 MOH DIO NUMBERY 14Y 13Y 12Y 11Y 9Y 10Y 8Y 7N 4N 3N 2N 1N 06.6 MemoryThe flash memory provides nonvolatile storage for code and data. The flash memory is in-systemprogrammable.The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two4KB blocks and two 6KB blocks. Retention of the RAM contents in standby mode can be enabled ordisabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,the 8KB cache can be used as a general-purpose RAM.The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stacksoftware (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader thatcan be used to reprogram the device using SPI or UART.6.7 DebugThe on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)interface.
PRODUCTPREVIEW29CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDetailed DescriptionCopyright © 2016, Texas Instruments Incorporated(1) Not including RTOS overhead(2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD thresholdbetween two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releasesit. To avoid this, it is recommended that STANDBY mode is avoided if there is a risk that the supply voltage (VDDS) may drop below thespecified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as abattery replacement, triggers a Power-on-reset by ensuring that the VDDS decoupling network is fully depleted before applying supplyvoltage again (for example, inserting new batteries).6.8 Power ManagementTo minimize power consumption, the CC2650MOD device supports a number of power modes and powermanagement features (see Table 6-2).Table 6-2. Power ModesMODE SOFTWARE CONFIGURABLE POWER MODES RESET PINHELDACTIVE IDLE STANDBY SHUTDOWNCPU Active Off Off Off OffFlash On Available Off Off OffSRAM On On On Off OffRadio Available Available Off Off OffSupply System On On Duty Cycled Off OffCurrent 1.45 mA + 31 µA/MHz 550 µA 1 µA 0.15 µA 0.1 µAWake-up time to CPU active(1) – 14 µs 151 µs 1015 µs 1015 µsRegister retention Full Full Partial No NoSRAM retention Full Full Full No NoHigh-speed clock XOSC_HF orRCOSC_HF XOSC_HF orRCOSC_HF Off Off OffLow-speed clock XOSC_LF orRCOSC_LF XOSC_LF orRCOSC_LF XOSC_LF orRCOSC_LF Off OffPeripherals Available Available Off Off OffSensor Controller Available Available Available Off OffWake up on RTC Available Available Available Off OffWake up on pin edge Available Available Available Available OffWake up on reset pin Available Available Available Available AvailableBrown Out Detector (BOD) Active Active Duty Cycled(2) Off N/APower On Reset (POR) Active Active Active Active N/AIn active mode, the application CM3 CPU is actively executing code. Active mode provides normaloperation of the processor and all of the peripherals that are currently enabled. The system clock can beany available clock source (see Table 6-2).In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are notclocked and no code is executed. Any interrupt event will bring the processor back into active mode.In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, orsensor-controller event is required to bring the device back to active mode. MCU peripherals with retentiondo not need to be reconfigured when waking up again, and the CPU continues execution from where itwent into standby mode. All GPIOs are latched in standby mode.In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.The I/Os are latched with the value they had before entering shutdown mode. A change of state on anyI/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. TheCPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading thereset status register. The only state retained in this mode is the latched I/O state and the Flash memorycontents.
PRODUCTPREVIEW30CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDetailed Description Copyright © 2016, Texas Instruments IncorporatedThe Sensor Controller is an autonomous processor that can control the peripherals in the SensorController independently of the main CPU, which means that the main CPU does not have to wake up, forexample, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both currentand wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user toconfigure the sensor controller and choose which peripherals are controlled and which conditions wake upthe main CPU.6.9 Clock SystemsThe CC2650MOD device supports two external and two internal clock sources.A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally tocreate a 48-MHz clock.The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than±500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speedcrystal oscillator is designed for use with a 32-kHz watch-type crystal.The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem.The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystaloscillator is not used.The 32-kHz clock source can be used as external clocking reference through GPIO.6.10 General Peripherals and ModulesThe I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripheralsto be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have aprogrammable pullup and pulldown function and can generate an interrupt on a negative or positive edge(configurable). When configured as an output, pins can function as either push-pull or open-drain. FiveGPIOs have high-drive capabilities (marked in bold in Section 4).The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI'ssynchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud-rate generation up to a maximum of 3 Mbps .
PRODUCTPREVIEW31CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDetailed DescriptionCopyright © 2016, Texas Instruments IncorporatedTimer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can beconfigured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RFtimer can be synchronized to the RTC.The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interfaceis capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ringoscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.The watchdog timer is used to regain control if the system fails due to a software error after an externaldevice fails to respond as expected. The watchdog timer can generate an interrupt or a reset when apredefined time-out value is reached.The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way tooffload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and theavailable bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. TheµDMA controller has dedicated channels for each supported on-chip module and can be programmed toautomatically perform transfers between peripherals and memory as the peripheral is ready to transfermore data. Some features of the µDMA controller include the following (this is not an exhaustive list):• Highly flexible and configurable channel operation of up to 32 channels• Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral• Data sizes of 8, 16, and 32 bitsThe AON domain contains circuitry that is always enabled, except for in Shutdown (where the digitalsupply is off). This circuitry includes the following:• The RTC can be used to wake the device from any state where it is active. The RTC contains threecompare and one capture registers. With software support, the RTC can be used for clock andcalendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also becompensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is usedinstead of a crystal.• The battery monitor and temperature sensor are accessible by software and give a battery statusindication as well as a coarse temperature measure.
PRODUCTPREVIEW32CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDetailed Description Copyright © 2016, Texas Instruments Incorporated6.11 System ArchitectureDepending on the product configuration, CC26xx can function either as a Wireless Network Processor(WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or asa System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside thedevice.In the first case, the external host MCU communicates with the device using SPI or UART. In the secondcase, the application must be written according to the application framework supplied with the wirelessprotocol stack.6.12 CertificationThe CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable):Table 6-3. CC2650MODA List of CertificationsRegulatory Body Specification ID (if applicable)FCC (USA) Part 15C:2015+MPE FCC 1.1307 RF Exposure (Bluetooth)FCC ID: ZAT26M1Part 15C:2015+MPE FCC 1.1307 RF Exposure (802.15.4)IC (Canada) RSS-247 (Bluetooth)ID: 451H-26M1RSS-247 (802.15.4)ETSI/CE (Europe)EN300328 v1.9.1 (Bluetooth)EN300328 v1.9.1 (802.15.4)IEC/EN62479:Ver 2010 (MPE) (replacing EN50371)EN301489-1 v1.9.2:2011EN301489-3 v1.6.1:2013EN301489-17 v2.2.1:2012 (EMC)EN55022:2010+AC:2011EN55024:2011EN60950-1: A2/2013Japan MIC JRF-STD-66JATE6.12.1 Federal Communications Commission StatementYou are cautioned that changes or modifications not expressly approved by the part responsible forcompliance could void the user’s authority to operate the equipment.This device complies with Part 15 of the FCC Rules. Operation is subject to the following twoconditions:1. This device may not cause harmful interference and2. This device must accept any interference received, including interference that may cause undesiredoperation of the device.FCC RF Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. Endusers must follow the specific operating instructions for satisfying RF exposure limits. This transmittermust not be colocated or operating in conjunction with any other antenna or transmitter.
PRODUCTPREVIEW33CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDetailed DescriptionCopyright © 2016, Texas Instruments Incorporated6.12.2 Canada, Industry Canada (IC)This device complies with Industry Canada licence-exempt RSS standard(s).Operation is subject to the following two conditions:1. This device may not cause interference, and2. This device must accept any interference, including interference that may cause undesired operation ofthe deviceLe présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licenceL'exploitation est autorisée aux deux conditions suivantes:1. l'appareil ne doit pas produire de brouillage, et2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage estsusceptible d'en compromettre le fonctionnement.IC RF Radiation Exposure Statement:To comply with IC RF exposure requirements, this device and its antenna must not be co-located oroperating in conjunction with any other antenna or transmitter.Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antennene doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.6.13 End Product LabelingThis module is designed to comply with the FCC statement, FCC ID : ZAT26M1. The host system usingthis module must display a visible label indicating the following text:"Contains FCC ID: ZAT26M1"This module is designed to comply with the IC statement, IC : 451H-26M1. The host system using thismodule must display a visible label indicating the following text:"Contains IC: 451H-26M1"6.14 Manual Information to the End UserThe OEM integrator has to be aware not to provide information to the end user regarding how to install orremove this RF module in the user’s manual of the end product which integrates this module.The end user manual shall include all required regulatory information/warning as shown in this manual.
PRODUCTPREVIEWnResetJTAG-TCKJTAG-TMSDIO0DIO1DIO2DIO3DIO4DIO5DIO6DIO7DIO8DIO9DIO10DIO11DIO12DIO13DIO14VDDSVDDSCC2650MODAMOHU1NC_2 2DIO_04DIO_15DIO_26DIO_37DIO_48DIO_5/JTAG_TDO11DIO_6/JTAG_TDI12DIO_714DIO_815DIO_916DIO_1017DIO_1118DIO_1219DIO_1320DIO_1421VDDS 22nRESET13JTAG_TMSC9JTAG_TCKC10VDDS 23NC_24 24GND1GND3GND25EGP 26EGP 27EGP 28EGP 29R28100kCopyright © 2016, Texas Instruments Incorporated34CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODApplication, Implementation, and Layout Copyright © 2016, Texas Instruments Incorporated7 Application, Implementation, and LayoutNOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI's customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.7.1 Application Information7.1.1 Typical Application CircuitNo external components are required for the operation of the CC2650MOD device. Figure 7-1 shows theapplication circuit.Figure 7-1. CC2650MOD Application Circuit
PRODUCTPREVIEWSimpleLink™ MultistandardWireless MCUDEVICE FAMILYPREFIXCC2650 MODX = Experimental deviceBlank = Qualified deviceMOHAROM version 1Flash = 128KBDEVICEPACKAGE DESIGNATORMOH = 29-pin ModuleMOD = Module35CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDevice and Documentation SupportCopyright © 2016, Texas Instruments Incorporated8 Device and Documentation Support8.1 Device NomenclatureTo designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/ordate-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,CC2650MOD is in production; therefore, no prefix/identification is assigned).Device development evolutionary flow:XExperimental device that is not necessarily representative of the final device's electricalspecifications and may not use production assembly flow.PPrototype device that is not necessarily the final silicon die and may not necessarily meetfinal electrical specifications.null Production version of the silicon die that is fully qualified.Production devices have been characterized fully, and the quality and reliability of the device have beendemonstrated fully. TI's standard warranty applies.Predictions show that prototype devices (X or P) have a greater failure rate than the standard productiondevices. Texas Instruments recommends that these devices not be used in any production systembecause their expected end-use failure rate still is undefined. Only qualified production devices are to beused.TI device nomenclature also includes a suffix with the device family name. This suffix indicates thepackage type (for example, MOH).For orderable part numbers of CC2650MOD devices in the MOH package type, see the Package OptionAddendum of this document, the TI website (www.ti.com), or contact your TI sales representative.Figure 8-1. Device Nomenclature
PRODUCTPREVIEW36CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDevice and Documentation Support Copyright © 2016, Texas Instruments Incorporated8.2 Tools and SoftwareTI offers an extensive line of development tools, including tools to evaluate the performance of theprocessors, generate code, develop algorithm implementations, and fully integrate and debug softwareand hardware modules.The following products support development of the CC2650MOD device applications:Software Tools:SmartRF Studio 7:SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC atan early stage in the design process.• Test functions for sending and receiving radio packets, continuous wave transmit and receive• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger• Can also be used without any hardware, but then only to generate, edit and export radio configurationsettings• Can be used in combination with several development kits for TI's CCxxxx RF-ICsSensor Controller Studio:Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. TheSensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simplebackground tasks autonomously and independent of the System CPU state.• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controllermachine code and associated definitions• Allows for rapid development by using the integrated Sensor Controller task testing and debuggingfunctionality. This allows for live visualization of sensor data and algorithm verification.IDEs and Compilers:Code Composer Studio:• Integrated development environment with project management tools and editor• Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200• High integration with TI-RTOS with support for TI-RTOS Object ViewIAR Embedded Workbench for ARM• Integrated development environment with project management tools and editor• IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link• Integrated development environment with project management tools and editor• RTOS plugin is available for TI-RTOSFor a complete listing of development-support tools for the CC2650MOD platform, visit the TexasInstruments website at www.ti.com. For information on pricing and availability, contact the nearest TI fieldsales office or authorized distributor.
PRODUCTPREVIEW37CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODDevice and Documentation SupportCopyright © 2016, Texas Instruments Incorporated8.3 Documentation SupportThe following documents describe the CC2650MOD device. Copies of these documents are available onthe Internet at www.ti.com.CC26xx SimpleLink™ Wireless MCU Technical Reference ManualCC26xx SimpleLink™ Wireless MCU Errata8.3.1 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by therespective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to fostercollaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,explore ideas and help solve problems with fellow engineers.TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to helpdevelopers get started with Embedded Processors from Texas Instruments and to fosterinnovation and growth of general knowledge about the hardware and software surroundingthese devices.8.4 Texas Instruments Low-Power RF WebsiteTI's Low-Power RF website has all the latest products, application and design notes, FAQ section, newsand events updates. Go to www.ti.com/lprf.8.5 Low-Power RF eNewsletterThe Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, andother news and events associated with low-power RF products from TI. The Low-Power RF eNewsletterarticles include links to get more online information.Sign up at: www.ti.com/lprfnewsletter
PRODUCTPREVIEW38CC2650MODSWRS187 –AUGUST 2016www.ti.comSubmit Documentation FeedbackProduct Folder Links: CC2650MODDevice and Documentation Support Copyright © 2016, Texas Instruments Incorporated8.6 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by therespective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to fostercollaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,explore ideas and help solve problems with fellow engineers.TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to helpdevelopers get started with Embedded Processors from Texas Instruments and to fosterinnovation and growth of general knowledge about the hardware and software surroundingthese devices.Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community• Forums, videos, and blogs• RF design help• E2E interactionJoin here.Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-powerRF development partners to help customers speed up their application development. Thenetwork consists of recommended companies, RF consultants, and independent designhouses that provide a series of hardware module products and design services, including:• RF circuit, low-power RF, and ZigBee design services• Low-power RF and ZigBee module solutions and development tools• RF certification services and RF circuit manufacturingFor help with modules, engineering services or development tools:Search the Low-Power RF Developer Network to find a suitable partner.www.ti.com/lprfnetwork8.7 Additional InformationTexas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary andstandard-based wireless applications for use in industrial and consumer applications. The selectionincludes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as varioussoftware solutions for the sub-1-GHz and 2.4-GHz frequency bands.In addition, Texas Instruments provides a large selection of support collateral such as development tools,technical documentation, reference designs, application expertise, customer support, third-party anduniversity programs.The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and thechance to interact with engineers from all over the world.With a broad selection of product solutions, end-application possibilities, and a range of technical support,Texas Instruments offers the broadest low-power RF portfolio.8.8 TrademarksIAR Embedded Workbench is a registered trademark of IAR Systems AB.SmartRF, Code Composer Studio, SimpleLink, TI-RTOS, E2E are trademarks of Texas Instruments.ARM7 is a trademark of ARM Limited.ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries).ARM Thumb is a registered trademark of ARM Limited.Bluetooth is a registered trademark of Bluetooth SIG, Inc.CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.ZigBee is a registered trademark of ZigBee Alliance, Inc.
PRODUCTPREVIEW39CC2650MODwww.ti.comSWRS187 –AUGUST 2016Submit Documentation FeedbackProduct Folder Links: CC2650MODMechanical Packaging and Orderable InformationCopyright © 2016, Texas Instruments Incorporated8.9 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.8.10 Export Control NoticeRecipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data(as defined by the U.S., EU, and other Export Administration Regulations) including software, or anycontrolled product restricted by other applicable national regulations, received from Disclosing party underthis Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization fromU.S. Department of Commerce and other competent Government authorities to the extent required bythose laws.8.11 GlossarySLYZ022 —TI Glossary.This glossary lists and explains terms, acronyms and definitions.9 Mechanical Packaging and Orderable Information9.1 Packaging InformationThe following pages include mechanical packaging and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice andrevision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivityMailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

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