Trilliant Networks OSDI4W1 2.4 GHz Digitally modulated transmitter User Manual Usermanual

Trilliant Networks 2.4 GHz Digitally modulated transmitter Usermanual

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CONFIDENTIAL
DISTRIBUTED UNDER LICENSE
Hardware User Guide Overview for Open Smart Device
Interface (OSDI) SecureMesh™ Module
Models:
• OSDI-4000-1D
• OSDI-4000-1A
PRINTED VERSIONS OF THIS DOCUMENT ARE UNCONTROLLED
Distributed under legal commercial agreement
DOCUMENT RELEASE/APPROVALS
document #
DT-0237A
current revision
1.0
approvals
name
DT-0237A
title
page 1 of 33
date
Rev: 1.0
CONFIDENTIAL
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LEGAL NOTICES
THIS DOCUMENT CONTAINS SENSITIVE PROPRIETARY AND CONFIDENTIAL INFORMATION OWNED
BY TRILLIANT NETWORKS. THIS DOCUMENT HAS BEEN PROVIDED TO YOUR COMPANY THROUGH
A PREVIOUSLY EXECUTED OSDI MODULE DESIGN LICENSE AGREEMENT AND MAY NOT BE
DISTRIBUTED TO ANY OTHER 3RD PARTY, IN ANY FORM OR PORTION, WITHOUT TRILLIANT’S
EXPRESSED WRITTEN PERMISSION.
LICENSEE ACKNOWLEDGES THAT THE OSDI MODULE DOCUMENTATION PACKAGE AND TOOLS
ARE LICENSED TO IT ON AN "AS IS" BASIS. TRILLIANT MAKES NO OTHER REPRESENTATIONS
AND EXTENDS NO OTHER WARRANTIES OR CONDITIONS OF ANY KIND, EXPRESS, IMPLIED OR
STATUTORY INCLUDING WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY AND FITNESS
FOR A PARTICULAR USE. EXCEPT AS OTHERWISE EXPRESSLY SET FORTH IN THIS LICENSE,
TRILLIANT ASSUMES NO RESPONSIBILITIES OR LIABILITIES WHATSOEVER WITH RESPECT TO
USE OR SALE BY EITHER LICENSEE OR ITS VENDEES OR TRANSFEREES OF COMBINED
PRODUCTS.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
TRILLIANT RESERVES THE RIGHT TO CHANGE THE PRODUCT SPECIFICATIONS WITHOUT
CONSEQUENCE OF LIABILITY.
Trilliant Incorporated
1100 Island Drive, Redwood
City, CA 94065 USA
+1.650.204.5050
www.trilliantinc.com
DT-0237A
Trilliant™, CellReader®, CellGateway™, SecureMesh™, SerViewCom®, UnitySuite™,
SkyPilot®, SyncMesh™, the Trilliant logo, and the SkyPilot logo are trademarks of
Trilliant Incorporated and/or its subsidiaries. All other trademarks are the property of
their respective owners.
Copyright © 2015 Trilliant Incorporated. ALL RIGHTS RESERVED.
page 2 of 33
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CONFIDENTIAL
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Table of Contents
Overview
Features and Specifications
SecureMesh NAN Radio Performance
Electrical specifications
Physical, & Environmental
Compliance
Functional Description
OSDI Module
Host Interface & Optional IOs
Interface and Control Signals
Antennas
Antenna Placement
On board antennas
External antennas
Host PCB Requirements
Recommended Footprint
PasteMask
Layout requirements
Reference trace designs
Modifying the RF Signal Routing
Pin Numbering
Pin Description
Suggested Reflow profile, for reference only
SecureMesh Configuration
Mesh Programming tool
Data Link Library
Regulatory Agency Approvals
United States
Canada
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10
12
17
17
17
17
18
22
24
24
30
30
30
30
31
31
32
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CONFIDENTIAL
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Figures
Figure 1: Typical application with OSDI Module ................................................................................................................................7
Figure 2: M Antenna orientation inside scanned product. ............................................................................................................... 10
Figure 3 M Antenna Azimuth (left) and Elevation (right) Patterns. .................................................................................................. 10
Figure 4: uSplatch Planar Antenna Picture....................................................................................................................................... 11
Figure 5: uSplatch Antenna Radiation Patterns. .............................................................................................................................. 11
Figure 6: Larsen RO2406NM Drawing. ............................................................................................................................................. 12
Figure 7: Larsen RO2406NM Radiation Patterns. ............................................................................................................................. 12
Figure 8: MobileMark IMAG5-2400-3K-BLK-120. ............................................................................................................................. 13
Figure 9: L-Com HG2403RD-RTF. ...................................................................................................................................................... 14
Figure 10: L-Com HG2403RD-RTF Radiation Patterns. ...................................................................................................................... 14
Figure 11: Mobile Mark CVS-2400. .................................................................................................................................................. 15
Figure 12: Mobile Mark CVS-2400 Radiation Patterns. .................................................................................................................... 15
Figure 13: Molex 1461530100.......................................................................................................................................................... 16
Figure 14 Molex 1461530100 Radiation Patterns............................................................................................................................ 16
Figure 15 Footprint OSDI-4000-1X ................................................................................................................................................... 17
Figure 16 FCC and IC approved trace design layout and picture for the M antenna of section 4.2.1 ............................................... 18
Figure 17 FCC and IC approved trace design layout and picture for the uSplash antenna of section 4.2.2 ...................................... 19
Figure 18 FCC and IC approved trace design layout and picture for external antennas of section 4.3 ............................................. 20
Figure 19 FCC and IC approved trace design layout and picture for external antennas of section 4.3 ............................................. 20
Figure 20 FCC and IC approved trace design layout and picture for external antennas ................................................................... 21
Figure 21 FCC and IC approved trace design layout and picture for external antennas ................................................................... 21
Figure 22 Coupon requirements to validate trace impedance......................................................................................................... 22
Figure 23: Micro-strip trace parameters .......................................................................................................................................... 23
Figure 24: Example stack-up ............................................................................................................................................................ 23
Figure 25: 50 ohms calculation (mm) Trace width: 0.7mm Copper clearance: 0.1445mm ................................................................ 23
Figure 26: Pin Numbering Diagram Bottom view ............................................................................................................................. 24
Figure 27: Preliminary OSDI Module Reflow Profile and Set Points. ................................................................................................ 30
Tables
Table 1: OSDI module control signals description and usage. ............................................................................................................7
Table 2 Antenna micro-strip trace parts for M antenna .................................................................................................................. 19
Table 3 Antenna micro-strip trace parts for M antenna .................................................................................................................. 19
Table 4 Antenna micro-strip trace parts for external antennas....................................................................................................... 20
Table 5 Antenna micro-strip trace parts for external antennas....................................................................................................... 21
Table 6 Antenna micro-strip trace parts for external antennas....................................................................................................... 21
Table 7 Antenna micro-strip trace parts for external antennas....................................................................................................... 22
Table 8: Pin numbering details. ....................................................................................................................................................... 29
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1 Overview
The SecureMesh Ready, Open Smart Device Interface Modules (OSDI) are Trilliant 2.4GHz RF modules which can be integrated into a
variety of third party OEM products. These small and versatile modules include a microcontroller, memory, transceiver, power
management all on an LGA circuit board.
Based on IEEE 802.15.4 wireless communication standard and utilizing Trilliant’s robust SecureMesh networking protocol, the OSDI
modules deliver industry leading 2.4GHz networking solution. The modules are easy to integrate, provide low power consumption, long
range and many more features and functionalities.
The OSDI family of products are currently available in 2 base hardware models:
Hardware Model
Description
OSDI-4000-1A
4th generation OSDI module with maximum transmit power of 1 watt; ANSI protocol
OSDI-4000-1D
4th generation OSDI module with maximum transmit power of 1 watt; DLMS/COSEM Protocol
Throughout the remainder of this document, the OSDI module platforms will be referred to by the base hardware model.
2 Features and Specifications
The OSDI modules are designed for a broad range of applications and products, and provide a compliant ready RF mesh solution for both
domestic and international markets. The modules have a unique set of features, including:
•
•
•
•
•
Reporting Retries and Acknowledgements.
Remote Firmware upgrades.
Programmable Network Parameters.
AES, DES Encryption crypto module.
Frequency hopping for a reliable communication link against interference (future enhancement)
SecureMesh NAN Radio Performance
Protocols
Modulations
Frequency band
Frequency channels
Channel spacing
Maximum transmit power
Receive sensitivity
• SecureMesh NAN Transport layer
• SecureMesh NAN Network layer
• IEEE 802.15.4 MAC layer
• IEEE 802.15.4 PHY layer (2.4 GHz)
DSSS – OQPSK
Direct Sequence Spread Spectrum
Offset Quadrature Phase-Shift Keying
Data rate: 250 kbps (transmit/receive)
2.400 - 2.4835 GHz (unlicensed operation)
15
5 MHz
+30dBm
-103dBm
Electrical specifications
Voltage
Current
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Min.
4.0
Typ.
4.5
1. 2A
Max.
5.0
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Physical, & Environmental
Mounting method
Dimensions (L x W x H)
Operating temperature
Humidity
Compliance
LGA (Land Grid Array)
29.8 x 35.3 x 4.4 mm
-40 °C to +85 °C
5 to 95% non-condensing
Radio emissions
•
•
•
•
FCC Part 15 Class B
Industry Canada ICES-003 Class B
MID
others pending
Unlicensed radio operation
•
•
•
•
FCC Part 15.212, 15.247
Industry Canada RSS-Gen, RSS-247
MID
others pending
Human Exposure
•
•
FCC Part 2.1091, 2.1093
RSS-102
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3 Functional Description
OSDI Module
The OSDI modules are low power 2.4GHz ISM band transceivers. Figure 1 below shows a block diagram of the OSDI-4000 modules and
the surrounding optional functionalities that are intended as a reference implementation example.
The configuration of the transceiver, reading and writing of Frame Buffer is controlled by a SPI interface and additional control lines. The
control of the RF front-end is done via the transceiver digital control pins.
The OSDI modules are equipped with a Low Drop Out voltage (LDO) regulator that enables them to work in standalone mode with a
voltage supply between 4 and 5 volts.
The VCPU power supply line of the microcontroller is available on the external connection for optional backup supply when Real Time
Power Outage Reporting (RTPOR) is required.
Figure 1: Typical application with OSDI Module
Host Interface & Optional IOs
Communication with the host is achieved using a serial communication port and control signals that are bundled with the power lines
inside the host connector. Diagnostic and programming signals are available to the host. See Table 1 below for the description of the
various signals found in the diagnostic and programming interface. The RF input/output signal must be routed through the host device as
described in section 5.4. Antennas of section 4 can be used in relation with regulation. The OSDI module is designed with outputs to
drive a multicolor LED indicator that allows visual diagnostic and status monitoring of the device. See Table 1 below for an interpretation
of the existing LED patterns.
Interface and Control Signals
Table 1: OSDI module control signals description and usage.
Signal
Description
TX_EXT-RX_LGA
Transmit from the meter / Receive to the
module.
Signal Type: UART.
Receive to the meter / Transmit from the
module.
Signal Type: UART.
RX_EXT-TX_LGA
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Usage
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•
•
•
Meter Connector serial port.
Meter USB Port.
Default baud rate is set to 9.6 kbps.
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Signal
Description
DIAG-RX_LGA
Module receive diagnostic port.
Signal Type: UART.
DIAG-TX_LGA
Module transmit diagnostic port.
•
Signal Type: UART.
Control Red and Green LEDs.
•
Diagnostic LEDs.
Signal Type: Active low output.
•
Needs to be visible from the outside of the meter for
0=LED on, 1= LED off.
installation purposes in normal design.
Note: Red and green led are in one physical LEDs off: Power save mode/POR mode or no power.
unit. Yellow is produced when both LEDs
Flashing green: Initialization (5 sec).
are on.
Steady Red: Working but not associated to a network.
Steady Yellow: Working and trying to associate to a network.
Steady Green: Working and associated to a network.
Flashing Yellow: Working and exchanging info.
RED_LED and
GRN_LED
P-FAIL_EXT
P-FAIL
RESET
TEST
SC_HI
PWR_MON
Usage
•
•
•
External signal from the meter indicating
that an interruption of power has been
detected.
Signal Type: Active low input from the
meter.
0 = Power fail, 1 = Normal condition.
Signal indicating that an interruption of
power has been detected.
Signal Type: Interrupt input.
0 = Power fail, 1 = Normal condition.
Signal Type: Hardware reset.
0 = Reset, 1 = Normal operation.
Select test / diagnostic mode.
Signal Type: Active high input.
1 = Diagnostic mode, 0 = Normal mode.
Signal Type: Input.
1 = Supercap voltage > 3.6V
Power supply monitoring signal.
Signal Type: Analog.
RESET-PDI_CLK,
TDI-PDI_DATA,
TDO, TMS, TCK
Program and Debug Interface.
SLEEP
Sleep mode power activation.
Signal Type: low open-drain output.
0 = SLEEP Enabled, 1 = SLEEP Disabled.
MESURE_VCAP
+3.3V
+VMAIN
1.5 Farad capacitor voltage monitoring.
Signal Type: Analog, feeds ADC input.
LDO voltage regulator’s output.
Main power supply input.
+VCPU2
3.3 Volts supply for OSDI module’s CPU.
+VCPU
+VLDO_IN
+V1.5F_SW
3.3 Volts supply for OSDI module’s CPU.
LDO regulator’s input.
1.5 Farad capacitor switched voltage.
DT-0237A
Diagnostic serial port
Diagnostic USB Port.
Default baud rate is set to 9.6 kbps in diagnostic mode
and 19.2 kbps in trace mode.
Should be accessible via test points in normal design.
•
Meter Connector.
•
PFAIL Circuit.
Provides an early detection of power outage events.
•
PFAIL Circuit.
•
CPU Reset Control Circuit.
Provides early detection of power outage events.
•
•
•
•
•
•
•
CPU Reset Control Circuit.
For use during development only.
Do not connect to the meter.
Reserved
Diagnostic/Programming Connector.
Should be accessible via test points in normal design.
On/off signal from the fail safe circuit to detect if the
super cap is higher than 3.6V.
•
Meter Connector.
Provision for self-detection of power outages by the OSDI
modules, if P-FAIL is not available.
•
Diagnostic/Programming Connector.
•
Used only during development.
•
See schematic for proper use.
•
Should be accessible via test points in normal design.
•
RTPOR Supply Management circuit.
Used to send the command to the power management circuit
to connect the 1.5 Farad capacitor (+V1.5F) directly to the
input supply (+VCPU) of OSDI module’s CPU in order to feed
it with minimum power waste, in sleep mode.
Provision for monitoring of voltage level of the 1.5F capacitor.
Regulated 3.3V voltage supply from the OSDI module.
Used by the power management circuit as input to the LDO
regulator and to charge the 1.5 Farad super capacitor.
Used to feed power to the CPU during debug and
programming.
Input supply (+VCPU) of OSDI module’s CPU.
Input of the LDO regulator (+VLDO) of the OSDI module.
Power path for the sleep mode power supply.
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4 Antennas
The maximum output power authorized by the FCC and Industry Canada in the 2.4GHz band is 36 dBm EIRP. For the OSDI-4000-1x, the
maximum output power of the radio is 30 dBm which can be combined to an antenna with a maximum gain of 6 dBi.
The OSDI module has been certified with many different types of integrated antennas as described in the following sections. The
information shown was taken from datasheets or measured when mounted on specific products. Actual patterns will be influenced by the
PCB layout and by surrounding material.
NOTE: Certification regulations differ from one country to the other. It remains the responsibility of the meter manufacturer to
choose an antenna that will meet the requirements of the country where the meters will be deployed as well as any local
certifications that may be required to comply with specific market regulations. See section 7 for more details.
Antenna Placement
Antenna performance is significantly impacted by the type and physical placement of the antenna. The antenna should be oriented in the
device to properly radiate the RF emissions from the face of the device forward and in an upward direction for optimal connectivity to the
Trilliant SecureMesh network infrastructure. In addition, there should be as few obstacles as possible between the antenna and the outside
of the device.
Through the following examples, Trilliant is attempting to provide antenna options for the most commonly used antenna design scenarios
but keep in mind that this is greatly dependent on the host device design. If you are unsure about which antenna to select, or how it should
be implemented into the overall design, please contact Trilliant for guidance.
The RF connection from the OSDI module to the antenna is made using a 50 ohms micro-strip trace on the host’s PCB. See section 5.4
for routing instructions.
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4.2.1
On board antennas
‘M’ Antenna
Triliant p/n: CP-0299A
Chan. 18, P=28.7 dBm
Plane
Min
(dBi)
Max
(dBi)
Avg
(dBi)
-23.1
3.6
-5.6
Horizontal
-25.1
-8.5
-15.7
Vertical
-30.7
-12.3
-19.0
Horizontal
-21.5
4.8
-7.7
Polarization
Azimuthal Vertical
Elevation
Figure 2: M Antenna orientation inside scanned product.
90
90
120
60
120
60
-5
150
30
-10
30
-10
-15
-15
-20
-20
-25
-25
180
210
330
240
-5
150
10
10
180
210
300
330
240
270
300
270
____Vertical Polarization Gain (dBi)
min: -23.1
max: +3.6
avg: -5.6
____Vertical Polarization Gain (dBi)
min: -30.7
max: -12.3
avg: -19.0
------- Horizontal Polarization Gain (dBi)
min: -25.1
max: -8.5
avg: -15.7
------- Horizontal Polarization Gain (dBi)
min: -21.5
max: +4.8
avg: -7.7
Figure 3 M Antenna Azimuth (left) and Elevation (right) Patterns.
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4.2.2
uSplatch planarAntenna
Linx #: ANT-2.4-uSP
Center frequency: 2.4 GHz
Bandwidth: 150 MHz
Wavelength: ¼-wave
VSWR: ≤ 2.0 typical at center
Peak gain: 3.8 dBi
Impedance: 50 ohms
Figure 4: uSplatch Planar Antenna Picture.
Figure 5: uSplatch Antenna Radiation Patterns.
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External antennas
The following section describes types of external antennas that have been certified with the OSDI-4000 module.
Note that a Reverse Polarity connector must be used for external antennas.
4.3.1
Larsen RO2406NM
Vendor: Larsen
Vendor #: RO2406NM
Frequency: 2400-2500 MHz
Nominal Impedance: 50 Ohms
VSWR: 2:1 Max
Gain: 6 dBi
Polarization: Vertical
Power withstanding: 20 W
Connector: N-Type Male (To use this antenna with the OSDI
module, a RP connector that is actually in discussion, must be
used; the part number will change accordingly)
Figure 6: Larsen RO2406NM Drawing.
Figure 7: Larsen RO2406NM Radiation Patterns.
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4.3.2
MobileMark IMAG5-2400
Vendor: MobileMark
Vendor #: IMAG5-2400-3K-BLK-120
Frequency: 2400-2485 MHz
Nominal Impedance: 50 Ohms
VSWR: 2:1 over band
Gain: 5 dBi
Maximum Power: 10 Watts
Connector: TNC Plug-RP (female center pin)
Temperature: -40°C to +85°C
Figure 8: MobileMark IMAG5-2400-3K-BLK-120.
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4.3.3
L-Com HG2403RD-RTF
Vendor = L-Com Global Connectifity
Vendor #: HG2403RD-RTF
Frequency: 2400 – 2 500 MHz
Gain: 3 dBi max
VSWR:<2.0
Impedance: 50 ohm
Polarization: Vertical
Connector: TNC Plug-RP (female center pin)
Temperature Range: -40° to +85°C
Figure 9: L-Com HG2403RD-RTF.
Figure 10: L-Com HG2403RD-RTF Radiation Patterns.
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4.3.4
Mobile Mark CVS-2400
Vendor = Mobile Mark
Vendor #: CVS-2400-2SA-BLK-13
Frequency: 2.4 – 2.5 GHz
Gain: 2.0 dBi max
VSWR: 2:1 over band
Impedance: 50 ohm nominal
Maximum Power: 10 Watts
Connector: SMA Plug-RP
Temperature Range: -40° to +85°C
Figure 11: Mobile Mark CVS-2400.
Antenna Dimensions:
3 3/4" Length x 1 1/4" Width x 3/8” Deep
(95 mm x 32 mm x 9 mm)
Figure 12: Mobile Mark CVS-2400 Radiation Patterns.
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4.3.5
Molex 1461530100
Vendor = Molex
Vendor #: 1461530100
Frequency: 2.4 / 5 GHz
Peak Gain: 3.0 dBi at 2.4 GHz
4.5 dBi at 5 GHz
Impedance: 50 ohm nominal
Maximum Power: 2 Watts
Connector: U.FL
Figure 13: Molex 1461530100.
Temperature Range: -30° to +85°C
Figure 14 Molex 1461530100 Radiation Patterns.
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5 Host PCB Requirements
Recommended Footprint
The footprints shown below are available upon request as a PAD Layout source file.
OSDI-4000-1X
•
•
Overall (L x W x H), including shield: 29.8 x 35.3 x 4.0mm
Suggested Silkscreen Outline (L x W): 30.3 x 35.8mm
•
Avoid vias, traces or copper inside Keep-Out Areas
Figure 15 Footprint OSDI-4000-1X
PasteMask
Paste Mask Stencil openings can be of the same size as the recommended footprint (1:1); suggested thickness of stencil foil ≥ 120µm.
•
•
Layout requirements
Traces routed to RF_EXT pad must be 50 ohm.
Traces current rating:
+VCPU
+3.3V
+VLDO_IN
+V1.5F_SW
≥
≥
≥
≥
90 mA
90 mA
1.4 Amp
90mA
•
Thermal reliefs are strongly recommended for all pads connected to Ground net.
•
Finish recommendation for PCB pad surfaces: ROHS Compliant (EU Directive 2002/95/EC) 2-10 µIN Immersion Gold Over 50200µIN Electro less Nickel (ENIG)
•
Non Solder Mask Defined (NSMD) type is recommended for the solder pads on the PCB.
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•
Pads Solder Mask Opening of 0.1mm is recommended.
Reference trace designs
RF traces from OSDI module pads W10 and W16 to the antenna must be made using micro-strip traces. This micro-strip trace must
respect the design of the Gerber files associated with the following designs in order to obtain a uniform transmission line with a
characteristic impedance of 50 ohms. The reference trace designs are shown in the following sections.
5.4.1
Layout and parts for M antenna
The reference trace for this antenna is the green traces along with the side copper filled with vias on the left side of Figure 16 where
components G8, G9, G11 and G12 are not installed. As preliminary information the traces width of all sections are 0.27mm and the length
of each section, starting from the LGA pad to the M antenna are: LGA pad to G7: 15.38mm; G7 to G10: 12.37mm; G10 to R50: 2.3mm;
R50 to M antenna: 4.85mm. However, refer to associated Gerber files for more accurate details on dimensions and refer to Trilliant
Networks Inc for more details on the Gerber files. Table 2 shows the parts used in this reference trace design.
Figure 16 FCC and IC approved trace design layout and picture for the M antenna of section 4.2.1
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Table 2 Antenna micro-strip trace parts for M antenna
Part Number
Designator
Description
Manufacturer
N/A
G8, G9, G11, G12
Not installed
N/A
RK73Z1ETTP
G7, G10, R50
RESISTOR 0.0 OHMS 1/16W 5% 0402 SMT
KOA Speer Electronics
CP-0299A
J51
Trilliant M antenna
Trilliant
5.4.2
Layout and parts for uSplash antenna
The reference trace for this antenna is the green traces along with the side copper filled with vias on the left side of Figure 17 where
components G8, G10, G17, G19 and G20 are not installed. As preliminary information the traces width of all sections are 0.27mm and
the length of each section, starting from the LGA pad to the uSplash are: LGA pad to G7: 15.38mm; G7 to G9: 12.37mm; G9 to G17:
6.7mm; G17 to R53: 2.1mm and R53 to uSplash antenna: 7.2mm. However, refer to associated Gerber files for more accurate details on
dimensions and refer to Trilliant Networks Inc for more details on the Gerber files. Table 3 shows the parts used in this reference trace
design.
Figure 17 FCC and IC approved trace design layout and picture for the uSplash antenna of section 4.2.2
Table 3 Antenna micro-strip trace parts for M antenna
Part Number
Designator
Description
Manufacturer
N/A
G8, G9, G11, G12
Not installed
N/A
RK73Z1ETTP
G7, G9, G18, R53
RESISTOR 0.0 OHMS 1/16W 5% 0402 SMT
KOA Speer Electronics
ANT-2.4-uSP
ANT1
PC mount quarter-wave antenna
Linx
5.4.3
Layout and parts for external antennas
The reference traces for these antennas are the green traces along with the side copper filled with vias on the left side of Figure 18 where
components G8, G10, G15, G16 and G18 are not installed, the left side of Figure 19 where G4 is not install, the pink trace on the left side
of Figure 20 where R13 and R15 are not installed and the left side of Figure 21 where G1 and G2 are not installed.
As preliminary information for Figure 18 the traces width of all sections are 0.27mm and the length of each section, starting from the LGA
pad to J53 connector are: LGA pad to G7: 15.38mm; G7 to G9: 12.37mm; G9 to G17: 6.7mm; G17 to R52: 2.1mm; R52 to J53: 7.2mm.
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However, refer to associated Gerber files for more accurate details on dimensions and refer to Trilliant Networks Inc for more details on
the Gerber files. Table 4 shows the parts used in the reference trace design.
Figure 18 FCC and IC approved trace design layout and picture for external antennas of section 4.3
Table 4 Antenna micro-strip trace parts for external antennas
Part Number
Designator
Description
Manufacturer
N/A
G8, G10, G15, G16, G18
Not installed
N/A
RK73Z1ETTP
G7, G9, G17, R52
RESISTOR 0.0 OHMS 1/16W 5% 0402 SMT
KOA Speer Electronics
LQW18AN75NG00D
L2
INDUCTOR 75nH, 2%, 270mA 560mΩ, 0603 SMT
Murata Manufacturing
1-1478979-0
J53
SMA JACK CONNECTOR (FEMALE) PCB Mount 4 TE Connectivity
legs, SS/Gold pl.
As preliminary information for Figure 19, the traces width of all sections are 1mm and the length of each section, starting from the LGA
pad to J5 connector are: LGA pad to G3: 14.18mm; G3 to J5: 5.05mm. However, refer to associated Gerber files for more accurate details
on dimensions and refer to Trilliant Networks Inc for more details on the Gerber files. Table 5 shows the parts used in the reference trace
design.
Figure 19 FCC and IC approved trace design layout and picture for external antennas of section 4.3
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Table 5 Antenna micro-strip trace parts for external antennas
Part Number
Designator
Description
Manufacturer
N/A
G4
Not installed
N/A
RK73Z1ETTP
G3
RESISTOR 0.0 OHMS 1/16W 5% 0402 SMT
KOA Speer Electronics
142-0701-801
J5
SMA End Launch Jack receptacle (FEMALE) Round Johnson Components
Contact, Gold pl.
As preliminary information for Figure 20, the traces width of all sections is 0.6mm and the length of each section, starting from the LGA
pad to J4 connector are: LGA pad to R14: 14.7mm; R14 to J4: 2.1mm. However, refer to associated Gerber files for more accurate details
on dimensions and refer to Trilliant Networks Inc for more details on the Gerber files. Table 6 shows the parts used in the reference trace
design.
Figure 20 FCC and IC approved trace design layout and picture for external antennas
Table 6 Antenna micro-strip trace parts for external antennas
Part Number
Designator
Description
Manufacturer
ESR01MZPJ391
R13, R15
RES SMD 390 OHM 5% 1/5W 0402
Rohm Semiconductor
CRCW040210R7FKEDHP
R14
RES SMD 10.7 OHM 1% 1/5W 0402
Vishay
73412-0110
J4
JACK, U.FL, Straight, PCB, SMT
Molex
As preliminary information for Figure 21, the traces width of all sections is 0.2mm and the length of each section, starting from the LGA
pad to J7 connector are: LGA pad to R18: 11.82mm; R18 to J7: 5.2mm. However, refer to associated Gerber files for more accurate
details on dimensions and refer to Trilliant Networks Inc for more details on the Gerber files. Table 7 shows the parts used in the reference
trace design.
Figure 21 FCC and IC approved trace design layout and picture for external antennas
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Table 7 Antenna micro-strip trace parts for external antennas
Part Number
Designator
Description
Manufacturer
N/A
G1, G2
Not installed
N/A
RK73Z1ETTP
R18
RESISTOR 0.0 OHMS 1/16W 5% 1005/0402 SMT
KOA Speer Electronics
6-1460820-2
J7
MMCX CONNECTOR RIGHT ANGLE JACK (female), Tin pl. SMT TE Connectivity
5.4.4
Design validation & production procedures
To verify compliance of the reference trace, a coupon must be requested with every manufacturing panel form and for which the
characteristics are described in the Gerber files. Part of these characteristic are shown in Figure 22. Then a network analyzer is used to
measure the impedance of this coupon in order to validate the antenna trace.
Figure 22 Coupon requirements to validate trace impedance
5.4.5
Other considerations
The only antennas, also describe is section 4.3, that can be used with the module using the reference trace design are the:
- Trilliant, CP-0299A, 4.8 dBi
- Linx, ANT-2.4-uSP, 3.8 dBi
- Larsen Antenna, RO2406NM, 6 dBi
- Mobile Mark, IMAG5-2400-3K-BLK-120, 5 dBi
- L-Com, HG2403RD-RTF, 3 dBi
- Mobile Mark, CVS-2400, 2.5 dBi
- Molex 1461530100, 3 dBi
The use of any other antenna or any changes to the reference trace design are subject to additional testing and authorization through a
Class II permissive change.
Modifying the RF Signal Routing
As previously mentioned, any changes to the RF traces is subject to approbation, additional testing and authorization through a Class II
permissive change on the FCC and IC grants.
The objective is to use the W10 and W16 pads from OSDI module to route a micro-strip traces in order to obtain a uniform transmission
line with a characteristic impedance of 50 ohms. The characteristic impedance depends on the geometry of the trace and on the relative
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dielectric constant of the PCB as shown in Figure 23. However, the characteristic impedance does not depend on the length of the trace.
Many tools are available on the web to help calculate the optimum dimensions.
Figure 23: Micro-strip trace parameters
H1 and T1 are taken from the stack-up parameter of the host’s PCB as shown in Figure 24, the relative dielectric constant depend on the
material used.
Figure 24: Example stack-up
An example stack-up, copper thickness, RF traces width and traces to copper clearance in order to get 50 ohms is presented below. The
calculation toll is then used to find the remaining parameters of the micro-strip traces as shown in Figure 25.
Figure 25: 50 ohms calculation (mm) Trace width: 0.7mm Copper clearance: 0.1445mm
The resulting parameters can then be used to define the trace width and copper clearance on RF traces of the host’s PCB. The RF traces
must be surrounded by copper all along the path of undefined length; the path should be as short as possible to reduce losses. Vias must
be added all along the RF traces. See reference trace design in Figure 18 for an example.
Note: a new trace design is subject to validation, additional testing and authorization through a Class II Permissive change on
the FCC and IC grants.
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Pin Numbering
Figure 26: Pin Numbering Diagram
Bottom view
Pin Description
Pad
Name
Description
A2
*8_NRST
Test point only
A3
PB31
Do not connect
A4
PB23/AD4
Spare I/O
A5
PA12/AD0
Spare I/O
A6
RESERVED
Do not connect
A7
+VCPU
+VCPU
A8
*12_PA16
Spare I/O
A9
PB28
Spare I/O
A10
PB4/RX0
Test point only
A11
PB5/TX0
Test point only
A12
PB7
Status LED
A13
RESERVED
Do not connect
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Pad
Name
Description
A14
+VCPU
+VCPU
A15
RESERVED
Do not connect
A16
PA0_*1
Spare I/O
A17
*1_PB26
Spare I/O
B1
PA13/SCK_EXT1
Provision for external SPI
B2
PA14/CS_EXT1
Provision for external SPI
B3
PA15
Spare I/O
B4
PB27
Power management signal
B5
RESERVED
Do not connect
B6
RESERVED
Do not connect
B7
RESERVED
Do not connect
B8
RESERVED
Do not connect
B9
PA2_*5
Spare I/O
B10
RESERVED
Do not connect
B11
SHDN
Power management signal
B12
PB8
Status LED
B13
PB25
Spare I/O
B14
PB10_*4
Spare I/O
B15
PB14_*5
Spare I/O
B16
PB11_*6
Spare I/O
B17
PB12_*1
Spare I/O
B18
PB16/MISO_EXT2_*2
Spare I/O
C1
PA10/MOSI_EXT1
Provision for external SPI
C2
PB1/TDO_*11
Spare I/O
C3
RESERVED
Do not connect
C4
PA17/PFAIL
Power management signal
C5
RESERVED
Do not connect
C6
RESERVED
Do not connect
C7
RESERVED
Do not connect
C8
RESERVED
Do not connect
C9
RESERVED
Do not connect
C10
RESERVED
Do not connect
C11
+VCPU
+VCPU
C12
GND_NC
Do not connect
C13
PB29
Spare I/O
C14
RESERVED
Do not connect
C15
PC0/TX1
Meter interface
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Pad
Name
Description
C16
RESERVED
Do not connect
C17
RESERVED
Do not connect
C18
RESERVED
Do not connect
D1
PA9/MISO_EXT1
Provision for external SPI
D2
PB3/TCK_*11
Spare I/O
D3
PB2/TMS_*11
Spare I/O
D16
GND_NC
Do not connect
D17
RESERVED
Do not connect
D18
PC1/RX1
Meter interface
E1
*9_NRST
Test point only
E2
RESERVED
Do not connect
E3
PB13/AD3
Power management signal
E16
PA19/CS_EXT2_*2
Spare I/O
E17
PB18/SCK_EXT2_*2
Spare I/O
E18
PB17/MOSI_EXT2_*2
Spare I/O
F1
PB0/TDI
Spare I/O
F2
PA4/AD1
Power management signal
F3
RESERVED
Do not connect
F16
RESERVED
Do not connect
F17
RESERVED
Do not connect
F18
+VLDO_IN
Input of LGA LDO
G1
RESERVED
Do not connect
G2
*3_PC5
Spare I/O
G3
+VCPU
+VCPU
G16
GND_NC
Do not connect
G17
GND_NC
Do not connect
G18
+VLDO_IN
Input of LGA LDO
H1
RESERVED
Do not connect
H2
GND_NC
Do not connect
H3
RESERVED
Connected to Gnd via 0 ohms resistor.
H16
GND_NC
Do not connect
H17
GND_NC
Do not connect
H18
GND_NC
Do not connect
J1
GND_NC
Do not connect
J2
GND_NC
Do not connect
J3
RESERVED
Connected to Gnd via 0 ohms resistor.
J16
GND_NC
Do not connect
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Pad
Name
Description
J17
GND_NC
Do not connect
J18
GND_NC
Do not connect
K1
GND_NC
Do not connect
K2
GND_NC
Do not connect
K3
RESERVED
Do not connect
K16
RESERVED
Do not connect
K17
RESERVED
Do not connect
K18
XIN32
32KHz xtal
L1
GND_NC
Do not connect
L2
GND_NC
Do not connect
L3
GND_NC
Do not connect
L16
PB15_*13
Spare I/O
L17
+3.3V
Output from LGA LDO
L18
XOUT32
32KHz xtal
M1
GND
GND
M2
RESERVED
Do not connect
M3
GND_NC
Do not connect
M16
GND
GND
M17
GND
GND
M18
+V1.5F_SW
LGA backup power
N1
GND
GND
N2
GND_NC
Do not connect
N3
GND
GND
N16
GND
GND
N17
GND
GND
N18
+3.3V
Output from LGA LDO
P1
GND
GND
P2
GND_NC
Do not connect
P3
GND_NC
Do not connect
P16
GND
GND
P17
GND
GND
P18
+3.3V
Output from LGA LDO
R1
GND
GND
R2
GND_NC
Do not connect
R3
GND
GND
R16
GND
GND
R17
GND
GND
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Pad
Name
Description
R18
GND
GND
T1
GND
GND
T2
GND_NC
Do not connect
T3
GND_NC
Do not connect
T16
GND
GND
T17
GND
GND
T18
GND
GND
U1
GND
GND
U2
GND
GND
U3
GND
GND
U16
GND
GND
U17
GND
GND
U18
GND
GND
V1
GND
GND
V2
GND_NC
Do not connect
V3
RESERVED
Do not connect
V4
GND
GND
V5
GND
GND
V6
GND
GND
V7
RESERVED
Do not connect
V8
GND
GND
V9
GND
GND
V10
GND
GND
V11
GND
GND
V12
GND
GND
V13
GND
GND
V14
GND
GND
V15
GND
GND
V16
GND
GND
V17
GND
GND
V18
GND
GND
W1
GND
GND
W2
GND_NCRESERVED
Do not connect
W3
GND
GND
W4
RESERVED
Do not connect
W5
RESERVED
Do not connect
W6
GND
GND
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Pad
Name
Description
W7
RESERVED
Do not connect
W8
RESERVED
Do not connect
W9
GND
GND
W10
RESERVED
Do not connect
W11
GND
GND
W12
GND
GND
W13
GND
GND
W14
RESERVED
Do not connect
W15
GND
GND
W16
RF_EXT1
RF to/from antenna
W17
GND
GND
W18
GND
GND
Y2
GND
GND
Y3
GND
GND
Y4
GND
GND
Y5
GND
GND
Y6
GND
GND
Y7
GND
GND
Y8
GND
GND
Y9
GND
GND
Y11
GND
GND
Y12
GND
GND
Y13
GND
GND
Y14
RESERVED
Do not connect
Y15
GND
GND
Y17
GND
GND
Table 8: Pin numbering details.
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Suggested Reflow profile, for reference only
Figure 27: Preliminary OSDI Module Reflow Profile and Set Points.
6 SecureMesh Configuration
The configuration of the OSDI module is the last step in the manufacturing process, just before shipping to the customer. This process
consists of configuring of programming the customer related parameters as applicable, via the SecureMesh network, using the Mesh
Programming tool.
Mesh Programming tool
Trilliant’s Mesh Programming tool is an MS Windows application that communicates with the OSDI modules using a SecureMesh USB
radio dongle.
The configuration file is generated by Trilliant for each deployment project to define the configuration parameters for each OSDI module
in a given SecureMesh network.
Refer to document DP-1145 for more details.
Data Link Library
A DLL can also be used for volume production. It contains the necessary functions to allow the automatic test equipment to configure the
OSDI modules according to the configuration file generated by Trilliant.
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7 Regulatory Agency Approvals
Modular approval allows end users to place the OSDI module inside a finished product without the need for regulatory testing, provided
no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the
equipment. The end user must comply with all of the instructions provided by the grantee, which indicate installation and/or operating
conditions necessary for compliance.
The OSDI Module has been tested and conforms to FCC and IC regulation for unlicensed transmitter module. The module tests can be
applied toward final product certification. Additional testing may be required depending on the targeted application.
The integrator may still be responsible for testing the end product for any additional compliance requirements that become necessary.
For more information on regulatory compliance, refer to the specific country radio regulations in the following sections.
United States
With the approval of Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C-Intentional Radiators
15.212 Modular Transmitter approval, the OSDI module is authorized to be integrated into a finished product without obtaining subsequent
and separate FCC approvals for intentional radiation.
The OSDI module is labeled with its own FCC ID number. If the FCC ID is not visible when the module is installed inside another device,
then the outside of the finished product into which the module is installed shall display a label referring to the enclosed module. This
exterior label shall bear the following statement:
Contains Transmitter Module FCC ID: TMB-OSDI4W1
Or
Contains FCC ID: TMB- OSDI4W1
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
A user manual for the finish product shall include the following statement:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
•
•
•
•
7.1.1
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
RF Human Exposure
All transmitters regulated by FCC must comply with RF exposure requirements. Part 1.1310, Evaluating Compliance with FCC
Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed
or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance.
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If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels
and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of
antennas.
The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure
compliance:
To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more
should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer
than this distance is not recommended.
If the OSDI modules are used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator
is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091.
7.1.2
Approved External Antenna Types
To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use
different antenna manufacturer provided the same antenna type and antenna gain (equal to or less than) is used. Also, the antenna(s)
used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Testing of the OSDI module has been performed with the antenna types listed in Section 4.3 above.
7.1.3
Helpful Web Sites
Federal Communications Commission (FCC):
http://www.fcc.gov.
Canada
The OSDI module targets certification for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-247 and
RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device.
Labeling Requirements for the Host Device (from Section 7.2, RSP-100, Issue 10, November 2014):
The host device shall be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host
device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter
module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 6028A-OSDI4W1
Or
Contains IC: 6028A-OSDI4W1
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014):
User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user
manual or alternatively on the device or both:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1)
this device may not cause interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
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7.2.1
RF Human Exposure
All transmitters regulated by Industry Canada must comply with RF exposure requirements. RSS-102, Radio Frequency (RF) Exposure
Compliance of Radiocommunication Apparatus (All Frequency Bands), sets out the requirements and measurement techniques
used to evaluate radio frequency (RF) exposure compliance of radiocommunication apparatus designed to be used within the vicinity of
the human body.
If appropriate, compliance with exposure requirements for mobile and unlicensed devices can be accomplished by the use of warning
labels and by providing users with information concerning minimum separation distances from transmitting structures and proper
installation of antennas.
The following statement must be included as a CAUTION statement in manuals of OEM products to alert users of Industry Canada RF
exposure compliance:
To satisfy Industry Canada RF Exposure requirements for mobile and base station transmission devices, a separation distance of
20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance,
operation at closer than this distance is not recommended.
Pour satisfaire les requis d'industrie Canda sur les expositions aux radiofréquences pour les appareils mobiles et les stations de
transmission, une distance de 20 cm ou plus doit être maintenue entre l'antenne de cet appareil et les personnes durant l'opération.
Pour assurer la conformité, les opérations à des distances inférieures ne sont pas recommandées.
If the OSDI modules are used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator
is responsible for performing Specific Absorption Rate (SAR) testing in accordance with Industry Canada RSS-102.
7.2.2
Approved External Antenna Types
The OSDI modules may operate with different types of antennas. However, it is not permissible to exceed the maximum equivalent
isotropically radiated power (e.i.r.p.) limits specified in the applicable standard (RSS) for the licence-exempt apparatus.
Testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type, with the transmitter output
power set at the maximum level. When a measurement at the antenna connector is used to determine RF output power, the effective gain
of the device's antenna shall be stated, based on measurement or on data from the antenna manufacturer. User manuals for transmitters
equipped with detachable antennas shall also contain the following notice in a conspicuous location:
This radio transmitter TMB-OSDI4W1 has been approved by Industry Canada to operate with the antenna types listed below with the
maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated
for that type, are strictly prohibited for use with this device.
Le présent émetteur radio TMB-OSDI4W1 a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés
ci‑dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain
maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter,
indicating the maximum permissible antenna gain (in dBi).
The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Projected approved external antenna types for the OSDI modules are listed in Section 4.3 above.
7.2.3
Helpful Web Sites
Industry Canada: http://www.ic.gc.ca/
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Title                           : 
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Creator                         : dfrechette
Producer                        : Adobe PDF Library 11.0
Keywords                        : 
Document 0020number             : DT-0237A
Document 0020 Type 0            : 
Page Layout                     : OneColumn
Page Count                      : 33
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FCC ID Filing: TMB-OSDI4W1

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