UTStarcom Korea Technologies CDMRF101 Cellular/ PCS CDMA Modem User Manual

UTStarcom Korea Technologies Ltd. Cellular/ PCS CDMA Modem Users Manual

Users Manual

  CDMRF101 TCU Phone Module   Component Technical Specification Manual Ver. 00.1              Apr. 27. 2007
Notice  All data and information contained in or disclosed by this document are confidential and proprietary information of UTStarcom Inc., and all rights therein are expressly reserved. By  accepting this material,  the  recipient  agrees  that  this material and the information contained  therein  are  held  in  confidence  and  in  trust  and  will  not  be  used,  copied, reproduced, or distributed in whole or in part, nor its contents revealed in any manner to  others  without  the  express  written permission  of  UTStarcom  Inc.    UTStarcom  Inc.   does  not  assume  any  liability  arising  out  of  the  application  or  use  of  its  products.   UTStarcom  Inc.  assumes  no  responsibility  for  any  damage  or  loss resulting from the misuse of its products. UTStarcom Inc. assumes no responsibility for any loss or claims by  third  parties,  which  may  arise  through  the  use  of  its  products.  UTStarcom  Inc. assumes no responsibility for any damage or loss caused by the deletion or loss of data as a result of malfunctions or repairs.  The information contained  in this  document  is subject to change without notice. Information contained herein is for reference only and does  not  constitute  a  commitment  on  the  part  of  UTStarcom  Inc.  Although  the information in this document has been carefully reviewed and it’s believed to be reliable, UTStarcom Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in this document nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this document.    It is advised for the customers to contact our engineers for more information with respect to Keypad, audio interface, RF interface and input power supply before they start an actual design.  OEM  integrators  and  installers  are  instructed  that  the  phrase.  This  device  contains transmitter FCC ID:    O6Y-CDMRF101 must be placed on the outside of the host.    Warning: Exposure to Radio Frequency Radiation The radiated output power of this device is far below the FCC radio frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human contact during normal operation is minimized. In  order  to  avoid  the  possibility  of  exceeding  the  FCC  radio frequency  exposure  limits,  human  proximity  to  the  antenna  should not be less than 20cm during normal operation. The gain of the antenna for Cellular band must not exceed 0dBi. The gain of the antenna for PCS band must not exceed -3dBi.
Table of Contents  CDMRF101...........................................................................................................................................................1 TCU PHONE MODULE........................................................................................................................................1 1 INTRODUCTION / OVERVIEW...................................................................................................................6 1.1 MSM 6050 Chipset .................................................................................................................................6 1.1.1 MSM 6050 Features........................................................................................................................ 6 1.2 IS- Mobile Standards .............................................................................................................................7 1.3 Acronym Definitions..............................................................................................................................8 1.4 Development Tools for the Phone Module..........................................................................................8 1.4.1 LT Box............................................................................................................................................. 8 ..................................................................................................................................................................... 8 2 MECHANICAL DESCRIPTION ...................................................................................................................9 2.1 Phone Module Mechanical Outline ......................................................................................................9 2.2 Phone Module I/O Connector ...............................................................................................................9 2.2.1 I/O Connector Drawing and Supplier Part Number......................................................................... 9 2.2.2 I/O Connector Electrical Characteristics ....................................................................................... 10 2.2.2.1 I/O Connector Pin Assignment .............................................................................................. 10 3 OPERATING TEMPERATURE AND STORAGE .....................................................................................13 3.1 Temperature .........................................................................................................................................13 3.1.1 Storage Temperature....................................................................................................................13 3.1.2 Operating Temperature.................................................................................................................13 4 ELECTRICAL INTERFACE.......................................................................................................................14 4.1 Design Guidelines ...............................................................................................................................14 4.1.1 Component Derating.....................................................................................................................14 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors..................................................................... 14 4.1.1.2 Electrolytic Capacitors ...........................................................................................................14 4.1.1.3 Tantalum Capacitors..............................................................................................................14 4.1.2 Communication Pins and Unused Pins......................................................................................... 14 4.2 Supply Voltage.....................................................................................................................................14
4.3 Current Draw........................................................................................................................................15 4.4 Inputs/Outputs Logic Levels ..............................................................................................................15 4.5 Output Power .......................................................................................................................................16 4.6 Audio Interface.....................................................................................................................................16 4.6.1 PCM Audio....................................................................................................................................16 4.6.1.1 MSM Timing Parameters ....................................................................................................... 16 4.6.1.2 PCM Sync Timing ..................................................................................................................16 4.6.1.3 MSM Receive Timing.............................................................................................................17 4.6.1.4 MSM Transmitting Timing...................................................................................................... 17 4.6.2 UART Data Interface.....................................................................................................................17 4.6.3 Cellular Antenna Open/Short Sense.............................................................................................19 4.6.4 I/O Interface Circuit Diagrams.......................................................................................................20
List of Tables
1 INTRODUCTION / OVERVIEW 1.1  MSM 6050 Chipset The MSM6050 CDMA2000 1X solution is optimized to support voice and key data capabilities while enabling CDMA2000 network benefits. Designed to support the CDMA2000 1X standard to address enhanced features as simultaneous voice and data applications and utilize network optimizations, the MSM6050 chipset will support packet data rates of 153 kbps on the forward and reverse links (FL and RL). It provides a seamless migration path from 2G to 3G services and applications, and the increased voice capacity of a CDMA2000 network. The MSM6050 solution will enable manufacturers to quickly develop handsets meeting specifications for worldwide cdmaOne™ and CDMA2000 1X systems.  The MSM6050 CDMA 2000 1X solution will be used to build a phone module based solution where the module will be used in a telematics module for an automotive application.    The phone module will be designed for use on the Verizon network.    The phone module will not have the typical user interfaces common to handsets (i.e. keypad, display, etc.).    The phone module will have an I/O connector and an RF connector.    Likewise, the phone module will be designed to be certified by Verizon and FCC as a stand alone module meant for embedded applications.    The MSM6050 chipset solution consists of the MSM6050 baseband processor, direct conversion RFR6155™ and RFR6000™  receive devices, the direct conversion RFT61500™  transmit device MAX8629™ power management device and a compatible power amplifier device.    1.1.1  MSM 6050 Features ■gpsOne position location capabilities (not enabled in this module) ■CDMA2000 1X support, offering data rates up to 153 kbps on the forward and reverse links ■Quad-mode (CDMA cellular, CDMA PCS, AMPS cellular, gpsOne) ■Vocoder support (EVRC, 13K QCELP) ■Fast 800 Hz forward power control ■Quasi-Orthogonal functions ■Supplemental channel (SCH) support ■CDMA2000 1X Forward Quick Paging channel (F-QPCH) ■Convolutional and turbo codes on SCH ■ITU 144 kbps requirements achieved ■153 kbps on FL and RL (aggregate) ■Integrated wideband mono voice CODEC
■Voice recognition (VR) (not enabled in this application) ■Acoustic echo cancellation   ■Audio AGC   ■External stereo DAC support   ■Internal Vocoder supporting 13kbps Pure Voice QCELP and EVRC   ■Industry standard ARM7TDMI embedded microprocessor subsystem   ■Internal watchdog and sleep timers   ■Three universal asynchronous receiver transmitter (UART) serial ports    1.2 IS- Mobile Standards  Standard  Description  Comment IS-707  Data Service Options for Spread Spectrum Systems    IS-127  Enhanced Variable Rate Codec (EVRC)  EVRC IS-733  High Rate Speech Service Option 17 for Wide Band Spread Spectrum   Communication Systems  13k codec IS-99  Data Services Option Standard for Wideband Spread Spectrum Digital Cellular   System     IS-657  Packet Data Service Option Standard for Wideband Spread Spectrum Systems        IS-687  Medium Speed Interface for Data Terminal Equipment and Data Circuit Terminating Equipment     IS-19  Recommended Minimum Standards for 800-MHz Cellular Subscriber   Units-Replaced by TIA/EIA-690     IS-41  The protocol for 'roaming' within the USA, describing how services should 'hand over' between operators     IS-683  Over-the-Air Service Provisioning of Mobile Stations in Spread Spectrum Standards    IS-2000  Introduction to CDMA2000 Spread Spectrum Systems      IS-801  Position Determination Service for cdma2000 Spread Spectrum Systems    IS-91 Analog Cellular and PCS. The TIA version of the analog cellular standard,   incorporating the functionality of IS-88 (narrowband analog) and IS-94 as well   as PCS band operation.   AMPS IS-95 XXXXXX
 1.3 Acronym Definitions Define all acronyms that will be used in the document 1.4  Development Tools for the Phone Module 1.4.1 LT Box
2 MECHANICAL DESCRIPTION 2.1  Phone Module Mechanical Outline  2.2  Phone Module I/O Connector Iriso 30 pin connector, 9827B-30C-GF    2.2.1  I/O Connector Drawing and Supplier Part Number This connector is placed on the phone module
   2.2.2  I/O Connector Electrical Characteristics I 2.2.2.1 I/O Connector Pin Assignment  Pin No   Name   Description  Default @ Low est current mode  I/O @ Phone  Logic Condition   1  GND   Ground   Low   O   System ground   2    NC     NA     NA     NA    NA    3    PHONE_PWR     3.8 volts +/-5% supply voltage to phone module     High     I      The application provides the main power of the phone module
 4    PHONE_PWR     3.8 volts +/-5% supply voltage to phone module     High     I      The application provides the main power of the phone module      5    PHONE_PWR     3.8 volts +/-5% supply voltage to phone module     High     I      The application provides the main power of the phone module      6    NC     NA     NA     NA    NA   7  GND   Ground   Low   O   System ground   8    V_REF    Reference Logic Voltage level generated by the Phone      High     O      Provide the application with its logic supply    9    RI     Ring Indicator Generated by the phone     High     O      The phone module indicates the incoming call condition by pulling down    10    CAIT_RX      CAIT Receive Data Input to the Phone       Low     I     CAIT RX provides diagnostic signals from the application to the phone using AT commands    11    CAIT_TX     CAIT Transmit Data Output from the Phone     NA     O     CAIT TX provides diagnostic signals from the application to the phone using the monitor      12    IG_IND      The Ignition status indicator     High     I     Ignition indicator provides the status of the gnition. Ignition on condition is indicated by pulling down and ignition off condition is indicated by pulling up      13    HW_SD     Hardware Shutdown     High     I      The phone module can be shut down by pulling down      14    SD_REQ     Hardware Shutdown request     High     O     The phone module can request hardwarw shutdown by pulling down and it will be back to pull up after completion of the hardware shut down      15    PHONE_WU      Reuest to wake_up the phone from TCU       High     I      Phone wake up is requested by pulling down for 500ms      16    UART_DTR     UART Data terminal ready to Phone from TCU    High     I     UART DTR provides the status signal that indicates the TCU processor is active when it is Low      17    UART_TX      UART Transimt from the Phone to TCU       Low     O     UART TX provides control signals from the application to the phone using AT commands   18  UART_RX    UART Recevie to the  Low    I    UART RX provides co signals from the
Phone from TCU    applic to the phone using AT commands  19    PHONE_RST      Phone Reset gnerated by the application       High     I      The application can reset the phone module by pulling down      20   SPK_OUT_PHONE     Speaker low level audio Output to TCU from Phone    TBD     O     TBD   21  GND   Ground   Low   O   System ground   22   MIC_IN_PHONE   Microphone low level Audio input to Phone from TCU   TBD     I     TBD   23  GND   Ground   Low   O   System ground  24 PCM_IN   PCM Audio Input to the Phone from TCU    Low   I   PCM IN provides the and data information f the TCU application t phone  25    GND     GND    Low     O     System ground   26 PCM_OUT   PCM Audio Output from the Phone to the TCU    High O  PCM OUT provides v and data information f the phone to the appli    27    GND     GND    Low     O     System ground   28 PCM_CLK   PCM Audio Clock Generated by the Phone  Low   O   PCM CLK provides v and data information f the phone to the appli   29 PCM _SYNC   PCM Audio Sync Generated by the Phone  Low   O   PCM sync indicate the signal when it is high   30    GND     GND     Low     O     System ground
3  OPERATING TEMPERATURE AND STORAGE 3.1 Temperature 3.1.1 Storage Temperature The phone module shall be capable of being stored at -30C – 85C without any degregation in performance. 3.1.2 Operating Temperature The phone module shall operate within specification from -30C – 85C
4 ELECTRICAL INTERFACE Phone / TCU System Mechanization 4.1 Design Guidelines 4.1.1 Component Derating 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors Ceramic capacitors or parallel plate capacitors on power lines shall be two devices in series to protect against capacitor shorts.      4.1.1.2 Electrolytic Capacitors Electrolytic capacitors shall be rated at 2x the maximum voltage for a given circuit.  4.1.1.3 Tantalum Capacitors Tantalum capacitors shall be rated at 3x the maximum voltage for a given circuit on a power supply.    They shall be rated at 2X for applications on signal lines.  Tantalum capacitors shall not be placed on circuits with currents that exceed a current of 1A or the current shall be limited to 1A.   4.1.2  Communication Pins and Unused Pins Serial communications signals shall be terminated per manufacturers specifications.  Unused IC pins should be terminated according to manufacturer’s recommendations.     4.2 Supply Voltage Supply Voltage (From TCU to Phone)  Min  Max  Units  I Max Ripple Max
3.8V Supply  3.61  3.99  V  1.0A  100 mV p-p  Regulation type and frequency: Step-down Switching regulator, 220 kHz to 280 kHz Note: Phone Module should not be damaged by the instantaneous loss of the supply voltage   4.3 Current Draw Current Draw Chart @ Room Temperature 25CMin Typ Max Units Min Typ Max Units Min Typ Max UnitsNA NA NA uA NA NA NA us NA NA NA us800 mA NA NA NA us NA NA NA usWake 90 110 130 mA 130 msSleep600 800 uA 5.12-wakeuptime sPre-Wake up 150 mA 20 sWake up 800 mA usCDMA Registration minusPhone ModeCDMA:  0 dBW CallCDMA:  -7 dBW CallCDMA:  Verizon Slot cycle index for waiting for incomming call                Current @ 5.0V Duration Period      4.4  Inputs/Outputs Logic Levels           Limits   Parameter   Min  Max  Units Voltage Output High  VOH 2.437 3.187 Volts Voltage Output Low  VOL 0.00 0.45 Volts Voltage Input High  VIH 1.87655 3.187  Volts
Voltage Input Low  VIL -0.3 1.01045 Volts  4.5 Output Power The phone output power is measured at the end of phone module antenna connector using the RF power meter.    The power level of the phone module is controlled by the base station and the range of the power level is varied from Min output power to Max output power that is defined in the table below.  Item  Specification  Min  Typical  Maximum  Unit Max Output Power  Power Class II  23  24  26  dBm/1.23MHz Min Output Power                   -53              -50  dBm/1.23MHz  4.6 Audio Interface 4.6.1 PCM Audio 4.6.1.1 MSM Timing Parameters  4.6.1.2 PCM Sync Timing
  4.6.1.3 MSM Receive Timing  4.6.1.4 MSM Transmitting Timing  4.6.2  UART Data Interface The Universal Asynchronous Receiver Transmitter (UART) communicates with serial data that conforms to RS-232 interface protocol. The UART    can be used as a serial data port in Mobile Station testing and debugging with a properly written, user-defined download program. All communication between the microprocessor and the UART goes through the microprocessor interface. The microprocessor interface synchronizes the data and command signals to the UART.
The UART has a 512-byte transmit FIFO and a 512-byte receive FIFO.  UART1 (CAIT_RX, CAIT_TX)  Mobile Station Test, Debugging, Download UART2 (UART_RX, UART_TX)  Communication between the Phone Module and TCU  The phone shall have the following UART parameters set by default. Baud = 9600 Data Bits = 8 Parity = ODD Stop Bit = 1 Start Bit = 1 Flow Control = None  Line feed and Carriage return shall be sent following each command and response.
 4.6.3  Cellular Antenna Open/Short Sense The phone module provides the antenna diagnostics function by the antenna detection circuit. The antenna detection circuit can detect three statuses: GOOD, OPEN and SHORTED.    The detection circuit can support the antenna resistance values of 1 kOhm to 20 kOhm.    The commands are detailed in the AT command manual.     DC Voltage  2.60V Status ADC Voltage  HEX GOOD 1.30V  0x80 OPEN 2.60V  0xFF SHORTED 0.00V  0x00 DCVoltageDetectorAntenna10KDNI10KPAMLNA RX PathTX PathDuplexerMSM
 4.6.4  I/O Interface Circuit Diagrams

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