UTStarcom Korea Technologies CDMRF101 Cellular/ PCS CDMA Modem User Manual
UTStarcom Korea Technologies Ltd. Cellular/ PCS CDMA Modem Users Manual
Users Manual
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| Document ID | 799841 |
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| Document Description | Users Manual |
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| Document Type | User Manual |
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| Filesize | 97.02kB (1212741 bits) |
| Date Submitted | 2007-06-04 00:00:00 |
| Date Available | 2007-12-01 00:00:00 |
| Creation Date | 2007-05-23 13:51:40 |
| Producing Software | Acrobat Distiller 7.0 (Windows) |
| Document Lastmod | 2007-06-04 11:13:35 |
| Document Title | Microsoft Word - CDMRF101_FCC_Phone_Module_Manual.doc |
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CDMRF101 TCU Phone Module Component Technical Specification Manual Ver. 00.1 Apr. 27. 2007 Notice All data and information contained in or disclosed by this document are confidential and proprietary information of UTStarcom Inc., and all rights therein are expressly reserved. By accepting this material, the recipient agrees that this material and the information contained therein are held in confidence and in trust and will not be used, copied, reproduced, or distributed in whole or in part, nor its contents revealed in any manner to others without the express written permission of UTStarcom Inc. UTStarcom Inc. does not assume any liability arising out of the application or use of its products. UTStarcom Inc. assumes no responsibility for any damage or loss resulting from the misuse of its products. UTStarcom Inc. assumes no responsibility for any loss or claims by third parties, which may arise through the use of its products. UTStarcom Inc. assumes no responsibility for any damage or loss caused by the deletion or loss of data as a result of malfunctions or repairs. The information contained in this document is subject to change without notice. Information contained herein is for reference only and does not constitute a commitment on the part of UTStarcom Inc. Although the information in this document has been carefully reviewed and it’s believed to be reliable, UTStarcom Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in this document nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this document. It is advised for the customers to contact our engineers for more information with respect to Keypad, audio interface, RF interface and input power supply before they start an actual design. OEM integrators and installers are instructed that the phrase. This device contains transmitter FCC ID: O6Y-CDMRF101 must be placed on the outside of the host. Warning: Exposure to Radio Frequency Radiation The radiated output power of this device is far below the FCC radio frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human contact during normal operation is minimized. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna should not be less than 20cm during normal operation. The gain of the antenna for Cellular band must not exceed 0dBi. The gain of the antenna for PCS band must not exceed -3dBi. Table of Contents CDMRF101 ........................................................................................................................................................... 1 TCU PHONE MODULE ........................................................................................................................................ 1 INTRODUCTION / OVERVIEW ................................................................................................................... 6 1.1 MSM 6050 Chipset ................................................................................................................................. 6 1.1.1 MSM 6050 Features........................................................................................................................ 6 1.2 IS- Mobile Standards ............................................................................................................................. 7 1.3 Acronym Definitions.............................................................................................................................. 8 1.4 Development Tools for the Phone Module.......................................................................................... 8 1.4.1 LT Box............................................................................................................................................. 8 ..................................................................................................................................................................... 8 MECHANICAL DESCRIPTION ................................................................................................................... 9 2.1 Phone Module Mechanical Outline ...................................................................................................... 9 2.2 Phone Module I/O Connector ............................................................................................................... 9 2.2.1 I/O Connector Drawing and Supplier Part Number......................................................................... 9 2.2.2 I/O Connector Electrical Characteristics ....................................................................................... 10 2.2.2.1 OPERATING TEMPERATURE AND STORAGE ..................................................................................... 13 3.1 I/O Connector Pin Assignment .............................................................................................. 10 Temperature ......................................................................................................................................... 13 3.1.1 Storage Temperature .................................................................................................................... 13 3.1.2 Operating Temperature................................................................................................................. 13 ELECTRICAL INTERFACE....................................................................................................................... 14 4.1 Design Guidelines ............................................................................................................................... 14 4.1.1 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors..................................................................... 14 4.1.1.2 Electrolytic Capacitors ........................................................................................................... 14 4.1.1.3 Tantalum Capacitors.............................................................................................................. 14 4.1.2 4.2 Component Derating ..................................................................................................................... 14 Communication Pins and Unused Pins......................................................................................... 14 Supply Voltage ..................................................................................................................................... 14 4.3 Current Draw ........................................................................................................................................ 15 4.4 Inputs/Outputs Logic Levels .............................................................................................................. 15 4.5 Output Power ....................................................................................................................................... 16 4.6 Audio Interface..................................................................................................................................... 16 4.6.1 PCM Audio .................................................................................................................................... 16 4.6.1.1 MSM Timing Parameters ....................................................................................................... 16 4.6.1.2 PCM Sync Timing .................................................................................................................. 16 4.6.1.3 MSM Receive Timing............................................................................................................. 17 4.6.1.4 MSM Transmitting Timing...................................................................................................... 17 4.6.2 UART Data Interface..................................................................................................................... 17 4.6.3 Cellular Antenna Open/Short Sense............................................................................................. 19 4.6.4 I/O Interface Circuit Diagrams....................................................................................................... 20 List of Tables 1 INTRODUCTION / OVERVIEW 1.1 MSM 6050 Chipset The MSM6050 CDMA2000 1X solution is optimized to support voice and key data capabilities while enabling CDMA2000 network benefits. Designed to support the CDMA2000 1X standard to address enhanced features as simultaneous voice and data applications and utilize network optimizations, the MSM6050 chipset will support packet data rates of 153 kbps on the forward and reverse links (FL and RL). It provides a seamless migration path from 2G to 3G services and applications, and the increased voice capacity of a CDMA2000 network. The MSM6050 solution will enable manufacturers to quickly develop handsets meeting specifications for worldwide cdmaOne™ and CDMA2000 1X systems. The MSM6050 CDMA 2000 1X solution will be used to build a phone module based solution where the module will be used in a telematics module for an automotive application. designed for use on the Verizon network. The phone module will not have the typical user interfaces common to handsets (i.e. keypad, display, etc.). connector. The phone module will be The phone module will have an I/O connector and an RF Likewise, the phone module will be designed to be certified by Verizon and FCC as a stand alone module meant for embedded applications. The MSM6050 chipset solution consists of the MSM6050 baseband processor, direct conversion RFR6155 ™ and RFR6000™ receive devices, the direct conversion RFT61500™ transmit device MAX8629™ power management device and a compatible power amplifier device. 1.1.1 MSM 6050 Features ■gpsOne position location capabilities (not enabled in this module) ■CDMA2000 1X support, offering data rates up to 153 kbps on the forward and reverse links ■Quad-mode (CDMA cellular, CDMA PCS, AMPS cellular, gpsOne) ■Vocoder support (EVRC, 13K QCELP) ■Fast 800 Hz forward power control ■Quasi-Orthogonal functions ■Supplemental channel (SCH) support ■CDMA2000 1X Forward Quick Paging channel (F-QPCH) ■Convolutional and turbo codes on SCH ■ITU 144 kbps requirements achieved ■153 kbps on FL and RL (aggregate) ■Integrated wideband mono voice CODEC ■Voice recognition (VR) (not enabled in this application) ■Acoustic echo cancellation ■Audio AGC ■External stereo DAC support ■Internal Vocoder supporting 13kbps Pure Voice QCELP and EVRC ■Industry standard ARM7TDMI embedded microprocessor subsystem ■Internal watchdog and sleep timers ■Three universal asynchronous receiver transmitter (UART) serial ports 1.2 IS- Mobile Standards Standard Description IS-707 Data Service Options for Spread Spectrum Systems IS-127 Enhanced Variable Rate Codec (EVRC) IS-733 IS-99 IS-657 IS-687 IS-19 IS-41 High Rate Speech Service Option 17 for Wide Band Spread Spectrum Communication Systems Comment EVRC 13k codec Data Services Option Standard for Wideband Spread Spectrum Digital Cellular System Packet Data Service Option Standard for Wideband Spread Spectrum Systems Medium Speed Interface for Data Terminal Equipment and Data Circuit Terminating Equipment Recommended Minimum Standards for 800-MHz Cellular Subscriber Units-Replaced by TIA/EIA-690 The protocol for 'roaming' within the USA, describing how services should 'hand over' between operators IS-683 Over-the-Air Service Provisioning of Mobile Stations in Spread Spectrum Standards IS-2000 Introduction to CDMA2000 Spread Spectrum Systems IS-801 Position Determination Service for cdma2000 Spread Spectrum Systems Analog Cellular and PCS. The TIA version of the analog cellular standard, IS-91 incorporating the functionality of IS-88 (narrowband analog) and IS-94 as well as PCS band operation. IS-95 XXXXXX AMPS 1.3 Acronym Definitions Define all acronyms that will be used in the document 1.4 Development Tools for the Phone Module 1.4.1 LT Box 2 MECHANICAL DESCRIPTION 2.1 Phone Module Mechanical Outline 2.2 Phone Module I/O Connector Iriso 30 pin connector, 9827B-30C-GF 2.2.1 I/O Connector Drawing and Supplier Part Number This connector is placed on the phone module 2.2.2 I/O Connector Electrical Characteristics 2.2.2.1 I/O Connector Pin Assignment Default @ Pin Name Low est I/O @ current Phone Description No Logic Condition mode GND NC PHONE_PWR Ground NA Low NA NA High 3.8 volts +/-5% supply voltage to phone module System ground NA The application provides the main power of the phone module 3.8 volts +/-5% supply PHONE_PWR The application provides the main High voltage to phone module power of the phone module 3.8 volts +/-5% supply PHONE_PWR The application provides the main High voltage to phone module NC GND NA Ground power of the phone module NA Low NA NA System ground Reference Logic Provide the application with its logic V_REF Voltage level generated High supply by the Phone Ring Indicator RI The phone module indicates the High Generated by the phone incoming call condition by pulling down CAIT RX provides diagnostic signals CAIT Receive Data 10 CAIT_RX Low from the application to the phone using Input to the Phone AT commands CAIT TX provides diagnostic signals CAIT Transmit Data 11 CAIT_TX NA from the application to the phone using Output from the Phone the monitor Ignition indicator provides the status of The Ignition status 12 IG_IND the gnition. Ignition on condition is High indicator indicated by pulling down and ignition off condition is indicated by pulling up The phone module can be shut down by 13 HW_SD Hardware Shutdown High pulling down The phone module can request Hardware Shutdown 14 SD_REQ hardwarw shutdown by pulling down and High request it will be back to pull up after completion of the hardware shut down Reuest to wake_up the 15 PHONE_WU Phone wake up is requested by pulling High phone from TCU down for 500ms UART Data terminal 16 UART_DTR ready to Phone from UART DTR provides the status signal High TCU that indicates the TCU processor is active when it is Low UART TX provides control signals from UART Transimt from the 17 UART_TX Low the application to the phone using AT Phone to TCU commands 18 UART_RX UART Recevie to the Low UART RX provides co signals from the Phone from TCU applic to the phone using AT commands Phone Reset gnerated 19 PHONE_RST The application can reset the phone High by the application module by pulling down Speaker low level audio 20 21 SPK_OUT_PHO Output to TCU from NE Phone GND Ground TBD Low TBD Low Low TBD System ground Microphone low level 22 MIC_IN_PHONE Audio input to Phone TBD from TCU 23 GND 24 PCM_IN Ground PCM Audio Input to the PCM IN provides the and data Phone from TCU 25 GND GND information f the TCU application t phone Low PCM Audio Output from 26 PCM_OUT GND GND information f the phone to the appli Low PCM Audio Clock 28 PCM_CLK information f the phone to the appli PCM Audio Sync PCM _SYNC PCM sync indicate the signal when it is Low Generated by the Phone 30 GND GND System ground PCM CLK provides v and data Low Generated by the Phone 29 System ground PCM OUT provides v and data High the Phone to the TCU 27 System ground high Low System ground 3 OPERATING TEMPERATURE AND STORAGE 3.1 Temperature 3.1.1 Storage Temperature The phone module shall be capable of being stored at -30C – 85C without any degregation in performance. 3.1.2 Operating Temperature The phone module shall operate within specification from -30C – 85C 4 ELECTRICAL INTERFACE Phone / TCU System Mechanization 4.1 Design Guidelines 4.1.1 Component Derating 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors Ceramic capacitors or parallel plate capacitors on power lines shall be two devices in series to protect against capacitor shorts. 4.1.1.2 Electrolytic Capacitors Electrolytic capacitors shall be rated at 2x the maximum voltage for a given circuit. 4.1.1.3 Tantalum Capacitors Tantalum capacitors shall be rated at 3x the maximum voltage for a given circuit on a power supply. They shall be rated at 2X for applications on signal lines. Tantalum capacitors shall not be placed on circuits with currents that exceed a current of 1A or the current shall be limited to 1A. 4.1.2 Communication Pins and Unused Pins Serial communications signals shall be terminated per manufacturers specifications. Unused IC pins should be terminated according to manufacturer’s recommendations. 4.2 Supply Voltage Supply Voltage (From TCU to Phone) Min Max Units I Max Ripple Max 3.8V Supply 3.61 3.99 1.0A 100 mV p-p Regulation type and frequency: Step-down Switching regulator, 220 kHz to 280 kHz Note: Phone Module should not be damaged by the instantaneous loss of the supply voltage 4.3 Current Draw Current Draw Chart @ Room Temperature 25C Current @ 5.0V Max Units Min Typ Max Units Min NA NA uA NA NA NA us NA NA NA us 800 mA NA NA NA us NA NA NA us 110 130 mA 130 ms 600 800 uA Sleep Pre-Wake up 5.12wakeuptime 150 mA Wake up 800 mA Wake CDMA: Verizon Slot cycle index for waiting for incomming call 4.4 Period Typ NA CDMA: -7 dBW Call CDMA Registration Duration Min Phone Mode CDMA: 0 dBW Call 90 Typ Max us 20 min us Inputs/Outputs Logic Levels Limits Parameter Units Min Max Units Voltage Output High VOH 2.437 3.187 Volts Voltage Output Low VOL 0.00 0.45 Volts Voltage Input High VIH 1.87655 3.187 Volts Voltage Input Low 4.5 VIL -0.3 1.01045 Volts Output Power The phone output power is measured at the end of phone module antenna connector using the RF power meter. The power level of the phone module is controlled by the base station and the range of the power level is varied from Min output power to Max output power that is defined in the table below. Item Specification Max Output Power Power Class II Min Output Power 4.6 Audio Interface 4.6.1 PCM Audio 4.6.1.1 MSM Timing Parameters 4.6.1.2 PCM Sync Timing Min 23 Typical Maximum 24 26 -53 Unit dBm/1.23MHz -50 dBm/1.23MHz 4.6.1.3 MSM Receive Timing 4.6.1.4 MSM Transmitting Timing 4.6.2 UART Data Interface The Universal Asynchronous Receiver Transmitter (UART) communicates with serial data that conforms to RS-232 interface protocol. The UART can be used as a serial data port in Mobile Station testing and debugging with a properly written, user-defined download program. All communication between the microprocessor and the UART goes through the microprocessor interface. The microprocessor interface synchronizes the data and command signals to the UART. The UART has a 512-byte transmit FIFO and a 512-byte receive FIFO. UART1 (CAIT_RX, CAIT_TX) UART2 (UART_RX, UART_TX) Mobile Station Test, Debugging, Download Communication between the Phone Module and TCU The phone shall have the following UART parameters set by default. Baud = 9600 Data Bits = 8 Parity = ODD Stop Bit = 1 Start Bit = 1 Flow Control = None Line feed and Carriage return shall be sent following each command and response. 4.6.3 Cellular Antenna Open/Short Sense The phone module provides the antenna diagnostics function by the antenna detection circuit. The antenna detection circuit can detect three statuses: GOOD, OPEN and SHORTED. The detection circuit can support the antenna resistance values of 1 kOhm to 20 kOhm. The commands are detailed in the AT command manual. DC Voltage Status GOOD OPEN SHORTED 2.60V ADC Voltage 1.30V 2.60V 0.00V HEX 0x80 0xFF 0x00 Antenna DC PAM TX Path Duplexer 10K Voltage Detector DNI LNA RX Path MSM 10K 4.6.4 I/O Interface Circuit Diagrams
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