UTStarcom Korea Technologies CDMRF102 Dual-Band CDMA Module (CDMA/PCS CDMA) User Manual CDMRF102 user manual

UTStarcom Korea Technologies Ltd. Dual-Band CDMA Module (CDMA/PCS CDMA) CDMRF102 user manual

Users Manual

CDMRF102 TCU Phone Module Component Technical Specification Manual Ver. 0.1 Aug. 14. 2008
Table of Contents CDMRF102..................................................................................................................................................... 1 TCU PHONE MODULE.................................................................................................................................. 1 1 INTRODUCTION / OVERVIEW .................................................................................................................. 6 1.1 QSC 6055 Chipset .............................................................................................................................. 6 1.1.1 QSC 6055 Features........................................................................................................................... 6 1.2 IS- Mobile Standards .......................................................................................................................... 7 1.3 Acronym Definitions........................................................................................................................... 8 1.4 Development Tools for the Phone Module....................................................................................... 8 1.4.1 LT Box...................................................................................................................................... ...……8 2 MECHANICAL DESCRIPTION .................................................................................................................. 9 2.1 Phone Module Mechanical Outline ................................................................................................... 9 2.2 Phone Module I/O Connector ............................................................................................................ 9 2.2.1 I/O Connector Drawing and Supplier Part Number…......................................................................... 9 2.2.2 I/O Connector Electrical Characteristics ….......................................................................................10 2.2.2.1 I/O Connector Pin Assignment ..................................................................................................... 10 3 OPERATING TEMPERATURE AND STORAGE ..................................................................................... 13 3.1 Temperature ...................................................................................................................................... 13 3.1.1 Storage Temperature….................................................................................................................... 13 3.1.2 Operating Temperature…................................................................................................................ 13 4 ELECTRICAL INTERFACE...................................................................................................................... 14 4.1 Design Guidelines ............................................................................................................................ 14 4.1.1 Component Derating…..................................................................................................................... 14 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors……….................................................................. 14 4.1.1.2 Electrolytic Capacitors .................................................................................................................. 14 4.1.1.3 Tantalum Capacitors..................................................................................................................... 14 4.1.2 Communication Pins and Unused Pins............................................................................................ 14 4.2 Supply Voltage................................................................................................................................... 14
4.3 Current Draw ....................................................................................................................................... 15 4.4 Output Power ...................................................................................................................................... 16 4.5 Audio Interface.................................................................................................................................... 16 4.5.1 PCM Audio....................................................................................................................................…..16 4.5.1.1 QSC Timing Parameters ..............................................................................................................…16 4.5.1.2 PCM Sync Timing ........................................................................................................................... 16 4.5.1.3 QSC Receive Timing........................................................................................................................17 4.5.1.4 QSC Transmitting Timing................................................................................................................ 17 4.5.2 UART Data Interface.......................................................................................................................... 17 4.5.3 Cellular Antenna Open/Short Sense................................................................................................ ..19
1 INTRODUCTION / OVERVIEW 1.1 QSC6055 Chipset The QSC60x5 family of devices represents the next generation of chipset architecture and enhancements for the QCT value and multimedia tiers of products. The QSC60x5 family includes the QSC6055 and QSC6065 devices (supporting CDMA2000 1x voice and data, and Simultaneous-GPS (S-GPS)), the QSC6075 device (adding CDMA2000 EV-DO rel. 0 support) and the QSC6085 device (adding CDMA2000 EV-DO rev. A support). These airlink and multimedia capabilities are supported by integrating Mobile Station Modem™ (MSM™) baseband, radioOne® RF, and power management functionality into a single 12 mm x 12 mm chip scale package (CSP). Together these functions perform all the signal processing and power management tasks within a subscriber unit. This enables reduced handset complexity, cost, time-to-market, and board-space requirements while providing many features and functionalities. The global expansion of 3G CDMA 1x networks has extended the availability of high-speed, wireless data access. With increased accessibility comes increased demand for wireless devices that function as cameras, camcorders, personal video players, MP3 audio players, gaming consoles, and phones. To efficiently support next-generation data speeds and functionality, wireless devices must integrate applications processors with high-performance modems. The QSC60x5 devices extend the level of integration to include radio frequency and power management functions. 3G products based upon the QSC60x5 devices may include: ■ Voice and data phones ■ Music player-enabled devices and applications ■ Camera phones ■ Multimedia phones, including gaming, streaming video, videoconferencing, and more ■ Position location devices ■ Other applications and devices QSC60x5 benefits are applied to each of these product-types, including: ■ Higher integration to reduce PCB surface area, power consumption, time-to-market, and BOM costs while adding capabilities and processing power ❒ Baseband functions, including multiple hardware cores ❒ radioOne RF and analog functions (Rx and Tx, both eliminating their intermediate frequency (IF) components) ❒ Power management functions ■ Integrated hardware cores eliminate multimedia co-processors, providing superior image quality and resolution for mobile devices while extending application times: ❒ Longer run-time for mobile devices over other industry solutions that use companion processors ■ Location-based services and applications, including points of interest, personal navigation, and friend finder ■ Single platform that provides dedicated support for all market leading CODECs and other multimedia formats to support carrier deployments around the world
■ DC power reduction using innovative techniques, such as the QUALCOMM IntelliCeiver™ technology and PA bypassing 1.1.1 QSC6055 Features ■ Modem microprocessor – a low-power, high-performance RISC microprocessor core running at 192 MHz and featuring the ARM926EJ-S™ CPU and Jazelle™ accelerator circuit from ARM® Limited. ■ Modem digital signal processor (mDSP) – the low-power, high-performance QDSP4u8™ targeting 85 MHz. ■ Application digital signal processor (aDSP) – the low-power, high-performance QDSP4u8™ targeting 115 MHz. ■ 96 MHz bus clock for 16-bit DDR SDRAM and 16/32-bit PSRAM ■ Dual-memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2), such as LCD panels ■ 1.8 V memory interface support on EBI1 ■ 1.8 V or 2.6 V memory interface support on EBI2 ■ Memory types supported: ❒ 16-bit NOR flash (burst mode), including multiplexed address/data types ❒ 8-bit and 16-bit NAND flash and 16-bit OneNAND ❒ 16-bit DDR SDRAM ❒ 16-bit and 32-bit PSRAM requiring multiplexed address/data types ■ Bootup is supported from the following devices: ❒ Burst NOR on EBI1 ❒ Any supported NAND memory type on EBI2 ■ CDMA2000 1X revisions A and B ■ Enhanced GPS position location ❒ Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of location-based services and applications, including points of interest, personal navigation, and friend finder ❒ Simultaneous-GPS (processes GPS on its Rx path while CDMA signals continue to be processed on a separate Rx path) ❒ 1024x searcher, DFT accelerator, off-chip RAM for measured data storage ■ Two universal asynchronous receiver transmitter (UART) serial ports
1.2 Mobile Standards Service Provisioning- OTASP ANSI TIA EIA-683 Parameter Administration - OTAPA ANSI TTA ETA-683 Caller ID IS-2000 Call Hold & Call Waiting IS-2000 Three-Way Calling IS-41 E911 Location Determination TIA EIA IS-801 CDMA 1xRTT Packet Data (153 Kbps forward and reverse) TIA EIA IS-2000 Mobile IP TIA EIA IS-835-A Enhanced Variable Rate Codec-B (EVRC-B) 3GPP2 C.S0014.B Enhanced Variable Rate Codec (EVRC) TIA EIA IS-127 EVRC TTY TDD Extension TTA ETA IS-127-3 SMS (MT,MO) IS-637 1.3 Acronym Definitions Define all acronyms that will be used in the document
1.4 Development Tools for the Phone Module 1.4.1 LT Box 2 MECHANICAL DESCRIPTION 2.1 Phone Module Mechanical Outline 2.2 Phone Module I/O Connector Iriso Part Number: 9827B-40BGFC (connector only) 9827B-40Y912 (tape and reel)
2.2.1 I/O Connector Drawing and Supplier Part Number This connector is placed on the phone module 2.2.2 I/O Connector Electrical Characteristics I 2.2.2.1 I/O Connector Pin Assignment, I/O Interface, and Circuit Diagrams Phone_PWR Min:3.61VMax:3.99VMax:1.5AISIGNALDESCRIPTIONSIGNALVOLTAGELEVELIMPEDANCETCU PHONECURRENTI/O INTERFACETCU SIDE PHONE SIDESIGNALNAMECOMMENTSSIGNALTYPEANALOGORDIGITALDC input. ANALOGPIN#J1-1PINTYPEJ1-2J1-3J1-4J1-5J1-6Phone_PWRPhone_PWRPhone_PWRGNDGND3.8 volts supplyvoltage to phonemodule3.8 volts supplyvoltage to phonemoduleDC input. Min:3.61VMax:3.99VNA NANANA Max:1.5AANALOG I3.8 volts supplyvoltage to phonemoduleDC input. Min:3.61VMax:3.99VNA NA Max:1.5AANALOG I3.8 volts supplyvoltage to phonemoduleDC input. Min:3.61VMax:3.99VNA NA Max:1.5AANALOG IOver_VoltageProtection3.8V QSC6055VPH_PWR4.7uf1000pf0.01 f1000pf200 f3.85VSwitching RegLTC383522 H40m10101515FBATT
SIGNALDESCRIPTIONSIGNALVOLTAGELEVELIMPEDANCEPHONECURRENTI/O INTERFACETCU SIDE PHONE SIDESIGNALNAMEPhone_VREFOSIGNALTYPEANALOGORDIGITALCOMMENTSDC supply output AnalogPIN#PINTYPEJ1-7J1-8J1-9J1-10J1-11J1-12DNAD_RX5VSW_FROM_PHONEDNAD_TXGNDDNAD_CTS(Removed)2.6V +/- 2%supply output fromNAD to TCUMin.:2.548V.Max:2.652VNA NACAIT Receive Datafrom TCU toPhone.Digital input VHigh:0.65*Vdd_P toVdd_p+0.3VVLow:-0.3V to0.35*Vdd_p*Vdd_P=2.85V10K10mADigital I5V +/- 5%supply output fromNAD to TCUDC supply output Min.:4.75V.Max:5.25V NA NA 70mA Analog OCAIT transmitDatafrom phone toTCUDigital Output Voh:Vdd_P-0.45to Vdd_PVol:0 to 0.45Vdd_P=2.85V47K Digital OPower Ground Ground NA NA AnalogCAIT CTS datafrom TCU fromPhoneDigital Input VHigh:0.65*Vdd_P toVdd_p+0.3VVLow:-0.3V to0.35*Vdd_p*Vdd_P=2.85V10K Digital ITCU2.2uFQSC6055VREG_MSMP2.6vVPH_PWRQSC6055VSW_5VVREG_5V10uFCurrent LimitSwitch(200mA)5VSW_PWR_EN1000pF2.2uH2.6VV4 – A4V3 – B9* DNI 1000pF* DNI0: Phone_VREF is routed to pullups on RESET, UART, PCM, lines0.01 f1000pf1000pf5VPhone_VREF 100k* DNIV4 – A5V3 – B10* DNI 1000pF* DNI0Phone_VREF 100k* DNIVREG_2.85VQSC6055CAIT_RX4.7KcQSC6055CAIT_TXVREG_2.85V4.7K2.2K(DNI)
3 OPERATING TEMPERATURE AND STORAGE 3.1 Temperature 3.1.1 Storage Temperature The phone module shall be capable of being stored at -40C ~ 85C without any damage. 3.1.2 Operating Temperature The phone module shall operate within specification from -30C – 85C 4 ELECTRICAL INTERFACE Phone / TCU System Mechanization 4.1 Design Guidelines 4.1.1 Component Derating 4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors Ceramic capacitors or parallel plate capacitors on power lines shall be two devices in series to protect against capacitor shorts. 4.1.1.2 Electrolytic Capacitors Electrolytic capacitors shall be rated at 2x the maximum voltage for a given circuit. 4.1.1.3 Tantalum Capacitors Tantalum capacitors shall be rated at 3x the maximum voltage for a given circuit on a power supply. They shall be rated at 2X for applications on signal lines. Tantalum capacitors shall not be placed on circuits with currents that exceed a current of 1A or the current shall be limited to 1A. 4.1.2 Communication Pins and Unused Pins Serial communications signals shall be terminated per manufacturers specifications. Unused IC pins should be terminated according to manufacturer’s recommendations. 4.2 Supply Voltage A power supply or supplies with the following characteristics shall power the NAD: Note: Phone Module should not be damaged by the instantaneous loss of the supply voltage 4.3 Current Draw 4.3.1 TX Current Drain <Voice Call> -. USCellular(Ch.384) Current: 245 mA -. USPCS(Ch.675) Current : 230 mA <Data Call> -. USCellular(Ch.384) Current: 350 mA -. USPCS(Ch.675) Current: 360 mA
4.3.2 Standby Current Drain. Band Celluar (ch 384) PCS (ch 600) Slot Mode SLOT1 SLOT2 SLOT1 SLOT2 Current [mA] 3.78 mA 2.63 mA 3.76 mA 2.59 mA 4.3.3 Off current drain. -Under 100uA 4.4 Output Power The phone output power is measured at the end of phone module antenna connector using the RF power meter. The power level of the phone module is controlled by the base station and the range of the power level is varied from Min output power to Max output power that is defined in the table below. Item Specification Min Typical Maximum UnitMax Output Power Power Class II 23 24 26 dBm/1.23MHzMin Output Power -53 -50 dBm/1.23MHz 4.6 Audio Interface 4.6.1 PCM Audio 4.6.1.1 QSC Timing Parameters
4.6.1.2 PCM Sync Timing
4.6.1.3 QSC Receive Timing 4.6.1.4 MSM Transmitting Timing 4.6.2 UART Data Interface QSC6055 devices are capable of providing up to two universal asynchronous receiver transmitter (UART) ports. Each UART communicates with serial data ports that conform to the RS-232 interface protocol. With a properly written and user-defined download program, the UART can be used as the handset’s serial data port for test and debug, and can support additional interface functions such as an external keypad or ringer. If the handset uses EEPROM or flash memory, then the UART can be used to load and/or upgrade system software. UART1 capability is expanded to include a high-speed (Up to 4 Mbps) mode. 4.6.3 Cellular Antenna Open/Short Sense The phone module provides the antenna diagnostics function by the antenna detection cir-cuit. The antenna detection circuit can detect three statuses: GOOD, OPEN and SHORTED. The detection circuit senses current drain through anttena and sends analog voltage to QSC. QSC reads analog voltage by its ADC and monitors the antenna status. <Antenna Input Fault Requirement>
<Antenna Detection Circuit>
Notice OEM integrators and installers are instructed that the phrase. This device contains transmitter FCC ID: O6Y-CDMRF102 must be placed on the outside of the host. Warning: Exposure to Radio Frequency Radiation The radiated output power of this device is far below the FCC radio frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human contact during normal operation is minimized. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna should not be less than 20cm during normal operation. The gain of the antenna for Cellular band must not exceed-1.5 dBi. The gain of the antenna for PCS band must not exceed -2.5dBi.

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