Unigen UGWC821R NEMO BLUETOOTH RADIO MODULE User Manual NEMO2 Design Guidelines

Unigen Corporation NEMO BLUETOOTH RADIO MODULE NEMO2 Design Guidelines

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Unigen Corp. Wireless Module Products

NEMO Bluetooth Radio Modules

UGWC821RSMA133

Design Guidelines Application Note

Issue Date: April 3rd, 2012

Revision: 1.0

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CONTENTS

Contents........................................................................................................................................................2

ListofFigures................................................................................................................................................4

ListofTables.................................................................................................................................................5

Scope.............................................................................................................................................................6

FCCTransmitterModularApprovalIntroduction.........................................................................................6

Class2PermissiveChanges...........................................................................................................................7

NEMO2ModuleGeneralDescription...........................................................................................................7

CSRBlueCore6ROMTransceiverIC.............................................................................................................8

FunctionalBlockDiagrams............................................................................................................................9

Nemo2LGAFormFactor.............................................................................................................................12

LGAPadsandAssignments.....................................................................................................................12

Nemo2ReferenceEvaluationBoard...........................................................................................................14

Nemo2EvaluationBoardBOM...............................................................................................................16

PCBLayout..............................................................................................................................................17

ComponentLayout..................................................................................................................................17

TopLayer(Layer1)..................................................................................................................................18

GroundLayer(Layer2)...........................................................................................................................18

VDDLayer(Layer3).................................................................................................................................19

BottomLayer(Layer4)............................................................................................................................20

PCBStack,Materials,Drill&Notes.........................................................................................................21

NEMO2DesignIntegrationRules...............................................................................................................22

IntendedUse...........................................................................................................................................22

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Antenna&ExternalRFPath....................................................................................................................24

MicrostripTransmissionLineSpecification............................................................................................25

MicrostripPCBBoardDetails:.................................................................................................................26

MicrostripGroundReference.................................................................................................................26

RFShielding.............................................................................................................................................29

SupportContact......................................................................................................................................31

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LIST OF FIGURES

Figure1:Nemo2BasicBlockDiagram..........................................................................................................9

Figure2:CSRBlueCore6ChipsetBlockDiagram........................................................................................10

Figure3:NEMO2ElaborateBlockDiagram................................................................................................11

Figure4:NEMO2LGAPads.........................................................................................................................12

Figure5:NEMO2Evaluationboard............................................................................................................14

Figure6:NEMO2EvaluationBoardComponentLayout.............................................................................17

Figure7:NEMO2EvaluationBoardTopLayer1.........................................................................................18

Figure8:NEMO2EvaluationBoardGroundLayer2...................................................................................18

Figure9:NEMO2PowerPlaneLayer3.......................................................................................................19

Figure10:NEMO2BottomSignalLayer4...................................................................................................20

Figure11:NEMO2EvaluationBoardPCBStackUp....................................................................................21

Figure12:NEMO2EvaluationBoardDrillChart.........................................................................................22

Figure13:NEMO2BluetoothSoftwareStackArchitecture........................................................................23

Figure14:NEMO2MicrostripDimensionDetails.......................................................................................25

Figure15:NEMO2EvaluationMicrostripPCBStackUPDetails.................................................................26

Figure16:NEMO2MicrostripGroundReference.......................................................................................27

Figure17:NEMO2GroundingTechnique,GroundStitchingandAdjacentGroundLayer.........................27

Figure18:GroundingConsiderations.........................................................................................................28

Figure19:NEMO2EvaluationBoardExampleShield.................................................................................29

Figure20:NEMO2EvaluationBoardTopSoldermaskRFShieldOutline...................................................30

Figure21:NEMO2EvaluationBoardRFShieldMicrostripgapspacing.....................................................30

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LIST OF TABLES

Table1:NEMO2LGAPadDescription........................................................................................................13

Table2:NEMO2EvaluationBoardBOM.....................................................................................................16

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SCOPE

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The purpose of this document is to describe the functionality, operation, specific

design restrictions and guidelines of the NEMO2 module for integration and

regulatory/certification explanation with approved partners. Design integration is

important to comply with FCC/IC regulatory limited module approvals. The NEMO2

evaluation board will be used as an example and reference to modular approvals on

transmission line and antennas.

FCC TRANSMITTER MODULAR APPROVAL INTRODUCTION

A transmitter with a modular or limited modular grant can be installed in different

end-use products (referred to as a host, host product, or host device) by the

grantee or other equipment manufacturer; and the host may not require additional

testing or equipment authorization for the transmitter function provided by that

specific module or limited module.

NEMO2 has received Limited Modular Approval and each OEM will be

required to have Radiated Emissions measured to ensure compliance.

A host product incorporating a certified device cannot take advantage of the pre-

existing certification of the component transmitter module without conformity with

these specific requirements. Modular approvals are for tangible, clearly delineated,

devices that operate when installed within, or attached to, a host in one of the

following four physical configurations:

1. Single-modular transmitter: a complete RF transmission sub-assembly,

designed to be incorporated into another device, that must demonstrate

compliance with FCC rules and policies independent of any host;

2. Limited single-modular transmitter: a single-modular transmitter that

complies with the Section 15.212(a)(1) modular rules, only when constrained

to specific operating host(s) and/or associated grants condition(s);

3. Split-modular transmitter: a RF transmission system that complies with

the requirements for a single-modular transmitter, that is separated into a

radio front-end section and a control-element section, and can demonstrate

compliance for a range of similar type hosts;

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4. Limited split-modular transmitter: a split-modular transmitter that

complies with the definition and technical rules for split modules only when

constrained to specific operating host(s), and/or associated grant

condition(s).

A host product is required to comply with all applicable FCC equipment

authorizations regulations, requirements and equipment functions not associated

with the transmitter module portion. For example, compliance must be

demonstrated to regulations for other transmitter components within the host

product; to requirements for unintentional radiators (Part 15B), such as digital

devices, computer peripherals, radio receivers, etc.; and to additional authorization

requirements for the non-transmitter functions on the transmitter module (i.e.,

Verification, or Declaration of Conformity) (e.g., Bluetooth and WiFi transmitter

modules may also contain digital logic functions) as appropriate.

To ensure compliance with all non-transmitter functions the host manufacturer is

responsible for ensuring compliance with the module(s) installed and fully

operational. For example, if a host was previously authorized as an unintentional

radiator under the Declaration of Conformity procedure without a transmitter

certified module and a module is added, the host manufacturer is responsible for

ensuring that the after the module is installed and operational the host continues to

be compliant with the Part 15B unintentional radiator requirements. Since this may

depend on the details of how the module is integrated with the host, the grantee

(the party responsible for the module grant) shall provide guidance to the host

manufacturer for compliance with the Part 15B4 requirements.

CLASS 2 PERMISSIVE CHANGES

NEMO2 is not equipped with a permanently attached antenna or unique antenna

connector. The integrator can choose to use the same antenna, connector and

microstrip transmission line in the end product design. However, any changes to this

RF path will require retesting on the radiated portion and a Class II permissive

change to utilize part of the modular Unigen grant. For more information on Class II

permissive change and processes, please inquire your regulatory TCB.

NEMO2 MODULE GENERAL DESCRIPTION

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The Nemo2 module is a complete Bluetooth 2.4GHz radio transceiver operating in

the license free ISM (Industrial, Scientific and Medical) band. The Nemo module has

CSR’s BlueCore 6 ROM Bluetooth solution. The CSR BlueCore 6 ROM is a single-chip

radio and baseband IC for Bluetooth 2.4GHz systems including enhanced data rate

(EDR) to 3Mbps. With the on-chip CSR Bluetooth software stack, it provides a fully

compliant Bluetooth v2.1 + EDR specification system for data and voice

communications. The Nemo2 is a complete separate PCBA module with dimensions

measure 6.5mm x 6.5mm x 1.5mm. A single 3.3V power supply input, single ended

RF output/input, and a low 26 pad count makes the NEMO module easy to interface

with. The module contains on board supply regulation, radio crystal oscillator,

BALUN and bandpass filter.

CSR BLUECORE 6 ROM TRANSCEIVER IC

BlueCore™6-ROM is a single-chip transceiver radio and baseband IC for Bluetooth

2.4 GHz systems. With the on-chip CSR Bluetooth software stack, it provides a fully

compliant Bluetooth system to v2.1 of the specification for data and voice

communications with buffered modulation/data inputs to ensure that the device will

comply with Part 15 requirements with any type of input signal.

The device incorporates auto-calibration and built-in self-test (BIST) routines to

simplify development, type approval and production test. All hardware and device

firmware is fully compliant with the Bluetooth v2.1 +EDR specification (all

mandatory and optional features).

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FUNCTIONAL BLOCK DIAGRAMS

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Figure1:Nemo2BasicBlockDiagram

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Figure2:CSRBlueCore6ChipsetBlockDiagram

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Figure3:NEMO2ElaborateBlockDiagram

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NEMO2 LGA FORM FACTOR

Nemo2 is a 26 pad LGA surface mount LGA module. The 26 pads interfaces the

module to a host and host PCB with power supply, ground, digital UART

communications, regulator enable, PCM audio bus, digital PIOs and single RF output.

LGA Pads and Assignments

Figure4:NEMO2LGAPads

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Table1:NEMO2LGAPadDescription

Pin Signal Name Type Description

1 CLK32K_IN Input

32.768kHz low power clock

input

2 SDIO_SD_CSB Input SDIO Interface/Enable

3 SDIO_SD_CMD -- SDIO Interface

4 SDIO_SD_CLK -- SDIO Interface

5 GND -- Ground Reference

6 PIO(0) I/O I/O or WiFi- Coex signal

7 PIO(1) I/O I/O or WiFi- Coex signal

8 PIO(4) I/O I/O or WiFi- Coex signal

9 PIO(5) I/O I/O or WiFi- Coex signal

10 PIO(7) I/O I/O

11 GND -- Ground Reference

12 GND -- Ground Reference

13 ANT_OUT -- Antenna Output

14 GND -- Ground Reference

15 GND -- Ground Reference

16 PCM_CLK -- PCM Interface

17 PCM_OUT -- PCM Interface

18 PCM_IN -- PCM Interface

19 PCM_SYNC -- PCM Interface

20 GND -- Ground Reference

21 UART_RX/SDIO_DATA[2] I/O UART/SDIO_DATA Interface

22 UART_RTS/SDIO_DATA[1] I/O UART/SDIO_DATA Interface

23 UARTCTS/SDIO_DATA[3] I/O UART/SDIO_DATA Interface

24 UART_TX/SDIO_DATA[0] I/O UART/SDIO_DATA Interface

25 GND -- Ground Reference

26 BT_REG_CTRL_P PWR Internal Regulator Enable.

27 3V3 PWR PWR Supply

28 3V3 PWR PWR Supply

29 MODULE_RST_N Input Module Reset

30 VDD_RF -- Output of Internal Regulator

Note: Active Low signals are designated with an '_N' suffix, and Active High signals are designated

with an '_P' suffix.

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NEMO2 REFERENCE EVALUATION BOARD

The Nemo2 reference evaluation board is used for testing and evaluation of the

Nemo2 product for performance testing, application evaluation, software testing and

RF performance testing. The Nemo2 reference evaluation board was also used for

Bluetooth, FCC, IC and ETSI certification testing. The Nemo2 is a reference example

design and the physical design and rules should be taken into consideration of the

integrator of the Nemo2 module.

Design files are available from Unigen upon request.

Figure5:NEMO2Evaluationboard

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Schematic

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Nemo2 Evaluation Board BOM

Table2:NEMO2EvaluationBoardBOM

Description Qty

Reference

Designator Part Number(s) Manufacturer (s)

CONN SMA FEMALE EDGE MOUNT

0.031IN THK BD 1.0 ANT1 CONREVSMA003.031

LINX

TECHNOLOGIES

CONN HDR 3POS 2.54MM AU VERT TH 2.0 JUMP1,JUMP2 TSW-103-07-G-S SAMTEC

CONN HDR 7x2 2.54MM VERT THRU-

HOLE 1 CON4 TSW-107-07-G-D SAMTEC

CONN SOCKET 17x2 2MM SQ TAIL TH 1.0 CON1 SQT-117-03-L-D SAMTEC

RES 0 OHM JUMPER 1/16W 0402 6.0 R2,R4,R6,R8,R9,R11

RC0402JR-070RL,

CRCW04020000Z0ED,

WR04X000PTL,

ERJ-2GE0R00X

YAGEO,

VISHAY,

WALSIN,

PANASONIC

RES 100K OHM 1/16W 5% 0402 2.0 R22,R23 ERJ-2GEJ104X PANASONIC

RES 10K OHM 1/16W 5% 0402 2.0 R14,R16 MCR01MZPJ103 ROHM

CAP CER 0.01UF 5% 50V X7R 0603 1.0 C1 0603B103J500CT WALSIN

NEMO2 1.0 U1 UGWC821RSMA133 Unigen

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PCB Layout

Component Layout

Figure6:NEMO2EvaluationBoardComponentLayout

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Top Layer (Layer 1)

Figure7:NEMO2EvaluationBoardTopLayer1

Ground Layer (Layer 2)

Figure8:NEMO2EvaluationBoardGroundLayer2

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VDD Layer (Layer 3)

Figure9:NEMO2PowerPlaneLayer3

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Bottom Layer (Layer 4)

Figure10:NEMO2BottomSignalLayer4

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PCB Stack, Materials, Drill & Notes

Figure11:NEMO2EvaluationBoardPCBStackUp

NOTES:

1.) Material:

a. Epoxy glass laminate and prepreg. Type, Standard FR4. Finished external

layer 1 oz copper

b. Finished thickness 0.8 ± 5%mm

2.) Drilling:

a. Diameters in drill table are finished hole sizes, tolerance ± 0.0762mm.

b. Teardrop allowed on entry of via on every trace layer

3.) Final Fabrication:

a. Soldermask primary and secondary side of the board using liquid

photoimagable mask material over bare copper per IPC-SM840. Mask

artworks provided are 1:1. Solder mask color “GREEN”

4.) Copper Finish shall be immersion silver (2 ~ 8 u)

5.) Manufacture board to be in accordance with performance standard IPC-A-

6011/6012 Class 2.

6.) Maximum warp or twist shall not exceed 1%

7.) PCB shall be RoHS and WEE compliance directive 2002/95/EC

8.) Board outline dimension tolerance ± 0.13mm unless otherwise specified.

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Figure12:NEMO2EvaluationBoardDrillChart

NEMO 2 DESIGN INTEGRATION RULES

Nemo2 meets regulatory modular certifications. The use of Nemo2 and integration is

important and shall be used for its intended purposes. The use of Nemo2 and

integration outside of Unigen’s design rules and use void any certifications with the

module or require permissive change and additional testing to meet certifications.

Intended Use

Application

Nemo2 is intended to be used for Bluetooth applications only. Bluetooth applications

may apply to consumer products, mobile, computing, audio applications, and other

various Bluetooth end user applications. The use of Nemo2 outside of Bluetooth

application is strictly prohibited and all Bluetooth and regulatory certifications will be

voided.

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Software and Host

Nemo2 is intended to operate with a host. The host will communicate to the module

via the physical communication interfaces, UART/SDIO, to control the modules RF

operating behavior. The host shall run the Bluetooth Upper software protocol stack

operate Nemo2 in Bluetooth modes only. Nemo2 is not intended to operate without

a host and Bluetooth protocol stack. The Nemo2 software interface is based on the

Bluetooth Host Controller Interface Transport Layer specification (HCI). For more

details on the Bluetooth HCI protocol layer, please see the latest Bluetooth

Specification (3.0+HS), volume 4 and the section pertaining to Host Controller

Interface [Transport Layer]

Figure13:NEMO2BluetoothSoftwareStackArchitecture

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Antenna & External RF Path

Nemo2 is not shipped with an on board antenna and an antenna is not fixed on the

module. It is the integrators responsibility to handle the design of the antenna design of

their product when using Nemo2.

NEMO2 was tested and qualified with a 2.4GHz, external, reverse SMA, di-pole, one-

quarter wave length antenna connected to a reverse SMA RF connectors and a

microstrip transmission line on the Nemo2 evaluation reference board. Any change of

antenna, RF connector or miscrostip transmission line characteristics used other than

the Nemo2 reference evaluation board may require retesting of radiated portion of the

FCC part 15B specification and will require a Class II permissive change.

NEMO2 has a single ended RF pad on the bottom of the module. The pad impedance is

50 ohms. The integrator must take care on using a microstrip transmission line for the

RF signal out. Extra care is needed on the design of the microstrip and must adhere to

Unigen’s design integration rules. The termination of the path can be a matched

antenna (printed or component) or can terminate to a RF connector (U.FL, GSC, SMA,

etc).

Antenna specifications:

 Manufacturer: Pulse

 Part Number: W1030

 Frequency: 2.4GHz – 2.5GHz

 Gain: 2.0dBi

 Impedance: 50Ω

 VSWR: ≤ 2.0

 Polarization: Vertical

 Electrical Length: ¼ wave, di-pole

 Radiation: Omni

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Microstrip Transmission Line Specification

The Nemo2 module requires a Microstrip transmission line on the integrators PCB

motherboard to route the RF path to an antenna or RF connector. The microstrip on

the Nemo2 reference evaluation board was used during testing and certifications.

The integrator shall use the exact Microstrip transmission line on the reference

evaluation board in the integrators product/design. The same Microstrip

transmission line can feed into any RF connector or antenna. However, any change

of antenna, RF connector or miscrostip transmission line characteristics used other

than the Nemo2 reference evaluation board may require retesting of radiated

portion of the FCC part 15B specification and will require a Class II permissive

change. Design files of the Nemo2 reference evaluation board are available in

GERBER format from Unigen.

Microstrip Dimension Details:

Length: 8.20mm

Width: 0.25mm

Impedance: 50 Ohms

Figure14:NEMO2MicrostripDimensionDetails

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Microstrip PCB Board Details:

Figure15:NEMO2EvaluationMicrostripPCBStackUPDetails

Microstrip Ground Reference

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The Microstrip will have a ground reference on the adjacent inner layer and top

(same) layer as the Microstrip. The Nemo2 reference evaluation board has an

adjacent ground plane inner layer below the Microstrip. The top layer has a ground

reference to the Microstrip as well. The spacing between the top ground references

is crucial and should be at least 3x the width of the Microstrip. The Nemo2

Evaluation board uses 1mm spacing from the Microstrip to the top layer ground

reference.

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Figure16:NEMO2MicrostripGroundReference

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A grid of through hole vias are used to join the top layer ground to the adjacent

inner layer ground plane. This is known as “stitching”. The integrator should use as

much stitching as possible.

Figure17:NEMO2GroundingTechnique,GroundStitchingandAdjacentGroundLayer

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External grounding

External grounding and care is the integrators responsibility with the Nemo2 module for

functionality and RF integration with an antenna or antenna connector. A solid ground

reference is needed in particular to the Rf signal path to the terminating component

such as an antenna or antenna connector.

The Nemo2 evaluation board with a SMA connector and the SMA di-pole antenna took

great consideration of the RF path and its reference to ground. See below on the

layout of the top layer where the RF path resides and ground fill as a reference to the

RF signal.

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Figure18:GroundingConsiderations

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RF Shielding

The NEMO2 module is not shipped with an RF shield. In order to comply with

modular approvals, the integrator must shield the circuitry around the NEMO2

module on the integrators board. The shield must be grounded and shall have an

opening for the microstrip transmission line.

NEMO2 has received Limited Modular Approval due to the absence of a

shield and each OEM will be required to have Radiated Emissions

measured to ensure compliance.

There is an outline on the NEMO2 evaluation board for a metal shield. Below are

dimensions of the shield for the NEMO2 evaluation board. The shield is keyed for

placement with the PCB and shield outline also reflecting the keyed holes. The

details are provided in the NEMO2 evaluation board GERBERS. The gap spacing with

the microstrip is also illustrated below.

Figure19:NEMO2EvaluationBoardExampleShield

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Figure20:NEMO2EvaluationBoardTopSoldermaskRFShieldOutline

Figure21:NEMO2EvaluationBoardRFShieldMicrostripgapspacing

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Support Contact

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ForanyinquiriesonthedesignandsupportofNemo2,pleasecontactsales@unigen.com

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Unigen UGWC821R NEMO BLUETOOTH RADIO MODULE User Manual NEMO2 Design Guidelines

Unigen Corporation NEMO BLUETOOTH RADIO MODULE NEMO2 Design Guidelines

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