WiSilica WISE1230 BLE Module User Manual users manual

WiSilica, Inc. BLE Module users manual

users manual

WiSe 1230BLE Module Technical Specification WiSilica Inc WiSe 1230 Hardware and Technical Specification Version (Rev 1.5) Issued: 14/06/2017
WiSe 1230BLE Module Technical Specification WiSilica Inc Table of Contents General Information ............................................................................................................................... 4 Features .............................................................................................................................................. 4 General Description ............................................................................................................................ 4 Block Diagram: ........................................................................................................................................ 4 Application: ............................................................................................................................................. 5 Form factor: ............................................................................................................................................ 5 Hardware Specification: .......................................................................................................................... 5 Antenna ................................................................................................................................................... 5 Pinout and Pin Description ..................................................................................................................... 6 Pinout Diagram ................................................................................................................................... 6 Electrical characteristics.......................................................................................................................... 7 Absolute Maximum Ratings ................................................................................................................ 7 Recommended operating condition ................................................................................................... 7 AIO ...................................................................................................................................................... 7 PWM ....................................................................................................................................................... 7 Current Consumption: ............................................................................................................................ 7 RF Characteristics: ................................................................................................................................... 8 Host details: ............................................................................................................................................ 9 Multisensor ......................................................................................................................................... 9 Smart lighting device........................................................................................................................... 9 Best practices .................................................................................................................................... 10
WiSe 1230BLE Module Technical Specification WiSilica Inc Revision History Rev No Date Notes Rev 1.0 05/01/2017 Draft Release Rev 1.1 07/02/2017 BLE chip partnumber corrected Rev1.2 14/02/2017 Block diagram and External antenna guide included. Rev1.3 23/02/2017 Land Pattern Dimension added. Rev1.4 17/04/2017 PCB Antenna description removed. Rev1.5 14/06/17 Module Host details added.
WiSe 1230BLE Module Technical Specification WiSilica Inc General Information Features  Bluetooth v4.0 specification complaint  Support for Bluetooth 4.1 specification host stack  512KB of Flash memory  12 MHz and 32MHz clock system  PWM/SPI/GPIO/UART/I2C interface  TX output power upto +5dbm  -92dbm BT4.0 RX sensitivity  RSSI Monitoring  5 programmable GPIO’s/ 5 PWM channels  2 AIO channels General Description WiSe 1230 module enables ultra-low-power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards.WiSe 1230 is intended to provide considerably reduced power consumption and cost. Block Diagram: TLSR8269F512AT32 GPIO CRYSTAL 12MHz IO 512KB FLASH PWM I2C DMIC 2.4GHz Radio
WiSe 1230BLE Module Technical Specification WiSilica Inc Application: WiSe 1230 enables connectivity and data transfer to leading smartphone, tablet and personal computing devices including Apple iPhone, iPad, iPod and Mac products and leading Android devices.  Smart mesh light application  Smart home heating and lighting control  Health sensors like blood pressure, thermometer and glucose meter  Beacons  Security  Sensors  Wearable devices. Form factor:  Dimension: 23.45x15mm Hardware Specification: COMPONENTS DESCRIPTION BLE CHIP TLSR8269F512AT32 CRYSTAL 12MHz External antenna. Antenna WiSe1230 Modules has external antenna with UFL connector.The WiSe1230 has been certified with the external antenna only. The external antenna’s directivity determines the required position and orientation of the antenna with respect to the ground plane. We need to make sure the external antenna impedance is close to 50 Ohm to have optimal matching. External antenna’scentreband frequency should be in the range of 2.4 to 2.483 GHz.The nearby materials and nature of the application determine whether you need a directional or omnidirectional antenna. The following are some design guidelines to help ensure antenna performance:  Never place the ground plane or route copper traces directly underneath the antenna portion of the module.  Never place the antenna close to metallic objects.  In the overall design, ensure that wiring and other components are not placed near the antenna.  Do not place the antenna in a metallic or metalized plastic enclosure.
WiSe 1230BLE Module Technical Specification WiSilica Inc  Keep plastic enclosures 1cm or more away from the antenna in any direction.Description Pinout and Pin Description Pinout Diagram PINS NAME FUNCTION COMMENTS 1 GND Ground Ground(Vss) 2 ANA_B1 I/O Programmable I/O or AIO 3 ANA_B0/SWS I/O or AIO Programmable I/O or AIO 4 GP5 I/O or AIO Programmable I/O or AIO 5 TX I/O Programmable I/O 6 RX I/O Programmable I/O 7 PWM1 I/O or AIO Programmable I/O or AIO 8 SPI_CLK I SPI Clock or Programmable I/O 9 DP/IO I/O Programmable I/O 10 DMIC_DI/A0 I/O DMIC data I/P or Programmable I/O 11 DMIC_CLK/A1 I/O DMIC Clk or Programmable I/O 12 GND Ground Ground(Vss) 13 GND Ground Ground(Vss) 14 SWM/A7 I/O Single Wire Master or I/O 15 I2C_SDA I/O I2C Data or Programmable I/O 16 I2C_SCL I/O I2C Clk or Programmable I/O 17 PWM5 I/O Programmable I/O 18 PWM4 I/O Programmable I/O 19 PWM0 I/O Programmable I/O 20 VDD33 Power Power Input(Vdd) 21 GP4/D2 I/O Programmable I/O 22 CSB O SPI select or Programmable I/O
WiSe 1230BLE Module Technical Specification WiSilica Inc 23 SPI_MISO O SPI data output or Programmable I/O 24 SPI_MOSI I SPI data input or Programmable I/O Electrical characteristics Absolute Maximum Ratings Ratings Min Max Storage Temperature -65°C 125°C Supply voltage 2.2V 3.6V Recommended operating condition Item Min Typical Max Operating Temperature -40 - 125°C Supply voltage 2.2V 3.3V 3.6V IO Supply Voltage V - 3.6V AIO Ratings Min Max Input Voltage 0.7 3.3V Output voltage V 3.3V PWM Totally there are 5 PWM channels. PWM Frequency: Target frequency TBD kHz. Maximum voltage for logic low: VIL = 0 V Absolute maximum current sourced: IMAX = mA Absolute maximum voltage level: VMax =3.6V Current Consumption: Mode Total Typical Current at 3V Sleep Mode 15μA RX/TX active ~15mA @ 3V peak current
WiSe 1230BLE Module Technical Specification WiSilica Inc RF Characteristics: Path Description Conditions Min Typ Max Unit Operating Frequency 2402 2480 MHz Maximum output power 7 dBm 2nd harmonic 54 dBuV 3rd harmonic 54 dBuV TX Modulation delta F1 average 225 255 275 kHz Modulation delta F1 / F2 0.8 Modulation delta F2 max 100 % Frequency accuracy -100 25 100 kHz Frequency offset -100 25 100 kHz RX Receiver Sensitivity -92 dBm Receiver Sensitivity (with dirty transmitter) -93 dBm Maximum received signal at 30.8% PER -10 dBm Module Dimension
WiSe 1230BLE Module Technical Specification WiSilica Inc Recommended Land Pattern Dimension:  Dimension: 23.45x15mm  Pitch: 1.5mm  Pad dimension: 0.96x0.96mm  Height:3.4mm(includes shield) Host details: The WiSe1230 module is going to be embedded with Multisensor Multisensor Multisensor is the one which contains PIR (ALS312), LDR (TEMT6000)RTC (HYM8563) and WiSe1230 module. It is intended to be a general purpose remote control that contains PIR, Ambient light sensor, Real time clock. Eventually we can make this an extremely flexible device by combining the PIR and ambient light sensor functions into one, and use the real-time clock to send out time sync packets for the low-power mesh.Also it can be used as a scheduler. Also this device is the 2 x AAA battery powered. Note: The module can be integrated only in the host plattform where it has been tested. Any additional hosts having different function, shape and electrical characteristics should be added with a class 2 permissive change. This implies additional testing of the radiated emissions within the new host.
WiSe 1230BLE Module Technical Specification WiSilica Inc Best practices When designing with WiSe1230 modules, please pay attention to the following recommendations  While integrating module make sure all the module pads are soldered properly.  The module's voltage requirement is 2.5 to 3.6V, if the power supply is over 3.3V, please use a voltage regulator.  If the communicating host uses a different voltage then the BLE module, please make sure that the voltage matches on the communication ports.  The external antenna needs to be connected to the module.  For best wireless signals, please avoid packing the antenna close to metal parts or case.
Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module isintegrated" hasto be labelled with an auxilliary lable stating the FCC IDofthe RF Module, such as "Contains FCC ID: 2AG4NWISE1230" "This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1)this devicemay not cause harmful interference, and (2)this devicemust accept any interference received, including interference thatmay cause undesired operation." NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/TV technician for help. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module'sintentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101.

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