Wistron NeWeb IMS2 LTE Cat-M1 Module User Manual
Wistron NeWeb Corporation LTE Cat-M1 Module
User Manual
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| Document ID | 3561706 |
| Application ID | hN6FAWogQEh7EyBGfG7QTg== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 137.58kB (1719702 bits) |
| Date Submitted | 2017-09-14 00:00:00 |
| Date Available | 2017-09-14 00:00:00 |
| Creation Date | 2017-09-13 15:19:15 |
| Producing Software | Microsoft® Office Word 2007 |
| Document Lastmod | 2017-09-13 15:19:15 |
| Document Title | User Manual |
| Document Creator | Microsoft® Office Word 2007 |
| Document Author: | 09038843 |
IMS2 module user manual Project Name: IMS2 Author: Wistron NeWeb Corporation Revision: 1.1 Revision Date: 2017/09/13 □ Normal □ Internal Use Confidential □ Restricted Confidential 1 / 26 Product datasheet Contact Information Technical Support Website Company Website https://SupportIoT.wnc.com.tw www.wnc.com.tw Revision History Rev. # Author Summary of Changes Date 1.0 WNC First release 2017/07/14 1.1 WNC Add FCC statement and manual information to the end user in the user manual 2017/09/13 □ Normal □ Internal Use Confidential □ Restricted Confidential 2 / 29 Product datasheet © Wistron NeWeb Corporation THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC. LIMITATION OF LIABILITY THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT. FCC Statement Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:NKRIMS2”. Any similar wording that expresses the same meaning may be used. Manual Information to the End User The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. □ Normal □ Internal Use Confidential □ Restricted Confidential 3 / 29 Product datasheet Contents Contact Information .......................................................................................................................... 2 Revision History ............................................................................................................................... 2 Product Features ...................................................................................................................... 6 1.1 Features Description ........................................................................................................... 6 Pin Definitions ......................................................................................................................... 8 2.1 LGA Module Pin Diagram .................................................................................................. 8 2.2 LGA Module Pin Definitions .............................................................................................. 8 Electrical Specifications......................................................................................................... 12 3.1 Electrical Operating Conditions ........................................................................................ 12 3.1.1 Detailed Information .............................................................................................. 12 3.1.2 Power Tree ............................................................................................................. 12 3.2 Control Interfaces .............................................................................................................. 13 3.2.1 Power-on Signal (TBD) ......................................................................................... 13 3.2.2 Wake-up Interface (TBD) ...................................................................................... 13 3.2.3 Reset Signal............................................................................................................ 14 3.3 UART Interface................................................................................................................. 14 3.4 UIM Interface .................................................................................................................... 15 3.5 I/O Characteristics............................................................................................................. 15 3.6 JTAG Interface .................................................................................................................. 17 3.7 Power Consumption .......................................................................................................... 17 3.8 RF Performance ................................................................................................................ 18 3.8.1 RF Pad Design ....................................................................................................... 18 3.8.2 RF Matching Guide ................................................................................................ 21 3.8.3 Interference and Sensitivity.................................................................................... 21 3.8.4 Band Support.......................................................................................................... 22 3.8.5 Bandwidth Support................................................................................................. 22 3.8.6 RF Transmission Specifications ............................................................................. 22 3.8.7 RF Receiver Specifications .................................................................................... 23 3.9 Temperature ...................................................................................................................... 23 3.10 LTE Power Saving Mode ................................................................................................ 23 3.11 Serial Number and IMEI ................................................................................................. 23 Mechanical Information ......................................................................................................... 25 4.1 Physical Dimensions ......................................................................................................... 25 4.2 Pin Dimensions ................................................................................................................. 25 4.3 Marking Information ......................................................................................................... 27 Packing Information............................................................................................................... 28 5.1 Packing Information .......................................................................................................... 28 5.2 Storage Conditions ............................................................................................................ 28 PCB Mounting Guidelines ..................................................................................................... 28 6.1 Mounting Considerations .................................................................................................. 28 Regulatory and Industry Approval ......................................................................................... 28 7.1 Certification Testing ......................................................................................................... 28 □ Normal □ Internal Use Confidential □ Restricted Confidential 4 / 29 Product datasheet 7.2 GP Compliance ................................................................................................................. 28 Initialisms ........................................................................................................................................ 29 □ Normal □ Internal Use Confidential □ Restricted Confidential 5 / 29 1 Product Features 1.1 Features Description The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and AT&T Wireless LTE Cat. M1 UE specifications. The architecture block diagram of the IMS2 is presented in Figure 1-1 below. Figure 1-1. IMS2 block diagram Table 1-1. General features of the IMS2 • JTAG • USIM General interfaces • GPIO • UART • LTE Band 2 Supported frequency bands • LTE Band 4 • LTE Band 12 Operating voltage • VCC (range from 3.3 V to 4.2 V) • LGA module Packaging • 104 pads (21.5 mm × 16.5 mm × 2.3 mm) • RoHS compliant • 3GPP compliant: –20 °C to +60 °C (ambient) Operating temperature • Operational: –40 °C to +85 °C (functional) □ Normal □ Internal Use Confidential □ Restricted Confidential 6 / 26 Product datasheet Table 1-2. LTE-related features of the IMS2 Standards • 3GPP E-UTRA Release 13 compliance • One UL and one DL transceiver • Supports HD-FDD Duplexing • Category M1 UE • Normal cyclic prefix • Supports MPDCCH • Modulation - DL: QPSK, 16QAM PHY - UL: QPSK, 16QAM • All coding schemes corresponding to modulations • All channel coding (turbo-coding with inter-leaver, tail biting convolutional coding, block and repetition coding) and CRC lengths • All power control schemes and DL power allocation schemes • UEPCOP (from 3GPP Release 12) Power Saving Mode • Random access procedure in normal sub-frames • Scheduling request, buffer status reporting, and power headroom reporting MAC • Discontinuous reception (DRX, eDRX) with long and short cycles • Fast scanning • IPv4, IPv6 RLC • ARQ modes: UM, AM, and TM • Ciphering and deciphering: NULL, AES, SNOW 3G PDCP • Integrity and protection: AES, SNOW 3G • MIB and new SIB1bis RRC • Supports up to eight data radio bearers • NAS NAS and above • SMS over SG • LWM2M client □ Normal □ Internal Use Confidential □ Restricted Confidential 7 / 29 Product datasheet Pin Definitions 2.1 LGA Module Pin Diagram The IMS2 LGA module pin layout is illustrated below. Figure 2-1. IMS2 LGA module pin layout 2.2 LGA Module Pin Definitions The signals and all the related details are listed in the below table. Table 2-1. IMS2 module pin definition Pin No. Name Description GND Ground GND Ground NC Not connected 10 GND Ground 11 GND Ground 12 GND Ground 13 GND Ground 14 GND Ground □ Normal □ Internal Use Confidential □ Restricted Confidential 8 / 29 Product datasheet 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 80 81 82 83 84 85 Main antenna GND GND GND GND GND NC GND GND GND GND GND NC GND GND GND Power Power Power Power Power Power NC GND GND GPIO46 GPIO47 GPIO48 GPIO49 GND GND GPIO01 GPIO02 UART1_CTS UART1_RTS UART1_Rx UART1_Tx GND GND Main antenna port Ground Ground Ground Ground Ground Not connected Ground Ground Ground Ground Ground Not connected Ground Ground Ground Power Power Power Power Power Power Not connected Ground Ground General purpose input/output General purpose input/output General purpose input/output General purpose input/output Ground Ground General purpose input/output General purpose input/output Clear to send for UART 1 Request to send for UART 1 Receive for UART 1 Transmit for UART 1 Ground Ground □ Normal □ Internal Use Confidential □ Restricted Confidential 9 / 29 Product datasheet 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 201 202 203 NC NC NC GND GND GND UART0_CTS UART0_TX UART2_TX UART0_RX UART2_RX UART0_RTS UART2_RTS UART2_CTS FFF/FFH mode switch RFDATA5 RFDATA6 RFDATA7 ADC ADC GPIO08 UIM_VCC UIM DATA UIM CLK UIM RESET UIM DETECT NC GND GND WWAN_STATE Power on WAKEUP_OUT WAKEUP_IN RESET VREF JTAG TCK JTAG TDI JTAG TDO Not connected Not connected Not connected Ground Ground Ground Clear to send for UART 0 Transmit for UART 0 Transmit for UART 2 Receive for UART 0 Receive for UART 2 Request to send for UART 0 Request to send for UART 2 Clear to send for UART 2 FFF/FFH mode switch; FFF is normal mode; FFH is for design mode. RF control interface RF control interface RF control interface Analog-to-digital converter Analog-to-digital converter General purpose input/output SIM card power SIM card data line SIM card clock line SIM card reset line SIM card detect line Not connected Ground Ground Wireless WAN radio state Power on the module Module wakes up host. Host wakes up module. Main reset line Reference logic voltage (1.8 V voltage) JTAG TCK JTAG TDI JTAG TDO □ Normal □ Internal Use Confidential □ Restricted Confidential 10 / 29 Product datasheet 204 205 206 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 JTAG_TMS JTAG_SRST_N NC GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND JTAG_TMS JTAG_SRST_N Not connected Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground □ Normal □ Internal Use Confidential □ Restricted Confidential 11 / 29 Product datasheet Electrical Specifications 3.1 Electrical Operating Conditions 3.1.1 Detailed Information Table 3-1. Electrical operating conditions for the IMS2. Direction Minimum Typical Maximum VCC In 3.3 V 3.8 V 4.2 V IMS2 includes an integrated Power Manager enabling single and direct voltage supply from the battery and reducing the overall bill of materials. Layout Suggestion: Each power trace should possess sufficient line width to withstand its respective current listed in Table 3-2 below. Table 3-2. Power supply reference currency Net Name Current Value VCC(1–6) total TBD UIM_VCC TBD VREF TBD Note: Routing under a 1 A design is desired as it will result in more stable power. 3.1.2 Power Tree Figure 3-1 provides a representation of the power tree of the IMS2 LGA module Figure 3-1. IMS2 power tree □ Normal □ Internal Use Confidential □ Restricted Confidential 12 / 29 Product datasheet 3.2 Control Interfaces This section describes the power-on/off, wake-up, and reset interface for controlling the module. 3.2.1 Power-on Signal (TBD) The POWER_ON signal is an active low input signal used to enable or disable the module. Do not toggle the PERST# pin during power-on. This signal has the highest priority among the wakeup, the alarm signal, and the digital control pins. There are three possible states of the module: • Module Off: VCC is not present. • Module Enabled: VCC is supplied, and the module is enabled. • Module Disabled: VCC is supplied, and the module is disabled. The state transitions are defined as follows: • When voltage is applied to VCC, the module shall enter the Module Disabled state. An input to the POWER_ON pin shall trigger the transition from the Module Disabled to the Module Enabled state. See Figure 6; a low pulse (tlow > 0s) on the POWER_ON pad will enable the module after VCC is applied. 3.2.2 Wake-up Interface (TBD) In applications where power consumption is a major factor in performance metrics (such as battery-operated sensors that are based on an IOT/M2M modem solution and also include a third-party host), definitions are necessary for a simple interface that will enable both the modem and the host to enter low-power states whenever possible and the other side to wake it up once required. For example, if the host has no data to transmit or any other tasks, it may enter a low-power state according to its own capabilities and configurations. If during that period the host is in a low-power state and the modem suddenly receives data, it must wake-up the host. A similar requirement exists in the reverse case. For example, if the modem is in a low-power state and suddenly the host must transmit data, it must be able to wakeup the modem. The interface consists of two signals: One is triggered by the host and received by the modem; the other is triggered by the modem and received by the host. Each side can wake the other by toggling a wakeup signal high and enabling the □ Normal □ Internal Use Confidential □ Restricted Confidential 13 / 29 Product datasheet other side to activate sleep mode when not needed by toggling it low. • “WAKEUP_IN” (Host: Output, Modem: Input): • LOW: SoC does not require the MODEM (allowing it to sleep). • HIGH: SoC requires the MODEM or acknowledges it is ready following a wakeup request from the MODEM. • “WAKEUP_OUT” (Host: Input, Modem: Output): • LOW: The MODEM does not require the Host (allowing it to sleep). • HIGH: The MODEM requires the Host or acknowledges it is ready following a wakeup request from the SoC. When the IMS2 module functions as a modem, keep WAKEUP_IN high before the system boot process is complete. After the system boot, maintain WAKEUP_IN in a low state. The WAKEUP_IN and WAKEUP_OUT operation in host mode will be discussed according to product specifications. 3.2.3 Reset Signal The Reset Signal is a hardware reset signal to control the system reset directly. The user can connect it to a key or a control signal. A low pulse after power on will reset the module. 3.3 UART Interface There are three UART interfaces; these interfaces are 4 bit for high-speed data transfer, and the UART definitions of IMS2 are shown in Figure 3-2. 1. UART0 for data 2. UART1 for debugging the DM tool and software upgrade 3. UART2 for the console Figure 3-2. UART connection (example) □ Normal □ Internal Use Confidential □ Restricted Confidential 14 / 29 Product datasheet 3.4 UIM Interface IMS2 modules provide a UIM_DETECT input pin for UIM connectors to detect a UIM card. When a UIM card is present, UIM_DETECT should be high (1.8 V). If the UIM card is absent, UIM_DETECT should be low. This is required to pull UIM_DETECT to VREF with a 470 kΩ resistor. A 0.1 μF and a 33 pF capacitor are recommended to place between UIM_VCC and Ground in parallel. We recommend placing a 33 pF capacitor between UIM_RESET, UIM_CLK, and UIM_DATA and Ground in parallel. (Refer to Figure 5.) An electrostatic discharge (ESD) protection circuit is also recommended to place near the UIM socket as close as possible, and the Ground pin of the ESD protection component must be well connected to the Ground plane. The following figure illustrates an example UIM card circuit. The default configuration is active high. Figure 3-3. Example UIM card circuit 3.5 I/O Characteristics The voltage and current characteristics of the various IO pads of the IMS2 versus IO bank supply voltage are illustrated in Table 3-3 below. Table 3-3. DC characteristics for digital IOs, voltage 1.8 V - BIDIR and IN types Drive Parameter Min. Nom. Max. Strength VIL VSS 0.3 × PVDD_1V8 Input low voltage VIH 0.7 × PVDD_1V8 PVDD_1V8 Input high voltage □ Normal □ Internal Use Confidential □ Restricted Confidential Unit 15 / 29 Product datasheet VOL Output low voltage VOH Output high voltage IRPU Input pull-up resistor current RPU Input pull-up resistance IRPD Input pull-down resistor current RPD Input pull-down resistance VH Input hysteresis IPAD Input leakage current, nontolerant IOZ Off-state leakage current IOL Sink current at VOL (max) IOH Source current at VOH (max) VSS 0.2 × PVDD_1V8 0.8 × PVDD_1V8 PVDD_1V8 15 μA 32.4 15 μA 32.4 0.1 × PVDD_1V8 kΩ –1 2 mA 4 mA 8 mA 12 mA 2 mA 4 mA 8 mA kΩ μA μA 1.11 2.25 4.48 6.72 1.1 2.2 4.4 12 mA □ Normal □ Internal Use Confidential □ Restricted Confidential mA mA mA mA mA mA mA 16 / 29 Product datasheet 3.6 JTAG Interface The IMS2 series contains one JTAG interface; leave JTAG pins floating if they are not used. Figure 3-4. JTAG schematic 3.7 Power Consumption This section describes the typical power consumption of the IMS2 (for reference). Table 3-4. LTE power consumption Working Mode Airplane mode Conditions Result Only the module; no other devices TBD TBD TBD Power saving mode TBD TBD LTE Band2 working mode TBD LTE Band4 working mode TBD LTE Band12 working mode TBD Powering on Conditions Peak power consumption Power consumption peak when the module is powering on □ Normal □ Internal Use Confidential □ Restricted Confidential TBD TBD TBD TBD TBD Result TBD 17 / 29 Product datasheet Power off Conditions Result Power off consumption The module is powered off. TBD 3.8 RF Performance Each IMS2 module has only one RF pad; developers must connect it via 50 Ω traces to the main board. Main antenna pad (Pin15) – Primary RX/TX path 3.8.1 RF Pad Design We recommended that a ground not be present under the surface of the RF pads in the layout. Details are included below. Layer2 has the same exclusion area as Layer1. Figure 3-5. Sample RF pad layout □ Normal □ Internal Use Confidential □ Restricted Confidential 18 / 29 Product datasheet The RF trace between RF pads and antenna should as shorter as possible with 50ohm characteristic impedance. The characteristic impedance depends on the dielectric of PCB, the track width and the ground plane spacing. Microstrip type is required. The detail simulation as below. □ Normal □ Internal Use Confidential □ Restricted Confidential 19 / 29 Product datasheet The antenna should be 50ohm characteristic impedance with the return loss of better than -10dB at the operation band. The antenna gain would affect the radiated power and regulator test result. □ Normal □ Internal Use Confidential □ Restricted Confidential 20 / 29 Product datasheet 3.8.2 RF Matching Guide 1. Reserve the matching circuit as depicted in the topological structure below. 2. The matching circuit should be as close to the module as possible. The impedance (S11) should be close to 50 Ω, VSWR < 1.5. Primary Antenna Antenna matching RF connector Pin15 RF_1 IMS2 module Figure 3-6. RF matching guide 3.8.3 Interference and Sensitivity This section includes tips to help developers identify interferences that may affect the IMS2 module when used in systems. Interference from other wireless devices – Harmonics, inter-modulated signals generated from wireless devices within the RX ranges of the modules may result in degraded RX performance. – We highly recommend checking the RX performance of entire systems within the shielding environment. Interference from the host interface – High-speed signal-switching elements in systems can easily couple noise into the module (ex.: DDR memory, LCD modules, DC-DC converters, PCM signals). Methods to avoid sources of interference – Antenna location is important; we recommend directing the antenna away from high-speed switching signals. Furthermore, the trace from the module to the antenna should be as short as possible and must be shielded by complete grounding. – The IMS2 module is well shielded; high-speed elements (Ex.: DDR memory, LCD modules, DC-to-DC converters, PCM signals) on a system should have shielding reserved during the early stages of development. □ Normal □ Internal Use Confidential □ Restricted Confidential 21 / 29 Product datasheet 3.8.4 Band Support Table 3-5. Band support Band Uplink (MHz) Downlink (MHz) LTE Band 2 1,850–1,910 1,930–1,990 LTE Band 4 1,710–1,755 2,110–2,155 LTE Band 12 699–716 729–746 3.8.5 Bandwidth Support Table 3-6. Bandwidth support Bandwidth Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz LTE Band 2 LTE Band 4 LTE Band 12 Note: The IMS2 supports 1.4 MHz and 3 MHz (not default settings). 3.8.6 RF Transmission Specifications Table 3-7. Conductive Tx output power Band Items Parameter Unit Min. Typ. Max. LTE Band 2 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 23 25.7 LTE Band 4 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 23 25.7 LTE Band 12 Max. TX Power 10 MHz 1 RBs/QPSK dBm 20.3 23 25.7 Notes: 1.The RF transmission specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. □ Normal □ Internal Use Confidential □ Restricted Confidential 22 / 29 Product datasheet 3.8.7 RF Receiver Specifications Table 3-7. Conductive Rx sensitivity-3GPP Band Items Parameter Unit Min. Hz wit h4 RB Typ. Max. –99.5 LTE Band 4 RX Sensitivity 5 MHz with 4 RBs dBm –101.5 LTE Band 12 RX Sensitivity 5 MHz with 4 RBs dBm –98.5 Notes: 1. The RF receiver specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. 3.9 Temperature • 3GPP compliance: –20 °C to +60 °C (ambient) • Functional: –40 °C to +85 °C • Storage: –40 °C to +85 °C 3.10 LTE Power Saving Mode Note: Details will be provided in a future revision of this document. 3.11 Serial Number and IMEI Serial number and IMEI data can be written to the module only once; these two data □ Normal □ Internal Use Confidential □ Restricted Confidential 23 / 29 Product datasheet points cannot be rewritten on the SQN3330 platform. □ Normal □ Internal Use Confidential □ Restricted Confidential 24 / 29 Product datasheet Mechanical Information 4.1 Physical Dimensions Device dimensions illustrated in Figure 4-1 and Figure 4-2 below. Figure 4-1. Top view Figure 4-2. Right view 4.2 Pin Dimensions The dimensions are illustrated in Figure 4-3, Figure 4-4, and Figure 4-5 below. Figure 4-3. PIN dimensions (bottom view) □ Normal □ Internal Use Confidential □ Restricted Confidential 25 / 29 Product datasheet Figure 4-4. PIN dimensions Figure 4-5. PIN dimensions □ Normal □ Internal Use Confidential □ Restricted Confidential 26 / 29 Product datasheet 4.3 Marking Information Note: Details will be provided in a future version of this document. □ Normal □ Internal Use Confidential □ Restricted Confidential 27 / 29 Product datasheet Packing Information 5.1 Packing Information The module is delivered in tape-and-reel based on MPQ. Note: Module packing details will be provided in a future revision of this document. 5.2 Storage Conditions Note: Details will be provided in a future revision of this document. PCB Mounting Guidelines 6.1 Mounting Considerations This section details the recommended reflow profile when the module is mounted onto other boards. Note: Details will be provided in a future revision of this document. Regulatory and Industry Approval 7.1 Certification Testing PTCRB, FCC, and AT&T TA 7.2 GP Compliance RoHS (2011/65/EU) □ Normal □ Internal Use Confidential □ Restricted Confidential 28 / 29 Product datasheet Initialisms Initialisms and Definitions Initialism Definition AC Alternating Current DC Direct Current ETSI European Telecommunications Standards Institute GND Ground GPIO General Purpose Input Output I/O Input/Output IoT Internet of Things I2C Inter-Integrated Circuit LGA Land Grid Array LTE Long Term Evolution N/A Not/Applicable OS Operating System PIN Personal Identification Number SIM Subscriber Identity Module SPI Serial Peripheral Interface UART Universal Asynchronous Receiver-Transmitter UIM User Identity Module USB Universal Serial Bus Vref Voltage reference WNC Wistron NeWeb Corporation □ Normal □ Internal Use Confidential □ Restricted Confidential 29 / 29
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