Wistron NeWeb UMC-6270Q module User Manual HiLo3G technical specification

Wistron NeWeb Corporation module HiLo3G technical specification

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UMC 6270Q User Manual

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Product specification 1 Wistron NeWeb Corp. CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION. UMC-6270QV User Guide

Product specification 2 CONTENTS CONTENTS .......................................................................................................................................................................... 2 1. INTRODUCTION ...................................................................................................................................................... 3 1.1 PRODUCT CONCEPT ........................................................................................................................................ 3 1.2 STANDARDS ....................................................................................................................................................... 3 1.3 TERMS AND ABBREVIATION ......................................................................................................................... 4 1.4 CONVENTIONS ................................................................................................................................................... 4 1.5 PRODUCT FEATURES OVERVIEW ............................................................................................................... 5 2. BLOCK DIAGRAM & PIN ASSIGNMENT ........................................................................................................... 7 3. RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14 3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14 3.1.1 Air interfaces ............................................................................................................................................. 14 3.2 RF PERFORMANCE ......................................................................................................................................... 14 3.3 TRANSMITTER POWER CLASS ................................................................................................................... 14 4. OPERATING CONDITIONS ................................................................................................................................ 15 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15 4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16 5. CURRENT CONSUMPTION ................................................................................................................................ 17 6. APPLCATION DESIGN NOTES ......................................................................................................................... 18 6.1 LAYOUT NOTES .................................................................................................................................. 18 7. MECHANICAL REQUIREMENTS ...................................................................................................................... 20 7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20 8. CERTIFICATION REQUIREMENTS ................................................................................................................ 22 8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22 8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22 8.3 FCC WARNING STATEMENT ........................................................................................................................ 22 Revision history Revision Date Description V1.0 April 7 2014 Initial release V2.0 May 13 2014 Modify recommended operating condition

Product specification 3 1. INTRODUCTION This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect the device application and the air interface. Two versions of Small Form Factor (SFF) module are described in this specification document as follows:  UMC-6270QV - HSDPA 1.1 PRODUCT CONCEPT The SFF module is one of the smallest available WCDMA HSDPA of the market. The target application is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management), tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost, In addition to its size it has the following outstanding characteristics:  Minimum low power consumption in idle mode: 1.4mA  High input voltage range: 3.4 V to 4.2 V  USB High Speed  Digital Audio PCM  Full set of AT commands as well as analogue and Digital audio interface. In addition to the module, a complete development kit can be provided for customers. 1.2 STANDARDS This product, together with its evaluation board, is in compliance with the directives and standards listed below: Directives FCC RF : FCC Part 22H (850 Band ) FCC Part 24E (for 1900 Band) FCC Part 22 Subpart H: Cellular Radiotelephone Service; Subpart I: Offshore Radiotelephone Service; FCC Part 24 E: Personal Communications Service; Subpart E: Broadband PCS. EMI: FCC Part 15B Subpart B - Radio frequency devices subpart B – Unintentional Radiators SAR(MPE) : OET65C

Product specification 4 1.3 TERMS AND ABBREVIATION ADC Analog to Digital Converter CODEC Coder-Decoder CLIP Calling Line Identification Presentation COLP Connected Line Identification Presentation CLIR Calling Line Identification Restriction COLR Connected Line Identification Restriction CTS Clear To Send CSD Circuit Switched Data CS Codec Scheme DCS Digital Communications System DSR Data Set Ready DTR Data Terminal Ready ENS Enhanced network selection EONS Enhanced operator name string ESD Electrostatic Discharge ETS European Telecommunication Standard FAX Facsimile HSCSD High Speed Circuit Switched Data HSDPA High Speed Downlink Packet Access IC Integrated Circuit IEEE Institute of Electrical and Electronics Engineers I/O Input / Output ISO International Standards Organization ITU International Telecommunication Union JTAG Joint Test Action Group Kbps kilobit per second LCD Liquid Crystal Display LED Light Emitting Diode Mbps Megabit per second PBCCH Packet Broadcast Channel PCB Printed Circuit Board PCM Pulse Code Modulation PCS Personal Communication System PWM Pulse Width Modulation RAM Random Access Memory RF Radio Frequency RI Ring Indication RMS Root Mean Square RTS Ready To Send RX Reception SIM Subscriber Identification Module SMS Short Message Service TBC To Be Confirmed TBD To Be Defined TX Transmission UART Universal Asynchronous Receiver and Transmitter UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module USSD Unstructured Supplementary Service Data 1.4 CONVENTIONS Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls the module device by sending AT commands via its serial interface. DCE (data communication equipment) indicates the module device.

Product specification 5 1.5 PRODUCT FEATURES OVERVIEW Temperature range Normal range: -25°C to +85°C Storage: -40°C to +85°C Weight 6 g (typ.) ESD ESD protection >= 2 kV Physical dimensions 22.1 x 25.1 x 2.65 mm (typical) Connection 141 pin LGA type Power supply 3.4V to 4.2V range, 3.8V nominal Power consumption* Off mode: 50 µA typical Registered idle mode:  WCDMA: 1.3 mA (DRX=9) Peak Current  WCDMA: up to 700 mA Antenna /RF interface Both GPS and transmitter/receiver RF are LGA Pad. Frequency bands WNC module supports UMTS B2 /B5 Transmit power Class 3 for UMTS 850/1900 Supported SIM cards 3V and 1.8V SIM cards SIM slot Signals for the management of the SIM card are provided on LGA pads. PWM Signal for LED, vibrating device and Buzzer management is provided on the PWM pin Digital audio link A digital audio interface PCM bus is provided. Master mode with 16 bits and a frequency of 2048 KHz. Data/command multiplexing Software management of data/command multiplexing on the serial link UART. USB Supports USB High speed 480Mbps and full speed 12Mbps, with 3 logical Channels. Battery charging is achieved through USB USIM Use USIM controller to achieve USIM connection Module Hardware Configuration The SFF LGA module will support the QSC6270/6055 chipset with the configuration described below. For UMC-6270QV module: Key Features • Compliant with 3GPP Rel’5 for WCDMA and HSDPA • Max. Data Rate: 384Kbps uplink, 384Kbps downlink with WCDMA Rel’99 and 3.6Mbps downlink with HSDPA • Support OS: Brew Mobile Platform • ARM9 operating at 230Mhz maximum frequency * The power consumption is highly dependent on the customer’s product design and the module environment.

Product specification 6 • Data interface: USB2.0 Host High Speed • Form Factor: LGA module Specification • Communication Interface: (I2C x1/UART x1/USB2.0 x1/SPI x1/ SDIO x2) • Support HSDPA (DL 3.6Mbps/UL 384Kbps) • Supported SIM cards (3V and 1.8V SIM cards) • USIM interface • General purpose I/O pins ( x25) • Audio Interface (PCM/ I2S) • MCP (DDR 512Mb + 1Gb NAND) • Support GPS • RF interface: 2 RF pads for WCDMA TX/RX, and GPS. WCDMA/HSDPA Support Bands • Band 2 and Band 5 WCDMA Power Class • Class3 (24dBm +1/-3 dB)

Product specification 7 2. BLOCK DIAGRAM & PIN ASSIGNMENT Pin Definition 4 This section is intended to capture the final LGA pin out for the SFF Module. The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1. For UMC-6270QV module:

Product specification 8 Figure 2-1: UMC-6270QV module Pin number Category pin name Pad group Pad type Description Driving capacity 1 RF WCDMA_ANT AI,AO WCDMA antenna signal 2 GND GND GND

Product specification 9 3 GPIO GPIO9 1.8V I/O, PD Configurable I/O 1-8mA 4 GPIO GPIO2 1.8V I/O, PD Configurable I/O 1-8mA 5 GPIO GPIO5 1.8V I/O, PD Configurable I/O 1-8mA 6 GPIO GPIO8 1.8V I/O, PD Configurable I/O 1-8mA 7 I2C I2C_SCL 1.8V I/O I2C clock 8 PCM PCM_BCLK 1.8V DO Clock for the PCM interface 9 PCM PCM_SYNC 1.8V DO PCM interface sync 10 PCM PCM_DIN 1.8V DI PCM I/F data in (if UMC-6270QV master) 11 PCM PCM_DOUT 1.8V DO PCM I/F data out (if UMC-6270QV master) 12 GPS_LNA_EN 1.8V I/O, PU Configurable I/O 1-8mA 13 SPI SPI_CS_N 1.8V DO Serial peripheral interface chip-select 14 SPI SPI_CLK 1.8V DO Serial peripheral interface clock 15 GND GND GND 16 GND GND GND 17 RF GPS_ANT AI GPS antenna signal 18 GND GND GND 19 GPIO GPIO21 1.8V I/O, PU Configurable I/O 20 GND GND GND 21 GPIO GPIO20 1.8V I/O, PU Configurable I/O 1-8mA 22 GPIO GPIO16 1.8V I/O, PU Configurable I/O 1-8mA 23 GPIO GPIO17 1.8V I/O, PU Configurable I/O 1-8mA 24 SDIO2 SDCC2_DATA2 2.6V I/O SDIO2 data bit 2 2-16mA 25 SDIO2 SDCC2_DATA3 2.6V I/O SDIO2 data bit 3 2-16mA 26 SDIO1 SDCC1_CMD 2.6V I/O SDIO1 command bit 2-16mA 27 SDIO1 SDCC1_DATA3 2.6V I/O SDIO1 data bit 3 2-16mA 28 SDIO1 SDCC1_DATA2 2.6V I/O SDIO1 data bit 2 2-16mA 29 GPIO GPIO10 1.8V I/O, PU Configurable I/O 1-8mA 30 GND GND GND 31 UICC USIM_CLK 1.8V/2.85V DO USIM clock 32 USB USB_ID AI High-speed USB identification line 33 power input/output VBAT_BB 3.7V~4.2V P Input power for BB section, could connect this pin with VBAT_RF

Product specification 10 34 JTAG JTAG_TMS 1.8V DI, PU JTAG test mode select 35 JTAG JTAG_RTCK 1.8V DO JTAG return clock 36 JTAG JTAG_TCK 1.8V DI, PU JTAG clock input 37 UICC USIM_DAT 1.8V/2.85V I/O USIM data 38 power input USB_VBUS P External supply voltage; connect directly to the external USB power supplier 39 power output USIM_VREG 1.8V/2.85V P Output of the linear regulators 150mA 40 GND GND GND 41 GND GND GND 42 power input VCHG P External supply voltage; connect both pins directly to the external power supply (such as a wall charger). 43 power input VCHG P External supply voltage; connect both pins directly to the external power supply (such as a wall charger). 44 power output VREG_MSME 1.8V 300mA Output of the linear regulators 45 GND GND GND 46 power input/output VCOIN P Used as an analog input from the 3 V coin cell for SMPL, RTC,and crystal oscillator backup; a capacitor (rather than a coin cell) can be used if only SMPL is supported 47 GND GND GND 48 ADC in MPP3 AI,AO, DI, DO multipurpose pin 49 other PON_REST_N 1.8V DO Connected internally to RESIN_N; logic low causes the baseband circuits to reset. 50 GND GND GND 51 ADC in BATT_THERM AI connect to battery package thermal pin 52 GND GND GND 53 microphone MIC_P AI Microphone #1 input (+) 54 microphone MIC_M AI Microphone #1 input (-) 55 GND GND GND 56 GPIO GPIO4 1.8V I/O, PD Configurable I/O 1-8mA 57 GPIO GPIO6 1.8V I/O, PU Configurable I/O 1-8mA

Product specification 11 58 GPIO GPIO11 1.8V I/O, PD Configurable I/O 1-8mA 59 GPIO GPIO24 1.8V I/O, PD Configurable I/O 1-8mA 60 GND GND GND 61 GPIO GPIO18 1.8V I/O, PD Configurable I/O 1-8mA 62 GPIO GPIO15 1.8V I/O, PD Configurable I/O 1-8mA 63 GPIO GPIO7 1.8V I/O, PD Configurable I/O 1-8mA 64 GPIO GPIO1 1.8V I/O, PD Configurable I/O 1-8mA 65 I2C I2C_SDA 1.8V I/O I2C data 66 UART UART_TX 1.8V DO High-speed UART transmit data output 67 UART UART_RFR 1.8V DO High-speed UART ready for receive signal 68 UART UART_RX 1.8V DI High-speed UART receive data input 69 UART UART_CTS 1.8V DI High-speed UART clear to send signal 70 power input VBAT_RF 3.7V~4.2V P Input power for RF section, could connect this pin with VBAT_BB 71 power input VBAT_RF 3.7V~4.2V P Input power for RF section, could connect this pin with VBAT_BB 72 SPI SPI_MOSI 1.8V DO SPI (master only) master out/slave in data 73 SPI SPI_MISO 1.8V DI SPI (master only) master in/slave out data 74 GND GND GND 75 GND GND GND 76 GND GND GND 77 GND GND GND 78 GND GND GND 79 GPIO GPIO22 1.8V I/O, PU Configurable I/O 80 GPIO GPIO23 1.8V I/O, PU Configurable I/O 1-8mA 81 GPIO GPIO19 1.8V I/O, PU Configurable I/O 1-8mA 82 GPIO GPIO14 1.8V I/O, PU Configurable I/O 1-8mA 83 SDIO2 SDCC2_DATA0 2.6V I/O SDIO2 data bit 0 2-16mA 84 SDIO2 SDCC2_CMD 2.6V I/O SDIO2 command bit 2-16mA 85 SDIO2 SDCC2_DATA1 2.6V I/O SDIO2 data bit 1 2-16mA 86 SDIO2 SDCC2_CLK 2.6V DO Output clock for SDIO2 device 2-16mA 87 SDIO1 SDCC1_DATA0 2.6V I/O SDIO1 data bit 0 2-16mA

Product specification 12 88 SDIO1 SDCC1_DATA1 2.6V I/O SDIO1 data bit 1 2-16mA 89 SDIO1 SDCC1_CLK 2.6V DO Output clock for SDIO1 device 2-16mA 90 GPIO GPIO3 1.8V I/O, PU Configurable I/O 1-8mA 91 GND GND GND 92 WLAN_PWR_DOWN 2.6V I/O, PU Configurable I/O 2-16mA 93 UICC USIM_RST 1.8V/2.85V DO USIM reset 94 JTAG JTAG_TDO 1.8V Z JTAG test data output 95 JTAG JTAG_TDI 1.8V DI, PU JTAG test data input 96 power output VREG_MSMP 2.6V Output of the linear regulators 300mA 97 JTAG JTAG_TRST_N 1.8V DI, PD JTAG reset 98 USB UICC USIM_D_P 1.8V/2.85V I/O USB-UICC data plus line 99 USB UICC USIM_D_M 1.8V/2.85V I/O USB-UICC data minus line 100 GND GND GND 101 USB USB_D_M AI,AO High-speed USB differential data, (-) side 102 USB USB_D_P AI,AO High-speed USB differential data, (+) side 103 GND GND GND 104 power on key MSM_PON 1.8V AI.PU Connect to the keypad power button. This signal is pulled up internally to dVDD. When the QSC device is off, pulling this pin low initiates a powerup and generates an interrupt. 105 ADC in MPP4 AI,AO, DI, DO multipurpose pin 106 other D2D_PS_HOLD DI Baseband circuits drive this input high to keep power on, low to shut down 107 GND GND GND 108 GND GND GND 109 Speaker SPKR_OUT_P AO Speaker driver (+) output. Connect directly to the speaker 500mW 110 Speaker SPKR_OUT_M AO Speaker driver (-) output. Connect directly to the speaker 500mW 111 power output VREG_GP1 2.85V P Output of the linear regulators 150mA 112 power output VREG_GP2 2.9V P Output of the linear regulators 300mA 113 ADC in MPP2 AI,AO, multipurpose pin

Product specification 13 DI, DO 114 current sink VIB_DRV_N AI Connect to the vibration motor (-) terminal. The (+) terminal of the motor connects to VDD 115 ADC in HKAIN1 AI ADC input 116 current sink LCD_DRV_N AI Connect to the LCD backlight (-) terminal. The (+) terminal of the LCD backlight connects to VDD 150mA 117 GND GND GND 118 GPIO GPIO13 1.8V I/O, PD Configurable I/O 1-8mA 119 GPIO GPIO0 1.8V I/O, PD Configurable I/O 1-8mA 120 GPIO GPIO12 1.8V I/O, PD Configurable I/O 1-8mA 121 PDM GP_PDM_0 2.6V DO,PD 12-bit Pulse-density modulation output 2-16mA 122 GND GND GND 123 GND GND GND 124 GND GND GND 125 GND GND GND 126 GND GND GND 127 GND GND GND 128 GND GND GND 129 GND GND GND 130 GND GND GND 131 GND GND GND 132 GND GND GND 133 GND GND GND 134 GND GND GND 135 GND GND GND 136 GND GND GND 137 GND GND GND 138 GND GND GND 139 GND GND GND 140 GND GND GND 141 GND GND GND

Product specification 14 3. RF AIR INTERFACES AND PERFORMANCE 3.1 RF AIR INTERFACE AND BAND CONFIGURATION 3.1.1 Air interfaces UMC-6270QV module supports WCDMA R99, HSDPA and GPS 3.2 RF PERFORMANCE The UMC-6270QV modules RF transmitter/receiver is fully compliant with the applicable standards. The sensitivity and max output power are listed in Table 3-2-1 and Table 3-2-2 Specification Min Typ Max Units UMTS Sensitivity BC2(PCS) (1930-1990MHz Rx) -104.7 -108 dBm BC5(Cell) (869-894MHz Rx) -106.7 -110 dBm GPS Sensitivity -155 dBm Table 3-2-1 Conducted Receiver Sensitivity Specification Min Typ Max Units UMTS Max Output Power BC2(PCS) (1850-1910MHz Tx) 23.5 dBm BC5(Cell) (824-849MHz Tx) 23.5 dBm GPS Sensitivity -155 dBm Table 3-2-2 Conducted Transmitter Max Output Power 3.3 TRANSMITTER POWER CLASS The UMC-6270QV Modules support the power classes listed in Table 3-3 Mode Band Power Class WCDMA/HSDPA B2/B5 3 Table 3-3 Supported Power Classes

Product specification 15 4. OPERATING CONDITIONS 4.1 ABSOLUTE MAXIMUM RATINGS Operating UMC-6270QV Modules under conditions beyond its absolute maximum ratings (Table 4-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability. Symbol Parameter Min Max Unit Ts Storage temperature -40 85 C USB_VBUS DC power supply voltage 4.5 5.5 V VBAT Battery input voltage 3.4 4.2 V VESD_HBM Eletrostatic discharging voltage rating (human body model) * V VESD_CDM Electrostatic discharge voltage rating (charge device model) * V RH_Operating Operating humidity range 10 90 % RH_Non-OP Nonoperating humidity range 5 95 % *NOTE: ESD protection should be provided external to the module. Table 4-1 : Absolute maximum ratings

Product specification 16 4.2 RECOMMENDED OPERATING CONDITION The devices meet all performance specifications when used within the recommended operating conditions as described in Table 4-2 Symbol Parameter Min Typ. Max Unit T Operating Temperature -25 +85 Normal operating temperature range See section 4.2.1 -20 +65 Extended operating temperature range 1 See section 4.2.2 -25 -20 Extended operating temperature range 2 See section 4.2.3 +65 +85 USB_VBUS DC Power Supply Voltage 4.75 5 5.25 V VBAT (Battery) DC Power Supply Voltage 3.4 3.8 4.2 V Table 4-2 4.2.1 Normal operating temperature range The wireless module is fully functional and meets the 3GPP specification across the specified temperature range. 4.2.2 Extended operating temperature range 1 The wireless module is fully functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. 4.2.3 Extended operating temperature range 2 The wireless module is functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. Thermal protection including automatic shutdown is implemented for protection against overheating.

Product specification 17 5. CURRENT CONSUMPTION The specified supply currents in Table 5-1 are based operation at room temperature. Current measurements are taken with default parameter settings, nominal supply voltage. The DUT is mounted on a module test board and the accelerometer on, unless otherwise noted. Operating Modes Description Conditions Average Current Min Typ Max Unit Power Down(OFF) VBAT voltage applied Power Down*1,2 22 µA WCDMA Between Rx wakeups Sleep*1,2 1 mA Rx awake current Rx Idle 57 mA Average Sleep and Rx Standby*3 1.6 mA Average GPS only Average GPS only 30 mA HSDPA 3.6MbpsDL/384Kbps UL (0dBm) 180 mA WCDMA Tx/Rx (23.5dBm) 550 mA Table 5-1 Typical Power Consumption Note 1 Measurement taken without Test Board Note 2 Measurement taken without Accelerometer Note 3 Value calculated from measured IUSB_AVG subtacted from ITOTAL_GPS_AVG, I-GPS = I-Total_GPS_AVG – IUSB_AVG

Product specification 18 6. APPLICATION DESIGN NOTES 6.1 Layout Notes 6.1.1 RF Pin Input Impedance Matching Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the Description column in the table below. Layer Material Type Dielectric Thickness Trace Width Copper Thickness Dielectric Constant Char. Impedance Description 1 Conductive - 27 2.1 - 50 Microstrip Dielectric 16 - - 4.3 - Prepreg 2 Conductive - - 1.4 - Plane Dielectric 20 4.3 - Prepreg 3 Conductive - - 1.4 - - Plane Dielectric 16 - - 4.3 - Prepreg 4 Conductive - 27 2.1 - 50 Microstrip Table 6-1-1-1 Application Board Characteristic Impedance Figure 6-1-1-1 Application Board Layer Stack Up 6.1.2 Handling Requirements DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING. 6.1.3 Soldering Requirements Soldering Iron Soldering Solder Temperature: 350oC Immersion Duration: 2 ~ 3 seconds

Product specification 20 7. MECHANICAL REQUIREMENTS 7.1 Module Dimension and Footprint The dimension of this module: Figure 7-1-1 Dimension of SFF Module

Product specification 21 Figure 7-1-2 Recommended Footprint of SFF Module

Product specification 22 8 Certification Requirements 8.1 Carrier Certification Requirements The SFF Development Kit will be used to demonstrate Safe for Network (SFN) compliance for the SFF module on selected cellular carriers. 8.2 Regulatory Compliance 5 8.3 FCC warning statement FCC Regulations: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Product specification 23 Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the antenna gain allowed for use with this device is 2 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: NKRUMC-6270Q”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.