Wistron NeWeb UMC-6270Q module User Manual HiLo3G technical specification
Wistron NeWeb Corporation module HiLo3G technical specification
User Manual.pdf
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| Document ID | 2348940 |
| Application ID | LnuhP8WQ9+c4PrYlHgJHCA== |
| Document Description | User Manual.pdf |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 89.66kB (1120705 bits) |
| Date Submitted | 2014-08-06 00:00:00 |
| Date Available | 2015-02-02 00:00:00 |
| Creation Date | 2014-07-24 14:32:51 |
| Producing Software | Microsoft® Office Word 2007 |
| Document Lastmod | 2014-08-05 13:48:51 |
| Document Title | HiLo3G technical specification |
| Document Creator | Microsoft® Office Word 2007 |
| Document Author: | AMMARI Mohamed |
Product specification UMC-6270QV User Guide Wistron NeWeb Corp. CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION. Product specification CONTENTS CONTENTS .......................................................................................................................................................................... 2 1. INTRODUCTION...................................................................................................................................................... 3 1.1 PRODUCT CONCEPT ........................................................................................................................................ 3 1.2 STANDARDS ....................................................................................................................................................... 3 1.3 TERMS AND ABBREVIATION ......................................................................................................................... 4 1.4 CONVENTIONS ................................................................................................................................................... 4 1.5 PRODUCT FEATURES OVERVIEW ............................................................................................................... 5 2. BLOCK DIAGRAM & PIN ASSIGNMENT........................................................................................................... 7 3. RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14 3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14 3.1.1 Air interfaces ............................................................................................................................................. 14 3.2 RF PERFORMANCE......................................................................................................................................... 14 3.3 TRANSMITTER POWER CLASS ................................................................................................................... 14 4. OPERATING CONDITIONS ................................................................................................................................ 15 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15 4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16 5. CURRENT CONSUMPTION ................................................................................................................................ 17 6. APPLCATION DESIGN NOTES ......................................................................................................................... 18 6.1 LAYOUT NOTES .................................................................................................................................. 18 7. MECHANICAL REQUIREMENTS ...................................................................................................................... 20 7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20 8. CERTIFICATION REQUIREMENTS ................................................................................................................ 22 8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22 8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22 8.3 FCC WARNING STATEMENT ........................................................................................................................ 22 Revision history Revision Date Description V1.0 V2.0 April 7 2014 May 13 2014 Initial release Modify recommended operating condition Product specification 1. INTRODUCTION This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect the device application and the air interface. Two versions of Small Form Factor (SFF) module are described in this specification document as follows: 1.1 UMC-6270QV - HSDPA PRODUCT CONCEPT The SFF module is one of the smallest available WCDMA HSDPA of the market. The target application is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management), tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost, In addition to its size it has the following outstanding characteristics: Minimum low power consumption in idle mode: 1.4mA High input voltage range: 3.4 V to 4.2 V USB High Speed Digital Audio PCM Full set of AT commands as well as analogue and Digital audio interface. In addition to the module, a complete development kit can be provided for customers. 1.2 STANDARDS This product, together with its evaluation board, is in compliance with the directives and standards listed below: Directives FCC RF : FCC Part 22H (850 Band ) FCC Part 24E (for 1900 Band) EMI: FCC Part 15B FCC Part 22 Subpart H: Cellular Radiotelephone Service; Subpart I: Offshore Radiotelephone Service; FCC Part 24 E: Personal Communications Service; Subpart E: Broadband PCS. Subpart B - Radio frequency devices subpart B – Unintentional Radiators SAR(MPE) : OET65C Product specification 1.3 TERMS AND ABBREVIATION ADC CODEC CLIP COLP CLIR COLR CTS CSD CS DCS DSR DTR ENS EONS ESD ETS FAX HSCSD HSDPA IC IEEE I/O ISO ITU JTAG Kbps LCD LED Mbps PBCCH PCB PCM PCS PWM RAM RF RI RMS RTS RX SIM SMS TBC TBD TX UART UMTS USB USIM USSD 1.4 Analog to Digital Converter Coder-Decoder Calling Line Identification Presentation Connected Line Identification Presentation Calling Line Identification Restriction Connected Line Identification Restriction Clear To Send Circuit Switched Data Codec Scheme Digital Communications System Data Set Ready Data Terminal Ready Enhanced network selection Enhanced operator name string Electrostatic Discharge European Telecommunication Standard Facsimile High Speed Circuit Switched Data High Speed Downlink Packet Access Integrated Circuit Institute of Electrical and Electronics Engineers Input / Output International Standards Organization International Telecommunication Union Joint Test Action Group kilobit per second Liquid Crystal Display Light Emitting Diode Megabit per second Packet Broadcast Channel Printed Circuit Board Pulse Code Modulation Personal Communication System Pulse Width Modulation Random Access Memory Radio Frequency Ring Indication Root Mean Square Ready To Send Reception Subscriber Identification Module Short Message Service To Be Confirmed To Be Defined Transmission Universal Asynchronous Receiver and Transmitter Universal Mobile Telecommunications System Universal Serial Bus Universal Subscriber Identity Module Unstructured Supplementary Service Data CONVENTIONS Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls the module device by sending AT commands via its serial interface. DCE (data communication equipment) indicates the module device. Product specification 1.5 PRODUCT FEATURES OVERVIEW Temperature range Normal range: -25°C to +85°C Storage: -40°C to +85°C Weight 6 g (typ.) ESD ESD protection >= 2 kV Physical dimensions 22.1 x 25.1 x 2.65 mm (typical) Connection 141 pin LGA type Power supply 3.4V to 4.2V range, 3.8V nominal Power consumption Off mode: 50 µA typical Registered idle mode: WCDMA: 1.3 mA (DRX=9) Peak Current WCDMA: up to 700 mA Antenna /RF interface Both GPS and transmitter/receiver RF are LGA Pad. Frequency bands WNC module supports UMTS B2 /B5 Transmit power Class 3 for UMTS 850/1900 Supported SIM cards 3V and 1.8V SIM cards SIM slot Signals for the management of the SIM card are provided on LGA pads. Signal for LED, vibrating device and Buzzer management is provided on the PWM pin A digital audio interface PCM bus is provided. Master mode with 16 bits and a frequency of 2048 KHz. PWM Digital audio link Data/command multiplexing Software management of data/command multiplexing on the serial link UART. USB Supports USB High speed 480Mbps and full speed 12Mbps, with 3 logical Channels. Battery charging is achieved through USB Use USIM controller to achieve USIM connection USIM Module Hardware Configuration The SFF LGA module will support the QSC6270/6055 chipset with the configuration described below. For UMC-6270QV module: Key Features • • • • Compliant with 3GPP Rel’5 for WCDMA and HSDPA Max. Data Rate: 384Kbps uplink, 384Kbps downlink with WCDMA Rel’99 and 3.6Mbps downlink with HSDPA Support OS: Brew Mobile Platform ARM9 operating at 230Mhz maximum frequency The power consumption is highly dependent on the customer’s product design and the module environment. Product specification • Data interface: USB2.0 Host High Speed • Form Factor: LGA module Specification • • • • • • • • • Communication Interface: (I2C x1/UART x1/USB2.0 x1/SPI x1/ SDIO x2) Support HSDPA (DL 3.6Mbps/UL 384Kbps) Supported SIM cards (3V and 1.8V SIM cards) USIM interface General purpose I/O pins ( x25) Audio Interface (PCM/ I2S) MCP (DDR 512Mb + 1Gb NAND) Support GPS RF interface: 2 RF pads for WCDMA TX/RX, and GPS. WCDMA/HSDPA Support Bands • Band 2 and Band 5 WCDMA Power Class • Class3 (24dBm +1/-3 dB) Product specification 2. BLOCK DIAGRAM & PIN ASSIGNMENT Pin Definition 4 This section is intended to capture the final LGA pin out for the SFF Module. The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1. For UMC-6270QV module: Product specification Figure 2-1: UMC-6270QV module Pin numbe Category RF GND pin name WCDMA_A NT GND Pad Pad type Description group AI,AO WCDMA antenna signal GND Driving capacity Product specification GPIO GPIO9 1.8V I/O, PD Configurable I/O 1-8mA GPIO GPIO2 1.8V I/O, PD Configurable I/O 1-8mA GPIO GPIO5 1.8V I/O, PD Configurable I/O 1-8mA GPIO GPIO8 1.8V I/O, PD Configurable I/O 1-8mA I2C I2C_SCL 1.8V I/O I2C clock PCM PCM_BCLK 1.8V DO Clock for the PCM interface PCM PCM_SYNC 1.8V DO 10 PCM PCM_DIN 1.8V DI 11 PCM PCM_DOUT 1.8V DO PCM interface sync PCM I/F data in (if UMC-6270QV master) PCM I/F data out (if UMC-6270QV master) GPS_LNA_E 1.8V 12 I/O, PU Configurable I/O 1-8mA Serial peripheral interface chipselect Serial peripheral interface clock 13 SPI SPI_CS_N 1.8V DO 14 SPI SPI_CLK 1.8V DO 15 GND GND GND 16 GND GND GND 17 RF GPS_ANT AI 18 GND GND GND 19 GPIO GPIO21 20 GND GND 21 GPIO GPIO20 1.8V I/O, PU Configurable I/O 1-8mA 22 GPIO GPIO16 1.8V I/O, PU Configurable I/O 1-8mA 23 GPIO 1.8V I/O, PU Configurable I/O 1-8mA 24 SDIO2 25 SDIO2 26 SDIO1 27 SDIO1 28 SDIO1 29 GPIO GPIO17 SDCC2_DAT A2 SDCC2_DAT A3 SDCC1_CM SDCC1_DAT A3 SDCC1_DAT A2 GPIO10 30 GND GND 31 UICC USIM_CLK 32 33 USB USB_ID power input/outpu VBAT_BB 1.8V GPS antenna signal I/O, PU Configurable I/O GND 2.6V I/O SDIO2 data bit 2 2-16mA 2.6V I/O SDIO2 data bit 3 2-16mA 2.6V I/O SDIO1 command bit 2-16mA 2.6V I/O SDIO1 data bit 3 2-16mA 2.6V I/O SDIO1 data bit 2 2-16mA I/O, PU Configurable I/O 1-8mA 1.8V GND 1.8V/2 .85V 3.7V~ 4.2V DO USIM clock AI High-speed USB identification line Input power for BB section, could connect this pin with VBAT_RF Product specification 34 JTAG 35 JTAG 36 JTAG 37 38 39 40 41 JTAG_TMS 1.8V JTAG_RTCK 1.8V DI, PU JTAG test mode select DO 1.8V DI, PU JTAG clock input 1.8V/2 UICC USIM_DAT I/O USIM data .85V External supply voltage; connect power input USB_VBUS directly to the external USB power supplier power 1.8V/2 USIM_VREG Output of the linear regulators output .85V GND GND GND GND JTAG_TCK GND power input VCHG 43 power input VCHG 45 power output GND 150mA GND 42 44 JTAG return clock VREG_MSM 1.8V GND External supply voltage; connect both pins directly to the external power supply (such as a wall charger). External supply voltage; connect both pins directly to the external power supply (such as a wall charger). 300mA Output of the linear regulators GND Used as an analog input from the 3 V coin cell for SMPL, RTC,and crystal oscillator backup; a capacitor (rather than a coin cell) can be used if only SMPL is supported 46 power input/outpu VCOIN 47 GND GND 48 ADC in MPP3 49 other 50 GND 51 ADC in 52 GND GND GND 53 microphone MIC_P AI Microphone #1 input (+) 54 microphone MIC_M AI Microphone #1 input (-) 55 GND GND GND 56 GPIO GPIO4 1.8V I/O, PD Configurable I/O 1-8mA 57 GPIO GPIO6 1.8V I/O, PU Configurable I/O 1-8mA PON_REST_ 1.8V GND BATT_THER GND AI,AO, multipurpose pin DI, DO Connected internally to RESIN_N; DO logic low causes the baseband circuits to reset. GND connect to battery package thermal AI pin 10 Product specification 58 GPIO GPIO11 1.8V I/O, PD Configurable I/O 1-8mA 59 GPIO GPIO24 1.8V I/O, PD Configurable I/O 1-8mA 60 GND GND 61 GPIO GPIO18 1.8V I/O, PD Configurable I/O 1-8mA 62 GPIO GPIO15 1.8V I/O, PD Configurable I/O 1-8mA 63 GPIO GPIO7 1.8V I/O, PD Configurable I/O 1-8mA 64 GPIO GPIO1 1.8V I/O, PD Configurable I/O 1-8mA 65 I2C I2C_SDA 1.8V I/O 66 UART UART_TX 1.8V DO 67 UART UART_RFR 1.8V DO 68 UART UART_RX 1.8V DI 69 UART UART_CTS 1.8V DI GND 70 power input VBAT_RF 3.7V~ 4.2V 71 power input VBAT_RF 3.7V~ 4.2V I2C data High-speed UART transmit data output High-speed UART ready for receive signal High-speed UART receive data input High-speed UART clear to send signal Input power for RF section, could connect this pin with VBAT_BB Input power for RF section, could connect this pin with VBAT_BB SPI (master only) master out/slave in data SPI (master only) master in/slave out data 72 SPI SPI_MOSI 1.8V DO 73 SPI SPI_MISO 1.8V DI 74 GND GND GND 75 GND GND GND 76 GND GND GND 77 GND GND GND 78 GND GND GND 79 GPIO GPIO22 1.8V I/O, PU Configurable I/O 80 GPIO GPIO23 1.8V I/O, PU Configurable I/O 1-8mA 81 GPIO GPIO19 1.8V I/O, PU Configurable I/O 1-8mA 82 GPIO 1.8V I/O, PU Configurable I/O 1-8mA 83 SDIO2 84 SDIO2 85 SDIO2 86 SDIO2 87 SDIO1 GPIO14 SDCC2_DAT A0 SDCC2_CM SDCC2_DAT A1 SDCC2_CLK SDCC1_DAT A0 2.6V I/O SDIO2 data bit 0 2-16mA 2.6V I/O SDIO2 command bit 2-16mA 2.6V I/O SDIO2 data bit 1 2-16mA 2.6V DO Output clock for SDIO2 device 2-16mA 2.6V I/O SDIO1 data bit 0 2-16mA 11 Product specification 88 SDIO1 89 SDIO1 90 GPIO 91 GND 92 93 UICC 94 JTAG 95 JTAG power output 96 97 98 99 100 101 102 103 104 105 106 107 GND 109 Speaker 110 Speaker 112 113 GPIO3 1.8V I/O SDIO1 data bit 1 2-16mA DO Output clock for SDIO1 device 2-16mA I/O, PU Configurable I/O GND GND WLAN_PWR 2.6V I/O, PU Configurable I/O _DOWN 1.8V/2 USIM_RST DO USIM reset .85V JTAG_TDO 1.8V JTAG test data output JTAG_TDI 1.8V DI, PU JTAG test data input VREG_MSM 2.6V Output of the linear regulators JTAG_TRST JTAG 1.8V DI, PD JTAG reset _N 1.8V/2 USB UICC USIM_D_P I/O USB-UICC data plus line .85V 1.8V/2 USB UICC USIM_D_M I/O USB-UICC data minus line .85V GND GND GND High-speed USB differential data, USB USB_D_M AI,AO (-) side High-speed USB differential data, USB USB_D_P AI,AO (+) side GND GND GND Connect to the keypad power button. This signal is pulled up power on internally to dVDD. When the QSC MSM_PON 1.8V AI.PU key device is off, pulling this pin low initiates a powerup and generates an interrupt. AI,AO, ADC in MPP4 multipurpose pin DI, DO Baseband circuits drive this input D2D_PS_HO other DI high to keep power on, low to shut LD down GND GND GND 108 111 SDCC1_DAT 2.6V A1 SDCC1_CLK 2.6V power output power output ADC in GND SPKR_OUT_ SPKR_OUT_ 1-8mA 2-16mA 300mA GND AO AO Speaker driver (+) output. Connect directly to the speaker Speaker driver (-) output. Connect directly to the speaker 500mW 500mW VREG_GP1 2.85V Output of the linear regulators 150mA VREG_GP2 Output of the linear regulators 300mA MPP2 2.9V AI,AO, multipurpose pin 12 Product specification DI, DO 114 115 116 current sink VIB_DRV_N ADC in HKAIN1 current sink LCD_DRV_N AI Connect to the vibration motor (-) terminal. The (+) terminal of the motor connects to VDD AI ADC input AI Connect to the LCD backlight (-) terminal. The (+) terminal of the LCD backlight connects to VDD 150mA 117 GND GND GND 118 GPIO GPIO13 1.8V I/O, PD Configurable I/O 1-8mA 119 GPIO GPIO0 1.8V I/O, PD Configurable I/O 1-8mA 120 GPIO GPIO12 1.8V 1-8mA 121 PDM GP_PDM_0 2.6V 122 GND GND I/O, PD Configurable I/O 12-bit Pulse-density modulation DO,PD output GND 123 GND GND GND 124 GND GND GND 125 GND GND GND 126 GND GND GND 127 GND GND GND 128 GND GND GND 129 GND GND GND 130 GND GND GND 131 GND GND GND 132 GND GND GND 133 GND GND GND 134 GND GND GND 135 GND GND GND 136 GND GND GND 137 GND GND GND 138 GND GND GND 139 GND GND GND 140 GND GND GND 141 GND GND GND 13 2-16mA Product specification 3. RF AIR INTERFACES AND PERFORMANCE 3.1 RF AIR INTERFACE AND BAND CONFIGURATION 3.1.1 Air interfaces UMC-6270QV module supports WCDMA R99, HSDPA and GPS 3.2 RF PERFORMANCE The UMC-6270QV modules RF transmitter/receiver is fully compliant with the applicable standards. The sensitivity and max output power are listed in Table 3-2-1 and Table 3-2-2 Specification Min Typ Max Units -104.7 -108 dBm -106.7 -110 dBm -155 dBm UMTS Sensitivity BC2(PCS) (1930-1990MHz Rx) BC5(Cell) (869-894MHz Rx) GPS Sensitivity Table 3-2-1 Conducted Receiver Sensitivity Specification Min Typ Max Units UMTS Max Output Power BC2(PCS) (1850-1910MHz Tx) 23.5 dBm BC5(Cell) (824-849MHz Tx) 23.5 dBm -155 dBm GPS Sensitivity Table 3-2-2 Conducted Transmitter Max Output Power 3.3 TRANSMITTER POWER CLASS The UMC-6270QV Modules support the power classes listed in Table 3-3 Mode Band Power Class WCDMA/HSDPA B2/B5 Table 3-3 Supported Power Classes 14 Product specification 4. OPERATING CONDITIONS 4.1 ABSOLUTE MAXIMUM RATINGS Operating UMC-6270QV Modules under conditions beyond its absolute maximum ratings (Table 4-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability. Symbol Parameter Min Max Unit Ts Storage temperature -40 85 USB_VBUS DC power supply voltage 4.5 5.5 VBAT Battery input voltage 3.4 4.2 VESD_HBM Eletrostatic discharging voltage rating (human body model) VESD_CDM Electrostatic discharge voltage rating (charge device model) RH_Operating Operating humidity range 10 90 RH_Non-OP Nonoperating humidity range *NOTE: ESD protection should be provided external to the module. 95 Table 4-1 : Absolute maximum ratings 15 Product specification 4.2 RECOMMENDED OPERATING CONDITION The devices meet all performance specifications when used within the recommended operating conditions as described in Table 4-2 Symbol Parameter Min Typ. Max -25 +85 -20 +65 -25 -20 +65 +85 Unit USB_VBUS Operating Temperature Normal operating temperature range See section 4.2.1 Extended operating temperature range 1 See section 4.2.2 Extended operating temperature range 2 See section 4.2.3 DC Power Supply Voltage 4.75 5.25 VBAT (Battery) DC Power Supply Voltage 3.4 3.8 4.2 Table 4-2 4.2.1 Normal operating temperature range The wireless module is fully functional and meets the 3GPP specification across the specified temperature range. 4.2.2 Extended operating temperature range 1 The wireless module is fully functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. 4.2.3 Extended operating temperature range 2 The wireless module is functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. Thermal protection including automatic shutdown is implemented for protection against overheating. 16 Product specification 5. CURRENT CONSUMPTION The specified supply currents in Table 5-1 are based operation at room temperature. Current measurements are taken with default parameter settings, nominal supply voltage. The DUT is mounted on a module test board and the accelerometer on, unless otherwise noted. Operating Modes Description Power Down(OFF) VBAT voltage applied Between Rx wakeups WCDMA Rx awake current Average Sleep and Rx Average GPS only Average Current Conditions Min Typ Max Unit Power Down*1,2 22 µA Sleep*1,2 mA Rx Idle 57 mA Standby*3 1.6 mA 30 mA HSDPA 3.6MbpsDL/384Kbps UL (0dBm) 180 mA WCDMA Tx/Rx (23.5dBm) 550 mA Average GPS only Table 5-1 Typical Power Consumption Note 1 Measurement taken without Test Board Note 2 Measurement taken without Accelerometer Note 3 Value calculated from measured IUSB_AVG subtacted from ITOTAL_GPS_AVG, I-GPS = I-Total_GPS_AVG – IUSB_AVG 17 Product specification 6. APPLICATION DESIGN NOTES 6.1 Layout Notes 6.1.1 RF Pin Input Impedance Matching Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the Description column in the table below. Layer Material Type Conductive 27 2.1 50 Microstrip Dielectric Conductive Dielectric Conductive Dielectric Conductive 16 20 16 1.4 4.3 27 1.4 2.1 - Prepreg - Plane - Prepreg - Plane - Prepreg 50 Microstrip Dielectric Trace Thickness Width Copper Thickness Dielectric Constant Char. Description Impedance 4.3 4.3 Table 6-1-1-1 Application Board Characteristic Impedance Figure 6-1-1-1 Application Board Layer Stack Up 6.1.2 Handling Requirements DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING. 6.1.3 Soldering Requirements Soldering Iron Soldering Solder Temperature: 350oC Immersion Duration: 2 ~ 3 seconds 18 Product specification 6.1.4 Reflow Profile 19 Product specification 7. MECHANICAL REQUIREMENTS 7.1 Module Dimension and Footprint The dimension of this module: Figure 7-1-1 Dimension of SFF Module 20 Product specification Figure 7-1-2 Recommended Footprint of SFF Module 21 Product specification 8 Certification Requirements 8.1 Carrier Certification Requirements The SFF Development Kit will be used to demonstrate Safe for Network (SFN) compliance for the SFF module on selected cellular carriers. 8.2 Regulatory Compliance 8.3 FCC warning statement FCC Regulations: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 22 Product specification Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the antenna gain allowed for use with this device is 2 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: NKRUMC-6270Q”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 23
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : Yes Encryption : Standard V2.3 (128-bit) User Access : Print, Extract, Print high-res Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 4.0-c316 44.253921, Sun Oct 01 2006 17:14:39 Create Date : 2014:07:24 14:32:51+08:00 Creator Tool : Microsoft® Office Word 2007 Modify Date : 2014:08:05 13:48:51+08:00 Metadata Date : 2014:08:05 13:48:51+08:00 Format : application/pdf Description : HiLo3G technical specification Creator : AMMARI Mohamed Title : HiLo3G technical specification Keywords : HiLo3G technical specification Producer : Microsoft® Office Word 2007 Document ID : uuid:9239845b-bf93-4876-b4f1-128bf2e91f18 Instance ID : uuid:a13ffe36-a96f-48e6-8e04-64c53dc8dc28 Page Count : 23 Language : zh-TW Subject : HiLo3G technical specification Author : AMMARI MohamedEXIF Metadata provided by EXIF.tools