Xilinx Virtex 5 Fpga Ml561 Users Manual UG199 Memory Interfaces Development Board, User Guide

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Virtex-5 FPGA ML561

Memory Interfaces

Development Board

User Guide

UG199 (v1.2) April 19, 2008

Virtex-5 FPGA ML561 User Guide www.xilinx.com UG199 (v1.2) April 19, 2008

Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development

of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

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the right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errors

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other countries. PCI EXPRESS is a registered trademark of PCI-SIG. All other trademarks are the property of their respective owners.

Revision History

The following table shows the revision history for this document.

Date Version Revision

02/12/07 1.0 Initial Xilinx release.

08/09/07 1.1 Revised Read and Write Strobe in Table 5-4, page 49. Added Chapter 7, “ML561

Hardware-Simulation Correlation.”

04/19/08 1.2 Revised Figure 3-11, page 37 and Table 3-19, page 38. Corrected FPGA driver for Read

Data and Read Strobe in Table 5-4, page 49. Updated Data and Strobe entries in Table 5-5,

page 49. Updated manufacturers and links in Appendix B, “Bill of Materials.”

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Preface: About This Guide

Guide Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Additional Support Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Typographical. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Online Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chapter 1: Introduction

About the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit . . . . . . . . . . . . . . . . 11

Virtex-5 FPGA ML561 Memory Interfaces Development Board. . . . . . . . . . . . . . . 12

Chapter 2: Getting Started

Documentation and Reference Design CD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Initial Board Check Before Applying Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Applying Power to the Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Chapter 3: Hardware Description

Hardware Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

FPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DDR400 SDRAM Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DDR2 DIMM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DDR2 SDRAM Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

QDRII SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

RLDRAM II Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Memory Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DDR400 and DDR2 Component Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DDR2 SDRAM DIMM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

QDRII and RLDRAM II Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

RS-232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Clocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

200 MHz LVPECL Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

SMA Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

33 MHz Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

33 MHz System ACE Controller Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

GTP Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

User I/Os. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

General-Purpose Headers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

DIP Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table of Contents

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Seven-Segment Displays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Light Emitting Diodes (LEDs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Pushbuttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Power On or Off Slide Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Soft Touch Probe Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Power Measurement Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Liquid Crystal Display Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Power Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Board Design Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Chapter 4: Electrical Requirements

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

FPGA Internal Power Budget. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Chapter 5: Signal Integrity Recommendations

Termination and Transmission Line Summaries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Chapter 6: Configuration

Configuration Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

JTAG Chain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

JTAG Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Parallel IV Cable Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

System ACE Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Chapter 7: ML561 Hardware-Simulation Correlation

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Signal Integrity Correlation Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

DDR2 Component Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

DDR2 Component Read Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

DDR2 DIMM Write Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

DDR2 DIMM Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

QDRII Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

QDRII Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Summary and Recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

How to Generate a User-Specific FPGA IBIS Model . . . . . . . . . . . . . . . . . . . . . . . . . 93

Appendix A: FPGA Pinouts

FPGA #1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

FPGA #2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

FPGA #3 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

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Appendix B: Bill of Materials

Appendix C: LCD Interface

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Display Hardware Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Hardware Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Peripheral Device KS0713 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Controller – Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Controller – LCD Panel Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Controller – Power Supply Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Operation Example of the 64128EFCBC-3LP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Read/Write Characteristics (6800 Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Design Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

LCD Panel Used in Full Graphics Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

LCD Panel Used in Character Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Array Connector Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

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Preface

About This Guide

This user guide describes the Virtex®-5 FPGA ML561 Memory Interfaces Development

Board. Complete and up-to-date documentation of the Virtex-5 family of FPGAs is

available on the Xilinx website at http://www.xilinx.com/virtex5.

Guide Contents

This manual contains the following chapters:

•Chapter 1, “Introduction”

•Chapter 2, “Getting Started”

•Chapter 3, “Hardware Description”

•Chapter 4, “Electrical Requirements”

•Chapter 5, “Signal Integrity Recommendations”

•Chapter 6, “Configuration”

•Chapter 7, “ML561 Hardware-Simulation Correlation”

•Appendix A, “FPGA Pinouts”

•Appendix B, “Bill of Materials”

•Appendix C, “LCD Interface”

Additional Documentation

The following documents are also available for download at

http://www.xilinx.com/virtex5.

•Virtex-5 Family Overview

The features and product selection of the Virtex-5 family are outlined in this overview.

•Virtex-5 FPGA Data Sheet: DC and Switching Characteristics

This data sheet contains the DC and Switching Characteristic specifications for the

Virtex-5 family.

•Virtex-5 FPGA User Guide

Chapters in this guide cover the following topics:

- Clocking Resources

- Clock Management Technology (CMT)

- Phase-Locked Loops (PLLs)

-Block RAM

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- Configurable Logic Blocks (CLBs)

-SelectIO™ Resources

- SelectIO Logic Resources

- Advanced SelectIO Logic Resources

•Virtex-5 FPGA RocketIO GTP Transceiver User Guide

This guide describes the RocketIO™ GTP transceivers available in the Virtex-5 LXT

and SXT platforms.

•Virtex-5 FPGA RocketIO GTX Transceiver User Guide

This guide describes the RocketIO GTX transceivers available in the Virtex-5 FXT

platform.

•Virtex-5 FPGA Embedded Processor Block for PowerPC® 440 Designs

This reference guide is a description of the embedded processor block available in the

Virtex-5 FXT platform.

•Virtex-5 FPGA Embedded Tri-Mode Ethernet MAC User Guide

This guide describes the dedicated Tri-Mode Ethernet Media Access Controller

available in the Virtex-5 LXT, SXT, and FXT platforms.

•Virtex-5 FPGA Integrated Endpoint Block User Guide for PCI Express Designs

This guide describes the integrated Endpoint blocks in the Virtex-5 LXT, SXT, and FXT

platforms used for PCI Express® designs.

•Virtex-5 FPGA XtremeDSP Design Considerations User Guide

This guide describes the XtremeDSP™ slice and includes reference designs for using

the DSP48E.

•Virtex-5 FPGA Configuration Guide

This all-encompassing configuration guide includes chapters on configuration

interfaces (serial and SelectMAP), bitstream encryption, Boundary-Scan and JTAG

configuration, reconfiguration techniques, and readback through the SelectMAP and

JTAG interfaces.

•Virtex-5 FPGA System Monitor User Guide

The System Monitor functionality available in all the Virtex-5 devices is outlined in

this guide.

•Virtex-5 FPGA Packaging and Pinout Specifications

This specification includes the tables for device/package combinations and maximum

I/Os, pin definitions, pinout tables, pinout diagrams, mechanical drawings, and

thermal specifications.

•Virtex-5 FPGA PCB Designer’s Guide

This guide provides information on PCB design for Virtex-5 devices, with a focus on

strategies for making design decisions at the PCB and interface level.

Additional Support Resources

To search the database of silicon and software questions and answers, or to create a

technical support case in WebCase, see the Xilinx website at:

http://www.xilinx.com/support.

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Conventions

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Conventions

This document uses the following conventions. An example illustrates each convention.

Typographical

This document uses the following typographical conventions. An example illustrates each

convention.

Online Document

The following conventions are used in this document:

Terminology

This section defines terms used in Chapter 7, “ML561 Hardware-Simulation Correlation,”

of this document.

Convention Meaning or Use Example

Italic font

References to other documents See the Virtex-5 Configuration Guide

for more information.

Emphasis in text The address (F) is asserted after

clock event 2.

Underlined Text Indicates a link to a web page. http://www.xilinx.com/virtex5

Convention Meaning or Use Example

Blue text Cross-reference link to a location

in the current document

See the section “Additional

Documentation” for details.

Refer to “Clock Management

Technology (CMT)” in

Chapter 2 for details.

Red text Cross-reference link to a location

in another document

See Figure 5 in the Virtex-5 FPGA

Data Sheet

Blue, underlined text Hyperlink to a website (URL) Go to http://www.xilinx.com

for the latest documentation.

Data Valid Window (DVW)

DVW is the data valid window opening measured by the VIH and VIL masks. The

smaller of the two values are listed as absolute time as well as in terms of the percentage

of UI (Unit Interval), or bit time.

Extrapolation

The ultimate goal of a design is to ascertain quality of signal at the receiver I/O Buffer

(IOB). This measurement can only be simulated. When the hardware measurements are

correlated with the simulation at the probe point, the extra probe capacitance is

removed from the IBIS schematics, and the simulation is repeated at two extreme

corners (slow-weak and fast-strong). Removal of probe capacitance is important to

represent the actual hardware. If the SI characteristics of these simulations are proved

to be within the acceptable range with sufficient margin, then the performance

requirements for data signal interface of the corresponding memory operation at the

target clock frequency are proved to have been met.

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Hardware Measurements

These measurements are the actual real-time measurements of an eye diagram and a

segment of the test pattern (PRBS6) waveform captured on ML561 hardware at the

designated probe point using an Agilent scope.

Inter-Symbol Interference

(ISI)

As the frequency of operation increases, the signal delay is affected by the data pattern

that precedes the current data bit. This is called the inter-symbol interference (ISI) effect.

All testing is performed with a pseudo-random bitstream (PRBS) of order 6, that is,

PRBS6. ISI is the jitter represented by the eye at all four voltage thresholds. The worst

of the following two sum values are listed in this table:

•Sum of ISI at VIH(ac)-min and VIH(dc)-min

•Sum of ISI at VIL(ac)-max and VIL(dc)-max

Noise Margin

This is the noise margin available at the receiver. Measurements are taken at the AC

voltage levels as the minimum vertical opening of the eye in the vicinity of the center

of the bit period. Ideally, the input voltage needs to remain above the DC voltage

specifications. However, by considering the AC voltage specifications for the nominal

voltage level for VREF, these measurements are more conservative values that also

include the effects of VREF variations.

•VIH margin: Difference between the top of the eye opening and VIH(ac)-min

•VIL margin: Difference between VIL(ac)-max and the bottom of the eye opening

These measurements are performed in stand-alone fashion for the signal under test.

Thus no consideration of crosstalk or Simultaneously Switching Output (SSO) effects

are accounted for.

Overshoot / Undershoot

Margin

Overshoot margin is the difference between the maximum allowable VIH per JEDEC

specification and the maximum amplitude of the measured eye. Similarly, undershoot

margin is the difference between the minimum amplitude of the measured eye and the

minimum allowable VIL value per JEDEC specification. For both SSTL18 and 1.8V

HSTL specifications:

•VIH(max) < (VDDQ + 300 mV) = (1.8 + 0.3)V = 2.1V

•VIL(min) > -300 mV = 0.3V

Simulation Correlation

The BoardSim utility of the HyperLynx simulator is used to extract the IBIS schematics

of the same signal net for which hardware measurements are made. To replicate the

hardware measurement probe set up at the probe point, a 0.5 pF probe capacitance is

added based on Agilent probe loading specifications to the extracted IBIS schematics of

the memory signal. For the FPGA devices soldered on the ML561 board under test, the

process corner (slow, typical, or fast) is not known. Thus simulation is performed for all

three corners (slow-weak, typical, and fast-strong), and the results of the case that best

fits with hardware measurement is selected for tabulation.

VIH(ac)-min This term is the minimum input level at which the receiver must recognize input logic

High.

VIH(dc)-min

When the input signal reaches VIH(ac)-min, the receiver continues to interpret the

input as a logic High as long as the signal remains above this voltage. (This parameter

is basically the hysteresis for a logic ‘1’.)

VIL(ac)-max This term is the maximum input level at which the receiver must recognize input logic

Low.

VIL(dc)-max

When the input signal reaches VIL(ac)-max, the receiver continues to interpret the input

as a logic Low as long as the signal remains below this voltage. (This parameter is

basically the hysteresis for logic ‘0’.)

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Chapter 1

Introduction

This chapter introduces the Virtex®-5 FPGA ML561 reference design. It contains the

following sections:

•“About the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit”

•“Virtex-5 FPGA ML561 Memory Interfaces Development Board”

About the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit

The Virtex-5 FPGA ML561 Memory Interfaces Tool Kit provides a complete development

platform to interface with external memory devices for designing and verifying

applications based on the Virtex-5 LXT FPGA platform. This kit allows designers to

implement high-speed applications with extreme flexibility using IP cores and customized

modules. The Virtex-5 LXT FPGA, with its column-based architecture, makes it possible to

develop highly flexible memory interface applications.

The Virtex-5 FPGA ML561 Memory Interfaces Tool Kit includes the following:

•Virtex-5 FPGA ML561 Memory Interfaces Development Board (XC5VLX50T-FFG1136

FPGA)

•5V/6.5 A DC power supply

•Country-specific power supply line cord

•RS-232 serial cable, DB9-F to DB9-F

•Documentation and reference design CD-ROM

Optional items that also support development efforts include:

•Xilinx® ISE® software

•JTAG cable

•Xilinx Parallel IV cable

For assistance with any of these items, contact your local Xilinx distributor or visit the

Xilinx online store at www.xilinx.com.

The heart of the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit is the Virtex-5 FPGA

ML561 Development Board. This manual provides comprehensive information on Rev A3

and later revisions of this board.

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Virtex-5 FPGA ML561 Memory Interfaces Development Board

A high-level functional block diagram of the Virtex-5 FPGA ML561 Memory Interfaces

Development Board is shown in Figure 1-1.

The Virtex-5 FPGA ML561 Development Board includes the following major functional

blocks:

•Three XC5VLX50T-FFG1136 FPGAs (see DS100, Virtex-5 Family Overview)

•DDR400 components: 128 MB (32M x 32 bits) at 200 MHz clock speed. See XAPP851,

DDR SDRAM Controller Using Virtex-5 FPGA Devices.

•DDR2 DIMM: Five PC2-5300 DIMM sockets for up to 2 GB (128M x 144 bits). See

XAPP858, High-Performance DDR2 SDRAM Interface in Virtex-5 Devices.

•DDR2-667 components: 64 MB (16M x 32 bits) at 333 MHz clock speed

•QDRII memory: 16 MB (2M x 72 bits) at up to 300 MHz clock speed. See XAPP853,

QDR II SRAM Interface for Virtex-5 Devices.

•RLDRAM II memory: 64 MB (16M x 36 bits) at up to 300 MHz clock speed. See

XAPP852, RLDRAM II Memory Interface for Virtex-5 FPGAs.

•One DB9-M RS-232 port and one USB 2.0 port

•A System ACE™ CompactFlash (CF) Configuration Controller that allows storing

and downloading of up to eight FPGA configuration image files

•On-board power regulators with ±5% output margin test capabilities

Figure 1-1: Virtex-5 FPGA ML561 Development Board Block Diagram

DDR2 DIMM 72

72

RLDRAM II

(CIO)

36

QDRII SRAM

DDR2 SDRAM 32

32

FPGA #1

XC5VLX50T/

FFG1136

FPGA #2

XC5VLX50T/

FFG1136

DDR400 SDRAM

SSTL18/SSTL2 SSTL18 HSTL

External Interfaces:

System ACE Controller,

USB, RS-232, LCD

DDR2 DIMM

DDR2 DIMM

DDR2 DIMM

DDR2 DIMM

72

72

UG191_c1_01_020807

FPGA #3

XC5VLX50T/

FFG1136

WIDE

DEEP

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Figure 1-2 shows the Virtex-5 FPGA ML561 Development Board and indicates the

locations of the resident memory devices.

Figure 1-2: Virtex-5 FPGA ML561 Development Board

S A i l N 10 t hit / d h d F/L

DDR2

SDRAM

DIMM

32-bit

DDR400

SDRAM

32-bit

DDR2

SDRAM

72-bit

QDRII

SRAM

36-bit

RLDRAM II

144 bits wide

72 bits wide,

up to 4 deep

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Chapter 2

Getting Started

This chapter describes the items needed to configure the Virtex-5 FPGA ML561 Memory

Interfaces Development Board. The Virtex-5 FPGA ML561 Development Board is tested at

the factory after assembly and should be received in working condition. It is set up to load

a bitstream from the CompactFlash card at socket J27 through the System ACE controller

(U45).

This chapter contains the following sections:

•“Documentation and Reference Design CD”

•“Initial Board Check Before Applying Power”

•“Applying Power to the Board”

Documentation and Reference Design CD

The CD included in the Virtex-5 FPGA ML561 Memory Interfaces Tool Kit contains the

design files for the Virtex-5 FPGA ML561 Development Board, including schematics,

board layout, and reference design files. Open the ReadMe.rtf file on the CD to review

the list of contents.

Initial Board Check Before Applying Power

Perform these steps before applying board power:

1. Set up the Configuration Mode jumpers (P27, P46, and P112) for JTAG configuration.

See “Configuration Modes” on page 51 for all available modes for the Virtex-5 FPGA

ML561 Development Board.

2. Confirm that the JTAG chain jumpers P38, P44, and P109 are connecting pins 1 to 2 and

pins 3 to 4. This way, all three devices are in the chain. Otherwise, the ISE iMPACT

software will not find all three devices to configure. For more information see “JTAG

Chain” on page 52.

3. Make sure that no inhibit jumpers are present on any of the power supply regulator

modules. For more information, see “Voltage Regulators” on page 34.

4. The Virtex-5 FPGA ML561 Development Board has a 200 MHz on-board oscillator,

which provides a copy of a differential LVPECL clock to each of the three FPGAs

through a differential clock buffer (ICS853006). There is also a connection to a pair of

SMA connectors (J19, J20) to provide a differential LVDS clock from an off-board signal

generator. Another differential clock buffer (ICS853006) provides a copy of this clock to

each of the three FPGAs. These clocks are available after configuration for the design to

use for various system clocks.

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5. Insert the CompactFlash card included in the kit into socket J27 on the Virtex-5 FPGA

ML561 Development Board. To select the startup file, check that SW8 is set to position

0.

Applying Power to the Board

The Virtex-5 FPGA ML561 Development Board is now ready to power on. The Virtex-5

FPGA ML561 Development Board is shipped with a country-specific AC line cord for the

universal input 5V desktop power supply. Follow these steps to power up the Virtex-5

FPGA ML561 Development Board:

1. Confirm that the ON-OFF switch, SW5, is in the OFF position.

2. Plug the 5V desktop power supply into the 5V DC input barrel jack J28 on the Virtex-5

FPGA ML561 Development Board. Plug the desktop power supply AC line cord into

an electrical outlet supplying the appropriate voltage.

3. Turn SW5 to the ON position. The power indicators for all regulator modules should

come on, indicating output from the regulators. The System ACE status LED D37

comes on when the System ACE controller (U45) extracts the BIT configuration file

from the CompactFlash card to the FPGA. If no CompactFlash card is installed in the

card socket J27 on the Virtex-5 FPGA ML561 Development Board, the red System ACE

error LED D38 flashes.

4. If a CompactFlash card is not installed in socket J27, a JTAG cable must be used to

configure the FPGAs. To use a Parallel IV cable or other JTAG pod, download the

FPGA configuration bitstream into each FPGA. After the DONE LED (D28) comes on,

the FPGAs are configured and ready to use.

5. Push the reset button SW4.

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Chapter 3

Hardware Description

This chapter describes the major hardware blocks on the Virtex-5 FPGA ML561

Development Board and provides useful design consideration. It contains the following

sections:

•“Hardware Overview”

•“Memory Details”

•“External Interfaces”

•“Power Regulation”

•“Board Design Considerations”

Hardware Overview

The ML561 Development/Evaluation system reference design is implemented with three

XC5VLX50T-FFG1136 devices from the Virtex-5 FPGA family to demonstrate high-speed

external memory application interfaces. The memory technologies supported by the

Virtex-5 FPGA ML561 Development Board are DDR2 SDRAM, DDR400 SDRAM, QDRII

SRAM, and RLDRAM II SDRAM.

Figure 3-1 provides a view of all the major components on ML561 board. It shows the

placement of the three Virtex-5 FPGAs, and the position of the associated major interfaces

for each FPGA.

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FPGA

The ML561 uses three Virtex-5 XC5VLX50T-FFG1136 devices, each in a 1136-pin,

35 mm x 35 mm BGA package. Figure 1-1, page 12 shows the memory devices associated

with the three FPGAs. Refer to Appendix A, “FPGA Pinouts,” for a complete pinout of all

Virtex-5 devices on the board. Refer to Appendix B, “Bill of Materials,” for a list of major

components on the Virtex-5 FPGA ML561 Development Board, including their reference

designators and links to their corresponding data sheets.

Figure 3-1: ML561 XC5VLX50T-FFG1136 Board Placement Diagram

HSTL

FPGA #3

FPGA #1

FPGA #2

SSTL18

HSTL

VTT & VREF

SSTL18

VTT & VREF

SSTL2

VTT & VREF

VCCAUX /

VCCO

VCCINT

USB

DIP3

DIP1

DIP2

7SEG3

7SEG2

7SEG1

Config3

PROG

External

CLK

5V Input

Jack

5V Banana

Jacks

12V Banana

Jacks

12V Input

Jack

SPY

SPY

ON

OFF

OFF

ON

RESET

SPY

Config1

Config2

SPY

SSTL2

JTAG

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System ACE

Controller

FPGA #3 LEDs

FPGA #1

LEDs

FPGA #1

LEDs

FPGA #2

LEDs

JTAG Test Header

Test Header 3

A1

A1

A1

Test Header 2

Test Header 1

Serial Header

HSTL

12V -> 5V

RLDRAM II QDRII

QDRII

DDR2

AVTRX

AVC

CPLL

AVTTX

VVTTR

XC FBD

VCC

RS-232

Driver

DDR

DDR

DDR2 MGT

CLK

MGT Connections

RLDRAM II

Clocks &

Buffers

SSTL18

_M

DIMM1

DIMM2

DIMM3

DIMM4

DIMM5

SSTL2

_M

3.3V

LCD Connector

Pwr Measure Header

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Memories

Table 3-1 lists the types of memories that the ML561 board supports.

When a larger data/strobe ratio is implemented, for example, a x36 QDRII device, the

smaller configurations can also be demonstrated by programming the FPGA for a smaller

data width, such as a 9:1 data/strobe ratio for the QDRII device.

DDR400 SDRAM Components

The Virtex-5 FPGA ML561 Development Board has two 200 MHz Micron

MT46V32M16BN-5B (16-bit) DDR400 SDRAM components that provide a 32-bit interface.

Each 16-bit device is packaged in a 60-ball FBGA package, with a common address and

control bus and separate clocks and DQS/DQ signals.

DDR2 DIMM

The Virtex-5 FPGA ML561 Development Board contains five PC-5300 240-pin DIMM

sockets for a maximum data width of 144 bits or a maximum depth of four DIMMs. The

sockets are arranged in a row leading away from the FPGA so they can share common

address and control signals. DIMM1 through DIMM4 share DQ/DQS signals to form a

deep 72-bit memory interface, while DIMM5 has separate DQ/DQS signals.

For the deep DDR2 interface, the sockets are to be populated starting at socket DIMM4.

Table 3-2 illustrates how the sockets should be populated based on the interface wanted.

Populating the DIMMs in this order is necessary due to the placement of the termination

on the signals being shared. More detail on termination is given in “Board Design

Considerations,” page 36.

Table 3-1: Summary of ML561 Memory Interfaces

Memory Type Maximum Speed Data Rate Data Width I/O Standard Data/Strobe

Ratios

DDR400 SDRAM 200 MHz 400 Mbps 32 SSTL2 8:1

DDR2 DIMM 333 MHz 667 Mbps 144 SSTL18 8:1

DDR2 SDRAM 333 MHz 667 Mbps 32 SSTL18 8:1

QDRII SRAM 300 MHz 1.2 Gbps 72 HSTL18 18:1, 36:1

RLDRAM II 300 MHz 600 Mbps 36 HSTL18 9:1, 18:1

Table 3-2: Populating DDR2 DIMM Sockets

DIMM Interface DIMM Sockets

Populated Interface Width

One Deep 5 or 4 72-bit

Two Deep 4 and 3 72-bit

Three Deep 4, 3, and 2 72-bit

Four Deep 4, 3, 2, and 1 72-bit

Two Wide 5 and 4 144-bit

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DDR2 SDRAM Components

The ML561 board contains two 333 MHz Micron MT47H32M16CC-3 (16-bit) DDR2

SDRAM components that provide a 32-bit interface to FPGA #1. Each 16-bit device is

packaged in an 84-ball FBGA package, with a common address and control bus and

separate clocks and DQS/DQ signals.

QDRII SRAM

The ML561 board contains a 300 MHz QDRII SRAM interface with a 72-bit Read interface

and a 72-bit Write interface using two Samsung K7R643684M-FC30 components (x36).

They are packaged in a 165-ball FBGA package with a body size of 15 x 17 mm. These two

components share the same address/control signals but have separate clock and data

signals.

RLDRAM II Devices

The ML561 contains a 300 MHz 36-bit RLDRAM II interface using two Micron

MT49H16M18BM-25 devices (x18) packaged in a 144-ball PBGA package. They share a

common address and control bus but have separate clocks and DQS/DQ signals.

Figure 3-2: DDR2 Deep and Wide DIMM Sockets

DIMM1 (XP5)

DIMM2 (XP4)

DIMM3 (XP3)

DIMM4 (XP2)

DIMM5 (XP1)

DQ and DQS

BY0-BY7, CB0_7

DQ and DQS

BY8-BY15, CB8_15

Address and Commands

DIMM1 Control

Wide

Deep

DIMM2 Control

DIMM3 Control

DIMM4 Control

DIMM5 Control

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Memory Details

DDR400 and DDR2 Component Memories

The FPGA #1 device on the Virtex-5 FPGA ML561 Development Board is connected to

DDR and DDR2 component memories, as shown in Figure 3-3.

Figure 3-3 summarizes the distribution of DDR and DDR2 discrete component interface

signals among the different banks of the FPGA #1 device.

Figure 3-3: FPGA #1 Banks for DDR400 and DDR2 Component (Top View)

BANK 21 (40)

BANK 13 (40)

DDR Components

DQ 0, 1, 2

BANK 114

BANK 112

BANK 11 (40)

DDR Components

DQ 3 & Controls

BANK 12 (40)

USB Controls

BANK 17 (40) BANK 18 (40) BANK 118

BANK 22 (40) BANK 122

BANK 126

(Configuration)

BANK 0

BANK 4 (20)

Global Clock Inputs

BANK 25 (40) BANK 6 (20)

GTP I/O

BANK 2 (20)

Voltage Control

BANK 15 (40)

DDR2 Component

DQ 0, 1

BANK 116

BANK 19 (40)

DDR2 Component

DQ 2, 3

BANK 120BANK 20 (40)

RS232

Inter-FPGA MII Links

BANK 1 (20)

DDR2 Component

Address

BANK 23 (40) BANK 124BANK 5 (20)

BANK 3 (20)

DDR2 Component

Controls

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Table 3-3 describes all signals associated with DDR400 Component memories.

Table 3-4 describes all signals associated with DDR2 Component memories. For a complete

list of FPGA #1 signals and their pin locations, refer to Appendix A, “FPGA Pinouts.”

XAPP851, DDR SDRAM Controller Using Virtex-5 FPGA Devices, XAPP858, High-

Performance DDR2 SDRAM Interface in Virtex-5 Devices, and the corresponding demos are

included on the CD shipped with the ML561 Tool Kit. For a complete list of FPGA #1

signals and their pin locations, refer to Appendix A, “FPGA Pinouts.”

Table 3-3: DDR400 Component Signal Summary

Board Signal Name(s) Bits Description

DDR1_A[13:0] 14 DDR400 Component Address

DDR1_CK[2:1]_[P,N] 4 DDR400 Component Differential Clock

DDR1_[RAS,CAS,WE]_N, DDR1_CKE,

DDR1_BA[1:0], DDR1_BY[0_1,2_3]_CS_N,

DDR1_DM_BY[3:0]

12 DDR400 Component Control Signals

DDR1_DQ_BY0_B[7:0], DDR1_DQS_BY0_P 9 DDR400 Data and Strobe: Byte 0

DDR1_DQ_BY1_B[7:0], DDR1_DQS_BY1_P 9 DDR400 Data and Strobe: Byte 1

DDR1_DQ_BY2_B[7:0], DDR1_DQS_BY2_P 9 DDR400 Data and Strobe: Byte 2

DDR1_DQ_BY3_B[7:0], DDR1_DQS_BY3_P 9 DDR400 Data and Strobe: Byte 3

Notes:

1. DDR1_CKE signal has a weak 4.7KΩ pull-down resistor to meet the memory power-up requirements.

Table 3-4: DDR2 Component Signal Summary

Board Signal Name(s) Bits Description

DDR2_A[12:0] 13 DDR2 Component Address

DDR2_CK[1:0]_[P,N] 4 DDR2 Component Differential

Clock

DDR2_ODT[1:0], DDR2_[RAS,CAS,WE]_N,

DDR2_CKE, DDR2_BA[1:0], DDR2_CS[1:0]_N,

DDR2_DM_BY[3:0]

14 DDR2 Component Control Signals

DDR2_DQ_BY0_B[7:0], DDR2_DQS_BY0_[P,N] 10 DDR2 Data and Strobe: Byte 0

DDR2_DQ_BY1_B[7:0], DDR2_DQS_BY1_[P,N] 10 DDR2 Data and Strobe: Byte 1

DDR2_DQ_BY2_B[7:0], DDR2_DQS_BY2_[P,N] 10 DDR2 Data and Strobe: Byte 2

DDR2_DQ_BY3_B[7:0], DDR2_DQS_BY3_[P,N] 10 DDR2 Data and Strobe: Byte 3

Notes:

1. DDR2_CKE and DDR2_ODT[1:0] signals have a weak 4.7KΩ pull-down resistor to meet the memory

power-up requirements.

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DDR2 SDRAM DIMM

The FPGA #2 device on the Virtex-5 FPGA ML561 Development Board is connected to

DDR2 memories. The DDR2 memory interface includes a 144-bit wide DIMM connection

to up to five 240-pin DDR2 DIMM sockets.

For the 144-bit wide DIMM datapath, the data bytes are spread across multiple banks of

the FPGA #2 device. Figure 3-4 summarizes the distribution of DDR2 DIMM interface

signals among the different banks of the FPGA #2 device.

Figure 3-4: FPGA #2 Banks for DDR2 DIMM (SSTL18) Interfaces (Top View)

BANK 20 (40)

DDR2 DIMM

DQ 8, 9, 10

BANK 12 (40)

DDR2 DIMM

DQ 11, 12, CB8_15

BANK 11 (40)

DDR2 DIMM

DQ 6, 3 CB0_7

BANK 112

BANK 114 BANK 13 (40)

DDR2 DIMM

DQ 5, 7, 4

BANK 15 (40)

DDR2 DIMM

DQ 0, 1, 2

BANK 116

GTP CLK

BANK 19 (40)

DDR2 DIMM

Controls & DIMM1 Cntl

BANK 120

RX 0, 1

(Configuration)

BANK 0

BANK 3 (20)

General I/O

BANK 5 (20) BANK 23 (40)BANK 124

TX 0, 1

BANK 1 (20)

General I/O

BANK 18 (40)

DDR2 DIMM

DQ 14, 15, 13

BANK 17 (40)

DDR2 DIMM

Common Controls

BANK 118

BANK 22 (40)

DDR2 DIMM

DIMM 4 & 5 Cntl

BANK 122 BANK 21 (40)

DDR2 DIMM

DIMM 1, 2, 3 Cntl

BANK 2 (20)

Inter-FPGA MII Links

BANK 25 (40)BANK 126 BANK 6 (20)

BANK 4 (20)

Global Clock Inputs

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Table 3-5 describes all the signals associated with DDR2 DIMM component memories. For

the Deep DIMM interface to four DIMMs, the individual dedicated control signals are

listed at the bottom of Table 3-5.

XAPP858, High-Performance DDR2 SDRAM Interface in Virtex-5 Devices and its

corresponding demo are included on the CD shipped with the ML561 Tool Kit.

Table 3-5: DDR2 DIMM Signal Summary

Board Signal Name(s) Bits Description

DDR2_DIMM_A[15:0] 16 DDR2 DIMM Address

DDR2_DIMM[5:1]_CK[2:0]_[P,N] 30 DDR2 DIMM Differential Clocks: Three copies per

DIMM

DDR2_DIMM_[RAS,CAS,WE,RESET]_N,

DDR2_DIMM[5:1]_CKE[1:0], DDR2_DIMM_BA[2:0],

DDR2_DIMM[5:1]_CS[1:0]_N,

DDR2_DIMM[5:1]_ODT[1:0]

37 DDR2 DIMM Common Control Signals

DDR2_DIMM[1:5]_CS[1:0]_N,

DDR2_DIMM[1:5]_CKE[1:0],

DDR2_DIMM[1:5]_ODT[1:0]

20 DDR2 DIMM Dedicated Control Signals

DDR2_DIMM_LB_BK[11,13,15]_[IN,OUT] 6 Deep DIMMs (DIMM1 through DIMM4) Loopback

Signals

DDR2_DIMM_LB_BK[12,18,20] 3 Wide DIMM (DIMM5) Loopback Signals (Total of six

FPGA pins)

DDR2_DIMM[1:5]_CNTL_PAR,

DDR2_DIMM[1:5]_CNTL_PAR_ERR,

DDR2_DIMM[1:5]_NC_019, DDR2_DIMM[1:5]_NC_102

20 Miscellaneous Place Holder Signals to the Five

DIMMs

DDR2_DIMM_DQ_BY[0:15]_B[7:0],

DDR2_DIMM_DQS_BY[0:15]_L_[P,N],

DDR2_DIMM_DM_BY[0:15]

176 DDR2 DIMM Data, Strobes, and Data Mask: Bytes 0

through 15

DDR2_DIMM_DQ_CB0_7_B[7:0],

DDR2_DIMM_DQS_CB0_7_L_[P,N],

DDR2_DIMM_DM_CB0_7

11 DDR2 DIMM Data, Strobes, and Data Mask: Check

Byte 0

DDR2_DIMM_DQ_CB8_15_B[7:0],

DDR2_DIMM_DQS_CB8_15_L_[P,N],

DDR2_DIMM_DM_CB8_15

11 DDR2 DIMM Data, Strobes, and Data Mask: Check

Byte 1

DDR2_DIMM[1:5]_SA[2:0] 15 Serial PROM Address

DDR2_DIMM_[SCL,SDA]" 2 Serial PROM interface CLK and Data

Notes:

1. DDR2_DIMM_CKE and DDR2_DIMM_ODT signals are connected to a 4.7KΩ pull-down resistor to meet the memory power-up

requirements.

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QDRII and RLDRAM II Memories

Figure 3-5 summarizes the distribution of QDRII and RLDRAM II component interface

signals among the different banks of the FPGA #3 device.

Figure 3-5: FPGA #3 Banks for QDRII SRAM and RLDRAM II Interfaces (Top View)

BANK 20 (40)

RLDII Data

DQ 0, 1 & D0

BANK 12 (40)

RLDII Data

DQ 2, 3 & D1

BANK 11 (40)

QDRII Data

Q0, 2 & D6

BANK 112

BANK 114 BANK 13 (40)

QDRII Data

Q4, 5, 6

BANK 15 (40)

QDRII Data

D7, 2, 3, 0

BANK 116

BANK 19 (40)

QDRII Data

Q1, 3 & D1

BANK 120

(Configuration)

BANK 0

BANK 3 (20)

General I/O

BANK 5 (20) BANK 23 (40)BANK 124

BANK 1 (20)

System ACE Controls

BANK 18 (40)

RLDII Data

D 2, 3

BANK 17 (40)

QDRII Data

Q7 & D4, 5

BANK 118

BANK 22 (40)

RLDII Address

and Control

BANK 122 BANK 21 (40)

QDRII Address

and Control

BANK 2 (20)

Inter-FPGA MII Links

BANK 25 (40)BANK 126 BANK 6 (20)

BANK 4 (20)

Global Clock Inputs

UG199_c3_05_050106

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Table 3-6 describes all the signals associated with QDRII component memories.

XAPP853: QDR II SRAM Interface for Virtex-5 Devices and its corresponding demo are

included on the CD shipped with the ML561 Tool Kit.

For a complete list of FPGA #3 signals and their pin locations, refer to Appendix A, “FPGA

Pinouts.”

Table 3-7 describes all signals associated with RLDRAM II devices.

XAPP852, RLDRAM II Memory Interface for Virtex-5 FPGAs and its corresponding demo are

included on the CD shipped with the ML561 Tool Kit.

Table 3-6: QDRII Component Signal Summary

Board Signal Name(s) Bits Description

QDR2_SA[18:0] 19 QDRII Address

QDR2_CK_BY0_3_[P,N],

QDR2_CK_BY4_7_[P,N]

4QDRII Differential Clock

QDR2_[R,W,DLL_OFF]_N 3 QDRII Control Signals

QDR2_D_BY[3:0]_B[8:0],

QDR2_K_BY0_3_[P,N],

QDR2_BW_BY[3:0]

42 QDRII Write Data, Strobes, and Byte Write: Bytes 3:0

QDR2_Q_BY[3:0]_B[8:0],

QDR2_CQ_BY0_3_[P,N]

38 QDRII Read Data and Strobes: Bytes 3:0

QDR2_D_BY[7:4]_B[8:0],

QDR2_K_BY4_7_[P,N],

QDR2_BW_BY[3:0]

42 QDRII Write Data, Strobes, and Byte Write: Bytes 7:4

QDR2_Q_BY[7:4]_B[8:0],

QDR2_CQ_BY4_7_[P,N]

38 QDRII Read Data and Strobes: Bytes 7:4

Notes:

1. QDR2_SA[18] is incorrectly labeled QDR2_NC_A3 in the ML561 schematics and layout file.

Table 3-7: RLDRAM II Component Signal Summary

Board Signal Name(s) Bits Description

RLD2_A[19:0], RLD2_BA[2:0] 23 RLDRAM II Address

RLD2_CK_BY0_1 _[P,N] 2 RLDRAM II Differential Clock

RLD2_CK_BY2_3 _[P,N] 2 RLDRAM II Differential Clock

RLD2_CS_BY[0_1,2_3]_N, RLD2_[REF,WE]_N,

RLD2_DM_BY[0_1,2_3]_N, RLD2_QVLD_BY[0_1,2_3]

8 RLDRAM II Control Signals

RLD2_DQ_BY[1:0]_B[8:0], RLD2_DK_BY0_1_[P,N],

RLD2_QK_BY[1:0]_[P,N]

24 RLDRAM II Data and Strobes: Bytes 1:0

RLD2_DQ_BY[3:2]_B[8:0], RLD2_DK_BY0_1_[P,N],

RLD2_QK_BY[3:2]_[P,N]

24 RLDRAM II Data and Strobes: Bytes 3:2

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External Interfaces

The external interfaces of the Virtex-5 FPGA ML561 Development Board are described in

this section.

RS-232

The ML561 board provides an RS-232 serial interface using a Maxim MAX3316ECUP

device. The maximum speed of this device is 460 Kbps.

Hooks are provided to connect and disconnect FPGAs to the RS-232 serial interface, by

placing jumpers on headers based on the FPGA involved in the communication. Only one

FPGA is allowed in the communication, and others must be disconnected before operation.

The ML561 toolkit CD contains code to implement a UART core in one FPGA for

interfacing with a host PC.

The RS-232 interface is accessible through a male DB-9 serial connector (P73).

USB

Full-speed (12 Mbps) USB functionality is proved using a Silicon Laboratories CP2102-GM

USB to RS-232 Bridge. RS-232 and USB signals are converted between one another so a

RS-232 core needs to be implemented in the FPGA for communication. A level translator is

used to convert between the 2.5V I/O of the FPGA and the 3.3V I/O the CP2102 uses.

Hooks are provided to connect and disconnect FPGAs to the USB connection, by placing

jumpers on headers based on the FPGA involved in the communication. Only one FPGA is

allowed in the communication, and others must be disconnected before operation.

The USB interface is accessible through a female ‘A’ USB connector (J29).

Clocks

The ML561 board contains a 200 MHz LVPECL clock oscillator and connectors for external

clock inputs for use as system clocks (J19 and J20). The GTP transceivers use their own

clock source that can be provided through SMA connectors on the board (J16 and J21).

Table 3-8: RS-232 Jumper Settings

To Connect FPGA # to

DB-9 (P73) TX RX

FPGA #1 P52 Pin 2 -> P52 Pin 1 P53 Pin 2 -> P53 Pin 1

FPGA #2 P52 Pin 2 -> P51 Pin 1 P53 Pin 2 -> P54 Pin 1

FPGA #3 P52 Pin 2 -> P52 Pin 3 P53 Pin 2 -> P53 Pin 3

Table 3-9: USB Jumper Settings

To Connect FPGA # to DB-9

(J29) TX RX

FPGA #1 P36 Pin 2 -> P36 Pin 1 P22 Pin2 -> P22 Pin 1

FPGA #2 P36 Pin 2 -> P35 Pin 1 P22 Pin2 -> P23 Pin 1

FPGA #3 P36 Pin 2 -> P36 Pin 3 P22 Pin2 -> P22 Pin 3

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200 MHz LVPECL Clock

The 200 MHz LVPECL clock source is an Epson EG-2121CA200M-PCHS oscillator (Y1)

with a differential output. The oscillator runs at 200 MHz ± 100 PPM with an operating

voltage of 2.5V ±5%. This output is fed into an ICS853006 LVPECL buffer for generating a

separate differential copy for each FPGA as well as a test point (P59).

SMA Clock

Two SMA connectors are provided for the input of an off-board differential clock (J19 and

J20). A differential clock buffer (ICS853006) is used on the board (U17 and U18) to generate

four LVPECL copies of the differential clock signal, one for each FPGA along with a probe

point (P40) for testing. The traces from the buffer are routed as a differential pair to each

FPGA where they are terminated with 100Ω differential termination.

33 MHz Clock

A single-ended 33 MHz Epson SG-8002CA oscillator is provided on the board (Y2) for

testing purposes. Four copies of this clock are generated using a clock buffer (ICS8304) on

the board, one per FPGA along with a probe point for testing (P41).

The application using this clock source as an input to the PLL on the Virtex-5 device has

not yet been fully verified.

Table 3-10: FPGA 200 MHz IDELAY Reference Clock Source

FPGA # Signal Name

1 DIRECT_CLK_TO_FPGA1_P

1 DIRECT_CLK_TO_FPGA1_N

2 DIRECT_CLK_TO_FPGA2_P

2 DIRECT_CLK_TO_FPGA2_N

3 DIRECT_CLK_TO_FPGA3_P

3 DIRECT_CLK_TO_FPGA3_N

Table 3-11: FPGA External Clock Sources

FPGA # Signal Name

1 EXT_CLK_TO_FPGA1_P

1 EXT_CLK_TO_FPGA1_N

2 EXT_CLK_TO_FPGA2_P

2 EXT_CLK_TO_FPGA2_N

3 EXT_CLK_TO_FPGA3_P

3 EXT_CLK_TO_FPGA3_N

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External Interfaces

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33 MHz System ACE Controller Oscillator

A single-ended 33 MHz Epson SG-8002CA oscillator is provided on the board (Y3) as a

clock source for System ACE functionality.

GTP Clocks

Two SMA connectors are provided for the input of an off-board differential clock (J16 and

J21). A differential clock buffer (ICS8543BG) is used on the board (U20) to generate four

LVDS copies of the differential clock signal, two for FPGA #1, one for FPGA #2, and one for

FPGA #3.

A header is used to select between a clock forwarded by the GTP or from the external clock

source used to provide a clock to the FPGA logic.

User I/Os

This subsection describes the devices that connect to the User I/Os of the ML561 board.

These I/Os are provided to ease hardware development using the ML561.

General-Purpose Headers

The 16-pin test headers are surface mounted, one per FPGA. Of the two bytes of test

signals, traces are matched for signals within a byte.

DIP Switch

One four-position DIP switch per FPGA (for a total of three) is available to externally pull

up or pull down a signal on the FPGA. This can be used to manually set values used by the

design running on the FPGA.

Table 3-12: FPGA Slow Clock Sources

FPGA Signal Name

1 FPGA1_LOW_FREQ_CLK

2 FPGA2_LOW_FREQ_CLK

3 FPGA3_LOW_FREQ_CLK

Table 3-13: Test Headers

Header Signal Description Location Header Pin #

FPGA1_TEST_HDR_BY0_B[0:7] P20 (TEST1) Odd pins: 1, 3, 5, 7, 9, 11, 13, 15

FPGA1_TEST_HDR_BY1_B[0:7] P20 (TEST1) Even pins: 2, 4, 6, 8, 10, 12, 14, 16

FPGA2_TEST_HDR_BY0_B[0:7] P21 (TEST2) Odd pins: 1, 3, 5, 7, 9, 11, 13, 15

FPGA2_TEST_HDR_BY1_B[0:7] P21 (TEST2) Even pins: 2, 4, 6, 8, 10, 12, 14, 16

FPGA3_TEST_HDR_BY0_B[0:7] P93 (TEST3) Odd pins: 1, 3, 5, 7, 9, 11, 13, 15

FPGA3_TEST_HDR_BY1_B[0:7] P93 (TEST3) Even pins: 2, 4, 6, 8, 10, 12, 14, 16

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Seven-Segment Displays

One seven-segment display per FPGA (for a total of three) is available for use. The red

Stanley-Electric NAR131SB displays are active Low, using seven inputs to display a

character or number plus another input for a decimal point.

Light Emitting Diodes (LEDs)

Each FPGA is able to control four active-high green LEDs. The green is used to distinguish

the User LEDs from the blue system LEDs on the Virtex-5 FPGA ML561 Development

Board.

Pushbuttons

The ML561 board contains two momentary pushbuttons. Their functions and locations are

described in Table 3-14.

The Reset signal goes to a buffer (U32) that provides a separate copy of Reset to each

FPGA.

Figure 3-6: Seven-Segment Display Signal Mapping

7SEG_5_N 7SEG_1_N

7SEG_0_N

7SEG_6_N

7SEG_3_N

7SEG_4_N 7SEG_2_N

7SEG_DP_N

UG199_c3_06_050106

Table 3-14: User Pushbuttons

Button Description Pin Connection

SW7 PROG_B: Configure FPGA System ACE Controller: Pin 33

SW4 RESET_N: Reset the FPGA designs FPGA #1: AH14

FPGA #2: AH14

FPGA #3: AH14

Virtex-5 FPGA ML561 User Guide www.xilinx.com 31

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Power On or Off Slide Switch

The power on or off slide switch is a DPST slide switch used to apply input power to the

board. While the board contains two such switches, the 5V switch is primarily used to

supply 5V power to the board, whereas the 12V switch is available for testing only.

Soft Touch Probe Points

Soft Touch E5396A Probeless connection points are provided for monitoring FPGA #2 and

FPGA #3 test signals with a compatible Agilent logic analyzer. FPGA #2 uses separate test

signals for soft touch pins, while FPGA #3 shares the general-purpose test header signals

with soft touch pins due to lack of available I/O pins.

Power Measurement Header

The ML561 comes with a 3M Pak 100 power measurement header to enable easy

measurement of the power being consumed by the devices on the ML561. Each power

regulator uses an Isotek Kelvin current sense resistor (SMV-R010-0.5) in the path from the

output of the regulator to the power plane. The power can be computed by measuring the

voltage drop across each of these resistors.

Figure 3-7: Virtex-5 FPGA ML561 Development Board Power Measurement System

Table 3-15: Power Measurement Header Pins (P102)

Header Signal Power Header Pin #

VCC1V0_SENSE+ 1

VCC1V0_SENSE- 2

VCC1V0_MON 3

VCC2V5_SENSE+ 5

VCC2V5_SENSE- 6

VCC2V5_MON 7

VCC3V3_SENSE+ 9

VCC3V3_SENSE- 10

VCC3V3_MON 11

UG199_c3_07_050106

MARGIN+ MARGIN-

Voltage

Regulator

RSET

VIN VOUT

+5V or +12V To FPGA or

Other Device

To

Monitor

Cable

VCCXX Sense-

VCCXX Sense+

VCCXX Mon

VCCX

RKELVIN = 10 mΩ

1KΩ

VCCXXPR

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Liquid Crystal Display Connector

Previous memory boards such as the ML461 had a DisplaytechQ 64128E-FC-BC-3LP

64x128 LCD panel. This display was removed from the ML561, but the connection is still

available for use with embedded systems if the user connects the display to connector

(P104). The LCD panel needs to hang off the edge of the board as shown in Figure 3-8.

VCC1V8_SENSE+ 13

VCC1V8_SENSE- 14

VCC1V8_MON 15

VCC1V5_SENSE+ 17

VCC1V5_SENSE- 18

VCC1V5_MON 19

VCC2V6_SENSE+ 21

VCC2V6_SENSE- 22

VCC2V6_MON 23

VCC5_SENSE+ 25

VCC5_SENSE- 26

VCC5_MON 24

VCC5 20

GND 4

GND 8

GND 12

GND 16

Table 3-15: Power Measurement Header Pins (P102) (Continued)

Header Signal Power Header Pin #

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UG199 (v1.2) April 19, 2008

Power Regulation

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The product specification at

http://www.displaytech.com.hk/pdf/graphic/64128e%20series-v10.PDF provides more

information. Appendix C, “LCD Interface,” describes the LCD operation in detail.

Power Regulation

This section describes the devices that supply power to the Virtex-5 FPGA ML561

Development Board. For electrical requirements and power consumption, see Chapter 4,

“Electrical Requirements.”

Power Distribution

The ML561 board uses +5V to drive numerous voltage regulators. Figure 3-9 shows a

general overview of the power distribution system.

The Virtex-5 FPGA ML561 Development Board is powered through the +5V input jack

(J28) from the power supply included in the ML561 Tool Kit. Alternatively, the +5V can

Figure 3-8: LCD Panel Connector for Possible LCD Support

HSTL

FPGA3

HSTL

VTT & VREF

VCCAUX /

VCCO

USB

DIP3

7SEG3

7SEG1

Config3

PROG

5V Input

Jack

5V Banana

Jacks

12V Input

Jack

SPY

SPY

OFF

OFF

ON

RESET

JTAG

UG199_c3_08_050106

System ACE

Controller

FPGA3 LEDs

JTAG Test Header

Test Header 3

A1

Serial Header

HSTL

12V -> 5V

RLDRAM II QDRII

QDRII

RS232

Driver

RLDRAM II

3.3V

LCD Connector

Pwr Measure Header

LCD

Figure 3-9: Virtex-5 FPGA ML561 Development Board Power Distribution System

Board Power

3.3V

FPGA Power

VCCINT or VCCAUX/VCCO

VTT VTT

To FPGAs

To All FPGAs

To Memories

To Devices

VREF VREF

MGT

Power MGT Power

12V -> 5V

+12V

+5V

Slide

Switch

Slide

Switch

FPGA Power

SSTL18, HSTL, or SSTL2

Memory Power

SSTL18, HSTL, or SSTL2

UG199_c3_09_050106

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also be supplied from a bench supply using the two banana jacks: J25 (RED) for +5V and

J24 (BLACK) for GND.

The Rev-A assembly of the Virtex-5 FPGA ML561 Development Board does not support

the +12V input via jack J23 or via banana jacks J18 (RED) for +12V and J17 (BLACK) for

GND.

The memory and FPGAs use separate power supplies for SSTL18, HSTL, and SSTL2,

respectively. Thus the power being consumed can be easily measured for each using the

power measurement header provided on the ML561.

Voltage Regulators

The +5V voltage source is supplied as input to nine on-board regulator modules. Six of

those modules (TI PTH05010-WAZ) are used to generate the +1.0V, +2.5V, and +1.8V for

SSTL18 at FPGA #1 and FPGA #2, +1.8V for HSTL18 at FPGA #3, +2.6V for SSTL2 at

FPGA #1, and +3.3V voltages for the GTP power supplies, LEDs, etc. The remaining three

modules (TI PTH05000-ADJ) are used to generate +1.8V for SSTL18 at the memories, +1.8V

for HSTL at the memories, and +2.6V for SSTL2 at the memories.

An additional three bulk voltage regulators (Fairchild FN6555) are used to generate

termination (VTT) and reference (VREF) voltages each for the SSTL2, SSTL18, and HSTL

power levels. By design, these voltage levels are half of the input reference voltage being

supplied by the memory power supplies.

The TI PTH05010-WAZ and TI PTH05000-ADJ regulator modules require a fixed 5V input.

The output is adjustable over a range of 0.9V to 3.6V by changing the resistor tied between

pin 4 and GND. The difference between these two modules is that the PTH05010-WAZ

output voltage can be margined up to+ 5% of the nominal value by driving pin 10 to GND

(or digital Low), or margined down to -5% of the nominal value by driving pin 9 Low. The

PTH05010-WAZ also has a tracking feature that can be used to track another voltage

source.

There are two ways to apply the digital controls to the margin input pins of the PTH05010:

either from FPGA #1 or manually with jumpers.

Figure 3-10: PTH05010 Voltage Regulator

PTH05010

Voltage Regulator

VIN

GND TRACK MRGNUP MRGNDN GND

CIN RSET

470 μF

COUT

330 μF

(optional)

VOUT

5V

+ +

1

2

3 5 4

6

7

8 9 10

Inhibit

Jumper

INHIBIT VO_ADJ VO_SENSE

VMARGIN_UP_xxxx_N

VMARGIN_DN_xxxx_N

TRACK

UG199_c3_10_050106

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The FPGA can drive VMARGIN_DN_xxxx_N and VMARGIN_UP_xxxx_N signals, where

xxxx indicates one of the six main power regulators: SSTL2, HSTL, SSTL18, VCC1V0,

VCC2V5, and VCC3V3.

If both voltage-margining inputs to the power regulator are pulled Low, the output voltage

is close to nominal but has the possibility of a slightly higher error in the output voltage.

The power modules use a low-leakage open-drain control signal to control the voltage

margining. In the FPGA, this can be approximated by using a control signal that drives the

output Low when active and does not drive the signal at all when inactive (high-

impedance output).

Three-pin headers are available for performing manual voltage margining, using jumpers

to select between Nominal, -5%, and +5%. Table 3-17 shows the jumper settings.

The TI PTH05010-WAZ and TI PTH05000-ADJ regulator outputs can be enabled or

inhibited through the use of on-board two-pin jumpers. The inhibit jumpers use the

following conventions:

•Jumper OFF = Enabled

•Jumper ON = Inhibited

Table 3-16: Manual Voltage Margining

VMARGIN_UP_N VMARGIN_DN_N Output Voltage

High High Nominal

High Low -5%

Low High +5%

Low Low Not Applicable

Table 3-17: FPGA #1 Signals and On-Board Jumpers for Voltage Margining

Power Regulator Signal Name Jumper Setting

VCCINT (VR6) VMARGIN_UP_VCC1V0_N P48: 1 -> 2

VMARGIN_DN_VCC1V0_N P48: 3 -> 2

SSTL18 (VR1) VMARGIN_UP_SSTL18_N P4: 1 -> 2

VMARGIN_DN_SSTL18_N P4: 3 -> 2

SSTL2 (VR9) VMARGIN_UP_SSTL2_N P450 1 -> 2

VMARGIN_DN_SSTL2_N P50: 3 -> 2

HSTL (VR10) VMARGIN_UP_HSTL_N P58: 1 -> 2

VMARGIN_DN_HSTL_N P58: 3 -> 2

VCCAUX (VR12) VMARGIN_UP_VCC2V5_N P69: 1 -> 2

VMARGIN_DN_VCC2V5_N P69: 3 -> 2

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Table 3-18 summarizes the inhibit headers.

Board Design Considerations

UG086, Memory Interface Generator (MIG) User Guide includes PCB implementation rules

and guidelines to be followed for designing a board for a MIG reference design.

The Virtex-5 FPGA ML561 Development Board design allows implementation of DCI

termination scheme at the FPGA for each of the memory interfaces on the board. A

preliminary analysis of the Weighted Average Simultaneously Switching Outputs

(WASSO) for all three Virtex-5 devices indicates that the SSO guidelines are met for the

current pinout. The following factors helped to reduce the SSO noise as compared to the

Virtex-4 FPGA ML461 board implementation:

•SparseChevron pinout resulting in larger number of Power/GND pin pairs per bank

•A revised higher SSO allowance per Power/GND pair for SparseChevron packages

•Reduced thickness of the board (74 mils vs. 98 mils) resulting in reduced via

inductance

External terminations at both the memory and FPGA are provided for data signals for

most of the memory interfaces on the Virtex-5 FPGA ML561 Development Board layout.

The external VTT termination is implemented with a single 50Ω termination to the VREF

level. See Chapter 5, “Signal Integrity Recommendations,” for specific recommendations

and guidelines for terminations.

These are VTT end terminations to the respective voltage levels for SSTL2, SSTL18, and

HSTL signals. There are two topologies of end terminations for data signals:

1. Fly-by termination: The parallel termination is placed after the receiver pin.

2. Non-fly-by termination: The parallel termination is placed between the driver and the

receiver along the trace as close to the receiver pin as possible. Also the stub from

signal trace to the termination resistor is kept very short, within 0.1 inch.

For Read data, terminations at the FPGA have non-fly-by termination topology. These

terminations can be selectively depopulated on the ML561 board when DCI termination is

implemented inside FPGA for received data. Due to non-fly-by termination topology, the

result is a minimal stub for the signal, thus preserving good signal integrity for read data.

Table 3-18: Headers for Voltage Regulator Inhibition

Power Regulator Inhibit Header

VCCINT (VR6) P63

SSTL18 (VR1) P11

SSTL18_M (VR4) P32

SSTL2 (VR9) P68

SSTL2_M (VR2) P5

HSTL (VR10) P74

HSTL_M (VR14) P105

VCCAUX (VR12) P79

VCC3V3 (VR13) P101

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UG199 (v1.2) April 19, 2008

Board Design Considerations

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For Write data and terminations at the memory, if the trace length from the receiver pin to

the termination resistor can be guaranteed to be within 0.3 inches, then the fly-by

termination scheme is implemented. Otherwise, the non-fly-by termination topology is

implemented for Write data at the memory end.

The physical dimensions of the raw PCB are 12.75 inches x 11.75 inches. With the

overhangs due to edge connectors, the actual size of the fully assembled board is

approximately 13 inches x 12 inches, with 1.5 inches height allowance for the DIMM

modules. This 14-layer board has 6 signal layers, 4 GND layers, and 4 power planes and

uses Polyclad 370HR material for lead-free assembly. Figure 3-11 shows a stack-up

diagram of the ML561 Revision A PCB.

Refer to UG203, Virtex-5 PCB Designer’s Guide for more information on the PCB design

using Virtex-5 devices.

Figure 3-11: ML561 Revision A PCB Stack-Up

73.90 ±7 mils

UG199_c3_11_102407

1.0 oz, TOP, Z0 = 50Ω, width = 6 mils

3.8 mils, Er = 4.4

1.0 oz, 02_GND1

4 mils, Er = 4.4

0.5 oz, 03_INR1, Z0 = 50Ω, width = 4.5 mils

5.3 mils, Er = 4.4

1.0 oz, 04_PWR1

8 mils, Er = 4.4

0.5 oz, 05_INR2, Z0 = 50Ω, width = 4.5 mils

3.2 mils, Er = 4.4

1.0 oz, 06_GND2

3 mils, Er = 4.4

1.0 oz, 07_PWR2

3.3 mils, Er = 4.4

1.0 oz, 08_PWR3

3 mils, Er = 4.4

1.0 oz, 09_GND3

3.2 mils, Er = 4.4

0.5 oz, 10_INR5, Z0 = 50Ω, width = 4.5 mils

8 mils, Er = 4.4

1.0 oz, 11_PWR4

5.3 mils, Er = 4.4

0.5 oz, 12_INR6, Z0 = 50Ω, width = 4.5 mils

4 mils, Er = 4.4

1.0 oz, 13_GND4

3.8 mils, Er = 4.4

1.0 oz, BOTTOM, Z0 = 50Ω, width = 6 mils

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Table 3-19 shows the details of the dielectric material and construction for each layer and

the controlled impedance values for the signal layers.

Table 3-19: ML561 Revision A PCB Controlled Impedance

Seq # Layer

Name Type Usage

Cu

Weight

(oz.)

Substrate

Thickness

(mils)

Er

Test

Width

(mils)

Z0

(ohms) Comment

1 TOP Metal Signal 1.0 <Auto> 6 50 ±5 Microstrip Signal Top

2 Dielectric Substrate 3.8 4.4

3 02_GND1 Metal Plane 1.0 <Auto> Ground Plane #1

4 Dielectric Substrate 4 4.4

5 03_INR1 Metal Signal 0.5 <Auto> 4.5 50 ±5 Stripline Signal - Inner #1

6 Dielectric Substrate 5.3 4.4

7 04_PWR1 Metal Plane 1.0 <Auto> Split Power Plane #1

8 Dielectric Substrate 8 4.4

9 05_INR2 Metal Signal 0.5 <Auto> 4.5 50 ±5 Stripline Signal - Inner #2

10 Dielectric Substrate 3.2 4.4

11 06_GND2 Metal Plane 1.0 <Auto> Ground Plane #2

12 Dielectric Substrate 3 4.4

13 07_PWR2 Metal Plane 1.0 <Auto> Split Power Plane #2

14 Dielectric Substrate 3.3 4.4

15 08_PWR3 Metal Plane 1.0 <Auto> Split Power Plane #3

16 Dielectric Substrate 3 4.4

17 09_GND3 Metal Plane 1.0 <Auto> Ground Plane #3

18 Dielectric Substrate 3.2 4.4

19 10_INR5 Metal Signal 0.5 <Auto> 4.5 50 ±5 Stripline Signal - Inner #3

20 Dielectric Substrate 8 4.4

21 11_PWR4 Metal Plane 1.0 <Auto> Split Power Plane #4

22 Dielectric Substrate 5.3 4.4

23 12_INR6 Metal Signal 0.5 <Auto> 4.5 50 ±5 Stripline Signal - Inner #4

24 Dielectric Substrate 4 4.4

25 13_GND4 Metal Plane 1.0 <Auto> Ground Plane #4

26 Dielectric Substrate 3.8 4.4

27 BOTTOM Metal Signal 1.0 <Auto> 6 50 ±5 Microstrip Signal Bottom

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Chapter 4

Electrical Requirements

This chapter provides the electrical requirements for the Virtex-5 FPGA ML561

Development Board. It contains the following sections:

•“Power Consumption”

•“FPGA Internal Power Budget”

Power Consumption

Table 4-1 lists the operating voltages, maximum currents, and power consumption used by

the ML561 board devices. The Virtex-5 FPGA ML561 Development Board has provisions

for two power inputs: a 5V power supply and a 12V power supply. The maximum rating of

a commercially available 5V power supply is limited to 8A, or a 40W maximum capacity.

This power supply is similar to the 5V brick used for previous memory tool kits, for

example, ML461. This tool kit expects the Virtex-5 FPGA ML561 Development Board to

exercise only one external memory interface at a time. In this case, the total power

consumption of the board stays within the 40W limit.

As shown in Table 4-1, if all three FPGA devices and their associated memory devices are

activated simultaneously, then the total power consumption is approximately 57W, which

exceeds the 40W capacity of the 5V power brick. So an alternate 12V power input jack (J23)

is provided on the Virtex-5 FPGA ML561 Development Board to hook up a 12V power

brick, for example, CUI DTS120500U with a 60W capacity. The 12V is converted to 5V

using the TI PTH12010WAS power module (VR11), which can supply up to 12A of current

at 5V, or a 60W capacity.

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Table 4-1: ML561 Power Consumption

Device Description Quantity Voltage (V) Current

(mA)

Power

(W) Source

Total Available Power

5V Power Supply 1 5.0 8000 40.0 Bellus Power SPD-050-5

12V Power Supply 1 12.0 5000 60.0 CUI DTS120500U

Power Consumed

DDR400 Component Interface

XC5VLX50T-FFG1136:

FPGA #1 (DDR400)

1 1.0, 2.5, 2.6 1887 3.7 Xilinx Power Estimator

DDR x16 Memory 2 2.6 210 1.1 Micron DDR Component Data Sheet

DDR Comp VTT Termination 60 1.2 16 1.2 All signals. ±608 mV swing around VTT

DDR2 Component Interface

XC5VLX50T-FFG1136:

FPGA #1 (DDR2) 11.0, 1.8[S],

2.5 1991 3.1 Xilinx Power Estimator

DDR2 x16 Memory 2 1.8 250 0.9 Micron DDR2 Component Data Sheet

DDR2 Comp VTT Termination 25 1.2 16 0.5 Addr/Cntl: ±603 mV swing around VTT

DDR2 DIMM Interface

XC5VLX50T-FFG1136:

FPGA #2 (DDR2) 11.0, 1.8[S],

2.5 6420 10.2 Xilinx Power Estimator

DDR2 DIMM 2 1.8 1755 6.3 Micron DDR2 DIMM Data Sheet

DDR2 DIMM VTT Termination 160 1.2 16 3.1 All signals: ±603 mV swing around VTT

QDRII Memory Interface

XC5VLX50T-FFG1136:

FPGA #3 (QDRII) 11.0, 1.8[H],

1.8[S], 2.5 3917 6.3 Xilinx Power Estimator

QDRII Memory [H] 2 1.8 950 3.4 Samsung QDRII Data Sheet

QDRII VTT Termination 175 1.0 16 2.8 All signals. ±500 mV swing around VTT

RLDRAM II Memory Interface

XC5VLX50T-FFG1136:

FPGA #3 (RLDRAM II) 11.0, 1.8[H],

2.5 3069 4.5 Xilinx Power Estimator

RLDRAM II Memory 2 1.8 920 3.3 Micron RLDRAM II Data Sheet

RLDRAM II VTT Termination 60 1.0 16 1.0 All signals. ±500 mV swing around VTT

Miscellaneous Circuit

Clock Buffer 1 3.3 23 0.1 ICS8304 Data Sheet

Differential Clock Buffer 2 3.3 115 0.8 ICS853006 Data Sheet

System ACE Controller 1 3.3 200 0.7

DS080,

System ACE CompactFlash Solution

200 MHz Oscillator 1 2.5 30 0.1 Epson EG2121CA Data Sheet

33 MHz Oscillator 2 3.3 45 0.3 Epson SG-8002CA Data Sheet

Total Power Consumed 53.2

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Power Modules Capacity

VCCINT Power Plane (1.0V) 1 1.00 15000 15.0 TI PTH05010 15A Module Data Sheet

HSTL FPGA Power Plane (1.8V) 1 1.80 15000 27.0

HSTL Memory Power Plane (1.8V) 1 1.80 6000 10.8 TI PTH05000 6A Module Data Sheet

HSTL _VREF Power Plane (0.9V) 1 0.90 3000 2.7 Fairchild FN6555 Data Sheet

SSTL18 FPGA Power Plane (1.8V) 1 1.80 15000 27.0 TI PTH05010 15A Module Data Sheet

SSTL18 Memory Power Plane (1.8V) 1 1.80 6000 10.8 TI PTH05000 6A Module Data Sheet

SSTL18 _VREF Power Plane (0.9V) 1 0.90 3000 2.7 Fairchild FN6555 Data Sheet

SSTL2 FPGA Power Plane (2.6V) 1 2.60 15000 39.0 TI PTH05010 15A Module Data Sheet

SSTL2 Memory Power Plane (2.6V) 1 2.60 6000 15.6 TI PTH05000 6A Module Data Sheet

SSTL2 _VREF Power Plane (1.3V) 1 1.30 3000 3.9 Fairchild FN6555 Data Sheet

2.5V Power Plane 1 2.50 15000 37.5 TI PTH05010 15A Module Data Sheet

3.3V Power Plane 1 3.30 15000 49.5

12V-to-5V Converter 1 5.00 12000 60.0 TI PTH12010 12A Module Data Sheet

Notes:

1. [S] = 1.8V power for SSTL18 plane.

2. [H] = 1.8V power for HSTL18 plane.

Table 4-1: ML561 Power Consumption (Continued)

Device Description Quantity Voltage (V) Current

(mA)

Power

(W) Source

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Table 4-2 lists the 12 different power planes on the Virtex-5 FPGA ML561 Development

Board. For the SSTL2, SSTL18, and HSTL power, separate power modules are

implemented for VCCO to FPGA, and VDD to memory, allowing for ease of power

measurement for the FPGAs. The power modules for VCCO inputs are implemented with

TI PTH05010 modules, which have provisions for ±5% voltage margining pins.

Each of the three Fairchild FN6555 Bus Terminator Regulators has two voltage outputs:

one each for VREF and VTT. The FN6555 regulator is a push-pull device rated at ± 3A for the

VTT output and 3 mA for the VREF output.

Because the VREF voltage is used by the FPGA and memory devices only as reference, the

power supply does not source any real current. Thus the 3 mA capacity for the VREF output

is considered sufficient.

The VTT voltage is guaranteed to within ± 20 mV of the VREF output by the FN6555

regulator. The minimum driver output voltage swing around VREF is specified for the

SSTL18, SSTL2, and HSTL I/O standards as:

•SSTL2: ± 608 mV

•SSTL18: ± 603 mV

•HSTL: ± 500 mV (for HSTL18)

For a given memory interface, the maximum number of single-ended (non-differential)

signals that might need to be pulled up or down at a time for QDRII is 144 data bits and

approximately 30 address and control signals. The differential pair signals offset for the

sink and source of current. With a continuous current capacity of 3A for the FN6555

regulator, the regulator can supply up to (3000 / 175) = 17 mA of current per signal. The

maximum drive strength for a driver is specified at 16 mA. For a 50Ω VTT termination, this

Table 4-2: Power Planes

Voltage Regulator Module (VRM) Part Power Plane VRM REFDES Stack-Up

Layer

TI PTH05010 15A Modules

VCCINT Power Plane (1.0V) VR6 Layer 4

SSTL18 FPGA Power Plane (1.8V) VR1 Layer 7

HSTL FPGA Power Plane (1.8V) VR10 Layer 8

VCCAUX Power Plane (2.5V) VR12 Layer 11

SSTL2 FPGA Power Plane (2.6V) VR9 Layer 8

TTL Power Plane (3.3V) VR13 Layer 11

TI PTH05000 6A Modules

SSTL18 Memory Power Plane (1.8V) VR4 Layer 7

HSTL Memory Power Plane (1.8V) VR14 Layer 8

SSTL2 Memory Power Plane (2.6V) VR2 Layer 8

Fairchild FN6555 3A Bus Term Regulators

(Separate outputs for VTT and VREF)

SSTL18_VREF Power Plane (0.9V) U14 Layer 8

SSTL18_VTT Power Plane (0.9V) Layer 8

HSTL_VREF Power Plane (0.9V) U42 Layer 7

HSTL_VTT Power Plane (0.9V) Layer 7

SSTL2_VREF Power Plane (1.3V) U2 Layer 7

SSTL2_VTT Power Plane (1.3V) Layer 7

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current can support a voltage swing of up to (16 mA * 50Ω) = 800 mV, which is sufficient to

meet the output voltage specifications for SSTL18, SSTL2, and HSTL18 I/O standards.

Table 4-3 separates the power consumption information from Table 4-1 according to the

nine TI power modules for the first set of nine power planes and the three Fairchild

regulators for the VTT power planes. The positive values in the Excess Power column of

Table 4-3 show that each of the 14 modules can supply the necessary power for the

corresponding power plane.

Table 4-3: ML561 Power Plane Capacities

Device Description Quantity Voltag e

(V)

Current

(mA)

Power

(W)

Excess

Power

(W)

Source

Total Available Power

5V Power Supply 1 5.0 8000 40.0 Bellus Power SPD-050-5

12V Power Supply 1 12.0 5000 60.0 CUI DTS120500U

Power Consumed by Power Plane

XC5VLX50T-FFG1136: FPGA #1

(DDR400, DDR2) 1 1.0 2289 2.3 Xilinx Power Estimator

XC5VLX50T-FFG1136: FPGA #2

(DDR2 DIMM) 1 1.0 1945 1.9 Xilinx Power Estimator

XC5VLX50T-FFG1136: FPGA #3

(QDRII and RLDRAM II) 1 1.0 2675 2.7 Xilinx Power Estimator

VCCINT Power Plane (1.0V) Capacity 1 1.0 15000 15.0 8.1 TI PTH05010 15A Module Data

Sheet

XC5VLX50T-FFG1136: FPGA #3

(QDRII and RLDRAM II) 1 1.8 3876 7.0 Xilinx Power Estimator

HSTL FPGA Power Plane (1.8V)

Capacity 1 1.8 15000 27.0 20.0 TI PTH05010 15A Module Data

Sheet

QDRII Memory [H] 2 1.8 950 3.4 Samsung QDRII Data Sheet

RLDRAM II Memory 2 1.8 920 3.3 Micron RLDRAM II Data Sheet

HSTL_Mem Power Plane (1.8V)

Capacity 1 1.8 6000 10.8 4.1 TI PTH05000 6A Module Data

Sheet

QDRII VTT Termination 175 1.0 16 2.8 All signals. ±500 mV swing

around VTT.

RLDRAM II VTT Termination 60 1.0 16 1.0 All signals. ±500 mV swing

around VTT.

HSTL _VREF Power Plane (0.9V) 1 0.9 3000 2.7 -0.1 Fairchild FN6555 Data Sheet

XC5VLX50T-FFG1136:

FPGA #1 (DDR2) 1 1.8 1011 1.8 Xilinx Power Estimator

XC5VLX50T-FFG1136:

FPGA #2 (DDR2 DIMM) 1 1.8 4258 7.7 Xilinx Power Estimator

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SSTL18 FPGA Power Plane (1.8V)

Capacity 1 1.8 15000 27.0 17.5 TI PTH05010 15A Module Data

Sheet

DDR2 x16 Memory 2 1.8 250 0.9 Micron DDR2 Component Data

Sheet

DDR2 DIMM 2 1.8 1755 6.3 Micron DDR2 DIMM Data Sheet

SSTL18_Mem Power Plane (1.8V)

Capacity 1 1.8 6000 10.8 3.6 TI PTH05010 15A Module Data

Sheet

DDR2 Comp VTT Termination 25 1.2 16 0.5 Addr/Cntl: ±603 mV swing

around VTT

DDR2 DIMM VTT Termination 160 1.2 16 3.1 All signals: ±603 mV swing

around VTT

SSTL18 _VREF Power Plane (0.9V) 1 0.9 3000 2.7 -0.9 Fairchild FN6555 Data Sheet

XC5VLX50T-FFG1136: FPGA #1

(DDR400, DDR2) 1 2.5 609 1.5 Xilinx Power Estimator

XC5VLX50T-FFG1136: FPGA #2

(DDR2 DIMM) 1 2.5 218 0.5 Xilinx Power Estimator

XC5VLX50T-FFG1136: FPGA #3

(QDRII and RLDRAM II) 1 2.5 435 1.1 Xilinx Power Estimator

Differential Clock Buffer 2 2.5 115 0.8 ICS853006 Data Sheet

200 MHz Osc 1 2.5 30 0.1 Epson EG2121CA Data Sheet

2.5V Power Plane Capacity 1 2.5 15000 37.5 34.1 TI PTH05010 15A Module Data

Sheet

XC5VLX50T-FFG1136: FPGA #1

(DDR400) 1 2.6 950 2.5 Xilinx Power Estimator

SSTL2_FPGA Power Plane (2.6V)

Capacity 1 2.6 15000 39.0 36.5 TI PTH05010 15A Module Data

Sheet

DDR x16 Memory 2 2.6 210 1.1 Micron DDR Component Data

Sheet

SSTL2_Mem Power Plane (2.6V)

Capacity 1 2.6 6000 15.6 14.5 TI PTH05010 15A Module Data

Sheet

DDR Comp VTT Termination 60 1.2 16 1.2 All signals. ±608 mV swing

around VTT

SSTL2 _VREF Power Plane (1.3V) 1 1.3 3000 3.9 2.7 Fairchild FN6555 Data Sheet

Clock Buffer 1 3.3 23 0.1 ICS8304 Data Sheet

Table 4-3: ML561 Power Plane Capacities (Continued)

Device Description Quantity Voltag e

(V)

Current

(mA)

Power

(W)

Excess

Power

(W)

Source

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System ACE Controller 1 3.3 200 0.7 DS080, System ACE

CompactFlash Solution

33 MHz Oscillator 2 3.3 45 0.3 Epson SG-8002CA Data Sheet

3.3V Power Plane Capacity 1 3.3 15000 49.5 47.8 TI PTH05010 15A Module Data

Sheet

Total Power Consumed 53.2

12V-to-5V Power Module Capacity 1 5.0 12000 60.0 6.8 TI PTH12010 12A Module Data

Sheet

Notes:

1. [S] = 1.8V power for SSTL18 plane.

2. [H] = 1.8V power for HSTL18 plane.

Table 4-3: ML561 Power Plane Capacities (Continued)

Device Description Quantity Voltag e

(V)

Current

(mA)

Power

(W)

Excess

Power

(W)

Source

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FPGA Internal Power Budget

Table 4-4 summarizes power consumption estimates by each of the three

XC5VLX50T-FFG1136 FPGAs on the Virtex-5 FPGA ML561 Development Board. This

estimate derives the FPGA utilization information from the respective map report of a fully

configured reference design.

Table 4-4: ML561 FPGA Power Estimate Summary

FPGA # FPGA #1 FPGA #2(1) FPGA #3

Interface DDR400 Comp

(DCI)

DDR2 Comp

(DCI)

DDR2 DIMM

(DCI) QDRII (DCI) RLDRAM II

(DCI)

I/O Standard SSTL_18 HSTL_18 HSTL_18

Total Power (W) 3.7 3.1 10.2 6.3 4.5

VCCINT (1.0V) mW 763 763 1945 1160 1515

VCCAUX (2.5V) mW 435 544 544 544 544

SSTL_18 VCCO (1.8V) mW 1819 7664

SSTL_2 VCCO (2.6V) mW 2469

HSTL_18 VCCO (1.8V) mW 4571 2406

I/O Frequency (MHz) 200 400 400 400 400

Fabric Frequency (MHz) 200 200 200 200 200

Number of Slices 1500 1500 5910 2750 1951

Number of Flip-flops 2000 2000 7352 2000 1800

Number of Shift Register LUTs 50 50 143 750 400

Number of Block RAMs 5 5 17 14 21

Number of DCMs 2 2 2 2 2

Inputs 10 10 10 90 13

Outputs 50 50 90 160 52

Bidirectionals 36 40 192 0 36

Ambient Temperature (°C) 25 25 25 25 25

Airflow (LFM) 0 0 250 250 0

Heat Sink (Theta-J) n/a n/a 5 5 n/a

Junction Temperature (°C) 67 60 78 58 76

Notes:

1. For DDR2 DIMMs as well as QDRII memory interfaces with DCI, an MD35E-10B heat sink is needed. A heat sink with Theta-J = 5.0

should be okay without airflow. See http://www.alphanovatech.com/c_md35e.html for the heat sink profile. A heat sink with

Theta-J = 5.0 might need airflow of 250 LFM.

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Chapter 5

Signal Integrity Recommendations

Termination and Transmission Line Summaries

The following are common recommendations for the signal termination scheme to all

external memories implemented on the Virtex-5 FPGA ML561 Development Board:

•Single-ended signals: Simulation indicates that for a single-ended signal, there is no

significant performance difference for a signal with split termination of 100Ω + 100Ω

between VDD and GND versus the VTT termination of 50Ω to the VREF voltage.

Because the power consumption for the split termination is considerably higher than

the VTT termination for the SSTL2, SSTL18, and HSTL I/O standards, VTT termination

is recommended for single-ended signals on the board, such as data, address, and

control. For bidirectional single-ended signals (for example, DDR2 DQ), the VTT

termination is provided at both ends of the signal at the FPGA as well as at the

memory.

•Differential signals: For differential pair signals, a 100Ω differential termination is

provided between the two legs of the differential pair. This termination is placed

closest to the load. For bidirectional differential signals (for example, DDR2 DQS), the

differential SelectIO™ primitives in Virtex-5 FPGAs (for example,

DIFF_SSTL_II_18_DCI), account for the differential termination within the IOB. So

external differential termination is required only at the memory.

•Multiload signals: Address and control signals are driven by the FPGA, and they

have multiple loads. The termination is placed at the end of the trace after the last

load.

Table 5-1 through Table 5-5 summarize the specific termination schemes used on the

Virtex-5 FPGA ML561 Development Board for the following five different memory

interfaces. For each signal category, these tables include reference to the preliminary IBIS

simulation results(1).

1. DDR400 SDRAM Components (Table 5-1)

2. DDR2 SDRAM DIMM (Table 5-2)

3. DDR2 SDRAM Components (Table 5-3)

4. QDRII SRAM (Table 5-4)

5. RLDRAM II (Table 5-5)

1. Virtex-4 device IBIS models were used during the development of the ML561 board to understand the

expected signal integrity of the memory interface signals. When the Virtex-5 device IBIS models are available,

the results of post-layout IBIS simulations and characterization results will be reported.

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Table 5-1: DDR400 SDRAM Component Terminations

Signal FPGA Driver Termination at FPGA Termination at Memory

Data (DQ) SSTL2_II_DCI No termination 50Ω pull-up to 1.3V

Data Strobe (DQS) SSTL2_II_DCI No termination 50Ω pull-up to 1.3V

Clock (CK, CK) SSTL2_II No termination 100Ω differential termination

between pair

Address (A, BA) SSTL2_II No termination 50Ω pull-up to 1.3V after the last

component

Control (RAS, CAS, WE, CS, DM, and

CKE)

SSTL2_II No termination 50Ω pull-up to 1.3V after the last

component

Table 5-2: DDR2 SDRAM DIMM Terminations

Signal FPGA Driver Termination at FPGA Termination at Memory

Data (DQ) SSTL18_II_DCI No termination No termination (use 75Ω ODT(1))

Data Strobe (DQS, DQS) DIFF_SSTL18_II_DCI No termination No termination (use 75Ω ODT)

Data Mask (DM) SSTL18_II No termination No termination (use 75Ω ODT)

6 Pairs of Clocks (CK, CK),

3 each per DIMM

SSTL18_II No termination No termination(2)

Address (A, BA) SSTL18_II No termination 50Ω pull-up to 0.9V after the second

DIMM

Control (RAS, CAS, WE,

CS, CKE, and others)

SSTL18_II No termination 50Ω pull-up to 0.9V after the second

DIMM

Notes:

1. Due to use of DCI I/O for DQ and DQS, these signals have parallel termination at the source during Write operations. Simulation

results show that use of a weaker 75Ω ODT instead of a matching 50Ω ODT setting gives better noise margin at the memory.

2. The DIMM already contains 120Ω differential termination. A 5 pF capacitive termination is provided on the board as per Micron

TN-47-01.

Table 5-3: DDR2 SDRAM Component Terminations

Signal FPGA Driver Termination at FPGA Termination at Memory

Data (DQ) SSTL18_II_DCI No termination No termination (use 75Ω ODT)

Data Strobe (DQS, DQS) DIFF_SSTL18_II_DCI No termination No termination (use 75Ω ODT)

Data Mask (DM) SSTL18_II No termination No termination (use 75Ω ODT)

Clock (CK, CK) SSTL18_II No termination 100Ω differential termination between

pair

Address (A, BA) SSTL18_II No termination 50Ω pull-up to 0.9V after the last

component

Control (RAS, CAS, WE, CS,

and CKE)

SSTL18_II No termination 50Ω pull-up to 0.9V after the last

component

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Table 5-4: QDRII SRAM Terminations

Signal FPGA Driver Termination at FPGA Termination at Memory

Write Data (D) HSTL_I_18 No termination 50Ω pull-up to 0.9V

Read Data (Q) HSTL_I_DCI_18 No termination No termination

Write Strobe (K, K) HSTL_I_18 No termination 50Ω pull-up to 0.9V

Read Strobe (CQ, CQ) HSTL_I_DCI_18 No termination No termination

Clock (CK, CK) HSTL_I_18 No termination 100Ω differential termination

between pair

Address (A, BA) HSTL_I_18 No termination 50Ω pull-up to 0.9V after the last

component

Control (RAS, CAS, WE,

CS, CKE, and BW)

HSTL_I_18 No termination 50Ω pull-up to 0.9V after the last

component

Table 5-5: RLDRAM II Terminations

Signal FPGA Driver Termination at FPGA Termination at Memory

Data (DQ for CIO) HSTL_II_DCI_18 No termination 50Ω pull-up to 0.9V

Data (Q for SIO) HSTL_I_DCI_18 No termination No termination

Write Data (D for SIO) HSTL_I_18 No termination 50Ω pull-up to 0.9V

Write Strobe (DK, DK) DIFF_HSTL_I_18 No termination 100Ω differential termination

between pair

Read Strobe (QK, QK) DIFF_HSTL_II_DCI_18 (for CIO)

DIFF_HSTL_I_DCI_18 (for SIO)

No termination No termination

Data Valid (QVLD) HSTL_II_DCI_18 (for CIO)

HSTL_I_DCI_18 (for SIO)

No termination No termination

Clock (CK, CK) DIFF_HSTL_I_18 No termination 100Ω differential termination

between pair

Address (A, BA) HSTL_I_18 No termination 50Ω pull-up to 0.9V after the last

component

Control (RAS, CAS, WE,

CS, and CKE)

HSTL_I_18 No termination 50Ω pull-up to 0.9V after the last

component

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Chapter 6

Configuration

This chapter provides a brief description of the FPGA configuration methods used on the

Virtex-5 FPGA ML561 Development Board. This chapter contains the following sections:

•“Configuration Modes”

•“JTAG Chain”

•“JTAG Port”

•“Parallel IV Cable Port”

•“System ACE Interface”

Configuration Modes

The Virtex-5 FPGA ML561 Memory Interfaces Development Board includes several

options to configure the Virtex-5 FPGAs. The configuration modes are:

•System ACE mode

•JTAG mode

Table 6-1 shows the Virtex-5 FPGA configuration modes. The Master and Slave (Parallel)

SelectMAP configuration modes are not supported on the Virtex-5 FPGA ML561

Development Board. A separate 6-pin 3x2 header is provide for each FPGA to control the

Mode bits setting. The three headers are P27, P46, and P112 for FPGA #1, FPGA #2, and

FPGA #3, respectively. The even pins (# 2, 4, and 6) of the headers are tied to GND, and the

odd pins (# 1, 3, and 5) are connected to the respective Mode bit FPGA inputs (M0, M1, and

M2, respectively). A weak (4.7KΩ) pull-up is applied to each of these pins to set a logic '1'

by default.

Table 6-1: Configuration Modes

Mode XCONFIG

P72

JTAG

P114

Mode Jumpers(3,4)

5 -> 6

(M2)

3 -> 4

(M1)

1 -> 2

(M0)

Master Serial X(1) —(2) 000

Slave Serial X — 1 1 1

Master SelectMAP — — 0 1 1

Slave SelectMAP — — 1 1 0

JTAG — X 1 0 1

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JTAG Chain

Four devices (the System ACE chip and three XC5VLX50T-FFG1136 FPGAs) are connected

via a JTAG chain on the Virtex-5 FPGA ML561 Development Board. The order of the four

devices in the JTAG chain is System ACE chip (U45), FPGA #1 (U7), FPGA #2 (U5), and

FPGA #3 (U34). The DONE pin of the FPGAs in the chain are tied together to a single LED

(D28). Each FPGA in the JTAG chain must be programmed for the board to be configured

properly. To program FPGAs in the JTAG chain that do not need functionality, a blank

design with no logic implementation can be used to compile to generate the corresponding

configuration bitstream.

Three different sources can be used to drive this JTAG chain:

•JTAG Port

•Xilinx Parallel IV Cable

•System ACE Controller

JTAG Port

The Virtex-5 FPGA ML561 Development Board provides a JTAG connector (P114) that can

be used to program the Virtex-5 FPGAs, and program and/or configure other JTAG

devices in the chain.

Parallel IV Cable Port

The Virtex-5 FPGA ML561 Development Board provides a Parallel IV Cable connector

(P64) to configure the Virtex-5 FPGAs and program JTAG devices located in the JTAG

chain.

System ACE Interface

The Virtex-5 FPGA ML561 Development Board provides a System ACE interface to

configure the Virtex-5 FPGA. The interface also gives software designers the ability to run

code (for soft processor IP within the FPGA) from removable CompactFlash cards.

Refer to the DS080, System ACE CompactFlash Solution for detailed information on creating

System ACE compatible ACE files, formatting the CompactFlash card, and storing

multiple design images.

System ACE CF Card — — 1 1 1

Notes:

1. X = Supported.

2. — = Not applicable.

3. Corresponding jumper position is Closed.

4. Corresponding jumper position is Open.

Table 6-1: Configuration Modes (Continued)

Mode XCONFIG

P72

JTAG

P114

Mode Jumpers(3,4)

5 -> 6

(M2)

3 -> 4

(M1)

1 -> 2

(M0)

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Table 6-2 shows the System ACE interface signal names, descriptions, and pin

assignments.

Table 6-2: System ACE Interface Signal Descriptions

System ACE Pin Number Signal Name

70 SYSACE_MPA0

69 SYSACE_MPA1

68 SYSACE_MPA2

67 SYSACE_MPA3

45 SYSACE_MPA4

44 SYSACE_MPA5

43 SYSACE_MPA6

66 SYSACE_MPD0

65 SYSACE_MPD1

63 SYSACE_MPD2

62 SYSACE_MPD3

61 SYSACE_MPD4

60 SYSACE_MPD5

59 SYSACE_MPD6

58 SYSACE_MPD7

77 SYSACE_CTRL0/MPOE

76 SYSACE_CTRL1/MPWE

42 SYSACE_CTRL2/MPCE

41 SYSACE_CTRL3/MPIRQ

39 SYSACE_CTRL4/MPBRDY

93 SYSACE_CLK

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Chapter 7

ML561 Hardware-Simulation

Correlation

This chapter contains the following sections:

•“Introduction”

•“Test Setup”

•“Signal Integrity Correlation Results”

•“Summary and Recommendations”

•“How to Generate a User-Specific FPGA IBIS Model”

Introduction

Signal integrity (SI) simulation is a very powerful tool that predicts the quality of signal at

the receiver. The quality of signal at the I/O buffer of the receiver device is most important

to the system designer. The observation point is buried within the IC device and is not

accessible for attaching a physical probe. This signal can only be simulated. It cannot be

measured on the hardware with an oscilloscope.

Signals can only be measured on hardware at the via probe points of a printed circuit board

(PCB) near the receiver device. For a high level of confidence in the SI simulation results, it

is necessary to develop and validate the simulation model to get a good correlation with

the hardware measurements at the probe points. When the correlation is obtained, the

same simulation model is used to extrapolate and accurately predict the signal quality at

the I/O buffer of the receiver device for the two significant corner driver conditions: slow-

weak and fast-strong.

The Virtex-5 FPGA ML561 Development Board implements five different memory

interfaces:

•32-bit DDR2 component

•144-bit DDR2 DIMM

•72-bit QDRII SRAM

•32-bit DDR component

•36-bit RLDRAM II

Each of these interfaces consists address, control, clock, data, and strobe signals. The

ML561 board has over 500 unique signals.

DDR2 SDRAMs and QDRII SRAM represent the large majority of Virtex-5 FPGA memory

applications. The dual data rate (DDR) data bits are the most critical signals to analyze.

This chapter presents SI analysis for only six representative data bit signals. The procedure

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illustrated here for these signals can be easily adopted to perform SI analysis for any other

memory interface signal on the ML561 board.

This chapter presents the SI results for the following six data bit signals:

•DDR2 component DQ bit (DDR2_DQ_BY2_B3) for write operations

•DDR2 component DQ bit (DDR2_DQ_BY2_B3) for read operations

•DDR2 DIMM DQ bit (DDR2_DIMM_DQ_BY2_B3) for write operations

•DDR2 DIMM DQ bit (DDR2_DIMM_DQ_BY2_B3) for read operations

•QDRII D bit (QDR2_D_BY0_B5) for write operations

•QDRII Q bit (QDR2_Q_BY0_B5) for read operations

Test Setup

Hardware measurements were performed for the six specific signal nets, and then signal

integrity (SI) simulations were performed for correlation and extrapolation. The test setup

consisted of the following hardware equipment, simulation software tools, the stimulus

test pattern, and test criteria for determining the quality of signals. The test bench is

designed so that the test pattern is applied only to the signal under test, and all other data

bits to the same memory interface are kept in a quiet Low state. This setup ensures that the

hardware measurement is not altered due to any simultaneous switching output (SSO)

effect.

•Hardware measurement equipment

♦Agilent DSO80604B 6 GHz oscilloscope

♦Agilent 1131A 3.5 GHz Infiniimax probe amplifier

♦Agilent E2675A (Differential browser) or E2677A (Differential solder-in probe) or

N5425A (ZIF probe)

♦Virtex-5 FPGA ML561, Rev B2 board: S/N 103

♦SRS Model CG635 Synthesized Clock Generator for low jitter clock source

•Simulation software

♦Mentor Graphics HyperLynx EXT, Version 7.5 with LineSim and BoardSim

features

♦Xilinx Virtex-5 FPGA IBIS package file: ff1136_5vlx50t.pkg, Rev 1.0 dated

June 12, 2006

♦ML561, Rev B layout file: ML561_B_041706.hyp

♦Micron DDR2-667 IBIS model for output and ODT input

♦Micron PC2-5300 RDIMM IBIS model

♦Molex DDR2 DIMM socket specification (P/N 087705-1041)

♦Samsung QDRII HSTL 1.8V IBIS model

♦IBISWriter Utility of ISE software suite to create customized IBIS model of the

FPGA1 (U7) and FPGA3 (U34) devices on the ML561 board: Model files

ml561_fpga1_u7.ibs and ml561_fpga3_u34.ibs. (See “How to Generate a

User-Specific FPGA IBIS Model,” page 93 for steps on how to create a customized

IBIS model of Virtex-5 FPGA for your design.)

•Stimulus

Pseudo Random Bit Stream (PRBS) is accepted as the most effective test pattern to

measure the quality of data signals because, unlike the periodic signals like clock and

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strobe, a random value can be applied to data bits from one cycle to another. A 63-bit

PRBS6(1) (PRBS of order 6) test pattern stimulus is used for this analysis. The value of

this PRBS6 string is 63’h03F5_66ED_2717_9461, that is:

63’b000001111110101011001101110110100100111000101111001010001100001.

The HyperLynx stimulus setup is for: a 2-sequence repeat, 10 bits skipped, 1 eye, and

0% jitter.

•Test criteria

Quality of a signal is measured in terms of the opening of the signal eye at the receiver

input for both the amplitude and the width. DDR2 SDRAM (Component and DIMM)

interfaces utilize the SSTL_18 I/O standard, and the QDRII SRAM interface utilizes

the HSTL 1.8V I/O standard. For each of these two I/O standards, the eye mask is

defined by the trapezoid enclosed by the following four voltage thresholds at the

receiver input:

♦VIH(ac)-min at the rising edge

♦VIH(dc)-min at the falling edge

♦VIL(dc)-max at the rising edge

♦VIL(ac)-max at the falling edge

Refer to Figure 7-1 for the definition of voltage levels with regard to the trapezoidal

eye mask. Refer to “Terminology,” page 9 for definitions of the voltage thresholds.

Because the HyperLynx SI simulation software does not support a trapezoidal mask

definition, two separate triangular masks for VIH and VIL are defined, as shown in

Figure 7-2, such that the third vertex of triangle falls on the VREF axis.

1. A maximal-length PRBS test sequence of order n generates all (2n – 1), n-bit combinations of test sequences

(except all 0s). Thus the test sequence contains one n-bit long consecutive string of 1s and two (n-1)-bit long

consecutive strings of 0s. With the PRBS6 test pattern, at the highest test frequency of 333 MHz (that is, the bit

time is 1.5 ns), measurements in this setup result in a maximum settling time of (1.5 ns * 5) = 7.5 ns for a logic

Low, and a maximum settling time of (1.5 ns * 6) = 9 ns for a logic High. 7.5 ns is sufficient time for the test

signal to reach a steady state before the next transition. Thus a PRBS test pattern of higher order, such as 7 or

9, does not change the eye pattern, as proven by sample simulation of one test signal with PRBS6, PRBS7, and

PRBS9 stimuli.

Figure 7-1: Single Trapezoid Eye Mask Definition

VOH(dc)

VOL(dc)

VOH(ac)

VOL(ac)

UG199_c7_01_062707

VIH(ac)

VIL(ac)

VIH(dc)

VIL(dc)

VDDQ

VSS

VREF

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♦DDR2 mask (for nominal VDDQ = 1.8V and VREF = 0.9V):

-VIH(ac)-min = VREF + 200 mV = 1.1V

-VIH(dc)-min = VREF + 125 mV = 1.025V

-VIL(ac)-max = VREF – 200 mV = 0.7V

-VIL(dc)-max = VREF – 125 mV = 0.775V

♦QDRII mask (for nominal values of VDDQ = 1.8V and VREF = 0.9V):

-VIH(ac)-min = VREF + 200 mV = 1.1V

-VIH(dc)-min = VREF + 100 mV = 1.0V

-VIL(ac)-max = VREF – 200 mV = 0.7V

-VIL(dc)-max = VREF – 100 mV = 0.8V

Signal Integrity Correlation Results

This section presents SI results for each of the six chosen memory signals on the ML561

board. The following information is presented for each memory signal:

•A post-layout IBIS schematics of the signal under test

•A description of the major circuit elements(1) of this signal

•A summary of four SI results: hardware measurement, correlation simulation, slow-

weak corner driver simulation extrapolation, and fast-strong corner driver simulation

extrapolation

•A set of eight figures showing eye and waveform scope shots for each of the four SI

results mentioned in the bulleted list in the previous section

For an explanation of the different terms used to present these results, refer to

“Terminology,” page 9 for some definitions and routing terminologies.

Figure 7-2: Two Triangular Eye Mask Definitions for VIH and VIL

VOH(dc)

VOL(dc)

VOH(ac)

VOL(ac)

UG199_c7_02_062707

VIH(ac)

VIL(ac)

VIH(dc)

VIL(dc)

VDDQ

VSS

VREF

1. With regard to transmission line impedance, Table 3-19 in the “Board Design Considerations” section lists

controlled impedance values of all routing layers. The design goal for the ML561 board is to keep the

characteristic impedance for all routing layers as close to 50Ω as possible. Manufacturing tolerance is usually

±10%. The characteristic impedance of DIMM PCB is derived from the Micron DIMM layout file.

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DDR2 Component Write Operation

This subsection shows the test results for the DDR2_DQ_BY2_B3 signal from FPGA1 (U7)

to the DDR2 memory component (U12) measured at 333 MHz (667 Mb/s), where the unit

interval (UI) = 1.5 ns.

Figure 7-3: Post-Layout IBIS Schematics of DDR2 Component Write Data Bit (DDR2_DQ_BY2_B3)

UG199_c7_03_071907

MT47H32M16CC_…

DQ11

U12.D3

TL2 TL3 TL8 TL9 TL5

U7.P25

DDR2_D…

DDR2_D…

DDR2_D…

DDR2_D…

DDR2_D… C7

C9

DDR2_D…

28.5 ohms

3.579 ps

0.022 in

DDR2_DQ_BY2_B3

71.0 ohms

27.482 ps

AutoPadstk_3

22.9 fF 22.9 fF 500.0 fF 58.1 fF 140.8 fF

365.6 fF

49.0 ohms

24.721 ps

0.164 in

DDR2_DQ_BY2_B3

58.3 ohms

25.244 ps

AutoPadstk_19

21.2 ohms

1.000 ps

AutoPadstk_3

49.1 ohms

47.132 ps

0.302 in

DDR2_DQ_BY2_B3

49.1 ohms

445.560 ps

2.852 in

DDR2_DQ_BY2_B3

28.5 ohms

4.473 ps

0.028 in

DDR2_DQ_BY2_B3

Virtex-5 FPGA

DDR2_DQ_BY2_B3

TL4 TL6 TL1

500.0 fF

22.9 fF

Table 7-1: Circuit Elements of DDR2 Component Write Data Bit

(DDR2_DQ_BY2_B3)

Element Designation Description

Driver U7.P25 FPGA SSTL18_II_DCI_O

Receiver U12.D3 DDR2 Memory, 75 Ω ODT

Probe Point C9 Via under the memory device

PCB Termination None ODT75 at load

Trace Length TL 2, 4, 9, 6, 1 3.37 inches

Table 7-2: DDR2 Component Write Operation Correlation Results

Measurement DVW(1)

(%UI)

ISI

(% UI)

Noise Margin

(VIH, + VIL) = Total

(% of VREF)

Overshoot / Undershoot

Margin

(% of VREF)

Hardware at probe

point

1.18 ns

(78.7%)

(80 + 80) = 160 ps

(10.7%)

(274 + 384) = 658 mV

(73.1%)

(550 + 470) = 1020 mV

(113.3%)

Simulation correlation

slow-weak corner

1.22 ns

(81.3%)

(77 + 36) = 113 ps

(7.5%)

(294 + 266) = 560 mV

(62.2%)

(461 + 490) = 951 mV

(105.7%)

Correlation Delta:

HW vs. Simulation

40 ps

(2.6%)

47 ps

(3.2%)

98 mV

(10.9%)

69 mV

(7.6%)

Extrapolation at IOB

slow-weak corner

1.27 ns

(84%)

(91 + 36) = 127 ps

(8.5%)

(300 + 270) = 570 mV

(63.3%)

(469 + 501) = 970 mV

(107.8%)

Extrapolation at IOB

fast-strong corner

1.39 ns

(92%)

(34 + 20) = 54 ps

(3.7%)

(406 + 351) = 757 mV

(84.1%)

(304 + 381) = 685 mV

(76.1%)

Notes:

1. DVW = Data Valid Window, ISI = Inter-Symbol Interference

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DDR2 DQ is a bidirectional signal. To perform hardware measurements for a Write

operation that is not interrupted by a Read response or a Refresh operation, the testbench

on FPGA1 is controlled by DIP switches (SW2) as indicated in Table 7-3.

Table 7-3: DIP[1:2] Settings

Setting Description

2’b00 or 2’b11 Normal alternating Write/Read sequence

2’b01 Write only, Refresh disabled

2’b10 Write once, then Read only, Refresh disabled

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Figure 7-4: DDR2 Component Write HW Measurement - Eye Scope Shot at Probe Point (DDR2 Memory Via)

UG199_c7_04_071107

Figure 7-5: DDR2 Component Write Correlation - Eye Scope Shot at Probe Point (Slow Corner)

0.000 400.0 800.0 1200.0 1600.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

Voltage (mV)

1200.0

1400.0

1600.0

1800.0

Time (ps)

Probe 3:C9.1 (at pin)

UG199_c7_05_070907

♦333 MHz, Slow, PRBS6, 81.5% UI

♦Cursor 1: 1.1028V, 123.6 ps

♦Cursor 2: 1.0253V, 1.3458 ns

♦Delta Voltage = 77.5 mV, Delta Time = 1.2222 ns (81.5% UI)

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Figure 7-6: DDR2 Component Write HW Measurement - Waveform Scope Shot at Probe Point

(DDR2 Memory Via)

UG199_c7_06_071107

Figure 7-7: DDR2 Component Write Correlation - Waveform Scope Shot at Probe Point (Slow Corner)

65.000 75.000 85.000 95.000 105.000

-200.0

Time (ns)

Voltage (mV)

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Probe 3:C9.1 (at pin)

UG199_c7_07_070907

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Figure 7-8: DDR2 Component Write Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

-200.0 200.0 600.0

Time (ps)

Voltage (mV)

1000.0 1400.0 1800.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Probe 1:U12.D3 (at die)

UG199_c7_08_071007

♦333 MHz, Slow, PRBS6, 84.5% UI

♦Cursor 1: 1.1007V, 123.7 ps

♦Cursor 2: 1.0253V, 1.3921 ns

♦Delta Voltage = 75.4 mV, Delta Time = 1.2684 ns (84.5% UI)

Figure 7-9: DDR2 Component Write Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner)

65.000 75.000 85.000 95.000 105.000

UG199_c7_09_071007

-200.0

Time (ns)

0.000

200.0

400.0

600.0

Voltage (mV)

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Probe 1:U12.D3 (at die)

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Figure 7-10: DDR2 Component Write Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

UG199_c7_10_071007

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

Voltage (mV)

1500.0

1700.0

1900.0

800.0 1200.0 1600.0

Time (ps)

2000.0 2400.0 2800.0

Probe 1:U12.D3 (at die)

♦333 MHz, Fast, PRBS6, 92.5% UI

♦Cursor 1: 701.2 mV, 1.0026 ns

♦Cursor 2: 774.6 mV, 2.3908 ns

♦Delta Voltage = 73.4 mV, Delta Time = 1.3883 ns (92.5% UI)

Figure 7-11: DDR2 Component Write Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

65.000 75.000 85.000 95.000 105.000

UG199_c7_11_071007

-100.0

Time (ns)

100.0

300.0

500.0

700.0

Voltage (mV)

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

Probe 1:U12.D3 (at die)

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DDR2 Component Read Operation

This subsection shows the test results for the DDR2_DQ_BY2_B3 signal from the DDR2

memory component (U12) to FPGA1 (U7) measured at 333 MHz (667 Mb/s), where the

unit interval (UI) = 1.5 ns.

To perform hardware measurements for a Read operation that is not interrupted by a Write

or a Refresh operation, the testbench on FPGA1 is controlled by the following DIP switch

(SW2) setting:

•DIP[1:2] = 2’b10 – Write once, then Read only, Refresh disabled

Figure 7-12: Post-Layout IBIS Schematics of the DDR2 Component Read Data Bit (DDR2_DQ_BY2_B3)

49.0 ohms

24.721 ps

0.164 in

DDR2_DQ_BY2_B3

28.5 ohms

3.579 ps

0.022 in

DDR2_DQ_BY2_B3

MT47H64M8CB-3

DQ3

TL2 TL3 TL4 TL8 TL9 TL6 TL5 TL1 U7.P25

C7

C9

U12.D3

49.1 ohms

47.132 ps

0.302 in

DDR2_DQ_BY2_B3

58.3 ohms

25.244 ps

AutoPadstk_19

21.2 ohms

1.000 ps

AutoPadstk_3

71.0 ohms

27.482 ps

AutoPadstk_3

49.1 ohms

445.560 ps

2.852 in

DDR2_DQ_BY2_B3

28.5 ohms

4.473 ps

0.028 in

DDR2_DQ_BY2_B3

Virtex-5 FPGA

DDR2_DQ_BY2_B3

22.9 fF 22.9 fF 500.0 fF 58.1 fF 140.8 fF

DDR2_D… DDR2_D… DDR2_D… DDR2_D…

DDR2_D…

DDR2_D…

365.6 fF 500.0 fF

22.9 fF

UG199_c7_12_071907

Table 7-4: Circuit Elements of DDR2 Component Read Data Bit

(DDR2_DQ_BY2_B3)

Element Designation Description

Driver U12.D3 DDR2 Memory

Receiver U7.P25 FPGA SSTL18_II_DCI_I

Probe Point C7 Via under FPGA1

PCB Termination None DCI at receiver

Trace Length TL 2, 4, 9, 6, 1 3.37 inches

Table 7-5: DDR2 Component Read Operation Correlation Results

Measurement DVW (% UI) ISI

(% UI)

Noise Margin

(VIH + VIL) = Total

(% of VREF)

Overshoot /

Undershoot Margin

(% of VREF)

Hardware at probe point 1.28 ns

(85%)

(70 + 110) = 180 ps

(12%)

(423 + 416) = 839 mV

(83.1%)

(400 +400) = 800 mV

(79.1%)

Simulation correlation

slow-weak corner

1.28 ns

(85%)

(132 + 91) = 223 ps

(14.9%)

(406 +439) = 845 mV

(83.8%)

(279 +277) = 556 mV

(61.9%)

Correlation Delta:

HW vs. Simulation

0 ps

(0.0%)

43 ps

(2.9%)

6 mV

(0.7%)

244 mV

(17.2%)

Extrapolation at IOB

slow-weak corner

1.29 ns

(86%)

(96 + 82) = 178 ps

(11.9%)

(418 + 449) = 867 mV

(96.3%)

(304 +265) = 569 mV

(63.1%)

Extrapolation at IOB

fast-strong corner

1.32 ns

(88%)

(29 + 67) = 96 ps

(6.7%)

(455 +435) = 890 mV

(98.9%)

(167 +182) = 349 mV

(38.9%)

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Figure 7-13: DDR2 Component Read HW Measurement - Eye Scope Shot at Probe Point (FPGA1 Via)

UG199_c7_13_071107

Figure 7-14: DDR2 Component Read Correlation - Eye Scope Shot at Probe Point (Slow Corner)

800.0 1200.0 1600.0 2000.0 2400.0 2800.0

UG199_c7_14_071107

Time (ns)

Voltage (mV)

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

Probe 3:C7.1 (at pin)

♦333 MHz, Slow, PRBS6, 85.9% UI

♦Cursor 1: 697.1 mV, 1.2345 ns

♦Cursor 2: 774.6 mV, 2.5191 ns

♦Delta Voltage = 77.5 mV, Delta Time = 1.2846 ns (85.9% UI)

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Figure 7-15: DDR2 Component Read HW Measurement - Waveform Scope Shot at Probe Point (FPGA1

Via)

UG199_c7_15_071107

Figure 7-16: DDR2 Component Read Correlation - Waveform Scope Shot at Probe Point (Slow Corner)

65.000 75.000 85.000 95.000 105.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_16_071007

Time (ns)

Voltage (mV)

Probe 3:C7.1 (at pin)

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Figure 7-17: DDR2 Component Read Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

800.0 1200.0 1600.0 2000.0 2400.0 2800.0

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_17_071007

Time (ps)

Voltage (mV)

Probe 1:U7.P25 (at die)

♦333 MHz, Slow, PRBS6, 85.5% UI

♦Cursor 1: 1.0988V, 1.2170 ns

♦Cursor 2: 1.0254V, 2.5029 ns

♦Delta Voltage = 73.4 mV, Delta Time = 1.2859 ns (85.5% UI)

Figure 7-18: DDR2 Component Read Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner)

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

65.000 75.000 85.000 95.000 105.000

Probe 1:U7.P25 (at die)

Voltage (mV)

Time (ns) UG199_c7_18_071007

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Figure 7-19: DDR2 Component Read Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

800.0 1200.0 1600.0 2000.0 2400.0 2800.0

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_19_071007

Time (ps)

Voltage (mV)

Probe 1:U7.P25 (at die)

♦333 MHz, Fast, PRBS6, 88% UI

♦Cursor 1: 701.2 mV, 1.0772 ns

♦Cursor 2: 774.6 mV, 2.3980 ns

♦Delta Voltage = 73.4 mV, Delta Time = 1.3208 ns (88% UI)

Figure 7-20: DDR2 Component Read Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

65.000 75.000 85.000 95.000 105.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_20_071007

Time (ns)

Voltage (mV)

Probe 1:U7.P25 (at die)

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DDR2 DIMM Write Operation

This subsection shows the test results for the DDR2_DIMM_DQ_BY2_B3 signal from

FPGA2 (U5) to the DDR2 DIMM (XP2) measured at 333 MHz (667 Mb/s), where the unit

interval (UI) = 1.5 ns.

The IBIS schematics for DDR2 DIMM interface is extracted from a multi-board project

definition of the two-board combination, which includes the ML561 motherboard and the

DDR2 DIMM at the XP2 connector of the motherboard. The impedance characteristics of

the Molex socket pin (XP2, pin 31) is also included in the IBIS model as a (TL13,

R_00179_CONN_0001, TL14) combination.

The ML561 board under test (S/N 103) is assembled with DDR2 sockets XP3, XP4, and

XP5, which can be utilized for deep DIMM interfaces as described in Table 3-2, page 19 and

Figure 3-2, page 20. To accurately represent the IBIS model of the

DDR2_DIMM_DQ_BY2_B3 signal, the IBIS schematics in Figure 7-21 have added stubs for

the three socket pins at the XP3, XP4, and XP5 connectors.

The DDR2 DIMM used for this correlation testing is a single-rank DIMM part (Micron part

number MT9HTF6472xx-667). Thus for hardware measurements closest to the load, a

probe point via on the DIMM for pin U3.J1 is available.

Figure 7-21: Post-Layout IBIS Schematics of DDR2 DIMM Write Data Bit (DDR2_DIMM_DQ_BY2_B3)

MT47H64M8CB_C...

DQ6

59.8 ohms

3.590 ps

0.022 in

MDQ19_B01

59.8 ohms

31.503 ps

0.195 in

MDQ19_B01

59.8 ohms

78.962 ps

0.490 in

MDQ19_B01

59.8 ohms

10.373 ps

0.064 in

DQ19_B01

49.8 ohms

94.605 ps

0.606 in

DDR2_DIMM_DQ_...

49.8 ohms

90.955 ps

0.582 in

DDR2_DIMM_DQ_...

49.8 ohms

90.340 ps

0.578 in

DDR2_DIMM_DQ_...

49.8 ohms

864.365 ps

5.533 in

DDR2_DIMM_DQ_...

28.5 ohms

4.473 ps

0.028 in

DDR2_DIMM_DQ_...

49.1 ohms

41.316 ps

0.264 in

DDR2_DIMM_DQ_...

49.1 ohms

78.216 ps

0.501 in

DDR2_DIMM_DQ_...

DDR2_DI...

U5_B00.H29

UG199_c7_21_071907

XP5_B00.31XP4_B00.31XP3_B00.31XP2_B00.31

DDR2_DI...

DDR2_DI...DDR2_DI...

59.1 ohms

12.486 ps

AutoPadstk_12_B...

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DQ19_B...

71.6 ohms

22.319 ps

AutoPadstk_3_B00

TL1 TL5 TL11 TL1222.0 ohms

C13

500.0 fF

17.3 fF

MDQ19_...

0.0 milliohms 0.0 milliohms 0.0 milliohms 0.0 milliohms

RN6_B01

R_00179... R7 R5 R6

TL15 TL16 TL17 TL18

TL24

TL25TL23TL27TL14

????????????

????

TL22TL26

TL13

TL3TL6TL7TL20TL19

U3_B01.J1 J1_B01.31

????

500.0 fF

C8

96.3 fF

46.4 fF253.0 fF

22.9 fF

Virtex-5 FPGA

DDR2_DQ_BY2_B3

Table 7-6: Circuit Elements of DDR2 DIMM Write Data Bit

(DDR2_DIMM_DQ_BY2_B3)

Element Designation Description

Driver U5.H29 FPGA SSTL18_II_DCI_O

Receiver XP2-U3.J1 DDR2 DIMM, 75 Ω ODT

Probe Point C13 Via under memory on DIMM

PCB Termination None ODT at load

Trace Length Multiple TLs 8.975 inches

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DDR2 DQ is a bidirectional signal. To perform hardware measurements for a Write

operation that is not interrupted by a Read response or a Refresh operation, the testbench

on FPGA2 is controlled by DIP switches (SW1) as indicated in Table 7-8.

Table 7-7: DDR2 DIMM Write Operation Correlation Results

Measurement DVW

(%UI)

ISI

(% UI)

Noise Margin

(VIH + VIL) = Total

(% of VREF)

Overshoot / Undershoot

Margin

(% of VREF)

Hardware at Probe

Point

942 ps

(62.8%)

(300 + 200) = 500 ps

(33.3%)

(110 + 100) = 210 mV

(23.3%)

(620 + 620) = 1240 mV

(137.7%)

Simulation correlation

at memory via (C13)

slow-weak corner

1.16 ns

(77.3%)

(80 + 54) = 134 ps

(8.9%)

(172 + 150) = 322 mV

(35.9%)

(606 + 636) =1242 mV

(138%)

Correlation Delta:

HW vs. Simulation

218 ps

(14.5%)

366 ps

(24.4%)

112 mV

(12.6%)

2 mV

(0.3%)

Extrapolation at IOB

slow-weak corner

1.23 ns

(82%)

(85 + 32) = 117 ps

(7.8%)

(178 + 137) = 315 mV

(35.0%)

(604 + 632) = 1236 mV

(137.3%)

Extrapolation at IOB

fast-strong corner

1.32 ns

(88%)

(54 + 46) = 100 ps

(6.7%)

(146 + 107) = 253 mV

(28.1%)

(457 + 524) = 981 mV

(109.0%)

Table 7-8: DIP[1:2] Settings

Setting Description

2’b00 or 2’b11 Normal alternating Write/Read sequence

2’b01 Write only, Refresh disabled

2’b10 Write once, then Read only, Refresh disabled

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Figure 7-22: DDR2 DIMM Write HW Measurement - Eye Scope Shot at Probe Point #1 (DDR2 Memory Via)

UG199_c7_22_071107

Figure 7-23: DDR2 DIMM Write Correlation - Eye Scope Shot at Probe Point #1 (Slow Corner)

800.0 1200.0 1600.0 2000.0 2400.0 2800.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_23_070907

Time (ps)

Voltage (mV)

Probe 3:C13.1 (at pin)

♦333 MHz, Slow, PRBS6, 77% UI

♦Cursor 1: 1.1004V, 1.2553 ns

♦Cursor 2: 1.0253V, 2.4105 ns

♦Delta Voltage = 75.2 mV, Delta Time = 1.1582 ns (77% UI)

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Figure 7-24: DDR2 DIMM Write HW Measurement - Waveform Scope Shot at Probe Point #1 (DDR2 Memory

Via)

UG199_c7_24_071107

Figure 7-25: DDR2 DIMM Write Correlation - Waveform Scope Shot at Probe Point #1 (Slow Corner)

95.000 105.000 115.000 125.000 135.000 145.000

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_23_071007

Time (ns)

Voltage (mV)

Probe 3:C13.1 (at pin)

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Figure 7-26: DDR2 DIMM Write Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

1000.0 1400.0 1800.0 2200.0 2600.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_26_071007

Time (ps)

Voltage (mV)

Probe 6:U3_B01.J1 (at die)

♦333 MHz, Slow, PRBS6, 82% UI

♦Cursor 1: 1.1028V, 1.2399 ns

♦Cursor 2: 1.0253V, 2.4671 ns

♦Delta Voltage = 77.5 mV, Delta Time = 1.2272 ns (82% UI)

Figure 7-27: DDR2 DIMM Write Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner)

95.000 105.000 115.000 125.000 135.000 145.000

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_27_071007

Time (ns)

Voltage (mV)

Probe 6:U3_B01.J1 (at die)

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Figure 7-28: DDR2 DIMM Write Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

400.0 800.0 1200.0 1600.0 2000.0 2400.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_28_071007

Time (ps)

Voltage (mV)

Probe 6:U3_B01.J1 (at die)

♦333 MHz, Fast, PRBS6, 88% UI

♦Cursor 1: 1.1004V, 646.3 ps

♦Cursor 2: 1.0273V, 1.9659 ns

♦Delta Voltage = 73.1 mV, Delta Time = 1.3196 ns (88% UI)

Figure 7-29: DDR2 DIMM Write Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

95.000 105.000 115.000 125.000 135.000 145.000

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_29_071007

Time (ns)

Voltage (mV)

Probe 6:U3_B01.J1 (at die)

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DDR2 DIMM Read Operation

This subsection shows the test results for the DDR2_DIMM_DQ_BY2_B3 signal from the

DDR2 DIMM (XP2) to FPGA2 (U5) measured at 333 MHz (667 Mb/s), where the unit

interval (UI) = 1.5 ns.

To perform hardware measurements for a Read operation that is not interrupted by a Write

or a Refresh operation, the testbench on FPGA1 is controlled by the following DIP switch

(SW1) setting:

•DIP[1:2] = 2’b10 – Write once, then Read only, Refresh disabled

Figure 7-30: Post-Layout IBIS Schematics of the DDR2 DIMM Read Data Bit (DDR2_DIMM_DQ_B)

59.8 ohms

78.962 ps

0.490 in

MDQ19_B01

59.8 ohms

31.503 ps

0.195 in

MDQ19_B01

59.8 ohms

3.590 ps

0.022 in

MDQ19_B01

TL11TL1

U3_B01.J1

TL5 22.0 ohms

RN6_B01

MT47H64M8CB_C...

DQ6

C13

500.0 fF

17.3 fF

MDQ19_...

59.8 ohms

10.373 ps

0.064 in

DQ19_B01

TL12

J1_B01.31

????

49.8 ohms

94.605 ps

0.606 in

DDR2_DIMM_DQ_...

49.8 ohms

90.955 ps

0.582 in

DDR2_DIMM_DQ_...

49.8 ohms

90.340 ps

0.578 in

DDR2_DIMM_DQ_...

49.8 ohms

864.365 ps

5.533 in

DDR2_DIMM_DQ_...

59.1 ohms

12.486 ps

AutoPadstk_12_B...

TL15 TL16 TL17 TL18 TL19

XP5_B00.31XP4_B00.31XP3_B00.31XP2_B00.31

TL25TL23TL27TL14

????????????

????

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

50.3 ohms

23.650 ps

DDR2_D...

0.0 milliohms 0.0 milliohms 0.0 milliohms 0.0 milliohms

R_00179... R7 R5 R6

DDR2_DI...

253.0 fF

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DQ19_B...

50.3 ohms

23.650 ps

DQ19_B...

TL24TL22TL26

TL13

DDR2_DI...

DDR2_DI...

DDR2_DI...

500.0 fF

C8

96.3 fF

46.4 fF

22.9 fF

U5_B00.H29

Virtex-5 FPGA

DIMM_DQ_BY2_B3

28.5 ohms

4.473 ps

0.028 in

DDR2_DIMM_DQ_...

49.1 ohms

41.316 ps

0.264 in

DDR2_DIMM_DQ_...

49.1 ohms

78.216 ps

0.501 in

DDR2_DIMM_DQ_...

71.6 ohms

22.319 ps

AutoPadstk_3_B00

TL3TL6TL7TL20

UG199_c7_30_071907

Table 7-9: Circuit Elements of DDR2 DIMM Read Data Bit

(DDR2_DIMM_DQ_BY2_B3)

Element Designation Description

Driver XP2-U3.J1 DDR2 DIMM

Receiver U5.H29 FPGA SSTL18_II_DCI_I

Probe Point C8 Via under FPGA2 (U5.H29)

PCB Termination None DCI at load

Trace Length Multiple TLs 8.975 inches

Table 7-10: DDR2 DIMM Read Operation Correlation Results

Measurement DVW (%

UI)

ISI

(% UI)

Noise Margin

(VIH + VIL) = Total

(% of VREF)

Overshoot / Undershoot

Margin

(% of VREF)

Hardware at probe

point

904 ps

(60%)

(107 + 62) = 169 ps

(11.2%) (242 + 258) = 500 mV (623 + 613) = 1236 mV

(137.3%)

Simulation correlation

slow-weak corner

865 ps

(59%)

(130 + 83) = 213 ps

(14.2%) (+292 + 298) = 590 mV (524 + 504) = 1028 mV

(114.2%)

Correlation Delta:

HW vs. Simulation

39 ps

(2.6%) 44 ps (2.9%) 90 mV (10%) 208 mV (23.1%)

Extrapolation at IOB

slow-weak corner

1.23 ns

(82%)

(139 + 75) = 224 ps

(14.9%)

(243 + 303) = 546 mV

(60.7%)

(594 + 544) = 1138 mV

(116.5%)

Extrapolation at IOB

fast-strong corner

1.24 ns

(83%)

(131 + 60) = 191 ps

(12.7%)

(288 + 282) = 570 mV

(63.3%)

(+481 + 508) = 989 mV

(109.9%)

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Figure 7-31: DDR2 DIMM Read HW Measurement - Eye Scope Shot at Probe Point (FPGA1 Via)

UG199_c7_31_071107

Figure 7-32: DDR2 DIMM Read Correlation - Eye Scope Shot at Probe Point (Slow Corner)

2000.0 2400.0 2800.0 3200.0 3600.0

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

Time (ps)

Voltage (mV)

UG199_c7_32_071107

Probe 3:C8.1 (at pin)

♦333 MHz, Slow, PRBS6, 59% UI

♦Cursor 1: 1.0988V, 2.5207 ns

♦Cursor 2: 1.0254V, 3.3859 ns

♦Delta Voltage = 73.4 mV, Delta Time = 865.2 ps (59% UI)

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Figure 7-33: DDR2 DIMM Read HW Measurement - Waveform Scope Shot at Probe Point (FPGA1 Via)

UG199_c7_33_071107

Figure 7-34: DDR2 DIMM Read Correlation - Waveform Scope Shot at Probe Point (Slow Corner)

25.000 35.000 45.000 55.000 65.000 75.000

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ns)

Voltage (mV)

UG199_c7_34_071007

Probe 3:C8.1 (at pin)

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Figure 7-35: DDR2 DIMM Read Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

2000.0 2400.0 2800.0 3200.0 3600.0 4000.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_35_071007

Probe 6:U5_B00.H29 (at die)

♦333 MHz, Slow, PRBS6, 82% UI

♦Cursor 1: 1.1007V, 2.3997 ns

♦Cursor 2: 1.0232V, 3.6257 ns

♦Delta Voltage = 77.5 mV, Delta Time = 1.2260 ns (82% UI)

Figure 7-36: DDR2 DIMM Read Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner)

30.000 40.000 50.000 60.000 70.000

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_36_071007

Time (ns)

Voltage (mV)

Probe 6:U5_B00.H29 (at die)

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Figure 7-37: DDR2 DIMM Read Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

400.0 800.0 1200.0 1600.0 2000.0 2400.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_37_071007

Probe 6:U5_B00.H29 (at die)

♦333 MHz, Fast, PRBS6, 83% UI

♦Cursor 1: 697.0 mV, 763.0 ps

♦Cursor 2: 776.6 mV, 2.0052 ns

♦Delta Voltage = 79.5 mV, Delta Time = 1.2422 ns (83% UI)

Figure 7-38: DDR2 DIMM Read Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

30.000 40.000 50.000 60.000 70.000

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

UG199_c7_38_071007

Time (ns)

Voltage (mV)

Probe 6:U5_B00.H29 (at die)

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QDRII Write Operation

This subsection shows the test results for the QDR2_D_BY0_B5 signal from FPGA3 (U34)

to QDRII memory (U35) measured at 300 MHz (600 Mb/s), where the unit interval

(UI) = 167 ns.

Figure 7-39: Post-Layout IBIS Schematics of QDRII Write Data Bit (QDR2_D_BY0_B5)

K7R323684M_1.8V

D5

C7

500.0 fF 58.1 fF 399.1 fF 177.3 fF 22.9 fF

22.9 fF22.9 fF

U35.G11

28.5 ohms

4.404 ps

0.027 in

QDR2_D_BY0_B5

49.0 ohms

11.902 ps

0.079 in

QDR2_D_BY0_B5

49.8 ohms

520.665 ps

3.333 in

QDR2_D_BY0_B5

28.5 ohms

4.473 ps

0.028 in

QDR2_D_BY0_B5

Virtex-5 FPGA

QDR2_D_BY0_B5

U34.M31

UG199_c7_39_070907

49.0 ohms

5.283 ps

0.035 in

QDR2_D_BY0_B5

71.0 ohms

27.482 ps

AutoPadstk_3

45.1 ohms

7.862 ps

AutoPadstk_19

70.8 ohms

16.339 ps

AutoPadstk_3

TL2 TL4 TL5

TL6

TL7 TL8 TL3 TL1

QDR2_D... QDR2_D... QDR2_D... QDR2_D...

QDR2_D...

QDR2_D...

R1586

VCC0V7…

0.9V

49.9 ohms

Table 7-11: Circuit Elements of QDRII Write Data bit (QDR2_D_BY0_B5)

Element Designation Description

Driver U34.M31 FPGA HSTL_I_18

Receiver U35.G11 QDRII memory

Probe Point C7 Via under Memory

PCB Termination R1586 External termination at memory

Trace Length TL 2, 5, 8, 1 3.46 inches

Table 7-12: QDRII Write Operation Correlation Results

Measurement DVW

(% UI)

ISI

(% UI)

Noise Margin

(VIH + VIL) = Total

(% of VREF)

Overshoot / Undershoot

Margin

(% of VREF)

Hardware at probe

point

1.40 ns

(84.1%) (50 + 70) = 120 ps (7.2%) (340 + 400) = 740 mV

(82.2%)

(450 + 400) = 850 mV

(94.5%)

Simulation correlation

slow-weak corner

1.39 ns

(83.5%) (136 + 91) = 227 ps (13.6%) (344 + 398) = 742 mV

(82.5%)

(483 + 452) = 935 mV

(103.9%)

Correlation Delta:

HW vs. Simulation

10 ps

(0.6%) 107 ps (6.4%) 2 mV (0.3%) 85 mV (9.4%)

Extrapolation at IOB

slow-weak corner

1.38 ns

(83%)

(172 + 141) = 313 ps

(18.8%)

(329 + 358) = 687 mV

(76.3%)

(400 + 361) = 761 mV

(84.5%)

Extrapolation at IOB

fast-strong corner

1.49 ns

(89%) (126 + 91) = 217 ps (13.0%) (353 + 376) = 729 mV

(81.0%)

(156 + 30) = 186 mV

(20.7%)

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Figure 7-40: QDRII Write HW Measurement - Eye Scope Shot at Probe Point (QDRII Memory Via)

UG199_c7_40_071107

Figure 7-41: QDRII Write Correlation - Eye Scope Shot at Probe Point (Slow Corner)

0.000 400.0 800.0 1200.0 1600.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_41_070907

Probe 3:C7.1 (at pin)

♦300 MHz, Slow, PRBS6, 83.5% UI

♦Cursor 1: 699.1 mV, 90.0 ps

♦Cursor 2: 801.0 mV, 1.4770 ns

♦Delta Voltage = 101.9 mV, Delta Time = 1.3870 ns (83.5% UI)

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Figure 7-42: QDRII Write HW Measurement - Waveform Scope Shot at Probe Point (QDRII Memory Via)

UG199_c7_42_071107

Figure 7-43: QDRII Write Correlation - Waveform Scope Shot at Probe Point (Slow Corner)

110.000 120.000 130.000 140.000 150.000 160.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

Time (ns)

Voltage (mV)

UG199_c7_43_071007

Probe 3:C7.1 (at pin)

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Figure 7-44: QDRII Write Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

0.000 400.0 800.0 1200.0 1600.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_44_070907

Probe 6:U35.G11 (at die)

♦300 MHz, Slow, PRBS6, 83% UI

♦Cursor 1: 699.1 mV, 61.3 ps

♦Cursor 2: 801.0 mV, 1.4433 ns

♦Delta Voltage = 101.9 mV, Delta Time = 1.3820 ns (83% UI)

Figure 7-45: QDRII Write Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner)

110.000 120.000 130.000 140.000 150.000 160.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_45_071007

Time (ns)

Voltage (mV)

Probe 6:U35.G11 (at die)

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Figure 7-46: QDRII Write Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

800.0 1200.0 1600.0 2000.0 2400.0 2800.0

-1900.0

-1400.0

-900.0

-400.0

100.0

600.0

1100.0

1600.0

2100.0

2600.0

3100.0

Time (ps)

Voltage (mV)

UG199_c7_46_070907

Probe 6:U35.G11 (at die)

♦300 MHz, Fast, PRBS6, 89% UI

♦Cursor 1: 699.1 mV, 1.1440 ns

♦Cursor 2: 801.0 mV, 2.6334 ns

♦Delta Voltage = 101.9 mV, Delta Time = 1.4894 ns (89% UI)

Figure 7-47: QDRII Write Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

110.000 120.000 130.000 140.000 150.000 160.000

-1600.0

-1100.0

-600.0

-100.0

400.0

900.0

1400.0

1900.0

2400.0

2900.0

3400.0

UG199_c7_47_070907

Time (ns)

Voltage (mV)

Probe 6:U35.G11 (at die)

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QDRII Read Operation

This subsection shows the test results for the QDR2_Q_BY0_B5 signal from QDRII

memory (U35) to FPGA3 (U34) measured at 300 MHz (600 Mb/s), where the unit interval

(UI) = 1.67 ns.

Figure 7-48: Post-Layout IBIS Schematics of QDRII Read Data Bit (QDR2_Q_BY0_B5)

Virtex-5 FPGA

QDR2_Q_BY0_B5

U34.G33

28.5 ohms

4.473 ps

0.028 in

QDR2_Q_BY0_B5

49.1 ohms

95.834 ps

0.613 in

QDR2_Q_BY0_B5

28.5 ohms

4.404 ps

0.027 in

QDR2_Q_BY0_B5

49.1 ohms

427.654 ps

2.737 in

QDR2_Q_BY0_B5

71.6 ohms

22.319 ps

AutoPadstk_3

71.8 ohms

22.319 ps

AutoPad...

TL1 TL2 TL3 TL6 TL7 TL8

22.9 fF 96.3 fF 500.0 fF

513.2 fF

C7

QDR2_Q...

QDR2_Q...

QDR2_Q...

96.3 fF

QDR2_Q...

22.9 fF

QDR2_Q...

U35.F11

UG199_c7_48_071907

K7R323684M_1.8V

C5

Table 7-13: Circuit Elements of QDRII Read Data Bit (QDR2_Q_BY0_B5)

Element Designation Description

Driver U36.F11 QDRII memory

Receiver U34.G33 FPGA HSTL_I_DCI_18

Probe Point C7 Via under FPGA3 (U34)

PCB Termination None DCI at FPGA

Trace Length TL 1, 3, 6, 8 3.41 inches

Table 7-14: QDRII Read Operation Correlation Results

Measurement DVW

(% UI)

ISI

(% UI)

Noise Margin

(VIH + VIL) = Total

(% of VREF)

Overshoot / Undershoot

Margin

(% of VREF)

Hardware at probe point 1.09 ns

(65.4%) (70 + 50) = 120 ps (7.2%) (400 + 400) = 800 mV

(88.9%)

(500 + 500) = 1000 mV

(111.1%)

Simulation correlation

slow-weak corner

984 ps

(59.0%) (72 + 75) = 147 ps (8.8%) (250 + 264) = 514 mV

(57.1%)

(532 + 518) = 1050 mV

(105.5%)

Correlation Delta:

HW vs. Simulation

106 ps

(6.4%) 27 ps (1.6%) 386 mV (31.8%) 50 mV (5.6%)

Extrapolation at IOB

slow-weak corner

1.46 ns

(88%) (49 + 36) = 85 ps (5.1%) (237 + 272) = 509 mV

(56.5%)

(608 + 575) = 1183 mV

(131.5%)

Extrapolation at IOB

fast-strong corner

1.45 ns

(87%) (27 + 39) = 66 ps (4.0%) (341 +201) = 542 mV

(60.3%)

(532 + 661) = 1193 mV

(132.6%)

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Figure 7-49: QDRII Read HW Measurement - Eye Diagram Scope Shot at Probe Point (FPGA3 Via)

UG199_c7_49_071107

Figure 7-50: QDRII Read Correlation - Eye Diagram Scope Shot at Probe Point (Slow Corner)

800.0 1200.0 1600.0 2000.0 2400.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_50_070907

Probe 3:C7.1 (at pin)

♦300 MHz, Slow, PRBS6, 59% UI

♦Cursor 1: 1.1007V, 1.4881 ns

♦Cursor 2: 1.0029V, 2.4719 ns

♦Delta Voltage = 97.9 mV, Delta Time = 983.8 ps (59% UI)

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Figure 7-51: QDRII Read HW Measurement - Waveform Scope Shot at Probe Point (FPGA3 Via)

UG199_c7_51_071107

Figure 7-52: QDRII Read Correlation - Waveform Scope Shot at Probe Point (Slow Corner)

20.000 30.000 40.000 50.000 60.000 70.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

Time (ns)

Voltage (mV)

UG199_c7_52_071007

Probe 3:C7.1 (at pin)

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Figure 7-53: QDRII Read Extrapolation - Eye Scope Shot at Receiver IOB (Slow Corner)

1000.0 1400.0 1800.0 2200.0 2600.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_53_070907

Probe 6:U34.G33 (at die)

♦300 MHz, Slow, PRBS6, 88% UI

♦Cursor 1: 1.1008V, 1.2758 ns

♦Cursor 2: 998.9 mV, 2.7352 ns

♦Delta Voltage = 101.9 mV, Delta Time = 1.4594 ns (88% UI)

Figure 7-54: QDRII Read Extrapolation - Waveform Scope Shot at Receiver IOB (Slow Corner

30.000 40.000 50.000 60.000 70.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_54_071007

Time (ns)

Voltage (mV)

Probe 6:U34.G33 (at die)

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Figure 7-55: QDRII Read Extrapolation - Eye Scope Shot at Receiver IOB (Fast Corner)

1200.0 1600.0 2000.0 2400.0 2800.0

-200.0

0.000

200.0

400.0

600.0

800.0

1000.0

1200.0

1400.0

1600.0

1800.0

Time (ps)

Voltage (mV)

UG199_c7_55_070907

Probe 6:U34.G33 (at die)

♦300 MHz, Fast, PRBS6, 87% UI

♦Cursor 1: 801 mV, 2.7263 ns

♦Cursor 2: 697.0 mV, 1.2744 ns

♦Delta Voltage = 104.0 mV, Delta Time = 1.4519 ns (87% UI)

Figure 7-56: QDRII Read Extrapolation - Waveform Scope Shot at Receiver IOB (Fast Corner)

25.000 35.000 45.000 55.000 65.000 75.000

-100.0

100.0

300.0

500.0

700.0

900.0

1100.0

1300.0

1500.0

1700.0

1900.0

UG199_c7_56_071007

Time (ns)

Voltage (mV)

Probe 6:U34.G33 (at die)

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Summary and Recommendations

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Summary and Recommendations

The first objective of this exercise is to establish correlation between hardware

measurements and the simulation at the probe point. The intention was to validate the

simulation model for the targeted signal. The degree of correlation achieved is looked at in

terms of absolute difference as well as relative percentage. The relative percentage

differences are presented in terms of unit interval (UI) for timing characteristics and in

terms of VREF voltage for the voltage margin characteristics.

Correlation simulation is performed under ideal conditions, that is, the stimulus is

generated without any jitter. On the other hand, the hardware measurements are subject to

jitter (which tends to increase ISI), board-level power fluctuation (which can affect the eye

amplitude), and stability of the probing station. Thus some correlation differences are

expected. The user ultimately uses his or her own judgment to account for these

differences, and adjusts the values extrapolated for quality of signal at the receiver IOB.

Table 7-15 contains this information for all six test signals.

There are varying degrees of correlation differences among the six test signals. In general,

there is a good match between hardware measurements and the correlation simulation,

except for some yet-to-be analyzed differences, for example, DDR2 DIMM Write DVW and

QDRII read noise margin.

The remainder of this section summarizes the extrapolation results of the data bit interface

for all six memory operations on the ML561 board. The measure of SI characteristics of

each signal is determined by the worst-case extrapolation measurement from among the

simulations with drivers at slow-weak and fast-strong corners. The values chosen between

these two corner cases are:

•Minimum of DVW, noise margin, and overshoot/undershoot margin

•Maximum of ISI

Table 7-15: Summary of Correlation Differences: Hardware vs. Simulation

Operation ΔDVW

(% UI(1))

ΔISI

(% UI)

Noise Margin

(% VREF)

Overshoot /

Undershoot Margin

(% VREF)

DDR2 Component Write 40 ps

(2.6%)

47 ps

(3.2%)

98 mV

(10.9%)

69 mV

(7.6%)

DDR2 Component Read 0 ps

(0%)

43 ps

(2.9%)

6 mV

(0.7%)

244 mV

(17.2%)

DDR2 DIMM Write 218 ps

(14.5%)

366 ps

(24.5%)

112 mV

(12.6%)

2 mV

(0.3%)

DDR2 DIMM Read 39 ps

(2.6%)

44 ps

(2.9%)

90 mV

(10.0%)

208 mV

(23.1%)

QDRII Write 10 ps

(0.6%)

107 ps

(6.4%)

2 mV

(0.3%)

85 mV

(9.4%)

QDRII Read 106 ps

(6.4%)

27 ps

(1.6%)

386 mV

(31.8%)

50 mV

(5.6%)

Notes:

1. Unit Interval (UI): 1.5 ns for DDR2 and 1.67 ns for QDRII. VREF = 0.9V for DDR2 and QDRII.

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Table 7-16 summarizes the extrapolated SI characteristics of all six test signals.

Here are some observations about extrapolated SI characteristics among these test signals:

•The Data Valid Window (DVW) values already account for the degradation caused by

ISI due to the PRBS6 test pattern. For timing analysis, two values need to be taken into

consideration appropriately. For a PRBS6 test pattern, the worst-case DVW value

(after discounting for ISI) is 82% UI for DDR2 DIMM operations.

•DDR2 write operations, as compared to QDRII write operations, have a lower noise

margin due to the always on nature of the DCI termination on the DQ signal for the

SSTL18_II_DCI I/O standard at the FPGA. Consequently, the overshoot/undershoot

margin for DDR2 write operations is higher than for QDRII write operations. The

DDR2 DIMM write operation has the lowest VIL noise margin of 107 mV.

•For read operations, the sum of VIH and VIL noise margins beyond the AC value

specifications is at least 509 mV (56.6% of VREF). QDRII read operations have the

lowest VIL noise margin of 201 mV.

•All six signals have positive values for overshoot and undershoot margins. QDRII

write operations have the lowest undershoot margin value of 30 mV.

(For Table 5-1, page 48 through Table 5-5, page 49, the recommendations remain the same

except for a clarification for DDR2 ODT as “75 ohm ODT”.)

Table 7-16: Summary of Worst-Case SI Characteristics

Operation ΔDVW

(% UI)

ΔISI

(% UI)

Noise Margin

(% VREF)

Overshoot /

Undershoot Margin

(% VREF)

DDR2 Component Write 1.27 ns

(84%)

127 ps

(8.5%)

570 mV

(63.3%)

685 mV

(76.1%)

DDR2 Component Read 1.29 ns

(86%)

178 ps

(11.9%)

867 mV

(96.3%)

349 mV

(38.9%)

DDR2 DIMM Write 1.23 ns

(82%)

117 ps

(7.8%)

253 mV

(28.1%)

981 mV

(109.0%)

DDR2 DIMM Read 1.23 ns

(82%)

224 ps

(14.9%)

546 mV

(60.7%)

989 mV

(109.9%)

QDRII Write 1.38 ns

(83%)

313 ps

(18.8%)

687 mV

(76.3%)

186 mV

(20.7%)

QDRII Read 1.45 ns

(87%)

85 ps

(5.1%)

509 mV

(56.5%)

1183 mV

(131.5%)

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How to Generate a User-Specific FPGA IBIS Model

The following steps indicate how to generate an IBIS model:

1. Under ISE, open your fully compiled project.

2. Go to the Tcl S h e l l tab, and issue an ibiswriter command as:

ibiswriter –allmodels <your top level project design file>.ncd <name up

to 24 lowercase characters>.ibs ;

For example, ibiswriter –allmodels mem_interface_top.ncd

ml561_fpga3_u34.ibs

3. Unzip the Virtex-5 FPGA IBIS models ZIP file located at the Xilinx Download Center

(under the “Device Models” sidebar link). Then unzip the ZIP file containing the

device package files and extract a package file for your device, for example,

ff1136_5vlx50t.pkg. Place this file in the same directory as the FPGA IBIS file (for

example, ml561_fpga3_u34.ibs).

4. Open the ml561_fpga3_u34.ibs file generated by ibiswriter in HyperLynx Visual

IBIS Editor. Check the file for correctness by clicking on the check (9) button in the top

toolbar. Warnings are okay.

5. Open the ff1136_5vlx50t.pkg file using a text editor and locate the [Define

Package Model] line. Copy and paste this line into the ml561_fpga3_u34.ibs file

just above the line with the [Package] declaration. Edit the copied line to change

[Define Package Model] to [Package Model].

6. Again, check the file for correctness by clicking on the check (9) button in the top

toolbar. Multiple errors will appear. The package model file defines I/O definitions for

all usable pins, but now ibiswriter only declares pins defined under the UCF. Thus

errors are displayed for all the undefined pins, for example:

ERROR - Pin 'AK9' found in Package_Model 'ff1136_xc5vlx50t_fga0106_dc' Pin_Numbers

list not found in Component 'VIRTEX-5' Pin list.

7. Copy all these errors into a text file with a .txt file type.

♦Open this text file with Excel and provide the delimiter as (‘), which puts all the

unused pin names in one column. Delete all other columns before and after the

one with the pin names.

♦In column 2, fill in Unused_IO for all pins.

♦In column 3, fill in the name of one of the I/O standards defined under the

[Model] section of the ml561_fpga3_u34.ibs file, for example,

LVCMOS25_S_12. Choose a name that is not an output only standard, because it

might conflict with other outputs in the same bank.

♦Right-justify the indentation for all three columns and make sure that each

column is wider by a few spaces than the longest string in that column.

♦Save this file with the Save As command in Excel using the Formatted Text (space

delimited) (*.prn) option to create a text file with text columns separated by

spaces. (The IBIS checker gives a warning if the .ibs file contains tabs.)

8. Open the .prn file with a text editor and copy all these lines to the .ibs file at the end

of the [Pin] definitions section (just above the [Diff Pin] declarations).

9. Check (9) the .ibs file again. There should not be any errors. Again, warnings are

okay.

10. The result is an accurate custom-made IBIS model of a Virtex-5 device specific to your

design.

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Appendix A

FPGA Pinouts

This appendix provides the pinouts for the three FPGAs on the Virtex-5 FPGA ML561

Development Board. The toolkit CD shipped with every ML561 contains sample UCFs for

each memory interface. These UCFs are for pinout reference only and do not include other

constraints, like I/O standards.

FPGA #1 Pinout

Table A-1 lists the connections for FPGA #1 (U7).

Table A-1: FPGA #1 Pinout

Signal Name Pin Signal Name Pin

DDR400 Component Interface

DDR1_A0 M32 DDR1_CK1_N AJ34

DDR1_A1 L33 DDR1_CK1_P AH34

DDR1_A10 E33 DDR1_CK2_N AE34

DDR1_A11 E32 DDR1_CK2_P AF34

DDR1_A12 E34 DDR1_CKE AC34

DDR1_A13 F33 DDR1_LB_BK11 N32

DDR1_A2 K32 DDR1_LB_BK11 P32

DDR1_A3 K34 DDR1_LB_BK13 AJ32

DDR1_A4 L34 DDR1_LB_BK13 AK32

DDR1_A5 J34 DDR1_RAS_N AB32

DDR1_A6 H34 DDR1_WE_N AD34

DDR1_A7 H33 DDR1_DM_BY0 AG32

DDR1_A8 F34 DDR1_DM_BY1 Y32

DDR1_A9 G33 DDR1_DM_BY2 P34

DDR1_BA0 AK33 DDR1_DM_BY3 G32

DDR1_BA1 AK34 DDR1_DQ_BY0_B0 AP32

DDR1_BY0_1_CS_N AB33 DDR1_DQ_BY0_B1 AN32

DDR1_BY2_3_CS_N AC33 DDR1_DQ_BY0_B2 AN33

DDR1_CAS_N AC32 DDR1_DQ_BY0_B3 AN34

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DDR400 Component Interface (cont.)

DDR1_DQ_BY0_B4 AM32 DDR1_DQ_BY2_B4 R32

DDR1_DQ_BY0_B5 AM33 DDR1_DQ_BY2_B5 R33

DDR1_DQ_BY0_B6 AL33 DDR1_DQ_BY2_B6 R34

DDR1_DQ_BY0_B7 AL34 DDR1_DQ_BY2_B7 T33

DDR1_DQ_BY1_B0 Y34 DDR1_DQ_BY3_B0 D34

DDR1_DQ_BY1_B1 AA34 DDR1_DQ_BY3_B1 C34

DDR1_DQ_BY1_B2 AA33 DDR1_DQ_BY3_B2 D32

DDR1_DQ_BY1_B3 Y33 DDR1_DQ_BY3_B3 C32

DDR1_DQ_BY1_B4 V34 DDR1_DQ_BY3_B4 C33

DDR1_DQ_BY1_B5 W34 DDR1_DQ_BY3_B5 B33

DDR1_DQ_BY1_B6 V33 DDR1_DQ_BY3_B6 A33

DDR1_DQ_BY1_B7 V32 DDR1_DQ_BY3_B7 B32

DDR1_DQ_BY2_B0 U31 DDR1_DQS_BY0_P AD32

DDR1_DQ_BY2_B1 U32 DDR1_DQS_BY1_P AF33

DDR1_DQ_BY2_B2 T34 DDR1_DQS_BY2_P K33

DDR1_DQ_BY2_B3 U33 DDR1_DQS_BY3_P J32

DDR2 Component Interface

DDR2_A0 K12 DDR2_CAS_N J14

DDR2_A1 K13 DDR2_CK0_N K19

DDR2_A10 G22 DDR2_CK0_P L19

DDR2_A11 J15 DDR2_CK1_N J19

DDR2_A12 K16 DDR2_CK1_P K18

DDR2_A2 H23 DDR2_CKE K17

DDR2_A3 G23 DDR2_CS0_N H20

DDR2_A4 H12 DDR2_CS1_N H19

DDR2_A5 J12 DDR2_LB_BK15 T28

DDR2_A6 K22 DDR2_LB_BK15 T29

DDR2_A7 K23 DDR2_LB_BK19 M28

DDR2_A8 K14 DDR2_LB_BK19 N28

DDR2_A9 L14 DDR2_ODT0 H18

DDR2_BA0 K21 DDR2_ODT1 H17

DDR2_BA1 J22 DDR2_RAS_N H13

Table A-1: FPGA #1 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #1 Pinout

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DDR2 Component Interface (cont.)

DDR2_WE_N J21 DDR2_DQ_BY2_B2 N25

DDR2_DM_BY0 U30 DDR2_DQ_BY2_B3 P25

DDR2_DM_BY1 L29 DDR2_DQ_BY2_B4 P24

DDR2_DM_BY2 K27 DDR2_DQ_BY2_B5 N24

DDR2_DM_BY3 J27 DDR2_DQ_BY2_B6 P27

DDR2_DQ_BY0_B0 T25 DDR2_DQ_BY2_B7 P26

DDR2_DQ_BY0_B1 U25 DDR2_DQ_BY3_B0 M26

DDR2_DQ_BY0_B2 T26 DDR2_DQ_BY3_B1 M25

DDR2_DQ_BY0_B3 U26 DDR2_DQ_BY3_B2 J25

DDR2_DQ_BY0_B4 R27 DDR2_DQ_BY3_B3 J24

DDR2_DQ_BY0_B5 R26 DDR2_DQ_BY3_B4 L26

DDR2_DQ_BY0_B6 U28 DDR2_DQ_BY3_B5 L25

DDR2_DQ_BY0_B7 U27 DDR2_DQ_BY3_B6 L24

DDR2_DQ_BY1_B0 E31 DDR2_DQ_BY3_B7 K24

DDR2_DQ_BY1_B1 F31 DDR2_DQS_BY0_N N30

DDR2_DQ_BY1_B2 J29 DDR2_DQS_BY0_P M31

DDR2_DQ_BY1_B3 H29 DDR2_DQS_BY1_N P29

DDR2_DQ_BY1_B4 F30 DDR2_DQS_BY1_P N29

DDR2_DQ_BY1_B5 G30 DDR2_DQS_BY2_N E27

DDR2_DQ_BY1_B6 F29 DDR2_DQS_BY2_P E26

DDR2_DQ_BY1_B7 E29 DDR2_DQS_BY3_N H27

DDR2_DQ_BY2_B0 T24 DDR2_DQS_BY3_P G27

DDR2_DQ_BY2_B1 23 R24

FPGA #1 Clock and Reset Signals

CLK_TO_FPGA1_MGT_116_N H3 DIRECT_CLK_TO_FPGA1_P AG22

CLK_TO_FPGA1_MGT_116_P H4 EXT_CLK_TO_FPGA1_N AG13

CLK_TO_FPGA1_MGT_118_N AF3 EXT_CLK_TO_FPGA1_P AH12

CLK_TO_FPGA1_MGT_118_P AF4 FPGA1_LOW_FREQ_CLK AH20

DIRECT_CLK_TO_FPGA1_N AH22 FPGA1_RESET_N AH14

Table A-1: FPGA #1 Pinout (Continued)

Signal Name Pin Signal Name Pin

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Appendix A: FPGA Pinouts

R

FPGA #1 MII Link Interface

FPGA2_TO_FPGA1_MII_TX_CLK J10 FPGA3_TO_FPGA1_MII_TX_CLK D10

FPGA2_TO_FPGA1_MII_TX_DATA0 C13 FPGA3_TO_FPGA1_MII_TX_DATA0 H10

FPGA2_TO_FPGA1_MII_TX_DATA1 B13 FPGA3_TO_FPGA1_MII_TX_DATA1 C12

FPGA2_TO_FPGA1_MII_TX_DATA2 K9 FPGA3_TO_FPGA1_MII_TX_DATA2 D12

FPGA2_TO_FPGA1_MII_TX_DATA3 K8 FPGA3_TO_FPGA1_MII_TX_DATA3 J11

FPGA2_TO_FPGA1_MII_TX_EN L11 FPGA3_TO_FPGA1_MII_TX_EN A13

FPGA2_TO_FPGA1_MII_TX_ERR L10 FPGA3_TO_FPGA1_MII_TX_ERR H9

FPGA2_TO_FPGA1_MII_TX_SPARE J9 FPGA3_TO_FPGA1_MII_TX_SPARE K11

FPGA #1 Configuration Signals

FPGA_INIT N14 FPGA1_D_IN P15

FPGA_PROGB M22 FPGA1_DONE M15

FPGA_TMS AC14 FPGA1_DOUT_B AD15

FPGA_VBATT L23 FPGA1_HSWAPEN M23

FPGA1_CCLK N15 FPGA1_TCK AB15

FPGA1_CNFG_M0 AD21 FPGA1_TDI_IN AC15

FPGA1_CNFG_M1 AC22 FPGA1_TDO 15 AD14

FPGA1_CNFG_M2 AD22

FPGA #1 Test and Debug Signals

FPGA1_DIP0 AG18 FPGA1_TEST_HDR_BY0_B6 E8

FPGA1_DIP1 AG15 FPGA1_TEST_HDR_BY0_B7 E9

FPGA1_DIP2 AH15 FPGA1_TEST_HDR_BY1_B0 E12

FPGA1_DIP3 AG20 FPGA1_TEST_HDR_BY1_B1 L9

FPGA1_SPYHOLE_BK21 AF26 FPGA1_TEST_HDR_BY1_B2 M10

FPGA1_TEST_HDR_BY0_B0 H8 FPGA1_TEST_HDR_BY1_B3 E11

FPGA1_TEST_HDR_BY0_B1 G8 FPGA1_TEST_HDR_BY1_B4 F11

FPGA1_TEST_HDR_BY0_B2 G10 FPGA1_TEST_HDR_BY1_B5 L8

FPGA1_TEST_HDR_BY0_B3 F10 FPGA1_TEST_HDR_BY1_B6 M8

FPGA1_TEST_HDR_BY0_B4 F8 FPGA1_TEST_HDR_BY1_B7 G12

FPGA1_TEST_HDR_BY0_B5 F9

Table A-1: FPGA #1 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #1 Pinout

R

FPGA #1 Test Display Signals

FPGA1_7SEG_0_N AG17 FPGA1_7SEG_6_N AF19

FPGA1_7SEG_1_N AH18 FPGA1_7SEG_DP_N AG21

FPGA1_7SEG_2_N AE18 FPGA1_LED0 AD19

FPGA1_7SEG_3_N AF18 FPGA1_LED1 AE19

FPGA1_7SEG_4_N AG16 FPGA1_LED2 AE17

FPGA1_7SEG_5_N AH17 FPGA1_LED3 AF16

FPGA #1 External Interfaces

FPGA1_LCD_BL_ON M6 FPGA1_LCD_E M5

FPGA1_LCD_CSB M7 FPGA1_LCD_R_WB N8

FPGA1_LCD_DB0 K6 FPGA1_LCD_RESET_N L6

FPGA1_LCD_DB1 K7 FPGA1_LCD_RS N7

FPGA1_LCD_DB2 P6 FPGA1_RS232_CTS R11

FPGA1_LCD_DB3 P7 FPGA1_RS232_RTS G5

FPGA1_LCD_DB4 L5 FPGA1_RS232_RX P9

FPGA1_LCD_DB5 L4 FPGA1_RS232_TX H5

FPGA1_LCD_DB6 P5 FPGA1_TXN0_BK124 B9

FPGA1_LCD_DB7 N5 FPGA1_TXP0_BK124 B10

FPGA1_USB_CTS_N G6 FPGA1_USB_RTS_N G7

FPGA1_USB_DSR_N E6 FPGA1_USB_RX T9

FPGA1_USB_DTR_N E7 FPGA1_USB_SUSPEND T11

FPGA1_USB_RST_N T10 FPGA1_USB_TX U10

FPGA #1 Voltage Margining Interface

VMARGIN_DN_3V3_N AE22 VMARGIN_UP_3V3_N AE23

VMARGIN_DN_HSTL_N AE13 VMARGIN_UP_HSTL_N AE12

VMARGIN_DN_SSTL18_N AF13 VMARGIN_UP_SSTL18_N AG12

VMARGIN_DN_SSTL2_N AF23 VMARGIN_UP_SSTL2_N AG23

VMARGIN_DN_VCC1V0_N AF20 VMARGIN_UP_VCC1V0_N AF21

VMARGIN_DN_VCC2V5_N AE14 VMARGIN_UP_VCC2V5_N AF14

Table A-1: FPGA #1 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #2 Pinout

Table A-2 lists the connections for FPGA #2 (U5).

Table A-2: FPGA #2 Pinout

Signal Name Pin Signal Name Pin

DDR2 DIMM Deep Interface

DDR2_DIMM_A0 AG30 DDR2_DIMM1_CK0_N M26

DDR2_DIMM_A1 AH29 DDR2_DIMM1_CK0_P M25

DDR2_DIMM_A10 AF31 DDR2_DIMM1_CK1_N J25

DDR2_DIMM_A11 AC29 DDR2_DIMM1_CK1_P J24

DDR2_DIMM_A12 AD30 DDR2_DIMM1_CK2_N L26

DDR2_DIMM_A13 AA30 DDR2_DIMM1_CK2_P L25

DDR2_DIMM_A14 AA29 DDR2_DIMM1_CKE0 G28

DDR2_DIMM_A15 AC30 DDR2_DIMM1_CKE1 H28

DDR2_DIMM_A2 AH30 DDR2_DIMM1_CS0_N V27

DDR2_DIMM_A3 AJ30 DDR2_DIMM1_CS1_N V28

DDR2_DIMM_A4 AF30 DDR2_DIMM1_ODT0 H24

DDR2_DIMM_A5 AF29 DDR2_DIMM1_ODT1 H25

DDR2_DIMM_A6 AK31 DDR2_DIMM2_CK0_N AF26

DDR2_DIMM_A7 AJ31 DDR2_DIMM2_CK0_P AF25

DDR2_DIMM_A8 AD29 DDR2_DIMM2_CK1_N AG25

DDR2_DIMM_A9 AE29 DDR2_DIMM2_CK1_P AF24

DDR2_DIMM_BA0 AB30 DDR2_DIMM2_CK2_N AJ26

DDR2_DIMM_BA1 AA31 DDR2_DIMM2_CK2_P AH27

DDR2_DIMM_BA2 AB31 DDR2_DIMM2_CKE0 AE24

DDR2_DIMM_CAS_N V29 DDR2_DIMM2_CKE1 AD24

DDR2_DIMM_LB_BK11_IN P32 DDR2_DIMM2_CS0_N W27

DDR2_DIMM_LB_BK11_OUT H33 DDR2_DIMM2_CS1_N Y27

DDR2_DIMM_LB_BK13_IN AJ32 DDR2_DIMM2_ODT0 AE26

DDR2_DIMM_LB_BK13_OUT AK32 DDR2_DIMM2_ODT1 AE27

DDR2_DIMM_LB_BK15_IN T28 DDR2_DIMM3_CK0_N AA24

DDR2_DIMM_LB_BK15_OUT T29 DDR2_DIMM3_CK0_P Y24

DDR2_DIMM_RAS_N Y28 DDR2_DIMM3_CK1_N AC27

DDR2_DIMM_RESET_N Y29 DDR2_DIMM3_CK1_P AB27

DDR2_DIMM_WE_N W29 DDR2_DIMM3_CK2_N AA26

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FPGA #2 Pinout

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DDR2 DIMM Deep Interface (cont.)

DDR2_DIMM3_CK2_P AA25 DDR2_DIMM_DQ_BY0_B4 R27

DDR2_DIMM3_CKE0 AE28 DDR2_DIMM_DQ_BY0_B5 R26

DDR2_DIMM3_CKE1 AH28 DDR2_DIMM_DQ_BY0_B6 U28

DDR2_DIMM3_CS0_N W25 DDR2_DIMM_DQ_BY0_B7 U27

DDR2_DIMM3_CS1_N V25 DDR2_DIMM_DQ_BY1_B0 N29

DDR2_DIMM3_ODT0 AB26 DDR2_DIMM_DQ_BY1_B1 M30

DDR2_DIMM3_ODT1 AB25 DDR2_DIMM_DQ_BY1_B2 L30

DDR2_DIMM4_CK0_N AK9 DDR2_DIMM_DQ_BY1_B3 J31

DDR2_DIMM4_CK0_P AK8 DDR2_DIMM_DQ_BY1_B4 J30

DDR2_DIMM4_CK1_N AJ11 DDR2_DIMM_DQ_BY1_B5 G31

DDR2_DIMM4_CK1_P AK11 DDR2_DIMM_DQ_BY1_B6 H30

DDR2_DIMM4_CK2_N AD11 DDR2_DIMM_DQ_BY1_B7 L29

DDR2_DIMM4_CK2_P AD10 DDR2_DIMM_DQ_BY2_B0 E31

DDR2_DIMM4_CKE0 AG11 DDR2_DIMM_DQ_BY2_B1 F31

DDR2_DIMM4_CKE1 AG10 DDR2_DIMM_DQ_BY2_B2 J29

DDR2_DIMM4_CS0_N W26 DDR2_DIMM_DQ_BY2_B3 H29

DDR2_DIMM4_CS1_N Y26 DDR2_DIMM_DQ_BY2_B4 F30

DDR2_DIMM4_ODT0 AE11 DDR2_DIMM_DQ_BY2_B5 G30

DDR2_DIMM4_ODT1 AF11 DDR2_DIMM_DQ_BY2_B6 F29

DDR2_DIMM_DM_BY0 U30 DDR2_DIMM_DQ_BY2_B7 E29

DDR2_DIMM_DM_BY1 R31 DDR2_DIMM_DQ_BY3_B0 J32

DDR2_DIMM_DM_BY2 T31 DDR2_DIMM_DQ_BY3_B1 F34

DDR2_DIMM_DM_BY3 L33 DDR2_DIMM_DQ_BY3_B2 G33

DDR2_DIMM_DM_BY4 AK34 DDR2_DIMM_DQ_BY3_B3 E33

DDR2_DIMM_DM_BY5 AG32 DDR2_DIMM_DQ_BY3_B4 E32

DDR2_DIMM_DM_BY6 P34 DDR2_DIMM_DQ_BY3_B5 E34

DDR2_DIMM_DM_BY7 AK33 DDR2_DIMM_DQ_BY3_B6 F33

DDR2_DIMM_DM_CB0_7 M32 DDR2_DIMM_DQ_BY3_B7 G32

DDR2_DIMM_DQ_BY0_B0 T25 DDR2_DIMM_DQ_BY4_B0 Y34

DDR2_DIMM_DQ_BY0_B1 U25 DDR2_DIMM_DQ_BY4_B1 AA34

DDR2_DIMM_DQ_BY0_B2 T26 DDR2_DIMM_DQ_BY4_B2 AA33

DDR2_DIMM_DQ_BY0_B3 U26 DDR2_DIMM_DQ_BY4_B3 Y33

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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DDR2 DIMM Deep Interface (cont.)

DDR2_DIMM_DQ_BY4_B4 V34 DDR2_DIMM_DQ_BY7_B7 Y32

DDR2_DIMM_DQ_BY4_B5 W34 DDR2_DIMM_DQ_CB0_7_B0 D34

DDR2_DIMM_DQ_BY4_B6 V33 DDR2_DIMM_DQ_CB0_7_B1 C34

DDR2_DIMM_DQ_BY4_B7 V32 DDR2_DIMM_DQ_CB0_7_B2 D32

DDR2_DIMM_DQ_BY5_B0 AP32 DDR2_DIMM_DQ_CB0_7_B3 C32

DDR2_DIMM_DQ_BY5_B1 AN32 DDR2_DIMM_DQ_CB0_7_B4 C33

DDR2_DIMM_DQ_BY5_B2 AN33 DDR2_DIMM_DQ_CB0_7_B5 B33

DDR2_DIMM_DQ_BY5_B3 AN34 DDR2_DIMM_DQ_CB0_7_B6 A33

DDR2_DIMM_DQ_BY5_B4 AM32 DDR2_DIMM_DQ_CB0_7_B7 B32

DDR2_DIMM_DQ_BY5_B5 AM33 DDR2_DIMM_DQS_BY0_L_N N30

DDR2_DIMM_DQ_BY5_B6 AL33 DDR2_DIMM_DQS_BY0_L_P M31

DDR2_DIMM_DQ_BY5_B7 AL34 DDR2_DIMM_DQS_BY1_L_N P30

DDR2_DIMM_DQ_BY6_B0 U31 DDR2_DIMM_DQS_BY1_L_P P31

DDR2_DIMM_DQ_BY6_B1 U32 DDR2_DIMM_DQS_BY2_L_N L31

DDR2_DIMM_DQ_BY6_B2 T34 DDR2_DIMM_DQS_BY2_L_P K31

DDR2_DIMM_DQ_BY6_B3 U33 DDR2_DIMM_DQS_BY3_L_N J34

DDR2_DIMM_DQ_BY6_B4 R32 DDR2_DIMM_DQS_BY3_L_P H34

DDR2_DIMM_DQ_BY6_B5 R33 DDR2_DIMM_DQS_BY4_L_N AE34

DDR2_DIMM_DQ_BY6_B6 R34 DDR2_DIMM_DQS_BY4_L_P AF34

DDR2_DIMM_DQ_BY6_B7 T33 DDR2_DIMM_DQS_BY5_L_N AE32

DDR2_DIMM_DQ_BY7_B0 AF33 DDR2_DIMM_DQS_BY5_L_P AD32

DDR2_DIMM_DQ_BY7_B1 AB33 DDR2_DIMM_DQS_BY6_L_N K32

DDR2_DIMM_DQ_BY7_B2 AC33 DDR2_DIMM_DQS_BY6_L_P K33

DDR2_DIMM_DQ_BY7_B3 AB32 DDR2_DIMM_DQS_BY7_L_N AJ34

DDR2_DIMM_DQ_BY7_B4 AC32 DDR2_DIMM_DQS_BY7_L_P AH34

DDR2_DIMM_DQ_BY7_B5 AD34 DDR2_DIMM_DQS_CB0_7_L_N K34

DDR2_DIMM_DQ_BY7_B6 AC34 DDR2_DIMM_DQS_CB0_7_L_P L34

DDR2 DIMM Wide Interface

DDR2_DIMM5_CK0_N AM13 DDR2_DIMM5_CK2_N AP14

DDR2_DIMM5_CK0_P AN13 DDR2_DIMM5_CK2_P AN14

DDR2_DIMM5_CK1_N AA10 DDR2_DIMM5_CKE0 AC10

DDR2_DIMM5_CK1_P AB10 DDR2_DIMM5_CKE1 AM11

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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DDR2 DIMM Wide Interface (cont.)

DDR2_DIMM5_CS0_N V24 DDR2_DIMM_DQ_BY11_B5 G6

DDR2_DIMM5_CS1_N W24 DDR2_DIMM_DQ_BY11_B6 T11

DDR2_DIMM5_ODT0 AA9 DDR2_DIMM_DQ_BY11_B7 T10

DDR2_DIMM5_ODT1 AA8 DDR2_DIMM_DQ_BY12_B0 J6

DDR2_DIMM_LB_BK12 F5 DDR2_DIMM_DQ_BY12_B1 T6

DDR2_DIMM_LB_BK12 F6 DDR2_DIMM_DQ_BY12_B2 R6

DDR2_DIMM_LB_BK18 W10 DDR2_DIMM_DQ_BY12_B3 K6

DDR2_DIMM_LB_BK18 Y6 DDR2_DIMM_DQ_BY12_B4 K7

DDR2_DIMM_LB_BK20 E11 DDR2_DIMM_DQ_BY12_B5 P6

DDR2_DIMM_LB_BK20 F11 DDR2_DIMM_DQ_BY12_B6 P7

DDR2_DIMM_DM_BY10 G11 DDR2_DIMM_DQ_BY12_B7 L4

DDR2_DIMM_DM_BY11 R11 DDR2_DIMM_DQ_BY13_B0 AD7

DDR2_DIMM_DM_BY12 G5 DDR2_DIMM_DQ_BY13_B1 AC7

DDR2_DIMM_DM_BY13 Y11 DDR2_DIMM_DQ_BY13_B2 AB5

DDR2_DIMM_DM_BY14 AH7 DDR2_DIMM_DQ_BY13_B3 AA5

DDR2_DIMM_DM_BY15 W11 DDR2_DIMM_DQ_BY13_B4 AB7

DDR2_DIMM_DM_BY8 M8 DDR2_DIMM_DQ_BY13_B5 AB6

DDR2_DIMM_DM_BY9 G12 DDR2_DIMM_DQ_BY13_B6 AC5

DDR2_DIMM_DM_CB8_15 H5 DDR2_DIMM_DQ_BY13_B7 AC4

DDR2_DIMM_DQ_BY10_B0 H8 DDR2_DIMM_DQ_BY14_B0 V9

DDR2_DIMM_DQ_BY10_B1 G8 DDR2_DIMM_DQ_BY14_B1 V10

DDR2_DIMM_DQ_BY10_B2 G10 DDR2_DIMM_DQ_BY14_B2 AK6

DDR2_DIMM_DQ_BY10_B3 F10 DDR2_DIMM_DQ_BY14_B3 AK7

DDR2_DIMM_DQ_BY10_B4 F8 DDR2_DIMM_DQ_BY14_B4 U8

DDR2_DIMM_DQ_BY10_B5 F9 DDR2_DIMM_DQ_BY14_B5 V8

DDR2_DIMM_DQ_BY10_B6 E8 DDR2_DIMM_DQ_BY14_B6 AJ6

DDR2_DIMM_DQ_BY10_B7 E9 DDR2_DIMM_DQ_BY14_B7 AJ7

DDR2_DIMM_DQ_BY11_B0 E7 DDR2_DIMM_DQ_BY15_B0 W6

DDR2_DIMM_DQ_BY11_B1 E6 DDR2_DIMM_DQ_BY15_B1 AE6

DDR2_DIMM_DQ_BY11_B2 U10 DDR2_DIMM_DQ_BY15_B2 AD6

DDR2_DIMM_DQ_BY11_B3 T9 DDR2_DIMM_DQ_BY15_B3 Y7

DDR2_DIMM_DQ_BY11_B4 G7 DDR2_DIMM_DQ_BY15_B4 AA6

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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DDR2 DIMM Wide Interface (cont.)

DDR2_DIMM_DQ_BY15_B5 AD5 DDR2_DIMM_DQ_CB8_15_B4 N7

DDR2_DIMM_DQ_BY15_B6 AD4 DDR2_DIMM_DQ_CB8_15_B5 N8

DDR2_DIMM_DQ_BY15_B7 Y8 DDR2_DIMM_DQ_CB8_15_B6 M5

DDR2_DIMM_DQ_BY8_B0 G13 DDR2_DIMM_DQ_CB8_15_B7 M6

DDR2_DIMM_DQ_BY8_B1 F13 DDR2_DIMM_DQS_BY10_L_N J9

DDR2_DIMM_DQ_BY8_B2 N9 DDR2_DIMM_DQS_BY10_L_P J10

DDR2_DIMM_DQ_BY8_B3 N10 DDR2_DIMM_DQS_BY11_L_N J7

DDR2_DIMM_DQ_BY8_B4 E13 DDR2_DIMM_DQS_BY11_L_P H7

DDR2_DIMM_DQ_BY8_B5 E12 DDR2_DIMM_DQS_BY12_L_N U7

DDR2_DIMM_DQ_BY8_B6 L9 DDR2_DIMM_DQS_BY12_L_P T8

DDR2_DIMM_DQ_BY8_B7 M10 DDR2_DIMM_DQS_BY13_L_N AF6

DDR2_DIMM_DQ_BY9_B0 A13 DDR2_DIMM_DQS_BY13_L_P AE7

DDR2_DIMM_DQ_BY9_B1 H9 DDR2_DIMM_DQS_BY14_L_N V7

DDR2_DIMM_DQ_BY9_B2 H10 DDR2_DIMM_DQS_BY14_L_P W7

DDR2_DIMM_DQ_BY9_B3 C12 DDR2_DIMM_DQS_BY15_L_N AF5

DDR2_DIMM_DQ_BY9_B4 D12 DDR2_DIMM_DQS_BY15_L_P AG5

DDR2_DIMM_DQ_BY9_B5 J11 DDR2_DIMM_DQS_BY8_L_N C13

DDR2_DIMM_DQ_BY9_B6 K11 DDR2_DIMM_DQS_BY8_L_P B13

DDR2_DIMM_DQ_BY9_B7 D11 DDR2_DIMM_DQS_BY9_L_N K9

DDR2_DIMM_DQ_CB8_15_B0 20 P5 DDR2_DIMM_DQS_BY9_L_P K8

DDR2_DIMM_DQ_CB8_15_B1 N5 DDR2_DIMM_DQS_CB8_15_L_N R8

DDR2_DIMM_DQ_CB8_15_B2 L6 DDR2_DIMM_DQS_CB8_15_L_P R7

DDR2_DIMM_DQ_CB8_15_B3 M7

DDR2 DIMM Miscellaneous Signals

DDR2_DIMM1_CNTL_PAR G27 DDR2_DIMM3_CNTL_PAR AA28

DDR2_DIMM1_CNTL_PAR_ERR H27 DDR2_DIMM3_CNTL_PAR_ERR AG28

DDR2_DIMM1_NC_019 K24 DDR2_DIMM3_NC_019 AK29

DDR2_DIMM1_NC_102 L24 DDR2_DIMM3_NC_102 AJ29

DDR2_DIMM2_CNTL_PAR AD26 DDR2_DIMM4_CNTL_PAR AG8

DDR2_DIMM2_CNTL_PAR_ERR AD25 DDR2_DIMM4_CNTL_PAR_ERR AH8

DDR2_DIMM2_NC_019 AK28 DDR2_DIMM4_NC_019 AL10

DDR2_DIMM2_NC_102 AK27 DDR2_DIMM4_NC_102 AE8

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #2 Pinout

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DDR2 DIMM Miscellaneous Signals (cont.)

DDR2_DIMM5_CNTL_PAR AB8 DDR2_DIMM2_SA2 N24

DDR2_DIMM5_CNTL_PAR_ERR AM12 DDR2_DIMM3_SA0 P27

DDR2_DIMM5_NC_019 AC9 DDR2_DIMM3_SA1 P26

DDR2_DIMM5_NC_102 AL11 DDR2_DIMM3_SA2 N28

DDR2_DIMM_SCL W31 DDR2_DIMM4_SA0 K27

DDR2_DIMM_SDA Y31 DDR2_DIMM4_SA1 L28

DDR2_DIMM1_SA0 T24 DDR2_DIMM4_SA2 K28

DDR2_DIMM1_SA1 R24 DDR2_DIMM5_SA0 E26

DDR2_DIMM1_SA2 N25 DDR2_DIMM5_SA1 F28

DDR2_DIMM2_SA0 P25 DDR2_DIMM5_SA2 E28

DDR2_DIMM2_SA1 P24

FPGA #2 Clock and Reset Signals

CLK_TO_FPGA2_MGT_N H3 EXT_CLK_TO_FPGA2_N AG13

CLK_TO_FPGA2_MGT_P H4 EXT_CLK_TO_FPGA2_P AH12

DIRECT_CLK_TO_FPGA2_N AH22 FPGA2_LOW_FREQ_CLK AH20

DIRECT_CLK_TO_FPGA2_P AG22 FPGA2_RESET_N_IN AH14

FPGA #2 MII Link Interface

FPGA1_TO_FPGA2_MII_TX_CLK AE14 FPGA1_TO_FPGA2_MII_TX_DATA3 AF20

FPGA1_TO_FPGA2_MII_TX_DATA0 AE16 FPGA1_TO_FPGA2_MII_TX_EN AD20

FPGA1_TO_FPGA2_MII_TX_DATA1 AF15 FPGA1_TO_FPGA2_MII_TX_ERR AE21

FPGA1_TO_FPGA2_MII_TX_DATA2 AF21 FPGA1_TO_FPGA2_MII_TX_SPARE AF14

FPGA #2 Configuration Signals

FPGA_INIT N14 FPGA2_D_IN P15

FPGA_PROGB M22 FPGA2_DONE M15

FPGA_TMS AC14 FPGA2_DOUT_B AD15

FPGA_VBATT L23 FPGA2_HSWAPEN M23

FPGA2_CCLK N15 FPGA2_TCK AB15

FPGA2_CNFG_M0 AD21 FPGA2_TDI_IN AC15

FPGA2_CNFG_M1 AC22 FPGA2_TDO AD14

FPGA2_CNFG_M2 AD22

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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R

FPGA #2 Test and Debug Signals

FPGA2_DIP0 AG18 FPGA2_SOFTTOUCH_BY1_B7 H17

FPGA2_DIP1 AG15 FPGA2_SPYHOLE_BK15 P29

FPGA2_DIP2 AH15 FPGA2_SPYHOLE_BK18 W9

FPGA2_DIP3 AG20 FPGA2_TEST_HDR_BY0_B0 AE23

FPGA2_SOFTTOUCH_BY0_B0 H20 FPGA2_TEST_HDR_BY0_B1 AE22

FPGA2_SOFTTOUCH_BY0_B1 H19 FPGA2_TEST_HDR_BY0_B2 AG12

FPGA2_SOFTTOUCH_BY0_B2 H13 FPGA2_TEST_HDR_BY0_B3 AF13

FPGA2_SOFTTOUCH_BY0_B3 J14 FPGA2_TEST_HDR_BY0_B4 AG23

FPGA2_SOFTTOUCH_BY0_B4 J21 FPGA2_TEST_HDR_BY0_B5 AF23

FPGA2_SOFTTOUCH_BY0_B5 J20 FPGA2_TEST_HDR_BY0_B6 AE12

FPGA2_SOFTTOUCH_BY0_B6 H15 FPGA2_TEST_HDR_BY0_B7 AE13

FPGA2_SOFTTOUCH_BY0_B7 H14 FPGA2_TEST_HDR_BY1_B0 K12

FPGA2_SOFTTOUCH_BY1_B0 J19 FPGA2_TEST_HDR_BY1_B1 K13

FPGA2_SOFTTOUCH_BY1_B1 K18 FPGA2_TEST_HDR_BY1_B2 H23

FPGA2_SOFTTOUCH_BY1_B2 G16 FPGA2_TEST_HDR_BY1_B3 G23

FPGA2_SOFTTOUCH_BY1_B3 G15 FPGA2_TEST_HDR_BY1_B4 H12

FPGA2_SOFTTOUCH_BY1_B4 L18 FPGA2_TEST_HDR_BY1_B5 J12

FPGA2_SOFTTOUCH_BY1_B5 K17 FPGA2_TEST_HDR_BY1_B6 K22

FPGA2_SOFTTOUCH_BY1_B6 H18 FPGA2_TEST_HDR_BY1_B7 K23

FPGA #2 Test Display Signals

FPGA2_7SEG_0_N AG17 FPGA2_7SEG_6_N AF19

FPGA2_7SEG_1_N AH18 FPGA2_7SEG_DP_N AG21

FPGA2_7SEG_2_N AE18 FPGA2_LED0 AD19

FPGA2_7SEG_3_N AF18 FPGA2_LED1 AE19

FPGA2_7SEG_4_N AG16 FPGA2_LED2 AE17

FPGA2_7SEG_5_N AH17 FPGA2_LED3 AF16

FPGA #2 External Interfaces

FPGA2_116_TX0_N G2 FPGA2_120_RX1_P D1

FPGA2_116_TX0_P F2 FPGA2_124_TX0_N B10

FPGA2_120_RX0_N A2 FPGA2_124_TX0_P B9

FPGA2_120_RX0_P A3 FPGA2_124_TX1_N B6

FPGA2_120_RX1_N C1 FPGA2_124_TX1_P B5

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #2 External Interfaces (cont.)

FPGA2_TXN0_BK120 B3 FPGA2_USB_CTS_N L15

FPGA2_TXN1_BK120 D2 FPGA2_USB_DSR_N K16

FPGA2_TXP0_BK120 B4 FPGA2_USB_DTR_N J15

FPGA2_TXP1_BK120 E2 FPGA2_USB_RST_N L21

FPGA2_RS232_CTS K14 FPGA2_USB_RTS_N L16

FPGA2_RS232_RTS L14 FPGA2_USB_RX J22

FPGA2_RS232_RX G22 FPGA2_USB_SUSPEND L20

FPGA2_RS232_TX H22 FPGA2_USB_TX K21

Table A-2: FPGA #2 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #3 Pinout

Table A-3 lists the connections for FPGA #3 (U34).

Table A-3: FPGA #3 Pinout

Signal Name Pin Signal Name Pin

QDRII Memory Interface

QDR2_CK_BY0_3_N K34 QDR2_SA11 AB26

QDR2_CK_BY0_3_P G28 QDR2_SA12 AB25

QDR2_CK_BY0_3_P L34 QDR2_SA13 AA24

QDR2_CK_BY4_7_N AJ34 QDR2_SA14 Y24

QDR2_CK_BY4_7_P AA31 QDR2_SA15 AC27

QDR2_CK_BY4_7_P AH34 QDR2_SA16 AB27

QDR2_CQ_BY0_3_N E26 QDR2_SA17 AA26

QDR2_CQ_BY0_3_P K33 QDR2_SA2 AJ27

QDR2_CQ_BY4_7_N AA29 QDR2_SA3 AK26

QDR2_CQ_BY4_7_P AD32 QDR2_SA4 AF28

QDR2_DLL_OFF_N AK27 QDR2_SA5 AE28

QDR2_K_BY0_3_N F28 QDR2_SA6 AH28

QDR2_K_BY0_3_P E28 QDR2_SA7 AG28

QDR2_K_BY4_7_N AC30 QDR2_SA8 AA28

QDR2_K_BY4_7_P AB30 QDR2_SA9 AB28

QDR2_LB_BK11 P32 QDR2_W_N AH27

QDR2_LB_BK11 P34 QDR2_BW_BY0_N M32

QDR2_LB_BK13 AE34 QDR2_BW_BY1_N L33

QDR2_LB_BK13 AJ32 QDR2_BW_BY2_N L28

QDR2_LB_BK17 AE29 QDR2_BW_BY3_N K28

QDR2_LB_BK17 AF31 QDR2_BW_BY4_N AK33

QDR2_LB_BK19 K27 QDR2_BW_BY5_N AK34

QDR2_LB_BK19 M28 QDR2_BW_BY6_N AC29

QDR2_NC_A3 AG25 QDR2_BW_BY7_N AD30

QDR2_NC_C6 AF24 QDR2_D_BY0_B0 T28

QDR2_R_N AJ26 QDR2_D_BY0_B1 U30

QDR2_SA0 AJ29 QDR2_D_BY0_B2 R31

QDR2_SA1 AK29 QDR2_D_BY0_B3 T31

QDR2_SA10 AC28 QDR2_D_BY0_B4 N30

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FPGA #3 Pinout

R

QDRII Memory Interface (cont.)

QDR2_D_BY0_B5 M31 QDR2_D_BY4_B1 AH29

QDR2_D_BY0_B6 P30 QDR2_D_BY4_B2 AH30

QDR2_D_BY0_B7 P31 QDR2_D_BY4_B3 AJ30

QDR2_D_BY0_B8 L31 QDR2_D_BY4_B4 AF30

QDR2_D_BY1_B0 J27 QDR2_D_BY4_B5 AF29

QDR2_D_BY1_B1 M26 QDR2_D_BY4_B6 AK31

QDR2_D_BY1_B2 M25 QDR2_D_BY4_B7 AJ31

QDR2_D_BY1_B3 J25 QDR2_D_BY4_B8 AD29

QDR2_D_BY1_B4 J24 QDR2_D_BY5_B0 V30

QDR2_D_BY1_B5 L26 QDR2_D_BY5_B1 W27

QDR2_D_BY1_B6 L25 QDR2_D_BY5_B2 Y27

QDR2_D_BY1_B7 L24 QDR2_D_BY5_B3 W25

QDR2_D_BY1_B8 K24 QDR2_D_BY5_B4 V25

QDR2_D_BY2_B0 L29 QDR2_D_BY5_B5 W26

QDR2_D_BY2_B1 E31 QDR2_D_BY5_B6 Y26

QDR2_D_BY2_B2 F31 QDR2_D_BY5_B7 V24

QDR2_D_BY2_B3 J29 QDR2_D_BY5_B8 W24

QDR2_D_BY2_B4 H29 QDR2_D_BY6_B0 U31

QDR2_D_BY2_B5 F30 QDR2_D_BY6_B1 U32

QDR2_D_BY2_B6 G30 QDR2_D_BY6_B2 T34

QDR2_D_BY2_B7 F29 QDR2_D_BY6_B3 U33

QDR2_D_BY2_B8 E29 QDR2_D_BY6_B4 R32

QDR2_D_BY3_B0 K31 QDR2_D_BY6_B5 R33

QDR2_D_BY3_B1 P29 QDR2_D_BY6_B6 R34

QDR2_D_BY3_B2 N29 QDR2_D_BY6_B7 T33

QDR2_D_BY3_B3 M30 QDR2_D_BY6_B8 N32

QDR2_D_BY3_B4 L30 QDR2_D_BY7_B0 T25

QDR2_D_BY3_B5 J31 QDR2_D_BY7_B1 U25

QDR2_D_BY3_B6 J30 QDR2_D_BY7_B2 T26

QDR2_D_BY3_B7 G31 QDR2_D_BY7_B3 U26

QDR2_D_BY3_B8 H30 QDR2_D_BY7_B4 R27

QDR2_D_BY4_B0 AG30 QDR2_D_BY7_B5 R26

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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R

QDRII Memory Interface (cont.)

QDR2_D_BY7_B6 U28 QDR2_Q_BY3_B2 G27

QDR2_D_BY7_B7 U27 QDR2_Q_BY3_B3 F26

QDR2_D_BY7_B8 T29 QDR2_Q_BY3_B4 F25

QDR2_Q_BY0_B0 J34 QDR2_Q_BY3_B5 H24

QDR2_Q_BY0_B1 H34 QDR2_Q_BY3_B6 H25

QDR2_Q_BY0_B2 H33 QDR2_Q_BY3_B7 G26

QDR2_Q_BY0_B3 J32 QDR2_Q_BY3_B8 G25

QDR2_Q_BY0_B4 F34 QDR2_Q_BY4_B0 AP32

QDR2_Q_BY0_B5 G33 QDR2_Q_BY4_B1 AN32

QDR2_Q_BY0_B6 E33 QDR2_Q_BY4_B2 AN33

QDR2_Q_BY0_B7 E32 QDR2_Q_BY4_B3 AN34

QDR2_Q_BY0_B8 E34 QDR2_Q_BY4_B4 AM32

QDR2_Q_BY1_B0 T24 QDR2_Q_BY4_B5 AM33

QDR2_Q_BY1_B1 R24 QDR2_Q_BY4_B6 AL33

QDR2_Q_BY1_B2 N25 QDR2_Q_BY4_B7 AL34

QDR2_Q_BY1_B3 P25 QDR2_Q_BY4_B8 AK32

QDR2_Q_BY1_B4 P24 QDR2_Q_BY5_B0 AF34

QDR2_Q_BY1_B5 N24 QDR2_Q_BY5_B1 AE33

QDR2_Q_BY1_B6 P27 QDR2_Q_BY5_B2 AF33

QDR2_Q_BY1_B7 P26 QDR2_Q_BY5_B3 AB33

QDR2_Q_BY1_B8 N28 QDR2_Q_BY5_B4 AC33

QDR2_Q_BY2_B0 G32 QDR2_Q_BY5_B5 AB32

QDR2_Q_BY2_B1 D34 QDR2_Q_BY5_B6 AC32

QDR2_Q_BY2_B2 C34 QDR2_Q_BY5_B7 AD34

QDR2_Q_BY2_B3 D32 QDR2_Q_BY5_B8 AC34

QDR2_Q_BY2_B4 C32 QDR2_Q_BY6_B0 Y32

QDR2_Q_BY2_B5 C33 QDR2_Q_BY6_B1 Y34

QDR2_Q_BY2_B6 B33 QDR2_Q_BY6_B2 AA34

QDR2_Q_BY2_B7 A33 QDR2_Q_BY6_B3 AA33

QDR2_Q_BY2_B8 B32 QDR2_Q_BY6_B4 Y33

QDR2_Q_BY3_B0 H28 QDR2_Q_BY6_B5 V34

QDR2_Q_BY3_B1 H27 QDR2_Q_BY6_B6 W34

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #3 Pinout

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QDRII Memory Interface (cont.)

QDR2_Q_BY6_B7 V33 QDR2_Q_BY7_B4 W29

QDR2_Q_BY6_B8 V32 QDR2_Q_BY7_B5 Y31

QDR2_Q_BY7_B0 AB31 QDR2_Q_BY7_B6 W31

QDR2_Q_BY7_B1 Y29 QDR2_Q_BY7_B7 V27

QDR2_Q_BY7_B2 Y28 QDR2_Q_BY7_B8 V28

QDR2_Q_BY7_B3 V29

RLDRAM II Memory Interface

RLD2_A0 AD10 RLD2_CK_BY2_3_N AE11

RLD2_A1 AD9 RLD2_CK_BY2_3_P AF11

RLD2_A10 AC8 RLD2_CS_BY0_1_N AK9

RLD2_A11 AP12 RLD2_CS_BY2_3_N AK8

RLD2_A12 AA9 RLD2_DK_BY0_1_N AH8

RLD2_A13 AA8 RLD2_DK_BY0_1_P AG8

RLD2_A14 AM13 RLD2_DK_BY2_3_N AH10

RLD2_A15 AN13 RLD2_DK_BY2_3_P AH9

RLD2_A16 AA10 RLD2_QK_BY0_N C13

RLD2_A17 AB10 RLD2_QK_BY0_P B13

RLD2_A18 AP14 RLD2_QK_BY1_N K9

RLD2_A19 AN14 RLD2_QK_BY1_P K8

RLD2_A2 AE8 RLD2_QK_BY2_N J7

RLD2_A3 AL10 RLD2_QK_BY2_P H7

RLD2_A4 AL11 RLD2_QK_BY3_N U7

RLD2_A5 AC9 RLD2_QK_BY3_P T8

RLD2_A6 AC10 RLD2_QVLD_BY0_1 F11

RLD2_A7 AM11 RLD2_QVLD_BY2_3 U10

RLD2_A8 AM12 RLD2_REF_N AJ9

RLD2_A9 AB8 RLD2_WE_N AF9

RLD2_BA0 AJ11 RLD2_D_BY0_B0 D11

RLD2_BA1 AK11 RLD2_D_BY0_B1 H8

RLD2_BA2 AD11 RLD2_D_BY0_B2 G8

RLD2_CK_BY0_1_N AG11 RLD2_D_BY0_B3 G10

RLD2_CK_BY0_1_P AG10 RLD2_D_BY0_B4 F10

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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RLDRAM II Memory Interface (cont.)

RLD2_D_BY0_B5 F8 RLD2_DM_BY2_3_N T9

RLD2_D_BY0_B6 F9 RLD2_DQ_BY0_B0 G13

RLD2_D_BY0_B7 E8 RLD2_DQ_BY0_B1 F13

RLD2_D_BY0_B8 E9 RLD2_DQ_BY0_B2 N9

RLD2_D_BY1_B0 R11 RLD2_DQ_BY0_B3 N10

RLD2_D_BY1_B1 R7 RLD2_DQ_BY0_B4 E13

RLD2_D_BY1_B2 J6 RLD2_DQ_BY0_B5 E12

RLD2_D_BY1_B3 T6 RLD2_DQ_BY0_B6 L9

RLD2_D_BY1_B4 R6 RLD2_DQ_BY0_B7 M10

RLD2_D_BY1_B5 K6 RLD2_DQ_BY0_B8 E11

RLD2_D_BY1_B6 K7 RLD2_DQ_BY1_B0 J10

RLD2_D_BY1_B7 P6 RLD2_DQ_BY1_B1 B12

RLD2_D_BY1_B8 P7 RLD2_DQ_BY1_B2 A13

RLD2_D_BY2_B0 V9 RLD2_DQ_BY1_B3 H9

RLD2_D_BY2_B1 V10 RLD2_DQ_BY1_B4 H10

RLD2_D_BY2_B2 AK6 RLD2_DQ_BY1_B5 C12

RLD2_D_BY2_B3 AK7 RLD2_DQ_BY1_B6 D12

RLD2_D_BY2_B4 U8 RLD2_DQ_BY1_B7 J11

RLD2_D_BY2_B5 V8 RLD2_DQ_BY1_B8 K11

RLD2_D_BY2_B6 AJ6 RLD2_DQ_BY2_B0 E7

RLD2_D_BY2_B7 AJ7 RLD2_DQ_BY2_B1 E6

RLD2_D_BY2_B8 W9 RLD2_DQ_BY2_B2 G7

RLD2_D_BY3_B0 Y8 RLD2_DQ_BY2_B3 G6

RLD2_D_BY3_B1 AD7 RLD2_DQ_BY2_B4 F6

RLD2_D_BY3_B2 AC7 RLD2_DQ_BY2_B5 F5

RLD2_D_BY3_B3 AB5 RLD2_DQ_BY2_B6 J5

RLD2_D_BY3_B4 AA5 RLD2_DQ_BY2_B7 G5

RLD2_D_BY3_B5 AB7 RLD2_DQ_BY2_B8 H5

RLD2_D_BY3_B6 AB6 RLD2_DQ_BY3_B0 L4

RLD2_D_BY3_B7 AC5 RLD2_DQ_BY3_B1 P5

RLD2_D_BY3_B8 AC4 RLD2_DQ_BY3_B2 N5

RLD2_DM_BY0_1_N G12 RLD2_DQ_BY3_B3 L6

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #3 Pinout

R

RLDRAM II Memory Interface (cont.)

RLD2_DQ_BY3_B4 M7 RLD2_DQ_BY3_B7 M5

RLD2_DQ_BY3_B5 N7 RLD2_DQ_BY3_B8 M6

RLD2_DQ_BY3_B6 N8

FPGA #3 Clock and Reset Signals

CLK_TO_FPGA3_MGT_N D4 EXT_CLK_TO_FPGA3_N AG13

CLK_TO_FPGA3_MGT_P E4 EXT_CLK_TO_FPGA3_P AH12

DIRECT_CLK_TO_FPGA3_N AH22 FPGA3_LOW_FREQ_CLK AH20

DIRECT_CLK_TO_FPGA3_P AG22 FPGA3_RESET_N_IN AH14

FPGA #3 MII Link Interface

FPGA1_TO_FPGA3_MII_TX_CLK AE14 FPGA1_TO_FPGA3_MII_TX_DATA3 AF20

FPGA1_TO_FPGA3_MII_TX_DATA0 AE16 FPGA1_TO_FPGA3_MII_TX_EN AD20

FPGA1_TO_FPGA3_MII_TX_DATA1 AF15 FPGA1_TO_FPGA3_MII_TX_ERR AE21

FPGA1_TO_FPGA3_MII_TX_DATA2 AF21 FPGA1_TO_FPGA3_MII_TX_SPARE AF14

FPGA #3 Configuration Signals

FPGA_INIT N14 FPGA3_D_IN P15

FPGA_PROGB M22 FPGA3_DONE M15

FPGA_TMS AC14 FPGA3_DOUT_B AD15

FPGA_VBATT L23 FPGA3_HSWAPEN M23

FPGA3_CCLK N15 FPGA3_TCK AB15

FPGA3_CNFG_M0 AD21 FPGA3_TDI_IN AC15

FPGA3_CNFG_M1 AC22 FPGA3_TDO AD14

FPGA3_CNFG_M2 AD22

FPGA #3 Test and Debug Signals

FPGA3_DIP0 AG18 FPGA3_TEST_HDR_BY0_B3 AF13

FPGA3_DIP1 AG15 FPGA3_TEST_HDR_BY0_B4 AG23

FPGA3_DIP2 AH15 FPGA3_TEST_HDR_BY0_B5 AF23

FPGA3_DIP3 AG20 FPGA3_TEST_HDR_BY0_B6 AE12

FPGA3_SPYHOLE_BK12 R8 FPGA3_TEST_HDR_BY0_B7 AE13

FPGA3_SPYHOLE_BK13 AG32 FPGA3_TEST_HDR_BY1_B0 AE24

FPGA3_TEST_HDR_BY0_B0 AE23 FPGA3_TEST_HDR_BY1_B1 AD24

FPGA3_TEST_HDR_BY0_B1 AE22 FPGA3_TEST_HDR_BY1_B2 AD25

FPGA3_TEST_HDR_BY0_B2 AG12 FPGA3_TEST_HDR_BY1_B3 AD26

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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FPGA #3 Test and Debug Signals (cont.)

FPGA3_TEST_HDR_BY1_B4 AC24 FPGA3_TEST_HDR_BY1_B6 AE26

FPGA3_TEST_HDR_BY1_B5 AC25 FPGA3_TEST_HDR_BY1_B7 AE27

FPGA #3 Test Display Signals

FPGA3_7SEG_0_N AG17 FPGA3_7SEG_6_N AF19

FPGA3_7SEG_1_N AH18 FPGA3_7SEG_DP_N AG21

FPGA3_7SEG_2_N AE18 FPGA3_LED0 AD19

FPGA3_7SEG_3_N AF18 FPGA3_LED1 AE19

FPGA3_7SEG_4_N AG16 FPGA3_LED2 AE17

FPGA3_7SEG_5_N AH17 FPGA3_LED3 AF16

FPGA #3 External Interfaces

FPGA3_RS232_CTS G15 FPGA3_USB_DTR_N H13

FPGA3_RS232_RTS L18 FPGA3_USB_RST_N L19

FPGA3_RS232_RX H18 FPGA3_USB_RTS_N H15

FPGA3_RS232_TX K17 FPGA3_USB_RX J20

FPGA3_USB_CTS_N H14 FPGA3_USB_SUSPEND K19

FPGA3_USB_DSR_N J14 FPGA3_USB_TX J21

FPGA #3 System ACE Control Signals

SYSACE_CTRL0 H12 SYSACE_MPA5 K22

SYSACE_CTRL1 G23 SYSACE_MPA6 J12

SYSACE_CTRL2 H23 SYSACE_MPD0 L21

SYSACE_CTRL3 K13 SYSACE_MPD1 L20

SYSACE_CTRL4 K12 SYSACE_MPD2 L15

SYSACE_MPA0 G22 SYSACE_MPD3 L16

SYSACE_MPA1 H22 SYSACE_MPD4 J22

SYSACE_MPA2 L14 SYSACE_MPD5 K21

SYSACE_MPA3 K14 SYSACE_MPD6 K16

SYSACE_MPA4 K23 SYSACE_MPD7 J15

Table A-3: FPGA #3 Pinout (Continued)

Signal Name Pin Signal Name Pin

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Appendix B

Bill of Materials

This appendix lists the bill of materials (BOM) for many of the components used for the

assembly of the Virtex-5 FPGA ML561 Development Board, Revision A. Wherever feasible

and practical, the associated reference designators are also listed for each part. The

component part number in the “Mfr. Part Number” column includes a link to the

corresponding manufacturer or supplier’s web page. Check with the manufacturer for

current information regarding the location and status of component data sheets.

Table B-1: Bill of Materials

Category Description Manufacturer Mfr. Part Number Reference Designators

FPGA Virtex-5 FPGA Xilinx XC5VLX50T-FFG1136 -2 speed grade U5, U7, U34

Memory

DDR2 Registered DIMM Micron MT9HTF6472Y-667 (RDIMM)XP1, XP2, XP3, XP4, XP5

(DIMM)

DDR2 Unbuffered DIMM Micron MT9HTF6472AY-667 (UDIMM) XP1, XP2, XP3, XP4, XP5

(DIMM)

DDR400 SDRAM Micron MT46V32M16BN-5B U6, U9

DDR2 SDRAM Micron MT47H32M16CC-3 U11, U12

QDRII Samsung K7R643684M-FC30U35, U41

RLDRAM II Micron MT49H16M18BM-25 U25, U33

DIMM Socket SMP Technology B037-2401-010-0-Z XP1, XP2, XP3, XP4, XP5

(Socket)

Clock

33 MHz Oscillator Epson SG-8002CA-33.0000M-PCCY2, Y3

200 MHz Oscillator Epson EG2121CA-200.0000M-PHPABY1

Configuration

System ACE Controller Xilinx XCCACE-TQG144I U45

JTAG Port Molex 87832-1420 P114

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Power

15A Power Module Texas Instruments PTH05010-WAZ VR1, VR6, VR9, VR10,

VR12, VR13

6A Power Module Texas Instruments PTH05000-WAZ VR2, VR4, VR14

4A LDO Maxim MAX8556ETE VR3, VR5, VR7, VR8

1.5A VLDO Regulator Linear Technology LTC3026EMSE#PBF U15

DDR Bus Termination

Regulator

Fairchild

Semiconductor FN6555U1, U2, U14, U42

Power Measurement Header 3M 3429-6002 P102

500 mA VLDO Regulator Linear Technology LT3021ES8 U16, U22

5A LDO Texas Instruments TPS75501 U23

Power Sensing Resistor Isotek Corp. SMV-R010-0.5 R63, R724, R764, R777,

R874, R885, R954

Glue Logic

USB to RS-232 Bridge Silicon Labs CP2102GM U43

Schmitt Inverter Toshiba TC74LCX14FTCT-ND U32

Level Translator Maxim MAX3008 U10

RS-232 Compatible Transceiver Maxim MAX3316ECUP U31

CMOS Octal Buffer ON Semiconductor MC74LCX541DT U37, U38

Clock Buffer

LVCMOS, 1-to-4 Integrated Device

Technology ICS8304U19

LVCMOS, 1-to-4, 5V Tolerant Integrated Device

Technology ICS553MIU30, U44

Differential LVPECL, 1-to-6 Integrated Device

Technology ICS853006U17, U18

Diff. LVPECL-to-LVDS, 1-to-4 Integrated Device

Technology ICS8543BGU20

Diff. HCSL, 1-to-4 Integrated Device

Technology ICS557-06U24

Display 7-Segment LED Stanley Electric NAR131SB D17, D23, D35

Socket/

Connector

Banana Jack (Red) Hirschmann 973-582-101J18, J25

Banana Jack (Black) Hirschmann 973-582-100 J17, J24

RS232 DB-9 Port Tyco Electronics 747250-4 P73

USB Port KYCON KUSB-AS-1-N-BLKJ29

Test Headers (2x8) Tyco Electronics 146130-7-ND P20, P21, P93

CompactFlash Holder Molex 55358-5038J27

CompactFlash Ejector Molex 55364-0011

5V Power Input Jack CUI Inc. PJ-002AHJ28

Power Fuse Digikey RUE600-NDF1, F2

SMA for Ext Clock Inputs AMPHENOL-RF 901-144-8RFXJ16, J19, J20, J21

Table B-1: Bill of Materials (Continued)

Category Description Manufacturer Mfr. Part Number Reference Designators

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Switch

DIP (Test Inputs) ITT_INDUSTRIES SDA04H1KD SW1, SW2, SW6

System Reset (Black) Panasonic EVQ11L07K SW4

Configuration Reset (Red) Panasonic EVQ11L05K SW7

Power Input (12V and 5V) APEM 25336NASW3, SW5

Rotary 8-position Digikey GH3311-NDSW8

Capacitor

0402 (Assorted Values) Panasonic ECJ-xxx MLC_CAP_0402

0603 (Assorted Values) Panasonic ECJ-xxx MLC_CAP_0603

0805 (Assorted Values) Panasonic ECJ-xxx MLC_CAP_0805

Tantalum C Kemet T520xxx TANT_CAP_C

Tantalum D Kemet T520xxx TANT_CAP_D

Tantalum E Kemet T520xxx TANT_CAP_E

Inductor

DO3316 Coilcraft DO3316 Lxx

Ferrite Bead TDK MPZ1608S221A FBxx

0805 (assorted values) Digikey HZ0805E601R-00Lxx

Resistor

0402 (assorted values) Panasonic ERJ-xxx Rxxx

0603 (assorted values) Panasonic ERJ-xxx Rxxx

0805 (assorted values) Panasonic ERJ-xxx Rxxx

Transistor MOSFET Diodes BSS138 Qxx

Table B-1: Bill of Materials (Continued)

Category Description Manufacturer Mfr. Part Number Reference Designators

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Appendix C

LCD Interface

This appendix describes the LCD interface for the Virtex-5 FPGA ML561 Development

Board.

General

The Virtex-5 FPGA ML561 Development Board has a full graphical LCD panel. This

display was chosen because of its possible use in embedded systems. A character-type

display also can be connected because the graphical LCD has the same interface as the

character-type LCD panels.

A hardware character generator must be designed to display characters on the screen.

Display Hardware Design

The FPGA (I/O functioning at 2.5V) is connected to the graphic LCD panel through a set of

voltage-level converting devices. These switches translate the 2.5 I/O voltage to a 3.3V

voltage for the LCD panel.

A graphics-based LCD panel from DisplayTech (64128EFCBC-XLP) is used on the Virtex-5

FPGA ML561 Development Board. The control for this LCD panel is based on the KS0713

controller from Samsung. The KS0713 is a 65-column, 132-segment driver-controller device

for graphic dot matrix LCD systems. The chip accepts serial or parallel display data. The

8-bit parallel interface is compatible with most LCD panel manufacturers. The serial

connection mode is write only.

Extra features added to the interface in addition to the normal parallel signals are:

•Intel or Motorola compatible interface

•External reset of the chip

•External chip select

The interface also contains the following built-in options for the display and controller:

•On-chip oscillator circuitry

•On-chip voltage converter (x2, x3, x4, and x5)

•A 64-step electronic contrast control function

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Table C-1 summarizes the controller specifications.

The on-chip RAM size is 65 x 132 = 8580 bits.

Hardware Schematic Diagram

Figure C-1 illustrates the schematic for the display.

Tab le C -1 : Display Controller Specifications

Parameter Specification

Supply Voltage 2.4V to 3.6V (VDD)

LCD Driving Voltage 4V to 15V (VLCD =V0-V

DD)

Power Consumption 70 μA typical (VDD = 3V, x4 boost, V0 = 11V,

internal supply = ON)

Sleep Mode 2 μA

Standby Mode 10 μA

Figure C-1: Display Schematic Diagram

3.3V

LCD_D[7:0]

ENA, R/W, RSEL, CS1B

LCD-BUS

DIP1_4

3.3V

Rst Gnd Vcc - +

LED

MI

3.3V

3.3V

68xx

68xx

Default = 68xx

Default =

Resistor to Gnd

Backlight ON/OFF

IC19

IC22

IC23

SamArray

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Peripheral Device KS0713

Figure C-2 is a block diagram of the Samsung KS0713.

Figure C-2: KS0713 Block Diagram

V/C

Circuit

V/R

Circuit

V/F

Circuit

Page

Address

Circuit

Line

Address

Circuit

Display Data RAM

65 x132 =

8580 Bits

132 Segment

Driver

Circuits

33 Common

Driver

Circuits

33 Common

Driver

Circuits

Column Address

Circuit

Segment Controller Common Controller

I/O

Buffer

KS0713 Samsung

VDD

VSS

CS1B

RS

E_RD

RW_WR

PS

RESETB

MI

DB7 (SID)

MPU Interface (Parallel & Serial)

Bus Holder

Oscillator

Display

Timing

Generator

Circuit

Status Register

Instruction Decoder

Instruction Register

DB6 (SCLK)

DB5

DB4

DB3

DB2

DB1

DB0

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Figure C-3 shows only the signals of interest for the LCD controller. The data sheet from

the Samsung web pages provides a complete signal listing.

Figure C-4 shows the dimensions for the 64128EFCBC-XLP LCD panel.

Figure C-3: 64128EFCBC-XLP Block Diagram

Controller

KS0713

LCD Panel

LED Backlight

C64

S128

Jumper J3

Parallel or Serial Selection.

Default is Parallel.

UG199_C_03_050106

1 VSS

2 VDD

3 MI

4 DB7

5 DB6

6 DB5

7 DB4

8 DB3

9 DB2

10 DB1

11 DB0

12 E

13 R/W

14 RS

15 RST

16 CS1B

17 LED+

18 LED-

Figure C-4: 64128EFCBC-XLP Dimensions

128 x 64 DOTS

56.00

2.50

2.54

69.00

74.00

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36.70

41.70

1 2

30 1

17 18

LED

J1 J2

8.00 Max Dimensions in mm

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Controller – Operation

The pixels for the LCD panel are stored in the controller data RAM. This RAM is a 65-row

by 132-column array. Each display pixel is represented by a single bit in the RAM array.

The interface to the RAM array goes through the 8-bit (DB0 – DB7) LCD interface.

Therefore, the 65-bit rows are split into eight pages of eight lines. The ninth page is a single

line page (DB0 only).

Interface designs can read from or write to the RAM array.

The display page is changed through the 4-bit page address register.

The column address (line address) is set with a two-byte register access. The line address

corresponds to the first line that is going to be displayed on the LCD panel. This address is

located in a 6-bit address register.

The RAM array is configured such that there are two characters per row (page), where each

character pair uses eight rows of the display panel. Table C-2 shows the input data bytes,

address lines, ADC control, and LCD outputs (segments).

Table C-2: LCD Panel

DB3 DB2 DB1 DB0 Data Line

Address

0000

DB0

Page 0

00H

DB1 01H

DB2 02H

DB3 03H

DB4 04H

DB5 05H

DB6 06H

DB7 07H

0001

DB0

Page 1

08H

DB1 09H

DB2 0AH

DB3 0BH

DB4 0CH

DB5 0DH

DB6 0EH

DB7 0FH

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0010

DB0

Page 2

10H

DB1 11H

DB2 12H

DB3 13H

DB4 14H

DB5 15H

DB6 16H

DB7 17H

0011

DB0

Page 3

18H

DB1 19H

DB2 1AH

DB3 1BH

DB4 1CH

DB5 1DH

DB6 1EH

DB7 1FH

0100

DB0

Page 4

20H

DB1 21H

DB2 22H

DB3 23H

DB4 24H

DB5 25H

DB6 26H

DB7 27H

0101

DB0

Page 5

28H

DB1 29H

DB2 2AH

DB3 2BH

DB4 2CH

DB5 2DH

DB6 2EH

DB7 2FH

Table C-2: LCD Panel (Continued)

DB3 DB2 DB1 DB0 Data Line

Address

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When a page is addressed, all the bits representing dots on the LCD panel can be accessed

in that page. An array of 8x132 bits is available. The line address dictates what line of the

RAM is going to be displayed on the first line of the glass panel.

Controller – LCD Panel Connections

The controller die, KS0713, connects to the LCD glass panel and user connection pins via a

small PCB. Other necessary pins have default connections on the PCB.

0110

DB0

Page 6

30H

DB1 31H

DB2 32H

DB3 33H

DB4 34H

DB5 35H

DB6 36H

DB7 37H

0111

DB0

Page 7

38H

DB1 39H

DB2 3AH

DB3 3BH

DB4 3CH

DB5 3DH

DB6 3EH

DB7 3FH

1000

DB0 Page 8

Column

Address

ADC = 00123456 789 AB 7E7F80818283

ADC = 1 83 82 81 80 7F 7

E

7

D

7

C

7

B

7

A

7978 5 43210

LCD Output

Seg 1

Seg 2

Seg 3

Seg 4

Seg 5

Seg 6

Seg 7

Seg 8

Seg 9

Seg 10

Seg 11

Seg 12

Seg 127

Seg 128

Seg 129

Seg 130

Seg 131

Seg 132

Table C-2: LCD Panel (Continued)

DB3 DB2 DB1 DB0 Data Line

Address

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Controller – Power Supply Circuits

Figure C-5 shows the power supply circuits. The power supply is used in the five times

boost mode, where VDD is 3.3V and VOUT is 16.5V. VOUT is the operating voltage of the

operational amplifier delivering the operating voltage, V0, for the LCD panel.

The LCD operating voltage, V0, is set with two resistors RA and RB. INTRS is driven Low

when the resistors are external. INTRS is driven High when the resistors are internal. For

the Virtex-5 FPGA ML561 Development Board, internal resistors are selected.

The LCD operating voltage (V0) and the Electronic Volume Voltage (VEV) can be calculated

in units of V using Equation C-1 and Equation C-2:

Equation C-1

Equation C-2

In Equation C-2, VREF is equal to 2.0V at 25 °C.

The values of the reference voltage parameter, α, and the ratio RA/RB are determined with

bit settings in the LCD controller’s instruction registers. Thus, it is possible to change

physical operating parameters of the LCD through register bit settings, controlling the

operating voltage, and the electronic volume level.

Figure C-5: Power Supply Circuits

DUTY1

DUTY2

BSTS

VR

MS

INTRS

17 VDD

18 VOUT

25

26

27

28

29

30 VSS1

2

1

VDD

VSS

VOUT

5 x VDD

VDD

VSS

16 VSS

DCDC5B

UG199_C_05_050106

V01

RB

RA

-------+

⎝⎠

⎛⎞

VEV

×=

VEV 163 α–

300

---------------–

⎝⎠

⎛⎞

VREF

×=

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The voltage and contrast settings must be configured before the LCD panel is ready for

operation. Figure C-6 shows the initialization procedure required to set up the LCD

controller.

Operation Example of the 64128EFCBC-3LP

The KS0713 LCD controller has several default settings of operation on the LCD panel

PCB. Some settings are forced through direct bonding on the chip. The default settings are:

•Master mode

•Parallel mode

•Internal oscillator

•Duty cycle ratio is set to 1/65

•Voltage converter input is between 2.4V ≤ VDD ≤ 3.6V, where VDD connects to 3.3V

•Internal voltage divider resistors

•Temperature coefficient is set to -0.05%/°C

•Normal power mode is set

Figure C-6: LCD Controller Initialization Flow

End Initialization

Regulator Resistor Select

Set Reference Voltage

FPGA Configured and Application Running

RESETB Pin is Taken HIGH

Start FPGA Configuration

RESETB Pin is Kept LOW

RESETB Pin is Kept LOW

Setup Instruction Flow

Wait longer than 1 ms between

each instruction to let the voltages stabilize.

The on-chip resistors are used.

Therefore, the selection MUST be

set to 101.

Setting Reference Voltage

is a two-pass instruction:

- Set Reference Voltage Mode

- Set Reference Voltage Register

LCD Bias

DUTY0, 1 is "11".

LCD Bias 0 = 1/7

LCD Bias 1 = 1/9

SHL Select

- SHL = 0 COM1 --> COM64

- SHL = 1 COM64 --> COM1

ADC Select

- ADC = 0 SEG1 --> SEG132

- ADC = 1 SEG132 --> SEG1

Board Power Supply Start

Power ON

Voltage Converter ON

Voltage Regulator ON

Voltage Follower ON

ADC Select

SHL Select

LCD Bias Select

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•The voltage follower and voltage regulator are set to:

♦Five times boost mode

♦The V4, V3, V2, V1, and V0 outputs depend on the bias settings of 1/9 or 1/7.

Because of these default settings, the following display controller connections are not used:

•DISP: Turns into an output when Master mode is selected

•FRS: Static driver segment output

•M: Used in Master/Slave display configurations

•CL: Clock pin used in Master/Slave display configurations

When RESETB is Low, the display controller is initialized as indicated in Table C-3.

When RESETB is High, the display must be initialized. The first steps to be taken to

guarantee correct operation of the display and the controller are:

•Configure the ADC bit. This bit determines the scanning direction of the segments.

♦When the RESETB signal is active, ADC is reset to 0, meaning that the segments

are scanned from SEG1 up to SEG132.

♦When ADC is set to 1, the segments are scanned in opposite direction.

•Configure the SHL bit. This bit sets the scanning direction of the COM lines.

♦When the RESETB signal is active, SHL is reset to 0, meaning that the segments

are scanned from COM1 up to COM64.

♦When SHL is set to 1, the common lines are scanned in opposite direction.

Tab le C -3 : Display Controller Initialization (RESETB is Low)

Parameter Initial Value

Display OFF

Entire Display OFF

ADC Select OFF

Reverse Display OFF

Power Control 0,0,0 (VC, VR, VF)

LCD Bias 1/7

Read-Modify-Write OFF

SHL Select OFF

Static Indicator Mode OFF

Static Indicator Register 0,0 (S1, S0)

Display Start 0 (First line)

Column Address 0

Page Address 0

Regulator Select 0,0,0 (R2, R1, R0)

Reference Voltage OFF

Reference Voltage Register 1,0,0,0,0,0 (SV5, SV4, SV3, SV2, SV1, SV0)

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After the SHL bit is configured, these settings normally are not changed.

•Select the LCD bias settings.

♦The duty cycle is selected as 1/65 by hardwiring the controller IC pads on the

display PCB.

♦The LCD bias is set to:

-1/7: when the BIAS bit is 0

-1/9: when the BIAS bit is 1

The following steps are performed next:

•Start the onboard converter, regulator, and follower

•Set the regulator resistor values (see Table C-4)

•Configure the reference voltage register parameters (see Table C-5)

At startup of the LCD controller (after RESETB operation), the resistor and reference

voltage values are:

•Resistor selection is: 0,0,0

•Reference voltage is: 1,0,0,0,0,0

The resistor selection value MUST be set to 101b when using this LCD panel.

After the display is brought to operational mode, it is best to wait at least 1 ms to ensure the

stabilization of power supply levels. After this time, all other necessary display

initializations can be performed.

Tab le C -4 : Resistor Value Settings

3-Bit Data Settings (R2 R1 R0)

000 001 010 011 100 101 110 111

1+(Rb/Ra) 1.90 2.19 2.55 3.02 3.61 4.35 5.29 6.48

Tab le C -5 : Reference Voltage Parameters

SV5 SV4 SV3 SV2 SV1 SV0 Reference Voltage Parameter (α)

000000 0

000001 1

..

..

..

..

…

..

..

..

..

..

..

..

..

..

111110 62

111111 63

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Instruction Set

Table C-6 shows the instruction set for the LCD panel.

Table C-6: Display Instructions

Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

Read display data 1 1 Read Data

8-bit data specified by the column and page address can be read from the Display Data RAM. The column address is increased automatically,

thus data can be read continuously from the addressed page.

Write display data 1 0 Write Data

8-bit data can be written into a RAM location specified by the column and page address. The column address is increased automatically, thus

data can be written continuously to the addressed page.

Read status 0 1 BUSY ADC ONOFF RESETB 0 0 0 0

BUSY: Device is BUSY when internal operation or reset. (0=active, 1 =busy).

ADC: Indicates the relationship between RAM column address and segment driver.

ONOFF: Indicates display ON or OFF status.

RESETB: Indicates if initialization is in progress.

Display ON/OFF001010111DON

Turn display ON or OFF. (1=ON, 0 = OFF)

Initial display line 0 0 0 1 ST5 ST4 ST3 ST2 ST1 ST0

Sets the line address of the display RAM to determine the initial line of the LCD panel.

ST5 ST4 ST3 ST2 ST1 ST0

000000Line address 0

000001Line address 1

.. .. .. .. .. .. ..

111110Line address 62

111111Line address 63

Set reference voltage mode0010000001

Set reference voltage register 0 0 x x SV5 SV4 SV3 SV2 SV1 SV0

This is a two-byte instruction. The first instruction sets the reference voltage mode. The second instruction sets the reference voltage parameter.

SV5 SV4 SV3 SV2 SV1 SV0

0000000

0000011

.. .. .. .. .. .. ..

11111062

11111163

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Set page address 0 0 1 0 1 1 P3 P2 P1 P0

This instruction sets the address of the display data page. Any RAM data bit can be accessed when its page address and column address are

specified. Changing the Page Address does not affect the display status.

P3 P2 P1 P0

0000page 0

0001page 1

.. .. .. .. ...

0111page 7

1000page 8

Set column address MSB 0 0 0 0 0 1 Y7 Y6 Y5 Y4

Set column address LSB 0 0 0 0 0 0 Y3 Y2 Y1 Y0

This instruction sets the address of the display data RAM. When a read or write to or from the display data RAM occurs, the addresses are

automatically increased.

Y7 Y6 Y5 Y4 Y3 Y2 Y1 Y0

00000000

Col

Addr 0

00000001

Col

Addr 1

.. .. .. .. .. .. .. .. ...

11111110

Col

Addr

130

11111111

Col

Addr

131

ADC select 0 0 1 010000ADC

This instruction changes the relationship between RAM column address and segment driver.

ADC = 0, SEG1 --> SEG132 default mode

ADC = 1, SEG132 --> SEG1

Table C-6: Display Instructions (Continued)

Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

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Reverse display ON/OFF001010011REV

REV RAM bit data = '1' RAM bit data = '0'

0 Pixel ON Pixel OFF

1 Pixel OFF Pixel ON

Entire display ON/OFF001010010EON

This instruction forces the display to be turned on regardless the contents of the display data RAM. The contents of the display data RAM are

saved. This instruction has priority over reverse display.

LCD bias select 0 0 1 010001BIAS

This instruction selects the LCD bias.

Duty

ratio Bias = 0 Bias = 1

1/65 1/7 1/9

Set modify-read 0011100000

This instruction stops the automatic incrementing of the column address by a read operation. The automatic increment is still done with a

write operation.

Reset modify-read0011101110

This instruction resets the changed modify-read to the normal.

Reset 0011100010

This instruction resets the LCD controller registers to the default values. The instruction CANNOT initialize the LCD power supply initialized

with RESETB.

SHL select 0 0 1 1 0 0 SHL x x x

This instruction sets the COM output scanning direction.

SHL = 0, COM1 ----> COM64 (default)

SHL = 1, COM64 ----> COM1

Power Control 0000101VCVRVF

This instruction selects one of the eight power circuit functions. In the case of the DisplayTech 64128EFCBC display, these must be kept at "000"

Regulator resistor select 0 0 0 0100R2R1R0

This instruction selects the resistor ratio Rb/Ra.

Set static indicator mode001010110SM

Set static indicator register00xxxxxxS1S0

This is a two-byte instruction. The first instruction enables the second instruction. The second instruction update the contents of the static

indicator register.

Table C-6: Display Instructions (Continued)

Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

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Read/Write Characteristics (6800 Mode)

Table C-7 list the read and write timing parameters in 6800 mode. The associated

waveforms for these parameters are illustrated in Figure C-7.

Tab le C -7 : Read/Write Characteristics in 6800 Mode

Parameter Signal Symbol Min Typ Max Unit

Address Setup Time RS TAS 13 - - ns

Address Hold Time TAH 17 - - ns

Data Setup Time DB7 to DB0 TDS 35 - - ns

Data Hold Time TDH 13 - - ns

Access Time TACC - - 125 ns

Output Disable Time TOD 10 - 90 ns

System Cycle Time RS TCYC 400 - - ns

Enable Pulse Width Read/Write E_RD TPWR 125 - ns

TPWW 55 - ns

Figure C-7: Read/Write Timing Waveforms (6800 Mode)

RS

RW

CS1B

E

WRITE

DB0-DB7

READ

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TASTAH

TCYC

TPWR

TACC TOD

TPWW

TDSTDH

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Appendix C: LCD Interface

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Design Examples

LCD Panel Used in Full Graphics Mode

The LCD controller RAM has eight 132-byte pages (in fact, there are nine pages; page 9 is

special). Each page is one byte wide. If all the pages are put in one memory block, the

needed space is 8 pages x 8 bits x 132 pixels or 8448 bits (1056 bytes).

One Virtex-5 FPGA block RAM can be configured as 8+1 by 2048.

One block RAM can be used to store one complete pixel view of the LCD panel. There is

enough space left for commands.

The ninth bit in the block RAM indicates whether the data in the block RAM is real data to

be displayed or is a command for the controller.

The interface to the LCD panel is slow. The E signal can be used as the controller clock

signal. This signal has a minimum cycle time of 400 ns for displaying 8 bits (equal to 8 dots)

on the LCD. One full page of the display takes up to 132 x 400 ns = 52.8 μs. Updating the

full display takes 52.8μs x 8 = 423μs.

If using the dual port and data width capabilities of the block RAM, then writes to the

block RAM can be 32 bits (+4 control bits), and reads from the block RAM on the LCD side

can be 8 bits (1 control bit). An entire LCD page is updated in 33 write operations.

The interface on the LCD panel side sequentially reads the block RAM, and thus, updates

the screen contiguously (like a television screen). The controller (microcontroller or other)

side of the block RAM can be written at any time.

The write operation happens on the rising edge of the clock and the read (LCD update)

happens on the falling edge of the clock. Normally write and read operations at the same

address give corrupt read data when the read and write clock edges do not respect the

clock-to-clock setup timing. This problem is solved by using both edges of the clock.

A state machine provides correct timing of the signals on the LCD panel side. The panel

can be used in write-only mode or in read/write mode. Most of the time, LCD panels

operate in write-only mode.

At first, the block RAM must be initialized with some data (instructions to the LCD) to

make the LCD operate correctly. Figure C-8 illustrates a general block diagram of the LCD

panel in full graphics mode.

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LCD Panel Used in Character Mode

This design example requires a byte representing a command or data to be displayed as

input.

•When the Enable signal is Low, nothing happens. The display interface design is

locked.

•When the Enable signal is High and the data_or_command control signal is Low, the

byte written is a display command.

•When the Enable signal and the data_or_command control signal are High, the byte

written is the ASCII character code of the character to be put on the display.

Display Command Byte

The command set of the display can be found in Table C-6, page 130.

When the LCD interface is enabled for the first time, a set of command bytes is sent to the

LCD. This command set provides the basic initialization of the LCD controller. When this

initialization is done, the normal LCD interface is freed for normal use. Command bytes

from the valid command set can be sent to the display (controller).

The Toplevel.vhd.txt file provides a detailed description of the LCD controller

interface.

Figure C-8: General Block Diagram of LCD Panel in Full Graphics Mode

UG199_C_08_050106

Block RAM

IorD = '1' Instruction

'0' Data

Design for Full Graphics Interface, Attached to CoreConnect Bus

Enable

Write

Address

WData (32+4)

RData (8+gnd)

ena

Clock

read

Addr

IorD (bit 9)

DataIn (8)

DataOut (8)

RW

E

Clock

Reset

Clock

Reset

Clock

E

TC

RS

CS1B

DB (8)

CoreConnect

State

Machine

Clock

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Appendix C: LCD Interface

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Display Data Byte

The supplied byte must be a valid ASCII representation of a character as shown in

Figure C-9.

The character set is stored in block RAM (used as ROM). The CharacterSet.xls file

contains the layout of the block RAM character set. The block RAM (see Figure C-10) is

organized as small arrays of eight bytes, which is easy for address calculation.

Figure C-9: ASCII Character Representations

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When presenting byte value 30 hex, character 0 must be displayed. Shifting the value

00110000b (30h) up three positions gives the value 180h or 348d.

Because each character uses eight byte locations, character 0 in the character set starts from

memory location 348 decimal.

For example, character X has byte value 58h or 01011000b. Shifting this value three

positions gives the value 2C0h or 704d.

Figure C-10: Block RAM Organization

F0 - FF

The RAM array is divided in

pages of eight bytes by 16,

forming an array of 128 bytes.

This array represents one

column of standard ASCII table.

A character is stored as:

E0 - EF

D0 - DF

C0 - CF

B0 - BF

A0 - AF

Not Used

Not Used

70 - 7F

60 - 6F

50 - 5F

40 - 4F

30 - 3F

20 - 2F

10 - 1F

Not Used

2047

1280

1279

1024

1023

N-x

N

N-1 Shift

Direction

Addr

0

01234567 Data

256

255

0

Addr[10:0]

Data[7:0]

RAMB16_S9

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Figure C-11 shows a block diagram of the LCD character generator controller. Character

data is latched and then shifted left three positions. This shifted value is the start byte for a

counter that outputs an address to the block RAM. The result is a stream of bytes

representing a character for the display.

A small second counter determines when a new character is loaded into the block RAM

address counter.

A state machine manages the processing order.

A minimum cycle time of 400 ns on the E signal used as a reference. The 200 MHz system

clock frequency is used as reference system clock. One E cycle uses at least 80 system clock

cycles when the design is running at 200 MHz. The E pulse is part of the state machine, and

the design only depends on the system clock. Timing is met as long as the system clock

does not exceed 200 MHz.

This design can be adapted easily to fit the MicroBlaze™ or PPC405 CoreConnect bus

system.

Figure C-11: LCD Character Generator Controller

TC

L

Addr

DI

E E

RAMB16_S9

Counter B

Counter A

Position

Register

Clk

Ena

DataIn

Ena

E Load

Clk

Clk

Clk

We

DO

Ssr

8

3

11 11 8

Count to 8.

Stop both counters at TC.

Send character position and

line to the LCD.

Load new value in counter A.

Switch to character ROM.

Enable counters.

8

Clk

Ena State Machine

Page

Rst

Rst

Display

Register

DesRst

DesRst DesRst

DesRst

DesRst

DesRst

8

Clk

LUT-ROM

Display

Initialization

RS

RW

Data

E

1

0

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Array Connector Numbering

Figure C-12 shows the LCD connections for Bank 0.

Figure C-12: LCD Connections (Bank 0)

Bank 0

Connector Pin

ABCDE FGH I D9 LCD_D0

10 D7 LCD_D4

9D5 LCD_D5

8D3 LCD_D6

7D1 LCD_D7

6E10 LCD_RST

5E8LCD_D1

4E6 LCD_D2

3E4 LCD_D3

2E2 LCD_ENA

1F5 LCD_R/W

F3 LCD_RSEL

Connector J32 F1 LCD_CS1B

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Appendix C: LCD Interface

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