Users Manual
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| Document Description | Users Manual |
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| Date Submitted | 2016-08-10 00:00:00 |
| Date Available | 2017-02-07 00:00:00 |
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ME3630 HARDWARE DEVELOPMENT GUIDE Version: V1.0 Date: 2016-02-26 LTE Module Series Website: www.ztewelink.com E-mail: ztewelink@zte.com.cn ME3630 Hardware Development Guide LEGAL INFORMATION By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document. Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table, data or other information contained in this document. is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE Corporation’s registered trademark. The other products or company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document. The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of products should abide by the product manual, relevant contract or the laws and regulations of relevant country. ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps the right to revise or retrieve the document any time. If you have any question about the manual, please consult the company or its distributors promptly. Copyright © ZTEWeLink Technology Co., LTD, All rights reserved. REVISION HISTORY Version Date Description 1.0 2016-02-26 1 released version st All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide ABOUT THIS DOCUMENT A. Application Range This document is the Product Technical Specification for the ME3630 GSM/CDMA/WCDMA/ TD-SCDMA/LTE TDD/LTE FDD module. It defines the high level product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. B. Reading Note The symbols below are the reading notes you should pay attention on: : Warning or Attention : Note or Remark C. Purpose This document provides the hardware solutions and development fundamentals for a product with the module. By reading this document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this document, the user can successfully fulfill the application and development of wireless Internet product or equipment. Besides the product features and technical parameters, this document also provides the product reliability tests and related testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design reference. NOTE: To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a single pass and ensure the module soldering quality. D. Abbreviations Table below is a list of abbreviations involved in this document, as well as the English full names. Abbreviations Full Name 3GPP Third Generation Partnership Project AP Another name of DTE CHAP Challenge Handshake Authentication Protocol CE European Conformity CMOS Complementary Metal Oxide Semiconductor DCE Data Communication Equipment DL Downlink DTE Data Terminal Equipment EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electro-Static discharge ESR Equivalent Series Resistance FDD Frequency Division Duplex GPIO General-purpose I/O LCC Leadless Chip Carrier All Rights reserved, No Spreading abroad without Permission II ME3630 Hardware Development Guide LDO Low-Dropout LED Light Emitting Diode LTE Long Term Evolution ME Mobile Equipment MO Mobile Origination Call MT Mobile Termination Call MSB Most Significant Bit PC Personal Computer PCB Printed Circuit Board PDA Personal Digital Assistant PDU Protocol Data Unit PAP Password Authentication Protocol PPP Point to Point Protocol RTC Real Time Clock SMS Short Messaging Service SMT Surface Mount Technology SPI Serial Peripheral Interface TBD To Be Determined TCP Transmission Control Protocol TIS Total Isotropic Sensitivity TRP Total Radiated Power TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol UL Up Link USB Universal Serial Bus USIM Universal Subscriber Identity Module URC Unsolicited result code VIH Logic High level of input voltage VIL Logic Low level of input voltage VOH Logic High level of output voltage VOL Logic Low level of output voltage All Rights reserved, No Spreading abroad without Permission III ME3630 Hardware Development Guide SAFETY INFORMATION The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, ZTEWelink does not take on any liability for customer failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers a Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. All Rights reserved, No Spreading abroad without Permission IV ME3630 Hardware Development Guide CONTACT INFORMATION 9/F, Tower A, Hans Innovation Mansion, Post North Ring Rd., No.9018, Hi-Tech Industrial Park, Nanshan District, Shenzhen. Web www.ztewelink.com Phone +86-755-26902600 E-Mail ztewelink@zte.com.cn Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site. All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide CONTENTS 1. Product Overview ......................................................................................................................................................................... 1 1.1. General Description....................................................................................................................................................................................................... 1 1.2. Key Features ........................................................................................................................................................................................................ 2 1.3. Function Diagram ........................................................................................................................................................................................................ 4 1.4. Evaluation Board ........................................................................................................................................................................................................ 5 2. Application Interface..................................................................................................................................................................... 6 2.1. General Description ............................................................................................................................................................................. 6 2.2. Pin Assignment ................................................................................................................................................................................... 6 2.3. Pin Description ................................................................................................................................................................................... 7 2.4. Power Supply ................................................................................................................................................................................. 13 2.4.1. Power Supply Pins ................................................................................................................................................................... 13 2.4.2. Decrease Voltage Drop............................................................................................................................................................ 13 2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 13 2.5. Turn on Scenarios .............................................................................................................................................................................. 14 2.6. USIM Card Interface........................................................................................................................................................................... 15 2.6.1. Description of PINs .................................................................................................................................................................. 15 2.6.2. Design Considerations for USIM Card Holder.......................................................................................................................... 17 2.7. USB Interface ................................................................................................................................................................................. 18 2.8. UART Interface ................................................................................................................................................................................. 20 2.9. Network Status Indication ................................................................................................................................................................. 22 2.10. ADC Interface ................................................................................................................................................................................. 22 2.11. WAKEUP_OUT Signal ....................................................................................................................................................................... 23 2.12. GPIO Interface ............................................................................................................................................................................... 23 3. Antenna Interface ....................................................................................................................................................................... 24 3.1. Pin Definition ................................................................................................................................................................................. 24 3.2. Reference Design ............................................................................................................................................................................... 24 3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 24 3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 25 3.4.1. EMC Design Requirements ...................................................................................................................................................... 25 3.4.2. ESD Design Requirements ....................................................................................................................................................... 25 3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 26 4. Electrical, Reliability and Radio Characteristics............................................................................................................................ 27 4.1. Absolute Maximum Ratings ............................................................................................................................................................... 27 4.2. Operating Temperature ..................................................................................................................................................................... 27 4.3. Current Consumption ........................................................................................................................................................................ 27 4.4. RF Output Power ............................................................................................................................................................................... 28 4.5. RF Receiving Sensitivity...................................................................................................................................................................... 28 4.6. GNSS Technical Parameters ............................................................................................................................................................... 29 All Rights reserved, No Spreading abroad without Permission VI ME3630 Hardware Development Guide 4.7. Electrostatic Discharge ...................................................................................................................................................................... 29 5. Mechanical Dimensions .............................................................................................................................................................. 30 5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 30 5.2. Footprint of Recommendation .......................................................................................................................................................... 31 5.3. Top View of the Module .................................................................................................................................................................... 32 5.4. Bottom View of the Module .............................................................................................................................................................. 32 6. Related Test & Test Standard ...................................................................................................................................................... 33 6.1. Testing Reference .............................................................................................................................................................................. 33 6.2. Description of Testing Environment .................................................................................................................................................. 34 6.3. Reliability Testing Environment ......................................................................................................................................................... 35 7. SMT Process and Baking Guide.................................................................................................................................................... 36 7.1. Storage Requirements ....................................................................................................................................................................... 36 7.2. Module Plainness Standard ............................................................................................................................................................... 36 7.3. Process Routing Selection .................................................................................................................................................................. 36 7.3.1. Solder Paste Selection ............................................................................................................................................................. 36 7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 36 7.3.3. Module Board’s SMT process .................................................................................................................................................. 37 7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 38 7.3.5. Reflow method ........................................................................................................................................................................ 39 7.3.6. Maintenance of defects .......................................................................................................................................................... 39 7.4. Module’s Baking Requirements ......................................................................................................................................................... 40 7.4.1. Module’s Baking Environment ................................................................................................................................................ 40 7.4.2. Baking device and operation procedure ................................................................................................................................. 40 7.4.3. Module Baking Conditions ...................................................................................................................................................... 40 All Rights reserved, No Spreading abroad without Permission VII ME3630 Hardware Development Guide TABLES Table 1-1 ME3630 Reference Using Area .................................................................................................................................................. 1 Table 1-2 ME3630 Supported Band ........................................................................................................................................................... 1 Table 1-3 ME3630 Key Features ............................................................................................................................................................. 3 Table 2-1 IO Parameters Definition ........................................................................................................................................................ 7 Table 2-2 Logic levels Description ........................................................................................................................................................... 8 Table 2-3 Pin Description ........................................................................................................................................................................ 8 Table 2-4 Power Supply ........................................................................................................................................................................ 13 Table 2-5 POWER_ON/OFF Pin Description .......................................................................................................................................... 14 Table 2-6 Power-on Time...................................................................................................................................................................... 15 Table 2-7 Pin Definition of the USIM Interface ..................................................................................................................................... 15 Table 2-8 Pin Description of Molex USIM Card Holder ......................................................................................................................... 17 Table 2-9 Pin Description of Amphenol USIM Card Holder .................................................................................................................. 18 Table 2-10 USB Pin Description ............................................................................................................................................................ 19 Table 2-11 Pin Definition of the Main UART Interface.......................................................................................................................... 20 Table 2-12 Pin Definition of the Debug UART Interface ....................................................................................................................... 20 Table 2-13 Pin Definition of Network Indicator .................................................................................................................................... 22 Table 2-14 Working State of the Network Indicator ............................................................................................................................. 22 Table 2-15 Pin Definition of the ADC .................................................................................................................................................... 22 Table 2-16 Characteristic of the ADC .................................................................................................................................................... 23 Table 2-17 Pin Definition of WAKEUP_OUT .......................................................................................................................................... 23 Table 2-18 Pin Definition of GPIO ......................................................................................................................................................... 23 Table 3-1 Pin Definition of GPIO ........................................................................................................................................................... 24 Table 4-1 Absolute Maximum Ratings .................................................................................................................................................. 27 Table 4-2 Operating Temperature ........................................................................................................................................................ 27 Table 4-3 Averaged standby DC power consumption [1] ..................................................................................................................... 27 Table 4-4 Averaged standby DC power consumption [2] ..................................................................................................................... 27 Table 4-5 Averaged standby DC power consumption [3] ..................................................................................................................... 28 Table 4-6 Conducted RF Output Power ................................................................................................................................................ 28 Table 4-7 Conducted RF Receiving Sensitivity [1] ................................................................................................................................. 28 Table 4-8 Conducted RF Receiving Sensitivity [2] ................................................................................................................................. 28 Table 4-9 GNSS Technical Parameters .................................................................................................................................................. 29 Table 4-10 ESD ...................................................................................................................................................................................... 29 Table 6-1 Testing Standard ................................................................................................................................................................... 33 Table 6-2 Testing Environment ............................................................................................................................................................. 34 Table 6-3 Testing Instrument & Device ................................................................................................................................................ 34 Table 6-4 Reliability Features ............................................................................................................................................................... 35 Table 7-1 Baking parameters ................................................................................................................................................................ 36 Table 7-2 LCC module PAD’s steel mesh opening ................................................................................................................................. 36 All Rights reserved, No Spreading abroad without Permission VIII ME3630 Hardware Development Guide FIGURES Figure 1-1 System Connection Structure ................................................................................................................................................ 5 Figure 2-1 Pin Assignment ...................................................................................................................................................................... 7 Figure 2-2 Structure of the Power Supply............................................................................................................................................. 13 Figure 2-3 Reference circuit of AAT2138 .............................................................................................................................................. 14 Figure 2-4 Reference circuit of LDO ...................................................................................................................................................... 14 Figure 2-5 Timing of Turning on Mode ................................................................................................................................................. 15 Figure 2-6 Reference Circuit of the 8 Pin USIM Card ............................................................................................................................ 15 Figure 2-7 Reference Circuit of the 6 Pin USIM Card ............................................................................................................................ 16 Figure 2-8 Molex 91228 USIM Card Holder .......................................................................................................................................... 17 Figure 2-9 Amphenol C707 10M006 512 2 USIM Card Holder ............................................................................................................. 18 Figure 2-10 Reference Circuit of USB Application................................................................................................................................. 19 Figure 2-11 Reference Circuit of USB Communication between module and AP ................................................................................. 19 Figure 2-12 Reference Circuit of Logic Level Translator........................................................................................................................ 21 Figure 2-13 RS232 Level Match Circuit ................................................................................................................................................. 21 Figure 2-14 Reference Circuit of Main UART with 4 Line Level Translator ........................................................................................... 21 Figure 2-15 Reference Circuit of UART with 2 Line Level Translator .................................................................................................... 21 Figure 2-16 Reference Circuit of the Network Indicator ....................................................................................................................... 22 Figure 2-17 The output signal of WAKEUP_OUT .................................................................................................................................. 23 Figure 3-1 Reference Circuit of Antenna Interface ............................................................................................................................... 24 Figure 3-2 The OTA test system of CTIA................................................................................................................................................ 26 Figure 5-1 ME3630 Top and Side Dimensions ...................................................................................................................................... 30 Figure 5-2 ME3630 Bottom Dimensions (Bottom view) ....................................................................................................................... 30 Figure 5-3 Recommended Footprint (Top view) ................................................................................................................................... 31 Figure 5-4 Location and dimension of test points ................................................................................................................................ 31 Figure 5-5 Top View of the Module ...................................................................................................................................................... 32 Figure 5-6 Bottom View of the Module ................................................................................................................................................ 32 Figure 7-1 Module Board’s Steel Mesh Diagram .................................................................................................................................. 37 Figure 7-2 Material Module Pallet ........................................................................................................................................................ 37 Figure 7-3 Tape Reel Dimension ........................................................................................................................................................... 38 Figure 7-4 Module Furnace Temperature Curve Reference Diagram ................................................................................................... 39 All Rights reserved, No Spreading abroad without Permission IX ME3630 Hardware Development Guide 1. PRODUCT OVERVIEW 1.1. G ENERAL D ESCRIPTION ME3630 is a GSM/CDMA/ WCDMA/ TD-SCDMA/LTE TDD/LTE FDD wireless communication module with LCC interface. It is widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services. ME3630 a GSM/CDMA/ WCDMA/ TD-SCDMA/LTE TDD/LTE FDD wireless communication module. ME3630 contains three variants ME3630-C1A, ME3630-C1B, ME3630-U1A, ME3630-E1A. Customer can choose the dedicated type based on the wireless network configuration. The following tables show entire radio band configuration of ME3630 series. Table 1-1 ME3630 Reference Using Area Variants Description ME3630-C1A GSM B3/8,CDMA1X CDMA EVDO,WCDMA B1,TD-SCDMA B34/39,LTE FDD B1/3,LTE TDD B38/39/40/41 for China ME3630-C1B GSM B3/8，CDMA1X CDMA EVDO，WCDMA B1，TD-SCDMA B34/39，LTE FDD B1/3，LTE TDD B38/39/40/41 （GNSS and Rx-diversity are not supported yet）for China ME3630-U1A WCDMA B2/5,LTE FDD B2/4/5/12/17 for America ME3630-E1A GSM B3/8,WCDMA B1/8,LTE FDD B1/3/7/8/20 for Europe Table 1-2 ME3630 Supported Band PID RF support RF Band Transmit Frequency (TX) Receive Frequency (RX) Maximum Output Power GSM B3 1710 to 1785 MHz 1805 to 1880 MHz 30dBm±2dBm B8 880 to 915 MHz 925 to 960 MHz 33dBm±2dBm BC0 824 to 849MHz 869 to 894 MHz 23dBm~30dBm WCDMA B1 1920 to 1980 MHz 2110 to 2170 MHz 24dBm+1/-3dBm TD-SCDMA B34 2010 to 2025 MHz 2010 to 2025 MHz 24dBm+1/-3dBm B39 1880 to 1920 MHz 1880 to 1920 MHz 24dBm+1/-3dBm B1 1920 to 1980 MHz 2110 to 2170 MHz 23dBm±2.7dBm B3 1710 to 1785 MHz 1805 to 1880MHZ 23dBm±2.7dBm B38 2570 to 2620MHZ 2570 to 2620MHZ 23dBm±2.7dBm B39 1880 to 1920MHZ 1880 to 1920MHZ 23dBm±2.7dBm B40 2300 to 2400MHZ 2300 to 2400MHZ 23dBm±2.7dBm B41 2496 to 2690MHZ 2496 to 2690MHZ 23dBm±2.7dBm B2 1850 to 1910 MHz 1930 to 1990 MHz 23dBm±2.7dBm B4 1710 to 1755 MHz 2110 to 2155 MHz 23dBm±2.7dBm B5 824 to 849 MHz 869 to 894 MHz 23dBm±2.7dBm B12 698 to 716 MHz 728 to 746 MHz 23dBm±2.7dBm B17 704 to 716 MHz 734 to 746 MHz 23dBm±2.7dBm B2 1850 to 1910 MHz 1930 to 1990 MHz 24dBm+1/-3dBm B5 824 to 849 MHz 869 to 894 MHz 24dBm+1/-3dBm CDMA (EVDO/CDMA1X) ME3630-C1A LTE FDD LTE TDD LTE FDD ME3630-U1A WCDMA All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide LTE FDD WCDMA ME3630-E1A GSM B1 1920 to 1980 MHz 2110 to 2170 MHz 23dBm±2.7dBm B3 1710 to 1785 MHz 1805 to 1880 MHz 23dBm±2.7dBm B7 2500 to 2570 MHz 2620 to 2690 MHz 23dBm±2.7dBm B8 880 to 915 MHz 925 to 960 MHz 23dBm±2.7dBm B20 832 to 862 MHz 791 to 821 MHz 23dBm±2.7dBm B1 1920 to 1980 MHz 2110 to 2170 MHz 24dBm+1/-3dBm B8 880 to 915MHZ 925 to 960MHZ 24dBm+1/-3dBm B3 1710 to 1785 MHz 1805 to 1880 MHz 30dBm±2dBm B8 880 to 915 MHz 925 to 960 MHz 33dBm±2dBm NOTE: For convenience of description, in the next content, the “ME3630” means the “ME3630 product serials”. With a tiny profile of 30.0mm×30.0mm×2.3mm (without label, the label is 0.1mm), ME3630 can meet almost all requirements for M2M application such as automotive, metering, tracking system, security solutions, routers, wireless POS, mobile computing devices, PDA phone and tablet PC, etc. ME3630 is an SMD type module, which can be embedded in customer application through its 96-pin pads including 80 LCC signal pads and 16 ground pads. ME3630 is integrated with internet service protocols like TCP/UDP and PPP. Extended AT commands have been developed for customer to use these internet service protocols easily. 1.2. K EY F EATURES The table below describes the detailed features of the ME3630 module. All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide Table 1-3 ME3630 Key Features Feature Description Small form factor-30 mm × 30 mm × 2.3mm Physical RF connection pads (RF main interface) LCC with 80 pins Power Supply The range of voltage supply is 3.4V-4.2V, typical value is 3.8V Frequency Bands C1A/C1B LTE FDD B1/B3 LTE TDD B38/B39/B40/B41 WCDMA B1 CDMA BC0 TD-SCDMA GSM U1A E1A B34/B39 B3/B8 LTE FDD B2/B4 /B5/B12/B17 WCDMA B2/B5 LTE FDD B1/B3 /B7/B8/B20 WCDMA B1/B8 GSM B3/B8 Transmission Date LTE : Max 150Mbps(DL)/Max 50Mbps(UL) Transmitting Power Class 3 (23dBm±2.7dBm) for LTE Internet Protocol Features Support TCP/PPP/UDP protocols Support the protocols PAP and CHAP usually used for PPP connections USIM Interface 1.8v/3v support SIM extraction/hot plug detection Support SIM and USIM Supports SIM application tool kit with proactive SIM commands UART Interface Support two UART interface: main UART interface and debug UART interface Main UART interface: Eight lines on main UART interface Support RTS and CTS hardware flow control Baud rate can reach up to 921600 bps,115200 bps by default Used for AT command, data transmission or firmware upgrade Multiplexing function Debug UART interface: Two lines on debug UART interface, can be used for software debug, firmware upgrade USB Interface Compliant with USB 2.0 specification (slave only) Used for AT command communication, data transmission, software debug and firmware upgrade. USB Driver: Support Windows XP, Windows Vista, Windows 7, Windows 8, Windows All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide 10,Windows CE5.0/6.0 and later, Linux 2.6.20 and later, Android 2.3/4.X/5.X SDIO interface 1.8v support (full speed) 4bits,SDIO compatible to WLAN (802.11) Antenna Interface Include main antenna ,diversity antenna and GPS antenna(C1B is not included) Rx-diversity Support WCDMA/LTE Rx-diversity(C1B is not included) AT commands Compliant with 3GPP TS 27.007,27.005 and ZTEWelink enhanced AT commands Network Indication Use LED_MODE to indicate network connectivity status SMS Text and PDU mode Point to point MO and MT SMS saving/reading to SIM card or ME storage SMS cell broadcast Temperature Range Normal operation: -30°C to +75°C 1) Restricted operation : -40°C~ -30°C and +75°C~ +85°C 1) Storage temperature: -40°C to +85°C Firmware Upgrade USB interface or main UART interface, debug UART interface NOTE: 1.1)means when the module works within this temperature range, RF performance might degrade. For example, the frequency error and the phase error would increase. 1.3. F UNCTION D IAGRAM The figure below shows a block diagram of the ME3630 and illustrates the major functional parts. Power management Baseband Memory (512MB flash + 256MB LPDDR2) Radio frequency Peripheral interface --UART interface --USIM card interface --USB interface --SDIO interface --SPI interface --I2C interface --ADC interface --Status interface (LED) All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide Figure 1-1 System Connection Structure 1.4. E VALUATION B OARD In order to help you to develop applications with ME3630, ZTEWelink supplies an evaluation board (G2000), RS-232 to USB cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to the related document [ZTEWelink G2000 Dev Board User Guide_V1.2]. All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide 2. A PPLICATION INTERFACE 2.1. G ENERAL D ESCRIPTION ME3630 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters: Pin assignment Pin description Power supply Turn on/off scenarios USIM interface USB interface HSIC interface UART interface SDIO interface SPI interface Network status interface (LED) ADC interface WAKEUP_OUT signal GPIO interface 2.2. P IN A SSIGNMENT The following figure shows the pin assignment of the ME3630 module. All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide Figure 2-1 Pin Assignment NOTE: Keep all reserved pins and unused pins unconnected. 2.3. P IN D ESCRIPTION The following table shows the IO Parameters Definition. Table 2-1 IO Parameters Definition Type Description IO Bidirectional input/output DI Digital input DO Digital output PI Power input PO Power output AI Analog input AO Analog output OD Open drain The logic levels are described in the following table. All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide Table 2-2 Logic levels Description Parameter Min Max Unit VIH 0.65*VDD_IO VDD_IO+0.3 VIL -0.3 0.35* VDD_IO VOH VDD_IO-0.45 VDD_IO VOL 0.45 NOTE: VDD_IO is the voltage level of pins. The following tables show the ME3630’s pin definition. Table 2-3 Pin Description Power Supply Pin Name Pin NO. I/O Description DC Characteristics Comment V_BAT 50.51 PI Power supply for Vmax = 4.2V It must be able to provide module Vmin = 3.4V sufficient current in a Vnorm = 3.8V transmitting burst which typically rises to 2.0A VREF_1V8 GND PO 3,9,11,20,21,31,36, Provide 1.8V for Vnorm = 1.8V Power supply for external external circuit Imax = 300mA GPIO’S pull up circuits Ground 46,49,52, 61,63,78, 80, Turn On/Off Pin Name Pin NO. I/O Description DC Characteristics Comment POWER_ON DI Turn on/off module VIH max = 2.1V Pull-up to 1.8V through 100K VIH min = 1.17V resistance, active low VIL max = 0.63V RESET_N DI Reset module VIH max = 2.1V Pull-up to 1.8V through 100K VIH min = 1.17V resistance, active low VIL max = 0.63V Status Indication Pin Name Pin NO. I/O Description DC Characteristics Comment LED_MODE 70 DO Indicate the module VOH min = 1.35V 1.8V power domain network registration VOL max = 0.45V mode USB Interface Pin Name Pin NO. I/O Description DC Characteristics Comment USB_DP 24 IO USB differential data Compliant with USB Require differential impedance USB_DM 23 IO bus 2.0 standard specification of 90Ω USB_VBUS 22 PI USB power All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide HSIC Interface Pin Name Pin NO. I/O Description DC Characteristics Comment USB_STROBE 25 IO HSIC strobe InterChip USB(HSIC) Require differential impedance of 90Ω USB_DATA 26 IO HSIC data Pin Name Pin NO. I/O Description DC Characteristics Comment USIM_VCC 40 PO Power supply for For 1.8V USIM: Either 1.8V or 3V is supported USIM card Vmax = 1.9V by the module automatically USIM Interface Vmin = 1.7V For 3.0V USIM: Vmax = 3.05V Vmin = 2.7V IO max = 50mA USIM_DATA 38 IO Data signal of USIM For 1.8V USIM: Pull-up to USIM_VCC with 10k card VIL max = 0.63V resistor internally VIH min = 1.17V VOL max = 0.45V VOH min = 1.35V For 3V USIM: VIL max = 1.05V VIH min = 1.95V VOL max = 0.45V VOH min = 2.6V USIM_CLK 37 DO Clock signal of USIM For 1.8V USIM: card VOL max = 0.45V VOH min = 1.35V For 3V USIM: VOL max = 0.45V VOH min = 2.6V USIM_RST 39 DO Reset signal of USIM For 1.8V USIM: card VOL max = 0.45V VOH min = 1.35V For 3V USIM: VOL max = 0.45V VOH min = 2.6V USIM_DETECT 41 DI USIM card input VIL min = -0.3V 1.8V power domain. detection VIL max = 0.63V Pulled up by default. VIH min = 1.17V Active low VIH max = 2.1V ADC Interface All Rights reserved, No Spreading abroad without Permission ME3630 Hardware Development Guide Pin Name Pin NO. I/O Description DC Characteristics Comment ADC1 48 AI Analog to digital 0.05V to 1.75V ADC2 47 AI Analog to digital 0.05V to 1.75V Pin Name Pin NO. I/O Description DC Characteristics Comment UART_RI 60 DO Ring indicator VOL max = 0.45V 1.8V power domain Main UART Interface VOH min = 1.35V UART_DCD UART_CTS 59 56 DO DO Data carrier VOL max = 0.45V detection VOH min = 1.35V Clear to send VOL max = 0.45V 1.8V power domain 1.8V power domain VOH min = 1.35V UART_RTS 55 DI Request to send VIL min = -0.3V 1.8V power domain VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V UART_DTR 58 DI Data terminal ready VIL min = -0.3V 1.8V power domain. VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V UART_DSR 57 DI Data set ready VIL min = -0.3V 1.8V power domain. VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V UART_TXD 53 DO Transmit data VOL max = 0.45V 1.8V power domain VOH min = 1.35V UART_RXD 54 DI Receive data VIL min = -0.3V 1.8V power domain VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V Debug UART Interface Pin Name Pin NO. I/O Description DC Characteristics Comment UART_DEBUG_TX 68 DO Transmit data VOL max = 0.45V 1.8V power domain UART_DEBUG_RX VOH min = 1.35V 67 DI Receive data VIL min = -0.3V 1.8V power domain VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V RF Interface Pin Name Pin NO. I/O Description DC Characteristics MAIN_ANT 62 IO Main antenna 50Ω impedance All Rights reserved, No Spreading abroad without Permission Comment 10 ME3630 Hardware Development Guide DIV_ANT 79 AI Diversity antenna 50Ω impedance GPS_ANT 10 IO GPS antenna 50Ω impedance Pin Name Pin NO. I/O Description DC Characteristics Comment I2C_SCL 73 DO I2C serial clock VOL max = 0.45V External pull-up VOH min = 1.35V resistor is required VOL max = 0.45V External pull-up VOH min = 1.35V resistor is required I2C Interface I2C_SDA 74 IO I2C serial data VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO Interface Pin Name Pin NO. I/O Description DC Characteristics Comment SDIO_CMD 14 IO Secure digital CMD VOL max = 0.45V 1.8V power domain VOH min = 1.35V External pull-up 10k resistor is VIL min = -0.3V required VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO_CLK 19 DO Secure digital CLK VOL max = 0.45V 1.8V power domain VOH min = 1.35V SDIO_D0 15 IO Secure digital IO data VOL max = 0.45V bit 0 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO_D1 16 IO Secure digital IO data VOL max = 0.45V bit 1 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO_D2 17 IO Secure digital IO data VOL max = 0.45V bit 2 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V All Rights reserved, No Spreading abroad without Permission 11 ME3630 Hardware Development Guide SDIO_D3 18 IO Secure digital IO data VOL max = 0.45V bit 3 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO Interface Pin Name Pin NO. I/O Description DC Characteristics Comment SPI_MISO 32 IO SPI main input slave VOL max = 0.45V 1.8V power domain output VOH min = 1.35V VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SPI_MOSI 33 IO SPI main output slave VOL max = 0.45V input VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SPI_CLK 34 DO SPI clock VOL max = 0.45V 1.8V power domain VOH min = 1.35V SPI_CS_N 35 DO SPI segment VOL max = 0.45V 1.8V power domain VOH min = 1.35V Other Pins Pin Name Pin NO. I/O Description DC Characteristics Comment WAKEUP_IN 72 DI Sleep mode control VIL min = -0.3V 1.8V power domain. Pull-up by VIL max = 0.45V default. Low level wakes up VIH min = 1.53V the module VIH max = 2.1V WAKEUP_OUT 71 DO Output wakeup signal VOL max = 0.8V Wakeup external circuits VOH min = 1.35V GPIO 7, 8, 12, 13, 27, 28, IO General input/output VOL max = 0.45V 29, 30, 64, 65, 75, VOH min = 1.35V 76,7 7 VIL min = -0.3V If unused, keep them floating. VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V NC 4,6,66,42,43,44,45 All Rights reserved, No Spreading abroad without No connection NC Permission 12 ME3630 Hardware Development Guide 2.4. P OWER S UPPLY 2.4.1. POWER SUPPLY PINS The ME3630 is supplied through the V_BAT signal with the following characteristics. Table 2-4 Power Supply Pin Name Pin NO. Description Minimum Typical Maximum Unit V_BAT 50,51 Power supply for module 3.4 3.8 4.2 GND 3, 9, 11, 20, 21, 31, 36, Ground 46, 49, 52, 61, 63, 78, 80, GND signal (Pin No: 3/9/11/20/21/31/36/46/49/52/61/63/78/80) is the power and signal ground of the module, which needs to be connected to the ground on the system board. If the GND signal is not connected completely, the performance of module will be affected. 2.4.2. DECREASE VOLTAGE DROP The power supply range of the module is 3.4V~ 4.2V. Because of the voltage drop during the transmitting time, a bypass capacitor of about 100 µF with low ESR should be used. Multi -layer ceramic chip (MLCC) capacitor can provide the best combination of low ESR. Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the V_BAT pins. The capacitors should be placed close to the ME3630’s V_BAT pins. The following figure shows structure of the power supply. Figure 2-2 Structure of the Power Supply NOTES: The rated current of FB1 should be more than 2.5A. The PCB traces from the V_BAT pins to the power source must be wide enough to ensure that there isn’t too much voltage drop occurs in the transmitting procedure. The width of V_BAT trace should be no less than 2mm, and the principle of the V_BAT trace is the longer, the wider. In poor situation of the network is, the antenna will transmit at the maximum power, and the transient maximum peak current can reach as high as 2A. So the power supply capacity of system board needs to be above 2.5A to satisfy the requirement of module peak current; and the average current on the system side needs to be above 0.9A. 2.4.3. REFERENCE CIRCUIT OF POWER SUPPLY Option One: DC\DC switching The over-current capability requirement of DC/DC switching power supply needs to be above 2.5A. The reference circuit of AAT2138 shows as figure below. Place a tantalum capacitor of 330uF at the input of the chip. Place a 220uF and 33uF capacitor tantalum capacitors at the output of the chip. This circuit fully meets the module power requirements. The current capacity of inductance L5 is greater than 3A,Please visit http://www.analogictech.com for more information of AAT2138. All Rights reserved, No Spreading abroad without Permission 13 ME3630 Hardware Development Guide Figure 2-3 Reference circuit of AAT2138 Option Two: LDO The over-current capability of LDO is above 2.5A. As the poor transient response of linear regulator, large capacitors should be placed at the input and output of LDO, place a capacitor above 100uF at output of LDO,R2、R3 recommend 1% accuracy. The reference power supply circuit design with LDO is shown as figure below: Figure 2-4 Reference circuit of LDO 2.5. T URN ON S CENARIOS The following table shows the pin definition of POWER_ON/OFF. Table 2-5 POWER_ON/OFF Pin Description Pin Name Pin NO. I/O Description Comment POWER_ON DI Turn on/off the module 1.8V power domain，low active The power on scenarios is illustrated as the following figure, the module power on and running when the POWER_ON pin keep in low level. All Rights reserved, No Spreading abroad without Permission 14 ME3630 Hardware Development Guide Figure 2-5 Timing of Turning on Mode Table 2-6 Power-on Time Parameter Description Min Typical Max Unit T1 The period that the Power-on signal for power on operation is kept on the low 0.1 0.5 -- second PWL 2.6. USIM C ARD I NTERFACE 2.6.1. DESCRIPTION OF PINS The USIM card interface circuitry meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V USIM cards are supported. Table 2-7 Pin Definition of the USIM Interface Pin Name Pin NO. I/O Description Comment USIM_VCC 40 PO Power supply for USIM card Either 1.8V or 3V is supported by the module automatically USIM_DATA 38 IO Data signal of USIM card Pull-up to USIM_VDD with 10k resistor internally USIM_CLK 37 DO Clock signal of USIM card USIM_RST 39 DO Reset signal of USIM card USIM_DETECT 41 DI USIM card input detection GND 36 1.8V power domain Ground The following figure shows the reference design of the 8-pin USIM card. Figure 2-6 Reference Circuit of the 8 Pin USIM Card All Rights reserved, No Spreading abroad without Permission 15 ME3630 Hardware Development Guide NOTES: 1. R10~R12 and D5 are applied to suppress the EMI spurious transmission and enhance the ESD protection.Should be closed to J3. 2.USIM_DETECT is used to detect USIM card, which will be low when the USIM card is inserted. 3.The value of C29 shoule be less than 1uF 4.USIM_DETECT is 1.8V power domain,VDD_MCU should be 1.8V. ME3630 supports USIM card hot-plugging via the USIM_ DETECT pin. For details, refer to document [ME3630_AT_Commands_Manual_V1.0]. If you do not need the USIM card detect function, keep USIM_ DETECT unconnected. The reference circuit for using a 6-pin USIM card socket is illustrated as the following figure. Figure 2-7 Reference Circuit of the 6 Pin USIM Card NOTES: 1. R14~R16 and D6 are applied to suppress the EMI spurious transmission and enhance the ESD protection.D6 should be closed to J4 2.The value of C33 shoule be less than 1uF. In order to enhance the reliability and availability of the USIM card in customer’s application, please follow the following criterion in the USIM circuit design: Keep layout of USIM card as close as possible to the module. Assure the possibility of the length of the trace is less than 50mm. Keep USIM card signal away from RF and V_BAT alignment. Assure the ground between module and USIM cassette short and wide. Keep the width of ground and USIM_VCC no less than 0.5mm to maintain the same electric potential. The decouple capacitor of USIM_VCC should be less than 1uF and must be near to USIM cassette. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away with each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add TVS such as WILL (http://www.willsemi.com) ESDA6V8AV6. The 33Ω resistors should be added in series between the module and the USIM card so as to suppress the EMI spurious transmission and enhance the ESD protection. Please note that the USIM peripheral circuit should be close to the USIM card socket. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion is applied. All Rights reserved, No Spreading abroad without Permission 16 ME3630 Hardware Development Guide 2.6.2. DESIGN CONSIDERATIONS FOR USIM CARD HOLDER For 8-pin USIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information. Figure 2-8 Molex 91228 USIM Card Holder Table 2-8 Pin Description of Molex USIM Card Holder Pin Name Pin NO. Function GND Ground VPP Not connected DATA I/O USIM card data CLK USIM card clock RST USIM card reset VDD USIM card power supply Pull-down GND with external circuit. When the tray is present, 4 is connected to 5 Not defined For 6-pin USIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information. All Rights reserved, No Spreading abroad without Permission 17 ME3630 Hardware Development Guide Figure 2-9 Amphenol C707 10M006 512 2 USIM Card Holder Table 2-9 Pin Description of Amphenol USIM Card Holder Pin Name Pin NO. Function GND Ground VPP Not connected DATA I/O USIM card data CLK USIM card clock RST USIM card reset VDD USIM card power supply 2.7. USB I NTERFACE ME3630 contains one integrated USB transceiver which complies with the USB 2.0 specification and supports high speed (480 Mbps), full speed (12 Mbps) and low speed (1.5 Mbps) mode. The USB interface is primarily used for AT command, data transmission, software debug and firmware upgrade. The following table shows the pin definition of USB interface. All Rights reserved, No Spreading abroad without Permission 18 ME3630 Hardware Development Guide Table 2-10 USB Pin Description Pin Name Pin NO. I/O Description Comment USB_DP 24 IO USB differential data bus (positive) Require differential impedance of 90Ω USB_DM 23 IO USB differential data bus (negative) Require differential impedance of 90Ω USB_VBUS 22 PI USB power USB plug detect GND 21 Ground More details about the USB 2.0 specifications, please visit http://www.usb.org/home. For different use purposes, different designs can be referred to: When USB is not the desired function, connect differential signal, power and GND via test points. Connect USB interface to USB connector directly. The following figure shows the reference circuit of USB interface. Figure 2-10 Reference Circuit of USB Application Reference Circuit of USB Communication between module and AP is the one below. The 0Ω in the figure should be placed near pin. Figure 2-11 Reference Circuit of USB Communication between module and AP In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply with the following principles. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90ohm. Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically, the capacitance value should be less than 2pF. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding not only upper and lower layer but also right and left side. All Rights reserved, No Spreading abroad without Permission 19 ME3630 Hardware Development Guide Keep the ESD components as closer to the USB connector as possible. 2.8. UART I NTERFACE The module provides two UART interfaces: Main UART Port and Debug UART Port. The Main UART Port can work in full function mode while the Debug UART Port is used for software debugging or Firmware upgrade. The following show the different features. Main UART interface support 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600bps baud rate, the default is 115200bps, This interface can be used for data transmission; AT communication or firmware upgrade (upgrade is not supported currently). Debug UART interface supports 115200bps baud rate. It can be used for software debug and firmware upgrade. The module is designed as the DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. The following tables show the pin definition of these two UART interfaces. Table 2-11 Pin Definition of the Main UART Interface Pin Name Pin NO. I/O Description Comment UART_RI 60 DO Ring indicator 1.8V power domain UART_DCD 59 DO Data carrier detection 1.8V power domain UART_CTS 56 DO Clear to send 1.8V power domain UART_RTS 55 DI Request to send 1.8V power domain UART_DTR 58 DI Data terminal ready 1.8V power domain. UART_DSR 57 DI Data set ready 1.8V power domain. UART_TXD 53 DO Transmit data 1.8V power domain UART_RXD 54 DI Receive data 1.8V power domain Table 2-12 Pin Definition of the Debug UART Interface Pin Name Pin NO. I/O Description Comment UART_DEBUG_TXD 68 DO Transmit data 1.8V power domain UART_DEBUG_RXD 67 DI Receive data 1.8V power domain Reference Circuit of Logic Level Translator ME3630 provides you with a 1.8V UART interface. A level shifter should be used if your application is equipped with a 3.3V UART interface. A level shifter TXB0108PWR provided by Texas Instruments is recommended. The following figure shows the reference design of the TXB0108PWR. Module All Rights reserved, No Spreading abroad without TXB0108PWR Permission MCU 20 ME3630 Hardware Development Guide Figure 2-12 Reference Circuit of Logic Level Translator Please visit http://www.ti.com for more information. A. Reference Circuit between ME3630 and PC The following figure is an example of connection between ME3630 and PC. A voltage level translator and a RS-232 level translator chip must be inserted between module and PC, since these two UART interfaces do not support the RS-232 level, while support the 1.8V CMOS level only. Module TXB0108PWR MAX3238 DB9 to PC Figure 2-13 RS232 Level Match Circuit B. Reference Circuit of Main URAT Port to 4 Line UART Port The following figure shows the reference circuit of main UART interface with 4 line logic level translator. TXB0104PWR provided by Texas Instruments is recommended. Module TXB0104PWR MCU Figure 2-14 Reference Circuit of Main UART with 4 Line Level Translator Reference Circuit of URAT Port to 2 line UART Port The following figure shows the reference circuit of UART interfaces with 2 line logic level translator. TXB0102DCU provided by Texas Instruments is recommended. Module TXB0102DCU MCU Figure 2-15 Reference Circuit of UART with 2 Line Level Translator Please visit http://www.ti.com for more information. C. Debugging UART port All Rights reserved, No Spreading abroad without Permission 21 ME3630 Hardware Development Guide Debugging UART port is a 2-wire interface. It should be connected with its test point or jumper pin during design. 2.9. N ETWORK S TATUS I NDICATION The network indication pin LED_MODE can be used to drive a network status indicator LED. The different modes of status indicator flashing indicate different network statuses. The following tables describe pin definition and logic level changes in different network status. Table 2-13 Pin Definition of Network Indicator Pin Name Pin NO. I/O Description Comment LED_MODE 70 DO Indicate the module network registration mode 1.8V power domain Table 2-14 Working State of the Network Indicator LED Status Module status High level, LED on Module is in the standby mode Low level 1.8s(LED off), High level 0.2s(LED on) PDP activated, and get the IP address Low level 0.2s(LED off), High level 1.8s(LED on) Socket established(when using External protocol stack, $MYSOCKETLED should be sent by CMUX to control the LED) Figure below is the reference circuit design diagram. Figure 2-16 Reference Circuit of the Network Indicator 2.10. ADC I NTERFACE The module provides two ADCs to digitize the analog signal to 10-bit digital data such as battery voltage, temperature and so on. Using AT command “AT+ZADC1?” can read the voltage value on ADC1 pin. Using AT command “AT+ZADC2?” can read the voltage value on ADC2 pin. The read value is expressed in mV. For more details of these AT commands, please refer to document [ME3630_AT_Commands_Manual_V1.0]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 2-15 Pin Definition of the ADC Pin Name Pin NO. Description ADC1 48 General purpose analog to digital converter. ADC2 47 General purpose analog to digital converter. The following table describes the characteristic of the ADC function. All Rights reserved, No Spreading abroad without Permission 22 ME3630 Hardware Development Guide Table 2-16 Characteristic of the ADC Item Min ADC1 voltage range ADC2 voltage range Typ. Max Unit 0.05 1.75 0.05 1.75 15 Bits ADC resolution 2.11. WAKEUP_OUT S IGNAL The module provides an AP control interface for communicating with external Application Processor including WAKEUP_OUT. The following table shows the pin definition of AP control interface. Table 2-17 Pin Definition of WAKEUP_OUT Pin Name Pin NO. I/O Description Comment WAKEUP_OUT 71 DO Output wakeup signal 1.8V power domain When there is a SMS received by the module, it will output the level shown as the figure below through pin 71. Figure 2-17 The output signal of WAKEUP_OUT NOTE: WAKEUP_OUT is only supported SMS by the firmware version of ME3630 currently. 2.12. GPIO I NTERFACE Module provides 8 GPIO pins. The direction and output voltage level of the GPIO can be set by AT command “AT+ZGPIO”. The input voltage level of the GPIO can also be read by AT command “AT+ZGPIO”. For more details of these AT commands, please refer to document [ME3630_AT_Commands_Manual_V1.0]. Table 2-18 Pin Definition of GPIO Pin Name Pin NO. I/O Description Comment GPIO1 IO General input/output 1.8V power domain GPIO2 IO General input/output 1.8V power domain GPIO3 12 IO General input/output 1.8V power domain GPIO4 13 IO General input/output 1.8V power domain GPIO5 27 IO General input/output 1.8V power domain GPIO6 28 IO General input/output 1.8V power domain GPIO7 29 IO General input/output 1.8V power domain GPIO8 30 IO General input/output 1.8V power domain GPIO9 64 IO General input/output 1.8V power domain GPIO10 65 IO General input/output 1.8V power domain GPIO11 75 IO General input/output 1.8V power domain GPIO12 76 IO General input/output 1.8V power domain GPIO13 77 IO General input/output 1.8V power domain All Rights reserved, No Spreading abroad without Permission 23 ME3630 Hardware Development Guide 3. A NTENNA INTERFACE ME3630 antenna interface includes a main antenna, an optional Rx-diversity antenna, which is used for improve receiving performance. The antenna interface has an impedance of 50Ω. 3.1. P IN D EFINITION The main antenna and Rx-diversity antenna pins definition are shown below. Table 3-1 Pin Definition of GPIO Pin Name Pin NO. I/O Description Comment MAIN_ANT 62 IO Main antenna 50Ω impedance DIV_ANT 79 AI Diversity antenna 50Ω impedance GPS_ANT 10 IO GPS antenna 50Ω impedance 3.2. R EFERENCE D ESIGN The antenna is a sensitive device and its performance is greatly affected by external environments. The radiation performance of the antenna is affected by the module dimensions, antenna position, occupied space size of the antenna, and the grounding of surrounding components of the antenna. Besides, the fixed assembly of the antenna, the wiring of RF cables on the antenna, and the fixed position of the antenna all affect the radiation performance of the antenna too. The reference design of main antenna and Rx-diversity antenna is shown as below. It should reserve a π-type matching circuit for better RF performance, and place these components as close as possible to the module. The capacitors are not mounted by default. DIV_ANT NC NC MAIN_ANT NC NC GPS_ANT NC NC Figure 3-1 Reference Circuit of Antenna Interface NOTE: Keep a proper distance between main and diversity antenna to improve the receiving sensitivity. GNSS and Rx-diversity are not supported by C1B, therefore GNNS antenna design is not concerned in C1B type. 3.3. R EFERENCE PCB L AYOUT OF A NTENNA Please follow the following criterion in the process of antenna line PCB layout design: Make sure that the transmission line’s characteristic impedance is 50ohm; Keep line on the PCB as short as possible, since the antenna line loss shall be less than 0.3 dB; Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves; It is wise to surround the PCB transmission line with ground, avoid having other signal tracks facing directly the antenna line All Rights reserved, No Spreading abroad without Permission 24 ME3630 Hardware Development Guide track. Keep at least one layer of the PCB used only for the ground plane; and use this layer as reference ground plane for the transmission line; The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track; Place EMI noisy devices as far as possible from modules antenna line; Keep the antenna line far away from the module power supply lines; If EM noisy devices are present on the PCB hosting the Module, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with ground planes, or shield it with a metal frame cover. 3.4. S UGGESTIONS FOR EMC & ESD D ESIGN 3.4.1. EMC DESIGN REQUIREMENTS During the design of the whole device, the user needs to fully consider the EMC problem caused by the signal integrity and power integrity. During the product design, it is better to separate the module from the mainboard PCB, instead of installing the module on the ground of the mainboard. If they cannot be separated, the module should be far from modules and components that might generate EMI, such as chip and memory, power interface, and data cable interface. Because the mainboard of PAD, CPE, and Internet laptops does not have a shielding cover, as that of mobile terminals, to shield most circuits to avoid overflow of electromagnetic interference, you can spray conductive paint on the surface on non-antenna areas within the structural components above and below the mainboard, and the conductive paint should be connected to the ground on the mainboard by several points to shield electromagnetic interference. Besides, data cables of the LCD and the camera might introduce interference signals, which affect the receiving performance of the antenna. Thus, it is necessary to wrap conductive cloth around the two data cables and connected them to the ground. RF cables of the antenna should be far from modules and components that might generate EMI, such as chip and memory, power interface, and data cable interface. The wiring of RF cables should be close to the ground of the mainboard. During the layout and wiring of peripheral circuits, for the wiring of power and signal cables, keep a distance of 2 times of the line width, so as to effectively reduce the coupling between signals and keep a clean reflux path for the signal. During the design of peripheral power circuits, the de-coupled capacitor should be placed closed to the module power PIN, the high-frequency high-speed circuit and the sensitive circuit should be placed far away from the border of PCB. They should better be separated during layout, so as to reduce the interference between them and protect the sensitive signal. For the circuit or device on the side of system board that might interfere with the module, it should be shielded during design. 3.4.2. ESD DESIGN REQUIREMENTS Module is embedded on the side of system board, so the user needs to make the ESD protection during design. For the key input/output signal interface, such as the (U)SIM card signal interface, the ESD device should be placed closely for protection. Besides, on the side of main board, the user should reasonably design the structure and PCB layout, guarantee that the metallic shielding shell is fully grounded, so as to leave a smooth discharge channel for ESD. All Rights reserved, No Spreading abroad without Permission 25 ME3630 Hardware Development Guide 3.5. T EST M ETHODS FOR W HOLE -S ET A NTENNA OTA Figure below is the diagram of OTA test system of CTIA. The system is mainly composed of test chamber, high-precision positioning system and its controller, Windows based PC running test software and RF test instruments with automatic test program. The main RF instruments are integrated RF test equipment, Spectrum Analyzer, Network Analyzer. The radio equipments, Relay Switch Unit and PC with automatic test software are communicated via GPIB interface. Figure 3-2 The OTA test system of CTIA All Rights reserved, No Spreading abroad without Permission 26 ME3630 Hardware Development Guide 4. E LECTRICAL , RELIABILITY AND R ADIO CHARACTERISTICS 4.1. A BSOLUTE M AXIMUM R ATINGS Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 4-1 Absolute Maximum Ratings Parameter Min Max Unit V_BAT -0.5 6.0 Peak current of V_BAT Voltage at digital pin -0.3 2.1 Voltage at ADC1 0.05 1.75 Voltage at ADC2 0.05 1.75 4.2. O PERATING T EMPERATURE The operating temperature is listed in the following table. Table 4-2 Operating Temperature Parameter Min Typ. Max Unit Normal Temperature -30 25 75 ℃ Storage Temperature -40 85 ℃ NOTE: 1) When the module works within the temperature range, the deviations from the RF specification may occur. For example, the frequency error or the phase error would increase. 4.3. C URRENT C ONSUMPTION The values of current consumption in different operating mode are shown below. Table 4-3 Averaged standby DC power consumption [1] Parameter Condition Typical Value OFF state Power down 45 Sleep All system is halted 1.5 Unit Table 4-4 Averaged standby DC power consumption [2] Parameter Condition Bandwidth LTE Typical Value Unit 5MHz 10MHz 15MHz 20MHz LTE FDD Band 1, Pout=23dBm 550 560 590 600 mA LTE FDD Band 3, Pout=23dBm 500 520 580 590 mA LTE TDD Band 38 ,Pout=23dBm 380 390 430 450 mA LTE TDD Band 39 ,Pout=23dBm 300 310 360 390 mA LTE TDD Band 40, Pout=23dBm 350 360 400 430 mA LTE TDD Band 41, Pout=23dBm 380 390 430 450 mA All Rights reserved, No Spreading abroad without Permission 27 ME3630 Hardware Development Guide Table 4-5 Averaged standby DC power consumption [3] Parameter Condition Typical Value Unit WCDMA Band1 ,Pout=24dBm 550 mA TD-SCDMA Band34, Pout=24dBm 180 mA Band39, Pout=24dBm 180 mA CDMA BC0, Pout=23dBm 600 mA GSM Band3, Pout=30dBm 200 mA Band8, Pout=33dBm 300 mA 4.4. RF O UTPUT P OWER The following table shows the RF output power of ME3630 module. Table 4-6 Conducted RF Output Power Frequency Max Min LTE FDD Band 1 23dBm ±2.7dB <-39dBm LTE FDD Band 3 23dBm ±2.7dB <-39dBm LTE TDD Band38 23dBm ±2.7dB <-39dBm LTETDD Band 39 23dBm ±2.7dB <-39dBm LTE TDD Band40 23dBm ±2.7dB <-39dBm LTE TDD Band 41 23dBm ±2.7dB <-39dBm WCDMA Band1 24+1/-3 dBm <-50dBm TD-SCDMA Band34 24+1/-3 dBm <-50dBm TD-SCDMA Band39 24+1/-3 dBm <-50dBm CDMA BC0 23~30 dBm <-50dBm GSM Band3 30dBm ±2dB <-50dBm GSM Band8 33dBm ±2dB <-50dBm 4.5. RF R ECEIVING S ENSITIVITY The following table shows the conducted RF receiving sensitivity of ME3630 module. Table 4-7 Conducted RF Receiving Sensitivity [1] Band 5 MHz(dBm) 10 MHz(dBm) 20 MHz(dBm) LTE FDD Band 1 -100 dBm -97 dBm -94 dBm LTE FDD Band 3 -97 dBm -94dBm -91dBm LTE TDD Band 38 -100 dBm -97 dBm -94 dBm LTE TDD Band 39 -100 dBm -97 dBm -94 dBm LTE TDD Band 40 -100 dBm -97 dBm -94 dBm LTE TDD Band 41 -100 dBm -97 dBm -94 dBm Table 4-8 Conducted RF Receiving Sensitivity [2] Band Sensitivity WCDMA Band1 -107 dBm TD-SCDMA BAND34 -108 dBm TD-SCDMA BAND39 -108 dBm All Rights reserved, No Spreading abroad without Permission 28 ME3630 Hardware Development Guide CDMA BC0 -104 dBm GSM Band3 -102 dBm GSM Band8 -102 dBm 4.6. GNSS T ECHNICAL P ARAMETERS The following table shows the GNSS techinical parameters of ME3630 module. Table 4-9 GNSS Technical Parameters GNSS (GPS/GLONASS) Technical specification GPS Frequency 1575.42±1.023 MHz Tracking sensitivity -155dbm Cold-start sensitivity -143dbm Accuracy (Open Sky) 2meter TTFF (Open Sky) Hot start: 4s Cold start: 55s Receiver Type Qualcomm GPS Gen8C GPS L1 Frequency 1575.42MHz Update rate 2-4 HZ GNSS (GPS/GLONASS) data format ZTE Loc API/ZTE auto-negotiation GNSS (GPS/GLONASS) Current consumption 65mA GNSS (GPS/GLONASS) antenna Passive/Active antenna 4.7. E LECTROSTATIC D ISCHARGE The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module electrostatics discharge characteristics. Table 4-10 ESD Tested Points Contact discharge Air Discharge Unit V_BAT ±5 ± 10 kV All antenna interfaces ±4 ±8 kV Other interfaces ± 0.5 ±1 kV All Rights reserved, No Spreading abroad without Permission 29 ME3630 Hardware Development Guide 5. M ECHANICAL D IMENSIONS This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. 5.1. M ECHANICAL D IMENSIONS OF THE M ODULE Figure 5-1 ME3630 Top and Side Dimensions Figure 5-2 ME3630 Bottom Dimensions (Bottom view) All Rights reserved, No Spreading abroad without Permission 30 ME3630 Hardware Development Guide 5.2. F OOTPRINT OF R ECOMMENDATION Figure 5-3 Recommended Footprint (Top view) Figure 5-4 Location and dimension of test points NOTE: 1. Keep out the area below the test point (circular area on the above figure) in the host PCB. 2. In order to maintain the module, keep about 3mm between the module and other components in the host PCB. All Rights reserved, No Spreading abroad without Permission 31 ME3630 Hardware Development Guide 5.3. T OP V IEW OF THE M ODULE Figure 5-5 Top View of the Module 5.4. B OTTOM V IEW OF THE M ODULE Figure 5-6 Bottom View of the Module All Rights reserved, No Spreading abroad without Permission 32 ME3630 Hardware Development Guide 6. RELATED T EST & T EST STANDARD 6.1. T ESTING R EFERENCE The related tests of MODULE comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related testing standards for MODULE. Table 6-1 Testing Standard NOTE: IEC: International Electro technical Commission; GB/T: Recommended national standard Test Standard Document Reference IEC6006826 Environmental testing-Part2.6: Test FC: Sinusoidal Vibration IEC60068234 Basic environment testing procedures part2. IEC60068264 Environmental testing-part2-64: Test FH: vibration, broadband random and guidance. IEC60068214 Environmental testing-part 2-14: Test N: change of temperature IEC60068229 Basic environmental testing procedures-part2: Test EB and guidance. IEC6006822 Environmental testing-part2-2: Test B:dry heat IEC6006821 Environment testing-part2-1: Test A: cold. GB/T 15844.2 MS telecommunication RF wireless phone-set environment requirement & experimental method – part 4: Strict level of experimental condition GB/T 2423.17 Basic environment experiment of electronic products-Experiment Ka: Salt mist experiment method GB/T 2423.5 Basic environment experiment of electronic products-Part2: Experiment method Try Ea & Introduction: Shock GB/T 2423.11 Basic environment experiment of electronic products-Part2: Experiment method Try Fd: Broad frequency band random vibration (General requirement) TIA/EIA 603 3.3.5 TIA Standard-part3-5:Shock Stability All Rights reserved, No Spreading abroad without Permission 33 ME3630 Hardware Development Guide 6.2. D ESCRIPTION OF T ESTING E NVIRONMENT The working temperature range of MODULE is divided into the normal working temperature range and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal. Under the extreme temperature range, the RF index basically complies with the 3GPP specifications, and the quality of data communication is affected to a certain extent, but its normal function is not affected. MODULE has passed the EMC test. Table 6-2 is the requirement for the testing environment, and Table 6-3 lists out the instruments and devices that might be used during the test. WARNING: Table 6-2 lists the extreme working conditions for the Module. Using the Module beyond these conditions may result in permanent damage to the module. Table 6-2 Testing Environment Working Condition Min Temperature Max Temperature Remark Normal working condition -30°C 75°C All the indexes are good. Extreme working condition -40~ -30°C 75~85°C Some indexes become poorer. Storage -40°C 85°C Storage environment of module Table 6-3 Testing Instrument & Device Testing Item Instrument & Device RF test Comprehensive testing device RF cable Tower antenna Microwave darkroom High/Low-temperature running & storage test High/Low-temperature experimental box Temperature shock test Temperature shock experimental box Vibration test Vibration console All Rights reserved, No Spreading abroad without Permission 34 ME3630 Hardware Development Guide 6.3. R ELIABILITY T ESTING E NVIRONMENT The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters. Table 6-4 Reliability Features Test Item Test Condition Test Standard Random vibration Frequency range: 5-20Hz, PSD: 1.0m2/s3 IEC 68-2-6 Frequency range: 20-200Hz, -3dB/oct 3 axis, 1 hour for each axis Temperature shock Low temperature: -40°C ± 2°C IEC 68-2-14 Na High temperature: +80°C ± 2°C Temperature changing period: less than 30s Test duration: 2 hours Cycle: 10 High-temperature running Normal high temperature: 75 °C ZTE standard Extreme high temperature: 85°C Duration: 24 hours Low-temperature running Normal low temperature: -30°C ZTE standard Extreme low temperature: -40°C Duration: 24 hours High temperature & high humidity Temperature: +60°C ZTE standard Humidity: 95% Duration: 48 hours High temperature storage Temperature: 85°C IEC 68-2-1 Ab Duration: 24 hours Low temperature storage Temperature: -40°C IEC 68-2-2 Bb Duration: 24 hours NOTE: When the Module works at the normal temperature, all its RF indexes comply with the 3GPP specifications. When the Module works at extreme temperature, certain RF indexes do not comply with the 3GPP specifications. All Rights reserved, No Spreading abroad without Permission 35 ME3630 Hardware Development Guide 7. SMT PROCESS AND BAKING G UIDE This chapter describes module’s storage, PAD design, SMT process parameters, baking requirements, etc., and it is applicable for the process guide to second-level assembly of LCC encapsulation module. 7.1. S TORAGE R EQUIREMENTS Storage conditions: temperature<40℃, relative humidity<90% (RH), 12 months weld ability guaranteed under this circumstances of excellent sealing package. The Moisture sensitivity level for all modules is level 3 (Conforming to IPC/JEDEC J-STD-020). After opening the package, mount within 168 hours under the environment conditions of temperature<30℃, relative humidity<60% (RH). If it doesn’t meet the above requirements, perform the baking process. See the baking parameters in Table below: Table 7-1 Baking parameters Temperature Baking conditions Baking time Remarks 125± 5℃ Moisture: ≤60%RH 8 hours The accumulated baking time must be less than 96 hours 45± 5℃ Moisture: ≤5%RH 192 hours The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033 When in the process of PAD designing of module, refer to IPC-SM-782A and the chapter 6.2 below. 7.2. M ODULE P LAINNESS S TANDARD Plainness of the module is required to be less than 0.15mm. Measurement method: put the module on the marble plane, use the feeler gage to measure the gap width at the position of maximum warp, and do not exert force on the module during the measurement. 7.3. P ROCESS R OUTING S ELECTION The modules are manufactured with the lead-free process and meet the ROHS requirements, therefore it’s recommended to follow the lead-free manufacturing process upon the selection of process routing for module board and main board. 7.3.1. SOLDER PASTE SELECTION The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is accordingly recommended to use the no-clean solder paste. If the solder paste which needs cleaning is used, we cannot guarantee the components on the module board could withstand the washing of the cleaning solvents. This might cause the functional problems of such components and affect the appearance of the module. During the printing process, make sure the solder paste’s thickness at the position of module’s PAD is within 0.18mm~0.20mm. 7.3.2. DESIGN OF MODULE PAD’S STEEL MESH OPENING ON MAIN BOARD The thickness of the steel mesh on main board is selected according to the encapsulation type of components on the main board. Pay attention to the following requirements: Make sure to design the module PAD on main board according to chapter 5. The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad can be increased to 0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on main board. Requirements on the thickness of solder paste: control the thickness between 0.18mm and 0.20mm. See the LCC module PAD’s steel mesh opening in the following table: Table 7-2 LCC module PAD’s steel mesh opening Module PAD GAP (G)=Center Distance (e)－PAD width (X) All Rights reserved, No Spreading abroad without Steel mesh opening Permission 36 ME3630 Hardware Development Guide G≥0.5mm Drill holes at 100% scale in the direction of width; extend 0.3mm outward in the direction of length Contract 0.05~0.1mm in the G＜0.5mm direction of width; Contract 0.05~0.1mm inward in the direction of length, extend 0.5mm outward in the direction of length. 0.1mm 0.1mm 0.5mm Steel mesh opening Module PAD on PCB 0.1mm Figure 7-1 Module Board’s Steel Mesh Diagram 7.3.3. MODULE BOARD’S SMT PROCESS 1） SMT Tape Reel: The tape reels, which are suitable for SMT, have been made for most ZTE modules. If the module has provided the tape reel itself and meets the SMT requirements, customers can directly use it for module SMT. Figure 7-2 Material Module Pallet NOTE: Figure7-3 is just for reference, it doesn’t represent the actual Material Module Tape Reel. Otherwise, customers need make a loading tool similar to the tape reel. Customers can take out the module from the packaging box, put them into the tape according to the sequence and direction, and then start SMT. 2） Tape Reel Dimension (unit: mm): The following picuture is the tape reel specific dimension for your reference: All Rights reserved, No Spreading abroad without Permission 37 ME3630 Hardware Development Guide A: Whole dimension: B: Detailed dimension: Figure 7-3 Tape Reel Dimension 3） Mounting Pressure: In order to ensure a good contact between the module and the solder paste on main board, the pressure of placing the module board on main board should be 2-5N according to our experiences. Different modules have different numbers of pads, therefore the pressure selected are different. Customers can select proper pressure based on their own situations to suppress the module paste as little as possible, in order to avoid the surface tension of the solder paste melts too much to drag the module during reflow. 7.3.4. MODULE SOLDERING REFLOW CURVE Module soldering furnace temperature curve is: Peak value: 245+0/-5℃ ≥217℃: 30〜〜60S 150〜200℃: 60〜〜120S Temperature rise slope: <3℃/S Temperature drop rate: －2〜－4℃/S All Rights reserved, No Spreading abroad without Permission 38 ME3630 Hardware Development Guide NOTE: The test board of furnace temperature must be the main board with the module board mounted on, and there must be testing points at the position of module board. Figure 7-4 Module Furnace Temperature Curve Reference Diagram 7.3.5. REFLOW METHOD If the main board used by customers is a double-sided board, it is recommended to mount the module board at the second time. In addition, it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time. If such failure is caused by any special reason, the fixture should be also used to make such main board reflow on the track so as to avoid the deformation of PCB during the reflow process. 7.3.6. MAINTENANCE OF DEFECTS If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module board and main board, the welder can directly use the soldering iron to repair welding according to the factory’s normal welding parameters. All Rights reserved, No Spreading abroad without Permission 39 ME3630 Hardware Development Guide 7.4. M ODULE ’ S B AKING R EQUIREMENTS The module must be baked prior to the second reflow. 7.4.1. MODULE’S BAKING ENVIRONMENT The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good static-resistant environment. Refer to the following environment requirements: WARNING: The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033. 7.4.2. BAKING DEVICE AND OPERATION PROCEDURE Baking device: Any oven where the temperature can rise up to 125°C or above. Precautions regarding baking: during the baking process, the modules should be put in the high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the modules. During the baking process, do not overlay the modules directly because it might cause damage to the module’s chipset. 7.4.3. MODULE BAKING CONDITIONS See the baking parameters in Table 7-1. 8. FEDERAL C OMMUNICATION C OMMISSION INTERFERENCE STATEMENT This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: ● Reorient or relocate the receiving antenna. ● Increase the separation between the equipment and receiver. ● Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ● Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This All Rights reserved, No Spreading abroad without Permission 40 ME3630 Hardware Development Guide equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 4.8 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID:SRQ-ME3630”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. All Rights reserved, No Spreading abroad without Permission 41
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