ZTE MG2639 GSM/GPRS Module User Manual MG2639 V1 0en 0314

ZTE Corporation GSM/GPRS Module MG2639 V1 0en 0314

User Manual

MG2639 User Manual Version：V1.0
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第I页 Copyright Statement Copyright © 2010 by ZTE Corporation All rights reserved. No part of this publication may be excerpted, reproduced, translated or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without the prior written permission of ZTE Corporation. is the registered trademark of ZTE Corporation. All other trademarks appeared in this manual are owned by the relevant companies. ZTE Corporation reserves the right to make modifications on print errors or update specifications in this manual without prior notice. ZTE Corporation keeps the right to make the final explanation to this manual.
第II 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. Descriptions of version update Product version Document version Document No. Descriptions of document update MG2639 V1.0 Release for the first time Author Document version Date Written by Checked by Approved by 1.0 2011-8-22 Zhou Tao
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第III 页 With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module customers with the following all-around technical support: 1. Provide complete technical documentation; 2. Provide the development board used for R&D, test, production, after-sales, etc.; 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios; 4. Provide test environment; ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone, website, instant communication, E-mail, etc.
第IV 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. Preface Summary This document introduces MG2639 module’s product principle diagram, PINs, hardware interface and module’s mechanical design, which can instruct the users how to quickly and conveniently design different kinds of wireless terminals based on this type of module. Target Readers This document mainly applies to the following engineers:  System designing engineers  Mechanical engineers  Hardware engineers  Software engineers  Test engineers
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第V页 Contents 1GENERAL DESCRIPTION OF MODULE ........................................................................ 11.1INTRODUCTION OF MODULE’S FUNCTIONS ..................................................... 11.2MODULE’S PRINCIPLE DIAGRAM ....................................................................... 21.3ABBREVIATIONS ................................................................................................... 32DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES ........................................ 52.1DEFINITIONS OF MODULE’S INTERFACES ........................................................ 52.2ANTENNA INTERFACE ......................................................................................... 63MODULE’S ELECTRICAL CHARACTERISTICS ........................................................... 83.1DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS ..................................... 83.1.1RESET .......................................................................................................... 83.1.2SIM CARD INTERFACE ............................................................................... 83.1.3AUDIO INTERFACE ..................................................................................... 93.1.4NETWORK SIGNAL INDICATION ................................................................ 93.2MODULE POWER CONSUMPTION .................................................................... 103.3RELIABILITY CHARACTERISTICS ..................................................................... 104INTERFACE CIRCUIT DESIGN .................................................................................... 114.1RESET AND POWER DESIGN ............................................................................ 114.2UART INTERFACE ............................................................................................... 124.3SIM CARD INTERFACE ....................................................................................... 134.4AUDIO INTERFACE ............................................................................................. 145MECHANICAL DIMENSIONS ....................................................................................... 155.1APPEARANCE DIAGRAM ................................................................................... 155.2MODULE ASSEMBLY DIAGRAM ........................................................................ 155.3PCB DIMENSIONS .............................................................................................. 166ANTENNA INTERFACE ................................................................................................ 166.1ANTENNA INSTALLATION .................................................................................. 176.2ANTENNA PAD .................................................................................................... 176.3ANTENNA CONNECTOR .................................................................................... 17
第VI 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. 6.4ANTENNA SUBSYSTEM ..................................................................................... 186.4.1ANTENNA SPECIFICATIONS .................................................................... 186.4.2CABLE LOSS.............................................................................................. 196.4.3ANTENNA GAIN MAXIMUM REQUIREMENTS ......................................... 196.4.4ANTENNA MATCHING ............................................................................... 196.4.5PCB DESIGN CONSIDERATIONS ............................................................. 19ANTENNA INTERFACE ................................................................................................. 197OEM/INTEGRATORS INSTALLATIONS ...................................................................... 20
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第VII 页 Figures Figure 1-1 Module’s principle diagram ............................................................................................ 2Figure 2-1 Antenna interface diagram ............................................................................................. 6Figure 5-1 MG2639 module’s appearance .................................................................................... 15Figure 5-2 Module’s assembly diagram ........................................................................................ 15Figure 5-3 Relevant PCB dimensions ........................................................................................... 16Tables Table 1-1 Module’s functions .......................................................................................................... 1Table 1-1 28Pin stamp-hole definition............................................................................................. 5Table 4-1 Voltage characteristics .................................................................................................. 11
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第1页 1 General description of module This chapter mainly provides a general description of the module, including basic functions and logic block diagram. 1.1 Introduction of module’s functions The maximum operating ambient temperature of the equipment declared by the manufacturer is 75℃ Table 1-1 Module’s functions Parameter MG2639 General Features Frequency Bands GSM850/EGSM900/DCS1800/PCS1900 Dimensions 30.0×25.0x2.68mm Weight 7g Operating Temperature Range -30°C~+75°C Storage Temperature Range -40°C~+85°C Performance Operating Voltage Range 3.6V~4.2V/Typical: 3.9V Current Consumption Typically Idle Current: 2mA Call Current: 128mA Max Current: 300mA TX Power GSM850/EGSM900: Class 4 (2W) DCS1800/PCS1900: Class 1 (1W) RX Sensitivity <-106dBm Interfaces Connector 28Pin Stamp Holes Antenna SMT 50Ω Antenna Connector Antenna Solder Pad Integrated Full Duplex UART AT/Data SIM Card Interface 1.8V/3.0V Data Features GPRS Class 10 Mobile Station Class B Max Downlink 85.6kbps Max Uplink 42.8kbps Protocol Internal TCP/IP&UDP Embedded FTP SMS Features
第2页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. Parameter MG2639 Support TEXT/PDU Mode Point-to-point MO/MT SMS Cell Broadcast Voice Features Vocoders HR/FR/EFR/AMR Echo Cancellation/Volume Control/DTMF AT Command Set GSM 07.05/GSM 07.07/ZTE Proprietary AT Commands1.2 Module’s principle diagram The block diagram is used to describe the module’s major logic functions: Figure 1-1 Module’s principle diagram
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第3页 1.3 Abbreviations A ADC Analog-Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASIC Application Specific Integrated Circuit B BER Bit Error Rate BTS Base Transceiver Station C CDMA Code Division Multiple Access CDG CDMA Development Group CS Coding Scheme CSD Circuit Switched Data CPU Central Processing Unit D DAI Digital Audio interface DAC Digital-to-Analog Converter DCE Data Communication Equipment DSP Digital Signal Processor DTE Data Terminal Equipment DTMF Dual Tone Multi-Frequency DTR Data Terminal Ready E EDGE Enhanced Data Rate for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Electro Magnetic Interference ESD Electronic Static Discharge ETS European Telecommunication Standard F FDMA Frequency Division Multiple Access FR Full Rate G GPRS General Packet Radio Service GSM Global Standard for Mobile Communications H HR Half Rate I IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union L
第4页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. LCD Liquid Crystal Display LED Light Emitting Diode M MCU Machine Control Unit MMI Man Machine Interface MS Mobile Station MTBF Mean Time Before Failure P PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication System PDU Protocol Data Unit PLL Phase Locked Loop PPP Point-to-point protocol R RAM Random Access Memory RF Radio Frequency ROM Read-only Memory RMS Root Mean Square RTC Real Time Clock S SIM Subscriber Identification Module SMS Short Message Service SMT Surface Mount Technology SRAM Static Random Access Memory T TA Terminal adapter TDMA Time Division Multiple Access TE Terminal Equipment also referred it as DTE U UART Universal asynchronous receiver-transmitter UIM User Identifier Management USB Universal Serial Bus USIM Universal Subscriber Identity Module V VSWR Voltage Standing Wave Ratio Z ZTE ZTE Corporation
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第5页 2 Descriptions of module’s external interfaces This chapter mainly describes the module’s external interfaces, such as B2B connector, MINI PCI-E, stamp-hole connector, etc. 2.1 Definitions of module’s interfaces Table 1-1 28Pin stamp-hole definition No. Definition I/O Description Remarks 1 GND GND 2 RF_ANT I/O RF antenna 3 GND GND 4 RING O Ring signal indication Level varies upon an incoming call or receipt of text message. 5 GND GND 6 VBAT I Work voltage 7 RSSI_LED O Network signal indication Internal pull-down, LED on at high level, need add triode driver externally. -power-on status: LED off; -network searching status: LED blinks at 3Hz -Idle status: LED blinks at 1Hz -Traffic status (call, data): LED blinks at 5Hz. 8 RTS I Request to send
第6页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. 9 CTS O Clear to send 10 DCD O Carrier detection 11 CARD_RST O card reset 12 CARD_CLK O card clock 13 CARD_DATA I/O card data 14 V_CARD O Card voltage 15 RXD I Receive data 16 TXD O Transmit data 17 SYSRST_N I Reset signal Valid at low level, need connect an open collector/drain switch. 18 SPK_2P O Headset Speaker + 19 SPK_1P O Microphone speaker + 20 SPK_1N O Microphone speaker - 21 MIC_2P I Headset microphone + 22 MIC_1P I Receiver microphone + 23 MIC_1N I Receiver microphone - 24 PWRKEY_N I power on-off Valid at low level, need connect an open collector/drain switch. 25 DTR I Data terminal ready _WAKEUP 26 DSR O Data set ready 27 V_MSM O 2.8V 28 GND GND 2.2 Antenna interface MG2639 module provides two kinds of antenna interface:  PCB welding pad  Antenna test socket PCB welding pad adopts 50Ω RF shield cable to connect the module and the antenna, in order to reduce the cost. However, using this method can’t completely shield the electromagnets, which might have slight influence on RF signal quality. Please note that there should not be strong radiation near the welding pad. Meantime, during the welding, make sure the core of RF shield cable must connect with RF welding pad, and RF shield cable’s shield metal mask must be welded to the module’s GND. During the welding, the GND must be welding securely, otherwise the core is easily broken due to the shaking of shield cable. See figure 2-1 for RF welding pad antenna. Figure 2-1 Antenna interface diagram
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第7页
第8页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. 3 Module’s electrical characteristics This chapter mainly introduces the module’s electrical characteristics, including the level, power consumption, reliability of module’s interfaces. 3.1 Descriptions of levels of interface signals It describes the MAX, MIN and typical value of the level of module’s external interfaces. 3.1.1 Reset SYSRST_N PIN is used to reset the module’s main chip, and SYSRST_N signal needs to be pulled down 500ms to reset the module. Likewise, this pin is required to pull up 2.8V (Max: 2.9V, Min: 2.7V, typical: 2.8V) through 4.7K resistor inside the module, and pull down 0.1uF capacitance to GMD filtering, and it’s required to externally connect dynatron driver. MG2639 module provides 1CH serial interface, supports 8-wire serial BUS interface or 4-wire serial BUS interface or 2-wire serial interface. The module communicates with the external devices and inputs AT commands through UART interface. Classification Definition I/O Description Min. voltage Typical voltage Max. voltageUART RXD I Receive data 2.4V 2.8V 3.1V /RTS I Request to send 2.4V 2.8V 3.1V TXD O Transmit data 2.4V 2.8V 3.1V /DTR I Data terminal ready_WAKEUP 2.4V 2.8V 3.1V /CTS O Clear to send 2.4V 2.8V 3.1V RING O Ring signal indication 2.4V 2.8V 3.1V /DSR O Data set ready 2.4V 2.8V 3.1V DCD O Carrier detection 2.4V 2.8V 3.1V 3.1.2 SIM Card Interface MG2639 module baseband processor integrates SIM card interface conforming to ISO 7816-3 standard, and it’s compatible with SIM card with two voltages 1.8V/3.0V and reserves SIM card interface signal on the stamp-hole PIN. Users should note that SIM card’s electrical interface definitions are the same as SIM card socket’s definitions. Figure 3-1 Standard SIM card PIN Definitions Diagram
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第9页 Classification Definition I/O Description Remarks SIM V_CARD O Card voltage 1.8V/3V; maximum output current 20mACARD_RST O Card reset GND GND CARD_CLK O Card clock CARD_DATA I/O Card data 3.1.3 Audio Interface MG2639 module supports 2CH audio signal inputs/outputs. It features in handheld microphone, handheld receiver or hands-free speaker and earpiece microphone/receiver function. These two MIC inputs are coupled in AC domain and the offset voltage is added inside, and they should directly connect with the receiver. The two receiver interfaces SPK_1 and SPK_2 are both differential interfaces with 32Ωresistance; SPK_2 is single-ended interface with 32Ω resistance. See the audio interface signals in the table below: Classification Definition I/O Description Remarks AUDIO MIC_1N I Receiver’s Microphone- The first differential receiver used for the default audio input/output and the second receiver used for headset audio input/output. MIC_1P I Receiver’s Microphone+ MIC_2P I Headset microphone + SPK_1N O Receiver’s speaker- SPK_1P O Receiver’s speaker+ SPK_2P O Headset speaker + 3.1.4 Network Signal Indication RSSI_LED Internal pull-down, LED turns on at high level, and need add triode driver externally. -Power-on status: LED off; -Network searching status: LED blinks at 3Hz -Idle status: LED blinks at 1Hz -Traffic status (call, data): LED blinks at 5Hz.
第10 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. SIG_LED PIN output status is defined according to the software protocol, and users could judge the module’s work status according to SIG_LED status. SIG_LED PIN is common I/O port, which can’t directly drive LED, and it needs to work with dynatron. 3.2 Module Power Consumption It describes the module’s power consumption under each status: No. Test items Typical value（mA） 1 Power-off leakage current (Normal power-off) 50uA 2 Average standby current (no operation after power-on) 2mA 3 Average standby current (after talk) 2mA 4 Talk current 128mA 3.3 Reliability Characteristics It describes the temperature, including working temperature and storage temperature. Working temperature: -30°C~+75°C Storage temperature: -40°C~+85°C
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第11 页 4 Interface circuit design It provides the reference design circuit of the interface and precautions according to the module’s functions. 4.1 Reset and power design See the reference design principle of power and reset circuit in figure 4-1: Figure 4-1 Power and reset circuit reference design principle diagram  Power design MG2639 module is powered by VBAT. See the voltage characteristics in table 4-1. Table 4-1 Voltage characteristics Classification MIN Typical MAX Input voltage 3.4V 3.9V 4.25V Input current 2mA（average）-- 300mA（depends on the network signal） D1 is an enabled LDO with 6V~9V input voltage. Through adjusting R31and R41, it could make V_MAIN at 3.9V to power the module, and it’s required to place at least one 1000uF tantalum capacitor at V-Main input pin. The module is very strict with the requirements on power and GND, therefore it’s requested that filtering must be performed to power and GND, and the power ripple must be controlled under 50Mv. Do not use LDO to power any other part in the system because it might affect the RF performance. Finally, select the power cables with at least 80mil traces during the layout and keep the integrality of ground line. If MG2639 module uses other LDO, make sure the output current is larger than 2A.  Power on The module is under power-off status after it’s normally powered on. To turn on the module, provide a 2s-5s low level pulse to PWRKEY_N pin when the module is OFF. If one 1K resistance is connected with PWRKEY_N, the module can be turned on after power supply. Note: ON/OFF and /Reset need to connect an open collector/drain gate. It’s not required to operate /RESET signal upon power-on.
第12 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission.  Power off To turn off the module, use AT command “AT+ZPWROFF” or provide a 2s~5s low level pulse to PWRKEY_N PIN.  Reset Use the above method to firstly “power-off” and then “power-on” to hard reset the module. If the external reset function has to be used, low level pulse lasting at least 500ms should be provided to /RESET Pin within 2 seconds after the module is turned on. Before that, the external I/O signal must be kept at low level. See the reset circuit design in figure 4-1. If SYSRST_N Pin is not used, suspend the pin. See the module’s power-on/off time sequence in the diagram below: Figure 4-1 Power-on/off time sequence Table 4-2 Power-on/off circuit time characteristics ta tb tc td te 20ms 10ms 3s 3s 6s  V_MSM There is a voltage output pin with current adjuster, which can be used to supply external power to the board. The voltage of this pin and the voltage of baseband processor/memory come from the same voltage adjuster. The voltage output is available only when the module is on. The normal output voltage is 2.85V, and the user should absorb the current from this pin as little as possible (less than 10mA). Generally, it is recommended to use this pin to match the level. When the module is off, the output voltage for this pin remains unchanged, but the impedance is rather high. Therefore, it’s not recommended to use this pin for other purposes.  Other advice In order to make sure the data is saved safely, please don’t cut off the power when the module is on. It’s strongly recommended to add battery or soft switch like the power key on the module. 4.2 UART interface Note: when using the module for overall design, the users should export UART for module’s software upgrade. MG2639 module provides an integrated full duplex UART interface and an accessorial full duplex UART interface, whose maximal data rate is 115200bps. External interface is 2.8VCMOS level signal, their logic functions conform to RS-232 interface standard. These two UART could be used as serial port data interfaces, usually UART1 is used for AT commands, data transmission and updating software of module. The module’s output IO level is 2.8V，it needs to transfer the level when connecting with standard 3.3V or 5V logic circuit（such as MCU or RS232 drive chip MAX3238 etc）, Figure 4-3 shows the COM port level transfer circuit. The converted signal should connect with MCU or RS232 drive chip
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第13 页 directly. Common low power switch triode should be applied as the crystal triode shown in Figure 4-3. Please note that the module won’t enter sleep mode as RXD is at high level. Figure 4-3 UART interface reference design block diagram Remarks: the module doesn’t support USB. 4.3 SIM card interface MG2639 module supports 1.8V or 3V SIM card, and there are 4 pins at the terminal of the card. V_CARD is used to supply SIM card. It’s strongly recommended to add ESD to protect SIM card in hostile environments. Figure 4-4 SIM card circuit reference design diagram
第14 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. NOTE: The SIM card PCB wiring should be laid closely around the module as much as possible to prevent the interference sources from affecting the SIM card’s reading/writing. Besides, Since the SIM card needs to be designed to meet the requirements of ESD performance and avoid the damage of the SIM card caused by ESD, it’s recommended to add TVS components on 4-CH SIM card signals, meanwhile, the signal wires need go through TVS component before entering the module’s baseband processor during the layout. 4.4 Audio interface MG2639 module provides audio input and output interfaces through its PINs. There are 2 Speaker interfaces and 2 Microphone interfaces. Only one pair I/O works at the same time. See the audio interface circuit in figure 4-5. Figure 4-5 Audio interface circuit reference design principle diagram  Microphone The system connector provides two microphone interfaces MIC_1 and MIC_2, MIC_1 is differential interface; while MIC_2 is single ended interface. These two inputs are coupled in AC domain and 2.0V offset voltage are added inside, therefore they should directly connect to the microphone.  Speaker The system connector provides two speakers, SPK_1 & SPK_2. SPK_1 is differential interface, while SPK_2 is single-ended interface. They both have 32 ohm impedance. GSM/GPRS module audio interface is designed as below:  Design of the audio interface on the receiver Select the microphone with the sensitivity lower than -51.5dB since the output impedance for SPK_1 is 32 ohm and the max. gain in MIC_1 reaches 51.5dB. The level of MIC_1P PIN is about 2.2V. Note: if other kind of audio input method is adopted, the input signal should be within 0.5V. If the signal voltage is lower than 0.5V, then the pre-amplifier should be added. If the signal voltage is higher than 0.5V, then network attenuation should be added.  Design of the audio interface on the headset Select the microphone with the sensitivity lower than -51.5dB since the output impedance for SPK_2 is 32 ohm and the max. gain in MIC_2 reaches 51.5dB. The level of MIC_2P PIN is about 2.2V. The design is just the same as that on the receiver
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第15 页 5 Mechanical dimensions It introduces the module’s mechanical dimensions. 5.1 Appearance Diagram Figure 5-1 MG2639 module’s appearance  Dimensions（L×W×H）：30.0×25.0×2.68mm  Weight：7g 5.2 Module Assembly Diagram See the module assembly diagram in figure 5.2. Figure 5-2 Module’s assembly diagram
第16 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. 5.3 PCB Dimensions See the module’s PCB dimensions in figure 5-3. Figure 5-3 Relevant PCB dimensions Precautions while designing PCB: 1）Copper-clad and wiring are forbidden at the area below the RF test points. 2）For the convenience of testing and maintenance, it might be necessary to drill holes on the PCB. 6 Antenna Interface The RF interface of the MG2639 Module has an impedance of 50 . The module is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the MG2639 Module PCB and should be placed in the host application.
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第17 页 Regarding the return loss, the Module provides the following values in the active band: Table 6-1 Return Loss in the Active Band State of Module Return Loss of Module Recommended Return Loss of Application Receive ≥ 8dB ≥ 12dBTransmit not applicable ≥ 12dBThe connection of the antenna or other equipment must be de coupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 6.1 Antenna Installation To suit the physical design of individual applications, the MC2261 offers two alternative approached to connecting the antenna: ■ Recommended approach: MM9329-2700B antenna connector manufactured by MURATA assembled on the component side of the PCB (top view on Module). See Section 4.3 for details. ■ Antenna pad and grounding plane placed on the bottom side. See Section 4.2 for details. The MM9329-2700B connector has been chosen as antenna reference point (ARP) for the ZTEMT reference equipment submitted to type approve the MG2639 Module. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the ZTEMT type approval you are advised to give priority to the connector, rather than using the antenna pad. Note: Both solutions can be applied alternatively. This means,if the antenna is connected to the pad, then the connector on the Module must be left empty,and when the antenna is connected to the Module connector, the pad is useless, 6.2 Antenna Pad The antenna pad of the module is soldered to the board on the customer design to connect with RF line. For proper grounding connect the RF line to the ground plane on the bottom of the MG2639 Module which must be connected to the ground plane of the application. Consider that according to GSM recommendations as 50Ω connector is mandatory for type approval measurements. It must be ensured that the RF line which is connected to antenna pad should be controlled on 50Ω. Notes on soldering ■ To prevent damage to the Module and to obtain long-term solder joint properties, you are advised to maintain the standards of good engineering practice for soldering. Material Properties ■ MG2639 Module PCB: FR4 ■ Antenna pad: Gold plated pad 6.3 Antenna connector The MG2639 Module uses a microwave coaxial connector supplied by Murata Ltd. The product name is MM9329-2700B. The position of the antenna connector on the Module PCB can be seen in Figure 6-3. Figure 6-3 Specification of MM9329-2700B connector
第18 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. Table 6-2 Product specifications of MM9329-2700B connector Part Number Rated Voltag e (V) Contact Resistan ce (ohm) Withstandi ng Voltage (rms) Insulatio n Resistance (M ohm) Durabili ty (cycles)Frequen cy Rating (GHz)Temperatu re Range (degree C)VSWR Center Conta ct Outer Conta ct Insulator MM9329 -2700B 250 0.015 max. 300 (AC) 500 min. 100 DC - 6.0 -40~+90. 1.2 max. (DC~3GH z) Copper Alloy Gold plated Copper Alloy Silver plated Engineeri ng plastic 6.4 Antenna Subsystem The antenna sub-system and its design is a major part of the final product integration. Special attention and care should be taken in adhering to the following guidelines. 6.4.1 Antenna Specifications Choice of the antenna cable (type, length, performance, RF loss, etc) and antenna connector (type + losses) can have a major impact on the success of the design.
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第19 页 6.4.2 Cable Loss All cables have RF losses. Minimizing the length of the cable between the antenna and the RF connectors on the module will help obtain superior performance. High Quality/Low loss co-axial cables should be used to connect the antenna to the RF connectors. Contact the antenna vendor for the specific type of cable that interfaces with their antenna and ask them to detail the RF losses of the cables supplied along with the antenna. Typically, the cable length should be such that they have no more than 1-2dB of loss. Though the system will work with longer (lossy) cables, this will degrade GSM system performance. Care should also be taken to ensure that the cable end connectors/terminations are well assembled to minimize losses and to offer a reliable, sturdy connection to the Module sub-system. This is particularly important for applications where the module is mounted on a mobile or portable environment where it is subject to shock and vibration. 6.4.3 Antenna Gain Maximum Requirements Our FCC Grant imposes a maximum gain for the antenna subsystem: 2 dBi for the GSM850 band and 2dBi for the 1900 band. Warning: Excessive gain could damage sensitive RF circuits and void the warranty. 6.4.4 Antenna Matching The module’s RF connectors are designed to work with a 50-ohm subsystem. It is assumed that the antenna chosen has matching internal to it to match between the 50-ohm RF connectors and the antenna impedance. 6.4.5 PCB Design Considerations • The antenna subsystem should be treated like any other RF system or component. It should be isolated as much as possible from any noise generating circuitry including the interface signals via filtering and shielding. • As a general recommendation all components or chips operating at high frequencies such as micro controllers, memory, DC/DC converts and other RF components should not be placed too close to the module. When such cases exist, correct supply and ground de-coupling areas should be designed and validated. • Avoid placing the components around the RF connection and close to the RF line between the RF antenna and the module. • RF lines and cables should be as short as possible. • If using coaxial cable it should not be placed close to devices operating at low frequencies. Signals like charger circuits may require some EMI/RFI decoupling such as filter capacitors or ferrite beads. • Adding external impedance matching to improve the match to your cable and antenna assemblies is optional. Please contact the antenna vendor for matching requirements. • For better ESD protection one can implement a shock coil to ground and place it close to the RF connector. Antenna Interface Proper measures should be taken to reduce the access loss of effective bands, and good shielding should be established between the external antenna and the RF connector. Besides, the external RF cables should be kept far away from all interference sources such as high-speed digital signal or switch power supply. According to mobile station standard, stationary wave ratio of antenna should be between1.1 to 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antenna’s gain. Generally, the larger gain in the band and smaller outside the band, the better performance the antenna has. Isolation degree among ports must more than 30dB when multi-ports antenna is used. For example, between
第20 页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission. two different polarized ports on dual-polarized antenna, two different frequency ports on dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, isolation degree should be more than 30dB. 7 OEM/Integrators Installations Clear and specific instructions describing the conditions, limitations and procedures for third-parties to use integrate the module into a host device. Important compliance information for North American users The MG2639 Module has been granted modular approval for mobile applications. Integrators may use the MG2639 Module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed 2dBi in the cellular band and 2dBi in the PCS band. 3. The MG2639 Module and its antenna must not be co-located or operating in conjunction with any other transmitter or antenna within a host device. 4. A label must be affixed to the outside of the end product into which the MG2639 Module is incorporated, with a statement similar to the following:·ForMG2639: This device contains FCC ID: Q78-MG2639. 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded MG2639 Module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.
This document is not allowed to transmit without ZTE Corporation’s permission. ©ZTE CORPORATION All rights reserved 第21 页 8. EU Regulatory Conformance Hereby, ZTE CORPORATION declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. For the declaration of conformity, visit the Web site www.zte.com

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