ZTE ZM8620 LTE Wireless Data Terminal User Manual

ZTE Corporation LTE Wireless Data Terminal Users Manual

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ZM8620 User Manual

User Manual

Hardware Development Guide of Module Product Welink Your Smart Version 2.3, 2014-04-15 ZM8620_V2

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink II 错误！未找到用源。 ZM8620_V2 Applicability Table Product ZM8620_V2EUD ZM8620_V2LAT

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink III 错误！未找到用源。 ZM8620_V2 Revision History Version Date Description V1.0 2013-02-22 First published V2.0 2013-03-20 Delete the part of 4.8 in the former version, and change the header, front cover, legal information and footer. V2.1 2013-08-16 1. Modify the legal information 2. Modify the part of 7.1.1 3. Modify the format of footer and header 4. Modify the figure of PIN Configuration Diagram 5. Add the figure of PIN Distribution Diagram 6. Add chapter 8 of Debugging Environment and Method 7. Modify chapter 7 of Antenna 2013-09-30 8. Modify the typical voltage of power supply to 3.8V 9. Add the support of WinCE OS 10. Update the Product Material Object Picture of Figure 2-1 11. Modify the support of GPRS Class B in Table 2-1 12. Modify the Specification of SIM interface in Table 2-1 13. Modify the pin NO. of USIM in Table 4-4 14. Modify the Figure of (U)SIM Card Signal Connection Circuit 15. Modify the support of MMS, RAS, phonebook, network lock, and USSD in Table 2-1 16. Add the Figure 4-4 of Module Serial Port & AP Application Processor 17. Add the Table 4-6 of Definition of UART Signal 18. Add 4.10 of W_DISABLE_N Signal 19. Modify chapter 5.3 of Resetting Flow 20. Delete the part of Power_on/Power_off in chapter 5.2 and chapter 4.8 21. Add Table 5-3 of Power-on/Resetting Period 22. Complete and modify Table 4-2 of PIN Interface Definition 2013-10-11 23. Add chapter 4.8 of SPI Interface 24. Add chapter 6 of Related Test & Testing Standard 2013-12-12 25. Add Contact Information 26. Modify Power-on/Resetting Period in chapter 5 27. Add the document in table List for Supported& Related Documents 28. Modify LTE TDD in Technical Standard to DL 50Mbps / UL 25Mbps (10MHz) in Table 2-1 29. Modify the RxDiv Band in Table 2-1 30. Add the power consumption in the mode of UMTS/LTE in

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink V 错误！未找到用源。 ZM8620_V2 Contact Information Post 9/F, Tower A, Hans Innovation Mansion, North Ring Rd., No.9018, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P.R.China. Web www.ztewelink.com Phone +86-755-86360200-8679 E-Mail ztewelink@zte.com.cn Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink VI 错误！未找到用源。 ZM8620_V2 Contents LEGAL INFORMATION ....................................................................................................................................... I 1 ABOUT THIS DOCUMENT ..................................................................................................................... 1 1.1 Application Range ................................................................................................................................. 1 1.2 Purpose ................................................................................................................................................ 1 1.3 Supported & Reference Document List .................................................................................................... 1 1.4 Abbreviations ....................................................................................................................................... 2 2 PRODUCT OVERVIEW ........................................................................................................................... 3 2.1 Product Technical Parameter .................................................................................................................. 4 2.2 Function Overview ................................................................................................................................ 7 2.2.1 Baseband Function .................................................................................................................... 7 2.2.2 Radio Frequency Function ......................................................................................................... 7 3 MECHANIC FEATURE ............................................................................................................................ 9 3.1 Dimensions and Interface ....................................................................................................................... 9 3.2 Antenna Interface ................................................................................................................................ 11 3.3 Thermal Design .................................................................................................................................. 12 4 PIN DESCRIPTION ................................................................................................................................ 14 4.1 Dimensions and Interface ..................................................................................................................... 14 4.1.1 Definition of PIN I/O Parameters .............................................................................................. 14 4.1.2 PIN Configuration Diagram ...................................................................................................... 14 4.1.3 PIN Description ........................................................................................................................ 15 4.2 Feature of Interface Power Level .......................................................................................................... 18 4.2.1 Power Level of IO Interface ...................................................................................................... 18 4.3 Power Interface ................................................................................................................................... 19 4.3.1 Description of Power PINs ....................................................................................................... 19 4.3.2 Requirement of Power Supply .................................................................................................. 19 4.4 (U)SIM Card Interface ......................................................................................................................... 19 4.4.1 Description of PINs ................................................................................................................... 19

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink VII 错误！未找到用源。 ZM8620_V2 4.4.2 Electric Feature ........................................................................................................................ 20 4.5 USB2.0 Interface ................................................................................................................................ 20 4.5.1 Description of PINs ................................................................................................................... 20 4.5.2 Electric Feature ........................................................................................................................ 21 4.6 UART Interface .................................................................................................................................. 21 4.6.1 Description of PINs ................................................................................................................... 21 4.6.2 Electric Feature ........................................................................................................................ 22 4.7 SPI Interface ....................................................................................................................................... 23 4.8 Reset Signal PERST# .......................................................................................................................... 24 4.9 WAKE# Signal ................................................................................................................................... 24 4.10 W_DISABLE_N Signal ....................................................................................................................... 25 4.11 Recommended Upgrade Methods ......................................................................................................... 26 5 ELECTRIC FEATURE ........................................................................................................................... 27 5.1 Power Feature ..................................................................................................................................... 27 5.1.1 Power Supply ........................................................................................................................... 27 5.1.2 Working Current ....................................................................................................................... 27 5.2 Power-on/Resetting Flow ..................................................................................................................... 28 5.3 Resetting Flow .................................................................................................................................... 29 6 RELATED TEST & TESTING STANDARD ........................................................................................... 30 6.1 Testing Reference ................................................................................................................................ 30 6.2 Description of Testing Environment ...................................................................................................... 30 6.3 Reliability Testing Environment ............................................................................................................ 31 6.4 Reliability Test Result .......................................................................................................................... 32 7 RF SPECIFICATIONS ........................................................................................................................... 34 7.1 Technical Specification for UMTS Mode Radio Frequency ..................................................................... 34 7.1.1 Maximum Transmission Power................................................................................................. 34 7.1.2 Receiving Sensitivity ................................................................................................................ 34 7.1.3 Spurious Specification .............................................................................................................. 35 7.2 Technical Specification of GSM Mode Radio Frequency ......................................................................... 35

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink VIII 错误！未找到用源。 ZM8620_V2 7.2.1 Maximum Transmission Power................................................................................................. 35 7.2.2 Receiving Sensitivity ................................................................................................................ 36 7.3 Technical Specification of LTE Mode Radio Frequency .......................................................................... 36 7.3.1 Maximum Transmission Power................................................................................................. 36 7.3.2 Receiving Sensitivity ................................................................................................................ 36 7.3.3 Spurious Specification .............................................................................................................. 38 8 ANTENNA ............................................................................................................................................. 41 8.1 RF Antenna Specification ..................................................................................................................... 41 8.1.1 Technical Parameter for the Main Antenna Connector ............................................................. 41 8.2 Proposal on Layout of Product in Terminal Product ................................................................................ 42 8.3 Antenna Dimensions and Location ........................................................................................................ 43 8.4 Diversity Antenna Design .................................................................................................................... 43 9 DEBUGGING ENVIRONMENT AND METHOD .................................................................................... 44 9.1 Debugging Board ................................................................................................................................ 44 9.2 Interfaces on Debugging Board............................................................................................................. 45 9.2.1 JTAG Interface ......................................................................................................................... 45 9.2.2 USB Interface ........................................................................................................................... 45 9.2.3 Power-supply Interface ............................................................................................................. 45 9.2.4 USIM Card Console Interface .................................................................................................. 46 9.2.5 PON_RESET_N Button ............................................................................................................ 46 9.2.6 W_DISABLE_N Button ............................................................................................................. 46 9.2.7 LED Indicator............................................................................................................................ 46 10 PACKAGE SYSTEM .............................................................................................................................. 47 11 SAFETY INFORMATION ....................................................................................................................... 48

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink X 错误！未找到用源。 ZM8620_V2 Tables Table 1–1 List for Supported& Related Documents .................................................................................................. 1 Table 1–2 Abbreviation List ...................................................................................................................................... 2 Table 2–1 The bands informaiton of ZM8620_V2 module........................................................................................ 3 Table 2–2 Overview of Major Technical Parameters ................................................................................................. 4 Table 2–3 Product Operating Frequency Band .......................................................................................................... 8 Table 3–1 PCI Express Mini Card ............................................................................................................................. 9 Table 4–1 PIN Parameters ....................................................................................................................................... 14 Table 4–2 PIN Interface Definition .......................................................................................................................... 15 Table 4–3 Power Level Range of Digital Signal ...................................................................................................... 18 Table 4–4 Definition & Description of (U) SIM Card Signal Group ....................................................................... 20 Table 4–5 Definition of UART Signal ..................................................................................................................... 21 Table 4–6 Definition and Description of SPI Control Signal Group ........................................................................ 23 Table 4–7 Definition and Description of PERST# Signal ........................................................................................ 24 Table 4–8 Definition and Description of W_DISABLE_N Signal .......................................................................... 25 Table 5–1 Input Voltages ......................................................................................................................................... 27 Table 5–2 Averaged standby DC power consumption ............................................................................................. 27 Table 5–3 DC power consumption in UMTS mode ................................................................................................. 27 Table 5–4 DC power consumption in LTE mode (Unit: mA) .................................................................................. 28 Table 5–5 Power-on/Resetting Period ...................................................................................................................... 28 Table 6–1 Testing Standard ...................................................................................................................................... 30 Table 6–2 Testing Environment ............................................................................................................................... 31 Table 6–3 Testing Instrument & Device .................................................................................................................. 31 Table 6–4 Reliability Feature ................................................................................................................................... 31 Table 6–5 Temperature Testing Result under Windless Environment ...................................................................... 32 Table 6–6 Test Results of High/low Temperature Running and Reliability Test ...................................................... 33 Table 7–1 Maximum Transmission Power ............................................................................................................... 34 Table 7–2 Receiving Sensitivity Reference Table .................................................................................................... 34 Table 7–3 General Requirement of Receiver Spurious Emission ............................................................................ 35 Table 7–4 Additional Spurious Emission Requirement ........................................................................................... 35 Table 7–5 Maximum Transmission Power ............................................................................................................... 35 Table 7–6 Reference Table of Receiving Sensitivity ............................................................................................... 36 Table 7–7 Maximum Transmission Power ............................................................................................................... 36 Table 7–8 Receiving Sensitivity Reference Table .................................................................................................... 37 Table 7–9 General Requirement of Receiver Spurious Emission ............................................................................ 38 Table 7–10 UE Co-existence Spurious Emission Requirement ............................................................................... 38

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 1 错误！未找到用源。 ZM8620_V2 1 About This Document 1.1 Application Range This document is applicable as the hardware development guide of ZM8620_V2 LTE module product. The user can conduct secondary development according to the requirement and guidance in this document. And it is only applicable for the hardware application development based on the use of ZM8620_V2 module product. 1.2 Purpose This document provides the design and development fundamentals for the users of ZM8620_V2. By reading this document, the user can have an overall knowledge of this product, and a clear understanding of the technical parameters, hardware interfaces, electrical and mechanical details of this product. With this document, the user can use ZM8620_V2 successfully fulfill the wireless communication function development of M2M applications including Wireless POS, mobile terminal products such as Tablet, Notepad etc. 1.3 Supported & Reference Document List Besides this hardware development document, ZTEWelink also provides the software development guide. Table 1-1 is the list of supported documents. Table 1–1 List for Supported& Related Documents NUM Document Name 1 ZTEWelink Software Development Guide of LTE Module Products-V2.3.pdf 2 ZTEWelink ZM8620_V2 Module Specification.pdf 3 AT Command reference guide for ZTEWelink LTE Module.pdf 4 3GPP LTE 36.101 protocol (Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) radio transmission and reception)

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 2 错误！未找到用源。 ZM8620_V2 5 3GPP TS 34.121 protocol 1.4 Abbreviations Table 1-2 is a list of the relevant abbreviations, and interpretations in Chinese and English involved in the whole document. Table 1–2 Abbreviation List Abbreviations English full name BER Bit Error Rate DCE Data circuit-terminating equipment DL Downlink DTE Data terminal equipment DTR Data terminal ready DPCH Dedicated Physical Channel DPCH_Ec Average energy per PN chip for DPCH. DPCH EMC Electromagnetic compatibility ESD Electro-Static discharge FDD Frequency Division Duplexing GPRS General Packet Radio Service GSM Global Standard for Mobile Communications I/O Input/output LED Light Emitting Diode PCB Printed Circuit Board SIM Subscriber Identification Module SMS Short Message Service SPI Serial Peripheral Interface UART Universal asynchronous receiver-transmitter UMTS Universal Mobile Telecommunication System USB Universal Serial Bus WCDMA Wideband Code Division Multi Access

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 3 错误！未找到用源。 ZM8620_V2 2 Product Overview ZM8620_V2 is a multimode wireless communication module with mini-PCIE express interface, which can be applied in but not limited to equipment such as Tablet, Vehicle Mounted Terminals, CPE and electronic consumer products, and provides equipment with high-speed data access service in mobile environment (LTE FDD, UTMS and GSM network). ZM8620_V2contains two variants ZM8620_V2EUD and ZM8620_V2LAT. Customer can choose the dedicated type based on the wireless network configuration. The following table shows the entire radio band configuration of ZM8620_V2series. Table 2–1 The bands informaiton of ZM8620_V2 module BAND ZM8620_V2EUD ZM8620_V2LAT FDD-LTE BAND 1 √ √ BAND 2 -- √ BAND 3 √ -- BAND 4 -- √ BAND 5 -- √ BAND 7 √ √ BAND 8 √ √ BAND12 -- √ BAND 20 √ -- TD-LTE BAND 38 -- √ BAND 40 √ -- UMTS BAND 1 √ √ BAND 2 √ √ BAND 4 -- √ BAND 5 √ √ BAND 8 √ √ GSM Quadband √ √  NOTE: In the Table 2-1 ―√‖ means theband is supported by module ZM8620_V2, while ―--‖ means not supported The Figure 2-1 below shows the product material object picture.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 4 错误！未找到用源。 ZM8620_V2 Figure 2–1 Product Material Object Picture 2.1 Product Technical Parameter The major features of ZM8620_V2 can be described from the aspects of mechanic feature, base band, radio frequency, technical standard and environment feature. Table 2-2 is a list of the major technical parameters and features supported by ZM8620_V2. Table 2–2 Overview of Major Technical Parameters Item Feature Specifications Mechanic Specifications Dimensions 51mm x 30mm x 4.9mm Weight About 11g Form Factor Mini-PCIE package(52Pin) Baseband (U)SIM/SIM 3V SIM card and 1.8V SIM card Memory(SDRAM/NAND) 128MByte & 256MByte MICRO SD Card No memory card support USB Version USB 2.0 HIGH SPEED UART Interface Yes Reset/Power_on/Power_off interface Yes SPI Interface Yes Maximum power TBD

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 5 错误！未找到用源。 ZM8620_V2 Item Feature Specifications consumption Power supply Typical is 3.3V, the range is 3.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 6 错误！未找到用源。 ZM8620_V2 Item Feature Specifications Equalization Yes Main Antenna Provide external main Antenna Interface of RF connector mode GPS Antenna Provide external GPS Antenna Interface of RF connector mode Receive Diversity Antenna Provide external Diversity Antenna Interface of RF connector mode Technical Standard LTE TDD DL 50Mbps / UL 25Mbps (10MHz) GSM/EDGE/WCDMA GSM CS: UL 9.6kbps/DL 9.6kbps GPRS: Multi-slot Class 10 EDGE: Multi-slot Class 12 WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps HSDPA/HSUPA/ HSPA+/ DC-HSPA+ HSDPA Rel 6: DL 14.4Mb/s HSUPA Rel 6: UL 5.76Mb/s HSPA+ Rel 7: DL 28/UL 5.76Mb/s DC-HSPA+ Rel 8: DL 42/UL 5.76 Mb/s CDMA 1xEV-DO N/A LTE-FDD DL 100Mbps / UL 50Mbps (Category 3) 3GPP Release R99, R5, R6, R7, R8(HSPA+),R9(FDD) OS Windows XP/Vista/7/8, Android, Linux, WinCE GPRS Class Class A Environment Operating Temperature -10 to 60 °C Storage Temperature -40 to 85 °C Humidity 5%~ 95% Application DATA RAS Yes ECM Yes NDIS Yes SMS Yes MMS Yes, not support embedded MMS stack STK No TCP/IP No USSD Yes (Phase I &Phase II) Phonebook Yes

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 7 错误！未找到用源。 ZM8620_V2 Item Feature Specifications NETWORK LOCK No BAND LOCK Yes SIM Reader Yes Firmware Update Yes GPS/AGPS Yes 2.2 Function Overview 2.2.1 Baseband Function When connect the module product ZM8620_V2 to the system board, there are several main signal groups as follows: USB signal, SIM card signal, UART signal, GPIO signal, SPI signal, power on and resetting signal, wakeup signal, power supply and ground. At the same time, ZM8620_V2 has the main antenna interface, diversity antenna interface, and GPS antenna interface. Main Antenna USBSIM cardPOWERGNDGPIOUART WAKE#&PERST#&W_DISABLE Signals GPS Antenna ZM8620_V2 PCIE LTE wireless Internet access moduleDiversity AntennaSPI Figure 2–2 System Connection Diagram 2.2.2 Radio Frequency Function The radio frequency function of ZM8620_V2 can be viewed from the aspect of over-the-air wireless bearer network, frequency band, whether receive diversity feature is supported. (a) Support LTE FDD, LTE TDD, UMTS;

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 8 错误！未找到用源。 ZM8620_V2 (b) Support GSM 850/900/1800/1900 MHz; (c) Support the diversity receives; The operating frequencies of module ZM8620_V2 are shown as Table 2-3. Table 2–3 Product Operating Frequency Band Operating Frequency Band Uplink Frequency Band (Uplink) Downlink Frequency Band (Downlink) UMTS850 824 MHz — 849 MHz 869 MHz — 894 MHz UMTS900 880 MHz — 915 MHz 925 MHz — 960 MHz UMTS1700 1710 MHz — 1755MHz 2110 MHz — 2155MHz UMTS1900 1850 MHz — 1910 MHz 1930 MHz — 1990 MHz UMTS2100 1920 MHz — 1980 MHz 2110 MHz — 2170 MHz GSM1900 1850 MHz — 1910 MHz 1930 MHz — 1990 MHz GSM850 824 MHz — 849 MHz 869 MHz — 894 MHz GSM900 890 MHz — 915MHz 935 MHz — 960MHz GSM1800 1710 MHz — 1785MHz 1805 MHz — 1880MHz LTE-FDD Band17 788 MHz — 798 MHz 734 MHz — 746 MHz LTE-FDD Band5 824 MHz — 849MHz 869 MHz — 894 MHz LTE-FDD Band8 880 MHz — 915 MHz 925 MHz — 960 MHz LTE-FDD Band4 1710 MHz — 1755MHz 2110 MHz — 2155 MHz LTE-FDD Band2 1850 MHz — 1910MHz 1930 MHz — 1990MHz LTE-FDD Band1 1920 MHz — 1980 MHz 2110 MHz — 2170 MHz LTE-FDD Band7 2500 MHz — 2570MHz 2620 MHz — 2690MHz LTE-TDD Band38 2570 MHz — 2620MHz 2570 MHz — 2620MHz

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 9 错误！未找到用源。 ZM8620_V2 3 Mechanic Feature 3.1 Dimensions and Interface This product adopts the standard PCI Express Mini Card interface type, and the contour size is designed according to F1 type. Figure 3-1 illustrates the dimensions and slot compatibility of PCI Express Mini Card. Users of this module can refer to the document named PCI Express Mini Card Electromechanical Specification Revision 1.2, October 26 2007 for the detail of PCIE interface. Table 3–1 PCI Express Mini Card Card Type Full-Mini- Only Socket Half-Mini- Only Socket Dual-Use Socket Dual Head-to-Head Socket Connector A Connector A Connector A Connector A Connector B F1 Full-Mini Yes No No No No F2 Full-Mini with bottom-side keep outs Yes No Yes Yes No F3 Half-Mini No Yes Yes Yes No F4 Half-Mini with bottom-side keep outs No Yes Yes Yes Yes

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 10 错误！未找到用源。 ZM8620_V2 (a) (b)

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 11 错误！未找到用源。 ZM8620_V2 (c) Figure 3–1 PCI Express Mini Card Dimensions Type and Slot Compatibility Figure (a) is TOP surface dimensions; Figure (b) is BOTTOM surface dimensions; Figure (c) is thickness information. 3.2 Antenna Interface This product has three radio frequency antenna interfaces: One is the main antenna interface (there is the ―MAIN‖ flag on the PCB), one is a diversity receiving antenna (diversity optional) interface (there is ―AUX‖ flag on the PCB), and one is GPS antenna, as shown in Figure 3-2. The radio frequency bases adopted by the antenna interface of ZM8620_V2 module are all U.FL-R-SMT-1(80)(HRS)/ ECT818000071(ECT) at present as shown in Figure 3-3.  NOTE: The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13 of I-PEX by ZM8620 before.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 12 错误！未找到用源。 ZM8620_V2 Figure 3–2 Antenna Interface Flag Diagram (with Diversity) Figure 3–3 Radio Frequency Interface Test Base This product antenna is placed on the side of the system board. If this product is embedded in a notebook, place it on the top of the LCD screen. 3.3 Thermal Design The thermal design of this product strictly complies with the specification [PCI Express Mini Card Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat source evenly, and has excellent heat dissipating design. As the maximum power consumption of the overall system is very high when transmitting, if it is impossible to ensure the temperature of ZM8620_V2 less than 60°C, the rise of the overall system temperature will lead to the performance degradation of ZM8620_V2, or even not operate normally. In order to ensure product performance, safety and stability, the following proposals are provided for the main board design: (a) the module far away from the switch power and high-speed signal cable as much as

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 13 错误！未找到用源。 ZM8620_V2 possible. Well protect the wiring of the interference sources. (b) located close the interference sources. (c) the module close to devices with large heat dissipation, such as CPU, south bridge, etc. The high temperature will affect the RF performance.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 14 错误！未找到用源。 ZM8620_V2 4 Pin Description 4.1 Dimensions and Interface 4.1.1 Definition of PIN I/O Parameters The definition of the module‘s I/O parameter is as shown in Table 4-1. Table 4–1 PIN Parameters PIN Attribute Description AI Analog signal input AO Analog signal output B bidirectional digital with CMOS input DI Digital signal input DO Digital signal output Z High-resistance output P1 PIN group 1, the power supply voltage is VDD_P1 P2 PIN group 2, the power supply voltage is VDD_P2 PU PIN internal pull-up PD PIN internal pull-down 4.1.2 PIN Configuration Diagram The PIN sequence of interfaces on the module is following the mini-PCIE interface and defined as shown in Figure 4-2.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 15 错误！未找到用源。 ZM8620_V2 Figure 4–1 PIN Distribution Diagram 123579111315171921232527293133353739414345495146810121416182022242628303234363840424446485052VDD_3V3VREG_UIMUIM_ DATAUIM_ CLKUIM_ RSTUART1_DSRW_DISABLE_NPERST#VDD_3V3USB_ DMUSB_ DPVDD_3V3VDD_3V3 LED_ PWRVDD_3V347GNDSPI_CSGNDGNDGPIONCGNDGNDNCSLIC_INTSLIC_RESETGNDWAKE #SPI_SDISPI_SDOSPI_CLKGNDGNDGNDGNDGNDGNDGNDUART1_RXUART1_RIGPIO_79UART1_CTSUART1_RFRUART1_DTRGNDRESERVEDRESERVEDRESERVEDRESERVEDCOEX1COEX2CLKREQ*GND[1]REFCLK-REFCLK+GND[2]RESERVED5_UIM_C8RESERVED4_UIM_C4GND[4]PERN0PERP0GND[6]GND[7]PETN0PETP0GND[9]GND[10]3V3VAUX[2]3V3VAUX[3]GND[12]RESERVED3RESERVED2RESERVED0RESERVED13V3VAUX[0]GND[0]1V5[0]UIM_PWRUIM_DATAUIM_CLKUIM_RESETUIM_VPPW_DISABLE*PERST*3V3VAUX[1]GND[5]1V5[1]SMB_CLKSMB_DATAGND[8]USB_D+LED_WWAN*LED_WLAN*LED_WPAN*1V5[2]GND[13]3V3VAUX[4]ZM8620_V2USB_D-GND[11]GND[3]UART1_DCDUART1_TXNC Figure 4–2 PIN Configuration Diagram 4.1.3 PIN Description Table 4–2 PIN Interface Definition

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 16 错误！未找到用源。 ZM8620_V2 Pin Standard PIN ZM8620_V2 PIN Description I/O Remark 1 WAKE# WAKE# Wake up the system host DO -- 2 3.3Vaux VDD_3V3 3.3V supply DI 3.1V-3.6V，The typical value is 3.3V 3 COEX1 SPI_SDI SPI data signal DI 3.3V 4 GND GND Ground -- Ground pin 5 COEX2 SPI_SDO SPI data signal DO 3.3V 6 1.5V SPI_CS SPI segment signal DO 3.3V 7 CLKREQ# SPI_CLK SPI synchronization clock -- 3.3V 8 UIM_PWR VREG_UIM USIM card power supply DO 2.85V/1.8V for SIM card 9 GND GND Ground -- Ground pin 10 UIM_DATA UIM_DATA USIM card data signal DI/DO 2.85V/1.8V.this signal requires a pull-up resistor on the host board 11 REFCLK- UART1_RX UART port receive data DI 3.3V 12 UIM_CLK UIM_CLK USIM card clock signal DO 2.85V/1.8V 13 REFCLK+ UART1_TX UART port transmit data DO 3.3V 14 UIM_RESET UIM_RST USIM card reset signal DO 2.85V/1.8V 15 GND GND Ground -- Ground pin 16 UIM_VPP UATR1_DSR Data is ready DO 1.8V 17 Reserved(UIM_C8) UART1_RI Ringtone indicator DO 1.8V 18 GND GND Ground -- Ground pin 19 Reserved(UIM_C4) GPIO_79 The standby and wakeup of module -- -- 20 W_DISABLE# W_DISABLE_N Active low signal. This signal is used by the system to disable radio operation on add-in cards that implement radio frequency applications. DI Active low 21 GND GND Ground -- Ground pin 22 PERST# PERST# Module resetting DI 1.8V 23 PERn0 UART1_CTS UART port, clear to send DI 1.8V 24 +3.3Vaux VDD_3V3 3.3V supply DI 3.1V-3.6V，The typical value is 3.3V 25 PERp0 UART1_RFR UART port, preparing to receive DO 1.8V 26 GND GND Ground -- Ground pin 27 GND GND Ground -- Ground pin

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 17 错误！未找到用源。 ZM8620_V2 Pin Standard PIN ZM8620_V2 PIN Description I/O Remark 28 +1.5V GPIO General Purpose Input/Output DI/DO 1.8V 29 GND GND Ground -- Ground pin 30 SMB_CLK NC -- -- -- 31 PETn0 UART1_DTR UART1 data terminal ready DI 1.8V 32 SMB_DATA NC -- -- -- 33 PETp0 UART1_DCD UART1 carrier wave detection DO 1.8V 34 GND GND Ground -- Ground pin 35 GND GND Ground -- Ground pin 36 USB_D- USB_DM USB differential signal, minus side DI/DO -- 37 GND GND Ground -- Ground pin 38 USB_D+ USB_DP USB differential signal, positive side DI/DO -- 39 +3.3Vaux VDD_3V3 3.3V supply DI 3.1V-3.6V，The typical value is 3.3V 40 GND GND Ground -- Ground pin 41 +3.3Vaux VDD_3V3 3.3V supply DI 3.1V-3.6V，The typical value is 3.3V 42 LED_WWAN# LED_PWR Open drain，active low signals. This signal is used to provide status indicator DO -- 43 GND GND Ground -- Ground pin 44 LED_WLAN# NC -- -- -- 45 Reserved Reserved -- -- -- 46 LED_WPAN# SLIC_INT exclusive use for routing adaptation DO -- 47 Reserved Reserved -- -- -- 48 +1.5V SLIC_RESET exclusive use for routing adaptation DO -- 49 Reserved Reserved -- -- -- 50 GND GND Ground Ground pin 51 Reserved Reserved -- -- -- 52 +3.3Vaux VDD_3V3 3.3V supply DI 3.1V-3.6V，The typical value is 3.3V

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 18 错误！未找到用源。 ZM8620_V2  NOTE: The voltage design of external circuit interfaces should match that of the ZM8620_V2 PINs. In the Table 4-2, the Power supply of ZM8620_V2 has been updated between 3.1V-3.6V, and the typical value is 3.3V at present. While in ZM8620 module, the Power supply is 3.4-4.2V, and typical is 3.8V before. In ZM8620_V2, the signal of pin 6,11,13,16,17,23,25,28,30~33,44,46.48 is different from that of module ZM8620. 4.2 Feature of Interface Power Level 4.2.1 Power Level of IO Interface Table 4–3 Power Level Range of Digital Signal Signal Description Min Max Units VIH High level of input voltage 0.65*VDD_PX VDD_PX+0.3 V VIL Low level of input voltage -0.3 0.35* VDD_PX V VOH High level of output voltage VDD_PX-0.45 VDD_PX V VOL Low level of output voltage 0 0.45 V  NOTE: 1. The high/low PWL of input voltage should comply with the range in the table. 2. The high/low PWL of external interface signal should match the interface PWL of ZM8620_V2. 3. VDD_PX indicates the typical voltage of each Pin specified in Table 4-2.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 19 错误！未找到用源。 ZM8620_V2 4.3 Power Interface 4.3.1 Description of Power PINs Power VCC (PIN No: 2, 24, 39, 41, 52). This is the positive signal of 3.3V power supply. GND signal (PIN No: 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50). This is the power ground and signal ground of the module, which needs to be connected to the ground on the system board. If the GND signal is not connected completely, the performance of the module will be affected. 4.3.2 Requirement of Power Supply The power supply is recommended to be within the range of 3.1~3.6V. If the network is in poor situation, the antenna will transmit at the maximum power, and the transient maximum peak current less than 2G mode can reach as high as 1.8A. So the power supply capacity for peak current needs to be above 2.5A, and the average peak current needs to be above 0.9A. 4.4 (U)SIM Card Interface 4.4.1 Description of PINs ZM8620_V2 module baseband processor integrates the (U)SIM card interface. The signals on SIM card interface is as shown in Figure 4-3. Figure 4–3 (U)SIM Card Signal Connection Circuit VREG_UIM VREG_UIM

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 20 错误！未找到用源。 ZM8620_V2  NOTE: The PCB wiring of UIM card should be laid closely around the module as possible as you can, and the ESD component should be put near the UIM card socket by the customer. Table 4–4 Definition & Description of (U) SIM Card Signal Group PIN Signal Name Signal Description 8 VREG_UIM USIM card power, output from the module 10 UIM_DATA USIM card DATA signal, two-way signal 12 UIM_CLK USIM card clock signal, output from the module 14 UIM_RST USIM card reset signal, output from the module 4.4.2 Electric Feature The signals of (U)SIM card signal group are described in Table 4-4. As the USIM card console is placed on the system board side, be sure to add the ESD protection during the design. To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it is recommended to place (U)SIM card console close to the (U)SIM card interface, to prevent the wiring from being too long, which might seriously distort the waveform and thus affect the signal integrity. It is recommended to make the grounding protection for UIM_CLK and UIM_DATA signal wiring. Cascade one 0.1uF and 33pF capacitor between VREG_UIM and GND, and cascade a 33pF bypass capacitor between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals. It is recommended to cascade a 20ohm resistance on UIM_DATA signal. And UIM_DATA must be pulled up via a 20K ohm resistance to VREG_UIM. 4.5 USB2.0 Interface 4.5.1 Description of PINs ZM8620_V2 has the high-speed USB2.0 interface,. USB is connected to the system board side via the PCI-E interface, to communicate with the processor on the system board side. Its PINs are PIN36 (USB_DM), PIN38 (USB_DP). The USB interface can be mapped to difference ports, such as Diagnostics port to capture the log, AT port is used to complete AT command interaction with the AP side.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 21 错误！未找到用源。 ZM8620_V2 4.5.2 Electric Feature The USB interface of Module complies with the USB2.0 specifications and the electrical characteristics. During the PCB wiring, the wires must be parallel, the distance should be as short as possible and as far away as possible from the antenna, and it‘s enveloped by the ground wires to avoid strong interference sources. USB_DP and USB_DM should be wired strictly in the differential mode, and the length difference of the two signals is within 1mm.  NOTE: The differential resistance needs to be controlled within 90Ω, and the difference cannot exceed 5%. It is recommended to cascade the high-speed common-mode rejection filter on the USB differential traces. If some of the trace is exposed, it is recommended to add the ESD protection device, and the junction capacitor of the ESD protection device should better be kept within 1.5pF. Large junction capacitor will distort the waveform, and affect the bus communication. 4.6 UART Interface The UART interface is used as MODEM port by default which is occupied by data service. 4.6.1 Description of PINs The wireless module ZM8620_V2 supports the full UART interface with flow control function, which complies with the RS-232 interface protocol, and supports the 8-wires serial bus interface or 2-wires serial interface. The module can perform the serial communication and AT instruction interaction with external. This UART port supports the programmable data width, programmable data stop bit and programmable parity check, and has an independent TX and RX FIFOs (512 bytes for each). For the normal UART application (non-Bluetooth), the maximum baud rate is 230400bps, and the default baud rate is 115200bps. The PINs are defined as shown in Table 4-5. Table 4–5 Definition of UART Signal PIN Signal Name Description Level 11 UART1_RX UART port RX receive data Power level is 3.3V. 13 UART1_TX UART port TX transmit data Power level is 3.3V.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 22 错误！未找到用源。 ZM8620_V2 16 UART1_DSR Data is ready Power level is 1.8V. 17 UART1_RI Ringtone indicator 23 UART1_CTS UART port CTS clear to send 25 UART1_RFR UART port RFR preparing to receive 31 UART1_DTR DTE is ready 33 UART1_DCD Carrier detection 4.6.2 Electric Feature During the software interconnection process, there is a method of capturing logs, and it is recommended that this interface be kept during the design and the testing point be reserved. If the module is used together with the application processor, and the PWL of it matches with the power level of the module, the connection mode is as shown in Figure 4-4. The 4-wires or 2-wires mode can also be used for connection. If it does not match the PWL of AP interface, it is recommended to add the PWL conversion circuit. Otherwise, it might cause unstable com ports because the level is not matched or cause damage to the module because it is at high level for long time. The connection of ZM8620_V2 UART port and standard RS-232-C interface can be through the chip like class 232. The design involves the transformation of TTL level and EIA level. We recommend to use the chip of NLSX5014MUTAG. If using the 2-byte serial bus interface, MAX3232 is recommended, and if using the 8-byte serial bus interface, SP3238 or MAX3238 is recommended. The connection mode is as shown in Figure 4-5. ZM8620_V2 APRXDRXDTXDTXDCTSRFR CTSRFRDTRDSRDSRDTRDCDRI RIDCDGND GND Figure 4–4 Module Serial Port & AP Application Processor

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 23 错误！未找到用源。 ZM8620_V2 TTL-RS232 level translator SP3238 MAX3238ZM8620_V2module1.8V-TTL level translator NLSX5014MUTAGUART_DCDUART_DSRUART_CTSUART_RFRUART_DTRUART_RIGNDRS232_DCDRS232_DSRRS232_TXDRS232_CTSRS232_RXDRS232_RTSRS232_DTRRS232_RIGND123456789User Board Female DB9Note:UART_RFR is equal To UART_RTS.The level of UART1_Rx and UART1_TX is 3.3V, the other pins of UART is 1.8V and needs the TTL level translatorUART_TXDUART_RXD Figure 4–5 The connection of ZM8620_V2 UART and Standard RS-232-C interface 4.7 SPI Interface The SPI signal interface is used to control PCI voices. The SPI_CLK clock is 127.2kHz. Pin No: 3/5/6/7 are SPI control signals. Table 4-6 describes detailed definition for each signal. The system board side needs to convert the power level of SPI_SDI (SPI control output signal cable on the system board side) into 3.3V, to comply with the high power level VIH input requirements. Table 4–6 Definition and Description of SPI Control Signal Group PIN Signal Name I/O Signal Description 3 SPI_SDI I SPI data signal, ZM8620_V2 input, input high power level is VIH, and low power level is VIL. 5 SPI_SDO O SPI data signal, ZM8620_V2 output, input high power level is VOH, and low power level is VOL. 6 SPI_CS O SPI chip select pin, ZM8620_V2 output, input high power level is VOH, and low power level is VOL. 7 SPI_CLK -- SPI synchronization clock, 100kHz, output by ZM8620_V2, high power level is VOH, and low power level is VOL.  NOTE: VIH, VIL, VOH, and VOL comply with the power I/O interface power level requirements in 4.2.1.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 24 错误！未找到用源。 ZM8620_V2 4.8 Reset Signal PERST# The PERST# signal (PIN No: 22) is the system reset signal of ZM8620_V2, active low. Table 4-7 illustrates its control logic. It shows that pull down the reset key (PERST#) to 100ms will reset the module.  NOTE: Do not directly connect this signal to the positive end of power supply. Table 4–7 Definition and Description of PERST# Signal PERST# ZM8620_V2 Status ‗1‘ ZM8620_V2 is in the normal working status. ‗0‘ and ≥100ms RF is in the OFF mode, ZM8620_V2 is reset. Figure 4–6 Reference Circuit Design of PERST# Signal 4.9 WAKE# Signal Figure 4-7 illustrates the reference connection circuit of WAKE# signal. The WAKE# signal (PIN No.: 1) is an output signal, active low level or low fall edge. This signal is a reserved signal for ZM8620_V2 to wake up the system host. ZM8620_V2 pulls up the power level to VDD_3V3 internally by the 10Kohm resistance. It is recommended to connect the 47ohm resistance to the GPIO PIN on the main chip (If this GPIO PIN is on the system side, it can wake up the host). ZM8620_V2

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 25 错误！未找到用源。 ZM8620_V2  NOTE: Do not directly connect this signal to the positive end of power supply. Figure 4–7 Reference Connection Circuit of WAKE# Signal 4.10 W_DISABLE_N Signal The W_DISABLE_N signal (PIN No: 20) is the input signal of ZM8620_V2, active low. Table 4-8 describes its control logic. Table 4–8 Definition and Description of W_DISABLE_N Signal W_DISABLE_N ZM8620_V2 Status ‗1‘ RF is enabled. ‗0‘ RF is disabled. The W_DISABLE_N signal is pulled up by the 150Kohm resistance to 3.3V inside ZM8620_V2, so the system side does not pull up this circuit any more.  NOTE: Do not directly connect this signal to the positive end of power supply. Figure 4-8 illustrates the reference circuit design of W_DISABLE_N signal. ZM8620_V2

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 26 错误！未找到用源。 ZM8620_V2 Figure 4–8 Reference Circuit Design of W_DISABLE_N Signal 4.11 Recommended Upgrade Methods It‘s recommended to use the one-click software upgrade tool to upgrade through the USB port provided by ZTEWelink in the Windows system. If the customers want to upgrade the module in other operation systems, ZTEWelink provides the corresponding reliable tools too. ZM8620_V2

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 27 错误！未找到用源。 ZM8620_V2 5 Electric Feature 5.1 Power Feature 5.1.1 Power Supply The input voltage range of the module is DC 3.1V~3.6V, and the typical value is 3.3V, as shown in Table 5-1. Table 5–1 Input Voltages Parameter Min Typical Max Input voltage 3.1V 3.3V 3.6V 5.1.2 Working Current The working current range of the module is as shown in Table 5-2 to Table 5-4. The tables provide the working power consumption under LTE and WCMA mode. As the power consumptions are affected by many factors, it‘s normal that there are some differences when tested by users, and these tables can only be viewed as one example. Table 5–2 Averaged standby DC power consumption Mode Bands Test value (mA) Remark HSDPA/WCDMA UMTS bands TBD Sleep mode GSM/GPRS/EDGE GSM bands TBD Sleep mode LTE LTE bands TBD Sleep mode Note: assumes USB bus is fully suspended during measurements. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 5–3 DC power consumption in UMTS mode Power Consumption of R99 BAND BAND1 BAND2 BAND5 BAND8 Power Consumption (Unit: mA) Maximum Transmit power (23.32dBm) TBD TBD TBD TBD

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 28 错误！未找到用源。 ZM8620_V2 Power Consumption of HSDPA Power Consumption with HS-DPCCH (HSDPA) Maximum Transmit power (dBm) 22.62 22.56 22.04 22.51 Power Consumption (mA) TBD TBD TBD TBD Power Consumption of HSUPA Power Consumption with HS-DPCCH (HSUPA) Maximum Transmit power (dBm) 22.2 21.9 21.7 21.7 Power Consumption (mA) TBD TBD TBD TBD Power Consumption of HSPA+ Power Consumption (Unit: mA) Maximum Transmit power (22.89dBm) TBD TBD TBD TBD Table 5–4 DC power consumption in LTE mode (Unit: mA) Test band BAND 1 BAND 2 BAND 4 BAND 5 BAND 7 BAND 8 BAND 12 TDD BAND38 BW 10M band channel 300 650 2175 2450 3400 3500 5130 38200 Power Consumption QPSK 1RB MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD QPSK 12RB MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD QPSK 50RB MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD 16QAM 12RG MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD 16QAM 50RG MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD  NOTE: Under different environments and conditions (for example: under different band channel, transmit power, power level etc.), the testing values of Table 5-3 and Table 5-4 might be slightly different. Take the actual situation as the reference. 5.2 Power-on/Resetting Flow Table 5–5 Power-on/Resetting Period

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 29 错误！未找到用源。 ZM8620_V2 No. Status Average Remark 1 Response time of power-on and power-off About 12s From the time of module power-on to port initialization 2 Searching network upon power-on About 15s Depending on the actual network situation Note: 1. The specific power-on/power-off response time depends on the actual software versions. The time of searching network upon power-on differs according to the network quality. The above values are only an example. 2. By default, the module is started up upon power-on. 5.3 Resetting Flow The failing edge of PERST# reset signal initiates a reset process. The module is reset by driving this pin with a low pulse. 10PERST# signal 100ms Resetting at the edge of rising Figure 5–1 Module Reset Flow

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 30 错误！未找到用源。 ZM8620_V2 6 Related Test & Testing Standard 6.1 Testing Reference The related tests of ZM8620_V2 comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related testing standards for ZM8620_V2. Table 6–1 Testing Standard Testing Standard Document Reference IEC6006826 Environmental testing-Part2.6:Test FC: Sinusoidal Vibration IEC60068234 Basic environment testing procedures part2. IEC60068264 Environmental testing-part2-64: Test FH: vibration, broadband random and guidance. IEC60068214 Environmental testing-part 2-14: Test N:change of temperature. IEC60068229 Basic environmental testing procedures-part2: Test EB and guidance. IEC6006822 Environmental testing-part2-2:Test B:dry heat IEC6006821 Environment testing-part2-1: Test A: cold. GB/T 15844.2 MS telecommunication RF wireless phone-set environment requirement & experimental method – part 4: Strict level of experimental condition GB/T 2423.17 Basic environment experiment of electronic products-Experiment Ka: Salt mist experiment method GB/T 2423.5 Basic environment experiment of electronic products-Part2:Experiment method Try Ea & Introduction: Shock GB/T 2423.11 Basic environment experiment of electronic products-Part2:Experiment method Try Fd: Broad frequency band random vibration (General requirement) TIA/EIA 603 3.3.5 TIA Standard-part3-5:Shock Stability Note: 1. IECL International Electro technical Commission; 2. GB/T: Recommended national standard 6.2 Description of Testing Environment The working temperature range of ZM8620_V2 is divided into the normal working temperature range

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 31 错误！未找到用源。 ZM8620_V2 and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal. Under the extreme temperature range, the RF index basically complies with the 3GPP specifications, and the quality of data communication is affected to a certain extent, but its normal function is not affected. ZM8620_V2 has passed the EMC test. Table 6–2 is the requirement for the testing environment, and Table 6–3 lists out the instruments and devices that might be used during the test. Table 6–2 Testing Environment Working Condition Min Temperature Max Temperature Remark Normal working condition -10° C 60° C All the indexes are good. Extreme working condition -20°C 70°C Some indexes become poorer. Storage -40° C 85° C Storage environment of ZM8620_V2 Table 6–3 Testing Instrument & Device Testing Item Instrument & Device RF test Comprehensive testing device RF cable Tower antenna Microwave darkroom High/Low-temperature running & storage test High/Low-temperature experimental box Temperature shock test Temperature shock experimental box Vibration test Vibration console 6.3 Reliability Testing Environment The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters. Table 6–4 Reliability Feature

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 32 错误！未找到用源。 ZM8620_V2 Test Standard Test Item Test Condition Test Reference Random Oscillation Frequency range: 5-20Hz, PSD:1.0m2/s3; Frequency range: 20-200Hz, -3dB/oct; On the 3 axis, 1 hour for each axis IEC 68-2-6 Shock Testing Half sine wave shock Acceleration: 20g Short time: 11ms On 6 axis, one shock on each axis (±x, y and z) TIA/EIA 603 3.3.5 GB/T 15844.2.4.1 Temperature Shock Low temperature: -40°C ±2°C High temperature: +80°C ±2°C Temperature changing time: less than 30 seconds Testing duration: 2 hours Cycles: 10 IEC 68-2-14 Na High-temperature Working Temperature: +60°C Testing duration: 24h ZTE standard Low-temperature Working Temperature: -10°C Testing duration: 24h ZTE standard High-temperature and high humidity Temperature: +55°C Humidity: 95% Duration: 48 hours ZTE standard High-temperature Storage Temperature: 85°C Testing duration: 24h IEC 68-2-1 Ab Low-temperature Storage Temperature: -40°C Testing duration: 24h IEC 68-2-2 Bb 6.4 Reliability Test Result Table 6–5 Temperature Testing Result under Windless Environment Mode Ambient Temperature Voltage Transmission power Duration Results GPRS Class 10 +25°C 3.3V Max ≥1 hour Pass EDGE Class 12 +25°C 3.3V Max ≥1 hour Pass

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 33 错误！未找到用源。 ZM8620_V2 WCDMA +25°C 3.3V Max ≥1 hour Pass LTE +25°C 3.3V Max ≥1 hour Pass Table 6–6 Test Results of High/low Temperature Running and Reliability Test Test Item Test Conditions and Criteria Test Items Results Random vibration Refer to Table 6-4 RF test and function test Pass Impact test Refer to Table 6-4 RF test and function test Pass Temperature impact Refer to Table 6-4 RF test and function test Pass Running at low temperature Refer to Table 6-4 RF test and function test Pass Running at high temperature Refer to Table 6-4 RF test and function test Pass Running at the limit of low temperature Refer to Table 6-4 RF test and function test Pass Running at the limit of high temperature Refer to Table 6-4 RF test and function test Pass Storage at low temperature Refer to Table 6-4 RF test and function test Pass Storage at high temperature Refer to Table 6-4 RF test and function test Pass

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 34 错误！未找到用源。 ZM8620_V2 7 RF Specifications The following content is the description of module radio frequency performance. 7.1 Technical Specification for UMTS Mode Radio Frequency 7.1.1 Maximum Transmission Power In the normal test environment, UMTS 2100/1900/850/900/(1700)MHz maximum output power meets the requirement in Table 7-1. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 7–1 Maximum Transmission Power Power grade Maximum output power Tolerance value Test value Class 3 24dBm +1/-3dBm TBD 7.1.2 Receiving Sensitivity UMTS 2100/1900/850/900/(1700)MHz receiving sensitivity meets 3GPP TS 34.121 protocol requirement. Under the specification that BER does not exceed 0.001, it meets the requirement in Table 7-2. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 7–2 Receiving Sensitivity Reference Table Operating band Unit DPCH_Ec <REFSENS> <REFIOR> Test value  dBm/3.84 MHz -117 -106.7 TBD  dBm/3.84 MHz -115 -104.7 TBD  dBm/3.84 MHz -117 -106.7 TBD  dBm/3.84 MHz -115 -104.7 TBD  dBm/3.84 MHz -114 -104.7 TBD NOTE 1: For Power class 3 this shall be at the maximum output power NOTE 2: For Power class 4 this shall be at the maximum output power NOTE 3: For the UE which supports both Band  and Band  operating frequencies, the reference sensitivity level of -114.5 dBm DPCH_Ec<REFSENS> shall apply for Band .

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 35 错误！未找到用源。 ZM8620_V2 The corresponding <REFIOR> is -104.2 dBm 7.1.3 Spurious Specification Spurious emission meets 3GPP TS 34.121 protocol requirement. The receiver spurious emission power refers to the spurious power generated or amplified by the receiver, which is tested from the antenna connector. The spurious emission shall meet the requirements in Table 7-3 and Table 7-4: Table 7–3 General Requirement of Receiver Spurious Emission Frequency band Resolution rate bandwidth Minimum requirement 9 kHz  f < 1 GHz 100 kHz -57 dBm 1 GHz  f < 12.75 GHz 1 MHz -47 dBm Table 7–4 Additional Spurious Emission Requirement Frequency band Measurement bandwidth Minimum requirement 1920 MHz  f  1980 MHz 3.84 MHz -60 dBm 2110 MHz  f  2170 MHz 3.84 MHz -60 dBm 7.2 Technical Specification of GSM Mode Radio Frequency 7.2.1 Maximum Transmission Power In the normal test environment, GSM: 1900/1800/900/850MHz maximum output power meets the requirement in Table 7-5. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 7–5 Maximum Transmission Power Operating band Power control level Power class Maximum output power Tolerance value Test Value  2 Class 2 30dBm ±2dBm TBD  2 Class 2 30dBm ±2dBm TBD

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 36 错误！未找到用源。 ZM8620_V2  2 Class 4 33dBm ±2dBm TBD  2 Class 4 33dBm ±2dBm TBD 7.2.2 Receiving Sensitivity GSM 1900/1800/900/850MHz receiving sensitivity meets 3GPP TS 34.121 protocol requirement. Under the specification that BER does not exceed 2.24, it meets the requirement smaller than -102dBm. It meets the requirement in Table 7-6. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 7–6 Reference Table of Receiving Sensitivity Operating Band Unit 3GPP Protocol Claim Test value GSM850 dBm/3.84 MHz ≤-102dBm TBD GSM900 dBm/3.84 MHz ≤-102dBm TBD GSM1800 dBm/3.84 MHz ≤-102dBm TBD GSM1900 dBm/3.84 MHz ≤-102dBm TBD 7.3 Technical Specification of LTE Mode Radio Frequency 7.3.1 Maximum Transmission Power The maximum output power of LTE FDD, LTE TDD in the normal test environment meets Table 7-7 requirement. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 7–7 Maximum Transmission Power Power grade Maximum output power Tolerance value Test value Class 3 23 dBm +2.7/-2.7dBm 21.4 dBm 7.3.2 Receiving Sensitivity LTE FDD/TDD receiving sensitivity meets 3GPP TS 36.101 protocol requirement. Under the specification that the throughput is not smaller than 95% of the maximum throughput, it meets Table 7-8 requirement. The test values are the average of some test samples. Under different environments, the

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 37 错误！未找到用源。 ZM8620_V2 testing results might be slightly different. Take the actual situation as the reference. Table 7–8 Receiving Sensitivity Reference Table E-UTRA Band Channel bandwidth Test value (dBm) 1.4 MHz (dBm) 3 MHz (dBm) 5 MHz (dBm) 10 MHz (dBm) 15 MHz (dBm) 20 MHz (dBm) Duplex Mode 1 - - -100 -97 -95.2 -94 FDD TBD 2 -102.7 -99.7 -98 -95 -93.2 -92 FDD TBD 3 -101.7 -98.7 -97 -94 -92.2 -91 FDD -- 4 -104.7 -101.7 -100 -97 -95.2 -94 FDD TBD 5 -103.2 -100.2 -98 -95 FDD TBD 6 -100 -97 FDD -- 7 -98 -95 -93.2 -92 FDD TBD 8 -102.2 -99.2 -97 -94 FDD TBD 9 -99 -96 -94.2 -93 FDD -- 10 -100 -97 -95.2 -94 FDD -- 11 -100 -97 FDD -- 12 -101.7 -98.7 -97 -94 FDD TBD 13 -97 -94 FDD -- 14 -99.2 -97 -94 FDD -- … -- 17 -102.2 -99.2 -97 -94 FDD -- 18 -100 -97 -95.2 FDD -- 19 -100 -97 -95.2 FDD -- 20 -97 -94 -91.2 -90 FDD -- 21 -100 -97 -95.2 FDD -- … -- 33 -100 -97 -95.2 -94 TDD -- 34 -100 -97 -95.2 -94 TDD -- 35 -106.2 -102.2 -100 -97 -95.2 -94 TDD -- 36 -106.2 -102.2 -100 -97 -95.2 -94 TDD -- 37 -100 -97 -95.2 -94 TDD -- 38 -100 -97 -95.2 -94 TDD TBD 39 -100 -97 -95.2 -94 TDD -- 40 -100 -97 -95.2 -94 TDD --

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 38 错误！未找到用源。 ZM8620_V2 41 [-100] [-97] [-95.2] [-94] TDD -- Note 1: The transmitter shall be set to maximum output power level as defined in clause 6.2.5 in the protocol of 3GPP TS 36.101 Note 2: Reference measurement channel is specified A.3.2 with one sided dynamic OCNG Pattern OP.1 FDD/TDD as described in Annex A.5.1.1/A.5.2.1 in the protocol of 3GPP TS 36.101 Note 3: The signal power is specified per port Note 4: For the UE which supports both Band 3 and Band 9 the reference sensitivity level of Band 3 + 0.5 dB is applicable for band 9 Note 5: For the UE which supports both Band 11 and Band 21 the reference sensitivity level is FFS. 7.3.3 Spurious Specification Spurious emission meets 3GPP TS 36.101 protocol requirement. The receiver spurious emission power refers to the spurious power generated or amplified by the module, which is tested from the antenna connector. The spurious emission shall meet the requirement of Table 7-9 and Table 7-10: Table 7–9 General Requirement of Receiver Spurious Emission Frequency range Maximum level Measurement bandwidth 9 kHz  f < 150 kHz -36 dBm 1 kHz 150 kHz  f < 30 MHz -36 dBm 10 kHz 30 MHz  f < 1000 MHz -36 dBm 100 kHz 1 GHz  f < 12.75 GHz -30 dBm 1 MHz Table 7–10 UE Co-existence Spurious Emission Requirement E-UTRA Band Spurious emission Protected band Frequency range (MHz) Level (dBm) Bandwidth (MHz) Comment 1 E-UTRA Band 1, 3, 7, 8, 9, 11, 34, 38, 40 FDL_low - FDL_high -50 1 Frequency range 860-895 -50 1 Frequency range 1884.5-1919.6 -41 0.3 Note6,Note7 1884.5-1915.7 Note 6, Note8 E-UTRA band 33 1900-1920 -50 1 Note 3 E-UTRA band 39 1880-1920 -50 1 Note 3 2 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 39 错误！未找到用源。 ZM8620_V2 3 E-UTRA Band 1, 3, 7, 8, 9, 11, 33, 34, 38 FDL_low- FDL_high -50 1 4 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 5 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 6 E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high -50 1 Frequency range 860-875 -37 1 Frequency range 875-895 -50 1 Frequency range 1884.5-1919.6 -41 0.3 Note7 1884.5-1915.7 Note8 7 E-UTRA Band 1, 3, 7, 8, 33, 34 FDL_low- FDL_high -50 1 E-UTRA Band 38 2570-2620 -50 1 Note 3 8 E-UTRA Band 1, 8, 7, 33, 34, 38, 39, 40 FDL_low- FDL_high -50 1 E-UTRA band 3 1805-1830 -50 1 Note 4 E-UTRA band 3 1805-1880 -36 0.1 Note 2,4 E-UTRA band 3 1830-1880 -50 1 Note 4 E-UTRA band 7 2640-2690 -50 1 Note 4 E-UTRA band 7 2640-2690 -36 0.1 Note 2,4 9 E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high -50 1 Frequency range 860-895 -50 1 Frequency range 1884.5-1919.6 -41 0.3 Note7 1884.5-1915.7 Note8 10 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 11 E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high -50 1 Frequency range 860-895 -50 1 Frequency range 1884.5-1919.6 -41 0.3 Note7 1884.5-1915.7 Note8 12 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 13 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 Frequency range 763-775 -35 0.00625 14 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high -50 1 Frequency range 763-775 -35 0.00625 17 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low FDL_high -50 1 …

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 40 错误！未找到用源。 ZM8620_V2 33 E-UTRA Band 1, 3, 8, 34, 38, 39, 40 FDL_low- FDL_high -50 1 Note 5 34 E-UTRA Band 1, 3, 7, 8, 9, 11, 33, 38,39, 40 FDL_low- FDL_high -50 1 Note 5 Frequency range 860-895 -50 1 Frequency range 1884.5-1919.6 -41 0.3 Note7 1884.5-1915.7 Note8 35 36 37 38 E-UTRA Band 1,3, 33, 34 FDL_low- FDL_high -50 1 39 E-UTRA Band 34, 40 FDL_low- FDL_high -50 1 40 E-UTRA Band 1, 3, 33, 34, 39 FDL_low- FDL_high -50 1 Note 1 FDL_low and FDL_high refer to each E-UTRA frequency band specified in Table 5.5-1 in the protocol of 3GPP TS 36.101 2 As exceptions, measurements with a level up to the applicable requirements defined in Table 7-9 are permitted for each assigned E-UTRA carrier used in the measurement due to 2nd or 3rd harmonic spurious emissions. An exception is allowed if there is at least one individual RE within the transmission bandwidth (see Figure 5.6-1 in the protocol of 3GPP TS 36.101) for which the 2nd or 3rd harmonic, i.e. the frequency equal to two or three times the frequency of that RE, is within the measurement bandwidth. 3 To meet these requirements some restriction will be needed for either the working band or protected band 4 Requirements are specified in terms of E-UTRA sub-bands 5 For non synchronized TDD operation to meet these requirements some restriction will be needed for either the working band or protected band 6 Applicable when NS_05 in section 6.6.3.3.1 in the protocol of 3GPP TS 36.101 is signaled by the network. 7 Applicable when co-existence with PHS system working in. 1884.5-1919.6MHz. 8 Applicable when co-existence with PHS system working in 1884.5-1915.7MHz.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 42 错误！未找到用源。 ZM8620_V2 The PCB layout is shown in the Figure 8-2. Figure 8–2 Recommended PCB layout  NOTE: The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13 of I-PEX by ZM8620 before. 8.2 Proposal on Layout of Product in Terminal Product The module layout among other terminal products should take full consideration of the electric magnetic compatibility. As the types of terminal products vary and their circuit layouts are different, when considering the module layout, we should reduce the electric magnetic interference from other devices upon the module. Taking 3G Internet-access laptop as an example, during the layout of laptops, make sure that the module is not adjacent to the switch power or the high-speed signal cable, and well protect the cabling of these interference sources. At the same time, keep the antenna and the coaxial cables of network cables and antenna far away from the interference sources. Keep the module away from the devices that have a large heat-radiating capacity such as CPU, hard disk and south bridge, to guarantee that heat can be radiated effectively.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 43 错误！未找到用源。 ZM8620_V2 8.3 Antenna Dimensions and Location The dimensions of different terminal products are different, so they impose different requirements upon the performance of antenna. The dimensions and location of antennas are also different. Taking 3G Internet-access laptop as an example, it is recommended that the antenna be placed on the top of LCD. 8.4 Diversity Antenna Design ZM8620_V2 supports diversity receiving function, and if it is necessary to support diversity, the notebook needs to add diversity antenna. The design method of the diversity antenna is consistent with the main antenna, and its efficiency index is allowed to reduce by 3dB. The isolation of the main antenna and the diversity antenna is required to be bigger than 12dB.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 44 错误！未找到用源。 ZM8620_V2 9 Debugging Environment and Method In the process of the actual implementation, it is necessary to adopt the switching board to convert MINI PCIE module interface into the standard USB interface to connect the host for debugging verification. It is also necessary to connect external power supply adaptor to provide the module with sufficient current, and the diagram for the switching board is as follows: Module boardComputer hostSwitching boardPower supply adapterPCI Express Mini Card Interface USB PortAC Figure 9–1 The diagram for the switching board 9.1 Debugging Board Figure 9-2 shows the module debugging & installation method. The debugging board is mainly used to debug the basic functions of ZM8620_V2 module, such as downloading the JTAG program, resetting the module, powering off and shutting down RF, LED indicator display, making a call or browsing web pages via computer UI by inserting the USIM card into the switching board. The USB interface supplies power to the debugging board, provides it to the module after LDO conversion, and directly supplies the power to the module by the power socket on the board.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 45 错误！未找到用源。 ZM8620_V2 Figure 9–2 Debugging Board Note: 1 – UIM card console; 2 –JTAG downloading interface; 3- DC power interface; 4 – USB interface; 5 – LED indicator; 6 - PON_RESET_N button (module resetting); 7 –W_DISABLE_N button (RF switch) 9.2 Interfaces on Debugging Board 9.2.1 JTAG Interface The JTAG interface can be used to download and debug the firmware program. This interface is reserved in the module of ZM8620_V2. 9.2.2 USB Interface The USB2.0 interface on the debugging board is connected to the PCI-E interface on ZM8620_V2. 9.2.3 Power-supply Interface The USB interface as illustrated in Figure 9-2 supplies power, provides the 3.3V power to the module after LDO conversion, and directly supplies the 3.3V power to the module by the power socket on the board. Module ZM8620_V2 1 2 3 4 5 6 7

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 46 错误！未找到用源。 ZM8620_V2 9.2.4 USIM Card Console Interface As shown in Figure 9-2, 1 the USIM card console is the 5PIN USIM card console on the conversion board, connecting to: power, ground, UIM_DATA, USIM_CMD and UIM_CLK. It supports the 1.8V/3V USIM card. 9.2.5 PON_RESET_N Button This button corresponds to the PON_RESET_N PIN of the PCI-E interfaced. The user presses the button to reset the module. 9.2.6 W_DISABLE_N Button This button corresponds to the W_DISABLE_N PIN of the PCI-E interface. The user presses this button to enable or disconnect RF, so as to perform the debugging of this PIN. 9.2.7 LED Indicator The LED indicator on the debugging board is connected to the LED_WWAN_N interface of ZM8620_V2. By controlling the indicator, the user can debug the function of this interface.

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 47 错误！未找到用源。 ZM8620_V2 10 Package System The ZM8620_V2 modules are wrapped with anti-static shielding bags, which is packaged on EPE trays of 6 pieces each. And these modules are put into cardboard box in a set of 10 trays. Each cardboard box is with 60 modules typically. The package process of ZM8620_V2 modules is shown as the Figure below. The unit of dimensions is mm. Figure 10–1 Package process of ZM8620_V2 modules ×10 trays Cardboard box

Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 48 错误！未找到用源。 ZM8620_V2 11 Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal incorporating ZM8620_V2 module. Manufacturers of the cellular terminal should send the following safety information to users, operating personnel and to incorporate these guidelines into all manuals supplied with the product. The use of this product may be dangerous and has to be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, aircrafts, airports, etc, switch off before boarding an aircraft. Make sure the cellular terminal is switched off in these areas. The operation of wireless appliances in the hospitals, aircrafts and airports are forbidden to prevent interference with communication systems.  Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as gasoline stations, oil refineries, etc make sure that wireless devices are turned off. It‘s the responsibility of users to enforce other country regulations and the specific environment regulations. And ZTEWelink does not take on any liability for customer failure to comply with these precautions.

12.NOTICE Note1：This device complies with Part 15 of the FCC Rules，Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note2: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. Note3: For EUT which intended use is at least 20 cm between human body and antenna. Note4: Label of The End Product The final end product must be labeled in a visible are with the following Contains TX FCC ID:SRQ-ZM8620.The FCC part 15.19 statement below has to also be available on the label:This device complies with Part 15 of FCC rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an Module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note:If this module is intended for use in a portable device,you are responsible for separate approval to satify the SAR requirements of FCC Part 2.1093.

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