ZTE ZM8620 LTE Wireless Data Terminal User Manual

Hardware Development Guide of

Module Product

Welink Your Smart

Version 2.3, 2014-04-15

ZM8620_V2

Hardware Development Guide of Module Product

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ZM8620_V2

Legal Information

By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as

ZTEWelink), you are deemed to have agreed to the following terms. If you don‘t agree to the following

terms, please stop using the document.

contains ZTEWelink‘s proprietary information. Without the prior written permission of ZTEWelink, no

entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any

image, table, data or other information contained in this document.

As the wholly-owned subsidiaries of ZTE, ZTEWelink is the professional company engaging in R&D,

manufacture and sales of wireless module product. is the registered trademark of

ZTEWelink. The name and logo of ZTEWelink are ZTEWelink‘s trademark or registered trademark.

Meanwhile, ZTEWelink is a wholly-owned subsidiary of ZTE Corporation, and is granted to use ZTE

Corporation‘s registered trademark. The other products or company names mentioned in this document

are the trademark or registered trademark of their respective owner. Without the prior written permission

of ZTEWelink or the third-party oblige, no one is allowed to read this document.

The product meets the design requirements of environmental protection and personal security. The

storage, use or disposal of products should abide by the product manual, relevant contract or the laws

and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document without

prior notice, and keeps the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

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ZM8620_V2

Applicability Table

Product

ZM8620_V2EUD

ZM8620_V2LAT

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ZM8620_V2

Revision History

Version

Date

Description

V1.0

2013-02-22

First published

V2.0

2013-03-20

Delete the part of 4.8 in the former version, and change the header,

front cover, legal information and footer.

V2.1

2013-08-16

1. Modify the legal information

2. Modify the part of 7.1.1

3. Modify the format of footer and header

4. Modify the figure of PIN Configuration Diagram

5. Add the figure of PIN Distribution Diagram

6. Add chapter 8 of Debugging Environment and Method

7. Modify chapter 7 of Antenna

2013-09-30

8. Modify the typical voltage of power supply to 3.8V

9. Add the support of WinCE OS

10. Update the Product Material Object Picture of Figure 2-1

11. Modify the support of GPRS Class B in Table 2-1

12. Modify the Specification of SIM interface in Table 2-1

13. Modify the pin NO. of USIM in Table 4-4

14. Modify the Figure of (U)SIM Card Signal Connection Circuit

15. Modify the support of MMS, RAS, phonebook, network lock,

and USSD in Table 2-1

16. Add the Figure 4-4 of Module Serial Port & AP Application

Processor

17. Add the Table 4-6 of Definition of UART Signal

18. Add 4.10 of W_DISABLE_N Signal

19. Modify chapter 5.3 of Resetting Flow

20. Delete the part of Power_on/Power_off in chapter 5.2 and

chapter 4.8

21. Add Table 5-3 of Power-on/Resetting Period

22. Complete and modify Table 4-2 of PIN Interface Definition

2013-10-11

23. Add chapter 4.8 of SPI Interface

24. Add chapter 6 of Related Test & Testing Standard

2013-12-12

25. Add Contact Information

26. Modify Power-on/Resetting Period in chapter 5

27. Add the document in table List for Supported& Related

Documents

28. Modify LTE TDD in Technical Standard to DL 50Mbps / UL

25Mbps (10MHz) in Table 2-1

29. Modify the RxDiv Band in Table 2-1

30. Add the power consumption in the mode of UMTS/LTE in

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ZM8620_V2

Version

Date

Description

chapter 5.1

31. Modify the antenna interface to MHF-A13 of I-PEX

V2.2

2014-03-06

1. Modify the typical voltage of power supply to 3.3V，and the

range to 3.1-3.6V

2. Modify the the Profile Dimensions in Figure 8-1 and The PCB

layout is shown in the Figure 8-2.

3. Modify the antenna interface to U.FL-R-SMT-1(80)(HRS)/

ECT818000071(ECT)

4. Modify the pins in chapter 4.1

5. Modify the chapter 4.6 of UART interface

6. Update the format and template of the document

7. Update the legal information of this document

8. Update the Product Material Object Picture in Figure 2-1

V2.3

2014-04-15

1. Update the document as the hardware development guide of

module ZM8620_V2

2. Add the difference between the module ZM8620_V2 and

ZM8620.

3. Update the bands information of two variants

ZM8620_V2EUD and ZM8620_V2LAT

4. Modify the Figure in chapter of UART electric feature

5. Add the chapter of 10 and 11

6. Update the Overview of Major Technical Parameters in Table

2–2

Note: Because of ZTEWelink ZM8620_V2 module is still under revision to improve its performances,

the present document could be subject to revisions without notice.

Hardware Development Guide of Module Product

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ZM8620_V2

Contact Information

Post

9/F, Tower A, Hans Innovation Mansion,

North Ring Rd., No.9018, Hi-Tech Industrial Park,

Nanshan District, Shenzhen, P.R.China.

Web

www.ztewelink.com

Phone

+86-755-86360200-8679

E-Mail

ztewelink@zte.com.cn

Note: Consult our website for up-to-date product descriptions, documentation, application notes,

firmware upgrades, troubleshooting tips, and press releases

Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone,

website, instant messaging, E-mail and on-site.

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ZM8620_V2

Contents

LEGAL INFORMATION ....................................................................................................................................... I

1 ABOUT THIS DOCUMENT ..................................................................................................................... 1

1.1 Application Range ................................................................................................................................. 1

1.2 Purpose ................................................................................................................................................ 1

1.3 Supported & Reference Document List .................................................................................................... 1

1.4 Abbreviations ....................................................................................................................................... 2

2 PRODUCT OVERVIEW ........................................................................................................................... 3

2.1 Product Technical Parameter .................................................................................................................. 4

2.2 Function Overview ................................................................................................................................ 7

2.2.1 Baseband Function .................................................................................................................... 7

2.2.2 Radio Frequency Function ......................................................................................................... 7

3 MECHANIC FEATURE ............................................................................................................................ 9

3.1 Dimensions and Interface ....................................................................................................................... 9

3.2 Antenna Interface ................................................................................................................................ 11

3.3 Thermal Design .................................................................................................................................. 12

4 PIN DESCRIPTION ................................................................................................................................ 14

4.1 Dimensions and Interface ..................................................................................................................... 14

4.1.1 Definition of PIN I/O Parameters .............................................................................................. 14

4.1.2 PIN Configuration Diagram ...................................................................................................... 14

4.1.3 PIN Description ........................................................................................................................ 15

4.2 Feature of Interface Power Level .......................................................................................................... 18

4.2.1 Power Level of IO Interface ...................................................................................................... 18

4.3 Power Interface ................................................................................................................................... 19

4.3.1 Description of Power PINs ....................................................................................................... 19

4.3.2 Requirement of Power Supply .................................................................................................. 19

4.4 (U)SIM Card Interface ......................................................................................................................... 19

4.4.1 Description of PINs ................................................................................................................... 19

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4.4.2 Electric Feature ........................................................................................................................ 20

4.5 USB2.0 Interface ................................................................................................................................ 20

4.5.1 Description of PINs ................................................................................................................... 20

4.5.2 Electric Feature ........................................................................................................................ 21

4.6 UART Interface .................................................................................................................................. 21

4.6.1 Description of PINs ................................................................................................................... 21

4.6.2 Electric Feature ........................................................................................................................ 22

4.7 SPI Interface ....................................................................................................................................... 23

4.8 Reset Signal PERST# .......................................................................................................................... 24

4.9 WAKE# Signal ................................................................................................................................... 24

4.10 W_DISABLE_N Signal ....................................................................................................................... 25

4.11 Recommended Upgrade Methods ......................................................................................................... 26

5 ELECTRIC FEATURE ........................................................................................................................... 27

5.1 Power Feature ..................................................................................................................................... 27

5.1.1 Power Supply ........................................................................................................................... 27

5.1.2 Working Current ....................................................................................................................... 27

5.2 Power-on/Resetting Flow ..................................................................................................................... 28

5.3 Resetting Flow .................................................................................................................................... 29

6 RELATED TEST & TESTING STANDARD ........................................................................................... 30

6.1 Testing Reference ................................................................................................................................ 30

6.2 Description of Testing Environment ...................................................................................................... 30

6.3 Reliability Testing Environment ............................................................................................................ 31

6.4 Reliability Test Result .......................................................................................................................... 32

7 RF SPECIFICATIONS ........................................................................................................................... 34

7.1 Technical Specification for UMTS Mode Radio Frequency ..................................................................... 34

7.1.1 Maximum Transmission Power................................................................................................. 34

7.1.2 Receiving Sensitivity ................................................................................................................ 34

7.1.3 Spurious Specification .............................................................................................................. 35

7.2 Technical Specification of GSM Mode Radio Frequency ......................................................................... 35

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7.2.1 Maximum Transmission Power................................................................................................. 35

7.2.2 Receiving Sensitivity ................................................................................................................ 36

7.3 Technical Specification of LTE Mode Radio Frequency .......................................................................... 36

7.3.1 Maximum Transmission Power................................................................................................. 36

7.3.2 Receiving Sensitivity ................................................................................................................ 36

7.3.3 Spurious Specification .............................................................................................................. 38

8 ANTENNA ............................................................................................................................................. 41

8.1 RF Antenna Specification ..................................................................................................................... 41

8.1.1 Technical Parameter for the Main Antenna Connector ............................................................. 41

8.2 Proposal on Layout of Product in Terminal Product ................................................................................ 42

8.3 Antenna Dimensions and Location ........................................................................................................ 43

8.4 Diversity Antenna Design .................................................................................................................... 43

9 DEBUGGING ENVIRONMENT AND METHOD .................................................................................... 44

9.1 Debugging Board ................................................................................................................................ 44

9.2 Interfaces on Debugging Board............................................................................................................. 45

9.2.1 JTAG Interface ......................................................................................................................... 45

9.2.2 USB Interface ........................................................................................................................... 45

9.2.3 Power-supply Interface ............................................................................................................. 45

9.2.4 USIM Card Console Interface .................................................................................................. 46

9.2.5 PON_RESET_N Button ............................................................................................................ 46

9.2.6 W_DISABLE_N Button ............................................................................................................. 46

9.2.7 LED Indicator............................................................................................................................ 46

10 PACKAGE SYSTEM .............................................................................................................................. 47

11 SAFETY INFORMATION ....................................................................................................................... 48

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Figures

Figure 2–1 Product Material Object Picture .............................................................................................................. 4

Figure 2–2 System Connection Diagram ................................................................................................................... 7

Figure 3–1 PCI Express Mini Card Dimensions Type and Slot Compatibility ........................................................ 11

Figure 3–2 Antenna Interface Flag Diagram (with Diversity) ................................................................................. 12

Figure 3–3 Radio Frequency Interface Test Base .................................................................................................... 12

Figure 4–1 PIN Distribution Diagram ..................................................................................................................... 15

Figure 4–2 PIN Configuration Diagram .................................................................................................................. 15

Figure 4–3 (U)SIM Card Signal Connection Circuit ............................................................................................... 19

Figure 4–4 Module Serial Port & AP Application Processor ................................................................................... 22

Figure 4–5 The connection of ZM8620_V2 UART and Standard RS-232-C interface ........................................... 23

Figure 4–6 Reference Circuit Design of PERST# Signal ........................................................................................ 24

Figure 4–7 Reference Connection Circuit of WAKE# Signal .................................................................................. 25

Figure 4–8 Reference Circuit Design of W_DISABLE_N Signal ........................................................................... 26

Figure 5–1 Module Reset Flow ............................................................................................................................... 29

Figure 8–1 the Profile Dimensions .......................................................................................................................... 41

Figure 8–2 Recommended PCB layout .................................................................................................................... 42

Figure 9–1 The diagram for the switching board ..................................................................................................... 44

Figure 9–2 Debugging Board .................................................................................................................................. 45

Figure 10–1 Package process of ZM8620_V2 modules .......................................................................................... 47

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Tables

Table 1–1 List for Supported& Related Documents .................................................................................................. 1

Table 1–2 Abbreviation List ...................................................................................................................................... 2

Table 2–1 The bands informaiton of ZM8620_V2 module........................................................................................ 3

Table 2–2 Overview of Major Technical Parameters ................................................................................................. 4

Table 2–3 Product Operating Frequency Band .......................................................................................................... 8

Table 3–1 PCI Express Mini Card ............................................................................................................................. 9

Table 4–1 PIN Parameters ....................................................................................................................................... 14

Table 4–2 PIN Interface Definition .......................................................................................................................... 15

Table 4–3 Power Level Range of Digital Signal ...................................................................................................... 18

Table 4–4 Definition & Description of (U) SIM Card Signal Group ....................................................................... 20

Table 4–5 Definition of UART Signal ..................................................................................................................... 21

Table 4–6 Definition and Description of SPI Control Signal Group ........................................................................ 23

Table 4–7 Definition and Description of PERST# Signal ........................................................................................ 24

Table 4–8 Definition and Description of W_DISABLE_N Signal .......................................................................... 25

Table 5–1 Input Voltages ......................................................................................................................................... 27

Table 5–2 Averaged standby DC power consumption ............................................................................................. 27

Table 5–3 DC power consumption in UMTS mode ................................................................................................. 27

Table 5–4 DC power consumption in LTE mode (Unit: mA) .................................................................................. 28

Table 5–5 Power-on/Resetting Period ...................................................................................................................... 28

Table 6–1 Testing Standard ...................................................................................................................................... 30

Table 6–2 Testing Environment ............................................................................................................................... 31

Table 6–3 Testing Instrument & Device .................................................................................................................. 31

Table 6–4 Reliability Feature ................................................................................................................................... 31

Table 6–5 Temperature Testing Result under Windless Environment ...................................................................... 32

Table 6–6 Test Results of High/low Temperature Running and Reliability Test ...................................................... 33

Table 7–1 Maximum Transmission Power ............................................................................................................... 34

Table 7–2 Receiving Sensitivity Reference Table .................................................................................................... 34

Table 7–3 General Requirement of Receiver Spurious Emission ............................................................................ 35

Table 7–4 Additional Spurious Emission Requirement ........................................................................................... 35

Table 7–5 Maximum Transmission Power ............................................................................................................... 35

Table 7–6 Reference Table of Receiving Sensitivity ............................................................................................... 36

Table 7–7 Maximum Transmission Power ............................................................................................................... 36

Table 7–8 Receiving Sensitivity Reference Table .................................................................................................... 37

Table 7–9 General Requirement of Receiver Spurious Emission ............................................................................ 38

Table 7–10 UE Co-existence Spurious Emission Requirement ............................................................................... 38

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ZM8620_V2

1 About This Document

1.1 Application Range

This document is applicable as the hardware development guide of ZM8620_V2 LTE module product.

The user can conduct secondary development according to the requirement and guidance in this

document. And it is only applicable for the hardware application development based on the use of

ZM8620_V2 module product.

1.2 Purpose

This document provides the design and development fundamentals for the users of ZM8620_V2. By

reading this document, the user can have an overall knowledge of this product, and a clear understanding

of the technical parameters, hardware interfaces, electrical and mechanical details of this product. With

this document, the user can use ZM8620_V2 successfully fulfill the wireless communication function

development of M2M applications including Wireless POS, mobile terminal products such as Tablet,

Notepad etc.

1.3 Supported & Reference Document List

Besides this hardware development document, ZTEWelink also provides the software development

guide. Table 1-1 is the list of supported documents.

Table 1–1 List for Supported& Related Documents

NUM

Document Name

1

ZTEWelink Software Development Guide of LTE Module Products-V2.3.pdf

2

ZTEWelink ZM8620_V2 Module Specification.pdf

3

AT Command reference guide for ZTEWelink LTE Module.pdf

4

3GPP LTE 36.101 protocol (Evolved Universal Terrestrial Radio Access

(E-UTRA); User Equipment (UE) radio transmission and reception)

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5

3GPP TS 34.121 protocol

1.4 Abbreviations

Table 1-2 is a list of the relevant abbreviations, and interpretations in Chinese and English involved in

the whole document.

Table 1–2 Abbreviation List

Abbreviations

English full name

BER

Bit Error Rate

DCE

Data circuit-terminating equipment

DL

Downlink

DTE

Data terminal equipment

DTR

Data terminal ready

DPCH

Dedicated Physical Channel

DPCH_Ec

Average energy per PN chip for DPCH. DPCH

EMC

Electromagnetic compatibility

ESD

Electro-Static discharge

FDD

Frequency Division Duplexing

GPRS

General Packet Radio Service

GSM

Global Standard for Mobile Communications

I/O

Input/output

LED

Light Emitting Diode

PCB

Printed Circuit Board

SIM

Subscriber Identification Module

SMS

Short Message Service

SPI

Serial Peripheral Interface

UART

Universal asynchronous receiver-transmitter

UMTS

Universal Mobile Telecommunication System

USB

Universal Serial Bus

WCDMA

Wideband Code Division Multi Access

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ZM8620_V2

2 Product Overview

ZM8620_V2 is a multimode wireless communication module with mini-PCIE express interface, which

can be applied in but not limited to equipment such as Tablet, Vehicle Mounted Terminals, CPE and

electronic consumer products, and provides equipment with high-speed data access service in mobile

environment (LTE FDD, UTMS and GSM network).

ZM8620_V2contains two variants ZM8620_V2EUD and ZM8620_V2LAT. Customer can choose the

dedicated type based on the wireless network configuration. The following table shows the entire radio

band configuration of ZM8620_V2series.

Table 2–1 The bands informaiton of ZM8620_V2 module

BAND

ZM8620_V2EUD

ZM8620_V2LAT

FDD-LTE

BAND 1

√

BAND 2

--

√

BAND 3

√

--

BAND 4

--

√

BAND 5

--

√

BAND 7

√

BAND 8

√

BAND12

--

√

BAND 20

√

--

TD-LTE

BAND 38

--

√

BAND 40

√

--

UMTS

BAND 1

√

BAND 2

√

BAND 4

--

√

BAND 5

√

BAND 8

√

GSM

Quadband

√

 NOTE:

In the Table 2-1 ―√‖ means theband is supported by module ZM8620_V2, while ―--‖ means not

supported

The Figure 2-1 below shows the product material object picture.

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Figure 2–1 Product Material Object Picture

2.1 Product Technical Parameter

The major features of ZM8620_V2 can be described from the aspects of mechanic feature, base band,

radio frequency, technical standard and environment feature. Table 2-2 is a list of the major technical

parameters and features supported by ZM8620_V2.

Table 2–2 Overview of Major Technical Parameters

Item

Feature

Specifications

Mechanic

Specifications

Dimensions

51mm x 30mm x 4.9mm

Weight

About 11g

Form Factor

Mini-PCIE package(52Pin)

Baseband

(U)SIM/SIM

3V SIM card and 1.8V SIM card

Memory(SDRAM/

NAND)

128MByte & 256MByte

MICRO SD Card

No memory card support

USB Version

USB 2.0 HIGH SPEED

UART Interface

Yes

Reset/Power_on/Po

wer_off interface

Yes

SPI Interface

Yes

Maximum power

TBD

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Item

Feature

Specifications

consumption

Power supply

Typical is 3.3V, the range is 3.

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Item

Feature

Specifications

Equalization

Yes

Main Antenna

Provide external main Antenna Interface of RF connector mode

GPS Antenna

Provide external GPS Antenna Interface of RF connector mode

Receive Diversity

Antenna

Provide external Diversity Antenna Interface of RF connector

mode

Technical

Standard

LTE TDD

DL 50Mbps / UL 25Mbps (10MHz)

GSM/EDGE/WCD

MA

GSM CS: UL 9.6kbps/DL 9.6kbps

GPRS: Multi-slot Class 10

EDGE: Multi-slot Class 12

WCDMA CS: UL 64kbps/DL 64kbps

WCDMA PS: UL 384kbps/DL 384kbps

HSDPA/HSUPA/

HSPA+/

DC-HSPA+

HSDPA Rel 6: DL 14.4Mb/s

HSUPA Rel 6: UL 5.76Mb/s

HSPA+ Rel 7: DL 28/UL 5.76Mb/s

DC-HSPA+ Rel 8: DL 42/UL 5.76 Mb/s

CDMA 1xEV-DO

N/A

LTE-FDD

DL 100Mbps / UL 50Mbps (Category 3)

3GPP Release

R99, R5, R6, R7, R8(HSPA+),R9(FDD)

OS

Windows XP/Vista/7/8, Android, Linux, WinCE

GPRS Class

Class A

Environment

Operating

Temperature

-10 to 60 °C

Storage

Temperature

-40 to 85 °C

Humidity

5%~ 95%

Application

DATA

RAS

Yes

ECM

Yes

NDIS

Yes

SMS

Yes

MMS

Yes, not support embedded MMS stack

STK

No

TCP/IP

No

USSD

Yes (Phase I &Phase II)

Phonebook

Yes

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Item

Feature

Specifications

NETWORK

LOCK

No

BAND LOCK

Yes

SIM Reader

Yes

Firmware Update

Yes

GPS/AGPS

Yes

2.2 Function Overview

2.2.1 Baseband Function

When connect the module product ZM8620_V2 to the system board, there are several main signal

groups as follows: USB signal, SIM card signal, UART signal, GPIO signal, SPI signal, power on and

resetting signal, wakeup signal, power supply and ground. At the same time, ZM8620_V2 has the main

antenna interface, diversity antenna interface, and GPS antenna interface.

Main

Antenna

USB

SIM card

POWER

GND

GPIO

UART

WAKE#&PERST#&W

_DISABLE Signals

GPS

Antenna

ZM8620_V2

PCIE LTE wireless

Internet access

module

Diversity

Antenna

SPI

Figure 2–2 System Connection Diagram

2.2.2 Radio Frequency Function

The radio frequency function of ZM8620_V2 can be viewed from the aspect of over-the-air wireless

bearer network, frequency band, whether receive diversity feature is supported.

(a) Support LTE FDD, LTE TDD, UMTS;

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(b) Support GSM 850/900/1800/1900 MHz;

(c) Support the diversity receives;

The operating frequencies of module ZM8620_V2 are shown as Table 2-3.

Table 2–3 Product Operating Frequency Band

Operating Frequency

Band

Uplink Frequency Band

(Uplink)

Downlink Frequency Band

(Downlink)

UMTS850

824 MHz — 849 MHz

869 MHz — 894 MHz

UMTS900

880 MHz — 915 MHz

925 MHz — 960 MHz

UMTS1700

1710 MHz — 1755MHz

2110 MHz — 2155MHz

UMTS1900

1850 MHz — 1910 MHz

1930 MHz — 1990 MHz

UMTS2100

1920 MHz — 1980 MHz

2110 MHz — 2170 MHz

GSM1900

1850 MHz — 1910 MHz

1930 MHz — 1990 MHz

GSM850

824 MHz — 849 MHz

869 MHz — 894 MHz

GSM900

890 MHz — 915MHz

935 MHz — 960MHz

GSM1800

1710 MHz — 1785MHz

1805 MHz — 1880MHz

LTE-FDD Band17

788 MHz — 798 MHz

734 MHz — 746 MHz

LTE-FDD Band5

824 MHz — 849MHz

869 MHz — 894 MHz

LTE-FDD Band8

880 MHz — 915 MHz

925 MHz — 960 MHz

LTE-FDD Band4

1710 MHz — 1755MHz

2110 MHz — 2155 MHz

LTE-FDD Band2

1850 MHz — 1910MHz

1930 MHz — 1990MHz

LTE-FDD Band1

1920 MHz — 1980 MHz

2110 MHz — 2170 MHz

LTE-FDD Band7

2500 MHz — 2570MHz

2620 MHz — 2690MHz

LTE-TDD Band38

2570 MHz — 2620MHz

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3 Mechanic Feature

3.1 Dimensions and Interface

This product adopts the standard PCI Express Mini Card interface type, and the contour size is designed

according to F1 type. Figure 3-1 illustrates the dimensions and slot compatibility of PCI Express Mini

Card.

Users of this module can refer to the document named PCI Express Mini Card Electromechanical

Specification Revision 1.2, October 26 2007 for the detail of PCIE interface.

Table 3–1 PCI Express Mini Card

Card Type

Full-Mini-

Only Socket

Half-Mini-

Only Socket

Dual-Use

Socket

Dual Head-to-Head

Socket

Connector

A

Connector

A

Connector

A

Connector

A

Connector

B

F1

Full-Mini

Yes

No

F2

Full-Mini with

bottom-side keep

outs

Yes

No

Yes

No

F3

Half-Mini

No

Yes

No

F4

Half-Mini with

bottom-side keep

outs

No

Yes

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ZM8620_V2

(a)

(b)

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(c)

Figure 3–1 PCI Express Mini Card Dimensions Type and Slot Compatibility

Figure (a) is TOP surface dimensions; Figure (b) is BOTTOM surface dimensions; Figure (c) is

thickness information.

3.2 Antenna Interface

This product has three radio frequency antenna interfaces: One is the main antenna interface (there is the

―MAIN‖ flag on the PCB), one is a diversity receiving antenna (diversity optional) interface (there is

―AUX‖ flag on the PCB), and one is GPS antenna, as shown in Figure 3-2. The radio frequency bases

adopted by the antenna interface of ZM8620_V2 module are all U.FL-R-SMT-1(80)(HRS)/

ECT818000071(ECT) at present as shown in Figure 3-3.

 NOTE:

The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is

U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13

of I-PEX by ZM8620 before.

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ZM8620_V2

Figure 3–2 Antenna Interface Flag Diagram (with Diversity)

Figure 3–3 Radio Frequency Interface Test Base

This product antenna is placed on the side of the system board. If this product is embedded in a notebook,

place it on the top of the LCD screen.

3.3 Thermal Design

The thermal design of this product strictly complies with the specification [PCI Express Mini Card

Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat source evenly,

and has excellent heat dissipating design. As the maximum power consumption of the overall system is

very high when transmitting, if it is impossible to ensure the temperature of ZM8620_V2 less than 60°C,

the rise of the overall system temperature will lead to the performance degradation of ZM8620_V2, or

even not operate normally. In order to ensure product performance, safety and stability, the following

proposals are provided for the main board design:

(a) the module far away from the switch power and high-speed signal cable as much as

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ZM8620_V2

possible. Well protect the wiring of the interference sources.

(b)

located close the interference sources.

(c) the module close to devices with large heat dissipation, such as CPU, south

bridge, etc. The high temperature will affect the RF performance.

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ZM8620_V2

4 Pin Description

4.1 Dimensions and Interface

4.1.1 Definition of PIN I/O Parameters

The definition of the module‘s I/O parameter is as shown in Table 4-1.

Table 4–1 PIN Parameters

PIN Attribute

Description

AI

Analog signal input

AO

Analog signal output

B

bidirectional digital with CMOS

input

DI

Digital signal input

DO

Digital signal output

Z

High-resistance output

P1

PIN group 1, the power supply

voltage is VDD_P1

P2

PIN group 2, the power supply

voltage is VDD_P2

PU

PIN internal pull-up

PD

PIN internal pull-down

4.1.2 PIN Configuration Diagram

The PIN sequence of interfaces on the module is following the mini-PCIE interface and defined as

shown in Figure 4-2.

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ZM8620_V2

Figure 4–1 PIN Distribution Diagram

12

3

5

7

9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

49

51

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

VDD_3V3

VREG_UIM

UIM_ DATA

UIM_ CLK

UIM_ RST

UART1_DSR

W

_DISABLE_N

PERST#

VDD_3V3

USB_ DM

USB_ DP

VDD_3V3

VDD_3V3 LED_ PWR

VDD_3V3

47

GND

SPI_CS

GND

GPIO

NC

GND

NC

SLIC_INT

SLIC_RESET

GND

WAKE #

SPI_SDI

SPI_SDO

SPI_CLK

GND

UART1_RX

UART1_RI

GPIO_79

UART1_CTS

UART1_RFR

UART1_DTR

GND

RESERVED

COEX1

COEX2

CLKREQ*

GND[1]

REFCLK-

REFCLK+

GND[2]

RESERVED5_UIM_C8

RESERVED4_UIM_C4

GND[4]

PERN0

PERP0

GND[6]

GND[7]

PETN0

PETP0

GND[9]

GND[10]

3V3VAUX[2]

3V3VAUX[3]

GND[12]

RESERVED3

RESERVED2

RESERVED0

RESERVED1

3V3VAUX[0]

GND[0]

1V5[0]

UIM_PWR

UIM_DATA

UIM_CLK

UIM_RESET

UIM_VPP

W_DISABLE*

PERST*

3V3VAUX[1]

GND[5]

1V5[1]

SMB_CLK

SMB_DATA

GND[8]

USB_D+

LED_WWAN*

LED_WLAN*

LED_WPAN*

1V5[2]

GND[13]

3V3VAUX[4]

ZM8620_V2

USB_D-

GND[11]

GND[3]

UART1_DCD

UART1_TX

NC

Figure 4–2 PIN Configuration Diagram

4.1.3 PIN Description

Table 4–2 PIN Interface Definition

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ZM8620_V2

Standard PIN

ZM8620_V2 PIN

Description

I/O

Remark

1

WAKE#

Wake up the system host

DO

--

2

3.3Vaux

VDD_3V3

3.3V supply

DI

3.1V-3.6V，The

typical value is

3.3V

3

COEX1

SPI_SDI

SPI data signal

DI

3.3V

4

GND

Ground

--

Ground pin

5

COEX2

SPI_SDO

SPI data signal

DO

3.3V

6

1.5V

SPI_CS

SPI segment signal

DO

3.3V

7

CLKREQ#

SPI_CLK

SPI synchronization clock

--

3.3V

8

UIM_PWR

VREG_UIM

USIM card power supply

DO

2.85V/1.8V for

SIM card

9

GND

Ground

--

Ground pin

10

UIM_DATA

USIM card data signal

DI/DO

2.85V/1.8V.this

signal requires a

pull-up resistor

on the host board

11

REFCLK-

UART1_RX

UART port receive data

DI

3.3V

12

UIM_CLK

USIM card clock signal

DO

2.85V/1.8V

13

REFCLK+

UART1_TX

UART port transmit data

DO

3.3V

14

UIM_RESET

UIM_RST

USIM card reset signal

DO

2.85V/1.8V

15

GND

Ground

--

Ground pin

16

UIM_VPP

UATR1_DSR

Data is ready

DO

1.8V

17

Reserved(UIM_C8)

UART1_RI

Ringtone indicator

DO

1.8V

18

GND

Ground

--

Ground pin

19

Reserved(UIM_C4)

GPIO_79

The standby and wakeup of

module

--

20

W_DISABLE#

W_DISABLE_N

Active low signal. This

signal is used by the system

to disable radio operation on

add-in cards that implement

radio frequency applications.

DI

Active low

21

GND

Ground

--

Ground pin

22

PERST#

Module resetting

DI

1.8V

23

PERn0

UART1_CTS

UART port, clear to send

DI

1.8V

24

+3.3Vaux

VDD_3V3

3.3V supply

DI

3.1V-3.6V，The

typical value is

3.3V

25

PERp0

UART1_RFR

UART port, preparing to

receive

DO

1.8V

26

GND

Ground

--

Ground pin

27

GND

Ground

--

Ground pin

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ZM8620_V2

Standard PIN

ZM8620_V2 PIN

Description

I/O

Remark

28

+1.5V

GPIO

General Purpose

Input/Output

DI/DO

1.8V

29

GND

Ground

--

Ground pin

30

SMB_CLK

NC

--

31

PETn0

UART1_DTR

UART1 data terminal ready

DI

1.8V

32

SMB_DATA

NC

--

33

PETp0

UART1_DCD

UART1 carrier wave

detection

DO

1.8V

34

GND

Ground

--

Ground pin

35

GND

Ground

--

Ground pin

36

USB_D-

USB_DM

USB differential signal,

minus side

DI/DO

--

37

GND

Ground

--

Ground pin

38

USB_D+

USB_DP

USB differential signal,

positive side

DI/DO

--

39

+3.3Vaux

VDD_3V3

3.3V supply

DI

3.1V-3.6V，The

typical value is

3.3V

40

GND

Ground

--

Ground pin

41

+3.3Vaux

VDD_3V3

3.3V supply

DI

3.1V-3.6V，The

typical value is

3.3V

42

LED_WWAN#

LED_PWR

Open drain，active low

signals. This signal is used

to provide status indicator

DO

--

43

GND

Ground

--

Ground pin

44

LED_WLAN#

NC

--

45

Reserved

--

46

LED_WPAN#

SLIC_INT

exclusive use for routing

adaptation

DO

--

47

Reserved

--

48

+1.5V

SLIC_RESET

exclusive use for routing

adaptation

DO

--

49

Reserved

--

50

GND

Ground

Ground pin

51

Reserved

--

52

+3.3Vaux

VDD_3V3

3.3V supply

DI

3.1V-3.6V，The

typical value is

3.3V

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ZM8620_V2

 NOTE:

The voltage design of external circuit interfaces should match that of the ZM8620_V2 PINs.

In the Table 4-2, the Power supply of ZM8620_V2 has been updated between 3.1V-3.6V, and the typical

value is 3.3V at present. While in ZM8620 module, the Power supply is 3.4-4.2V, and typical is 3.8V

before.

In ZM8620_V2, the signal of pin 6,11,13,16,17,23,25,28,30~33,44,46.48 is different from that of

module ZM8620.

4.2 Feature of Interface Power Level

4.2.1 Power Level of IO Interface

Table 4–3 Power Level Range of Digital Signal

Signal

Description

Min

Max

Units

VIH

High level of input voltage

0.65*VDD_PX

VDD_PX+0.3

V

VIL

Low level of input voltage

-0.3

0.35*

VDD_PX

V

VOH

High level of output

voltage

VDD_PX-0.45

VDD_PX

V

VOL

Low level of output

voltage

0

0.45

V

 NOTE:

1. The high/low PWL of input voltage should comply with the range in the table.

2. The high/low PWL of external interface signal should match the interface PWL of ZM8620_V2.

3. VDD_PX indicates the typical voltage of each Pin specified in Table 4-2.

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ZM8620_V2

4.3 Power Interface

4.3.1 Description of Power PINs

Power VCC (PIN No: 2, 24, 39, 41, 52). This is the positive signal of 3.3V power supply.

GND signal (PIN No: 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50). This is the power ground and

signal ground of the module, which needs to be connected to the ground on the system board. If the

GND signal is not connected completely, the performance of the module will be affected.

4.3.2 Requirement of Power Supply

The power supply is recommended to be within the range of 3.1~3.6V. If the network is in poor situation,

the antenna will transmit at the maximum power, and the transient maximum peak current less than 2G

mode can reach as high as 1.8A. So the power supply capacity for peak current needs to be above 2.5A,

and the average peak current needs to be above 0.9A.

4.4 (U)SIM Card Interface

4.4.1 Description of PINs

ZM8620_V2 module baseband processor integrates the (U)SIM card interface. The signals on SIM card

interface is as shown in Figure 4-3.

Figure 4–3 (U)SIM Card Signal Connection Circuit

VREG_UIM

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ZM8620_V2

 NOTE:

The PCB wiring of UIM card should be laid closely around the module as possible as you can, and the

ESD component should be put near the UIM card socket by the customer.

Table 4–4 Definition & Description of (U) SIM Card Signal Group

Signal Name

Signal Description

8

VREG_UIM

USIM card power, output from the module

10

UIM_DATA

USIM card DATA signal, two-way signal

12

UIM_CLK

USIM card clock signal, output from the module

14

UIM_RST

USIM card reset signal, output from the module

4.4.2 Electric Feature

The signals of (U)SIM card signal group are described in Table 4-4. As the USIM card console is placed

on the system board side, be sure to add the ESD protection during the design.

To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it is recommended to

place (U)SIM card console close to the (U)SIM card interface, to prevent the wiring from being too long,

which might seriously distort the waveform and thus affect the signal integrity. It is recommended to

make the grounding protection for UIM_CLK and UIM_DATA signal wiring.

Cascade one 0.1uF and 33pF capacitor between VREG_UIM and GND, and cascade a 33pF bypass

capacitor between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals. It is

recommended to cascade a 20ohm resistance on UIM_DATA signal. And UIM_DATA must be pulled up

via a 20K ohm resistance to VREG_UIM.

4.5 USB2.0 Interface

4.5.1 Description of PINs

ZM8620_V2 has the high-speed USB2.0 interface,. USB is connected to the system board side via the

PCI-E interface, to communicate with the processor on the system board side. Its PINs are PIN36

(USB_DM), PIN38 (USB_DP). The USB interface can be mapped to difference ports, such as

Diagnostics port to capture the log, AT port is used to complete AT command interaction with the AP

side.

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ZM8620_V2

4.5.2 Electric Feature

The USB interface of Module complies with the USB2.0 specifications and the electrical characteristics.

During the PCB wiring, the wires must be parallel, the distance should be as short as possible and as far

away as possible from the antenna, and it‘s enveloped by the ground wires to avoid strong interference

sources. USB_DP and USB_DM should be wired strictly in the differential mode, and the length

difference of the two signals is within 1mm.

 NOTE:

The differential resistance needs to be controlled within 90Ω, and the difference cannot exceed 5%.

It is recommended to cascade the high-speed common-mode rejection filter on the USB differential

traces. If some of the trace is exposed, it is recommended to add the ESD protection device, and the

junction capacitor of the ESD protection device should better be kept within 1.5pF. Large junction

capacitor will distort the waveform, and affect the bus communication.

4.6 UART Interface

The UART interface is used as MODEM port by default which is occupied by data service.

4.6.1 Description of PINs

The wireless module ZM8620_V2 supports the full UART interface with flow control function, which

complies with the RS-232 interface protocol, and supports the 8-wires serial bus interface or 2-wires

serial interface. The module can perform the serial communication and AT instruction interaction with

external.

This UART port supports the programmable data width, programmable data stop bit and programmable

parity check, and has an independent TX and RX FIFOs (512 bytes for each). For the normal UART

application (non-Bluetooth), the maximum baud rate is 230400bps, and the default baud rate is

115200bps. The PINs are defined as shown in Table 4-5.

Table 4–5 Definition of UART Signal

Signal Name

Description

Level

11

UART1_RX

UART port RX receive data

Power level is 3.3V.

13

UART1_TX

UART port TX transmit data

Power level is 3.3V.

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ZM8620_V2

16

UART1_DSR

Data is ready

Power level is 1.8V.

17

UART1_RI

Ringtone indicator

23

UART1_CTS

UART port CTS clear to send

25

UART1_RFR

UART port RFR preparing to

receive

31

UART1_DTR

DTE is ready

33

UART1_DCD

Carrier detection

4.6.2 Electric Feature

During the software interconnection process, there is a method of capturing logs, and it is recommended

that this interface be kept during the design and the testing point be reserved. If the module is used

together with the application processor, and the PWL of it matches with the power level of the module,

the connection mode is as shown in Figure 4-4. The 4-wires or 2-wires mode can also be used for

connection. If it does not match the PWL of AP interface, it is recommended to add the PWL conversion

circuit. Otherwise, it might cause unstable com ports because the level is not matched or cause damage

to the module because it is at high level for long time.

The connection of ZM8620_V2 UART port and standard RS-232-C interface can be through the chip

like class 232. The design involves the transformation of TTL level and EIA level. We recommend to

use the chip of NLSX5014MUTAG. If using the 2-byte serial bus interface, MAX3232 is recommended,

and if using the 8-byte serial bus interface, SP3238 or MAX3238 is recommended. The connection mode

is as shown in Figure 4-5.

ZM8620_V2 AP

RXD

RXDTXD

TXD

CTS

RFR CTS

RFR

DTR

DSRDSR

DTR

DCD

RI RI

DCD

GND GND

Figure 4–4 Module Serial Port & AP Application Processor

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ZM8620_V2

TTL-

RS232

level

translator

SP3238

MAX3238

ZM8620_

V2

module

1.8V

-TTL

level

translator

NLSX5014MUTAG

UART_DCD

UART_DSR

UART_CTS

UART_RFR

UART_DTR

UART_RI

GND

RS232_DCD

RS232_DSR

RS232_TXD

RS232_CTS

RS232_RXD

RS232_RTS

RS232_DTR

RS232_RI

GND

1

2

3

4

5

6

7

8

9

User Board Female DB9

Note:UART_RFR is equal To UART_RTS.

The level of UART1_Rx and UART1_TX is 3.3V, the other pins of UART is

1.8V and needs the TTL level translator

UART_TXD

UART_RXD

Figure 4–5 The connection of ZM8620_V2 UART and Standard RS-232-C interface

4.7 SPI Interface

The SPI signal interface is used to control PCI voices. The SPI_CLK clock is 127.2kHz. Pin No: 3/5/6/7

are SPI control signals. Table 4-6 describes detailed definition for each signal. The system board side

needs to convert the power level of SPI_SDI (SPI control output signal cable on the system board side)

into 3.3V, to comply with the high power level VIH input requirements.

Table 4–6 Definition and Description of SPI Control Signal Group

Signal Name

I/O

Signal Description

3

SPI_SDI

I

SPI data signal, ZM8620_V2 input, input high power

level is VIH, and low power level is VIL.

5

SPI_SDO

O

SPI data signal, ZM8620_V2 output, input high power

level is VOH, and low power level is VOL.

6

SPI_CS

O

SPI chip select pin, ZM8620_V2 output, input high

power level is VOH, and low power level is VOL.

7

SPI_CLK

--

SPI synchronization clock, 100kHz, output by

ZM8620_V2, high power level is VOH, and low power

level is VOL.

 NOTE:

VIH, VIL, VOH, and VOL comply with the power I/O interface power level requirements in 4.2.1.

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ZM8620_V2

4.8 Reset Signal PERST#

The PERST# signal (PIN No: 22) is the system reset signal of ZM8620_V2, active low. Table 4-7

illustrates its control logic. It shows that pull down the reset key (PERST#) to 100ms will reset the

module.

 NOTE:

Do not directly connect this signal to the positive end of power supply.

Table 4–7 Definition and Description of PERST# Signal

PERST#

ZM8620_V2 Status

‗1‘

ZM8620_V2 is in the

normal working status.

‗0‘ and ≥100ms

RF is in the OFF mode,

ZM8620_V2 is reset.

Figure 4–6 Reference Circuit Design of PERST# Signal

4.9 WAKE# Signal

Figure 4-7 illustrates the reference connection circuit of WAKE# signal. The WAKE# signal (PIN No.: 1)

is an output signal, active low level or low fall edge. This signal is a reserved signal for ZM8620_V2 to

wake up the system host. ZM8620_V2 pulls up the power level to VDD_3V3 internally by the 10Kohm

resistance. It is recommended to connect the 47ohm resistance to the GPIO PIN on the main chip (If this

GPIO PIN is on the system side, it can wake up the host).

ZM8620_V2

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ZM8620_V2

 NOTE:

Do not directly connect this signal to the positive end of power supply.

Figure 4–7 Reference Connection Circuit of WAKE# Signal

4.10 W_DISABLE_N Signal

The W_DISABLE_N signal (PIN No: 20) is the input signal of ZM8620_V2, active low. Table 4-8

describes its control logic.

Table 4–8 Definition and Description of W_DISABLE_N Signal

W_DISABLE_N

ZM8620_V2 Status

‗1‘

RF is enabled.

‗0‘

RF is disabled.

The W_DISABLE_N signal is pulled up by the 150Kohm resistance to 3.3V inside ZM8620_V2, so the

system side does not pull up this circuit any more.

 NOTE:

Do not directly connect this signal to the positive end of power supply.

Figure 4-8 illustrates the reference circuit design of W_DISABLE_N signal.

ZM8620_V2

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ZM8620_V2

Figure 4–8 Reference Circuit Design of W_DISABLE_N Signal

4.11 Recommended Upgrade Methods

It‘s recommended to use the one-click software upgrade tool to upgrade through the USB port provided

by ZTEWelink in the Windows system. If the customers want to upgrade the module in other operation

systems, ZTEWelink provides the corresponding reliable tools too.

ZM8620_V2

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ZM8620_V2

5 Electric Feature

5.1 Power Feature

5.1.1 Power Supply

The input voltage range of the module is DC 3.1V~3.6V, and the typical value is 3.3V, as shown in Table

5-1.

Table 5–1 Input Voltages

Parameter

Min

Typical

Max

Input voltage

3.1V

3.3V

3.6V

5.1.2 Working Current

The working current range of the module is as shown in Table 5-2 to Table 5-4. The tables provide the

working power consumption under LTE and WCMA mode. As the power consumptions are affected by

many factors, it‘s normal that there are some differences when tested by users, and these tables can only

be viewed as one example.

Table 5–2 Averaged standby DC power consumption

Mode

Bands

Test value (mA)

Remark

HSDPA/WCDMA

UMTS bands

TBD

Sleep mode

GSM/GPRS/EDGE

GSM bands

TBD

Sleep mode

LTE

LTE bands

TBD

Sleep mode

Note: assumes USB bus is fully suspended during measurements. Under different

environments, the testing results might be slightly different. Take the actual situation as

the reference.

Table 5–3 DC power consumption in UMTS mode

Power Consumption of R99

BAND

BAND1

BAND2

BAND5

BAND8

Power Consumption

(Unit: mA)

Maximum Transmit power

(23.32dBm)

TBD

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ZM8620_V2

Power Consumption of HSDPA

Power Consumption with

HS-DPCCH (HSDPA)

Maximum Transmit power

(dBm)

22.62

22.56

22.04

22.51

Power Consumption (mA)

TBD

Power Consumption of HSUPA

Power Consumption with

HS-DPCCH (HSUPA)

Maximum Transmit power

(dBm)

22.2

21.9

21.7

Power Consumption (mA)

TBD

Power Consumption of HSPA+

Power Consumption

(Unit: mA)

Maximum Transmit power

(22.89dBm)

TBD

Table 5–4 DC power consumption in LTE mode (Unit: mA)

Test band

BAND

1

BAND

2

BAND

4

BAND

5

BAND

7

BAND

8

BAND

12

TDD

BAND38

BW 10M

band channel

300

650

2175

2450

3400

3500

5130

38200

Power

Consumpti

on

QPSK 1RB

MAX PWR

TBD

QPSK 12RB

MAX PWR

TBD

QPSK 50RB

MAX PWR

TBD

16QAM 12RG

MAX PWR

TBD

16QAM 50RG

MAX PWR

TBD

 NOTE:

Under different environments and conditions (for example: under different band channel, transmit power,

power level etc.), the testing values of Table 5-3 and Table 5-4 might be slightly different. Take the

actual situation as the reference.

5.2 Power-on/Resetting Flow

Table 5–5 Power-on/Resetting Period

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ZM8620_V2

No.

Status

Average

Remark

1

Response time of

power-on and power-off

About 12s

From the time of module

power-on to port initialization

2

Searching network upon

power-on

About 15s

Depending on the actual

network situation

Note:

1. The specific power-on/power-off response time depends on the actual software versions.

The time of searching network upon power-on differs according to the network quality. The

above values are only an example.

2. By default, the module is started up upon power-on.

5.3 Resetting Flow

The failing edge of PERST# reset signal initiates a reset process. The module is reset by driving this pin

with a low pulse.

1

0

PERST# signal 100ms Resetting at

the edge of

rising

Figure 5–1 Module Reset Flow

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ZM8620_V2

6 Related Test & Testing Standard

6.1 Testing Reference

The related tests of ZM8620_V2 comply with the IEC standard, including the equipment running under

high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the

list of testing standard, which includes the related testing standards for ZM8620_V2.

Table 6–1 Testing Standard

Testing Standard

Document Reference

IEC6006826

Environmental testing-Part2.6:Test FC: Sinusoidal Vibration

IEC60068234

Basic environment testing procedures part2.

IEC60068264

Environmental testing-part2-64: Test FH: vibration, broadband

random and guidance.

IEC60068214

Environmental testing-part 2-14: Test N:change of temperature.

IEC60068229

Basic environmental testing procedures-part2: Test EB and guidance.

IEC6006822

Environmental testing-part2-2:Test B:dry heat

IEC6006821

Environment testing-part2-1: Test A: cold.

GB/T 15844.2

MS telecommunication RF wireless phone-set environment

requirement & experimental method – part 4: Strict level of

experimental condition

GB/T 2423.17

Basic environment experiment of electronic products-Experiment Ka:

Salt mist experiment method

GB/T 2423.5

Basic environment experiment of electronic

products-Part2:Experiment method Try Ea & Introduction: Shock

GB/T 2423.11

Basic environment experiment of electronic

products-Part2:Experiment method Try Fd: Broad frequency band

random vibration (General requirement)

TIA/EIA 603 3.3.5

TIA Standard-part3-5:Shock Stability

Note: 1. IECL International Electro technical Commission; 2. GB/T: Recommended national standard

6.2 Description of Testing Environment

The working temperature range of ZM8620_V2 is divided into the normal working temperature range

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and the extreme working temperature range. Under the normal working temperature range, the testing

result of RF complies with the requirements of 3GPP specifications, and its function is normal. Under

the extreme temperature range, the RF index basically complies with the 3GPP specifications, and the

quality of data communication is affected to a certain extent, but its normal function is not affected.

ZM8620_V2 has passed the EMC test. Table 6–2 is the requirement for the testing environment, and

Table 6–3 lists out the instruments and devices that might be used during the test.

Table 6–2 Testing Environment

Working Condition

Min

Temperature

Max

Temperature

Remark

Normal working

condition

-10° C

60° C

All the indexes are

good.

Extreme working

condition

-20°C

70°C

Some indexes

become poorer.

Storage

-40° C

85° C

Storage environment

of ZM8620_V2

Table 6–3 Testing Instrument & Device

Testing Item

Instrument & Device

RF test

Comprehensive testing

device

RF cable

Tower antenna

Microwave darkroom

High/Low-temperature

running & storage test

High/Low-temperature

experimental box

Temperature shock test

Temperature shock

experimental box

Vibration test

Vibration console

6.3 Reliability Testing Environment

The reliability test includes the vibration test, high/low-temperature running, high/low-temperature

storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters.

Table 6–4 Reliability Feature

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ZM8620_V2

Test Standard

Test Item

Test Condition

Test Reference

Random Oscillation

Frequency range: 5-20Hz,

PSD:1.0m2/s3;

Frequency range: 20-200Hz, -3dB/oct;

On the 3 axis, 1 hour for each axis

IEC 68-2-6

Shock Testing

Half sine wave shock

Acceleration: 20g

Short time: 11ms

On 6 axis, one shock on each axis (±x,

y and z)

TIA/EIA 603 3.3.5

GB/T 15844.2.4.1

Temperature Shock

Low temperature: -40°C ±2°C

High temperature: +80°C ±2°C

Temperature changing time: less than

30 seconds

Testing duration: 2 hours

Cycles: 10

IEC 68-2-14 Na

High-temperature

Working

Temperature: +60°C

Testing duration: 24h

ZTE standard

Low-temperature

Working

Temperature: -10°C

Testing duration: 24h

ZTE standard

High-temperature

and high humidity

Temperature: +55°C

Humidity: 95%

Duration: 48 hours

ZTE standard

High-temperature

Storage

Temperature: 85°C

Testing duration: 24h

IEC 68-2-1 Ab

Low-temperature

Storage

Temperature: -40°C

Testing duration: 24h

IEC 68-2-2 Bb

6.4 Reliability Test Result

Table 6–5 Temperature Testing Result under Windless Environment

Mode

Ambient

Temperature

Voltage

Transmission

power

Duration

Results

GPRS Class 10

+25°C

3.3V

Max

≥1 hour

Pass

EDGE Class 12

+25°C

3.3V

Max

≥1 hour

Pass

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WCDMA

+25°C

3.3V

Max

≥1 hour

Pass

LTE

+25°C

3.3V

Max

≥1 hour

Pass

Table 6–6 Test Results of High/low Temperature Running and Reliability Test

Test Item

Test Conditions and

Criteria

Test Items

Results

Random vibration

Refer to Table 6-4

RF test and function test

Pass

Impact test

Refer to Table 6-4

RF test and function test

Pass

Temperature impact

Refer to Table 6-4

RF test and function test

Pass

Running at low

temperature

Refer to Table 6-4

RF test and function test

Pass

Running at high

temperature

Refer to Table 6-4

RF test and function test

Pass

Running at the limit

of low temperature

Refer to Table 6-4

RF test and function test

Pass

Running at the limit

of high temperature

Refer to Table 6-4

RF test and function test

Pass

Storage at low

temperature

Refer to Table 6-4

RF test and function test

Pass

Storage at high

temperature

Refer to Table 6-4

RF test and function test

Pass

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ZM8620_V2

7 RF Specifications

The following content is the description of module radio frequency performance.

7.1 Technical Specification for UMTS Mode Radio Frequency

7.1.1 Maximum Transmission Power

In the normal test environment, UMTS 2100/1900/850/900/(1700)MHz maximum output power meets

the requirement in Table 7-1. The test values are the average of some test samples. Under different

environments, the testing results might be slightly different. Take the actual situation as the reference.

Table 7–1 Maximum Transmission Power

Power grade

Maximum output power

Tolerance value

Test value

Class 3

24dBm

+1/-3dBm

TBD

7.1.2 Receiving Sensitivity

UMTS 2100/1900/850/900/(1700)MHz receiving sensitivity meets 3GPP TS 34.121 protocol

requirement. Under the specification that BER does not exceed 0.001, it meets the requirement in Table

7-2. The test values are the average of some test samples. Under different environments, the testing

results might be slightly different. Take the actual situation as the reference.

Table 7–2 Receiving Sensitivity Reference Table

Operating

band

Unit

DPCH_Ec

Test value



dBm/3.84 MHz

-117

-106.7

TBD



dBm/3.84 MHz

-115

-104.7

TBD



dBm/3.84 MHz

-117

-106.7

TBD



dBm/3.84 MHz

-115

-104.7

TBD



dBm/3.84 MHz

-114

-104.7

TBD

NOTE 1: For Power class 3 this shall be at the maximum output power

NOTE 2: For Power class 4 this shall be at the maximum output power

NOTE 3: For the UE which supports both Band  and Band  operating frequencies, the

reference sensitivity level of -114.5 dBm DPCH_Ec<REFSENS> shall apply for Band .

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The corresponding <REFIOR> is -104.2 dBm

7.1.3 Spurious Specification

Spurious emission meets 3GPP TS 34.121 protocol requirement.

The receiver spurious emission power refers to the spurious power generated or amplified by the receiver,

which is tested from the antenna connector.

The spurious emission shall meet the requirements in Table 7-3 and Table 7-4:

Table 7–3 General Requirement of Receiver Spurious Emission

Frequency band

Resolution rate

bandwidth

Minimum requirement

9 kHz  f < 1 GHz

100 kHz

-57 dBm

1 GHz  f < 12.75 GHz

1 MHz

-47 dBm

Table 7–4 Additional Spurious Emission Requirement

Frequency band

Measurement

bandwidth

Minimum requirement

1920 MHz  f  1980 MHz

3.84 MHz

-60 dBm

2110 MHz  f  2170 MHz

3.84 MHz

-60 dBm

7.2 Technical Specification of GSM Mode Radio Frequency

7.2.1 Maximum Transmission Power

In the normal test environment, GSM: 1900/1800/900/850MHz maximum output power meets the

requirement in Table 7-5. The test values are the average of some test samples. Under different

environments, the testing results might be slightly different. Take the actual situation as the reference.

Table 7–5 Maximum Transmission Power

Operating

band

Power

control level

Power

class

Maximum

output power

Tolerance

value

Test

Value



2

Class 2

30dBm

±2dBm

TBD



2

Class 2

30dBm

±2dBm

TBD

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

2

Class 4

33dBm

±2dBm

TBD



2

Class 4

33dBm

±2dBm

TBD

7.2.2 Receiving Sensitivity

GSM 1900/1800/900/850MHz receiving sensitivity meets 3GPP TS 34.121 protocol requirement. Under

the specification that BER does not exceed 2.24, it meets the requirement smaller than -102dBm. It

meets the requirement in Table 7-6. The test values are the average of some test samples. Under different

environments, the testing results might be slightly different. Take the actual situation as the reference.

Table 7–6 Reference Table of Receiving Sensitivity

Operating Band

Unit

3GPP Protocol Claim

Test value

GSM850

dBm/3.84 MHz

≤-102dBm

TBD

GSM900

dBm/3.84 MHz

≤-102dBm

TBD

GSM1800

dBm/3.84 MHz

≤-102dBm

TBD

GSM1900

dBm/3.84 MHz

≤-102dBm

TBD

7.3 Technical Specification of LTE Mode Radio Frequency

7.3.1 Maximum Transmission Power

The maximum output power of LTE FDD, LTE TDD in the normal test environment meets Table 7-7

requirement. The test values are the average of some test samples. Under different environments, the

testing results might be slightly different. Take the actual situation as the reference.

Table 7–7 Maximum Transmission Power

Power grade

Maximum output power

Tolerance value

Test value

Class 3

23 dBm

+2.7/-2.7dBm

21.4 dBm

7.3.2 Receiving Sensitivity

LTE FDD/TDD receiving sensitivity meets 3GPP TS 36.101 protocol requirement. Under the

specification that the throughput is not smaller than 95% of the maximum throughput, it meets Table 7-8

requirement. The test values are the average of some test samples. Under different environments, the

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ZM8620_V2

testing results might be slightly different. Take the actual situation as the reference.

Table 7–8 Receiving Sensitivity Reference Table

E-UTRA

Band

Channel bandwidth

Test value

(dBm)

1.4 MHz

(dBm)

3 MHz

(dBm)

5 MHz

(dBm)

10 MHz

(dBm)

15 MHz

(dBm)

20 MHz

(dBm)

Duplex

Mode

1

-

-100

-97

-95.2

-94

FDD

TBD

2

-102.7

-99.7

-98

-95

-93.2

-92

FDD

TBD

3

-101.7

-98.7

-97

-94

-92.2

-91

FDD

--

4

-104.7

-101.7

-100

-97

-95.2

-94

FDD

TBD

5

-103.2

-100.2

-98

-95

FDD

TBD

6

-100

-97

FDD

--

7

-98

-95

-93.2

-92

FDD

TBD

8

-102.2

-99.2

-97

-94

FDD

TBD

9

-99

-96

-94.2

-93

FDD

--

10

-100

-97

-95.2

-94

FDD

--

11

-100

-97

FDD

--

12

-101.7

-98.7

-97

-94

FDD

TBD

13

-97

-94

FDD

--

14

-99.2

-97

-94

FDD

--

…

--

17

-102.2

-99.2

-97

-94

FDD

--

18

-100

-97

-95.2

FDD

--

19

-100

-97

-95.2

FDD

--

20

-97

-94

-91.2

-90

FDD

--

21

-100

-97

-95.2

FDD

--

…

--

33

-100

-97

-95.2

-94

TDD

--

34

-100

-97

-95.2

-94

TDD

--

35

-106.2

-102.2

-100

-97

-95.2

-94

TDD

--

36

-106.2

-102.2

-100

-97

-95.2

-94

TDD

--

37

-100

-97

-95.2

-94

TDD

--

38

-100

-97

-95.2

-94

TDD

TBD

39

-100

-97

-95.2

-94

TDD

--

40

-100

-97

-95.2

-94

TDD

--

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41

[-100]

[-97]

[-95.2]

[-94]

TDD

--

Note 1: The transmitter shall be set to maximum output power level as defined in clause 6.2.5 in the protocol

of 3GPP TS 36.101

Note 2: Reference measurement channel is specified A.3.2 with one sided dynamic OCNG Pattern OP.1

FDD/TDD as described in Annex A.5.1.1/A.5.2.1 in the protocol of 3GPP TS 36.101

Note 3: The signal power is specified per port

Note 4: For the UE which supports both Band 3 and Band 9 the reference sensitivity level of Band 3 + 0.5

dB is applicable for band 9

Note 5: For the UE which supports both Band 11 and Band 21 the reference sensitivity level is FFS.

7.3.3 Spurious Specification

Spurious emission meets 3GPP TS 36.101 protocol requirement.

The receiver spurious emission power refers to the spurious power generated or amplified by the module,

which is tested from the antenna connector.

The spurious emission shall meet the requirement of Table 7-9 and Table 7-10:

Table 7–9 General Requirement of Receiver Spurious Emission

Frequency range

Maximum level

Measurement bandwidth

9 kHz  f < 150 kHz

-36 dBm

1 kHz

150 kHz  f < 30 MHz

-36 dBm

10 kHz

30 MHz  f < 1000

MHz

-36 dBm

100 kHz

1 GHz  f < 12.75 GHz

-30 dBm

1 MHz

Table 7–10 UE Co-existence Spurious Emission Requirement

E-UTRA

Band

Spurious emission

Protected band

Frequency range

(MHz)

Level

(dBm)

Bandwidth

(MHz)

Comment

1

E-UTRA Band 1, 3, 7, 8, 9, 11,

34, 38, 40

FDL_low - FDL_high

-50

1

Frequency range

860-895

-50

1

Frequency range

1884.5-1919.6

-41

0.3

Note6,Note7

1884.5-1915.7

Note 6, Note8

E-UTRA band 33

1900-1920

-50

1

Note 3

E-UTRA band 39

1880-1920

-50

1

Note 3

2

E-UTRA Band 2, 4, 5, 10, 12,

13, 14, 17

FDL_low- FDL_high

-50

1

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3

E-UTRA Band 1, 3, 7, 8, 9, 11,

33, 34, 38

FDL_low- FDL_high

-50

1

4

E-UTRA Band 2, 4, 5, 10, 12,

13, 14, 17

FDL_low- FDL_high

-50

1

5

E-UTRA Band 2, 4, 5, 10,

12, 13, 14, 17

FDL_low- FDL_high

-50

1

6

E-UTRA Band 1, 9, 11, 34

FDL_low- FDL_high

-50

1

Frequency range

860-875

-37

1

Frequency range

875-895

-50

1

Frequency range

1884.5-1919.6

-41

0.3

Note7

1884.5-1915.7

Note8

7

E-UTRA Band 1, 3, 7, 8, 33,

34

FDL_low- FDL_high

-50

1

E-UTRA Band 38

2570-2620

-50

1

Note 3

8

E-UTRA Band 1, 8, 7, 33,

34, 38, 39, 40

FDL_low- FDL_high

-50

1

E-UTRA band 3

1805-1830

-50

1

Note 4

E-UTRA band 3

1805-1880

-36

0.1

Note 2,4

E-UTRA band 3

1830-1880

-50

1

Note 4

E-UTRA band 7

2640-2690

-50

1

Note 4

E-UTRA band 7

2640-2690

-36

0.1

Note 2,4

9

E-UTRA Band 1, 9, 11, 34

FDL_low- FDL_high

-50

1

Frequency range

860-895

-50

1

Frequency range

1884.5-1919.6

-41

0.3

Note7

1884.5-1915.7

Note8

10

E-UTRA Band 2, 4, 5, 10, 12,

13, 14, 17

FDL_low- FDL_high

-50

1

11

E-UTRA Band 1, 9, 11, 34

FDL_low- FDL_high

-50

1

Frequency range

860-895

-50

1

Frequency range

1884.5-1919.6

-41

0.3

Note7

1884.5-1915.7

Note8

12

E-UTRA Band 2, 4, 5, 10,

12, 13, 14, 17

FDL_low- FDL_high

-50

1

13

E-UTRA Band 2, 4, 5, 10,

12, 13, 14, 17

FDL_low- FDL_high

-50

1

Frequency range

763-775

-35

0.00625

14

E-UTRA Band 2, 4, 5, 10,

12, 13, 14, 17

FDL_low- FDL_high

-50

1

Frequency range

763-775

-35

0.00625

17

E-UTRA Band 2, 4, 5, 10,

12, 13, 14, 17

FDL_low FDL_high

-50

1

…

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33

E-UTRA Band 1, 3, 8, 34,

38, 39, 40

FDL_low- FDL_high

-50

1

Note 5

34

E-UTRA Band 1, 3, 7, 8, 9,

11, 33, 38,39, 40

FDL_low- FDL_high

-50

1

Note 5

Frequency range

860-895

-50

1

Frequency range

1884.5-1919.6

-41

0.3

Note7

1884.5-1915.7

Note8

35

36

37

38

E-UTRA Band 1,3, 33, 34

FDL_low- FDL_high

-50

1

39

E-UTRA Band 34, 40

FDL_low- FDL_high

-50

1

40

E-UTRA Band 1, 3, 33, 34, 39

FDL_low- FDL_high

-50

1

Note

1

FDL_low and FDL_high refer to each E-UTRA frequency band specified in Table 5.5-1 in the protocol

of 3GPP TS 36.101

2

As exceptions, measurements with a level up to the applicable requirements defined in Table 7-9 are

permitted for each assigned E-UTRA carrier used in the measurement due to 2nd or 3rd harmonic

spurious emissions. An exception is allowed if there is at least one individual RE within the

transmission bandwidth (see Figure 5.6-1 in the protocol of 3GPP TS 36.101) for which the 2nd or 3rd

harmonic, i.e. the frequency equal to two or three times the frequency of that RE, is within the

measurement bandwidth.

3

To meet these requirements some restriction will be needed for either the working band or protected

band

4

Requirements are specified in terms of E-UTRA sub-bands

5

For non synchronized TDD operation to meet these requirements some restriction will be needed for

either the working band or protected band

6

Applicable when NS_05 in section 6.6.3.3.1 in the protocol of 3GPP TS 36.101 is signaled by the

network.

7

Applicable when co-existence with PHS system working in. 1884.5-1919.6MHz.

8

Applicable when co-existence with PHS system working in 1884.5-1915.7MHz.

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8 Antenna

8.1 RF Antenna Specification

8.1.1 Technical Parameter for the Main Antenna Connector

The main and diversity antenna is the product U.FL-R-SMT-1(80)(HRS)/ ECT818000071(ECT). The

Profile Dimensions is shown in Figure 8-1. If more technical parameter for the main antenna connector

is needed, please contact with ZTEWelink.

Figure 8–1 the Profile Dimensions

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ZM8620_V2

The PCB layout is shown in the Figure 8-2.

Figure 8–2 Recommended PCB layout

 NOTE:

The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is

U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13

of I-PEX by ZM8620 before.

8.2 Proposal on Layout of Product in Terminal Product

The module layout among other terminal products should take full consideration of the electric magnetic

compatibility. As the types of terminal products vary and their circuit layouts are different, when

considering the module layout, we should reduce the electric magnetic interference from other devices

upon the module. Taking 3G Internet-access laptop as an example, during the layout of laptops, make

sure that the module is not adjacent to the switch power or the high-speed signal cable, and well protect

the cabling of these interference sources. At the same time, keep the antenna and the coaxial cables of

network cables and antenna far away from the interference sources. Keep the module away from the

devices that have a large heat-radiating capacity such as CPU, hard disk and south bridge, to guarantee

that heat can be radiated effectively.

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8.3 Antenna Dimensions and Location

The dimensions of different terminal products are different, so they impose different requirements upon

the performance of antenna. The dimensions and location of antennas are also different. Taking 3G

Internet-access laptop as an example, it is recommended that the antenna be placed on the top of LCD.

8.4 Diversity Antenna Design

ZM8620_V2 supports diversity receiving function, and if it is necessary to support diversity, the

notebook needs to add diversity antenna. The design method of the diversity antenna is consistent with

the main antenna, and its efficiency index is allowed to reduce by 3dB. The isolation of the main antenna

and the diversity antenna is required to be bigger than 12dB.

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9 Debugging Environment and Method

In the process of the actual implementation, it is necessary to adopt the switching board to convert MINI

PCIE module interface into the standard USB interface to connect the host for debugging verification. It

is also necessary to connect external power supply adaptor to provide the module with sufficient current,

and the diagram for the switching board is as follows:

Module

board

Computer

host

Switching

board

Power supply

adapter

PCI Express

Mini Card

Interface USB Port

AC

Figure 9–1 The diagram for the switching board

9.1 Debugging Board

Figure 9-2 shows the module debugging & installation method. The debugging board is mainly used to

debug the basic functions of ZM8620_V2 module, such as downloading the JTAG program, resetting the

module, powering off and shutting down RF, LED indicator display, making a call or browsing web

pages via computer UI by inserting the USIM card into the switching board. The USB interface supplies

power to the debugging board, provides it to the module after LDO conversion, and directly supplies the

power to the module by the power socket on the board.

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ZM8620_V2

Figure 9–2 Debugging Board

Note: 1 – UIM card console; 2 –JTAG downloading interface; 3- DC power interface; 4 – USB interface; 5 – LED indicator; 6

- PON_RESET_N button (module resetting); 7 –W_DISABLE_N button (RF switch)

9.2 Interfaces on Debugging Board

9.2.1 JTAG Interface

The JTAG interface can be used to download and debug the firmware program. This interface is reserved

in the module of ZM8620_V2.

9.2.2 USB Interface

The USB2.0 interface on the debugging board is connected to the PCI-E interface on ZM8620_V2.

9.2.3 Power-supply Interface

The USB interface as illustrated in Figure 9-2 supplies power, provides the 3.3V power to the module

after LDO conversion, and directly supplies the 3.3V power to the module by the power socket on the

board.

Module

ZM8620_V2

1

2

3

4

5

6

7

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ZM8620_V2

9.2.4 USIM Card Console Interface

As shown in Figure 9-2, 1 the USIM card console is the 5PIN USIM card console on the conversion

board, connecting to: power, ground, UIM_DATA, USIM_CMD and UIM_CLK. It supports the

1.8V/3V USIM card.

9.2.5 PON_RESET_N Button

This button corresponds to the PON_RESET_N PIN of the PCI-E interfaced. The user presses the button

to reset the module.

9.2.6 W_DISABLE_N Button

This button corresponds to the W_DISABLE_N PIN of the PCI-E interface. The user presses this button

to enable or disconnect RF, so as to perform the debugging of this PIN.

9.2.7 LED Indicator

The LED indicator on the debugging board is connected to the LED_WWAN_N interface of

ZM8620_V2. By controlling the indicator, the user can debug the function of this interface.

Hardware Development Guide of Module Product

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ZM8620_V2

10 Package System

The ZM8620_V2 modules are wrapped with anti-static shielding bags, which is packaged on EPE trays of 6

pieces each. And these modules are put into cardboard box in a set of 10 trays. Each cardboard box is with 60

modules typically.

The package process of ZM8620_V2 modules is shown as the Figure below. The unit of dimensions is mm.

Figure 10–1 Package process of ZM8620_V2 modules

×10 trays

Cardboard box

Hardware Development Guide of Module Product

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ZM8620_V2

11 Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage, service

or repair of any cellular terminal incorporating ZM8620_V2 module. Manufacturers of the cellular terminal

should send the following safety information to users, operating personnel and to incorporate these guidelines

into all manuals supplied with the product.

The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, aircrafts, airports,

etc, switch off before boarding an aircraft. Make sure the cellular terminal is switched off in these areas.

The operation of wireless appliances in the hospitals, aircrafts and airports are forbidden to prevent

interference with communication systems.

 Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or

chemical transfer or storage facilities, areas where the air contains chemicals or particles such as

gasoline stations, oil refineries, etc make sure that wireless devices are turned off.

It‘s the responsibility of users to enforce other country regulations and the specific environment regulations.

And ZTEWelink does not take on any liability for customer failure to comply with these precautions.

12.NOTICE

Note1

：

This device complies with Part 15 of the FCC Rules

，

Operation is subject to the

following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference

that may cause undesired operation.

Note2: This equipment has been tested and found to comply with the limits for a Class

B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to

radio or television reception, which can be determined by turning the equipment off and

on, the user is encouraged to try to correct the interference by one or more of the

following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

Note3: For EUT which intended use is at least 20 cm between human body and antenna.

Note4: Label of The End Product

The final end product must be labeled in a visible are with the following



Contains TX

FCC ID:SRQ-ZM8620



.The FCC part 15.19 statement below has to also be available on

the label:This device complies with Part 15 of FCC rules.Operation is subject to the foll

owing two conditions: (1) This device may not cause harmful interference, and (2) this

device must accept any interference received, including interference that may cause u

ndesired operation. To comply with FCC regulations limiting both maximum RF output

power and human exposure to RF radiation.

A user manual with the end product must clearly indicate the operating requirements a

nd conditions that must be observed to ensure compliance with current FCC RF expos

ure guidelines. The end product with an Module may also need to pass the FCC Part 1

5 unintentional emission testing requirements and be properly authorized per FCC Part

15. Note:If this module is intended for use in a portable device,you are responsible for

separate approval to satify the SAR requirements of FCC Part 2.1093.

ZTE ZM8620 LTE Wireless Data Terminal User Manual

ZTE Corporation LTE Wireless Data Terminal Users Manual

User Manual

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