ZTE ZTEMF206A HSPA LGA Module User Manual

Hardware Development Guide of

Module Product

Version 2.5, 2015-06-18

MF206A

Hardware Development Guide of Module Product

MF206A

Legal Information

By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as

ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the

following terms, please stop using the document.

contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink,

no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or

any image, table, data or other information contained in this document.

is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are

ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE

Corporation’s registered trademark. The other products or company names mentioned in this

document are the trademark or registered trademark of their respective owner. Without the prior

written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.

The product meets the design requirements of environmental protection and personal security. The

storage, use or disposal of products should abide by the product manual, relevant contract or the laws

and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document

without prior notice, and keeps the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

Hardware Development Guide of Module Product

MF206A

Revision History

Version

Date

Description

1.0

2010-11-18

Initial version

2.0

2011-3-15

Chapter 1:

1. Add the application range and compilation purpose

Chapter 2:

1. Update Table2-1

2. Add the introduction of baseband function and radio frequency;

add the frame structure

Chapter 3:

1. Add the definition of PIN I/O parameter, and provide the

description of PINs

2. Add the feature of interface PWL

Chapter 4:

1. Add the chapter

Chapter 5:

1. Update the RF sourced index and source less index

Chapter 6:

1. Update the testing standard and testing environment

Chapter 7:

1. Add the chapter

Chapter 8:

1. Add the chapter

2.1

2013-03-26

1. Modify the logo of cover and page footer

2. Modify Legal Information

3. Modify some errors in the Table 2-2 of Working Frequency Band

4. Update the Table 1-1 of Supported Document List

5. Modify the chapter of 7.7 of Recommended Upgrade Methods

6. Modify the Figure 7-1 of Main Antenna RF Connector Interface

to erase the IMEI in picture

7. Modify the test result in Table 6-6

8. Modify the name of Table 5-1 to sourceless

2013-05-31

9. Release as Version 2.1

2.2

2013-12-09

1. Modify the Figure 2-2.

2. Add the contact information

Hardware Development Guide of Module Product

MF206A

Version

Date

Description

3. Update Document Format

2.3

2013-12-30

1. Add the profile dimensions of RF antenna console

2. Modify part 7.3 of RF Circuit Design

2.4

2014-06-30

1. Update the legal information

2. Add the NOTE in chapter 1.2

3. Update Table 1-1 of Reference Document List

4. Update Table 2-1 of Major Technical Parameters

5. Update Table 3-1 of PIN Parameters

6. Add Table 3–3 of The Mandatory Pins of Module

7. Update Figure 3-3 of SD Typical Application Circuit

8. Modify chapter 3.10 of Power-on/Power-off & Reset Signal

9. Update Figure 3-16 of Reference Circuit of Status Indicator

10. Modify chapter 4.2 of Working Current

11. Move the chapter 4.2 and 4.3 of Power-on/Power-off Flow in the

former document to chapter 3.10

12. Modify Index of RF under UMTS & GPRS/GSM/EDGE Mode

in chapter 5.1 and 5.2

13. Add the NOTE in chapter 6.3

14. Add Figure 9-1 of Recommended PCB Wielding Panel Design

15. Modify Figure 5–1 of Main Antenna RF Connector Interface

16. Modify chapter 10.2 of Furnace Temperature Curve

17. Add chapter 11 of Safety Information

18. Add the chapter 10.3 of Package System

2.5

2015-06-15

1. Add the description of Suspend and Resume of module in

chapter 3.10 &3.7

2. Update the figures of module

Hardware Development Guide of Module Product

MF206A

Contact Information

Post

9/F, Tower A, Hans Innovation Mansion,

North Ring Rd., No.9018, Hi-Tech Industrial Park,

Nanshan District, Shenzhen. P.R.China

Web

www.ztewelink.com

Phone

+86-755-26902600

E-Mail

ztewelink@zte.com.cn

Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware

upgrades, troubleshooting tips, and press releases

Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone,

website, instant messaging, E-mail and on-site.

Hardware Development Guide of Module Product

MF206A

Contents

1 About This Document ...................................................................................... 13

1.1 Application Range ............................................................................................................ 13

1.2 Purpose ............................................................................................................................ 13

1.3 Supported & Reference Document List ............................................................................... 13

1.4 Abbreviations ................................................................................................................... 14

2 Product Overview ............................................................................................ 15

2.1 Mechanic Features ............................................................................................................ 16

2.2 Technical Parameters ........................................................................................................ 17

2.3 Function Overview ........................................................................................................... 20

2.3.1 Baseband Function ........................................................................................................... 20

2.3.2 Radio Frequency Function ................................................................................................. 21

3 Interfaces ......................................................................................................... 23

3.1 Definition of PINs ............................................................................................................ 23

3.1.1 Definition of PIN I/O Parameters ....................................................................................... 23

3.1.2 PIN Configuration Diagram ............................................................................................... 23

3.1.3 PIN Description ................................................................................................................ 25

3.2 Working Condition ........................................................................................................... 29

3.3 Feature of Digital Power Level .......................................................................................... 30

3.4 Power Interface ................................................................................................................ 30

3.4.1 Description of Power PINs ................................................................................................ 30

3.4.2 Requirement of Power Supply ........................................................................................... 30

3.5 (U)SIM Card Interface ...................................................................................................... 31

3.5.1 Description of PINs .......................................................................................................... 31

3.5.2 Electric Feature ................................................................................................................ 31

3.5.3 Application of (U)SIM Card Interface ................................................................................ 32

3.6 SD Card Interface ............................................................................................................. 32

Hardware Development Guide of Module Product

MF206A

3.6.1 Description of PINs .......................................................................................................... 32

3.6.2 Electric Feature ................................................................................................................ 33

3.6.3 Application of SD Card Interface ....................................................................................... 33

3.7 USB2.0 Interface .............................................................................................................. 34

3.7.1 Description of PINs .......................................................................................................... 34

3.7.2 Electric Feature ................................................................................................................ 34

3.7.3 Application of USB Interface............................................................................................. 34

3.8 SPI (Serial Peripheral Interface) Bus Interface .................................................................... 35

3.8.1 Description of PINs .......................................................................................................... 35

3.8.2 Electric Feature ................................................................................................................ 35

3.9 I2C Bus ........................................................................................................................... 36

3.9.1 Description of PINs .......................................................................................................... 36

3.9.2 Electric Feature ................................................................................................................ 37

3.10 UART Interface ................................................................................................................ 38

3.10.1 Description of PINs .......................................................................................................... 38

3.10.2 Electric Feature ................................................................................................................ 38

3.11 JTAG (Joint Test Action Group) Interface .......................................................................... 39

3.11.1 Description of PINs .......................................................................................................... 39

3.11.2 Application of JTAG Interface ........................................................................................... 40

3.12 Power-on/Power-off & Reset Signal ................................................................................... 40

3.12.1 Description of PINs .......................................................................................................... 40

3.12.2 Power-on/Power-off Flow ................................................................................................. 42

3.12.3 Resetting Flow ................................................................................................................. 43

3.13 Interactive Application Interface ........................................................................................ 44

3.13.1 Description of PINs .......................................................................................................... 44

3.13.2 Interface Application ........................................................................................................ 45

3.14 LED Indicator Interface .................................................................................................... 45

3.14.1 Description of PINs .......................................................................................................... 45

3.14.2 Interface Application ........................................................................................................ 46

Hardware Development Guide of Module Product

MF206A

4 Power Interface Design Guideline ..................................................................... 47

4.1 General Design Rules........................................................................................................ 47

4.2 Power Supply Requirement ............................................................................................... 47

4.3 Circuit Requirements of Power Supply Output .................................................................... 48

4.4 Recommended Power Reference Circuit ............................................................................. 49

4.5 PCB Layout Guideline of Power Supply ............................................................................. 51

5 RF Antenna Design Guide ................................................................................ 53

5.1 Antenna Types ................................................................................................................. 53

5.2 Antenna RF Cable and RF Connector ................................................................................. 53

5.2.1 RF Connector ................................................................................................................... 53

5.2.2 RF Cable.......................................................................................................................... 56

5.3 Design of Antenna ............................................................................................................ 57

5.3.1 Preliminary Antenna Evaluation ........................................................................................ 57

5.3.2 Suggested Antenna Location ............................................................................................. 58

5.3.3 Suggested Antenna Occupancy Space ................................................................................ 58

5.3.4 Matching Circuit of Antenna ............................................................................................. 58

5.3.5 Type of Antenna RF Cable & RF Connector ....................................................................... 59

5.4 Recommended Antenna Manufacturers .............................................................................. 60

5.5 PCB line guidelines .......................................................................................................... 60

5.6 Suggestions for EMC & ESD Design ................................................................................. 61

5.6.1 EMC Design Requirements ............................................................................................... 61

5.6.2 ESD Design Requirements ................................................................................................ 62

5.7 Antenna Indexes ............................................................................................................... 62

5.7.1 Passive Indexes ................................................................................................................ 63

5.7.2 Active Indexes ................................................................................................................. 63

5.7.3 Test Methods for Whole-Set Antenna OTA ........................................................................ 64

6 Electric Feature ............................................................................................... 65

6.1 Power Supply ................................................................................................................... 65

Hardware Development Guide of Module Product

MF206A

6.2 Working Current .............................................................................................................. 65

7 Technical Index of Radio Frequency ................................................................. 68

7.1 Index of RF under UMTS Mode ........................................................................................ 68

7.1.1 UMTS (WCDMA) ............................................................................................................ 68

7.1.2 Acquiring Radio Frequency Index ...................................................................................... 69

7.1.3 Maximum Transmission Power .......................................................................................... 69

7.1.4 Receiving Sensibility ........................................................................................................ 69

7.1.5 Spurious Emission Index ................................................................................................... 70

7.2 Index of RF under GPRS/GSM/EDGE Mode ...................................................................... 70

7.2.1 Output Transmission Power ............................................................................................... 70

7.2.2 Receiving Sensibility ........................................................................................................ 71

7.2.3 Spurious Emission Index ................................................................................................... 71

8 Related Test & Test Standard ........................................................................... 72

8.1 Testing Reference ............................................................................................................. 72

8.2 Description of Testing Environment ................................................................................... 73

8.3 Reliability Testing Environment ........................................................................................ 74

8.4 Reliability Testing Result .................................................................................................. 75

9 Design Guide ................................................................................................... 77

9.1 General Design Rule & Requirement .................................................................................. 77

9.2 Suggestions for PCB Wielding Panel Design ...................................................................... 77

9.3 Suggestions for Heat-dissipation Design ............................................................................. 78

9.4 Recommended Product Upgrading Plan .............................................................................. 79

10 Manufacturing Guide ....................................................................................... 80

10.1 Design of Steel Mesh ........................................................................................................ 80

10.2 Furnace Temperature Curve .............................................................................................. 81

10.3 Package System ................................................................................................................ 83

11 Safety Information ........................................................................................... 85

Hardware Development Guide of Module Product

MF206A

Figures

Figure 2–1 Product Illustration ............................................................................................ 15

Figure 2–2 Module Dimensions ........................................................................................... 16

Figure 2–3 System Connection Structure .............................................................................. 21

Figure 3–1 PIN Configuration Diagram ................................................................................ 24

Figure 3–2 (U)SIM Card Signal Connection Circuit ............................................................... 32

Figure 3–3 SD Typical Application Circuit ........................................................................... 33

Figure 3–4 USB Typical Circuit Application ......................................................................... 35

Figure 3–5 SPI Bus Sequence Chart ..................................................................................... 36

Figure 3–6 I2C Reference Circuit Diagram ........................................................................... 37

Figure 3–7 Module Serial Port & AP Application Processor .................................................... 39

Figure 3–9 Turn on the Module Using Driving Circuit ............................................................ 41

Figure 3–10 Resetting the Module Using Driving Circuit ........................................................ 41

Figure 3–11 Power-on Sequence Chart of Module.................................................................. 42

Figure 3–12 Power-off Sequence Chart of Module ................................................................. 43

Figure 3–13 Module Resetting Flow ..................................................................................... 44

Figure 3–14 Timing of Resetting Module .............................................................................. 44

Figure 3–16 Reference Circuit of Status Indicator .................................................................. 46

Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS .............................. 48

Figure 4–2 Add storage capacitor to Module power supply terminal ......................................... 49

Figure 4–3 DC/DC Switching Power Supply ......................................................................... 50

Figure 4–4 LDO Power Supply ............................................................................................ 51

Figure 5–1 Main Antenna RF Connector Interface ................................................................. 54

Figure 5–2 Interface of Main Antenna and GPS Antenna Welding Pad ..................................... 54

Figure 5–3 RF Interface Testing Console .............................................................................. 55

Figure 5–4 Profile Dimensions of RF antenna console ............................................................ 55

Figure 5–5 Recommended Receptacles Mode for MF206A ..................................................... 57

Figure 5–6 Transition Circuit ............................................................................................... 59

Figure 5–7 The OTA test system of CTIA ............................................................................. 64

Figure 9–1 Recommended PCB Wielding Panel Design.......................................................... 78

Hardware Development Guide of Module Product

MF206A

Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel ....................................... 80

Figure 10–2 Furnace Temperature Curve Reference Diagram .................................................. 82

Figure 10–3 The dimensions of Package tray ......................................................................... 83

Figure 10–4 Package process of modules .............................................................................. 84

Hardware Development Guide of Module Product

MF206A

Tables

Table 1–1 Reference Document List ..................................................................................... 14

Table 1–2 Abbreviation List ................................................................................................ 14

Table 2–1 Major Technical Parameters ................................................................................. 18

Table 2–2 Working Frequency Band .................................................................................... 21

Table 3–1 PIN Parameters ................................................................................................... 23

Table 3–2 PIN Interface Definition ...................................................................................... 25

Table 3–3 Mandatory Pins of Module ................................................................................... 28

Table 3–4 Working Condition ............................................................................................. 29

Table 3–5 Power Level Range of Digital Signal ..................................................................... 30

Table 3–6 Definition & Description of (U)SIM Card Signal Group .......................................... 31

Table 3–7 Definition of SD Card Signal Interface .................................................................. 32

Table 3–8 Definition of SPI Signal ....................................................................................... 35

Table 3–9 Definition of UART Signal .................................................................................. 38

Table 3–10 Definition of JTAG Signal ................................................................................. 39

Table 3–11 Power-on/Power-off Time .................................................................................. 43

Table 3–12 Interactive Application Interface ......................................................................... 44

Table 3–13 Definition of LED PIN Signal ............................................................................. 45

Table 3–14 Definition of Indicator Status .............................................................................. 46

Table 5–1 The Cable Consumption ...................................................................................... 56

Table 5–2 Passive Indexes of Main Antennas on PAD Products ............................................... 63

Table 5–3 ZTEWelink Indexes for Mobile Terminal Devices .................................................. 63

Table 6–1 Input Voltage ..................................................................................................... 65

Table 6–2 Averaged standby DC power consumption ............................................................. 65

Table 6–3 Averaged idle mode DC power consumption .......................................................... 66

Table 6–4 Averaged DC power consumption in working state ................................................. 66

Table 7–1 Maximum Transmission Power ............................................................................ 69

Table 7–2 Reference Table of Receiving Sensitivity ............................................................... 69

Table 7–3 Spurious Emission Index...................................................................................... 70

Table 7–4 Output Transmission Power of GSM850/900/1800/1900 (GMSK) ............................ 70

Hardware Development Guide of Module Product

MF206A

Table 7–5 Reference Table of Receiving Sensitivity ............................................................... 71

Table 8–1 Testing Standard ................................................................................................. 72

Table 8–2 Testing Environment ........................................................................................... 73

Table 8–3 Testing Instrument & Device ................................................................................ 74

Table 8–4 Reliability Features ............................................................................................. 74

Table 8–5 Temperature Testing Result Under Windless Environment ....................................... 75

Table 8–6 High/Low-temperature Running & Storage Testing Result ....................................... 75

Table 10–1 Curve Temperature Curve Parameter Setting ........................................................ 81

Hardware Development Guide of Module Product

MF206A

1 About This Document

1.1 Application Range

This document is applicable as the hardware development guide of MF206A WCDMA module products. The

user can design the product according to the requirement and guidance in this document. It is only applicable for

the hardware application and development of MF206A WCDMA module products.

1.2 Purpose

This document provides the hardware solutions and development fundamentals for a product with the

ZTEWelink module. By reading this document, the user can have an overall knowledge of MF206A and a clear

understanding of the technical parameters. With this document, the user can successfully fulfill the application

and development of wireless 3G Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests

and related testing standards, service function implementation flow, RF performance indexes and a guide on the

design of user circuits, to provide the user with a complete design reference.

 NOTE:

To ensure the module manufacturing and welding quality, do as the chapter 10 of Manufacturing Guide in

this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a

single pass and ensure the module soldering quality

1.3 Supported & Reference Document List

Besides the hardware development document, ZTEWelink also provides the board operation guide, software

development guide and upgrading plan guide of MF206A. Table 1–1 is the list of supported documents.

Hardware Development Guide of Module Product

MF206A

Table 1–1 Reference Document List

NO.

Document Name

1

ZTEWelink LGA Type Ⅱ Module Dev Board User Guide.pdf

2

ZTEWelink Software Development Guide of Module

Products.pdf

3

AT Commands reference guide for ZTEWelink WCDMA

Modules.pdf

4

ZTEWelink SMT & Baking User Guide of Module Products.pdf

1.4 Abbreviations

Table 1–2 is a list of abbreviations involved in this document, as well as the English full names.

Table 1–2 Abbreviation List

Abbreviations

Full Name

AP

Another name of DTE

BER

Bit Error Rate

DL

Downlink

DPCH

Dedicated Physical Channel

ESD

Electro-Static discharge

ECT

Electric Connector Technology CO.,LTD

GPRS

General Packet Radio Service

GSM

Global Standard for Mobile Communications

I/O

Input/output

LED

Light Emitting Diode

PWL

Power Level

SIM

Subscriber Identification Module

SMT

Surface Mount Technology

SPI

Serial Peripheral Interface

UMTS

Universal Mobile Telecommunication System

WCDMA

Wideband Code Division Multi Access

Hardware Development Guide of Module Product

MF206A

2 Product Overview

MF206A is a wireless Internet module with LGA interface. A rich set of internet protocols and abundant

functions extend the applicability of the module to a wide range of M2M applications such as metering, tracking

systems, security solutions, routers, wireless POS, mobile computing devices, PDAs, tablet PC and so on. The

features of module are described as below.

1. It can support UMTS 850(900)/1900/2100MHz frequency band, and GSM/GPRS/EDGE

850/900/1800/1900MHz frequency band.

2. It can provide high-speed data access service under the mobile environment.

3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V), USB2.0 interface, UART

interface, SD2.0 interface, power-on/power-off, and resetting.

Figure 2–1 Product Illustration

Note: The figures above are just for reference.

Hardware Development Guide of Module Product

MF206A

2.1 Mechanic Features

MF206A is a 108-pin LGA encapsulation module. Except for the signal PIN, there are many dedicated

heat-dissipation ground wielding panel to improve the grounding performance, mechanical strength and

heat-dissipation performance. There are altogether 30 heat-dissipation ground wielding panels, evenly

distributed at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm, and the height is

2.5+/-0.2mm. The location of PIN 1 is identified by the ground wielding panel with an inclination at the bottom,

and its angle orientates to the top welding panel of the corresponding module. Figure 2–2 is a figure about the

dimensions of module, and the unit of dimensions is mm.

Figure 2–2 Module Dimensions

Hardware Development Guide of Module Product

MF206A

(Top View)

2.2 Technical Parameters

The major features of module can be described from the aspects of mechanic feature, base band, radio frequency,

technical standard and environment feature. Table 2-1 is a list of the major technical parameters and features

supported by module.

Hardware Development Guide of Module Product

MF206A

Table 2–1 Major Technical Parameters

Name

Item

Specifications

Mechanical

Feature

Dimensions

36mm * 26mm * (2.5+/-0.2)mm

Weight

About 5.5g

Encapsulation type

LGA package(108 Pin)

Baseband

Processor architecture

ARM 9 architecture

(U)SIM/SIM

Standard 6 PIN SIM card interface

Support 3V SIM card and 1.8V SIM card

Memory

32MByte NAND Flash/128MByte DDR

USB interface

USB 2.0 HIGH SPEED, the data transfer rate can reach up to 480

Mbps.

Can be used for AT command communication, data transmission,

GNSS NMEA output, software debug and firmware upgrade

UART interface

Used for AT command, data transmission or Diag service

And can be switch by the command of +UART

Maximum power

consumption

2.2W note1

Power Supply

The range of voltage supply is 3. 4V-4.2V, and the typical value

is3.8V

Working current note2

Peak current

≤2A (3.8V)

Average normal working current

≤500mA (3.8V)

Average normal working current

(without services)

≤75mA

Standby current

≤5mA (3.8V)

RF

GSM band

EDGE/GPRS/GSM Quad-band: GSM850, EGSM900, DCS1800,

PCS1900.

UMTS band

UMTS: 2100/1900/850(900)MHz

RxDiv band

NAnote3

Max. Transmitter Power

UMTS2100/1900/850(900): Power Class 3 (+24 +1/-3dBm)

GSM/GPRS 850MHz/900MHz: Power Class 4 (+33±2dBm)

GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30±2dBm)

EDGE 850MHz/900MHz: Power Class E2 (+27±3dBm)

EDGE 1800MHz/1900MHz: Power Class E2 (+26 -4/+3dBm)

Receiving sensitivity

WCDMA2100: ≤-106.7dBm

WCDMA1900/850: ≤-104.7dBm

Hardware Development Guide of Module Product

MF206A

Name

Item

Specifications

WCDMA900: ≤-103.7dBm

GSM850/900/1800/1900: ≤-102dBm

Main antenna interface

Support

Receive diversity (GPS)

antenna interface

Support the GPS wielding panel interface, don’t support the diversity

antenna interface .We don’t provide the antenna, and the antenna is

provided by the third party.

Technical

Standard

Data rate

GSM CS: UL 9.6kbps/DL 9.6kbps

GPRS: Multi-slot Class 10

EDGE: Multi-slot Class 12

WCDMA CS: UL 64kbps/DL 64kbps

WCDMA PS: UL 384kbps/DL 384kbps

HSDPA: DL 3.6Mbps

GPRS type

Class B

3GPP protocol

R99,R5

Other protocols

Support embedded TCP /UDP protocols

Support PPP protocol

Support the protocols PAP (Password Authentication Protocol) and

CHAP (Challenge Handshake Authentication Protocol) usually used

for PPP connections.

Operating system

Windows XP (SP2 and later)

Windows Vista

Windows 7

WinCE5.0/6.0 (X86 and ARM)

Linux

Android 2.x / 4.x

Environment

Feature note4

Normal Working

Temperature

-30 to 75° C

Storage Temperature

-45 to 90° C

Humidity

5%~ 95%

Application

RAS dialup

Support

GPS/AGPS

Support

SMS

Support Text and PDU mode.

Point to point MO and MT.

SMS Status Report & SMS centre address setting

Hardware Development Guide of Module Product

MF206A

Name

Item

Specifications

Management of SMS: read, write, send, receive, delete, storage

status, SMS list, new SMS alert

Network locking

Support

SIM READER

Support

AT Commands

Compliant with 3GPP TS 27.007, 27.005 and ZTEWelink AT

commands.

Upgrading

Support, the time of upgrading is less than 12min.

 NOTE:

1: Test condition: The maximum power consumption of the module refers to the average value measured

under the maximum transmission power;

2: In the working current, the peak current, average normal working current, average normal working

current (without services) are all the maximum value measured under the maximum power consumption.

The standby current refers to the current under the SLEEP mode

3: NA means unrelated.

4: Using the module beyond these conditions may result in permanent damage to the module.

2.3 Function Overview

2.3.1 Baseband Function

The baseband part of module mainly includes the following signal groups: USB signal, (U)SIM card signal,

wakeup signal, working status indicator signal, UART signal, SD interface signal, I2C interface signal, module

power-on/resetting signal, SPI, main antenna interface, GPS antenna interface and power-supply interface.

Figure 2–3 is a diagram of the system connection structure.

Hardware Development Guide of Module Product

MF206A

Figure 2–3 System Connection Structure

PA and

Switch

RF

Baseband

Memory

108 Pin LGA Connector Interface

USB

USIM

UART

I2C

SD

SPI

LED

POWER

JTAG

RESET

Data Bus

Address Bus

Control

Communication

Tx SAW

Filter

Main Antenna

Filter

RX

GPS Antenna

Rx

ADC

2.3.2 Radio Frequency Function

The radio frequency function of module can be viewed from the aspect of over-the-air wireless bearer network,

frequency band, whether the receive diversity feature is supported, and the GPS function.

1. Support UMTS 850(900)/1900/2100MHz;

2. Support GSM/EDGE/GPRS 850/900/1800/1900 MHz;

3. Support GPS/AGPS;

The working frequency band of module is as shown in Table 2–2.

Table 2–2 Working Frequency Band

Working Frequency Band

Uplink Frequency Band

Downlink Frequency Band

UMTS850

824 MHz — 849 MHz

869 MHz — 894 MHz

UMTS900

880 MHz — 915 MHz

925 MHz — 960 MHz

Hardware Development Guide of Module Product

MF206A

UMTS1900

1850 MHz — 1910 MHz

1930 MHz — 1990 MHz

UMTS2100

1920 MHz — 1980 MHz

2110 MHz — 2170 MHz

GSM850

824 MHz — 849MHz

869 MHz — 894 MHz

GSM900

890 MHz — 915MHz

935 MHz — 960MHz

GSM1800

1710 MHz — 1785MHz

1805 MHz — 1880MHz

GSM1900

1850 MHz — 1910MHz

1930 MHz — 1990MHz

Hardware Development Guide of Module Product

MF206A

3 Interfaces

3.1 Definition of PINs

3.1.1 Definition of PIN I/O Parameters

The definition of module I/O parameter is as shown in Table 3–1.

Table 3–1 PIN Parameters

PIN Attribute

Description

DI

Digital Input Pin

DO

Digital Output Pin

AI

Analog Input Pin

AO

Analog Output Pin

B

Two-way digital port, CMOS

input

Z

High-resistance output

P1

PIN group 1, the power supply

voltage is VDD_P1

P2

PIN group 2, the power supply

voltage is VDD_P2

PU

PIN internal pull-up

PD

PIN internal pull-down

3.1.2 PIN Configuration Diagram

The PIN sequence of interfaces on module is defined as shown in Figure 3–1.

Hardware Development Guide of Module Product

MF206A

Figure 3–1 PIN Configuration Diagram

2 3 45 6 7 8 9 10 11 12 14 15 16 17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41424344454647484950

51

5253545556

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79 80 81 82 83

84 85 86 87 88

89 90 91 92 93

94 95 96 97 98

99 100 101 102 103

104 105 106 107 108

13

1

ANT_MAIN

GND

JTAG_RESOUT_N

PON_RST_N

POWER_ON

AP_READY

I2C_SCL

I2C_SDA

MODULE_READY

AP_WAKEUP_MODULE

MODULE _WAKEUP_AP

GND

NC

GND

NC

NCSPI_CLK

NC

MODULE_POWERON

LED_GREEN

LED_RED

LED_BLUE

VPH_PWR

UART_CTS

UART_RFR

UART_TXD

UART_RXD

GND

NC

GND

ADC

GND

SPI_CS_N

SPI_DATA_MI_SO

SPI_DATA_MO_SI

USB_VBUS

GND

USB_DP

USB_DM

GND

VREG_RUIM

UIM_DATA

UIM_CLK

UIM_RST

UIM_DP

UIM_DM

GND

VREG_SDCC

SDCC_CMD

SDCC_CLK

SDCC_DATA3

SDCC_DATA2

SDCC_DATA1

SDCC_DATA0

SD_DET_N

GND

NC

GND

NC

GND

GPS_ANT

GND

JTAG_TRST_N

JTAG_RTCK

JTAG_TCK

JTAG_TDO

JTAG_TDI

JTAG_TMS

GND

(Top View)

Hardware Development Guide of Module Product

MF206A

3.1.3 PIN Description

Table 3–2 PIN Interface Definition

Signal Definition

Voltage

I/O

PIN Attribute

PU/PD

Remark

1

ANT_MAIN

--

AI/

AO

Main antenna feedback

point(50 ohm)

--

2

GND

--

Ground

--

3

JTAG_RESOUT_N

P1

DI

JTAG reset LGA

module

--

4

PON_RST_N

P1

DI

Reset the module

--

Pull-up to 1.8V internally.

Active low.

5

POWER_ON

P1

DI

Turn on/off the

module.

PU

Pull-up to 1.8V internally.

6

AP_READY

P1

DI

Module queries AP

sleep status

--

7

I2C_SCL

P1

B

I2C serial clock

--

8

I2C_SDA

P1

B

I2C serial data

--

9

MODULE_READY

P1

DO

AP queries Module

sleep status

--

10

AP_WAKEUP_MOD

ULE

P1

DI

AP wakes up Module

--

Low-power level wakeup.

To make the module

standby, the AP needs to

raise up this low signal.

11

MODULE

_WAKEUP_AP

P1

DO

Module wakes up AP

--

12

GND

--

13

NC

--

14

GND

--

15

NC

--

16

NC

--

17

NC

--

18

NC

--

19

MODULE_POWER

ON

P1

DO

MODULE power-on

status indicator

--

20

LED_GREEN

P1

AO

Signal indicator

interface

--

high-current driver.

Hardware Development Guide of Module Product

MF206A

Signal Definition

Voltage

I/O

PIN Attribute

PU/PD

Remark

21

LED_RED

P1

AO

Signal indicator

interface

--

high-current driver.

22

LED_BLUE

P1

AO

Signal indicator

interface

--

high-current driver.

23

VPH_PWR

Vmax =

4.2V

Vmin =

3.4V

Vnorm =

3.8V

AI

Power supply

--

It must be able to provide

sufficient current in a

transmitting burst which

typically rises to 2.0A.

24

VPH_PWR

--

25

VPH_PWR

--

26

VPH_PWR

--

27

UART_CTS

P1

DI(

HV

)

UART clear to send

signal

--

28

UART_RFR

P1

DO

UART ready for

receive signal

--

29

UART_TXD

P1

DO

UART transmit data

output

--

30

UART_RXD

P1

DI

UART receive data

input

--

31

GND

--

Ground

--

32

NC

--

33

NC

--

34

NC

--

35

NC

--

36

GND

--

Ground

--

37

ADC

--

AI

Analog / Digital

converter input

--

38

GND

--

Ground

--

39

SPI_CS_N

P1

DO

SPI interface channel

signal

--

40

SPI_CLK

P1

DO

SPI clock signal

--

41

SPI_DATA_MI_SO

P1

B

SPI data IO signal

--

42

SPI_DATA_MO_SI

P1

B

SPI data IO signal

--

43

USB_VBUS

--

AI

Power sense for the

internal USB

--

Pay attention to the

power-on sequence of

Hardware Development Guide of Module Product

MF206A

Signal Definition

Voltage

I/O

PIN Attribute

PU/PD

Remark

transceiver

VPH_PWR

44

GND

--

Ground

--

45

USB_DP

--

AI/

AO

USB differential data

(+)

--

Require differential

impedance of 90Ω.

46

USB_DM

--

AI/

AO

USB differential data

(-)

--

Require differential

impedance of 90Ω.

47

GND

--

Ground

--

48

VREG_RUIM

P1/ P2

AO

Power supply for

USIM card.

--

49

UIM_DATA

P1/ P2

B

Data signal of USIM

card.

--

50

UIM_CLK

P1/ P2

DO

Clock signal of USIM

card.

--

51

UIM_RST

P1/ P2

DO

Reset signal of

USIM card.

--

52

UIM_DP

P1/ P2

AI/

AO

Data plus line

--

53

UIM_DM

P1/ P2

AI/

AO

Data minus line

--

54

GND

--

Ground

--

55

VREG_SDCC

P2

AO

Power supply for SD

card.

--

56

SDCC_CMD

P2

B

SD card control signal

HV

--

57

SDCC_CLK

P2

DO

SD card clock signal

--

58

SDCC_DATA3

P2

B

SD card data signal

--

59

SDCC_DATA2

P2

B

SD card data signal

--

60

SDCC_DATA1

P2

B

SD card data signal

--

61

SDCC_DATA0

P2

B

SD card data signal

--

62

SD_DET_N

--

NC

--

Reserved

63

GND

--

Ground

--

64

NC

--

65

NC

--

66

GND

--

Ground

--

67

NC

--

Hardware Development Guide of Module Product

MF206A

Signal Definition

Voltage

I/O

PIN Attribute

PU/PD

Remark

68

NC

--

69

GND

--

Ground

--

70

GPS_ANT

--

GPS antenna

--

71

GND

--

Ground

--

72

JTAG_TRST_N

P1

DI

JTAG reset

PD

--

73

JTAG_RTCK

P1

DO

JTAG return clock

--

74

JTAG_TCK

P1

DI

JTAG clock input

-PU

--

75

JTAG_TDO

P1

Z

JTAG test data output

--

76

JTAG_TDI

P1

DI

JTAG test data input

PU

--

77

JTAG_TMS

P1

DI

JTAG test mode select

PU

--

78

GND

--

Ground

--

79.-

108.

GND

--

Heat-dissipation welder

--

 NOTE:

―NC‖ indicates Not Connected internal. That is, there is no connection inside the module. P1 and P2

refer to the power-supply signal level group 1 and 2.

If not used, almost all pins should be left disconnected. The only exceptions are the following pins as

shown in the Table 3-3 below:

Table 3–3 Mandatory Pins of Module

Signal Definition

Remark

1

ANT_MAIN

5

POWER_ON

Pull-up to 1.8V internally.

23

VPH_PWR

It must be able to provide sufficient current in a

transmitting burst which typically rises to 2.0A.

43

USB_VBUS

45

USB_DP

Require differential impedance of 90Ω.

46

USB_DM

Require differential impedance of 90Ω.

48

VREG_RUIM

49

UIM_DATA

Hardware Development Guide of Module Product

MF206A

50

UIM_CLK

51

UIM_RST

2/12/14/31/36/

38/44/47/54/63

/66/69/71/78

GND

79.-108.

GND

3.2 Working Condition

Table 3–4 Working Condition

Signal

Description

Min

Typical

Max

Unit

VPH_PWR

Main power supply of the module

3.4

3.8

4.2

V

USB_VBUS

Power supply PIN of USB PHY

3.3

5

5.25

V

ADC

Analog input

0

--

2.2

V

VDD_P1

Voltage of PIN group P1

1.65

1.8

1.95

V

VDD_P2

Voltage of PIN group P2

2.7

2.85

3

V

 NOTE:

1. The typical voltage refers to the default I/O voltage of P1 and P2 PIN group. It is required that the

external input PIN provides this voltage.

2. The voltage design of external circuit interfaces should match that of the module PINs.

3. When VPH_PWR works within the voltage range, it can reach good whole-set performance. If it is

lower than the minimum value, the whole-set performance will be affected, or the module cannot work

normally. If it is higher than the maximum value, the module might be damaged

Hardware Development Guide of Module Product

MF206A

3.3 Feature of Digital Power Level

Table 3–5 Power Level Range of Digital Signal

Parameter

Description

Min

Max

Unit

VIH

High level of input voltage

0.65*VDD_PX

VDD_PX+0.3

V

VIL

Low level of input voltage

-0.3

0.35* VDD_PX

V

VOH

High level of output voltage

VDD_PX-0.45

VDD_PX

V

VOL

Low level of output voltage

0

0.45

V

3.4 Power Interface

3.4.1 Description of Power PINs

Power VPH_PWR signal (PIN No: 23-26). This is the positive signal of 3.8V power supply.

GND signal (PIN No: 2/12/14/31/36/38/44/47/54/63/66/69/71/78). This is the power ground and signal ground

of module, which needs to be connected to the ground on the system board. If the GND signal is not connected

completely, the performance of module will be affected. Besides, there are altogether 30 heat-dissipation

wielding panel with PIN No. 79-108.

3.4.2 Requirement of Power Supply

The power supply is recommended to be within the range of 3.4~4.2V. If the network is in poor situation, the

antenna will transmit at the maximum power, and the transient maximum peak current under 2G mode can reach

as high as 2A. So the power supply capacity for peak current needs to be above 2.5A, and the average current

needs to be above 2A.

 NOTE:

More details about the designing of power supply please refer to Chapter 4 of Power Interface Design

Guideline of this document.

Hardware Development Guide of Module Product

MF206A

3.5 (U)SIM Card Interface

3.5.1 Description of PINs

Module baseband processor integrates the (U)SIM card interface in compliance with ISO 7816-3 standards, and

supports to automatically detect 3.0V/1.8V (U)SIM cards. The signals on SIM card interface is as shown in

Table 3-6.;

Table 3–6 Definition & Description of (U)SIM Card Signal Group

PIN No.

Pin Name

Signal Definition

Signal Description

48

VREG_RSIM

Power supply for USIM card.

Output range: 1.5-3.0V

49

UIM_RST

Reset signal of USIM card.

UIM card reset signal, output

from the module

50

UIM_DATA

Data signal of USIM card.

--

51

UIM_CLK

Clock signal of USIM card.

--

52

UIM_DP

Data cable

USIM card data signal, applied

on a large-capacity SIM card

53

UIM_DM

Data cable

USIM card data signal, applied

on a large-capacity SIM card

3.5.2 Electric Feature

On the line close to the (U)SIM card console, be sure to add the ESD circuit protection during the design.

To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it is recommended to place

(U)SIM card console close to the (U)SIM card interface, to prevent the wiring from being too long, which might

seriously distort the waveform and thus affect the signal integrity. It is recommended to make the grounding

protection for UIM_CLK and UIM_DATA signal wiring. Cascade one 0.1μF and 33pF capacitor between

VREG_RSIM and GND, and cascade a 33pF capacitor between UIM_CLK, UIM_RST and GND, to filter out

the interference by RF signals. It is recommended to cascade a 20ohm resistance on UIM_DATA cable.

Hardware Development Guide of Module Product

MF206A

3.5.3 Application of (U)SIM Card Interface

The following Figure 3-2 shows the reference design of the USIM card.

Figure 3–2 (U)SIM Card Signal Connection Circuit

3.6 SD Card Interface

3.6.1 Description of PINs

The SD card interface of module is the storage card based on FLASH, embedded with 4-bit and 1-bit SD

controller, supporting SD and Mini SD cards. Its PIN signals are as shown in Table 3-7.

Table 3–7 Definition of SD Card Signal Interface

PIN No.

Pin Name

Signal Definition

Signal Description

61

SDCC_DATA0

SD card data cable PIN

SD card data cable

60

SDCC_DATA1

SD card data cable PIN

59

SDCC_DATA2

SD card data cable PIN

58

SDCC_DATA3

SD card data cable PIN

57

SDCC_CLK

SD card clock cable PIN

SD control clock output can

reach up to 20MHz

56

SDCC_CMD

SD card control PIN

--

Hardware Development Guide of Module Product

MF206A

55

VREG_MMC

SD card power

3V

3.6.2 Electric Feature

SDCC_CLK: Clock signal, host2device, default is 0~25MHz.

SDCC_CMD: Command/response, two-way: the command can be sent from the host to a single card/all cards,

the response is sent from a single card/all cards to the host.

SDCC_DATA[3..0]: Data cable, two-way, default is 0~12.5MB/sec.

3.6.3 Application of SD Card Interface

Figure 3–3 is the reference design diagram for the SD interface. The detection of SD card adopts the polling

mode of DATA3 signal cable to judge whether T card is inserted or not.

Figure 3–3 SD Typical Application Circuit

Hardware Development Guide of Module Product

MF206A

3.7 USB2.0 Interface

3.7.1 Description of PINs

MF206A has the high-speed USB2.0 interface, which supports both the full-speed mode and the high-speed

mode. The main processor (AP) is connected with the module via the USB interface to transmit data.

3.7.2 Electric Feature

The USB interface complies with the USB2.0 specifications and the electric features. USB_DP, USB_DM are

wired strictly according to the differential mode, and the length difference between the two cables should be

restricted within 1mm.

 NOTE:

NOTE: If the users of module need the wakeup and sleep function, and your AP side connects with the

module through USB interface, the AP side needs to support USB suspend and resume to realize this

function.

The differential impedance should be controlled within 90ohm.

It is recommended to connect to a high-speed common-mode echo filter on the USB differential signal wire. If

the cable is exposed to the external environment, it is suggested to add an ESD protection device. The power

capacity of the ESD protection device should be kept within 1.5pF.

3.7.3 Application of USB Interface

The USB bus is mainly used in data transmission, software upgrading and modular program detection. Figure

3–4 shows a reference circuit design.

Hardware Development Guide of Module Product

MF206A

Figure 3–4 USB Typical Circuit Application

3.8 SPI (Serial Peripheral Interface) Bus Interface

3.8.1 Description of PINs

The definition of SPI interface signaling is defined as shown in Table 3-8.

Table 3–8 Definition of SPI Signal

PIN No.

Pin Name

I/O Type

Signal Description

39

SPI_ CS_N

O

SPI segment

40

SPI_ CLK

O

SPI clock

41

SPI_MISO_DATA

B

Main input, slave output

42

SPI_MOSI_DATA

B

Main input, slave output

3.8.2 Electric Feature

The SPI bus is configured as the master equipment, and there are three modes for SPI:

Running mode: Basic running mode.

Hardware Development Guide of Module Product

MF206A

Waiting mode: The waiting mode of SPI is a configurable low-power mode, enabled by the byte of the control

registered. In the waiting mode, if the waiting byte is cleared, SPI works under the similar running mode.

However, if SPI waits for the position byte, SPI clock stops and enters the low-power status.

Stop mode: Under the stop mode, SPI is not available, so the power consumption is reduced. If SPI is configured

as the master equipment, any transmission process will be stopped, but it can enter the running mode when the

waiting mode stops. Figure 3–5 is the SPI bus sequence chart.

Figure 3–5 SPI Bus Sequence Chart

3.9 I2C Bus

3.9.1 Description of PINs

I2C is the two-wire bus for the communication between ICs, which supports any IC process (NMOS, CMOS,

dual-polarity). The two signal wires, serial data (SDA) and serial clock (SCL), can transmit information between

the connected equipment. Each equipment is identified by the unique address (such as the micro controller,

storage, LCD driver, audio DAC or keyboard interface). Due to the different functions of the equipment, it can

be used as both the sender and the receiver.

Hardware Development Guide of Module Product

MF206A

3.9.2 Electric Feature

The I2C interface has the following features:

1. The two-wire bus is used for the communication between ICs.

2. It supports any external equipment of any manufacturing technology (1.8V).

3. It supports the external functions, such as the image sensor, micro controller, FM radio chip, LCD

chip, audio DAC and keyboard interface.

The I2C interface has two working modes with different transmission ratios: standard mode with a speed as high

as 100kbps; high-speed mode with a speed as high as 400kbps. Figure 3–6 is the I2C reference circuit design

diagram.

Figure 3–6 I2C Reference Circuit Diagram

Hardware Development Guide of Module Product

MF206A

3.10 UART Interface

3.10.1 Description of PINs

Module provides a circuit of serial communication interface UART, which complies with the RS-232 interface

protocol, and supports the 4-wires serial bus interface or 2-wires serial interface. Via the UART interface, the

module can perform the serial communication and AT instruction interaction with the external.

This UART port supports the programmable data width, programmable data stop digit and programmable

odd/even checksum, and has an independent TX and RX FIFOs (512 bytes for each). For the normal UART

application (non-Bluetooth), the maximum baud rate is 230400bps, the 4Mbps high baud rate is only used on

Bluetooth 2.0 application, and the default baud rate is 115200bps. The PINs are defined as shown in Table 3-9.

Table 3–9 Definition of UART Signal

PIN No.

Pin Name

Signal Definition

Signal Description

27

UART1_CTS

UART clear to send signal

UART power level

is 1.8V.

28

UART1_RFR

UART ready for receive signal

29

UART1_TXD

UART transmit data output

30

UART1_RXD

UART receive data input

 NOTE:

If the users of module need the wakeup and sleep function, and you AP side connects with the module

through UART interface, you need to connect the PIN10&PIN11 (AP_WAKEUP_MODULE,

MODULE_WAKEUP_AP) to the AP side to realize this function. The details of this two pin you can refer

to chapter 3.13.

3.10.2 Electric Feature

During the software interconnection process, there is a method of capturing logs, and it is recommended that this

interface be kept during the design and the testing point be reserved. If the module is used together with the

application processor, and the PWL matches with 1.8V, the 4-wires connection mode is as shown in Figure 3–7.

The 4-wires or 2-wires mode can be used for connection. The module interface PWL is 1.8V. If it does not

match the PWL of AP interface, it is recommended to add the PWL conversion circuit.

Hardware Development Guide of Module Product

MF206A

Figure 3–7 Module Serial Port & AP Application Processor

MF206A AP

RXD

RXDTXD

TXD

CTS

RFR CTS

RFR

3.11 JTAG (Joint Test Action Group) Interface

3.11.1 Description of PINs

The JTAG interface complies with the ANSI/ICEEE Std. 1149.1-1990 standard, and the interface is defined as

shown in Table 3-10.

Table 3–10 Definition of JTAG Signal

PIN No.

Pin Name

I/O Type

Signal Description

3

JTAG_RESOUT_N

DI

LGA reset

72

JTAG_TRST_N

DI-PD

JTAG reset

73

JTAG_RTCK

DO

JTAG return clock

74

JTAG_TCK

DI-PU

JTAG clock input

75

JTAG_TDO

Z

JTAG test data output

76

JTAG_TDI

DI-PU

JTAG test data input

77

JTAG_TMS

DI-PU

JTAG test mode select

78

GND

--

Grounding

Hardware Development Guide of Module Product

MF206A

3.11.2 Application of JTAG Interface

On the system board, you need to reserve the testing point or interface of the related JTAG signal, so as to solve

the un-repairable fault of LGA module due to emergencies such as downloading interruption.

3.12 Power-on/Power-off & Reset Signal

3.12.1 Description of PINs

To turn on the module the pad POWER_ON must be tied low for at least 0.05 seconds and then released.

To turn off the module the pad POWER_ON must be tied low for at least 5 seconds and then released.

A simple circuit to do it is as shown in the following Figure 3-9.

 NOTE:

The resistors R1 and R2 in Figure 3-9 and Figure 3-1 are only the recommended value and they may

different according to the users transistor selection.

Hardware Development Guide of Module Product

MF206A

Figure 3–8 Turn on the Module Using Driving Circuit

≥50ms

Turn on pulse R2

R1

POWER_ON

You can reset the module by driving the PON_RST_N to a low level voltage for more than 100ms and then

releasing. A simple circuit to do it is as shown in the following Figure 3-10.

Figure 3–9 Resetting the Module Using Driving Circuit

≥100ms

Reset pulse R2

R1

PON_RST_N

Hardware Development Guide of Module Product

MF206A

3.12.2 Power-on/Power-off Flow

To guarantee the user can power on and power off stably, you can refer to the power-on sequence chart as shown

in Figure 3-11 and the power-off sequence chart as shown in Figure 3-12. Table 3-11 shows the power-on and

resetting time, which needs to be paid attention to during the module power-on process.

1. Once VPH_PWR is powered on, the POWER_ON signal will be synchronized and be established

as the high PWL.

2. After VPH_PWR is established normally, the interval between it to the POWER_ON signal

cannot be too short. Refer to T2 parameter. ZTEWelink recommends that VPH_PWR adopt the

power-off plan that does not disconnect the power supply.

3. The power-on startup time takes the lower level of POWER_ON as the starting point, and

POWER_ON needs to be released after being kept on the low PWL for a period.

4. SUB_VBUS is the USB PHY power supply. It is not recommended to be established before

VPH_PWR.

During the process of establishing the module PINs, pay attention to the following items:

1. To power off by the POWER_ON signal, the T4 period needs to be designed as required.

2. After VPH_PWR and USB_VBUS are powered off, it is recommended not to disconnect the

power supply.

Figure 3–10 Power-on Sequence Chart of Module

VPH_PWR

USB_VBUS

POWER_ON

T1

T2

T3

Hardware Development Guide of Module Product

MF206A

Figure 3–11 Power-off Sequence Chart of Module

POWER_ON

T5

T4

VPH_PWR

USB_VBUS

Table 3–11 Power-on/Power-off Time

Parameter

Description

Min

Typical

Max

Unit

T1

From powering on VPH_PWR to

establishing USB_VBUS

0

0.5

1

second

T2

From powering on VPH_PWR to Power-on

taking effect

1

1.5

--

second

T3

The period that the Power-on signal for

power on operation is kept on the low PWL

0.05

0.1

--

second

T4

The period that the Power-on signal for

power off operation is kept on the low PWL

4

5

--

second

T5

From the releasing the Power-on button for

power off operation to the power off of

VPH_PWR and USB_VBUS

1

2

--

second

3.12.3 Resetting Flow

The PON_RST_N reset signal of module is the increasing resetting, so it is reset after decreasing this PIN by

100ms. Figure 3-13 is the module resetting flow. Figure 3-14 is the timing of resetting module.

Hardware Development Guide of Module Product

MF206A

Figure 3–12 Module Resetting Flow

100ms

1

0

PON_RST_N

Figure 3–13 Timing of Resetting Module

VPH_PWR

PON_RST_N

Module

Status ResettingRunning Running

100ms

3.13 Interactive Application Interface

3.13.1 Description of PINs

Table 3-12 mainly describes the interfaces interacting with the application processor, including the following

three types of interfaces: querying, wakeup and status indication.

Table 3–12 Interactive Application Interface

PIN No.

Pin Name

I/O Type

Signal Description

6

AP_READY

DI

Module querying AP sleep status

9

MODULE_READY

DO

AP querying Module sleep status

10

AP_WAKEUP_MODULE

DI

AP wakeup Module

11

MODULE_WAKEUP_AP

DO

Module wakeup AP

19

MODULE_POWERON

DO

MODULE power-on status indication

Hardware Development Guide of Module Product

MF206A

3.13.2 Interface Application

The module provides 5 handshake signals for the communication with the application processor (AP). By

MODULE_POWERON, AP can query whether LGA is powered on and is working normally. By

MODULE_READY, AP queries whether the LGA module has entered the sleep status, wakes up the module

under the sleep status by AP_WAKEUP _MODULE. In the same way, when AP is in the sleep status, the LGA

module can query the AP status by AP_READY, and wakes up AP by MODULE _WAKEUP_AP.

AP_READY: Indicates that the AP server is sleep: the high PWL indicates the sleep status, and the low PWL

indicates the wakeup status.

MODULE_READY: Indicates that the module is sleep: the high PWL indicates the sleep status, and the low

PWL indicates the wakeup status.

AP_WAKEUP_MODULE: After the module has entered the sleep status, the AP server can wake up the module

by the low PWL control; if it’s always on the low PWL, the module cannot enter the sleep status. After the AP

server enters the high PWL, the module enters the sleep status.

MODULE_WAKEUP_AP: After the AP server has entered the sleep status, the module can lower down this

signal to wake up the AP server. After the module has queried that the server sleep indicator AP_READY is low,

it resets this signal to high.

MODULE_POWERON: After the module is powered on, this signal is set to high, and kept until the system is

restarted or powered down. Low signal indicates that the server is not powered on, during the power-on process

or is being restarted.

3.14 LED Indicator Interface

3.14.1 Description of PINs

Table 3–13 Definition of LED PIN Signal

Signal Name

I/O Type

Function

20.

LED_GREEN

AO

Module signal indicator interface

21.

LED_RED

AO

Module signal indicator interface

22.

LED_BLUE

AO

Module signal indicator interface

Hardware Development Guide of Module Product

MF206A

3.14.2 Interface Application

The LGA module has three PINs to control the LED indicator, which is used to indicate the network connection

status. The different modes of status indicator flashing indicate different network statuses. All the three PINs use

the current sink type of current source for control, which connects to the negative end of LED and connects to

VPH_PWR externally, to directly drive LED. Figure 3-16 is the reference circuit design diagram.

The flashing of indicator is controlled by the switch of RF, and the LED PIN indicates the control signal to the

external. The indicator status of network is as defined in Table 3-14. If the RF control is not needed, the AP

server can design the status of control indicator by itself.

Figure 3–14 Reference Circuit of Status Indicator

Table 3–14 Definition of Indicator Status

Indicator Status

Module Working Status

RED indicator always on

Not registered to the network

GREEN indicator always on

Have been registered to 2G network

GREEN indicator flashing

Have been registered to 2G network,

and there is data service as well.

BLUE indicator always on

Have been registered to 3G network

BLUE indicator flashing

Have been registered to 3G network,

and there is data service as well.

Hardware Development Guide of Module Product

MF206A

4 Power Interface Design Guideline

This chapter provides the power supply requirements, general design rules and Power-on/Power-off/Reset flow

of modules. Users can design the power supply of module to achieve stable and well working performance

according to this document.

4.1 General Design Rules

When the ZTEWelink module is used for different external applications, pay special attention to the design for

the power supply.

In the process of peripheral circuit designing, users of this Module product should ensure that the external power

supply circuit is capable of providing sufficient power supply capacity firstly, and control the supply range

between 3.4V~4.2V strictly. If the value above module voltage range, it will lead the main chip burned, while

below module voltage range, it will affect the RF circuit’s work or cause shutdown and restart occurred. For the

design of high-speed USB signal lines, it requires to control the differential impedance at 90ohm. The voltage

design of external circuit interfaces should match that of the module PINs, and the detailed value can be got in

Table 3-2. The module product has a good RF indicator; customers can refer to the Chapter 5 of Antenna Design

Guide of Module Product in the process of antenna circuit designing. Otherwise it will affect the whole RF

performance.

4.2 Power Supply Requirement

The power supply of ZTEWelink LGA Type module is usually recommended to be within the range of 3.4~4.2V.

According to the requirement of mobile terminal device, the power supply voltage of module is 3.8V under

normal working condition.

Hardware Development Guide of Module Product

MF206A

In poor situation of the network, the antenna will transmit at the maximum power, and the transient maximum

peak current can reach as high as 2A. So the power supply capacity of system board needs to be above 2.5A to

satisfy the requirement of module peak current; and the average current on the system side needs to be above

2.0A. Meanwhile, consider the voltage drop of power supply on the side of main board. If the network is in a

poor situation or under 2G, the module peak current will be great, Therefore the power supply has to be designed

in order to withstand with these current peaks without big voltage drops; this means that both the electrical

design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed

a strong noise floor is generated on the ground and the supply; and exceptions such as restart of the module may

occur.

The peak current of ZTEWelink module under the GSM BURST mode is different due to the differences in

actual network environments. And its transient current under different powers will be various as well. The

greater the power is, the greater the transient current is. The network quality also directly affects the work

current of the module. If the network is in well situation, the peak work current on the module will be small. But

if the network is in poor situation, its peak current will be great as shown in Figure 4-1. When ZTEWelink

module works under the EDGE/GPRS Time Slot (2-high 6-low) and CLASS 10, if the module works under the

2-high work Time Slot, it requires greater current, and the voltage drop will occur accordingly.

Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS

0t/ms

0

Unit: 200mA/cell

Unit: V/cell

Voltage

Current

EDGE/GPRS TS

2-high 6-low

CLASS10 3.462ms1.154ms (577us/cell)

200mA

1V

2V

3V

3.6V

4.3 Circuit Requirements of Power Supply Output

Requirement：

Hardware Development Guide of Module Product

MF206A

 The power supply capacity of system board needs to be above 2.5A to satisfy the requirement of

module peak current;

 The average current on the system side needs to be above 2.0A.

 When designing the PCB line, the power cable on the system board should be thick enough, and

should form a good reflux with the ground.

 In the power supply circuit design, the user needs to add the large storage capacitor on the kilo level,

to guarantee the transient power supply capability, and to prevent the module from resetting and

shutting down caused by voltage fluctuation.

Figure 4–2 Add storage capacitor to Module power supply terminal

DC3.8V

VDD_3V8

0.47uF

22uF

330uF

2200uF

330uF

C1

C2

C3

C4

C5

C6

330uF

Add storage capacitor to Module power supply terminal to ensure the system instantaneous power capacity

4.4 Recommended Power Reference Circuit

Option one:

Use DC\DC switching power supply and large storage capacitor on the kilo level to ensure the normal operation

of the RF power amplifier to withstand these current peaks without big voltage drops.

Advantage:

Can provide well transient current under 2G weak signal environment to satisfy modules requirements, to

prevent device from shutdown and Ports re-enumeration as a consequence of the supply voltage drop.

Hardware Development Guide of Module Product

MF206A

The over-current capability requirement of DC/DC switching power supply need to be above 3A, for

example,ZI1153, AAT2138 and so on.

Input voltage range of ZI1153 is: 2.5～5.5V，output voltage range of ZI1153 is from 0.6V to VIN( input

voltage).

Input voltage range of AAT2138is: 2.7～5.5V，output voltage range of AAT2138 is from 3.3～5.5V.

As shown in the Figure below, use DC/DC switching power supply ZI1153 as the buck chip. Place a tantalum

capacitor of 330μF at the input of the chip. Place a 2200μF capacitor or place several 330μF tantalum

capacitors in parallel. This circuit fully meets the module power requirements. (If the user’s PCB size is limited,

the output of buck chip can place three more 330μF tantalum capacitors of which the total capacity is more than

1000μF)

Figure 4–3 DC/DC Switching Power Supply

Vin=5V Vout=3.8V

Option two:

Use LDO as the buck chip. The over-current capability of LDO is above 3A. As the poor transient response of

linear regulator, large capacitors should be placed at the input and output of LDO. The output of LDO, place a

capacitors above 2000μF. The reference power supply circuit design with LDO is as shown in Figure below.

Hardware Development Guide of Module Product

MF206A

Figure 4–4 LDO Power Supply

4.5 PCB Layout Guideline of Power Supply

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut

the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion.

The placement of these components is crucial for the correct working of the circuitry. A misplaced component

can be useless or can even decrease the power supply performances. The users of ZTEWelink modules should do

as the following guidelines in the process of power supply PCB line designing:

The use of a good common ground plane is suggested.

The placement of the power supply on the board should be done in such a way to guarantee that the high current

return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone

amplifier/buffer or earphone amplifier.

The power supply input cables should be kept separate from noise sensitive lines such as

microphone/earphone/RF cables.

The Bypass low ESR capacitor must be placed close to the ZTEWelink module power input pads, or in the case

the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB

trace from the capacitor to the module is wide enough to ensure a dropless connection even during the 2.5A

current peaks.

The protection diode must be placed close to the input connector where the power source is drained.

The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage

drops occur when the 2.5A current peaks are absorbed. Note that this is not made in order to save power loss but

especially to avoid the voltage drops on the power line at the current peaks frequency that will reflect on all the

Hardware Development Guide of Module Product

MF206A

components connected to that supply, introducing the noise floor at the burst base frequency. For this reason

while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage

drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but

only uses the data feature of the ZTEWelink module, then this noise is not so disturbing and power supply layout

design can be more forgiving.

The PCB traces to the ZTEWelink module and the Bypass capacitor must be wide enough to ensure no

significant voltage drops occur when the 2.5A current peaks are absorbed. This is for the same reason as

previous point. Try to keep this trace as short as possible.

The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as

possible by placing the inductor and the diode very close to the power switching IC (only for switching power

supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz

usually).

Hardware Development Guide of Module Product

MF206A

5 RF Antenna Design Guide

The antenna connection and board layout design are the most important aspect in the full product design as they

strongly affect the product overall performances, hence read carefully and follow the requirements and the

guidelines for a proper design.

5.1 Antenna Types

Antenna types and modes are different according to the different ID designs and circuit layout designs of the

product itself. You can choose the antenna type and mode according to the estimation result by antenna

engineers.

1. For PAD products, because the product itself has low sections, usually printed antennas are used as

the antenna mode (the antenna wiring is printed on a thin PCB board), and IFA plus parasitic units or

monopole plus parasitic units are used as the antenna type.

2. For CPE products, because most products of this type have a large size, the available space for

antennas is also relative large. Thus, this type of products usually adopts the mode of PC racks plus FPC

antennas or PC racks plus bullet antennas. IFA plus parasitic units or monopole plus parasitic units are used

as the antenna type.

3. If the product supports external antenna, then switch between the external antenna and internal

antenna must be using mechanical switches instead of electronic switches.

5.2 Antenna RF Cable and RF Connector

5.2.1 RF Connector

There are two interfaces on the RF antenna of module: main antenna interface, and GPS antenna. The main

antenna supports two access modes of RF signal: by LGA wielding panel mode and by RF connector mode. The

GPS antenna only supports the access mode of LGA wielding panel. Figure 5-1 is the main antenna connector

Hardware Development Guide of Module Product

MF206A

interface, and Figure 5-2 is the Interface of Main Antenna and GPS Antenna Welding Pad. Figure 5-3 shows the

main antenna RF connector. Currently, ZTEWelink module adopts the ECT818000157 RF connector testing

console from ECT Company.

Figure 5–1 Main Antenna RF Connector Interface

Figure 5–2 Interface of Main Antenna and GPS Antenna Welding Pad

Hardware Development Guide of Module Product

MF206A

Figure 5–3 RF Interface Testing Console

Figure 5–4 Profile Dimensions of RF antenna console

If the main antenna is access by the RF connector, the using of corresponding cables of RF interface are

recommended. When this connection mode is adopted, the RF antenna connector can be directly inserted to the

RF testing console of the module, so it saves the connection between the RF port and the antenna interface.

If the main antenna is accessed by the LGA wielding panel, the RF main antenna wield pane of the module itself

needs to be connected to the antenna interface on main board via the wield pane and micro stripline or stripline.

The micro stripline or stripline is designed according to the 50ohm impedance, and the dual-L model matching

circuit is reserved.

RF interface on ZTEWelink module is ECT818000157. Because this type of RF interfaces requires RF cables

with smaller diameters and larger consumptions, it is usually recommended not to directly connect RF

connectors of antenna RF cables with RF interfaces on the module, and it is recommended to convert them into

Hardware Development Guide of Module Product

MF206A

common interfaces by conversion circuits, such as ECT818000071 of I-PEX and U.FL-R-SMT-1(80) of

HIROSE.

The design of GPS antenna is consistent with the main antenna, and its efficiency index is allowed to be 3dB

lower. The separation degree between the main antenna and the diversity antenna is required to be greater than

12dB.

5.2.2 RF Cable

If the diameter of RF cables used by the antenna is different, its consumption is also different. During the

2G/3G/LTE communication, usually RF cables with a diameter of 1.37mm or 1.13mm are adopted. It is

recommended to select the RF coaxial cable with a diameter of 1.37mm because it has less consumption. There

are many manufacturers of RF cables, such as GBE in Taiwan, Shenyu and Yuanda in China mainland,

SUMITOMO and Shin Din in Japan. All of these manufacturers provide RF cables of more than two

specifications. The following tables describe RF cables of several specifications.

The Standard Value of cable (RF137XR4 of GBE, RF-1.37 of Shenyu, 0.8DS-PBM(1.35) of SUMITOMO)

consumption is shown as Table 5-1 below (Unit: dB/m):

Table 5–1 The Cable Consumption

Frequency

RF137XR4 of GBE

RF-1.37 of Shenyu

0.8DS-PBM(1.35)

0.4GHz

1.0

--

0.8GHz

1.5

--

1.0GHz

1.6

≤1.7

≤1.5

1.5GHz

2.0

--

2.0GHz

2.3

≤2.5

≤2.2

2.4GHz

--

≤2.6

3.0GHz

2.9

≤3

≤2.8

4.0GHz

--

≤3.5

≤3.4

5.0GHz

--

≤4

≤3.8

5.2GHz

4.0

--

5.8GHz

4.2

--

6.0GHz

4.3

≤4.5

≤4.3

Hardware Development Guide of Module Product

MF206A

Because RF cables used by the antenna inevitably introduce certain loss, it is necessary to consider the wiring

length of RF cables during the design of module position and antenna position. It is recommended to control the

length within the loss range of 0.5 dB (HF). During the wiring design of antenna RF cables, avoid right angle,

pressed and wearing.

The recommended receptacles Mode of ECT 818000157 is ECT 818000160 as shown below:

Figure 5–5 Recommended Receptacles Mode for module

5.3 Design of Antenna

5.3.1 Preliminary Antenna Evaluation

The antenna is a sensitive device and its performance is greatly affected by external environments. The radiation

performance of the antenna is affected by the mainboard dimensions, antenna position, occupied space size of

the antenna, and the grounding of surrounding components of the antenna. Besides, the fixed assembly of the

antenna, the wiring of RF cables on the antenna, and the fixed position of the antenna all affect the radiation

performance of the antenna too. Thus, during the preliminary design phase of an antenna, it is critical that

antenna engineers, RF engineers, baseband engineers, structure engineers, and ID engineers work together to

make an estimation for both 2D and 3D design.

The antenna interface should have an impedance of 50Ω.

Hardware Development Guide of Module Product

MF206A

5.3.2 Suggested Antenna Location

During the design of the board with ZTEWelink module, the placement of components should be placed

properly, and keep the line length as short as possible, thus leading to lowest power losses possible.

Usually, the antenna position is designed according product features and antenna shall not be installed inside

metal cases. For example, for Internet laptops and PAD products, the ideal position of antennas is on the top left

corner or top right corner of the LCD, which is relatively far from the mainboard, so the electromagnetic

interference is relatively small. Besides, because it is far from human bodies, it is easy to satisfy SAR indexes.

For PAD products or Internet laptops, the ideal position is where hands rarely touch, so the impact from hand

holding is the minimum.

The above example only considers the antenna position area in a specific scenario. For the specific position, it is

critical to determine with antenna engineers, RF engineers, baseband engineers, structure engineers, and ID

engineers during the 2D/3D estimation phase according to the specific product. Antenna shall be installed also

according to antenna manufacturer instructions.

5.3.3 Suggested Antenna Occupancy Space

For different product types, because their frequency bands are different, required occupation space of the

antenna is also different. For the specific antenna space, it is critical to estimate it with antenna engineers, RF

engineers, baseband engineers, structure engineers, and ID engineers during the 2D/3D estimation phase. Taking

the PAD product with a dimension of 95 mm * 125 mm (length * width) as an example, if the antenna should

cover 824-960 MHz and 1710-2170 MHz, it is recommended to reserve the following antenna space: if the

printed antenna mode is adopted, the reserved space should be above 75mm*10mm (length*width); if the

antenna mode of PC rack plus FPC or PC rack plus spring is adopted, the reserved space should be above

70mm*10mm*3mm (length*width*height).

5.3.4 Matching Circuit of Antenna

For all products with ZTEWelink module, the antenna is basically connected to the module through RF cables

and RF connectors. This section describes two situations.

1. If the RF terminal connector of the module does not match the RF cables used by the antenna, or the

direct connection between the RF antenna mated connector of RF cables and the RF port of the module is

Hardware Development Guide of Module Product

MF206A

restricted by the height, a circuit is required between them for transition. During the design of transit

circuits on the mainboard, the natural impedance of the microstrip line or stripline between the RF port of

the module and the RF port on the mainboard connected to the antenna is designed to be 50 ohm, and a

dual-L matching circuit is reserved, as shown in Figure 5-6. Use a zero-ohm resistor on the cascading

position between them.

2. If the RF connector used by the RF cable can be directly connected to the RF terminal on the module,

and the height falls within the limited range, the circuit transition between the RF port on the module and

the antenna interface can be saved, and the RF connected used by the RF cable of the antenna can be

directly connected to the RF terminal of the module.

Figure 5–6 Transition Circuit

Microstrip line or

stripline with a

natural impedance of

50 ohm

Microstrip line or

stripline with a

natural impedance of

50 ohm

Dual-L matching

network

RF coaxial cable of

the antenna

RF interface on the

antenna RF cable

and RF interface on

the mainboard

RF interface on

the module

Antenna

5.3.5 Type of Antenna RF Cable & RF Connector

The antenna RF connection cable usually adopts GBE(TW) and Shenyu (Mainland), or Japanese Somitomo and

Shin Din. The antenna RF cable usually adopts a line width of 1.37mm. The antenna RF connector usually

adopts Japanese IPX, or HRS, while the price of the latter is higher.

Hardware Development Guide of Module Product

MF206A

5.4 Recommended Antenna Manufacturers

Many domestic antenna manufacturers in China can design proper matched antennas according to specific

products. This section recommends several antenna manufacturers with strong integrative strength in the mobile

terminal industry, which have powerful hardware resources and software resources, experienced antenna design

engineers, and advanced antenna test systems (including antenna Passive test, Passive OTA test, and SAR test)

to satisfy various customer requirements.

1. Ethertronics at Shanghai

2. Skycross at Shanghai

3. Laird at Beijing

4. Sherbed at Suzhou

5. Yaodeng Electronic Communication Technology (kunshan) Co., Ltd.

5.5 PCB line guidelines

The users of ZTEWelink modules should do as the following guidelines in the process of RF PCB line design:

1. Make sure that the transmission line’s characteristic impedance is 50ohm ;

2. Keep line on the PCB as short as possible, since the antenna line loss shall be less than around 0,3 dB;

3. Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt

curves;

4. If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended,

so the geometry can be as similar as possible to the related canonical model;

5. It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal

tracks facing directly the antenna line track.

6. Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this

layer as reference Ground plane for the transmission line;

7. Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;

Hardware Development Guide of Module Product

MF206A

8. The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane

by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;

9. Place EM noisy devices as far as possible from modules antenna line;

10. Keep the antenna line far away from the module power supply lines;

11. If EM noisy devices are present on the PCB hosting the ZTEWelink module, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with

Ground planes, or shield it with a metal frame cover.

5.6 Suggestions for EMC & ESD Design

5.6.1 EMC Design Requirements

During the design of the whole device, the user needs to fully consider the EMC problem caused by the signal

integrity and power integrity.

1. During the product design, it is better to separate the module from the mainboard PCB, instead of

installing the module on the ground of the mainboard. If they cannot be separated, the module should be far

from modules and components that might generate EMI, such as chip and memory, power interface, and

data cable interface.

2. Because the mainboard of PAD, CPE, and Internet laptops does not have a shielding cover, as that of

mobile terminals, to shield most circuits to avoid overflow of electromagnetic interference, you can spray

conductive paint on the surface on non-antenna areas within the structural components above and below the

mainboard, and the conductive paint should be connected to the ground on the mainboard by several points

to shield electromagnetic interference.

3. Besides, data cables of the LCD and the camera might introduce interference signals, which affect the

receiving performance of the antenna. Thus, it is necessary to wrap conductive cloth around the two data

cables and connected them to the ground.

4. RF cables of the antenna should be far from modules and components that might generate EMI, such

as chip and memory, power interface, and data cable interface. The wiring of RF cables should be close to

the ground of the mainboard.

Hardware Development Guide of Module Product

MF206A

5. During the layout and wiring of peripheral circuits, for the wiring of power and signal cables, keep a

distance of 2 times of the line width, so as to effectively reduce the coupling between signals and keep a

clean reflux path for the signal.

6. During the design of peripheral power circuits, the de-coupled capacitor should be placed closed to the

module power PIN, the high-frequency high-speed circuit and the sensitive circuit should be placed far

away from the border of PCB. They should better be separated during layout, so as to reduce the

interference between them and protect the sensitive signal.

7. For the circuit or device on the side of system board that might interfere with the module, it should be

shielded during design.

5.6.2 ESD Design Requirements

MF206A is embedded on the side of system board, so the user needs to make the ESD protection during design.

For the key input/output signal interface, such as the (U)SIM card signal interface, the ESD device should be

placed closely for protection. Besides, on the side of main board, the user should reasonably design the structure

and PCB layout, guarantee that the metallic shielding shell is fully grounded, so as to leave a smooth discharge

channel for ESD.

5.7 Antenna Indexes

The module supports the AGPS/GPS function, so the system equipment needs to add the GPS antenna. The

design of GPS antenna is consistent with that of the main antenna, and its efficiency index can be 3dB lower.

The separation degree between the main antenna and the diversity antenna is required to be greater than 12dB.

The antenna index is divided into the Inactive index and Active index. The Inactive index includes S11,

efficiency, gains, orientation diagram and polarity, which can be used as the parameter measuring the

performance of the antenna itself. The Active index is also called the OTA index, including TRP (all-round

radiation power), TIS (all-round receiving sensitivity), radiation orientation diagram, which is an important

index measuring the radiation performance of the whole set (including the antenna, module, main board).

Hardware Development Guide of Module Product

MF206A

5.7.1 Passive Indexes

Different products have different requirements for antenna performance. The following table describes wireless

indexes for PAD products as a reference to users, but the radiation performance of the antenna is finally

determined by Active indexes.

Table 5–2 Passive Indexes of Main Antennas on PAD Products

Frequency

824-960MHz

1710-2170MHz

VSWR

<3.5:1

Maximum gains

>0dBi

Average gains

>-3.5dBi

Efficiency

>40%

5.7.2 Active Indexes

Active indexes are important indexes measuring the radiation performance of the whole mobile phone (including

the antenna, module, and mainboard), thus they determine the final radiation performance of the terminal

product. However, different products have different Active indexes, and different carries have different

requirements for Active indexes as well. Thus, antenna engineers, RF engineers, baseband engineers, structure

engineers, and ID engineers should work together to estimate the performance of the board during the project

preliminary phase according to the Active indexes. There is no universal international standard for mobile

terminal products, so mobile terminals are all designed according to the carrier requirements. Table 5-3 describes

the requirement of Active indexes by ZTEWelink for Mobile Terminal Devices as a reference to users.

Table 5–3 ZTEWelink Indexes for Mobile Terminal Devices

Mode

Band

TRP(dBm)

TIS(dBm)

Free space

GSM

GSM850MHz

28

-104

GSM900MHz

28

-104

GSM1800MHz

26

-102

GSM1900MHz

26

-102

WCDMA

Band I

19

-106

Band II

19

-104.5

Band V

19

-104.5

Band VIII

19

-104.5

The Active indexes of diversity antennas are determined by the performance of diversity antennas.

Hardware Development Guide of Module Product

MF206A

5.7.3 Test Methods for Whole-Set Antenna OTA

Figure 5-7 is the diagram of OTA test system of CTIA. The system is mainly composed of test chamber,

high-precision positioning system and its controller, Windows based PC running test software and RF test

instruments with automatic test program. The main RF instruments are integrated RF test equipment, Spectrum

Analyzer, Network Analyzer.

The radio equipments, Relay Switch Unit and PC with automatic test software are communicated via GPIB

interface.

Figure 5–7 The OTA test system of CTIA

Hardware Development Guide of Module Product

MF206A

6 Electric Feature

6.1 Power Supply

The external power supply must be connected to VPH_PWR signals and must fulfill the following requirements:

The input voltage range of module is DC 3.4V~4.2V, and the typical value is 3.8V as shown in Table6-1.

Table 6–1 Input Voltage

Parameter

Min

Typical

Max

Input voltage

3.4V

3.8V

4.2V

6.2 Working Current

The working current range of module is as shown in Table 6-2 to Table 6-4. The IDLE mode indicates the power

consumption of the module when there is no service but the module is interactive with network. The table also

provides the working current range under GSM and WCMA mode when there is data service.

Table 6–2 Averaged standby DC power consumption

Mode

Bands

Test value (mA)

Remark

/WCDMA

Band I (IMT2100)

2.3

Standby mode

Band II (PCS1900)

2.3

Band V (850M)

2.4

GSM/GPRS/EDGE

GPRS 1900

5.4

Standby mode

GPRS 1800

5.4

GPRS 900

5.6

GPRS 850

5.9

Note: assumes USB bus is fully suspended during measurements. Under different

environments, the testing results might be slightly different. Take the actual situation as the

reference.

Hardware Development Guide of Module Product

MF206A

Table 6–3 Averaged idle mode DC power consumption

Mode

Bands

Test value (mA)

Remark

UMTS

Band I (IMT2100)

68

Idle mode

Band II (PCS1900)

60

Band V (850M)

59

GPRS

GPRS1900

51

Idle mode

GPRS1800

46

GPRS900

24

GPRS850

21

EDGE

EDGE1900

39

Idle mode

EDGE1800

23

EDGE900

47

EDGE850

41

Note: The IDLE mode indicates the power consumption of the module when there is no

service. But the module is interactiving with the network such as network registration, and

USB is active.

The above values are the average of some test samples. Under different environments, the

testing results might be slightly different. Take the actual situation as the reference.

Table 6–4 Averaged DC power consumption in working state

Mode

Bands

Test value (mA)

Remark

UMTS

Band I (IMT2100)

468

Acquired under the

maximum

transmission power

Band II (PCS1900)

475

Band V (850M)

376

GPRS

GPRS1900

287

Acquired under the

maximum

transmission power

GPRS1800

275

GPRS900

352

GPRS850

363

EDGE

EDGE1900

208

Acquired under the

maximum

transmission power

EDGE1800

202

EDGE900

210

Hardware Development Guide of Module Product

MF206A

EDGE850

215

Note: The above average current is acquired under the maximum transmission power.

Under different environments, the testing results might be slightly different. Take the

actual situation as the reference.

 NOTE:

The above average current is acquired under the maximum transmission power. Under different

environments, the testing results might be slightly different. Take the actual situation as the reference.

Hardware Development Guide of Module Product

MF206A

7 Technical Index of Radio Frequency

Test Environment:

 Test instrument: Agilent 8960

 Power supply: Agilent 66319D

 RF cable for testing

 Cable length: About 15 cm

 Compensation for WCDMA 850 MHz or WCDMA 900 MHz: 0.6 dB

 Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz: 0.8 dB

 NOTE:

The compensation for different frequency bands relates to the cable and the test environment.

The instrument compensation needs to be set according to the actual cable conditions.

7.1 Index of RF under UMTS Mode

7.1.1 UMTS (WCDMA)

The RF index should be tested strictly in accordance with the related testing specifications of 3GPP. The RF

indexes of UMTS2100/1900/850 should satisfy the requirements of 3GPP TS 34.121 protocol.

Hardware Development Guide of Module Product

MF206A

7.1.2 Acquiring Radio Frequency Index

The testing of radio frequency index should strictly follow the specified testing specifications of 3GPP. In

particular, when carrying out the acceptance test of related indexes, make sure to perform the test in a

well-shielded environment.

7.1.3 Maximum Transmission Power

Under the normal testing environment, the maximum transmission power of UMTS2100/1900/850(900) should

satisfy the requirements in Table 7-1.

Table 7–1 Maximum Transmission Power

Operating Band

level

3GPP Protocol Claim (dBm)

Test value

UMTS850

Class 3

+24dBm +1/-3dBm

22.4dBm

UMTS1900

Class 3

+24dBm +1/-3dBm

22.3dBm

UMTS2100

Class 3

+24dBm +1/-3dBm

22.3dBm

7.1.4 Receiving Sensibility

The receiving sensitivity is a key parameter that indicates the receiver performance of module. The receiving

sensitivity is the weakest signal that the module at the antenna port can receive. At the same time the BER (Bit

Error Rate) must meet the 3GPP TS 34.121protocol requirements in case of the minimum signal. The test value

of UMTS2100/1900/850(900) receiving sensibility is shown in the Table 7-2.

Table 7–2 Reference Table of Receiving Sensitivity

Operating Band

Unit

3GPP Protocol Claim

Test value

UMTS850

dBm/3.84 MHz

≤-104.7dBm

-109dBm

UMTS1900

dBm/3.84 MHz

≤-104.7dBm

-109dBm

UMTS2100

dBm/3.84 MHz

≤-106.7dBm

-110dBm

Hardware Development Guide of Module Product

MF206A

7.1.5 Spurious Emission Index

The spurious emission index of UMTS2100/1900/850(900) should comply with the requirements in 3GPP TS

34.121 protocol, as illustrated below. And the test result of module in UMTS mode meets the requirement in

Table 7-3.

Table 7–3 Spurious Emission Index

Frequency Band

Resolution Bandwidth

Minimum Requirement

9 kHz  f < 150 kHz

1 kHz

-36 dBm

150 kHz  f < 30 MHz

10 kHz

-36 dBm

30 MHz  f < 1000 MHz

100 kHz

-36 dBm

1 GHz  f < 12.75 GHz

1 MHz

-30 dBm

7.2 Index of RF under GPRS/GSM/EDGE Mode

The RF indexes of GSM/GPRS/EDGE850/900/1800/1900 should satisfy the requirements of 3GPP TS 05.05

protocol.

7.2.1 Output Transmission Power

The maximum output transmission power of GSM850/900/1800/1900 (GMSK/8PSK) should comply with the

requirements of 3GPP TS 05.05 4.1 protocol, as shown in Table 7-4 indicates the power level of each frequency

band.

Table 7–4 Output Transmission Power of GSM850/900/1800/1900 (GMSK)

Operating Band

Power level

3GPP Protocol Claim (dBm)

Test value

GSM850

Class 4

+33dBm±2dBm

32.0dBm

GSM900

Class 4

+33dBm±2dBm

32.0dBm

GSM1800

Class 1

+30dBm ±2dBm

29.0dBm

GSM1900

Class 1

+30dBm ±2dBm

29.0dBm

Hardware Development Guide of Module Product

MF206A

7.2.2 Receiving Sensibility

The receiving sensitivity is a key parameter that indicates the receiver performance of module. The receiving

sensitivity is the weakest signal that the module at the antenna port can receive. At the same time the BER (Bit

Error Rate) must meet the 3GPP TS 05.05 6.2 protocol requirements in case of the minimum signal. The test

value of GSM850/900/1800/1900 receiving sensibility is shown in the Table 7-5.

Table 7–5 Reference Table of Receiving Sensitivity

Operating Band

Unit

3GPP Protocol Claim

Test value

GSM850

dBm/3.84 MHz

≤-102dBm

-108dBm

GSM900

dBm/3.84 MHz

≤-102dBm

-108dBm

GSM1800

dBm/3.84 MHz

≤-102dBm

-107dBm

GSM1900

dBm/3.84 MHz

≤-102dBm

-107dBm

7.2.3 Spurious Emission Index

The spurious emission index of GSM850/900/1800/1900 (GMSK) should comply with the requirements of

3GPP TS 4.3.2.1 protocol, as shown in the table below.

The power measured in bandwidth of 9kHz to 1GHz shall be no more than -36 dBm.

The power measured in bandwidth of 1GHz to 12.75GHz shall be no more than -30dBm.

And the test result of module in GPRS/GSM/EDGE mode meets the requirement above.

Hardware Development Guide of Module Product

MF206A

8 Related Test & Test Standard

8.1 Testing Reference

The related tests of module comply with the IEC standard, including the equipment running under high/low

temperature, storage under high/low temperature, temperature shock and EMC. Table 8-1 is the list of testing

standard, which includes the related testing standards.

Table 8–1 Testing Standard

Test Standard

Document Reference

IEC6006826

Environmental testing-Part2.6:Test FC: Sinusoidal Vibration

IEC60068234

Basic environment testing procedures part2.

IEC60068264

Environmental testing-part2-64: Test FH: vibration, broadband random and

guidance.

IEC60068214

Environmental testing-part 2-14: Test N:change of temperature.

IEC60068229

Basic environmental testing procedures-part2: Test EB and guidance.

IEC6006822

Environmental testing-part2-2:Test B:dry heat

IEC6006821

Environment testing-part2-1: Test A: cold.

GB/T 15844.2

MS telecommunication RF wireless phone-set environment requirement &

experimental method – part 4: Strict level of experimental condition

GB/T 2423.17

Basic environment experiment of electronic products-Experiment Ka: Salt

mist experiment method

GB/T 2423.5

Basic environment experiment of electronic products-Part2:Experiment

method Try Ea & Introduction: Shock

GB/T 2423.11

Basic environment experiment of electronic products-Part2:Experiment

method Try Fd: Broad frequency band random vibration (General

requirement)

TIA/EIA 603 3.3.5

TIA Standard-part3-5:Shock Stability

Hardware Development Guide of Module Product

MF206A

 NOTE:

1. IECL International Electro technical Commission;

2. GB/T: Recommended national standard

8.2 Description of Testing Environment

The working temperature range of module is divided into the normal working temperature range and the extreme

working temperature range. Under the normal working temperature range, the testing result of RF complies with

the requirements of 3GPP specifications, and its function is normal. Under the extreme temperature range, the

RF index basically complies with the 3GPP specifications, and the quality of data communication is affected to a

certain extent, but its normal function is not affected. The module has passed the EMC test. Table 8-2 is the

requirement for the testing environment, and Table 8-3 lists out the instruments and devices that might be used

during the test.

 WARNING:

Table 6-2 lists the extreme working conditions for the module. Using the module beyond these conditions

may result in permanent damage to the module.

Table 8–2 Testing Environment

Working

Condition

Min

Temperature

Max

Temperature

Remark

Normal

working

condition

-30°C

75°C

All the indexes are good.

Extreme

working

condition

-40°C

85°C

Some indexes become

poorer.

Storage

-45°C

90°C

Storage environment of

module

Hardware Development Guide of Module Product

MF206A

Table 8–3 Testing Instrument & Device

Testing Item

Instrument & Device

RF test

Comprehensive testing device

RF cable

Tower antenna

Microwave darkroom

High/Low-temperature

running & storage test

High/Low-temperature

experimental box

Temperature shock test

Temperature shock

experimental box

Vibration test

Vibration console

8.3 Reliability Testing Environment

The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and

temperature shock experiment test. Refer to Table 8-4 for the specific parameters.

Table 8–4 Reliability Features

Test Item

Test Condition

Test Standard

Random vibration

Frequency range: 5-20Hz, PSD:1.0m2/s3

Frequency range: 20-200Hz, -3dB/oct

3 axis, 1 hour for each axis

IEC 68-2-6

Temperature shock

Low temperature: -40°C ±2°C

High temperature: +80°C ±2°C

Temperature changing period: less than

30seconds

Test duration: 2 hours

Cycle: 10

IEC 68-2-14 Na

High-temperature

running

Normal high temperature: 75 °C

Extreme high temperature: 85°C

Duration: 24 hours

ZTE standard

Low-temperature

running

Normal low temperature: -30°C

Extreme low temperature: -40°C

Duration: 24 hours

ZTE standard

Hardware Development Guide of Module Product

MF206A

High temperature &

high humidity

Temperature: +60°C

Humidity: 95%

Duration: 48 hours

ZTE standard

High temperature

storage:

Temperature: 90°C

Duration: 24 hours

IEC 68-2-1 Ab

Low temperature

storage:

Temperature: -45°C

Duration: 24 hours

IEC 68-2-2 Bb

 NOTE:

When the module works at the normal temperature, all its RF indexes comply with the 3GPP specifications.

When the module works at extreme temperature, certain RF indexes do not comply with the 3GPP

specifications.

8.4 Reliability Testing Result

Table 8–5 Temperature Testing Result Under Windless Environment

Mode

Temperature

Voltage

Transmission

Power

Duration

Testing

Result

GPRS Class 10

+25℃

(3.8±10%)V

Max

≥1hour

Pass

EDGE Class 12

+25℃

(3.8±10%)V

Max

≥1 hour

Pass

WCDMA

+25℃

(3.8±10%)V

Max

≥1 hour

Pass

Table 8–6 High/Low-temperature Running & Storage Testing Result

Test Item

Test Condition &

Standard

Test Content

Test

Result

Random vibration

Refer to Table 8-4

RF test & function test

Pass

Temperature shock

Refer to Table 8-4

RF test & function test

Pass

Low-temperature

working

Refer to Table 8-4

RF test & function test

Pass

High-temperature

working

Refer to Table 8-4

RF test & function test

Pass

Extreme low-

temperature working

Refer to Table 8-4

RF test & function test

Pass

Hardware Development Guide of Module Product

MF206A

Extreme

high-temperature

working

Refer to Table 8-4

RF test & function test

Pass

Low-temperature

storage

Refer to Table 8-4

RF test & function test

Pass

High-temperature

storage

Refer to Table 8-4

RF test & function test

Pass

Hardware Development Guide of Module Product

MF206A

9 Design Guide

This chapter provides the general design guide for module, used as a reference for the user during the design

process, so that the product can reach better performance.

9.1 General Design Rule & Requirement

When the user is designing the peripheral circuits of module, he needs to first guarantee that the external circuit

has the sufficient power supply capability, and the USB of high-speed signal cable is required to have 90ohm

differential resistance. For the common signal interface, it is required to design according to ZTEWelink

requirements, which needs to comply with the power level of interface signal, so as to prevent the impedance

from damaging the module. The RF index of this product itself is good, and the user needs to design the antenna

circuit of the main board and make the corresponding impedance control. Otherwise, the RF index of the whole

set will be affected.

9.2 Suggestions for PCB Wielding Panel Design

When the user is designing the encapsulation wielding panel on main board, the 30 heat wielding panels in the

center are recommended to be designed according to the dimensions as described in Figure 9-1. The surrounding

78 wielding panels should be extended by more than 0.3mm, and the other three sides of the wielding panel are

extended by 0.05mm. For the right angles of wielding panels for the main antenna PIN1 and GPS antenna PIN70,

they are recommended to be rounded into a round angel with a radius of 0.3mm. In this way, it is convenient for

the import of interference and the radiation of RF signal. The Recommended PCB Wielding Panel Design is

shown in Figure 9-1 (Unit:mm).

Hardware Development Guide of Module Product

MF206A

Figure 9–1 Recommended PCB Wielding Panel Design

9.3 Suggestions for Heat-dissipation Design

The module will dissipate heat during the working process, and might also be affected by other high-temperature

devices. The heat dissipation is taken into full consideration during the product design, as 30 heat wielding

Hardware Development Guide of Module Product

MF206A

panels are reserved in the center of the module. During the connection with the system board, make sure that

these wielding panes are grounded well, which is greatly helpful to heat conductivity and heat balance, and is

greatly beneficial to the electric performance of the whole set as well.

 NOTE:

1. Keep this product away from heat-dissipation devices with high power, to prevent the temperature of the

module from being too high.

2. Do not put the module close to the large heat-dissipation devices, such as CPU or bridge. The high

temperature will affect the RF performance.

9.4 Recommended Product Upgrading Plan

It’s recommended to use the one-click software upgrade tool to upgrade through the USB port provided by

ZTEWelink in the Windows system. If the customer wants to upgrade the module in other operation systems,

ZTEWelink provides the corresponding reliable tools as well.

.

Hardware Development Guide of Module Product

MF206A

10 Manufacturing Guide

10.1 Design of Steel Mesh

During the design of steel mesh, note:

1. When manufacturing the steel mesh of thermal pad on the bottom of the module, narrow the mouth of

the steel mesh of the original size, so as to reduce the risk of shortcut between the module thermal and

the peripheral PINs. This method is effective.

2. It is recommended to design to the mouth of steel mesh on the thermal pad wielding panel to the lattice

form. Figure 10-1 shows the recommended pattern for the steel mesh.

Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel

.

Hardware Development Guide of Module Product

MF206A

10.2 Furnace Temperature Curve

The furnace temperature curve greatly affects the wielding quality and the material status, so it needs to be paid

great attention to. The temperature increasing speed cannot be too fast, with the increase speed from the room

temperature to 150℃ less than 3℃/second. At the same time, if the temperature is above 217℃, the duration

should be kept within 70 seconds, while the interim value 55 seconds is ideal. Otherwise, the great temperature

shock will make certain devices ineffective, causing the quality to decrease and the maintenance difficulty to

increase. At the same, keep the precise maximum temperature to be below 245℃, as certain materials (such as

the crystal) might crack under the high temperature and won’t vibrate any more, so the product function is

affected. Refer to Table 10-1 for the detailed requirements setting of furnace temperature curve, refer to Figure

10-2 for the furnace temperature curve and the testing result.

Table 10–1 Curve Temperature Curve Parameter Setting

Lead-free Curve Temperature Curve

Phase

Temperature

Duration

Pre-heat

Temperature is

increased from room

temperature to 150℃

Temperature

increasing ratio

<3℃/second

Temperature keeping

150℃~200℃

40~110 seconds

Wielding

Greater than 217℃

40~70 seconds

Above 230℃

15~45 seconds

Peak temperature

MAX: 245℃

MIN: 230℃

Hardware Development Guide of Module Product

MF206A

Figure 10–2 Furnace Temperature Curve Reference Diagram

Company: ZTE

Furnace:

Place: SMTMobile phone R&D line 1

Process limit:

(Degree centigrade)

Temperature range

Upper temperature range

Lower temperature range

(cm per minute)

Degree centigrade

Seconds

Module edge point

Module bottom

Chip

Temperature difference

Process limit

Butter of antimony:

Statistic name Lower limit Upper limit

Maximum temperature ascending slope (target: 2.0)

(Time distance = 20 seconds)

Maximum temperature descending slope

(Time distance = 20 seconds)

Preheat time 150200C

Time of the reflow temperature or above271C

Maximum temperature

Time of the temperature above 230C

Degree per second

Degree centigrade

Seconds

Unit

Upper limit

Preheat time 150200C Time of the reflow

temperature or above271C

Maximum temperature

ascending slope Maximum temperature

descending slope Total time

 NOTE:

More Guide Information about SMT & Baking about the Manufacturing process, please refer to the

document named SMT & Baking User Guide of ZTEWelink LGA Module Products.pdf

Hardware Development Guide of Module Product

MF206A

10.3 Package System

The modules are packaged on trays of 40 pieces each. These trays can be used in SMT processes for pick &

place handling.

The dimensions tolerance of tray is between 1mm except the dimensions with ☆ in the Figure below (and the

unit of dimensions is mm):

Figure 10–3 The dimensions of Package tray

The package process of modules is shown as the Figure below:

Hardware Development Guide of Module Product

MF206A

Figure 10–4 Package process of modules

Hardware Development Guide of Module Product

MF206A

11 Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage, service or

repair of any cellular terminal incorporating module. Manufacturers of the cellular terminal should send the

following safety information to users, operating personnel and to incorporate these guidelines into all manuals

supplied with the product.

The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, aircrafts, airports, etc,

switch off before boarding an aircraft. Make sure the cellular terminal is switched off in these areas. The

operation of wireless appliances in the hospitals, aircrafts and airports are forbidden to prevent interference

with communication systems.

 Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or

chemical transfer or storage facilities, areas where the air contains chemicals or particles such as gasoline

stations, oil refineries, etc make sure that wireless devices are turned off.

It’s the responsibility of users to enforce other country regulations and the specific environment regulations. And

ZTEWelink does not take on any liability for customer failure to comply with these precautions.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can

radiate radio frequency energy and, if not installed and used in accordance with the instructions, may

cause harmful interference to radio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or

Hardware Development Guide of Module Product

MF206A

television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one of the following measures:

● Reorient or relocate the receiving antenna.

● Increase the separation between the equipment and receiver.

● Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

● Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 5 dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the

OEM integrator is still responsible for testing their end-product for any additional compliance

requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer

considered valid and the FCC ID can not be used on the final product. In these circumstances, the

OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed

such that 20 cm may be maintained between the antenna and users. The final end product must

Hardware Development Guide of Module Product

MF206A

be labeled in a visible area with the following: “Contains FCC ID: Q78-ZTEMF206A”. The

grantee's FCC ID can be used only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to

install or remove this RF module in the user’s manual of the end product which integrates this

module. The end user manual shall include all required regulatory information/warning as show in

this manual.

ZTE ZTEMF206A HSPA LGA Module User Manual

ZTE Corporation HSPA LGA Module Users Manual

Contents

Users Manual

Navigation menu

Namespaces

Views

Navigation