iWaylink IM0002 Frey User Manual IT7000N user Menu

Bitatek Co., Ltd. Frey IT7000N user Menu

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Users Manual

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Document ID3069586
Application IDZSJS2jiDxvb9bfi9ln8X1Q==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize130.75kB (1634358 bits)
Date Submitted2016-07-20 00:00:00
Date Available2017-01-17 00:00:00
Creation Date2016-07-18 13:42:00
Producing SoftwareMicrosoft® Office Word 2007
Document Lastmod2016-07-18 13:42:00
Document TitleIT7000N user Menu
Document CreatorMicrosoft® Office Word 2007
Document Author: wesley

Frey M1 Module
18 July 2016
Version 2.0
Page 1
BitaTek Co., Ltd.
Copyright protected. All rights reserved.
NO. 115 Wugong 3rd Rd.,
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.)
Tel +886 2 2298 8588
Fax+886 2 2290 0029
Contents
Charpt 1.
Revision History ..................................................................... 4
Charpt 2.
Charpt 3.
3.1.
3.1.1.
3.1.2.
3.1.3.
3.1.4.
3.1.5.
3.1.6.
3.1.7.
3.1.8.
3.1.9.
3.2.
3.3.
3.4.
Introduction ............................................................................ 5
Product Concept .................................................................... 6
Main Feature.......................................................................... 6
Chipset on module ................................................................. 6
Memory .................................................................................. 6
Multimedia ............................................................................. 6
Audio (PM8952 codec ) ......................................................... 7
Expansion Slot Interface ........................................................ 7
USB ....................................................................................... 7
Keypad................................................................................... 7
Dimension .............................................................................. 7
Operation temperature ........................................................... 7
Module Block Diagram ........................................................... 8
Pin Definition.......................................................................... 8
Pad assignments (Top view) ................................................ 27
3.5.
Electrical Specification ......................................................... 28
3.5.1. Input power specification ..................................................... 28
3.5.2. Output power specification................................................... 29
3.5.3. Current consumption ........................................................... 32
3.5.4. Digital logic characteristics................................................... 32
3.5.5. Coin-cell charging ................................................................ 34
3.5.6. Audio ................................................................................... 34
3.5.7. Vibrator ................................................................................ 37
3.5.8. Display ± bias ...................................................................... 37
3.5.9. Flash drivers (including torch mode) .................................... 38
3.5.10. Display backlight (WLEDs) .................................................. 39
3.5.11. System clock (BB_CLK)....................................................... 40
3.5.12. RF Transmit and Receiver Specifications ............................ 40
3.5.13. Electrostatic Discharge ........................................................ 42
Charpt 4.
Module Mounting Issues ...................................................... 44
4.1.
Solder Paste ........................................................................ 44
4.2.
Stencil Printing ..................................................................... 44
Page 2
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Wugu Dist., New Taipei City 248, Taiwan (R.O.C.)
Tel +886 2 2298 8588
Fax+886 2 2290 0029
4.2.1.
4.2.2.
4.2.3.
4.2.4.
4.3.
4.3.1.
4.3.2.
4.4.
4.4.1.
4.4.2.
4.5.
4.6.
4.6.1.
4.6.2.
4.6.3.
Charpt 5.
5.1.
5.2.
5.2.1.
5.3.
5.4.
5.5.
5.6.
5.6.1.
5.6.2.
5.6.3.
Charpt 6.
6.1.
6.2.
Charpt 7.
7.1.
7.2.
General Stencil Considerations ........................................... 44
Used Parameters and Recommendations ........................... 45
Pick and Place ..................................................................... 45
Reflow Profile....................................................................... 45
Soldering Conditions and Temperature ............................... 47
Reflow Profile....................................................................... 47
Maximum Temperature and Duration .................................. 48
Soldering Process Evaluation .............................................. 48
Visual Inspection .................................................................. 48
X-Ray Inspection and Void Content ..................................... 48
Board Level Reliability Investigation .................................... 49
Desoldering Process ............................................................ 50
Preparation of LGA Module ................................................. 51
Baking of Application Board ................................................. 51
Removal of LGA Module ...................................................... 51
Packaging ............................................................................ 52
Mechanical Dimensions of Frey M1 ..................................... 52
Shipping Materials ............................................................... 54
Moisture Barrier Bag ............................................................ 56
Packing Label ...................................................................... 58
Storage Conditions .............................................................. 62
Moisture Sensitivity Level .................................................... 63
Durability and Mechanical Handling ..................................... 63
Storage Life ......................................................................... 63
Processing Life .................................................................... 63
Electrostatic Discharge ........................................................ 63
Regulatory and Type Approval Information.......................... 64
Safety Precautions ............................................................... 66
Safety .................................................................................. 68
Appendix .............................................................................. 70
Abbreviations ....................................................................... 70
Mounting Advice Sheet ........................................................ 70
Page 3
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NO. 115 Wugong 3rd Rd.,
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.)
Tel +886 2 2298 8588
Fax+886 2 2290 0029
Charpt 1. Revision History
Changes to the original manual are listed below:
Version
Date
Description
1.00
2016/06/21
Initial release
2.00
2016/7/18
Update FCC statement
Page 4
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Tel +886 2 2298 8588
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Charpt 2. Introduction
This document defines the specification for FREY M1. FREY M1 is a smart module for
handheld device and builds in Bluetooth, WiFi and GPS function. It also can support SD
card, LCM , Touch Screen , Audio , dual camera , Flash LED , Accelerometer /
Magnetometer / Gyroscope / Proximity & Light Sensor functions through application design
board.
Page 5
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Tel +886 2 2298 8588
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Charpt 3. Product Concept
3.1. Main Feature
3.1.1. Chipset on module
Digital processor : APQ8052 (ARM Cortex-A53 octa cores)

Quad core at 1.516 GHz, 512 kB L2 cache

Quad core at 1.209 GHz, 512 kB L2 cache
Power management : PM8952 and PMI8952
WLAN/BT/FM : WCN3680B

WLAN IEEE 802.11a/b/g/n/ac dual bands

Bluetooth V2.1BER/EDR+3.0HS+4.1 LE

FM RDS & RBDS, RX only
GPS : WGR7640

GPS, Glonass , Galileo or Beidou
3.1.2. Memory
eMCP , 2GB LPDDR3 RAM plus 16GB eMMC Flash ROM
3.1.3. Multimedia
Display interface：

Support one 4-lane MIPI DSI port , FHD (1920 × 1200) 60 fps
Camera interface：

Support 4-lane + 4-lane or 4-lane + 2-lane + 1-lane MIPI CSI port

Two Flash LED interface
Graphics：

Qualcomm® Adreno™ 405
Touch screen：

Capacitive panels via external IC by I2C
Page 6
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3.1.4. Audio (PM8952 codec )
Support two Microphones interface with noise cancellation
Support one speaker interface
Support one receiver interface
Support one audio jack interface
Support one vibrator control interface
3.1.5. Expansion Slot Interface
One micro SD Memory slot interface with SDHC
UIM interface x1
3.1.6. USB
Support one USB OTG
3.1.7. Keypad
Support 5x5 Key matrix
3.1.8. Dimension
44 x 33.6 x 2.7 mm
3.1.9. Operation temperature
Item
Min.
Typ.
Max.
Unit
Normal temperature range
+15
+25
+55
°C
Extreme temperature range
-30
+70
°C
Page 7
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3.2. Module Block Diagram
3.3. Pin Definition
Pin
AI : Analog input ;
AO : Analog output ;
DI : Digital input ;
DO : Digital output
PI : Power input ;
PO : Power output
Pin Name
Number
Wakeup
Pad
Functional description
Type
Power
W18
Input power from selected
USB_VBUS_IN
PI, PO
source, or output during
USB-OTG.
W19
Input power from selected
USB_VBUS_IN
PI, PO
source, or output during
USB-OTG.
X18
USB_VBUS_IN
PI, PO
Input power from selected
source, or output during
Page 8
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USB-OTG.
X19
Input power from selected
USB_VBUS_IN
PI, PO
source, or output during
USB-OTG.
T18
VBATT
PI, PO
Battery power supply
T19
VBATT
PI, PO
Battery power supply
U18
VBATT
PI, PO
Battery power supply
U19
VBATT
PI, PO
Battery power supply
PI, PO
Primary system power
Z18
Z19
AA18
AA19
VPH_PWR
VPH_PWR
VPH_PWR
VPH_PWR
supply node
PI, PO
Primary system power
supply node
PI, PO
Primary system power
supply node
PI, PO
Primary system power
supply node
U16
VREG_L1
PO
LDO output
F16
VREG_L4
PO
LDO output
C15
VREG_L5
PO
LDO output
F12
VREG_L6
PO
LDO output
C19
VREG_L10
PO
LDO output
D17
VREG_L11
PO
LDO output
E13
VREG_L12
PO
LDO output
C18
VREG_L14
PO
LDO output
C16
VREG_L16
PO
LDO output
E16
VREG_L17
PO
LDO output
D19
VREG_L18
PO
LDO output
D18
VREG_L22
PO
LDO output
T17
VREG_L23
PO
LDO output
U17
PMI8952_VBIAS
PO
Dedicated voltage source
for battery-related resistor
networks, not use for other
purpose.
X20
SYSON
PO
LDO output that supplies
SCHG FET drivers
RTC Battery
Page 9
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P20
VCOIN
PI, PO
For RTC battery.
DO
Buffered baseband
Clock
F17
PM8952_BB_CLK2
(low-power) XO clock 2
System
W17
DI
Internal pull-up to dVdd;
keep C load < 10 pF. Dual
function:
1. Keypad power on;
KYPD_PWR_N
initiates power on when
grounded
2. Can be configured as
stage 2 or stage 3 reset if
held LOW longer
X15
DI
RESIN_N
PMIC reset input ; initiates
stage 2 or stage 3 reset if
held LOW
W20
PMI8952_CHG_EN
DI
Charger enable
V20
CHG_VBAT_SNS
AI
Sensed battery voltage for
charger circuits
T20
AI
BATT_ID
Battery ID input to ADC;
also detects missing
battery
Y16
V15
V16
U15
CS_MINUS
CS_PLUS
BATT_MINUS
BATT_PLUS
X17
AI
Current sense resistor —
minus side (low side)
AI
Current sense resistor —
plus side (high side)
AI
Battery minus (-) terminal
sense input
AI
Battery plus (+) terminal
sense input
AI
Battery temperature input
to ADC (measures pack
BATT_THERM
temperature) , default NTC
is 47KΩ±1% in EVB
battery .
Page 10
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V17
V19
PA_THERM
AI
PMI8952_USB_EN
DO
AMUX input – PA
thermistor divider
Enable USB path from
external power multiplexer
Y18
PMI8952_USB_SNS
AI
USB input voltage sense
pin from external power
multiplexer
V18
PMI8952_DC_EN
DO
Enable 2nd power path
from external power
multiplexer
Y19
PMI8952_DC_SNS
AI
2nd power voltage sense to
determine in or out of valid
range
Z16
Keep it floating and doesn't
NC
NC
H18
MIC_BIAS1
AO
Microphone bias #1
I18
MIC_BIAS2
AO
Microphone bias #2
H19
MIC1_IN_M
AI
Microphone input 1, minus
H20
MIC1_IN_P
AI
Microphone input 1, plus
M19
MIC2_IN
AI
Microphone input 2
L18
MIC3_IN
AI
Microphone input 3
K18
GND_CFILT
GND
Microphone
connect to GND.
Audio
bias
filter
ground
J19
J20
K20
HPH_L
HPH_R
HPH_REF
AO
Headphone output, left
channel
AO
Headphone
output,
right
channel
AI
Headphone ground
reference
N18
HS_DET
AI
Headset detection
L20
EARO_M
AO
Earpiece output, minus (-)
L19
EARO_P
AO
Earpiece output, plus (+)
N20
SPKR_DRV_M
AO
Class-D speaker driver
output, minus (-)
N19
SPKR_DRV_P
AO
Class-D speaker driver
Page 11
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output, plus (+)
Vibrator
Y15
Y14
HAP_OUT_N
HAP_OUT_P
AO
Vibrator driver output
negative
AO
Vibrator driver output
positive
SD
V1
X2
W1
V2
V3
W2
SDC2_CLK
SDC2_CMD
SDC2_DATA_0
SDC2_DATA_1
SDC2_DATA_2
SDC2_DATA_3
DO
Secure digital controller 2
clock
DI,DO
Secure digital controller 2
command
DI,DO
Secure digital controller 2
data bit 0
DI,DO
Secure digital controller 2
data bit 1
DI,DO
Secure digital controller 2
data bit 2
DI,DO
Secure digital controller 2
data bit 3
USB
Z15
Dual function:
1. OTG mode enable
(programmable polarity;
PMI8952_USB_ID
AI, AO
can also be controlled by
OTG enable bit)
2. OTG ID monitor to detect
the OTG ID resistor value.
H13
USB_HS_DM
DI,DO
USB HS data minus
H14
USB_HS_DP
DI,DO
USB HS data plus
R19
USB data minus for power
PMI_USB_DM
DI
source detection only;
modem IC handles data
transactions
R18
USB data plus for power
PMI_USB_DP
DI
source detection only;
modem IC handles data
Page 12
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transactions
LED driver
X9
VREG_WLED_ANOD
PO
LCM WLED boost output
AO
WLED low-side current sink
Y13
WLED_SINK1
input, string 1
Z14
WLED_SINK2
AO
WLED low-side current sink
input, string 2
Y12
WLED_SINK3
AO
WLED low-side current sink
input, string 3
Z12
WLED_SINK4
AO
WLED low-side current sink
input, string 4
W14
WLED_CABC
DI
Content adaptive backlight
control (CABC); PWM
signal from display
controller for dynamic
dimming of LCD
X16
Z17
Y17
FLASH_LED1
FLASH_LED2
CHARGE_LED_RED
AO
High-side current source
for flash/torch LED1 anode
AO
High-side current source
for flash/torch LED2 anode
AO
Current sink for charging
indication
Display
V14
VREG_DISP_N5V
PO
Regulated output for the
display’s negative bias
V13
VREG_DISP_P5V
PO
Regulated output for the
display’s positive bias
U14
NC
NC
Keep it floating and doesn't
connect to GND.
K2
MIPI_DSI_CLK_N
DO
MIPI DSI clock negative
K3
MIPI_DSI_CLK_P
DO
MIPI DSI clock positive
J2
MIPI_DSI_LN0_N
DO
MIPI DSI data0 negative
J3
MIPI_DSI_LN0_P
DO
MIPI DSI data0 positive
I2
MIPI_DSI_LN1_N
DO
MIPI DSI data1 negative
I1
MIPI_DSI_LN1_P
DO
MIPI DSI data1 positive
Page 13
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K1
MIPI_DSI_LN2_N
DO
MIPI DSI data2 negative
J1
MIPI_DSI_LN2_P
DO
MIPI DSI data2 positive
L2
MIPI_DSI_LN3_N
DO
MIPI DSI data3 negative
L3
MIPI_DSI_LN3_P
DO
MIPI DSI data3 positive
P3
MIPI_CSI0_CLK_N
DI
MIPI CSI clock negative
P2
MIPI_CSI0_CLK_P
DI
MIPI CSI0 clock positive
Q2
MIPI_CSI0_LN0_N
DI
MIPI CSI0 data0 negative
Q3
MIPI_CSI0_LN0_P
DI
MIPI CSI0 data0 positive
R2
MIPI_CSI0_LN2_N
DI
MIPI CSI0 data1 negative
S2
MIPI_CSI0_LN2_P
DI
MIPI CSI0 data1 positive
S1
MIPI_CSI0_LN3_N
DI
MIPI CSI0 data2 negative
R1
MIPI_CSI0_LN3_P
DI
MIPI CSI0 data2 positive
Q1
MIPI_CSI0_LN4_N
DI
MIPI CSI0 data3 negative
P1
MIPI_CSI0_LN4_P
DI
MIPI CSI0 data3 positive
N3
MIPI_CSI1_CLK_N
DI
MIPI CSI1 clock negative
N2
MIPI_CSI1_CLK_P
DI
MIPI CSI1 clock positive
O3
MIPI_CSI1_LN0_N
DI
MIPI CSI1 data0 negative
O2
MIPI_CSI1_LN0_P
DI
MIPI CSI1 data0 positive
N1
MIPI_CSI1_LN2_N
DI
MIPI CSI1 data1 negative
O1
MIPI_CSI1_LN2_P
DI
MIPI CSI1 data1 positive
M3
MIPI_CSI1_LN3_N
DI
MIPI CSI1 data2 negative
M2
MIPI_CSI1_LN3_P
DI
MIPI CSI1 data2 positive
L1
MIPI_CSI1_LN4_N
DI
MIPI CSI1 data3 negative
M1
MIPI_CSI1_LN4_P
DI
MIPI CSI1 data3 positive
A2
WLAN_BT_ANT
ANT
WLAN/BT antenna
A19
GPS_ANT
ANT
GPS antenna
A13
FM_ANT
ANT
FM RX antenna
MPP
1. Configurable as digital
CAMERA
Antenna
MPP(Multi-Purpose Pin)
X14
I/Os
PMI8952_MPP_1
2. Analog multiplexer inputs
3. Even MPPs configurable
as current sinks; odd MPPs
Page 14
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configurable as analog
outputs
X13
MPP
1. Configurable as digital
I/Os
2. Analog multiplexer inputs
PMI8952_MPP_2
3. Even MPPs configurable
as current sinks; odd MPPs
configurable as analog
outputs
W13
PMI8952_MPP_3
MPP
1. Configurable as digital
I/Os
2. Analog multiplexer inputs
3. Even MPPs configurable
as current sinks; odd MPPs
configurable as analog
outputs
G16
1. Configurable as digital
I/Os
2. Level-translating
bidirectional I/Os
PM8952_MPP_02
MPP
3. Analog multiplexer inputs
4. Even MPPs can be
current sinks and odd
MPPs can be VREF buffer
outputs
F15
1. Configurable as digital
I/Os
2. Level-translating
bidirectional I/Os
PM8952_MPP_03
MPP
3. Analog multiplexer inputs
4. Even MPPs can be
current sinks and odd
MPPs can be VREF buffer
outputs
G15
PM8952_MPP_04
MPP
1. Configurable as digital
I/Os
Page 15
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2. Level-translating
bidirectional I/Os
3. Analog multiplexer inputs
4. Even MPPs can be
current sinks and odd
MPPs can be VREF buffer
outputs
GPIO
E2
GPIO_0
GPIO
1. Configurable I/O
2. BLSP1_SPI_MOSI
3. BLSP1_UART_TX
F2
GPIO
1. Configurable I/O
2. BLSP3_SPI_CS_N
GPIO_1
3. BLSP3_I2C_SDA
4. GP_CLK_2B
E3
GPIO_2
GPIO
1. Configurable I/O
2. BLSP8_SPI_MISO
F3
GPIO_3
GPIO
1. Configurable I/O
2. BLSP1_SPI_CLK
3. BLSP1_UART_RFR_N
4. BLSP1_I2C_SCL
U4
GPIO_4
GPIO
1. Configurable I/O
2. BLSP2_SPI_MOSI
3. BLSP2_UART_TX
T4
GPIO_5
GPIO
1. Configurable I/O
2. BLSP2_SPI_MISO
3. BLSP2_UART_RX
4. LDO_EN
X3
GPIO_6
GPIO
1. Configurable I/O
2. BLSP2_SPI_CS_N
3. BLSP2_UART_CTS_N
4. BLSP2_I2C_SDA
5. GP_CLK_1B
W3
GPIO
GPIO_7
1. Configurable I/O
2. BLSP2_SPI_CLK
3. BLSP2_UART_RFR_N
Page 16
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4. BLSP2_I2C_SCL
5. GP_PDM_2A
I3
GPIO_8
GPIO
1. Configurable I/O
H2
GPIO_9
GPIO
1. Configurable I/O
G3
GPIO_10
GPIO
1. Configurable I/O
2. BLSP1_SPI_MISO
3. BLSP1_UART_RX
G2
GPIO
1. Configurable I/O
2. BLSP3_SPI_CLK
GPIO_11
3. BLSP3_I2C_SCL
4. GP_CLK_3B
D4
GPIO_12
GPIO
1. Configurable I/O
2. BLSP4_SPI_MOSI
3. MI2S_2_D0
D1
GPIO
GPIO_13
1. Configurable I/O
2. BLSP4_SPI_MISO
3. MI2S_2_D1
F1
GPIO
GPIO_14
1. Configurable I/O
2. BLSP4_SPI_CS_N
3. BLSP4_I2C_SDA
E1
GPIO
GPIO_15
1. Configurable I/O
2. BLSP4_SPI_CLK
3. BLSP4_I2C_SCL
E4
GPIO
GPIO_16
1. Configurable I/O
2. BLSP5_SPI_MOSI
3. BLSP5_UART_TX
G4
GPIO
GPIO_17
1. Configurable I/O
2. BLSP5_SPI_MISO
3. BLSP5_UART_RX
B4
GPIO
1. Configurable I/O
2. BLSP5_SPI_CS_N
GPIO_18
3. BLSP5_UART_CTS_N
4. BLSP5_I2C_SDA
C4
GPIO
GPIO_19
1. Configurable I/O
2. BLSP5_SPI_CLK
3. BLSP5_UART_RFR_N
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4. BLSP5_I2C_SCL
V9
GPIO
1. Configurable I/O
2. BLSP6_SPI_MOSI
GPIO_20
3. BLSP6_UART_TX
4. GP_PDM_1B
W9
GPIO
GPIO_21
1. Configurable I/O
2. BLSP6_SPI_MISO
3. BLSP6_UART_RX
T15
GPIO_22
GPIO
1. Configurable I/O
2. BLSP6_SPI_CS_N
3. BLSP6_UART_CTS_N
4. BLSP6_I2C_SDA
T16
C1
GPIO_23
GPIO_24
G1
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
2. SDE_VSYNC_P
GPIO
1. Configurable I/O
2. SDE_VSYNC_S
GPIO_25
3. PRI_MI2S_MCLK_A
4. SEC_MI2S_MCLK_A
T12
Y9
T13
GPIO_26
GPIO_27
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
2. CAM_MCLK1
GPIO_28
1. Configurable I/O
2. CAM_MCLK2
Y11
1. Configurable I/O
GPIO_29
GPIO
2. BLSP6_SPI_CS2_N
3. GP_CLK1
Z11
W10
Y8
T8
GPIO
GPIO_30
GPIO_31
1. Configurable I/O
2. CCI_I2C0_SCL
GPIO
1. Configurable I/O
2. CCI_I2C1_SDA
GPIO
GPIO_32
1. Configurable I/O
2. CCI_I2C1_SCL
GPIO_33
GPIO
1. Configurable I/O
2. CCI_TIMER0
X10
GPIO_35
GPIO
1. Configurable I/O
Page 18
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W11
GPIO_36
GPIO
1. Configurable I/O
W8
GPIO_37
GPIO
1. Configurable I/O
V8
GPIO_38
GPIO
1. Configurable I/O
Z8
GPIO_39
GPIO
1. Configurable I/O
2. CCI_ASYNC0
3. GP_MN
Z13
GPIO_40
GPIO
1. Configurable I/O
X11
GPIO_41
GPIO
1. Configurable I/O
2. SD_WRITE_PROTECT
Z10
Y10
GPIO_42
GPIO_43
GPIO
1. Configurable I/O
2. GP_CLK_1A
GPIO
1. Configurable I/O
2. GP_CLK_2A
V12
GPIO_44
GPIO
1. Configurable I/O
2. GP_CLK_3A
T9
GPIO_45
GPIO
1. Configurable I/O
2. GP_PDM_1A
V10
GPIO_46
GPIO
1. Configurable I/O
2. GP_CLK0
X12
GPIO
GPIO_47
U9
1. Configurable I/O
2. CCI_I2C0_SDA
GPIO_48
1. Configurable I/O
GPIO
2. BLSP6_SPI_CS2_N
3. GP_PDM_0B
W12
GPIO_50
GPIO
1. Configurable I/O
F14
GPIO_51
GPIO
1. Configurable I/O
F13
GPIO_52
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
H12
B11
G9
F11
GPIO_53
GPIO_54
2. UIM1_RESET
1. Configurable I/O
2. UIM1_PRESENT
GPIO
GPIO_57
GPIO_58
GPIO
1. Configurable I/O
2. UIM2_RESET
GPIO
1. Configurable I/O
2. UIM2_PRESENT
E14
GPIO_59
GPIO
1. Configurable I/O
Page 19
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E12
GPIO_60
GPIO
1. Configurable I/O
G12
GPIO_61
GPIO
1. Configurable I/O
G11
GPIO_62
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
T11
GPIO_63
U13
GPIO_64
H6
GPIO_65
T14
GPIO_67
H3
GPIO_68
H4
GPIO_85
D5
2. CAM_MCLK0
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
GPIO
1. Configurable I/O
GPIO_86
GPIO
1. Configurable I/O
E5
GPIO_87
GPIO
1. Configurable I/O
C5
GPIO_88
GPIO
1. Configurable I/O
2. BLSP8_I2C_SDA
3. BLSP8_SPI_CS_N
F6
GPIO_89
GPIO
1. Configurable I/O
2. DMIC0_CLK
H8
A4
B5
GPIO_90
GPIO
1. Configurable I/O
2. DMIC0_DATA
GPIO
GPIO_91
1. Configurable I/O
2. MI2S_1_SCK
GPIO_92
GPIO
1. Configurable I/O
2. BLSP7_SPI_MOSI
3. MI2S_1_WS
A5
GPIO_93
GPIO
1. Configurable I/O
2. BLSP7_SPI_MISO
3. MI2S_1_D0
D2
GPIO
1. Configurable I/O
2. WSA_IO_DATA
GPIO_94
3. BLSP7_SPI_CS_N
4. BLSP7_I2C_SDA
D3
GPIO
1. Configurable I/O
2. WSA_IO_CLK
GPIO_95
3. BLSP7_SPI_CLK
4. BLSP7_I2C_SCL
C2
GPIO_96
GPIO
1. Configurable I/O
Page 20
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2. BLSP8_SPI_MOSI
C6
GPIO_97
GPIO
1. Configurable I/O
2. BLSP1_SPI_CS_N
3. BLSP1_UART_CTS_N
4. BLSP1_I2C_SDA
D6
GPIO_98
GPIO
1. Configurable I/O
2. MI2S_1_D1
C3
1. Configurable I/O
GPIO_99
GPIO
2. BLSP8_I2C_SCL
3. BLSP8_SPI_CLK
D12
E11
C10
GPIO_100
GPIO_101
GPIO_102
GPIO
1. Configurable I/O
2. GRFC_0
GPIO
1. Configurable I/O
2. GRFC_1
GPIO
1. Configurable I/O
2. GRFC_2
D11
GPIO_103
GPIO
1. Configurable I/O
2. GRFC_3
D10
GPIO_104
GPIO
1. Configurable I/O
2. GRFC_4
H10
GPIO_105
GPIO
1. Configurable I/O
2. GRFC_5
B10
H11
GPIO_106
GPIO_110
E10
GPIO
1. Configurable I/O
GPIO
1.Configurable I/O
2. GRFC_10
GPIO
1.Configurable I/O
2. GRFC_15
GPIO_115
3.
GSM_TX_PHASE_TXDAC
F10
GPIO_116
G10
GPIO
2. GRFC_28
GPIO
GPIO_117
1. Configurable I/O
1.Configurable I/O
2.
SM_TX_PHASE_TXDAC0
3. GRFC_27
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F8
E8
G8
GPIO_118
GPIO_119
GPIO_120
GPIO
1.Configurable I/O
2. RFFE1_CLK
GPIO
1.Configurable I/O
2. RFFE1_DATA
GPIO
1. Configurable I/O
2. RFFE2_CLK
G7
GPIO_121
GPIO
1. Configurable I/O
2. RFFE2_DATA
G6
GPIO_122
GPIO
1. Configurable I/O
2. RFFE4_CLK
G5
GPIO_123
GPIO
1. Configurable I/O
2. RFFE4_DATA
H5
GPIO_124
GPIO
1. Configurable I/O
2. RFFE5_CLK
F5
GPIO_125
GPIO
1. Configurable I/O
2. RFFE5_DATA
H7
GPIO_126
GPIO
1. Configurable I/O
2. RFFE3_CLK
F4
GPIO_127
GPIO
1. Configurable I/O
2. RFFE3_DATA
W4
GPIO_128
GPIO
1. Configurable I/O
V4
GPIO_129
GPIO
1. Configurable I/O
T3
GPIO_130
GPIO
1. Configurable I/O
X8
GPIO_131
GPIO
1. Configurable I/O
U8
GPIO_132
GPIO
1. Configurable I/O
Z9
GPIO_133
GPIO
1. Configurable I/O
W15
PMI8952_GPIO_1
GPIO
1. Configurable I/O
W16
PMI8952_GPIO_2
GPIO
1. Configurable I/O
D16
PM8952_GPIO_01
GPIO
1. Configurable I/O
D15
PM8952_GPIO_02
GPIO
1. Configurable I/O
H16
PM8952_GPIO_04
GPIO
1. Configurable I/O
C17
PM8952_GPIO_05
GPIO
1. Configurable I/O
E15
PM8952_GPIO_06
GPIO
1. Configurable I/O
P18
PM8952_GPIO_07
GPIO
1. Configurable I/O
P19
PM8952_GPIO_08
GPIO
1. Configurable I/O
GND
Page 22
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A1
GND
GND
A3
GND
GND
A6
GND
GND
A7
GND
GND
A8
GND
GND
A9
GND
GND
A10
GND
GND
A11
GND
GND
A12
GND
GND
A14
GND
GND
A15
GND
GND
A16
GND
GND
A17
GND
GND
A18
GND
GND
A20
GND
GND
B1
GND
GND
B2
GND
GND
B3
GND
GND
B6
GND
GND
B7
GND
GND
B8
GND
GND
B9
GND
GND
B12
GND
GND
B13
GND
GND
B14
GND
GND
B15
GND
GND
B16
GND
GND
B17
GND
GND
B18
GND
GND
B19
GND
GND
B20
GND
GND
C7
GND
GND
C8
GND
GND
C9
GND
GND
C11
GND
GND
Page 23
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C12
GND
GND
C13
GND
GND
C14
GND
GND
C20
GND
GND
D7
GND
GND
D8
GND
GND
D9
GND
GND
D13
GND
GND
D14
GND
GND
D20
GND
GND
E6
GND
GND
E7
GND
GND
E9
GND
GND
E17
GND
GND
E18
GND
GND
E19
GND
GND
E20
GND
GND
F7
GND
GND
F9
GND
GND
F18
GND
GND
F19
GND
GND
F20
GND
GND
G13
GND
GND
G14
GND
GND
G17
GND
GND
G18
GND
GND
G19
GND
GND
G20
GND
GND
H1
GND
GND
H9
GND
GND
H15
GND
GND
H17
GND
GND
I19
GND
GND
I20
GND
GND
J18
GND
GND
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K19
GND
GND
M18
GND
GND
M20
GND
GND
O18
GND
GND
O19
GND
GND
O20
GND
GND
Q18
GND
GND
Q19
GND
GND
Q20
GND
GND
R3
GND
GND
R20
GND
GND
S3
GND
GND
S18
GND
GND
S19
GND
GND
S20
GND
GND
T1
GND
GND
T2
GND
GND
T5
GND
GND
T6
GND
GND
T7
GND
GND
T10
GND
GND
U1
GND
GND
U2
GND
GND
U3
GND
GND
U5
GND
GND
U6
GND
GND
U7
GND
GND
U10
GND
GND
U11
GND
GND
U12
GND
GND
U20
GND
GND
V5
GND
GND
V6
GND
GND
V7
GND
GND
V11
GND
GND
Page 25
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W5
GND
GND
W6
GND
GND
W7
GND
GND
X1
GND
GND
X4
GND
GND
X5
GND
GND
X6
GND
GND
X7
GND
GND
Y1
GND
GND
Y2
GND
GND
Y3
GND
GND
Y4
GND
GND
Y5
GND
GND
Y6
GND
GND
Y7
GND
GND
Y20
GND
GND
Z1
GND
GND
Z2
GND
GND
Z3
GND
GND
Z4
GND
GND
Z5
GND
GND
Z6
GND
GND
Z7
GND
GND
Z20
GND
GND
AA1
GND
GND
AA2
GND
GND
AA3
GND
GND
AA4
GND
GND
AA5
GND
GND
AA6
GND
GND
AA7
GND
GND
AA8
GND
GND
AA9
GND
GND
AA10
GND
GND
AA11
GND
GND
Page 26
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AA12
GND
GND
AA13
GND
GND
AA14
GND
GND
AA15
GND
GND
AA16
GND
GND
AA17
GND
GND
AA20
GND
GND
3.4. Pad assignments (Top view)
Page 27
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3.5. Electrical Specification
3.5.1. Input power specification
Absolute maximum rating:
Operating FREY M1 under conditions beyond its absolute maximum ratings may damage
the device. Absolute maximum ratings are limiting values to be considered individually
when all other parameters are within their specified operating ranges. Functional operation
and specification compliance under any absolute maximum condition, or after exposure to
any of these conditions, is not guaranteed or implied. Exposure may affect device reliability.
Parameter
Min.
Max.
Units
USB_VBUS_IN
25
VPH_PWR
CHG_OUT (VBAT)
Steady state
CHG_OUT (VBAT)
Transient (< 10 ms)
Operation condition:
Operating conditions include parameters that are under the control of the user : power supply
voltage and ambient temperature. The FREY M1 meets all performance specifications listed in
this document when used and/or stored within the operating conditions, unless otherwise noted
in those sections (provided the absolute maximum ratings have never been exceeded).
Parameter
Min.
Max.
Units
USB_VBUS_IN
4.0
10
VPH_PWR
3.5
4.5
CHG_OUT (VBAT)
3.5
4.5
Note : There is battery detection algorithm in FREY M1 , user need to implement battery ID and
thermal pin on the system , otherwise system can't be powered on successfully .
Page 28
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Battery charger:
The FREY M1 features a fully programmable switch-mode battery charger, input power and
output power controller for terminal devices. The device is designed to be used in
conjunction with systems using single-cell Li-ion and Li-polymer battery packs.
Parameter
Conditions
Min
Typ
Max
Units
Peak switching current
USB_IN = 9.0 V
Maximum DC output
USB_IN = 9.0 V
Switching frequency
0.95
1.0
1.05
MHz
OTG output voltage
4.85
5.00
5.15
1.5
0.5
1.3
0.3
current
Charger-specific digital I/O characteristics
High-level input voltage
All charger digital
(VIH)
interface pads except
Low-level input voltage
CHG_EN
(VIL)
CHG_EN high-level input
voltage (VIH)
CHG_EN low-level input
voltage (VIL)
3.5.2. Output power specification
Output
Circuit
Default
Specified
Rated
power
type
voltage (V)
voltage range
current
(V)6
(mA)
1.000
1.000
200
RFICs
1.800
1.800
450
RFICs and
VREG_L1
VREG_L4
NMOS
LDO
PMOS
LDO
PMOS
VREG_L5
Expected use
GPS eLNA
1.800
1.800
300
LDO
Most digital
I/Os, LPDDR
and eMMC
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PMOS
1.800
1.800
300
LDO
APQ DSI PLL
and OTP,
Camera,
VREG_L6
Touch screen,
Display, and
sensors
VREG_L10
VREG_L11
PMOS
2.850
150
Sensors
2.950
2.950
800
Micro SD
2.950
1.800/2.950
150
APQ pad
LDO
PMOS
LDO
PMOS
VREG_L12
2.850
LDO
group 2 and
SDC2
PMOS
1.800
1.800/3.300
50
LDO
APQ pad
group 5,
VREG_L14
dual-voltage
UIM1, and
NFC
VREG_L16
PMOS
1.800
2.850
2.850
600
PMIC HKADC
LDO
PMOS
VREG_L17
1.800
LDO
Camera,
Display, and
Touch screen
VREG_L18
VREG_L22
VREG_L23
PMOS
2.700
2.700
150
LDO
PMOS
front-end
2.800
2.800
300
LDO
NMOS
QTI RF
Camera –
analog
1.200
1.200
300
LDO
Camera –
digital
Page 30
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LDO performance specifications
Parameter
Comments
Min
Typ
Max
Units
Output voltage

All NMOS

12.5 mV steps
0.375
1.5375

All PMOS

12.5 V steps
1.75
3.3375
Overall DC voltage output
Over-voltage,
error
temperature, and process

Normal mode
variations plus load and
-2
 At default voltage
line regulation
-3
Low-power mode
-4
 At default voltage
-5
-100
100
ppm/°C
 50 Hz–1 kHz
60
70
dB
 1–10 kHz
60
dB
 10–100 kHz
50
dB
 50 Hz–1 kHz
50
dB
 1–100 kHz
40
dB
 At non-default
voltages

 At non-default
voltages
Temperature coefficient
NMOS power-supply ripple
PSRR
rejection


Normal mode
Low-power mode
PMOS power-supply ripple
rejection

50 Hz–1 kHz
43
dB

1–10 kHz
35
dB

10–100 kHz
13
dB
Page 31
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3.5.3. Current consumption
Item
Test condition
Max.
Units
Off mode current
Module is turned off
250
uA
Flight mode current
Module is turned on and in sleep mode
4.5
mA
and all RF is turned off
WiFi TX current
2.4G, 11b, 11 Mbps, 15 dBm
250
mA
WiFi RX current
2.4G
130
mA
WiFi TX current
5G, 11a, 54 Mbps, 15 dBm
250
mA
WiFi RX current
5G
130
mA
BT TX current
class 2 , 2dBm
150
mA
130
mA
BT RX current
Note 1. The measurement is at VBAT of module and VBAT=3.8V .
Note 2. WiFi & BT current is measured with IQexl 160.
3.5.4. Digital logic characteristics
Digital I/Os specification
Pad voltage
Usage
Table
1.8 V
Most digital I/Os
Table 3.5.4.1
Dual-V (1.8 V/2.95 V)
SDC2, UIM
Table 3.5.4.2
Dual-V (1.8 V/3.05 V)
USB
Table 3.5.4.3
Table 3.5.4.1 Digital I/O (VDD_P3= VREG_L5)
Parameter
Min.
Max.
Unit
VIH
High-level input voltage
0.65 × VDD_P3
VIL
Low-level input voltage
0.35 × VDD_P3
VOH
High-level output voltage
VDD_P3 - 0.45
VOL
Low-level output voltage
0.45
Page 32
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Table 3.5.4.2 SDC2,UIM
Parameter
Min.
Max.
Unit
Common to UIM pads at either voltage (VDD_PX= VREG_L14)
VIH
High-level input voltage
0.7 × VDD_PX
VDD_PX + 0.3
VIL
Low-level input voltage
0.2 × VDD_PX
VOH
High-level output voltage
0.8 × VDD_PX
VDD_PX
VOL
Low-level output voltage
0.4
VDD_PX + 0.3
0.25 × VDD_PX
SDC2 pads at 2.95 V only(VDD_PX= VREG_L12)
VIH
High-level input voltage
0.625 ×
VDD_PX
VIL
Low-level input voltage
VOH
High-level output voltage
0.75 × VDD_PX
VDD_PX
VOL
Low-level output voltage
0.125 × VDD_PX
SDC2 pads at 1.8 V only
VIH
High-level input voltage
1.27
VIL
Low-level input voltage
0.58
VOH
High-level output voltage
1.4
VOL
Low-level output voltage
0.45
Table 3.5.4.3 USB
Parameter
Min.
Typ.
Max.
Unit
1.80
3.075
Frequency
19.2
MHz
Duty cycle
40
60
Low-level input voltage (VIL)
0.85
High-level input voltage (VIH)
1.27
2.0
5.25
Supply voltages
Dual-supply
USBPHY_SYSCLK
USBPHY_VBUS
Valid USB_HS_VBUS detection
voltage
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3.5.5. Coin-cell charging
Parameter
Target regulator
Condition
VIN > 3.3 V, ICHG = 100 µA
Min
Typ
Max
Unit
2.50
3.10
3.25
voltage(*)
(*) Valid regulator voltage settings are 2.5, 3.0, 3.1, and 3.2 V.
3.5.6. Audio
All audio codec performance data are collected above Vbatt of 3.7 V, unless otherwise
specified.
Inputs and Tx processing
All Tx performance parameters are measured with a 1.02 kHz sine wave input signal,
capless differential or single-ended inputs, Fs = 48 kHz, 24-bit data, and MCLK = 9.6 MHz
or 12.288 MHz.
Parameter
Conditions
Min
Typ
Max
Units
19.0
25.1
µVrms
92.0
94.0
2.7
4.2
84.0
88.0
Microphone amplifier gain = 0 dB (minimum gain)
Input referred noise
Analog input = -200 dBV,
A-weighted, bandwidth 20
Hz–20 kHz
Signal-to-noise
Analog input = 0 dBV,
ratio
A-weighted, bandwidth 20
dB
Hz–20 kHz
Microphone amplifier gain = 24 dB (maximum gain)
Input referred noise
Analog input = -200 dBV,
µVrms
A-weighted, bandwidth 20
Hz–20 kHz
Signal-to-noise
Analog input = -24 dBV,
ratio
A-weighted, bandwidth 20
dB
Hz–20 kHz
General requirements
Power supply
100 mVpp sine wave
rejection
imposed on PMIC vph_pwr
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input; analog input = 0
Vrms, terminated with 0 Ω
Terminate inputs with 0 Ω;
gain = 0 dB
75
95
dB
75
95
dB
60
97
dB
Input impedance
Input disabled
MΩ
Input capacitance
Capless input
15
pF
Conditions
Min
Typ
Max
Units
f = 1.02 kHz, 0 dBFS input,
120.0
127.0
mW
160.0
172.0
mW
150.0
160.0
mW
10.7
32.0
50000
Ω
500
pF
1.0
MΩ
1.52
1.60
1.68
Outputs and Rx processing
Parameter
Earpiece
Output power
6 dB gain mode, 32 Ω
f = 1.02 kHz, -1.5 dBFS
input, 6 dB gain mode, 16
Ω
f = 1.02 kHz, -3.5 dBFS
input, 6 dB gain mode,
10.67 Ω
Output load
Supported output load
Output
Total capacitance between
capacitance
EARO_P and EARO_M,
including PCB capacitance
and EMI
Disabled
Measured externally with
output
amplifier disabled
impedance
Output
Measured externally with
common mode
amplifier disabled
voltage
Headphone
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Output power
f = 1.02 kHz, 0 dB FS, 16 Ω
60.0
63.0
mW
27.0
30.8
mW
13.0
16.0
50000
Ω
1000
pF
1.0
MΩ
1700
mW
+15 µH
1200
1400
mW
THD+N ≤ 1%; 15 µH + 8 Ω +
1500
2150
mW
60.0
85.0
dB
60.0
86.0
dB
40.0
86.0
dB
40.0
82.0
dB
Pout = 1 W, 15 µH + 8 Ω + 15
73.0
82.0
µH
60.0
77.0
load; VDD_CP = 1.95 V, 0 dB
gain mode
f = 1.02 kHz, 0 dB FS, 32 Ω
load; VDD_CP = 1.95 V, 0 dB
gain mode
Output load
Supported output load
Output
Total capacitance on HPH
capacitance
output (single-ended),
including PCB capacitance
and EMI
Disabled output
Measured externally, with
impedance
amplifier disabled
Mono speaker
Output power
Vdd = 5 V , f = 1 kHz
THD + N < 8.7%; 15 µH + 8 Ω
15 µH
THD+N ≤ 1%; 15 µH + 4 Ω +
15 µH
Power supply
200 mVpp sine wave imposed
rejection
on PMIC_VBATT; digital input
= -999 dBFS2
1 kHz
Efficiency
Vdd = 5 V
Pout = 2 W, 15 µH + 4 Ω + 15
µH
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3.5.7. Vibrator
Parameter
Conditions
Operational input
Connected at VDD_HAP (VH
voltage
below)
Min
Typ
Max
Units
2.5
3.6
4.75
Output voltage
Peak, no load
At HAP_OUT_P and
VH
Average (V_HA)
HAP_OUT_N
3.6
Maximum drive
Differential, over one PWM
1.2
3.6
Accuracy
cycle
50
mV
300
400
500
mA
600
800
1000
mA
253
503
1076
KHz
+/-16
Differential, over one PWM
cycle
Duty cycle < 95%
Output current limit
Cycle-to-cycle limit
R_ERM or R_load
R_load = 10
Internal PWM
253 kHz, 505 kHz, 739 kHz,
frequency
1076 kHz
Programmable
options
Accuracy
3.5.8. Display ± bias
FREY M1 provides the plus and minus bias voltages for LCD displays; pertinent
performance specifications are listed as below.
Display plus bias
Parameter
Operational input voltage
Conditions
Connected at VDD_DIS_P
Min
Typ
Max
Units
2.5
4.75
5.0
5.5
6.1
Output voltage
(VDIS_P_OUT)
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Range, no load to 150 mA
100
mV
150
mA
92
1.48
MHz
Resolution
Output current
Efficiency
I_out = 30 mA
Switching frequency
(default)
NOTE: All specifications apply at VDD_DIS_x = 3.6 V , T = -30 to +85ºC, VDIS_P_OUT = 5.5 V, L
= 4.7 µH, and C = 10 µF (capacitance value de-rated from 22 µF nominal) .
Display minus bias
Parameter
Conditions
Min
Typ
Max
Units
Operational input voltage
Connected at VDD_DIS_N
2.5
4.75
-1.4
-6.0
100
mV
150
mA
84
1.48
MHz
Output voltage
(VDIS_N_OUT)
Range, no load to 150
mA
Resolution
Output current
Efficiency
I_out = 50 mA
Switching frequency
(default)
NOTE: All specifications apply at VDD_DIS_x = 3.6 V, T = -30 to +85ºC, VDIS_N_OUT = -5.5 V,
L = 4.7 µH, C = 10 µF (capacitance value de-rated from 22 µF nominal) .
3.5.9. Flash drivers (including torch mode)
Parameter
Conditions
Min
Typ
Max
Units
2.5
10
5.8
3.6
5.5
Driver input voltage
VDD_FLASH
Flash disabled
Flash enabled
VDD_TORCH
Expected source is PMI’s
DC_IN_OUT
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Expected source is PMI’s
VREG_BST_BYP
Output current per
LED
Flash
1000
mA
200
mA
Torch
NOTE: All specifications apply at VPH_PWR = 3.6 V, T = -30 to +85ºC unless noted otherwise.
3.5.10.
Display backlight (WLEDs)
The FREY M1 supports WLEDs with a boost converter that generates the high voltage needed
for powering a string of WLEDs, plus four output drivers for sinking the current from WLED
strings.
Parameter
Conditions
Min
Typ
Max
Units
2.5
4.75
Operational input voltage
VPH_PWR
Input voltage for full
I_led = 20 mA per string
brightness
V_out = 28 V across panel
2.8
V_out = 24 V across panel
3.6
6.0
28.5
830
980
1200
mA
0.6
0.8
1.6
MHz
2 strings (~16 WLEDs)
4 strings (~28 WLEDs)
Output voltage
Over-current protection
Programmable, set to 980 mA
Switching frequency
Efficiency
VDD = 3.6 V, 25°C, F_sw = 0.8
Peak
MHz
86
Average
I_out = 15 mA/string (x4), 13.5 V
80
Light load
out
75
30
mA
20
40
KHz
I_out = 5 to 25 mA/string (x4)
I_out = 1 to 5 mA/string (x4); PSM
en
Full-scale current range
Programmable range, 2.5 mA
step
CABC frequency
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3.5.11.
System clock (BB_CLK)
Parameter
Comment
Min
Typ
Operating frequency
Max
19.2
Units
MHz
Output levels

Logic high (VOH)
1.17

Logic low (VOL)
0.63
3.5.12.
RF Transmit and Receiver Specifications
RF Operation Frequency Band
Band
Min
Max
WIFI 2.4G
2412MHz
2472MHz
WiFi 5G
5180MHz
5825MHz
BT
2402MHz
2480MHz
GPS
1574.40MHz
1576.44MHz
Glonass
1598MHz
1606MHz
WIFI
Considering SAR regulatory, limit WiFi Tx power at certain level.
Parameter
Bandwidth
Mode
11b
TX output
power level
Constellation
Error (EVM)
Sensitivity
HT20
HT20
HT20
Rate
(Mbps)
11
2.4G
Data Rate
Unit
Min
Typical
Max
CCK-11
13
15
17
dBm
11g
54
OFDM-54
11
13
15
dBm
11n
65
MCS7
10
12
14
dBm
11b
11
CCK-11
-18
dB
11g
54
OFDM-54
-24
dB
11n
65
MCS7
-26
dB
11b
11
CCK-11
-89
dBm
11g
54
OFDM-54
-74
dBm
11n
65
MCS7
-70
dBm
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Parameter
Bandwidth
Mode
11a
TX output
power level
HT20
11n
5G
Rate
Data Rate
(Mbps)
54
Unit
Min
Typical
Max
13
15
17
dBm
10
12
14
dBm
OFDM-54
65
MCS7
11ac
78
MAC8
10
12
14
dBm
11n
135
MCS7
10
12
14
dBm
11ac
180
MCS9
10
12
14
dBm
11ac
433
MCS9
11
13
dBm
11a
54
OFDM-54
-24
dB
11n
65
MCS7
-25
dB
11ac
78
MCS8
-28
dB
11n
135
MCS7
-25
dB
11ac
180
MCS9
-28
dB
11ac
390
MCS9
-32
dB
11a
54
OFDM-54
-70
dBm
11n
65
MCS7
-68
dBm
11ac
78
MCS8
-58
dBm
11n
135
MCS7
-58
dBm
11ac
180
MCS9
-53
dBm
11ac
380
MCS9
-51
dBm
HT40
HT80
HT20
Constellation
Error (EVM)
HT40
HT80
HT20
Sensitivity
HT40
HT80
Bluetooth
Parameters
RCV/CA/01/C (Single Sensitivity)
Min
Typ
Max
Uint
-87
dBm
-87
dBm
-87
dBm
RCV/CA/07/C (EDR Sensitivity)
2Mbps Packet Length: 2-DH1
RCV/CA/07/C (EDR Sensitivity)
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3Mbps Packet Length: 3-DH1
TRM/CA/01/C Output power(class1)
12
dBm
TRM/CA/01/C Output power(class2)
-6
dBm
GPS
Test Items
Test condition
CN ration
Satellites@-130dBm
Min
Sensitivity
3.5.13.
Typical
38
-145
Max
Unit
40
dBm
dBm
Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD
sensitive components. Proper ESD handling and packaging procedures must be applied
throughout the processing, handling and operation of any application that incorporates a
FREY M1 module.
Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is
therefore advisable to develop measures and methods to counter ESD and to use these to
control the electrostatic environment at manufacturing sites.
Specification
ANSI/ESDA/JEDEC JS-001-2011
± 1KV Human Body Model (HBM)
JESD22-A114-F
± 500V Charge Device Model (CDM)
EN301-489
± 4KV (Indirect discharge) *
± 8KV (Air discharge) **
Note * : Indirect discharge with coupling metal plane .
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Note ** : Air discharge on location 1,2,3,4,5 on module , module is mounted on EVB .
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Charpt 4. Module Mounting Issues
Frey M1 modules have been designed with an easy integration into SMT processes in mind.
Some module mounting issues are discussed in more detail in the sections below.
Please note that Frey M1 modules are specified for one soldering cycle only. Once removed
from the application, the module will very likely be destroyed and cannot be soldered onto
another application. Please also note that the modules are not sealed and should therefore
not be subjected to any post SMT wash or to any environments where condensation could
occur.
4.1. Solder Paste
A variety of solder paste types can be used to realize connections to external applications.
Soldering using lead free eutectic SnAgCu alloy can be done without any special restrictions,
because of its maximum allowed temperature of 245°C.
ENIG finish of the modules soldering pads ensures good wetting properties even after 12
month of storage.
However, there are some restrictions that should be noted before selecting the solder paste:
Due to the fact that the top side of the modules is assembled using standard eutectic SnAgCu
alloy, no higher melting alloys should be used (even though remelting of top side solder joints
also happens with eutectic SnAgCu).
Higher temperatures mean more stress to materials than lower temperatures: Increasing the
reflow temperature increases the growth of intermetallics, especially if the temperature lies
above the melting point of that alloy. Large intermetallics are commonly considered a
reliability risk. They should therefore be kept as small as possible.
4.2. Stencil Printing
4.2.1. General Stencil Considerations
The higher the stand off formed by the solder paste volume, the better the reliability for land
grid array (=LGA) based connections. The solder paste volume in a stencil printing process is
formed by aperture size (area) and stencil height:
VolumeSolder paste = AreaAperture x HeightStencil
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It is recommended that customers do their own testing to determine the optimal solder paste
volume. This volume can be applied by stencil printing with different stencil heights to fit your
existing assembly needs. The volume is kept constant by varying the aperture size
accordingly.
The most common thicknesses 110μm and 150μm (stainless steel, laser cut) have been
tested with good results with regard to printing process, soldering process and reliability
testing. Similar results are expected with stencil thicknesses in between.
Different solder paste volumes have been tested too but with much lower volume there is a
trend to poor solder joints and a risk for open joints. Much larger solder joints tend to form
solder balling in the vicinity of the solder joints.
4.2.2. Used Parameters and Recommendations
For stencil printing, a stainless steel stencil, laser cut (or similar technology) should be used.
Parameters must be optimized depending on actual application board design, equipment und
solder paste.
To simulate different applications, two different stencil thicknesses of 110μm and 150μm
were used while keeping the solder paste volume constant by variation of the apertures.
If the results for all tested versions were found to be good. For exact pad and aperture
dimensions, as well as module geometry and footprint design
4.2.3. Pick and Place
FREY M1 well be put into the antistatic tray plate. One antistatic tray plate will have 15 Frey
M1 modules, and one moisture barrier bag will have max 5 antistatic tray plates
4.2.4. Reflow Profile
Short profiles are recommended for reflow soldering processes in order to prevent top side
solder joints from growing large intermetallic compounds. Peak zone temperature should be
adjusted high enough to ensure proper wetting and optimized forming of solder joints. On the
other hand, a plateau during preheating can help to reduce voiding behavior. Generally
speaking, unnecessary long exposure and exposure to more than 245°C should be avoided.
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As an example and during Frey M1 internal tests, forced convection machines were able to
realize a good reflow soldering profile, so there was no need for using vapor phase
equipment.
For analyzing and adapting solder profiles a carrier board was prepared with thermocouples
(TC) .
In order to get a good overall performance the resulting voiding and the formation of
intermetallics as well as other thermal induced degradations must be well balanced. As
mentioned above a longer preheating phase can help gasses to escape from solder joints
before solidification. To not overstress the assembly, the complete reflow profile should be as
short as possible.
Here an optimization considering all components on the application must be performed. The
optimization of a reflow profile is a gradual process. It needs to be performed for every paste,
equipment and product combination. The presented profiles are only samples and valid for the
used pastes, reflow machines and test application boards. Therefore a "ready to use" reflow
profile can not be given.
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4.3. Soldering Conditions and Temperature
4.3.1. Reflow Profile
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature Minimum (Tsmin)
Temperature Maximum (Tsmax)
Time (Tsmin to Tsmax) (tS)
150°C
200°C
60-120 seconds
Average ramp up rate (Tsmax to Tp)
3K/second max.
Liquidous temperature (TL)
217°C
Time at liquidous (tL)
60-90 seconds
Peak package body temperature (Tp)
245°C +0/-5°C
Time (tP) within 5 °C of the peak package body
30 seconds max.
temperature (TP)
Average ramp-down rate (TP to TSmax)
3 K/second max.
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Time 25°C to maximum temperature
8 minutes max.
4.3.2. Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach
the module:
• A maximum module temperature of 245°C. This specifies the temperature as
measured at the module’s top side.
• A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best
temperature and duration for solder reflow should generally be followed, the limits listed
above must not be exceeded.
Frey M1 is specified for one soldering cycle only. Once Frey M1 is removed from the
application, the module will very likely be destroyed and cannot be soldered onto another
application.
4.4. Soldering Process Evaluation
4.4.1. Visual Inspection
As a rule, automated optical inspection (AOI) of solder joints is not suitable for evaluating LGA
modules, because most of the I/O pins are hidden underneath the module. Inspection of the
outermost I/Os is not sufficient to evaluate soldering. Please reference IPC-A-610 standard.
4.4.2. X-Ray Inspection and Void Content
X-Ray inspection is an appropriate method for evaluating solder joints after reflow. X-Ray
images can show wetting problems, missing solder volume or of course bridging.
X-Ray inspection is made somehow more difficult by overlaying module components and by
possible bottom side (application) assemblies. However, module connections are
characterized by their shape and size, so in most cases they can easily be distinguished from
the mentioned overlaying structures.
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The set shows typical X-Ray images of sample modules soldered to an assumed application
board including some failure samples. The images are taken from assembly and BLR testing
and comprise two different stencil versions (110μm and 150μm thickness).
A good solder joint at Frey M1 signal pins in X-Ray inspection is characterized by a
rectangular shape, described by the dimensions of the pad at the module.
Solder joints which have a round footprint in X-Ray image are found in areas with high stand
off and are more column like instead of flat. These are good from electrical point of view but
indicate processing problems like aslope standing of the module or warpage.
It is recommended to use X-Ray to determine level of voiding. Entrapments of gases can
often not be completely avoided, if large flat solder joints are used. Currently there are no
standards available defining limits for void content. The available IPC610 standard for ball
grid arrays (=BGA) must not be applied to LGAs and hence to the Frey M1 SMT modules.
As seen from the X-Ray images above there is no significant difference in reflow result for the
110μm and 150μm stencils. This is mainly due to the fact, that the resulting volume was kept
constant by varying the apertures accordingly. The resulting shape of the solder joint is only
influenced by the volume.
Only if solder paste spreading is limited, which can occur with lead free solder on Cu-OSP or
immersion tin PCB surfaces, a little difference in solder joint shape can be expected but with
no effect on quality or yield. This is a characteristic of lead free solders and not a wetting
issue.
4.5. Board Level Reliability Investigation
The board level reliability tests described as follow table
Item No
Test case
Storage Test
International standard
IEC60068-2-1
IEC60068-2-2
Thermal Cycle
IEC60068-2-3
IEC60068-2-56
IEC60068-2-38
IEC60068-2-30
Thermal Stress
IEC60068-2-3
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IEC60068-2-56
IEC60068-2-38
IEC60068-2-30
Thermal Shock
IEC60068-2-14
Vibration
IEC60068-2-6
IEC60068-2-59
Mechanical Shock
IEC60068-2-27
Micro Drop
IEC60068-2-32
ESD
IEC61000-4-2
Low temperature start test
IEC60068-2-1
10
High temperature start test
IEC60068-2-2
4.6. Desoldering Process
In case of persisting module issues, the module may be desoldered from the application
board. Desoldering however should only be the final means of diagnosis after all other
possible electrical on-board tests using the implemented test points were not successful.
The desoldering process is very similar to the employed soldering process, meaning that it is
quite specific for any type of external application.
The intention of desoldering is to provide a possibility to employ the standard RMA process.
Even if a further usage of the application board cannot be guaranteed (because of the
potential impact on neighboring components throughout the desoldering process), a high
reuse probability is expected, if the desoldering process is done in a professional manner.
There are a various types of desoldering machines available. The choice of a desoldering
machine (e.g., a Martin machine) strongly depends on the layout of the external application
board, the size and position of other components close to the module have an impact on the
temperature profile and type of heating.
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4.6.1. Preparation of LGA Module
It is recommended to use a vacuum lift system to pick up the desoldered module from the
application board. To secure a fixed connection between module shielding and module PCB,
additional glue points have to be provided.
4.6.2. Baking of Application Board
For a reliable desoldering process the moisture level has to taken into account. As known
from the soldering process, the moisture has to be limited to a certain level to avoid any
damages to components. Therefore, the complete application board including the module will
have to be baked before the desoldering process begins.
4.6.3. Removal of LGA Module
After preparation (glueing, baking) the module can be desoldered from the application board.
The desoldering temperature profile has to be selected that fits to the application and module
requirements (e.g., used solder paste, soldered components, PCBs). As recommended for
the LGA modules’ soldering process, the temperature profile should not exceed a
temperature of 245°C
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Charpt 5. Packaging
5.1. Mechanical Dimensions of Frey M1
Length: 44mm
Width: 33.6mm
Height: 2.7mm
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Bottom
5.2. Shipping Materials
FREY M1 is described below, including the following required shipping materials:
• Moisture barrier bag, including desiccant and humidity indicator card.
FREY M1 well be put into the antistatic tray plate. One antistatic tray plate will have 15 Frey M1
modules, and one moisture barrier bag will have max 5 antistatic tray plates.
The material of tray plate is styrene-butadiene Copolymer(CAS NO. 9003-55-8), the operation
temperature range please refence CAS NO 9003-55-8.
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5.2.1. Moisture Barrier Bag
Those are stored inside a moisture barrier bag, The bag is ESD protected and delimits
moisture transmission. It is vacuum-sealed and should be handled carefully to avoid
puncturing or tearing. The bag protects the Frey M1 modules from moisture exposure. It
should not be opened until the devices are ready to be soldered onto the application.
The moisture barrier bag size : 420 x 240 MM
The moisture barrier bag thickness : 0.15MM
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Desiccant size :
90MM+ /-10MM
The moisture barrier bag s contain one or more desiccant pouches to absorb moisture that
may be in the bag. The humidity indicator card described below should be used to
determine whether the enclosed components have absorbed an excessive amount of
moisture.
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The desiccant pouches should not be baked or reused once removed from the moisture
barrier bag.
The humidity indicator card is a moisture indicator and is included in the moisture barrier
bag to show the approximate relative humidity level within the bag. A sample humidity card
is shown in follow Figure. If the components have been exposed to moisture above the
recommended limits, the units will have to be rebaked.
5.3. Packing Label
The label shown in summarizes requirements regarding moisture sensitivity, including shelf
life and baking requirements. It is attached to the outside of the moisture barrier bag.
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Caution label
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Module label : this label will on the top site of Frey M1.
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Vacuum bag label : It is attached to the outside of the moisture barrier bag.
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Carton label : It is attached to the outside of the carton
5.4. Storage Conditions
The conditions stated below are only valid for modules in their original packed state in
weather protected, non-temperature-controlled storage locations. Normal storage time
under these conditions is 12 months maximum. The modules will be delivered in a
packaging that meets the requirements Low Temperature Carriers.
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5.5. Moisture Sensitivity Level
Frey M1 comprises components that are susceptible to damage induced by absorbed
moisture.
5.6. Durability and Mechanical Handling
5.6.1. Storage Life
Frey M1 modules must be stored in sealed, moisture barrier anti-static bags. The shelf
life in a sealed moisture bag is an estimated 12 months. However, such a life span
requires a non-condensing atmospheric environment, ambient temperatures below 40°C
and a relative humidity below 90%
5.6.2. Processing Life
Frey M1 must be soldered to an application within 72 hours after opening the moisture
barrier bag (MBB) it was stored in.
The manufacturing site processing the modules should have ambient temperatures
below 30°C and a relative humidity below 60%.
5.6.3. Electrostatic Discharge
Electrostatic discharge (ESD) may lead to irreversible damage for the module. It
is therefore advisable to develop measures and methods to counter ESD and to
use these to control the electrostatic environment at manufacturing sites.
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Charpt 6. Regulatory and Type Approval Information
It is the responsibility of the application manufacturer to ensure compliance of the final product with all
provisions of the applicable directives and standards as well as with the technical specifications provided
Directive
99/05/EC
Directive of the European Parliament and of the council of 9 March
1999 on radio equipment and telecommunications terminal
equipment and the
mutual recognition of their conformity (in short referred to as R&TTE
Directive 1999/5/EC). The product is labeled with the CE conformity
mark
2011/65/EC (RoHS 2)
Directive of the European Parliament and of the Council of 27
January 2003 (and revised on 8 June 2011) on the restriction of the
use of certain hazardous substances in electrical and electronic
equipment (RoHS)
REACH
REACH is a regulation of the European Union, adopted to improve
the protection of human health and the environment from the risks
that can be posed by chemicals, while enhancing the
competitiveness of the EU chemicals industry. It also promotes
alternative methods for the hazard assessment of substances in
order to reduce the number of tests on animals. REACH stands for
Registration, Evaluation, Authorisation and Restriction of Chemicals.
It entered into force on 1 June 2007
Standards of European type approval
Electromagnetic compatibility and Radio spectrum Matters
EN300328 V1.9.1
(ERM); Wideband transmission systems; Data transmission
EN300 328 V1.9.1: 2015
equipment operating in the 2.4GHz ISM band and using wide
band modulation techniques; Harmonized EN covering the
essential requirements of article 3.2 of R&TTE Directive.
EN301893 V1.8.1
Broadband Radio Access Networks (BRAN); 5GHz high
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EN301 893 V1.8.1: 2015
performance RLAN; Harmonized EN covering the essential
requirements of article 3.2 of the R&TTE Directive.
DFS
The advantage of 802.11a wireless market and the
EN301893 V1.8.1
constant push to open up spectrum for unlicensed use
EN301 893 V1.8.1: 2015
created a requirement for Dynamic Frequency Selection
(DFS), a mechanism to use the 5GHz frequency bands
already allocated to radar systems without causing
interference to those radars.
EN300 440-1 v1.6.1:2010
Electromagnetic compatibility and Radio spectrum Matters
EN300 440-2 v1.4.1:2010
(ERM); Short range devices; Radio equipment to be used in
the 1GHz to 40GHz frequency range
EN 301 489–1 v1.9.2 : 2011,
Electromagnetic compatibility and Radio spectrum Matters
EN 301 489–3 v1.6.1 : 2013
(ERM); ElectroMagnetic Compatibility (EMC) standard for
EN 301 489–17 v2.2.1 : 2012
radio equipment and services
EN 55022 : 2010+AC:2011
The modified derivative of CISPR 22 and applies to, as the
EN 61000-4-2 : 2009,
name implies, information technology equipment (ITE).
EN 61000-4-3 :
2006+A1:2008+A2:2010
EN 55022 : 2010+AC:2011
EN 55024 : 2010,
IEC 61000-4-2 : 2008
IEC 61000-4-3 :
2006+A1:2007+A2:2010
IEC 61000-4-8 : 2009
EN 62311: 2008
Assessment of electronic and electrical equipment
related to human exposure restrictions for
electromagnetic fields (0Hz -300GHz)
Standard of FCC Regulatory Approval
FCC 15C
Frequency hopping and digitally modulated system
RADIO FREQUENCY DEVICES -Unlicensed National
FCC15E
Information Infrastructure Devices
Compliance measurement procedures for unlicensed
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material information infrastructure device operating in the
DFS
5.25Ghz ~5.35GHz and 5.47GHz~5.725GHz Bands
incorporating dynamic frequency selection
Part 15B
Radio Frequency Devices
operations or devices comply with limits for human
OET65 (SAR)
exposure to radiofrequency (RF) fields adopted by the
Federal Communications
BQB Certificate:
BQB
complies with all the Bluetooth SIG requirements
WiFi Alliance:
WiFi Logo
WiFi Alliance approval
Note: SAR requirements specific to portable mobiles
This requires the Specific Absorption Rate (SAR) of portable Frey M1 applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers
are advised to submit their product for approval if designed for portable use. For European
markets the relevant directives are mentioned below. It is the responsibility of the
manufacturer of the final product to verify whether or not further standards,
recommendations or directives are in force outside these areas.
6.1. Safety Precautions
The following safety precautions must be observed during all phases of the operation,
usage, service or repair of any cellular terminal or mobile incorporating Frey M1
Manufacturers of the cellular terminal are advised to convey the following safety information
to users and operating personnel and to incorporate these guidelines into all manuals
supplied with the product. Failure to comply with these precautions violates safety
standards of design, manufacture and intended use of the product.
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When in a hospital or other health care facility, observe the restrictions on the
use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so
by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and
hearing aids can be affected by interference from cellular terminals or mobiles
placed close to the device. If in doubt about potential danger, contact the
physician or the manufacturer of the device to verify that the equipment is
properly shielded. Pacemaker patients are advised to keep their hand-held
mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure
it cannot be switched on inadvertently. The operation of wireless appliances in
an aircraft is forbidden to prevent interference with communications systems.
Failure to observe these instructions may lead to the suspension or denial of
cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol
stations, fuel depots, chemical plants or where blasting operations are in
progress. Operation of any electrical equipment in potentially explosive
atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy
while switched on. Remember that interference can occur if it is used close to
TV sets, radios, computers or inadequately shielded equipment. Follow any
special regulations and always switch off the cellular terminal or mobile
wherever forbidden, or when you suspect that it may cause interference or
danger.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all
conditions.
Therefore, you should never rely solely upon any wireless device for essential
communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services or
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phone features are in use (e.g. lock functions, fixed dialing etc.). You may need
to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
6.2. Safety
European Union notice
This device complies with the R&TTE Directive (1999/5/EC) issued by the Commission of
the European Community.
We declare under our sole responsibility that our product and in combination with our
accessories, to which this declaration relates is in conformity with the appropriate standards
EN 55022/24, EN 301 489-1-3-17, EN62311, EN 300 328, EN301 893, EN300 440
following the provisions of, radio equipment and telecommunication terminal equipment
directive 1999/5/EC.
Federal Communications Commission (FCC) Statements
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including any interference that may cause undesired
operation of the device.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide
reasonable protection
against harmful interference in a residential installation. This equipment generates, uses
and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
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FCC Warning:
The FCC requires that you be notified that any changes or modifications to this device not
expressly approved by the manufacturer could void the user’s authority to operate the
equipment.
RF Radiation Exposure Statement:
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with a minimum distance of
20 centimeters between the radiator and your body.
This Transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
Regulatory Module Integration Instructions
Only those antennas with same type and lesser gain filed under this FCC ID number can be
used with this device.
The final system integrator must ensure there is no instruction provided in the user manual
or customer documentation indicating how to install or remove the transmitter module.
Required end product labeling:
Any device incorporating this module must include an external, visible, permanent marking
or label which states: “Contains FCC ID: SPYIM0002”
The final host / module combination may also need to be evaluated against the FCC Part
15B criteria for unintentional radiators in order to be properly authorized for operation as a
Part 15 digital device.
If the final host / module combination is intended for use as a portable device (see
classifications below) the host manufacturer is responsible for separate approvals for the
SAR requirements from FCC Part 2.1093.
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Charpt 7. Appendix
7.1. Abbreviations
Abbreviation
Description
BGA
Ball Grid Array
BLR
Board Level Reliability
DCE
Data Communication Equipment
DTE
Data Terminal Equipment
ENIG
Electroless Nickel Immersion Gold
LGA
Land Grid Array
PCB
Printed Circuit Board
RF
Radio Frequency
SMD
Surface Mount Device
SMT
Surface Mount Technology
TC
Thermocouples
TP
Test Point
UART
Universal Asynchronous Receiver-Transmitter
7.2. Mounting Advice Sheet
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure
it is soldered flat against the host device. The advice sheet on the follow shows a number
of examples for the kind of bending that may lead to mechanical damage of the module
(the module as part of an external application is integrated into a housing).
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By pressing from above
By mounting under pressure
By putting object on top
By putting objects below
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Title                           : IT7000N user Menu
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Modify Date                     : 2016:07:18 13:42:00+08:00
Producer                        : Microsoft® Office Word 2007
EXIF Metadata provided by EXIF.tools
FCC ID Filing: SPYIM0002

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