2) The address range starts at the lowest address defined in the User’s Manual (See the Memory Maps chapter). 3) Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual). 4) Featuring flash firmware (µCode) version 23H Addendum 5 v1.10, 2021-04-15
AURIXTM TC27x variants Data Sheet Addendum TC277 / TC275 / TC270 AURIXTM 32-bit microcontroller Addendum v1.10, 2021-04-15 M i c r o c o n t r o ll e r s AURIXTM TC27x variants Data Sheet Addendum Table of Contents About this document .............................................................................................................................................. 3 1. Variants BC Step............................................................................................................................4 2. Variants CA Step............................................................................................................................5 3. Variants DB Step ........................................................................................................................... 6 4. Variants DC Step ........................................................................................................................... 7 Memory Maps of Variants ....................................................................................................................................... 8 Revision History .................................................................................................................................................... 11 Addendum 2 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum About this document Scope and purpose This document is an addendum to the TC27x data sheet listing all intended product variants, key parameters such as memory size, and optional features.. Naming Conventions Prefix SAK: Tambient Temperature Range from -40 °C up to +125 °C SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device) Feature Package T Standard type without HSM TP Standard type with HSM enabled TC customer specific feature set Addendum 3 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum 1. Variants BC Step Derivative SAK-TC277TP-64F200S BC Production Package Type Status Temp. Range Chip ID Freq. Flash (MHz) (MB) 1) EEPROM (KB) 2) Total SRAM (KB) Core 1&2 TC16P 1) DSPR PSPR (KB) (KB) Core 0 TC16E 1) DSPR PSPR (KB) (KB) LMU ADC FlexRay (KB) Chan. (#/ch.) ETH HSM CAN FD -40°C 4740 7153H on request PG-LFBGA-292 +125°C 4746 7153H 3) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes No 1) The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter). 2) Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual). 3) Featuring flash firmware (µCode) version 23H Addendum 4 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum 2. Variants CA Step Derivative Production Status 1) Package Type Temp. Range Chip ID Freq. PFlash (MHz) (MB) 2) EEPROM (KB) 3) Total Core 1&2 Core 0 LMU SRAM (KB) TC16P 2) TC16E (KB) 2) DSPR PSPR DSPR PSPR (KB) (KB) (KB) (KB) ADC FlexRay ETH HSM CAN FD CAN Chan. (#/ch.) FD ISO frame SAK-TC277TP-64F200S CA SAK-TC277TC-64F200S CA SAK-TC277T-64F200S CA SAK-TC275TP-64F200W CA SAK-TC275TC-64F200W CA SAK-TC275T-64F200W CA SAL-TC275T-64F200W CA SAL-TC275TP-64F200W CA SAL-TC277T-64F200S CA on request PG-LFBGA-292 on request PG-LFBGA-292 on request PG-LFBGA-292 on request PG-LQFP-176 on request PG-LQFP-176 on request PG-LQFP-176 on request PG-LQFP-176 on request PG-LQFP-176 on request PG-LFBGA-292 -40°C +125°C -40°C +125°C -40°C +125°C -40°C +125°C -40°C +125°C -40°C +125°C -40°C +150°C -40°C +150°C -40°C +150°C 4742 7160H 4746 7160H 4) 200 4742 7560H 4746 7560H 4) 200 0742 7160H 0746 7160H 4) 200 4742 7060H 4746 7060H 4) 200 4742 7460H 4746 7460H 4) 200 0742 7060H 0746 7060H 4) 200 0742 7060H 0746 7060H 4) 200 4742 7060H 4746 7060H 4) 200 0742 7160H 0746 7160H 4) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes Yes No 4 24 @ 500k 424 120 24 112 24 - 60 1 / 2 No Yes No No 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes No Yes No 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes Yes No 4 24 @ 500k 424 120 24 112 24 - 48 1 / 2 No Yes No No 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes No Yes No 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes No Yes No 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes Yes No 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes No Yes No 1) STANDARD = serial production planned. 2) The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter). 3) Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual). 4) Featuring flash firmware (µCode) version 23H Addendum 5 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum 3. Variants DB Step Derivative Production Status 1) Package Type Temp. Range Chip ID Freq. Flash (MHz) (MB) 2) EEPROM (KB) 3) Total SRAM (KB) Core 1&2 Core 0 LMU TC16P TC16E (KB) 2) 2) DSPR PSPR DSPR PSPR (KB) (KB) (KB) (KB) ADC FlexRay ETH HSM CAN FD CAN Chan. (#/ch.) FD ISO frame SAK-TC277TP-64F200S DB SAK-TC277T-64F200S DB SAK-TC277TC-64F200S DB SAK-TC275TP-64F200W DB SAK-TC275T-64F200W DB SAK-TC275TC-64F200W DB SAL-TC270TP-64F200 DB SAL-TC277TP-64F200S DB SAL-TC277T-64F200S DB SAL-TC275TP-64F200W DB SAL-TC275T-64F200W DB -40°C 4744 7171H on request PG-LFBGA-292 +125°C 4746 7171H 4) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes Yes No -40°C 0744 7171H on request PG-LFBGA-292 +125°C 0746 7171H 4) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes No Yes No -40°C 4744 7571 H on request PG-LFBGA-292 +125°C 4746 7571H 4) 200 4 24 @ 500k 424 120 24 112 24 - 60 1 / 2 No Yes No No -40°C 4744 7071 H on request PG-LQFP-176 +125°C 4746 7071H 4) 200 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes Yes No -40°C 4744 7071 H on request PG-LQFP-176 +125°C 4746 7071H 4) 200 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes No No -40°C 4744 7471 H on request PG-LQFP-176 +125°C 4746 7471H 4) 200 4 24 @ 500k 424 120 24 112 24 - 48 1 / 2 No Yes No No on request Bare Die -40°C 4744 7F71 +170°C H4746 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes Yes No -40°C 4)74F77414 7171H on request PG-LFBGA-292 +150°C 4746 7171H 4) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes Yes No -40°C 0744 7171H on request PG-LFBGA-292 +150°C 0746 7171H 4) 200 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes No Yes No -40°C 4744 7071 H on request PG-LQFP-176 +150°C 4746 7071H 4) 200 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes Yes No -40°C 4744 7071 H on request PG-LQFP-176 +150°C 4746 7071H 4) 200 4 64 @ 500k 472 120 32 112 24 32 48 1 / 2 Yes Yes No No 1) STANDARD = serial production planned. 2) The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter). 3) Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual). 4) Featuring flash firmware (µCode) version 23H Addendum 6 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum 4. Variants DC Step Derivative Production Package Type Status 1) Temp. Range Chip ID Freq. (MHz) Flash (MB) 2) EEPROM (KB) 3) Total Core 1&2 SRAM TC16P Core 0 TC16E LMU ADC FlexRay ETH HSM CAN FD CAN (KB) Chan. (#/ch.) FD (KB) 2) 2) DSPR PSPR DSPR PSPR ISO (KB) (KB) (KB) (KB) frame SAK-TC277TP-64F200N DC SAK-TC277TP-64F200S DC SAK-TC277TC-64F200N DC SAK-TC277TC-64F200S DC SAK-TC277T-64F200N DC SAK-TC277T-64F200S DC SAK-TC275TP-64F200N DC SAK-TC275TP-64F200W DC SAK-TC275T-64F200N DC SAK-TC275TC-64F200N DC SAK-TC275TC-64F200W DC SAK-TC275T-64F200W DC SAL-TC277TP-64F200N DC SAL-TC277T-64F200S DC SAL-TC275TP-64F200N DC SAL-TC275TP-64F200W DC SAL-TC270TP-64F200N DC STANDARD PG-LFBGA-292 -40°C +125°C 4746 7172H 200 STANDARD PG-LFBGA-292 -40°C +125°C 4746 7172H 200 on request PG-LFBGA-292 -40°C +125°C 4746 7572H 200 on request PG-LFBGA-292 -40°C +125°C 4746 7572H 200 on request PG-LFBGA-292 -40°C +125°C 0746 7172H 200 on request PG-LFBGA-292 -40°C +125°C 0746 7172H 200 STANDARD PG-LQFP-176 -40°C +125°C 4746 7072H 200 on request PG-LQFP-176 -40°C +125°C 4746 7072H 200 on request PG-LQFP-176 -40°C +125°C 0746 7072H 200 on request PG-LQFP-176 -40°C +125°C 4746 7472H 200 on request PG-LQFP-176 -40°C +125°C 4746 7472H 200 on request PG-LQFP-176 -40°C +125°C 0746 7072H 200 on request PG-LFBGA-292 -40°C +150°C 4746 7172H 200 on request PG-LFBGA-292 -40°C +150°C 0746 7172H 200 on request PG-LQFP-176 -40°C +150°C 4746 7072H 200 on request PG-LQFP-176 -40°C +150°C 4746 7072H 200 on request Bare Die -40°C +170°C 4746 7F72H 200 4 64 @ 500k 472 120 32 112 24 32 60 4 64 @ 500k 472 120 32 112 24 32 60 4 24 @ 500k 424 120 24 112 24 - 60 4 24 @ 500k 424 120 24 112 24 - 60 4 64 @ 500k 472 120 32 112 24 32 60 4 64 @ 500k 472 120 32 112 24 32 60 4 64 @ 500k 472 120 32 112 24 32 48 4 64 @ 500k 472 120 32 112 24 32 48 4 64 @ 500k 472 120 32 112 24 32 48 4 24 @ 500k 424 120 24 112 24 - 48 4 24 @ 500k 424 120 24 112 24 - 48 4 64 @ 500k 472 120 32 112 24 32 48 4 64 @ 500k 472 120 32 112 24 32 60 4 64 @ 500k 472 120 32 112 24 32 60 4 64 @ 500k 472 120 32 112 24 32 48 4 64 @ 500k 472 120 32 112 24 32 48 4 64 @ 500k 472 120 32 112 24 32 60 1 / 2 Yes Yes Yes Yes 1 / 2 Yes Yes Yes No 1 / 2 No Yes Yes Yes 1 / 2 No Yes No No 1 / 2 Yes No Yes Yes 1 / 2 Yes No Yes No 1 / 2 Yes Yes Yes Yes 1 / 2 Yes Yes Yes No 1 / 2 Yes No Yes Yes 1 / 2 No Yes Yes Yes 1 / 2 No Yes No No 1 / 2 Yes No Yes No 1 / 2 Yes Yes Yes Yes 1 / 2 Yes No Yes No 1 / 2 Yes Yes Yes Yes 1 / 2 Yes Yes Yes No 1 / 2 Yes Yes Yes Yes 1) STANDARD = serial production planned. 2) The address range starts at the lowest address defined in the User's Manual (See Memory Maps chapter). 3) Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual). Addendum 7 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum Memory Maps of Variants This section shows the influence of above feature variants on the memory map. DF_EEPROM Variants: Exemplary EEPROM size: 384 KB 64 KB @ 500k AF00 0000H Logical Sector EEPROM0 EEPROM1 EEPROM2 Size Offset Address 8 KB 00 0000H 8 KB 00 2000H 8 KB 00 4000H ... ... ... AF06 0000H EEPROM47 8 KB 05 E000H 144 KB 24 KB @ 500k AF00 0000H AF02 4000H Logical Sector Size EEPROM0 8 KB EEPROM1 8 KB EEPROM2 8 KB ... ... EEPROM17 8 KB Reserved Offset Address 00 0000H 00 2000H 00 4000H ... 02 2000H AF06 0000H Core1/2 PSPR Variants: 32 KB 24 KB 5010 0000H 5010 0000H CPU2.PSPR (32 KB) CPU2.PSPR (24 KB) 5010 8000H 5010 6000H 5010 8000H Reserved 6010 0000H 6010 0000H CPU1.PSPR (32 KB) CPU1.PSPR (24 KB) 6010 8000H 6010 6000H 6010 8000H Reserved Addendum 8 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum LMU Variants: 9000 0000H 32 KB 0 KB 9000 0000H LMURAM (32 KB) Reserved 9000 8000H B000 0000H 9000 8000H B000 0000H LMURAM (32 KB) Reserved B000 8000H B000 8000H ETH Variants: Yes No F001 D000H F001 D000H ETH Control Register (256 B) F001 D100H F001 E000H Reserved ETH (8 KB) Reserved F002 0000H F002 0000H Addendum 9 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum HSM Variants: Yes AF11 0000H DF_HSM (DF1) (64 KB) No AF11 0000H Reserved AF12 0000H F004 0000H AF12 0000H F004 0000H HSM (128 KB) Reserved F006 0000H FF11 0000H DF_HSM (DF1) (64 KB) F006 0000H FF11 0000H Reserved FF12 0000H FF12 0000H CAN FD Variants: No influence on Memory Map. CAN FD = "No" variants: all CAN register fields NCRx.FDEN have to be kept 0B. Addendum 10 v1.10, 2021-04-15 AURIXTM TC27x variants Data Sheet Addendum Revision History Major changes since the last revision Page or Reference Description of change V1.1 5, 6 Chip IDs for CA & DC steps corrected Bugs in HSM (Y/N) and CAN FD (Y/N) corrected V1.2 Memory maps added CAN FD DIS2015 markings added µCode 23H ChipIDs added V1.3 V1.4 V1.5 V1.6 V1.7 V1.8 V1.9 V1.10 Memory maps corrections CAN FD Chip ID added Variant cleanup on older steps New CAN FD marking options added Navigation pane added to improve Ease of Use Alignment with Safety Documentation Corrections to the CA step table Package information updated Chip ID for SAK-TC277T-64F200S DB and SAL-TC277T-64F200S DB corrected Addendum 11 v1.10, 2021-04-15 Trademarks of Infineon Technologies AG AURIXTM, C166TM, CanPAKTM, CIPOSTM, CIPURSETM, CoolGaNTM, CoolMOSTM, CoolSETTM, CoolSiCTM, CORECONTROLTM, CROSSAVETM, DAVETM, DI-POLTM, DrBLADETM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPACKTM, EconoPIMTM, EiceDRIVERTM, eupecTM, FCOSTM, HITFETTM, HybridPACKTM, ISOFACETM, IsoPACKTM, iWaferTM, MIPAQTM, ModSTACKTM, my-dTM, NovalithICTM, OmniTuneTM, OPTIGATM, OptiMOSTM, ORIGATM, POWERCODETM, PRIMARIONTM, PrimePACKTM, PrimeSTACKTM, PROFETTM, PRO-SILTM, RASICTM, REAL3TM, ReverSaveTM, SatRICTM, SIEGETTM, SIPMOSTM, SmartLEWISTM, SOLID FLASHTM, SPOCTM, TEMPFETTM, thinQ!TM, TRENCHSTOPTM, TriCoreTM. Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM, ARMTM, MULTI-ICETM, KEILTM, PRIMECELLTM, REALVIEWTM, THUMBTM, µVisionTM of ARM Limited, UK. ANSITM of American National Standards Institute. AUTOSARTM of AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. HYPERTERMINALTM of Hilgraeve Incorporated. MCSTM of Intel Corp. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM of Openwave Systems Inc. RED HATTM of Red Hat, Inc. RFMDTM of RF Micro Devices, Inc. SIRIUSTM of Sirius Satellite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex. Last Trademarks Update 2014-07-17 www.infineon.com Edition 2021-04-15 Published by Infineon Technologies AG 81726 Munich, Germany © 2019 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? 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