u blox 05 BMD-350 User Manual BMD 300 Series Datasheet
Rigado LLC BMD-350 BMD 300 Series Datasheet
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Users manual
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| Document ID | 3177148 |
| Application ID | rMlAQo/7/9gVSrYtGAcnWw== |
| Document Description | Users manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 206.39kB (2579876 bits) |
| Date Submitted | 2016-10-27 00:00:00 |
| Date Available | 2016-10-27 00:00:00 |
| Creation Date | 2016-10-20 16:50:28 |
| Producing Software | Microsoft® Word 2016 |
| Document Lastmod | 2016-10-20 16:50:28 |
| Document Title | BMD-300 Series Datasheet |
| Document Creator | Microsoft® Word 2016 |
| Document Author: | Rigado, LLC |
Rigado LLC 3950 Fairview Industrial Dr. Salem, Oregon 97302 866-6-RIGADO modules@rigado.com www.rigado.com/modules BMD-300 Series Module for Bluetooth 4.2 LE The BMD-300 Series from Rigado is a line of powerful, highly flexible, ultra-low power Bluetooth Smart modules based on the nRF52832 SoC from Nordic Semiconductor. With an ARM® Cortex™ M4F CPU, embedded 2.4GHz transceiver, and integrated antenna, they provide a complete RF solution with no additional RF design, allowing faster time to market. Providing full use of the nRF52832’s capabilities and peripherals, the BMD-300 Series can power the most demanding applications, all while simplifying designs and reducing BOM costs. With an internal DC-DC converter and intelligent power control, the BMD-300 Series provide class-leading power efficiency, enabling ultra-low power sensitive applications. Regulatory pre-approvals reduce the burden to enter the market, and the included BMD Software Suite provides access to great features like a secure BLE & UART bootloader, iOS & Android Bluetooth libraries, and more. Available in three variants: internal antenna (BMD-300), U.FL connector (BMD301), and ultra-miniature (BMD-350). 1. Features Based on the Nordic nRF52832 SoC Complete RF solution with integrated antenna (BMD-300 & BMD-350) or U.FL connector (BMD301) Integrated DC-DC converter No external components required ARM® Cortex™-M4F 32-bit processor Serial Wire Debug (SWD) Nordic SoftDevice ready Over-the-Air (OTA) firmware updates 512kB embedded flash memory 64kB RAM 32 General Purpose I/O Pins 12-bit/200KSPS ADC -40C to +85 Temperature Range BMD Software Suite included FCC: 2AA9B04 (BMD-300/BMD-301) 2AA9B05 (BMD-350) Three SPI Master/Slave (8 Mbps) Low power comparator Temperature sensor Random Number Generator Two 2-wire Master/Slave (I2C compatible) I2S audio interface UART (w/ CTS/RTS and DMA) 20 channel CPU independent Programmable Peripheral Interconnect (PPI) Quadrature Demodulator (QDEC) 128-bit AES HW encryption 5 x 32bit, 3 x 24bit Real Timer Counters (RTC) NFC-A tag interface for OOB pairing BMD-300/301 Dimensions: 14 x 9.8 x 1.9mm BMD-350 Dimensions: 8.7 x 6.4 x 1.5mm IC: 12208A-04 (BMD-300/BMD-301) 12208A-05 (BMD-350) Japan: 210-106799 (BMD-300) 210-107153 (BMD-301) 2. Applications App-cessories Beacons – iBeacon™, AltBeacon, Eddystone, etc. Low-Power Sensors Lighting Products Fitness devices Wearables BMD-300-Series-DS V1.7 Page 1 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 3. Ordering Information Email modules@rigado.com for quotes and ordering or visit www.rigado.com/BMD-300 Part Number BMD-300-A-CT BMD-300-A-R BMD-301-A-CT BMD-301-A-R BMD-350-A-CT BMD-350-A-R BMD-300-EVAL-S BMD-301-EVAL-S Description BMD-300 module, Rev A, Cut Tape BMD-300 module, Rev A, Tape & Reel, 1000 piece multiples BMD-301 module, Rev A, Cut Tape BMD-301 module, Rev A, Tape & Reel, 1000 piece multiples BMD-350 module, Rev A, Cut Tape BMD-350 module, Rev A, Tape & Reel, 1000 piece multiples BMD-300 Evaluation Kit with Segger J-Link programmer BMD-301 Evaluation Kit with Segger J-Link programmer w/antennas Table 1 – Ordering Part Numbers 4. Block Diagram BMD-300 Series Modules nRF52832 64 kB RAM SWD Debug & Programming Core LDO DC/DC Buck Regulator Accel Address Resolver ARM Cortex-M4F @ 64MHz 2.4GHz Radio Multi-protocol AES ECB Balun 512kB Flash Matching Network AES CCM Mode Encryption Clock Management Real Time Counter x3 Watchdog Timer Timer x5 Random Number Gen Programmable Peripheral Interconnect Temperature Sensor GPIO Task Event Blocks Low Power Comparator TWI Master x2 SPI Master x3 UART I2S Quadrature Decoder General Purpose Comparator TWI Slave x2 SPI Slave X3 PWM PDM NFC Tag 8-ch 12-bit ADC DC-DC Inductor Bulk Capacitors Decoupling Capacitors GPIO x32 (Analog x8) Antenna / U.FL 32 MHz Crystal Figure 1 – Block Diagram BMD-300-Series-DS V1.7 Page 2 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Table of Contents 1. FEATURES...............................................................................................................................................................................1 2. APPLICATIONS ........................................................................................................................................................................1 3. ORDERING INFORMATION......................................................................................................................................................2 4. BLOCK DIAGRAM ....................................................................................................................................................................2 5. QUICK SPECIFICATIONS ..........................................................................................................................................................5 6. PIN DESCRIPTIONS .................................................................................................................................................................6 6.1 BMD-300 / BMD-301..................................................................................................................................................................... 6 6.2 BMD-350 ....................................................................................................................................................................................... 7 6.3 RIGDFU PIN FUNCTIONS ..................................................................................................................................................................... 9 6.4 BMDWARE PIN FUNCTIONS ................................................................................................................................................................. 9 7. ELECTRICAL SPECIFICATIONS ................................................................................................................................................ 10 7.1 ABSOLUTE MAXIMUM RATINGS........................................................................................................................................................... 10 7.2 OPERATING CONDITIONS ................................................................................................................................................................... 10 7.3 GENERAL PURPOSE I/O ..................................................................................................................................................................... 10 7.4 MODULE RESET ............................................................................................................................................................................. 10 7.5 DEBUG & PROGRAMMING ................................................................................................................................................................. 11 7.6 CLOCKS .......................................................................................................................................................................................... 11 8. FIRMWARE ........................................................................................................................................................................... 13 8.1 FACTORY IMAGE .............................................................................................................................................................................. 13 8.1.1 Firmware Version ‘AA’ .............................................................................................................................................................. 13 8.1.2 Firmware Version ‘AB’ .............................................................................................................................................................. 13 8.1.3 Module Programming and Read-Back Protection .................................................................................................................... 13 8.2 SOFTDEVICES .................................................................................................................................................................................. 14 8.2.1 S132 .......................................................................................................................................................................................... 14 8.2.2 S212 .......................................................................................................................................................................................... 14 8.2.3 S332 .......................................................................................................................................................................................... 15 8.3 MAC ADDRESS INFO ........................................................................................................................................................................ 15 9. MECHANICAL DATA .............................................................................................................................................................. 16 9.1 MECHANICAL DIMENSIONS ................................................................................................................................................................. 16 9.1.1 BMD-300 Dimensions ............................................................................................................................................................... 16 9.1.2 BMD-301 Dimensions ............................................................................................................................................................... 16 9.1.3 BMD-350 Dimensions ............................................................................................................................................................... 17 9.2 RECOMMENDED PCB LAND PADS ........................................................................................................................................................ 17 9.2.1 BMD-300/301 ........................................................................................................................................................................... 17 9.2.2 BMD-350 ................................................................................................................................................................................... 18 10. MODULE MARKING .............................................................................................................................................................. 18 10.1 BMD-300 MODULE MARKING .......................................................................................................................................................... 18 10.2 BMD-301 MODULE MARKING .......................................................................................................................................................... 19 10.3 BMD-350 MODULE MARKING .......................................................................................................................................................... 19 11. RF DESIGN NOTES ................................................................................................................................................................. 20 11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ..................................................................................................................................... 20 11.1.1 BMD-300 ................................................................................................................................................................................... 20 11.1.2 BMD-301 ................................................................................................................................................................................... 20 11.1.3 BMD-350 ................................................................................................................................................................................... 20 11.2 MECHANICAL ENCLOSURE .................................................................................................................................................................. 21 11.3 ANTENNA PATTERNS ......................................................................................................................................................................... 22 11.3.1 BMD-300 ................................................................................................................................................................................... 22 11.3.2 BMD-350 ................................................................................................................................................................................... 24 12. EVALUATION BOARDS .......................................................................................................................................................... 25 13. CUSTOM DEVELOPMENT ...................................................................................................................................................... 25 14. BLUETOOTH QUALIFICATION ................................................................................................................................................ 26 15. REGULATORY STATEMENTS .................................................................................................................................................. 26 15.1 FCC STATEMENT: ............................................................................................................................................................................ 26 15.2 FCC IMPORTANT NOTES: ................................................................................................................................................................... 30 15.3 IC STATEMENT: ............................................................................................................................................................................... 28 15.4 IC IMPORTANT NOTES: ...................................................................................................................................................................... 28 15.5 CE REGULATORY: ............................................................................................................................................................................. 29 15.6 JAPAN (MIC) .................................................................................................................................................................................. 29 15.7 AUSTRALIA / NEW ZEALAND ............................................................................................................................................................... 30 15.8 APPROVED EXTERNAL ANTENNAS......................................................................................................................................................... 30 16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 31 BMD-300-Series-DS V1.7 Page 3 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 16.1 MOISTURE SENSITIVITY LEVEL ............................................................................................................................................................. 31 17. PACKAGING AND LABELING.................................................................................................................................................. 31 17.1 CARRIER TAPE DIMENSIONS ................................................................................................................................................................ 31 17.1.1 BMD-300 & BMD-301 ............................................................................................................................................................... 31 17.1.2 BMD-350 ................................................................................................................................................................................... 32 17.2 REEL PACKAGING ............................................................................................................................................................................. 32 17.3 PACKAGING LABEL ............................................................................................................................................................................ 33 18. CAUTIONS ............................................................................................................................................................................ 33 19. LIFE SUPPORT POLICY ........................................................................................................................................................... 33 20. DOCUMENT HISTORY ........................................................................................................................................................... 34 21. RELATED DOCUMENTS ......................................................................................................................................................... 34 BMD-300-Series-DS V1.7 Page 4 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 5. Quick Specifications Bluetooth Version 4.2 (Bluetooth Smart) Concurrent Central & Peripheral (S132) Security AES-128 LE connections Up to 8 as Central, 1 as Peripheral, Observer, Broadcaster (S132) Radio Frequency 2.360GHz to 2.500GHz Modulations GFSK at 1 Mbps, 2 Mbps data rates Transmit power +4 dBm Receiver sensitivity -96 dBm (BLE mode) Antenna Integrated Current Consumption TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled TX only @ +4 dBm, 0 dBm RX only @ 1 Mbps @ 3V, DCDC enabled RX only @ 1 Mbps CPU @ 64MHz from flash, from RAM CPU @ 64MHz from flash, from RAM @ 3V, DCDC System Off, On Additional current for RAM retention 7.5 mA, 5.3 mA 16.6 mA, 11.6 mA 5.4 mA 11.7 mA 7.4 mA, 6.7 mA 3.7 mA, 3.3 mA 0.3 µA, 1.2 µA 30 nA / 4KB block Dimensions BMD-300 BMD-301 BMD-350 Length Width Height Length Width Height 14.0 mm ± 0.3mm 9.8 mm ± 0.3mm 1.9 mm ± 0.1mm 8.7 mm ± 0.2mm 6.4 mm ± 0.2mm 1.5 mm ± 0.1mm Hardware Interfaces SPI Master/Slave x 3 UART Two-Wire Master/Slave (I2C) x 2 GPIO x 32 Power supply 1.7V to 3.6V Temperature Range -40 to +85°C I2S PWM PDM Certifications Australia / New Zealand FCC part 15 modular certification BMD-300/BMD-301 FCC ID: 2AA9B04 BMD-350 FCC ID: 2AA9B05 Industry Canada RSS-210 modular certification BMD-300/BMD-301 IC: 12208A-04 BMD-350 IC: 12208A-05 EN 60950-1: 2011-01 3.1 (a): Health and Safety of the User (pending) EN 301 489-1 V1.9.2 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V2.2.1 EN 300 328 V1.9.1 3.2: Effective use of spectrum allocated Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan BMD-300: 210-106799 BMD-301: 210-107153 AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices Bluetooth RF-PHY Component (Tested) – DID: D030629; QDID: 81876 FCC IC CE Japan (MIC) Table 2 – Quick Specifications BMD-300-Series-DS V1.7 Page 5 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 6. Pin Descriptions 6.1 BMD-300 / BMD-301 Figure 2 – BMD-300/301 Pin out (Top View) Pin 10 11 12 13 14 15 19 20 21 22 23 24 25 26 27 28 31 32 33 BMD-300-Series-DS V1.7 Name P0.25 P0.26 P0.27 P0.28 P0.29 P0.30 P0.31 P0.00 P0.01 P0.02 P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 Pin description Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out Description GPIO2 GPIO2 GPIO2 GPIO/AIN42 GPIO/AIN52 GPIO/AIN62 GPIO/AIN72 GPIO/XTAL1 (32.768kHz) GPIO/XTAL2 (32.768kHz) GPIO/AIN0 GPIO/AIN1 GPIO/AIN2 GPIO/AIN3 GPIO GPIO GPIO GPIO/NFC1 GPIO/NFC2 GPIO GPIO GPIO GPIO/TRACEDATA[3] GPIO/TRACEDATA[2] Page 6 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Pin 34 35 36 37 38 39 40 41 42 43 44 17 1, 2, 3, 4, 5, 16, 18, 29, 30, 45, 46, 47 Name P0.16 P0.17 P0.18 P0.19 P0.20 P0.21 P0.22 P0.23 P0.24 SWCLK SWDIO VCC Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In In/Out Power Description GPIO/TRACEDATA[1] GPIO GPIO/TRACEDATA[0]/SWO GPIO GPIO/TRACECLK ̅̅̅̅̅̅̅̅ GPIO/RESET GPIO GPIO2 GPIO2 SWD Clock SWD IO +1.7V to +3.6V1 GND Power Electrical Ground Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw. Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using only low frequency, low-drive functions when possible. Table 3 – BMD-300/301 Pin Descriptions 6.2 BMD-350 Figure 3 – BMD-350 Pin out (Top View) Pin BMD-300-Series-DS V1.7 Name SWCLK SWDIO P0.20 P0.21 Pin description Direction In In/Out In/Out In/Out Description SWD Clock SWD IO GPIO/TRACECLK ̅̅̅̅̅̅̅̅ GPIO/RESET Page 7 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Pin 10 11 12 13 14 16 17 18 19 20 21 22 23 24 27 28 29 30 31 32 33 34 35 36 41 42 44 45 25 1, 2, 3, 15, 26, 37, 38, 39, 40, 43, 46, 47 Name P0.18 P0.16 P0.17 P0.15 P0.13 P0.12 P0.14 P0.09 P0.10 P0.11 P0.06 P0.08 P0.05 P0.07 P0.01 P0.00 P0.04 P0.02 P0.30 P0.31 P0.29 P0.27 P0.25 P0.26 P0.23 P0.24 P0.22 P0.19 P0.03 P0.28 VCC Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out Power Description GPIO/TRACEDATA[0]/SWO GPIO/TRACEDATA[1] GPIO GPIO/TRACEDATA[2] GPIO GPIO GPIO/TRACEDATA[3] GPIO/NFC1 GPIO/NFC2 GPIO GPIO GPIO GPIO/AIN3 GPIO GPIO/XTAL2 (32.768kHz) GPIO/XTAL1 (32.768kHz) GPIO/AIN2 GPIO/AIN0 GPIO/AIN62 GPIO/AIN72 GPIO/AIN52 GPIO2 GPIO2 GPIO2 GPIO2 GPIO2 GPIO2 GPIO GPIO/AIN1 GPIO/AIN42 +1.7V to +3.6V1 GND Power Electrical Ground Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw. Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using only low frequency, low-drive functions when possible. Table 4 – BMD-350 Pin Descriptions BMD-300-Series-DS V1.7 Page 8 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 6.3 RigDFU Pin Functions Rigado RigDFU is programmed on the BMD-300 Series at the factory. Two GPIO pins are configured as UART pins for transferring new firmware images to the BMD-300. Pins are configured only when bootloader is running, and are fully available to the application firmware. RigDFU can be removed from the BMD-300 by performing a fullchip erase. BMD-300/1 Pin BMD-350 Name Pin Direction RigDFU Functions 22 19 P0.06 Out UART TX for bootloader 24 20 P0.08 In UART RX for bootloader Hi-Z until bootloader activation message received on UART RX. Internal 12kΩ pull-down enabled Table 5 – RigDFU Functions 6.4 BMDware Pin Functions Rigado BMDware is programmed on the BMD-300 Series at the factory. BMDware provides UART-to-BLE Bridge, beaconing, and Direct Test Mode (DTM) functionality. The pins in Table 6 below describe the pin functionality in BMDware. DTM Mode, Beacon-Only Mode, and AT Command Mode pin states are checked at BMDware start-up to configure BMDware as required by the user, and are then set to Hi-Z to conserve power. For further details on BMDware operation, please see the BMDware Datasheet that can be found at www.rigado.com. BMDware can be overwritten by RigDFU with custom application firmware, or removed along with RigDFU by a full chip erase. BMD-300/1 Pin BMD-350 Name Pin Direction 21 21 P0.05 Out 22 19 P0.06 Out 23 22 P0.07 In 24 20 P0.08 In 27 18 P0.11 Out BMDware Functions Bridge UART RTS Disabled in Beacon-Only & DTM modes, N/C if not used. Bridge UART TX Disabled in Beacon-Only & DTM modes, N/C if not used. Bridge UART CTS Disabled in Beacon-Only & DTM modes, N/C if not used. Bridge UART RX Disabled in Beacon-Only & DTM modes, N/C if not used. DTM UART TX Only enabled in DTM mode; N/C if not used. DTM UART RX / DTM Mode 28 13 P0.12 In Only enabled in DTM mode; N/C if not used. On BMDware Start-up: High = Enter DTM mode; Low = Enter Normal Operation Internal 12kΩ pull-down during BMDware start-up, then Hi-Z Beacon Only Mode 31 12 P0.13 In On BMDware Start-up: High = Bridge UART enabled; Low = Bridge UART disabled Internal 12kΩ pull-up during BMDware start-up, then Hi-Z 32 14 P0.14 In UART AT Command Mode On BMDware Start-up: High = Full pass-through mode; Low = AT command mode Internal 12kΩ pull-up during BMDware start-up, then Hi-Z Table 6 – BMDware Functions at Start-up BMD-300-Series-DS V1.7 Page 9 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 7. Electrical Specifications 7.1 Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3V Storage Temperature Range -40 125 °C TS Table 7 – Absolute Maximum Ratings 7.2 Operating Conditions Symbol VCC TR_VCC TA Parameter Operating supply voltage Supply rise time (0V to 1.7V) Operating Ambient Temperature Range Min. Typ. Max. Unit 1.7 3.0 3.6 60 ms -40 25 85 °C Table 8 – Operating Conditions 7.3 General Purpose I/O The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features: Input/output direction Output drive strength Internal pull-up and pull-down resistors Wake-up from high or low level triggers on all pins Trigger interrupt on all pins All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Min. Typ. Max. Unit VIH Input High Voltage 0.7 x VCC VCC VIL Input Low Voltage VSS 0.3 x VCC VOH Output High Voltage VCC − 0.4 VCC VOL Output Low Voltage VSS VSS + 0.4 RPU Pull-up Resistance 11 13 16 kΩ RPD Pull-down Resistance 11 13 16 kΩ Table 9 – GPIO 7.4 Module RESET GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and ̅̅̅̅̅̅̅̅, the internal pull-up is automatically PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as RESET ̅̅̅̅̅̅̅̅. enabled. Rigado and Nordic example applications and development kits program P0.21 as RESET BMD-300-Series-DS V1.7 Page 10 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 7.5 Debug & Programming The BMD-300 Series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. The BMD-300 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports serial trace via the Serial Wire Output (SWO) trace protocol. 7.6 Clocks The BMD-300 Series requires two clocks, a high frequency clock and a low frequency clock. The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the nRF52832 for radio operation. The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest accuracy. Using the internal RC oscillator with calibration provides acceptable performance for BLE applications at a reduced cost and slight increase in power consumption. Note: the ANT protocol requires the use of an external crystal. 32.768 kHz Crystal (LFXO) Symbol Typ. Max. Unit 32.768 kHz Frequency tolerance, BLE applications ±250 ppm CL_LFXO Load Capacitance 12.5 pF C0_LFXO Shunt Capacitance pF RS_LFXO Equivalent series resistance 100 kΩ Input Capacitance on XL1 & XL2 pads pF FNOM_LFXO FTOL_LFXO_BLE Cpin Parameter Crystal frequency Table 10 – 32.768 kHz Crystal BMD-300-Series-DS V1.7 Page 11 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 32.768 kHz Oscillator Comparison Symbol Parameter Min. Typ. Max. Unit ILFXO Current for 32.768kHz Crystal Oscillator 0.25 µA ILFRC Current for 32.768kHz RC Oscillator 0.6 µA ILFSYNT Current for 32.768kHz Synthesized Oscillator Frequency Tolerance, 32.768kHz Crystal Oscillator (BLE Stack)1 Frequency Tolerance, 32.768kHz Crystal Oscillator (ANT Stack)1 Frequency Tolerance, 32.768kHz RC Oscillator 100 µA ±250 ppm ±50 ppm ±2 Frequency tolerance, 32.768kHz RC after calibration Frequency Tolerance, 32.768kHz Synthesized Oscillator ±250 ppm ±48 ppm fTOL_LFXO_BLE fTOL_LFXO_ANT f TOL_LFRC fTOL_CAL_LFRC fTOL_LFSYNT Note 1: fTOL_LFXO_BLE and fTOL_LFXO_ANT are the max allowed for BLE and ANT applications. Actual tolerance depends on the crystal used. Table 11 – 32.768 kHz Oscillator BMD-300-Series-DS V1.7 Page 12 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 8. Firmware 8.1 Factory Image All modules are shipped with factory programmed firmware. The factory programmed firmware version is indicated on the label. 8.1.1 Firmware Version ‘AA’ Factory firmware version ‘AA’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.0 (42), Nordic S132 SoftDevice v2.0.0, and Rigado BMDware v3.1.0 (50). Modules can be programmed with customer code via BLE and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA updates. Visit the BMD Software Suite page at www.rigado.com for more information. Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC Address Info” on how to retain it. 8.1.2 Firmware Version ‘AB’ Factory firmware version ‘AB’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.1 (43), Nordic S132 SoftDevice v2.0.0, and Rigado BMDware v3.1.1 (51). Modules can be programmed with customer code via BLE and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA updates. Visit the BMD Software Suite page at www.rigado.com for more information. Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC Address Info” on how to retain it. 8.1.3 Module Programming and Read-Back Protection RigDFU allows for UART and OTA updates to RigDFU, the SoftDevice and application firmware. Read-back protection of the BMD-300 Series modules is enabled which prevents unauthorized access to the firmware and optional encryption keys through the SWD debug port. If the SWD port is required, for example when developing custom firmware, the nRF52 must be erased and recovered. This is accomplished with the Rigado BMD-300 Eraser and Recovery Utility at www.rigado.com, or with nrfjprog, which is provided with the Nordic Semiconductor command line utilities: nrfjprog -f NRF52 ––recover A full chip erase is performed, so all components will need re-loaded (RigDFU Bootloader, SoftDevice and application Firmware). The rigado/bootloader-tools repository on GitHub contains the utilities to load these items. Procedures are described in the RigDFU Datasheet at www.rigado.com for programming, firmware preparation, and update procedures. The BMD-300 Series modules may also be restored to the factory firmware versions noted above with the utilities available at the rigado/programming repository on GitHub. Access to the Rigado BMD Software Suite may be requested on the Rigado Website. BMD-300-Series-DS V1.7 Page 13 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 8.2 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic website. The BMD-300 with the nRF52832 SoC supports the S132 (BLE Central & Peripheral), S212 (ANT) and S312 (ANT and BLE) SoftDevices. 8.2.1 S132 The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution supporting up to three Central and one Peripheral simultaneous connections and concurrent Observer and Broadcaster roles. It integrates a low energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy System on Chip (SoC) solutions. Key Features Bluetooth 4.2 compliant low energy single-mode protocol stack suitable for Bluetooth Smart products Memory isolation between application and protocol stack for robustness and security Concurrent Central, Observer, Peripheral, and Broadcaster roles with up to: Thread-safe supervisor-call based API Asynchronous, event-driven behavior No RTOS dependency Three connections as a central One connection as a peripheral Observer Broadcaster Link layer L2CAP, ATT, and SM protocols GATT and GAP APIs GATT Client and Server Complementary nRF52 SDK including Bluetooth profiles and example applications Master Boot Record for over-the-air device firmware update No link-time dependencies Standard ARM® CortexTMM4F project configuration for application development Support for concurrent and non-concurrent multiprotocol operation Any RTOS can be used Concurrent with the Bluetooth stack using concurrent multiprotocol timeslot API Alternate protocol stack in application space 8.2.2 S212 The S212 SoftDevice is an ANT protocol stack solution that provides a full and flexible Application Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip. The S212 SoftDevice simplifies combining the ANT protocol stack and an application on the same CPU. Key Features Advanced ANT stack Simple to complex network topologies: o Peer-to-peer, Star, Tree, Star-to-star and more Up to 15 logical channels, each with configurable: o Channel type, ID and period o RF frequency o Networks Broadcast, Acknowledged, and Burst Data modes Device search, pairing and proximity support Enhanced ANT features: BMD-300-Series-DS V1.7 Advanced Burst Transfer mode (up to 60 kbps) Up to 15 channels encryption (AES-128) support Additional networks – up to 8 Event Filtering and Selective Data Updates Asynchronous Transmission Fast Channel Initiation Page 14 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 SoftDevice features Built-in NVM access and radio coexistence management Master Boot Record for over-the air device firmware update Memory isolation between application and protocol stack for robustness and security Thread-safe supervisor-call based API Asynchronous, event-driven behavior No RTOS dependency Any RTOS can be used No link-time dependencies Standard ARM® Cortex™ -M4F project configuration for application development Support for concurrent and non-concurrent multiprotocol operation Concurrent multiprotocol timeslot API Alternate protocol stack running in application space 8.2.3 S332 The S332 SoftDevice is a combined ANT™ and Bluetooth® low energy (BLE) protocol stack solution. It supports all four Bluetooth low energy roles (central, peripheral, observer, broadcaster) and ANT. The S332 SoftDevice provides a full and flexible Application Programming Interface (API) for building concurrent ANT and BLE System on Chip (SoC) solutions. It simplifies combining an ANT and BLE protocol stack and an application on the same CPU, therefore eliminating the need for an added device to support concurrent multiprotocol. 8.3 MAC Address Info The BMD-300 Series modules comes preprogrammed with a unique MAC address from the factory. The MAC address is also printed on a 2D barcode on the top of the module. Figure 4 – BMD-300/301 MAC Address on Label Figure 5 – BMD-350 MAC Address on Label The 6-byte BLE Radio MAC address is stored in the nRF52832 UICR at NRF_UICR_BASE+0x80 LSB first. Please read the MAC Address Provisioning application note if you are not using the built in bootloader to avoid erasing/overwriting the MAC address during programming. Important: The BMD-300 comes with full memory protection enabled, not allowing the UICR to be read via the SWD interface. If performing a full-erase, the MAC can then only be recovered from the 2D barcode and human-readable text. UICR Register: NRF_UICR + 0x80 (0x10001080): MAC_Addr [0] (0xZZ) NRF_UICR + 0x81 (0x10001081): MAC_Addr [1] (0xYY) NRF_UICR + 0x82 (0x10001082): MAC_Addr [2] (0xXX) NRF_UICR + 0x83 (0x10001083): MAC_Addr [3] (0x93) NRF_UICR + 0x84 (0x10001084): MAC_Addr [4] (0x54) NRF_UICR + 0x85 (0x10001085): MAC_Addr [5] (0x94) BMD-300-Series-DS V1.7 Page 15 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9. Mechanical Data 9.1 Mechanical Dimensions 9.1.1 BMD-300 Dimensions Figure 6 – BMD-300 Module Dimensions (All dimensions are in mm) 9.1.2 BMD-301 Dimensions Figure 7 – BMD-301 Module Dimensions (All dimensions are in mm) BMD-300-Series-DS V1.7 Page 16 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9.1.3 BMD-350 Dimensions Figure 8 – BMD-350 Module Dimensions (All dimensions are in mm) 9.2 Recommended PCB Land Pads 9.2.1 BMD-300/301 The BMD-300 and BMD-301 have identical PCB layout footprints. Note: RF keep-out not required when using the BMD-301. Figure 9 – BMD-300/301 Dimensions (Top View) (All dimensions are in mm) BMD-300-Series-DS V1.7 Page 17 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 9.2.2 BMD-350 Figure 10 – BMD-350 Dimensions (Top View) (All dimensions are in mm) 10. Module Marking 10.1 BMD-300 Module Marking Figure 11 – BMD-300 Module Marking – Rev A BMD-300-Series-DS V1.7 Page 18 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 10.2 BMD-301 Module Marking Figure 12 – BMD-301 Module Marking – Rev A 10.3 BMD-350 Module Marking Figure 13 – BMD-350 Module Marking – Rev A BMD-300-Series-DS V1.7 Page 19 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11. RF Design Notes 11.1 Recommended RF Layout & Ground Plane 11.1.1 BMD-300 For the BMD-300, the integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane from that shown in Figure 14 will reduce the effective radiated power. For example, a 27mm x 29mm board (about the size of a coin cell) has approximately 3dB lower output than the BMD-300 Evaluation Board. Figure 14 – BMD-300 Recommended RF Layout 11.1.2 BMD-301 For the BMD-301, refer to the external antenna datasheet for antenna placement and grounding recommendations. 11.1.3 BMD-350 For the BMD-305, the integrated chip antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. BMD-300-Series-DS V1.7 Page 20 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 Figure 15 – BMD-350 Recommended RF Layout 11.2 Mechanical Enclosure For the BMD-300 and BMD-350, care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer. For the BMD-301, refer to the external antenna datasheet for placement in or on a mechanical enclosure. BMD-300-Series-DS V1.7 Page 21 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3 Antenna Patterns 11.3.1 BMD-300 Antenna patterns are based off of the BMD-300 Evaluation Kit Version A with a ground plane size of 82mm x 56mm. X-Y-Z orientation is shown in Figure 16: Figure 16 – X-Y-Z Antenna Orientation 11.3.1.1 X-Y Plane Figure 17 – X-Y Plane Antenna Pattern BMD-300-Series-DS V1.7 Page 22 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.1.2 Y-Z Plane Figure 18 – Y-Z Plane Antenna Pattern 11.3.1.3 Z-X Plane Figure 19 – Z-X Plane Antenna Pattern BMD-300-Series-DS V1.7 Page 23 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.2 BMD-350 11.3.2.1 X-Y Plane Figure 20 – X-Y Plane Antenna Pattern 11.3.2.2 Y-Z Plane Figure 21 – Y-Z Plane Antenna Pattern BMD-300-Series-DS V1.7 Page 24 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 11.3.2.3 Z-X Plane Figure 22 – Z-X Plane Antenna Pattern 12. Evaluation Boards Rigado has developed full featured evaluation boards that provide a complete I/O pin out to headers, onboard programming and debug, 32.768 kHz crystal, power & virtual COM port over USB, 4 user LEDs, and 4 user buttons. The evaluation boards also provide the option to be powered from a CR2032 coin cell battery, and have current sense resistors and headers to allow for convenient current measurements. An Arduino Uno R3 style header is provided for easy prototyping of additional functions. The evaluation boards also support programming off-board BMD-300 Series modules. Evaluation kits are available 13. Custom Development Rigado is a full-service design house offering end-to-end product development from concept to manufacturing. We can provide custom modules and do electrical and mechanical design, end product manufacturing, firmware and mobile development, and web and cloud integration. Please contact Rigado at info@rigado.com or 1-866-6-RIGADO for custom engineering options and fees. BMD-300-Series-DS V1.7 Page 25 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 14. Bluetooth Qualification The BMD-300 Series modules are qualified as a Bluetooth Component (tested) for RF-PHY. This allows customers to use different SoftDevices that have been qualified by Nordic without the need to complete additional RF-PHY testing. To achieve Bluetooth End Product qualification, the Rigado RF-PHY QDID can be combined with Nordic QDIDs for the SoftDevice used when filing on the Bluetooth SIG website. The only testing required is for the Bluetooth profiles supported by the customer’s product. Products with only custom profiles do not require any additional testing. BMD-300/BMD-301: Declaration ID D030629 / QDID 81876 BMD-350: Declaration ID TBD / QDID TBD 15. Regulatory Statements 15.1 FCC Statement: This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment. Note: Modification to this product will void the users’ authority to operate this equipment. 15.2 FCC Important Notes (1) FCC Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in this document. Caution! The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment. BMD-300-Series-DS V1.7 Page 26 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter antenna. (3) OEM integration instructions： This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.) In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. Caution! The OEM is still responsible for verifying compliance with FCC Part 15, subpart B limits for unintentional radiators through an accredited test facility. (4) End product labeling： The final end product must be labeled in a visible area with the following: BMD-300: “Contains FCC ID: 2AA9B04” BMD-301: “Contains FCC ID: 2AA9B04” BMD-350: “Contains FCC ID: 2AA9B05” Any similar wording that expresses the same meaning may be used. The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” (5) Information regarding the end user manual： The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)). BMD-300-Series-DS V1.7 Page 27 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.3 IC Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur . 15.4 IC Important Notes 1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures. 3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system. 4. The host device shall be properly labelled to identify the module within the host device. The final end product must be labeled in a visible area with the following: BMD-300: “Contains IC: 12208A-04“ BMD-301: “Contains IC: 12208A-04“ BMD-350: “Contains IC: 12208A-05“ Any similar wording that expresses the same meaning may be used. The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device. “This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.” BMD-300-Series-DS V1.7 Page 28 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.5 CE Regulatory The BMD-300 Series modules are tested and compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC: EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 (pending) From R&TTE Directive 1999/5/EC: ETSI EN 300 328 V 1.9.1 From Directive 2004/108/EC: ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1 Declarations of Conformity and supporting test reports are available at www.rigado.com. 15.6 Japan (MIC) The BMD-300 Series modules have received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final end product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. • There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html Note: Certifications for the BMD-350 are pending. The label on the final end product which contains a BMD-300 Series module must follow the MIC marking requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm. The BMD-300 module is labeled with its assigned technical conformity mark and certification number. The final end product in which this module is being used must have an external label referring to the type certified module inside: Contains transmitter module with certificate number: The BMD-301 module is labeled with its assigned technical conformity mark and certification number. The final end product in which this module is being used must have an external label referring to the type certified module inside: Contains transmitter module with certificate number: BMD-300-Series-DS V1.7 Page 29 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 15.7 Australia / New Zealand The BMD-300 Series modules have been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices – Limits and methods of measurement. The report may be downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM. Information on registration as a Responsible Party, license and labeling requirements may be found at the following websites: Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-2004 New Zealand: http://www.rsm.govt.nz/compliance The A-Tick and C-Tick marks are being migrated to the Regulatory Compliance Mark (RCM). Only Australianbased and New Zealand-based companies who are registered may be granted permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the RCM on behalf of a company not in Australia or New Zealand. 15.8 Approved External Antennas The antennas listed below were tested for use with the BMD-301. Manufacturer Part Number Max Gain Type Size Approvals Pulse W1030 2 dBi 1/4 Wave Dipole – Whip Length: 108.3mm FCC, IC, MIC Taoglas FXP73.07.0100A 2.5dBi 1/4 Wave Dipole – Flex 7mm x 47mm x 0.1mm FCC, IC, MIC Pulse W1027 3.2 dBi 1/4 Wave Dipole – Whip Length: 136.8mm FCC, IC, MIC FCC, IC, MIC FCC, IC, MIC Kinsun 6670113050-145 2.0 dBi 1/4 Wave Dipole – PCB 12mm x 65mm x 0.46mm Kinsun 6610103081 5.0 dBi 1/2 Wave Dipole – Whip Length: 196.6mm Table 12 - Approved External Antennas 15.9 BMD-350 Module Labeling Due to the extreme size constraints, the FCC and IC have granted an exemption for the BMD-350 module from requiring the FCC ID and IC number to be physically located on the module. However, the host product is still required to affixed the FCC ID: 2AA9B05 and IC: 12208A-05 to the outside of the host product and in the user manual. See Section 5.2 FCC Important Notes and Section 5.4 IC Important Notes for host product and user manual labeling instructions. BMD-300-Series-DS V1.7 Page 30 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 16. Solder Reflow Temperature-Time Profile Figure 23 – Reflow Profile for Lead Free Solder 16.1 Moisture Sensitivity Level The BMD-300 Series is rated for MSL 3, 168-hour floor life after opening. 17. Packaging and Labeling 17.1 Carrier Tape Dimensions 17.1.1 BMD-300 & BMD-301 Figure 24 – Carrier Tape Dimensions BMD-300-Series-DS V1.7 Page 31 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 17.1.2 BMD-350 17.2 Reel Packaging Modules come on 330mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340x350x65mm box. On the outside of the bag an antistatic warning and reel label are adhered. Figure 25 – Reel Cartons BMD-300-Series-DS V1.7 Page 32 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 17.3 Packaging Label Figure 26 – Packaging Label 18. Cautions 1) The guidelines of this document should be followed in order to assure proper performance of the module. 2) This product is for use in office, business, and residential applications, but not medical devices. 3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used. This could be accomplished by redundant systems and protection circuits. 4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally, it should not contain noise, spikes, or AC ripple voltage. 5) Avoid use with other high frequency circuits. 6) Use methods to eliminate static electricity when working with the module as it can damage the components. 7) Contact with wires, the enclosure, or any other objects should be avoided. 8) Refer to the recommended pattern when designing for this module. 9) If hand soldering is used, be sure to use the precautions outlined in this document. 10) This module should be kept away from heat, both during storage and after installation. 11) Do not drop or physically shock the module. 12) Do not damage the interface surfaces of the module. 13) The module should not be mechanically stressed at any time (storage, handling, installation). 14) Do not store or expose this module to: Humid or salty air conditions High concentrations of corrosive gasses. Long durations of direct sunlight. Temperatures lower than -40°C or higher than 125°C. 19. Life Support Policy This product is not designed to be used in a life support device or system, or in applications where there is potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that result. BMD-300-Series-DS V1.7 Page 33 of 34 BMD-300 Series Module Datasheet Bluetooth 4.2 LE October 20, 2016 20. Document History Revision Date Changes / Notes 0.8 11/06/2015 0.8.1 11/10/2015 0.8.2 11/11/2015 Initial preliminary release Updated Table 5, Figure 5, Section 7.5 Corrected antenna references Updated Figure 1 0.8.3 11/20/2015 Updated current ratings from nRF52832 OPC v0.6.3 Corrected Table 3 0.9 0.9.4 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 3/17/2016 3/23/2016 5/04/2016 5/20/2016 6/03/2016 6/06/2016 7/07/2016 7/28/2016 8/10/2016 10/19/2016 Added BMD-301, GPIO notes, MSL, updated certifications, updated electrical specifications Added BMD-301 antennas Production Release; removed pending for FCC, Japan (MIC), & Bluetooth Removed pending for IC, MIC (BMD-301) Added Factory Firmware Version AB information Updated Module Programming and Read-Back Protection section Added preliminary information for the BMD-350 Added RigDFU and BMDware pin numbers, corrected nRF52832 PS link Corrected RESET pin number on BMD-350 Updated layout drawings, updated BMD-350 certifications 21. Related Documents Rigado Documents: BMD-300-Series-EVAL-UG: Evaluation Kit User Guide RIGDFU-DS-1: RigDFU Secure Bootloader Datasheet BMDWARE-DS-1: BMDware Datasheet Nordic Documents: Visit infocenter.nordicsemi.com for a comprehensive library of Nordic technical documentation. nRF52832 – nRF52832 Product Specification S132-SDS – nRF52832 S132 Soft Device Specification S212-SDS – nRF52832 S132 Soft Device Specification S332-SDS – nRF52832 S132 Soft Device Specification BMD-300-Series-DS V1.7 Page 34 of 34
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No Page Count : 34 Language : en-US Tagged PDF : Yes XMP Toolkit : 3.1-701 Producer : Microsoft® Word 2016 Title : BMD-300 Series Datasheet Creator : Rigado, LLC Description : BMD-300-Series-DS Creator Tool : Microsoft® Word 2016 Create Date : 2016:10:20 16:50:28-07:00 Modify Date : 2016:10:20 16:50:28-07:00 Document ID : uuid:8B8B1CD5-E65B-4F05-AFB4-E94A2A4BF4A6 Instance ID : uuid:8B8B1CD5-E65B-4F05-AFB4-E94A2A4BF4A6 Author : Rigado, LLC Subject : BMD-300-Series-DSEXIF Metadata provided by EXIF.tools